ATE463345T1 - Verbundfolie - Google Patents

Verbundfolie

Info

Publication number
ATE463345T1
ATE463345T1 AT99901928T AT99901928T ATE463345T1 AT E463345 T1 ATE463345 T1 AT E463345T1 AT 99901928 T AT99901928 T AT 99901928T AT 99901928 T AT99901928 T AT 99901928T AT E463345 T1 ATE463345 T1 AT E463345T1
Authority
AT
Austria
Prior art keywords
composite film
solvent
solution
tetracarboxylic dianhydride
soluble
Prior art date
Application number
AT99901928T
Other languages
English (en)
Inventor
Hiroshi Itatani
Shunichi Matsumoto
Original Assignee
Pi R & D Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pi R & D Co Ltd filed Critical Pi R & D Co Ltd
Application granted granted Critical
Publication of ATE463345T1 publication Critical patent/ATE463345T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Glass Compositions (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AT99901928T 1999-01-13 1999-02-01 Verbundfolie ATE463345T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11043648A JP2000202970A (ja) 1999-01-13 1999-01-13 ポリイミド被覆フィルム
PCT/JP1999/000409 WO2000041884A1 (fr) 1999-01-13 1999-02-01 Film complexe

Publications (1)

Publication Number Publication Date
ATE463345T1 true ATE463345T1 (de) 2010-04-15

Family

ID=12669696

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99901928T ATE463345T1 (de) 1999-01-13 1999-02-01 Verbundfolie

Country Status (6)

Country Link
US (1) US6589662B1 (de)
EP (1) EP1145845B1 (de)
JP (1) JP2000202970A (de)
AT (1) ATE463345T1 (de)
DE (1) DE69942234D1 (de)
WO (1) WO2000041884A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100369708B1 (ko) * 2001-02-07 2003-02-05 한국화학연구원 접착성이 우수한 폴리이미드/폴리에틸렌테레프탈레이트 복합필름 및 그의 제조방법
US6856086B2 (en) 2001-06-25 2005-02-15 Avery Dennison Corporation Hybrid display device
US6727970B2 (en) 2001-06-25 2004-04-27 Avery Dennison Corporation Method of making a hybrid display device having a rigid substrate and a flexible substrate
US7094492B2 (en) 2001-10-11 2006-08-22 Honda Giken Kogyo Kabushiki Kaisha Electrode for polymer electrolyte fuel cell
JP3978012B2 (ja) * 2001-11-01 2007-09-19 株式会社クレハ 多層容器及びその製造方法
DE60322663D1 (de) * 2002-01-15 2008-09-18 Pi R & D Co Ltd Lösungsmittellösliche block-copolyimidzusammensetzung und herstellungsverfahren dafür
US6811815B2 (en) 2002-06-14 2004-11-02 Avery Dennison Corporation Method for roll-to-roll deposition of optically transparent and high conductivity metallic thin films
US7452610B2 (en) * 2005-06-29 2008-11-18 Du Pont Toray Company Limited Multi-layer polyimide films and flexible circuit substrates therefrom
JPWO2007132529A1 (ja) * 2006-05-17 2009-09-17 株式会社ピーアイ技術研究所 金属複合フィルム及びその製造方法
JP2008205974A (ja) 2007-02-21 2008-09-04 Sony Corp スピーカ用振動板
CN101651234B (zh) * 2008-08-13 2012-10-17 比亚迪股份有限公司 一种锂离子二次电池
WO2011063247A2 (en) * 2009-11-20 2011-05-26 E. I. Du Pont De Nemours And Company Interposer films useful in semiconductor packaging applications, and methods relating thereto
JP2010045863A (ja) * 2009-11-24 2010-02-25 Sony Corp スピーカ用振動板およびそれを備えたスピーカ装置
JP5510908B2 (ja) 2010-02-26 2014-06-04 株式会社ピーアイ技術研究所 半導体装置用ポリイミド樹脂組成物並びにそれを用いた半導体装置中の膜形成方法及び半導体装置
JP5655206B2 (ja) 2010-09-21 2015-01-21 株式会社ピーアイ技術研究所 太陽電池の裏面反射層形成用ポリイミド樹脂組成物及びそれを用いた太陽電池の裏面反射層形成方法
JP2012069594A (ja) 2010-09-21 2012-04-05 Pi R & D Co Ltd 太陽電池内の絶縁膜形成用ポリイミド樹脂組成物及びそれを用いた太陽電池内の絶縁膜形成方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0816173B2 (ja) 1988-12-12 1996-02-21 帝人株式会社 可撓性回路基盤及びそのベースフイルム
JP2658632B2 (ja) * 1991-06-12 1997-09-30 信越化学工業株式会社 半導体封止用エポキシ樹脂成形材料接着用プライマー組成物
JP2721445B2 (ja) * 1991-10-21 1998-03-04 住友ベークライト株式会社 エレクトロニクス用フィルム接着剤
JP3126577B2 (ja) * 1993-12-02 2001-01-22 パーカー加工株式会社 ポリイミドブロック共重合体の製造方法及びその溶液組成物
US5502143A (en) * 1992-12-25 1996-03-26 Pi Material Research Laboratory Process for preparing polyimide resins
DE69324662T2 (de) * 1992-12-25 1999-09-02 Itatani Polyamid-Lösungszusammensetzungen und Verfahren zur Herstellung
JP3952560B2 (ja) * 1997-10-31 2007-08-01 日本ゼオン株式会社 複合フィルム
DE10008121B4 (de) * 2000-02-22 2006-03-09 Saehan Micronics Inc. Verfahren zur Herstellung von Polyamidsäure und Polyimid und Haft- oder Klebemittel, das aus der oder dem so hergestellten Polyamidsäure oder Polyimid besteht

