ATE521692T1 - Halbleiteroberflächenbehandlung und dabei verwendete mischung - Google Patents

Halbleiteroberflächenbehandlung und dabei verwendete mischung

Info

Publication number
ATE521692T1
ATE521692T1 AT03810398T AT03810398T ATE521692T1 AT E521692 T1 ATE521692 T1 AT E521692T1 AT 03810398 T AT03810398 T AT 03810398T AT 03810398 T AT03810398 T AT 03810398T AT E521692 T1 ATE521692 T1 AT E521692T1
Authority
AT
Austria
Prior art keywords
surface treatment
substrate
semiconductor surface
mixture used
relates
Prior art date
Application number
AT03810398T
Other languages
English (en)
Inventor
Marc Boerner
Gernod Kilian
Rudolf Rhein
Lucia Arnold
Michael Schuster
Alexander Leopold
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Application granted granted Critical
Publication of ATE521692T1 publication Critical patent/ATE521692T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/39—Organic or inorganic per-compounds
    • C11D3/3947—Liquid compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/06—Hydroxides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3245—Aminoacids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • Formation Of Insulating Films (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
AT03810398T 2002-11-05 2003-10-10 Halbleiteroberflächenbehandlung und dabei verwendete mischung ATE521692T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP02024675 2002-11-05
PCT/EP2003/011254 WO2004041989A1 (en) 2002-11-05 2003-10-10 Semiconductor surface treatment and mixture used therein

Publications (1)

Publication Number Publication Date
ATE521692T1 true ATE521692T1 (de) 2011-09-15

Family

ID=32309312

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03810398T ATE521692T1 (de) 2002-11-05 2003-10-10 Halbleiteroberflächenbehandlung und dabei verwendete mischung

Country Status (10)

Country Link
US (1) US20060025320A1 (de)
EP (1) EP1567633B1 (de)
JP (1) JP2006505132A (de)
KR (1) KR20050084939A (de)
CN (1) CN1711349B (de)
AT (1) ATE521692T1 (de)
AU (1) AU2003276094A1 (de)
RU (1) RU2329298C2 (de)
TW (1) TWI333975B (de)
WO (1) WO2004041989A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602004009584T2 (de) * 2003-06-27 2008-08-07 Interuniversitair Microelektronica Centrum (Imec) Halbleiterreinigungslösung
WO2006009668A1 (en) * 2004-06-16 2006-01-26 Memc Electronic Materials, Inc. Silicon wafer etching process and composition
DE602006014551D1 (de) * 2006-10-31 2010-07-08 Soitec Silicon On Insulator Verfahren zur Charakterisierung von Defekten auf Silizium-Oberflächen, Ätzlösung für Silizium-Oberflächen und Verfahren zur Behandlung von Silizium-Oberflächen mit der Ätzlösung
EP2426705A4 (de) * 2009-04-30 2012-09-26 Lion Corp Verfahren zur reinigung eines halbleitersubstrats und saure lösung
JP5278492B2 (ja) * 2010-06-16 2013-09-04 株式会社デンソー 半導体装置の製造方法
RU2486287C2 (ru) * 2011-04-29 2013-06-27 Антон Викторович Мантузов Способ очистки поверхности полупроводниковых пластин и регенерации травильных растворов
RU2495512C2 (ru) * 2011-11-23 2013-10-10 Валерий Михайлович Рыков Способ очистки поверхности полупроводниковых пластин
US20140054266A1 (en) * 2012-08-24 2014-02-27 Wiechang Jin Compositions and methods for selective polishing of platinum and ruthenium materials
WO2017188325A1 (ja) * 2016-04-28 2017-11-02 富士フイルム株式会社 組成物、組成物収容体、組成物の製造方法
WO2017188296A1 (ja) * 2016-04-28 2017-11-02 富士フイルム株式会社 処理液及び処理液収容体
CN109075052A (zh) * 2016-04-28 2018-12-21 富士胶片株式会社 组合物、组合物收容体及组合物的制造方法
CN116631848A (zh) * 2023-07-20 2023-08-22 山东有研艾斯半导体材料有限公司 一种改善硅抛光片表面金属和颗粒品质的硅片的清洗方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5209927A (en) * 1985-01-23 1993-05-11 Alcon Laboratories, Inc. Ophthalmic solution
CA2059841A1 (en) * 1991-01-24 1992-07-25 Ichiro Hayashida Surface treating solutions and cleaning method
EP0789071B1 (de) * 1995-07-27 2006-10-11 Mitsubishi Chemical Corporation Verfahren zur behandlung einer substratoberfläche und behandlungsmittel hierfür
TW416987B (en) * 1996-06-05 2001-01-01 Wako Pure Chem Ind Ltd A composition for cleaning the semiconductor substrate surface
US5962384A (en) * 1997-10-28 1999-10-05 International Business Machines Corporation Method for cleaning semiconductor devices
IL139546A (en) * 1998-05-18 2005-08-31 Mallinckrodt Inc Silicate-containing alkaline compositions for cleaning microelectronic substrates
EP1091395A1 (de) * 1999-09-30 2001-04-11 Interuniversitair Microelektronica Centrum Vzw Reinigungslösung für Behandlung von Halbleitersubstraten
US7678836B2 (en) * 1999-11-04 2010-03-16 Fxs Ventures, Llc Method for rendering a contact lens wettable
US6599370B2 (en) * 2000-10-16 2003-07-29 Mallinckrodt Inc. Stabilized alkaline compositions for cleaning microelectronic substrates
FR2816528B3 (fr) * 2000-11-14 2003-04-04 Lionel Girardie Procede de gravure selective du cuivre et de nettoyage par face et de la circonference d'un substrat
US6803353B2 (en) * 2002-11-12 2004-10-12 Atofina Chemicals, Inc. Copper chemical mechanical polishing solutions using sulfonated amphiprotic agents
US6911393B2 (en) * 2002-12-02 2005-06-28 Arkema Inc. Composition and method for copper chemical mechanical planarization

Also Published As

Publication number Publication date
WO2004041989A1 (en) 2004-05-21
CN1711349A (zh) 2005-12-21
AU2003276094A1 (en) 2004-06-07
RU2329298C2 (ru) 2008-07-20
KR20050084939A (ko) 2005-08-29
EP1567633A1 (de) 2005-08-31
TW200416284A (en) 2004-09-01
EP1567633B1 (de) 2011-08-24
CN1711349B (zh) 2010-05-26
US20060025320A1 (en) 2006-02-02
TWI333975B (en) 2010-12-01
JP2006505132A (ja) 2006-02-09
RU2005117609A (ru) 2006-01-20

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