AR222930A1 - Conjunto de montaje de una pastilla de circuito integrado - Google Patents
Conjunto de montaje de una pastilla de circuito integradoInfo
- Publication number
- AR222930A1 AR222930A1 AR283947A AR28394781A AR222930A1 AR 222930 A1 AR222930 A1 AR 222930A1 AR 283947 A AR283947 A AR 283947A AR 28394781 A AR28394781 A AR 28394781A AR 222930 A1 AR222930 A1 AR 222930A1
- Authority
- AR
- Argentina
- Prior art keywords
- assembly
- integrated circuit
- circuit pad
- pad
- integrated
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
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- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H01L2924/01023—Vanadium [V]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
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- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/113,159 US4339768A (en) | 1980-01-18 | 1980-01-18 | Transistors and manufacture thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
AR222930A1 true AR222930A1 (es) | 1981-06-30 |
Family
ID=22347887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AR283947A AR222930A1 (es) | 1980-01-18 | 1981-01-14 | Conjunto de montaje de una pastilla de circuito integrado |
Country Status (12)
Country | Link |
---|---|
US (1) | US4339768A (es) |
EP (1) | EP0034001B1 (es) |
JP (1) | JPS56108254A (es) |
AR (1) | AR222930A1 (es) |
AT (1) | ATE4757T1 (es) |
AU (1) | AU541489B2 (es) |
BR (1) | BR8100197A (es) |
CA (1) | CA1162392A (es) |
DE (1) | DE3160887D1 (es) |
ES (2) | ES498581A0 (es) |
HK (1) | HK81986A (es) |
MX (1) | MX149018A (es) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59135753A (ja) * | 1983-01-25 | 1984-08-04 | Toshiba Corp | 半導体装置とその製造方法 |
IT1213139B (it) * | 1984-02-17 | 1989-12-14 | Ates Componenti Elettron | Componente elettronico integrato di tipo "single-in-line" eprocedimento per la sua fabbricazione. |
FR2588122B1 (fr) * | 1985-10-01 | 1988-06-24 | Radiotechnique Compelec | Dispositif semi-conducteur de puissance pour montage en surface |
JPS61260657A (ja) * | 1985-05-15 | 1986-11-18 | Mitsubishi Electric Corp | 半導体装置 |
DE3621994A1 (de) * | 1986-07-01 | 1988-01-14 | Bbc Brown Boveri & Cie | Leistungshalbleitermodul |
DE3717489A1 (de) * | 1987-05-23 | 1988-12-01 | Asea Brown Boveri | Leistungshalbleitermodul und verfahren zur herstellung des moduls |
AU604904B2 (en) * | 1987-06-05 | 1991-01-03 | Nippondenso Co. Ltd. | A resin sealed semiconductor device and a method for making the same |
US4846701A (en) * | 1987-12-16 | 1989-07-11 | Amp Incorporated | Quick disconnect smart connector |
US5019892A (en) * | 1988-02-18 | 1991-05-28 | Amp Incorporated | Chip carrier with accumulator |
US5059746A (en) * | 1989-05-01 | 1991-10-22 | Amp Incorporated | Housing assembly for electronic components |
JP2527828B2 (ja) * | 1990-02-27 | 1996-08-28 | 三菱電機株式会社 | 半導体パッケ―ジ |
EP0452752B1 (en) * | 1990-04-16 | 1996-12-18 | Fujitsu Limited | Chip carrier for enabling production of high performance microwave semiconductor device by disposing semiconductor chip thereon |
DE69220601T2 (de) * | 1991-04-10 | 1997-10-23 | Caddock Electronics Inc | Schichtwiderstand |
JP3018554B2 (ja) * | 1991-04-25 | 2000-03-13 | 株式会社日立製作所 | 半導体モジュ−ル及びその製造方法 |
US6020219A (en) * | 1994-06-16 | 2000-02-01 | Lucent Technologies Inc. | Method of packaging fragile devices with a gel medium confined by a rim member |
JPH08139113A (ja) * | 1994-11-09 | 1996-05-31 | Mitsubishi Electric Corp | 樹脂封止型半導体装置 |
JP3353526B2 (ja) * | 1995-03-23 | 2002-12-03 | 株式会社デンソー | 半導体パッケージ及びその製造方法 |
US5738269A (en) * | 1996-04-19 | 1998-04-14 | Motorola, Inc. | Method for forming a solder bump |
DE19621000C2 (de) | 1996-05-24 | 1999-01-28 | Heraeus Sensor Nite Gmbh | Temperatur-Sensor mit einem Meßwiderstand |
DE10221857A1 (de) * | 2002-05-16 | 2003-11-27 | Osram Opto Semiconductors Gmbh | Verfahren zum Befestigen eines Halbleiterchips in einem Kunststoffgehäusekörper, optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung |
FR2902277B1 (fr) * | 2006-06-13 | 2008-09-05 | Valeo Electronique Sys Liaison | Support pour composant electrique et dispositif electrique comprenant le support et le composant |
WO2024132153A1 (en) * | 2022-12-22 | 2024-06-27 | Dynex Semiconductor Limited | Power semiconductor module |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3574815A (en) * | 1966-07-13 | 1971-04-13 | Motorola Inc | Method of fabricating a plastic encapsulated semiconductor assembly |
US3532944A (en) * | 1966-11-04 | 1970-10-06 | Rca Corp | Semiconductor devices having soldered joints |
US3606673A (en) * | 1968-08-15 | 1971-09-21 | Texas Instruments Inc | Plastic encapsulated semiconductor devices |
US3706915A (en) * | 1970-03-09 | 1972-12-19 | Gen Electric | Semiconductor device with low impedance bond |
US4125740A (en) * | 1973-09-26 | 1978-11-14 | Sgs-Ates Componenti Elettronici S.P.A. | Resin-encased microelectronic module |
DE2714483A1 (de) * | 1975-09-15 | 1978-10-12 | Siemens Ag | Verfahren zur teilautomatisierten kontaktierung von halbleitersystemen |
DE2608250C3 (de) * | 1976-02-28 | 1985-06-05 | Telefunken electronic GmbH, 7100 Heilbronn | Verfahren zum Thermokompressions-Verbinden von auf Halbleiterkörpern befindlichen Metall-Anschlußkontakten mit zugeordneten Gehäuseanschlußteilen und Vorrichtung zur Durchführung des Verfahrens |
IN148328B (es) * | 1977-04-18 | 1981-01-17 | Rca Corp | |
JPS53132975A (en) * | 1977-04-26 | 1978-11-20 | Toshiba Corp | Semiconductor device |
US4158745A (en) * | 1977-10-27 | 1979-06-19 | Amp Incorporated | Lead frame having integral terminal tabs |
-
1980
- 1980-01-18 US US06/113,159 patent/US4339768A/en not_active Expired - Lifetime
-
1981
- 1981-01-06 AU AU65994/81A patent/AU541489B2/en not_active Ceased
- 1981-01-06 DE DE8181300037T patent/DE3160887D1/de not_active Expired
- 1981-01-06 AT AT81300037T patent/ATE4757T1/de not_active IP Right Cessation
- 1981-01-06 EP EP81300037A patent/EP0034001B1/en not_active Expired
- 1981-01-14 AR AR283947A patent/AR222930A1/es active
- 1981-01-14 BR BR8100197A patent/BR8100197A/pt not_active IP Right Cessation
- 1981-01-15 MX MX185568A patent/MX149018A/es unknown
- 1981-01-16 ES ES498581A patent/ES498581A0/es active Granted
- 1981-01-16 CA CA000368647A patent/CA1162392A/en not_active Expired
- 1981-01-19 JP JP711981A patent/JPS56108254A/ja active Pending
- 1981-02-04 ES ES1981255953U patent/ES255953Y/es not_active Expired
-
1986
- 1986-10-30 HK HK819/86A patent/HK81986A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
ES255953U (es) | 1981-06-01 |
ATE4757T1 (de) | 1983-10-15 |
CA1162392A (en) | 1984-02-21 |
JPS56108254A (en) | 1981-08-27 |
ES8204224A1 (es) | 1982-04-01 |
ES255953Y (es) | 1981-12-01 |
BR8100197A (pt) | 1981-08-04 |
EP0034001A2 (en) | 1981-08-19 |
AU541489B2 (en) | 1985-01-10 |
EP0034001B1 (en) | 1983-09-21 |
EP0034001A3 (en) | 1981-08-26 |
MX149018A (es) | 1983-08-08 |
US4339768A (en) | 1982-07-13 |
HK81986A (en) | 1986-11-07 |
DE3160887D1 (en) | 1983-10-27 |
ES498581A0 (es) | 1982-04-01 |
AU6599481A (en) | 1981-07-23 |
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