WO2024109437A1 - Multifunctional film-coated plate and preparation method therefor, and anti-corrosion bottom film - Google Patents
Multifunctional film-coated plate and preparation method therefor, and anti-corrosion bottom film Download PDFInfo
- Publication number
- WO2024109437A1 WO2024109437A1 PCT/CN2023/127054 CN2023127054W WO2024109437A1 WO 2024109437 A1 WO2024109437 A1 WO 2024109437A1 CN 2023127054 W CN2023127054 W CN 2023127054W WO 2024109437 A1 WO2024109437 A1 WO 2024109437A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- parts
- resin
- base film
- film layer
- film
- Prior art date
Links
- 238000005260 corrosion Methods 0.000 title claims abstract description 63
- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- 229920005989 resin Polymers 0.000 claims abstract description 106
- 239000011347 resin Substances 0.000 claims abstract description 106
- 239000002994 raw material Substances 0.000 claims abstract description 75
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 49
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 48
- 229920000642 polymer Polymers 0.000 claims abstract description 42
- 229910052751 metal Inorganic materials 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 31
- 239000004831 Hot glue Substances 0.000 claims abstract description 25
- 239000011159 matrix material Substances 0.000 claims abstract description 21
- 229920001912 maleic anhydride grafted polyethylene Polymers 0.000 claims abstract description 17
- 239000010410 layer Substances 0.000 claims description 153
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 76
- 239000012790 adhesive layer Substances 0.000 claims description 51
- 229910052710 silicon Inorganic materials 0.000 claims description 39
- 239000010703 silicon Substances 0.000 claims description 39
- 239000011863 silicon-based powder Substances 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 33
- 239000003822 epoxy resin Substances 0.000 claims description 32
- 229920000647 polyepoxide Polymers 0.000 claims description 32
- 239000012528 membrane Substances 0.000 claims description 29
- 238000001125 extrusion Methods 0.000 claims description 24
- 239000008188 pellet Substances 0.000 claims description 22
- 230000007704 transition Effects 0.000 claims description 20
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 18
- 239000003963 antioxidant agent Substances 0.000 claims description 15
- 230000003078 antioxidant effect Effects 0.000 claims description 12
- 239000012752 auxiliary agent Substances 0.000 claims description 12
- 229920000092 linear low density polyethylene Polymers 0.000 claims description 12
- 239000004707 linear low-density polyethylene Substances 0.000 claims description 12
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 12
- 229920006287 phenoxy resin Polymers 0.000 claims description 10
- 239000013034 phenoxy resin Substances 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- 239000003085 diluting agent Substances 0.000 claims description 9
- 238000005469 granulation Methods 0.000 claims description 9
- 230000003179 granulation Effects 0.000 claims description 9
- 239000003208 petroleum Substances 0.000 claims description 9
- 239000004408 titanium dioxide Substances 0.000 claims description 9
- 238000007731 hot pressing Methods 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 8
- 238000013329 compounding Methods 0.000 claims description 7
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 6
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 6
- 229920001903 high density polyethylene Polymers 0.000 claims description 6
- 239000004700 high-density polyethylene Substances 0.000 claims description 6
- 229920001684 low density polyethylene Polymers 0.000 claims description 6
- 239000004702 low-density polyethylene Substances 0.000 claims description 6
- 150000003505 terpenes Chemical class 0.000 claims description 6
- 235000007586 terpenes Nutrition 0.000 claims description 6
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 5
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 5
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 5
- -1 polypropylene Polymers 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 4
- 229910001335 Galvanized steel Inorganic materials 0.000 claims description 4
- 239000004743 Polypropylene Substances 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims description 4
- 239000008397 galvanized steel Substances 0.000 claims description 4
- 229920001910 maleic anhydride grafted polyolefin Polymers 0.000 claims description 4
- 229920001155 polypropylene Polymers 0.000 claims description 4
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 claims description 4
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 claims description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 2
- 239000000347 magnesium hydroxide Substances 0.000 claims description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 2
- 239000011120 plywood Substances 0.000 claims 6
- 239000000654 additive Substances 0.000 claims 4
- 230000000996 additive effect Effects 0.000 claims 4
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 12
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 239000000843 powder Substances 0.000 abstract description 6
- 239000000377 silicon dioxide Substances 0.000 abstract description 6
- 238000004078 waterproofing Methods 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 6
- 238000009835 boiling Methods 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000011056 performance test Methods 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 3
- 238000006748 scratching Methods 0.000 description 3
- 230000002393 scratching effect Effects 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- 229920002633 Kraton (polymer) Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000012968 metallocene catalyst Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920005629 polypropylene homopolymer Polymers 0.000 description 1
- 229920005653 propylene-ethylene copolymer Polymers 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/001—Combinations of extrusion moulding with other shaping operations
- B29C48/0021—Combinations of extrusion moulding with other shaping operations combined with joining, lining or laminating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/07—Flat, e.g. panels
- B29C48/08—Flat, e.g. panels flexible, e.g. films
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
- C08L23/0815—Copolymers of ethene with aliphatic 1-olefins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/06—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
- C09J123/0815—Copolymers of ethene with aliphatic 1-olefins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/346—Applications of adhesives in processes or use of adhesives in the form of films or foils for building applications e.g. wrap foil
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B10/00—Integration of renewable energy sources in buildings
- Y02B10/10—Photovoltaic [PV]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the invention relates to a multifunctional film-covered board and a preparation method thereof and an anti-corrosion base film.
- TPO waterproof membranes have been proven to have an outdoor service life of more than 25 years. Compounding exposed TPO waterproof membranes to metal plates can greatly increase the corrosion resistance of metal plates, and the weldability can ensure that the overlap of TPO waterproof membranes has good waterproof performance after welding. However, in actual application, it was found that when the thickness of TPO waterproof membranes is below 0.4mm, TPO waterproof membranes are very prone to wrinkling or even damage during hot air welding.
- the back of the metal plate that is not compounded with the TPO waterproof membrane is also prone to rust.
- there are some anti-corrosion methods for the back of the metal plate which is to compound a layer of PE, PET, PVC, etc. on the back of the metal plate as an anti-corrosion base film.
- this method has limited anti-corrosion performance and will further increase the heat dissipation during welding of the TPO waterproof membrane, making it easier to burn the thinner TPO waterproof membrane.
- the present invention provides an improved film-coated board and a preparation method thereof, which also has the performance of resistance to water boiling after scratching.
- the present invention also provides an anti-corrosion base film for a film-covered plate, wherein the anti-corrosion base film enables the film-covered plate to have anti-corrosion performance as well as thermal conductivity and heat dissipation performance.
- a film-covered board comprising an anti-corrosion base film, a metal plate, a hot-melt adhesive film and a polymer waterproof coiled material arranged in sequence, wherein silicon micropowder is added to the polymer waterproof coiled material and the hot-melt adhesive film respectively;
- the anti-corrosion base film comprises a first base film layer for bonding with the metal plate and a second base film layer arranged on the first base film layer;
- the raw materials of the first base film layer include maleic anhydride grafted polyethylene, tackifying resin, silicon micropowder and graphene oxide, and the mass ratio of maleic anhydride grafted polyethylene, tackifying resin, silicon micropowder and graphene oxide is 1:0.1-0.5:0.05-0.6:0.0001-0.08;
- the raw materials of the second base film layer include base resin, silicon micropowder and graphene oxide, and the mass ratio of the base resin, silicon micropowder and graphene oxide is 1:0.05 to 1:0.0001 to 0.1.
- the particle size D50 of the silicon micropowder is 2 to 8 ⁇ m, and the whiteness is above 95.
- the thermal conductivity of the silicon micropowder is above 10 W/K ⁇ m.
- the particle size D50 of the graphene oxide is less than 10 ⁇ m, and the specific surface area is 150 to 400 m 2 /g.
- the specific surface area of the graphene oxide is 180 to 250 m 2 /g.
- the graphene oxide is commercially available SE1132 (specific surface area of 225 ⁇ 25 m 2 /g) or SE1133 (specific surface area of 260-350 m 2 /g) produced by Changzhou Sixth Element Material Technology Co., Ltd., China.
- the raw materials of the first bottom film layer include 45-90 parts of maleic anhydride grafted polyethylene, 10-20 parts of tackifying resin, 5-25 parts of silicon micropowder and 0.01-3 parts of graphene oxide.
- the raw materials of the first bottom film layer include 45-90 parts of maleic anhydride grafted polyethylene, 10-20 parts of tackifying resin, 8-20 parts of silicon micropowder and 0.5-2 parts of graphene oxide.
- the raw material of the first base film layer further includes 0.2 to 2 parts of auxiliary agents, and the auxiliary agents in the first base film layer include a combination of one or more of antioxidants and ultraviolet absorbers.
- the tackifying resin in the first base film layer is a combination of one or more of hydrogenated petroleum resin, rosin resin, hydrogenated rosin resin, terpene phenolic resin, and terpene resin.
- the raw materials of the second bottom film layer include 30-90 parts of base resin, 5-25 parts of silicon powder and 0.01-3 parts of graphene oxide.
- the raw materials of the second bottom film layer include 50-80 parts of base resin, 8-20 parts of silicon powder and 0.5-2 parts of graphene oxide.
- the raw material of the second base film layer further includes 0.2 to 2 parts of auxiliary agents, and the auxiliary agents in the second base film layer include a combination of one or more of antioxidants and ultraviolet absorbers.
- the base resin in the second bottom film layer includes at least one of HDPE (high-density polyethylene), LDPE (low-density polyethylene), LLDPE (linear low-density polyethylene), and SIS (styrene-isoprene-styrene block copolymer).
- HDPE high-density polyethylene
- LDPE low-density polyethylene
- LLDPE linear low-density polyethylene
- SIS styrene-isoprene-styrene block copolymer
- the thickness of the first base film layer is 10 to 30 ⁇ m
- the thickness of the second base film layer is 10 to 30 ⁇ m.
- the thickness of the layer is 20 to 60 ⁇ m.
- the second base film layer has a 2-layer, 3-layer or more layer structure.
- the raw materials of the polymer waterproofing coiled material include base resin and silicon micropowder, and the mass ratio of the base resin to the silicon micropowder in the polymer waterproofing coiled material is 1:0.1-2.5.
- the polymer waterproofing membrane is a TPO waterproofing membrane
- the base resin of the polymer waterproofing membrane is a combination of TPO and polypropylene in a mass ratio of 1:0.3 to 7.
- the raw material of the polymer waterproof coiled material further includes titanium dioxide, and the mass ratio of the base resin to the titanium dioxide in the polymer waterproof coiled material is 1:0.2-2.5.
- the raw materials of the polymer waterproofing membrane include 10-50 parts of base resin, 5-25 parts of silicon powder and 10-25 parts of titanium dioxide by weight.
- the raw materials of the TPO waterproofing membrane include 25-35 parts of base resin, 8-20 parts of silicon powder and 10-25 parts of titanium dioxide by weight.
- the raw materials of the polymer waterproof coiled material further include 0 to 30 parts of filler, 0.1 to 2 parts of antioxidant and 0.1 to 2 parts of ultraviolet absorber.
- polypropylene is homopolypropylene or a polypropylene-ethylene copolymer.
- the TPO is an ethylene- ⁇ -olefin copolymer, preferably a combination of one or more of an ethylene-propylene copolymer, an ethylene-butene copolymer, and an ethylene-octene copolymer.
- the filler includes but is not limited to a combination of one or more of calcium carbonate, talc, aluminum hydroxide, and magnesium hydroxide.
- the thickness of the polymer waterproofing coiled material is 0.2 to 2.0 mm.
- the thickness of the polymer waterproofing coiled material is 0.2 to 0.4 mm.
- the hot melt adhesive film is a multi-layer structure
- the raw materials of each layer structure include base resin and silicon powder
- the mass ratio of the base resin to silicon powder in each layer structure is 1:0.04-1.
- the hot melt adhesive film includes a first adhesive layer for bonding to the metal plate, a second adhesive layer for bonding to the polymer waterproof membrane, and a transition layer disposed between the first adhesive layer and the second adhesive layer, wherein:
- the matrix resin of the first adhesive layer is epoxy resin, and the mass ratio of the matrix resin to silicon powder in the first adhesive layer is 1:0.05-0.45.
- the base resin of the transition layer is phenoxy resin, ethylene-vinyl acetate copolymer, maleic anhydride grafted
- the polyolefin resin is combined in a mass ratio of 1:0.1-3:0.3-4.5, and the mass ratio of the base resin to the silicon powder in the transition layer is 1:0.04-0.9.
- the matrix resin of the second adhesive layer is at least one of HDPE, LDPE, LLDPE, SEBS, and POE, and the mass ratio of the matrix resin to the silicon powder in the second adhesive layer is 1:0.05-0.6.
- the raw materials of the first adhesive layer also include epoxy resin reactive diluent, epoxy resin latent curing agent and epoxy resin curing accelerator, and the mass ratio of the base resin, epoxy resin reactive diluent, epoxy resin latent curing agent and epoxy resin curing accelerator in the first adhesive layer is 1: 0.06-0.25: 0.02-0.15: 0.01-0.09.
- the raw materials of the first adhesive layer include 60-80 parts of matrix resin, 5-15 parts of epoxy resin reactive diluent, 2-8 parts of epoxy resin latent curing agent, 1-5 parts of epoxy resin curing accelerator, 0.5-2.5 parts of silane coupling agent and 5-25 parts of silicon powder.
- the raw materials of the first adhesive layer include 60-80 parts of matrix resin, 5-15 parts of epoxy resin reactive diluent, 2-8 parts of epoxy resin latent curing agent, 1-5 parts of epoxy resin curing accelerator, 0.5-2.5 parts of silane coupling agent and 8-20 parts of silicon powder.
- the weight average molecular weight of the phenoxy resin is greater than 40000.
- the weight average molecular weight of the phenoxy resin is 40000 to 65000. More preferably, the weight average molecular weight of the phenoxy resin is 50000 to 65000.
- the raw materials of the transition layer include 30 to 125 parts of base resin and 5 to 25 parts of silicon powder.
- the raw materials of the transition layer include 25-35 parts of phenoxy resin, 10-20 parts of ethylene-vinyl acetate copolymer, 25-35 parts of maleic anhydride grafted polyolefin resin and 8-20 parts of silicon powder.
- the raw material of the transition layer further includes 0.2 to 2 parts of an auxiliary agent, and the auxiliary agent in the transition layer includes a combination of one or more of an antioxidant and an ultraviolet absorber.
- the raw material of the second adhesive layer further includes a tackifying resin, and the mass ratio of the base resin to the tackifying resin in the second adhesive layer is 1:0.1-0.5.
- the raw materials of the second adhesive layer include 45-90 parts of base resin, 10-20 parts of tackifying resin and 5-25 parts of silicon powder.
- the raw materials of the second adhesive layer include 45-90 parts of base resin, 10-20 parts of tackifying resin and 8-20 parts of silicon powder.
- the raw material of the second adhesive layer further includes 0.2 to 2 parts of an auxiliary agent
- the auxiliary agent in the second adhesive layer includes one or a combination of antioxidants and ultraviolet absorbers.
- the thickness of each layer structure is selected from 0.01 to 0.05 mm; and/or the metal plate is a galvanized steel plate.
- the metal plate is a galvanized steel plate.
- the TPO is a polyolefin thermoplastic elastomer
- the SEBS refers to a styrene-ethylene-butylene-styrene block copolymer
- the POE refers to a random copolymer elastomer that is polymerized in situ using a metallocene catalyst with ethylene and a high carbon ⁇ -olefin (1-butene, 1-hexene, 1-octene, etc.).
- the method for preparing the film-covered board includes the step of preparing an anti-corrosion base film, and the method for preparing the anti-corrosion base film includes the following steps:
- Step S1 adding all the raw materials of the first bottom film layer into a twin-screw extruder, performing extrusion granulation, and obtaining first bottom film layer pellets;
- Step S2 adding all the raw materials of the second bottom film layer into a twin-screw extruder, performing extrusion granulation, and obtaining second bottom film layer pellets;
- Step S3 adding the first base film layer pellets of step S1 and the second base film layer pellets of step S2 into co-extrusion equipment respectively, co-extruding and compounding, to obtain the anti-corrosion base film.
- step S1 the extrusion temperature of the twin-screw extruder is 170-180°C.
- step S2 the extrusion temperature of the twin-screw extruder is 180-190°C.
- step S3 the temperature of the co-extrusion die of the co-extrusion equipment is 175-185°C.
- the second technical solution adopted by the present invention is: a method for preparing the above-mentioned film-coated board, comprising arranging a polymer waterproof roll material, a hot melt adhesive film and a metal plate in sequence, and then bonding them together through a first hot pressing process, and then compounding an anti-corrosion base film on the metal plate, and then bonding them through a second hot pressing process to obtain the film-coated board.
- the first hot pressing is carried out at a temperature of 180-220° C. and a pressure of 0.3-0.8 MPa
- the second hot pressing is carried out at a temperature of 140-180° C. and a pressure of 0.3-0.8 MPa.
- the present invention has the following advantages compared with the prior art:
- the film-coated board of the present invention introduces silicon powder into both the polymer waterproofing coil and the hot melt adhesive film, and redesigns the formula of the anti-corrosion base film, so that the film-coated board has anti-corrosion properties on the back and the film-coated board as a whole has thermal conductivity and heat dissipation properties, which can quickly diffuse the heat generated when welding the exposed polymer waterproofing coil, avoiding poor welding caused by wrinkles that are very easy to occur when welding thinner polymer waterproofing coils such as TPO.
- the anti-corrosion base film of the present invention not only has thermal conductivity and heat dissipation properties, but graphene oxide can also form a dense physical shielding layer in the anti-corrosion base film, extending the diffusion path of the corrosive medium, reducing the diffusion rate of the corrosion factor, and greatly improving the anti-corrosion base film.
- the main idea of the present invention is to introduce silicon powder into the polymer waterproofing membrane and the hot melt adhesive film, which can quickly diffuse the heat generated during welding, and thinner polymer waterproofing membranes such as TPO will not be scalded, wrinkled or damaged during welding.
- a further concept of the present invention is to redesign the formula of the anti-corrosion base film so that the film-coated board has anti-corrosion performance on the back side while not having poor thermal conductivity due to the addition of the anti-corrosion base film, and the entire film-coated board has good thermal conductivity and heat dissipation performance.
- the inventor of the present invention unexpectedly discovered that by introducing graphene oxide into the first bottom film layer of the anti-corrosion bottom film bonded to the metal plate, the anti-corrosion bottom film has significantly improved its resistance to water boiling after scratching. Therefore, a further conception of the present invention is that the hot melt adhesive film uses a high temperature resistant hot melt adhesive film in combination with the anti-corrosion bottom film of the present invention, so that the entire film-coated board has resistance to water boiling after scratching.
- the silicon micropowder selected is crystalline silicon micropowder produced by Jiangsu Lianrui New Materials Co., Ltd. of China, with D50 of 5um and whiteness of 95;
- the epoxy resin selected is polyphenol epoxy resin (specifically F-51 produced by Jiangsu Sanmu Group of China);
- the epoxy resin active diluent selected is phenyl glycidyl ether;
- the epoxy resin latent curing agent selected is HT 2844 produced by Ciba Geigy of Switzerland;
- the epoxy resin curing accelerator selected is UR500 produced by Azken of Germany;
- the silane coupling agent is KH-560;
- the phenoxy resin selected is PKFE produced by Huntsman of the United States, with a weight average molecular weight of 60,000;
- the maleic anhydride grafted polyolefin resin selected is FB19E5 produced by Fine-Blend of Shanghai Jiayirong of China;
- the POE selected is Engage 8440 produced
- the film-faced board provided in this embodiment includes an anti-corrosion base film, a metal plate, a hot-melt adhesive film and a TPO waterproof membrane which are arranged in sequence.
- the raw material formula of TPO waterproof membrane is as follows: 10 parts of TPO, 20 parts of polypropylene, 15 parts of silica powder and 20 parts of titanium dioxide, the thickness of the TPO waterproof membrane is 0.3mm.
- the hot melt adhesive film includes a first adhesive layer for bonding to the metal plate, a second adhesive layer for bonding to the TPO waterproof membrane, and a transition layer arranged between the first adhesive layer and the second adhesive layer, wherein the raw material formula of the first adhesive layer is as follows: 70 parts of epoxy resin, 10 parts of epoxy resin active diluent, 5 parts of epoxy resin latent curing agent, 3 parts of epoxy resin curing accelerator, 1.5 parts of silane coupling agent and 15 parts of silicon micropowder; the raw material formula of the transition layer is as follows: 30 parts of phenoxy resin, 15 parts of EVA, 30 parts of maleic anhydride grafted polyethylene, 0.5 parts of antioxidant 1010, 0.5 parts of ultraviolet absorber and 15 parts of silicon micropowder; the raw material formula of the second adhesive layer is as follows: 75 parts of LLDPE, 15 parts of hydrogenated petroleum resin, 15 parts of silicon micropowder, 0.5 parts of antioxidant and 0.5 parts of ultraviolet absorber.
- the raw material formula of the first adhesive layer is as follows:
- the hot melt adhesive film is prepared by the following method:
- Step (1) mixing all raw materials of the first adhesive layer at a temperature of about 70° C. for 60 minutes to obtain a first adhesive layer liquid;
- Step (2) adding all raw materials of the transition layer into a twin-screw extruder, and performing extrusion granulation to obtain transition layer pellets, wherein the extrusion temperature is 150-160° C.;
- Step (3) adding all the raw materials of the second adhesive layer into a twin-screw extruder, extruding and granulating to obtain second adhesive layer pellets, wherein the extrusion temperature is 160-170° C.;
- Step (4) respectively adding the first adhesive layer liquid, the transition layer pellets, and the second adhesive layer pellets into a three-layer calendering co-extrusion device, and performing three-layer co-extrusion compounding to obtain a three-layer hot melt adhesive film, wherein the working temperature of the feed screw of the adhesive material of the first adhesive layer is controlled to be 90-100°C, the working temperature of the feed screw of the pellets of the transition layer is controlled to be 130-140°C, the working temperature of the feed screw of the pellets of the second adhesive material is controlled to be 170-180°C, the temperature of the co-extrusion die is controlled to be 170-180°C, the thickness of the first adhesive layer is 0.02mm, the thickness of the transition layer is 0.02mm, and the thickness of the second adhesive layer is 0.02mm.
- the anticorrosive base film includes a first base film layer for bonding with a metal plate and a second base film layer disposed on the first base film layer, wherein the raw material formula of the first base film layer is as follows: 75 parts of maleic anhydride grafted polyethylene, 15 parts of hydrogenated petroleum resin, 15 parts of silicon micropowder, 1 part of graphene oxide, 0.5 parts of antioxidant and 0.5 parts of ultraviolet absorber; the raw material formula of the second base film layer is as follows: 75 parts of LLDPE, 15 parts of silicon micropowder, 1 part of graphene oxide, 0.5 parts of antioxidant and 0.5 parts of ultraviolet absorber.
- graphene oxide uses SE1132 from Changzhou Sixth Element Material Technology Co., Ltd. of China.
- the above anticorrosive base film is prepared by the following method:
- Step S1 adding all the raw materials of the first bottom film layer into a twin-screw extruder, performing extrusion granulation, and obtaining first bottom film layer pellets, wherein the extrusion temperature is 175° C.;
- Step S2 adding all the raw materials of the second bottom film layer into a twin-screw extruder, performing extrusion granulation, and obtaining second bottom film layer pellets, wherein the extrusion temperature is 185° C.;
- Step S3 respectively add the first bottom film layer pellets of step S1 and the second bottom film layer pellets of step S2 into the three-layer blown film co-extrusion equipment, co-extrude and compound, and obtain a three-layer anti-corrosion bottom film, wherein the die head temperature is 180°C, the second bottom film layer is a two-layer structure, and the two-layer structure is made of exactly the same material, the thickness of the first bottom film layer is 20 ⁇ m, and the thickness of the second bottom film layer is 40 ⁇ m.
- the metal plate is a galvanized steel plate with a thickness of 0.6 mm.
- the film-covered board is prepared by the following method:
- the TPO waterproofing membrane, hot melt adhesive film and metal plate are hot pressed at a temperature of 200°C and a pressure of 0.6 MPa for 20 seconds to obtain a semi-finished product, and then the semi-finished metal plate is compounded with the anti-corrosion base film and hot pressed at a temperature of 150°C and a pressure of 0.6 MPa for 20 seconds to obtain a film-coated board.
- the film-covered board provided in this embodiment is basically the same as that in embodiment 1, but differs from embodiment 1 in that:
- the amount of silica powder used in TPO waterproof membrane is 5 parts;
- the amount of silicon powder in the first adhesive layer, transition layer and second adhesive layer of the hot melt adhesive film is 5 parts respectively;
- the amount of silicon powder used in the first base film layer and the second base film layer of the anti-corrosion base film is 5 parts.
- the amount of graphene oxide used in the first base film layer and the second base film layer of the anti-corrosion base film is 0.05 parts.
- the film-covered board provided in this embodiment is basically the same as that in embodiment 1, but differs from embodiment 1 in that:
- the amount of silica powder used in TPO waterproof membrane is 25 parts;
- the amount of silicon powder in the first adhesive layer, transition layer and second adhesive layer of the hot melt adhesive film is 25 parts respectively;
- the amount of silicon powder used in the first base film layer and the second base film layer of the anti-corrosion base film is 25 parts.
- the amount of graphene oxide used in the first base film layer and the second base film layer of the anti-corrosion base film is 3 parts.
- the film-covered board provided in this embodiment is basically the same as that in Embodiment 1, but differs from Embodiment 1 in that:
- the raw material formula of the first base film layer is as follows: 50 parts of maleic anhydride grafted polyethylene, 15 parts of hydrogenated petroleum resin, 10 parts of silicon micropowder, 1.5 parts of graphene oxide, 0.5 parts of antioxidant and 0.5 parts of ultraviolet absorber.
- the film-covered board provided in this embodiment is basically the same as that in embodiment 1, but differs from embodiment 1 in that:
- the raw material formula of the second bottom film layer is as follows: 50 parts of LLDPE, 10 parts of silicon powder, 2 parts of graphene oxide, 0.5 parts of antioxidant and 0.5 parts of UV absorber.
- the coated board provided in this embodiment is basically the same as that in Embodiment 1, and the difference from Embodiment 1 is that the graphene oxide in the anti-corrosion base film is different from that in Embodiment 1, specifically SE1133 of Changzhou Sixth Element Materials Technology Co., Ltd.
- the preparation method of the film-covered plate provided in this comparative example is basically the same as that of Example 1, and the difference from Example 1 is that no graphene oxide is added to the first base film layer and the second base film layer of the anti-corrosion base film.
- the preparation method of the film-coated board provided in this comparative example is basically the same as that of Example 1, and the difference from Example 1 is that no graphene oxide sheets are added to the first base film layer and the second base film layer of the anti-corrosion base film, but an equal amount of mica flakes with barrier and anti-corrosion effects are added.
- Boiling test after cross-cutting The finished laminated board was cross-cut according to the adhesion test method in the group standard T/CBMCA 017-2020 "Film-coated steel sheets for construction". Both sides of the laminated board were cross-cut to 3mm ⁇ 3mm. Then the cross-cut laminated board was boiled in boiling water for 48 hours according to this standard to observe whether there was bulging or falling off. At the same time, the peel strength of the laminated board at room temperature was tested according to the group standard T/CBMCA 017-2020 "Film-coated steel sheets for construction".
- Welding performance test Use a manual hot air welding gun to perform overlapping edge welding at a welding temperature of 360°C.
- Table 1 is the performance test results of the film-faced boards of Examples 1 to 6 and Comparative Examples 1 to 2
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
A multifunctional film-coated plate and a preparation method therefor, and an anti-corrosion bottom film. The film-coated plate comprises an anti-corrosion bottom film, a metal plate, a hot melt adhesive film, and a polymer waterproof sheet arranged in sequence. Silica powder is added into the polymer waterproof sheet and the hot melt adhesive film, respectively. The anti-corrosion bottom film comprises a first bottom film layer and a second bottom film layer. Raw materials of the first bottom film layer comprise maleic anhydride grafted polyethylene, a tackifying resin, silica powder and graphene oxide. Raw materials of the second bottom film layer comprise a matrix resin, silica powder, and graphene oxide. The entire film-coated plate has heat conduction performance and heat dissipation performance, and can quickly diffuse heat generated during welding of the exposed polymer waterproof sheet, avoiding poor welding caused by scorching and wrinkling which are extremely prone to occur during welding of relatively thin TPO and other polymer waterproof sheets.
Description
本发明涉及一种多功能覆膜板及其制备方法和防腐底膜。The invention relates to a multifunctional film-covered board and a preparation method thereof and an anti-corrosion base film.
一般工商业厂房屋面上使用的彩钢瓦户外使用年限不超过10年，而光伏组件的设计使用年限是不低于25年，分布式光伏屋面若采用彩钢瓦就会出现屋面同光伏组件生命周期不匹配的问题，增加后期维护成本，降低投资回报率。外露型TPO防水卷材已被证明其户外使用寿命在25年以上，将外露型TPO防水卷材复合到金属板上可以大幅增加金属板的耐腐蚀性能，可焊接性能可以保证TPO防水卷材搭接处经焊接处理后有较好的防水性能。但实际应用过程中发现当TPO防水卷材的厚度在0.4mm以下，热风焊接时TPO防水卷材极易出现烫皱乃至破损的现象。The outdoor service life of color steel tiles used on the roofs of general industrial and commercial factories does not exceed 10 years, while the design service life of photovoltaic modules is not less than 25 years. If distributed photovoltaic roofs use color steel tiles, there will be a mismatch between the life cycle of the roof and the photovoltaic modules, which will increase the cost of later maintenance and reduce the return on investment. Exposed TPO waterproof membranes have been proven to have an outdoor service life of more than 25 years. Compounding exposed TPO waterproof membranes to metal plates can greatly increase the corrosion resistance of metal plates, and the weldability can ensure that the overlap of TPO waterproof membranes has good waterproof performance after welding. However, in actual application, it was found that when the thickness of TPO waterproof membranes is below 0.4mm, TPO waterproof membranes are very prone to wrinkling or even damage during hot air welding.
此外，金属板的未与TPO防水卷材复合的背面也容易出现锈蚀现象，目前，也有一些金属板背面的防腐方法，就是在金属板的背面复合一层PE、PET、PVC等作为防腐底膜，然而此方式的防腐，防腐性能有限，并且会进一步增加对TPO防水卷材焊接时散热不利，更易烫坏厚度较薄的TPO防水卷材。In addition, the back of the metal plate that is not compounded with the TPO waterproof membrane is also prone to rust. At present, there are some anti-corrosion methods for the back of the metal plate, which is to compound a layer of PE, PET, PVC, etc. on the back of the metal plate as an anti-corrosion base film. However, this method has limited anti-corrosion performance and will further increase the heat dissipation during welding of the TPO waterproof membrane, making it easier to burn the thinner TPO waterproof membrane.
综上，目前针对TPO防水卷材厚度较薄同时含有防腐底膜的覆膜板的TPO搭接边焊接易烫皱的问题，仍然没有有效的解决方案。In summary, there is still no effective solution to the problem that the TPO overlap edges of the coated panels with thin TPO waterproof membranes and containing anti-corrosion base films are prone to wrinkling during welding.
发明内容Summary of the invention
发明目的：为了解决现有技术存在的TPO防水卷材厚度较薄同时含有防腐底膜的覆膜板的TPO搭接边焊接易烫皱的问题，本发明提供一种改进的覆膜板及其制备方法，该覆膜板同时还具有耐划格后水煮性能。Purpose of the invention: In order to solve the problem in the prior art that the TPO waterproofing membrane is relatively thin and the TPO overlap edges of the film-coated board containing an anti-corrosion base film are easily wrinkled during welding, the present invention provides an improved film-coated board and a preparation method thereof, which also has the performance of resistance to water boiling after scratching.
本发明还提供一种覆膜板用防腐底膜，该防腐底膜使覆膜板具有防腐性能的同时还具有导热性能和散热性能。The present invention also provides an anti-corrosion base film for a film-covered plate, wherein the anti-corrosion base film enables the film-covered plate to have anti-corrosion performance as well as thermal conductivity and heat dissipation performance.
技术方案：为了解决上述技术问题，本发明采用如下技术方案：Technical solution: In order to solve the above technical problems, the present invention adopts the following technical solution:
一种覆膜板，包括依次设置的防腐底膜、金属板、热熔胶膜和高分子防水卷材，所述高分子防水卷材、热熔胶膜中分别添加有硅微粉；A film-covered board, comprising an anti-corrosion base film, a metal plate, a hot-melt adhesive film and a polymer waterproof coiled material arranged in sequence, wherein silicon micropowder is added to the polymer waterproof coiled material and the hot-melt adhesive film respectively;
所述防腐底膜包括用于与所述金属板粘接的第一底膜层和设置在所述第一底膜层上的第二底膜层；
The anti-corrosion base film comprises a first base film layer for bonding with the metal plate and a second base film layer arranged on the first base film layer;
所述第一底膜层的原料包括马来酸酐接枝聚乙烯、增粘树脂、硅微粉和氧化石墨烯，所述马来酸酐接枝聚乙烯、增粘树脂、硅微粉和氧化石墨烯的质量比为1：0.1～0.5：0.05～0.6：0.0001～0.08；The raw materials of the first base film layer include maleic anhydride grafted polyethylene, tackifying resin, silicon micropowder and graphene oxide, and the mass ratio of maleic anhydride grafted polyethylene, tackifying resin, silicon micropowder and graphene oxide is 1:0.1-0.5:0.05-0.6:0.0001-0.08;
所述第二底膜层的原料包括基体树脂、硅微粉和氧化石墨烯，所述基体树脂、硅微粉、氧化石墨烯的质量比为1：0.05～1：0.0001～0.1。The raw materials of the second base film layer include base resin, silicon micropowder and graphene oxide, and the mass ratio of the base resin, silicon micropowder and graphene oxide is 1:0.05 to 1:0.0001 to 0.1.
进一步地，所述硅微粉的粒径D50为2～8μm，白度为95以上。所述硅微粉的热传导率为10W/K·m以上。Furthermore, the particle size D50 of the silicon micropowder is 2 to 8 μm, and the whiteness is above 95. The thermal conductivity of the silicon micropowder is above 10 W/K·m.
进一步地，所述氧化石墨烯的粒径D50为10μm以下、比表面积为150～400m2/g。优选地，所述氧化石墨烯的比表面积为180～250m2/g。Furthermore, the particle size D50 of the graphene oxide is less than 10 μm, and the specific surface area is 150 to 400 m 2 /g. Preferably, the specific surface area of the graphene oxide is 180 to 250 m 2 /g.
所述氧化石墨烯为市售的中国常州第六元素材料科技股份有限公司的SE1132(比表面积为225±25m2/g)或SE1133(比表面积为260～350m2/g)。The graphene oxide is commercially available SE1132 (specific surface area of 225±25 m 2 /g) or SE1133 (specific surface area of 260-350 m 2 /g) produced by Changzhou Sixth Element Material Technology Co., Ltd., China.
进一步地，按重量份计，所述第一底膜层的原料包括马来酸酐接枝聚乙烯45～90份、增粘树脂10～20份、硅微粉5～25份和氧化石墨烯0.01～3份。优选地，按重量份计，所述第一底膜层的原料包括马来酸酐接枝聚乙烯45～90份、增粘树脂10～20份、硅微粉8～20份和氧化石墨烯0.5～2份。Further, by weight, the raw materials of the first bottom film layer include 45-90 parts of maleic anhydride grafted polyethylene, 10-20 parts of tackifying resin, 5-25 parts of silicon micropowder and 0.01-3 parts of graphene oxide. Preferably, by weight, the raw materials of the first bottom film layer include 45-90 parts of maleic anhydride grafted polyethylene, 10-20 parts of tackifying resin, 8-20 parts of silicon micropowder and 0.5-2 parts of graphene oxide.
根据本发明的一些实施方面，所述第一底膜层的原料还包括0.2～2份助剂，所述第一底膜层中的所述助剂包括抗氧剂、紫外线吸收剂中的一种或多种的组合。According to some implementation aspects of the present invention, the raw material of the first base film layer further includes 0.2 to 2 parts of auxiliary agents, and the auxiliary agents in the first base film layer include a combination of one or more of antioxidants and ultraviolet absorbers.
进一步地，所述第一底膜层中的所述增粘树脂为氢化石油树脂、松香树脂、氢化松香树脂、萜烯酚醛树脂、萜烯树脂中的一种或多种的组合。Furthermore, the tackifying resin in the first base film layer is a combination of one or more of hydrogenated petroleum resin, rosin resin, hydrogenated rosin resin, terpene phenolic resin, and terpene resin.
进一步地，按重量份计，所述第二底膜层的原料包括基体树脂30～90份、硅微粉5～25份和氧化石墨烯0.01～3份。优选地，按重量份计，所述第二底膜层的原料包括基体树脂50～80份、硅微粉8～20份和氧化石墨烯0.5～2份。Further, by weight, the raw materials of the second bottom film layer include 30-90 parts of base resin, 5-25 parts of silicon powder and 0.01-3 parts of graphene oxide. Preferably, by weight, the raw materials of the second bottom film layer include 50-80 parts of base resin, 8-20 parts of silicon powder and 0.5-2 parts of graphene oxide.
根据本发明的一些实施方面，所述第二底膜层的原料还包括0.2～2份助剂，所述第二底膜层中的所述助剂包括抗氧剂、紫外线吸收剂中的一种或多种的组合。According to some implementation aspects of the present invention, the raw material of the second base film layer further includes 0.2 to 2 parts of auxiliary agents, and the auxiliary agents in the second base film layer include a combination of one or more of antioxidants and ultraviolet absorbers.
根据本发明的一些实施方面，所述第二底膜层中的所述基体树脂包括HDPE(高密度聚乙烯)、LDPE(低密度聚乙烯)、LLDPE(线性低密度聚乙烯)、SIS(苯乙烯一异戊二烯一苯乙烯嵌段共聚物)中的至少一种。所述第二底膜层的使用相比防腐底膜全部采用第一底膜层能够大大降低防腐底膜的成本。According to some implementation aspects of the present invention, the base resin in the second bottom film layer includes at least one of HDPE (high-density polyethylene), LDPE (low-density polyethylene), LLDPE (linear low-density polyethylene), and SIS (styrene-isoprene-styrene block copolymer). Compared with the anti-corrosion bottom film that uses the first bottom film layer entirely, the use of the second bottom film layer can greatly reduce the cost of the anti-corrosion bottom film.
根据本发明的一些实施方面，所述第一底膜层的厚度为10～30μm，所述第二底膜
层的厚度为20～60μm。According to some implementation aspects of the present invention, the thickness of the first base film layer is 10 to 30 μm, and the thickness of the second base film layer is 10 to 30 μm. The thickness of the layer is 20 to 60 μm.
在一些实施方式中，所述第二底膜层采用2层、3层或更多层结构。In some embodiments, the second base film layer has a 2-layer, 3-layer or more layer structure.
根据本发明的一些实施方面，所述高分子防水卷材的原料包括基体树脂和硅微粉，所述高分子防水卷材中所述基体树脂与硅微粉的质量比为1：0.1～2.5。According to some implementation aspects of the present invention, the raw materials of the polymer waterproofing coiled material include base resin and silicon micropowder, and the mass ratio of the base resin to the silicon micropowder in the polymer waterproofing coiled material is 1:0.1-2.5.
在一些实施方式中，所述高分子防水卷材为TPO防水卷材，所述高分子防水卷材的所述基体树脂为TPO和聚丙烯按质量比为1：0.3～7的组合。In some embodiments, the polymer waterproofing membrane is a TPO waterproofing membrane, and the base resin of the polymer waterproofing membrane is a combination of TPO and polypropylene in a mass ratio of 1:0.3 to 7.
在一些实施方式中，所述高分子防水卷材的原料还包括钛白粉，所述高分子防水卷材中所述基体树脂与钛白粉的质量比1：0.2～2.5。In some embodiments, the raw material of the polymer waterproof coiled material further includes titanium dioxide, and the mass ratio of the base resin to the titanium dioxide in the polymer waterproof coiled material is 1:0.2-2.5.
在一些优选且具体实施方式中，按重量份计，所述高分子防水卷材的原料包括基体树脂10～50份、硅微粉5～25份和钛白粉10～25份。优选地，按重量份计，所述TPO防水卷材的原料包括基体树脂25～35份、硅微粉8～20份和钛白粉10～25份。In some preferred and specific embodiments, the raw materials of the polymer waterproofing membrane include 10-50 parts of base resin, 5-25 parts of silicon powder and 10-25 parts of titanium dioxide by weight. Preferably, the raw materials of the TPO waterproofing membrane include 25-35 parts of base resin, 8-20 parts of silicon powder and 10-25 parts of titanium dioxide by weight.
在一些具体实施方式中，所述高分子防水卷材的原料还包括0～30份填料、0.1～2份抗氧剂和0.1～2份紫外线吸收剂。In some specific embodiments, the raw materials of the polymer waterproof coiled material further include 0 to 30 parts of filler, 0.1 to 2 parts of antioxidant and 0.1 to 2 parts of ultraviolet absorber.
进一步地，所述聚丙烯为均聚聚丙烯或聚丙烯-乙烯的共聚物。Furthermore, the polypropylene is homopolypropylene or a polypropylene-ethylene copolymer.
进一步地，所述TPO为乙烯-α-烯烃共聚物，优选为乙烯-丙烯共聚物、乙烯-丁烯共聚物、乙烯-辛烯共聚物中的一种或多种的组合。Furthermore, the TPO is an ethylene-α-olefin copolymer, preferably a combination of one or more of an ethylene-propylene copolymer, an ethylene-butene copolymer, and an ethylene-octene copolymer.
进一步地，所述填料包括但不限于碳酸钙、滑石粉、氢氧化铝、氢氧化镁中的一种或多种的组合。Furthermore, the filler includes but is not limited to a combination of one or more of calcium carbonate, talc, aluminum hydroxide, and magnesium hydroxide.
进一步地，所述高分子防水卷材的厚度为0.2～2.0mm。优选地，所述高分子防水卷材的厚度为0.2～0.4mm。Furthermore, the thickness of the polymer waterproofing coiled material is 0.2 to 2.0 mm. Preferably, the thickness of the polymer waterproofing coiled material is 0.2 to 0.4 mm.
根据本发明的一些实施方面，所述热熔胶膜为多层结构，各层结构的原料分别包括基体树脂和硅微粉，且所述各层结构中的所述基体树脂与硅微粉的质量比为1：0.04～1。According to some implementation aspects of the present invention, the hot melt adhesive film is a multi-layer structure, the raw materials of each layer structure include base resin and silicon powder, and the mass ratio of the base resin to silicon powder in each layer structure is 1:0.04-1.
在一些实施方式中，所述热熔胶膜包括用于与所述金属板粘接的第一胶层、用于与所述高分子防水卷材粘接的第二胶层及设置在所述第一胶层和第二胶层之间的过渡层，其中，In some embodiments, the hot melt adhesive film includes a first adhesive layer for bonding to the metal plate, a second adhesive layer for bonding to the polymer waterproof membrane, and a transition layer disposed between the first adhesive layer and the second adhesive layer, wherein:
所述第一胶层的所述基体树脂为环氧树脂，所述第一胶层中所述基体树脂与硅微粉的质量比为1：0.05～0.45。The matrix resin of the first adhesive layer is epoxy resin, and the mass ratio of the matrix resin to silicon powder in the first adhesive layer is 1:0.05-0.45.
所述过渡层的所述基体树脂为苯氧树脂、乙烯-醋酸乙烯共聚物、马来酸酐接枝
聚烯烃树脂按质量比为1：0.1～3：0.3～4.5的组合，所述过渡层中所述基体树脂与硅微粉的质量比为1：0.04～0.9。The base resin of the transition layer is phenoxy resin, ethylene-vinyl acetate copolymer, maleic anhydride grafted The polyolefin resin is combined in a mass ratio of 1:0.1-3:0.3-4.5, and the mass ratio of the base resin to the silicon powder in the transition layer is 1:0.04-0.9.
所述第二胶层的所述基体树脂为HDPE、LDPE、LLDPE、SEBS、POE中的至少一种，所述第二胶层中所述基体树脂与所述硅微粉的质量比为1：0.05～0.6。The matrix resin of the second adhesive layer is at least one of HDPE, LDPE, LLDPE, SEBS, and POE, and the mass ratio of the matrix resin to the silicon powder in the second adhesive layer is 1:0.05-0.6.
在一些具体实施方式中，所述第一胶层的原料还包括环氧树脂活性稀释剂、环氧树脂潜伏性固化剂和环氧树脂固化促进剂，所述第一胶层中所述基体树脂、环氧树脂活性稀释剂、环氧树脂潜伏性固化剂和环氧树脂固化促进剂的质量比为1：0.06～0.25：0.02～0.15：0.01～0.09。In some specific embodiments, the raw materials of the first adhesive layer also include epoxy resin reactive diluent, epoxy resin latent curing agent and epoxy resin curing accelerator, and the mass ratio of the base resin, epoxy resin reactive diluent, epoxy resin latent curing agent and epoxy resin curing accelerator in the first adhesive layer is 1: 0.06-0.25: 0.02-0.15: 0.01-0.09.
进一步地，按重量份计，所述第一胶层的原料包括基体树脂60～80份、环氧树脂活性稀释剂5～15份、环氧树脂潜伏性固化剂2～8份、环氧树脂固化促进剂1～5份、硅烷偶联剂0.5～2.5份和硅微粉5～25份。优选地，按重量份计，所述第一胶层的原料包括基体树脂60～80份、环氧树脂活性稀释剂5～15份、环氧树脂潜伏性固化剂2～8份、环氧树脂固化促进剂1～5份、硅烷偶联剂0.5～2.5份和硅微粉8～20份。Further, by weight, the raw materials of the first adhesive layer include 60-80 parts of matrix resin, 5-15 parts of epoxy resin reactive diluent, 2-8 parts of epoxy resin latent curing agent, 1-5 parts of epoxy resin curing accelerator, 0.5-2.5 parts of silane coupling agent and 5-25 parts of silicon powder. Preferably, by weight, the raw materials of the first adhesive layer include 60-80 parts of matrix resin, 5-15 parts of epoxy resin reactive diluent, 2-8 parts of epoxy resin latent curing agent, 1-5 parts of epoxy resin curing accelerator, 0.5-2.5 parts of silane coupling agent and 8-20 parts of silicon powder.
在一些具体实施方式中，所述苯氧树脂的重均分子量为40000以上。优选地，所述苯氧树脂重均分子量40000～65000。进一步优选地，所述苯氧树脂的重均分子量为50000～65000。In some specific embodiments, the weight average molecular weight of the phenoxy resin is greater than 40000. Preferably, the weight average molecular weight of the phenoxy resin is 40000 to 65000. More preferably, the weight average molecular weight of the phenoxy resin is 50000 to 65000.
进一步地，按重量份计，所述过渡层的原料包括基体树脂30～125份和硅微粉5～25份。Furthermore, in parts by weight, the raw materials of the transition layer include 30 to 125 parts of base resin and 5 to 25 parts of silicon powder.
在一些优选且具体实施方式中，所述过渡层的原料包括苯氧树脂25～35份、乙烯-醋酸乙烯共聚物10～20份、马来酸酐接枝聚烯烃树脂25～35份和硅微粉8～20份。In some preferred and specific embodiments, the raw materials of the transition layer include 25-35 parts of phenoxy resin, 10-20 parts of ethylene-vinyl acetate copolymer, 25-35 parts of maleic anhydride grafted polyolefin resin and 8-20 parts of silicon powder.
在一些具体实施方式中，所述过渡层的原料还包括0.2～2份助剂，所述过渡层中的所述助剂包括抗氧剂、紫外线吸收剂的中一种或多种的组合。In some specific embodiments, the raw material of the transition layer further includes 0.2 to 2 parts of an auxiliary agent, and the auxiliary agent in the transition layer includes a combination of one or more of an antioxidant and an ultraviolet absorber.
在一些具体实施方式中，所述第二胶层的原料还包括增粘树脂，所述第二胶层中所述基体树脂、增粘树脂的质量比为1：0.1～0.5。In some specific embodiments, the raw material of the second adhesive layer further includes a tackifying resin, and the mass ratio of the base resin to the tackifying resin in the second adhesive layer is 1:0.1-0.5.
进一步地，按重量份计，所述第二胶层的原料包括基体树脂45～90份、增粘树脂10～20份和硅微粉5～25份。优选地，按重量份计，所述第二胶层的原料包括基体树脂45～90份、增粘树脂10～20份和硅微粉8～20份。Further, by weight, the raw materials of the second adhesive layer include 45-90 parts of base resin, 10-20 parts of tackifying resin and 5-25 parts of silicon powder. Preferably, by weight, the raw materials of the second adhesive layer include 45-90 parts of base resin, 10-20 parts of tackifying resin and 8-20 parts of silicon powder.
进一步地，所述第二胶层的原料还包括0.2～2份助剂，所述第二胶层中的所述助剂包括抗氧剂、紫外线吸收剂中的一种或几种的组合。
Furthermore, the raw material of the second adhesive layer further includes 0.2 to 2 parts of an auxiliary agent, and the auxiliary agent in the second adhesive layer includes one or a combination of antioxidants and ultraviolet absorbers.
根据本发明的一些实施方面，所述各层结构的厚度分别选自0.01～0.05mm；和/或，所述金属板为镀锌钢板。According to some implementation aspects of the present invention, the thickness of each layer structure is selected from 0.01 to 0.05 mm; and/or the metal plate is a galvanized steel plate.
根据本发明的一些实施方面，所述金属板为镀锌钢板。According to some implementation aspects of the present invention, the metal plate is a galvanized steel plate.
本发明中，所述TPO是聚烯烃热塑性弹性体；所述SEBS是指苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物；所述POE是指采用茂金属催化剂的乙烯与高碳α－烯烃(1－丁烯、1－己烯、1－辛烯等)实现原位聚合的无规共聚物弹性体。In the present invention, the TPO is a polyolefin thermoplastic elastomer; the SEBS refers to a styrene-ethylene-butylene-styrene block copolymer; and the POE refers to a random copolymer elastomer that is polymerized in situ using a metallocene catalyst with ethylene and a high carbon α-olefin (1-butene, 1-hexene, 1-octene, etc.).
根据本发明的一些实施方面，所述覆膜板的制备方法包括制备防腐底膜的步骤，所述防腐底膜的制备方法包括以下步骤：According to some implementation aspects of the present invention, the method for preparing the film-covered board includes the step of preparing an anti-corrosion base film, and the method for preparing the anti-corrosion base film includes the following steps:
步骤S1、将所述第一底膜层的所有原料加入双螺杆挤出机中，进行挤出造粒，得到第一底膜层料粒；Step S1, adding all the raw materials of the first bottom film layer into a twin-screw extruder, performing extrusion granulation, and obtaining first bottom film layer pellets;
步骤S2、将所述第二底膜层的所有原料加入双螺杆挤出机中，进行挤出造粒，得到第二底膜层料粒；Step S2, adding all the raw materials of the second bottom film layer into a twin-screw extruder, performing extrusion granulation, and obtaining second bottom film layer pellets;
步骤S3、将步骤S1的所述第一底膜层料粒、步骤S2的所述第二底膜层料粒分别加入共挤设备中，共挤复合，得到所述防腐底膜。Step S3, adding the first base film layer pellets of step S1 and the second base film layer pellets of step S2 into co-extrusion equipment respectively, co-extruding and compounding, to obtain the anti-corrosion base film.
进一步地，步骤S1中，所述双螺杆挤出机的挤出温度为170～180℃。Furthermore, in step S1, the extrusion temperature of the twin-screw extruder is 170-180°C.
进一步地，步骤S2中，所述双螺杆挤出机的挤出温度为180～190℃。Furthermore, in step S2, the extrusion temperature of the twin-screw extruder is 180-190°C.
进一步地，步骤S3中，所述共挤设备的共挤模头的温度为175～185℃。Furthermore, in step S3, the temperature of the co-extrusion die of the co-extrusion equipment is 175-185°C.
本发明采取的第二技术方案为：一种上述所述的覆膜板的制备方法，包括使高分子防水卷材、热熔胶膜和金属板依次设置，然后经第一热压粘接在一起，再将防腐底膜复合在所述金属板上，然后经第二热压粘接，得到所述覆膜板。The second technical solution adopted by the present invention is: a method for preparing the above-mentioned film-coated board, comprising arranging a polymer waterproof roll material, a hot melt adhesive film and a metal plate in sequence, and then bonding them together through a first hot pressing process, and then compounding an anti-corrosion base film on the metal plate, and then bonding them through a second hot pressing process to obtain the film-coated board.
进一步地，所述第一热压在温度180～220℃、压力0.3～0.8MPa条件下进行，所述第二热压在140～180℃、压力0.3～0.8MPa条件下进行。Furthermore, the first hot pressing is carried out at a temperature of 180-220° C. and a pressure of 0.3-0.8 MPa, and the second hot pressing is carried out at a temperature of 140-180° C. and a pressure of 0.3-0.8 MPa.
由于上述技术方案运用，本发明与现有技术相比具有下列优点：Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:
本发明的覆膜板在高分子防水卷材和热熔胶膜中均引入硅微粉，同时重新设计防腐底膜的配方，使得覆膜板在背面具有防腐性能的同时覆膜板整体具有导热性能和散热性能，可使外露的高分子防水卷材焊接时产生的热量快速扩散出去，避免较薄厚度的TPO等高分子防水卷材焊接时极易出现的烫皱而导致的焊接不良。此外，本发明的防腐底膜不仅具有导热性能和散热性能，氧化石墨烯在防腐底膜中还能形成致密的物理屏蔽层，延长腐蚀介质的扩散路径，降低腐蚀因子的扩散速率，大大提高防腐底
膜的耐腐蚀性能进而同可外露的TPO等高分子防水卷材一起显著提高覆膜板整体的防腐性能。The film-coated board of the present invention introduces silicon powder into both the polymer waterproofing coil and the hot melt adhesive film, and redesigns the formula of the anti-corrosion base film, so that the film-coated board has anti-corrosion properties on the back and the film-coated board as a whole has thermal conductivity and heat dissipation properties, which can quickly diffuse the heat generated when welding the exposed polymer waterproofing coil, avoiding poor welding caused by wrinkles that are very easy to occur when welding thinner polymer waterproofing coils such as TPO. In addition, the anti-corrosion base film of the present invention not only has thermal conductivity and heat dissipation properties, but graphene oxide can also form a dense physical shielding layer in the anti-corrosion base film, extending the diffusion path of the corrosive medium, reducing the diffusion rate of the corrosion factor, and greatly improving the anti-corrosion base film. The corrosion resistance of the membrane, together with the exposed TPO and other polymer waterproof membranes, significantly improves the overall corrosion resistance of the film-faced board.
如背景技术所述，现有的覆膜板在使用较薄的TPO防水卷材同时还含有防腐底膜时，焊接易出现烫皱破损现象。As described in the background art, when the existing film-faced panels use thinner TPO waterproofing membranes and also contain anti-corrosion base films, the welding process is prone to wrinkling and breakage.
本发明的主要构思在于在高分子防水卷材和热熔胶膜中引入硅微粉，可以快速将焊接时产生的热量扩散出去，较薄的TPO等高分子防水卷材焊接时也不会出现烫皱破损现象。The main idea of the present invention is to introduce silicon powder into the polymer waterproofing membrane and the hot melt adhesive film, which can quickly diffuse the heat generated during welding, and thinner polymer waterproofing membranes such as TPO will not be scalded, wrinkled or damaged during welding.
本发明的进一步构思在于重新设计防腐底膜的配方，使得覆膜板在背面具有防腐性能的同时不会因防腐底膜增加而出现导热不良的现象，整个覆膜板均具有良好的导热和散热性能。A further concept of the present invention is to redesign the formula of the anti-corrosion base film so that the film-coated board has anti-corrosion performance on the back side while not having poor thermal conductivity due to the addition of the anti-corrosion base film, and the entire film-coated board has good thermal conductivity and heat dissipation performance.
此外，本发明发明人还意外发现，在防腐底膜的与金属板粘接的第一底膜层中引入氧化石墨烯，防腐底膜的耐划格后水煮性能有了明显提升。所以，本发明的再进一步构思在于，热熔胶膜选用耐高温的热熔胶膜配合本发明的防腐底膜的使用，使得覆膜板整体具有耐划格后水煮性能。In addition, the inventor of the present invention unexpectedly discovered that by introducing graphene oxide into the first bottom film layer of the anti-corrosion bottom film bonded to the metal plate, the anti-corrosion bottom film has significantly improved its resistance to water boiling after scratching. Therefore, a further conception of the present invention is that the hot melt adhesive film uses a high temperature resistant hot melt adhesive film in combination with the anti-corrosion bottom film of the present invention, so that the entire film-coated board has resistance to water boiling after scratching.
下面结合具体实施例详细说明本发明的技术方案，以便本领域技术人员更好理解和实施本发明的技术方案，但并不因此将本发明限制在所述的实例范围之中。The technical solution of the present invention is described in detail below in conjunction with specific embodiments so that those skilled in the art can better understand and implement the technical solution of the present invention, but the present invention is not limited to the scope of the examples.
以下实施例中采用的原料来源如下：The sources of the raw materials used in the following examples are as follows:
硅微粉选用中国江苏联瑞新材料股份有限公司的结晶硅微粉，D50为5um，白度为95；环氧树脂选用多酚型环氧树脂(具体为中国江苏三木集团的F-51)；环氧树脂活性稀释剂选用苯基缩水甘油醚；环氧树脂潜伏性固化剂选用瑞士汽巴(Ciba Geigy)公司的HT 2844；环氧树脂固化促进剂选用德国阿兹肯公司的UR500；硅烷偶联剂为KH-560；苯氧树脂选用美国亨斯迈公司的PKFE，其重均分子量为60000；马来酸酐接枝聚烯烃树脂选用中国上海佳易容的Fine-Blend的FB19E5；POE选用美国陶氏Engage 8440；SEBS选用美国科腾Kraton G1657；氢化石油树脂选用美国埃克森的5600；LLDPE选用中国吉林石化7042。The silicon micropowder selected is crystalline silicon micropowder produced by Jiangsu Lianrui New Materials Co., Ltd. of China, with D50 of 5um and whiteness of 95; the epoxy resin selected is polyphenol epoxy resin (specifically F-51 produced by Jiangsu Sanmu Group of China); the epoxy resin active diluent selected is phenyl glycidyl ether; the epoxy resin latent curing agent selected is HT 2844 produced by Ciba Geigy of Switzerland; the epoxy resin curing accelerator selected is UR500 produced by Azken of Germany; the silane coupling agent is KH-560; the phenoxy resin selected is PKFE produced by Huntsman of the United States, with a weight average molecular weight of 60,000; the maleic anhydride grafted polyolefin resin selected is FB19E5 produced by Fine-Blend of Shanghai Jiayirong of China; the POE selected is Engage 8440 produced by Dow of the United States; the SEBS selected is Kraton G1657 produced by Kraton of the United States; the hydrogenated petroleum resin selected is 5600 produced by Exxon of the United States; and the LLDPE selected is 7042 produced by Jilin Petrochemical of China.
实施例1Example 1
本实施例提供的覆膜板包括依次设置的防腐底膜、金属板、热熔胶膜和TPO防水卷材。The film-faced board provided in this embodiment includes an anti-corrosion base film, a metal plate, a hot-melt adhesive film and a TPO waterproof membrane which are arranged in sequence.
本例中，TPO防水卷材的原料配方如下：TPO 10份、聚丙烯20份、硅微粉15份
和钛白粉20份，该TPO防水卷材的厚度为0.3mm。In this example, the raw material formula of TPO waterproof membrane is as follows: 10 parts of TPO, 20 parts of polypropylene, 15 parts of silica powder and 20 parts of titanium dioxide, the thickness of the TPO waterproof membrane is 0.3mm.
本例中，热熔胶膜包括用于与金属板粘接的第一胶层、用于与TPO防水卷材粘接的第二胶层及设置在第一胶层和第二胶层之间的过渡层，其中，第一胶层的原料配方如下：环氧树脂70份、环氧树脂活性稀释剂10份、环氧树脂潜伏性固化剂5份、环氧树脂固化促进剂3份、硅烷偶联剂1.5份和硅微粉15份；过渡层的原料配方如下：苯氧树脂30份、EVA 15份、马来酸酐接枝聚乙烯30份、抗氧剂1010 0.5份、紫外吸收剂0.5份和硅微粉15份；第二胶层的原料配方如下：LLDPE 75份、氢化石油树脂15份、硅微粉15份、0.5份抗氧剂和0.5份紫外线吸收剂。In this example, the hot melt adhesive film includes a first adhesive layer for bonding to the metal plate, a second adhesive layer for bonding to the TPO waterproof membrane, and a transition layer arranged between the first adhesive layer and the second adhesive layer, wherein the raw material formula of the first adhesive layer is as follows: 70 parts of epoxy resin, 10 parts of epoxy resin active diluent, 5 parts of epoxy resin latent curing agent, 3 parts of epoxy resin curing accelerator, 1.5 parts of silane coupling agent and 15 parts of silicon micropowder; the raw material formula of the transition layer is as follows: 30 parts of phenoxy resin, 15 parts of EVA, 30 parts of maleic anhydride grafted polyethylene, 0.5 parts of antioxidant 1010, 0.5 parts of ultraviolet absorber and 15 parts of silicon micropowder; the raw material formula of the second adhesive layer is as follows: 75 parts of LLDPE, 15 parts of hydrogenated petroleum resin, 15 parts of silicon micropowder, 0.5 parts of antioxidant and 0.5 parts of ultraviolet absorber.
上述热熔胶膜通过以下方法制备得到：The hot melt adhesive film is prepared by the following method:
步骤(1)，将第一胶层的所有原料在温度70℃左右进行混合60min，得到第一胶层料液；Step (1), mixing all raw materials of the first adhesive layer at a temperature of about 70° C. for 60 minutes to obtain a first adhesive layer liquid;
步骤(2)，将过渡层的所有原料加入双螺杆挤出机中，进行挤出造粒，得到过渡层料粒，其中，挤出温度为150～160℃；Step (2), adding all raw materials of the transition layer into a twin-screw extruder, and performing extrusion granulation to obtain transition layer pellets, wherein the extrusion temperature is 150-160° C.;
步骤(3)，将第二胶层的所有原料加入双螺杆挤出机中，进行挤出造粒，得到第二胶层料粒，其中，挤出温度为160～170℃；Step (3), adding all the raw materials of the second adhesive layer into a twin-screw extruder, extruding and granulating to obtain second adhesive layer pellets, wherein the extrusion temperature is 160-170° C.;
步骤(4)，将第一胶层料液、过渡层料粒、第二胶层料粒分别加入三层压延共挤设备中，进行三层共挤复合得到三层结构的热熔胶膜，其中，第一胶层的胶料的进料螺杆的工作温度控制为90～100℃，过渡层的料粒的进料螺杆的工作温度控制为130～140℃，第二胶料的料粒的进料螺杆的工作温度控制为170～180℃，共挤模头的温度控制为170～180℃，第一胶层的厚度为0.02mm，过渡层的厚度为0.02mm，第二胶层的厚度为0.02mm。Step (4), respectively adding the first adhesive layer liquid, the transition layer pellets, and the second adhesive layer pellets into a three-layer calendering co-extrusion device, and performing three-layer co-extrusion compounding to obtain a three-layer hot melt adhesive film, wherein the working temperature of the feed screw of the adhesive material of the first adhesive layer is controlled to be 90-100°C, the working temperature of the feed screw of the pellets of the transition layer is controlled to be 130-140°C, the working temperature of the feed screw of the pellets of the second adhesive material is controlled to be 170-180°C, the temperature of the co-extrusion die is controlled to be 170-180°C, the thickness of the first adhesive layer is 0.02mm, the thickness of the transition layer is 0.02mm, and the thickness of the second adhesive layer is 0.02mm.
本例中，防腐底膜包括用于与金属板粘接的第一底膜层和设置在第一底膜层上的第二底膜层，其中，第一底膜层的原料配方如下：马来酸酐接枝聚乙烯75份、氢化石油树脂15份、硅微粉15份、氧化石墨烯1份、0.5份抗氧剂和0.5份紫外线吸收剂；第二底膜层的原料配方如下：LLDPE 75份、硅微粉15份、氧化石墨烯1份、抗氧剂0.5份和紫外线吸收剂0.5份。其中，氧化石墨烯选用中国常州第六元素材料科技股份有限公司SE1132。In this example, the anticorrosive base film includes a first base film layer for bonding with a metal plate and a second base film layer disposed on the first base film layer, wherein the raw material formula of the first base film layer is as follows: 75 parts of maleic anhydride grafted polyethylene, 15 parts of hydrogenated petroleum resin, 15 parts of silicon micropowder, 1 part of graphene oxide, 0.5 parts of antioxidant and 0.5 parts of ultraviolet absorber; the raw material formula of the second base film layer is as follows: 75 parts of LLDPE, 15 parts of silicon micropowder, 1 part of graphene oxide, 0.5 parts of antioxidant and 0.5 parts of ultraviolet absorber. Among them, graphene oxide uses SE1132 from Changzhou Sixth Element Material Technology Co., Ltd. of China.
上述防腐底膜通过以下方法制备得到：The above anticorrosive base film is prepared by the following method:
步骤S1、将第一底膜层的所有原料加入双螺杆挤出机中，进行挤出造粒，得到第一底膜层料粒，其中，挤出温度为175℃；
Step S1, adding all the raw materials of the first bottom film layer into a twin-screw extruder, performing extrusion granulation, and obtaining first bottom film layer pellets, wherein the extrusion temperature is 175° C.;
步骤S2、将第二底膜层的所有原料加入双螺杆挤出机中，进行挤出造粒，得到第二底膜层料粒，其中，挤出温度为185℃；Step S2, adding all the raw materials of the second bottom film layer into a twin-screw extruder, performing extrusion granulation, and obtaining second bottom film layer pellets, wherein the extrusion temperature is 185° C.;
步骤S3、将步骤S1的第一底膜层料粒、步骤S2的第二底膜层料粒分别加入三层吹膜共挤设备中，共挤复合，得到三层结构的防腐底膜，其中，模头温度为180℃，第二底膜层为两层结构，且该两层结构材质完全相同，第一底膜层的厚度为20μm，第二底膜层的厚度为40μm。Step S3, respectively add the first bottom film layer pellets of step S1 and the second bottom film layer pellets of step S2 into the three-layer blown film co-extrusion equipment, co-extrude and compound, and obtain a three-layer anti-corrosion bottom film, wherein the die head temperature is 180°C, the second bottom film layer is a two-layer structure, and the two-layer structure is made of exactly the same material, the thickness of the first bottom film layer is 20μm, and the thickness of the second bottom film layer is 40μm.
本例中，金属板采用镀锌钢板，厚度为0.6mm。In this example, the metal plate is a galvanized steel plate with a thickness of 0.6 mm.
该覆膜板通过以下方法制备得到：The film-covered board is prepared by the following method:
将TPO防水卷材、热熔胶膜和金属板在热压温度为200℃、压力为0.6Mpa的条件下热压时间20s，得到半成品，然后将半成品的金属板与防腐底膜复合并在热压温度为150℃、压力为0.6Mpa的条件下热压时间20s，得到覆膜板。The TPO waterproofing membrane, hot melt adhesive film and metal plate are hot pressed at a temperature of 200°C and a pressure of 0.6 MPa for 20 seconds to obtain a semi-finished product, and then the semi-finished metal plate is compounded with the anti-corrosion base film and hot pressed at a temperature of 150°C and a pressure of 0.6 MPa for 20 seconds to obtain a film-coated board.
