BR0317901A - Lead Free Combined Alloy Solder Paste - Google Patents

Lead Free Combined Alloy Solder Paste

Info

Publication number
BR0317901A
BR0317901A BR0317901-0A BR0317901A BR0317901A BR 0317901 A BR0317901 A BR 0317901A BR 0317901 A BR0317901 A BR 0317901A BR 0317901 A BR0317901 A BR 0317901A
Authority
BR
Brazil
Prior art keywords
solder paste
alloy
free combined
alloy solder
lead free
Prior art date
Application number
BR0317901-0A
Other languages
Portuguese (pt)
Inventor
Vahid Kazem Goudarzi
Edwin Bradley
Brian Fariello
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of BR0317901A publication Critical patent/BR0317901A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)

Abstract

"PASTA DE SOLDA DE LIGAS COMBINADAS ISENTA DE CHUMBO". Esta invenção refere-se a uma pasta de solda de ligas combinadas isenta de chumbo, a um método de fabricação da pasta de solda e a um método de utilização da pasta de solda. A pasta de solda compreende partículas de uma primeira liga e de uma segunda liga, combinadas em um decapante. A temperatura de fusão da primeira liga e a temperatura de fusão da segunda liga diferem por não mais que aproximadamente 15<198>C."LEAD-FREE COMBINED ALLOY WELDER FOLDER". This invention relates to a lead-free combined alloy solder paste, a solder paste manufacturing method and a method of using solder paste. Solder paste comprises first and second alloy particles combined in a paint stripper. The melt temperature of the first alloy and the melt temperature of the second alloy differ by no more than approximately 15 ° C.

BR0317901-0A 2002-12-31 2003-12-26 Lead Free Combined Alloy Solder Paste BR0317901A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33413202A 2002-12-31 2002-12-31
PCT/US2003/041326 WO2004060604A1 (en) 2002-12-31 2003-12-26 Mixed alloy lead-free solder paste

Publications (1)

Publication Number Publication Date
BR0317901A true BR0317901A (en) 2005-11-29

Family

ID=32710860

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0317901-0A BR0317901A (en) 2002-12-31 2003-12-26 Lead Free Combined Alloy Solder Paste

Country Status (8)

Country Link
US (1) US20060021466A1 (en)
EP (1) EP1585614A4 (en)
JP (1) JP2006512212A (en)
KR (1) KR100645241B1 (en)
CN (1) CN100408251C (en)
AU (1) AU2003299955A1 (en)
BR (1) BR0317901A (en)
WO (1) WO2004060604A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8961709B1 (en) * 2004-03-09 2015-02-24 Senju Metal Industry Co., Ltd. Solder paste
DE102004034035A1 (en) * 2004-07-13 2006-02-09 W.C. Heraeus Gmbh Lead-free solder pastes with increased reliability
KR101009564B1 (en) * 2006-06-30 2011-01-18 아사히 가세이 일렉트로닉스 가부시끼가이샤 Conductive filler
JP4973109B2 (en) * 2006-10-05 2012-07-11 富士電機株式会社 Manufacturing method of semiconductor device
US8083832B2 (en) * 2007-02-27 2011-12-27 International Rectifier Corporation Paste for forming an interconnect and interconnect formed from the paste
CN102171162B (en) * 2008-09-30 2014-12-24 倍耐力&C.Eco技术股份公司 Honeycomb structural body for exhaust gas purification
KR101535404B1 (en) * 2014-03-05 2015-07-10 주식회사 네패스 Semiconductor package and method of manufacturing the same
WO2019027261A1 (en) * 2017-08-01 2019-02-07 서울시립대학교 산학협력단 Lead-free solder alloy composition and preparation method therefor
CN110961831B (en) * 2018-09-28 2022-08-19 株式会社田村制作所 Forming solder and manufacturing method of forming solder

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5527628A (en) * 1993-07-20 1996-06-18 Iowa State University Research Foudation, Inc. Pb-free Sn-Ag-Cu ternary eutectic solder
CA2131256A1 (en) * 1993-09-07 1995-03-08 Dongkai Shangguan Lead-free solder alloy
US5455004A (en) * 1993-10-25 1995-10-03 The Indium Corporation Of America Lead-free alloy containing tin, zinc, indium and bismuth
US5439639A (en) * 1994-01-05 1995-08-08 Sandia Corporation Tin-silver-bismuth solders for electronics assembly
US5540379A (en) * 1994-05-02 1996-07-30 Motorola, Inc. Soldering process
US5427865A (en) * 1994-05-02 1995-06-27 Motorola, Inc. Multiple alloy solder preform
JP3776505B2 (en) * 1996-05-02 2006-05-17 松下電器産業株式会社 Solder joint
US5928404A (en) * 1997-03-28 1999-07-27 Ford Motor Company Electrical solder and method of manufacturing
JPH11186712A (en) * 1997-12-24 1999-07-09 Nissan Motor Co Ltd Solder paste and connecting method
JPH11291083A (en) * 1998-04-14 1999-10-26 Murata Mfg Co Ltd Solder alloy
EP1180411A1 (en) * 2000-08-17 2002-02-20 Senju Metal Industry Co., Ltd. Lead-free paste for reflow soldering
US6433425B1 (en) * 2000-09-12 2002-08-13 International Business Machines Corporation Electronic package interconnect structure comprising lead-free solders
JP4438974B2 (en) * 2000-10-05 2010-03-24 千住金属工業株式会社 Solder paste
GB2380964B (en) * 2001-09-04 2005-01-12 Multicore Solders Ltd Lead-free solder paste
US6767411B2 (en) * 2002-03-15 2004-07-27 Delphi Technologies, Inc. Lead-free solder alloy and solder reflow process

Also Published As

Publication number Publication date
EP1585614A1 (en) 2005-10-19
CN1732063A (en) 2006-02-08
KR20050085941A (en) 2005-08-29
US20060021466A1 (en) 2006-02-02
JP2006512212A (en) 2006-04-13
KR100645241B1 (en) 2006-11-15
EP1585614A4 (en) 2008-07-30
WO2004060604A1 (en) 2004-07-22
AU2003299955A1 (en) 2004-07-29
CN100408251C (en) 2008-08-06

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Legal Events

Date Code Title Description
B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE A 7A E 8A ANUIDADE(S).

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2144 DE 07/02/2012.