WO2024080335A1 - Electronic component production method and electronic component - Google Patents
Electronic component production method and electronic component Download PDFInfo
- Publication number
- WO2024080335A1 WO2024080335A1 PCT/JP2023/037079 JP2023037079W WO2024080335A1 WO 2024080335 A1 WO2024080335 A1 WO 2024080335A1 JP 2023037079 W JP2023037079 W JP 2023037079W WO 2024080335 A1 WO2024080335 A1 WO 2024080335A1
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- WO
- WIPO (PCT)
- Prior art keywords
- electronic component
- curable composition
- composition layer
- adhesive portion
- electronic
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 74
- 238000007789 sealing Methods 0.000 claims abstract description 46
- 239000007788 liquid Substances 0.000 claims abstract description 14
- 239000000853 adhesive Substances 0.000 claims description 167
- 230000001070 adhesive effect Effects 0.000 claims description 167
- 150000001875 compounds Chemical class 0.000 claims description 108
- 238000000034 method Methods 0.000 claims description 66
- -1 acrylate compound Chemical class 0.000 claims description 55
- 239000000463 material Substances 0.000 claims description 49
- 238000000016 photochemical curing Methods 0.000 claims description 35
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- 239000011347 resin Substances 0.000 claims description 31
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- 238000001723 curing Methods 0.000 claims description 24
- 238000013007 heat curing Methods 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 8
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 239000003990 capacitor Substances 0.000 claims description 4
- 238000010897 surface acoustic wave method Methods 0.000 claims description 4
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
Definitions
- the present invention relates to a method for manufacturing an electronic component using a curable composition, and to the electronic component.
- air cavities are formed using sheet materials such as photosensitive polyimide resin sheets and epoxy resin sheets (for example, see Patent Document 1 below).
- the object of the present invention is to provide a new method for manufacturing electronic components that can improve the sealing of the air cavity. It is also an object of the present invention to provide electronic components that can improve the sealing of the air cavity.
- This specification discloses the following electronic component manufacturing method and electronic component.
- Item 1 A method for manufacturing an electronic component, comprising the steps of mounting at least one electronic component on a circuit board, applying a liquid curable composition at 23°C to the top surface of the circuit board to form a curable composition layer, and curing the curable composition layer to form an adhesive portion, wherein in the step of forming the curable composition layer, the curable composition layer is formed so as to contact at least a portion of the side surface of the electronic component, and an air cavity is formed by the circuit board, the electronic component, and the adhesive portion.
- Item 2 The method for producing an electronic component according to Item 1, in which the electronic components are multiple, the multiple electronic components are mounted on the circuit board at intervals in the step of mounting the electronic components, and the curable composition layer is formed in such a way that the multiple electronic components do not contact at least a portion of the side of the electronic components in the portion where the multiple electronic components are adjacent to each other in the step of forming the curable composition layer.
- Item 3 The method for producing an electronic component according to Item 1, wherein in the step of forming the curable composition layer, the curable composition layer is formed over the entire periphery of the electronic component so as to contact the side surface of the electronic component.
- Item 4 The method for manufacturing an electronic component according to any one of items 1 to 3, wherein in the step of forming the curable composition layer, the curable composition layer is formed so as to contact the side surface of the electronic component from the upper end to the lower end.
- Item 5 The method for manufacturing an electronic component according to any one of items 1 to 4, wherein in the step of forming the curable composition layer, the curable composition layer is formed so as to contact the edge of the upper surface of the electronic component.
- Item 6 The method for manufacturing an electronic component according to any one of items 1 to 5, wherein in the step of forming the curable composition layer, the curable composition layer is formed so as not to come into contact with the lower surface of the electronic component.
- Item 7 The method for manufacturing an electronic component according to any one of items 1 to 6, wherein the step of forming the adhesive portion includes a step of photocuring the curable composition layer to form the adhesive portion.
- Item 8 The method for manufacturing an electronic component according to any one of items 1 to 7, wherein the step of forming the adhesive portion includes a step of photocuring the curable composition layer to obtain a B-staged material layer, and a step of thermally curing the B-staged material layer to form the adhesive portion.
- Item 9 The method for manufacturing an electronic component according to Item 8, wherein the step of forming the adhesive portion includes a step of photocuring the curable composition layer to obtain a multi-layer B-staged material layer each time multiple drops or one drop of the curable composition is applied, and a step of thermally curing the multi-layer B-staged material layer to form a multi-layer adhesive portion.
- Item 10 The method for manufacturing an electronic component according to any one of items 1 to 9, further comprising a step of sealing the upper and side surfaces of the adhesive portion with resin.
- Item 11 The method for producing an electronic component according to any one of items 1 to 10, wherein in the step of forming the curable composition layer, the curable composition is applied by an inkjet method.
- An electronic component comprising a circuit board, at least one electronic component, and an adhesive portion, wherein the at least one electronic component is mounted on the circuit board, the adhesive portion is a cured product of a curable composition that is liquid at 23°C, the adhesive portion is in contact with the upper surface of the circuit board and at least a part of the side surface of the electronic component, and an air cavity is formed by the circuit board, the electronic component, and the adhesive portion.
- Item 13 The electronic component according to item 12, in which the electronic components are multiple, the multiple electronic components are mounted on the circuit board with a gap between them, and the adhesive portion does not contact at least a portion of the side of the electronic components in the portion where the multiple electronic components are adjacent to each other.
- Item 14 The electronic component according to item 12, wherein the adhesive portion contacts the side surface of the electronic component over the entire periphery of the electronic component.
- Item 15 An electronic component according to any one of items 12 to 14, in which the adhesive portion is in contact with an edge portion of the upper surface of the electronic member.
- Item 16 An electronic component according to any one of items 12 to 15, in which the adhesive portion is not in contact with the bottom surface of the electronic member.
- Item 17 An electronic component according to any one of items 12 to 16, in which the height of the adhesive portion is 1 ⁇ m or more and 300 ⁇ m or less.
- Item 18 The electronic component according to any one of items 12 to 17, wherein the curable composition contains an epoxy compound, a (meth)acrylate compound, or a silicone compound.
- Item 19 An electronic component according to any one of items 12 to 18, wherein the electronic component is a semiconductor chip, a capacitor, or a light-emitting element.
- Item 20 An electronic component according to any one of items 12 to 19, wherein the electronic component is a surface acoustic wave filter, a bulk acoustic wave filter, or a film acoustic resonator filter.
- the method for manufacturing an electronic component according to the present invention includes the steps of mounting at least one electronic component on a circuit board, applying a liquid curable composition at 23°C to the upper surface of the circuit board to form a curable composition layer, and curing the curable composition layer to form an adhesive portion.
- the curable composition layer in the step of forming the curable composition layer, is formed so as to contact at least a portion of the side surface of the electronic component.
- an air cavity is formed by the circuit board, the electronic component, and the adhesive portion.
- the electronic component according to the present invention comprises a circuit board, at least one electronic component, and an adhesive part.
- the adhesive part is a cured product of a curable composition that is liquid at 23°C.
- the adhesive part is in contact with the upper surface of the circuit board and at least a portion of the side surface of the electronic component.
- an air cavity is formed by the circuit board, the electronic component, and the adhesive part. Since the electronic component according to the present invention has the above configuration, the sealing of the air cavity can be improved.
- FIG. 1A is a plan view that illustrates an electronic component according to a first embodiment of the present invention
- FIG. 1B is a cross-sectional view that illustrates the electronic component
- FIG. 2 is a cross-sectional view illustrating an electronic component according to a second embodiment of the present invention
- FIG. 3 is a cross-sectional view illustrating an electronic component according to a third embodiment of the present invention.
- 4A and 4B are cross-sectional views for explaining each step of the method for manufacturing the electronic component shown in FIG. 5C and 5D are cross-sectional views for explaining each step of the method for manufacturing the electronic component shown in FIG. 6(e) and 6(f) are cross-sectional views for explaining each step of the method for manufacturing the electronic component shown in FIG. FIG.
- FIG. 7G is a cross-sectional view for explaining each step of the method for manufacturing the electronic component shown in FIG. 8A and 8B are diagrams for explaining the formation areas of adhesive portions for electronic components.
- 9A and 9B are diagrams for explaining modified examples of the formation area of the adhesive portion for the electronic member.
- the inventors conducted extensive research to solve the above problems and found that the electronic component and manufacturing method for an electronic component according to the present invention significantly improves the air cavity sealability, particularly by forming an adhesive joint using a curable composition that is liquid at 23°C.
- the air cavity sealability is significantly improved compared to when an adhesive joint is formed using a curable sheet.
- the molding material is less likely to penetrate into the air cavity when molding and sealing.
- the electronic component according to the present invention includes a circuit board, at least one electronic member, and an adhesive portion.
- at least one electronic member is mounted on the circuit board.
- the adhesive portion is a cured product of a curable composition that is liquid at 23°C.
- the adhesive portion is in contact with an upper surface of the circuit board and at least a portion of a side surface of the electronic member.
- an air cavity is formed by the circuit board, the electronic member, and the adhesive portion.
- the method for manufacturing an electronic component according to the present invention comprises the following steps (1) to (3): (1) Mounting at least one electronic component on a circuit board. (2) Applying a liquid curable composition at 23°C to the upper surface of the circuit board to form a curable composition layer. (3) Curing the curable composition layer to form an adhesive portion.
- the curable composition layer is formed so as to contact at least a portion of the side surface of the electronic component.
- an air cavity is formed by the circuit board, the electronic component, and the adhesive portion.
- FIG. 1(a) is a plan view that shows a schematic diagram of an electronic component according to a first embodiment of the present invention
- FIG. 1(b) is a cross-sectional view that shows a schematic diagram of the electronic component.
- FIG. 1(b) is a cross-sectional view taken along line I-I in FIG. 1(a).
- the 1 includes a circuit board 1, an electronic component 2, an adhesive portion 3, and a molded resin portion 44.
- the electronic component 2 includes a solder ball 41, a resin sheet 42, and a connection terminal 43 (not shown in FIG. 1(a)).
- one electronic component 2 is mounted.
- the electronic component 10 there is one electronic component 2.
- the adhesive portion 3 is a cured product of a curable composition that is liquid at 23°C.
- the adhesive portion 3 is a photo- and heat-cured product of the curable composition.
- the adhesive portion 3 is in contact with the upper surface of the circuit board 1 and a part of the side surface of the electronic component 2.
- the adhesive portion 3 is in contact with a part of the upper surface of the circuit board 1, and is in contact with a part of the side surface and the entire upper surface of the electronic component 2.
- the adhesive portion 3 is not in contact with the lower surface of the electronic component 2.
- the adhesive portion 3 bonds the upper surface of the circuit board 1 to the side surface and upper surface of the electronic component 2.
- the adhesive portion 3 is disposed on the upper surface of the circuit board 1.
- the adhesive portion 3 is disposed on the side of the electronic component 2 and on the top surface of the electronic component 2.
- the adhesive portion 3 is disposed on part of the top surface of the circuit board 1, and on part of the side and the entire top surface of the electronic component 2.
- the adhesive portion 3 is not disposed on the bottom surface of the electronic component 2.
- An air cavity R is formed by the circuit board 1, the electronic component 2, and the adhesive portion 3.
- the molded resin portion 44 is disposed on the top and side surfaces of the adhesive portion 3.
- the air cavity R is highly sealed. Furthermore, in the present invention, the molding material (the material of the molded resin portion) is less likely to penetrate into the air cavity R.
- FIG. 2 is a cross-sectional view showing a schematic diagram of an electronic component according to a second embodiment of the present invention.
- the electronic component 11 shown in FIG. 2 includes a circuit board 1, multiple electronic components 2, adhesive portions 3, and a molded resin portion 44.
- Multiple electronic components 2 are mounted in the electronic component 11.
- the multiple electronic components 2 are mounted on the circuit board 1 with spaces between them.
- the adhesive portions 3 do not contact the side surfaces of the electronic components 2 in the portion where the multiple electronic components 2 are adjacent.
- the adhesive portions 3 are not disposed in the gaps between adjacent electronic components 2.
- the adhesive portions 3 are not disposed on the side surfaces of the electronic components 2 between adjacent electronic components 2.
- the adhesive portion 3 is in contact with the upper surface of the circuit board 1 and a part of the side surface of the electronic component 2.
- the adhesive portion 3 is in contact with a part of the upper surface of the circuit board 1, and is in contact with a part of the side surface and the entire upper surface of the electronic component 2.
- the adhesive portion 3 is not in contact with the lower surface of the electronic component 2.
- the adhesive portion 3 bonds the upper surface of the circuit board 1 to the side and upper surface of the electronic component 2.
- the adhesive portion 3 is disposed on the upper surface of the circuit board 1.
- the adhesive portion 3 is disposed on the side surface of the electronic component 2 and is also disposed on the upper surface of the electronic component 2.
- the adhesive portion 3 is disposed on a part of the upper surface of the circuit board 1, and is disposed on a part of the side surface and the entire upper surface of the electronic component 2.
- the adhesive portion 3 is not disposed on the lower surface of the electronic component 2.
- An air cavity R is formed by the circuit board 1, the electronic component 2, and the adhesive portion 3.
- the molded resin portion 44 is disposed on the upper surface and side of the adhesive portion 3.
- the sealing performance of the air cavity R is quite high. Furthermore, in the present invention, the molding material (the material of the molded resin portion) is less likely to penetrate into the air cavity R.
- FIG. 3 is a cross-sectional view showing a schematic diagram of an electronic component according to a third embodiment of the present invention.
- the electronic component 12 shown in FIG. 3 differs from the electronic component 10 shown in FIG. 1 only in the configuration of the adhesive portion 3.
- the adhesive portion 3 contacts the side of the electronic member 2 (excluding the solder balls 41) from the upper end to the lower end.
- the air cavity R is highly sealed. Furthermore, in the present invention, the molding material (the material of the molded resin portion) is less likely to penetrate into the air cavity R.
- the adhesive portion may or may not be in contact with the upper surface of the electronic member. In the electronic component, the adhesive portion may or may not be disposed on the upper surface of the electronic member. In addition, in the electronic component, the adhesive portion may or may not be in contact with the lower surface of the electronic member. In addition, in the electronic component, the adhesive portion may or may not be disposed on the lower surface of the electronic member.
- electronic member 2 is a semiconductor chip.
- Electronic components 10, 11, and 12, and electronic component 10X described below, are communication filters.
- FIGS. 4(a) and 4(b) are cross-sectional views for explaining each step of the method for manufacturing the electronic component shown in FIG. 1.
- FIGS. 5(c) and 5(d) are cross-sectional views for explaining each step of the method for manufacturing the electronic component shown in FIG. 1.
- FIGS. 6(e) and 6(f) are cross-sectional views for explaining each step of the method for manufacturing the electronic component shown in FIG. 1.
- FIG. 7(g) is a cross-sectional view for explaining each step of the method for manufacturing the electronic component shown in FIG. 1.
- FIGS. 4-7(a)-(g) show a series of steps in the method for manufacturing the electronic component shown in FIG. 1.
- a liquid curable composition is applied to the upper surface (front surface) of the circuit board 1 at 23° C. using an inkjet device to form a curable composition layer 3A (application process).
- the curable composition is applied to the upper surface of the circuit board 1 to form a curable composition layer 3A.
- the curable composition is ejected from the ejection section 51 of the inkjet device.
- the curable composition layer 3A is cured to form the adhesive portion 3.
- the curable composition layer 3A is irradiated with light from the light irradiation section 52 of the inkjet device to advance the curing of the curable composition layer 3A and form a B-staged material layer 3B (photocuring step).
- the B-staged material layer 3B is a preliminary cured material layer of the above-mentioned curable composition.
- the curable composition may be applied to a specific region, and then the entire applied curable composition may be irradiated with light to form a B-staged product layer.
- the applied curable composition may be irradiated with light every time multiple drops of the curable composition are applied to form a B-staged product layer.
- the applied curable composition may be irradiated with light every time one drop of the curable composition is applied to form a B-staged product layer. That is, the applied curable composition may be irradiated with light to form a B-staged product layer every time multiple drops or one drop of the curable composition are applied. Therefore, the curable composition layer may be photocured every time multiple drops or one drop of the curable composition are applied to obtain multiple B-staged product layers.
- the curable composition layer 3A in the step of forming the curable composition layer 3A (coating step), the curable composition layer 3A is formed so as to contact at least a portion of the side surface of the electronic component 2, and in the step of forming the B-stage compound layer 3B (photo-curing step), the B-stage compound layer 3B is formed so as to contact at least a portion of the side surface of the electronic component 2 (see FIG. 6(e)).
- the photocuring step it is determined whether or not to repeat the coating step and the photocuring step. If the coating step and the photocuring step are repeated, the curable composition is applied to the surface side of the formed B-stage material layer opposite the circuit board side.
- FIG. 5(c) and FIG. 5(d) are diagrams showing the second coating step and the second photocuring step, respectively.
- the above-mentioned curable composition is applied to the surface of the B-staged material layer 3B opposite the circuit board 1 side using an inkjet device, and a curable composition layer 3A is formed on the surface of the B-staged material layer 3B.
- the applied curable composition layer 3A is irradiated with light from the light irradiation section 52 of the inkjet device to form the B-staged material layer 3B.
- the coating step and the photocuring step are performed twice in the thickness direction of the curable composition layer, in Figures 4(a) and 4(b) and Figures 5(c) and 5(d).
- the coating step and the photocuring step may each be performed two or more times, or three or more times.
- a B-stage compound layer 3B is formed in contact with the side surface of the electronic component 2, as shown in FIG. 6(e).
- a B-stage compound layer 3B is formed in contact with the side surface and top surface of the electronic component 2.
- the B-staged material layer 3B is thermally cured by heating (thermal curing process).
- the laminated structure including the circuit board 1, electronic component 2, and B-staged material layer 3B obtained in FIG. 6(e) is heated to thermally cure the B-staged material layer 3B.
- the adhesive portion 3 is a photo- and thermo-cured layer of the curable composition.
- the upper and side surfaces of the adhesive portion 3 are sealed with resin.
- Resin is placed on the upper and side surfaces of the adhesive portion 3 to form a molded resin portion 44.
- FIGS. 8(a) and 8(b) are diagrams for explaining the formation area of the adhesive portion on the electronic component.
- FIG. 8(b) is a diagram taken along line I-I in FIG. 8(a).
- the formation area of the adhesive portion 3 is indicated by diagonal lines.
- adhesive portion 3 contacts all of the side surfaces of electronic component 2.
- adhesive portion 3 contacts the side surfaces of electronic component 2 over the entire periphery of electronic component 2.
- FIGS. 9(a) and 9(b) are diagrams for explaining modified examples of the formation area of the adhesive portion on the electronic component.
- FIG. 9(b) is a diagram taken along line I-I in FIG. 9(a).
- the formation area of the adhesive portion 3X is indicated by diagonal lines.
- adhesive portion 3X is in contact with part of the side surface of electronic component 2, and is in contact with part of the side surface of the periphery of electronic component 2.
- electronic component 10X there is an area on the side surface of electronic component 2 where adhesive portion 3X is not located.
- the above-mentioned method for producing an electronic component it is preferable to apply the above-mentioned curable composition by an inkjet method in the above-mentioned (2) step of forming a curable composition layer (coating step). From the viewpoint of further improving the air cavity sealability, in the above-mentioned method for producing an electronic component, it is preferable to apply the above-mentioned curable composition by an inkjet device in the above-mentioned (2) step of forming a curable composition layer (coating step).
- the adhesive portion may be in contact with the side surface of the electronic component over the entire periphery of the electronic component, or may be in contact with only a portion of the side surface of the periphery of the electronic component.
- the adhesive portion contacts the side of the electronic component over the entire periphery of the electronic component (see, for example, FIG. 8(b)). From the viewpoint of further enhancing the sealing of the air cavity, when there is one electronic component, it is preferable that the adhesive portion contacts all of the side surfaces of the electronic component. From the viewpoint of further enhancing the sealing of the air cavity, when there are multiple electronic components, it is preferable that the adhesive portion contacts the side of the electronic component over the entire periphery of the assembly of the electronic components.
- the sealing of the air cavity may be ensured even if the adhesive portion does not contact the side surface of the electronic component over the entire periphery of the electronic component.
- the adhesive portion may contact only a portion of the side surface of the periphery of the electronic component (see, for example, FIG. 9(b)).
- the adhesive portion may contact a portion of the side surface of the electronic component.
- the adhesive portion may contact a portion of the side surface of the periphery of the assembly of electronic components.
- the adhesive portion is preferably in contact with the entire vertical direction of the side surface of the electronic component.
- the curable composition layer is preferably formed so as to be in contact with the entire vertical direction of the side surface of the electronic component.
- the curable composition layer is preferably formed so as to be in contact with the entire vertical direction of the side surface of the electronic component.
- the curable composition is preferably applied from the upper end to the lower end of the side surface of the electronic component.
- "from the top to the bottom of the side of the electronic component” means from the top to the bottom of the side of the electronic component excluding the solder balls.
- the adhesive portion may be in contact with a portion of the side surface of the electronic member, or may be in contact with the entire side surface of the electronic member. From the viewpoint of more effectively exerting the effects of the present invention, it is preferable that the adhesive portion be in contact with the entire side surface of the electronic member in the electronic component. From the viewpoint of further improving the sealing property of the air cavity, it is preferable that in the manufacturing method of the electronic component, in the step (2) of forming a curable composition layer (coating step), the curable composition layer is formed so as to be in contact with the entire side surface of the electronic member. From the viewpoint of further improving the sealing property of the air cavity, it is preferable that in the manufacturing method of the electronic component, in the step (2) of forming a curable composition layer (coating step), the curable composition is coated on the entire side surface of the electronic member.
- the adhesive portion contacts at least a portion of all side surfaces of the electronic component, more preferably contacts all side surfaces of the electronic component from the top to the bottom, and even more preferably contacts the entirety of all side surfaces of the electronic component. In these cases, the effects of the present invention can be exerted even more effectively.
- the multiple electronic components are mounted on the circuit board with a gap between them.
- the gap between the electronic components is not particularly limited.
- the gap between the electronic components may be 50 ⁇ m or more, 100 ⁇ m or more, 500 ⁇ m or less, or 300 ⁇ m or less.
- the adhesive portion does not contact at least a part of the side of the electronic components in the portion where the multiple electronic components are adjacent. From the viewpoint of further enhancing the sealing property of the air cavity, when there are multiple electronic components, it is preferable that the adhesive portion is not arranged on at least a part of the side of the electronic components between adjacent electronic components, and it is preferable that the adhesive portion is not arranged on at least a part of the side of the electronic components in the portion where the multiple electronic components are adjacent.
- the side of the electronic components in the portion where the multiple electronic components are adjacent has a part that is not in contact with the adhesive portion.
- the adhesive portion does not contact the side between the electronic components in the portion where the multiple electronic components are adjacent.
- the adhesive portion is not disposed in the gap between adjacent electronic components, and is preferably not disposed on the side surface of the electronic components in the portion where multiple electronic components are adjacent to each other.
- the electronic components include a plurality of electronic components, that the plurality of electronic components are mounted on the circuit board at intervals, and that the adhesive portion does not contact at least a portion of the side of the electronic components in the portion where the plurality of electronic components are adjacent to each other.
- the adhesive portion contacts at least a portion of each side of the electronic components over the entire periphery of the assembly of electronic components, more preferably contacts each side from the top to the bottom, and even more preferably contacts the entirety of each side. In these cases, the sealing of the air cavity can be further improved.
- the electronic components are multiple, and that the multiple electronic components are mounted on the circuit board with a gap therebetween in the step (1) of mounting the electronic components (mounting step).
- the curable composition layer is formed in the step (2) of forming a curable composition layer (coating step) so that the curable composition layer does not contact at least a portion of the side surface of the electronic components in the portion where the multiple electronic components are adjacent to each other.
- the curable composition is not applied to at least a portion of the side surface of the electronic components in the portion where the multiple electronic components are adjacent to each other in the step (2) of forming a curable composition layer (coating step). In these cases, the sealing of the air cavity can be further improved.
- the adhesive portion contacts the edge of the upper surface of the electronic member, and it is more preferable that the adhesive portion contacts the entire upper surface of the electronic member.
