ATE456619T1 - Material für ein elektronisches teil zur hochfrequenz-verwendung und elektronisches teil zur hochfrequenz-verwendung enthaltend dieses material - Google Patents

Material für ein elektronisches teil zur hochfrequenz-verwendung und elektronisches teil zur hochfrequenz-verwendung enthaltend dieses material

Info

Publication number
ATE456619T1
ATE456619T1 AT07742911T AT07742911T ATE456619T1 AT E456619 T1 ATE456619 T1 AT E456619T1 AT 07742911 T AT07742911 T AT 07742911T AT 07742911 T AT07742911 T AT 07742911T AT E456619 T1 ATE456619 T1 AT E456619T1
Authority
AT
Austria
Prior art keywords
frequency use
electronic part
high frequency
cycloolefin resin
elastomer ingredient
Prior art date
Application number
AT07742911T
Other languages
English (en)
Inventor
Eiki Kunimoto
Hirotaka Miyazaki
Original Assignee
Polyplastics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co filed Critical Polyplastics Co
Application granted granted Critical
Publication of ATE456619T1 publication Critical patent/ATE456619T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
    • C08L23/0815—Copolymers of ethene with aliphatic 1-olefins
    • C08L23/0823—Copolymers of ethene with aliphatic cyclic olefins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)
AT07742911T 2006-05-09 2007-05-07 Material für ein elektronisches teil zur hochfrequenz-verwendung und elektronisches teil zur hochfrequenz-verwendung enthaltend dieses material ATE456619T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006129825A JP5345753B2 (ja) 2006-05-09 2006-05-09 高周波用電子部品用材料及び当該材料からなる高周波用電子部品
PCT/JP2007/059476 WO2007129694A1 (ja) 2006-05-09 2007-05-07 高周波用電子部品用材料及び当該材料からなる高周波用電子部品

Publications (1)

Publication Number Publication Date
ATE456619T1 true ATE456619T1 (de) 2010-02-15

Family

ID=38667802

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07742911T ATE456619T1 (de) 2006-05-09 2007-05-07 Material für ein elektronisches teil zur hochfrequenz-verwendung und elektronisches teil zur hochfrequenz-verwendung enthaltend dieses material

Country Status (8)

Country Link
EP (1) EP2022825B1 (de)
JP (1) JP5345753B2 (de)
KR (1) KR100958923B1 (de)
CN (1) CN101437893B (de)
AT (1) ATE456619T1 (de)
DE (1) DE602007004599D1 (de)
TW (1) TWI410455B (de)
WO (1) WO2007129694A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101497637B1 (ko) * 2011-02-25 2015-03-02 포리프라스틱 가부시키가이샤 성형품의 제조방법 및 성형품
JP6881406B2 (ja) * 2018-08-31 2021-06-02 株式会社村田製作所 方向性結合器
WO2024038794A1 (ja) * 2022-08-15 2024-02-22 三井化学株式会社 低誘電性樹脂組成物、接着付与剤、低誘電接着性組成物、低誘電接着性成形物、低誘電接着剤および積層体

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4400340A (en) 1982-01-25 1983-08-23 Hercules Incorporated Method for making a dicyclopentadiene thermoset polymer
US4380617A (en) 1982-01-20 1983-04-19 The B. F. Goodrich Company Preparation of polymers from cycloolefins
JP2598077B2 (ja) * 1988-04-06 1997-04-09 三井石油化学工業株式会社 環状オレフィン系ランダム共重合体組成物
KR910008771B1 (ko) * 1987-10-08 1991-10-21 미쓰이세끼유가가꾸고오교오 가부시끼가이샤 환상 올레핀계 랜덤 공중합체 조성물
JP3311390B2 (ja) * 1992-04-20 2002-08-05 三井化学株式会社 オレフィン系熱可塑性エラストマー組成物およびその製造方法
JP3319116B2 (ja) 1992-12-28 2002-08-26 日本ゼオン株式会社 架橋性ノルボルネン系樹脂組成物、及びそれから成る成形品
JP3114574B2 (ja) * 1995-05-31 2000-12-04 日本ゼオン株式会社 熱可塑性ノルボルネン系樹脂成形材料及びそれを用いる成形品
TW386095B (en) * 1996-03-14 2000-04-01 Cosmo Sogo Kenkyusho Kk Resin composition to be plated
JPH1121413A (ja) 1997-07-02 1999-01-26 Kanegafuchi Chem Ind Co Ltd シクロオレフィン系共重合体樹脂組成物及びその製造方法
JPH1160971A (ja) * 1997-08-18 1999-03-05 Nippon Zeon Co Ltd 熱可塑性炭化水素重合体組成物
JP4092756B2 (ja) * 1997-11-28 2008-05-28 日本ゼオン株式会社 熱可塑性炭化水素重合体製インシュレーターおよびコネクター
JP4194706B2 (ja) * 1999-03-23 2008-12-10 旭化成ケミカルズ株式会社 シクロオレフィン系樹脂組成物
JP2001011247A (ja) * 1999-06-28 2001-01-16 Mitsui Chemicals Inc 自動車用シール部材
JP2001011248A (ja) * 1999-06-28 2001-01-16 Mitsui Chemicals Inc オレフィン系熱可塑性エラストマー組成物
JP4144128B2 (ja) 1999-08-24 2008-09-03 日本ゼオン株式会社 硬化性組成物及び回路基板
JP2003115645A (ja) * 2001-10-05 2003-04-18 Nippon Zeon Co Ltd 立体回路基板
JP3847599B2 (ja) * 2001-10-22 2006-11-22 ポリプラスチックス株式会社 耐衝撃性環状オレフィン系樹脂組成物及び成形品
JP2003238761A (ja) 2002-02-21 2003-08-27 Nof Corp 架橋性樹脂組成物、架橋性成形品および架橋成形品
JP3801117B2 (ja) * 2002-08-26 2006-07-26 株式会社日立製作所 低誘電正接フィルムおよび配線フィルム
JP2004169049A (ja) * 2002-11-15 2004-06-17 Polyplastics Co 環状オレフィン系樹脂成形品表面への金属複合方法及び金属複合化環状オレフィン系樹脂成形品
JP2004167687A (ja) * 2002-11-15 2004-06-17 Polyplastics Co 環状オレフィン系樹脂成形品表面への金属複合方法及び金属複合化環状オレフィン系樹脂成形品
EP1592745B1 (de) * 2003-01-28 2007-04-11 Cryovac, Inc. Cycloolefinpolymer für hochmodulige folien
KR100935145B1 (ko) * 2005-03-07 2010-01-06 미쓰이 가가쿠 가부시키가이샤 환상 올레핀계 수지 조성물 및 그 수지 조성물로부터 얻어지는 기판
JP3981889B2 (ja) * 2005-06-15 2007-09-26 東洋紡績株式会社 高周波用電子部品

Also Published As

Publication number Publication date
TWI410455B (zh) 2013-10-01
EP2022825B1 (de) 2010-01-27
KR20090007404A (ko) 2009-01-16
EP2022825A1 (de) 2009-02-11
JP5345753B2 (ja) 2013-11-20
CN101437893A (zh) 2009-05-20
KR100958923B1 (ko) 2010-05-19
CN101437893B (zh) 2011-05-04
EP2022825A4 (de) 2009-05-27
JP2007302722A (ja) 2007-11-22
WO2007129694A1 (ja) 2007-11-15
TW200745247A (en) 2007-12-16
DE602007004599D1 (de) 2010-03-18

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