ATE521692T1 - Halbleiteroberflächenbehandlung und dabei verwendete mischung - Google Patents
Halbleiteroberflächenbehandlung und dabei verwendete mischungInfo
- Publication number
- ATE521692T1 ATE521692T1 AT03810398T AT03810398T ATE521692T1 AT E521692 T1 ATE521692 T1 AT E521692T1 AT 03810398 T AT03810398 T AT 03810398T AT 03810398 T AT03810398 T AT 03810398T AT E521692 T1 ATE521692 T1 AT E521692T1
- Authority
- AT
- Austria
- Prior art keywords
- surface treatment
- substrate
- semiconductor surface
- mixture used
- relates
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 4
- 238000004381 surface treatment Methods 0.000 title abstract 4
- 239000004065 semiconductor Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 4
- 238000000034 method Methods 0.000 abstract 2
- 239000012535 impurity Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/39—Organic or inorganic per-compounds
- C11D3/3947—Liquid compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/06—Hydroxides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3245—Aminoacids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Inorganic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
- Formation Of Insulating Films (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02024675 | 2002-11-05 | ||
PCT/EP2003/011254 WO2004041989A1 (en) | 2002-11-05 | 2003-10-10 | Semiconductor surface treatment and mixture used therein |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE521692T1 true ATE521692T1 (de) | 2011-09-15 |
Family
ID=32309312
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03810398T ATE521692T1 (de) | 2002-11-05 | 2003-10-10 | Halbleiteroberflächenbehandlung und dabei verwendete mischung |
Country Status (10)
Country | Link |
---|---|
US (1) | US20060025320A1 (de) |
EP (1) | EP1567633B1 (de) |
JP (1) | JP2006505132A (de) |
KR (1) | KR20050084939A (de) |
CN (1) | CN1711349B (de) |
AT (1) | ATE521692T1 (de) |
AU (1) | AU2003276094A1 (de) |
RU (1) | RU2329298C2 (de) |
TW (1) | TWI333975B (de) |
WO (1) | WO2004041989A1 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE602004009584T2 (de) * | 2003-06-27 | 2008-08-07 | Interuniversitair Microelektronica Centrum (Imec) | Halbleiterreinigungslösung |
WO2006009668A1 (en) * | 2004-06-16 | 2006-01-26 | Memc Electronic Materials, Inc. | Silicon wafer etching process and composition |
DE602006014551D1 (de) * | 2006-10-31 | 2010-07-08 | Soitec Silicon On Insulator | Verfahren zur Charakterisierung von Defekten auf Silizium-Oberflächen, Ätzlösung für Silizium-Oberflächen und Verfahren zur Behandlung von Silizium-Oberflächen mit der Ätzlösung |
EP2426705A4 (de) * | 2009-04-30 | 2012-09-26 | Lion Corp | Verfahren zur reinigung eines halbleitersubstrats und saure lösung |
JP5278492B2 (ja) * | 2010-06-16 | 2013-09-04 | 株式会社デンソー | 半導体装置の製造方法 |
RU2486287C2 (ru) * | 2011-04-29 | 2013-06-27 | Антон Викторович Мантузов | Способ очистки поверхности полупроводниковых пластин и регенерации травильных растворов |
RU2495512C2 (ru) * | 2011-11-23 | 2013-10-10 | Валерий Михайлович Рыков | Способ очистки поверхности полупроводниковых пластин |
US20140054266A1 (en) * | 2012-08-24 | 2014-02-27 | Wiechang Jin | Compositions and methods for selective polishing of platinum and ruthenium materials |
WO2017188325A1 (ja) * | 2016-04-28 | 2017-11-02 | 富士フイルム株式会社 | 組成物、組成物収容体、組成物の製造方法 |
WO2017188296A1 (ja) * | 2016-04-28 | 2017-11-02 | 富士フイルム株式会社 | 処理液及び処理液収容体 |
CN109075052A (zh) * | 2016-04-28 | 2018-12-21 | 富士胶片株式会社 | 组合物、组合物收容体及组合物的制造方法 |
CN116631848A (zh) * | 2023-07-20 | 2023-08-22 | 山东有研艾斯半导体材料有限公司 | 一种改善硅抛光片表面金属和颗粒品质的硅片的清洗方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5209927A (en) * | 1985-01-23 | 1993-05-11 | Alcon Laboratories, Inc. | Ophthalmic solution |
CA2059841A1 (en) * | 1991-01-24 | 1992-07-25 | Ichiro Hayashida | Surface treating solutions and cleaning method |
EP0789071B1 (de) * | 1995-07-27 | 2006-10-11 | Mitsubishi Chemical Corporation | Verfahren zur behandlung einer substratoberfläche und behandlungsmittel hierfür |
TW416987B (en) * | 1996-06-05 | 2001-01-01 | Wako Pure Chem Ind Ltd | A composition for cleaning the semiconductor substrate surface |
US5962384A (en) * | 1997-10-28 | 1999-10-05 | International Business Machines Corporation | Method for cleaning semiconductor devices |
IL139546A (en) * | 1998-05-18 | 2005-08-31 | Mallinckrodt Inc | Silicate-containing alkaline compositions for cleaning microelectronic substrates |
EP1091395A1 (de) * | 1999-09-30 | 2001-04-11 | Interuniversitair Microelektronica Centrum Vzw | Reinigungslösung für Behandlung von Halbleitersubstraten |
US7678836B2 (en) * | 1999-11-04 | 2010-03-16 | Fxs Ventures, Llc | Method for rendering a contact lens wettable |
US6599370B2 (en) * | 2000-10-16 | 2003-07-29 | Mallinckrodt Inc. | Stabilized alkaline compositions for cleaning microelectronic substrates |
FR2816528B3 (fr) * | 2000-11-14 | 2003-04-04 | Lionel Girardie | Procede de gravure selective du cuivre et de nettoyage par face et de la circonference d'un substrat |
US6803353B2 (en) * | 2002-11-12 | 2004-10-12 | Atofina Chemicals, Inc. | Copper chemical mechanical polishing solutions using sulfonated amphiprotic agents |
US6911393B2 (en) * | 2002-12-02 | 2005-06-28 | Arkema Inc. | Composition and method for copper chemical mechanical planarization |
-
2003
- 2003-10-10 RU RU2005117609/04A patent/RU2329298C2/ru not_active IP Right Cessation
- 2003-10-10 KR KR1020057007933A patent/KR20050084939A/ko not_active Application Discontinuation
- 2003-10-10 US US10/533,944 patent/US20060025320A1/en not_active Abandoned
- 2003-10-10 EP EP03810398A patent/EP1567633B1/de not_active Expired - Lifetime
- 2003-10-10 AU AU2003276094A patent/AU2003276094A1/en not_active Abandoned
- 2003-10-10 JP JP2004548738A patent/JP2006505132A/ja active Pending
- 2003-10-10 WO PCT/EP2003/011254 patent/WO2004041989A1/en active Application Filing
- 2003-10-10 AT AT03810398T patent/ATE521692T1/de not_active IP Right Cessation
- 2003-10-10 CN CN200380102813.1A patent/CN1711349B/zh not_active Expired - Fee Related
- 2003-10-31 TW TW092130535A patent/TWI333975B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2004041989A1 (en) | 2004-05-21 |
CN1711349A (zh) | 2005-12-21 |
AU2003276094A1 (en) | 2004-06-07 |
RU2329298C2 (ru) | 2008-07-20 |
KR20050084939A (ko) | 2005-08-29 |
EP1567633A1 (de) | 2005-08-31 |
TW200416284A (en) | 2004-09-01 |
EP1567633B1 (de) | 2011-08-24 |
CN1711349B (zh) | 2010-05-26 |
US20060025320A1 (en) | 2006-02-02 |
TWI333975B (en) | 2010-12-01 |
JP2006505132A (ja) | 2006-02-09 |
RU2005117609A (ru) | 2006-01-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |