US7390688B2
(en)
*
|
2005-02-21 |
2008-06-24 |
Casio Computer Co.,Ltd. |
Semiconductor device and manufacturing method thereof
|
JP2007048958A
(ja)
*
|
2005-08-10 |
2007-02-22 |
Renesas Technology Corp |
半導体装置の製造方法および半導体装置
|
JP4777761B2
(ja)
*
|
2005-12-02 |
2011-09-21 |
株式会社ディスコ |
ウエーハの分割方法
|
JP2007165706A
(ja)
*
|
2005-12-15 |
2007-06-28 |
Renesas Technology Corp |
半導体集積回路装置の製造方法
|
JP4851795B2
(ja)
*
|
2006-01-13 |
2012-01-11 |
株式会社ディスコ |
ウエーハの分割装置
|
JP5023614B2
(ja)
*
|
2006-08-24 |
2012-09-12 |
パナソニック株式会社 |
半導体チップの製造方法及び半導体ウエハの処理方法
|
JP4544231B2
(ja)
*
|
2006-10-06 |
2010-09-15 |
パナソニック株式会社 |
半導体チップの製造方法
|
JP4840200B2
(ja)
*
|
2007-03-09 |
2011-12-21 |
パナソニック株式会社 |
半導体チップの製造方法
|
US7989319B2
(en)
*
|
2007-08-07 |
2011-08-02 |
Semiconductor Components Industries, Llc |
Semiconductor die singulation method
|
US8012857B2
(en)
*
|
2007-08-07 |
2011-09-06 |
Semiconductor Components Industries, Llc |
Semiconductor die singulation method
|
US7781310B2
(en)
*
|
2007-08-07 |
2010-08-24 |
Semiconductor Components Industries, Llc |
Semiconductor die singulation method
|
US8859396B2
(en)
|
2007-08-07 |
2014-10-14 |
Semiconductor Components Industries, Llc |
Semiconductor die singulation method
|
JP5246001B2
(ja)
*
|
2009-04-10 |
2013-07-24 |
パナソニック株式会社 |
基板の加工方法および半導体チップの製造方法ならびに樹脂接着層付き半導体チップの製造方法
|
US9276336B2
(en)
|
2009-05-28 |
2016-03-01 |
Hsio Technologies, Llc |
Metalized pad to electrical contact interface
|
WO2011153298A1
(en)
|
2010-06-03 |
2011-12-08 |
Hsio Technologies, Llc |
Electrical connector insulator housing
|
WO2011139619A1
(en)
|
2010-04-26 |
2011-11-10 |
Hsio Technologies, Llc |
Semiconductor device package adapter
|
WO2010147939A1
(en)
|
2009-06-17 |
2010-12-23 |
Hsio Technologies, Llc |
Semiconductor socket
|
US9536815B2
(en)
|
2009-05-28 |
2017-01-03 |
Hsio Technologies, Llc |
Semiconductor socket with direct selective metalization
|
US8955215B2
(en)
|
2009-05-28 |
2015-02-17 |
Hsio Technologies, Llc |
High performance surface mount electrical interconnect
|
WO2011002709A1
(en)
|
2009-06-29 |
2011-01-06 |
Hsio Technologies, Llc |
Compliant printed circuit semiconductor tester interface
|
US8610265B2
(en)
|
2009-06-02 |
2013-12-17 |
Hsio Technologies, Llc |
Compliant core peripheral lead semiconductor test socket
|
US8618649B2
(en)
|
2009-06-02 |
2013-12-31 |
Hsio Technologies, Llc |
Compliant printed circuit semiconductor package
|
US8912812B2
(en)
|
2009-06-02 |
2014-12-16 |
Hsio Technologies, Llc |
Compliant printed circuit wafer probe diagnostic tool
|
US9320133B2
(en)
|
2009-06-02 |
2016-04-19 |
Hsio Technologies, Llc |
Electrical interconnect IC device socket
|
WO2014011226A1
(en)
|
2012-07-10 |
2014-01-16 |
Hsio Technologies, Llc |
Hybrid printed circuit assembly with low density main core and embedded high density circuit regions
|
WO2010141297A1
(en)
|
2009-06-02 |
2010-12-09 |
Hsio Technologies, Llc |
Compliant printed circuit wafer level semiconductor package
|
WO2010141303A1
(en)
|
2009-06-02 |
2010-12-09 |
Hsio Technologies, Llc |
Resilient conductive electrical interconnect
|
US8928344B2
(en)
|
2009-06-02 |
2015-01-06 |
Hsio Technologies, Llc |
Compliant printed circuit socket diagnostic tool
|
US8955216B2
(en)
|
2009-06-02 |
2015-02-17 |
Hsio Technologies, Llc |
Method of making a compliant printed circuit peripheral lead semiconductor package
|
US9613841B2
(en)
|
2009-06-02 |
2017-04-04 |
Hsio Technologies, Llc |
Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection
|
WO2010147934A1
(en)
*
|
2009-06-16 |
2010-12-23 |
Hsio Technologies, Llc |
Semiconductor die terminal
|
US9276339B2
(en)
|
2009-06-02 |
2016-03-01 |
Hsio Technologies, Llc |
Electrical interconnect IC device socket
|
WO2012074963A1
(en)
|
2010-12-01 |
2012-06-07 |
Hsio Technologies, Llc |
High performance surface mount electrical interconnect
|
WO2010141264A1
(en)
|
2009-06-03 |
2010-12-09 |
Hsio Technologies, Llc |
Compliant wafer level probe assembly
|
US9414500B2
(en)
|
2009-06-02 |
2016-08-09 |
Hsio Technologies, Llc |
Compliant printed flexible circuit
|
WO2013036565A1
(en)
|
2011-09-08 |
2013-03-14 |
Hsio Technologies, Llc |
Direct metalization of electrical circuit structures
|
WO2010141298A1
(en)
|
2009-06-02 |
2010-12-09 |
Hsio Technologies, Llc |
Composite polymer-metal electrical contacts
|
US8789272B2
(en)
|
2009-06-02 |
2014-07-29 |
Hsio Technologies, Llc |
Method of making a compliant printed circuit peripheral lead semiconductor test socket
|
US9930775B2
(en)
|
2009-06-02 |
2018-03-27 |
Hsio Technologies, Llc |
Copper pillar full metal via electrical circuit structure
|
US9318862B2
(en)
|
2009-06-02 |
2016-04-19 |
Hsio Technologies, Llc |
Method of making an electronic interconnect
|
US9196980B2
(en)
|
2009-06-02 |
2015-11-24 |
Hsio Technologies, Llc |
High performance surface mount electrical interconnect with external biased normal force loading
|
WO2010141311A1
(en)
|
2009-06-02 |
2010-12-09 |
Hsio Technologies, Llc |
Compliant printed circuit area array semiconductor device package
|
US9232654B2
(en)
|
2009-06-02 |
2016-01-05 |
Hsio Technologies, Llc |
High performance electrical circuit structure
|
US8988093B2
(en)
|
2009-06-02 |
2015-03-24 |
Hsio Technologies, Llc |
Bumped semiconductor wafer or die level electrical interconnect
|
US8525346B2
(en)
|
2009-06-02 |
2013-09-03 |
Hsio Technologies, Llc |
Compliant conductive nano-particle electrical interconnect
|
US8987886B2
(en)
|
2009-06-02 |
2015-03-24 |
Hsio Technologies, Llc |
Copper pillar full metal via electrical circuit structure
|
US8981568B2
(en)
|
2009-06-16 |
2015-03-17 |
Hsio Technologies, Llc |
Simulated wirebond semiconductor package
|
US8984748B2
(en)
|
2009-06-29 |
2015-03-24 |
Hsio Technologies, Llc |
Singulated semiconductor device separable electrical interconnect
|
US8384231B2
(en)
|
2010-01-18 |
2013-02-26 |
Semiconductor Components Industries, Llc |
Method of forming a semiconductor die
|
US9165833B2
(en)
*
|
2010-01-18 |
2015-10-20 |
Semiconductor Components Industries, Llc |
Method of forming a semiconductor die
|
US20110175209A1
(en)
*
|
2010-01-18 |
2011-07-21 |
Seddon Michael J |
Method of forming an em protected semiconductor die
|
US9299664B2
(en)
*
|
2010-01-18 |
2016-03-29 |
Semiconductor Components Industries, Llc |
Method of forming an EM protected semiconductor die
|
US8658436B2
(en)
*
|
2010-04-19 |
2014-02-25 |
Tokyo Electron Limited |
Method for separating and transferring IC chips
|
US8758067B2
(en)
|
2010-06-03 |
2014-06-24 |
Hsio Technologies, Llc |
Selective metalization of electrical connector or socket housing
|
US10159154B2
(en)
|
2010-06-03 |
2018-12-18 |
Hsio Technologies, Llc |
Fusion bonded liquid crystal polymer circuit structure
|
US9689897B2
(en)
|
2010-06-03 |
2017-06-27 |
Hsio Technologies, Llc |
Performance enhanced semiconductor socket
|
US9350093B2
(en)
|
2010-06-03 |
2016-05-24 |
Hsio Technologies, Llc |
Selective metalization of electrical connector or socket housing
|
US8642448B2
(en)
|
2010-06-22 |
2014-02-04 |
Applied Materials, Inc. |
Wafer dicing using femtosecond-based laser and plasma etch
|
JP2012109364A
(ja)
*
|
2010-11-17 |
2012-06-07 |
Disco Abrasive Syst Ltd |
光デバイスユニットの加工方法
|
WO2012112937A2
(en)
*
|
2011-02-18 |
2012-08-23 |
Applied Materials, Inc. |
Method and system for wafer level singulation
|
US9343365B2
(en)
*
|
2011-03-14 |
2016-05-17 |
Plasma-Therm Llc |
Method and apparatus for plasma dicing a semi-conductor wafer
|
US8802545B2
(en)
|
2011-03-14 |
2014-08-12 |
Plasma-Therm Llc |
Method and apparatus for plasma dicing a semi-conductor wafer
|
US20120322235A1
(en)
*
|
2011-06-15 |
2012-12-20 |
Wei-Sheng Lei |
Wafer dicing using hybrid galvanic laser scribing process with plasma etch
|
US9029242B2
(en)
|
2011-06-15 |
2015-05-12 |
Applied Materials, Inc. |
Damage isolation by shaped beam delivery in laser scribing process
|
US8703581B2
(en)
*
|
2011-06-15 |
2014-04-22 |
Applied Materials, Inc. |
Water soluble mask for substrate dicing by laser and plasma etch
|
US8759197B2
(en)
|
2011-06-15 |
2014-06-24 |
Applied Materials, Inc. |
Multi-step and asymmetrically shaped laser beam scribing
|
US9126285B2
(en)
*
|
2011-06-15 |
2015-09-08 |
Applied Materials, Inc. |
Laser and plasma etch wafer dicing using physically-removable mask
|
US9129904B2
(en)
*
|
2011-06-15 |
2015-09-08 |
Applied Materials, Inc. |
Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etch
|
US8557682B2
(en)
|
2011-06-15 |
2013-10-15 |
Applied Materials, Inc. |
Multi-layer mask for substrate dicing by laser and plasma etch
|
US8507363B2
(en)
|
2011-06-15 |
2013-08-13 |
Applied Materials, Inc. |
Laser and plasma etch wafer dicing using water-soluble die attach film
|
US8598016B2
(en)
*
|
2011-06-15 |
2013-12-03 |
Applied Materials, Inc. |
In-situ deposited mask layer for device singulation by laser scribing and plasma etch
|
US8557683B2
(en)
*
|
2011-06-15 |
2013-10-15 |
Applied Materials, Inc. |
Multi-step and asymmetrically shaped laser beam scribing
|
US8912077B2
(en)
*
|
2011-06-15 |
2014-12-16 |
Applied Materials, Inc. |
Hybrid laser and plasma etch wafer dicing using substrate carrier
|
US8951819B2
(en)
|
2011-07-11 |
2015-02-10 |
Applied Materials, Inc. |
Wafer dicing using hybrid split-beam laser scribing process with plasma etch
|
US8652940B2
(en)
|
2012-04-10 |
2014-02-18 |
Applied Materials, Inc. |
Wafer dicing used hybrid multi-step laser scribing process with plasma etch
|
US8748297B2
(en)
|
2012-04-20 |
2014-06-10 |
Infineon Technologies Ag |
Methods of forming semiconductor devices by singulating a substrate by removing a dummy fill material
|
US8946057B2
(en)
|
2012-04-24 |
2015-02-03 |
Applied Materials, Inc. |
Laser and plasma etch wafer dicing using UV-curable adhesive film
|
US8969177B2
(en)
*
|
2012-06-29 |
2015-03-03 |
Applied Materials, Inc. |
Laser and plasma etch wafer dicing with a double sided UV-curable adhesive film
|
US9048309B2
(en)
|
2012-07-10 |
2015-06-02 |
Applied Materials, Inc. |
Uniform masking for wafer dicing using laser and plasma etch
|
US9761520B2
(en)
|
2012-07-10 |
2017-09-12 |
Hsio Technologies, Llc |
Method of making an electrical connector having electrodeposited terminals
|
US8993414B2
(en)
|
2012-07-13 |
2015-03-31 |
Applied Materials, Inc. |
Laser scribing and plasma etch for high die break strength and clean sidewall
|
US8859397B2
(en)
|
2012-07-13 |
2014-10-14 |
Applied Materials, Inc. |
Method of coating water soluble mask for laser scribing and plasma etch
|
US8940619B2
(en)
|
2012-07-13 |
2015-01-27 |
Applied Materials, Inc. |
Method of diced wafer transportation
|
US8845854B2
(en)
|
2012-07-13 |
2014-09-30 |
Applied Materials, Inc. |
Laser, plasma etch, and backside grind process for wafer dicing
|
US20140057414A1
(en)
*
|
2012-08-27 |
2014-02-27 |
Aparna Iyer |
Mask residue removal for substrate dicing by laser and plasma etch
|
US9159574B2
(en)
|
2012-08-27 |
2015-10-13 |
Applied Materials, Inc. |
Method of silicon etch for trench sidewall smoothing
|
US9252057B2
(en)
|
2012-10-17 |
2016-02-02 |
Applied Materials, Inc. |
Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer application
|
US9484260B2
(en)
|
2012-11-07 |
2016-11-01 |
Semiconductor Components Industries, Llc |
Heated carrier substrate semiconductor die singulation method
|
US9136173B2
(en)
|
2012-11-07 |
2015-09-15 |
Semiconductor Components Industries, Llc |
Singulation method for semiconductor die having a layer of material along one major surface
|
US10211175B2
(en)
*
|
2012-11-30 |
2019-02-19 |
International Business Machines Corporation |
Stress-resilient chip structure and dicing process
|
US8975162B2
(en)
|
2012-12-20 |
2015-03-10 |
Applied Materials, Inc. |
Wafer dicing from wafer backside
|
JP6110136B2
(ja)
*
|
2012-12-28 |
2017-04-05 |
株式会社ディスコ |
ウエーハのレーザー加工方法およびレーザー加工装置
|
US8980726B2
(en)
*
|
2013-01-25 |
2015-03-17 |
Applied Materials, Inc. |
Substrate dicing by laser ablation and plasma etch damage removal for ultra-thin wafers
|
US9236305B2
(en)
|
2013-01-25 |
2016-01-12 |
Applied Materials, Inc. |
Wafer dicing with etch chamber shield ring for film frame wafer applications
|
JP6021687B2
(ja)
*
|
2013-02-25 |
2016-11-09 |
株式会社ディスコ |
積層ウェーハの加工方法
|
US9620379B2
(en)
|
2013-03-14 |
2017-04-11 |
Applied Materials, Inc. |
Multi-layer mask including non-photodefinable laser energy absorbing layer for substrate dicing by laser and plasma etch
|
US8883614B1
(en)
|
2013-05-22 |
2014-11-11 |
Applied Materials, Inc. |
Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approach
|
US20150011073A1
(en)
*
|
2013-07-02 |
2015-01-08 |
Wei-Sheng Lei |
Laser scribing and plasma etch for high die break strength and smooth sidewall
|
US10667410B2
(en)
|
2013-07-11 |
2020-05-26 |
Hsio Technologies, Llc |
Method of making a fusion bonded circuit structure
|
US10506722B2
(en)
|
2013-07-11 |
2019-12-10 |
Hsio Technologies, Llc |
Fusion bonded liquid crystal polymer electrical circuit structure
|
US9105710B2
(en)
*
|
2013-08-30 |
2015-08-11 |
Applied Materials, Inc. |
Wafer dicing method for improving die packaging quality
|
US20150079760A1
(en)
*
|
2013-09-19 |
2015-03-19 |
Wei-Sheng Lei |
Alternating masking and laser scribing approach for wafer dicing using laser scribing and plasma etch
|
US9224650B2
(en)
|
2013-09-19 |
2015-12-29 |
Applied Materials, Inc. |
Wafer dicing from wafer backside and front side
|
US20150087131A1
(en)
*
|
2013-09-20 |
2015-03-26 |
Infineon Technologies Ag |
Method for processing a chip
|
US9460966B2
(en)
*
|
2013-10-10 |
2016-10-04 |
Applied Materials, Inc. |
Method and apparatus for dicing wafers having thick passivation polymer layer
|
US9041198B2
(en)
*
|
2013-10-22 |
2015-05-26 |
Applied Materials, Inc. |
Maskless hybrid laser scribing and plasma etching wafer dicing process
|
US9406564B2
(en)
|
2013-11-21 |
2016-08-02 |
Infineon Technologies Ag |
Singulation through a masking structure surrounding expitaxial regions
|
US9312177B2
(en)
|
2013-12-06 |
2016-04-12 |
Applied Materials, Inc. |
Screen print mask for laser scribe and plasma etch wafer dicing process
|
US9299614B2
(en)
|
2013-12-10 |
2016-03-29 |
Applied Materials, Inc. |
Method and carrier for dicing a wafer
|
US9293304B2
(en)
|
2013-12-17 |
2016-03-22 |
Applied Materials, Inc. |
Plasma thermal shield for heat dissipation in plasma chamber
|
US9012305B1
(en)
|
2014-01-29 |
2015-04-21 |
Applied Materials, Inc. |
Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening clean
|
US9018079B1
(en)
|
2014-01-29 |
2015-04-28 |
Applied Materials, Inc. |
Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate reactive post mask-opening clean
|
US9299611B2
(en)
|
2014-01-29 |
2016-03-29 |
Applied Materials, Inc. |
Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistance
|
US8927393B1
(en)
|
2014-01-29 |
2015-01-06 |
Applied Materials, Inc. |
Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing
|
US8991329B1
(en)
|
2014-01-31 |
2015-03-31 |
Applied Materials, Inc. |
Wafer coating
|
US9236284B2
(en)
|
2014-01-31 |
2016-01-12 |
Applied Materials, Inc. |
Cooled tape frame lift and low contact shadow ring for plasma heat isolation
|
US20150255349A1
(en)
|
2014-03-07 |
2015-09-10 |
JAMES Matthew HOLDEN |
Approaches for cleaning a wafer during hybrid laser scribing and plasma etching wafer dicing processes
|
US9130030B1
(en)
|
2014-03-07 |
2015-09-08 |
Applied Materials, Inc. |
Baking tool for improved wafer coating process
|
US9418894B2
(en)
|
2014-03-21 |
2016-08-16 |
Semiconductor Components Industries, Llc |
Electronic die singulation method
|
US9275902B2
(en)
|
2014-03-26 |
2016-03-01 |
Applied Materials, Inc. |
Dicing processes for thin wafers with bumps on wafer backside
|
US9076860B1
(en)
|
2014-04-04 |
2015-07-07 |
Applied Materials, Inc. |
Residue removal from singulated die sidewall
|
US8975163B1
(en)
|
2014-04-10 |
2015-03-10 |
Applied Materials, Inc. |
Laser-dominated laser scribing and plasma etch hybrid wafer dicing
|
US8932939B1
(en)
|
2014-04-14 |
2015-01-13 |
Applied Materials, Inc. |
Water soluble mask formation by dry film lamination
|
US8912078B1
(en)
|
2014-04-16 |
2014-12-16 |
Applied Materials, Inc. |
Dicing wafers having solder bumps on wafer backside
|
US8999816B1
(en)
|
2014-04-18 |
2015-04-07 |
Applied Materials, Inc. |
Pre-patterned dry laminate mask for wafer dicing processes
|
US9159621B1
(en)
|
2014-04-29 |
2015-10-13 |
Applied Materials, Inc. |
Dicing tape protection for wafer dicing using laser scribe process
|
US8912075B1
(en)
|
2014-04-29 |
2014-12-16 |
Applied Materials, Inc. |
Wafer edge warp supression for thin wafer supported by tape frame
|
US8980727B1
(en)
|
2014-05-07 |
2015-03-17 |
Applied Materials, Inc. |
Substrate patterning using hybrid laser scribing and plasma etching processing schemes
|
US9112050B1
(en)
|
2014-05-13 |
2015-08-18 |
Applied Materials, Inc. |
Dicing tape thermal management by wafer frame support ring cooling during plasma dicing
|
US9034771B1
(en)
|
2014-05-23 |
2015-05-19 |
Applied Materials, Inc. |
Cooling pedestal for dicing tape thermal management during plasma dicing
|
US9130057B1
(en)
|
2014-06-30 |
2015-09-08 |
Applied Materials, Inc. |
Hybrid dicing process using a blade and laser
|
US9142459B1
(en)
|
2014-06-30 |
2015-09-22 |
Applied Materials, Inc. |
Wafer dicing using hybrid laser scribing and plasma etch approach with mask application by vacuum lamination
|
US9093518B1
(en)
|
2014-06-30 |
2015-07-28 |
Applied Materials, Inc. |
Singulation of wafers having wafer-level underfill
|
US9165832B1
(en)
|
2014-06-30 |
2015-10-20 |
Applied Materials, Inc. |
Method of die singulation using laser ablation and induction of internal defects with a laser
|
US9349648B2
(en)
|
2014-07-22 |
2016-05-24 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a rectangular shaped two-dimensional top hat laser beam profile or a linear shaped one-dimensional top hat laser beam profile laser scribing process and plasma etch process
|
US9117868B1
(en)
|
2014-08-12 |
2015-08-25 |
Applied Materials, Inc. |
Bipolar electrostatic chuck for dicing tape thermal management during plasma dicing
|
US9196498B1
(en)
|
2014-08-12 |
2015-11-24 |
Applied Materials, Inc. |
Stationary actively-cooled shadow ring for heat dissipation in plasma chamber
|
US9385041B2
(en)
|
2014-08-26 |
2016-07-05 |
Semiconductor Components Industries, Llc |
Method for insulating singulated electronic die
|
US9281244B1
(en)
*
|
2014-09-18 |
2016-03-08 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process
|
US9177861B1
(en)
|
2014-09-19 |
2015-11-03 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using laser scribing process based on an elliptical laser beam profile or a spatio-temporal controlled laser beam profile
|
US11195756B2
(en)
|
2014-09-19 |
2021-12-07 |
Applied Materials, Inc. |
Proximity contact cover ring for plasma dicing
|
US9196536B1
(en)
|
2014-09-25 |
2015-11-24 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a phase modulated laser beam profile laser scribing process and plasma etch process
|
US9130056B1
(en)
|
2014-10-03 |
2015-09-08 |
Applied Materials, Inc. |
Bi-layer wafer-level underfill mask for wafer dicing and approaches for performing wafer dicing
|
US9245803B1
(en)
*
|
2014-10-17 |
2016-01-26 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch process
|
US10692765B2
(en)
|
2014-11-07 |
2020-06-23 |
Applied Materials, Inc. |
Transfer arm for film frame substrate handling during plasma singulation of wafers
|
US9159624B1
(en)
|
2015-01-05 |
2015-10-13 |
Applied Materials, Inc. |
Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approach
|
US9355907B1
(en)
*
|
2015-01-05 |
2016-05-31 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process
|
US9330977B1
(en)
|
2015-01-05 |
2016-05-03 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a galvo scanner and linear stage hybrid motion laser scribing process and plasma etch process
|
JP6738591B2
(ja)
*
|
2015-03-13 |
2020-08-12 |
古河電気工業株式会社 |
半導体ウェハの処理方法、半導体チップおよび表面保護テープ
|
US9559447B2
(en)
|
2015-03-18 |
2017-01-31 |
Hsio Technologies, Llc |
Mechanical contact retention within an electrical connector
|
US9601375B2
(en)
|
2015-04-27 |
2017-03-21 |
Applied Materials, Inc. |
UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach
|
US9721839B2
(en)
|
2015-06-12 |
2017-08-01 |
Applied Materials, Inc. |
Etch-resistant water soluble mask for hybrid wafer dicing using laser scribing and plasma etch
|
US9478455B1
(en)
|
2015-06-12 |
2016-10-25 |
Applied Materials, Inc. |
Thermal pyrolytic graphite shadow ring assembly for heat dissipation in plasma chamber
|
KR20170122185A
(ko)
*
|
2015-11-09 |
2017-11-03 |
후루카와 덴키 고교 가부시키가이샤 |
반도체 칩의 제조방법 및 이것에 이용하는 마스크 일체형 표면 보호 테이프
|
JP6716263B2
(ja)
*
|
2016-01-22 |
2020-07-01 |
株式会社ディスコ |
ウエーハの加工方法
|
US9972575B2
(en)
|
2016-03-03 |
2018-05-15 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process
|
US9852997B2
(en)
|
2016-03-25 |
2017-12-26 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process
|
CN105717562B
(zh)
*
|
2016-04-22 |
2018-02-06 |
东莞市光志光电有限公司 |
一种新型增光膜规则点伤卷料模切工艺制造与方法
|
US9793132B1
(en)
|
2016-05-13 |
2017-10-17 |
Applied Materials, Inc. |
Etch mask for hybrid laser scribing and plasma etch wafer singulation process
|
JP6524553B2
(ja)
*
|
2016-05-30 |
2019-06-05 |
パナソニックIpマネジメント株式会社 |
素子チップの製造方法
|
JP6524554B2
(ja)
*
|
2016-05-30 |
2019-06-05 |
パナソニックIpマネジメント株式会社 |
素子チップの製造方法
|
US10366923B2
(en)
|
2016-06-02 |
2019-07-30 |
Semiconductor Components Industries, Llc |
Method of separating electronic devices having a back layer and apparatus
|
US10373869B2
(en)
|
2017-05-24 |
2019-08-06 |
Semiconductor Components Industries, Llc |
Method of separating a back layer on a substrate using exposure to reduced temperature and related apparatus
|
US11158540B2
(en)
|
2017-05-26 |
2021-10-26 |
Applied Materials, Inc. |
Light-absorbing mask for hybrid laser scribing and plasma etch wafer singulation process
|
US10363629B2
(en)
|
2017-06-01 |
2019-07-30 |
Applied Materials, Inc. |
Mitigation of particle contamination for wafer dicing processes
|
JP6782215B2
(ja)
*
|
2017-10-18 |
2020-11-11 |
古河電気工業株式会社 |
プラズマダイシング用マスク材、マスク一体型表面保護テープおよび半導体チップの製造方法
|
US10535561B2
(en)
|
2018-03-12 |
2020-01-14 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process
|
US11355394B2
(en)
|
2018-09-13 |
2022-06-07 |
Applied Materials, Inc. |
Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate breakthrough treatment
|
JP7158224B2
(ja)
*
|
2018-09-26 |
2022-10-21 |
浜松ホトニクス株式会社 |
半導体デバイス検査方法及び半導体デバイス検査装置
|
US20200194270A1
(en)
*
|
2018-12-13 |
2020-06-18 |
Asm Technology Singapore Pte Ltd |
Plasma chemical processing of wafer dies
|
US10818551B2
(en)
|
2019-01-09 |
2020-10-27 |
Semiconductor Components Industries, Llc |
Plasma die singulation systems and related methods
|
US11011424B2
(en)
|
2019-08-06 |
2021-05-18 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a spatially multi-focused laser beam laser scribing process and plasma etch process
|
US11342226B2
(en)
*
|
2019-08-13 |
2022-05-24 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using an actively-focused laser beam laser scribing process and plasma etch process
|
US10903121B1
(en)
|
2019-08-14 |
2021-01-26 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a uniform rotating beam laser scribing process and plasma etch process
|
GB201917988D0
(en)
*
|
2019-12-09 |
2020-01-22 |
Spts Technologies Ltd |
A semiconductor wafer dicing process
|
US11600492B2
(en)
|
2019-12-10 |
2023-03-07 |
Applied Materials, Inc. |
Electrostatic chuck with reduced current leakage for hybrid laser scribing and plasma etch wafer singulation process
|
US11211247B2
(en)
|
2020-01-30 |
2021-12-28 |
Applied Materials, Inc. |
Water soluble organic-inorganic hybrid mask formulations and their applications
|
JP2022085738A
(ja)
*
|
2020-11-27 |
2022-06-08 |
パナソニックIpマネジメント株式会社 |
チップの製造方法
|