AU2003268904A8 - Support for substrates and compound comprising a support substrate and an extremely thin substrate - Google Patents
Support for substrates and compound comprising a support substrate and an extremely thin substrateInfo
- Publication number
- AU2003268904A8 AU2003268904A8 AU2003268904A AU2003268904A AU2003268904A8 AU 2003268904 A8 AU2003268904 A8 AU 2003268904A8 AU 2003268904 A AU2003268904 A AU 2003268904A AU 2003268904 A AU2003268904 A AU 2003268904A AU 2003268904 A8 AU2003268904 A8 AU 2003268904A8
- Authority
- AU
- Australia
- Prior art keywords
- support
- substrate
- substrates
- compound
- extremely thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
Applications Claiming Priority (15)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE20215401.7 | 2002-10-07 | ||
DE20215401U DE20215401U1 (en) | 2002-10-07 | 2002-10-07 | Composite of a thin substrate and a carrier substrate with releasable connecting means |
DE10323303.2 | 2003-05-21 | ||
DE10323302A DE10323302A1 (en) | 2002-10-07 | 2003-05-21 | Composite comprises thin substrate (e.g. glass) less than 0.3 mm thick releasably bound to carrier substrate having fine structuring with open, infinitesimal cavities, useful in e.g. display industry, polymer electronics, and biotechnology |
DE10323302.4 | 2003-05-21 | ||
DE10323304A DE10323304A1 (en) | 2002-10-07 | 2003-05-21 | Composite comprises thin substrate (e.g. glass) less than 0.3 mm thick releasably bound to carrier substrate through adhesive force, useful e.g. in display industry, in polymer electronics, photovoltaic industry, sensors and biotechnology |
DE10323301.6 | 2003-05-21 | ||
DE10323301A DE10323301A1 (en) | 2002-10-07 | 2003-05-21 | Composite comprises thin substrate (e.g. glass) less than 0.3 mm thick releasably bound to carrier substrate by electrostatic force, useful e.g. in display industry, in polymer electronics, photovoltaic industry, sensors and biotechnology |
DE10323304.0 | 2003-05-21 | ||
DE10323303A DE10323303A1 (en) | 2002-10-07 | 2003-05-21 | Composite comprises thin substrate (e.g. glass) having less than 0.3 mm thickness releasably bound to carrier substrate through bonding material, useful in e.g. display industry, polymer electronics, in sensors, biotechnology and medicine |
DE10330430A DE10330430A1 (en) | 2003-07-04 | 2003-07-04 | Composite used e.g. in displays and in the production of optoelectronic components comprises an extremely thin substrate connected to a support substrate by a connecting material |
DE10330430.4 | 2003-07-04 | ||
PCT/EP2003/010358 WO2004032593A2 (en) | 2002-10-07 | 2003-09-18 | Extremely thin substrate support |
AU2003283248 | 2003-09-18 | ||
PCT/EP2003/010907 WO2004033197A2 (en) | 2002-10-07 | 2003-10-02 | Support for substrates and compound comprising a support substrate and an extremely thin substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
AU2003268904A1 AU2003268904A1 (en) | 2004-05-04 |
AU2003268904A8 true AU2003268904A8 (en) | 2004-05-04 |
Family
ID=32097194
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003268904A Abandoned AU2003268904A1 (en) | 2002-10-07 | 2003-10-02 | Support for substrates and compound comprising a support substrate and an extremely thin substrate |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU2003268904A1 (en) |
WO (1) | WO2004033197A2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI450047B (en) | 2007-07-13 | 2014-08-21 | Mapper Lithography Ip Bv | Lithography ststem, method of clamping and wafer table |
US8705010B2 (en) | 2007-07-13 | 2014-04-22 | Mapper Lithography Ip B.V. | Lithography system, method of clamping and wafer table |
DE102012215149A1 (en) * | 2012-08-27 | 2014-03-20 | Schott Ag | Glass substrate tape |
CN105307864B (en) | 2013-06-20 | 2018-03-30 | 肖特玻璃科技(苏州)有限公司 | The conjugant of thin glass on the support substrate and its production and use |
DE102015112036B4 (en) * | 2015-07-23 | 2017-05-11 | Schott Ag | Monolithic underlay for full surface support of a workpiece |
WO2017035770A1 (en) * | 2015-09-01 | 2017-03-09 | Schott Glass Technologies (Suzhou) Co., Ltd. | Method for producing a bonded glass article and a bonded glass article |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DD285085A5 (en) * | 1989-06-16 | 1990-12-05 | Veb Werk Fuer Technisches Glas Ilmenau,Dd | METHOD AND DEVICE FOR COATING CROSS-SECTION FLAT GLASS |
JPH0740870B2 (en) * | 1991-07-26 | 1995-05-10 | 株式会社いかるが牛乳 | Method for producing low-lactose milk |
JP3263128B2 (en) * | 1992-06-26 | 2002-03-04 | ローム株式会社 | Processing of thin glass |
JP2915254B2 (en) * | 1993-07-29 | 1999-07-05 | セントラル硝子株式会社 | Attachment of thin glass and method of transporting it |
DE19649488A1 (en) * | 1996-11-29 | 1997-11-06 | Schott Glaswerke | Pneumatic handling or transport system and for thin glass sheet in display manufacture |
JP4328465B2 (en) * | 1997-10-24 | 2009-09-09 | 奇美電子股▲分▼有限公司 | Laminate comprising a thin borosilicate glass substrate as a constituent layer, method of use and production |
US6689414B2 (en) * | 1999-02-16 | 2004-02-10 | Schott Glas | Method of protecting glass substrate surfaces |
JP2000252342A (en) * | 1999-03-01 | 2000-09-14 | Seiko Epson Corp | Method for transporting thin plate and manufacture of liquid crystal panel |
EP1217655A1 (en) * | 2000-12-23 | 2002-06-26 | VenTec Gesellschaft für Venturekapital und Unternehmensberatung | Method of handling a thin wafer |
JP2005538536A (en) * | 2002-07-17 | 2005-12-15 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Anti-crushing ultra-thin glass and its handling |
-
2003
- 2003-10-02 AU AU2003268904A patent/AU2003268904A1/en not_active Abandoned
- 2003-10-02 WO PCT/EP2003/010907 patent/WO2004033197A2/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO2004033197A3 (en) | 2004-08-05 |
AU2003268904A1 (en) | 2004-05-04 |
WO2004033197A2 (en) | 2004-04-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |