ATE551143T1 - Reflow-ofen - Google Patents

Reflow-ofen

Info

Publication number
ATE551143T1
ATE551143T1 AT05768510T AT05768510T ATE551143T1 AT E551143 T1 ATE551143 T1 AT E551143T1 AT 05768510 T AT05768510 T AT 05768510T AT 05768510 T AT05768510 T AT 05768510T AT E551143 T1 ATE551143 T1 AT E551143T1
Authority
AT
Austria
Prior art keywords
hot air
suction ports
discharge nozzles
reflow oven
air discharge
Prior art date
Application number
AT05768510T
Other languages
English (en)
Inventor
Hideki Nakamura
Atsushi Obara
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Application granted granted Critical
Publication of ATE551143T1 publication Critical patent/ATE551143T1/de

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/06—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity heated without contact between combustion gases and charge; electrically heated
    • F27B9/10—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity heated without contact between combustion gases and charge; electrically heated heated by hot air or gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/30—Details, accessories, or equipment peculiar to furnaces of these types
    • F27B9/36—Arrangements of heating devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Glass Compositions (AREA)
AT05768510T 2004-08-04 2005-08-03 Reflow-ofen ATE551143T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004228072 2004-08-04
JP2005070208 2005-03-14
PCT/JP2005/014216 WO2006013895A1 (ja) 2004-08-04 2005-08-03 リフロー炉

Publications (1)

Publication Number Publication Date
ATE551143T1 true ATE551143T1 (de) 2012-04-15

Family

ID=35787176

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05768510T ATE551143T1 (de) 2004-08-04 2005-08-03 Reflow-ofen

Country Status (5)

Country Link
US (1) US8084717B2 (de)
EP (1) EP1870191B9 (de)
JP (1) JP4169075B2 (de)
AT (1) ATE551143T1 (de)
WO (1) WO2006013895A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2007077727A1 (ja) * 2006-01-06 2009-06-11 株式会社タムラ製作所 リフロー装置
JP4887858B2 (ja) * 2006-03-27 2012-02-29 千住金属工業株式会社 リフロー炉
DE102006056518A1 (de) * 2006-11-06 2008-05-08 Otto Junker Gmbh Vorrichtung zur schwebenden Führung von bahnförmigem Material
CN101683002B (zh) * 2007-05-28 2012-06-13 千住金属工业株式会社 加热炉
DE102008047498A1 (de) * 2008-09-17 2010-04-15 Emitec Gesellschaft Für Emissionstechnologie Mbh Verfahren zum Löten eines metallischen Wabenkörpers und zur Abgasbehandlung
JPWO2010064428A1 (ja) * 2008-12-02 2012-05-10 千住金属工業株式会社 リフロー炉
JP5878018B2 (ja) * 2009-09-24 2016-03-08 千住金属工業株式会社 はんだ装置
WO2011135737A1 (ja) * 2010-04-28 2011-11-03 千住金属工業株式会社 加熱装置及び冷却装置
TWI397967B (zh) * 2010-05-28 2013-06-01 Taiwan Semiconductor Mfg 晶圓級迴銲設備和銲料球體與覆晶晶片組裝體的製造方法
JP5541354B1 (ja) * 2012-12-28 2014-07-09 千住金属工業株式会社 気体吹き出し孔の配列構造及びはんだ付け装置
JP5541353B1 (ja) * 2012-12-28 2014-07-09 千住金属工業株式会社 気体吸込み孔の配列構造及びはんだ付け装置
WO2014139099A1 (en) * 2013-03-13 2014-09-18 China Sunergy (Nanjing) Co., Ltd. Soldering system
DE102013217952B3 (de) * 2013-09-09 2014-11-06 Ersa Gmbh Vorrichtung zur Zuführung eines Heißgasstroms
JP2016203207A (ja) * 2015-04-22 2016-12-08 吉塚精機株式会社 リフロー炉
DE102016110040A1 (de) * 2016-05-31 2017-11-30 Endress + Hauser Gmbh + Co. Kg Fertigungslinie zum Löten
CN106081487B (zh) * 2016-07-28 2019-04-16 深圳市劲拓自动化设备股份有限公司 一种垂直回流炉
CN106241203B (zh) * 2016-07-28 2019-04-19 深圳市劲拓自动化设备股份有限公司 一种垂直回流炉
JP6905001B2 (ja) * 2018-05-01 2021-07-21 ユニバーサル製缶株式会社 缶体の製造方法
JP7241286B2 (ja) * 2018-06-27 2023-03-17 パナソニックＩｐマネジメント株式会社 リフロー炉およびはんだ付け処理方法
JP7420532B2 (ja) 2019-11-06 2024-01-23 アルテミラ製缶株式会社 乾燥装置
EP4234940A1 (de) * 2020-10-22 2023-08-30 Senju Metal Industry Co., Ltd. Lötvorrichtung

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2687504B2 (ja) * 1988-11-17 1997-12-08 松下電器産業株式会社 リフロー装置
JP2682138B2 (ja) 1989-05-16 1997-11-26 松下電器産業株式会社 加熱方法及びその装置
US5567151A (en) * 1994-10-21 1996-10-22 Senju Metal Industry Company Limited Reflow furnaces with hot air blow type heaters
JP3877477B2 (ja) 1999-11-12 2007-02-07 日本電熱計器株式会社 リフローはんだ付け装置
JP2001144427A (ja) 1999-11-12 2001-05-25 Nihon Dennetsu Keiki Co Ltd リフローはんだ付け装置
JP4043694B2 (ja) 2000-05-15 2008-02-06 松下電器産業株式会社 リフロー装置
JP3581828B2 (ja) 2000-12-25 2004-10-27 古河電気工業株式会社 半田付け用加熱炉
JP3799278B2 (ja) 2001-02-23 2006-07-19 株式会社タムラ製作所 熱風噴射装置、熱風噴射型加熱装置および加熱炉
JP4127482B2 (ja) 2002-05-14 2008-07-30 松下電器産業株式会社 リフロー加熱装置

Also Published As

Publication number Publication date
EP1870191A4 (de) 2009-12-09
JPWO2006013895A1 (ja) 2008-05-01
EP1870191B1 (de) 2012-03-28
EP1870191A1 (de) 2007-12-26
US20090134142A1 (en) 2009-05-28
EP1870191B9 (de) 2012-09-19
WO2006013895A1 (ja) 2006-02-09
JP4169075B2 (ja) 2008-10-22
US8084717B2 (en) 2011-12-27

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