ATE240817T1 - Verfahren und vorrichtung zur schichtdickenbestimmung beim wafertransportsystem - Google Patents

Verfahren und vorrichtung zur schichtdickenbestimmung beim wafertransportsystem

Info

Publication number
ATE240817T1
ATE240817T1 AT99914034T AT99914034T ATE240817T1 AT E240817 T1 ATE240817 T1 AT E240817T1 AT 99914034 T AT99914034 T AT 99914034T AT 99914034 T AT99914034 T AT 99914034T AT E240817 T1 ATE240817 T1 AT E240817T1
Authority
AT
Austria
Prior art keywords
determining
film thickness
layer thickness
transport system
cluster tool
Prior art date
Application number
AT99914034T
Other languages
English (en)
Inventor
Michael Labunsky
Andrew Nagengast
Anil Pant
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Application granted granted Critical
Publication of ATE240817T1 publication Critical patent/ATE240817T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
AT99914034T 1998-03-31 1999-03-22 Verfahren und vorrichtung zur schichtdickenbestimmung beim wafertransportsystem ATE240817T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/052,148 US6132289A (en) 1998-03-31 1998-03-31 Apparatus and method for film thickness measurement integrated into a wafer load/unload unit
PCT/US1999/006241 WO1999050025A1 (en) 1998-03-31 1999-03-22 Apparatus and method for film thickness measurement integrated into a wafer load/unload unit

Publications (1)

Publication Number Publication Date
ATE240817T1 true ATE240817T1 (de) 2003-06-15

Family

ID=21975774

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99914034T ATE240817T1 (de) 1998-03-31 1999-03-22 Verfahren und vorrichtung zur schichtdickenbestimmung beim wafertransportsystem

Country Status (7)

Country Link
US (1) US6132289A (de)
EP (1) EP1068047B1 (de)
JP (1) JP2002510149A (de)
KR (1) KR100602285B1 (de)
AT (1) ATE240817T1 (de)
DE (1) DE69908110T2 (de)
WO (1) WO1999050025A1 (de)

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Also Published As

Publication number Publication date
DE69908110T2 (de) 2003-11-27
JP2002510149A (ja) 2002-04-02
WO1999050025A1 (en) 1999-10-07
EP1068047B1 (de) 2003-05-21
US6132289A (en) 2000-10-17
KR100602285B1 (ko) 2006-07-14
KR20010042086A (ko) 2001-05-25
EP1068047A1 (de) 2001-01-17
DE69908110D1 (de) 2003-06-26

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