ATE377260T1 - Hybride photodetektoranordnung mit isolierten photogate-bildelementen - Google Patents

Hybride photodetektoranordnung mit isolierten photogate-bildelementen

Info

Publication number
ATE377260T1
ATE377260T1 AT03100971T AT03100971T ATE377260T1 AT E377260 T1 ATE377260 T1 AT E377260T1 AT 03100971 T AT03100971 T AT 03100971T AT 03100971 T AT03100971 T AT 03100971T AT E377260 T1 ATE377260 T1 AT E377260T1
Authority
AT
Austria
Prior art keywords
isolated
photosensors
image elements
plate
photodetector arrangement
Prior art date
Application number
AT03100971T
Other languages
English (en)
Inventor
Pierre Gidon
Philippe Pantigny
Original Assignee
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique filed Critical Commissariat Energie Atomique
Application granted granted Critical
Publication of ATE377260T1 publication Critical patent/ATE377260T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14634—Assemblies, i.e. Hybrid structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14636—Interconnect structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
    • H01L2224/05572—Disposition the external layer being disposed in a recess of the surface the external layer extending out of an opening
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Light Receiving Elements (AREA)
  • Facsimile Heads (AREA)
AT03100971T 2002-04-12 2003-04-10 Hybride photodetektoranordnung mit isolierten photogate-bildelementen ATE377260T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0204614A FR2838565B1 (fr) 2002-04-12 2002-04-12 Matrice de photodetecteurs, a pixels isoles et grille de stockage, hybridee sur un circuit de lecture

Publications (1)

Publication Number Publication Date
ATE377260T1 true ATE377260T1 (de) 2007-11-15

Family

ID=28052279

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03100971T ATE377260T1 (de) 2002-04-12 2003-04-10 Hybride photodetektoranordnung mit isolierten photogate-bildelementen

Country Status (6)

Country Link
US (1) US7271375B2 (de)
EP (1) EP1353381B1 (de)
JP (1) JP4545387B2 (de)
AT (1) ATE377260T1 (de)
DE (1) DE60317133T2 (de)
FR (1) FR2838565B1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4166471B2 (ja) * 2001-12-28 2008-10-15 三菱電機株式会社 光モジュール
WO2006137867A1 (en) * 2004-09-17 2006-12-28 California Institute Of Technology Fabrication method for back-illuminated cmos or ccd imagers made from soi wafer
DE102004060365B4 (de) * 2004-12-15 2009-03-19 Austriamicrosystems Ag Bauelement mit Halbleiterübergang und Verfahren zur Herstellung
KR100610481B1 (ko) * 2004-12-30 2006-08-08 매그나칩 반도체 유한회사 수광영역을 넓힌 이미지센서 및 그 제조 방법
KR100718878B1 (ko) 2005-06-28 2007-05-17 (주)실리콘화일 3차원 구조를 갖는 이미지 센서의 분리형 단위화소 및 그제조방법
US7749799B2 (en) 2005-11-15 2010-07-06 California Institute Of Technology Back-illuminated imager and method for making electrical and optical connections to same
JP2008131169A (ja) * 2006-11-17 2008-06-05 Shimadzu Corp 撮像素子およびそれを用いた撮像装置
KR100954927B1 (ko) * 2007-12-14 2010-04-27 주식회사 동부하이텍 이미지 센서 및 그 제조방법
US7774070B2 (en) * 2008-01-10 2010-08-10 Hill Laboratories Company Medical electrode assembly for electrotherapy and phototherapy treatment
FR2947952B1 (fr) 2009-07-07 2011-11-25 Commissariat Energie Atomique Dispositif photo-detecteur et procede de realisation de dispositif photo-detecteur
US9324747B2 (en) 2014-03-13 2016-04-26 Semiconductor Energy Laboratory Co., Ltd. Imaging device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4684812A (en) * 1983-08-31 1987-08-04 Texas Instruments Incorporated Switching circuit for a detector array
JPS6413766A (en) * 1987-07-07 1989-01-18 Nec Corp Infrared image sensing element
US4783594A (en) * 1987-11-20 1988-11-08 Santa Barbara Research Center Reticular detector array
JPH01205465A (ja) * 1988-02-10 1989-08-17 Sony Corp 固体撮像装置及びその製造方法
JPH0714996A (ja) * 1993-06-18 1995-01-17 Mitsubishi Electric Corp 赤外線検出器とその製造方法
FR2712693B1 (fr) * 1993-11-17 1995-12-15 Commissariat Energie Atomique Dispositif de détection de rayonnement, à éléments de détection aboutés, et procédé de fabrication de ce dispositif.
US5563405A (en) * 1995-04-28 1996-10-08 Santa Barbara Research Center Staring IR-FPA with on-FPA adaptive dynamic range control electronics
JP3577368B2 (ja) * 1995-08-25 2004-10-13 株式会社東芝 ハイブリッド型赤外線検出器
US5808329A (en) * 1996-07-15 1998-09-15 Raytheon Company Low light level imager with extended wavelength response employing atomic bonded (fused) semiconductor materials
JP4571267B2 (ja) * 2000-04-04 2010-10-27 浜松ホトニクス株式会社 放射線検出器
JP3713418B2 (ja) 2000-05-30 2005-11-09 光正 小柳 ３次元画像処理装置の製造方法
JP4653336B2 (ja) * 2001-04-18 2011-03-16 浜松ホトニクス株式会社 エネルギー線検出器及び装置
JP2003086827A (ja) * 2001-09-12 2003-03-20 Hamamatsu Photonics Kk ホトダイオードアレイ、固体撮像装置、及び、放射線検出器
FR2838561B1 (fr) * 2002-04-12 2004-09-17 Commissariat Energie Atomique Matrice de photodectecteurs, a pixels isoles par des murs, hybridee sur un circuit de lecture

Also Published As

Publication number Publication date
EP1353381B1 (de) 2007-10-31
US7271375B2 (en) 2007-09-18
FR2838565B1 (fr) 2004-06-25
JP2003347536A (ja) 2003-12-05
EP1353381A1 (de) 2003-10-15
US20030222204A1 (en) 2003-12-04
JP4545387B2 (ja) 2010-09-15
DE60317133T2 (de) 2008-10-02
FR2838565A1 (fr) 2003-10-17
DE60317133D1 (de) 2007-12-13

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Legal Events

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