ATE495655T1 - Elektronische vorrichtung - Google Patents

Elektronische vorrichtung

Info

Publication number
ATE495655T1
ATE495655T1 AT04027461T AT04027461T ATE495655T1 AT E495655 T1 ATE495655 T1 AT E495655T1 AT 04027461 T AT04027461 T AT 04027461T AT 04027461 T AT04027461 T AT 04027461T AT E495655 T1 ATE495655 T1 AT E495655T1
Authority
AT
Austria
Prior art keywords
substrate
radiator
case
heat
assembly
Prior art date
Application number
AT04027461T
Other languages
English (en)
Inventor
Takahiro Suzuki
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Application granted granted Critical
Publication of ATE495655T1 publication Critical patent/ATE495655T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Surgical Instruments (AREA)
  • Valve Device For Special Equipments (AREA)
  • Noodles (AREA)
AT04027461T 2003-12-10 2004-11-18 Elektronische vorrichtung ATE495655T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003411240A JP4197292B2 (ja) 2003-12-10 2003-12-10 電子装置

Publications (1)

Publication Number Publication Date
ATE495655T1 true ATE495655T1 (de) 2011-01-15

Family

ID=34510508

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04027461T ATE495655T1 (de) 2003-12-10 2004-11-18 Elektronische vorrichtung

Country Status (6)

Country Link
US (1) US7262970B2 (de)
EP (1) EP1542521B1 (de)
JP (1) JP4197292B2 (de)
CN (1) CN100471373C (de)
AT (1) ATE495655T1 (de)
DE (1) DE602004030988D1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2355628B1 (de) * 2010-01-29 2013-10-16 LG Electronics Inc. Mobiles Endgerät
CN102420001B (zh) * 2010-10-21 2014-04-09 延锋伟世通汽车电子有限公司 一种汽车音响光碟机芯散热模块
TWI642331B (zh) * 2017-06-02 2018-11-21 台達電子工業股份有限公司 印刷電路板組裝結構及其組裝方法
CN108990251B (zh) 2017-06-02 2020-12-25 台达电子工业股份有限公司 印刷电路板组装结构及其组装方法
JP2021040019A (ja) * 2019-09-03 2021-03-11 住友電装株式会社 基板ケース及び電気接続箱

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2964621A (en) * 1957-02-04 1960-12-13 Motorola Inc Combined transistor heat sink and panel
JPS60261160A (ja) * 1984-06-07 1985-12-24 Mitsubishi Electric Corp 電気機器の放熱装置
US4872102A (en) * 1986-04-28 1989-10-03 Dimensions Unlimited, Inc. D.C. to A.C. inverter having improved structure providing improved thermal dissipation
US5689403A (en) * 1994-12-27 1997-11-18 Motorola, Inc. Intercooled electronic device
JP2001111272A (ja) * 1999-10-12 2001-04-20 Kenwood Corp 放熱器取付構造
US6778388B1 (en) * 2001-07-23 2004-08-17 Garmin Ltd. Water-resistant electronic enclosure having a heat sink
JP2003289191A (ja) * 2002-03-28 2003-10-10 Denso Corp 電子制御装置

Also Published As

Publication number Publication date
CN100471373C (zh) 2009-03-18
DE602004030988D1 (de) 2011-02-24
US20050128711A1 (en) 2005-06-16
EP1542521A2 (de) 2005-06-15
CN1627893A (zh) 2005-06-15
EP1542521A3 (de) 2008-02-20
JP4197292B2 (ja) 2008-12-17
US7262970B2 (en) 2007-08-28
EP1542521B1 (de) 2011-01-12
JP2005175103A (ja) 2005-06-30

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Legal Events

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