WO2024080335A1 - Procédé de production d'un composant électronique et composant électronique - Google Patents

Procédé de production d'un composant électronique et composant électronique Download PDF

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Publication number
WO2024080335A1
WO2024080335A1 PCT/JP2023/037079 JP2023037079W WO2024080335A1 WO 2024080335 A1 WO2024080335 A1 WO 2024080335A1 JP 2023037079 W JP2023037079 W JP 2023037079W WO 2024080335 A1 WO2024080335 A1 WO 2024080335A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
curable composition
composition layer
adhesive portion
electronic
Prior art date
Application number
PCT/JP2023/037079
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English (en)
Japanese (ja)
Inventor
佳史 杉沢
貴志 渡邉
満 谷川
翔 長野
Original Assignee
積水化学工業株式会社
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Publication of WO2024080335A1 publication Critical patent/WO2024080335A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves

Definitions

  • the present invention relates to a method for manufacturing an electronic component using a curable composition, and to the electronic component.
  • air cavities are formed using sheet materials such as photosensitive polyimide resin sheets and epoxy resin sheets (for example, see Patent Document 1 below).
  • the object of the present invention is to provide a new method for manufacturing electronic components that can improve the sealing of the air cavity. It is also an object of the present invention to provide electronic components that can improve the sealing of the air cavity.
  • This specification discloses the following electronic component manufacturing method and electronic component.
  • Item 1 A method for manufacturing an electronic component, comprising the steps of mounting at least one electronic component on a circuit board, applying a liquid curable composition at 23°C to the top surface of the circuit board to form a curable composition layer, and curing the curable composition layer to form an adhesive portion, wherein in the step of forming the curable composition layer, the curable composition layer is formed so as to contact at least a portion of the side surface of the electronic component, and an air cavity is formed by the circuit board, the electronic component, and the adhesive portion.
  • Item 2 The method for producing an electronic component according to Item 1, in which the electronic components are multiple, the multiple electronic components are mounted on the circuit board at intervals in the step of mounting the electronic components, and the curable composition layer is formed in such a way that the multiple electronic components do not contact at least a portion of the side of the electronic components in the portion where the multiple electronic components are adjacent to each other in the step of forming the curable composition layer.
  • Item 3 The method for producing an electronic component according to Item 1, wherein in the step of forming the curable composition layer, the curable composition layer is formed over the entire periphery of the electronic component so as to contact the side surface of the electronic component.
  • Item 4 The method for manufacturing an electronic component according to any one of items 1 to 3, wherein in the step of forming the curable composition layer, the curable composition layer is formed so as to contact the side surface of the electronic component from the upper end to the lower end.
  • Item 5 The method for manufacturing an electronic component according to any one of items 1 to 4, wherein in the step of forming the curable composition layer, the curable composition layer is formed so as to contact the edge of the upper surface of the electronic component.
  • Item 6 The method for manufacturing an electronic component according to any one of items 1 to 5, wherein in the step of forming the curable composition layer, the curable composition layer is formed so as not to come into contact with the lower surface of the electronic component.
  • Item 7 The method for manufacturing an electronic component according to any one of items 1 to 6, wherein the step of forming the adhesive portion includes a step of photocuring the curable composition layer to form the adhesive portion.
  • Item 8 The method for manufacturing an electronic component according to any one of items 1 to 7, wherein the step of forming the adhesive portion includes a step of photocuring the curable composition layer to obtain a B-staged material layer, and a step of thermally curing the B-staged material layer to form the adhesive portion.
  • Item 9 The method for manufacturing an electronic component according to Item 8, wherein the step of forming the adhesive portion includes a step of photocuring the curable composition layer to obtain a multi-layer B-staged material layer each time multiple drops or one drop of the curable composition is applied, and a step of thermally curing the multi-layer B-staged material layer to form a multi-layer adhesive portion.
  • Item 10 The method for manufacturing an electronic component according to any one of items 1 to 9, further comprising a step of sealing the upper and side surfaces of the adhesive portion with resin.
  • Item 11 The method for producing an electronic component according to any one of items 1 to 10, wherein in the step of forming the curable composition layer, the curable composition is applied by an inkjet method.
  • An electronic component comprising a circuit board, at least one electronic component, and an adhesive portion, wherein the at least one electronic component is mounted on the circuit board, the adhesive portion is a cured product of a curable composition that is liquid at 23°C, the adhesive portion is in contact with the upper surface of the circuit board and at least a part of the side surface of the electronic component, and an air cavity is formed by the circuit board, the electronic component, and the adhesive portion.
  • Item 13 The electronic component according to item 12, in which the electronic components are multiple, the multiple electronic components are mounted on the circuit board with a gap between them, and the adhesive portion does not contact at least a portion of the side of the electronic components in the portion where the multiple electronic components are adjacent to each other.
  • Item 14 The electronic component according to item 12, wherein the adhesive portion contacts the side surface of the electronic component over the entire periphery of the electronic component.
  • Item 15 An electronic component according to any one of items 12 to 14, in which the adhesive portion is in contact with an edge portion of the upper surface of the electronic member.
  • Item 16 An electronic component according to any one of items 12 to 15, in which the adhesive portion is not in contact with the bottom surface of the electronic member.
  • Item 17 An electronic component according to any one of items 12 to 16, in which the height of the adhesive portion is 1 ⁇ m or more and 300 ⁇ m or less.
  • Item 18 The electronic component according to any one of items 12 to 17, wherein the curable composition contains an epoxy compound, a (meth)acrylate compound, or a silicone compound.
  • Item 19 An electronic component according to any one of items 12 to 18, wherein the electronic component is a semiconductor chip, a capacitor, or a light-emitting element.
  • Item 20 An electronic component according to any one of items 12 to 19, wherein the electronic component is a surface acoustic wave filter, a bulk acoustic wave filter, or a film acoustic resonator filter.
  • the method for manufacturing an electronic component according to the present invention includes the steps of mounting at least one electronic component on a circuit board, applying a liquid curable composition at 23°C to the upper surface of the circuit board to form a curable composition layer, and curing the curable composition layer to form an adhesive portion.
  • the curable composition layer in the step of forming the curable composition layer, is formed so as to contact at least a portion of the side surface of the electronic component.
  • an air cavity is formed by the circuit board, the electronic component, and the adhesive portion.
  • the electronic component according to the present invention comprises a circuit board, at least one electronic component, and an adhesive part.
  • the adhesive part is a cured product of a curable composition that is liquid at 23°C.
  • the adhesive part is in contact with the upper surface of the circuit board and at least a portion of the side surface of the electronic component.
  • an air cavity is formed by the circuit board, the electronic component, and the adhesive part. Since the electronic component according to the present invention has the above configuration, the sealing of the air cavity can be improved.
  • FIG. 1A is a plan view that illustrates an electronic component according to a first embodiment of the present invention
  • FIG. 1B is a cross-sectional view that illustrates the electronic component
  • FIG. 2 is a cross-sectional view illustrating an electronic component according to a second embodiment of the present invention
  • FIG. 3 is a cross-sectional view illustrating an electronic component according to a third embodiment of the present invention.
