ATE453203T1 - METALLIZATION OF CARBON NANOTUBE FOR FIELD EMISSION APPLICATIONS - Google Patents

METALLIZATION OF CARBON NANOTUBE FOR FIELD EMISSION APPLICATIONS

Info

Publication number
ATE453203T1
ATE453203T1 AT03746707T AT03746707T ATE453203T1 AT E453203 T1 ATE453203 T1 AT E453203T1 AT 03746707 T AT03746707 T AT 03746707T AT 03746707 T AT03746707 T AT 03746707T AT E453203 T1 ATE453203 T1 AT E453203T1
Authority
AT
Austria
Prior art keywords
carbon nanotubes
metallized carbon
methods
metallization
carbon nanotube
Prior art date
Application number
AT03746707T
Other languages
German (de)
Inventor
Dongsheng Mao
Zvi Yaniv
Richard Fink
Original Assignee
Applied Nanotech Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/372,006 external-priority patent/US20040018371A1/en
Priority claimed from US10/406,928 external-priority patent/US6975063B2/en
Application filed by Applied Nanotech Holdings Inc filed Critical Applied Nanotech Holdings Inc
Application granted granted Critical
Publication of ATE453203T1 publication Critical patent/ATE453203T1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1644—Composition of the substrate porous substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H01J9/022—Manufacture of electrodes or electrode systems of cold cathodes
    • H01J9/025—Manufacture of electrodes or electrode systems of cold cathodes of field emission cathodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2201/00—Electrodes common to discharge tubes
    • H01J2201/30—Cold cathodes
    • H01J2201/304—Field emission cathodes
    • H01J2201/30446—Field emission cathodes characterised by the emitter material
    • H01J2201/30453—Carbon types
    • H01J2201/30469—Carbon nanotubes (CNTs)

Abstract

The present invention is directed towards metallized carbon nanotubes, methods for making metallized carbon nanotubes using an electroless plating technique, methods for dispensing metallized carbon nanotubes onto a substrate, and methods for aligning magnetically-active metallized carbon nanotubes. The present invention is also directed towards cold cathode field emitting materials comprising metallized carbon nanotubes, and methods of using metallized carbon nanotubes as cold cathode field emitters.
AT03746707T 2002-04-12 2003-04-11 METALLIZATION OF CARBON NANOTUBE FOR FIELD EMISSION APPLICATIONS ATE453203T1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US37206702P 2002-04-12 2002-04-12
US41724602P 2002-10-09 2002-10-09
US10/372,006 US20040018371A1 (en) 2002-04-12 2003-02-21 Metallization of carbon nanotubes for field emission applications
US10/406,928 US6975063B2 (en) 2002-04-12 2003-04-04 Metallization of carbon nanotubes for field emission applications
PCT/US2003/011053 WO2003087707A2 (en) 2002-04-12 2003-04-11 Metallization of carbon nanotubes for field emission applications

Publications (1)

Publication Number Publication Date
ATE453203T1 true ATE453203T1 (en) 2010-01-15

Family

ID=46123439

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03746707T ATE453203T1 (en) 2002-04-12 2003-04-11 METALLIZATION OF CARBON NANOTUBE FOR FIELD EMISSION APPLICATIONS

Country Status (4)

Country Link
JP (1) JP4727928B2 (en)
KR (1) KR100836538B1 (en)
CN (1) CN1732549B (en)
AT (1) ATE453203T1 (en)

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JP2006261108A (en) * 2005-02-17 2006-09-28 Sonac Kk Cold-cathode electron source, its manufacturing method and display device
KR100688860B1 (en) * 2005-08-08 2007-03-02 삼성전기주식회사 Method for manufacturing a Field Emission Array
KR100749886B1 (en) * 2006-02-03 2007-08-21 (주) 나노텍 Heating element using Carbon Nano tube
JP4662877B2 (en) * 2006-03-29 2011-03-30 国立大学法人福井大学 Composite material and method for producing the same
KR100781190B1 (en) * 2006-06-13 2007-11-30 인하대학교 산학협력단 System for separating carbon nano-tube using inducing current and method thereof
CN101105488B (en) * 2006-07-14 2011-01-26 鸿富锦精密工业（深圳）有限公司 Work function measuring method
KR20080013366A (en) * 2006-08-08 2008-02-13 한국과학기술원 Method for manufacturing a field emitter electrode using the array of nanowires
KR100795903B1 (en) * 2006-08-10 2008-01-21 세메스 주식회사 Apparatus for trapping carbon nano tube and system and method producting carbon nano tube
KR101328765B1 (en) * 2006-12-29 2013-11-13 엘지디스플레이 주식회사 Nano powder patterning method
KR101281168B1 (en) 2007-01-05 2013-07-02 삼성전자주식회사 Field emission electrode, method for preparing the same and field emission device comprising the same
JP2009073692A (en) * 2007-09-20 2009-04-09 Toyota Motor Corp Carbon nanotube and its manufacturing method
CN102149629B (en) 2008-09-12 2016-06-01 Lg化学株式会社 Metal nanobelt and manufacture method thereof and conductive ink compositions and comprise the conductive membranes of this conductive ink compositions
KR101078079B1 (en) 2008-12-10 2011-10-28 엘에스전선 주식회사 Conductive Paste Containing Silver-Decorated Carbon Nanotubes
JP5551898B2 (en) * 2009-06-30 2014-07-16 京セラドキュメントソリューションズ株式会社 Manufacturing method of heating belt
KR101724064B1 (en) 2010-02-18 2017-04-10 삼성전자주식회사 Conductive carbon nanotube-metal composite ink
JP2012040664A (en) * 2010-08-23 2012-03-01 Nitto Denko Corp Fibrous columnar structure aggregate and adhesive member
CN102568977B (en) * 2012-03-16 2015-02-04 福州大学 Method for preparing metallized carbon nanotube cathode by electrophoretic deposition in assistance of magnetic field
JP6415540B2 (en) * 2013-04-21 2018-10-31 シェンジェン シェン ルイ グラフィン テクノロジー カンパニー リミテッド Carbon nanomaterial coating method

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Publication number Priority date Publication date Assignee Title
JP2546114B2 (en) * 1992-12-22 1996-10-23 日本電気株式会社 Foreign substance-encapsulated carbon nanotubes and method for producing the same
US6630772B1 (en) * 1998-09-21 2003-10-07 Agere Systems Inc. Device comprising carbon nanotube field emitter structure and process for forming device
JP2000233911A (en) * 1999-02-12 2000-08-29 Namiki Precision Jewel Co Ltd Method for processing carbon nanotube
US6504292B1 (en) * 1999-07-15 2003-01-07 Agere Systems Inc. Field emitting device comprising metallized nanostructures and method for making the same
US6741019B1 (en) * 1999-10-18 2004-05-25 Agere Systems, Inc. Article comprising aligned nanowires
JP2002056770A (en) * 2000-08-08 2002-02-22 Futaba Corp Electric field emission cathode and its manufacturing method
US6566983B2 (en) * 2000-09-02 2003-05-20 Lg Electronics Inc. Saw filter using a carbon nanotube and method for manufacturing the same
JP3573273B2 (en) * 2000-09-26 2004-10-06 シャープ株式会社 Electron emitting device and method of manufacturing the same

Also Published As

Publication number Publication date
JP2005532915A (en) 2005-11-04
JP4727928B2 (en) 2011-07-20
CN1732549A (en) 2006-02-08
KR20040101280A (en) 2004-12-02
CN1732549B (en) 2010-11-10
KR100836538B1 (en) 2008-06-10

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