ZA877006B - Process for preparing multilayer printed circuit boards - Google Patents

Process for preparing multilayer printed circuit boards

Info

Publication number
ZA877006B
ZA877006B ZA877006A ZA877006A ZA877006B ZA 877006 B ZA877006 B ZA 877006B ZA 877006 A ZA877006 A ZA 877006A ZA 877006 A ZA877006 A ZA 877006A ZA 877006 B ZA877006 B ZA 877006B
Authority
ZA
South Africa
Prior art keywords
image
circuit pattern
layer
copper
printed circuit
Prior art date
Application number
ZA877006A
Other languages
English (en)
Inventor
J. Ruszczyk Stanley
B. Larson Gary
R. Ferrier Donald
Gallegos Daniel
A. Castaldi Steven
Original Assignee
Macdermid, Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macdermid, Incorporated filed Critical Macdermid, Incorporated
Publication of ZA877006B publication Critical patent/ZA877006B/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Recrystallisation Techniques (AREA)
  • Bipolar Transistors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
ZA877006A 1986-11-10 1987-09-17 Process for preparing multilayer printed circuit boards ZA877006B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/929,640 US4761303A (en) 1986-11-10 1986-11-10 Process for preparing multilayer printed circuit boards

Publications (1)

Publication Number Publication Date
ZA877006B true ZA877006B (en) 1988-03-23

Family

ID=25458208

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA877006A ZA877006B (en) 1986-11-10 1987-09-17 Process for preparing multilayer printed circuit boards

Country Status (9)

Country Link
US (1) US4761303A (de)
EP (1) EP0288507B1 (de)
JP (1) JPH01501432A (de)
AT (1) ATE82529T1 (de)
AU (1) AU8102887A (de)
CA (1) CA1262577A (de)
DE (1) DE3782732T2 (de)
WO (1) WO1988003443A1 (de)
ZA (1) ZA877006B (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2553872B2 (ja) * 1987-07-21 1996-11-13 東京応化工業株式会社 ホトレジスト用剥離液
US5013402A (en) * 1989-01-20 1991-05-07 Casio Computer Co., Ltd. Method of manufacturing double-sided wiring substrate
US5049244A (en) * 1989-01-20 1991-09-17 Casio Computer Co., Ltd. Method of manufacturing double-sided wiring substrate
US4964947A (en) * 1989-01-20 1990-10-23 Casio Computer Co., Ltd. Method of manufacturing double-sided wiring substrate
US5108786A (en) * 1989-05-01 1992-04-28 Enthone-Omi, Inc. Method of making printed circuit boards
IT1232863B (it) * 1989-06-27 1992-03-05 Alfachimici Spa Procedimento a ciclo ridotto per la fabbricazione di circuiti stampati, e composizione per la sua attuazione
JPH0379100A (ja) * 1989-08-22 1991-04-04 Matsushita Electric Ind Co Ltd 光透過ペーストおよびそれを用いた金属銅析出方法
US5055164A (en) * 1990-03-26 1991-10-08 Shipley Company Inc. Electrodepositable photoresists for manufacture of hybrid circuit boards
US5227269A (en) * 1990-06-22 1993-07-13 Texas Instruments Incorporated Method for fabricating high density DRAM reticles
US5318803A (en) * 1990-11-13 1994-06-07 International Business Machines Corporation Conditioning of a substrate for electroless plating thereon
US5162144A (en) * 1991-08-01 1992-11-10 Motorola, Inc. Process for metallizing substrates using starved-reaction metal-oxide reduction
TW229350B (de) * 1992-08-28 1994-09-01 Hitachi Seisakusyo Kk
JP2885113B2 (ja) * 1995-01-30 1999-04-19 日本電気株式会社 印刷配線板およびその製造方法
US6207351B1 (en) 1995-06-07 2001-03-27 International Business Machines Corporation Method for pattern seeding and plating of high density printed circuit boards
WO1997039610A1 (en) * 1996-04-18 1997-10-23 International Business Machines Corporation Organic-metallic composite coating for copper surface protection
US5928790A (en) * 1996-04-23 1999-07-27 Mcgean-Rohco, Inc. Multilayer circuit boards and processes of making the same
US6440641B1 (en) * 1998-07-31 2002-08-27 Kulicke & Soffa Holdings, Inc. Deposited thin film build-up layer dimensions as a method of relieving stress in high density interconnect printed wiring board substrates
US7444253B2 (en) * 2006-05-09 2008-10-28 Formfactor, Inc. Air bridge structures and methods of making and using air bridge structures
RU2543518C1 (ru) * 2013-10-03 2015-03-10 Общество с ограниченной ответственностью "Компания РМТ"(ООО"РМТ") Способ изготовления двусторонней печатной платы
KR20150089276A (ko) * 2014-01-27 2015-08-05 삼성전기주식회사 적층 세라믹 전자부품 및 외부전극용 도전성 페이스트
CN107124830A (zh) * 2017-07-07 2017-09-01 台山市精诚达电路有限公司 一种fpc软板线路的制作方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3146125A (en) * 1960-05-31 1964-08-25 Day Company Method of making printed circuits
US3322881A (en) * 1964-08-19 1967-05-30 Jr Frederick W Schneble Multilayer printed circuit assemblies
JPS512206B2 (de) * 1972-05-18 1976-01-23
US3993801A (en) * 1975-02-18 1976-11-23 Surface Technology, Inc. Catalytic developer
FR2516739A1 (fr) * 1981-11-17 1983-05-20 Rhone Poulenc Spec Chim Procede de fabrication de circuits electroniques de type hybride a couches epaisses, des moyens destines a la mise en oeuvre de ce procede et les circuits obtenus selon ce procede
FR2518126B1 (fr) * 1981-12-14 1986-01-17 Rhone Poulenc Spec Chim Procede de metallisation d'articles electriquement isolants en matiere plastique et les articles intermediaires et finis obtenus selon ce procede
FR2544340A1 (fr) * 1983-04-15 1984-10-19 Rhone Poulenc Rech Procede de metallisation de films souples electriquement isolants en matiere plastique thermostable et articles obtenus
JPS60113993A (ja) * 1983-11-25 1985-06-20 三菱電機株式会社 多層回路基板の製造方法
US4526807A (en) * 1984-04-27 1985-07-02 General Electric Company Method for deposition of elemental metals and metalloids on substrates
FR2566611A1 (fr) * 1984-06-25 1985-12-27 Rhone Poulenc Rech Nouveaux circuits imprimes injectes et procede d'obtention

Also Published As

Publication number Publication date
ATE82529T1 (de) 1992-12-15
JPH01501432A (ja) 1989-05-18
CA1262577A (en) 1989-10-31
DE3782732T2 (de) 1993-04-15
EP0288507A1 (de) 1988-11-02
WO1988003443A1 (en) 1988-05-19
AU8102887A (en) 1988-06-01
DE3782732D1 (de) 1992-12-24
EP0288507B1 (de) 1992-11-19
JPH0529319B2 (de) 1993-04-30
US4761303A (en) 1988-08-02
EP0288507A4 (de) 1989-06-13

Similar Documents

Publication Publication Date Title
ZA877006B (en) Process for preparing multilayer printed circuit boards
US7169313B2 (en) Plating method for circuitized substrates
JPS62230091A (ja) 配線板の製造法
US11600430B2 (en) Inductor including high-rigidity insulating layers
US8205330B2 (en) Method for manufacturing a printed circuit board
JPH1075069A (ja) Ｙａｇレーザを利用したビルドアップ多層印刷回路基板の製造方法
EP0147566B1 (de) Verfahren zur Herstellung von Kontakten für biegsame Modulträger
US7080448B2 (en) PCB with inlaid outer-layer circuits and production methods thereof
US4421608A (en) Method for stripping peel apart conductive structures
US20010042733A1 (en) Process for manufacturing a multi-layer circuit board
KR950003244B1 (ko) 다층 회로판 제조공정
US5283949A (en) Method of producing a printed circuit board having a conductive pattern thereon
KR20130031592A (ko) 비아 및 미세 회로를 가진 인쇄회로기판을 제조하는 방법 및 그 방법에 의한 인쇄회로기판
TW475343B (en) Printed circuit boards
US6020049A (en) Product for producing viaholes in reinforced laminates and the related method for manufacturing viaholes
GB2203290A (en) Manufacture of printed circuit boards
GB2249219A (en) Manufacturing single sided printed wiring boards
GB2266999A (en) Method of manufacturing reinforced flexible printed circuit boards
JPH10126058A (ja) 多層プリント配線板の製造方法
JPH0423488A (ja) プリント基板の製造方法
JP2874330B2 (ja) 多層印刷配線板の製造方法
GB1005943A (en) Multilayer electrical circuit assemblies and processes for producing such assemblies
KR100228257B1 (ko) 미세 회로 형성에 적합한 플렉시블 인쇄 배선판용 기판 및 그 제조방법
JPS5921095A (ja) 多層印刷配線板の製造方法
JPH08186372A (ja) 多層プリント配線板の製造方法