BR7804013A - Processo para a fabricacao de disposicoes eletricamente condutoras e soldaveis - Google Patents

Processo para a fabricacao de disposicoes eletricamente condutoras e soldaveis

Info

Publication number
BR7804013A
BR7804013A BR7804013A BR7804013A BR7804013A BR 7804013 A BR7804013 A BR 7804013A BR 7804013 A BR7804013 A BR 7804013A BR 7804013 A BR7804013 A BR 7804013A BR 7804013 A BR7804013 A BR 7804013A
Authority
BR
Brazil
Prior art keywords
manufacture
electrically conductive
welding devices
welding
devices
Prior art date
Application number
BR7804013A
Other languages
English (en)
Inventor
W Erhard
P Ambros
E Gatzke
Original Assignee
Preh Elektro Feinmechanik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Preh Elektro Feinmechanik filed Critical Preh Elektro Feinmechanik
Publication of BR7804013A publication Critical patent/BR7804013A/pt

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/245Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001Interlayers, transition pieces for metallurgical bonding of workpieces
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0347Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12014All metal or with adjacent metals having metal particles
    • Y10T428/12028Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12049Nonmetal component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12014All metal or with adjacent metals having metal particles
    • Y10T428/12028Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063Nonparticulate metal component
    • Y10T428/12069Plural nonparticulate metal components
    • Y10T428/12076Next to each other
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12014All metal or with adjacent metals having metal particles
    • Y10T428/12028Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063Nonparticulate metal component
    • Y10T428/12104Particles discontinuous
    • Y10T428/12111Separated by nonmetal matrix or binder [e.g., welding electrode, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24372Particulate matter
    • Y10T428/24413Metal or metal compound
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256Heavy metal or aluminum or compound thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Conductive Materials (AREA)
BR7804013A 1977-06-24 1978-06-23 Processo para a fabricacao de disposicoes eletricamente condutoras e soldaveis BR7804013A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2728465A DE2728465C2 (de) 1977-06-24 1977-06-24 Gedruckte Schaltung

Publications (1)

Publication Number Publication Date
BR7804013A true BR7804013A (pt) 1979-04-03

Family

ID=6012250

Family Applications (1)

Application Number Title Priority Date Filing Date
BR7804013A BR7804013A (pt) 1977-06-24 1978-06-23 Processo para a fabricacao de disposicoes eletricamente condutoras e soldaveis

Country Status (7)

Country Link
US (2) US4248921A (pt)
JP (1) JPS5418072A (pt)
AT (1) AT374329B (pt)
BR (1) BR7804013A (pt)
DE (1) DE2728465C2 (pt)
FR (1) FR2395674A1 (pt)
GB (1) GB2000197B (pt)

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4409261A (en) * 1980-02-07 1983-10-11 Cts Corporation Process for air firing oxidizable conductors
DE3028496C2 (de) * 1980-07-26 1986-04-24 Preh, Elektrofeinmechanische Werke Jakob Preh Nachf. Gmbh & Co, 8740 Bad Neustadt Haftvermittler für ein Trägermaterial
JPS5731193A (en) * 1980-07-31 1982-02-19 Matsushita Electric Works Ltd Method of producing printed circuit board
US4495251A (en) * 1981-03-11 1985-01-22 General Electric Company Shielded plastic microwave oven cavity
WO1983002538A1 (en) * 1982-01-04 1983-07-21 Gen Electric Electroplated augmentative replacement processed conductors and manufacture thereof
US4591088A (en) * 1983-05-31 1986-05-27 Hughes Aircraft Company Solder reflow process for soldering shaped articles together
US4495253A (en) * 1983-05-31 1985-01-22 Hughes Aircraft Company Solderable plated plastic components and process for plating _
US4499157A (en) * 1983-05-31 1985-02-12 Hughes Aircraft Company Solderable plated plastic components and processes for manufacture and soldering
GB2152060B (en) * 1983-12-02 1987-05-13 Osaka Soda Co Ltd Electrically conductive adhesive composition
US4581301A (en) * 1984-04-10 1986-04-08 Michaelson Henry W Additive adhesive based process for the manufacture of printed circuit boards
EP0171482B1 (de) * 1984-08-17 1988-05-18 Werner Bandi Verfahren zur Herstellung einer Beschichtung auf ein Trägermaterial
US4680141A (en) * 1984-11-29 1987-07-14 Mcdonnell Douglas Corporation Solder composition
JPS61159793A (ja) * 1984-12-31 1986-07-19 株式会社 アサヒ化学研究所 基板に導電回路を形成する方法
DE3515985A1 (de) * 1985-05-03 1986-11-06 Wilhelm Ruf KG, 8000 München Verfahren zur herstellung einer loetbaren beschichtung auf einem substrat und leiterbahnplatte bzw. loetbare kontaktflaeche
US4680138A (en) * 1985-10-22 1987-07-14 Sayles Sr Delbert E Silver sensing material for use on film
US4673532A (en) * 1986-01-22 1987-06-16 Mcdonnell Douglas Corporation Rosin-free solder composition
US4780371A (en) * 1986-02-24 1988-10-25 International Business Machines Corporation Electrically conductive composition and use thereof
JPH0714105B2 (ja) * 1986-05-19 1995-02-15 日本電装株式会社 混成集積回路基板及びその製造方法
US4795508A (en) * 1987-02-05 1989-01-03 Shell Internationale Research Maatschappij B.V. Soldering compositions
JPH01214100A (ja) * 1988-02-21 1989-08-28 Asahi Chem Res Lab Ltd 電磁波シールド回路及びその製造方法
US4980225A (en) * 1988-07-12 1990-12-25 Sayles & Scheel Enterprises, Incorporated Conductive composition and method of use
US5106884A (en) * 1988-10-28 1992-04-21 The Dow Chemical Company Flexible polyurea foams having controlled load bearing qualities
GB8901114D0 (en) * 1989-01-19 1989-03-15 Cookson Group Plc Preparing articles for soldering
US5200264A (en) * 1989-09-05 1993-04-06 Advanced Products, Inc. Thermoset polymer thick film compositions and their use as electrical circuitry
US5227223A (en) * 1989-12-21 1993-07-13 Monsanto Company Fabricating metal articles from printed images
FR2659649B1 (fr) * 1990-03-16 1992-06-12 Kodak Pathe Preparation d'alkoxydes d'indium solubles dans les solvants organiques.
JP3118103B2 (ja) * 1992-12-21 2000-12-18 矢崎総業株式会社 電気回路用導電部材、電気回路体及びその製造方法
US5419954A (en) * 1993-02-04 1995-05-30 The Alpha Corporation Composition including a catalytic metal-polymer complex and a method of manufacturing a laminate preform or a laminate which is catalytically effective for subsequent electroless metallization thereof
JPH08148787A (ja) * 1994-11-21 1996-06-07 Sumitomo Kinzoku Ceramics:Kk 厚膜ペースト
JPH0912385A (ja) * 1995-04-28 1997-01-14 Mitsuboshi Belting Ltd メッキ用表面処理剤およびこれを付着した基材
KR100269830B1 (ko) * 1996-04-18 2000-10-16 포만 제프리 엘 구리표면 보호용 유기금속계 복합 피복물
EP0809423A1 (en) * 1996-05-23 1997-11-26 Mitsumi Electric Company Ltd. Flexible board
US6592943B2 (en) 1998-12-01 2003-07-15 Fujitsu Limited Stencil and method for depositing solder
US6054761A (en) 1998-12-01 2000-04-25 Fujitsu Limited Multi-layer circuit substrates and electrical assemblies having conductive composition connectors
CA2350506A1 (en) 1998-12-03 2000-06-08 Rt Microwave Ltd. Process for depositing conducting layer on substrate
US6291025B1 (en) * 1999-06-04 2001-09-18 Argonide Corporation Electroless coatings formed from organic liquids
KR100369118B1 (ko) * 2000-05-13 2003-01-24 한국과학기술연구원 스크린 프린팅에 의한 고밀도 세라믹 후막 제조방법
US6824857B2 (en) 2001-04-02 2004-11-30 Nashua Corporation Circuit elements having an embedded conductive trace and methods of manufacture
JP4595237B2 (ja) * 2001-04-27 2010-12-08 日立金属株式会社 銅めっき液および銅めっき方法
GB0117431D0 (en) * 2001-07-17 2001-09-12 Univ Brunel Method for printing conducting layer onto substrate
EP1460644B1 (en) * 2001-12-27 2007-07-25 Fujikura Ltd. Electroconductive composition, electroconductive coating and method for forming electroconductive coating
EP1383364A3 (en) * 2002-05-23 2006-01-04 Nashua Corporation Circuit elements having an ink receptive coating and a conductive trace and methods of manufacture
EP1542518A4 (en) * 2002-06-04 2009-08-26 Sumitomo Electric Industries CIRCUIT BOARD FOR PRINTED WIRING, PRINTED PCB AND METHOD FOR THE PRODUCTION THEREOF
DE10258824B3 (de) * 2002-12-06 2004-05-06 Hjb Rolling Mill Technology Gmbh Verfahren zum Herstellen eines Bandes mit einem in dessen Querschnitt verlaufenden Stufenprofil
TWI265762B (en) * 2003-01-14 2006-11-01 Sharp Kk Wiring material, wiring substrate and manufacturing method thereof, display panel, fine particle thin film material, substrate including thin film layer and manufacturing method thereof
US20050056365A1 (en) * 2003-09-15 2005-03-17 Albert Chan Thermal interface adhesive
US7071121B2 (en) * 2003-10-28 2006-07-04 Hewlett-Packard Development Company, L.P. Patterned ceramic films and method for producing the same
KR20110019421A (ko) * 2008-06-12 2011-02-25 나노마스 테크놀러지스, 인코포레이티드 전도성 잉크 및 페이스트
CN102264537B (zh) * 2008-12-26 2014-07-16 富士胶片株式会社 表面金属膜材料、表面金属膜材料的制作方法、金属图案材料的制作方法及金属图案材料
WO2011093515A1 (ja) * 2010-01-28 2011-08-04 独立行政法人科学技術振興機構 パターン状導電性膜の形成方法
CA2917967A1 (en) 2013-07-09 2015-01-15 United Technologies Corporation Plated polymer compressor
EP3019710A4 (en) 2013-07-09 2017-05-10 United Technologies Corporation Plated polymer fan
CA2917916A1 (en) 2013-07-09 2015-02-05 United Technologies Corporation Plated polymer nosecone
WO2015006421A1 (en) 2013-07-09 2015-01-15 United Technologies Corporation Metal-encapsulated polymeric article
US20160376709A1 (en) * 2013-07-09 2016-12-29 United Technologies Corporation Industrial products formed from plated polymers
US9398703B2 (en) 2014-05-19 2016-07-19 Sierra Circuits, Inc. Via in a printed circuit board
WO2016208006A1 (ja) * 2015-06-24 2016-12-29 株式会社メイコー 立体配線基板の製造方法、立体配線基板、立体配線基板用基材
US10537020B2 (en) 2015-08-17 2020-01-14 Sumitomo Electric Industries, Ltd. Printed circuit board and electronic component
US10537017B2 (en) * 2015-08-17 2020-01-14 Sumitomo Electric Industries, Ltd. Printed circuit board and electronic component
US20170113297A1 (en) * 2015-10-27 2017-04-27 Hutchinson Technology Incorporated Metallizing polymers, ceramics and composites for attachment structures
TWI538581B (zh) * 2015-11-20 2016-06-11 財團法人工業技術研究院 金屬導體結構及線路結構
US10925663B2 (en) 2016-06-27 2021-02-23 Mound Laser & Photonics Center, Inc. Metallized components and surgical instruments
US10844238B2 (en) 2016-07-28 2020-11-24 National Research Council Of Canada Copper ink and conductive solderable copper traces produced therefrom
US10849233B2 (en) 2017-07-10 2020-11-24 Catlam, Llc Process for forming traces on a catalytic laminate
TW201842087A (zh) 2017-02-08 2018-12-01 加拿大國家研究委員會 具改良之熱穩定性的分子油墨
WO2018146619A2 (en) 2017-02-08 2018-08-16 National Research Council Of Canada Silver molecular ink with low viscosity and low processing temperature
TW201842088A (zh) 2017-02-08 2018-12-01 加拿大國家研究委員會 可印刷分子油墨
US10349520B2 (en) 2017-06-28 2019-07-09 Catlam, Llc Multi-layer circuit board using interposer layer and conductive paste
US10765012B2 (en) 2017-07-10 2020-09-01 Catlam, Llc Process for printed circuit boards using backing foil
TW201920515A (zh) 2017-08-01 2019-06-01 加拿大國家研究委員會 銅墨水
EP3468312B1 (en) * 2017-10-06 2023-11-29 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Method of manufacturing a component carrier having a three dimensionally printed wiring structure
US10827624B2 (en) 2018-03-05 2020-11-03 Catlam, Llc Catalytic laminate with conductive traces formed during lamination

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2748701A (en) * 1951-08-28 1956-06-05 Wendell P Barrows Electrically conductive coating
US3031344A (en) * 1957-08-08 1962-04-24 Radio Ind Inc Production of electrical printed circuits
US3014818A (en) * 1957-12-09 1961-12-26 Du Pont Electrically conducting articles and process of making same
US3245833A (en) * 1964-04-20 1966-04-12 Eastman Kodak Co Electrically conductive coatings
US3488166A (en) * 1967-01-13 1970-01-06 Ibm Method for activating plastics,subsequent metallization and article of manufacture resulting therefrom
DE1615961A1 (de) * 1967-04-12 1970-06-25 Degussa Verfahren zur Herstellung von gedruckten Schaltungen
GB1199471A (en) * 1967-05-02 1970-07-22 Ingram & Glass Ltd Improvements relating to Laminated Sheet Material.
FR1548401A (pt) * 1967-08-16 1968-12-06
GB1164591A (en) * 1968-01-03 1969-09-17 Photocircuits Corp mprovements in Metallization of Insulating Substrates
DE1771661A1 (de) * 1968-06-22 1972-02-10 Basf Ag Verfahren zur Metallisierung von Kunststoffschaumkoerpern
US3640853A (en) * 1968-12-27 1972-02-08 Rca Corp Adhesion of nonconducting and conducting materials
GB1403198A (en) * 1971-09-30 1975-08-28 Bell & Howell Co Metal encapsulation
CH578621A5 (pt) * 1972-03-16 1976-08-13 Bbc Brown Boveri & Cie
DE2307776C3 (de) * 1973-02-16 1979-08-30 Wacker-Chemie Gmbh, 8000 Muenchen Verwendung von Gemischen auf Basis von OrganopolysUoxanen als Klebstoffe
US4009093A (en) * 1973-10-23 1977-02-22 The International Nickel Company, Inc. Platable polymeric composition
JPS525873A (en) * 1975-07-02 1977-01-17 Toyoda Automatic Loom Works Plating of synthetic resin goods
US4150177A (en) * 1976-03-31 1979-04-17 Massachusetts Institute Of Technology Method for selectively nickeling a layer of polymerized polyester resin
CA1097495A (en) * 1976-05-24 1981-03-17 James H. Aumiller Electrically conductive adhesive
US4113899A (en) * 1977-05-23 1978-09-12 Wear-Cote International, Inc. Method of obtaining electroless nickel coated filled epoxy resin article
US4170677A (en) * 1977-11-16 1979-10-09 The United States Of America As Represented By The Secretary Of The Army Anisotropic resistance bonding technique

Also Published As

Publication number Publication date
JPS5418072A (en) 1979-02-09
DE2728465C2 (de) 1982-04-22
GB2000197B (en) 1982-03-17
GB2000197A (en) 1979-01-04
FR2395674B3 (pt) 1981-02-06
US4391742A (en) 1983-07-05
ATA451878A (de) 1983-08-15
FR2395674A1 (fr) 1979-01-19
DE2728465A1 (de) 1979-01-11
AT374329B (de) 1984-04-10
US4248921A (en) 1981-02-03

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