  • 4A and 4B are cross-sectional views for explaining each step of the method for manufacturing the electronic component shown in FIG. 5C and 5D are cross-sectional views for explaining each step of the method for manufacturing the electronic component shown in FIG. 6(e) and 6(f) are cross-sectional views for explaining each step of the method for manufacturing the electronic component shown in FIG. FIG.
  • FIG. 7G is a cross-sectional view for explaining each step of the method for manufacturing the electronic component shown in FIG. 8A and 8B are diagrams for explaining the formation areas of adhesive portions for electronic components.
  • 9A and 9B are diagrams for explaining modified examples of the formation area of the adhesive portion for the electronic member.
  • the inventors conducted extensive research to solve the above problems and found that the electronic component and manufacturing method for an electronic component according to the present invention significantly improves the air cavity sealability, particularly by forming an adhesive joint using a curable composition that is liquid at 23°C.
  • the air cavity sealability is significantly improved compared to when an adhesive joint is formed using a curable sheet.
  • the molding material is less likely to penetrate into the air cavity when molding and sealing.
  • the electronic component according to the present invention includes a circuit board, at least one electronic member, and an adhesive portion.
  • at least one electronic member is mounted on the circuit board.
  • the adhesive portion is a cured product of a curable composition that is liquid at 23°C.
  • the adhesive portion is in contact with an upper surface of the circuit board and at least a portion of a side surface of the electronic member.
  • an air cavity is formed by the circuit board, the electronic member, and the adhesive portion.
  • the method for manufacturing an electronic component according to the present invention comprises the following steps (1) to (3): (1) Mounting at least one electronic component on a circuit board. (2) Applying a liquid curable composition at 23°C to the upper surface of the circuit board to form a curable composition layer. (3) Curing the curable composition layer to form an adhesive portion.
  • the curable composition layer is formed so as to contact at least a portion of the side surface of the electronic component.
  • an air cavity is formed by the circuit board, the electronic component, and the adhesive portion.
  • FIG. 1(a) is a plan view that shows a schematic diagram of an electronic component according to a first embodiment of the present invention
  • FIG. 1(b) is a cross-sectional view that shows a schematic diagram of the electronic component.
  • FIG. 1(b) is a cross-sectional view taken along line I-I in FIG. 1(a).
  • the 1 includes a circuit board 1, an electronic component 2, an adhesive portion 3, and a molded resin portion 44.
  • the electronic component 2 includes a solder ball 41, a resin sheet 42, and a connection terminal 43 (not shown in FIG. 1(a)).
  • one electronic component 2 is mounted.
  • the electronic component 10 there is one electronic component 2.
  • the adhesive portion 3 is a cured product of a curable composition that is liquid at 23°C.
  • the adhesive portion 3 is a photo- and heat-cured product of the curable composition.
  • the adhesive portion 3 is in contact with the upper surface of the circuit board 1 and a part of the side surface of the electronic component 2.
  • the adhesive portion 3 is in contact with a part of the upper surface of the circuit board 1, and is in contact with a part of the side surface and the entire upper surface of the electronic component 2.
  • the adhesive portion 3 is not in contact with the lower surface of the electronic component 2.
  • the adhesive portion 3 bonds the upper surface of the circuit board 1 to the side surface and upper surface of the electronic component 2.
  • the adhesive portion 3 is disposed on the upper surface of the circuit board 1.
  • the adhesive portion 3 is disposed on the side of the electronic component 2 and on the top surface of the electronic component 2.
  • the adhesive portion 3 is disposed on part of the top surface of the circuit board 1, and on part of the side and the entire top surface of the electronic component 2.
  • the adhesive portion 3 is not disposed on the bottom surface of the electronic component 2.
  • An air cavity R is formed by the circuit board 1, the electronic component 2, and the adhesive portion 3.
  • the molded resin portion 44 is disposed on the top and side surfaces of the adhesive portion 3.
  • the air cavity R is highly sealed. Furthermore, in the present invention, the molding material (the material of the molded resin portion) is less likely to penetrate into the air cavity R.
  • FIG. 2 is a cross-sectional view showing a schematic diagram of an electronic component according to a second embodiment of the present invention.
  • the electronic component 11 shown in FIG. 2 includes a circuit board 1, multiple electronic components 2, adhesive portions 3, and a molded resin portion 44.
  • Multiple electronic components 2 are mounted in the electronic component 11.
  • the multiple electronic components 2 are mounted on the circuit board 1 with spaces between them.
  • the adhesive portions 3 do not contact the side surfaces of the electronic components 2 in the portion where the multiple electronic components 2 are adjacent.
  • the adhesive portions 3 are not disposed in the gaps between adjacent electronic components 2.
  • the adhesive portions 3 are not disposed on the side surfaces of the electronic components 2 between adjacent electronic components 2.
  • the adhesive portion 3 is in contact with the upper surface of the circuit board 1 and a part of the side surface of the electronic component 2.
  • the adhesive portion 3 is in contact with a part of the upper surface of the circuit board 1, and is in contact with a part of the side surface and the entire upper surface of the electronic component 2.
  • the adhesive portion 3 is not in contact with the lower surface of the electronic component 2.
  • the adhesive portion 3 bonds the upper surface of the circuit board 1 to the side and upper surface of the electronic component 2.
  • the adhesive portion 3 is disposed on the upper surface of the circuit board 1.
  • the adhesive portion 3 is disposed on the side surface of the electronic component 2 and is also disposed on the upper surface of the electronic component 2.
  • the adhesive portion 3 is disposed on a part of the upper surface of the circuit board 1, and is disposed on a part of the side surface and the entire upper surface of the electronic component 2.
  • the adhesive portion 3 is not disposed on the lower surface of the electronic component 2.
  • An air cavity R is formed by the circuit board 1, the electronic component 2, and the adhesive portion 3.
  • the molded resin portion 44 is disposed on the upper surface and side of the adhesive portion 3.
  • the sealing performance of the air cavity R is quite high. Furthermore, in the present invention, the molding material (the material of the molded resin portion) is less likely to penetrate into the air cavity R.
  • FIG. 3 is a cross-sectional view showing a schematic diagram of an electronic component according to a third embodiment of the present invention.
  • the electronic component 12 shown in FIG. 3 differs from the electronic component 10 shown in FIG. 1 only in the configuration of the adhesive portion 3.
  • the adhesive portion 3 contacts the side of the electronic member 2 (excluding the solder balls 41) from the upper end to the lower end.
  • the air cavity R is highly sealed. Furthermore, in the present invention, the molding material (the material of the molded resin portion) is less likely to penetrate into the air cavity R.
  • the adhesive portion may or may not be in contact with the upper surface of the electronic member. In the electronic component, the adhesive portion may or may not be disposed on the upper surface of the electronic member. In addition, in the electronic component, the adhesive portion may or may not be in contact with the lower surface of the electronic member. In addition, in the electronic component, the adhesive portion may or may not be disposed on the lower surface of the electronic member.
  • electronic member 2 is a semiconductor chip.
  • Electronic components 10, 11, and 12, and electronic component 10X described below, are communication filters.
  • FIGS. 4(a) and 4(b) are cross-sectional views for explaining each step of the method for manufacturing the electronic component shown in FIG. 1.
  • FIGS. 5(c) and 5(d) are cross-sectional views for explaining each step of the method for manufacturing the electronic component shown in FIG. 1.
  • FIGS. 6(e) and 6(f) are cross-sectional views for explaining each step of the method for manufacturing the electronic component shown in FIG. 1.
  • FIG. 7(g) is a cross-sectional view for explaining each step of the method for manufacturing the electronic component shown in FIG. 1.
  • FIGS. 4-7(a)-(g) show a series of steps in the method for manufacturing the electronic component shown in FIG. 1.
  • a liquid curable composition is applied to the upper surface (front surface) of the circuit board 1 at 23° C. using an inkjet device to form a curable composition layer 3A (application process).
  • the curable composition is applied to the upper surface of the circuit board 1 to form a curable composition layer 3A.
  • the curable composition is ejected from the ejection section 51 of the inkjet device.
  • the curable composition layer 3A is cured to form the adhesive portion 3.
  • the curable composition layer 3A is irradiated with light from the light irradiation section 52 of the inkjet device to advance the curing of the curable composition layer 3A and form a B-staged material layer 3B (photocuring step).
  • the B-staged material layer 3B is a preliminary cured material layer of the above-mentioned curable composition.
  • the curable composition may be applied to a specific region, and then the entire applied curable composition may be irradiated with light to form a B-staged product layer.
  • the applied curable composition may be irradiated with light every time multiple drops of the curable composition are applied to form a B-staged product layer.
  • the applied curable composition may be irradiated with light every time one drop of the curable composition is applied to form a B-staged product layer. That is, the applied curable composition may be irradiated with light to form a B-staged product layer every time multiple drops or one drop of the curable composition are applied. Therefore, the curable composition layer may be photocured every time multiple drops or one drop of the curable composition are applied to obtain multiple B-staged product layers.
  • the curable composition layer 3A in the step of forming the curable composition layer 3A (coating step), the curable composition layer 3A is formed so as to contact at least a portion of the side surface of the electronic component 2, and in the step of forming the B-stage compound layer 3B (photo-curing step), the B-stage compound layer 3B is formed so as to contact at least a portion of the side surface of the electronic component 2 (see FIG. 6(e)).
  • the photocuring step it is determined whether or not to repeat the coating step and the photocuring step. If the coating step and the photocuring step are repeated, the curable composition is applied to the surface side of the formed B-stage material layer opposite the circuit board side.
  • FIG. 5(c) and FIG. 5(d) are diagrams showing the second coating step and the second photocuring step, respectively.
  • the above-mentioned curable composition is applied to the surface of the B-staged material layer 3B opposite the circuit board 1 side using an inkjet device, and a curable composition layer 3A is formed on the surface of the B-staged material layer 3B.
  • the applied curable composition layer 3A is irradiated with light from the light irradiation section 52 of the inkjet device to form the B-staged material layer 3B.
  • the coating step and the photocuring step are performed twice in the thickness direction of the curable composition layer, in Figures 4(a) and 4(b) and Figures 5(c) and 5(d).
  • the coating step and the photocuring step may each be performed two or more times, or three or more times.
  • a B-stage compound layer 3B is formed in contact with the side surface of the electronic component 2, as shown in FIG. 6(e).
  • a B-stage compound layer 3B is formed in contact with the side surface and top surface of the electronic component 2.
  • the B-staged material layer 3B is thermally cured by heating (thermal curing process).
  • the laminated structure including the circuit board 1, electronic component 2, and B-staged material layer 3B obtained in FIG. 6(e) is heated to thermally cure the B-staged material layer 3B.
  • the adhesive portion 3 is a photo- and thermo-cured layer of the curable composition.
  • the upper and side surfaces of the adhesive portion 3 are sealed with resin.
  • Resin is placed on the upper and side surfaces of the adhesive portion 3 to form a molded resin portion 44.
  • FIGS. 8(a) and 8(b) are diagrams for explaining the formation area of the adhesive portion on the electronic component.
  • FIG. 8(b) is a diagram taken along line I-I in FIG. 8(a).
  • the formation area of the adhesive portion 3 is indicated by diagonal lines.
  • adhesive portion 3 contacts all of the side surfaces of electronic component 2.
  • adhesive portion 3 contacts the side surfaces of electronic component 2 over the entire periphery of electronic component 2.
  • FIGS. 9(a) and 9(b) are diagrams for explaining modified examples of the formation area of the adhesive portion on the electronic component.
  • FIG. 9(b) is a diagram taken along line I-I in FIG. 9(a).
  • the formation area of the adhesive portion 3X is indicated by diagonal lines.
  • adhesive portion 3X is in contact with part of the side surface of electronic component 2, and is in contact with part of the side surface of the periphery of electronic component 2.
  • electronic component 10X there is an area on the side surface of electronic component 2 where adhesive portion 3X is not located.
  • the above-mentioned method for producing an electronic component it is preferable to apply the above-mentioned curable composition by an inkjet method in the above-mentioned (2) step of forming a curable composition layer (coating step). From the viewpoint of further improving the air cavity sealability, in the above-mentioned method for producing an electronic component, it is preferable to apply the above-mentioned curable composition by an inkjet device in the above-mentioned (2) step of forming a curable composition layer (coating step).
  • the adhesive portion may be in contact with the side surface of the electronic component over the entire periphery of the electronic component, or may be in contact with only a portion of the side surface of the periphery of the electronic component.
  • the adhesive portion contacts the side of the electronic component over the entire periphery of the electronic component (see, for example, FIG. 8(b)). From the viewpoint of further enhancing the sealing of the air cavity, when there is one electronic component, it is preferable that the adhesive portion contacts all of the side surfaces of the electronic component. From the viewpoint of further enhancing the sealing of the air cavity, when there are multiple electronic components, it is preferable that the adhesive portion contacts the side of the electronic component over the entire periphery of the assembly of the electronic components.
  • the sealing of the air cavity may be ensured even if the adhesive portion does not contact the side surface of the electronic component over the entire periphery of the electronic component.
  • the adhesive portion may contact only a portion of the side surface of the periphery of the electronic component (see, for example, FIG. 9(b)).
  • the adhesive portion may contact a portion of the side surface of the electronic component.
  • the adhesive portion may contact a portion of the side surface of the periphery of the assembly of electronic components.
  • the adhesive portion is preferably in contact with the entire vertical direction of the side surface of the electronic component.
  • the curable composition layer is preferably formed so as to be in contact with the entire vertical direction of the side surface of the electronic component.
  • the curable composition layer is preferably formed so as to be in contact with the entire vertical direction of the side surface of the electronic component.
  • the curable composition is preferably applied from the upper end to the lower end of the side surface of the electronic component.
  • "from the top to the bottom of the side of the electronic component” means from the top to the bottom of the side of the electronic component excluding the solder balls.
  • the adhesive portion may be in contact with a portion of the side surface of the electronic member, or may be in contact with the entire side surface of the electronic member. From the viewpoint of more effectively exerting the effects of the present invention, it is preferable that the adhesive portion be in contact with the entire side surface of the electronic member in the electronic component. From the viewpoint of further improving the sealing property of the air cavity, it is preferable that in the manufacturing method of the electronic component, in the step (2) of forming a curable composition layer (coating step), the curable composition layer is formed so as to be in contact with the entire side surface of the electronic member. From the viewpoint of further improving the sealing property of the air cavity, it is preferable that in the manufacturing method of the electronic component, in the step (2) of forming a curable composition layer (coating step), the curable composition is coated on the entire side surface of the electronic member.
  • the adhesive portion contacts at least a portion of all side surfaces of the electronic component, more preferably contacts all side surfaces of the electronic component from the top to the bottom, and even more preferably contacts the entirety of all side surfaces of the electronic component. In these cases, the effects of the present invention can be exerted even more effectively.
  • the multiple electronic components are mounted on the circuit board with a gap between them.
  • the gap between the electronic components is not particularly limited.
  • the gap between the electronic components may be 50 ⁇ m or more, 100 ⁇ m or more, 500 ⁇ m or less, or 300 ⁇ m or less.
  • the adhesive portion does not contact at least a part of the side of the electronic components in the portion where the multiple electronic components are adjacent. From the viewpoint of further enhancing the sealing property of the air cavity, when there are multiple electronic components, it is preferable that the adhesive portion is not arranged on at least a part of the side of the electronic components between adjacent electronic components, and it is preferable that the adhesive portion is not arranged on at least a part of the side of the electronic components in the portion where the multiple electronic components are adjacent.
  • the side of the electronic components in the portion where the multiple electronic components are adjacent has a part that is not in contact with the adhesive portion.
  • the adhesive portion does not contact the side between the electronic components in the portion where the multiple electronic components are adjacent.
  • the adhesive portion is not disposed in the gap between adjacent electronic components, and is preferably not disposed on the side surface of the electronic components in the portion where multiple electronic components are adjacent to each other.
  • the electronic components include a plurality of electronic components, that the plurality of electronic components are mounted on the circuit board at intervals, and that the adhesive portion does not contact at least a portion of the side of the electronic components in the portion where the plurality of electronic components are adjacent to each other.
  • the adhesive portion contacts at least a portion of each side of the electronic components over the entire periphery of the assembly of electronic components, more preferably contacts each side from the top to the bottom, and even more preferably contacts the entirety of each side. In these cases, the sealing of the air cavity can be further improved.
  • the electronic components are multiple, and that the multiple electronic components are mounted on the circuit board with a gap therebetween in the step (1) of mounting the electronic components (mounting step).
  • the curable composition layer is formed in the step (2) of forming a curable composition layer (coating step) so that the curable composition layer does not contact at least a portion of the side surface of the electronic components in the portion where the multiple electronic components are adjacent to each other.
  • the curable composition is not applied to at least a portion of the side surface of the electronic components in the portion where the multiple electronic components are adjacent to each other in the step (2) of forming a curable composition layer (coating step). In these cases, the sealing of the air cavity can be further improved.
  • the adhesive portion contacts the edge of the upper surface of the electronic member, and it is more preferable that the adhesive portion contacts the entire upper surface of the electronic member.
  • the curable composition layer is formed so as to contact the edge of the upper surface of the electronic member in the step (2) of forming the curable composition layer (coating step).
  • the curable composition is applied to the edge of the upper surface of the electronic member in the step (2) of forming the curable composition layer (coating step), and it is more preferable that the curable composition is applied to the entire upper surface of the electronic member.
  • the edge of the upper surface of the electronic member is a part (edge) located on the upper surface of the electronic member, and is different from a part located on the side of the electronic member.
  • the adhesive portion may contact an area of 5 ⁇ m extending inward from the edge of the top surface of the electronic component, or an area of 1000 ⁇ m extending inward from the edge of the top surface of the electronic component. It is preferable that the edge of the top surface of the electronic component is an area of 5 ⁇ m to 1000 ⁇ m extending inward from the edge of the top surface of the electronic component.
  • the adhesive portion does not contact the lower surface of the electronic member.
  • the curable composition layer is formed so as not to contact the lower surface of the electronic member.
  • the curable composition is not coated on the lower surface of the electronic member.
  • the above-mentioned (3) step of forming an adhesive part it is preferable to photo-cure the curable composition, and more preferably photo-cure and heat-cure. From the viewpoint of further improving the air cavity sealing property, in the above-mentioned (3) step of forming an adhesive part (curing step), it is preferable to cure the curable composition by irradiation with light and heating. From the viewpoint of further improving the air cavity sealing property, in the above-mentioned (3) step of forming an adhesive part (curing step), it is preferable to include a step of photo-cure the curable composition layer to form the adhesive part (photo-cure step). When the curable composition layer is photo-cure to form the adhesive part, heat curing may be performed after photo-cure.
  • the above-mentioned (3) step of forming an adhesive portion includes a step of photocuring the curable composition layer to obtain a B-staged product layer (photocuring step), and a step of thermally curing the B-staged product layer to obtain a cured product (adhesive portion) of the curable composition layer (thermal curing step).
  • the sealing property of the air cavity can be further improved.
  • the above-mentioned (3) step of forming an adhesive portion includes a step of photocuring the curable composition layer to obtain a multi-layered B-staged material layer each time one or more drops of the curable composition are applied (photocuring step), and a step of thermally curing the multi-layered B-staged material layer to form a multi-layered adhesive portion (thermal curing step).
  • the adhesive portion can be formed with high precision, and the effects of the present invention can be effectively achieved.
  • the process of obtaining a multi-layer B-staged material layer is performed by repeatedly applying multiple or one drop of the curable composition and photo-curing the curable composition layer.
  • the application and photo-curing are repeated in the thickness direction of the curable composition layer (thickness direction of the resulting multi-layer B-staged material layer) to form a multi-layer B-staged material layer.
  • the process of obtaining a multi-layer B-staged material layer is the following process.
  • a process of applying multiple or one drop of the curable composition and photo-curing the first curable composition layer to obtain a first B-staged material layer (lower B-staged material layer) is performed.
  • a process of applying multiple or one drop of the curable composition on the first B-staged material layer (lower B-staged material layer) and photo-curing the second curable composition layer (upper B-staged material layer) is performed to obtain a second B-staged material layer.
  • n times n is an integer of 2 or more
  • n layers n in total
  • the final nth operation is a process of applying multiple drops or one drop of the curable composition onto the (n-1)th B-staged material layer, and photocuring the nth curable composition layer to obtain the nth B-staged material layer.
