AU2001271709A1 - Grooved polishing pads and methods of use - Google Patents

Grooved polishing pads and methods of use

Info

Publication number
AU2001271709A1
AU2001271709A1 AU2001271709A AU7170901A AU2001271709A1 AU 2001271709 A1 AU2001271709 A1 AU 2001271709A1 AU 2001271709 A AU2001271709 A AU 2001271709A AU 7170901 A AU7170901 A AU 7170901A AU 2001271709 A1 AU2001271709 A1 AU 2001271709A1
Authority
AU
Australia
Prior art keywords
pad
bit
grooves
recess
stop member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001271709A
Inventor
Shyng-Tsong Chen
Kenneth M Davis
Kenneth P. Rodbell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of AU2001271709A1 publication Critical patent/AU2001271709A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)

Abstract

Grooves are formed in a CMP pad by positioning the pad on a supporting surface with a working surface of the pad in spaced relation opposite to a router bit and at least one projecting stop member adjacent to the router bit, an outer end portion of the bit projecting beyond the stop. When the bit is rotated, relative axial movement between the bit and the pad causes the outer end portion of the bit to cut an initial recess in the pad. Relative lateral movement between the rotating bit and the pad then forms a groove which extends laterally away from the recess and has a depth substantially the same as that of the recess. The depths of the initial recess and the groove are limited by applying a vacuum to the working surface of the pad to keep it in contact with the stop member(s). Different lateral movements between the bit and the pad are used to form a variety of groove patterns, the depths of which are precisely controlled by the stop member(s). The grooves may be formed in the polishing surface and/or the rear opposite surface of the pad and passages may be provided for interconnecting the rear grooves with the polishing surface or the front grooves.
AU2001271709A 2000-06-29 2001-06-29 Grooved polishing pads and methods of use Abandoned AU2001271709A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US21477400P 2000-06-29 2000-06-29
US60214774 2000-06-29
US09668142 2000-09-25
US09/668,142 US6656019B1 (en) 2000-06-29 2000-09-25 Grooved polishing pads and methods of use
PCT/US2001/020904 WO2002002279A2 (en) 2000-06-29 2001-06-29 Grooved polishing pads and methods of use

Publications (1)

Publication Number Publication Date
AU2001271709A1 true AU2001271709A1 (en) 2002-01-14

Family

ID=26909345

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001271709A Abandoned AU2001271709A1 (en) 2000-06-29 2001-06-29 Grooved polishing pads and methods of use

Country Status (9)

Country Link
US (2) US6656019B1 (en)
EP (1) EP1303381B1 (en)
JP (1) JP3823086B2 (en)
CN (1) CN1233508C (en)
AT (1) ATE289895T1 (en)
AU (1) AU2001271709A1 (en)
DE (1) DE60109170T2 (en)
TW (1) TW567121B (en)
WO (1) WO2002002279A2 (en)

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Also Published As

Publication number Publication date
US6685548B2 (en) 2004-02-03
EP1303381B1 (en) 2005-03-02
CN1233508C (en) 2005-12-28
JP3823086B2 (en) 2006-09-20
EP1303381A2 (en) 2003-04-23
DE60109170T2 (en) 2006-01-12
DE60109170D1 (en) 2005-04-07
ATE289895T1 (en) 2005-03-15
WO2002002279A3 (en) 2002-05-30
US6656019B1 (en) 2003-12-02
TW567121B (en) 2003-12-21
CN1449322A (en) 2003-10-15
JP2004501789A (en) 2004-01-22
US20030199234A1 (en) 2003-10-23
WO2002002279A2 (en) 2002-01-10

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