BE857125A - Boitier de circuit integre et son procede de fabrication - Google Patents
Boitier de circuit integre et son procede de fabricationInfo
- Publication number
- BE857125A BE857125A BE179612A BE179612A BE857125A BE 857125 A BE857125 A BE 857125A BE 179612 A BE179612 A BE 179612A BE 179612 A BE179612 A BE 179612A BE 857125 A BE857125 A BE 857125A
- Authority
- BE
- Belgium
- Prior art keywords
- integrated circuit
- manufacturing process
- circuit box
- box
- manufacturing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dispersion Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casings For Electric Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/710,043 US4079511A (en) | 1976-07-30 | 1976-07-30 | Method for packaging hermetically sealed integrated circuit chips on lead frames |
Publications (1)
Publication Number | Publication Date |
---|---|
BE857125A true BE857125A (fr) | 1978-01-25 |
Family
ID=24852388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE179612A BE857125A (fr) | 1976-07-30 | 1977-07-25 | Boitier de circuit integre et son procede de fabrication |
Country Status (12)
Country | Link |
---|---|
US (1) | US4079511A (xx) |
JP (2) | JPS5317276A (xx) |
BE (1) | BE857125A (xx) |
BR (1) | BR7704965A (xx) |
CA (1) | CA1069220A (xx) |
DE (1) | DE2734439A1 (xx) |
ES (2) | ES461133A1 (xx) |
FR (1) | FR2360174A1 (xx) |
GB (1) | GB1524776A (xx) |
IT (1) | IT1080619B (xx) |
NL (1) | NL7707424A (xx) |
SE (1) | SE423846B (xx) |
Families Citing this family (148)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4089575A (en) * | 1976-09-27 | 1978-05-16 | Amp Incorporated | Connector for connecting a circuit element to the surface of a substrate |
US4326214A (en) * | 1976-11-01 | 1982-04-20 | National Semiconductor Corporation | Thermal shock resistant package having an ultraviolet light transmitting window for a semiconductor chip |
US4136357A (en) * | 1977-10-03 | 1979-01-23 | National Semiconductor Corporation | Integrated circuit package with optical input coupler |
US4195193A (en) * | 1979-02-23 | 1980-03-25 | Amp Incorporated | Lead frame and chip carrier housing |
FR2456390A1 (fr) * | 1979-05-11 | 1980-12-05 | Thomson Csf | Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier |
US4258411A (en) * | 1979-05-21 | 1981-03-24 | Bell Telephone Laboratories, Incorporated | Electronic device packaging arrangement |
JPS5623759A (en) * | 1979-08-01 | 1981-03-06 | Hitachi Ltd | Resin-sealed semiconductor device and manufacture thereof |
US4303934A (en) * | 1979-08-30 | 1981-12-01 | Burr-Brown Research Corp. | Molded lead frame dual in line package including a hybrid circuit |
US4289922A (en) * | 1979-09-04 | 1981-09-15 | Plessey Incorporated | Integrated circuit package and lead frame |
JPS6356706B2 (xx) * | 1980-02-12 | 1988-11-09 | Mostek Corp | |
US4330790A (en) * | 1980-03-24 | 1982-05-18 | National Semiconductor Corporation | Tape operated semiconductor device packaging |
US4364620A (en) * | 1980-09-05 | 1982-12-21 | Mostek Corporation | Socket for housing a plurality of integrated circuits |
US4549247A (en) * | 1980-11-21 | 1985-10-22 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Carrier element for IC-modules |
DE3123198C2 (de) * | 1980-12-08 | 1993-10-07 | Gao Ges Automation Org | Trägerelemente für einen IC-Baustein |
US4391531A (en) * | 1980-12-19 | 1983-07-05 | Timex Corporation | Electrooptical display/lead frame subassembly and timepiece module including same |
US4381602A (en) * | 1980-12-29 | 1983-05-03 | Honeywell Information Systems Inc. | Method of mounting an I.C. chip on a substrate |
US4527185A (en) * | 1981-01-12 | 1985-07-02 | Avx Corporation | Integrated circuit device and subassembly |
US4454529A (en) * | 1981-01-12 | 1984-06-12 | Avx Corporation | Integrated circuit device having internal dampening for a plurality of power supplies |
EP0069733A1 (en) * | 1981-01-15 | 1983-01-19 | Mostek Corporation | Integrated circuit package |
