BR9105776A - Pelicula de cobre eletrodepositada e processo para produzir pelicula de cobre eletrodepositada - Google Patents

Pelicula de cobre eletrodepositada e processo para produzir pelicula de cobre eletrodepositada

Info

Publication number
BR9105776A
BR9105776A BR919105776A BR9105776A BR9105776A BR 9105776 A BR9105776 A BR 9105776A BR 919105776 A BR919105776 A BR 919105776A BR 9105776 A BR9105776 A BR 9105776A BR 9105776 A BR9105776 A BR 9105776A
Authority
BR
Brazil
Prior art keywords
electrodeposited copper
copper film
bath
copper
ions
Prior art date
Application number
BR919105776A
Other languages
English (en)
Portuguese (pt)
Inventor
Sidney J Clouser
Dino F Difranco
Craig J Hasegawa
Original Assignee
Gould Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gould Inc filed Critical Gould Inc
Publication of BR9105776A publication Critical patent/BR9105776A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/934—Electrical process
    • Y10S428/935—Electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12993—Surface feature [e.g., rough, mirror]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
BR919105776A 1990-05-30 1991-05-24 Pelicula de cobre eletrodepositada e processo para produzir pelicula de cobre eletrodepositada BR9105776A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US53145290A 1990-05-30 1990-05-30
PCT/US1991/003695 WO1991019024A1 (en) 1990-05-30 1991-05-24 Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations

Publications (1)

Publication Number Publication Date
BR9105776A true BR9105776A (pt) 1992-08-04

Family

ID=24117700

Family Applications (1)

Application Number Title Priority Date Filing Date
BR919105776A BR9105776A (pt) 1990-05-30 1991-05-24 Pelicula de cobre eletrodepositada e processo para produzir pelicula de cobre eletrodepositada

Country Status (9)

Country Link
US (2) US5421985A (ja)
EP (1) EP0485588B1 (ja)
JP (2) JP3392414B2 (ja)
KR (1) KR100275899B1 (ja)
AT (1) ATE151474T1 (ja)
AU (1) AU7952791A (ja)
BR (1) BR9105776A (ja)
DE (1) DE69125573T2 (ja)
WO (1) WO1991019024A1 (ja)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
US5679232A (en) * 1993-04-19 1997-10-21 Electrocopper Products Limited Process for making wire
RU2126312C1 (ru) * 1993-04-19 1999-02-20 ЭлектроКуппер Продактс Лимитед Способ получения металлического порошка, оксидов меди и медной фольги
US6123788A (en) * 1993-04-19 2000-09-26 Electrocopper Products Limited Copper wire and process for making copper wire
US5670033A (en) * 1993-04-19 1997-09-23 Electrocopper Products Limited Process for making copper metal powder, copper oxides and copper foil
US5366612A (en) * 1993-04-19 1994-11-22 Magma Copper Company Process for making copper foil
JP3709221B2 (ja) * 1994-10-06 2005-10-26 古河サーキットフォイル株式会社 銅箔の表面粗化処理方法
US6132887A (en) * 1995-06-16 2000-10-17 Gould Electronics Inc. High fatigue ductility electrodeposited copper foil
JP3313277B2 (ja) * 1995-09-22 2002-08-12 古河サーキットフォイル株式会社 ファインパターン用電解銅箔とその製造方法
TW432124B (en) 1996-05-13 2001-05-01 Mitsui Mining & Amp Smelting C Electrolytic copper foil with high post heat tensile strength and its manufacturing method
TW336325B (en) * 1996-05-24 1998-07-11 Electrocopper Products Ltd Copper wire and process for making copper wire
JP3053440B2 (ja) * 1996-08-23 2000-06-19 グールド エレクトロニクス インコーポレイテッド 高性能の可撓性積層体
US5863666A (en) * 1997-08-07 1999-01-26 Gould Electronics Inc. High performance flexible laminate
KR19980024945A (ko) * 1996-09-26 1998-07-06 야마모토 히데키 범프 접점을 갖는 회로 기판의 제조 방법 및 그 방법에 사용되는 제트 분사형 도금 장치
JPH10330983A (ja) 1997-05-30 1998-12-15 Fukuda Metal Foil & Powder Co Ltd 電解銅箔及びその製造方法
US5908544A (en) * 1997-09-04 1999-06-01 Gould Electronics, Inc. Zinc-chromium stabilizer containing a hydrogen inhibiting additive
US6054037A (en) * 1998-11-11 2000-04-25 Enthone-Omi, Inc. Halogen additives for alkaline copper use for plating zinc die castings
JP2001011685A (ja) * 1999-06-30 2001-01-16 Mitsui Mining & Smelting Co Ltd 電解銅箔およびその製造方法
JP3250994B2 (ja) * 1999-12-28 2002-01-28 三井金属鉱業株式会社 電解銅箔
US20020081443A1 (en) * 2000-06-08 2002-06-27 Connelly Susan M. Method of manufacturing circuit laminates
JP2002053993A (ja) * 2000-08-04 2002-02-19 Mitsui Mining & Smelting Co Ltd 電解銅箔およびその製造方法
WO2002049405A2 (en) 2000-08-15 2002-06-20 World Properties, Inc. Multi-layer circuits and methods of manufacture thereof
EP1412560A1 (en) * 2001-07-27 2004-04-28 PIRELLI PNEUMATICI Società per Azioni Electrolytic process for depositing a layer of copper on a steel wire
EP1327995A3 (en) * 2002-01-11 2005-10-12 Shipley Co. L.L.C. Resistor structure
KR100389061B1 (ko) * 2002-11-14 2003-06-25 일진소재산업주식회사 전해 동박 제조용 전해액 및 이를 이용한 전해 동박 제조방법
JP3963907B2 (ja) * 2004-05-26 2007-08-22 三井金属鉱業株式会社 純銅被覆銅箔及びその製造方法、並びにｔａｂテープ及びその製造方法
US8263225B2 (en) * 2004-06-01 2012-09-11 Isola Usa Corp. Laminate composition for producing reduced curl flat thin core laminate
US7190016B2 (en) * 2004-10-08 2007-03-13 Rohm And Haas Electronic Materials Llc Capacitor structure
JP4583149B2 (ja) * 2004-12-01 2010-11-17 三井金属鉱業株式会社 電解銅箔及びその製造方法
JP4770272B2 (ja) * 2005-05-27 2011-09-14 凸版印刷株式会社 銅めっき浴の管理方法及び銅めっき被膜の製造方法
JP4770271B2 (ja) * 2005-05-27 2011-09-14 凸版印刷株式会社 銅めっき浴の管理方法及び銅めっき被膜の製造方法
JP2007100113A (ja) * 2005-09-30 2007-04-19 Meiko:Kk 銅めっき方法とそれに用いる塩素イオン電解除去装置
US8303792B1 (en) 2007-08-29 2012-11-06 Magnecomp Corporation High strength electrodeposited suspension conductors
CL2009000969A1 (es) * 2009-04-23 2009-07-17 Ingenieria Y Desarrollo Tecnologico S A Un sistema para superponer una corriente alterna a la corriente continua que alimenta las celdas electroliticas de un proceso de electrolisis de metales que comprende dos grupos de celdas con un punto comun de conexion electrica, dos fuentes de corriente continua, una para cada celda y un conversor de corriente bidireccional.
JP2011091114A (ja) * 2009-10-20 2011-05-06 Nitto Denko Corp 配線回路基板およびその製法
EP2644753B1 (en) 2010-11-22 2016-05-11 Mitsui Mining & Smelting Co., Ltd. Surface-treated copper foil
KR20140035524A (ko) * 2011-07-13 2014-03-21 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 강도가 높고 또한 휨이 적은 전해 동박 및 그 제조 방법
US9428840B2 (en) * 2011-10-31 2016-08-30 Furukawa Electric Co., Ltd. High strength, high heat resistance electrodeposited copper foil and manufacturing method for same
JP5858849B2 (ja) * 2012-03-30 2016-02-10 Jx日鉱日石金属株式会社 金属箔
JP6067256B2 (ja) * 2012-06-27 2017-01-25 古河電気工業株式会社 電解銅箔、リチウムイオン二次電池用負極電極及びリチウムイオン二次電池
TWI539033B (zh) * 2013-01-07 2016-06-21 Chang Chun Petrochemical Co Electrolytic copper foil and its preparation method
KR101571063B1 (ko) 2013-11-28 2015-11-24 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 전기부품 및 전지, 및 전해동박 제조방법
KR101571060B1 (ko) 2013-11-28 2015-11-24 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 전기부품 및 전지, 및 전해동박 제조방법
KR101633725B1 (ko) * 2014-05-13 2016-06-27 (주)피엔티 합금박 제조 장치
US9707738B1 (en) 2016-01-14 2017-07-18 Chang Chun Petrochemical Co., Ltd. Copper foil and methods of use
JP6721547B2 (ja) * 2017-07-27 2020-07-15 ケイシーエフ テクノロジース カンパニー リミテッド 高い引張強度を有する電解銅箔、それを含む電極、それを含む二次電池、およびその製造方法
TWI679314B (zh) * 2018-06-07 2019-12-11 國立中興大學 以單一電鍍槽製備銅箔生箔同時形成粗化毛面的方法及該銅箔生箔
PL245191B1 (pl) * 2020-01-30 2024-05-27 Mitsui Mining & Smelting Co Ltd Elektrolityczna folia miedziana

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2563360A (en) * 1941-05-24 1951-08-07 Gen Motors Corp Electrodeposition of copper
US2475974A (en) * 1945-08-28 1949-07-12 Rca Corp Electrodeposition of copper
US2482354A (en) * 1946-07-06 1949-09-20 Rca Corp Copper plating solution
US2700019A (en) * 1951-07-05 1955-01-18 Westinghouse Electric Corp Acid copper plating
DE962489C (de) * 1954-02-10 1957-04-25 Dehydag Gmbh Sparbeizmittel zum Schutze von Metallen bei der Behandlung mit sauren Mitteln
US2876178A (en) * 1956-03-06 1959-03-03 Ewald H Mccoy Electrodepositing copper
US2859159A (en) * 1956-10-09 1958-11-04 Elechem Corp Bright copper plating bath containing mixtures of metal compounds
US3682788A (en) * 1970-07-28 1972-08-08 M & T Chemicals Inc Copper electroplating
US3864227A (en) * 1973-06-20 1975-02-04 Amax Inc Method for the electrolytic refining of copper
JPS5233074A (en) * 1975-09-10 1977-03-12 Nippon Mining Co Surface treatment of printed circuit copper foil
JPS5853079B2 (ja) * 1976-03-15 1983-11-26 三井アナコンダ銅箔株式会社 銅箔の防錆方法
JPS5438053A (en) * 1977-08-29 1979-03-22 Mitsubishi Electric Corp Safety device for elevator cage
US4169018A (en) * 1978-01-16 1979-09-25 Gould Inc. Process for electroforming copper foil
US4386139A (en) * 1980-10-31 1983-05-31 Furukawa Circuit Foil Co., Ltd. Copper foil for a printed circuit and a method for the production thereof
US4387006A (en) * 1981-07-08 1983-06-07 Fukuda Metal Foil & Powder Co., Ltd. Method of treating the surface of the copper foil used in printed wire boards
US4686017A (en) * 1981-11-05 1987-08-11 Union Oil Co. Of California Electrolytic bath and methods of use
JPH0639155B2 (ja) * 1986-02-21 1994-05-25 名幸電子工業株式会社 銅張積層板の製造方法
US4781001A (en) * 1986-03-17 1988-11-01 Cyclops Corporation Continuous preset access housing
US4647345A (en) * 1986-06-05 1987-03-03 Olin Corporation Metallurgical structure control of electrodeposits using ultrasonic agitation
AU579517B2 (en) * 1986-06-20 1988-11-24 Gould Inc. Double matte finish copper foil
US4781801A (en) * 1987-02-03 1988-11-01 Mcgean-Rohco, Inc. Method of copper plating gravure rolls
DE3718584A1 (de) * 1987-06-03 1988-12-15 Norddeutsche Affinerie Verfahren zur messung der wirksamen inhibitorkonzentration waehrend der metallabscheidung aus waessrigen elektrolyten
JPH0631461B2 (ja) * 1987-06-15 1994-04-27 日本電解株式会社 電解銅箔の製造方法
JPH0649958B2 (ja) * 1987-06-15 1994-06-29 日本電解株式会社 電解銅箔の製造方法
US4956053A (en) * 1988-05-26 1990-09-11 Olin Corporation Apparatus and process for the production of micro-pore free high ductility metal foil
US5181770A (en) * 1989-04-19 1993-01-26 Olin Corporation Surface topography optimization through control of chloride concentration in electroformed copper foil
US5171417A (en) * 1989-09-13 1992-12-15 Gould Inc. Copper foils for printed circuit board applications and procedures and electrolyte bath solutions for electrodepositing the same
US5215645A (en) * 1989-09-13 1993-06-01 Gould Inc. Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same
JPH05233074A (ja) * 1992-02-25 1993-09-10 Dai Ichi Seiyaku Co Ltd ｐＨ制御方法及びその装置

