JP4887858B2 - リフロー炉 - Google Patents
リフロー炉 Download PDFInfo
- Publication number
- JP4887858B2 JP4887858B2 JP2006086000A JP2006086000A JP4887858B2 JP 4887858 B2 JP4887858 B2 JP 4887858B2 JP 2006086000 A JP2006086000 A JP 2006086000A JP 2006086000 A JP2006086000 A JP 2006086000A JP 4887858 B2 JP4887858 B2 JP 4887858B2
- Authority
- JP
- Japan
- Prior art keywords
- hot air
- heater
- reflow furnace
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007664 blowing Methods 0.000 claims description 48
- 238000010438 heat treatment Methods 0.000 claims description 39
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 8
- 238000001816 cooling Methods 0.000 description 7
- 238000005192 partition Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
3 予備加熱ゾーン
4 本加熱ゾーン
5 冷却ゾーン
6 熱風吹き出しヒーター
23 ヒーター面
24 ユニットノズル
A、B、C、D ヒーターブロック
25 噴出孔
26 吸い込み口
Claims (4)
- プリント基板に塗布したソルダペーストを溶融させてはんだ付けを行うリフロー炉において、
予備加熱ゾーンと本加熱ゾーンの上部または上下部に設置された熱風吹き出しヒーターを備え、
前記熱風吹き出しヒーターは、
近傍に吸い込み口が形成され、かつ、ヒーター面から突出して配置された複数のユニットノズルから構成され、
前記ユニットノズルは、
複数個のヒーターブロックが組み合わされて形成され、
前記ヒーターブロックは、その縦方に多数の噴出孔が穿設され、当該噴出孔の穿設面が山と谷を有した曲げ形状を成しており、
前記ユニットノズルは、
一方の前記ヒーターブロックの山と隣接する他方の前記ヒーターブロックの山とが一列に並べられて配置されることを特徴とするリフロー炉。 - 前記ヒーターブロックは、アルミニューム製であることを特徴とする請求項1に記載のリフロー炉。
- 前記ユニットノズルは、
複数個の前記ヒーターブロックが組み合わされてジグザグ形状を成していることを特徴とする請求項1に記載のリフロー炉。 - 前記ユニットノズルは、
複数個の前記ヒーターブロックが組み合わされて波形形状を成していることを特徴とする請求項1に記載のリフロー炉。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006086000A JP4887858B2 (ja) | 2006-03-27 | 2006-03-27 | リフロー炉 |
CN2007800104831A CN101411249B (zh) | 2006-03-27 | 2007-03-24 | 回流炉 |
PCT/JP2007/056112 WO2007116666A1 (ja) | 2006-03-27 | 2007-03-24 | リフロー炉 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006086000A JP4887858B2 (ja) | 2006-03-27 | 2006-03-27 | リフロー炉 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007266100A JP2007266100A (ja) | 2007-10-11 |
JP4887858B2 true JP4887858B2 (ja) | 2012-02-29 |
Family
ID=38580965
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006086000A Active JP4887858B2 (ja) | 2006-03-27 | 2006-03-27 | リフロー炉 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4887858B2 (ja) |
CN (1) | CN101411249B (ja) |
WO (1) | WO2007116666A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5541354B1 (ja) * | 2012-12-28 | 2014-07-09 | 千住金属工業株式会社 | 気体吹き出し孔の配列構造及びはんだ付け装置 |
JP5541353B1 (ja) * | 2012-12-28 | 2014-07-09 | 千住金属工業株式会社 | 気体吸込み孔の配列構造及びはんだ付け装置 |
CN103639564B (zh) * | 2013-12-11 | 2015-08-26 | 中国电子科技集团公司第二研究所 | 炉门带锁紧机构的共晶炉 |
WO2021003044A1 (en) * | 2019-07-03 | 2021-01-07 | Corning Incorporated | Shuttle kiln exhaust configuration |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0661364U (ja) * | 1993-01-19 | 1994-08-30 | 東京生産技研株式会社 | 半田付装置 |
JP3799278B2 (ja) * | 2001-02-23 | 2006-07-19 | 株式会社タムラ製作所 | 熱風噴射装置、熱風噴射型加熱装置および加熱炉 |
WO2006013895A1 (ja) * | 2004-08-04 | 2006-02-09 | Senju Metal Industry Co., Ltd. | リフロー炉 |
WO2007023604A1 (ja) * | 2005-08-23 | 2007-03-01 | Senju Metal Industry Co., Ltd. | リフロー炉 |
-
2006
- 2006-03-27 JP JP2006086000A patent/JP4887858B2/ja active Active
-
2007
- 2007-03-24 WO PCT/JP2007/056112 patent/WO2007116666A1/ja active Application Filing
- 2007-03-24 CN CN2007800104831A patent/CN101411249B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN101411249B (zh) | 2012-05-16 |
JP2007266100A (ja) | 2007-10-11 |
WO2007116666A1 (ja) | 2007-10-18 |
CN101411249A (zh) | 2009-04-15 |
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