DE69507915D1 - Kontaktlose Speicherkarte mit IC-Modul - Google Patents

Kontaktlose Speicherkarte mit IC-Modul

Info

Publication number
DE69507915D1
DE69507915D1 DE69507915T DE69507915T DE69507915D1 DE 69507915 D1 DE69507915 D1 DE 69507915D1 DE 69507915 T DE69507915 T DE 69507915T DE 69507915 T DE69507915 T DE 69507915T DE 69507915 D1 DE69507915 D1 DE 69507915D1
Authority
DE
Germany
Prior art keywords
module
support
memory card
printed circuit
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69507915T
Other languages
English (en)
Other versions
DE69507915T3 (de
DE69507915T2 (de
Inventor
Michel Gaumet
Alain Larchevesque
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Axalto SA
Original Assignee
Solaic SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9464513&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69507915(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Solaic SA filed Critical Solaic SA
Publication of DE69507915D1 publication Critical patent/DE69507915D1/de
Application granted granted Critical
Publication of DE69507915T2 publication Critical patent/DE69507915T2/de
Publication of DE69507915T3 publication Critical patent/DE69507915T3/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE69507915T 1994-06-22 1995-06-20 Kontaktlose Speicherkarte mit IC-Modul Expired - Fee Related DE69507915T3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9407657A FR2721732B1 (fr) 1994-06-22 1994-06-22 Carte à mémoire sans contact dont le circuit électronique comporte un module.

Publications (3)

Publication Number Publication Date
DE69507915D1 true DE69507915D1 (de) 1999-04-01
DE69507915T2 DE69507915T2 (de) 1999-08-12
DE69507915T3 DE69507915T3 (de) 2003-11-13

Family

ID=9464513

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69507915T Expired - Fee Related DE69507915T3 (de) 1994-06-22 1995-06-20 Kontaktlose Speicherkarte mit IC-Modul

Country Status (6)

Country Link
US (1) US5640306A (de)
EP (1) EP0689165B2 (de)
JP (1) JPH0855206A (de)
AT (1) ATE176959T1 (de)
DE (1) DE69507915T3 (de)
FR (1) FR2721732B1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4431604A1 (de) * 1994-09-05 1996-03-07 Siemens Ag Schaltungsanordnung mit einem Chipkartenmodul und einer damit verbundenen Spule
FR2734983B1 (fr) 1995-05-29 1997-07-04 Sgs Thomson Microelectronics Utilisation d'un micromodule comme boitier de montage en surface et procede correspondant
AT1470U1 (de) * 1995-08-01 1997-05-26 Austria Card Laminierte karte und verfahren zu ihrer herstellung
JPH0944576A (ja) * 1995-08-02 1997-02-14 Hitachi Ltd 電子財布貸付システム
DE19528730A1 (de) * 1995-08-04 1997-02-06 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Datenträgers
FR2741191B1 (fr) * 1995-11-14 1998-01-09 Sgs Thomson Microelectronics Procede de fabrication d'un micromodule, notamment pour cartes a puces
EP0976104A2 (de) * 1996-03-14 2000-02-02 PAV Card GmbH Chipkarte, verbindungsanordnung und verfahren zum herstellen einer chipkarte
ATE209379T1 (de) * 1996-08-22 2001-12-15 Pav Card Gmbh Verfahren zur herstellung einer elektrischen und mechanischen verbindung eines moduls in einer ausnehmung eines kartenkörpers
US5892661A (en) * 1996-10-31 1999-04-06 Motorola, Inc. Smartcard and method of making
FR2769390B1 (fr) * 1997-10-08 2003-02-14 Gemplus Card Int Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact
JP3687783B2 (ja) * 1997-11-04 2005-08-24 エルケ ツァケル コンタクトレスチップカードを製造する方法およびコンタクトレスチップカード
FR2778997B1 (fr) * 1998-05-20 2000-06-23 Bull Cp8 Support pour un circuit electronique, comprenant des moyens anti-arrachement
US6297789B2 (en) 1998-07-09 2001-10-02 Tyco Electronics Corporation Integrated circuit card with liquid crystal display for viewing at least a portion of the information stored in the card
DE29824520U1 (de) * 1998-09-10 2001-06-28 Skidata Ag, Gartenau Kartenförmiger Datenträger
US6337836B1 (en) 1999-06-01 2002-01-08 Arthur F. Eidelson Programmable electronic label
US6612852B1 (en) * 2000-04-13 2003-09-02 Molex Incorporated Contactless interconnection system
US6362972B1 (en) 2000-04-13 2002-03-26 Molex Incorporated Contactless interconnection system
US6588660B1 (en) 2000-09-29 2003-07-08 Hewlett-Packard Development Company, L.P. Passive contactless smartcard security system
EP1942392A1 (de) 2001-03-28 2008-07-09 Macrovision Corporation Verfahren, Vorrichtung und optisches Medium zur Aktivierung der Wiedergabe von verschlüsselten digitalen Videos auf einer Vielzahl von Wiedergabegeräten mit unterschiedlichen Sicherheitsmerkmalen
KR20030076274A (ko) * 2002-03-18 2003-09-26 도레 엔지니아린구 가부시키가이샤 비접촉 아이디 카드류 및 그 제조방법
US7094633B2 (en) * 2003-06-23 2006-08-22 Sandisk Corporation Method for efficiently producing removable peripheral cards
WO2005008385A2 (en) 2003-07-07 2005-01-27 Cryptography Research, Inc. Reprogrammable security for controlling piracy and enabling interactive content
KR100723493B1 (ko) * 2005-07-18 2007-06-04 삼성전자주식회사 와이어 본딩 및 플립 칩 본딩이 가능한 스마트 카드 모듈기판 및 이를 포함하는 스마트 카드 모듈
JP6090006B2 (ja) * 2013-06-25 2017-03-08 凸版印刷株式会社 Ｉｃモジュール、デュアルｉｃカードおよびｉｃモジュールの製造方法
US10737933B2 (en) * 2016-04-05 2020-08-11 University Of Florida Research Foundation, Incorporated Flush-mount micromachined transducers

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2527036A1 (fr) * 1982-05-14 1983-11-18 Radiotechnique Compelec Procede pour connecter un semiconducteur a des elements d'un support, notamment d'une carte portative
DE3248385A1 (de) * 1982-12-28 1984-06-28 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit integriertem schaltkreis
JPS61137335A (ja) * 1984-12-10 1986-06-25 Toshiba Corp 半導体装置
DE3723547C2 (de) * 1987-07-16 1996-09-26 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
JPH0687486B2 (ja) * 1989-10-25 1994-11-02 三菱電機株式会社 Ｉｃカード用モジュール
US5148266A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies having interposer and flexible lead
CA2051836C (en) * 1990-11-30 1996-07-23 Richard Michael Flynn Personal data card construction
FR2686996B1 (fr) * 1992-01-31 1996-02-02 Solaic Sa Procede de fabrication d'une carte a memoire comprenant un micromodule equipe d'un capot, et carte a memoire ainsi obtenue.
DE4416697A1 (de) † 1994-05-11 1995-11-16 Giesecke & Devrient Gmbh Datenträger mit integriertem Schaltkreis

Also Published As

Publication number Publication date
FR2721732B1 (fr) 1996-08-30
JPH0855206A (ja) 1996-02-27
EP0689165B1 (de) 1999-02-24
US5640306A (en) 1997-06-17
EP0689165A1 (de) 1995-12-27
FR2721732A1 (fr) 1995-12-29
ATE176959T1 (de) 1999-03-15
EP0689165B2 (de) 2003-01-29
DE69507915T3 (de) 2003-11-13
DE69507915T2 (de) 1999-08-12

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8366 Restricted maintained after opposition proceedings
8327 Change in the person/name/address of the patent owner

Owner name: SCHLUMBERGER SYSTEMES, MONTROUGE, FR

8327 Change in the person/name/address of the patent owner

Owner name: AXALTO S.A., MONTROUGE, FR

8339 Ceased/non-payment of the annual fee