JPWO2017006614A1 - 高周波モジュール - Google Patents
高周波モジュール Download PDFInfo
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- JPWO2017006614A1 JPWO2017006614A1 JP2017527105A JP2017527105A JPWO2017006614A1 JP WO2017006614 A1 JPWO2017006614 A1 JP WO2017006614A1 JP 2017527105 A JP2017527105 A JP 2017527105A JP 2017527105 A JP2017527105 A JP 2017527105A JP WO2017006614 A1 JPWO2017006614 A1 JP WO2017006614A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/40—Radiating elements coated with or embedded in protective material
- H01Q1/405—Radome integrated radiating elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/30—Arrangements for providing operation on different wavebands
- H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
- H01Q5/342—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes
- H01Q5/357—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes using a single feed point
- H01Q5/364—Creating multiple current paths
- H01Q5/371—Branching current paths
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2291—Supports; Mounting means by structural association with other equipment or articles used in bluetooth or WI-FI devices of Wireless Local Area Networks [WLAN]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
- H01Q9/42—Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09909—Special local insulating pattern, e.g. as dam around component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10522—Adjacent components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2081—Compound repelling a metal, e.g. solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Details Of Aerials (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
最初に、図1乃至図4を参照して、本発明の実施形態に係る高周波モジュール100の構造について説明する。図1は、高周波モジュール100の外観を示す斜視図であり、図2は、高周波モジュール100を上方から見た場合の模式図である。また、図3は、接着前の配線基板10及びアンテナ用基板20それぞれの、図2に示すA−A線から見た時の断面図である。図3(a)が、接着前のアンテナ用基板20であり、図3(b)が、接着前の配線基板10である。また、図4は、高周波モジュール100の、図2に示すA−A線から見た時の断面図である。尚、図2においては、内部の構造を分かり易く示すため、配線基板10が透明であると仮定して、配線基板10を2点鎖線で表示していると共に、アンテナ21を省略している。
11 非導電性接着剤
13 導電性接着剤
15 電子部品
20 アンテナ用基板
21 アンテナ
21a 金属パターン
23 スペーサ
23a 半田レジスト
25 隙間
27 電極部
27a 上面電極部
27b 側面電極部
27c 下面電極部
28 電極部
29 スルーホール
100 高周波モジュール
Claims (3)
- 配線基板と、前記配線基板の上面に配設されたアンテナ用基板と、を備え、
前記アンテナ用基板上には、金属パターンによって形成されたアンテナが形成されており、
前記配線基板と前記アンテナ用基板との間に、非導電性接着剤と導電性接着剤とが存在すると共に、前記非導電性接着剤と前記導電性接着剤との間に、スペーサが設けられている、
ことを特徴とする高周波モジュール。 - 前記スペーサが前記非導電性接着剤を囲んでいると共に、前記スペーサの一部に隙間が形成されており、前記隙間は、前記導電性接着剤が前記スペーサに接触しない位置に設けられる、
ことを特徴とする請求項1に記載の高周波モジュール。 - 前記スペーサは、半田レジストが前記アンテナ用基板の前記配線基板側の面に印刷工法で形成されることによって設けられ、
前記非導電性接着剤と前記導電性接着剤とが前記配線基板の前記アンテナ用基板側の面に塗布され、その後、前記アンテナ用基板と前記配線基板とが接着されることによって製造される、
ことを特徴とする請求項1又は請求項2に記載の高周波モジュール。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015137056 | 2015-07-08 | ||
JP2015137056 | 2015-07-08 | ||
PCT/JP2016/063208 WO2017006614A1 (ja) | 2015-07-08 | 2016-04-27 | 高周波モジュール |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2017006614A1 true JPWO2017006614A1 (ja) | 2018-03-08 |
Family
ID=57685052
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017527105A Withdrawn JPWO2017006614A1 (ja) | 2015-07-08 | 2016-04-27 | 高周波モジュール |
Country Status (4)
Country | Link |
---|---|
US (1) | US20180145397A1 (ja) |
EP (1) | EP3322264A4 (ja) |
JP (1) | JPWO2017006614A1 (ja) |
WO (1) | WO2017006614A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018205670A1 (de) * | 2018-04-13 | 2019-10-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Hermetisch abgedichtete Moduleinheit mit integrierten Antennen |
WO2021250727A1 (ja) * | 2020-06-08 | 2021-12-16 | オリンパス株式会社 | 電子モジュール、電子モジュールの製造方法および内視鏡 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002074297A (ja) * | 2000-08-30 | 2002-03-15 | Toppan Printing Co Ltd | Icモジュールの接続方法 |
JP2002217233A (ja) * | 2001-01-12 | 2002-08-02 | Sharp Corp | 半導体装置およびその製造方法 |
JP2004104960A (ja) * | 2002-09-12 | 2004-04-02 | Yokohama Rubber Co Ltd:The | パッシブ電源回路及びそのモジュール素子、並びに整流回路及びそのモジュール素子と半導体icチップ |
JP2005005987A (ja) * | 2003-06-11 | 2005-01-06 | Sony Chem Corp | アンテナ素子 |
WO2005045919A1 (ja) * | 2003-11-11 | 2005-05-19 | Toray Engineering Co.,Ltd. | 非接触idカード及びその製造方法 |
WO2007049376A1 (ja) * | 2005-10-27 | 2007-05-03 | Murata Manufacturing Co., Ltd. | 高周波モジュール |
JP2013109398A (ja) * | 2011-11-17 | 2013-06-06 | Fujitsu Semiconductor Ltd | 半導体モジュール、半導体モジュールの製造方法及びカード |
JP2013197104A (ja) * | 2012-03-15 | 2013-09-30 | Denso Corp | 外部接続導体付き回路基板及びその製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0999728A1 (en) * | 1998-11-04 | 2000-05-10 | TELEFONAKTIEBOLAGET L M ERICSSON (publ) | An electrical component and an electrical circuit module having connected ground planes |
TW569424B (en) * | 2000-03-17 | 2004-01-01 | Matsushita Electric Ind Co Ltd | Module with embedded electric elements and the manufacturing method thereof |
US7224280B2 (en) * | 2002-12-31 | 2007-05-29 | Avery Dennison Corporation | RFID device and method of forming |
JP2004247373A (ja) * | 2003-02-12 | 2004-09-02 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
US7268687B2 (en) * | 2004-03-23 | 2007-09-11 | 3M Innovative Properties Company | Radio frequency identification tags with compensating elements |
CA2472850A1 (en) * | 2004-07-05 | 2006-01-05 | Nenad Misevski | Bicycle pedal apparatus |
JP4712365B2 (ja) * | 2004-08-13 | 2011-06-29 | ルネサスエレクトロニクス株式会社 | 不揮発性半導体記憶装置および半導体記憶装置 |
US8783577B2 (en) * | 2005-03-15 | 2014-07-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device having the same |
WO2015083249A1 (ja) * | 2013-12-04 | 2015-06-11 | 株式会社日立製作所 | 多層配線基板およびその製造方法 |
-
2016
- 2016-04-27 JP JP2017527105A patent/JPWO2017006614A1/ja not_active Withdrawn
- 2016-04-27 EP EP16821085.4A patent/EP3322264A4/en not_active Withdrawn
- 2016-04-27 WO PCT/JP2016/063208 patent/WO2017006614A1/ja active Application Filing
-
2018
- 2018-01-05 US US15/863,269 patent/US20180145397A1/en not_active Abandoned
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002074297A (ja) * | 2000-08-30 | 2002-03-15 | Toppan Printing Co Ltd | Icモジュールの接続方法 |
JP2002217233A (ja) * | 2001-01-12 | 2002-08-02 | Sharp Corp | 半導体装置およびその製造方法 |
JP2004104960A (ja) * | 2002-09-12 | 2004-04-02 | Yokohama Rubber Co Ltd:The | パッシブ電源回路及びそのモジュール素子、並びに整流回路及びそのモジュール素子と半導体icチップ |
JP2005005987A (ja) * | 2003-06-11 | 2005-01-06 | Sony Chem Corp | アンテナ素子 |
WO2005045919A1 (ja) * | 2003-11-11 | 2005-05-19 | Toray Engineering Co.,Ltd. | 非接触idカード及びその製造方法 |
WO2007049376A1 (ja) * | 2005-10-27 | 2007-05-03 | Murata Manufacturing Co., Ltd. | 高周波モジュール |
JP2013109398A (ja) * | 2011-11-17 | 2013-06-06 | Fujitsu Semiconductor Ltd | 半導体モジュール、半導体モジュールの製造方法及びカード |
JP2013197104A (ja) * | 2012-03-15 | 2013-09-30 | Denso Corp | 外部接続導体付き回路基板及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP3322264A4 (en) | 2019-03-06 |
EP3322264A1 (en) | 2018-05-16 |
US20180145397A1 (en) | 2018-05-24 |
WO2017006614A1 (ja) | 2017-01-12 |
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