  • thermocuring process After the photocuring process for obtaining multiple B-staged material layers, a process of forming a multilayer adhesive portion (thermal curing process) is performed.
  • the process of forming a multilayer adhesive portion is a process of thermally curing n B-staged material layers to form n adhesive portions.
  • ultraviolet light is preferably irradiated.
  • the illuminance and irradiation time of the ultraviolet light in the photocuring step can be appropriately changed depending on the composition of the curable composition and the coating thickness of the curable composition.
  • the illuminance of the ultraviolet light in the photocuring step may be, for example, 1000 mW/cm 2 or more, 5000 mW/cm 2 or more, 10000 mW/cm 2 or less, or 8000 mW/cm 2 or less.
  • the irradiation time of the ultraviolet light in the photocuring step may be, for example, 0.01 seconds or more, 0.1 seconds or more, 400 seconds or less, or 100 seconds or less.
  • the illuminance of the ultraviolet light in the photocuring step may be 1000 mW/cm 2 or more and 10000 mW/cm 2 or less.
  • the irradiation time of the ultraviolet light in the photocuring step may be 0.01 seconds or more and 100 seconds or less.
  • the heating temperature and heating time in the heat curing process can be changed as appropriate depending on the composition of the curable composition and the thickness of the B-staged product layer.
  • the heating temperature in the heat curing process may be, for example, 100°C or higher, 120°C or higher, 250°C or lower, or 200°C or lower.
  • the heating time in the heat curing process may be, for example, 5 minutes or higher, 30 minutes or higher, 600 minutes or lower, or 300 minutes or lower.
  • the electronic component may or may not have a molded resin portion.
  • the upper and side surfaces of the adhesive portion may or may not be sealed with resin.
  • the method for manufacturing an electronic component further includes (4) a step of sealing the upper and side surfaces of the adhesive portion with resin (resin sealing step).
  • the method for manufacturing an electronic component further includes (4) a step of sealing with resin (resin sealing step) of disposing resin on the upper and side surfaces of the adhesive portion to form a molded resin portion.
  • the above resins include epoxy resins, acrylic resins, phenolic resins, silicone resins, and fluororesins. From the viewpoint of further improving the sealing properties of the air cavity, the above resins are preferably epoxy resins, acrylic resins, or phenolic resins, and more preferably epoxy resins or acrylic resins.
  • the ratio (height/width) of the height of the adhesive portion to the width of the adhesive portion is preferably 1.0 or more, more preferably 1.5 or more, even more preferably 2.0 or more, and particularly preferably 2.5 or more.
  • the upper limit of the ratio (height/width) is not particularly limited.
  • the ratio (height/width) of the adhesive portion may be 100 or less, 50 or less, 10 or less, or 5.0 or less. From the viewpoint of miniaturizing the resulting electronic component, it is preferable that the ratio (height/width) is 5.0 or less.
  • the width, height, shape, etc. of the adhesive part can be changed as appropriate.
  • the width of the adhesive portion is preferably the width of the adhesive portion at the contact surface between the surface of the circuit board and the adhesive portion. At the contact surface between the surface of the circuit board and the adhesive portion, the width of the adhesive portion may be 50 ⁇ m or more, 100 ⁇ m or more, 150 ⁇ m or more, 250 ⁇ m or less, 230 ⁇ m or less, or 200 ⁇ m or less.
  • the height of the adhesive portion is preferably the distance from the contact surface between the surface of the circuit board and the adhesive portion to the maximum height position of the adhesive portion.
  • the distance from the contact surface between the surface of the circuit board and the adhesive portion to the maximum height position of the adhesive portion is preferably 1 ⁇ m or more, more preferably 10 ⁇ m or more, even more preferably 50 ⁇ m or more, and is preferably 300 ⁇ m or less, more preferably 250 ⁇ m or less, even more preferably 200 ⁇ m or less.
  • the adhesive part may be multi-layered, and when the adhesive part is multi-layered, the thickness of each layer is preferably 5 ⁇ m or more, more preferably 10 ⁇ m or more, even more preferably 30 ⁇ m or more, and preferably 300 ⁇ m or less, more preferably 200 ⁇ m or less, even more preferably 100 ⁇ m or less.
  • the circuit board is a substrate having a circuit pattern on its surface.
  • the above electronic components include semiconductor chips, capacitors, and light-emitting elements.
  • the above-mentioned semiconductor chips include surface acoustic wave filters, bulk acoustic wave filters, and film acoustic resonator filters.
  • the light-emitting element may be a light-emitting diode, a semiconductor laser, etc.
  • the electronic component is preferably a semiconductor chip, a capacitor, or a light-emitting element, more preferably a semiconductor chip, and even more preferably a surface acoustic wave filter, a bulk acoustic wave filter, or a film acoustic resonator filter.
  • the curable composition is a liquid curable composition at 23° C.
  • the viscosity of the curable composition at 23° C. and 10 rpm is preferably 3 mPa ⁇ s or more, more preferably 5 mPa ⁇ s or more, even more preferably 10 mPa ⁇ s or more, still more preferably 160 mPa ⁇ s or more, and is preferably 2000 mPa ⁇ s or less, more preferably 1600 mPa ⁇ s or less, and still more preferably 1500 mPa ⁇ s or less.
  • the above viscosity is measured at 23°C using an E-type viscometer (for example, "TVE22L” manufactured by Toki Sangyo Co., Ltd.) in accordance with JIS K2283.
  • E-type viscometer for example, "TVE22L” manufactured by Toki Sangyo Co., Ltd.
  • the above-mentioned curable composition is preferably applied by an inkjet method.
  • the above-mentioned curable composition is preferably applied by an inkjet device.
  • the above curable composition can be used to bond a circuit board and an electronic component, and can also form an air cavity.
  • the above curable composition can be used to manufacture an electronic component having an air cavity.
  • the above curable composition is preferably a curable composition used to bond the upper surface of the circuit board and the side surface of the electronic component, and more preferably a curable composition used to bond the upper surface of the circuit board and the side and upper surface of the electronic component.
  • the above-mentioned curable composition is preferably used by curing it through irradiation with light and heating.
  • the above-mentioned curable composition is preferably used by curing it through irradiation with light and then curing it through heating.
  • the above-mentioned curable composition is preferably photocurable, preferably thermosetting, and more preferably photocurable and thermosetting.
  • the curable composition preferably contains a photocurable compound (a curable compound that can be cured by irradiation with light), and more preferably contains a photocurable compound and a thermosetting compound (a curable compound that can be cured by heating).
  • a photocurable compound a curable compound that can be cured by irradiation with light
  • a thermosetting compound a curable compound that can be cured by heating
  • (meth)acryloyl refers to “acryloyl” or “methacryloyl”
  • (meth)acrylate refers to "acrylate” or “methacrylate”.
  • the CH 2 ⁇ CH group of the (meth)acryloyl group is not included in the vinyl group.
  • the curable composition preferably contains (A) a photocurable compound.
  • the (A) photocurable compound has a photocurable functional group. Examples of the photocurable functional group include a (meth)acryloyl group and a vinyl group.
  • the (A) photocurable compound may have a (meth)acryloyl group, a vinyl group, or both a (meth)acryloyl group and a vinyl group. Only one type of (A) photocurable compound may be used, or two or more types may be used in combination.
  • the photocurable compound does not have a thermosetting functional group, which will be described later.
  • the photocurable compound preferably has a (meth)acryloyl group or a vinyl group, and more preferably has a (meth)acryloyl group.
  • the photocurable compound is preferably a (meth)acrylate compound.
  • the (A) photocurable compound may be a monofunctional (meth)acrylate compound or a polyfunctional (meth)acrylate compound.
  • the (A) photocurable compound may be a bifunctional (meth)acrylate compound, a bifunctional or higher (meth)acrylate compound, a trifunctional (meth)acrylate compound, a trifunctional or higher (meth)acrylate compound, or a tetrafunctional or higher (meth)acrylate compound.
  • the (A) photocurable compound may be a 20 or lower functional (meth)acrylate compound, a 10 or lower functional (meth)acrylate compound, or a 5 or lower functional (meth)acrylate compound.
  • the functionality corresponds to the number of (meth)acryloyl groups. Only one type of (A) photocurable compound may be used, or two or more types may be used in combination.
  • the photocurable compound may have one (meth)acryloyl group, may have two, may have two or more, may have three, may have three or more, may have four or more, may have 20 or less, may have 10 or less, or may have 5 or less.
  • the above-mentioned monofunctional (meth)acrylate compounds include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, i-propyl (meth)acrylate, n-butyl (meth)acrylate, i-butyl (meth)acrylate, sec-butyl (meth)acrylate, t-butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, allyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, phenyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 2-phenoxyeth
  • the above bifunctional (meth)acrylate compounds include 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanedi(meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 2,4-dimethyl-1,5-pentanediol di(meth)acrylate, butyl ethyl propanediol (meth)acrylate, ethoxylated cyclohexanemethanol di(meth)acrylate, ethoxylated bisphenone.
  • di(meth)acrylates examples include aryl di(meth)acrylate, polyethylene glycol di(meth)acrylate, oligoethylene glycol di(meth)acrylate, ethylene glycol di(meth)acrylate, 2-ethyl-2-butylbutanediol di(meth)acrylate, 2-ethyl-2-butylpropanediol di(meth)acrylate, tricyclodecane di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, urethane (meth)acrylate, and dipropylene glycol di(meth)acrylate.
  • trifunctional (meth)acrylate compounds include trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, alkylene oxide-modified tri(meth)acrylate of trimethylolpropane, pentaerythritol tri(meth)acrylate, dipentaerythritol tri(meth)acrylate, trimethylolpropane tri((meth)acryloyloxypropyl)ether, alkylene oxide-modified tri(meth)acrylate of isocyanuric acid, dipentaerythritol propionate tri(meth)acrylate, tri((meth)acryloyloxyethyl)isocyanurate, and sorbitol tri(meth)acrylate.
  • tetrafunctional (meth)acrylate compounds include pentaerythritol tetra(meth)acrylate, sorbitol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, and dipentaerythritol propionate tetra(meth)acrylate.
  • pentafunctional (meth)acrylate compounds examples include sorbitol penta(meth)acrylate and dipentaerythritol penta(meth)acrylate.
  • hexafunctional (meth)acrylate compounds include dipentaerythritol hexa(meth)acrylate, sorbitol hexa(meth)acrylate, and alkylene oxide-modified hexa(meth)acrylate of phosphazene.
  • Examples of the (A) photocurable compound having a vinyl group include vinyl ethers, ethylene derivatives, styrene, chloromethylstyrene, ⁇ -methylstyrene, maleic anhydride, dicyclopentadiene, N-vinylpyrrolidone, and N-vinylformamide.
  • the content of the photocurable compound (A) is preferably 2% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, and particularly preferably 15% by weight or more.
  • the content of the photocurable compound (A) is preferably 80% by weight or less, more preferably 70% by weight or less, even more preferably 65% by weight or less, even more preferably 60% by weight or less, even more preferably 50% by weight or less, and particularly preferably 40% by weight or less.
  • the content of the photocurable compound (A) is equal to or more than the lower limit and equal to or less than the upper limit, the effects of the present invention can be exhibited even more effectively.
  • the curable composition may contain (C) a photo- and heat-curable compound, which will be described later.
  • the content of (A) the photo-curable compound in 100% by weight of the curable composition is preferably 2% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, preferably 65% by weight or less, more preferably 60% by weight or less, and even more preferably 55% by weight or less.
  • the content of (A) the photo-curable compound is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be exhibited even more effectively.
  • the content of (A) the photo-curable compound in 100% by weight of the curable composition is preferably 5% by weight or more, more preferably 10% by weight or more, even more preferably 20% by weight or more, preferably 55% by weight or less, more preferably 45% by weight or less, and even more preferably 35% by weight or less.
  • the content of (A) the photo-curable compound is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be exhibited even more effectively.
  • the curable composition preferably contains a thermosetting compound (B).
  • the thermosetting compound (B) has a thermosetting functional group. Examples of the thermosetting functional group include a cyclic ether group and a thiirane group.
  • the thermosetting compound (B) may have a cyclic ether group, a thiirane group, or both a cyclic ether group and a thiirane group.
  • the thermosetting compound (B) may be used alone or in combination of two or more kinds.
  • the cyclic ether group may be an epoxy group, an oxetanyl group, or the like.
  • the epoxy group may be a part of a glycidyl group, or may be an epoxy group in a glycidyl group.
  • thermosetting compound does not have the above-mentioned photocurable functional group.
  • thermosetting compound (B) has a cyclic ether group, and it is more preferable that the compound has an epoxy group. From the viewpoint of exerting the effects of the present invention more effectively, it is preferable that the thermosetting compound (B) is an epoxy compound.
  • the above epoxy compounds include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, phenol novolac type epoxy compounds, biphenyl type epoxy compounds, biphenyl novolac type epoxy compounds, biphenol type epoxy compounds, naphthalene type epoxy compounds, fluorene type epoxy compounds, phenol aralkyl type epoxy compounds, naphthol aralkyl type epoxy compounds, dicyclopentadiene type epoxy compounds, anthracene type epoxy compounds, epoxy compounds having an adamantane skeleton, epoxy compounds having a tricyclodecane skeleton, naphthylene ether type epoxy compounds, and epoxy compounds having a triazine nucleus in the skeleton.
  • thermosetting compound having a thiirane group can be obtained by converting the epoxy group of the epoxy compound having an epoxy group to a thiirane group.
  • a preferred method for converting to the thiirane group is to continuously or intermittently add a solution containing the epoxy compound having an epoxy group to a first solution containing a sulfurizing agent, and then continuously or intermittently add a second solution containing a sulfurizing agent. This method allows the epoxy group to be converted to a thiirane group.
  • thermosetting compound (B) may be a maleimide compound, a styrene compound, a phenoxy compound, an oxetane compound, an episulfide compound, a (meth)acrylic compound, a phenol compound, an amino compound, an unsaturated polyester compound, a polyurethane compound, a silicone compound, or the like. From the viewpoint of further improving the sealing ability of the air cavity, it is preferable that the thermosetting compound (B) is a silicone compound.
  • the content of the thermosetting compound (B) is preferably 10% by weight or more, more preferably 15% by weight or more, even more preferably 20% by weight or more, preferably 50% by weight or less, more preferably 40% by weight or less, and even more preferably 35% by weight or less.
  • the content of the thermosetting compound (B) is equal to or more than the above lower limit and equal to or less than the above upper limit, the effect of the present invention can be exerted more effectively, and the adhesive strength between the circuit board and the electronic component and the adhesive part can be further increased.
  • the total content of (A) the photocurable compound and (B) the thermosetting compound is preferably 7% by weight or more, more preferably 12% by weight or more, even more preferably 17% by weight or more, particularly preferably 20% by weight or more, and most preferably 30% by weight or more.
  • the total content of (A) the photocurable compound and (B) the thermosetting compound is preferably 75% by weight or less, more preferably 70% by weight or less, and even more preferably 65% by weight or less.
  • the curable composition may or may not contain (C) a photo- and heat-curable compound.
  • the (C) photo- and heat-curable compound has a photo-curable functional group and a heat-curable functional group. From the viewpoint of further increasing the adhesive strength between the circuit board and the electronic component and the adhesive part, it is preferable that the curable composition contains (C) a photo- and heat-curable compound. Only one type of (C) photo- and heat-curable compound may be used, or two or more types may be used in combination. In this specification, "photo- and heat-curable" in a compound indicates that the compound has both photo-curable and heat-curable properties.
  • the (C) photo- and thermosetting compound may have a cyclic ether group and a (meth)acryloyl group, or may have an epoxy group and a (meth)acryloyl group. It is preferable that the (C) photo- and thermosetting compound is a curable compound different from the (A) photo-curable compound and the (B) thermosetting compound.
  • Examples of the (C) photo- and thermosetting compound having the above-mentioned epoxy group and (meth)acryloyl group include glycidyl (meth)acrylate, allyl glycidyl ether, 4-hydroxybutyl (meth)acrylate glycidyl ether, and 3,4-epoxycyclohexylmethyl (meth)acrylate.
  • the photo- and thermosetting compound is preferably glycidyl (meth)acrylate or 4-hydroxybutyl (meth)acrylate glycidyl ether, and more preferably 4-hydroxybutyl (meth)acrylate glycidyl ether.
  • the effect of the present invention can be exerted even more effectively, and the adhesive strength between the circuit board and the electronic components and the adhesive part can be further increased.
  • the content of (C) the photo- and thermosetting compound is preferably 5% by weight or more, more preferably 10% by weight or more, preferably 70% by weight or less, more preferably 65% by weight or less, and even more preferably 60% by weight or less.
  • the content of (C) the photo- and thermosetting compound is equal to or more than the above lower limit and equal to or less than the above upper limit, the effect of the present invention can be exerted more effectively, and the adhesive strength between the circuit board and the electronic component and the adhesive part can be further increased.
  • the curable composition contains an epoxy compound, a (meth)acrylate compound, or a silicone compound.
  • the curable composition preferably contains a photopolymerization initiator.
  • the photopolymerization initiator may be a photoradical polymerization initiator, a photocationic polymerization initiator, or the like. Only one type of the photopolymerization initiator may be used, or two or more types may be used in combination. From the viewpoint of further improving the sealing property of the air cavity, it is preferable that the photopolymerization initiator is a photoradical polymerization initiator.
  • the photoradical polymerization initiator is a compound that generates radicals by irradiation with light and initiates a radical polymerization reaction.
  • the photoradical polymerization initiator include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; alkylphenone compounds such as 1-hydroxycyclohexyl phenyl ketone and 2-hydroxy-2-methylpropiophenone; acetophenone compounds such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, and 1,1-dichloroacetophenone; 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-one, and 2-benzyl-2-dimethylamino-1-one; Aminoacetates such as -(4-
  • anthraquinone compounds such as 2-methylanthraquinone, 2-ethylanthraquinone, and 2-t-butylanthraquinone
  • thioxanthone compounds such as 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, and 2,4-diisopropylthioxanthone
  • ketal compounds such as acetophenone dimethyl ketal and benzyl dimethyl ketal
  • acylphosphine oxide compounds such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide
  • 1,2-octanedione 1-[4-(phenylthio)-2-(o-benzoyloxime)], ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9
  • the photopolymerization initiator preferably contains an aminoacetophenone compound, and more preferably contains 2-(dimethylamino)-2-(4-methylbenzyl)-1-(4-morpholinophenyl)butan-1-one.
  • a photopolymerization initiator assistant may be used together with the above-mentioned photoradical polymerization initiator.
  • the photopolymerization initiator assistant include N,N-dimethylaminobenzoic acid ethyl ester, N,N-dimethylaminobenzoic acid isoamyl ester, pentyl-4-dimethylaminobenzoate, triethylamine, and triethanolamine.
  • the above-mentioned photopolymerization initiator assistant may be used alone or in combination of two or more kinds.
  • Titanocene compounds such as CGI-784 (manufactured by Ciba Specialty Chemicals), which have absorption in the visible light region, may also be used to promote the photoreaction.
  • the above cationic photopolymerization initiators include sulfonium salts, iodonium salts, metallocene compounds, and benzoin tosylate.
  • the above cationic photopolymerization initiators may be used alone or in combination of two or more.
  • the content of the photopolymerization initiator is preferably 4% by weight or more, more preferably 5% by weight or more, and is preferably 20% by weight or less, more preferably 15% by weight or less, based on 100% by weight of the curable composition.
  • the curable composition preferably contains a heat curing agent, which thermally cures the thermosetting compound.
  • the above-mentioned heat curing agents include organic acids, amine compounds, amide compounds, hydrazide compounds, imidazole compounds, imidazoline compounds, phenol compounds, urea compounds, polysulfide compounds, and acid anhydrides.
  • the above-mentioned heat curing agents may be used alone or in combination of two or more kinds.
  • the above amine compounds include aliphatic polyamines, alicyclic polyamines, aromatic polyamines, hydrazides, and guanidine derivatives.
  • the above amine compounds may be modified polyamine compounds such as amine-epoxy adducts.
  • the above amine compounds may be adducts of the above amine compounds.
  • Examples of the adducts of the above amine compounds include epoxy compound-added polyamines (reactants of epoxy compounds and polyamines), Michael addition polyamines (reactants of ⁇ , ⁇ -unsaturated ketones and polyamines), Mannich addition polyamines (condensates of polyamines with formalin and phenols), thiourea-added polyamines (reactants of thiourea and polyamines), and ketone-blocked polyamines (reactants of ketone compounds and polyamines (ketimines)).
  • the above-mentioned aliphatic polyamines include diethylenetriamine, triethylenetetramine, tetraethylenepentamine, and diethylaminopropylamine.
  • the above alicyclic polyamines include menthene diamine, isophorone diamine, N-aminoethylpiperazine, 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro(5,5)undecane adduct, bis(4-amino-3-methylcyclohexyl)methane, and bis(4-aminocyclohexyl)methane.
  • the aromatic polyamines include m-phenylenediamine, p-phenylenediamine, o-xylylenediamine, m-xylylenediamine, p-xylylenediamine, 4,4-diaminodiphenylmethane, 4,4'-diamino-3,3'-diethyl-5,5'-dimethyldiphenylmethane, 4,4-diaminodiphenylpropane, 4,4-diaminodiphenylsulfone, 4,4-diaminodicyclohexane, bis(4-aminophenyl)phenylmethane, 1,5-diaminonaphthalene, 1,1-bis(4-aminophenyl)cyclohexane, 2,2-bis[(4-aminophenoxy)phenyl]propane, bis[4-(3-aminophenoxy)phenyl]sulfone, 1,3
  • hydrazides examples include carbodihydrazide, adipic acid dihydrazide, sebacic acid dihydrazide, dodecanedioic acid dihydrazide, and isophthalic acid dihydrazide.
  • guanidine derivatives include dicyandiamide, 1-o-tolyldiguanide, ⁇ -2,5-dimethylguanide, ⁇ , ⁇ -diphenyldiguanide, ⁇ , ⁇ -bisguanylguanidinodiphenyl ether, p-chlorophenyldiguanide, ⁇ , ⁇ -hexamethylenebis[ ⁇ -(p-chlorophenol)]diguanide, phenyldiguanide oxalate, acetylguanidine, and diethylcyanoacetylguanidine.
  • the above-mentioned phenolic compounds include polyhydric phenolic compounds.
  • Examples of the above-mentioned polyhydric phenolic compounds include phenol, cresol, ethylphenol, butylphenol, octylphenol, bisphenol A, tetrabromobisphenol A, bisphenol F, bisphenol S, 4,4'-biphenylphenol, phenol novolac resins containing a naphthalene skeleton, phenol novolac resins containing a xylylene skeleton, phenol novolac resins containing a dicyclopentadiene skeleton, and phenol novolac resins containing a fluorene skeleton.
  • acid anhydrides examples include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, dodecylsuccinic anhydride, chlorendic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, methylcyclohexenetetracarboxylic anhydride, trimellitic anhydride, and polyazelaic anhydride.
  • the heat curing agent preferably contains an amine compound, and is preferably an amine compound.
  • the amine compound is preferably an aromatic amine compound. In this case, the adhesive strength between the circuit board and the electronic component and the adhesive portion can be further increased.
  • the content of the heat curing agent in 100% by weight of the curable composition is preferably 1% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, preferably 40% by weight or less, more preferably 30% by weight or less, and even more preferably 25% by weight or less.
  • the adhesive strength between the circuit board and the electronic component and the adhesive part can be further increased.
  • the curable composition may or may not contain a curing accelerator.
  • the curing accelerator may be used alone or in combination of two or more.
  • the above-mentioned curing accelerators include tertiary amines, imidazoles, quaternary ammonium salts, quaternary phosphonium salts, organometallic salts, phosphorus compounds, and urea compounds.
  • the content of the curing accelerator is preferably 0.01% by weight or more, more preferably 0.05% by weight or more, and preferably 10% by weight or less, more preferably 5% by weight or less.
  • the curable composition may or may not contain a solvent.
  • the solvent may be used alone or in combination of two or more.
  • the above solvents include water and organic solvents.
  • the above solvent is an organic solvent.
  • the above organic solvents include alcohols such as ethanol, ketones such as acetone, methyl ethyl ketone, and cyclohexanone, aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene, glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and tripropylene glycol monomethyl ether, esters such as ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, and prop
  • the lower the solvent content in the curable composition the better.
  • the content of the solvent in 100% by weight of the curable composition is preferably 5% by weight or less, more preferably 1% by weight or less, and even more preferably 0.5% by weight or less. It is most preferable that the curable composition does not contain the solvent.
  • the curable composition may contain other components in addition to the above-mentioned components, such as a coupling agent, a filler, a leveling agent, a defoaming agent, and a polymerization inhibitor.

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

L'invention concerne un procédé de production de composant électronique et un composant électronique qui permettent d'améliorer l'étanchéité d'une cavité d'air.　Un procédé de production de composant électronique selon la présente invention comprend : une étape de montage d'au moins un élément électronique sur une carte de circuit imprimé ; une étape d'application, sur une surface supérieure de la carte de circuit imprimé, d'une composition durcissable qui est liquide à 23 °C et de formation d'une couche de composition durcissable ; et une étape de durcissement de la couche de composition durcissable et de formation d'une couche adhésive, dans l'étape de formation de la couche de composition durcissable, la couche de composition durcissable étant formée de façon à entrer en contact avec au moins une partie d'une surface latérale de l'élément électronique, et une cavité d'air étant formée par la carte de circuit imprimé, l'élément électronique et la couche adhésive.
PCT/JP2023/037079 2022-10-13 2023-10-12 Procédé de production d'un composant électronique et composant électronique WO2024080335A1 (fr)

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JP2022164725 2022-10-13

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004064732A (ja) * 2002-06-03 2004-02-26 Murata Mfg Co Ltd 表面弾性波装置
WO2014050688A1 (fr) * 2012-09-27 2014-04-03 積水化学工業株式会社 Composition durcissable pour jet d'encre et procédé de fabrication de partie électronique
JP2018074566A (ja) * 2016-08-25 2018-05-10 ゼネラル・エレクトリック・カンパニイ 埋め込みｒｆフィルタパッケージ構造およびその製造方法
WO2022203033A1 (fr) * 2021-03-26 2022-09-29 積水化学工業株式会社 Adhésif pour jet d'encre, procédé de production d'un composant électronique et composant électronique

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004064732A (ja) * 2002-06-03 2004-02-26 Murata Mfg Co Ltd 表面弾性波装置
WO2014050688A1 (fr) * 2012-09-27 2014-04-03 積水化学工業株式会社 Composition durcissable pour jet d'encre et procédé de fabrication de partie électronique
JP2018074566A (ja) * 2016-08-25 2018-05-10 ゼネラル・エレクトリック・カンパニイ 埋め込みｒｆフィルタパッケージ構造およびその製造方法
WO2022203033A1 (fr) * 2021-03-26 2022-09-29 積水化学工業株式会社 Adhésif pour jet d'encre, procédé de production d'un composant électronique et composant électronique

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