ZA731439B - Electroless copper plating solution and process - Google Patents

Electroless copper plating solution and process

Info

Publication number
ZA731439B
ZA731439B ZA731439A ZA731439A ZA731439B ZA 731439 B ZA731439 B ZA 731439B ZA 731439 A ZA731439 A ZA 731439A ZA 731439 A ZA731439 A ZA 731439A ZA 731439 B ZA731439 B ZA 731439B
Authority
ZA
South Africa
Prior art keywords
plating solution
copper plating
electroless copper
electroless
solution
Prior art date
Application number
ZA731439A
Inventor
K Hacias
Original Assignee
Oxy Metal Finishing Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oxy Metal Finishing Corp filed Critical Oxy Metal Finishing Corp
Publication of ZA731439B publication Critical patent/ZA731439B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal
ZA731439A 1972-03-13 1973-03-01 Electroless copper plating solution and process ZA731439B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US23430272A 1972-03-13 1972-03-13

Publications (1)

Publication Number Publication Date
ZA731439B true ZA731439B (en) 1973-11-28

Family

ID=22880806

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA731439A ZA731439B (en) 1972-03-13 1973-03-01 Electroless copper plating solution and process

Country Status (10)

Country Link
US (1) US3793037A (en)
JP (1) JPS5518782B2 (en)
AR (1) AR197980A1 (en)
AU (1) AU467404B2 (en)
BE (1) BE793376A (en)
CA (1) CA989105A (en)
ES (1) ES410196A1 (en)
FR (1) FR2175729B1 (en)
GB (1) GB1373895A (en)
ZA (1) ZA731439B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4981725A (en) * 1972-07-11 1991-01-01 Amp-Akzo Corporation Process and composition for sensitizing articles for metallization
US4259113A (en) * 1976-05-26 1981-03-31 Kollmorgen Technologies Corporation Composition for sensitizing articles for metallization
JPS52144901A (en) * 1976-05-28 1977-12-02 Shin Shirasuna Electric Corp Device for monitoring power supply voltage
JPS546731U (en) * 1977-06-16 1979-01-17
JPS645617Y2 (en) * 1981-05-29 1989-02-13
US4758025A (en) * 1985-06-18 1988-07-19 Mobil Oil Corporation Use of electroless metal coating to prevent galling of threaded tubular joints
DE3716640C2 (en) * 1986-05-19 1996-03-28 Harima Chemicals Inc Process for producing a metal coating on a substrate metal
JPH0332385U (en) * 1989-08-07 1991-03-28
DE4440299A1 (en) * 1994-11-11 1996-05-15 Metallgesellschaft Ag Process for the electroless deposition of copper coatings on iron and iron alloy surfaces
GB0031806D0 (en) * 2000-12-29 2001-02-07 Chemetall Plc Electroless copper plating of ferrous metal substrates
WO2002063069A2 (en) * 2001-01-12 2002-08-15 University Of Rochester Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features
JP2009001872A (en) * 2007-06-22 2009-01-08 Kobe Steel Ltd Copper-plating method of wire-like material, and copper-plated wire
BR112013003430A2 (en) * 2010-08-17 2016-06-21 Chemetall Gmbh "process for covering metallic substrates without electric current."

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2049517A (en) * 1934-06-06 1936-08-04 American Chem Paint Co Method of and material for inhibiting or retarding acid corrosion of ferrous metals
US2217921A (en) * 1938-03-23 1940-10-15 American Chem Paint Co Art of drawing ferrous metal
US3141780A (en) * 1962-03-30 1964-07-21 Minnesota Mining & Mfg Copper coating compositions

Also Published As

Publication number Publication date
CA989105A (en) 1976-05-18
JPS492726A (en) 1974-01-11
JPS5518782B2 (en) 1980-05-21
BE793376A (en) 1973-04-16
FR2175729A1 (en) 1973-10-26
US3793037A (en) 1974-02-19
AU467404B2 (en) 1975-11-27
ES410196A1 (en) 1976-01-01
FR2175729B1 (en) 1976-08-20
GB1373895A (en) 1974-11-13
AU5269773A (en) 1974-08-29
AR197980A1 (en) 1974-05-24

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