ATE432527T1 - Leitfähige paste für mehrlagigen elektronischen komponenten und mehrlagigen elektronischen komponenten damit - Google Patents

Leitfähige paste für mehrlagigen elektronischen komponenten und mehrlagigen elektronischen komponenten damit

Info

Publication number
ATE432527T1
ATE432527T1 AT06013327T AT06013327T ATE432527T1 AT E432527 T1 ATE432527 T1 AT E432527T1 AT 06013327 T AT06013327 T AT 06013327T AT 06013327 T AT06013327 T AT 06013327T AT E432527 T1 ATE432527 T1 AT E432527T1
Authority
AT
Austria
Prior art keywords
electronic components
conductive paste
layer electronic
multilayer electronic
internal electrode
Prior art date
Application number
AT06013327T
Other languages
English (en)
Inventor
Toshio Yoneima
Kaori Higashi
Original Assignee
Shoei Chemical Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shoei Chemical Ind Co filed Critical Shoei Chemical Ind Co
Application granted granted Critical
Publication of ATE432527T1 publication Critical patent/ATE432527T1/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Conductive Materials (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
AT06013327T 2005-07-01 2006-06-28 Leitfähige paste für mehrlagigen elektronischen komponenten und mehrlagigen elektronischen komponenten damit ATE432527T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005194098 2005-07-01
JP2006149388A JP4650794B2 (ja) 2005-07-01 2006-05-30 積層電子部品用導体ペーストおよびそれを用いた積層電子部品

Publications (1)

Publication Number Publication Date
ATE432527T1 true ATE432527T1 (de) 2009-06-15

Family

ID=37056906

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06013327T ATE432527T1 (de) 2005-07-01 2006-06-28 Leitfähige paste für mehrlagigen elektronischen komponenten und mehrlagigen elektronischen komponenten damit

Country Status (9)

Country Link
US (1) US7423220B2 (de)
EP (1) EP1739689B1 (de)
JP (1) JP4650794B2 (de)
KR (1) KR100819303B1 (de)
CN (1) CN1892926B (de)
AT (1) ATE432527T1 (de)
DE (1) DE602006006942D1 (de)
MY (1) MY137841A (de)
TW (1) TWI336480B (de)

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* Cited by examiner, † Cited by third party
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JP4442596B2 (ja) * 2006-09-08 2010-03-31 Tdk株式会社 導電性ペースト、積層セラミック電子部品及びその製造方法
JP4622974B2 (ja) * 2006-09-19 2011-02-02 Tdk株式会社 導電性ペースト、積層セラミック電子部品及びその製造方法
KR100711505B1 (ko) * 2007-01-30 2007-04-27 (주)이그잭스 도전막 형성을 위한 은 페이스트
US8505804B2 (en) 2007-03-22 2013-08-13 Tanaka Kikinzoku Kogyo K.K. Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric device
US7999175B2 (en) * 2008-09-09 2011-08-16 Palo Alto Research Center Incorporated Interdigitated back contact silicon solar cells with laser ablated grooves
US9150966B2 (en) * 2008-11-14 2015-10-06 Palo Alto Research Center Incorporated Solar cell metallization using inline electroless plating
JP5567842B2 (ja) * 2010-01-20 2014-08-06 積水化学工業株式会社 積層セラミック電子部品用ペースト
US8962424B2 (en) 2011-03-03 2015-02-24 Palo Alto Research Center Incorporated N-type silicon solar cell with contact/protection structures
KR101141361B1 (ko) * 2011-03-14 2012-05-03 삼성전기주식회사 적층형 세라믹 콘덴서 및 그 제조방법
JP5737388B2 (ja) * 2011-03-28 2015-06-17 株式会社村田製作所 ガラスセラミック基板およびその製造方法
EP2808880B1 (de) * 2012-01-27 2019-06-19 Shoei Chemical Inc. Herstellungsverfahren eines festelektrolyt-kondensatorelementes mittels leitfähiger paste
KR102248526B1 (ko) * 2013-07-23 2021-05-06 삼성전기주식회사 내부 전극용 니켈 분말, 이를 포함하는 적층 세라믹 커패시터 및 전자부품이 실장된 회로기판
KR102004792B1 (ko) * 2014-06-24 2019-07-29 삼성전기주식회사 적층 전자부품 및 내부전극용 도전성 페이스트 조성물
WO2019107500A1 (ja) * 2017-11-30 2019-06-06 住友金属鉱山株式会社 導電性ペースト、電子部品、及び積層セラミックコンデンサ

