ATE360885T1 - Substratreinigungssystem - Google Patents
SubstratreinigungssystemInfo
- Publication number
- ATE360885T1 ATE360885T1 AT01113291T AT01113291T ATE360885T1 AT E360885 T1 ATE360885 T1 AT E360885T1 AT 01113291 T AT01113291 T AT 01113291T AT 01113291 T AT01113291 T AT 01113291T AT E360885 T1 ATE360885 T1 AT E360885T1
- Authority
- AT
- Austria
- Prior art keywords
- cleaning
- booth
- substrates
- cleaning treatment
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01113291A EP1263022B1 (de) | 2001-05-31 | 2001-05-31 | Substratreinigungssystem |
US09/871,250 US6763839B2 (en) | 2001-05-31 | 2001-06-01 | Substrate cleaning system |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE360885T1 true ATE360885T1 (de) | 2007-05-15 |
Family
ID=26076605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT01113291T ATE360885T1 (de) | 2001-05-31 | 2001-05-31 | Substratreinigungssystem |
Country Status (3)
Country | Link |
---|---|
US (1) | US6763839B2 (de) |
EP (1) | EP1263022B1 (de) |
AT (1) | ATE360885T1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060035475A1 (en) | 2004-08-12 | 2006-02-16 | Applied Materials, Inc. | Semiconductor substrate processing apparatus |
US20120000494A1 (en) * | 2010-03-31 | 2012-01-05 | Ats Automation Tooling System Inc. | Wet bench apparatus and method |
DE102010028489A1 (de) * | 2010-05-03 | 2011-11-03 | Dürr Ecoclean GmbH | Anlage und Verfahren zum Reinigen und/oder Entgraten von Werkstücken |
US9530676B2 (en) * | 2011-06-01 | 2016-12-27 | Ebara Corporation | Substrate processing apparatus, substrate transfer method and substrate transfer device |
US9646858B2 (en) * | 2011-06-23 | 2017-05-09 | Brooks Automation, Inc. | Semiconductor cleaner systems and methods |
KR102410435B1 (ko) * | 2017-07-21 | 2022-06-17 | 코닝 인코포레이티드 | 압력 맵핑 장치 및 이를 이용한 유리 기판 세정 방법 |
JP6920141B2 (ja) * | 2017-09-05 | 2021-08-18 | 株式会社ディスコ | 研磨装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100221983B1 (ko) * | 1993-04-13 | 1999-09-15 | 히가시 데쓰로 | 처리장치 |
KR100390293B1 (ko) * | 1993-09-21 | 2003-09-02 | 가부시끼가이샤 도시바 | 폴리싱장치 |
US5518542A (en) * | 1993-11-05 | 1996-05-21 | Tokyo Electron Limited | Double-sided substrate cleaning apparatus |
US5975097A (en) * | 1996-09-02 | 1999-11-02 | Tokyo Electron Limited | Processing apparatus for target processing substrate |
AU3553599A (en) * | 1998-04-13 | 1999-11-01 | Acm Research, Inc. | Method and apparatus for enhancing adhesion between barrier layer and metal layer formed by plating |
US6610150B1 (en) * | 1999-04-02 | 2003-08-26 | Asml Us, Inc. | Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system |
-
2001
- 2001-05-31 EP EP01113291A patent/EP1263022B1/de not_active Expired - Lifetime
- 2001-05-31 AT AT01113291T patent/ATE360885T1/de not_active IP Right Cessation
- 2001-06-01 US US09/871,250 patent/US6763839B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1263022B1 (de) | 2007-04-25 |
US6763839B2 (en) | 2004-07-20 |
EP1263022A1 (de) | 2002-12-04 |
US20020179127A1 (en) | 2002-12-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
UEP | Publication of translation of european patent specification |
Ref document number: 1263022 Country of ref document: EP |
|
REN | Ceased due to non-payment of the annual fee |