FR2498814B1 (fr) * | 1981-01-26 | 1985-12-20 | Burroughs Corp | Boitier pour circuit integre, moyen pour le montage et procede de fabrication |
JPS57181146A (en) * | 1981-04-30 | 1982-11-08 | Hitachi Ltd | Resin-sealed semiconductor device |
US4496965A (en) * | 1981-05-18 | 1985-01-29 | Texas Instruments Incorporated | Stacked interdigitated lead frame assembly |
US5055704A (en) * | 1984-07-23 | 1991-10-08 | Sgs-Thomson Microelectronics, Inc. | Integrated circuit package with battery housing |
US4574297A (en) * | 1981-07-15 | 1986-03-04 | Rohm Company Limited | Encapsulated semiconductor with terminals having tabs to increase solder wetting |
EP0077276A3 (en) * | 1981-10-13 | 1986-03-26 | FAIRCHILD CAMERA & INSTRUMENT CORPORATION | Method for fabricating a hybrid circuit module |
FR2521350B1 (fr) * | 1982-02-05 | 1986-01-24 | Hitachi Ltd | Boitier porteur de puce semi-conductrice |
JPS58169948A (ja) * | 1982-03-30 | 1983-10-06 | Fujitsu Ltd | 樹脂封止型半導体装置 |
US4445736A (en) * | 1982-03-31 | 1984-05-01 | Amp Incorporated | Method and apparatus for producing a premolded packaging |
JPS58153459U (ja) * | 1982-04-07 | 1983-10-14 | 三菱電機株式会社 | 半導体装置 |
JPS592152U (ja) * | 1982-06-28 | 1984-01-09 | 富士通株式会社 | リ−ド付チツプキヤリア |
US4594770A (en) * | 1982-07-15 | 1986-06-17 | Olin Corporation | Method of making semiconductor casing |
US4480262A (en) * | 1982-07-15 | 1984-10-30 | Olin Corporation | Semiconductor casing |
US4633573A (en) * | 1982-10-12 | 1987-01-06 | Aegis, Inc. | Microcircuit package and sealing method |
US4477828A (en) * | 1982-10-12 | 1984-10-16 | Scherer Jeremy D | Microcircuit package and sealing method |
US5357057A (en) * | 1982-10-12 | 1994-10-18 | Raychem Corporation | Protected electrical connector |
DE3248385A1 (de) * | 1982-12-28 | 1984-06-28 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit integriertem schaltkreis |
JPS59189662A (ja) * | 1983-04-13 | 1984-10-27 | Fujitsu Ltd | 樹脂封止型半導体装置 |
US4567545A (en) * | 1983-05-18 | 1986-01-28 | Mettler Rollin W Jun | Integrated circuit module and method of making same |
US4736520A (en) * | 1983-11-04 | 1988-04-12 | Control Data Corporation | Process for assembling integrated circuit packages |
IT1213139B (it) * | 1984-02-17 | 1989-12-14 | Ates Componenti Elettron | Componente elettronico integrato di tipo "single-in-line" eprocedimento per la sua fabbricazione. |
US4663650A (en) * | 1984-05-02 | 1987-05-05 | Gte Products Corporation | Packaged integrated circuit chip |
IT1180514B (it) * | 1984-07-27 | 1987-09-23 | Arcotroniks Italia Spa | Procedimento per la realizzazione di involucri protettivi in cui risultano annegati corrispondenti componenti elettrico elettronici |
US4783697A (en) * | 1985-01-07 | 1988-11-08 | Motorola, Inc. | Leadless chip carrier for RF power transistors or the like |
GB2174538A (en) * | 1985-04-24 | 1986-11-05 | Stanley Bracey | Semiconductor package |
JPS628639U (xx) * | 1985-06-28 | 1987-01-19 | ||
JPH0325410Y2 (xx) * | 1985-08-10 | 1991-06-03 | ||
US4754317A (en) * | 1986-04-28 | 1988-06-28 | Monolithic Memories, Inc. | Integrated circuit die-to-lead frame interconnection assembly and method |
DE3616969A1 (de) * | 1986-05-20 | 1987-11-26 | Bosch Gmbh Robert | Gehaeuse fuer integrierte schaltkreise |
US4809135A (en) * | 1986-08-04 | 1989-02-28 | General Electric Company | Chip carrier and method of fabrication |
US4800419A (en) * | 1987-01-28 | 1989-01-24 | Lsi Logic Corporation | Support assembly for integrated circuits |
US4874722A (en) * | 1987-04-16 | 1989-10-17 | Texas Instruments Incorporated | Process of packaging a semiconductor device with reduced stress forces |
US4878108A (en) * | 1987-06-15 | 1989-10-31 | International Business Machines Corporation | Heat dissipation package for integrated circuits |
US4939014A (en) * | 1987-12-16 | 1990-07-03 | Ford Motor Company | Composite polymer/desiccant coatings for IC encapsulation |
US4977009A (en) * | 1987-12-16 | 1990-12-11 | Ford Motor Company | Composite polymer/desiccant coatings for IC encapsulation |
US4852250A (en) * | 1988-01-19 | 1989-08-01 | Microelectronics And Computer Technology Corporation | Hermetically sealed package having an electronic component and method of making |
US4872260A (en) * | 1988-01-19 | 1989-10-10 | Gte Products Corporation | Method of making pre-formed lead-ins for an IC package |
US5019892A (en) * | 1988-02-18 | 1991-05-28 | Amp Incorporated | Chip carrier with accumulator |
EP0401211B1 (de) * | 1988-02-20 | 1993-05-19 | Deutsche ITT Industries GmbH | Halbleiterbauelement, herstellungsverfahren, vorrichtung und montageplatz |
US5058800A (en) * | 1988-05-30 | 1991-10-22 | Canon Kabushiki Kaisha | Method of making electric circuit device |
FR2634616B1 (fr) * | 1988-07-20 | 1995-08-25 | Matra | Procede de montage de micro-composants electroniques sur un support et produit realisable par le procede |
US4959751A (en) * | 1988-08-16 | 1990-09-25 | Delco Electronics Corporation | Ceramic hybrid integrated circuit having surface mount device solder stress reduction |
US5121298A (en) * | 1988-08-16 | 1992-06-09 | Delco Electronics Corporation | Controlled adhesion conductor |
US5276351A (en) * | 1988-10-17 | 1994-01-04 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device and a manufacturing method for the same |
US5205036A (en) * | 1988-10-17 | 1993-04-27 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device with selective coating on lead frame |
US5092034A (en) * | 1988-12-19 | 1992-03-03 | Hewlett-Packard Company | Soldering interconnect method for semiconductor packages |
US5101550A (en) * | 1989-02-10 | 1992-04-07 | Honeywell Inc. | Removable drop-through die bond frame |
US5074036A (en) * | 1989-02-10 | 1991-12-24 | Honeywell Inc. | Method of die bonding semiconductor chip by using removable frame |
US4979289A (en) * | 1989-02-10 | 1990-12-25 | Honeywell Inc. | Method of die bonding semiconductor chip by using removable non-wettable by solder frame |
JP2855719B2 (ja) * | 1989-03-20 | 1999-02-10 | セイコーエプソン株式会社 | 半導体装置 |
US5142444A (en) * | 1989-08-31 | 1992-08-25 | Hewlett-Packard Company | Demountable tape-automated bonding system |
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-
1976
- 1976-07-30 US US05/710,043 patent/US4079511A/en not_active Expired - Lifetime
-
1977
- 1977-06-28 CA CA281,572A patent/CA1069220A/en not_active Expired
- 1977-06-30 IT IT25269/77A patent/IT1080619B/it active
- 1977-07-05 NL NL7707424A patent/NL7707424A/xx not_active Application Discontinuation
- 1977-07-12 GB GB29140/77A patent/GB1524776A/en not_active Expired
- 1977-07-13 SE SE7708156A patent/SE423846B/xx not_active IP Right Cessation
- 1977-07-25 BE BE179612A patent/BE857125A/xx not_active IP Right Cessation
- 1977-07-27 FR FR7723098A patent/FR2360174A1/fr active Granted
- 1977-07-28 BR BR7704965A patent/BR7704965A/pt unknown
- 1977-07-28 JP JP8989177A patent/JPS5317276A/ja active Granted
- 1977-07-29 ES ES461133A patent/ES461133A1/es not_active Expired
- 1977-07-29 DE DE19772734439 patent/DE2734439A1/de active Granted
- 1977-10-06 ES ES462978A patent/ES462978A1/es not_active Expired
-
1984
- 1984-07-27 JP JP59155643A patent/JPS60126850A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
ES462978A1 (es) | 1978-06-01 |
CA1069220A (en) | 1980-01-01 |
JPS6229908B2 (xx) | 1987-06-29 |
BR7704965A (pt) | 1978-04-25 |
JPS6143851B2 (xx) | 1986-09-30 |
JPS5317276A (en) | 1978-02-17 |
ES461133A1 (es) | 1978-06-01 |
US4079511A (en) | 1978-03-21 |
JPS60126850A (ja) | 1985-07-06 |
SE7708156L (sv) | 1978-01-31 |
GB1524776A (en) | 1978-09-13 |
DE2734439C2 (xx) | 1988-08-25 |
NL7707424A (nl) | 1978-02-01 |
IT1080619B (it) | 1985-05-16 |
DE2734439A1 (de) | 1978-02-02 |
FR2360174A1 (fr) | 1978-02-24 |
FR2360174B1 (xx) | 1983-01-21 |
SE423846B (sv) | 1982-06-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RE | Patent lapsed |
Owner name: AMP INC. (UNE SOC. DE PENNSYLVANIE) Effective date: 19960731 |