实施例2Example 2
本实施例提供的覆膜板，基本同实施例1，与实施例1的不同之处在于：The film-covered board provided in this embodiment is basically the same as that in embodiment 1, but differs from embodiment 1 in that:
TPO防水卷材中硅微粉的用量为5份；The amount of silica powder used in TPO waterproof membrane is 5 parts;
热熔胶膜的第一胶层、过渡层、第二胶层中的硅微粉用量分别为5份；The amount of silicon powder in the first adhesive layer, transition layer and second adhesive layer of the hot melt adhesive film is 5 parts respectively;
防腐底膜的第一底膜层、第二底膜层中的硅微粉用量为5份。The amount of silicon powder used in the first base film layer and the second base film layer of the anti-corrosion base film is 5 parts.
防腐底膜的第一底膜层、第二底膜层中的氧化石墨烯的用量为0.05份。The amount of graphene oxide used in the first base film layer and the second base film layer of the anti-corrosion base film is 0.05 parts.
实施例3Example 3
本实施例提供的覆膜板，基本同实施例1，与实施例1的不同之处在于：The film-covered board provided in this embodiment is basically the same as that in embodiment 1, but differs from embodiment 1 in that:
TPO防水卷材中硅微粉的用量为25份；The amount of silica powder used in TPO waterproof membrane is 25 parts;
热熔胶膜的第一胶层、过渡层、第二胶层中的硅微粉用量分别为25份；The amount of silicon powder in the first adhesive layer, transition layer and second adhesive layer of the hot melt adhesive film is 25 parts respectively;
防腐底膜的第一底膜层、第二底膜层中的硅微粉用量为25份。The amount of silicon powder used in the first base film layer and the second base film layer of the anti-corrosion base film is 25 parts.
防腐底膜的第一底膜层、第二底膜层中的氧化石墨烯的用量为3份。The amount of graphene oxide used in the first base film layer and the second base film layer of the anti-corrosion base film is 3 parts.
实施例4Example 4
本实施例提供的覆膜板，基本同实施例1，与实施例1的不同之处在于：The film-covered board provided in this embodiment is basically the same as that in Embodiment 1, but differs from Embodiment 1 in that:
第一底膜层的原料配方如下：马来酸酐接枝聚乙烯50份、氢化石油树脂15份、硅微粉10份、氧化石墨烯1.5份、0.5份抗氧剂和0.5份紫外线吸收剂。The raw material formula of the first base film layer is as follows: 50 parts of maleic anhydride grafted polyethylene, 15 parts of hydrogenated petroleum resin, 10 parts of silicon micropowder, 1.5 parts of graphene oxide, 0.5 parts of antioxidant and 0.5 parts of ultraviolet absorber.
实施例5Example 5
本实施例提供的覆膜板，基本同实施例1，与实施例1的不同之处在于：The film-covered board provided in this embodiment is basically the same as that in embodiment 1, but differs from embodiment 1 in that:
第二底膜层的原料配方如下：LLDPE 50份、硅微粉10份、氧化石墨烯2份、0.5
份抗氧剂和0.5份紫外线吸收剂。The raw material formula of the second bottom film layer is as follows: 50 parts of LLDPE, 10 parts of silicon powder, 2 parts of graphene oxide, 0.5 parts of antioxidant and 0.5 parts of UV absorber.
实施例6Example 6
本实施例提供的覆膜板，基本同实施例1，与实施例1的不同之处在于：防腐底膜中的氧化石墨烯与实施例1的不同，具体为常州第六元素材料科技股份有限公司SE1133。The coated board provided in this embodiment is basically the same as that in Embodiment 1, and the difference from Embodiment 1 is that the graphene oxide in the anti-corrosion base film is different from that in Embodiment 1, specifically SE1133 of Changzhou Sixth Element Materials Technology Co., Ltd.
对比例1Comparative Example 1
本对比例提供的覆膜板，其制备方法基本同实施例1，与实施例1的不同之处在于：防腐底膜的第一底膜层、第二底膜层中均不加氧化石墨烯。The preparation method of the film-covered plate provided in this comparative example is basically the same as that of Example 1, and the difference from Example 1 is that no graphene oxide is added to the first base film layer and the second base film layer of the anti-corrosion base film.
对比例2Comparative Example 2
本对比例提供的覆膜板，其制备方法基本同实施例1，与实施例1的不同之处在于：防腐底膜的第一底膜层、第二底膜层中均不加氧化石墨烯片，而是添加等量的具有阻隔防腐效应的云母鳞片。The preparation method of the film-coated board provided in this comparative example is basically the same as that of Example 1, and the difference from Example 1 is that no graphene oxide sheets are added to the first base film layer and the second base film layer of the anti-corrosion base film, but an equal amount of mica flakes with barrier and anti-corrosion effects are added.
将实施例1～6和对比例1～2的覆膜板进行以下性能测试，结果如表1所示：The following performance tests were performed on the film-covered boards of Examples 1 to 6 and Comparative Examples 1 to 2. The results are shown in Table 1:
划格后水煮测试：将制成的覆膜板参照团标T/CBMCA 017-2020《建筑用覆膜钢板》中的附着力测试方法进行划格，覆膜板的两面均需划格，划成3mm×3mm，然后将划格后的覆膜板按此标准在沸水中水煮48h，观察有无起鼓、脱落现象。同时依据团标T/CBMCA 017-2020《建筑用覆膜钢板》测试了覆膜板常温下的剥离强度。Boiling test after cross-cutting: The finished laminated board was cross-cut according to the adhesion test method in the group standard T/CBMCA 017-2020 "Film-coated steel sheets for construction". Both sides of the laminated board were cross-cut to 3mm×3mm. Then the cross-cut laminated board was boiled in boiling water for 48 hours according to this standard to observe whether there was bulging or falling off. At the same time, the peel strength of the laminated board at room temperature was tested according to the group standard T/CBMCA 017-2020 "Film-coated steel sheets for construction".
焊接性能测试：使用手动热风焊枪进行搭接边焊接，焊接温度为360℃。Welding performance test: Use a manual hot air welding gun to perform overlapping edge welding at a welding temperature of 360°C.
防腐(耐盐雾)性能测试：GB/T 17748-2016。Anti-corrosion (salt spray resistance) performance test: GB/T 17748-2016.
表1 为实施例1～6和对比例1～2的覆膜板的性能测试结果
Table 1 is the performance test results of the film-faced boards of Examples 1 to 6 and Comparative Examples 1 to 2
Table 1 is the performance test results of the film-faced boards of Examples 1 to 6 and Comparative Examples 1 to 2
上述实施例只为说明本发明的技术构思及特点，其目的在于让熟悉此项技术的人士能够了解本发明的内容并据以实施，并不能以此限制本发明的保护范围。凡根据本发明精神实质所作的等效变化或修饰，都应涵盖在本发明的保护范围之内。The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.
在本文中所披露的范围的端点和任何值都不限于该精确的范围或值，这些范围或值应当理解为包含接近这些范围或值的值。对于数值范围来说，各个范围的端点值之间、各个范围的端点值和单独的点值之间，以及单独的点值之间可以彼此组合而得到一个或多个新的数值范围，这些数值范围应被视为在本文中具体公开。
The endpoints and any values of the ranges disclosed in this article are not limited to the precise ranges or values, and these ranges or values should be understood to include values close to these ranges or values. For numerical ranges, the endpoint values of each range, the endpoint values of each range and the individual point values, and the individual point values can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed in this article.
Claims (30)
- 一种覆膜板，包括依次设置的防腐底膜、金属板、热熔胶膜和高分子防水卷材，其特征在于：所述高分子防水卷材、热熔胶膜中分别添加有硅微粉；A film-covered board, comprising an anti-corrosion base film, a metal plate, a hot-melt adhesive film and a polymer waterproof coiled material arranged in sequence, characterized in that silicon micropowder is added to the polymer waterproof coiled material and the hot-melt adhesive film respectively;所述防腐底膜包括用于与所述金属板粘接的第一底膜层和设置在所述第一底膜层上的第二底膜层；The anti-corrosion base film comprises a first base film layer for bonding with the metal plate and a second base film layer arranged on the first base film layer;按重量份计，所述第一底膜层的原料包括马来酸酐接枝聚乙烯50～75份、增粘树脂10～20份、硅微粉10～15份和氧化石墨烯1～1.5份；In parts by weight, the raw materials of the first base film layer include 50 to 75 parts of maleic anhydride grafted polyethylene, 10 to 20 parts of tackifying resin, 10 to 15 parts of silicon micropowder and 1 to 1.5 parts of graphene oxide;按重量份计，所述第二底膜层的原料包括基体树脂50～75份、硅微粉10～15份和氧化石墨烯1～2份；In parts by weight, the raw materials of the second base film layer include 50 to 75 parts of base resin, 10 to 15 parts of silicon powder and 1 to 2 parts of graphene oxide;所述氧化石墨烯的粒径D50为10μm以下、比表面积为180～250m2/g；The graphene oxide has a particle size D50 of less than 10 μm and a specific surface area of 180 to 250 m 2 /g;所述硅微粉的粒径D50为2～8μm。The particle size D50 of the silicon micropowder is 2 to 8 μm.
- 根据权利要求1所述的覆膜板，其特征在于：所述第一底膜层中，所述增粘树脂为氢化石油树脂；所述第二底膜层中，所述基体树脂为线性低密度聚乙烯。The film-covered board according to claim 1 is characterized in that: in the first base film layer, the tackifying resin is hydrogenated petroleum resin; in the second base film layer, the base resin is linear low-density polyethylene.
- 一种覆膜板，包括依次设置的防腐底膜、金属板、热熔胶膜和高分子防水卷材，其特征在于：所述高分子防水卷材、热熔胶膜中分别添加有硅微粉；A film-covered board, comprising an anti-corrosion base film, a metal plate, a hot-melt adhesive film and a polymer waterproof coiled material arranged in sequence, characterized in that silicon micropowder is added to the polymer waterproof coiled material and the hot-melt adhesive film respectively;所述防腐底膜包括用于与所述金属板粘接的第一底膜层和设置在所述第一底膜层上的第二底膜层；The anti-corrosion base film comprises a first base film layer for bonding with the metal plate and a second base film layer arranged on the first base film layer;所述第一底膜层的原料包括马来酸酐接枝聚乙烯、增粘树脂、硅微粉和氧化石墨烯，所述马来酸酐接枝聚乙烯、增粘树脂、硅微粉和氧化石墨烯的质量比为1：0.1～0.5：0.05～0.6：0.0001～0.08；The raw materials of the first base film layer include maleic anhydride grafted polyethylene, tackifying resin, silicon micropowder and graphene oxide, and the mass ratio of maleic anhydride grafted polyethylene, tackifying resin, silicon micropowder and graphene oxide is 1:0.1-0.5:0.05-0.6:0.0001-0.08;所述第二底膜层的原料包括基体树脂、硅微粉和氧化石墨烯，所述第二底膜层中的所述基体树脂、硅微粉、氧化石墨烯的质量比为1：0.05～1：0.0001～0.1。The raw materials of the second base film layer include matrix resin, silicon micropowder and graphene oxide. The mass ratio of the matrix resin, silicon micropowder and graphene oxide in the second base film layer is 1:0.05 to 1:0.0001 to 0.1.
- 根据权利要求3所述的覆膜板，其特征在于：所述硅微粉的粒径D50为2～8μm；和/或，所述氧化石墨烯的粒径D50为10μm以下、比表面积为150～400m2/g。The film-covered plate according to claim 3, characterized in that: the particle size D50 of the silicon powder is 2-8 μm; and/or the particle size D50 of the graphene oxide is less than 10 μm and the specific surface area is 150-400 m 2 /g.
- 根据权利要求4所述的覆膜板，其特征在于：所述氧化石墨烯的比表面积为180～250m2/g。The film-covered plate according to claim 4, characterized in that the specific surface area of the graphene oxide is 180-250 m 2 /g.
- 根据权利要求3所述的覆膜板，其特征在于：按重量份计，所述第一底膜层的原料包括马来酸酐接枝聚乙烯45～90份、增粘树脂10～20份、硅微粉5～25份和氧化石墨烯0.01～3份；和/或， The film-faced board according to claim 3 is characterized in that: in parts by weight, the raw materials of the first base film layer include 45 to 90 parts of maleic anhydride grafted polyethylene, 10 to 20 parts of tackifying resin, 5 to 25 parts of silicon powder and 0.01 to 3 parts of graphene oxide; and/or,按重量份计，所述第二底膜层的原料包括基体树脂30～90份、硅微粉5～25份和氧化石墨烯0.01～3份。In parts by weight, the raw materials of the second base film layer include 30 to 90 parts of base resin, 5 to 25 parts of silicon powder and 0.01 to 3 parts of graphene oxide.
- 根据权利要求6所述的覆膜板，其特征在于：按重量份计，所述第一底膜层的原料包括马来酸酐接枝聚乙烯45～90份、增粘树脂10～20份、硅微粉8～20份和氧化石墨烯0.5～2份；和/或，The film-faced board according to claim 6 is characterized in that: in parts by weight, the raw materials of the first base film layer include 45 to 90 parts of maleic anhydride grafted polyethylene, 10 to 20 parts of tackifying resin, 8 to 20 parts of silicon powder and 0.5 to 2 parts of graphene oxide; and/or,按重量份计，所述第二底膜层的原料包括基体树脂50～80份、硅微粉8～20份和氧化石墨烯0.5～2份。In parts by weight, the raw materials of the second base film layer include 50 to 80 parts of base resin, 8 to 20 parts of silicon micropowder and 0.5 to 2 parts of graphene oxide.
- 根据权利要求3所述的覆膜板，其特征在于：所述第一底膜层中，所述增粘树脂为氢化石油树脂；所述第二底膜层中，所述基体树脂为线性低密度聚乙烯。The film-covered board according to claim 3 is characterized in that: in the first base film layer, the tackifying resin is hydrogenated petroleum resin; in the second base film layer, the base resin is linear low-density polyethylene.
- 根据权利要求3所述的覆膜板，其特征在于：所述高分子防水卷材的原料包括基体树脂和硅微粉，所述高分子防水卷材中所述基体树脂与硅微粉的质量比为1：0.1～2.5。The film-faced board according to claim 3 is characterized in that the raw materials of the polymer waterproof coiled material include base resin and silicon micropowder, and the mass ratio of the base resin to the silicon micropowder in the polymer waterproof coiled material is 1:0.1-2.5.
- 根据权利要求9所述的覆膜板，其特征在于：所述高分子防水卷材为TPO防水卷材，所述高分子防水卷材的所述基体树脂为TPO和聚丙烯按质量比为1：0.3～7的组合；和/或，所述高分子防水卷材的原料还包括钛白粉，所述高分子防水卷材中所述基体树脂与钛白粉的质量比1：0.2～2.5。The film-faced board according to claim 9 is characterized in that: the polymer waterproof coiled material is a TPO waterproof coiled material, the matrix resin of the polymer waterproof coiled material is a combination of TPO and polypropylene in a mass ratio of 1:0.3 to 7; and/or the raw material of the polymer waterproof coiled material also includes titanium dioxide, and the mass ratio of the matrix resin to titanium dioxide in the polymer waterproof coiled material is 1:0.2 to 2.5.
- 根据权利要求10所述的覆膜板，其特征在于：按重量份计，所述高分子防水卷材的原料包括基体树脂10～50份、硅微粉5～25份和钛白粉10～25份。The film-faced board according to claim 10 is characterized in that, in parts by weight, the raw materials of the polymer waterproof coiled material include 10 to 50 parts of base resin, 5 to 25 parts of silicon micropowder and 10 to 25 parts of titanium dioxide.
- 根据权利要求11所述的覆膜板，其特征在于：按重量份计，所述高分子防水卷材的原料包括基体树脂25～35份、硅微粉8～20份和钛白粉10～25份。The film-faced board according to claim 11 is characterized in that, in parts by weight, the raw materials of the polymer waterproof coiled material include 25 to 35 parts of base resin, 8 to 20 parts of silicon powder and 10 to 25 parts of titanium dioxide.
- 根据权利要求11所述的覆膜板，其特征在于：所述高分子防水卷材的原料还包括0～30份填料、0.1～2份抗氧剂和0.1～2份紫外线吸收剂，所述填料为碳酸钙、滑石粉、氢氧化铝、氢氧化镁中的一种或多种的组合。The film-faced board according to claim 11 is characterized in that the raw materials of the polymer waterproof coiled material also include 0 to 30 parts of filler, 0.1 to 2 parts of antioxidant and 0.1 to 2 parts of ultraviolet absorber, and the filler is a combination of one or more of calcium carbonate, talcum powder, aluminum hydroxide and magnesium hydroxide.
- 根据权利要求3～13中任一项所述的覆膜板，其特征在于：所述热熔胶膜为多层结构，各层结构的原料分别包括基体树脂和硅微粉，且所述各层结构中的所述基体树脂与硅微粉的质量比为1：0.04～1。The film-coated board according to any one of claims 3 to 13 is characterized in that the hot melt adhesive film is a multi-layer structure, the raw materials of each layer structure respectively include a matrix resin and silicon micropowder, and the mass ratio of the matrix resin to the silicon micropowder in each layer structure is 1:0.04-1.
- 根据权利要求14所述的覆膜板，其特征在于：所述热熔胶膜包括用于与所述金属板粘接的第一胶层、用于与所述高分子防水卷材粘接的第二胶层及设置在所述第一胶层和第二胶层之间的过渡层，其中， The film-faced plate according to claim 14 is characterized in that: the hot melt adhesive film comprises a first adhesive layer for bonding to the metal plate, a second adhesive layer for bonding to the polymer waterproof membrane, and a transition layer arranged between the first adhesive layer and the second adhesive layer, wherein:所述第一胶层的所述基体树脂为环氧树脂，所述第一胶层中所述基体树脂与硅微粉的质量比为1：0.05～0.45；The matrix resin of the first adhesive layer is epoxy resin, and the mass ratio of the matrix resin to silicon powder in the first adhesive layer is 1:0.05-0.45;所述过渡层的所述基体树脂为苯氧树脂、乙烯-醋酸乙烯共聚物、马来酸酐接枝聚烯烃树脂按质量比为1：0.1～3：0.3～4.5的组合，所述过渡层中所述基体树脂与硅微粉的质量比为1：0.04～0.9；The base resin of the transition layer is a combination of phenoxy resin, ethylene-vinyl acetate copolymer, and maleic anhydride grafted polyolefin resin in a mass ratio of 1:0.1-3:0.3-4.5, and the mass ratio of the base resin to silicon powder in the transition layer is 1:0.04-0.9;所述第二胶层的所述基体树脂为HDPE、LDPE、LLDPE、SEBS、POE中的至少一种，所述第二胶层中所述基体树脂与所述硅微粉的质量比为1：0.05～0.6。The matrix resin of the second adhesive layer is at least one of HDPE, LDPE, LLDPE, SEBS, and POE, and the mass ratio of the matrix resin to the silicon powder in the second adhesive layer is 1:0.05-0.6.
- 根据权利要求15所述的覆膜板，其特征在于：所述第一胶层的原料还包括环氧树脂活性稀释剂、环氧树脂潜伏性固化剂和环氧树脂固化促进剂，所述第一胶层中所述基体树脂、环氧树脂活性稀释剂、环氧树脂潜伏性固化剂和环氧树脂固化促进剂的质量比为1：0.06～0.25：0.02～0.15：0.01～0.09；和/或，The film-coated board according to claim 15 is characterized in that: the raw materials of the first adhesive layer also include epoxy resin reactive diluent, epoxy resin latent curing agent and epoxy resin curing accelerator, and the mass ratio of the matrix resin, epoxy resin reactive diluent, epoxy resin latent curing agent and epoxy resin curing accelerator in the first adhesive layer is 1: 0.06-0.25: 0.02-0.15: 0.01-0.09; and/or,所述苯氧树脂的重均分子量为40000以上；和/或，The weight average molecular weight of the phenoxy resin is greater than 40,000; and/or,所述第二胶层的原料还包括增粘树脂，所述第二胶层中所述基体树脂、增粘树脂的质量比为1：0.1～0.5。The raw material of the second adhesive layer further includes a tackifying resin, and the mass ratio of the base resin to the tackifying resin in the second adhesive layer is 1:0.1-0.5.
- 根据权利要求16所述的覆膜板，其特征在于：按重量份计，所述第一胶层的原料包括基体树脂60～80份、环氧树脂活性稀释剂5～15份、环氧树脂潜伏性固化剂2～8份、环氧树脂固化促进剂1～5份、硅烷偶联剂0.5～2.5份和硅微粉8～20份；和/或，The film-faced board according to claim 16 is characterized in that: in parts by weight, the raw materials of the first adhesive layer include 60 to 80 parts of matrix resin, 5 to 15 parts of epoxy resin reactive diluent, 2 to 8 parts of epoxy resin latent curing agent, 1 to 5 parts of epoxy resin curing accelerator, 0.5 to 2.5 parts of silane coupling agent and 8 to 20 parts of silicon powder; and/or,按重量份计，所述过渡层的原料包括苯氧树脂25～35份、乙烯-醋酸乙烯共聚物10～20份、马来酸酐接枝聚烯烃树脂25～35份和硅微粉8～20份；和/或，In parts by weight, the raw materials of the transition layer include 25-35 parts of phenoxy resin, 10-20 parts of ethylene-vinyl acetate copolymer, 25-35 parts of maleic anhydride grafted polyolefin resin and 8-20 parts of silicon powder; and/or,按重量份计，所述第二胶层的原料包括基体树脂45～90份、增粘树脂10～20份、硅微粉8～20份。In parts by weight, the raw materials of the second adhesive layer include 45 to 90 parts of base resin, 10 to 20 parts of tackifying resin, and 8 to 20 parts of silicon powder.
- 根据权利要求14所述的覆膜板，其特征在于：所述各层结构的厚度分别选自0.01～0.05mm；和/或，所述金属板为镀锌钢板。The film-coated plate according to claim 14 is characterized in that: the thickness of each layer structure is selected from 0.01 to 0.05 mm; and/or the metal plate is a galvanized steel plate.
- 根据权利要求3所述的覆膜板，其特征在于：所述第一底膜层的原料还包括助剂，所述第一底膜层中的所述助剂包括抗氧剂、紫外线吸收剂中的一种或多种的组合；和/或，The film-covered board according to claim 3 is characterized in that: the raw material of the first base film layer further includes an additive, and the additive in the first base film layer includes a combination of one or more of an antioxidant and an ultraviolet absorber; and/or,所述第二底膜层的原料还包括助剂，所述第二底膜层中的所述助剂包括抗氧剂、紫外线吸收剂中的一种或多种的组合；和/或， The raw material of the second base film layer further includes an auxiliary agent, and the auxiliary agent in the second base film layer includes a combination of one or more of an antioxidant and an ultraviolet absorber; and/or,所述第二底膜层中的所述基体树脂包括HDPE、LDPE、LLDPE、SIS中的至少一种；和/或，The base resin in the second bottom film layer includes at least one of HDPE, LDPE, LLDPE and SIS; and/or,所述第一底膜层中的所述增粘树脂为氢化石油树脂、松香树脂、氢化松香树脂、萜烯酚醛树脂、萜烯树脂中的一种或多种的组合；和/或，The tackifying resin in the first base film layer is a combination of one or more of hydrogenated petroleum resin, rosin resin, hydrogenated rosin resin, terpene phenolic resin, and terpene resin; and/or,所述第一底膜层的厚度为10～30μm，所述第二底膜层的厚度为20～60μm；和/或，The thickness of the first base film layer is 10 to 30 μm, and the thickness of the second base film layer is 20 to 60 μm; and/or,所述高分子防水卷材的厚度为0.2～2.0mm。The thickness of the polymer waterproof coiled material is 0.2-2.0 mm.
- 根据权利要求3～13、19中任一项所述的覆膜板，其特征在于，其中所述防腐底膜通过包括以下步骤的制备方法制备得到：The film-covered plate according to any one of claims 3 to 13 and 19, characterized in that the anti-corrosion base film is prepared by a preparation method comprising the following steps:步骤S1、将所述第一底膜层的所有原料加入双螺杆挤出机中，进行挤出造粒，得到第一底膜层料粒；Step S1, adding all the raw materials of the first bottom film layer into a twin-screw extruder, performing extrusion granulation, and obtaining first bottom film layer pellets;步骤S2、将所述第二底膜层的所有原料加入双螺杆挤出机中，进行挤出造粒，得到第二底膜层料粒；Step S2, adding all the raw materials of the second bottom film layer into a twin-screw extruder, performing extrusion granulation, and obtaining second bottom film layer pellets;步骤S3、将步骤S1的所述第一底膜层料粒、步骤S2的所述第二底膜层料粒分别加入共挤设备中，共挤复合，得到所述防腐底膜。Step S3, adding the first base film layer pellets of step S1 and the second base film layer pellets of step S2 into co-extrusion equipment respectively, co-extruding and compounding, to obtain the anti-corrosion base film.
- 一种权利要求3～20中任一项所述的覆膜板的制备方法，其特征在于：包括使高分子防水卷材、热熔胶膜和金属板依次设置，然后经第一热压粘接在一起，再将防腐底膜复合在所述金属板上，然后经第二热压粘接，得到所述覆膜板。A method for preparing a film-coated board as claimed in any one of claims 3 to 20, characterized in that it comprises arranging a polymer waterproof coil, a hot melt adhesive film and a metal plate in sequence, and then bonding them together through a first hot pressing process, and then compounding an anti-corrosion base film on the metal plate, and then bonding them through a second hot pressing process to obtain the film-coated board.
- 根据权利要求21所述的覆膜板的制备方法，其特征在于：所述第一热压在温度180～220℃、压力0.3～0.8MPa条件下进行，所述第二热压在140～180℃、压力0.3～0.8MPa条件下进行。The method for preparing a film-coated board according to claim 21 is characterized in that the first hot pressing is carried out at a temperature of 180 to 220°C and a pressure of 0.3 to 0.8 MPa, and the second hot pressing is carried out at a temperature of 140 to 180°C and a pressure of 0.3 to 0.8 MPa.
- 一种覆膜板用防腐底膜，所述覆膜板具有金属板，其特征在于：所述防腐底膜包括用于与所述金属板粘接的第一底膜层和设置在所述第一底膜层上的第二底膜层；An anti-corrosion base film for a film-covered plate, the film-covered plate having a metal plate, characterized in that: the anti-corrosion base film comprises a first base film layer for bonding to the metal plate and a second base film layer arranged on the first base film layer;所述第一底膜层的原料包括马来酸酐接枝聚乙烯、增粘树脂、硅微粉和氧化石墨烯，所述马来酸酐接枝聚乙烯、增粘树脂、硅微粉和氧化石墨烯的质量比为1：0.1～0.5：0.05～0.6：0.0001～0.08；The raw materials of the first base film layer include maleic anhydride grafted polyethylene, tackifying resin, silicon micropowder and graphene oxide, and the mass ratio of maleic anhydride grafted polyethylene, tackifying resin, silicon micropowder and graphene oxide is 1:0.1-0.5:0.05-0.6:0.0001-0.08;所述第二底膜层的原料包括基体树脂、硅微粉和氧化石墨烯，所述第二底膜层中的所述基体树脂、硅微粉、氧化石墨烯的质量比为1：0.05～1：0.0001～0.1。The raw materials of the second base film layer include matrix resin, silicon micropowder and graphene oxide. The mass ratio of the matrix resin, silicon micropowder and graphene oxide in the second base film layer is 1:0.05 to 1:0.0001 to 0.1.
- 根据权利要求23所述的覆膜板用防腐底膜，其特征在于：所述硅微粉的粒 径D50为2～8μm；和/或，所述氧化石墨烯的粒径D50为10μm以下、比表面积为150～400m2/g。The anti-corrosion base film for film-covered boards according to claim 23 is characterized in that: the particle size of the silicon powder is The diameter D50 is 2 to 8 μm; and/or the particle diameter D50 of the graphene oxide is less than 10 μm and the specific surface area is 150 to 400 m 2 /g.
- 根据权利要求24所述的覆膜板用防腐底膜，其特征在于：所述氧化石墨烯的比表面积为180～250m2/g。The anticorrosive base film for film-faced plywood according to claim 24, wherein the specific surface area of the graphene oxide is 180 to 250 m 2 /g.
- 根据权利要求23所述的覆膜板用防腐底膜，其特征在于：按重量份计，所述第一底膜层的原料包括马来酸酐接枝聚乙烯45～90份、增粘树脂10～20份、硅微粉5～25份和氧化石墨烯0.01～3份；和/或，The anticorrosive base film for film-faced plywood according to claim 23, characterized in that: in parts by weight, the raw materials of the first base film layer include 45 to 90 parts of maleic anhydride grafted polyethylene, 10 to 20 parts of tackifying resin, 5 to 25 parts of silicon micropowder and 0.01 to 3 parts of graphene oxide; and/or,按重量份计，所述第二底膜层的原料包括基体树脂30～90份、硅微粉5～25份和氧化石墨烯0.01～3份。In parts by weight, the raw materials of the second base film layer include 30 to 90 parts of base resin, 5 to 25 parts of silicon powder and 0.01 to 3 parts of graphene oxide.
- 根据权利要求26所述的覆膜板用防腐底膜，其特征在于：按重量份计，所述第一底膜层的原料包括马来酸酐接枝聚乙烯45～90份、增粘树脂10～20份、硅微粉8～20份和氧化石墨烯0.5～2份；和/或，The anticorrosive base film for film-faced plywood according to claim 26, characterized in that: in parts by weight, the raw materials of the first base film layer include 45 to 90 parts of maleic anhydride grafted polyethylene, 10 to 20 parts of tackifying resin, 8 to 20 parts of silicon powder and 0.5 to 2 parts of graphene oxide; and/or,按重量份计，所述第二底膜层的原料包括基体树脂50～80份、硅微粉8～20份和氧化石墨烯0.5～2份。In parts by weight, the raw materials of the second base film layer include 50 to 80 parts of base resin, 8 to 20 parts of silicon micropowder and 0.5 to 2 parts of graphene oxide.
- 根据权利要求23所述的覆膜板用防腐底膜，其特征在于：所述第一底膜层的原料还包括助剂，所述第一底膜层中的所述助剂包括抗氧剂、紫外线吸收剂中的一种或多种的组合；和/或，The anticorrosive base film for film-faced plywood according to claim 23 is characterized in that: the raw material of the first base film layer also includes an additive, and the additive in the first base film layer includes a combination of one or more of an antioxidant and an ultraviolet absorber; and/or,所述第二底膜层的原料还包括助剂，所述第二底膜层中的所述助剂包括抗氧剂、紫外线吸收剂中的一种或多种的组合；和/或，The raw material of the second base film layer further includes an auxiliary agent, and the auxiliary agent in the second base film layer includes a combination of one or more of an antioxidant and an ultraviolet absorber; and/or,所述第二底膜层中的所述基体树脂包括HDPE、LDPE、LLDPE、SIS中的至少一种；和/或，The base resin in the second bottom film layer includes at least one of HDPE, LDPE, LLDPE, and SIS; and/or,所述第一底膜层中的所述增粘树脂为氢化石油树脂、松香树脂、氢化松香树脂、萜烯酚醛树脂、萜烯树脂中的一种或多种的组合；和/或，The tackifying resin in the first base film layer is a combination of one or more of hydrogenated petroleum resin, rosin resin, hydrogenated rosin resin, terpene phenolic resin, and terpene resin; and/or,所述第一底膜层的厚度为10～30μm，所述第二底膜层的厚度为20～60μm。The thickness of the first base film layer is 10 to 30 μm, and the thickness of the second base film layer is 20 to 60 μm.
- 根据权利要求23所述的覆膜板用防腐底膜，其特征在于：所述覆膜板还包括设置在所述金属板上的高分子防水卷材，所述高分子防水卷材中添加有硅微粉。The anti-corrosion base film for the film-covered plywood according to claim 23 is characterized in that: the film-covered plywood also includes a polymer waterproof coiled material arranged on the metal plate, and silicon micropowder is added to the polymer waterproof coiled material.
- 一种权利要求23～29中任一项所述的覆膜板用防腐底膜的制备方法，其特征在于，所述防腐底膜的制备方法包括以下步骤：A method for preparing an anti-corrosion base film for a film-faced plate according to any one of claims 23 to 29, characterized in that the method for preparing the anti-corrosion base film comprises the following steps:步骤S1、将所述第一底膜层的所有原料加入双螺杆挤出机中，进行挤出造粒， 得到第一底膜层料粒；Step S1, adding all the raw materials of the first bottom film layer into a twin-screw extruder for extrusion granulation, Obtaining first bottom film layer pellets;步骤S2、将所述第二底膜层的所有原料加入双螺杆挤出机中，进行挤出造粒，得到第二底膜层料粒；Step S2, adding all the raw materials of the second bottom film layer into a twin-screw extruder, performing extrusion granulation, and obtaining second bottom film layer pellets;步骤S3、将步骤S1的所述第一底膜层料粒、步骤S2的所述第二底膜层料粒分别加入共挤设备中，共挤复合，得到所述防腐底膜。 Step S3, adding the first base film layer pellets of step S1 and the second base film layer pellets of step S2 into co-extrusion equipment respectively, co-extruding and compounding, to obtain the anti-corrosion base film.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211479135.1 | 2022-11-24 | ||
| CN202211479135.1A CN115570864B (en) | 2022-11-24 | 2022-11-24 | Multifunctional film-coated plate and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2024109437A1 true WO2024109437A1 (en) | 2024-05-30 |
Family
ID=84590154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2023/127054 WO2024109437A1 (en) | 2022-11-24 | 2023-10-27 | Multifunctional film-coated plate and preparation method therefor, and anti-corrosion bottom film |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN115570864B (en) |
| WO (1) | WO2024109437A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115570864B (en) * | 2022-11-24 | 2023-03-31 | 江苏凯伦建材股份有限公司 | Multifunctional film-coated plate and preparation method thereof |
| CN118082315A (en) * | 2024-04-29 | 2024-05-28 | 江苏凯伦建材股份有限公司 | Laminated metal plate, preparation method and roof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11162724A (en) * | 1997-11-27 | 1999-06-18 | Nkk Corp | Manufacture of electromagnetic steel plate for bonded iron core excellent in bonding strength, anticorrosion, and blocking resistance |
| CN104385740A (en) * | 2014-11-13 | 2015-03-04 | 无锡中洁能源技术有限公司 | Anti-corrosion anti-aging substrate for solar battery back membrane and preparation method of substrate |
| CN108342028A (en) * | 2018-01-31 | 2018-07-31 | 北京军秀咨询有限公司 | A kind of energy conservation and environmental protection polymer membranes and preparation method thereof |
| CN108546459A (en) * | 2018-04-03 | 2018-09-18 | 佛山科学技术学院 | A kind of environmentally friendly Waterproof corrosion high-performance coating and preparation method |
| CN109910414A (en) * | 2019-02-28 | 2019-06-21 | 安徽省奥佳建材有限公司 | A kind of polymer membranes and its production technology |
| CN215551623U (en) * | 2021-04-16 | 2022-01-18 | 江阴海美金属新材料有限公司 | High corrosion-resistant nano film-coated plate |
| CN115044311A (en) * | 2022-08-17 | 2022-09-13 | 江苏凯伦建材股份有限公司 | High-temperature-resistant hot-melt adhesive film, preparation method thereof and film-coated plate |
| CN115570864A (en) * | 2022-11-24 | 2023-01-06 | 江苏凯伦建材股份有限公司 | Multifunctional film-coated plate and preparation method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203129447U (en) * | 2013-04-12 | 2013-08-14 | 于天功 | Waterproof roll for steel structure surface |
| CN205167730U (en) * | 2015-11-12 | 2016-04-20 | 广东澳洋顺昌金属材料有限公司 | Tectorial membrane metal sheet |
| CN205573168U (en) * | 2016-03-25 | 2016-09-14 | 青岛海尔智能技术研发有限公司 | High -efficient samming device based on graphite alkene heat conduction membrane technology |
| CN107053806B (en) * | 2017-03-29 | 2019-01-22 | 江阴海美金属新材料有限公司 | A kind of environment protection type corrosion resistant single-layer PET colorful covering membrane steel plate |
| CN217711881U (en) * | 2022-06-14 | 2022-11-01 | 江苏凯伦建材股份有限公司 | Roof renovating structure |
-
2022
- 2022-11-24 CN CN202211479135.1A patent/CN115570864B/en active Active
-
2023
- 2023-10-27 WO PCT/CN2023/127054 patent/WO2024109437A1/en unknown
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11162724A (en) * | 1997-11-27 | 1999-06-18 | Nkk Corp | Manufacture of electromagnetic steel plate for bonded iron core excellent in bonding strength, anticorrosion, and blocking resistance |
| CN104385740A (en) * | 2014-11-13 | 2015-03-04 | 无锡中洁能源技术有限公司 | Anti-corrosion anti-aging substrate for solar battery back membrane and preparation method of substrate |
| CN108342028A (en) * | 2018-01-31 | 2018-07-31 | 北京军秀咨询有限公司 | A kind of energy conservation and environmental protection polymer membranes and preparation method thereof |
| CN108546459A (en) * | 2018-04-03 | 2018-09-18 | 佛山科学技术学院 | A kind of environmentally friendly Waterproof corrosion high-performance coating and preparation method |
| CN109910414A (en) * | 2019-02-28 | 2019-06-21 | 安徽省奥佳建材有限公司 | A kind of polymer membranes and its production technology |
| CN215551623U (en) * | 2021-04-16 | 2022-01-18 | 江阴海美金属新材料有限公司 | High corrosion-resistant nano film-coated plate |
| CN115044311A (en) * | 2022-08-17 | 2022-09-13 | 江苏凯伦建材股份有限公司 | High-temperature-resistant hot-melt adhesive film, preparation method thereof and film-coated plate |
| CN115570864A (en) * | 2022-11-24 | 2023-01-06 | 江苏凯伦建材股份有限公司 | Multifunctional film-coated plate and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115570864B (en) | 2023-03-31 |
| CN115570864A (en) | 2023-01-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2024109437A1 (en) | Multifunctional film-coated plate and preparation method therefor, and anti-corrosion bottom film | |
| US6855432B1 (en) | Low activation temperature adhesive composition with high peel strength and cohesive failure | |
| TW201127628A (en) | Photovoltaic modules with polypropylene based backsheet | |
| WO2001018141A1 (en) | Low activation temperature adhesive composition with high peel strength and cohesive failure | |
| WO2015046017A1 (en) | Multilayered sheet for solar battery, sealing material-integrated back face protection sheet for solar battery, and solar battery module | |
| WO2008085238A2 (en) | Process for producing multi-layer structures having improved metal adhesion | |
| JP6841001B2 (en) | Sealant adhesive and lid film | |
| AU2008226762B2 (en) | Metallized films | |
| CN114672257B (en) | Anti-grid-scratching poached hot-melt adhesive film, preparation method thereof and film laminated plate | |
| CN115044311A (en) | High-temperature-resistant hot-melt adhesive film, preparation method thereof and film-coated plate | |
| JP2012001661A (en) | Adhesive resin composition for polyolefin multilayered film, method for producing adhesive resin composition for polyolefin multilayered film, polyolefin multilayered film, metal deposition film, and water-based coating agent for olefin film | |
| CA2392455A1 (en) | Laminating film and laminate | |
| JP6705181B2 (en) | Adhesives, films and lids for polyethylene terephthalate containers | |
| CN202242207U (en) | Biaxially oriented polypropylene film and composite material thereof | |
| JP7445104B2 (en) | Hot melt adhesive for solar cell backsheets, laminates, and solar cell backsheets | |
| JP4438108B2 (en) | Ethylene polymer composition and easy-open sealing material using the same | |
| JP2003213485A (en) | Masking tape for metal plating | |
| CN114654849B (en) | Polyolefin waterproof sheet and preparation method and application thereof | |
| WO2022270468A1 (en) | Multilayer sheet and production method therefor | |
| WO2023189774A1 (en) | Adhesive film, metal terminal using same, and secondary battery | |
| WO2024135571A1 (en) | Multilayer sheet | |
| JP2001096690A (en) | Exterior building material | |
| JP2023074575A (en) | Adhesive resin composition and laminate | |
| CN115873519A (en) | Adhesive film for aluminum honeycomb panel, preparation method of adhesive film, aluminum honeycomb panel and application of adhesive film | |
| EP4371769A1 (en) | Heat-fusible laminated film |