Also Published As

Publication number Publication date
DE69125573D1 (de) 1997-05-15
JP3392414B2 (ja) 2003-03-31
KR100275899B1 (ko) 2000-12-15
US5454926A (en) 1995-10-03
AU7952791A (en) 1991-12-31
EP0485588A1 (en) 1992-05-20
KR920703881A (ko) 1992-12-18
JP2001247994A (ja) 2001-09-14
WO1991019024A1 (en) 1991-12-12
JPH05502062A (ja) 1993-04-15
EP0485588A4 (en) 1993-03-31
DE69125573T2 (de) 1997-07-17
US5421985A (en) 1995-06-06
ATE151474T1 (de) 1997-04-15
EP0485588B1 (en) 1997-04-09

Similar Documents

Publication Publication Date Title
BR9105776A (pt) Pelicula de cobre eletrodepositada e processo para produzir pelicula de cobre eletrodepositada
ATE161901T1 (de) Elektroplattierte kupferfolie und verfahren zu deren herstellung
DE69316407D1 (de) Metallschaum und Verfahren zu dessen Herstellung
DE69411332D1 (de) Verfahren zur Herstellung elektrisch abgeschiedener Kupferfolie unter Verwendung von Elektrolytlösungen, die kontrollierte Zusätze von Chloridionen und anorganischen Verunreinigungen enthalten
DE3670862D1 (de) Verfahren zur elektrolytischen herstellung von hypochlorit in salzenthaltendem laufendem wasser und vorrichtung zur durchfuehrung dieses verfahrens.
DE3582497D1 (de) Verfahren zur herstellung einer elektrolytloesung zum elektroplattieren von zinn oder zinn-blei-legierungen.
EP0110463B1 (en) A process of electroforming a metal product and electroformed metal product
TW370578B (en) Copper foil for use in printed circuit boards, its process and electrolytic device therefor
BR7900244A (pt) Processo para eletrodeposicao de folha de cobre,folha eletrodepositada e banho usado no processo
DE69415474D1 (de) Elektrolytische Zelle zur Herstellung von Hypohalogenit für Wasserbehandlungszwecke
EP1065298A3 (en) Method of manfacturing electrodeposited copper foil and electrodeposited copper foil
ATE188753T1 (de) Verfahren zur anodisierung eines aluminiummaterials
DE69911941D1 (de) Verfahren zur herstellung von leiterzügen auf einer leiterplatte und vorrichtung zur durchführung des verfahrens
IT8422935A0 (it) Vasca di elettrolisi a intensita'superiore a 250.000 ampere per laproduzione di alluminio mediante il procedimento hall-heroult.
DE59103933D1 (de) Saures bad zur galvanischen abscheidung von kupferüberzügen und verfahren unter verwendung dieser kombination.
DE59305919D1 (de) Einrichtung zur elektrolytischen Herstellung von Wasserstoff aus Wasser
BR8804796A (pt) Processo de regulacao da acidez do banho de eletrolise por reciclagem dos efluentes fluorados emitidos pelas cubas de eletrolise hall-heroult
ES2026947T3 (es) Procedimiento e instalacion para el galvanizado de una banda de acero.
FR2732365B1 (fr) Procede continu d'electrozingage de bande metallique dans un bain d'electrolyse a base de chlorures pour obtenir des revetements de faible rugosite sous des densites de courant elevees
ATE124730T1 (de) Elektrischer leiter, verfahren zur herstellung eines elektrischen leiters und elektrode für elektrolysezelle.
DE69001949D1 (de) Vorrichtung zur fortlaufenden herstellung eines mehrwertigen metalls durch elektrolyse eines in einem schmelzbad aufgeloesten halogenids.
JPS5675595A (en) Anodic oxidized film coloring method of aluminum or aluminum alloy
JPS5635793A (en) Electrolytic formation of verdigris on surface of copper or copper alloy
FI923903A0 (fi) Elektrolyysilaitteisto vedyn tuottamiseksi
Walega et al. Selective High-Rate Electrodeposition of Gold--Iron Alloys in a Weak-Acid Bath. II. Properties of Baths and Au--Fe Alloy Coatings