- the curable composition layer is formed so as to contact the edge of the upper surface of the electronic member in the step (2) of forming the curable composition layer (coating step).
- the curable composition is applied to the edge of the upper surface of the electronic member in the step (2) of forming the curable composition layer (coating step), and it is more preferable that the curable composition is applied to the entire upper surface of the electronic member.
- the edge of the upper surface of the electronic member is a part (edge) located on the upper surface of the electronic member, and is different from a part located on the side of the electronic member.
- the adhesive portion may contact an area of 5 ⁇ m extending inward from the edge of the top surface of the electronic component, or an area of 1000 ⁇ m extending inward from the edge of the top surface of the electronic component. It is preferable that the edge of the top surface of the electronic component is an area of 5 ⁇ m to 1000 ⁇ m extending inward from the edge of the top surface of the electronic component.
- the adhesive portion does not contact the lower surface of the electronic member.
- the curable composition layer is formed so as not to contact the lower surface of the electronic member.
- the curable composition is not coated on the lower surface of the electronic member.
- the above-mentioned (3) step of forming an adhesive part it is preferable to photo-cure the curable composition, and more preferably photo-cure and heat-cure. From the viewpoint of further improving the air cavity sealing property, in the above-mentioned (3) step of forming an adhesive part (curing step), it is preferable to cure the curable composition by irradiation with light and heating. From the viewpoint of further improving the air cavity sealing property, in the above-mentioned (3) step of forming an adhesive part (curing step), it is preferable to include a step of photo-cure the curable composition layer to form the adhesive part (photo-cure step). When the curable composition layer is photo-cure to form the adhesive part, heat curing may be performed after photo-cure.
- the above-mentioned (3) step of forming an adhesive portion includes a step of photocuring the curable composition layer to obtain a B-staged product layer (photocuring step), and a step of thermally curing the B-staged product layer to obtain a cured product (adhesive portion) of the curable composition layer (thermal curing step).
- the sealing property of the air cavity can be further improved.
- the above-mentioned (3) step of forming an adhesive portion includes a step of photocuring the curable composition layer to obtain a multi-layered B-staged material layer each time one or more drops of the curable composition are applied (photocuring step), and a step of thermally curing the multi-layered B-staged material layer to form a multi-layered adhesive portion (thermal curing step).
- the adhesive portion can be formed with high precision, and the effects of the present invention can be effectively achieved.
- the process of obtaining a multi-layer B-staged material layer is performed by repeatedly applying multiple or one drop of the curable composition and photo-curing the curable composition layer.
- the application and photo-curing are repeated in the thickness direction of the curable composition layer (thickness direction of the resulting multi-layer B-staged material layer) to form a multi-layer B-staged material layer.
- the process of obtaining a multi-layer B-staged material layer is the following process.
- a process of applying multiple or one drop of the curable composition and photo-curing the first curable composition layer to obtain a first B-staged material layer (lower B-staged material layer) is performed.
- a process of applying multiple or one drop of the curable composition on the first B-staged material layer (lower B-staged material layer) and photo-curing the second curable composition layer (upper B-staged material layer) is performed to obtain a second B-staged material layer.
- n times n is an integer of 2 or more
- n layers n in total
- the final nth operation is a process of applying multiple drops or one drop of the curable composition onto the (n-1)th B-staged material layer, and photocuring the nth curable composition layer to obtain the nth B-staged material layer.
- thermocuring process After the photocuring process for obtaining multiple B-staged material layers, a process of forming a multilayer adhesive portion (thermal curing process) is performed.
- the process of forming a multilayer adhesive portion is a process of thermally curing n B-staged material layers to form n adhesive portions.
- ultraviolet light is preferably irradiated.
- the illuminance and irradiation time of the ultraviolet light in the photocuring step can be appropriately changed depending on the composition of the curable composition and the coating thickness of the curable composition.
- the illuminance of the ultraviolet light in the photocuring step may be, for example, 1000 mW/cm 2 or more, 5000 mW/cm 2 or more, 10000 mW/cm 2 or less, or 8000 mW/cm 2 or less.
- the irradiation time of the ultraviolet light in the photocuring step may be, for example, 0.01 seconds or more, 0.1 seconds or more, 400 seconds or less, or 100 seconds or less.
- the illuminance of the ultraviolet light in the photocuring step may be 1000 mW/cm 2 or more and 10000 mW/cm 2 or less.
- the irradiation time of the ultraviolet light in the photocuring step may be 0.01 seconds or more and 100 seconds or less.
- the heating temperature and heating time in the heat curing process can be changed as appropriate depending on the composition of the curable composition and the thickness of the B-staged product layer.
- the heating temperature in the heat curing process may be, for example, 100°C or higher, 120°C or higher, 250°C or lower, or 200°C or lower.
- the heating time in the heat curing process may be, for example, 5 minutes or higher, 30 minutes or higher, 600 minutes or lower, or 300 minutes or lower.
- the electronic component may or may not have a molded resin portion.
- the upper and side surfaces of the adhesive portion may or may not be sealed with resin.
- the method for manufacturing an electronic component further includes (4) a step of sealing the upper and side surfaces of the adhesive portion with resin (resin sealing step).
- the method for manufacturing an electronic component further includes (4) a step of sealing with resin (resin sealing step) of disposing resin on the upper and side surfaces of the adhesive portion to form a molded resin portion.
- the above resins include epoxy resins, acrylic resins, phenolic resins, silicone resins, and fluororesins. From the viewpoint of further improving the sealing properties of the air cavity, the above resins are preferably epoxy resins, acrylic resins, or phenolic resins, and more preferably epoxy resins or acrylic resins.
- the ratio (height/width) of the height of the adhesive portion to the width of the adhesive portion is preferably 1.0 or more, more preferably 1.5 or more, even more preferably 2.0 or more, and particularly preferably 2.5 or more.
- the upper limit of the ratio (height/width) is not particularly limited.
- the ratio (height/width) of the adhesive portion may be 100 or less, 50 or less, 10 or less, or 5.0 or less. From the viewpoint of miniaturizing the resulting electronic component, it is preferable that the ratio (height/width) is 5.0 or less.
- the width, height, shape, etc. of the adhesive part can be changed as appropriate.
- the width of the adhesive portion is preferably the width of the adhesive portion at the contact surface between the surface of the circuit board and the adhesive portion. At the contact surface between the surface of the circuit board and the adhesive portion, the width of the adhesive portion may be 50 ⁇ m or more, 100 ⁇ m or more, 150 ⁇ m or more, 250 ⁇ m or less, 230 ⁇ m or less, or 200 ⁇ m or less.
- the height of the adhesive portion is preferably the distance from the contact surface between the surface of the circuit board and the adhesive portion to the maximum height position of the adhesive portion.
- the distance from the contact surface between the surface of the circuit board and the adhesive portion to the maximum height position of the adhesive portion is preferably 1 ⁇ m or more, more preferably 10 ⁇ m or more, even more preferably 50 ⁇ m or more, and is preferably 300 ⁇ m or less, more preferably 250 ⁇ m or less, even more preferably 200 ⁇ m or less.
- the adhesive part may be multi-layered, and when the adhesive part is multi-layered, the thickness of each layer is preferably 5 ⁇ m or more, more preferably 10 ⁇ m or more, even more preferably 30 ⁇ m or more, and preferably 300 ⁇ m or less, more preferably 200 ⁇ m or less, even more preferably 100 ⁇ m or less.
- the circuit board is a substrate having a circuit pattern on its surface.
- the above electronic components include semiconductor chips, capacitors, and light-emitting elements.
- the above-mentioned semiconductor chips include surface acoustic wave filters, bulk acoustic wave filters, and film acoustic resonator filters.
- the light-emitting element may be a light-emitting diode, a semiconductor laser, etc.
- the electronic component is preferably a semiconductor chip, a capacitor, or a light-emitting element, more preferably a semiconductor chip, and even more preferably a surface acoustic wave filter, a bulk acoustic wave filter, or a film acoustic resonator filter.
- the curable composition is a liquid curable composition at 23° C.
- the viscosity of the curable composition at 23° C. and 10 rpm is preferably 3 mPa ⁇ s or more, more preferably 5 mPa ⁇ s or more, even more preferably 10 mPa ⁇ s or more, still more preferably 160 mPa ⁇ s or more, and is preferably 2000 mPa ⁇ s or less, more preferably 1600 mPa ⁇ s or less, and still more preferably 1500 mPa ⁇ s or less.
- the above viscosity is measured at 23°C using an E-type viscometer (for example, "TVE22L” manufactured by Toki Sangyo Co., Ltd.) in accordance with JIS K2283.
- E-type viscometer for example, "TVE22L” manufactured by Toki Sangyo Co., Ltd.
- the above-mentioned curable composition is preferably applied by an inkjet method.
- the above-mentioned curable composition is preferably applied by an inkjet device.
- the above curable composition can be used to bond a circuit board and an electronic component, and can also form an air cavity.
- the above curable composition can be used to manufacture an electronic component having an air cavity.
- the above curable composition is preferably a curable composition used to bond the upper surface of the circuit board and the side surface of the electronic component, and more preferably a curable composition used to bond the upper surface of the circuit board and the side and upper surface of the electronic component.
- the above-mentioned curable composition is preferably used by curing it through irradiation with light and heating.
- the above-mentioned curable composition is preferably used by curing it through irradiation with light and then curing it through heating.
- the above-mentioned curable composition is preferably photocurable, preferably thermosetting, and more preferably photocurable and thermosetting.
- the curable composition preferably contains a photocurable compound (a curable compound that can be cured by irradiation with light), and more preferably contains a photocurable compound and a thermosetting compound (a curable compound that can be cured by heating).
- a photocurable compound a curable compound that can be cured by irradiation with light
- a thermosetting compound a curable compound that can be cured by heating
- (meth)acryloyl refers to “acryloyl” or “methacryloyl”
- (meth)acrylate refers to "acrylate” or “methacrylate”.
- the CH 2 ⁇ CH group of the (meth)acryloyl group is not included in the vinyl group.
- the curable composition preferably contains (A) a photocurable compound.
- the (A) photocurable compound has a photocurable functional group. Examples of the photocurable functional group include a (meth)acryloyl group and a vinyl group.
- the (A) photocurable compound may have a (meth)acryloyl group, a vinyl group, or both a (meth)acryloyl group and a vinyl group. Only one type of (A) photocurable compound may be used, or two or more types may be used in combination.
- the photocurable compound does not have a thermosetting functional group, which will be described later.
- the photocurable compound preferably has a (meth)acryloyl group or a vinyl group, and more preferably has a (meth)acryloyl group.
- the photocurable compound is preferably a (meth)acrylate compound.
- the (A) photocurable compound may be a monofunctional (meth)acrylate compound or a polyfunctional (meth)acrylate compound.
- the (A) photocurable compound may be a bifunctional (meth)acrylate compound, a bifunctional or higher (meth)acrylate compound, a trifunctional (meth)acrylate compound, a trifunctional or higher (meth)acrylate compound, or a tetrafunctional or higher (meth)acrylate compound.
- the (A) photocurable compound may be a 20 or lower functional (meth)acrylate compound, a 10 or lower functional (meth)acrylate compound, or a 5 or lower functional (meth)acrylate compound.
- the functionality corresponds to the number of (meth)acryloyl groups. Only one type of (A) photocurable compound may be used, or two or more types may be used in combination.
- the photocurable compound may have one (meth)acryloyl group, may have two, may have two or more, may have three, may have three or more, may have four or more, may have 20 or less, may have 10 or less, or may have 5 or less.
- the above-mentioned monofunctional (meth)acrylate compounds include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, i-propyl (meth)acrylate, n-butyl (meth)acrylate, i-butyl (meth)acrylate, sec-butyl (meth)acrylate, t-butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, allyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, phenyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 2-phenoxyeth
- the above bifunctional (meth)acrylate compounds include 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanedi(meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 2,4-dimethyl-1,5-pentanediol di(meth)acrylate, butyl ethyl propanediol (meth)acrylate, ethoxylated cyclohexanemethanol di(meth)acrylate, ethoxylated bisphenone.
- di(meth)acrylates examples include aryl di(meth)acrylate, polyethylene glycol di(meth)acrylate, oligoethylene glycol di(meth)acrylate, ethylene glycol di(meth)acrylate, 2-ethyl-2-butylbutanediol di(meth)acrylate, 2-ethyl-2-butylpropanediol di(meth)acrylate, tricyclodecane di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, urethane (meth)acrylate, and dipropylene glycol di(meth)acrylate.
- trifunctional (meth)acrylate compounds include trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, alkylene oxide-modified tri(meth)acrylate of trimethylolpropane, pentaerythritol tri(meth)acrylate, dipentaerythritol tri(meth)acrylate, trimethylolpropane tri((meth)acryloyloxypropyl)ether, alkylene oxide-modified tri(meth)acrylate of isocyanuric acid, dipentaerythritol propionate tri(meth)acrylate, tri((meth)acryloyloxyethyl)isocyanurate, and sorbitol tri(meth)acrylate.
- tetrafunctional (meth)acrylate compounds include pentaerythritol tetra(meth)acrylate, sorbitol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, and dipentaerythritol propionate tetra(meth)acrylate.
- pentafunctional (meth)acrylate compounds examples include sorbitol penta(meth)acrylate and dipentaerythritol penta(meth)acrylate.
- hexafunctional (meth)acrylate compounds include dipentaerythritol hexa(meth)acrylate, sorbitol hexa(meth)acrylate, and alkylene oxide-modified hexa(meth)acrylate of phosphazene.
- Examples of the (A) photocurable compound having a vinyl group include vinyl ethers, ethylene derivatives, styrene, chloromethylstyrene, ⁇ -methylstyrene, maleic anhydride, dicyclopentadiene, N-vinylpyrrolidone, and N-vinylformamide.
- the content of the photocurable compound (A) is preferably 2% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, and particularly preferably 15% by weight or more.
- the content of the photocurable compound (A) is preferably 80% by weight or less, more preferably 70% by weight or less, even more preferably 65% by weight or less, even more preferably 60% by weight or less, even more preferably 50% by weight or less, and particularly preferably 40% by weight or less.
- the content of the photocurable compound (A) is equal to or more than the lower limit and equal to or less than the upper limit, the effects of the present invention can be exhibited even more effectively.
- the curable composition may contain (C) a photo- and heat-curable compound, which will be described later.
- the content of (A) the photo-curable compound in 100% by weight of the curable composition is preferably 2% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, preferably 65% by weight or less, more preferably 60% by weight or less, and even more preferably 55% by weight or less.
- the content of (A) the photo-curable compound is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be exhibited even more effectively.
- the content of (A) the photo-curable compound in 100% by weight of the curable composition is preferably 5% by weight or more, more preferably 10% by weight or more, even more preferably 20% by weight or more, preferably 55% by weight or less, more preferably 45% by weight or less, and even more preferably 35% by weight or less.
- the content of (A) the photo-curable compound is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be exhibited even more effectively.
- the curable composition preferably contains a thermosetting compound (B).
- the thermosetting compound (B) has a thermosetting functional group. Examples of the thermosetting functional group include a cyclic ether group and a thiirane group.
- the thermosetting compound (B) may have a cyclic ether group, a thiirane group, or both a cyclic ether group and a thiirane group.
- the thermosetting compound (B) may be used alone or in combination of two or more kinds.
- the cyclic ether group may be an epoxy group, an oxetanyl group, or the like.
- the epoxy group may be a part of a glycidyl group, or may be an epoxy group in a glycidyl group.
- thermosetting compound does not have the above-mentioned photocurable functional group.
- thermosetting compound (B) has a cyclic ether group, and it is more preferable that the compound has an epoxy group. From the viewpoint of exerting the effects of the present invention more effectively, it is preferable that the thermosetting compound (B) is an epoxy compound.
- the above epoxy compounds include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, phenol novolac type epoxy compounds, biphenyl type epoxy compounds, biphenyl novolac type epoxy compounds, biphenol type epoxy compounds, naphthalene type epoxy compounds, fluorene type epoxy compounds, phenol aralkyl type epoxy compounds, naphthol aralkyl type epoxy compounds, dicyclopentadiene type epoxy compounds, anthracene type epoxy compounds, epoxy compounds having an adamantane skeleton, epoxy compounds having a tricyclodecane skeleton, naphthylene ether type epoxy compounds, and epoxy compounds having a triazine nucleus in the skeleton.
- thermosetting compound having a thiirane group can be obtained by converting the epoxy group of the epoxy compound having an epoxy group to a thiirane group.
- a preferred method for converting to the thiirane group is to continuously or intermittently add a solution containing the epoxy compound having an epoxy group to a first solution containing a sulfurizing agent, and then continuously or intermittently add a second solution containing a sulfurizing agent. This method allows the epoxy group to be converted to a thiirane group.
- thermosetting compound (B) may be a maleimide compound, a styrene compound, a phenoxy compound, an oxetane compound, an episulfide compound, a (meth)acrylic compound, a phenol compound, an amino compound, an unsaturated polyester compound, a polyurethane compound, a silicone compound, or the like. From the viewpoint of further improving the sealing ability of the air cavity, it is preferable that the thermosetting compound (B) is a silicone compound.
- the content of the thermosetting compound (B) is preferably 10% by weight or more, more preferably 15% by weight or more, even more preferably 20% by weight or more, preferably 50% by weight or less, more preferably 40% by weight or less, and even more preferably 35% by weight or less.
- the content of the thermosetting compound (B) is equal to or more than the above lower limit and equal to or less than the above upper limit, the effect of the present invention can be exerted more effectively, and the adhesive strength between the circuit board and the electronic component and the adhesive part can be further increased.
- the total content of (A) the photocurable compound and (B) the thermosetting compound is preferably 7% by weight or more, more preferably 12% by weight or more, even more preferably 17% by weight or more, particularly preferably 20% by weight or more, and most preferably 30% by weight or more.
- the total content of (A) the photocurable compound and (B) the thermosetting compound is preferably 75% by weight or less, more preferably 70% by weight or less, and even more preferably 65% by weight or less.
- the curable composition may or may not contain (C) a photo- and heat-curable compound.
- the (C) photo- and heat-curable compound has a photo-curable functional group and a heat-curable functional group. From the viewpoint of further increasing the adhesive strength between the circuit board and the electronic component and the adhesive part, it is preferable that the curable composition contains (C) a photo- and heat-curable compound. Only one type of (C) photo- and heat-curable compound may be used, or two or more types may be used in combination. In this specification, "photo- and heat-curable" in a compound indicates that the compound has both photo-curable and heat-curable properties.
- the (C) photo- and thermosetting compound may have a cyclic ether group and a (meth)acryloyl group, or may have an epoxy group and a (meth)acryloyl group. It is preferable that the (C) photo- and thermosetting compound is a curable compound different from the (A) photo-curable compound and the (B) thermosetting compound.
- Examples of the (C) photo- and thermosetting compound having the above-mentioned epoxy group and (meth)acryloyl group include glycidyl (meth)acrylate, allyl glycidyl ether, 4-hydroxybutyl (meth)acrylate glycidyl ether, and 3,4-epoxycyclohexylmethyl (meth)acrylate.
- the photo- and thermosetting compound is preferably glycidyl (meth)acrylate or 4-hydroxybutyl (meth)acrylate glycidyl ether, and more preferably 4-hydroxybutyl (meth)acrylate glycidyl ether.
- the effect of the present invention can be exerted even more effectively, and the adhesive strength between the circuit board and the electronic components and the adhesive part can be further increased.
- the content of (C) the photo- and thermosetting compound is preferably 5% by weight or more, more preferably 10% by weight or more, preferably 70% by weight or less, more preferably 65% by weight or less, and even more preferably 60% by weight or less.
- the content of (C) the photo- and thermosetting compound is equal to or more than the above lower limit and equal to or less than the above upper limit, the effect of the present invention can be exerted more effectively, and the adhesive strength between the circuit board and the electronic component and the adhesive part can be further increased.
- the curable composition contains an epoxy compound, a (meth)acrylate compound, or a silicone compound.
- the curable composition preferably contains a photopolymerization initiator.
- the photopolymerization initiator may be a photoradical polymerization initiator, a photocationic polymerization initiator, or the like. Only one type of the photopolymerization initiator may be used, or two or more types may be used in combination. From the viewpoint of further improving the sealing property of the air cavity, it is preferable that the photopolymerization initiator is a photoradical polymerization initiator.
- the photoradical polymerization initiator is a compound that generates radicals by irradiation with light and initiates a radical polymerization reaction.
- the photoradical polymerization initiator include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; alkylphenone compounds such as 1-hydroxycyclohexyl phenyl ketone and 2-hydroxy-2-methylpropiophenone; acetophenone compounds such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, and 1,1-dichloroacetophenone; 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-one, and 2-benzyl-2-dimethylamino-1-one; Aminoacetates such as -(4-
- anthraquinone compounds such as 2-methylanthraquinone, 2-ethylanthraquinone, and 2-t-butylanthraquinone
- thioxanthone compounds such as 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, and 2,4-diisopropylthioxanthone
- ketal compounds such as acetophenone dimethyl ketal and benzyl dimethyl ketal
- acylphosphine oxide compounds such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide
- 1,2-octanedione 1-[4-(phenylthio)-2-(o-benzoyloxime)], ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9
- the photopolymerization initiator preferably contains an aminoacetophenone compound, and more preferably contains 2-(dimethylamino)-2-(4-methylbenzyl)-1-(4-morpholinophenyl)butan-1-one.
- a photopolymerization initiator assistant may be used together with the above-mentioned photoradical polymerization initiator.
- the photopolymerization initiator assistant include N,N-dimethylaminobenzoic acid ethyl ester, N,N-dimethylaminobenzoic acid isoamyl ester, pentyl-4-dimethylaminobenzoate, triethylamine, and triethanolamine.
- the above-mentioned photopolymerization initiator assistant may be used alone or in combination of two or more kinds.
- Titanocene compounds such as CGI-784 (manufactured by Ciba Specialty Chemicals), which have absorption in the visible light region, may also be used to promote the photoreaction.
- the above cationic photopolymerization initiators include sulfonium salts, iodonium salts, metallocene compounds, and benzoin tosylate.
- the above cationic photopolymerization initiators may be used alone or in combination of two or more.
- the content of the photopolymerization initiator is preferably 4% by weight or more, more preferably 5% by weight or more, and is preferably 20% by weight or less, more preferably 15% by weight or less, based on 100% by weight of the curable composition.
- the curable composition preferably contains a heat curing agent, which thermally cures the thermosetting compound.
- the above-mentioned heat curing agents include organic acids, amine compounds, amide compounds, hydrazide compounds, imidazole compounds, imidazoline compounds, phenol compounds, urea compounds, polysulfide compounds, and acid anhydrides.
- the above-mentioned heat curing agents may be used alone or in combination of two or more kinds.
- the above amine compounds include aliphatic polyamines, alicyclic polyamines, aromatic polyamines, hydrazides, and guanidine derivatives.
- the above amine compounds may be modified polyamine compounds such as amine-epoxy adducts.
- the above amine compounds may be adducts of the above amine compounds.
- Examples of the adducts of the above amine compounds include epoxy compound-added polyamines (reactants of epoxy compounds and polyamines), Michael addition polyamines (reactants of ⁇ , ⁇ -unsaturated ketones and polyamines), Mannich addition polyamines (condensates of polyamines with formalin and phenols), thiourea-added polyamines (reactants of thiourea and polyamines), and ketone-blocked polyamines (reactants of ketone compounds and polyamines (ketimines)).
- the above-mentioned aliphatic polyamines include diethylenetriamine, triethylenetetramine, tetraethylenepentamine, and diethylaminopropylamine.
- the above alicyclic polyamines include menthene diamine, isophorone diamine, N-aminoethylpiperazine, 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro(5,5)undecane adduct, bis(4-amino-3-methylcyclohexyl)methane, and bis(4-aminocyclohexyl)methane.
- the aromatic polyamines include m-phenylenediamine, p-phenylenediamine, o-xylylenediamine, m-xylylenediamine, p-xylylenediamine, 4,4-diaminodiphenylmethane, 4,4'-diamino-3,3'-diethyl-5,5'-dimethyldiphenylmethane, 4,4-diaminodiphenylpropane, 4,4-diaminodiphenylsulfone, 4,4-diaminodicyclohexane, bis(4-aminophenyl)phenylmethane, 1,5-diaminonaphthalene, 1,1-bis(4-aminophenyl)cyclohexane, 2,2-bis[(4-aminophenoxy)phenyl]propane, bis[4-(3-aminophenoxy)phenyl]sulfone, 1,3
- hydrazides examples include carbodihydrazide, adipic acid dihydrazide, sebacic acid dihydrazide, dodecanedioic acid dihydrazide, and isophthalic acid dihydrazide.
- guanidine derivatives include dicyandiamide, 1-o-tolyldiguanide, ⁇ -2,5-dimethylguanide, ⁇ , ⁇ -diphenyldiguanide, ⁇ , ⁇ -bisguanylguanidinodiphenyl ether, p-chlorophenyldiguanide, ⁇ , ⁇ -hexamethylenebis[ ⁇ -(p-chlorophenol)]diguanide, phenyldiguanide oxalate, acetylguanidine, and diethylcyanoacetylguanidine.
- the above-mentioned phenolic compounds include polyhydric phenolic compounds.
- Examples of the above-mentioned polyhydric phenolic compounds include phenol, cresol, ethylphenol, butylphenol, octylphenol, bisphenol A, tetrabromobisphenol A, bisphenol F, bisphenol S, 4,4'-biphenylphenol, phenol novolac resins containing a naphthalene skeleton, phenol novolac resins containing a xylylene skeleton, phenol novolac resins containing a dicyclopentadiene skeleton, and phenol novolac resins containing a fluorene skeleton.
- acid anhydrides examples include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, dodecylsuccinic anhydride, chlorendic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, methylcyclohexenetetracarboxylic anhydride, trimellitic anhydride, and polyazelaic anhydride.
- the heat curing agent preferably contains an amine compound, and is preferably an amine compound.
- the amine compound is preferably an aromatic amine compound. In this case, the adhesive strength between the circuit board and the electronic component and the adhesive portion can be further increased.
- the content of the heat curing agent in 100% by weight of the curable composition is preferably 1% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, preferably 40% by weight or less, more preferably 30% by weight or less, and even more preferably 25% by weight or less.
- the adhesive strength between the circuit board and the electronic component and the adhesive part can be further increased.
- the curable composition may or may not contain a curing accelerator.
- the curing accelerator may be used alone or in combination of two or more.
- the above-mentioned curing accelerators include tertiary amines, imidazoles, quaternary ammonium salts, quaternary phosphonium salts, organometallic salts, phosphorus compounds, and urea compounds.
- the content of the curing accelerator is preferably 0.01% by weight or more, more preferably 0.05% by weight or more, and preferably 10% by weight or less, more preferably 5% by weight or less.
- the curable composition may or may not contain a solvent.
- the solvent may be used alone or in combination of two or more.
- the above solvents include water and organic solvents.
- the above solvent is an organic solvent.
- the above organic solvents include alcohols such as ethanol, ketones such as acetone, methyl ethyl ketone, and cyclohexanone, aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene, glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and tripropylene glycol monomethyl ether, esters such as ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, and prop
- the lower the solvent content in the curable composition the better.
- the content of the solvent in 100% by weight of the curable composition is preferably 5% by weight or less, more preferably 1% by weight or less, and even more preferably 0.5% by weight or less. It is most preferable that the curable composition does not contain the solvent.
- the curable composition may contain other components in addition to the above-mentioned components, such as a coupling agent, a filler, a leveling agent, a defoaming agent, and a polymerization inhibitor.
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Acoustics & Sound (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Provided are an electronic component production method and an electronic component which make it possible to improve sealing of an air cavity. An electronic component production method according to the present invention comprises: a step for mounting at least one electronic member on a circuit board; a step for applying, to an upper surface of the circuit board, a curable composition that is liquid at 23°C and forming a curable composition layer; and a step for curing the curable composition layer and forming an adhesive layer, wherein in the step for forming the curable composition layer, the curable composition layer is formed so as to contact at least part of a side surface of the electronic member, and an air cavity is formed by the circuit board, the electronic member, and the adhesive layer.
Description
本発明は、硬化性組成物を用いた電子部品の製造方法及び電子部品に関する。
The present invention relates to a method for manufacturing an electronic component using a curable composition, and to the electronic component.
通信フィルターには、RDL層及び金属等で形成されたエアキャビティ(空間)が存在する。従来、エアキャビティは、感光性ポリイミド樹脂シート及びエポキシ樹脂シート等のシート材を用いて形成されている(例えば、下記の特許文献1)。
In communication filters, there is an air cavity (space) formed by an RDL layer and metal, etc. Conventionally, air cavities are formed using sheet materials such as photosensitive polyimide resin sheets and epoxy resin sheets (for example, see Patent Document 1 below).
シート材を用いる従来のエアキャビティの形成方法では、製造コストが高く、製造工程も複雑である。また、シート材を用いる従来のエアキャビティの形成方法では、フィルター構造の周辺部を樹脂によりモールドした場合に、樹脂がシート材を貫通してエアキャビティ内に浸入することがある。通信フィルターの通信信頼性を良好にするためには、エアキャビティ内にモールド材(樹脂)が浸入しないことが必要であり、より優れた封止性を有するエアキャビティが求められている。さらに、シート材を用いる従来のエアキャビティの形成方法では、シート材の端部を基板上に面接触させるために、基板上の本来配置する必要がない部分にもシートが配置されることがある。
Conventional methods for forming air cavities using sheet materials have high manufacturing costs and complicated manufacturing processes. Furthermore, when the periphery of the filter structure is molded with resin in conventional methods for forming air cavities using sheet materials, the resin may penetrate the sheet material and enter the air cavity. To improve the communication reliability of communication filters, it is necessary to prevent the molding material (resin) from entering the air cavity, and an air cavity with better sealing properties is required. Furthermore, in conventional methods for forming air cavities using sheet materials, in order to bring the end of the sheet material into surface contact with the board, the sheet may be placed on parts of the board where it is not actually required.
本発明の目的は、エアキャビティの封止性を高めることができる新しい電子部品の製造方法を提供することである。また、本発明の目的は、エアキャビティの封止性を高めることができる電子部品を提供することである。
The object of the present invention is to provide a new method for manufacturing electronic components that can improve the sealing of the air cavity. It is also an object of the present invention to provide electronic components that can improve the sealing of the air cavity.
本明細書において、以下の電子部品の製造方法、及び電子部品を開示する。
This specification discloses the following electronic component manufacturing method and electronic component.
項1.回路基板上に、少なくとも1つの電子部材を実装する工程と、前記回路基板の上面に23℃で液状の硬化性組成物を塗布して硬化性組成物層を形成する工程と、前記硬化性組成物層を硬化させて接着部を形成する工程とを有し、前記硬化性組成物層を形成する工程において、前記電子部材の側面の少なくとも一部に接するように前記硬化性組成物層を形成し、前記回路基板と前記電子部材と前記接着部とによりエアキャビティを形成する、電子部品の製造方法。
Item 1. A method for manufacturing an electronic component, comprising the steps of mounting at least one electronic component on a circuit board, applying a liquid curable composition at 23°C to the top surface of the circuit board to form a curable composition layer, and curing the curable composition layer to form an adhesive portion, wherein in the step of forming the curable composition layer, the curable composition layer is formed so as to contact at least a portion of the side surface of the electronic component, and an air cavity is formed by the circuit board, the electronic component, and the adhesive portion.
項2.前記電子部材が複数であり、前記電子部材を実装する工程において、前記回路基板上に、複数の前記電子部材を間隔を空けて実装し、前記硬化性組成物層を形成する工程において、複数の前記電子部材が隣り合う部分の前記電子部材の側面の少なくとも一部に接しないように、前記硬化性組成物層を形成する、項1に記載の電子部品の製造方法。
Item 2. The method for producing an electronic component according to Item 1, in which the electronic components are multiple, the multiple electronic components are mounted on the circuit board at intervals in the step of mounting the electronic components, and the curable composition layer is formed in such a way that the multiple electronic components do not contact at least a portion of the side of the electronic components in the portion where the multiple electronic components are adjacent to each other in the step of forming the curable composition layer.
項3.前記硬化性組成物層を形成する工程において、前記電子部材の外周全体にわたって、前記電子部材の側面に接するように前記硬化性組成物層を形成する、項1に記載の電子部品の製造方法。
Item 3. The method for producing an electronic component according to Item 1, wherein in the step of forming the curable composition layer, the curable composition layer is formed over the entire periphery of the electronic component so as to contact the side surface of the electronic component.
項4.前記硬化性組成物層を形成する工程において、前記電子部材の側面の上端から下端までに接するように前記硬化性組成物層を形成する、項1~3のいずれか1項に記載の電子部品の製造方法。
Item 4. The method for manufacturing an electronic component according to any one of items 1 to 3, wherein in the step of forming the curable composition layer, the curable composition layer is formed so as to contact the side surface of the electronic component from the upper end to the lower end.
項5.前記硬化性組成物層を形成する工程において、前記電子部材の上面の縁部に接するように前記硬化性組成物層を形成する、項1~4のいずれか1項に記載の電子部品の製造方法。
Item 5. The method for manufacturing an electronic component according to any one of items 1 to 4, wherein in the step of forming the curable composition layer, the curable composition layer is formed so as to contact the edge of the upper surface of the electronic component.
項6.前記硬化性組成物層を形成する工程において、前記電子部材の下面に接しないように前記硬化性組成物層を形成する、項1~5のいずれか1項に記載の電子部品の製造方法。
Item 6. The method for manufacturing an electronic component according to any one of items 1 to 5, wherein in the step of forming the curable composition layer, the curable composition layer is formed so as not to come into contact with the lower surface of the electronic component.
項7.前記接着部を形成する工程が、前記硬化性組成物層を光硬化させて前記接着部を形成する工程を備える、項1~6のいずれか1項に記載の電子部品の製造方法。
Item 7. The method for manufacturing an electronic component according to any one of items 1 to 6, wherein the step of forming the adhesive portion includes a step of photocuring the curable composition layer to form the adhesive portion.
項8.前記接着部を形成する工程が、前記硬化性組成物層を光硬化させてBステージ化物層を得る工程と、前記Bステージ化物層を熱硬化させて前記接着部を形成する工程とを備える、項1~7のいずれか1項に記載の電子部品の製造方法。
Item 8. The method for manufacturing an electronic component according to any one of items 1 to 7, wherein the step of forming the adhesive portion includes a step of photocuring the curable composition layer to obtain a B-staged material layer, and a step of thermally curing the B-staged material layer to form the adhesive portion.
項9.前記接着部を形成する工程が、前記硬化性組成物を複数滴又は1滴塗布するごとに、前記硬化性組成物層を光硬化させて、多層のBステージ化物層を得る工程と、前記多層のBステージ化物層を熱硬化させて、多層の接着部を形成する工程とを備える、項8に記載の電子部品の製造方法。
Item 9. The method for manufacturing an electronic component according to Item 8, wherein the step of forming the adhesive portion includes a step of photocuring the curable composition layer to obtain a multi-layer B-staged material layer each time multiple drops or one drop of the curable composition is applied, and a step of thermally curing the multi-layer B-staged material layer to form a multi-layer adhesive portion.
項10.前記接着部の上面及び側面を、樹脂を用いて封止する工程をさらに備える、項1~9のいずれか1項に記載の電子部品の製造方法。
Item 10. The method for manufacturing an electronic component according to any one of items 1 to 9, further comprising a step of sealing the upper and side surfaces of the adhesive portion with resin.
項11.前記硬化性組成物層を形成する工程において、前記硬化性組成物をインクジェット方式により塗布する、項1~10のいずれか1項に記載の電子部品の製造方法。
Item 11. The method for producing an electronic component according to any one of items 1 to 10, wherein in the step of forming the curable composition layer, the curable composition is applied by an inkjet method.
項12.回路基板と、少なくとも1つの電子部材と、接着部とを備え、前記回路基板上に、少なくとも1つの前記電子部材が実装されており、前記接着部が23℃で液状の硬化性組成物の硬化物であり、前記接着部が前記回路基板の上面と前記電子部材の側面の少なくとも一部とに接しており、前記回路基板と前記電子部材と前記接着部とによりエアキャビティが形成されている、電子部品。
Item 12. An electronic component comprising a circuit board, at least one electronic component, and an adhesive portion, wherein the at least one electronic component is mounted on the circuit board, the adhesive portion is a cured product of a curable composition that is liquid at 23°C, the adhesive portion is in contact with the upper surface of the circuit board and at least a part of the side surface of the electronic component, and an air cavity is formed by the circuit board, the electronic component, and the adhesive portion.
項13.前記電子部材が複数であり、前記回路基板上に、複数の前記電子部材が間隔を空けて実装されており、前記接着部が、複数の前記電子部材が隣り合う部分の前記電子部材の側面の少なくとも一部に接していない、項12に記載の電子部品。
Item 13. The electronic component according to item 12, in which the electronic components are multiple, the multiple electronic components are mounted on the circuit board with a gap between them, and the adhesive portion does not contact at least a portion of the side of the electronic components in the portion where the multiple electronic components are adjacent to each other.
項14.前記接着部が前記電子部材の外周全体にわたって、前記電子部材の側面に接している、項12に記載の電子部品。
Item 14. The electronic component according to item 12, wherein the adhesive portion contacts the side surface of the electronic component over the entire periphery of the electronic component.
項15.前記接着部が前記電子部材の上面の縁部に接している、項12~14のいずれか1項に記載の電子部品。
Item 15. An electronic component according to any one of items 12 to 14, in which the adhesive portion is in contact with an edge portion of the upper surface of the electronic member.
項16.前記接着部が前記電子部材の下面に接していない、項12~15のいずれか1項に記載の電子部品。
Item 16. An electronic component according to any one of items 12 to 15, in which the adhesive portion is not in contact with the bottom surface of the electronic member.
項17.前記接着部の高さが、1μm以上300μm以下である、項12~16のいずれか1項に記載の電子部品。
Item 17. An electronic component according to any one of items 12 to 16, in which the height of the adhesive portion is 1 μm or more and 300 μm or less.
項18.前記硬化性組成物が、エポキシ化合物、(メタ)アクリレート化合物、又はシリコーン化合物を含む、項12~17のいずれか1項に記載の電子部品。
Item 18. The electronic component according to any one of items 12 to 17, wherein the curable composition contains an epoxy compound, a (meth)acrylate compound, or a silicone compound.
項19.前記電子部材が、半導体チップ、コンデンサ、又は発光素子である、項12~18のいずれか1項に記載の電子部品。
Item 19. An electronic component according to any one of items 12 to 18, wherein the electronic component is a semiconductor chip, a capacitor, or a light-emitting element.
項20.前記電子部材が、弾性表面波フィルター、弾性バルク波フィルター、又はフィルム弾性共振器フィルターである、項12~19のいずれか1項に記載の電子部品。
Item 20. An electronic component according to any one of items 12 to 19, wherein the electronic component is a surface acoustic wave filter, a bulk acoustic wave filter, or a film acoustic resonator filter.
本発明に係る電子部品の製造方法は、回路基板上に、少なくとも1つの電子部材を実装する工程と、上記回路基板の上面に23℃で液状の硬化性組成物を塗布して硬化性組成物層を形成する工程と、上記硬化性組成物層を硬化させて接着部を形成する工程とを有する。本発明に係る電子部品の製造方法では、上記硬化性組成物層を形成する工程において、上記電子部材の側面の少なくとも一部に接するように上記硬化性組成物層を形成する。本発明に係る電子部品の製造方法では、上記回路基板と上記電子部材と上記接着部とによりエアキャビティを形成する。本発明は、新しい電子部品の製造方法に向けられており、本発明に係る電子部品の製造方法では、上記の構成が備えられているので、エアキャビティの封止性を高めることができる。
The method for manufacturing an electronic component according to the present invention includes the steps of mounting at least one electronic component on a circuit board, applying a liquid curable composition at 23°C to the upper surface of the circuit board to form a curable composition layer, and curing the curable composition layer to form an adhesive portion. In the method for manufacturing an electronic component according to the present invention, in the step of forming the curable composition layer, the curable composition layer is formed so as to contact at least a portion of the side surface of the electronic component. In the method for manufacturing an electronic component according to the present invention, an air cavity is formed by the circuit board, the electronic component, and the adhesive portion. The present invention is directed to a new method for manufacturing an electronic component, and since the method for manufacturing an electronic component according to the present invention has the above configuration, it is possible to improve the sealing of the air cavity.
本発明に係る電子部品は、回路基板と、少なくとも1つの電子部材と、接着部とを備える。本発明に係る電子部品では、上記回路基板上に、少なくとも1つの上記電子部材が実装されている。本発明に係る電子部品では、上記接着部が23℃で液状の硬化性組成物の硬化物である。本発明に係る電子部品では、上記接着部が上記回路基板の上面と上記電子部材の側面の少なくとも一部とに接している。本発明に係る電子部品では、上記回路基板と上記電子部材と上記接着部とによりエアキャビティが形成されている。本発明に係る電子部品では、上記の構成が備えられているので、エアキャビティの封止性を高めることができる。
The electronic component according to the present invention comprises a circuit board, at least one electronic component, and an adhesive part. In the electronic component according to the present invention, at least one of the electronic components is mounted on the circuit board. In the electronic component according to the present invention, the adhesive part is a cured product of a curable composition that is liquid at 23°C. In the electronic component according to the present invention, the adhesive part is in contact with the upper surface of the circuit board and at least a portion of the side surface of the electronic component. In the electronic component according to the present invention, an air cavity is formed by the circuit board, the electronic component, and the adhesive part. Since the electronic component according to the present invention has the above configuration, the sealing of the air cavity can be improved.
以下、本発明を詳細に説明する。
The present invention is explained in detail below.
シート材を用いる従来のエアキャビティの形成方法では、製造コストが高く、製造工程も複雑である。また、シート材を用いる従来のエアキャビティの形成方法では、フィルター構造の周辺部を樹脂によりモールドした場合に、樹脂がシート材を貫通してエアキャビティ内に浸入することがある。通信フィルターの通信信頼性を良好にするためには、エアキャビティ内にモールド材(樹脂)が浸入しないことが必要であり、より優れた封止性を有するエアキャビティが求められている。さらに、シート材を用いる従来のエアキャビティの形成方法では、シート材の端部を基板上に面接触させるために、基板上の本来配置する必要がない部分にもシートが配置されることがある。
Conventional methods for forming air cavities using sheet materials have high manufacturing costs and complicated manufacturing processes. Furthermore, when the periphery of the filter structure is molded with resin in conventional methods for forming air cavities using sheet materials, the resin may penetrate the sheet material and enter the air cavity. To improve the communication reliability of communication filters, it is necessary to prevent the molding material (resin) from entering the air cavity, and an air cavity with better sealing properties is required. Furthermore, in conventional methods for forming air cavities using sheet materials, in order to bring the end of the sheet material into surface contact with the board, the sheet may be placed on parts of the board where it is not actually required.
本発明者らは、上記の課題を解決するために、鋭意検討した結果、本発明に係る電子部品及び電子部品の製造方法により、特に23℃で液状の硬化性組成物を用いて接着部を形成することにより、エアキャビティの封止性がかなり高くなることを見出した。23℃で液状の硬化性組成物を用いて接着部を形成することにより、硬化性シートを用いて接着部を形成した場合と比べて、エアキャビティの封止性がかなり高くなる。さらに、本発明では、モールド封止する場合に、モールド材がエアキャビティ内に浸入し難い。
The inventors conducted extensive research to solve the above problems and found that the electronic component and manufacturing method for an electronic component according to the present invention significantly improves the air cavity sealability, particularly by forming an adhesive joint using a curable composition that is liquid at 23°C. By forming an adhesive joint using a curable composition that is liquid at 23°C, the air cavity sealability is significantly improved compared to when an adhesive joint is formed using a curable sheet. Furthermore, in the present invention, the molding material is less likely to penetrate into the air cavity when molding and sealing.
(電子部品及び電子部品の製造方法)
本発明に係る電子部品は、回路基板と、少なくとも1つの電子部材と、接着部とを備える。本発明に係る電子部品では、上記回路基板上に、少なくとも1つの上記電子部材が実装されている。本発明に係る電子部品では、上記接着部が23℃で液状の硬化性組成物の硬化物である。本発明に係る電子部品では、上記接着部が上記回路基板の上面と上記電子部材の側面の少なくとも一部とに接している。本発明に係る電子部品では、上記回路基板と上記電子部材と上記接着部とによりエアキャビティが形成されている。 (Electronic components and manufacturing methods for electronic components)
The electronic component according to the present invention includes a circuit board, at least one electronic member, and an adhesive portion. In the electronic component according to the present invention, at least one electronic member is mounted on the circuit board. In the electronic component according to the present invention, the adhesive portion is a cured product of a curable composition that is liquid at 23°C. In the electronic component according to the present invention, the adhesive portion is in contact with an upper surface of the circuit board and at least a portion of a side surface of the electronic member. In the electronic component according to the present invention, an air cavity is formed by the circuit board, the electronic member, and the adhesive portion.
本発明に係る電子部品は、回路基板と、少なくとも1つの電子部材と、接着部とを備える。本発明に係る電子部品では、上記回路基板上に、少なくとも1つの上記電子部材が実装されている。本発明に係る電子部品では、上記接着部が23℃で液状の硬化性組成物の硬化物である。本発明に係る電子部品では、上記接着部が上記回路基板の上面と上記電子部材の側面の少なくとも一部とに接している。本発明に係る電子部品では、上記回路基板と上記電子部材と上記接着部とによりエアキャビティが形成されている。 (Electronic components and manufacturing methods for electronic components)
The electronic component according to the present invention includes a circuit board, at least one electronic member, and an adhesive portion. In the electronic component according to the present invention, at least one electronic member is mounted on the circuit board. In the electronic component according to the present invention, the adhesive portion is a cured product of a curable composition that is liquid at 23°C. In the electronic component according to the present invention, the adhesive portion is in contact with an upper surface of the circuit board and at least a portion of a side surface of the electronic member. In the electronic component according to the present invention, an air cavity is formed by the circuit board, the electronic member, and the adhesive portion.
本発明に係る電子部品の製造方法は、以下の(1)~(3)の工程を備える。(1)回路基板上に、少なくとも1つの電子部材を実装する工程。(2)上記回路基板の上面に23℃で液状の硬化性組成物を塗布して硬化性組成物層を形成する工程。(3)上記硬化性組成物層を硬化させて接着部を形成する工程。
The method for manufacturing an electronic component according to the present invention comprises the following steps (1) to (3): (1) Mounting at least one electronic component on a circuit board. (2) Applying a liquid curable composition at 23°C to the upper surface of the circuit board to form a curable composition layer. (3) Curing the curable composition layer to form an adhesive portion.
本発明に係る電子部品の製造方法では、上記(2)硬化性組成物層を形成する工程において、上記電子部材の側面の少なくとも一部に接するように上記硬化性組成物層を形成する。
In the method for manufacturing an electronic component according to the present invention, in the step (2) of forming a curable composition layer, the curable composition layer is formed so as to contact at least a portion of the side surface of the electronic component.
本発明に係る電子部品の製造方法では、上記回路基板と上記電子部材と上記接着部とによりエアキャビティを形成する。
In the electronic component manufacturing method according to the present invention, an air cavity is formed by the circuit board, the electronic component, and the adhesive portion.
以下、図面を参照しつつ、本発明の具体的な実施形態を説明する。なお、以下の図面において、大きさ、厚み、及び形状等は、図示の便宜上、実際の大きさ、厚み、及び形状等と異なる場合がある。
Below, specific embodiments of the present invention will be described with reference to the drawings. Note that in the following drawings, the size, thickness, shape, etc. may differ from the actual size, thickness, shape, etc. for the convenience of illustration.
図1(a)は、本発明の第1の実施形態に係る電子部品を模式的に示す平面図であり、図1(b)は、該電子部品を模式的に示す断面図である。図1(b)は、図1(a)のI-I線に沿う断面図である。
FIG. 1(a) is a plan view that shows a schematic diagram of an electronic component according to a first embodiment of the present invention, and FIG. 1(b) is a cross-sectional view that shows a schematic diagram of the electronic component. FIG. 1(b) is a cross-sectional view taken along line I-I in FIG. 1(a).
図1に示す電子部品10は、回路基板1と、電子部材2と、接着部3と、モールド樹脂部44とを備える。電子部材2は、はんだボール41と、樹脂シート42と、接続端子43とを有する(図1(a)では図示せず)。電子部品10では、1つの電子部材2が実装されている。電子部品10では、電子部材2は1つである。接着部3は、23℃で液状の硬化性組成物の硬化物である。接着部3は、上記硬化性組成物の光及び熱硬化物である。接着部3は、回路基板1の上面と電子部材2の側面の一部とに接している。接着部3は、回路基板1の上面の一部と接しており、電子部材2の側面の一部及び上面の全体と接している。接着部3は、電子部材2の下面に接していない。接着部3は、回路基板1の上面と、電子部材2の側面及び上面とを接着している。接着部3は、回路基板1の上面に配置されている。接着部3は、電子部材2の側面に配置されており、かつ、電子部材2の上面に配置されている。接着部3は、回路基板1の上面の一部に配置されおり、電子部材2の側面の一部及び上面の全体に配置されている。接着部3は、電子部材2の下面に配置されていない。回路基板1と電子部材2と接着部3とにより、エアキャビティRが形成されている。モールド樹脂部44は、接着部3の上面及び側面に配置されている。
1 includes a circuit board 1, an electronic component 2, an adhesive portion 3, and a molded resin portion 44. The electronic component 2 includes a solder ball 41, a resin sheet 42, and a connection terminal 43 (not shown in FIG. 1(a)). In the electronic component 10, one electronic component 2 is mounted. In the electronic component 10, there is one electronic component 2. The adhesive portion 3 is a cured product of a curable composition that is liquid at 23°C. The adhesive portion 3 is a photo- and heat-cured product of the curable composition. The adhesive portion 3 is in contact with the upper surface of the circuit board 1 and a part of the side surface of the electronic component 2. The adhesive portion 3 is in contact with a part of the upper surface of the circuit board 1, and is in contact with a part of the side surface and the entire upper surface of the electronic component 2. The adhesive portion 3 is not in contact with the lower surface of the electronic component 2. The adhesive portion 3 bonds the upper surface of the circuit board 1 to the side surface and upper surface of the electronic component 2. The adhesive portion 3 is disposed on the upper surface of the circuit board 1. The adhesive portion 3 is disposed on the side of the electronic component 2 and on the top surface of the electronic component 2. The adhesive portion 3 is disposed on part of the top surface of the circuit board 1, and on part of the side and the entire top surface of the electronic component 2. The adhesive portion 3 is not disposed on the bottom surface of the electronic component 2. An air cavity R is formed by the circuit board 1, the electronic component 2, and the adhesive portion 3. The molded resin portion 44 is disposed on the top and side surfaces of the adhesive portion 3.
図1に示す電子部品10では、エアキャビティRの封止性がかなり高い。さらに、本発明では、モールド材(モールド樹脂部の材料)がエアキャビティR内に浸入し難い。
In the electronic component 10 shown in FIG. 1, the air cavity R is highly sealed. Furthermore, in the present invention, the molding material (the material of the molded resin portion) is less likely to penetrate into the air cavity R.
図2は、本発明の第2の実施形態に係る電子部品を模式的に示す断面図である。
FIG. 2 is a cross-sectional view showing a schematic diagram of an electronic component according to a second embodiment of the present invention.
図2に示す電子部品11は、回路基板1と、複数の電子部材2と、接着部3と、モールド樹脂部44とを備える。電子部品11では、複数の電子部材2が実装されている。電子部品11では、電子部材2が複数である。電子部品11では、回路基板1上に、複数の電子部材2が間隔を空けて実装されている。接着部3は、複数の電子部材2が隣り合う部分の電子部材2の側面に接していない。接着部3は、隣り合う電子部材2間の間隙には配置されていない。接着部3は、隣り合う電子部材2間の電子部材2の側面には配置されていない。
The electronic component 11 shown in FIG. 2 includes a circuit board 1, multiple electronic components 2, adhesive portions 3, and a molded resin portion 44. Multiple electronic components 2 are mounted in the electronic component 11. There are multiple electronic components 2 in the electronic component 11. In the electronic component 11, the multiple electronic components 2 are mounted on the circuit board 1 with spaces between them. The adhesive portions 3 do not contact the side surfaces of the electronic components 2 in the portion where the multiple electronic components 2 are adjacent. The adhesive portions 3 are not disposed in the gaps between adjacent electronic components 2. The adhesive portions 3 are not disposed on the side surfaces of the electronic components 2 between adjacent electronic components 2.
接着部3は、回路基板1の上面と電子部材2の側面の一部とに接している。接着部3は、回路基板1の上面の一部と接しており、電子部材2の側面の一部及び上面の全体と接している。接着部3は、電子部材2の下面に接していない。接着部3は、回路基板1の上面と、電子部材2の側面及び上面とを接着している。接着部3は、回路基板1の上面に配置されている。接着部3は、電子部材2の側面に配置されており、かつ、電子部材2の上面に配置されている。接着部3は、回路基板1の上面の一部に配置されおり、電子部材2の側面の一部及び上面の全体に配置されている。接着部3は、電子部材2の下面に配置されていない。回路基板1と電子部材2と接着部3とにより、エアキャビティRが形成されている。モールド樹脂部44は、接着部3の上面及び側面に配置されている。
The adhesive portion 3 is in contact with the upper surface of the circuit board 1 and a part of the side surface of the electronic component 2. The adhesive portion 3 is in contact with a part of the upper surface of the circuit board 1, and is in contact with a part of the side surface and the entire upper surface of the electronic component 2. The adhesive portion 3 is not in contact with the lower surface of the electronic component 2. The adhesive portion 3 bonds the upper surface of the circuit board 1 to the side and upper surface of the electronic component 2. The adhesive portion 3 is disposed on the upper surface of the circuit board 1. The adhesive portion 3 is disposed on the side surface of the electronic component 2 and is also disposed on the upper surface of the electronic component 2. The adhesive portion 3 is disposed on a part of the upper surface of the circuit board 1, and is disposed on a part of the side surface and the entire upper surface of the electronic component 2. The adhesive portion 3 is not disposed on the lower surface of the electronic component 2. An air cavity R is formed by the circuit board 1, the electronic component 2, and the adhesive portion 3. The molded resin portion 44 is disposed on the upper surface and side of the adhesive portion 3.
図2に示す電子部品11では、エアキャビティRの封止性がかなり高い。さらに、本発明では、モールド材(モールド樹脂部の材料)がエアキャビティR内に浸入し難い。
In the electronic component 11 shown in FIG. 2, the sealing performance of the air cavity R is quite high. Furthermore, in the present invention, the molding material (the material of the molded resin portion) is less likely to penetrate into the air cavity R.
図3は、本発明の第3の実施形態に係る電子部品を模式的に示す断面図である。
FIG. 3 is a cross-sectional view showing a schematic diagram of an electronic component according to a third embodiment of the present invention.
図3に示す電子部品12は、図1に示す電子部品10と、接着部3の構成のみが異なる。電子部品12では、接着部3が電子部材2(ただし、はんだボール41を除く)の側面の上端から下端までに接している。
The electronic component 12 shown in FIG. 3 differs from the electronic component 10 shown in FIG. 1 only in the configuration of the adhesive portion 3. In the electronic component 12, the adhesive portion 3 contacts the side of the electronic member 2 (excluding the solder balls 41) from the upper end to the lower end.
図3に示す電子部品12では、エアキャビティRの封止性がかなり高い。さらに、本発明では、モールド材(モールド樹脂部の材料)がエアキャビティR内に浸入し難い。
In the electronic component 12 shown in FIG. 3, the air cavity R is highly sealed. Furthermore, in the present invention, the molding material (the material of the molded resin portion) is less likely to penetrate into the air cavity R.
なお、上記電子部品では、上記接着部が、上記電子部材の上面に接していてもよく、接していなくてもよい。上記電子部品では、上記接着部が、上記電子部材の上面に配置されていてもよく、配置されていなくてもよい。また、上記電子部品では、上記接着部が、上記電子部材の下面に接していてもよく、接していなくてもよい。また、上記電子部品では、上記接着部が、上記電子部材の下面に配置されていてもよく、配置されていなくてもよい。
In the electronic component, the adhesive portion may or may not be in contact with the upper surface of the electronic member. In the electronic component, the adhesive portion may or may not be disposed on the upper surface of the electronic member. In addition, in the electronic component, the adhesive portion may or may not be in contact with the lower surface of the electronic member. In addition, in the electronic component, the adhesive portion may or may not be disposed on the lower surface of the electronic member.
電子部品10,11,12、及び後述する電子部品10Xでは、電子部材2は半導体チップである。電子部品10,11,12、及び後述する電子部品10Xは、通信フィルターである。
In electronic components 10, 11, and 12, and electronic component 10X described below, electronic member 2 is a semiconductor chip. Electronic components 10, 11, and 12, and electronic component 10X described below, are communication filters.
図4(a)及び図4(b)は、図1に示す電子部品の製造方法の各工程を説明するための断面図である。図5(c)及び図5(d)は、図1に示す電子部品の製造方法の各工程を説明するための断面図である。図6(e)及び図6(f)は、図1に示す電子部品の製造方法の各工程を説明するための断面図である。図7(g)は、図1に示す電子部品の製造方法の各工程を説明するための断面図である。図4~7の(a)~(g)は、図1に示す電子部品の製造方法の一連の工程を示している。
FIGS. 4(a) and 4(b) are cross-sectional views for explaining each step of the method for manufacturing the electronic component shown in FIG. 1. FIGS. 5(c) and 5(d) are cross-sectional views for explaining each step of the method for manufacturing the electronic component shown in FIG. 1. FIGS. 6(e) and 6(f) are cross-sectional views for explaining each step of the method for manufacturing the electronic component shown in FIG. 1. FIG. 7(g) is a cross-sectional view for explaining each step of the method for manufacturing the electronic component shown in FIG. 1. FIGS. 4-7(a)-(g) show a series of steps in the method for manufacturing the electronic component shown in FIG. 1.
先ず、回路基板1上に、少なくとも1つの電子部材を実装する(実装工程)。次に、図4(a)に示すように、回路基板1の上面(表面上)に、インクジェット装置を用いて、23℃で液状の硬化性組成物を塗布して、硬化性組成物層3Aを形成する(塗布工程)。回路基板1の上面に、上記硬化性組成物を塗布して、硬化性組成物層3Aを形成する。インクジェット装置の吐出部51から、上記硬化性組成物を吐出する。
First, at least one electronic component is mounted on the circuit board 1 (mounting process). Next, as shown in FIG. 4(a), a liquid curable composition is applied to the upper surface (front surface) of the circuit board 1 at 23° C. using an inkjet device to form a curable composition layer 3A (application process). The curable composition is applied to the upper surface of the circuit board 1 to form a curable composition layer 3A. The curable composition is ejected from the ejection section 51 of the inkjet device.
次に、図4(b)、図5(c)及び図5(d)、並びに図6(e)及び図6(f)に示すように、硬化性組成物層3Aを硬化させて接着部3を形成する。具体的に、図4(b)に示すように、インクジェット装置の光照射部52から硬化性組成物層3Aに光を照射して、硬化性組成物層3Aの硬化を進行させて、Bステージ化物層3Bを形成する(光硬化工程)。Bステージ化物層3Bは、上記硬化性組成物の予備硬化物層である。
Next, as shown in Figures 4(b), 5(c), 5(d), 6(e) and 6(f), the curable composition layer 3A is cured to form the adhesive portion 3. Specifically, as shown in Figure 4(b), the curable composition layer 3A is irradiated with light from the light irradiation section 52 of the inkjet device to advance the curing of the curable composition layer 3A and form a B-staged material layer 3B (photocuring step). The B-staged material layer 3B is a preliminary cured material layer of the above-mentioned curable composition.
なお、上記電子部品の製造方法では、特定の領域に上記硬化性組成物を塗布した後、塗布された上記硬化性組成物の全体に対して光を照射してBステージ化物層を形成してもよい。上記電子部品の製造方法では、上記硬化性組成物を複数滴塗布するごとに、塗布された上記硬化性組成物に対して光を照射してBステージ化物層を形成してもよい。上記電子部品の製造方法では、上記硬化性組成物を1滴塗布するごとに、塗布された上記硬化性組成物に対して光を照射してBステージ化物層を形成してもよい。すなわち、上記硬化性組成物を複数滴塗布又は1滴塗布するごとに、塗布された上記硬化性組成物に対して光を照射してBステージ化物層を形成してもよい。従って、上記硬化性組成物を複数滴塗布又は1滴塗布するごとに、上記硬化性組成物層を光硬化させて、多層のBステージ化物層を得てもよい。
In the method for producing an electronic component, the curable composition may be applied to a specific region, and then the entire applied curable composition may be irradiated with light to form a B-staged product layer. In the method for producing an electronic component, the applied curable composition may be irradiated with light every time multiple drops of the curable composition are applied to form a B-staged product layer. In the method for producing an electronic component, the applied curable composition may be irradiated with light every time one drop of the curable composition is applied to form a B-staged product layer. That is, the applied curable composition may be irradiated with light to form a B-staged product layer every time multiple drops or one drop of the curable composition are applied. Therefore, the curable composition layer may be photocured every time multiple drops or one drop of the curable composition are applied to obtain multiple B-staged product layers.
上記電子部品の製造方法では、硬化性組成物層3Aを形成する工程(塗布工程)において、電子部材2の側面の少なくとも一部に接するように硬化性組成物層3Aを形成し、Bステージ化物層3Bを形成する工程(光硬化工程)において、電子部材2の側面の少なくとも一部に接するようにBステージ化物層3Bを形成する(図6(e)参照)。
In the above-mentioned method for manufacturing electronic components, in the step of forming the curable composition layer 3A (coating step), the curable composition layer 3A is formed so as to contact at least a portion of the side surface of the electronic component 2, and in the step of forming the B-stage compound layer 3B (photo-curing step), the B-stage compound layer 3B is formed so as to contact at least a portion of the side surface of the electronic component 2 (see FIG. 6(e)).
上記光硬化工程後、上記塗布工程及び上記光硬化工程を繰り返すか否か判断する。上記塗布工程及び上記光硬化工程が繰り返される場合には、形成されたBステージ化物層の回路基板側とは反対の表面側に硬化性組成物が塗布される。
After the photocuring step, it is determined whether or not to repeat the coating step and the photocuring step. If the coating step and the photocuring step are repeated, the curable composition is applied to the surface side of the formed B-stage material layer opposite the circuit board side.
図5(c)及び図5(d)はそれぞれ、2回目の塗布工程及び2回目の光硬化工程を示す図である。図5(c)に示すように、インクジェット装置を用いて、Bステージ化物層3Bの回路基板1側とは反対の表面上に上記硬化性組成物を塗布し、Bステージ化物層3Bの表面上に硬化性組成物層3Aを形成する。次に、図5(d)に示すように、インクジェット装置の光照射部52から、塗布された硬化性組成物層3Aに光を照射して、Bステージ化物層3Bを形成する。
FIG. 5(c) and FIG. 5(d) are diagrams showing the second coating step and the second photocuring step, respectively. As shown in FIG. 5(c), the above-mentioned curable composition is applied to the surface of the B-staged material layer 3B opposite the circuit board 1 side using an inkjet device, and a curable composition layer 3A is formed on the surface of the B-staged material layer 3B. Next, as shown in FIG. 5(d), the applied curable composition layer 3A is irradiated with light from the light irradiation section 52 of the inkjet device to form the B-staged material layer 3B.
図4(a)及び図4(b)、並びに図5(c)及び図5(d)では、上記塗布工程及び上記光硬化工程は、硬化性組成物層の厚み方向にて、図4(a)及び図4(b)と、図5(c)及び図5(d)との2回行われている。上記塗布工程及び上記光硬化工程をそれぞれ、硬化性組成物層の厚み方向にて複数回行うことにより、Bステージ化物層の厚みを大きくすることができ、Bステージ化物層の比(高さ(厚み)/幅)(アスペクト比)を大きくすることができる。上記塗布工程及び上記光硬化工程はそれぞれ、2回以上行われてもよく、3回以上行われてもよい。
In Figures 4(a) and 4(b), and Figures 5(c) and 5(d), the coating step and the photocuring step are performed twice in the thickness direction of the curable composition layer, in Figures 4(a) and 4(b) and Figures 5(c) and 5(d). By performing the coating step and the photocuring step multiple times in the thickness direction of the curable composition layer, respectively, the thickness of the B-staged material layer can be increased, and the ratio (height (thickness)/width) (aspect ratio) of the B-staged material layer can be increased. The coating step and the photocuring step may each be performed two or more times, or three or more times.
上記塗布工程及び上記光硬化工程において、塗布と光硬化とを繰り返すことにより、図6(e)に示すように、電子部材2の側面と接触したBステージ化物層3Bを形成する。なお、図6(e)では、電子部材2の側面及び上面と接触したBステージ化物層3Bが形成されている。
By repeating the application and photo-curing in the application and photo-curing processes, a B-stage compound layer 3B is formed in contact with the side surface of the electronic component 2, as shown in FIG. 6(e). In FIG. 6(e), a B-stage compound layer 3B is formed in contact with the side surface and top surface of the electronic component 2.
次に、加熱によりBステージ化物層3Bを熱硬化させる(熱硬化工程)。図6(e)で得られた回路基板1と電子部材2とBステージ化物層3Bとを備える積層構造体を加熱することにより、Bステージ化物層3Bを熱硬化させる。これにより、図6(f)に示すように、接着部3が形成される。接着部3は、上記硬化性組成物の光及び熱硬化物層である。
Next, the B-staged material layer 3B is thermally cured by heating (thermal curing process). The laminated structure including the circuit board 1, electronic component 2, and B-staged material layer 3B obtained in FIG. 6(e) is heated to thermally cure the B-staged material layer 3B. This forms the adhesive portion 3 as shown in FIG. 6(f). The adhesive portion 3 is a photo- and thermo-cured layer of the curable composition.
次に、図7(g)に示すように、接着部3の上面及び側面を、樹脂を用いて封止する。接着部3の上面及び側面に樹脂を配置して、モールド樹脂部44を形成する。
Next, as shown in FIG. 7(g), the upper and side surfaces of the adhesive portion 3 are sealed with resin. Resin is placed on the upper and side surfaces of the adhesive portion 3 to form a molded resin portion 44.
このようにして、図1に示す電子部品10を得ることができる。
In this manner, the electronic component 10 shown in FIG. 1 can be obtained.
図8(a)及び図8(b)は、電子部材に対する接着部の形成領域を説明するための図である。図8(b)は、図8(a)のI-I線に沿う図である。図8(b)では、接着部3の形成領域が斜線で示されている。電子部品10では、接着部3は、電子部材2の側面の全てに接している。電子部品10では、接着部3が電子部材2の外周全体にわたって、電子部材2の側面に接している。
FIGS. 8(a) and 8(b) are diagrams for explaining the formation area of the adhesive portion on the electronic component. FIG. 8(b) is a diagram taken along line I-I in FIG. 8(a). In FIG. 8(b), the formation area of the adhesive portion 3 is indicated by diagonal lines. In electronic component 10, adhesive portion 3 contacts all of the side surfaces of electronic component 2. In electronic component 10, adhesive portion 3 contacts the side surfaces of electronic component 2 over the entire periphery of electronic component 2.
図9(a)及び図9(b)は、電子部材に対する接着部の形成領域の変形例を説明するための図である。図9(b)は、図9(a)のI-I線に沿う図である。図9(b)では、接着部3Xの形成領域が斜線で示されている。電子部品10Xでは、接着部3Xは、電子部材2の側面の一部に接しおり、電子部材2の外周の一部の側面に接している。電子部品10Xでは、電子部材2の側面において、接着部3Xが配置されていない領域が存在する。
FIGS. 9(a) and 9(b) are diagrams for explaining modified examples of the formation area of the adhesive portion on the electronic component. FIG. 9(b) is a diagram taken along line I-I in FIG. 9(a). In FIG. 9(b), the formation area of the adhesive portion 3X is indicated by diagonal lines. In electronic component 10X, adhesive portion 3X is in contact with part of the side surface of electronic component 2, and is in contact with part of the side surface of the periphery of electronic component 2. In electronic component 10X, there is an area on the side surface of electronic component 2 where adhesive portion 3X is not located.
エアキャビティの封止性をより一層高める観点からは、上記電子部品の製造方法では、上記(2)硬化性組成物層を形成する工程(塗布工程)において、上記硬化性組成物をインクジェット方式により塗布することが好ましい。エアキャビティの封止性をより一層高める観点からは、上記電子部品の製造方法では、上記(2)硬化性組成物層を形成する工程(塗布工程)において、上記硬化性組成物をインクジェット装置を用いて塗布することが好ましい。
From the viewpoint of further improving the air cavity sealability, in the above-mentioned method for producing an electronic component, it is preferable to apply the above-mentioned curable composition by an inkjet method in the above-mentioned (2) step of forming a curable composition layer (coating step). From the viewpoint of further improving the air cavity sealability, in the above-mentioned method for producing an electronic component, it is preferable to apply the above-mentioned curable composition by an inkjet device in the above-mentioned (2) step of forming a curable composition layer (coating step).
上記電子部品では、上記接着部が、上記電子部材の外周全体にわたって、上記電子部材の側面に接していていてもよく、上記電子部材の外周の一部の側面に接していてもよい。
In the electronic component, the adhesive portion may be in contact with the side surface of the electronic component over the entire periphery of the electronic component, or may be in contact with only a portion of the side surface of the periphery of the electronic component.
エアキャビティの封止性をより一層高める観点からは、上記電子部品では、上記接着部が、上記電子部材の外周全体にわたって、上記電子部材の側面に接していることが好ましい(例えば、図8(b)参照)。エアキャビティの封止性をより一層高める観点からは、上記電子部材が1つである場合に、上記接着部が、上記電子部材の全ての側面に接していることが好ましい。エアキャビティの封止性をより一層高める観点からは、上記電子部材が複数である場合に、上記接着部が、上記電子部材の集合体の外周全体にわたって、上記電子部材の側面に接していることが好ましい。
From the viewpoint of further enhancing the sealing of the air cavity, it is preferable that in the electronic component, the adhesive portion contacts the side of the electronic component over the entire periphery of the electronic component (see, for example, FIG. 8(b)). From the viewpoint of further enhancing the sealing of the air cavity, when there is one electronic component, it is preferable that the adhesive portion contacts all of the side surfaces of the electronic component. From the viewpoint of further enhancing the sealing of the air cavity, when there are multiple electronic components, it is preferable that the adhesive portion contacts the side of the electronic component over the entire periphery of the assembly of the electronic components.
なお、上記電子部品では、上記接着部が、上記電子部材の外周全体にわたって上記電子部材の側面に接していなくても、エアキャビティの封止性が確保できることがある。上記電子部品では、上記接着部が、上記電子部材の外周の一部の側面にのみ接していてもよい(例えば、図9(b)参照)。上記電子部材が1つである場合に、上記接着部が、上記電子部材の側面の一部に接していてもよい。上記電子部材が複数である場合に、上記接着部が、上記電子部材の集合体の外周の一部の側面に接していてもよい。
In the electronic component, the sealing of the air cavity may be ensured even if the adhesive portion does not contact the side surface of the electronic component over the entire periphery of the electronic component. In the electronic component, the adhesive portion may contact only a portion of the side surface of the periphery of the electronic component (see, for example, FIG. 9(b)). When there is one electronic component, the adhesive portion may contact a portion of the side surface of the electronic component. When there are multiple electronic components, the adhesive portion may contact a portion of the side surface of the periphery of the assembly of electronic components.
本発明の効果をより一層効果的に発揮する観点からは、上記電子部品では、上記接着部が上記電子部材の側面の上端から下端までに接していることが好ましい。本発明の効果をより一層効果的に発揮する観点からは、上記電子部品では、上記接着部が上記電子部材の側面の上下方向の全体に接していることが好ましい。本発明の効果をより一層効果的に発揮する観点からは、上記電子部品の製造方法では、上記(2)硬化性組成物層を形成する工程(塗布工程)において、上記電子部材の側面の上端から下端までに接するように上記硬化性組成物層を形成することが好ましい。本発明の効果をより一層効果的に発揮する観点からは、上記電子部品の製造方法では、上記(2)硬化性組成物層を形成する工程(塗布工程)において、上記電子部材の側面の上下方向の全体に接するように上記硬化性組成物層を形成することが好ましい。エアキャビティの封止性をより一層高める観点からは、上記電子部品の製造方法では、上記(2)硬化性組成物層を形成する工程(塗布工程)において、上記電子部材の側面の上端から下端までに上記硬化性組成物を塗布することが好ましい。なお、本明細書では、「電子部材の側面の上端から下端まで」とは、はんだボールを除く電子部材の側面の上端から下端までを意味する。
From the viewpoint of exerting the effect of the present invention more effectively, in the electronic component, the adhesive portion is preferably in contact with the entire vertical direction of the side surface of the electronic component. From the viewpoint of exerting the effect of the present invention more effectively, in the electronic component manufacturing method, in the step (2) of forming a curable composition layer (coating step), the curable composition layer is preferably formed so as to be in contact with the entire vertical direction of the side surface of the electronic component. From the viewpoint of exerting the effect of the present invention more effectively, in the electronic component manufacturing method, in the step (2) of forming a curable composition layer (coating step), the curable composition layer is preferably formed so as to be in contact with the entire vertical direction of the side surface of the electronic component. From the viewpoint of further enhancing the sealing property of the air cavity, in the electronic component manufacturing method, in the step (2) of forming a curable composition layer (coating step), the curable composition is preferably applied from the upper end to the lower end of the side surface of the electronic component. In this specification, "from the top to the bottom of the side of the electronic component" means from the top to the bottom of the side of the electronic component excluding the solder balls.
上記電子部品では、上記接着部が、上記電子部材の側面の一部に接していてもよく、上記電子部材の側面の全体に接していてもよい。本発明の効果をより一層効果的に発揮する観点からは、上記電子部品では、上記接着部が上記電子部材の側面の全体に接していることが好ましい。エアキャビティの封止性をより一層高める観点からは、上記電子部品の製造方法では、上記(2)硬化性組成物層を形成する工程(塗布工程)において、上記電子部材の側面の全体に接するように上記硬化性組成物層を形成することが好ましい。エアキャビティの封止性をより一層高める観点からは、上記電子部品の製造方法では、上記(2)硬化性組成物層を形成する工程(塗布工程)において、上記電子部材の側面の全体に上記硬化性組成物を塗布することが好ましい。
In the electronic component, the adhesive portion may be in contact with a portion of the side surface of the electronic member, or may be in contact with the entire side surface of the electronic member. From the viewpoint of more effectively exerting the effects of the present invention, it is preferable that the adhesive portion be in contact with the entire side surface of the electronic member in the electronic component. From the viewpoint of further improving the sealing property of the air cavity, it is preferable that in the manufacturing method of the electronic component, in the step (2) of forming a curable composition layer (coating step), the curable composition layer is formed so as to be in contact with the entire side surface of the electronic member. From the viewpoint of further improving the sealing property of the air cavity, it is preferable that in the manufacturing method of the electronic component, in the step (2) of forming a curable composition layer (coating step), the curable composition is coated on the entire side surface of the electronic member.
上記電子部材が1つである場合に、上記接着部は、上記電子部材の全ての側面の少なくとも一部に接していることが好ましく、上記電子部材の全ての側面の上端から下端までに接していることがより好ましく、上記電子部材の全ての側面の全体に接していることがさらに好ましい。これらの場合には、本発明の効果をより一層効果的に発揮することができる。
When there is only one electronic component, it is preferable that the adhesive portion contacts at least a portion of all side surfaces of the electronic component, more preferably contacts all side surfaces of the electronic component from the top to the bottom, and even more preferably contacts the entirety of all side surfaces of the electronic component. In these cases, the effects of the present invention can be exerted even more effectively.
エアキャビティの封止性をより一層高める観点からは、上記電子部材が複数である場合に、上記回路基板上に、複数の上記電子部材が間隔を空けて実装されていることが好ましい。上記電子部材間の間隔は、特に限定されない。上記電子部材間の間隔は、50μm以上であってもよく、100μm以上であってもよく、500μm以下であってもよく、300μm以下であってもよい。
From the viewpoint of further enhancing the sealing of the air cavity, when there are multiple electronic components, it is preferable that the multiple electronic components are mounted on the circuit board with a gap between them. The gap between the electronic components is not particularly limited. The gap between the electronic components may be 50 μm or more, 100 μm or more, 500 μm or less, or 300 μm or less.
エアキャビティの封止性をより一層高める観点からは、上記電子部材が複数である場合に、上記接着部が、複数の上記電子部材が隣り合う部分の上記電子部材の側面の少なくとも一部に接していないことが好ましい。エアキャビティの封止性をより一層高める観点からは、上記電子部材が複数である場合に、上記接着部が、隣り合う上記電子部材間の上記電子部材の側面の少なくとも一部に配置されていないことが好ましく、複数の上記電子部材が隣り合う部分の上記電子部材の側面の少なくとも一部に配置されていないことが好ましい。エアキャビティの封止性をより一層高める観点からは、上記電子部材が複数である場合に、複数の上記電子部材が隣り合う部分の上記電子部材の側面に、上記接着部と接していない部分があることが好ましい。エアキャビティの封止性をより一層高める観点からは、上記電子部材が複数である場合に、上記接着部は、複数の上記電子部材が隣り合う部分の上記電子部材間の側面には接していないことが好ましい。エアキャビティの封止性をより一層高める観点からは、上記電子部材が複数である場合に、上記接着部は、隣り合う上記電子部材間の間隙には配置されていないことが好ましく、複数の上記電子部材が隣り合う部分の上記電子部材の側面には配置されていないことが好ましい。
From the viewpoint of further enhancing the sealing property of the air cavity, when there are multiple electronic components, it is preferable that the adhesive portion does not contact at least a part of the side of the electronic components in the portion where the multiple electronic components are adjacent. From the viewpoint of further enhancing the sealing property of the air cavity, when there are multiple electronic components, it is preferable that the adhesive portion is not arranged on at least a part of the side of the electronic components between adjacent electronic components, and it is preferable that the adhesive portion is not arranged on at least a part of the side of the electronic components in the portion where the multiple electronic components are adjacent. From the viewpoint of further enhancing the sealing property of the air cavity, when there are multiple electronic components, it is preferable that the side of the electronic components in the portion where the multiple electronic components are adjacent has a part that is not in contact with the adhesive portion. From the viewpoint of further enhancing the sealing property of the air cavity, when there are multiple electronic components, it is preferable that the adhesive portion does not contact the side between the electronic components in the portion where the multiple electronic components are adjacent. From the viewpoint of further enhancing the sealing of the air cavity, when there are multiple electronic components, it is preferable that the adhesive portion is not disposed in the gap between adjacent electronic components, and is preferably not disposed on the side surface of the electronic components in the portion where multiple electronic components are adjacent to each other.
エアキャビティの封止性をより一層高める観点からは、上記電子部品では、特に、上記電子部品が複数であり、上記回路基板上に、複数の上記電子部材が間隔を空けて実装されており、上記接着部が、複数の上記電子部材が隣り合う部分の上記電子部材の側面の少なくとも一部に接していないことが好ましい。
From the viewpoint of further enhancing the sealing of the air cavity, it is particularly preferable that the electronic components include a plurality of electronic components, that the plurality of electronic components are mounted on the circuit board at intervals, and that the adhesive portion does not contact at least a portion of the side of the electronic components in the portion where the plurality of electronic components are adjacent to each other.
上記電子部材が複数である場合に、上記接着部は、上記電子部材の集合体の外周全体にわたって、上記電子部材の各側面の少なくとも一部に接していることが好ましく、各側面の上端から下端までに接していることがより好ましく、各側面の全体に接していることがさらに好ましい。これらの場合には、エアキャビティの封止性をより一層高めることができる。
When there are multiple electronic components, it is preferable that the adhesive portion contacts at least a portion of each side of the electronic components over the entire periphery of the assembly of electronic components, more preferably contacts each side from the top to the bottom, and even more preferably contacts the entirety of each side. In these cases, the sealing of the air cavity can be further improved.
上記電子部品の製造方法では、上記電子部材が複数であり、上記(1)電子部材を実装する工程(実装工程)において、上記回路基板上に、複数の上記電子部材を間隔を空けて実装することが好ましい。上記電子部品の製造方法では、上記(2)硬化性組成物層を形成する工程(塗布工程)において、複数の上記電子部材が隣り合う部分の上記電子部材の側面の少なくとも一部に接しないように、上記硬化性組成物層を形成することが好ましい。上記電子部品の製造方法では、上記(2)硬化性組成物層を形成する工程(塗布工程)において、複数の上記電子部材が隣り合う部分の上記電子部材の側面の少なくとも一部には上記硬化性組成物を塗布しないことが好ましい。これらの場合には、エアキャビティの封止性をより一層高めることができる。
In the method for producing an electronic component, it is preferable that the electronic components are multiple, and that the multiple electronic components are mounted on the circuit board with a gap therebetween in the step (1) of mounting the electronic components (mounting step). In the method for producing an electronic component, it is preferable that the curable composition layer is formed in the step (2) of forming a curable composition layer (coating step) so that the curable composition layer does not contact at least a portion of the side surface of the electronic components in the portion where the multiple electronic components are adjacent to each other. In the method for producing an electronic component, it is preferable that the curable composition is not applied to at least a portion of the side surface of the electronic components in the portion where the multiple electronic components are adjacent to each other in the step (2) of forming a curable composition layer (coating step). In these cases, the sealing of the air cavity can be further improved.
本発明の効果をより一層効果的に発揮する観点からは、上記電子部品では、上記接着部が上記電子部材の上面の縁部に接していることが好ましく、上記接着部が上記電子部材の上面の全体に接していることがより好ましい。エアキャビティの封止性をより一層高める観点からは、上記電子部品の製造方法では、上記(2)硬化性組成物層を形成する工程(塗布工程)において、上記電子部材の上面の縁部に接するように上記硬化性組成物層を形成することが好ましい。エアキャビティの封止性をより一層高める観点からは、上記電子部品の製造方法では、上記(2)硬化性組成物層を形成する工程(塗布工程)において、上記電子部材の上面の縁部に上記硬化性組成物を塗布することが好ましく、上記電子部材の上面の全体に上記硬化性組成物を塗布することがより好ましい。なお、上記電子部材の上面の縁部は、上記電子部材の上面に位置する部分(縁部)であり、上記電子部材の側面に位置する部分とは異なる。
From the viewpoint of exerting the effect of the present invention more effectively, in the electronic component, it is preferable that the adhesive portion contacts the edge of the upper surface of the electronic member, and it is more preferable that the adhesive portion contacts the entire upper surface of the electronic member. From the viewpoint of further improving the sealing property of the air cavity, in the manufacturing method of the electronic component, it is preferable that the curable composition layer is formed so as to contact the edge of the upper surface of the electronic member in the step (2) of forming the curable composition layer (coating step). From the viewpoint of further improving the sealing property of the air cavity, in the manufacturing method of the electronic component, it is preferable that the curable composition is applied to the edge of the upper surface of the electronic member in the step (2) of forming the curable composition layer (coating step), and it is more preferable that the curable composition is applied to the entire upper surface of the electronic member. Note that the edge of the upper surface of the electronic member is a part (edge) located on the upper surface of the electronic member, and is different from a part located on the side of the electronic member.
上記接着部は、上記電子部材の上面の端から内側に向かって5μmの領域に接していてもよく、上記電子部材の上面の端から内側に向かって1000μmの領域に接していてもよい。上記電子部材の上面の縁部は、上記電子部材の上面の端から内側に向かって、5μm以上1000μm以下の領域であることが好ましい。
The adhesive portion may contact an area of 5 μm extending inward from the edge of the top surface of the electronic component, or an area of 1000 μm extending inward from the edge of the top surface of the electronic component. It is preferable that the edge of the top surface of the electronic component is an area of 5 μm to 1000 μm extending inward from the edge of the top surface of the electronic component.
本発明の効果をより一層効果的に発揮する観点からは、上記電子部品では、上記接着部が上記電子部材の下面に接していないことが好ましい。エアキャビティの封止性をより一層高める観点からは、上記電子部品の製造方法では、上記(2)硬化性組成物層を形成する工程(塗布工程)において、上記電子部材の下面に接しないように上記硬化性組成物層を形成することが好ましい。エアキャビティの封止性をより一層高める観点からは、上記電子部品の製造方法では、上記(2)硬化性組成物層を形成する工程(塗布工程)において、上記電子部材の下面に上記硬化性組成物を塗布しないことが好ましい。
From the viewpoint of exerting the effect of the present invention more effectively, it is preferable that in the electronic component, the adhesive portion does not contact the lower surface of the electronic member. From the viewpoint of further improving the sealing property of the air cavity, it is preferable that in the manufacturing method of the electronic component, in the step (2) of forming a curable composition layer (coating step), the curable composition layer is formed so as not to contact the lower surface of the electronic member. From the viewpoint of further improving the sealing property of the air cavity, it is preferable that in the manufacturing method of the electronic component, in the step (2) of forming a curable composition layer (coating step), the curable composition is not coated on the lower surface of the electronic member.
エアキャビティの封止性をより一層高める観点からは、上記電子部品の製造方法では、上記(3)接着部を形成する工程(硬化工程)において、上記硬化性組成物を光硬化させることが好ましく、光硬化及び熱硬化させることがより好ましい。エアキャビティの封止性をより一層高める観点からは、上記電子部品の製造方法では、上記(3)接着部を形成する工程(硬化工程)において、上記硬化性組成物を光の照射及び加熱により硬化させることが好ましい。エアキャビティの封止性をより一層高める観点からは、上記電子部品の製造方法では、上記(3)接着部を形成する工程(硬化工程)において、上記硬化性組成物層を光硬化させて上記接着部を形成する工程(光硬化工程)を備えることが好ましい。上記硬化性組成物層を光硬化させて上記接着部を形成する場合に、光硬化後に熱硬化が行われてもよい。
From the viewpoint of further improving the air cavity sealing property, in the above-mentioned electronic component manufacturing method, in the above-mentioned (3) step of forming an adhesive part (curing step), it is preferable to photo-cure the curable composition, and more preferably photo-cure and heat-cure. From the viewpoint of further improving the air cavity sealing property, in the above-mentioned (3) step of forming an adhesive part (curing step), it is preferable to cure the curable composition by irradiation with light and heating. From the viewpoint of further improving the air cavity sealing property, in the above-mentioned (3) step of forming an adhesive part (curing step), it is preferable to include a step of photo-cure the curable composition layer to form the adhesive part (photo-cure step). When the curable composition layer is photo-cure to form the adhesive part, heat curing may be performed after photo-cure.
上記電子部品の製造方法では、上記(3)接着部を形成する工程(硬化工程)が、上記硬化性組成物層を光硬化させてBステージ化物層を得る工程(光硬化工程)と、上記Bステージ化物層を熱硬化させて上記硬化性組成物層の硬化物(接着部)を得る工程(熱硬化工程)とを備えることがより好ましい。この場合には、エアキャビティの封止性をより一層高めることができる。
In the above-mentioned method for manufacturing electronic components, it is more preferable that the above-mentioned (3) step of forming an adhesive portion (curing step) includes a step of photocuring the curable composition layer to obtain a B-staged product layer (photocuring step), and a step of thermally curing the B-staged product layer to obtain a cured product (adhesive portion) of the curable composition layer (thermal curing step). In this case, the sealing property of the air cavity can be further improved.
上記電子部品の製造方法では、上記(3)接着部を形成する工程(硬化工程)が、上記硬化性組成物を複数滴又は1滴塗布するごとに、上記硬化性組成物層を光硬化させて、多層のBステージ化物層を得る工程(光硬化工程)と、上記多層のBステージ化物層を熱硬化させて、多層の接着部を形成する工程(熱硬化工程)とを備えることが好ましい。この場合には、接着部を精度よく形成し、本発明の効果を効果的に発揮することができる。
In the above-mentioned method for manufacturing electronic components, it is preferable that the above-mentioned (3) step of forming an adhesive portion (curing step) includes a step of photocuring the curable composition layer to obtain a multi-layered B-staged material layer each time one or more drops of the curable composition are applied (photocuring step), and a step of thermally curing the multi-layered B-staged material layer to form a multi-layered adhesive portion (thermal curing step). In this case, the adhesive portion can be formed with high precision, and the effects of the present invention can be effectively achieved.
多層のBステージ化物層を得る工程(光硬化工程)は、上記硬化性組成物を複数滴又は1滴塗布し、上記硬化性組成物層を光硬化させる工程を繰り返すことにより行われる。塗布と光硬化とを上記硬化性組成物層の厚み方向(得られる多層のBステージ化物層の厚み方向)にて繰り返して、多層のBステージ化物層を形成する。多層のBステージ化物層を得る工程(光硬化工程)は、具体的には、以下の工程である。上記硬化性組成物を複数滴又は1滴塗布し、第1の硬化性組成物層を光硬化させて、第1のBステージ化物層(下層のBステージ化物層)を得る工程が行われる。次に、第1のBステージ化物層(下層のBステージ化物層)上にて、上記硬化性組成物を複数滴又は1滴塗布し、第2の硬化性組成物層(上層のBステージ化物層)を光硬化させて、第2のBステージ化物層を得る工程が行われる。この操作をn回(nは2以上の整数)繰り返すことで、n層(総数がn)のBステージ化物層が得られる。最後のn回目の操作は、第n-1のBステージ化物層上にて、上記硬化性組成物を複数滴又は1滴塗布し、第nの硬化性組成物層を光硬化させて、第nのBステージ化物層を得る工程である。多層のBステージ化物層を得る上記光硬化工程の後、多層の接着部を形成する工程(熱硬化工程)が行われる。多層の接着部を形成する工程(熱硬化工程)は、n層のBステージ化物層を熱硬化させて、n層の接着部を形成する工程である。
The process of obtaining a multi-layer B-staged material layer (photo-curing process) is performed by repeatedly applying multiple or one drop of the curable composition and photo-curing the curable composition layer. The application and photo-curing are repeated in the thickness direction of the curable composition layer (thickness direction of the resulting multi-layer B-staged material layer) to form a multi-layer B-staged material layer. Specifically, the process of obtaining a multi-layer B-staged material layer (photo-curing process) is the following process. A process of applying multiple or one drop of the curable composition and photo-curing the first curable composition layer to obtain a first B-staged material layer (lower B-staged material layer) is performed. Next, a process of applying multiple or one drop of the curable composition on the first B-staged material layer (lower B-staged material layer) and photo-curing the second curable composition layer (upper B-staged material layer) is performed to obtain a second B-staged material layer. By repeating this operation n times (n is an integer of 2 or more), n layers (n in total) of B-staged material layers are obtained. The final nth operation is a process of applying multiple drops or one drop of the curable composition onto the (n-1)th B-staged material layer, and photocuring the nth curable composition layer to obtain the nth B-staged material layer. After the photocuring process for obtaining multiple B-staged material layers, a process of forming a multilayer adhesive portion (thermal curing process) is performed. The process of forming a multilayer adhesive portion (thermal curing process) is a process of thermally curing n B-staged material layers to form n adhesive portions.
上記光硬化工程では、紫外線が照射されることが好ましい。上記光硬化工程における紫外線の照度及び照射時間は、上記硬化性組成物の組成及び上記硬化性組成物の塗布厚みにより適宜変更可能である。上記光硬化工程における紫外線の照度は、例えば、1000mW/cm2以上であってもよく、5000mW/cm2以上であってもよく、10000mW/cm2以下であってもよく、8000mW/cm2以下であってもよい。上記光硬化工程における紫外線の照射時間は、例えば、0.01秒以上であってもよく、0.1秒以上であってもよく、400秒以下であってもよく、100秒以下であってもよい。
In the photocuring step, ultraviolet light is preferably irradiated. The illuminance and irradiation time of the ultraviolet light in the photocuring step can be appropriately changed depending on the composition of the curable composition and the coating thickness of the curable composition. The illuminance of the ultraviolet light in the photocuring step may be, for example, 1000 mW/cm 2 or more, 5000 mW/cm 2 or more, 10000 mW/cm 2 or less, or 8000 mW/cm 2 or less. The irradiation time of the ultraviolet light in the photocuring step may be, for example, 0.01 seconds or more, 0.1 seconds or more, 400 seconds or less, or 100 seconds or less.
上記硬化性組成物を複数滴塗布するごとに、又は1滴塗布するごとに塗布された上記硬化性組成物に対して光を照射する場合、上記光硬化工程における紫外線の照度は、1000mW/cm2以上であってもよく、10000mW/cm2以下であってもよい。また、上記光硬化工程における紫外線の照射時間は、0.01秒以上であってもよく、100秒以下であってもよい。
When the applied curable composition is irradiated with light every time a plurality of drops of the curable composition are applied or every time one drop of the curable composition is applied, the illuminance of the ultraviolet light in the photocuring step may be 1000 mW/cm 2 or more and 10000 mW/cm 2 or less. In addition, the irradiation time of the ultraviolet light in the photocuring step may be 0.01 seconds or more and 100 seconds or less.
上記熱硬化工程における加熱温度及び加熱時間は、上記硬化性組成物の組成及びBステージ化物層の厚みにより適宜変更可能である。上記熱硬化工程における加熱温度は、例えば、100℃以上であってもよく、120℃以上であってもよく、250℃以下であってもよく、200℃以下であってもよい。上記熱硬化工程における加熱時間は、例えば、5分以上であってもよく、30分以上であってもよく、600分以下であってもよく、300分以下であってもよい。
The heating temperature and heating time in the heat curing process can be changed as appropriate depending on the composition of the curable composition and the thickness of the B-staged product layer. The heating temperature in the heat curing process may be, for example, 100°C or higher, 120°C or higher, 250°C or lower, or 200°C or lower. The heating time in the heat curing process may be, for example, 5 minutes or higher, 30 minutes or higher, 600 minutes or lower, or 300 minutes or lower.
上記電子部品は、モールド樹脂部を有していてもよく、有していなくてもよい。上記電子部品の製造方法では、上記接着部の上面及び側面を、樹脂を用いて封止してもよく、封止しなくてもよい。エアキャビティの封止性をより一層高める観点からは、上記電子部品の製造方法では、(4)上記接着部の上面及び側面を、樹脂を用いて封止する工程(樹脂封止工程)をさらに備えることが好ましい。エアキャビティの封止性をより一層高める観点からは、上記電子部品の製造方法では、上記(4)樹脂を用いて封止する工程(樹脂封止工程)において、上記接着部の上面及び側面に樹脂を配置して、モールド樹脂部を形成することが好ましい。
The electronic component may or may not have a molded resin portion. In the method for manufacturing an electronic component, the upper and side surfaces of the adhesive portion may or may not be sealed with resin. From the viewpoint of further improving the sealability of the air cavity, it is preferable that the method for manufacturing an electronic component further includes (4) a step of sealing the upper and side surfaces of the adhesive portion with resin (resin sealing step). From the viewpoint of further improving the sealability of the air cavity, it is preferable that the method for manufacturing an electronic component further includes (4) a step of sealing with resin (resin sealing step) of disposing resin on the upper and side surfaces of the adhesive portion to form a molded resin portion.
上記樹脂としては、エポキシ樹脂、アクリル樹脂、フェノール樹脂、シリコーン樹脂、及びフッ素樹脂等が挙げられる。エアキャビティの封止性をより一層高める観点からは、上記樹脂は、エポキシ樹脂、アクリル樹脂、又はフェノール樹脂であることが好ましく、エポキシ樹脂、又はアクリル樹脂であることがより好ましい。
The above resins include epoxy resins, acrylic resins, phenolic resins, silicone resins, and fluororesins. From the viewpoint of further improving the sealing properties of the air cavity, the above resins are preferably epoxy resins, acrylic resins, or phenolic resins, and more preferably epoxy resins or acrylic resins.
上記接着部の高さの、上記接着部の幅に対する比(高さ/幅)は、好ましくは1.0以上、より好ましくは1.5以上、さらに好ましくは2.0以上、特に好ましくは2.5以上である。上記比(高さ/幅)が上記下限以上であると、接着性及び封止性をより一層高めることができる。上記比(高さ/幅)の上限は、特に限定されない。上記接着部の上記比(高さ/幅)は、100以下であってもよく、50以下であってもよく、10以下であってもよく、5.0以下であってもよい。得られる電子部品を小型化する観点からは、上記比(高さ/幅)は、5.0以下であることが好ましい。
The ratio (height/width) of the height of the adhesive portion to the width of the adhesive portion is preferably 1.0 or more, more preferably 1.5 or more, even more preferably 2.0 or more, and particularly preferably 2.5 or more. When the ratio (height/width) is equal to or greater than the lower limit, the adhesiveness and sealing properties can be further improved. The upper limit of the ratio (height/width) is not particularly limited. The ratio (height/width) of the adhesive portion may be 100 or less, 50 or less, 10 or less, or 5.0 or less. From the viewpoint of miniaturizing the resulting electronic component, it is preferable that the ratio (height/width) is 5.0 or less.
上記接着部の幅、高さ及び形状等は適宜変更可能である。
The width, height, shape, etc. of the adhesive part can be changed as appropriate.
上記接着部の幅は、上記回路基板の表面と上記接着部との接触面における上記接着部の幅であることが好ましい。上記回路基板の表面と上記接着部との接触面において、上記接着部の幅は、50μm以上であってもよく、100μm以上であってもよく、150μm以上であってもよく、250μm以下であってもよく、230μm以下であってもよく、200μm以下であってもよい。
The width of the adhesive portion is preferably the width of the adhesive portion at the contact surface between the surface of the circuit board and the adhesive portion. At the contact surface between the surface of the circuit board and the adhesive portion, the width of the adhesive portion may be 50 μm or more, 100 μm or more, 150 μm or more, 250 μm or less, 230 μm or less, or 200 μm or less.
上記接着部の高さは、上記回路基板の表面と上記接着部との接触面から、上記接着部の最大高さ位置までの距離であることが好ましい。上記回路基板の表面と上記接着部との接触面から、上記接着部の最大高さ位置までの距離は、好ましくは1μm以上、より好ましくは10μm以上、さらに好ましくは50μm以上であり、好ましくは300μm以下、より好ましくは250μm以下、さらに好ましくは200μm以下である。
The height of the adhesive portion is preferably the distance from the contact surface between the surface of the circuit board and the adhesive portion to the maximum height position of the adhesive portion. The distance from the contact surface between the surface of the circuit board and the adhesive portion to the maximum height position of the adhesive portion is preferably 1 μm or more, more preferably 10 μm or more, even more preferably 50 μm or more, and is preferably 300 μm or less, more preferably 250 μm or less, even more preferably 200 μm or less.
上記接着部は多層状であってもよく、上記接着部が多層状である場合、1層あたりの厚みは、好ましくは5μm以上であり、より好ましくは10μm以上であり、さらに好ましくは30μm以上であり、好ましくは300μm以下、より好ましくは200μm以下、さらに好ましくは100μm以下である。
The adhesive part may be multi-layered, and when the adhesive part is multi-layered, the thickness of each layer is preferably 5 μm or more, more preferably 10 μm or more, even more preferably 30 μm or more, and preferably 300 μm or less, more preferably 200 μm or less, even more preferably 100 μm or less.
上記回路基板は、回路パターンを表面に有する基板である。
The circuit board is a substrate having a circuit pattern on its surface.
上記電子部材としては、半導体チップ、コンデンサ、及び発光素子等が挙げられる。
The above electronic components include semiconductor chips, capacitors, and light-emitting elements.
上記半導体チップとしては、弾性表面波フィルター、弾性バルク波フィルター、及びフィルム弾性共振器フィルター等が挙げられる。
The above-mentioned semiconductor chips include surface acoustic wave filters, bulk acoustic wave filters, and film acoustic resonator filters.
上記発光素子としては、発光ダイオード、半導体レーザー等が挙げられる。
The light-emitting element may be a light-emitting diode, a semiconductor laser, etc.
上記電子部材は、半導体チップ、コンデンサ、又は発光素子であることが好ましく、半導体チップであることがより好ましく、弾性表面波フィルター、弾性バルク波フィルター、又はフィルム弾性共振器フィルターであることがさらに好ましい。
The electronic component is preferably a semiconductor chip, a capacitor, or a light-emitting element, more preferably a semiconductor chip, and even more preferably a surface acoustic wave filter, a bulk acoustic wave filter, or a film acoustic resonator filter.
(硬化性組成物)
上記硬化性組成物は、23℃で液状の硬化性組成物である。上記硬化性組成物の23℃及び10rpmでの粘度は、好ましくは3mPa・s以上、より好ましくは5mPa・s以上、より一層好ましくは10mPa・s以上、さらに好ましくは160mPa・s以上であり、好ましくは2000mPa・s以下、より好ましくは1600mPa・s以下、さらに好ましくは1500mPa・s以下である。 (Curable Composition)
The curable composition is a liquid curable composition at 23° C. The viscosity of the curable composition at 23° C. and 10 rpm is preferably 3 mPa·s or more, more preferably 5 mPa·s or more, even more preferably 10 mPa·s or more, still more preferably 160 mPa·s or more, and is preferably 2000 mPa·s or less, more preferably 1600 mPa·s or less, and still more preferably 1500 mPa·s or less.
上記硬化性組成物は、23℃で液状の硬化性組成物である。上記硬化性組成物の23℃及び10rpmでの粘度は、好ましくは3mPa・s以上、より好ましくは5mPa・s以上、より一層好ましくは10mPa・s以上、さらに好ましくは160mPa・s以上であり、好ましくは2000mPa・s以下、より好ましくは1600mPa・s以下、さらに好ましくは1500mPa・s以下である。 (Curable Composition)
The curable composition is a liquid curable composition at 23° C. The viscosity of the curable composition at 23° C. and 10 rpm is preferably 3 mPa·s or more, more preferably 5 mPa·s or more, even more preferably 10 mPa·s or more, still more preferably 160 mPa·s or more, and is preferably 2000 mPa·s or less, more preferably 1600 mPa·s or less, and still more preferably 1500 mPa·s or less.
上記粘度は、JIS K2283に準拠して、E型粘度計(例えば、東機産業社製「TVE22L」)を用いて、23℃で測定される。
The above viscosity is measured at 23°C using an E-type viscometer (for example, "TVE22L" manufactured by Toki Sangyo Co., Ltd.) in accordance with JIS K2283.
上記硬化性組成物は、インクジェット方式により塗布されて用いられることが好ましい。上記硬化性組成物は、インクジェット装置を用いて塗布されて用いられることが好ましい。
The above-mentioned curable composition is preferably applied by an inkjet method. The above-mentioned curable composition is preferably applied by an inkjet device.
上記硬化性組成物を用いて、回路基板と電子部材とを接着させることができ、かつ、エアキャビティを形成させることができる。上記硬化性組成物を用いて、エアキャビティを有する電子部品を製造することができる。上記硬化性組成物は、上記回路基板の上面と、上記電子部材の側面とを接着させるために用いられる硬化性組成物であることが好ましく、上記硬化性組成物は、上記回路基板の上面と、上記電子部材の側面及び上面とを接着させるために用いられる硬化性組成物であることがより好ましい。
The above curable composition can be used to bond a circuit board and an electronic component, and can also form an air cavity. The above curable composition can be used to manufacture an electronic component having an air cavity. The above curable composition is preferably a curable composition used to bond the upper surface of the circuit board and the side surface of the electronic component, and more preferably a curable composition used to bond the upper surface of the circuit board and the side and upper surface of the electronic component.
上記硬化性組成物は、光の照射及び加熱により硬化させて用いられることが好ましい。上記硬化性組成物は、光の照射により硬化を進行させた後に加熱により硬化させて用いられることが好ましい。上記硬化性組成物は、光硬化性を有することが好ましく、熱硬化性を有することが好ましく、光硬化性と熱硬化性とを有することがより好ましい。
The above-mentioned curable composition is preferably used by curing it through irradiation with light and heating. The above-mentioned curable composition is preferably used by curing it through irradiation with light and then curing it through heating. The above-mentioned curable composition is preferably photocurable, preferably thermosetting, and more preferably photocurable and thermosetting.
上記硬化性組成物は、光硬化性化合物(光の照射により硬化可能な硬化性化合物)を含むことが好ましく、光硬化性化合物と、熱硬化性化合物(加熱により硬化可能な硬化性化合物)とを含むことがより好ましい。
The curable composition preferably contains a photocurable compound (a curable compound that can be cured by irradiation with light), and more preferably contains a photocurable compound and a thermosetting compound (a curable compound that can be cured by heating).
以下、上記硬化性組成物に用いることができる各成分の詳細を説明する。なお、本明細書において、「(メタ)アクリロイル」は「アクリロイル」又は「メタクリロイル」を示し、「(メタ)アクリレート」は「アクリレート」又は「メタクリレート」を示す。また、本明細書において、(メタ)アクリロイル基が有するCH2=CH基は、ビニル基に含まれないものとする。
Hereinafter, each component that can be used in the curable composition will be described in detail. In this specification, "(meth)acryloyl" refers to "acryloyl" or "methacryloyl", and "(meth)acrylate" refers to "acrylate" or "methacrylate". In this specification, the CH 2 ═CH group of the (meth)acryloyl group is not included in the vinyl group.
<(A)光硬化性化合物>
上記硬化性組成物は、(A)光硬化性化合物を含むことが好ましい。(A)光硬化性化合物は、光硬化性官能基を有する。上記光硬化性官能基としては、(メタ)アクリロイル基、及びビニル基等が挙げられる。(A)光硬化性化合物は、(メタ)アクリロイル基を有していてもよく、ビニル基を有していてもよく、(メタ)アクリロイル基とビニル基との双方を有していてもよい。(A)光硬化性化合物は、1種のみが用いられてもよく、2種以上が併用されてもよい。 <(A) Photocurable Compound>
The curable composition preferably contains (A) a photocurable compound. The (A) photocurable compound has a photocurable functional group. Examples of the photocurable functional group include a (meth)acryloyl group and a vinyl group. The (A) photocurable compound may have a (meth)acryloyl group, a vinyl group, or both a (meth)acryloyl group and a vinyl group. Only one type of (A) photocurable compound may be used, or two or more types may be used in combination.
上記硬化性組成物は、(A)光硬化性化合物を含むことが好ましい。(A)光硬化性化合物は、光硬化性官能基を有する。上記光硬化性官能基としては、(メタ)アクリロイル基、及びビニル基等が挙げられる。(A)光硬化性化合物は、(メタ)アクリロイル基を有していてもよく、ビニル基を有していてもよく、(メタ)アクリロイル基とビニル基との双方を有していてもよい。(A)光硬化性化合物は、1種のみが用いられてもよく、2種以上が併用されてもよい。 <(A) Photocurable Compound>
The curable composition preferably contains (A) a photocurable compound. The (A) photocurable compound has a photocurable functional group. Examples of the photocurable functional group include a (meth)acryloyl group and a vinyl group. The (A) photocurable compound may have a (meth)acryloyl group, a vinyl group, or both a (meth)acryloyl group and a vinyl group. Only one type of (A) photocurable compound may be used, or two or more types may be used in combination.
(A)光硬化性化合物は、後述する熱硬化性官能基を有さないことが好ましい
(A) It is preferable that the photocurable compound does not have a thermosetting functional group, which will be described later.
本発明の効果をより一層効果的に発揮する観点及び硬化性組成物層を高精度に形成する観点からは、(A)光硬化性化合物は、(メタ)アクリロイル基、又はビニル基を有することが好ましく、(メタ)アクリロイル基を有することがより好ましい。(A)光硬化性化合物は、(メタ)アクリレート化合物であることが好ましい。
From the viewpoint of exerting the effects of the present invention more effectively and from the viewpoint of forming a curable composition layer with high precision, (A) the photocurable compound preferably has a (meth)acryloyl group or a vinyl group, and more preferably has a (meth)acryloyl group. (A) the photocurable compound is preferably a (meth)acrylate compound.
(A)光硬化性化合物は、単官能の(メタ)アクリレート化合物であってもよく、多官能の(メタ)アクリレート化合物であってもよい。(A)光硬化性化合物は、2官能の(メタ)アクリレート化合物であってもよく、2官能以上の(メタ)アクリレート化合物であってもよく、3官能の(メタ)アクリレート化合物であってもよく、3官能以上の(メタ)アクリレート化合物であってもよく、4官能以上の(メタ)アクリレート化合物であってもよい。(A)光硬化性化合物は、20官能以下の(メタ)アクリレート化合物であってもよく、10官能以下の(メタ)アクリレート化合物であってもよく、5官能以下の(メタ)アクリレート化合物であってもよい。官能数は(メタ)アクリロイル基の数に対応する。(A)光硬化性化合物は、1種のみが用いられてもよく、2種以上が併用されてもよい。
The (A) photocurable compound may be a monofunctional (meth)acrylate compound or a polyfunctional (meth)acrylate compound. The (A) photocurable compound may be a bifunctional (meth)acrylate compound, a bifunctional or higher (meth)acrylate compound, a trifunctional (meth)acrylate compound, a trifunctional or higher (meth)acrylate compound, or a tetrafunctional or higher (meth)acrylate compound. The (A) photocurable compound may be a 20 or lower functional (meth)acrylate compound, a 10 or lower functional (meth)acrylate compound, or a 5 or lower functional (meth)acrylate compound. The functionality corresponds to the number of (meth)acryloyl groups. Only one type of (A) photocurable compound may be used, or two or more types may be used in combination.
(A)光硬化性化合物は、(メタ)アクリロイル基を1個有していてもよく、2個有していてもよく、2個以上有していてもよく、3個有していてもよく、3個以上有していてもよく、4個以上有していてもよく、20個以下で有していてもよく、10個以下で有していてもよく、5個以下で有していてもよい。
(A) The photocurable compound may have one (meth)acryloyl group, may have two, may have two or more, may have three, may have three or more, may have four or more, may have 20 or less, may have 10 or less, or may have 5 or less.
上記単官能の(メタ)アクリレート化合物としては、メチル(メタ)アクリレート、エチル(メタ)アクリレート、n-プロピル(メタ)アクリレート、i-プロピル(メタ)アクリレート、n-ブチル(メタ)アクリレート、i-ブチル(メタ)アクリレート、sec-ブチル(メタ)アクリレート、t-ブチル(メタ)アクリレート、2-ヒドロキシエチル(メタ)アクリレート、2-ヒドロキシプロピル(メタ)アクリレート、3-ヒドロキシプロピル(メタ)アクリレート、2-ヒドロキシブチル(メタ)アクリレート、3-ヒドロキシブチル(メタ)アクリレート、4-ヒドロキシブチル(メタ)アクリレート、アリル(メタ)アクリレート、ベンジル(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、フェニル(メタ)アクリレート、2-メトキシエチル(メタ)アクリレート、2-フェノキシエチル(メタ)アクリレート、メトキシジエチレングルコール(メタ)アクリレート、メトキシトリエチレングルコール(メタ)アクリレート、メトキシプロピレングリコール(メタ)アクリレート、メトキシジプロピレングリコール(メタ)アクリレート、イソデシル(メタ)アクリレート、イソノニル(メタ)アクリレート、イソボルニル(メタ)アクリレート、ジシクロペンタジエニル(メタ)アクリレート、2-ヒドロキシ-3-フェノキシプロピル(メタ)アクリレート、グリセロールモノ(メタ)アクリレート、2-エチルヘキシル(メタ)アクリレート、ジヒドロキシシクロペンタジエニル(メタ)アクリレート、ジシクロペンテニル(メタ)アクリレート、ジシクロペンテニルオキシエチル(メタ)アクリレート、ジシクロペンタニル(メタ)アクリレート、ナフチル(メタ)アクリレート、ラウリル(メタ)アクリレート、ドデシル(メタ)アクリレート、及びステアリル(メタ)アクリレート等が挙げられる。
The above-mentioned monofunctional (meth)acrylate compounds include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, i-propyl (meth)acrylate, n-butyl (meth)acrylate, i-butyl (meth)acrylate, sec-butyl (meth)acrylate, t-butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, allyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, phenyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, methoxydiethylene glycol, Examples of such acrylates include alcohol (meth)acrylate, methoxytriethylene glycol (meth)acrylate, methoxypropylene glycol (meth)acrylate, methoxydipropylene glycol (meth)acrylate, isodecyl (meth)acrylate, isononyl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentadienyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, glycerol mono(meth)acrylate, 2-ethylhexyl (meth)acrylate, dihydroxycyclopentadienyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, dicyclopentanyl (meth)acrylate, naphthyl (meth)acrylate, lauryl (meth)acrylate, dodecyl (meth)acrylate, and stearyl (meth)acrylate.
上記2官能の(メタ)アクリレート化合物としては、1,4-ブタンジオールジ(メタ)アクリレート、1,6-ヘキサンジオールジ(メタ)アクリレート、1,9-ノナンジ(メタ)アクリレート、1,10-デカンジオールジ(メタ)アクリレート、ネオペンチルグリコールジ(メタ)アクリレート、2,4-ジメチル-1,5-ペンタンジオールジ(メタ)アクリレート、ブチルエチルプロパンジオール(メタ)アクリレート、エトキシ化シクロヘキサンメタノールジ(メタ)アクリレート、エトキシ化ビスフェノールジ(メタ)アクリレート、ポリエチレングリコールジ(メタ)アクリレート、オリゴエチレングリコールジ(メタ)アクリレート、エチレングリコールジ(メタ)アクリレート、2-エチル-2-ブチルブタンジオールジ(メタ)アクリレート、2-エチル-2-ブチルプロパンジオールジ(メタ)アクリレート、トリシクロデカンジ(メタ)アクリレート、トリシクロデカンジメタノールジ(メタ)アクリレート、ウレタン(メタ)アクリレート、及びジプロピレングリコールジ(メタ)アクリレート等が挙げられる。
The above bifunctional (meth)acrylate compounds include 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanedi(meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 2,4-dimethyl-1,5-pentanediol di(meth)acrylate, butyl ethyl propanediol (meth)acrylate, ethoxylated cyclohexanemethanol di(meth)acrylate, ethoxylated bisphenone. Examples of such di(meth)acrylates include aryl di(meth)acrylate, polyethylene glycol di(meth)acrylate, oligoethylene glycol di(meth)acrylate, ethylene glycol di(meth)acrylate, 2-ethyl-2-butylbutanediol di(meth)acrylate, 2-ethyl-2-butylpropanediol di(meth)acrylate, tricyclodecane di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, urethane (meth)acrylate, and dipropylene glycol di(meth)acrylate.
上記3官能の(メタ)アクリレート化合物としては、トリメチロールプロパントリ(メタ)アクリレート、トリメチロールエタントリ(メタ)アクリレート、トリメチロールプロパンのアルキレンオキシド変性トリ(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート、ジペンタエリスリトールトリ(メタ)アクリレート、トリメチロールプロパントリ((メタ)アクリロイルオキシプロピル)エーテル、イソシアヌル酸アルキレンオキシド変性トリ(メタ)アクリレート、プロピオン酸ジペンタエリスリトールトリ(メタ)アクリレート、トリ((メタ)アクリロイルオキシエチル)イソシアヌレート、及びソルビトールトリ(メタ)アクリレート等が挙げられる。
Examples of the trifunctional (meth)acrylate compounds include trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, alkylene oxide-modified tri(meth)acrylate of trimethylolpropane, pentaerythritol tri(meth)acrylate, dipentaerythritol tri(meth)acrylate, trimethylolpropane tri((meth)acryloyloxypropyl)ether, alkylene oxide-modified tri(meth)acrylate of isocyanuric acid, dipentaerythritol propionate tri(meth)acrylate, tri((meth)acryloyloxyethyl)isocyanurate, and sorbitol tri(meth)acrylate.
上記4官能の(メタ)アクリレート化合物としては、ペンタエリスリトールテトラ(メタ)アクリレート、ソルビトールテトラ(メタ)アクリレート、ジトリメチロールプロパンテトラ(メタ)アクリレート、及びプロピオン酸ジペンタエリスリトールテトラ(メタ)アクリレート等が挙げられる。
Examples of the tetrafunctional (meth)acrylate compounds include pentaerythritol tetra(meth)acrylate, sorbitol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, and dipentaerythritol propionate tetra(meth)acrylate.
上記5官能の(メタ)アクリレート化合物としては、ソルビトールペンタ(メタ)アクリレート、及びジペンタエリスリトールペンタ(メタ)アクリレートが挙げられる。
Examples of the pentafunctional (meth)acrylate compounds include sorbitol penta(meth)acrylate and dipentaerythritol penta(meth)acrylate.
上記6官能の(メタ)アクリレート化合物としては、ジペンタエリスリトールヘキサ(メタ)アクリレート、ソルビトールヘキサ(メタ)アクリレート、及びフォスファゼンのアルキレンオキシド変性ヘキサ(メタ)アクリレート等が挙げられる。
Examples of the hexafunctional (meth)acrylate compounds include dipentaerythritol hexa(meth)acrylate, sorbitol hexa(meth)acrylate, and alkylene oxide-modified hexa(meth)acrylate of phosphazene.
ビニル基を有する(A)光硬化性化合物としては、ビニルエーテル類、エチレン誘導体、スチレン、クロロメチルスチレン、α-メチルスチレン、無水マレイン酸、ジシクロペンタジエン、N-ビニルピロリドン、及びN-ビニルホルムアミド等が挙げられる。
Examples of the (A) photocurable compound having a vinyl group include vinyl ethers, ethylene derivatives, styrene, chloromethylstyrene, α-methylstyrene, maleic anhydride, dicyclopentadiene, N-vinylpyrrolidone, and N-vinylformamide.
上記硬化性組成物100重量%中、(A)光硬化性化合物の含有量は、好ましくは2重量%以上、より好ましくは5重量%以上、さらに好ましくは10重量%以上、特に好ましくは15重量%以上である。上記硬化性組成物100重量%中、(A)光硬化性化合物の含有量は、好ましくは80重量%以下、より好ましくは70重量%以下、より一層好ましくは65重量%以下、さらに好ましくは60重量%以下、さらに一層好ましくは50重量%以下、特に好ましくは40重量%以下である。(A)光硬化性化合物の含有量が上記下限以上及び上記上限以下であると、本発明の効果をより一層効果的に発揮することができる。
In 100% by weight of the curable composition, the content of the photocurable compound (A) is preferably 2% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, and particularly preferably 15% by weight or more. In 100% by weight of the curable composition, the content of the photocurable compound (A) is preferably 80% by weight or less, more preferably 70% by weight or less, even more preferably 65% by weight or less, even more preferably 60% by weight or less, even more preferably 50% by weight or less, and particularly preferably 40% by weight or less. When the content of the photocurable compound (A) is equal to or more than the lower limit and equal to or less than the upper limit, the effects of the present invention can be exhibited even more effectively.
上記硬化性組成物は、後述する(C)光及び熱硬化性化合物を含んでいてもよい。
The curable composition may contain (C) a photo- and heat-curable compound, which will be described later.
上記硬化性組成物が(C)光及び熱硬化性化合物を含む場合には、上記硬化性組成物100重量%中、(A)光硬化性化合物の含有量は、好ましくは2重量%以上、より好ましくは5重量%以上、さらに好ましくは10重量%以上、好ましくは65重量%以下、より好ましくは60重量%以下、さらに好ましくは55重量%以下である。(A)光硬化性化合物の含有量が上記下限以上及び上記上限以下であると、本発明の効果をより一層効果的に発揮することができる。
When the curable composition contains (C) a photo- and heat-curable compound, the content of (A) the photo-curable compound in 100% by weight of the curable composition is preferably 2% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, preferably 65% by weight or less, more preferably 60% by weight or less, and even more preferably 55% by weight or less. When the content of (A) the photo-curable compound is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be exhibited even more effectively.
上記硬化性組成物が(C)光及び熱硬化性化合物を含まない場合には、上記硬化性組成物100重量%中、(A)光硬化性化合物の含有量は、好ましくは5重量%以上、より好ましくは10重量%以上、さらに好ましくは20重量%以上、好ましくは55重量%以下、より好ましくは45重量%以下、さらに好ましくは35重量%以下である。(A)光硬化性化合物の含有量が上記下限以上及び上記上限以下であると、本発明の効果をより一層効果的に発揮することができる。
When the curable composition does not contain (C) a photo- and heat-curable compound, the content of (A) the photo-curable compound in 100% by weight of the curable composition is preferably 5% by weight or more, more preferably 10% by weight or more, even more preferably 20% by weight or more, preferably 55% by weight or less, more preferably 45% by weight or less, and even more preferably 35% by weight or less. When the content of (A) the photo-curable compound is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be exhibited even more effectively.
<(B)熱硬化性化合物>
上記硬化性組成物は、(B)熱硬化性化合物を含むことが好ましい。(B)熱硬化性化合物は、熱硬化性官能基を有する。上記熱硬化性官能基としては、環状エーテル基、及びチイラン基等が挙げられる。(B)熱硬化性化合物は、環状エーテル基を有していてもよく、チイラン基を有していてもよく、環状エーテル基とチイラン基との双方を有していてもよい。(B)熱硬化性化合物は、1種のみが用いられてもよく、2種以上が併用されてもよい。 <(B) Thermosetting Compound>
The curable composition preferably contains a thermosetting compound (B). The thermosetting compound (B) has a thermosetting functional group. Examples of the thermosetting functional group include a cyclic ether group and a thiirane group. The thermosetting compound (B) may have a cyclic ether group, a thiirane group, or both a cyclic ether group and a thiirane group. The thermosetting compound (B) may be used alone or in combination of two or more kinds.
上記硬化性組成物は、(B)熱硬化性化合物を含むことが好ましい。(B)熱硬化性化合物は、熱硬化性官能基を有する。上記熱硬化性官能基としては、環状エーテル基、及びチイラン基等が挙げられる。(B)熱硬化性化合物は、環状エーテル基を有していてもよく、チイラン基を有していてもよく、環状エーテル基とチイラン基との双方を有していてもよい。(B)熱硬化性化合物は、1種のみが用いられてもよく、2種以上が併用されてもよい。 <(B) Thermosetting Compound>
The curable composition preferably contains a thermosetting compound (B). The thermosetting compound (B) has a thermosetting functional group. Examples of the thermosetting functional group include a cyclic ether group and a thiirane group. The thermosetting compound (B) may have a cyclic ether group, a thiirane group, or both a cyclic ether group and a thiirane group. The thermosetting compound (B) may be used alone or in combination of two or more kinds.
上記環状エーテル基としては、エポキシ基、及びオキセタニル基等が挙げられる。上記エポキシ基は、グリシジル基の一部であってもよく、グリシジル基中のエポキシ基であってもよい。
The cyclic ether group may be an epoxy group, an oxetanyl group, or the like. The epoxy group may be a part of a glycidyl group, or may be an epoxy group in a glycidyl group.
(B)熱硬化性化合物は、上記光硬化性官能基を有さないことが好ましい。
(B) It is preferable that the thermosetting compound does not have the above-mentioned photocurable functional group.
本発明の効果をより一層効果的に発揮する観点からは、(B)熱硬化性化合物は、環状エーテル基を有することが好ましく、エポキシ基を有することがより好ましい。本発明の効果をより一層効果的に発揮する観点からは、(B)熱硬化性化合物は、エポキシ化合物であることが好ましい。
From the viewpoint of exerting the effects of the present invention more effectively, it is preferable that the thermosetting compound (B) has a cyclic ether group, and it is more preferable that the compound has an epoxy group. From the viewpoint of exerting the effects of the present invention more effectively, it is preferable that the thermosetting compound (B) is an epoxy compound.
上記エポキシ化合物としては、ビスフェノールA型エポキシ化合物、ビスフェノールF型エポキシ化合物、ビスフェノールS型エポキシ化合物、フェノールノボラック型エポキシ化合物、ビフェニル型エポキシ化合物、ビフェニルノボラック型エポキシ化合物、ビフェノール型エポキシ化合物、ナフタレン型エポキシ化合物、フルオレン型エポキシ化合物、フェノールアラルキル型エポキシ化合物、ナフトールアラルキル型エポキシ化合物、ジシクロペンタジエン型エポキシ化合物、アントラセン型エポキシ化合物、アダマンタン骨格を有するエポキシ化合物、トリシクロデカン骨格を有するエポキシ化合物、ナフチレンエーテル型エポキシ化合物、及びトリアジン核を骨格に有するエポキシ化合物等が挙げられる。
The above epoxy compounds include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, phenol novolac type epoxy compounds, biphenyl type epoxy compounds, biphenyl novolac type epoxy compounds, biphenol type epoxy compounds, naphthalene type epoxy compounds, fluorene type epoxy compounds, phenol aralkyl type epoxy compounds, naphthol aralkyl type epoxy compounds, dicyclopentadiene type epoxy compounds, anthracene type epoxy compounds, epoxy compounds having an adamantane skeleton, epoxy compounds having a tricyclodecane skeleton, naphthylene ether type epoxy compounds, and epoxy compounds having a triazine nucleus in the skeleton.
上記チイラン基を有する熱硬化性化合物は、上記エポキシ基を有するエポキシ化合物のエポキシ基をチイラン基に変換することで得られる。上記チイラン基に変換する方法としては、硫化剤を含む第1の溶液に、上記エポキシ基を有するエポキシ化合物を含む溶液を連続的又は断続的に添加した後、硫化剤を含む第2の溶液を連続的又は断続的にさらに添加する方法が好ましい。この方法により、上記エポキシ基をチイラン基に変換することができる。
The thermosetting compound having a thiirane group can be obtained by converting the epoxy group of the epoxy compound having an epoxy group to a thiirane group. A preferred method for converting to the thiirane group is to continuously or intermittently add a solution containing the epoxy compound having an epoxy group to a first solution containing a sulfurizing agent, and then continuously or intermittently add a second solution containing a sulfurizing agent. This method allows the epoxy group to be converted to a thiirane group.
また、(B)熱硬化性化合物は、マレイミド化合物、スチレン化合物、フェノキシ化合物、オキセタン化合物、エピスルフィド化合物、(メタ)アクリル化合物、フェノール化合物、アミノ化合物、不飽和ポリエステル化合物、ポリウレタン化合物、又はシリコーン化合物等であってもよい。エアキャビティの封止性をより一層高める観点からは、(B)熱硬化性化合物は、シリコーン化合物であることが好ましい。
The thermosetting compound (B) may be a maleimide compound, a styrene compound, a phenoxy compound, an oxetane compound, an episulfide compound, a (meth)acrylic compound, a phenol compound, an amino compound, an unsaturated polyester compound, a polyurethane compound, a silicone compound, or the like. From the viewpoint of further improving the sealing ability of the air cavity, it is preferable that the thermosetting compound (B) is a silicone compound.
上記硬化性組成物100重量%中、(B)熱硬化性化合物の含有量は、好ましくは10重量%以上、より好ましくは15重量%以上、さらに好ましくは20重量%以上、好ましくは50重量%以下、より好ましくは40重量%以下、さらに好ましくは35重量%以下である。(B)熱硬化性化合物の含有量が上記下限以上及び上記上限以下であると、本発明の効果をより一層効果的に発揮することができ、回路基板及び電子部材と接着部との接着強度をより一層高めることができる。
In 100% by weight of the curable composition, the content of the thermosetting compound (B) is preferably 10% by weight or more, more preferably 15% by weight or more, even more preferably 20% by weight or more, preferably 50% by weight or less, more preferably 40% by weight or less, and even more preferably 35% by weight or less. When the content of the thermosetting compound (B) is equal to or more than the above lower limit and equal to or less than the above upper limit, the effect of the present invention can be exerted more effectively, and the adhesive strength between the circuit board and the electronic component and the adhesive part can be further increased.
上記硬化性組成物100重量%中、(A)光硬化性化合物と(B)熱硬化性化合物との合計の含有量は、好ましくは7重量%以上、より好ましくは12重量%以上、さらに好ましくは17重量%以上、特に好ましくは20重量%以上、最も好ましくは30重量%以上である。上記硬化性組成物100重量%中、(A)光硬化性化合物と(B)熱硬化性化合物との合計の含有量は、好ましくは75重量%以下、より好ましくは70重量%以下、さらに好ましくは65重量%以下である。上記合計の含有量が上記下限以上及び上記上限以下であると、本発明の効果をより一層効果的に発揮することができる。
In 100% by weight of the curable composition, the total content of (A) the photocurable compound and (B) the thermosetting compound is preferably 7% by weight or more, more preferably 12% by weight or more, even more preferably 17% by weight or more, particularly preferably 20% by weight or more, and most preferably 30% by weight or more. In 100% by weight of the curable composition, the total content of (A) the photocurable compound and (B) the thermosetting compound is preferably 75% by weight or less, more preferably 70% by weight or less, and even more preferably 65% by weight or less. When the total content is equal to or more than the lower limit and equal to or less than the upper limit, the effects of the present invention can be more effectively exhibited.
<(C)光及び熱硬化性化合物>
上記硬化性組成物は、(C)光及び熱硬化性化合物を含んでいてもよく、含んでいなくてもよい。(C)光及び熱硬化性化合物は、光硬化性官能基と熱硬化性官能基とを有する。回路基板及び電子部材と接着部との接着強度をより一層高める観点からは、上記硬化性組成物は、(C)光及び熱硬化性化合物を含むことが好ましい。(C)光及び熱硬化性化合物は、1種のみが用いられてもよく、2種以上が併用されてもよい。なお、本明細書において、化合物における「光及び熱硬化性」とは、化合物が、光硬化性と熱硬化性の両方の性質を有することを示す。 <(C) Photo- and Thermo-Curable Compound>
The curable composition may or may not contain (C) a photo- and heat-curable compound. The (C) photo- and heat-curable compound has a photo-curable functional group and a heat-curable functional group. From the viewpoint of further increasing the adhesive strength between the circuit board and the electronic component and the adhesive part, it is preferable that the curable composition contains (C) a photo- and heat-curable compound. Only one type of (C) photo- and heat-curable compound may be used, or two or more types may be used in combination. In this specification, "photo- and heat-curable" in a compound indicates that the compound has both photo-curable and heat-curable properties.
上記硬化性組成物は、(C)光及び熱硬化性化合物を含んでいてもよく、含んでいなくてもよい。(C)光及び熱硬化性化合物は、光硬化性官能基と熱硬化性官能基とを有する。回路基板及び電子部材と接着部との接着強度をより一層高める観点からは、上記硬化性組成物は、(C)光及び熱硬化性化合物を含むことが好ましい。(C)光及び熱硬化性化合物は、1種のみが用いられてもよく、2種以上が併用されてもよい。なお、本明細書において、化合物における「光及び熱硬化性」とは、化合物が、光硬化性と熱硬化性の両方の性質を有することを示す。 <(C) Photo- and Thermo-Curable Compound>
The curable composition may or may not contain (C) a photo- and heat-curable compound. The (C) photo- and heat-curable compound has a photo-curable functional group and a heat-curable functional group. From the viewpoint of further increasing the adhesive strength between the circuit board and the electronic component and the adhesive part, it is preferable that the curable composition contains (C) a photo- and heat-curable compound. Only one type of (C) photo- and heat-curable compound may be used, or two or more types may be used in combination. In this specification, "photo- and heat-curable" in a compound indicates that the compound has both photo-curable and heat-curable properties.
(C)光及び熱硬化性化合物は、環状エーテル基と、(メタ)アクリロイル基とを有していてもよく、エポキシ基と、(メタ)アクリロイル基とを有していてもよい。(C)光及び熱硬化性化合物は、(A)光硬化性化合物及び(B)熱硬化性化合物とは異なる硬化性化合物であることが好ましい。
The (C) photo- and thermosetting compound may have a cyclic ether group and a (meth)acryloyl group, or may have an epoxy group and a (meth)acryloyl group. It is preferable that the (C) photo- and thermosetting compound is a curable compound different from the (A) photo-curable compound and the (B) thermosetting compound.
上記エポキシ基と(メタ)アクリロイル基とを有する(C)光及び熱硬化性化合物としては、(メタ)アクリル酸グリシジル、アリルグリシジルエーテル、4-ヒドロキシブチル(メタ)アクリレートグリシジルエーテル、及び3,4-エポキシシクロヘキシルメチル(メタ)アクリレート等が挙げられる。
Examples of the (C) photo- and thermosetting compound having the above-mentioned epoxy group and (meth)acryloyl group include glycidyl (meth)acrylate, allyl glycidyl ether, 4-hydroxybutyl (meth)acrylate glycidyl ether, and 3,4-epoxycyclohexylmethyl (meth)acrylate.
(C)光及び熱硬化性化合物は、(メタ)アクリル酸グリシジル、又は4-ヒドロキシブチル(メタ)アクリレートグリシジルエーテルであることが好ましく、4-ヒドロキシブチル(メタ)アクリレートグリシジルエーテルであることがより好ましい。この場合には、本発明の効果をより一層効果的に発揮することができ、回路基板及び電子部材と接着部との接着強度をより一層高めることができる。
(C) The photo- and thermosetting compound is preferably glycidyl (meth)acrylate or 4-hydroxybutyl (meth)acrylate glycidyl ether, and more preferably 4-hydroxybutyl (meth)acrylate glycidyl ether. In this case, the effect of the present invention can be exerted even more effectively, and the adhesive strength between the circuit board and the electronic components and the adhesive part can be further increased.
上記硬化性組成物100重量%中、(C)光及び熱硬化性化合物の含有量は、好ましくは5重量%以上、より好ましくは10重量%以上、好ましくは70重量%以下、より好ましくは65重量%以下、さらに好ましくは60重量%以下である。(C)光及び熱硬化性化合物の含有量が上記下限以上及び上記上限以下であると、本発明の効果をより一層効果的に発揮することができ、回路基板及び電子部材と接着部との接着強度をより一層高めることができる。
In 100% by weight of the curable composition, the content of (C) the photo- and thermosetting compound is preferably 5% by weight or more, more preferably 10% by weight or more, preferably 70% by weight or less, more preferably 65% by weight or less, and even more preferably 60% by weight or less. When the content of (C) the photo- and thermosetting compound is equal to or more than the above lower limit and equal to or less than the above upper limit, the effect of the present invention can be exerted more effectively, and the adhesive strength between the circuit board and the electronic component and the adhesive part can be further increased.
エアキャビティの封止性をより一層高める観点からは、上記硬化性組成物は、エポキシ化合物、(メタ)アクリレート化合物、又はシリコーン化合物を含むことが好ましい。
From the viewpoint of further improving the sealing ability of the air cavity, it is preferable that the curable composition contains an epoxy compound, a (meth)acrylate compound, or a silicone compound.
<光重合開始剤>
上記硬化性組成物は、光重合開始剤を含むことが好ましい。 <Photopolymerization initiator>
The curable composition preferably contains a photopolymerization initiator.
上記硬化性組成物は、光重合開始剤を含むことが好ましい。 <Photopolymerization initiator>
The curable composition preferably contains a photopolymerization initiator.
上記光重合開始剤としては、光ラジカル重合開始剤、及び光カチオン重合開始剤等が挙げられる。上記光重合開始剤は、1種のみが用いられてもよく、2種以上が併用されてもよい。エアキャビティの封止性をより一層高める観点からは、上記光重合開始剤は、光ラジカル重合開始剤であることが好ましい。
The photopolymerization initiator may be a photoradical polymerization initiator, a photocationic polymerization initiator, or the like. Only one type of the photopolymerization initiator may be used, or two or more types may be used in combination. From the viewpoint of further improving the sealing property of the air cavity, it is preferable that the photopolymerization initiator is a photoradical polymerization initiator.
上記光ラジカル重合開始剤は、光の照射によりラジカルを発生し、ラジカル重合反応を開始するための化合物である。上記光ラジカル重合開始剤としては、ベンゾイン、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインイソプロピルエーテル等のベンゾイン化合物;1-ヒドロキシシクロヘキシルフェニルケトン、2-ヒドロキシ-2-メチルプロピオフェノン等のアルキルフェノン化合物;アセトフェノン、2,2-ジメトキシ-2-フェニルアセトフェノン、2,2-ジエトキシ-2-フェニルアセトフェノン、1,1-ジクロロアセトフェノン等のアセトフェノン化合物;2-メチル-1-[4-(メチルチオ)フェニル]-2-モルホリノプロパン-1-オン、2-ベンジル-2-ジメチルアミノ-1-(4-モルホリノフェニル)-ブタン-1-オン、2-(ジメチルアミノ)-2-(4-メチルベンジル)-1-(4-モルホリノフェニル)ブタン-1-オン、2-ベンジル-2-ジメチルアミノ-1-(4-モルホリノフェニル)-ブタノン-1、2-(ジメチルアミノ)-2-[(4-メチルフェニル)メチル]-1-[4-(4-モルホリニル)フェニル]-1-ブタノン、2-(ジメチルアミノ)-1-(4-モルホリノフェニル)-2-ベンジル-1-ブタノン、フェニルビス(2,4,6-トリメチルベンゾイル)ホスフィンオキサイド、N,N-ジメチルアミノアセトフェノン等のアミノアセトフェノン化合物;2-メチルアントラキノン、2-エチルアントラキノン、2-t-ブチルアントラキノン等のアントラキノン化合物;2,4-ジメチルチオキサントン、2,4-ジエチルチオキサントン、2-クロロチオキサントン、2,4-ジイソプロピルチオキサントン等のチオキサントン化合物;アセトフェノンジメチルケタール、ベンジルジメチルケタール等のケタール化合物;2,4,6-トリメチルベンゾイルジフェニルホスフィンオキサイド、ビス(2,4,6-トリメチルベンゾイル)-フェニルフォスフィンオキサイド等のアシルフォスフィンオキサイド化合物;1,2-オクタンジオン、1-[4-(フェニルチオ)-2-(o-ベンゾイルオキシム)]、エタノン、1-[9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル]-1-(o-アセチルオキシム)等のオキシムエステル化合物;ビス(シクロペンタジエニル)-ジ-フェニル-チタニウム、ビス(シクロペンタジエニル)-ジ-クロロ-チタニウム、ビス(シクロペンタジエニル)-ビス(2,3,4,5,6-ペンタフルオロフェニル)チタニウム、ビス(シクロペンタジエニル)-ビス(2,6-ジフルオロ-3-(ピロール-1-イル)フェニル)チタニウムなどのチタノセン化合物等が挙げられる。上記光ラジカル重合開始剤は、1種のみが用いられてもよく、2種以上が併用されてもよい。
The photoradical polymerization initiator is a compound that generates radicals by irradiation with light and initiates a radical polymerization reaction. Examples of the photoradical polymerization initiator include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; alkylphenone compounds such as 1-hydroxycyclohexyl phenyl ketone and 2-hydroxy-2-methylpropiophenone; acetophenone compounds such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, and 1,1-dichloroacetophenone; 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-one, and 2-benzyl-2-dimethylamino-1-one; Aminoacetates such as -(4-morpholinophenyl)-butan-1-one, 2-(dimethylamino)-2-(4-methylbenzyl)-1-(4-morpholinophenyl)butan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, 2-(dimethylamino)-1-(4-morpholinophenyl)-2-benzyl-1-butanone, phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, and N,N-dimethylaminoacetophenone. anthraquinone compounds such as 2-methylanthraquinone, 2-ethylanthraquinone, and 2-t-butylanthraquinone; thioxanthone compounds such as 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, and 2,4-diisopropylthioxanthone; ketal compounds such as acetophenone dimethyl ketal and benzyl dimethyl ketal; acylphosphine oxide compounds such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide; 1,2-octanedione , 1-[4-(phenylthio)-2-(o-benzoyloxime)], ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-1-(o-acetyloxime) and other oxime ester compounds; bis(cyclopentadienyl)-di-phenyl-titanium, bis(cyclopentadienyl)-di-chloro-titanium, bis(cyclopentadienyl)-bis(2,3,4,5,6-pentafluorophenyl)titanium, bis(cyclopentadienyl)-bis(2,6-difluoro-3-(pyrrol-1-yl)phenyl)titanium and other titanocene compounds. The above photoradical polymerization initiators may be used alone or in combination of two or more.
エアキャビティの封止性をより一層高める観点からは、上記光重合開始剤は、アミノアセトフェノン化合物を含むことが好ましく、2-(ジメチルアミノ)-2-(4-メチルベンジル)-1-(4-モルホリノフェニル)ブタン-1-オンを含むことがより好ましい。
From the viewpoint of further improving the sealing properties of the air cavity, the photopolymerization initiator preferably contains an aminoacetophenone compound, and more preferably contains 2-(dimethylamino)-2-(4-methylbenzyl)-1-(4-morpholinophenyl)butan-1-one.
上記光ラジカル重合開始剤とともに、光重合開始助剤を用いてもよい。上記光重合開始助剤としては、N,N-ジメチルアミノ安息香酸エチルエステル、N,N-ジメチルアミノ安息香酸イソアミルエステル、ペンチル-4-ジメチルアミノベンゾエート、トリエチルアミン、及びトリエタノールアミン等が挙げられる。上記光重合開始助剤は、1種のみが用いられてもよく、2種以上が併用されてもよい。
A photopolymerization initiator assistant may be used together with the above-mentioned photoradical polymerization initiator. Examples of the photopolymerization initiator assistant include N,N-dimethylaminobenzoic acid ethyl ester, N,N-dimethylaminobenzoic acid isoamyl ester, pentyl-4-dimethylaminobenzoate, triethylamine, and triethanolamine. The above-mentioned photopolymerization initiator assistant may be used alone or in combination of two or more kinds.
また、可視光領域に吸収があるCGI-784等(チバ・スペシャルティ・ケミカルズ社製)のチタノセン化合物などを、光反応を促進するために用いてもよい。
Titanocene compounds such as CGI-784 (manufactured by Ciba Specialty Chemicals), which have absorption in the visible light region, may also be used to promote the photoreaction.
上記光カチオン重合開始剤としては、スルホニウム塩、ヨードニウム塩、メタロセン化合物、及びベンゾイントシレート等が挙げられる。上記光カチオン重合開始剤は、1種のみが用いられてもよく、2種以上が併用されてもよい。
The above cationic photopolymerization initiators include sulfonium salts, iodonium salts, metallocene compounds, and benzoin tosylate. The above cationic photopolymerization initiators may be used alone or in combination of two or more.
エアキャビティの封止性をより一層高める観点からは、上記硬化性組成物100重量%中、上記光重合開始剤の含有量は、好ましくは4重量%以上、より好ましくは5重量%以上であり、好ましくは20重量%以下、より好ましくは15重量%以下である。
From the viewpoint of further improving the sealing ability of the air cavity, the content of the photopolymerization initiator is preferably 4% by weight or more, more preferably 5% by weight or more, and is preferably 20% by weight or less, more preferably 15% by weight or less, based on 100% by weight of the curable composition.
<熱硬化剤>
上記硬化性組成物は、熱硬化剤を含むことが好ましい。上記熱硬化剤は、熱硬化性化合物を熱硬化させる。 <Thermal hardener>
The curable composition preferably contains a heat curing agent, which thermally cures the thermosetting compound.
上記硬化性組成物は、熱硬化剤を含むことが好ましい。上記熱硬化剤は、熱硬化性化合物を熱硬化させる。 <Thermal hardener>
The curable composition preferably contains a heat curing agent, which thermally cures the thermosetting compound.
上記熱硬化剤としては、有機酸、アミン化合物、アミド化合物、ヒドラジド化合物、イミダゾール化合物、イミダゾリン化合物、フェノール化合物、ユリア化合物、ポリスルフィッド化合物、及び酸無水物等が挙げられる。上記熱硬化剤は、1種のみが用いられてもよく、2種以上が併用されてもよい。
The above-mentioned heat curing agents include organic acids, amine compounds, amide compounds, hydrazide compounds, imidazole compounds, imidazoline compounds, phenol compounds, urea compounds, polysulfide compounds, and acid anhydrides. The above-mentioned heat curing agents may be used alone or in combination of two or more kinds.
上記アミン化合物としては、脂肪族ポリアミン、脂環式ポリアミン、芳香族ポリアミン、ヒドラジド、及びグアニジン誘導体等が挙げられる。上記アミン化合物は、アミン-エポキシアダクト等の変性ポリアミン化合物であってもよい。上記アミン化合物は、上記アミン化合物のアダクト体であってもよい。上記アミン化合物のアダクト体としては、エポキシ化合物付加ポリアミン(エポキシ化合物とポリアミンの反応物)、マイケル付加ポリアミン(α,β-不飽和ケトンとポリアミンの反応物)、マンニッヒ付加ポリアミン(ポリアミンとホルマリン及びフェノールの縮合体)、チオ尿素付加ポリアミン(チオ尿素とポリアミンの反応物)、及びケトン封鎖ポリアミン(ケトン化合物とポリアミンの反応物(ケチミン))等が挙げられる。
The above amine compounds include aliphatic polyamines, alicyclic polyamines, aromatic polyamines, hydrazides, and guanidine derivatives. The above amine compounds may be modified polyamine compounds such as amine-epoxy adducts. The above amine compounds may be adducts of the above amine compounds. Examples of the adducts of the above amine compounds include epoxy compound-added polyamines (reactants of epoxy compounds and polyamines), Michael addition polyamines (reactants of α,β-unsaturated ketones and polyamines), Mannich addition polyamines (condensates of polyamines with formalin and phenols), thiourea-added polyamines (reactants of thiourea and polyamines), and ketone-blocked polyamines (reactants of ketone compounds and polyamines (ketimines)).
上記脂肪族ポリアミンとしては、ジエチレントリアミン、トリエチレンテトラミン、テトラエチレンペンタミン、及びジエチルアミノプロピルアミン等が挙げられる。
The above-mentioned aliphatic polyamines include diethylenetriamine, triethylenetetramine, tetraethylenepentamine, and diethylaminopropylamine.
上記脂環式ポリアミンとしては、メンセンジアミン、イソホロンジアミン、N-アミノエチルピペラジン、3,9-ビス(3-アミノプロピル)-2,4,8,10-テトラオキサスピロ(5,5)ウンデカンアダクト、ビス(4-アミノ-3-メチルシクロヘキシル)メタン、及びビス(4-アミノシクロヘキシル)メタン等が挙げられる。
The above alicyclic polyamines include menthene diamine, isophorone diamine, N-aminoethylpiperazine, 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro(5,5)undecane adduct, bis(4-amino-3-methylcyclohexyl)methane, and bis(4-aminocyclohexyl)methane.
上記芳香族ポリアミンとしては、m-フェニレンジアミン、p-フェニレンジアミン、o-キシレンジアミン、m-キシレンジアミン、p-キシレンジアミン、4,4-ジアミノジフェニルメタン、4,4’-ジアミノ-3,3’-ジエチル-5,5’-ジメチルジフェニルメタン、4,4-ジアミノジフェニルプロパン、4,4-ジアミノジフェニルスルフォン、4,4-ジアミノジシクロヘキサン、ビス(4-アミノフェニル)フェニルメタン、1,5-ジアミノナフタレン、1,1-ビス(4-アミノフェニル)シクロヘキサン、2,2-ビス[(4-アミノフェノキシ)フェニル]プロパン、ビス[4-(3-アミノフェノキシ)フェニル]スルフォン、1,3-ビス(4-アミノフェノキシ)ベンゼン、4,4-メチレン-ビス(2-クロロアニリン)、及び4,4-ジアミノジフェニルスルフォン等が挙げられる。
The aromatic polyamines include m-phenylenediamine, p-phenylenediamine, o-xylylenediamine, m-xylylenediamine, p-xylylenediamine, 4,4-diaminodiphenylmethane, 4,4'-diamino-3,3'-diethyl-5,5'-dimethyldiphenylmethane, 4,4-diaminodiphenylpropane, 4,4-diaminodiphenylsulfone, 4,4-diaminodicyclohexane, bis(4-aminophenyl)phenylmethane, 1,5-diaminonaphthalene, 1,1-bis(4-aminophenyl)cyclohexane, 2,2-bis[(4-aminophenoxy)phenyl]propane, bis[4-(3-aminophenoxy)phenyl]sulfone, 1,3-bis(4-aminophenoxy)benzene, 4,4-methylene-bis(2-chloroaniline), and 4,4-diaminodiphenylsulfone.
上記ヒドラジドとしては、カルボジヒドラジド、アジピン酸ジヒドラジド、セバシン酸ジヒドラジド、ドデカン二酸ジヒドラジド、及びイソフタル酸ジヒドラジド等が挙げられる。
Examples of the hydrazides include carbodihydrazide, adipic acid dihydrazide, sebacic acid dihydrazide, dodecanedioic acid dihydrazide, and isophthalic acid dihydrazide.
上記グアニジン誘導体としては、ジシアンジアミド、1-o-トリルジグアニド、α-2,5-ジメチルグアニド、α,ω-ジフェニルジグアニジド、α,α-ビスグアニルグアニジノジフェニルエーテル、p-クロロフェニルジグアニド、α,α-ヘキサメチレンビス[ω-(p-クロロフェノール)]ジグアニド、フェニルジグアニドオキサレート、アセチルグアニジン、及びジエチルシアノアセチルグアニジン等が挙げられる。
The above guanidine derivatives include dicyandiamide, 1-o-tolyldiguanide, α-2,5-dimethylguanide, α,ω-diphenyldiguanide, α,α-bisguanylguanidinodiphenyl ether, p-chlorophenyldiguanide, α,α-hexamethylenebis[ω-(p-chlorophenol)]diguanide, phenyldiguanide oxalate, acetylguanidine, and diethylcyanoacetylguanidine.
上記フェノール化合物としては、多価フェノール化合物等が挙げられる。上記多価フェノール化合物としては、フェノール、クレゾール、エチルフェノール、ブチルフェノール、オクチルフェノール、ビスフェノールA、テトラブロムビスフェノールA、ビスフェノールF、ビスフェノールS、4,4’-ビフェニルフェノール、ナフタレン骨格含有フェノールノボラック樹脂、キシリレン骨格含有フェノールノボラック樹脂、ジシクロペンタジエン骨格含有フェノールノボラック樹脂、及びフルオレン骨格含有フェノールノボラック樹脂等が挙げられる。
The above-mentioned phenolic compounds include polyhydric phenolic compounds. Examples of the above-mentioned polyhydric phenolic compounds include phenol, cresol, ethylphenol, butylphenol, octylphenol, bisphenol A, tetrabromobisphenol A, bisphenol F, bisphenol S, 4,4'-biphenylphenol, phenol novolac resins containing a naphthalene skeleton, phenol novolac resins containing a xylylene skeleton, phenol novolac resins containing a dicyclopentadiene skeleton, and phenol novolac resins containing a fluorene skeleton.
上記酸無水物としては、無水フタル酸、テトラヒドロ無水フタル酸、ヘキサヒドロ無水フタル酸、メチルテトラヒドロ無水フタル酸、無水メチルナジック酸、ドデシル無水コハク酸、無水クロレンディック酸、無水ピロメリット酸、ベンゾフェノンテトラカルボン酸無水物、メチルシクロヘキセンテトラカルボン酸無水物、無水トリメリット酸、及びポリアゼライン酸無水物等が挙げられる。
Examples of the acid anhydrides include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, dodecylsuccinic anhydride, chlorendic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, methylcyclohexenetetracarboxylic anhydride, trimellitic anhydride, and polyazelaic anhydride.
上記熱硬化剤は、アミン化合物を含むことが好ましく、アミン化合物であることが好ましい。上記アミン化合物は、芳香族アミン化合物であることが好ましい。この場合には、回路基板及び電子部材と接着部との接着強度をより一層高めることができる。
The heat curing agent preferably contains an amine compound, and is preferably an amine compound. The amine compound is preferably an aromatic amine compound. In this case, the adhesive strength between the circuit board and the electronic component and the adhesive portion can be further increased.
上記硬化性組成物100重量%中、上記熱硬化剤の含有量は、好ましくは1重量%以上、より好ましくは5重量%以上、さらに好ましくは10重量%以上、好ましくは40重量%以下、より好ましくは30重量%以下、さらに好ましくは25重量%以下である。上記熱硬化剤の含有量が上記下限以上及び上記上限以下であると、回路基板及び電子部材と接着部との接着強度をより一層高めることができる。
The content of the heat curing agent in 100% by weight of the curable composition is preferably 1% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, preferably 40% by weight or less, more preferably 30% by weight or less, and even more preferably 25% by weight or less. When the content of the heat curing agent is equal to or more than the lower limit and equal to or less than the upper limit, the adhesive strength between the circuit board and the electronic component and the adhesive part can be further increased.
<硬化促進剤>
上記硬化性組成物は、硬化促進剤を含んでいてもよく、含んでいなくてもよい。上記硬化促進剤は、1種のみが用いられてもよく、2種以上が併用されてもよい。 <Curing accelerator>
The curable composition may or may not contain a curing accelerator. The curing accelerator may be used alone or in combination of two or more.
上記硬化性組成物は、硬化促進剤を含んでいてもよく、含んでいなくてもよい。上記硬化促進剤は、1種のみが用いられてもよく、2種以上が併用されてもよい。 <Curing accelerator>
The curable composition may or may not contain a curing accelerator. The curing accelerator may be used alone or in combination of two or more.
上記硬化促進剤としては、第三級アミン、イミダゾール、第四級アンモニウム塩、第四級ホスホニウム塩、有機金属塩、リン化合物及び尿素系化合物等が挙げられる。
The above-mentioned curing accelerators include tertiary amines, imidazoles, quaternary ammonium salts, quaternary phosphonium salts, organometallic salts, phosphorus compounds, and urea compounds.
上記硬化性組成物100重量%中、上記硬化促進剤の含有量は、好ましくは0.01重量%以上、より好ましくは0.05重量%以上、好ましくは10重量%以下、より好ましくは5重量%以下である。
In 100% by weight of the curable composition, the content of the curing accelerator is preferably 0.01% by weight or more, more preferably 0.05% by weight or more, and preferably 10% by weight or less, more preferably 5% by weight or less.
<溶剤>
上記硬化性組成物は、溶剤を含んでいてもよく、含んでいなくてもよい。上記溶剤は、1種のみが用いられてもよく、2種以上が併用されてもよい。 <Solvent>
The curable composition may or may not contain a solvent. The solvent may be used alone or in combination of two or more.
上記硬化性組成物は、溶剤を含んでいてもよく、含んでいなくてもよい。上記溶剤は、1種のみが用いられてもよく、2種以上が併用されてもよい。 <Solvent>
The curable composition may or may not contain a solvent. The solvent may be used alone or in combination of two or more.
上記溶剤としては、水及び有機溶剤等が挙げられる。
The above solvents include water and organic solvents.
残留物の除去性をより一層高める観点からは、上記溶剤は、有機溶剤であることが好ましい。
In order to further improve the removability of residues, it is preferable that the above solvent is an organic solvent.
上記有機溶剤としては、エタノール等のアルコール類、アセトン、メチルエチルケトン、シクロヘキサノン等のケトン類、トルエン、キシレン、テトラメチルベンゼン等の芳香族炭化水素類、セロソルブ、メチルセロソルブ、ブチルセロソルブ、カルビトール、メチルカルビトール、ブチルカルビトール、プロピレングリコールモノメチルエーテル、ジプロピレングリコールモノメチルエーテル、ジプロピレングリコールジエチルエーテル、トリプロピレングリコールモノメチルエーテル等のグリコールエーテル類、酢酸エチル、酢酸ブチル、乳酸ブチル、セロソルブアセテート、ブチルセロソルブアセテート、カルビトールアセテート、ブチルカルビトールアセテート、プロピレングリコールモノメチルエーテルアセテート、ジプロピレングリコールモノメチルエーテルアセテート、炭酸プロピレン等のエステル類、オクタン、デカン等の脂肪族炭化水素類、並びに石油エーテル、ナフサ等の石油系溶剤等が挙げられる。
The above organic solvents include alcohols such as ethanol, ketones such as acetone, methyl ethyl ketone, and cyclohexanone, aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene, glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and tripropylene glycol monomethyl ether, esters such as ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, and propylene carbonate, aliphatic hydrocarbons such as octane and decane, and petroleum-based solvents such as petroleum ether and naphtha.
硬化性組成物層の厚み精度をより一層高める観点からは、上記硬化性組成物における溶剤の含有量は少ないほどよい。
In order to further improve the thickness accuracy of the curable composition layer, the lower the solvent content in the curable composition, the better.
上記硬化性組成物が上記溶剤を含む場合に、上記硬化性組成物100重量%中、上記溶剤の含有量は、好ましくは5重量%以下、より好ましくは1重量%以下、さらに好ましくは0.5重量%以下である。上記硬化性組成物は、上記溶剤を含まないことが最も好ましい。
When the curable composition contains the solvent, the content of the solvent in 100% by weight of the curable composition is preferably 5% by weight or less, more preferably 1% by weight or less, and even more preferably 0.5% by weight or less. It is most preferable that the curable composition does not contain the solvent.
<他の成分>
上記硬化性組成物は、上述した成分以外の他の成分を含んでいてもよい。上記他の成分としては、カップリング剤、フィラー、レベリング剤、消泡剤、及び重合禁止剤等が挙げられる。 <Other Ingredients>
The curable composition may contain other components in addition to the above-mentioned components, such as a coupling agent, a filler, a leveling agent, a defoaming agent, and a polymerization inhibitor.
上記硬化性組成物は、上述した成分以外の他の成分を含んでいてもよい。上記他の成分としては、カップリング剤、フィラー、レベリング剤、消泡剤、及び重合禁止剤等が挙げられる。 <Other Ingredients>
The curable composition may contain other components in addition to the above-mentioned components, such as a coupling agent, a filler, a leveling agent, a defoaming agent, and a polymerization inhibitor.
1…回路基板
2…電子部材
3,3X…接着部
3A…硬化性組成物層
3B…Bステージ化物層
10,10X,11,12…電子部品
41…はんだボール
42…樹脂シート
43…接続端子
44…モールド樹脂部
51…吐出部
52…光照射部
R…エアキャビティ REFERENCE SIGNSLIST 1...circuit board 2... electronic member 3, 3X...adhesive portion 3A...curable composition layer 3B...B-staged product layer 10, 10X, 11, 12...electronic component 41...solder ball 42...resin sheet 43...connection terminal 44...molded resin portion 51...discharge portion 52...light irradiation portion R...air cavity
2…電子部材
3,3X…接着部
3A…硬化性組成物層
3B…Bステージ化物層
10,10X,11,12…電子部品
41…はんだボール
42…樹脂シート
43…接続端子
44…モールド樹脂部
51…吐出部
52…光照射部
R…エアキャビティ REFERENCE SIGNS
Claims (20)
- 回路基板上に、少なくとも1つの電子部材を実装する工程と、
前記回路基板の上面に23℃で液状の硬化性組成物を塗布して硬化性組成物層を形成する工程と、
前記硬化性組成物層を硬化させて接着部を形成する工程とを有し、
前記硬化性組成物層を形成する工程において、前記電子部材の側面の少なくとも一部に接するように前記硬化性組成物層を形成し、
前記回路基板と前記電子部材と前記接着部とによりエアキャビティを形成する、電子部品の製造方法。 Mounting at least one electronic component on the circuit board;
applying a liquid curable composition at 23° C. to an upper surface of the circuit board to form a curable composition layer;
and curing the curable composition layer to form an adhesive portion,
In the step of forming the curable composition layer, the curable composition layer is formed so as to be in contact with at least a part of a side surface of the electronic member,
an air cavity is formed by the circuit board, the electronic member, and the adhesive portion, - 前記電子部材が複数であり、
前記電子部材を実装する工程において、前記回路基板上に、複数の前記電子部材を間隔を空けて実装し、
前記硬化性組成物層を形成する工程において、複数の前記電子部材が隣り合う部分の前記電子部材の側面の少なくとも一部に接しないように、前記硬化性組成物層を形成する、請求項1に記載の電子部品の製造方法。 The electronic components are multiple,
In the step of mounting the electronic components, a plurality of the electronic components are mounted on the circuit board at intervals;
2. The method for producing an electronic component according to claim 1, wherein in the step of forming the curable composition layer, the curable composition layer is formed so as not to contact at least a portion of a side surface of the electronic components in a portion where the plurality of electronic components are adjacent to each other. - 前記硬化性組成物層を形成する工程において、前記電子部材の外周全体にわたって、前記電子部材の側面に接するように前記硬化性組成物層を形成する、請求項1に記載の電子部品の製造方法。 The method for manufacturing an electronic component according to claim 1, wherein in the step of forming the curable composition layer, the curable composition layer is formed so as to contact the side surface of the electronic component over the entire outer periphery of the electronic component.
- 前記硬化性組成物層を形成する工程において、前記電子部材の側面の上端から下端までに接するように前記硬化性組成物層を形成する、請求項1~3のいずれか1項に記載の電子部品の製造方法。 The method for manufacturing an electronic component according to any one of claims 1 to 3, wherein in the step of forming the curable composition layer, the curable composition layer is formed so as to contact the side surface of the electronic component from the upper end to the lower end.
- 前記硬化性組成物層を形成する工程において、前記電子部材の上面の縁部に接するように前記硬化性組成物層を形成する、請求項1~4のいずれか1項に記載の電子部品の製造方法。 The method for manufacturing an electronic component according to any one of claims 1 to 4, wherein in the step of forming the curable composition layer, the curable composition layer is formed so as to contact the edge of the upper surface of the electronic component.
- 前記硬化性組成物層を形成する工程において、前記電子部材の下面に接しないように前記硬化性組成物層を形成する、請求項1~5のいずれか1項に記載の電子部品の製造方法。 The method for manufacturing an electronic component according to any one of claims 1 to 5, wherein in the step of forming the curable composition layer, the curable composition layer is formed so as not to come into contact with the lower surface of the electronic component.
- 前記接着部を形成する工程が、
前記硬化性組成物層を光硬化させて前記接着部を形成する工程を備える、請求項1~6のいずれか1項に記載の電子部品の製造方法。 The step of forming the adhesive joint comprises:
The method for producing an electronic component according to any one of claims 1 to 6, further comprising a step of photocuring the curable composition layer to form the adhesive portion. - 前記接着部を形成する工程が、
前記硬化性組成物層を光硬化させてBステージ化物層を得る工程と、
前記Bステージ化物層を熱硬化させて前記接着部を形成する工程とを備える、請求項1~7のいずれか1項に記載の電子部品の製造方法。 The step of forming the adhesive joint comprises:
a step of photocuring the curable composition layer to obtain a B-staged product layer;
The method for producing an electronic component according to any one of claims 1 to 7, further comprising the step of thermally curing the B-staged material layer to form the adhesive joint. - 前記接着部を形成する工程が、
前記硬化性組成物を複数滴又は1滴塗布するごとに、前記硬化性組成物層を光硬化させて、多層のBステージ化物層を得る工程と、
前記多層の層状のBステージ化物層を熱硬化させて、多層の接着部を形成する工程とを備える、請求項8に記載の電子部品の製造方法。 The step of forming the adhesive joint comprises:
a step of photocuring the curable composition layer after each application of a plurality of drops or each application of a single drop of the curable composition to obtain multiple B-staged product layers;
9. The method of claim 8, further comprising the step of: heat curing the multi-layered B-staged material layers to form a multi-layer bond joint. - 前記接着部の上面及び側面を、樹脂を用いて封止する工程をさらに備える、請求項1~9のいずれか1項に記載の電子部品の製造方法。 The method for manufacturing an electronic component according to any one of claims 1 to 9, further comprising a step of sealing the upper and side surfaces of the adhesive portion with resin.
- 前記硬化性組成物層を形成する工程において、前記硬化性組成物をインクジェット方式により塗布する、請求項1~10のいずれか1項に記載の電子部品の製造方法。 The method for manufacturing an electronic component according to any one of claims 1 to 10, wherein in the step of forming the curable composition layer, the curable composition is applied by an inkjet method.
- 回路基板と、少なくとも1つの電子部材と、接着部とを備え、
前記回路基板上に、少なくとも1つの前記電子部材が実装されており、
前記接着部が23℃で液状の硬化性組成物の硬化物であり、
前記接着部が前記回路基板の上面と前記電子部材の側面の少なくとも一部とに接しており、
前記回路基板と前記電子部材と前記接着部とによりエアキャビティが形成されている、電子部品。 The electronic device includes a circuit board, at least one electronic component, and an adhesive portion.
At least one of the electronic components is mounted on the circuit board,
the adhesive joint is a cured product of a curable composition that is liquid at 23°C,
the adhesive portion is in contact with an upper surface of the circuit board and at least a part of a side surface of the electronic component,
an air cavity is formed by the circuit board, the electronic member, and the adhesive portion. - 前記電子部材が複数であり、
前記回路基板上に、複数の前記電子部材が間隔を空けて実装されており、
前記接着部が、複数の前記電子部材が隣り合う部分の前記電子部材の側面の少なくとも一部に接していない、請求項12に記載の電子部品。 The electronic components are multiple,
A plurality of the electronic components are mounted on the circuit board at intervals,
The electronic component according to claim 12 , wherein the adhesive portion does not contact at least a part of a side surface of the electronic components in a portion where the plurality of electronic components are adjacent to each other. - 前記接着部が前記電子部材の外周全体にわたって、前記電子部材の側面に接している、請求項12に記載の電子部品。 The electronic component according to claim 12, wherein the adhesive portion contacts the side surface of the electronic component over the entire periphery of the electronic component.
- 前記接着部が前記電子部材の上面の縁部に接している、請求項12~14のいずれか1項に記載の電子部品。 The electronic component according to any one of claims 12 to 14, wherein the adhesive portion is in contact with the edge of the upper surface of the electronic component.
- 前記接着部が前記電子部材の下面に接していない、請求項12~15のいずれか1項に記載の電子部品。 The electronic component according to any one of claims 12 to 15, wherein the adhesive portion is not in contact with the bottom surface of the electronic component.
- 前記接着部の高さが、1μm以上300μm以下である、請求項12~16のいずれか1項に記載の電子部品。 The electronic component according to any one of claims 12 to 16, wherein the height of the adhesive portion is 1 μm or more and 300 μm or less.
- 前記硬化性組成物が、エポキシ化合物、(メタ)アクリレート化合物、又はシリコーン化合物を含む、請求項12~17のいずれか1項に記載の電子部品。 The electronic component according to any one of claims 12 to 17, wherein the curable composition contains an epoxy compound, a (meth)acrylate compound, or a silicone compound.
- 前記電子部材が、半導体チップ、コンデンサ、又は発光素子である、請求項12~18のいずれか1項に記載の電子部品。 The electronic component according to any one of claims 12 to 18, wherein the electronic component is a semiconductor chip, a capacitor, or a light-emitting element.
- 前記電子部材が、弾性表面波フィルター、弾性バルク波フィルター、又はフィルム弾性共振器フィルターである、請求項12~19のいずれか1項に記載の電子部品。 The electronic component according to any one of claims 12 to 19, wherein the electronic component is a surface acoustic wave filter, a bulk acoustic wave filter, or a film acoustic resonator filter.
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WO2014050688A1 (en) * | 2012-09-27 | 2014-04-03 | 積水化学工業株式会社 | Curable composition for inkjet, and method for producing electronic part |
JP2018074566A (en) * | 2016-08-25 | 2018-05-10 | ゼネラル・エレクトリック・カンパニイ | Embedded rf filter package structure and method of manufacturing the same |
WO2022203033A1 (en) * | 2021-03-26 | 2022-09-29 | 積水化学工業株式会社 | Ink-jet adhesive, method for producing electronic component, and electronic component |
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JP2004064732A (en) * | 2002-06-03 | 2004-02-26 | Murata Mfg Co Ltd | Surface acoustic wave device |
WO2014050688A1 (en) * | 2012-09-27 | 2014-04-03 | 積水化学工業株式会社 | Curable composition for inkjet, and method for producing electronic part |
JP2018074566A (en) * | 2016-08-25 | 2018-05-10 | ゼネラル・エレクトリック・カンパニイ | Embedded rf filter package structure and method of manufacturing the same |
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