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* Cited by examiner, † Cited by third party
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JPS57184296A (en) * 1981-05-09 1982-11-12 Hitachi Ltd Ceramic circuit board
JPS599992A (ja) * 1982-07-08 1984-01-19 株式会社日立製作所 多層配線基板の製造方法
JPS5911700A (ja) * 1982-07-12 1984-01-21 株式会社日立製作所 セラミツク多層配線回路板
JPS60235744A (ja) * 1984-05-04 1985-11-22 Asahi Glass Co Ltd セラミック基板用組成物
US4765929A (en) 1986-08-29 1988-08-23 Gte Products Corporation Silk-screenable circuit paste
US4985376A (en) * 1989-01-31 1991-01-15 Asahi Glass Company, Ltd. Conductive paste compositions and ceramic substrates
SU1689996A1 (ru) 1989-12-19 1991-11-07 Донецкий государственный университет Органическое св зующее проводниковых и диэлектрических паст
JPH05235497A (ja) 1992-02-20 1993-09-10 Murata Mfg Co Ltd 銅導電性ペースト
JP2976268B2 (ja) * 1993-07-05 1999-11-10 株式会社村田製作所 導電性ペーストおよびそれを用いた多層セラミック電子部品の製造方法
JPH07240340A (ja) * 1994-02-28 1995-09-12 Sumitomo Metal Mining Co Ltd 積層セラミックコンデンサー内部電極用ペースト
JPH0917687A (ja) * 1995-06-28 1997-01-17 Sumitomo Metal Mining Co Ltd 積層セラミックコンデンサ内部電極用ペーストおよびその製造方法
JP3571957B2 (ja) * 1999-03-30 2004-09-29 松下電器産業株式会社 導体ペーストおよびセラミック多層基板の製造方法
JP3780945B2 (ja) * 2001-03-14 2006-05-31 株式会社村田製作所 セラミック電子部品
CA2466233C (en) * 2001-12-20 2010-10-12 Cygnus, Inc. Highly catalytic screen-printing ink
WO2003101166A1 (fr) 2002-05-28 2003-12-04 Sumitomo Electric Industries, Ltd. Pastille frittee a base de nitrure d'aluminium comportant une couche metallisee et procede de preparation associe
US6841493B2 (en) * 2002-06-04 2005-01-11 E. I. Du Pont De Nemours And Company High K glass and tape composition for use at high frequency
JP4449484B2 (ja) * 2003-02-18 2010-04-14 東レ株式会社 導電性ペーストおよびそれを用いたプラズマディスプレイパネル用部材の製造方法
JP2005035850A (ja) * 2003-07-17 2005-02-10 Asahi Glass Co Ltd 隔壁用ペースト、隔壁付き基板の製造方法、およびプラズマディスプレイパネル
US7189341B2 (en) * 2003-08-15 2007-03-13 Animas Technologies, Llc Electrochemical sensor ink compositions, electrodes, and uses thereof

Also Published As

Publication number Publication date
CN1892926B (zh) 2010-07-14
TW200710877A (en) 2007-03-16
DE602006006942D1 (de) 2009-07-09
KR100819303B1 (ko) 2008-04-02
CN1892926A (zh) 2007-01-10
KR20070003614A (ko) 2007-01-05
US20070001152A1 (en) 2007-01-04
US7423220B2 (en) 2008-09-09
MY137841A (en) 2009-03-31
EP1739689B1 (de) 2009-05-27
TWI336480B (en) 2011-01-21
JP2007043092A (ja) 2007-02-15
EP1739689A1 (de) 2007-01-03
JP4650794B2 (ja) 2011-03-16

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