Also Published As

Publication number Publication date
EP1145845A1 (de) 2001-10-17
WO2000041884A1 (fr) 2000-07-20
JP2000202970A (ja) 2000-07-25
DE69942234D1 (de) 2010-05-20
EP1145845A4 (de) 2003-03-19
EP1145845B1 (de) 2010-04-07
US6589662B1 (en) 2003-07-08

Similar Documents

Publication Publication Date Title
ATE463345T1 (de) Verbundfolie
DK1022301T3 (da) I det væsentlige farvelöse, transparente polyimidcoatinger og -film
JP2907598B2 (ja) 柔軟な多層ポリイミドフィルム積層品及びそれらの製造法
KR980700686A (ko) 스크린 프린팅에 의한 폴리이미드 코팅막의 형성방법 (Forming polyimide coatings by screen printing)
US5112694A (en) Flexible printed-circuit base board and process for producing the same
EP1266926A4 (de) Polyimid-Klebstoffharz und Laminat-Klebemittel
KR970707211A (ko) 폴리암산 및 폴리암산을 폴리이미드벤즈옥사졸 필름으로 전환시키는 방법(Polyamic acids and methods to comvert polyamic acids into polyimidebenzoxazole films)
EP0303774A3 (de) Hochlösliche, klare Polyimide
JPH07214637A (ja) 同時押出多層芳香族ポリイミドフィルムの製造方法
MY100989A (en) Silicone polyimides, and method for making
CA2274264A1 (en) Polyimides having high tg, high tos, and low moisture regain
JPS57143327A (en) Production of siloxane-modified polyimide precursor
KR960701166A (ko) 3층 폴리이미드실록산 접착 테이프(Three-layer polyimidesiloxane adhesive tape)
DE69934960D1 (de) Tetracarbonsäuredianhydrid, Derivat und Herstellung davon, Polyimidvorläufer, Polyimid, Harzzusammensetzung, photoempfindliche Harzzusammensetzung, Verfahren zur Erzeugung von Prägemustern und elektronisches Bauteil
JP2004531608A5 (de)
KR910002949A (ko) 고분자량 폴리이미드 축합 생성 조성물 및 이들로 구성된 중합체 필름
DE69324662T2 (de) Polyamid-Lösungszusammensetzungen und Verfahren zur Herstellung
GB1428823A (en) Soluble polyimides form aromatic dianhydrides and 10,10-di- p-aminophenyl-thioxanthene
JPH11220248A (ja) 屈曲部付き柔軟性配線板および保護塗膜材
JP2001164006A5 (de)
JP3295952B2 (ja) フレキシブル配線基板の製造方法
DE69718251T2 (de) Polyesterblasfolie
US5254361A (en) Method for producing printed circuit boards
JPS57144526A (en) Liquid crystal display element
JPH04153224A (ja) 両面フレキシブルプリント回路基板用樹脂。

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties