ATE385857T1 - Verfahren und vorichtung zur kontrolle der schichtdicke - Google Patents

Verfahren und vorichtung zur kontrolle der schichtdicke

Info

Publication number
ATE385857T1
ATE385857T1 AT03773410T AT03773410T ATE385857T1 AT E385857 T1 ATE385857 T1 AT E385857T1 AT 03773410 T AT03773410 T AT 03773410T AT 03773410 T AT03773410 T AT 03773410T AT E385857 T1 ATE385857 T1 AT E385857T1
Authority
AT
Austria
Prior art keywords
control
layer thickness
substrate
datastorage
distributing
Prior art date
Application number
AT03773410T
Other languages
English (en)
Inventor
Chieh Ou-Yang
Original Assignee
Oc Oerlikon Balzers Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oc Oerlikon Balzers Ag filed Critical Oc Oerlikon Balzers Ag
Application granted granted Critical
Publication of ATE385857T1 publication Critical patent/ATE385857T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
AT03773410T 2002-12-05 2003-12-02 Verfahren und vorichtung zur kontrolle der schichtdicke ATE385857T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US43134602P 2002-12-05 2002-12-05

Publications (1)

Publication Number Publication Date
ATE385857T1 true ATE385857T1 (de) 2008-03-15

Family

ID=32469606

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03773410T ATE385857T1 (de) 2002-12-05 2003-12-02 Verfahren und vorichtung zur kontrolle der schichtdicke

Country Status (9)

Country Link
US (1) US8062705B2 (de)
EP (1) EP1569759B1 (de)
JP (1) JP5199531B2 (de)
CN (1) CN100553794C (de)
AT (1) ATE385857T1 (de)
AU (1) AU2003281895A1 (de)
DE (1) DE60319129T2 (de)
TW (1) TWI306784B (de)
WO (1) WO2004050261A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003274611A1 (en) * 2003-01-14 2004-08-10 Koninklijke Philips Electronics N.V. Method of manufacturing an optical data storage medium, optical data storage medium and apparatus for performing said method
CN101027138B (zh) 2004-06-03 2010-08-25 芝浦机械电子装置股份有限公司 树脂层形成方法及树脂层形成装置、盘及盘的制造方法
DE102005017178A1 (de) * 2005-04-13 2006-10-19 Bühler AG Verfahren zur Herstellung eines gefüllten Verzehrproduktes
US20070105400A1 (en) * 2005-11-08 2007-05-10 Unaxis Balzers Ag Method and apparatus for control of layer thicknesses
DE102006061585B4 (de) * 2006-08-23 2013-11-28 Singulus Technologies Ag Verfahren und Vorrichtung zur Rotationsbeschichtung von Substraten
JP5262117B2 (ja) * 2007-04-11 2013-08-14 株式会社リコー スピンコート装置及びその温度制御方法、並びに光ディスク製造装置及び光ディスク製造方法
US20120301998A1 (en) * 2009-12-28 2012-11-29 Takahiro Hashimoto Method for manufacturing solar cell
CN103295936B (zh) 2012-02-29 2016-01-13 斯克林集团公司 基板处理装置及基板处理方法
CN104205305B (zh) 2012-03-23 2017-03-08 斯克林集团公司 基板处理装置以及加热器清洗方法
JP5946401B2 (ja) * 2012-12-07 2016-07-06 株式会社ディスコ 保護膜の被覆方法
JP6242057B2 (ja) 2013-02-15 2017-12-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US9360755B2 (en) * 2013-03-14 2016-06-07 Taiwan Semiconductor Manufacturing Company Limited Thickening phase for spin coating process
JP6271304B2 (ja) 2013-03-29 2018-01-31 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
US9248466B2 (en) * 2013-05-10 2016-02-02 Infineon Technologies Ag Application of fluids to substrates
JP6319705B2 (ja) * 2013-12-14 2018-05-09 木村　光照 スピンコータ
JP6440111B2 (ja) * 2014-08-14 2018-12-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
US10421867B2 (en) 2015-03-16 2019-09-24 Taiwan Semiconductor Manufacturing Company, Ltd. Priming material for substrate coating

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5155336A (en) * 1990-01-19 1992-10-13 Applied Materials, Inc. Rapid thermal heating apparatus and method
US5580607A (en) * 1991-07-26 1996-12-03 Tokyo Electron Limited Coating apparatus and method
JPH05259061A (ja) * 1992-03-10 1993-10-08 Kawasaki Steel Corp 半導体基板のスピンコーティング方法および装置
JPH05259062A (ja) * 1992-03-10 1993-10-08 Kawasaki Steel Corp 半導体基板のスピンコーティング方法
KR100370728B1 (ko) * 1994-10-27 2003-04-07 실리콘 밸리 그룹, 인크. 기판을균일하게코팅하는방법및장치
JPH1012536A (ja) * 1996-06-27 1998-01-16 Dainippon Screen Mfg Co Ltd 基板熱処理装置
JP3405439B2 (ja) * 1996-11-05 2003-05-12 株式会社荏原製作所 固体表面の清浄化方法
KR100246964B1 (ko) * 1996-11-28 2000-03-15 윤종용 반도체 스피너장비
US5916368A (en) * 1997-02-27 1999-06-29 The Fairchild Corporation Method and apparatus for temperature controlled spin-coating systems
JPH10261579A (ja) * 1997-03-21 1998-09-29 Matsushita Electron Corp レジスト塗布装置及びレジスト塗布方法
DE19742126A1 (de) * 1997-09-24 1999-03-25 Siemens Ag Tragbarer Datenträger mit Aktivierungsschalter
US6300600B1 (en) 1998-08-12 2001-10-09 Silicon Valley Group, Inc. Hot wall rapid thermal processor
US6254936B1 (en) * 1998-09-14 2001-07-03 Silicon Valley Group, Inc. Environment exchange control for material on a wafer surface
US6174651B1 (en) * 1999-01-14 2001-01-16 Steag Rtp Systems, Inc. Method for depositing atomized materials onto a substrate utilizing light exposure for heating
US6322626B1 (en) * 1999-06-08 2001-11-27 Micron Technology, Inc. Apparatus for controlling a temperature of a microelectronics substrate
JP2001068490A (ja) * 1999-08-27 2001-03-16 Sony Corp 回転塗布装置および回転塗布方法

Also Published As

Publication number Publication date
WO2004050261A1 (en) 2004-06-17
JP2006508787A (ja) 2006-03-16
DE60319129T2 (de) 2009-03-05
TWI306784B (en) 2009-03-01
TW200420355A (en) 2004-10-16
EP1569759B1 (de) 2008-02-13
CN1720106A (zh) 2006-01-11
DE60319129D1 (de) 2008-03-27
EP1569759A1 (de) 2005-09-07
JP5199531B2 (ja) 2013-05-15
US20040137751A1 (en) 2004-07-15
US8062705B2 (en) 2011-11-22
AU2003281895A1 (en) 2004-06-23
CN100553794C (zh) 2009-10-28

Similar Documents

Publication Publication Date Title
ATE385857T1 (de) Verfahren und vorichtung zur kontrolle der schichtdicke
NO20083174L (no) Anordning og fremgangsmate for overflatebehandling av substrater
ATE483040T1 (de) Beschichtungsgerät mit einem reinigungsgerät für substrat und beschichtungsverfahren, das ein solches beschichtungsgerät benutzt
ATE465512T1 (de) Vorrichtung und verfahren zum verbinden von wafern
WO2007084952A3 (en) Systems and methods for drying a rotating substrate
SG130115A1 (en) Method for microstructure control of ceramic thermal spray coating
DE602004018643D1 (de) Einrichtung und verfahren zur nassbehandlung von scheibenartigen substraten
TW200733193A (en) Coating apparatus and coating method
ATE246268T1 (de) Kondensationsbeschichtungsverfahren
WO2009001935A1 (ja) 薄膜形成方法、有機エレクトロルミネッセンス素子の製造方法、半導体素子の製造方法及び光学素子の製造方法
TW200502048A (en) Coating apparatus, thin film forming method, thin film forming apparatus, and semiconductor device manufacturing method, electro-optic device and electronic instrument
DE60110462D1 (de) Verfahren und vorrichtung zum beschichten
MY143956A (en) Controls of ambient environment during wafer drying using proximity head
TW200625625A (en) Thin film transistor, electro-optical device and electronic apparatus
TW200736842A (en) Coating and developing method, coating and developing apparatus, and recording medium
WO2007035071A8 (en) Apparatus and method for treating substrate
TW200618699A (en) Thin-film pattern forming method, semiconductor device, electro-optic device, and electronic apparatus
TW200626247A (en) Coating apparatus, coating method and coating-film forming apparatus
DE69910430D1 (de) Verfahren und vorrichtung zum kontinuierlichen beschichten zumindest eines metallischen bandes mit flüssigkeitsfilm aus vernetzbarem polymer
TWI265349B (en) Substrate for electro-optical device, method of manufacturing substrate for electro-optical device, electro-optical device and electronic apparatus
TW200608506A (en) Coating-film forming apparatus and manufacture managing device and method of manufacturing semiconductor devices
DE59707533D1 (de) Verfahren und vorrichtung zum trocknen von substraten
PL2015873T3 (pl) Element aplikujący do rozpylacza rotacyjnego i przynależny sposób pracy
FR2856047B1 (fr) Procede de collage de substrats micro-structures
DE50207784D1 (de) Vorrichtung und Verfahren zum gerichteten Aufbringen von Depositionsmaterial auf ein Substrat

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties