ATE377260T1 - Hybride photodetektoranordnung mit isolierten photogate-bildelementen - Google Patents
Hybride photodetektoranordnung mit isolierten photogate-bildelementenInfo
- Publication number
- ATE377260T1 ATE377260T1 AT03100971T AT03100971T ATE377260T1 AT E377260 T1 ATE377260 T1 AT E377260T1 AT 03100971 T AT03100971 T AT 03100971T AT 03100971 T AT03100971 T AT 03100971T AT E377260 T1 ATE377260 T1 AT E377260T1
- Authority
- AT
- Austria
- Prior art keywords
- isolated
- photosensors
- image elements
- plate
- photodetector arrangement
- Prior art date
Links
- 238000009396 hybridization Methods 0.000 abstract 2
- 239000011159 matrix material Substances 0.000 abstract 2
- 238000005192 partition Methods 0.000 abstract 2
- 238000000926 separation method Methods 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
- H01L2224/05572—Disposition the external layer being disposed in a recess of the surface the external layer extending out of an opening
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Light Receiving Elements (AREA)
- Facsimile Heads (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0204614A FR2838565B1 (fr) | 2002-04-12 | 2002-04-12 | Matrice de photodetecteurs, a pixels isoles et grille de stockage, hybridee sur un circuit de lecture |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE377260T1 true ATE377260T1 (de) | 2007-11-15 |
Family
ID=28052279
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03100971T ATE377260T1 (de) | 2002-04-12 | 2003-04-10 | Hybride photodetektoranordnung mit isolierten photogate-bildelementen |
Country Status (6)
Country | Link |
---|---|
US (1) | US7271375B2 (de) |
EP (1) | EP1353381B1 (de) |
JP (1) | JP4545387B2 (de) |
AT (1) | ATE377260T1 (de) |
DE (1) | DE60317133T2 (de) |
FR (1) | FR2838565B1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4166471B2 (ja) * | 2001-12-28 | 2008-10-15 | 三菱電機株式会社 | 光モジュール |
WO2006137867A1 (en) * | 2004-09-17 | 2006-12-28 | California Institute Of Technology | Fabrication method for back-illuminated cmos or ccd imagers made from soi wafer |
DE102004060365B4 (de) * | 2004-12-15 | 2009-03-19 | Austriamicrosystems Ag | Bauelement mit Halbleiterübergang und Verfahren zur Herstellung |
KR100610481B1 (ko) * | 2004-12-30 | 2006-08-08 | 매그나칩 반도체 유한회사 | 수광영역을 넓힌 이미지센서 및 그 제조 방법 |
KR100718878B1 (ko) | 2005-06-28 | 2007-05-17 | (주)실리콘화일 | 3차원 구조를 갖는 이미지 센서의 분리형 단위화소 및 그제조방법 |
US7749799B2 (en) | 2005-11-15 | 2010-07-06 | California Institute Of Technology | Back-illuminated imager and method for making electrical and optical connections to same |
JP2008131169A (ja) * | 2006-11-17 | 2008-06-05 | Shimadzu Corp | 撮像素子およびそれを用いた撮像装置 |
KR100954927B1 (ko) * | 2007-12-14 | 2010-04-27 | 주식회사 동부하이텍 | 이미지 센서 및 그 제조방법 |
US7774070B2 (en) * | 2008-01-10 | 2010-08-10 | Hill Laboratories Company | Medical electrode assembly for electrotherapy and phototherapy treatment |
FR2947952B1 (fr) | 2009-07-07 | 2011-11-25 | Commissariat Energie Atomique | Dispositif photo-detecteur et procede de realisation de dispositif photo-detecteur |
US9324747B2 (en) | 2014-03-13 | 2016-04-26 | Semiconductor Energy Laboratory Co., Ltd. | Imaging device |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4684812A (en) * | 1983-08-31 | 1987-08-04 | Texas Instruments Incorporated | Switching circuit for a detector array |
JPS6413766A (en) * | 1987-07-07 | 1989-01-18 | Nec Corp | Infrared image sensing element |
US4783594A (en) * | 1987-11-20 | 1988-11-08 | Santa Barbara Research Center | Reticular detector array |
JPH01205465A (ja) * | 1988-02-10 | 1989-08-17 | Sony Corp | 固体撮像装置及びその製造方法 |
JPH0714996A (ja) * | 1993-06-18 | 1995-01-17 | Mitsubishi Electric Corp | 赤外線検出器とその製造方法 |
FR2712693B1 (fr) * | 1993-11-17 | 1995-12-15 | Commissariat Energie Atomique | Dispositif de détection de rayonnement, à éléments de détection aboutés, et procédé de fabrication de ce dispositif. |
US5563405A (en) * | 1995-04-28 | 1996-10-08 | Santa Barbara Research Center | Staring IR-FPA with on-FPA adaptive dynamic range control electronics |
JP3577368B2 (ja) * | 1995-08-25 | 2004-10-13 | 株式会社東芝 | ハイブリッド型赤外線検出器 |
US5808329A (en) * | 1996-07-15 | 1998-09-15 | Raytheon Company | Low light level imager with extended wavelength response employing atomic bonded (fused) semiconductor materials |
JP4571267B2 (ja) * | 2000-04-04 | 2010-10-27 | 浜松ホトニクス株式会社 | 放射線検出器 |
JP3713418B2 (ja) | 2000-05-30 | 2005-11-09 | 光正 小柳 | 3次元画像処理装置の製造方法 |
JP4653336B2 (ja) * | 2001-04-18 | 2011-03-16 | 浜松ホトニクス株式会社 | エネルギー線検出器及び装置 |
JP2003086827A (ja) * | 2001-09-12 | 2003-03-20 | Hamamatsu Photonics Kk | ホトダイオードアレイ、固体撮像装置、及び、放射線検出器 |
FR2838561B1 (fr) * | 2002-04-12 | 2004-09-17 | Commissariat Energie Atomique | Matrice de photodectecteurs, a pixels isoles par des murs, hybridee sur un circuit de lecture |
-
2002
- 2002-04-12 FR FR0204614A patent/FR2838565B1/fr not_active Expired - Fee Related
-
2003
- 2003-04-08 US US10/408,557 patent/US7271375B2/en not_active Expired - Fee Related
- 2003-04-10 DE DE60317133T patent/DE60317133T2/de not_active Expired - Lifetime
- 2003-04-10 JP JP2003106944A patent/JP4545387B2/ja not_active Expired - Fee Related
- 2003-04-10 AT AT03100971T patent/ATE377260T1/de not_active IP Right Cessation
- 2003-04-10 EP EP03100971A patent/EP1353381B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1353381B1 (de) | 2007-10-31 |
US7271375B2 (en) | 2007-09-18 |
FR2838565B1 (fr) | 2004-06-25 |
JP2003347536A (ja) | 2003-12-05 |
EP1353381A1 (de) | 2003-10-15 |
US20030222204A1 (en) | 2003-12-04 |
JP4545387B2 (ja) | 2010-09-15 |
DE60317133T2 (de) | 2008-10-02 |
FR2838565A1 (fr) | 2003-10-17 |
DE60317133D1 (de) | 2007-12-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |