AU2003254924A1 - Copper flake powder, method for producing copper flake powder, and conductive paste using copper flake powder - Google Patents

Copper flake powder, method for producing copper flake powder, and conductive paste using copper flake powder

Info

Publication number
AU2003254924A1
AU2003254924A1 AU2003254924A AU2003254924A AU2003254924A1 AU 2003254924 A1 AU2003254924 A1 AU 2003254924A1 AU 2003254924 A AU2003254924 A AU 2003254924A AU 2003254924 A AU2003254924 A AU 2003254924A AU 2003254924 A1 AU2003254924 A1 AU 2003254924A1
Authority
AU
Australia
Prior art keywords
flake powder
copper flake
conductive paste
producing
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003254924A
Inventor
Takahiko Sakaue
Kunihiko Yasunari
Katsuhiko Yoshimaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Publication of AU2003254924A1 publication Critical patent/AU2003254924A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B22F1/068—Flake-like particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/12—Metallic powder containing non-metallic particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
AU2003254924A 2002-11-22 2003-08-11 Copper flake powder, method for producing copper flake powder, and conductive paste using copper flake powder Abandoned AU2003254924A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002-338990 2002-11-22
JP2002338990A JP4145127B2 (en) 2002-11-22 2002-11-22 Flake copper powder, method for producing the flake copper powder, and conductive paste using the flake copper powder
PCT/JP2003/010192 WO2004048017A1 (en) 2002-11-22 2003-08-11 Copper flake powder, method for producing copper flake powder, and conductive paste using copper flake powder

Publications (1)

Publication Number Publication Date
AU2003254924A1 true AU2003254924A1 (en) 2004-06-18

Family

ID=32375760

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003254924A Abandoned AU2003254924A1 (en) 2002-11-22 2003-08-11 Copper flake powder, method for producing copper flake powder, and conductive paste using copper flake powder

Country Status (9)

Country Link
US (1) US20060137488A1 (en)
JP (1) JP4145127B2 (en)
KR (1) KR100613033B1 (en)
CN (1) CN1292861C (en)
AU (1) AU2003254924A1 (en)
CA (1) CA2506367A1 (en)
DE (1) DE10393768T5 (en)
TW (1) TWI236393B (en)
WO (1) WO2004048017A1 (en)

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JP4540945B2 (en) * 2003-06-26 2010-09-08 住友大阪セメント株式会社 Coating for forming metal thin film, metal thin film and method for producing the same
JP4859362B2 (en) * 2004-11-04 2012-01-25 三井金属鉱業株式会社 Flake nickel powder, method for producing the same, and conductive paste
JP4613362B2 (en) * 2005-01-31 2011-01-19 Ｄｏｗａエレクトロニクス株式会社 Metal powder for conductive paste and conductive paste
JP5144022B2 (en) * 2006-03-24 2013-02-13 三井金属鉱業株式会社 Copper powder manufacturing method and copper powder obtained by the manufacturing method
EP2009066B8 (en) 2006-04-05 2013-05-01 Nippon Sheet Glass Company, Limited Flaky particles and luster pigment, and cosmetic, coating composition, resin composition and ink composition each containing the same
JP5563732B2 (en) * 2007-01-19 2014-07-30 日本光研工業株式会社 Smooth flaky powder, highly bright pigment and method for producing the same
JP4922793B2 (en) * 2007-03-09 2012-04-25 アルファーサイエンティフィック株式会社 Mixed conductive powder and method for producing the same, conductive paste and method for producing the same
CN100493781C (en) * 2007-04-06 2009-06-03 深圳市危险废物处理站 Method of producing sheet shaped silver-plated copper powder
PL2191482T3 (en) 2007-09-13 2017-08-31 Henkel Ag & Co. Kgaa Electrically conductive composition
US8295033B2 (en) 2010-01-21 2012-10-23 George Van Straten Mobile electricity generator using solar, wind, and fuel-generated power
US8854794B2 (en) 2010-01-21 2014-10-07 George Van Straten Mobile electricity generator using solar panels
JP5820202B2 (en) * 2010-09-30 2015-11-24 Ｄｏｗａエレクトロニクス株式会社 Copper powder for conductive paste and method for producing the same
JP5563607B2 (en) * 2012-01-20 2014-07-30 東洋アルミニウム株式会社 Flaky conductive filler
JP5799948B2 (en) * 2012-02-03 2015-10-28 株式会社村田製作所 Ceramic electronic component and method for manufacturing the same
JP5794222B2 (en) * 2012-02-03 2015-10-14 株式会社村田製作所 Ceramic electronic components
WO2013161966A1 (en) * 2012-04-27 2013-10-31 太陽インキ製造株式会社 Electroconductive composition
KR101565639B1 (en) * 2013-02-20 2015-11-03 삼성전기주식회사 Multi-layered ceramic electronic parts
JP6180769B2 (en) 2013-03-29 2017-08-16 トクセン工業株式会社 Flaky microparticles
CN103273056B (en) * 2013-05-27 2016-01-20 中国科学院过程工程研究所 A kind of flake copper and preparation method thereof
JP2015035581A (en) * 2013-07-10 2015-02-19 株式会社村田製作所 Ceramic electronic component and method for manufacturing the same
JP2015034309A (en) * 2013-08-07 2015-02-19 三井金属鉱業株式会社 Composite copper particles and method for manufacturing the same
JP2015034310A (en) * 2013-08-07 2015-02-19 三井金属鉱業株式会社 Composite copper particles and method for manufacturing the same
CN103773984B (en) * 2014-01-23 2015-10-14 上海交通大学 The powder metallurgy process of Ultra-fine Grained alloy prepared by a kind of micro-nano lamination
WO2015122251A1 (en) * 2014-02-14 2015-08-20 三井金属鉱業株式会社 Copper powder
DE102014008756A1 (en) * 2014-06-12 2015-12-17 Pfisterer Kontaktsysteme Gmbh Device for contacting an electrical conductor and connection or connection device with such a device
CN104117681B (en) * 2014-07-31 2016-02-10 宁波广博纳米新材料股份有限公司 A kind of preparation method of ultra-fine copper sheet
JP5941588B2 (en) * 2014-09-01 2016-06-29 Ｄｏｗａエレクトロニクス株式会社 Bonding material and bonding method using the same
JP6222189B2 (en) * 2014-12-05 2017-11-01 Ｊｆｅスチール株式会社 Alloy steel powder and sintered body for powder metallurgy
CN107206485B (en) * 2015-02-06 2020-06-02 特线工业株式会社 Conductive fine particles
JP6060225B1 (en) * 2015-07-27 2017-01-11 三井金属鉱業株式会社 Copper powder and method for producing the same
SG11201801844XA (en) 2015-09-07 2018-04-27 Hitachi Chemical Co Ltd Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device
KR20170029843A (en) 2015-09-08 2017-03-16 창원대학교 산학협력단 Method for manufacturing metal powder having particle shape modified by milling process
CN105405490A (en) * 2015-12-23 2016-03-16 东洋油墨Sc控股株式会社 Conductive paste for laser processing, conductive sheet, fabrication method of signal layout line and electronic device
US10630100B2 (en) 2016-01-29 2020-04-21 George A. Van Straten Electricity generator having linearly deployed solar panels
CN106363165B (en) * 2016-09-05 2019-02-15 国核电力规划设计研究院 A kind of sheet of copper particle and preparation method thereof, catalyst, electrode
CN107414070A (en) * 2017-08-10 2017-12-01 上海交通大学 A kind of uniform-spherical graphene/monocrystalline copper composite powder and preparation method thereof
WO2020035859A2 (en) * 2018-08-13 2020-02-20 Yissum Research Development Company Of The Hebrew University Of Jerusalem Ltd. Thin copper flakes for conductive inks
CN110071050B (en) * 2019-04-24 2021-09-24 深圳第三代半导体研究院 Chip interconnection structure and preparation method thereof
US11884996B2 (en) 2019-05-24 2024-01-30 Jfe Steel Corporation Iron-based alloy sintered body and iron-based mixed powder for powder metallurgy
CN117597316A (en) * 2021-07-27 2024-02-23 日本板硝子株式会社 Flake-like particles and lustrous pigments
WO2023008118A1 (en) * 2021-07-27 2023-02-02 日本板硝子株式会社 Flaky particles and brilliant pigment
CN114888294B (en) * 2022-05-14 2023-04-25 安徽纳洛米特新材料科技股份有限公司 Industrial production method of flaky nano nickel powder
JPWO2023223586A1 (en) 2022-05-18 2023-11-23
CN116021010A (en) * 2023-02-01 2023-04-28 苏州星翰新材料科技有限公司 Preparation method of flaky copper powder

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JPH0456701A (en) * 1990-06-26 1992-02-24 Fukuda Metal Foil & Powder Co Ltd Manufacture of flaky metal powder
JPH04314802A (en) * 1991-04-12 1992-11-06 Daido Steel Co Ltd Production of flake powder
JPH08325612A (en) * 1995-05-30 1996-12-10 Mitsui Mining & Smelting Co Ltd Fine flake copper powder and its production
JP4136106B2 (en) * 1998-08-31 2008-08-20 三井金属鉱業株式会社 Flat micro copper powder and method for producing the same
US6395332B1 (en) * 1998-08-31 2002-05-28 Mitsui Mining And Smelting Company, Ltd. Fine copper powder and process for producing the same
CN1358593A (en) * 2000-12-09 2002-07-17 甘肃雷诺换热设备有限公司 Method for reducing atomized copper powder bulk loading density
JP4227373B2 (en) * 2001-08-07 2009-02-18 三井金属鉱業株式会社 Flake copper powder and copper paste using the flake copper powder
JP4168116B2 (en) * 2002-03-06 2008-10-22 Ｄｏｗａエレクトロニクス株式会社 Foil flake copper powder and conductive paste using the same

Also Published As

Publication number Publication date
KR100613033B1 (en) 2006-08-16
TWI236393B (en) 2005-07-21
KR20040086853A (en) 2004-10-12
JP2004169155A (en) 2004-06-17
WO2004048017A1 (en) 2004-06-10
JP4145127B2 (en) 2008-09-03
CN1642680A (en) 2005-07-20
CA2506367A1 (en) 2004-06-10
DE10393768T5 (en) 2005-10-20
TW200408475A (en) 2004-06-01
CN1292861C (en) 2007-01-03
US20060137488A1 (en) 2006-06-29

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase