AT311145B - Alkalisches wässeriges stromloses Verkupferungsbad und Verfahren zur stromlosen Verkupferung - Google Patents

Alkalisches wässeriges stromloses Verkupferungsbad und Verfahren zur stromlosen Verkupferung

Info

Publication number
AT311145B
AT311145B AT922170A AT922170A AT311145B AT 311145 B AT311145 B AT 311145B AT 922170 A AT922170 A AT 922170A AT 922170 A AT922170 A AT 922170A AT 311145 B AT311145 B AT 311145B
Authority
AT
Austria
Prior art keywords
copper plating
electroless copper
alkaline aqueous
plating bath
bath
Prior art date
Application number
AT922170A
Other languages
English (en)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Application granted granted Critical
Publication of AT311145B publication Critical patent/AT311145B/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
AT922170A 1969-10-16 1970-10-13 Alkalisches wässeriges stromloses Verkupferungsbad und Verfahren zur stromlosen Verkupferung AT311145B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6915718A NL6915718A (de) 1969-10-16 1969-10-16

Publications (1)

Publication Number Publication Date
AT311145B true AT311145B (de) 1973-10-25

Family

ID=19808149

Family Applications (1)

Application Number Title Priority Date Filing Date
AT922170A AT311145B (de) 1969-10-16 1970-10-13 Alkalisches wässeriges stromloses Verkupferungsbad und Verfahren zur stromlosen Verkupferung

Country Status (11)

Country Link
US (1) US3804638A (de)
AT (1) AT311145B (de)
AU (1) AU2101370A (de)
BE (1) BE757573A (de)
CA (1) CA947458A (de)
CH (1) CH550255A (de)
DE (1) DE2049061C3 (de)
FR (1) FR2065996A5 (de)
GB (1) GB1330332A (de)
HK (1) HK49576A (de)
NL (1) NL6915718A (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5627594B2 (de) * 1975-03-14 1981-06-25
US4171225A (en) 1976-01-23 1979-10-16 U.S. Philips Corporation Electroless copper plating solutions
US4211564A (en) * 1978-05-09 1980-07-08 Hitachi, Ltd. Chemical copper plating solution
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
US4303443A (en) * 1979-06-15 1981-12-01 Hitachi, Ltd. Electroless copper plating solution
JPS56156749A (en) * 1980-05-08 1981-12-03 Toshiba Corp Chemical copper plating solution
CA1184359A (en) * 1981-10-23 1985-03-26 Donald A. Arcilesi Metallic impurity control for electroless copper plating
IT1157006B (it) * 1982-03-09 1987-02-11 Alfachimici Spa Miscela stabilizzante per un bagno di rame chimico
US4548644A (en) * 1982-09-28 1985-10-22 Hitachi Chemical Company, Ltd. Electroless copper deposition solution
DE3473890D1 (en) * 1983-07-25 1988-10-13 Hitachi Ltd Electroless copper plating solution
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US5925403A (en) * 1994-01-31 1999-07-20 Matsushita Electric Works, Ltd. Method of coating a copper film on a ceramic substrate
US6852152B2 (en) * 2002-09-24 2005-02-08 International Business Machines Corporation Colloidal seed formulation for printed circuit board metallization
US20050016416A1 (en) * 2003-07-23 2005-01-27 Jon Bengston Stabilizer for electroless copper plating solution
JP4467571B2 (ja) * 2003-09-19 2010-05-26 アプライド マテリアルズ インコーポレイテッド 無電解堆積のエンドポイントを検出するための装置および方法
US20050067297A1 (en) * 2003-09-26 2005-03-31 Innovative Technology Licensing, Llc Copper bath for electroplating fine circuitry on semiconductor chips
US20060062897A1 (en) * 2004-09-17 2006-03-23 Applied Materials, Inc Patterned wafer thickness detection system
KR20060128739A (ko) * 2005-06-10 2006-12-14 엔쏜 인코포레이티드 비-전도성 기판의 직접적인 금속화 방법
US20160273112A1 (en) * 2013-03-27 2016-09-22 Atotech Deutschland Gmbh Electroless copper plating solution
US10060034B2 (en) 2017-01-23 2018-08-28 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions
US10655227B2 (en) 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10294569B2 (en) 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
CN110498532A (zh) * 2019-08-15 2019-11-26 深南电路股份有限公司 印制线路板废水的处理方法及处理装置
CN113388829A (zh) * 2021-06-11 2021-09-14 惠州金晟新电子科技有限公司 化学镀铜液以及利用化学镀铜液镀铜基板的方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3075856A (en) * 1958-03-31 1963-01-29 Gen Electric Copper plating process and solution
US3300335A (en) * 1963-11-20 1967-01-24 Dow Chemical Co Electroless metal plating with foam
US3485643A (en) * 1966-05-06 1969-12-23 Photocircuits Corp Electroless copper plating
US3472664A (en) * 1966-09-15 1969-10-14 Enthone Inhibiting stardusting in electroless copper plating
US3515563A (en) * 1967-12-28 1970-06-02 Photocircuits Corp Autocatalytic metal plating solutions

Also Published As

Publication number Publication date
CA947458A (en) 1974-05-21
HK49576A (en) 1976-08-06
DE2049061C3 (de) 1981-04-30
AU2101370A (en) 1972-04-20
DE2049061A1 (de) 1971-04-29
BE757573A (fr) 1971-04-15
FR2065996A5 (de) 1971-08-06
GB1330332A (en) 1973-09-19
US3804638A (en) 1974-04-16
CH550255A (de) 1974-06-14
NL6915718A (de) 1971-04-20
DE2049061B2 (de) 1980-07-24

Similar Documents

Publication Publication Date Title
AT311145B (de) Alkalisches wässeriges stromloses Verkupferungsbad und Verfahren zur stromlosen Verkupferung
AT301978B (de) Verfahren und Bad zum Beschichten metallischer Gegenstände
JPS5281032A (en) Tinngold electroplating bath and plating method
IT1024416B (it) Soluzioni di placcatura con oro metodo per applicareed oggetti placcati ottenuti
AT313017B (de) Bad zur stromlosen Metallabscheidung
AT320372B (de) Verfahren zur stromfreien Kupferplattierung und Kupferplattierungsbad
ZA731439B (en) Electroless copper plating solution and process
ZA703750B (en) Addition of metal ions to plating bath
SE390631B (sv) Alkaliskt vattenhaltigt kopparbeleggningsbad
ZA708430B (en) Electrodeposition of copper from acidic baths
ZA706968B (en) Electroless copper plating solution and process
AT304219B (de) Bad zur stromlosen Abscheidung von Metallen
AT315790B (de) Verfahren zur Drahtbehandlung
CH464643A (de) Stabilisiertes Bad zur chemischen Verkupferung
AT313663B (de) Cyanidische,thalliumhaeltige gold-elektroplattierloesung und verfahren zur elektrolytischen goldabscheidung
AT281536B (de) Verfahren zur stromlosen Tauchmetallisierung von Eisenmetalloberflächen
CH540987A (de) Verfahren zur Unterdrückung der Nebel- und Dunstbildung in wässrigen Chromplattierungsbädern
CH508055A (fr) Procédé de placage électrolytique de ruthénium, et bain aqueux pour la mise en oeuvre de ce procédé
CH498939A (fr) Procédé et installation de nickelage électrolytique
JPS54112948A (en) Treatment of electrodeposition bath
CH476114A (fr) Procédé de placage électrolytique d'or et bain électrolytique pour la mise en oeuvre de ce procédé
CA829178A (en) Method of electroless nickel plating and plating baths therefor
AT325914B (de) Verfahren zur stromlosen vernickelung
AT296714B (de) Verfahren zum stromlosen Verkupfern von Aluminium und dessen Legierungen
IL34975A (en) Metal plating of substrates

Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee