AU2003299955A1 - Mixed alloy lead-free solder paste - Google Patents

Mixed alloy lead-free solder paste

Info

Publication number
AU2003299955A1
AU2003299955A1 AU2003299955A AU2003299955A AU2003299955A1 AU 2003299955 A1 AU2003299955 A1 AU 2003299955A1 AU 2003299955 A AU2003299955 A AU 2003299955A AU 2003299955 A AU2003299955 A AU 2003299955A AU 2003299955 A1 AU2003299955 A1 AU 2003299955A1
Authority
AU
Australia
Prior art keywords
solder paste
free solder
alloy lead
mixed alloy
mixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003299955A
Inventor
Edwin Bradley
Brian Fariello
Vahid Kazem Goudari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of AU2003299955A1 publication Critical patent/AU2003299955A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
AU2003299955A 2002-12-31 2003-12-26 Mixed alloy lead-free solder paste Abandoned AU2003299955A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US33413202A 2002-12-31 2002-12-31
US10/334,132 2002-12-31
PCT/US2003/041326 WO2004060604A1 (en) 2002-12-31 2003-12-26 Mixed alloy lead-free solder paste

Publications (1)

Publication Number Publication Date
AU2003299955A1 true AU2003299955A1 (en) 2004-07-29

Family

ID=32710860

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003299955A Abandoned AU2003299955A1 (en) 2002-12-31 2003-12-26 Mixed alloy lead-free solder paste

Country Status (8)

Country Link
US (1) US20060021466A1 (en)
EP (1) EP1585614A4 (en)
JP (1) JP2006512212A (en)
KR (1) KR100645241B1 (en)
CN (1) CN100408251C (en)
AU (1) AU2003299955A1 (en)
BR (1) BR0317901A (en)
WO (1) WO2004060604A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3928657B2 (en) * 2004-03-09 2007-06-13 千住金属工業株式会社 Solder paste
DE102004034035A1 (en) * 2004-07-13 2006-02-09 W.C. Heraeus Gmbh Lead-free solder pastes with increased reliability
CN101454115B (en) * 2006-06-30 2012-04-25 旭化成电子材料株式会社 Conductive filler and solder paste
JP4973109B2 (en) * 2006-10-05 2012-07-11 富士電機株式会社 Manufacturing method of semiconductor device
US8083832B2 (en) * 2007-02-27 2011-12-27 International Rectifier Corporation Paste for forming an interconnect and interconnect formed from the paste
CN102171162B (en) * 2008-09-30 2014-12-24 倍耐力&C.Eco技术股份公司 Honeycomb structural body for exhaust gas purification
KR101535404B1 (en) * 2014-03-05 2015-07-10 주식회사 네패스 Semiconductor package and method of manufacturing the same
WO2019027261A1 (en) * 2017-08-01 2019-02-07 서울시립대학교 산학협력단 Lead-free solder alloy composition and preparation method therefor
CN110961831B (en) * 2018-09-28 2022-08-19 株式会社田村制作所 Forming solder and manufacturing method of forming solder

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5527628A (en) * 1993-07-20 1996-06-18 Iowa State University Research Foudation, Inc. Pb-free Sn-Ag-Cu ternary eutectic solder
US5429689A (en) * 1993-09-07 1995-07-04 Ford Motor Company Lead-free solder alloys
US5455004A (en) * 1993-10-25 1995-10-03 The Indium Corporation Of America Lead-free alloy containing tin, zinc, indium and bismuth
US5439639A (en) * 1994-01-05 1995-08-08 Sandia Corporation Tin-silver-bismuth solders for electronics assembly
US5427865A (en) * 1994-05-02 1995-06-27 Motorola, Inc. Multiple alloy solder preform
US5540379A (en) * 1994-05-02 1996-07-30 Motorola, Inc. Soldering process
JP3776505B2 (en) * 1996-05-02 2006-05-17 松下電器産業株式会社 Solder joint
US5928404A (en) * 1997-03-28 1999-07-27 Ford Motor Company Electrical solder and method of manufacturing
JPH11186712A (en) * 1997-12-24 1999-07-09 Nissan Motor Co Ltd Solder paste and connecting method
JPH11291083A (en) * 1998-04-14 1999-10-26 Murata Mfg Co Ltd Solder alloy
EP1180411A1 (en) * 2000-08-17 2002-02-20 Senju Metal Industry Co., Ltd. Lead-free paste for reflow soldering
US6433425B1 (en) * 2000-09-12 2002-08-13 International Business Machines Corporation Electronic package interconnect structure comprising lead-free solders
JP4438974B2 (en) * 2000-10-05 2010-03-24 千住金属工業株式会社 Solder paste
GB2380964B (en) * 2001-09-04 2005-01-12 Multicore Solders Ltd Lead-free solder paste
US6767411B2 (en) * 2002-03-15 2004-07-27 Delphi Technologies, Inc. Lead-free solder alloy and solder reflow process

Also Published As

Publication number Publication date
JP2006512212A (en) 2006-04-13
EP1585614A4 (en) 2008-07-30
CN100408251C (en) 2008-08-06
WO2004060604A1 (en) 2004-07-22
KR100645241B1 (en) 2006-11-15
US20060021466A1 (en) 2006-02-02
CN1732063A (en) 2006-02-08
EP1585614A1 (en) 2005-10-19
BR0317901A (en) 2005-11-29
KR20050085941A (en) 2005-08-29

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase