FR2309036A1 - Dispositif semiconducteur et son procede de fabrication - Google Patents
Dispositif semiconducteur et son procede de fabricationInfo
- Publication number
- FR2309036A1 FR2309036A1 FR7611731A FR7611731A FR2309036A1 FR 2309036 A1 FR2309036 A1 FR 2309036A1 FR 7611731 A FR7611731 A FR 7611731A FR 7611731 A FR7611731 A FR 7611731A FR 2309036 A1 FR2309036 A1 FR 2309036A1
- Authority
- FR
- France
- Prior art keywords
- semiconductor device
- manufacturing process
- manufacturing
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/3165—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation
- H01L21/31654—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation of semiconductor materials, e.g. the body itself
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/318—Inorganic layers composed of nitrides
- H01L21/3185—Inorganic layers composed of nitrides of siliconnitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/8605—Resistors with PN junctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/0217—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/061—Gettering-armorphous layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/085—Isolated-integrated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/112—Nitridation, direct, of silicon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/114—Nitrides of silicon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/958—Passivation layer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- High Energy & Nuclear Physics (AREA)
- Ceramic Engineering (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Bipolar Transistors (AREA)
- Element Separation (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50048378A JPS6041458B2 (ja) | 1975-04-21 | 1975-04-21 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2309036A1 true FR2309036A1 (fr) | 1976-11-19 |
FR2309036B1 FR2309036B1 (fr) | 1980-07-25 |
Family
ID=12801650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7611731A Granted FR2309036A1 (fr) | 1975-04-21 | 1976-04-21 | Dispositif semiconducteur et son procede de fabrication |
Country Status (7)
Country | Link |
---|---|
US (1) | US4084986A (fr) |
JP (1) | JPS6041458B2 (fr) |
CA (1) | CA1071772A (fr) |
DE (1) | DE2617397A1 (fr) |
FR (1) | FR2309036A1 (fr) |
GB (1) | GB1536719A (fr) |
NL (1) | NL7604237A (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2371779A1 (fr) * | 1976-11-19 | 1978-06-16 | Philips Nv | Dispositif semi-conducteur a faible capacite parasite et son procede de fabrication |
FR2382095A1 (fr) * | 1977-02-24 | 1978-09-22 | Rca Corp | Structure de passivation en plusieurs couches et procede de fabrication |
EP0137319A2 (fr) * | 1983-09-26 | 1985-04-17 | Kabushiki Kaisha Toshiba | Dispositif semi-conducteur et procédé de fabrication |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4105805A (en) * | 1976-12-29 | 1978-08-08 | The United States Of America As Represented By The Secretary Of The Army | Formation of metal nitride oxide semiconductor (MNOS) by ion implantation of oxygen through a silicon nitride layer |
DE2730367A1 (de) * | 1977-07-05 | 1979-01-18 | Siemens Ag | Verfahren zum passivieren von halbleiterelementen |
JPS5841659B2 (ja) * | 1977-08-30 | 1983-09-13 | 株式会社東芝 | 絶縁膜の形成方法 |
JPS5721856B2 (en) * | 1977-11-28 | 1982-05-10 | Nippon Telegraph & Telephone | Semiconductor and its manufacture |
US4473597A (en) * | 1978-02-01 | 1984-09-25 | Rca Corporation | Method and structure for passivating a PN junction |
US4742384A (en) * | 1978-02-01 | 1988-05-03 | Rca Corporation | Structure for passivating a PN junction |
JPS5939906B2 (ja) * | 1978-05-04 | 1984-09-27 | 超エル・エス・アイ技術研究組合 | 半導体装置の製造方法 |
DE2836911C2 (de) * | 1978-08-23 | 1986-11-06 | Siemens AG, 1000 Berlin und 8000 München | Passivierungsschicht für Halbleiterbauelemente |
US4242697A (en) * | 1979-03-14 | 1980-12-30 | Bell Telephone Laboratories, Incorporated | Dielectrically isolated high voltage semiconductor devices |
FR2459551A1 (fr) * | 1979-06-19 | 1981-01-09 | Thomson Csf | Procede et structure de passivation a autoalignement sur l'emplacement d'un masque |
JPS5640269A (en) * | 1979-09-11 | 1981-04-16 | Toshiba Corp | Preparation of semiconductor device |
JPS5679449A (en) * | 1979-11-30 | 1981-06-30 | Mitsubishi Electric Corp | Production of semiconductor device |
US4315782A (en) * | 1980-07-21 | 1982-02-16 | Rca Corporation | Method of making semiconductor device with passivated rectifying junctions having hydrogenated amorphous regions |
US4803528A (en) * | 1980-07-28 | 1989-02-07 | General Electric Company | Insulating film having electrically conducting portions |
US4339285A (en) * | 1980-07-28 | 1982-07-13 | Rca Corporation | Method for fabricating adjacent conducting and insulating regions in a film by laser irradiation |
US4430404A (en) | 1981-04-30 | 1984-02-07 | Hitachi, Ltd. | Electrophotographic photosensitive material having thin amorphous silicon protective layer |
US4420765A (en) * | 1981-05-29 | 1983-12-13 | Rca Corporation | Multi-layer passivant system |
US4417385A (en) * | 1982-08-09 | 1983-11-29 | General Electric Company | Processes for manufacturing insulated-gate semiconductor devices with integral shorts |
US4466176A (en) * | 1982-08-09 | 1984-08-21 | General Electric Company | Process for manufacturing insulated-gate semiconductor devices with integral shorts |
JPS6242829U (fr) * | 1985-08-30 | 1987-03-14 | ||
US4814285A (en) * | 1985-09-23 | 1989-03-21 | Harris Corp. | Method for forming planarized interconnect level using selective deposition and ion implantation |
JPS6276673A (ja) * | 1985-09-30 | 1987-04-08 | Toshiba Corp | 高耐圧半導体装置 |
GB2183905B (en) * | 1985-11-18 | 1989-10-04 | Plessey Co Plc | Method of semiconductor device manufacture |
DE3542166A1 (de) * | 1985-11-29 | 1987-06-04 | Telefunken Electronic Gmbh | Halbleiterbauelement |
US4705760A (en) * | 1986-01-16 | 1987-11-10 | Rca Corporation | Preparation of a surface for deposition of a passinating layer |
US4682407A (en) * | 1986-01-21 | 1987-07-28 | Motorola, Inc. | Means and method for stabilizing polycrystalline semiconductor layers |
US4740481A (en) * | 1986-01-21 | 1988-04-26 | Motorola Inc. | Method of preventing hillock formation in polysilicon layer by oxygen implanation |
KR900005038B1 (ko) * | 1987-07-31 | 1990-07-18 | 삼성전자 주식회사 | 고저항 다결정 실리콘의 제조방법 |
US4993427A (en) * | 1989-11-09 | 1991-02-19 | Sonotek Corporation | Heart contraction monitor |
JP2601136B2 (ja) * | 1993-05-07 | 1997-04-16 | 日本電気株式会社 | 半導体装置の製造方法 |
GB2323706B (en) * | 1997-03-13 | 2002-02-13 | United Microelectronics Corp | Method to inhibit the formation of ion implantation induced edge defects |
US5930659A (en) * | 1997-12-05 | 1999-07-27 | Advanced Microdevices, Inc. | Forming minimal size spaces in integrated circuit conductive lines |
US6046109A (en) * | 1997-12-29 | 2000-04-04 | Industrial Technology Research Institute | Creation of local semi-insulating regions on semiconductor substrates |
US6458645B2 (en) * | 1998-02-26 | 2002-10-01 | Micron Technology, Inc. | Capacitor having tantalum oxynitride film and method for making same |
US6995821B1 (en) * | 1999-04-23 | 2006-02-07 | International Business Machines Corporation | Methods of reducing unbalanced DC voltage between two electrodes of reflective liquid crystal display by thin film passivation |
US6635983B1 (en) * | 1999-09-02 | 2003-10-21 | Micron Technology, Inc. | Nitrogen and phosphorus doped amorphous silicon as resistor for field emission device baseplate |
KR100711000B1 (ko) * | 2005-11-28 | 2007-04-24 | 동부일렉트로닉스 주식회사 | 이중 게이트를 구비한 모스트랜지스터 및 그 제조방법 |
JP5195186B2 (ja) * | 2008-09-05 | 2013-05-08 | 三菱電機株式会社 | 半導体装置の製造方法 |
US20150050816A1 (en) * | 2013-08-19 | 2015-02-19 | Korea Atomic Energy Research Institute | Method of electrochemically preparing silicon film |
CN113774494B (zh) * | 2021-11-15 | 2022-03-29 | 浙江大学杭州国际科创中心 | 一种半绝缘型碳化硅单晶片剥离方法及剥离装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3563809A (en) * | 1968-08-05 | 1971-02-16 | Hughes Aircraft Co | Method of making semiconductor devices with ion beams |
JPS4936792B1 (fr) * | 1970-10-15 | 1974-10-03 | ||
US3897274A (en) * | 1971-06-01 | 1975-07-29 | Texas Instruments Inc | Method of fabricating dielectrically isolated semiconductor structures |
JPS4939235A (fr) * | 1972-08-24 | 1974-04-12 | ||
US3900345A (en) * | 1973-08-02 | 1975-08-19 | Motorola Inc | Thin low temperature epi regions by conversion of an amorphous layer |
JPS532552B2 (fr) * | 1974-03-30 | 1978-01-28 |
-
1975
- 1975-04-21 JP JP50048378A patent/JPS6041458B2/ja not_active Expired
-
1976
- 1976-04-15 GB GB15648/76A patent/GB1536719A/en not_active Expired
- 1976-04-19 US US05/678,061 patent/US4084986A/en not_active Expired - Lifetime
- 1976-04-20 CA CA250,473A patent/CA1071772A/fr not_active Expired
- 1976-04-21 NL NL7604237A patent/NL7604237A/xx not_active Application Discontinuation
- 1976-04-21 FR FR7611731A patent/FR2309036A1/fr active Granted
- 1976-04-21 DE DE19762617397 patent/DE2617397A1/de not_active Withdrawn
Non-Patent Citations (3)
Title |
---|
EXBK/71 * |
NV362/76 * |
NV931/75 * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2371779A1 (fr) * | 1976-11-19 | 1978-06-16 | Philips Nv | Dispositif semi-conducteur a faible capacite parasite et son procede de fabrication |
FR2382095A1 (fr) * | 1977-02-24 | 1978-09-22 | Rca Corp | Structure de passivation en plusieurs couches et procede de fabrication |
EP0137319A2 (fr) * | 1983-09-26 | 1985-04-17 | Kabushiki Kaisha Toshiba | Dispositif semi-conducteur et procédé de fabrication |
EP0137319A3 (en) * | 1983-09-26 | 1985-08-14 | Kabushiki Kaisha Toshiba | Semiconductor device and a method of manufacturing the same |
US4585489A (en) * | 1983-09-26 | 1986-04-29 | Kabushiki Kaisha Toshiba | Method of controlling lifetime of minority carriers by electron beam irradiation through semi-insulating layer |
Also Published As
Publication number | Publication date |
---|---|
CA1071772A (fr) | 1980-02-12 |
JPS6041458B2 (ja) | 1985-09-17 |
DE2617397A1 (de) | 1976-11-04 |
US4084986A (en) | 1978-04-18 |
FR2309036B1 (fr) | 1980-07-25 |
GB1536719A (en) | 1978-12-20 |
NL7604237A (nl) | 1976-10-25 |
JPS51123561A (en) | 1976-10-28 |
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