JPS628639U - - Google Patents
Info
- Publication number
- JPS628639U JPS628639U JP9963685U JP9963685U JPS628639U JP S628639 U JPS628639 U JP S628639U JP 9963685 U JP9963685 U JP 9963685U JP 9963685 U JP9963685 U JP 9963685U JP S628639 U JPS628639 U JP S628639U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lead pin
- semiconductor package
- groove
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 15
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9963685U JPS628639U (xx) | 1985-06-28 | 1985-06-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9963685U JPS628639U (xx) | 1985-06-28 | 1985-06-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS628639U true JPS628639U (xx) | 1987-01-19 |
Family
ID=30968698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9963685U Pending JPS628639U (xx) | 1985-06-28 | 1985-06-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS628639U (xx) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5317276A (en) * | 1976-07-30 | 1978-02-17 | Amp Inc | Integrated circuit package and method of manufacture thereof |
JPS55117263A (en) * | 1979-02-23 | 1980-09-09 | Amp Inc | Lead frame for integrated circuit |
-
1985
- 1985-06-28 JP JP9963685U patent/JPS628639U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5317276A (en) * | 1976-07-30 | 1978-02-17 | Amp Inc | Integrated circuit package and method of manufacture thereof |
JPS55117263A (en) * | 1979-02-23 | 1980-09-09 | Amp Inc | Lead frame for integrated circuit |