TW200510124A - Polishing pad for electrochemical-mechanical polishing - Google Patents

Polishing pad for electrochemical-mechanical polishing

Info

Publication number
TW200510124A
TW200510124A TW093116251A TW93116251A TW200510124A TW 200510124 A TW200510124 A TW 200510124A TW 093116251 A TW093116251 A TW 093116251A TW 93116251 A TW93116251 A TW 93116251A TW 200510124 A TW200510124 A TW 200510124A
Authority
TW
Taiwan
Prior art keywords
polishing
electrochemical
polishing pad
mechanical
grooves
Prior art date
Application number
TW093116251A
Other languages
Chinese (zh)
Other versions
TWI279290B (en
Inventor
Roland K Sevilla
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of TW200510124A publication Critical patent/TW200510124A/en
Application granted granted Critical
Publication of TWI279290B publication Critical patent/TWI279290B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials

Abstract

The invention provides a polishing pad comprising a body having a top surface comprising a first set of grooves with a first depth and first width and a bottom surface comprising a second set of grooves with a second depth and second width, wherein the first set of grooves and second set of grooves are interconnected and are oriented such that they are not aligned.
TW093116251A 2003-06-23 2004-06-04 Polishing pad for electrochemical-mechanical polishing TWI279290B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/601,601 US20040259479A1 (en) 2003-06-23 2003-06-23 Polishing pad for electrochemical-mechanical polishing

Publications (2)

Publication Number Publication Date
TW200510124A true TW200510124A (en) 2005-03-16
TWI279290B TWI279290B (en) 2007-04-21

Family

ID=33517994

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093116251A TWI279290B (en) 2003-06-23 2004-06-04 Polishing pad for electrochemical-mechanical polishing

Country Status (7)

Country Link
US (1) US20040259479A1 (en)
EP (1) EP1638733A1 (en)
JP (1) JP2007518577A (en)
KR (1) KR20060026437A (en)
CN (1) CN1809445A (en)
TW (1) TWI279290B (en)
WO (1) WO2005000525A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI595968B (en) * 2016-08-11 2017-08-21 宋建宏 Polishing pad and method for manufacturing the same

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7153195B2 (en) 2000-08-30 2006-12-26 Micron Technology, Inc. Methods and apparatus for selectively removing conductive material from a microelectronic substrate
US7134934B2 (en) * 2000-08-30 2006-11-14 Micron Technology, Inc. Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium
US7192335B2 (en) * 2002-08-29 2007-03-20 Micron Technology, Inc. Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
US7094131B2 (en) * 2000-08-30 2006-08-22 Micron Technology, Inc. Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material
US7078308B2 (en) 2002-08-29 2006-07-18 Micron Technology, Inc. Method and apparatus for removing adjacent conductive and nonconductive materials of a microelectronic substrate
US7153410B2 (en) * 2000-08-30 2006-12-26 Micron Technology, Inc. Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
US7129160B2 (en) 2002-08-29 2006-10-31 Micron Technology, Inc. Method for simultaneously removing multiple conductive materials from microelectronic substrates
US7112121B2 (en) * 2000-08-30 2006-09-26 Micron Technology, Inc. Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
US7220166B2 (en) 2000-08-30 2007-05-22 Micron Technology, Inc. Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
US7160176B2 (en) * 2000-08-30 2007-01-09 Micron Technology, Inc. Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate
JP2005123232A (en) * 2003-10-14 2005-05-12 Toshiba Corp Polishing device, polishing method, and method of manufacturing semiconductor device
US7442116B2 (en) * 2003-11-04 2008-10-28 Jsr Corporation Chemical mechanical polishing pad
US7153777B2 (en) * 2004-02-20 2006-12-26 Micron Technology, Inc. Methods and apparatuses for electrochemical-mechanical polishing
US7097536B2 (en) * 2004-06-30 2006-08-29 Intel Corporation Electrically enhanced surface planarization
US7566391B2 (en) 2004-09-01 2009-07-28 Micron Technology, Inc. Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media
JP3872081B2 (en) * 2004-12-29 2007-01-24 東邦エンジニアリング株式会社 Polishing pad
US20060151615A1 (en) * 2005-01-12 2006-07-13 Taiwan Name Plate Co., Ltd. Radio identifiable mark
JP2006332526A (en) * 2005-05-30 2006-12-07 Renesas Technology Corp Manufacturing method of semiconductor device, electrolytic polishing method, and polishing pad
US7807252B2 (en) * 2005-06-16 2010-10-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having secondary polishing medium capacity control grooves
US7503833B2 (en) * 2006-02-16 2009-03-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Three-dimensional network for chemical mechanical polishing
US7604529B2 (en) * 2006-02-16 2009-10-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Three-dimensional network for chemical mechanical polishing
US20080283502A1 (en) * 2006-05-26 2008-11-20 Kevin Moeggenborg Compositions, methods and systems for polishing aluminum oxide and aluminum oxynitride substrates
US7635290B2 (en) 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
US7517277B2 (en) * 2007-08-16 2009-04-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Layered-filament lattice for chemical mechanical polishing
US7828634B2 (en) 2007-08-16 2010-11-09 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interconnected-multi-element-lattice polishing pad
TWI409868B (en) * 2008-01-30 2013-09-21 Iv Technologies Co Ltd Polishing method, polishing pad and polishing system
JP2009297817A (en) * 2008-06-11 2009-12-24 Elpida Memory Inc Method of manufacturing polishing pad, polishing pad, and method of manufacturing substrate using the same
US8894799B2 (en) * 2011-09-22 2014-11-25 Dow Global Technologies Llc Method of forming layered-open-network polishing pads
US8801949B2 (en) 2011-09-22 2014-08-12 Dow Global Technologies Llc Method of forming open-network polishing pads
US9108291B2 (en) * 2011-09-22 2015-08-18 Dow Global Technologies Llc Method of forming structured-open-network polishing pads
JP5696024B2 (en) * 2011-11-09 2015-04-08 株式会社東芝 Chemical planarization method and chemical planarization apparatus
CN102601471B (en) * 2012-03-28 2013-07-24 华南理工大学 Finish machining method for space curve meshing gear mechanism
US20150056895A1 (en) * 2013-08-22 2015-02-26 Cabot Microelectronics Corporation Ultra high void volume polishing pad with closed pore structure
TWI550140B (en) * 2014-01-28 2016-09-21 國立中山大學 Electrochemial abrasive polishing apparatus with its polishing method
US10879087B2 (en) * 2017-03-17 2020-12-29 Toshiba Memory Corporation Substrate treatment apparatus and manufacturing method of semiconductor device
US10201887B2 (en) * 2017-03-30 2019-02-12 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing pad having grooves on bottom surface of top layer
US11878388B2 (en) * 2018-06-15 2024-01-23 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad, polishing apparatus and method of manufacturing semiconductor package using the same
CN109434568A (en) * 2018-10-23 2019-03-08 青岛韬谱光学科技有限公司 A kind of optical device polishing method of the high high roughness of face type
CN112536738B (en) * 2020-12-10 2022-05-27 郑州磨料磨具磨削研究所有限公司 Diamond roller rapid electroplating device and process
CN114918823B (en) * 2022-05-20 2023-08-25 安徽禾臣新材料有限公司 White pad for polishing large-size substrate and production process thereof

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63288620A (en) * 1987-05-22 1988-11-25 Kobe Steel Ltd Electrolytic compound supermirror machining method for aluminum
US4793895A (en) * 1988-01-25 1988-12-27 Ibm Corporation In situ conductivity monitoring technique for chemical/mechanical planarization endpoint detection
US5256565A (en) * 1989-05-08 1993-10-26 The United States Of America As Represented By The United States Department Of Energy Electrochemical planarization
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
JP3042593B2 (en) * 1995-10-25 2000-05-15 日本電気株式会社 Polishing pad
US5858813A (en) * 1996-05-10 1999-01-12 Cabot Corporation Chemical mechanical polishing slurry for metal layers and films
US5645469A (en) * 1996-09-06 1997-07-08 Advanced Micro Devices, Inc. Polishing pad with radially extending tapered channels
US5911619A (en) * 1997-03-26 1999-06-15 International Business Machines Corporation Apparatus for electrochemical mechanical planarization
US5807165A (en) * 1997-03-26 1998-09-15 International Business Machines Corporation Method of electrochemical mechanical planarization
US5888121A (en) * 1997-09-23 1999-03-30 Lsi Logic Corporation Controlling groove dimensions for enhanced slurry flow
WO1999026758A1 (en) * 1997-11-25 1999-06-03 John Hopkins University Electrochemical-control of abrasive polishing and machining rates
US6395152B1 (en) * 1998-07-09 2002-05-28 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices
US6413388B1 (en) * 2000-02-23 2002-07-02 Nutool Inc. Pad designs and structures for a versatile materials processing apparatus
US6113759A (en) * 1998-12-18 2000-09-05 International Business Machines Corporation Anode design for semiconductor deposition having novel electrical contact assembly
US6217426B1 (en) * 1999-04-06 2001-04-17 Applied Materials, Inc. CMP polishing pad
US6299741B1 (en) * 1999-11-29 2001-10-09 Applied Materials, Inc. Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus
US6379223B1 (en) * 1999-11-29 2002-04-30 Applied Materials, Inc. Method and apparatus for electrochemical-mechanical planarization
US6241596B1 (en) * 2000-01-14 2001-06-05 Applied Materials, Inc. Method and apparatus for chemical mechanical polishing using a patterned pad
US6368190B1 (en) * 2000-01-26 2002-04-09 Agere Systems Guardian Corp. Electrochemical mechanical planarization apparatus and method
US7059948B2 (en) * 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US7066800B2 (en) * 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US6375549B1 (en) * 2000-03-17 2002-04-23 Motorola, Inc. Polishing head for wafer, and method for polishing
US6478936B1 (en) * 2000-05-11 2002-11-12 Nutool Inc. Anode assembly for plating and planarizing a conductive layer
US6500054B1 (en) * 2000-06-08 2002-12-31 International Business Machines Corporation Chemical-mechanical polishing pad conditioner
US6656019B1 (en) * 2000-06-29 2003-12-02 International Business Machines Corporation Grooved polishing pads and methods of use
JP2002046024A (en) * 2000-08-04 2002-02-12 Sony Corp Electrolytic polishing device, electrolytic polishing method, and wafer to be polished
JP2002093761A (en) * 2000-09-19 2002-03-29 Sony Corp Polishing method, polishing system, plating method and plating system
JP2002110592A (en) * 2000-09-27 2002-04-12 Sony Corp Polishing method and apparatus
JP2002254248A (en) * 2001-02-28 2002-09-10 Sony Corp Electrochemical machining device
US6811680B2 (en) * 2001-03-14 2004-11-02 Applied Materials Inc. Planarization of substrates using electrochemical mechanical polishing
US6592742B2 (en) * 2001-07-13 2003-07-15 Applied Materials Inc. Electrochemically assisted chemical polish
US6723224B2 (en) * 2001-08-01 2004-04-20 Applied Materials Inc. Electro-chemical polishing apparatus
US6599175B2 (en) * 2001-08-06 2003-07-29 Speedfam-Ipeca Corporation Apparatus for distributing a fluid through a polishing pad
US20030194959A1 (en) * 2002-04-15 2003-10-16 Cabot Microelectronics Corporation Sintered polishing pad with regions of contrasting density
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI595968B (en) * 2016-08-11 2017-08-21 宋建宏 Polishing pad and method for manufacturing the same
CN107717720A (en) * 2016-08-11 2018-02-23 宋建宏 Polishing pad and method for manufacturing the same
US10239183B2 (en) 2016-08-11 2019-03-26 Slh Technology Co., Ltd. Chemical mechanical polishing pad and method for manufacturing the same

Also Published As

Publication number Publication date
US20040259479A1 (en) 2004-12-23
EP1638733A1 (en) 2006-03-29
WO2005000525A1 (en) 2005-01-06
KR20060026437A (en) 2006-03-23
TWI279290B (en) 2007-04-21
JP2007518577A (en) 2007-07-12
CN1809445A (en) 2006-07-26

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees