WO2024018615A1 - Interposer member, method for manufacturing circuit board, and design method - Google Patents

Interposer member, method for manufacturing circuit board, and design method Download PDF

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Publication number
WO2024018615A1
WO2024018615A1 PCT/JP2022/028461 JP2022028461W WO2024018615A1 WO 2024018615 A1 WO2024018615 A1 WO 2024018615A1 JP 2022028461 W JP2022028461 W JP 2022028461W WO 2024018615 A1 WO2024018615 A1 WO 2024018615A1
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WO
WIPO (PCT)
Prior art keywords
interposer
resin
dimensions
image
base substrate
Prior art date
Application number
PCT/JP2022/028461
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French (fr)
Japanese (ja)
Inventor
慎二 瀧川
Original Assignee
株式会社Fuji
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Publication date
Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to PCT/JP2022/028461 priority Critical patent/WO2024018615A1/en
Publication of WO2024018615A1 publication Critical patent/WO2024018615A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Definitions

  • the present invention relates to an interposer member, a circuit board manufacturing method, and a designing method.
  • An object of the present invention is to appropriately manufacture an interposer member.
  • an interposer member that is provided on a base board on which electrical components are mounted, and includes a conductive member that electrically connects the upper and lower sides of the interposer member.
  • An interposer member is disclosed that includes an enclosure member surrounding the periphery and a frame member erected along the outer edge of the base substrate.
  • the present specification provides a base substrate forming step in which a base substrate on which electrical components are mounted is formed of a curable resin, and a base substrate formed in the base substrate forming step.
  • an interposer member forming step of forming the interposer member from a curable resin A method for manufacturing a circuit board is disclosed, in which a frame member that is erected along the outer edge of the base substrate is formed on the base substrate using a curable resin.
  • the present specification provides a method for designing an interposer member provided on a base board on which electrical components are mounted, the upper and lower sides of the interposer member being electrically connected. Based on the dimensions and arrangement position of the conductive member to be connected, image data of an enclosing member surrounding the conductive member is generated, and based on the dimensions of the base substrate, the enclosing member is installed upright along the outer edge of the base substrate.
  • a design method for designing the interposer member by creating image data of the frame member is disclosed.
  • the interposer member includes an enclosure member that surrounds a conductive member that electrically connects the upper side and the lower side, and a frame member that stands up along the outer edge of the base substrate. This makes it possible to appropriately manufacture the interposer member.
  • FIG. 2 is a block diagram showing a control device.
  • FIG. 3 is a cross-sectional view showing a circuit with a resin laminate formed thereon.
  • FIG. 2 is a cross-sectional view showing a circuit in which pads are formed in holes in a resin laminate.
  • FIG. 2 is a cross-sectional view showing a circuit in which wiring is formed on a resin laminate.
  • FIG. 3 is a cross-sectional view showing a circuit with conductive resin paste discharged onto wiring.
  • FIG. 2 is a perspective view showing a circuit in which an interposer member is formed on a resin laminate.
  • FIG. 2 is a cross-sectional view showing a circuit in which an interposer member is formed on a resin laminate.
  • FIG. 2 is a cross-sectional view showing a circuit in which electronic components and probe pins are arranged.
  • FIG. 3 is a cross-sectional view showing the cover substrate.
  • FIG. 3 is a cross-sectional view showing a laminated substrate.
  • FIG. 3 is a diagram showing an interposer image. It is a figure showing a 3D image. It is a figure which shows the interposer member of an Example. It is a figure showing a conventional interposer member. It is a figure which shows the interposer member of a modification. It is a figure which shows the interposer image of a modification.
  • FIG. 1 shows an example of a circuit forming apparatus 10.
  • the circuit forming apparatus 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, a third modeling unit 25, a mounting unit 27, and a control device (see FIG. 2) 28.
  • the transport device 20 , the first modeling unit 22 , the second modeling unit 24 , the third modeling unit 25 , and the mounting unit 27 are arranged on the base 29 of the circuit forming apparatus 10 .
  • the base 29 has a generally rectangular shape, and in the following description, the longitudinal direction of the base 29 is the X-axis direction, the short direction of the base 29 is the Y-axis direction, and it is perpendicular to both the X-axis direction and the Y-axis direction. The direction will be described as the Z-axis direction.
  • the transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32.
  • the X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36.
  • the X-axis slide rail 34 is arranged on the base 29 so as to extend in the X-axis direction.
  • the X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction.
  • the X-axis slide mechanism 30 includes an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 is moved to any position in the X-axis direction by driving the electromagnetic motor 38.
  • the Y-axis slide mechanism 32 includes a Y-axis slide rail 50 and a stage 52.
  • the Y-axis slide rail 50 is disposed on the base 29 so as to extend in the Y-axis direction, and is movable in the X-axis direction.
  • One end of the Y-axis slide rail 50 is connected to the X-axis slider 36.
  • a stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction.
  • the Y-axis slide mechanism 32 includes an electromagnetic motor (see FIG. 2) 56, and the stage 52 is moved to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56. Thereby, the stage 52 is moved to an arbitrary position on the base 29 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.
  • the stage 52 has a base 60, a holding device 62, and a lifting device 64.
  • the base 60 is formed into a flat plate shape, and a substrate is placed on the top surface.
  • the holding device 62 is provided on both sides of the base 60 in the X-axis direction. Then, both edges of the substrate placed on the base 60 in the X-axis direction are held between the holding devices 62, so that the substrate is fixedly held. Further, the lifting device 64 is disposed below the base 60 and raises and lowers the base 60.
  • the first modeling unit 22 is a unit that models wiring on a substrate placed on the base 60 of the stage 52, and includes a first printing section 72 and a firing section 74.
  • the first printing section 72 has an inkjet head (see FIG. 2) 76, and the inkjet head 76 discharges metal ink in a linear manner.
  • Metal ink is made by dispersing nanometer-sized metal particles, such as silver, in a solvent. Note that the surface of the metal fine particles is coated with a dispersant to prevent agglomeration in the solvent. Further, the inkjet head 76 ejects metal ink from a plurality of nozzles using a piezo system using piezoelectric elements, for example.
  • the baking section 74 has an infrared irradiation device (see FIG. 2) 78.
  • the infrared irradiation device 78 is a device that irradiates the ejected metal ink with infrared rays.
  • the metal ink irradiated with infrared rays is fired and wiring is formed.
  • firing metal ink means that energy is applied to vaporize the solvent and decompose the protective film of the metal particles, that is, the dispersant, etc., and the metal particles contact or fuse to form a conductive layer. This is a phenomenon where the rate increases.
  • metal wiring is formed by firing the metal ink.
  • the second modeling unit 24 is a unit that models a resin layer on the substrate placed on the base 60 of the stage 52, and includes a second printing section 84 and a curing section 86.
  • the second printing section 84 has an inkjet head (see FIG. 2) 88, and the inkjet head 88 discharges ultraviolet curing resin.
  • Ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays.
  • the inkjet head 88 may be of a piezo type using a piezoelectric element, for example, or may be a thermal type of heating resin to generate bubbles and ejecting the bubbles from a plurality of nozzles.
  • the curing section 86 includes a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92.
  • the flattening device 90 flattens the upper surface of the ultraviolet curable resin discharged by the inkjet head 88, and for example, scrapes off excess resin with a roller or blade while leveling the surface of the ultraviolet curable resin. to make the thickness of the ultraviolet curing resin uniform.
  • the irradiation device 92 includes a mercury lamp or an LED as a light source, and irradiates the discharged ultraviolet curing resin with ultraviolet rays. As a result, the discharged ultraviolet curing resin is cured and a resin layer is formed.
  • the third molding unit 25 is a unit that molds connection parts between electrodes and wiring of electronic components on a substrate placed on a base 60 of the stage 52, and includes a third printing part 100 and a first heating part. 102.
  • the third printing unit 100 has a dispenser (see FIG. 2) 106, and the dispenser 106 discharges conductive resin paste.
  • the conductive resin paste is made by dispersing micrometer-sized metal particles in a resin that hardens by heating at a relatively low temperature. Incidentally, the metal particles are in the form of flakes, and the viscosity of the conductive resin paste is relatively high compared to the metal ink.
  • the first heating section 102 has a heater (see FIG. 2) 108.
  • the heater 108 is a device that heats the conductive resin paste applied by the dispenser 106. In the heated conductive resin paste, the resin hardens. At this time, in the conductive resin paste, the resin hardens and contracts, and the flaky metal particles dispersed in the resin come into contact with each other. Thereby, the conductive resin paste exhibits conductivity. Further, the resin of the conductive resin paste is, for example, an organic adhesive, and exhibits adhesive strength by being cured by heating.
  • the mounting unit 27 is a unit for mounting components on a circuit board, and includes a supply section 120 and a mounting section 122.
  • the supply unit 120 has a plurality of tape feeders (see FIG. 2) 124 that feed out taped components one by one, and supplies the components at a supply position.
  • the plurality of tape feeders 124 of the supply unit 120 supply components such as electronic components and probe pins.
  • the supply unit 120 is not limited to the tape feeder 124, and may be a tray-type supply device that picks up and supplies electronic components from a tray. Further, the supply unit 120 may be configured to include both a tape type and a tray type, or other supply devices.
  • the mounting section 122 includes a mounting head (see FIG. 2) 126 and a moving device (see FIG. 2) 128.
  • the mounting head 126 has a suction nozzle (not shown) for suctioning and holding components.
  • the suction nozzle is supplied with negative pressure from a positive and negative pressure supply device (not shown), and suctions and holds the component by suctioning air. Then, by supplying a slight positive pressure from the positive and negative pressure supply device, the parts are separated.
  • the moving device 128 moves the mounting head 126 between the component supply position by the tape feeder 124 and the substrate placed on the base 60. As a result, in the mounting section 122, the component supplied from the tape feeder 124 is held by the suction nozzle, and the component held by the suction nozzle is mounted on the board.
  • control device 28 includes a controller 130 and a plurality of drive circuits 132, as shown in FIG.
  • the plurality of drive circuits 132 include the electromagnetic motors 38 and 56, a holding device 62, a lifting device 64, an inkjet head 76, an infrared irradiation device 78, an inkjet head 88, a flattening device 90, an irradiation device 92, a dispenser 106, a heater 108, It is connected to a tape feeder 124, a mounting head 126, and a moving device 128.
  • the controller 130 is mainly a computer, including a CPU, ROM, RAM, etc., and is connected to a plurality of drive circuits 132. As a result, the operations of the transport device 20 , the first modeling unit 22 , the second modeling unit 24 , the third modeling unit 25 , and the mounting unit 27 are controlled by the controller 130 .
  • a base substrate is formed on the base 60, and an interposer member is formed on the base substrate, thereby forming a circuit board.
  • the stage 52 is moved below the second modeling unit 24. Then, in the second modeling unit 24, as shown in FIG. 3, a resin laminate 150 is formed on the base 60 of the stage 52.
  • the resin laminate 150 has a plurality of holes 152 and insertion holes 154, and the ejection of the ultraviolet curable resin from the inkjet head 88 and the irradiation of the ejected ultraviolet curable resin with ultraviolet rays by the irradiation device 92 are repeated. It is formed by
  • the inkjet head 88 discharges ultraviolet curing resin in a thin film onto the upper surface of the base 60. At this time, the inkjet head 88 discharges the ultraviolet curing resin so that a predetermined position on the upper surface of the base 60 is exposed. Subsequently, when the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened by a flattening device 90 in the curing section 86 so that the thickness of the ultraviolet curable resin becomes uniform. Then, the irradiation device 92 irradiates the thin film of ultraviolet curing resin with ultraviolet rays. As a result, a thin film-like resin layer 156 is formed on the base 60.
  • the inkjet head 88 discharges a thin film of ultraviolet curing resin onto the thin film resin layer 156. That is, the inkjet head 88 discharges the ultraviolet curing resin in a thin film onto the resin layer 156 so that a predetermined position on the upper surface of the base 60 is exposed. Then, the thin film-shaped ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet ray curable resin discharged in the thin film shape with ultraviolet rays, thereby forming a layer on the thin film-shaped resin layer 156. A thin film-like resin layer 156 is laminated.
  • a resin laminate 150 having the following properties is formed. Further, the resin laminate 150 has a generally rectangular plate shape, and four insertion holes 154 are formed at the four corners of the resin laminate 150. Further, the plurality of holes 152 are formed in a number corresponding to the number of probe pins arranged at positions corresponding to the arrangement locations of probe pins, which will be described later. Note that two holes 152 are formed in the resin laminate 150.
  • the stage 52 is moved below the third modeling unit 25. Then, in the third printing section 100 of the third modeling unit 25, the dispenser 106 discharges the conductive resin paste 158 into each of the plurality of holes 152, as shown in FIG. At this time, the dispenser 106 discharges the conductive resin paste 158 so as to fill the inside of the hole 152. In this manner, when the conductive resin paste 158 is discharged into the hole 152, the resin laminate 150 is heated by the heater 108 in the first heating section 102. As a result, the conductive resin paste 158 hardens inside the hole 152, and pads 160 exposed on the lower and upper surfaces of the resin laminate 150 are formed.
  • the stage 52 is moved below the first modeling unit 22.
  • the inkjet head 76 discharges the metal ink 162 linearly onto the upper surface of the resin laminate 150 according to the circuit pattern, as shown in FIG.
  • the infrared irradiation device 78 irradiates the metal ink 162 with infrared rays in the firing section 74 of the first modeling unit 22 .
  • the metal ink 162 is fired, and the wiring 164 is formed on the resin laminate 150.
  • two wires 164 are formed on the upper surface of the resin laminate 150, one end of each of the two wires 164 is connected to the pad 160, and the other end of the two wires 164 is connected to the pad 160. are facing each other.
  • the stage 52 is moved below the third modeling unit 25.
  • the dispenser 106 pastes a conductive resin paste onto one end of each of the two wirings 164 connected to the pad 160, as shown in FIG. 166 is discharged, and a conductive resin paste 168 is discharged onto the opposite ends of the two wirings 164.
  • the conductive resin pastes 166, 168 are heated by the heater 108, so that the conductive resin pastes 166, 168 exhibit conductivity.
  • the stage 52 is moved below the second modeling unit 24.
  • the discharge of the ultraviolet curing resin from the inkjet head 88 and the irradiation of the ejected ultraviolet curing resin with ultraviolet light by the irradiation device 92 are repeated, as shown in FIGS. 7 and 8.
  • a plurality of cylindrical members 170 and frame members 172 are formed on the resin laminate 150.
  • the cylindrical member 170 and the frame member 172 are basically formed by the same method as the resin laminate 150.
  • the inkjet head 88 discharges the ultraviolet curable resin in an annular shape onto the upper surface of the resin laminate 150 so as to surround the conductive resin paste 166. Then, the ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curable resin with ultraviolet rays, thereby forming a ring-shaped resin layer. Then, by stacking the annular resin layers, a cylindrical first cylindrical member 170a surrounding the conductive resin paste 166 is formed on the upper surface of the resin laminate 150.
  • the inkjet head 88 discharges the ultraviolet curing resin in an annular shape onto the upper surface of the resin laminate 150 so as to surround the opening of the insertion hole 154. Then, the ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curable resin with ultraviolet rays, thereby forming a ring-shaped resin layer. Then, by stacking the annular resin layers, a cylindrical second cylindrical member 170b surrounding the opening of the insertion hole 154 is formed on the upper surface of the resin laminate 150.
  • the inkjet head 88 discharges the ultraviolet curing resin in a rectangular shape onto the upper surface of the resin laminate 150 so as to surround the conductive resin paste 168. Then, the ultraviolet curing resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curing resin with ultraviolet rays, thereby forming a rectangular resin layer. Then, by stacking the rectangular frame-shaped resin layers, a rectangular third cylinder member 170c that surrounds the conductive resin paste 168 is formed on the upper surface of the resin laminate 150. Note that the third cylindrical member 170c surrounds the conductive resin paste 168 discharged onto the ends of the two wires 164 facing each other.
  • the inkjet head 88 discharges the ultraviolet curable resin in a frame shape onto the upper surface of the resin laminate 150 along the outer edge of the resin laminate 150.
  • the ultraviolet curing resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curing resin with ultraviolet rays, thereby forming a frame-shaped resin layer.
  • a frame-shaped frame member 172 along the outer edge of the resin laminate 150 is formed on the upper surface of the resin laminate 150.
  • the frame member 172 is formed on the outer edge of the resin laminate 150, it may also be formed along the outer edge of the resin laminate 150 at a predetermined distance inside from the outer edge of the resin laminate 150. good.
  • the frame member 172 is formed linearly along the outer edge of the resin laminate 150, it may be formed so as to curve along the outer edge of the resin laminate 150. Note that the height dimension of the cylindrical member 170 and the height dimension of the frame member 172 are the same. Moreover, the thickness dimension of the cylinder member 170 and the thickness dimension of the frame member 172 are the same.
  • the stage 52 is moved below the mounting unit 27.
  • an electronic component (see FIG. 9) 180 is supplied by one of the plurality of tape feeders 124, and the electronic component 180 is held by a suction nozzle of the mounting head 126.
  • the electronic component 180 includes a component body 182 and two electrodes 184 disposed on the lower surface of the component body 182.
  • the mounting head 126 is moved by the moving device 128, and the electronic component 180 held by the suction nozzle is mounted on the upper surface of the resin laminate 150 inside the third cylindrical member 170c.
  • the electronic component 180 is mounted so that the electrode 184 of the electronic component 180 comes into contact with the conductive resin paste 168 discharged onto the end of the wiring 164.
  • a probe pin 190 is supplied by another tape feeder among the plurality of tape feeders 124, and the probe pin 190 is held by a suction nozzle of the mounting head 126.
  • the probe pin 190 has a generally cylindrical shape and is expandable and contractible in the length direction. Then, the mounting head 126 is moved by the moving device 128, and the probe pin 190 held by the suction nozzle is mounted on the upper surface of the resin laminate 150 inside the first cylindrical member 170a. At this time, the lower end surface of the probe pin 190 comes into contact with the conductive resin paste 166 discharged onto the end of the wiring 164.
  • the wiring 164 is formed on the resin laminate 150 and the electronic component 180 etc. are mounted, and the cylindrical member 170 and the frame member 172 surrounding the electronic component 180 etc. are formed on the resin laminate 150.
  • the circuit board 200 is formed. That is, the resin laminate 150 serves as the base of the circuit board 200, and the interposer member 204 made of the cylinder member 170 and the frame member 172 is formed on the base substrate 202 made of the resin laminate 150, wiring 164, etc. By doing so, the circuit board 200 is formed.
  • a cover substrate 210 shown in FIG. 10 is also formed.
  • the cover substrate 210 is formed using the same method used to form the pads 160 on the resin laminate 150 as shown in FIG. 4 when the circuit board 200 is produced. That is, as shown in FIG. 10, a resin laminate 150 having a hole 152 and an insertion hole 154 is formed on the upper surface of the base 60. Then, pad 160 is formed by discharging conductive resin paste 158 into hole 152 .
  • the inkjet head 76 in the first printing section 72 of the first modeling unit 22 applies two pieces of metal ink 212 onto the upper surface of the resin laminate 150. Discharge so as to connect the pads 160. Then, in the firing section 74 of the first modeling unit 22, an infrared ray irradiation device 78 irradiates the metal ink 212 with infrared rays. As a result, the metal ink 212 is fired, and the wiring 214 is formed on the resin laminate 150.
  • a resin laminate 216 is formed on the resin laminate 150 using the same method as the resin laminate 150.
  • the outer dimensions of the resin laminate 216 are the same as the outer dimensions of the resin laminate 150 except for the thickness dimension.
  • an insertion hole 218 is formed in the resin laminate 216 at the same position as the insertion hole 154 of the resin laminate 150 . In this way, by forming the resin laminate 216 on the resin laminate 150, the cover substrate 210 is formed.
  • two circuit boards 200 are formed, and the two circuit boards 200 and the cover board 210 are stacked and bolted together to form a laminated board 220.
  • two circuit boards 200 are stacked, and a cover board 210 is stacked on the two stacked circuit boards 200.
  • the upper end surface of the probe pin 190a of the lowest circuit board 200a comes into contact with the lower end surface of the pad 160b of the circuit board 200b stacked on the circuit board 200a.
  • the probe pin 190a electrically connects the upper side and the lower side of the interposer member 204a on the circuit board 200a.
  • the upper end surface of the probe pin 190b of the circuit board 200b contacts the lower end surface of the pad 160c of the cover substrate 210 stacked on the circuit board 200b.
  • the probe pin 190b electrically connects the upper and lower sides of the interposer member 204b on the circuit board 200b.
  • the inside of the second cylindrical member 170b of the circuit board 200a communicates with the insertion hole 154 of the circuit board 200b.
  • the inside of the second cylindrical member 170b of the circuit board 200b and the insertion hole 154 of the cover board 210 communicate with each other.
  • the insertion hole 154 of the circuit board 200a and the inside of the second cylindrical member 170b, the insertion hole 154 of the circuit board 200b and the inside of the second cylindrical member 170b, and the insertion holes 154 and 218 of the cover board 210 communicate with each other. .
  • the bolts 230 are inserted into the insertion hole 154 of the circuit board 200a and the inside of the second cylindrical member 170b, the insertion hole 154 of the circuit board 200b and the inside of the second cylindrical member 170b, and the insertion holes 154 and 218 of the cover board 210.
  • the circuit board 200a, the circuit board 200b, and the cover board 210 are bolted together. As a result, a laminated substrate 220 is formed.
  • the circuit board 200a, the circuit board 200b, and the cover board 210 are laminated and, for example, bolted together to form the laminated board 220.
  • a substrate is disposed on a robot hand, it is desired to reduce the weight of the substrate from the viewpoint of increasing the moving speed of the robot hand and controlling vibration damping.
  • the board be lightweight so that it can operate for a long time with one charge.
  • the interposer member 204 constituting the circuit board 200 can be formed into an arbitrary shape by discharging the ultraviolet curing resin at an arbitrary position.
  • the interposer member 204 is made of ultraviolet curing resin.
  • a design image (hereinafter referred to as a "CAD image") of the circuit board 200 is created using CAD (Computer Aided Design). Since the method for creating a CAD image is a well-known technique, the method for creating a CAD image will be briefly described.
  • CAD image the operator inputs the dimensions of the resin laminate 150 constituting the circuit board 200 and the locations of the electronic components 180, probe pins 190, bolts 230, and the like. Then, a CAD image is created based on the dimensions of the resin laminate 150 constituting the circuit board 200 and the positions of the electronic components 180, probe pins 190, bolts 230, and the like.
  • the dimensions of the resin laminate 150 and the locations of the electronic component 180, probe pin 190, and bolt 230 can be calculated.
  • the created CAD image is stored in the control device 28 of the circuit forming apparatus 10. The operator also registers the dimensions of the electronic component 180, probe pin 190, and bolt 230 in the control device 28.
  • the controller 130 of the control device 28 stores a first design program 250 (see FIG. 2). Then, the first design program 250 calculates the dimensions of the resin laminate 150 and the placement positions of the electronic component 180, the probe pin 190, and the bolt 230 based on the CAD image stored in the control device 28. The first design program 250 also acquires the dimensions of the electronic component 180, probe pin 190, and bolt 230 registered in the control device 28. The first design program 250 also displays an input image for inputting the height and thickness of the interposer member 204 on a display monitor (not shown). At this time, the operator inputs the height and thickness of the interposer member 204 on the input screen. Note that the input height dimension of the interposer member 204 is described as an input height dimension, and the input thickness dimension of the interposer member 204 is described as an input thickness dimension.
  • the first design program 250 then designs the interposer member 204 based on the dimensions of the resin laminate 150, the arrangement positions and dimensions of the electronic component 180, the probe pin 190, and the bolt 230, the input height dimension, and the input thickness dimension. design. At this time, the first design program 250 generates an image of the interposer member 204 (hereinafter referred to as 260 (described as an "interposer image”) (see FIG. 12).
  • the first design program 250 creates an image of the frame member 172 that constitutes the interposer member 204 (hereinafter referred to as "frame member image") based on the dimensions of the resin laminate 150 and the input thickness dimension. 262 (see FIG. 12).
  • frame member image a frame member image 262 having a frame shape having an outer edge with the same dimensions as the outer dimensions when viewed from above of the resin laminate 150 and a thickness with the same dimension as the input thickness dimension is created.
  • the frame member image 262 is a frame-shaped image having an outer edge having the same dimensions as the outer dimensions of the resin laminate 150 when viewed from above, and having a thickness equal to the input thickness dimension.
  • the first design program 250 also generates an image of the first cylindrical member 170a constituting the interposer member 204 (hereinafter referred to as "first cylindrical member image") based on the dimensions and arrangement position of the probe pin 190 and the input thickness dimension. ) 264 (see FIG. 12).
  • first cylindrical member image an image of the first cylindrical member 170a constituting the interposer member 204
  • first cylindrical member image an image of the first cylindrical member 170a constituting the interposer member 204 (hereinafter referred to as "first cylindrical member image”) based on the dimensions and arrangement position of the probe pin 190 and the input thickness dimension. ) 264 (see FIG. 12).
  • an annular first cylindrical member image 264 having an inner diameter slightly larger than the outer diameter of the probe pin 190 and a thickness equal to the input thickness dimension is created. be done.
  • the first cylindrical member image 264 is an annular image having an inner diameter that is slightly larger than the outer dimension of the probe pin 190 when viewed from above, and a thickness that is the same
  • the first design program 250 also generates an image of the second cylindrical member 170b that constitutes the interposer member 204 (hereinafter referred to as a "second cylindrical member image") based on the dimensions and arrangement positions of the bolts 230 and the input thickness dimensions. ) 266 (see FIG. 12) is created.
  • a second cylindrical member image having an inner diameter slightly larger than the outer diameter of the shaft portion of the bolt 230 and a thickness equal to the input thickness dimension.
  • the second cylindrical member image 266 is an annular image having an inner diameter slightly larger than the outer diameter of the shaft portion of the bolt 230 and a thickness equal to the input thickness dimension.
  • the first design program 250 also generates an image of the third cylindrical member 170c that constitutes the interposer member 204 (hereinafter referred to as "third cylindrical member image") based on the dimensions and arrangement position of the electronic component 180 and the input thickness dimension. ) 268 (see FIG. 12).
  • third cylindrical member image a frame-shaped third cylindrical member having an inner edge slightly larger than the outer dimension when viewed from above the electronic component 180 and having a thickness equal to the input thickness dimension.
  • Image 268 is created. That is, the third cylindrical member image 268 is a frame-shaped image that has an inner edge that is slightly larger than the outer dimension when viewed from above the electronic component 180, and has a thickness that is the same as the input thickness dimension.
  • the interposer image 260 is formed by forming the frame member image 262, the first cylinder member image 264, the second cylinder member image 266, and the third cylinder member image 268.
  • the interposer image 260 is formed by the first design program 250, and the number of resin layers stacked when forming the interposer member 204 is calculated, thereby designing the interposer member 204. That is, the first design program 250 is based on the dimensions of the resin laminate 150, the arrangement positions and dimensions of the electronic component 180, the probe pin 190, and the bolt 230, the input height dimension, and the input thickness dimension input by the operator. Thus, the interposer member 204 is designed.
  • the controller 130 of the control device 28 stores not only the first design program 250 but also a second design program 252 (see FIG. 2). Then, in the second design program 252, the dimensions of the resin laminate 150 and the positions and dimensions of the electronic components 180, probe pins 190, and bolts 230 are acquired from the 3D image of the base board 202 that constitutes the circuit board 200. Ru. Then, the interposer member 204 is designed based on the obtained dimensions of the resin laminate 150 and the positions and dimensions of the electronic component 180, probe pin 190, and bolt 230.
  • the CAD image is created based on the dimensions of the resin laminate 150 and the placement positions of the electronic component 180, probe pin 190, bolt 230, and the like. Therefore, a 3D image of the circuit board 200 is created based on the CAD image and the dimensions of the electronic component 180, probe pin 190, bolt 230, etc.
  • the created 3D image is then stored in the control device 28. Note that since the method for creating a 3D image is a well-known technique, a description of the method for creating a 3D image will be omitted.
  • the second design program 252 calculates the dimensions of the resin laminate 150 and the placement positions and dimensions of the electronic component 180, probe pin 190, and bolt 230 based on the 3D image stored in the control device 28. Specifically, the second design program 252 specifies an image (hereinafter referred to as "base board image") 280 (see FIG. 13) of the top surface of the base board 202 that constitutes the circuit board 200 based on the 3D image. . In the base board image 280, as shown in FIG. The outer dimensions, the outer diameter of the probe pin 190, and the outer diameter of the shaft portion of the bolt 230 can be recognized.
  • the second design program 252 determines the external dimensions of the resin laminate 150 as viewed from above, the arrangement of the electronic component 180, the probe pin 190, and the bolt 230 based on the 3D image stored in the control device 28. The position, the outer size of the electronic component 180 when viewed from above, the outer diameter of the probe pin 190, and the outer diameter of the bolt 230 are calculated.
  • an input image for inputting the height dimension and thickness dimension of the interposer member 204 is displayed on the display monitor.
  • the operator inputs the height and thickness of the interposer member 204 on the input screen.
  • the second design program 252 calculates the calculated outer dimensions of the resin laminate 150, the arrangement positions of the electronic component 180, the probe pin 190, and the bolt 230, the outer dimension of the electronic component 180, the outer diameter of the probe pin 190, and the location of the bolt 230.
  • An interposer image 260 is created based on the outer diameter and the input thickness dimension.
  • the method for creating the interposer image 260 in the second design program 252 is the same as the method for creating the interposer image 260 in the first design program 250. Also, in the second design program 252, similarly to the first design program 250, the number of laminated resin layers when forming the interposer member 204 is calculated.
  • the interposer image 260 is formed, and the number of resin layers stacked when forming the interposer member 204 is calculated, thereby designing the interposer member 204.
  • An interposer image 260 is formed.
  • the ultraviolet curable resin is ejected by the inkjet head 88 based on the interposer image 260. Then, the discharged ultraviolet curable resin is flattened by a flattening device 90 and irradiated with ultraviolet rays by an irradiation device 92, thereby forming a resin layer having the shape shown in FIG. Then, the interposer member 204 having the shape shown in FIG. 14 is formed by laminating resin layers corresponding to the number of layers calculated at the time of designing the interposer member 204.
  • a conventional interposer member 290 is a plate-shaped member, and a through hole 292 is formed at the position where the electronic component 180, probe pin 190, and bolt 230 are disposed.
  • the interposer member 204 shown in FIG. 14 and the interposer member 290 shown in FIG. It is the shape.
  • the interposer member 204 created by the circuit forming apparatus 10 includes the frame member 172 for supporting the substrate laminated on the interposer member 204, the electronic component 180, the probe pin 190, and the bolt 230. It has a shape composed of a cylindrical member 170.
  • the volume of the interposer member 204 created by the circuit forming apparatus 10 is clearly smaller than the volume of the conventional interposer member 290.
  • the weight of the interposer member 204 produced by the circuit forming apparatus 10 can be made much smaller than the weight of the conventional interposer member 290, and the weight of the board can be reduced.
  • the formation of a resin laminate is eliminated. It is also possible to reduce the time required for the process and the material used for the resin laminate.
  • the interposer member 204 is designed by the first design program 250 or the second design program 252, it is possible to reduce the time required to design the interposer member 204.
  • first cylindrical member 170a is an example of an enclosing member.
  • Frame member 172 is an example of a frame member.
  • Electronic component 180 is an example of an electrical component.
  • Probe pin 190 is an example of a conductive member.
  • Base substrate 202 is an example of a base substrate.
  • Interposer member 204 is an example of an interposer member.
  • the interposer member 204 includes the cylindrical member 170 and the frame member 172, but may include members other than the cylindrical member 170 and the frame member 172.
  • the interposer member 204 may further include a convex member 300, as shown in FIG. In such a case, by inputting the placement position and dimensions of the convex member 300 into the first design program 250 or the second design program 252, an image 302 of the convex member 300 is included as shown in FIG.
  • An interposer image 310 is formed.
  • an interposer member 204 including the cylindrical member 170, the frame member 172, and the convex member 300 is formed.
  • the arrangement position and dimensions of the convex member 300 may be included in the CAD image or 3D image, or may be registered in the control device 28.
  • the interposer member 204 includes the cylindrical member 170 for arranging the electronic component 180, the probe pin 190, and the bolt 230; It may be provided with a cylindrical member for arranging the. Further, as the cylindrical member 170, a first cylindrical member 170a for arranging the probe pin 190, a second cylindrical member 170b for arranging the bolt 230, and a third cylindrical member 170b for arranging the electronic component 180. Although the member 170c is employed, at least the first cylindrical member 170a may be employed.
  • the interposer member 204 includes at least the first cylindrical member 170a and the frame member 172, it also includes at least one of the second cylindrical member 170b, the third cylindrical member 170c, and the convex member 300. You can.
  • the interposer member 204 includes the first cylindrical member 170a, the second cylindrical member 170b, the third cylindrical member 170c, and the frame member 172.
  • a connecting member that connects each of the third cylinder member 170b, the third cylinder member 170c, and the frame member 172 may be provided. Since the interposer member 204 further includes a connecting member, it becomes possible to create an integral interposer member 204, and it becomes possible to distribute the interposer member 204 alone.
  • cylindrical member 170 surrounds the entire circumference of the electronic component 180, the probe pin 190, and the bolt 230, it may partially surround the periphery of the electronic component 180, the probe pin 190, and the bolt 230.
  • the cylindrical member 170 is not limited to a cylindrical shape, and may be a cylindrical member with a part cut off.
  • first cylindrical member 170a, the second cylindrical member 170b, the third cylindrical member 170c, and the frame member 172 have the same height, but the first cylindrical member 170a and the second cylindrical member 170b have the same height.
  • the third cylindrical member 170c and the frame member 172 may have different height dimensions.
  • first design program 250 and the second design program 252 are stored in the control device 28 of the circuit forming device 10
  • first design program 250 and the second design program 252 are stored in a device different from the circuit forming device 10, for example, an information processing device used for designing a circuit board.
  • a first design program 250, and a second design program 252 may be stored.
  • only one of the first design program 250 and the second design program 252 may be stored in the control device 28 of the circuit forming device 10 or in a device different from the circuit forming device 10.
  • an ultraviolet curable resin is used as the curable resin for forming the interposer member 204, but it is possible to use various resins such as a thermosetting resin and a two-component mixed resin. It is.
  • the upper surface of the ultraviolet curing resin discharged by the inkjet head 88 is flattened by the flattening device 90.
  • the ultraviolet curing resin does not need to be flattened after being ejected by the inkjet head 88.
  • the hardening section 86 does not need to be provided with the flattening device 90.
  • 170a First cylinder member (enclosure member) 172: Frame member 180: Electronic component (electrical component) 190: Probe pin (conducting member) 202: Base board 204: Interposer member (interposer member)

Abstract

The present inventio discloses an interposer member that is provided on a base substrate on which electric components are mounted. The interposer member comprises a surrounding member that surrounds the periphery of a conductive member that electrically connects an upper side and a lower side of the interposer member, and a frame member that is erected along outer edges of the base substrate.

Description

インタポーザ部材、回路基板作製方法、および設計方法Interposer member, circuit board manufacturing method, and design method
　本発明は、インタポーザ部材、回路基板作製方法、および設計方法に関する。 The present invention relates to an interposer member, a circuit board manufacturing method, and a designing method.
　下記特許文献には、回路層に搭載されるインタポーザの形成に関する技術が記載されている。 The following patent document describes a technique related to the formation of an interposer mounted on a circuit layer.
国際公開第２０２１／０１９６８４号明細書International Publication No. 2021/019684
　本発明は、インタポーザ部材を適切に作製することを課題とする。 An object of the present invention is to appropriately manufacture an interposer member.
　上記課題を解決するために、本明細書は、電気部品が装着されるベース基板の上に設けられるインタポーザ部材であって、前記インタポーザ部材の上側と下側とを電気的に接続する導通部材の周囲を囲む囲い部材と、前記ベース基板の外縁に沿って立設される枠部材と、を備えるインタポーザ部材を開示する。 In order to solve the above problems, the present specification provides an interposer member that is provided on a base board on which electrical components are mounted, and includes a conductive member that electrically connects the upper and lower sides of the interposer member. An interposer member is disclosed that includes an enclosure member surrounding the periphery and a frame member erected along the outer edge of the base substrate.
　また、上記課題を解決するために、本明細書は、電気部品が装着されるベース基板を硬化性樹脂により形成するベース基板形成工程と、前記ベース基板形成工程において形成されたベース基板の上にインタポーザ部材を硬化性樹脂により形成するインタポーザ部材形成工程と、を含み、前記インタポーザ部材形成工程は、前記インタポーザ部材の上側と下側とを電気的に接続する導通部材の周囲を囲む囲い部材と、前記ベース基板の外縁に沿って立設される枠部材とを前記ベース基板の上に硬化性樹脂により形成する回路基板作製方法を開示する。 Further, in order to solve the above problems, the present specification provides a base substrate forming step in which a base substrate on which electrical components are mounted is formed of a curable resin, and a base substrate formed in the base substrate forming step. an interposer member forming step of forming the interposer member from a curable resin; A method for manufacturing a circuit board is disclosed, in which a frame member that is erected along the outer edge of the base substrate is formed on the base substrate using a curable resin.
　また、上記課題を解決するために、本明細書は、電気部品が装着されるベース基板の上に設けられるインタポーザ部材の設計方法であって、前記インタポーザ部材の上側と下側とを電気的に接続する導通部材の寸法及び配設位置に基づいて、前記導通部材の周囲を囲む囲い部材の画像データを生成し、前記ベース基板の寸法に基づいて、前記ベース基板の外縁に沿って立設される枠部材の画像データを作成することで前記インタポーザ部材を設計する設計方法を開示する。 Furthermore, in order to solve the above problems, the present specification provides a method for designing an interposer member provided on a base board on which electrical components are mounted, the upper and lower sides of the interposer member being electrically connected. Based on the dimensions and arrangement position of the conductive member to be connected, image data of an enclosing member surrounding the conductive member is generated, and based on the dimensions of the base substrate, the enclosing member is installed upright along the outer edge of the base substrate. A design method for designing the interposer member by creating image data of the frame member is disclosed.
　本開示では、インタポーザ部材が、上側と下側とを電気的に接続する導通部材の周囲を囲む囲い部材と、ベース基板の外縁に沿って立設される枠部材とを備える。これにより、インタポーザ部材を適切に作製することが可能となる。 In the present disclosure, the interposer member includes an enclosure member that surrounds a conductive member that electrically connects the upper side and the lower side, and a frame member that stands up along the outer edge of the base substrate. This makes it possible to appropriately manufacture the interposer member.
回路形成装置を示す図である。It is a figure showing a circuit formation device. 制御装置を示すブロック図である。FIG. 2 is a block diagram showing a control device. 樹脂積層体が形成された状態の回路を示す断面図である。FIG. 3 is a cross-sectional view showing a circuit with a resin laminate formed thereon. 樹脂積層体のホール内にパッドが形成された状態の回路を示す断面図である。FIG. 2 is a cross-sectional view showing a circuit in which pads are formed in holes in a resin laminate. 樹脂積層体の上に配線が形成された状態の回路を示す断面図である。FIG. 2 is a cross-sectional view showing a circuit in which wiring is formed on a resin laminate. 配線の上に導電性樹脂ペーストが吐出された状態の回路を示す断面図である。FIG. 3 is a cross-sectional view showing a circuit with conductive resin paste discharged onto wiring. 樹脂積層体の上にインタポーザ部材が形成された状態の回路を示す斜視図である。FIG. 2 is a perspective view showing a circuit in which an interposer member is formed on a resin laminate. 樹脂積層体の上にインタポーザ部材が形成された状態の回路を示す断面図である。FIG. 2 is a cross-sectional view showing a circuit in which an interposer member is formed on a resin laminate. 電子部品及びプローブピンが配設された状態の回路を示す断面図である。FIG. 2 is a cross-sectional view showing a circuit in which electronic components and probe pins are arranged. カバー基板を示す断面図である。FIG. 3 is a cross-sectional view showing the cover substrate. 積層基板を示す断面図である。FIG. 3 is a cross-sectional view showing a laminated substrate. インタポーザ画像を示す図である。FIG. 3 is a diagram showing an interposer image. ３Ｄ画像を示す図である。It is a figure showing a 3D image. 実施例のインタポーザ部材を示す図である。It is a figure which shows the interposer member of an Example. 従来のインタポーザ部材を示す図である。It is a figure showing a conventional interposer member. 変形例のインタポーザ部材を示す図である。It is a figure which shows the interposer member of a modification. 変形例のインタポーザ画像を示す図である。It is a figure which shows the interposer image of a modification.
　図１に回路形成装置１０の一例を示す。回路形成装置１０は、搬送装置２０と、第１造形ユニット２２と、第２造形ユニット２４と、第３造形ユニット２５と、装着ユニット２７と、制御装置（図２参照）２８とを備える。それら搬送装置２０と第１造形ユニット２２と第２造形ユニット２４と第３造形ユニット２５と装着ユニット２７とは、回路形成装置１０のベース２９の上に配置されている。ベース２９は、概して長方形状をなしており、以下の説明では、ベース２９の長手方向をＸ軸方向、ベース２９の短手方向をＹ軸方向、Ｘ軸方向及びＹ軸方向の両方に直交する方向をＺ軸方向と称して説明する。 FIG. 1 shows an example of a circuit forming apparatus 10. The circuit forming apparatus 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, a third modeling unit 25, a mounting unit 27, and a control device (see FIG. 2) 28. The transport device 20 , the first modeling unit 22 , the second modeling unit 24 , the third modeling unit 25 , and the mounting unit 27 are arranged on the base 29 of the circuit forming apparatus 10 . The base 29 has a generally rectangular shape, and in the following description, the longitudinal direction of the base 29 is the X-axis direction, the short direction of the base 29 is the Y-axis direction, and it is perpendicular to both the X-axis direction and the Y-axis direction. The direction will be described as the Z-axis direction.
　搬送装置２０は、Ｘ軸スライド機構３０と、Ｙ軸スライド機構３２とを備えている。そのＸ軸スライド機構３０は、Ｘ軸スライドレール３４とＸ軸スライダ３６とを有している。Ｘ軸スライドレール３４は、Ｘ軸方向に延びるように、ベース２９の上に配設されている。Ｘ軸スライダ３６は、Ｘ軸スライドレール３４によって、Ｘ軸方向にスライド可能に保持されている。さらに、Ｘ軸スライド機構３０は、電磁モータ（図２参照）３８を有しており、電磁モータ３８の駆動により、Ｘ軸スライダ３６がＸ軸方向の任意の位置に移動する。また、Ｙ軸スライド機構３２は、Ｙ軸スライドレール５０とステージ５２とを有している。Ｙ軸スライドレール５０は、Ｙ軸方向に延びるように、ベース２９の上に配設されており、Ｘ軸方向に移動可能とされている。そして、Ｙ軸スライドレール５０の一端部が、Ｘ軸スライダ３６に連結されている。そのＹ軸スライドレール５０には、ステージ５２が、Ｙ軸方向にスライド可能に保持されている。さらに、Ｙ軸スライド機構３２は、電磁モータ（図２参照）５６を有しており、電磁モータ５６の駆動により、ステージ５２がＹ軸方向の任意の位置に移動する。これにより、ステージ５２は、Ｘ軸スライド機構３０及びＹ軸スライド機構３２の駆動により、ベース２９上の任意の位置に移動する。 The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is arranged on the base 29 so as to extend in the X-axis direction. The X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction. Further, the X-axis slide mechanism 30 includes an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 is moved to any position in the X-axis direction by driving the electromagnetic motor 38. Further, the Y-axis slide mechanism 32 includes a Y-axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is disposed on the base 29 so as to extend in the Y-axis direction, and is movable in the X-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36. A stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction. Further, the Y-axis slide mechanism 32 includes an electromagnetic motor (see FIG. 2) 56, and the stage 52 is moved to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56. Thereby, the stage 52 is moved to an arbitrary position on the base 29 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.
　ステージ５２は、基台６０と、保持装置６２と、昇降装置６４とを有している。基台６０は、平板状に形成され、上面に基板が載置される。保持装置６２は、基台６０のＸ軸方向の両側部に設けられている。そして、基台６０に載置された基板のＸ軸方向の両縁部が、保持装置６２によって挟まれることで、基板が固定的に保持される。また、昇降装置６４は、基台６０の下方に配設されており、基台６０を昇降させる。 The stage 52 has a base 60, a holding device 62, and a lifting device 64. The base 60 is formed into a flat plate shape, and a substrate is placed on the top surface. The holding device 62 is provided on both sides of the base 60 in the X-axis direction. Then, both edges of the substrate placed on the base 60 in the X-axis direction are held between the holding devices 62, so that the substrate is fixedly held. Further, the lifting device 64 is disposed below the base 60 and raises and lowers the base 60.
　第１造形ユニット２２は、ステージ５２の基台６０に載置された基板の上に配線を造形するユニットであり、第１印刷部７２と、焼成部７４とを有している。第１印刷部７２は、インクジェットヘッド（図２参照）７６を有しており、インクジェットヘッド７６が金属インクを線状に吐出する。金属インクは、ナノメートルサイズの金属、例えば銀の微粒子が溶剤中に分散されたものである。なお、金属微粒子の表面は分散剤によりコーティングされており、溶剤中での凝集が防止されている。また、インクジェットヘッド７６は、例えば、圧電素子を用いたピエゾ方式によって複数のノズルから金属インクを吐出する。 The first modeling unit 22 is a unit that models wiring on a substrate placed on the base 60 of the stage 52, and includes a first printing section 72 and a firing section 74. The first printing section 72 has an inkjet head (see FIG. 2) 76, and the inkjet head 76 discharges metal ink in a linear manner. Metal ink is made by dispersing nanometer-sized metal particles, such as silver, in a solvent. Note that the surface of the metal fine particles is coated with a dispersant to prevent agglomeration in the solvent. Further, the inkjet head 76 ejects metal ink from a plurality of nozzles using a piezo system using piezoelectric elements, for example.
　焼成部７４は、赤外線照射装置（図２参照）７８を有している。赤外線照射装置７８は、吐出された金属インクに赤外線を照射する装置である。赤外線が照射された金属インクは焼成し、配線が形成される。なお、金属インクの焼成とは、エネルギーを付与することによって、溶媒の気化や金属微粒子の保護膜、つまり、分散剤の分解等が行われ、金属微粒子が接触または融着をすることで、導電率が高くなる現象である。そして、金属インクが焼成することで、金属製の配線が形成される。 The baking section 74 has an infrared irradiation device (see FIG. 2) 78. The infrared irradiation device 78 is a device that irradiates the ejected metal ink with infrared rays. The metal ink irradiated with infrared rays is fired and wiring is formed. Incidentally, firing metal ink means that energy is applied to vaporize the solvent and decompose the protective film of the metal particles, that is, the dispersant, etc., and the metal particles contact or fuse to form a conductive layer. This is a phenomenon where the rate increases. Then, metal wiring is formed by firing the metal ink.
　また、第２造形ユニット２４は、ステージ５２の基台６０に載置された基板の上に樹脂層を造形するユニットであり、第２印刷部８４と、硬化部８６とを有している。第２印刷部８４は、インクジェットヘッド（図２参照）８８を有しており、インクジェットヘッド８８は紫外線硬化樹脂を吐出する。紫外線硬化樹脂は、紫外線の照射により硬化する樹脂である。なお、インクジェットヘッド８８は、例えば、圧電素子を用いたピエゾ方式でもよく、樹脂を加熱して気泡を発生させ複数のノズルから吐出するサーマル方式でもよい。 Further, the second modeling unit 24 is a unit that models a resin layer on the substrate placed on the base 60 of the stage 52, and includes a second printing section 84 and a curing section 86. The second printing section 84 has an inkjet head (see FIG. 2) 88, and the inkjet head 88 discharges ultraviolet curing resin. Ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays. Note that the inkjet head 88 may be of a piezo type using a piezoelectric element, for example, or may be a thermal type of heating resin to generate bubbles and ejecting the bubbles from a plurality of nozzles.
　硬化部８６は、平坦化装置（図２参照）９０と照射装置（図２参照）９２とを有している。平坦化装置９０は、インクジェットヘッド８８によって吐出された紫外線硬化樹脂の上面を平坦化するものであり、例えば、紫外線硬化樹脂の表面を均しながら余剰分の樹脂を、ローラもしくはブレードによって掻き取ることで、紫外線硬化樹脂の厚みを均一させる。また、照射装置９２は、光源として水銀ランプもしくはＬＥＤを備えており、吐出された紫外線硬化樹脂に紫外線を照射する。これにより、吐出された紫外線硬化樹脂が硬化し、樹脂層が形成される。 The curing section 86 includes a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92. The flattening device 90 flattens the upper surface of the ultraviolet curable resin discharged by the inkjet head 88, and for example, scrapes off excess resin with a roller or blade while leveling the surface of the ultraviolet curable resin. to make the thickness of the ultraviolet curing resin uniform. Further, the irradiation device 92 includes a mercury lamp or an LED as a light source, and irradiates the discharged ultraviolet curing resin with ultraviolet rays. As a result, the discharged ultraviolet curing resin is cured and a resin layer is formed.
　第３造形ユニット２５は、ステージ５２の基台６０に載置された基板の上に電子部品の電極と配線との接続部を造形するユニットであり、第３印刷部１００と、第１加熱部１０２とを有している。第３印刷部１００は、ディスペンサ（図２参照）１０６を有しており、ディスペンサ１０６は導電性樹脂ペーストを吐出する。導電性樹脂ペーストは、比較的低温の加熱により硬化する樹脂に、マイクロメートルサイズの金属粒子が分散されたものである。ちなみに、金属粒子は、フレーク状とされており、導電性樹脂ペーストの粘度は、金属インクと比較して比較的高い。 The third molding unit 25 is a unit that molds connection parts between electrodes and wiring of electronic components on a substrate placed on a base 60 of the stage 52, and includes a third printing part 100 and a first heating part. 102. The third printing unit 100 has a dispenser (see FIG. 2) 106, and the dispenser 106 discharges conductive resin paste. The conductive resin paste is made by dispersing micrometer-sized metal particles in a resin that hardens by heating at a relatively low temperature. Incidentally, the metal particles are in the form of flakes, and the viscosity of the conductive resin paste is relatively high compared to the metal ink.
　第１加熱部１０２は、ヒータ（図２参照）１０８を有している。ヒータ１０８は、ディスペンサ１０６により塗布された導電性樹脂ペーストを加熱する装置である。加熱された導電性樹脂ペーストでは、樹脂が硬化する。この際、導電性樹脂ペーストでは、樹脂が硬化して収縮し、その樹脂に分散されたフレーク状の金属粒子が接触する。これにより、導電性樹脂ペーストが導電性を発揮する。また、導電性樹脂ペーストの樹脂は、例えば、有機系の接着剤であり、加熱により硬化することで接着力を発揮する。 The first heating section 102 has a heater (see FIG. 2) 108. The heater 108 is a device that heats the conductive resin paste applied by the dispenser 106. In the heated conductive resin paste, the resin hardens. At this time, in the conductive resin paste, the resin hardens and contracts, and the flaky metal particles dispersed in the resin come into contact with each other. Thereby, the conductive resin paste exhibits conductivity. Further, the resin of the conductive resin paste is, for example, an organic adhesive, and exhibits adhesive strength by being cured by heating.
　また、装着ユニット２７は、回路基板に部品を装着するユニットであり、供給部１２０と、装着部１２２とを有している。供給部１２０は、テーピング化された部品を１つずつ送り出すテープフィーダ（図２参照）１２４を複数有しており、供給位置において、部品を供給する。なお、供給部１２０の複数のテープフィーダ１２４では、電子部品やプローブピン等の部品を供給する。また、供給部１２０は、テープフィーダ１２４に限らず、トレイから電子部品をピックアップして供給するトレイ型の供給装置でもよい。また、供給部１２０は、テープ型とトレイ型との両方、あるいはそれ以外の供給装置を備えた構成でもよい。 Furthermore, the mounting unit 27 is a unit for mounting components on a circuit board, and includes a supply section 120 and a mounting section 122. The supply unit 120 has a plurality of tape feeders (see FIG. 2) 124 that feed out taped components one by one, and supplies the components at a supply position. Note that the plurality of tape feeders 124 of the supply unit 120 supply components such as electronic components and probe pins. Further, the supply unit 120 is not limited to the tape feeder 124, and may be a tray-type supply device that picks up and supplies electronic components from a tray. Further, the supply unit 120 may be configured to include both a tape type and a tray type, or other supply devices.
　装着部１２２は、装着ヘッド（図２参照）１２６と、移動装置（図２参照）１２８とを有している。装着ヘッド１２６は、部品を吸着保持するための吸着ノズル（図示省略）を有する。吸着ノズルは、正負圧供給装置（図示省略）から負圧が供給されることで、エアの吸引により部品を吸着保持する。そして、正負圧供給装置から僅かな正圧が供給されることで、部品を離脱する。また、移動装置１２８は、テープフィーダ１２４による部品の供給位置と、基台６０に載置された基板との間で、装着ヘッド１２６を移動させる。これにより、装着部１２２では、テープフィーダ１２４から供給された部品が、吸着ノズルにより保持され、その吸着ノズルによって保持された部品が、基板に装着される。 The mounting section 122 includes a mounting head (see FIG. 2) 126 and a moving device (see FIG. 2) 128. The mounting head 126 has a suction nozzle (not shown) for suctioning and holding components. The suction nozzle is supplied with negative pressure from a positive and negative pressure supply device (not shown), and suctions and holds the component by suctioning air. Then, by supplying a slight positive pressure from the positive and negative pressure supply device, the parts are separated. Furthermore, the moving device 128 moves the mounting head 126 between the component supply position by the tape feeder 124 and the substrate placed on the base 60. As a result, in the mounting section 122, the component supplied from the tape feeder 124 is held by the suction nozzle, and the component held by the suction nozzle is mounted on the board.
　また、制御装置２８は、図２に示すように、コントローラ１３０と、複数の駆動回路１３２とを備えている。複数の駆動回路１３２は、上記電磁モータ３８，５６、保持装置６２、昇降装置６４、インクジェットヘッド７６、赤外線照射装置７８、インクジェットヘッド８８、平坦化装置９０、照射装置９２、ディスペンサ１０６、ヒータ１０８、テープフィーダ１２４、装着ヘッド１２６、移動装置１２８に接続されている。コントローラ１３０は、ＣＰＵ，ＲＯＭ，ＲＡＭ等を備え、コンピュータを主体とするものであり、複数の駆動回路１３２に接続されている。これにより、搬送装置２０、第１造形ユニット２２、第２造形ユニット２４、第３造形ユニット２５、装着ユニット２７の作動が、コントローラ１３０によって制御される。 Further, the control device 28 includes a controller 130 and a plurality of drive circuits 132, as shown in FIG. The plurality of drive circuits 132 include the electromagnetic motors 38 and 56, a holding device 62, a lifting device 64, an inkjet head 76, an infrared irradiation device 78, an inkjet head 88, a flattening device 90, an irradiation device 92, a dispenser 106, a heater 108, It is connected to a tape feeder 124, a mounting head 126, and a moving device 128. The controller 130 is mainly a computer, including a CPU, ROM, RAM, etc., and is connected to a plurality of drive circuits 132. As a result, the operations of the transport device 20 , the first modeling unit 22 , the second modeling unit 24 , the third modeling unit 25 , and the mounting unit 27 are controlled by the controller 130 .
　回路形成装置１０では、上述した構成によって、基台６０の上にベース基板が形成され、そのベース基板の上にインタポーザ部材が形成されることで、回路基板が形成される。 In the circuit forming apparatus 10, with the above-described configuration, a base substrate is formed on the base 60, and an interposer member is formed on the base substrate, thereby forming a circuit board.
　具体的には、ステージ５２が、第２造形ユニット２４の下方に移動される。そして、第２造形ユニット２４において、図３に示すように、ステージ５２の基台６０の上に樹脂積層体１５０が形成される。樹脂積層体１５０は、複数のホール１５２及び挿通穴１５４を有しており、インクジェットヘッド８８からの紫外線硬化樹脂の吐出と、吐出された紫外線硬化樹脂への照射装置９２による紫外線の照射とが繰り返されることにより形成される。 Specifically, the stage 52 is moved below the second modeling unit 24. Then, in the second modeling unit 24, as shown in FIG. 3, a resin laminate 150 is formed on the base 60 of the stage 52. The resin laminate 150 has a plurality of holes 152 and insertion holes 154, and the ejection of the ultraviolet curable resin from the inkjet head 88 and the irradiation of the ejected ultraviolet curable resin with ultraviolet rays by the irradiation device 92 are repeated. It is formed by
　詳しくは、第２造形ユニット２４の第２印刷部８４において、インクジェットヘッド８８が、基台６０の上面に紫外線硬化樹脂を薄膜状に吐出する。この際、インクジェットヘッド８８は、基台６０の上面の所定の位置が露出するように、紫外線硬化樹脂を吐出する。続いて、紫外線硬化樹脂が薄膜状に吐出されると、硬化部８６において、紫外線硬化樹脂の膜厚が均一となるように、紫外線硬化樹脂が平坦化装置９０によって平坦化される。そして、照射装置９２が、その薄膜状の紫外線硬化樹脂に紫外線を照射する。これにより、基台６０の上に薄膜状の樹脂層１５６が形成される。 Specifically, in the second printing section 84 of the second modeling unit 24, the inkjet head 88 discharges ultraviolet curing resin in a thin film onto the upper surface of the base 60. At this time, the inkjet head 88 discharges the ultraviolet curing resin so that a predetermined position on the upper surface of the base 60 is exposed. Subsequently, when the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened by a flattening device 90 in the curing section 86 so that the thickness of the ultraviolet curable resin becomes uniform. Then, the irradiation device 92 irradiates the thin film of ultraviolet curing resin with ultraviolet rays. As a result, a thin film-like resin layer 156 is formed on the base 60.
　続いて、インクジェットヘッド８８が、その薄膜状の樹脂層１５６の上に紫外線硬化樹脂を薄膜状に吐出する。つまり、インクジェットヘッド８８は、基台６０の上面の所定の位置が露出するように、樹脂層１５６の上に紫外線硬化樹脂を薄膜状に吐出する。そして、平坦化装置９０によって薄膜状の紫外線硬化樹脂が平坦化され、照射装置９２が、その薄膜状に吐出された紫外線硬化樹脂に紫外線を照射することで、薄膜状の樹脂層１５６の上に薄膜状の樹脂層１５６が積層される。このように、薄膜状の樹脂層１５６の上への紫外線硬化樹脂の吐出と、紫外線の照射とが繰り返され、複数の樹脂層１５６が積層されることで、複数のホール１５２及び挿通穴１５４を有する樹脂積層体１５０が形成される。また、樹脂積層体１５０は概して矩形の板状をなし、樹脂積層体１５０の４隅に４個の挿通穴１５４が形成されている。また、複数のホール１５２は、後に説明するプローブピンの配設箇所に応じた位置に、プローブピンの配設個数に応じた個数、形成されている。なお、樹脂積層体１５０では、２個のホール１５２が形成されている。 Subsequently, the inkjet head 88 discharges a thin film of ultraviolet curing resin onto the thin film resin layer 156. That is, the inkjet head 88 discharges the ultraviolet curing resin in a thin film onto the resin layer 156 so that a predetermined position on the upper surface of the base 60 is exposed. Then, the thin film-shaped ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet ray curable resin discharged in the thin film shape with ultraviolet rays, thereby forming a layer on the thin film-shaped resin layer 156. A thin film-like resin layer 156 is laminated. In this way, the discharge of the ultraviolet curable resin onto the thin film-like resin layer 156 and the irradiation of ultraviolet rays are repeated, and a plurality of resin layers 156 are stacked, thereby forming a plurality of holes 152 and insertion holes 154. A resin laminate 150 having the following properties is formed. Further, the resin laminate 150 has a generally rectangular plate shape, and four insertion holes 154 are formed at the four corners of the resin laminate 150. Further, the plurality of holes 152 are formed in a number corresponding to the number of probe pins arranged at positions corresponding to the arrangement locations of probe pins, which will be described later. Note that two holes 152 are formed in the resin laminate 150.
　上述した手順により樹脂積層体１５０が形成されると、ステージ５２が第３造形ユニット２５の下方に移動される。そして、第３造形ユニット２５の第３印刷部１００において、ディスペンサ１０６が、図４に示すように、複数のホール１５２の各々の内部に導電性樹脂ペースト１５８を吐出する。この際、ディスペンサ１０６は、ホール１５２の内部を満たすように、導電性樹脂ペースト１５８を吐出する。このように、導電性樹脂ペースト１５８がホール１５２の内部に吐出されると、第１加熱部１０２においてヒータ１０８により樹脂積層体１５０が加熱される。これにより、ホール１５２の内部において導電性樹脂ペースト１５８が硬化し、樹脂積層体１５０の下面及び上面に露出するパッド１６０が形成される。 After the resin laminate 150 is formed by the above-described procedure, the stage 52 is moved below the third modeling unit 25. Then, in the third printing section 100 of the third modeling unit 25, the dispenser 106 discharges the conductive resin paste 158 into each of the plurality of holes 152, as shown in FIG. At this time, the dispenser 106 discharges the conductive resin paste 158 so as to fill the inside of the hole 152. In this manner, when the conductive resin paste 158 is discharged into the hole 152, the resin laminate 150 is heated by the heater 108 in the first heating section 102. As a result, the conductive resin paste 158 hardens inside the hole 152, and pads 160 exposed on the lower and upper surfaces of the resin laminate 150 are formed.
　続いて、ステージ５２が第１造形ユニット２２の下方に移動される。そして、第１造形ユニット２２の第１印刷部７２において、インクジェットヘッド７６が、図５に示すように、樹脂積層体１５０の上面に金属インク１６２を、回路パターンに応じて線状に吐出する。そして、金属インク１６２に、第１造形ユニット２２の焼成部７４において、赤外線照射装置７８が赤外線を照射する。これにより、金属インク１６２が焼成し、樹脂積層体１５０の上に配線１６４が形成される。なお、樹脂積層体１５０の上面には、２本の配線１６４が形成されており、２本の配線１６４の各々の一端部はパッド１６０に接続されており、２本の配線１６４の他端部は対向している。 Subsequently, the stage 52 is moved below the first modeling unit 22. Then, in the first printing section 72 of the first modeling unit 22, the inkjet head 76 discharges the metal ink 162 linearly onto the upper surface of the resin laminate 150 according to the circuit pattern, as shown in FIG. Then, the infrared irradiation device 78 irradiates the metal ink 162 with infrared rays in the firing section 74 of the first modeling unit 22 . As a result, the metal ink 162 is fired, and the wiring 164 is formed on the resin laminate 150. Note that two wires 164 are formed on the upper surface of the resin laminate 150, one end of each of the two wires 164 is connected to the pad 160, and the other end of the two wires 164 is connected to the pad 160. are facing each other.
　次に、ステージ５２が第３造形ユニット２５の下方に移動される。そして、第３造形ユニット２５の第３印刷部１００において、ディスペンサ１０６が、図６に示すように、２本の配線１６４の各々のパッド１６０に連結されている一端部の上に導電性樹脂ペースト１６６を吐出し、２本の配線１６４の互いに対向する他端部の上に導電性樹脂ペースト１６８を吐出する。そして、第３造形ユニット２５の第１加熱部１０２において、導電性樹脂ペースト１６６，１６８が、ヒータ１０８により加熱されることで、導電性樹脂ペースト１６６，１６８が導電性を発揮する。 Next, the stage 52 is moved below the third modeling unit 25. Then, in the third printing section 100 of the third modeling unit 25, the dispenser 106 pastes a conductive resin paste onto one end of each of the two wirings 164 connected to the pad 160, as shown in FIG. 166 is discharged, and a conductive resin paste 168 is discharged onto the opposite ends of the two wirings 164. Then, in the first heating section 102 of the third modeling unit 25, the conductive resin pastes 166, 168 are heated by the heater 108, so that the conductive resin pastes 166, 168 exhibit conductivity.
　続いて、ステージ５２が第２造形ユニット２４の下方に移動される。そして、第２造形ユニット２４において、インクジェットヘッド８８からの紫外線硬化樹脂の吐出と、吐出された紫外線硬化樹脂への照射装置９２による紫外線の照射とが繰り返されることにより、図７及び図８に示すように、樹脂積層体１５０の上に複数の筒部材１７０及び枠部材１７２が形成される。なお、筒部材１７０及び枠部材１７２は、基本的に樹脂積層体１５０と同様の手法により形成される。 Subsequently, the stage 52 is moved below the second modeling unit 24. Then, in the second modeling unit 24, the discharge of the ultraviolet curing resin from the inkjet head 88 and the irradiation of the ejected ultraviolet curing resin with ultraviolet light by the irradiation device 92 are repeated, as shown in FIGS. 7 and 8. As such, a plurality of cylindrical members 170 and frame members 172 are formed on the resin laminate 150. Note that the cylindrical member 170 and the frame member 172 are basically formed by the same method as the resin laminate 150.
　詳しくは、インクジェットヘッド８８が、樹脂積層体１５０の上面に導電性樹脂ペースト１６６を囲うように紫外線硬化樹脂を円環形状に吐出する。そして、紫外線硬化樹脂が平坦化装置９０によって平坦化され、照射装置９２が紫外線硬化樹脂に紫外線を照射することで、円環形状の樹脂層が形成される。そして、その円環形状の樹脂層が積層されることで、樹脂積層体１５０の上面に導電性樹脂ペースト１６６を囲う円筒形状の第１筒部材１７０ａが形成される。 Specifically, the inkjet head 88 discharges the ultraviolet curable resin in an annular shape onto the upper surface of the resin laminate 150 so as to surround the conductive resin paste 166. Then, the ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curable resin with ultraviolet rays, thereby forming a ring-shaped resin layer. Then, by stacking the annular resin layers, a cylindrical first cylindrical member 170a surrounding the conductive resin paste 166 is formed on the upper surface of the resin laminate 150.
　また、インクジェットヘッド８８は、樹脂積層体１５０の上面に挿通穴１５４の開口を囲うように紫外線硬化樹脂を円環形状に吐出する。そして、紫外線硬化樹脂が平坦化装置９０によって平坦化され、照射装置９２が紫外線硬化樹脂に紫外線を照射することで、円環形状の樹脂層が形成される。そして、その円環形状の樹脂層が積層されることで、樹脂積層体１５０の上面に挿通穴１５４の開口を囲う円筒形状の第２筒部材１７０ｂが形成される。 Further, the inkjet head 88 discharges the ultraviolet curing resin in an annular shape onto the upper surface of the resin laminate 150 so as to surround the opening of the insertion hole 154. Then, the ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curable resin with ultraviolet rays, thereby forming a ring-shaped resin layer. Then, by stacking the annular resin layers, a cylindrical second cylindrical member 170b surrounding the opening of the insertion hole 154 is formed on the upper surface of the resin laminate 150.
　また、インクジェットヘッド８８は、樹脂積層体１５０の上面に導電性樹脂ペースト１６８を囲うように紫外線硬化樹脂を矩形状に吐出する。そして、紫外線硬化樹脂が平坦化装置９０によって平坦化され、照射装置９２が紫外線硬化樹脂に紫外線を照射することで、矩形状の樹脂層が形成される。そして、その矩形の枠形状の樹脂層が積層されることで、樹脂積層体１５０の上面に導電性樹脂ペースト１６８を囲う角筒形状の第３筒部材１７０ｃが形成される。なお、第３筒部材１７０ｃは、互いに対向する２本の配線１６４の端部の上に吐出された導電性樹脂ペースト１６８を囲っている。 Further, the inkjet head 88 discharges the ultraviolet curing resin in a rectangular shape onto the upper surface of the resin laminate 150 so as to surround the conductive resin paste 168. Then, the ultraviolet curing resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curing resin with ultraviolet rays, thereby forming a rectangular resin layer. Then, by stacking the rectangular frame-shaped resin layers, a rectangular third cylinder member 170c that surrounds the conductive resin paste 168 is formed on the upper surface of the resin laminate 150. Note that the third cylindrical member 170c surrounds the conductive resin paste 168 discharged onto the ends of the two wires 164 facing each other.
　また、インクジェットヘッド８８は、樹脂積層体１５０の上面に樹脂積層体１５０の外縁に沿うように紫外線硬化樹脂を枠形状に吐出する。そして、紫外線硬化樹脂が平坦化装置９０によって平坦化され、照射装置９２が紫外線硬化樹脂に紫外線を照射することで、枠形状の樹脂層が形成される。そして、その枠形状の樹脂層が積層されることで、樹脂積層体１５０の上面に樹脂積層体１５０の外縁に沿う枠形状の枠部材１７２が形成される。なお、枠部材１７２は樹脂積層体１５０の外縁上に形成されているが、樹脂積層体１５０の外縁から所定距離、内側に位置する箇所に樹脂積層体１５０の外縁に沿うように形成されてもよい。また、枠部材１７２は樹脂積層体１５０の外縁に直線的に沿うように形成されているが、樹脂積層体１５０の外縁に曲線的に沿うように形成されてもよい。なお、筒部材１７０の高さ寸法と枠部材１７２の高さ寸法とは同じである。また、筒部材１７０の厚さ寸法と枠部材１７２の厚さ寸法とは同じである。 Further, the inkjet head 88 discharges the ultraviolet curable resin in a frame shape onto the upper surface of the resin laminate 150 along the outer edge of the resin laminate 150. Then, the ultraviolet curing resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curing resin with ultraviolet rays, thereby forming a frame-shaped resin layer. Then, by stacking the frame-shaped resin layers, a frame-shaped frame member 172 along the outer edge of the resin laminate 150 is formed on the upper surface of the resin laminate 150. Although the frame member 172 is formed on the outer edge of the resin laminate 150, it may also be formed along the outer edge of the resin laminate 150 at a predetermined distance inside from the outer edge of the resin laminate 150. good. Further, although the frame member 172 is formed linearly along the outer edge of the resin laminate 150, it may be formed so as to curve along the outer edge of the resin laminate 150. Note that the height dimension of the cylindrical member 170 and the height dimension of the frame member 172 are the same. Moreover, the thickness dimension of the cylinder member 170 and the thickness dimension of the frame member 172 are the same.
　このように、樹脂積層体１５０の上面に筒部材１７０及び枠部材１７２が形成されると、ステージ５２が装着ユニット２７の下方に移動される。装着ユニット２７では、複数のテープフィーダ１２４のうちの１のテープフィーダにより電子部品（図９参照）１８０が供給され、その電子部品１８０が装着ヘッド１２６の吸着ノズルによって、保持される。なお、電子部品１８０は、図９に示すように、部品本体１８２と、部品本体１８２の下面に配設された２個の電極１８４とにより構成されている。そして、装着ヘッド１２６が、移動装置１２８によって移動され、吸着ノズルにより保持された電子部品１８０が、第３筒部材１７０ｃの内部において樹脂積層体１５０の上面に装着される。この際、電子部品１８０の電極１８４が、配線１６４の端部に吐出された導電性樹脂ペースト１６８に接触するように、電子部品１８０は装着される。 After the cylindrical member 170 and the frame member 172 are formed on the upper surface of the resin laminate 150 in this manner, the stage 52 is moved below the mounting unit 27. In the mounting unit 27, an electronic component (see FIG. 9) 180 is supplied by one of the plurality of tape feeders 124, and the electronic component 180 is held by a suction nozzle of the mounting head 126. Note that, as shown in FIG. 9, the electronic component 180 includes a component body 182 and two electrodes 184 disposed on the lower surface of the component body 182. Then, the mounting head 126 is moved by the moving device 128, and the electronic component 180 held by the suction nozzle is mounted on the upper surface of the resin laminate 150 inside the third cylindrical member 170c. At this time, the electronic component 180 is mounted so that the electrode 184 of the electronic component 180 comes into contact with the conductive resin paste 168 discharged onto the end of the wiring 164.
　また、装着ユニット２７では、複数のテープフィーダ１２４のうちの他のテープフィーダによりプローブピン１９０が供給され、そのプローブピン１９０が装着ヘッド１２６の吸着ノズルによって、保持される。なお、プローブピン１９０は概して円筒形状をなしており、長さ方向において伸縮可能とされている。そして、装着ヘッド１２６が、移動装置１２８によって移動され、吸着ノズルにより保持されたプローブピン１９０が、第１筒部材１７０ａの内部において樹脂積層体１５０の上面に装着される。この際、プローブピン１９０の下端面が、配線１６４の端部に吐出された導電性樹脂ペースト１６６と接触する。 Further, in the mounting unit 27, a probe pin 190 is supplied by another tape feeder among the plurality of tape feeders 124, and the probe pin 190 is held by a suction nozzle of the mounting head 126. Note that the probe pin 190 has a generally cylindrical shape and is expandable and contractible in the length direction. Then, the mounting head 126 is moved by the moving device 128, and the probe pin 190 held by the suction nozzle is mounted on the upper surface of the resin laminate 150 inside the first cylindrical member 170a. At this time, the lower end surface of the probe pin 190 comes into contact with the conductive resin paste 166 discharged onto the end of the wiring 164.
　このように、樹脂積層体１５０の上に配線１６４が形成され、電子部品１８０等が装着されるとともに、電子部品１８０等を囲う筒部材１７０と枠部材１７２とが樹脂積層体１５０の上に形成されることで、回路基板２００が形成される。つまり、樹脂積層体１５０が回路基板２００のベースとなり、樹脂積層体１５０，配線１６４等により構成されるベース基板２０２の上に、筒部材１７０，枠部材１７２により構成されるインタポーザ部材２０４が形成されることで、回路基板２００が形成される。 In this way, the wiring 164 is formed on the resin laminate 150 and the electronic component 180 etc. are mounted, and the cylindrical member 170 and the frame member 172 surrounding the electronic component 180 etc. are formed on the resin laminate 150. By doing so, the circuit board 200 is formed. That is, the resin laminate 150 serves as the base of the circuit board 200, and the interposer member 204 made of the cylinder member 170 and the frame member 172 is formed on the base substrate 202 made of the resin laminate 150, wiring 164, etc. By doing so, the circuit board 200 is formed.
　また、回路形成装置１０では、図１０に示すカバー基板２１０も形成される。カバー基板２１０は、回路基板２００の作成時において図４に示すように樹脂積層体１５０にパッド１６０が形成されるまでの手法と同じ手法で形成される。つまり、図１０に示すように、基台６０の上面に、ホール１５２及び挿通穴１５４を有する樹脂積層体１５０が形成される。そして、ホール１５２の内部に導電性樹脂ペースト１５８が吐出されることでパッド１６０が形成される。 Further, in the circuit forming apparatus 10, a cover substrate 210 shown in FIG. 10 is also formed. The cover substrate 210 is formed using the same method used to form the pads 160 on the resin laminate 150 as shown in FIG. 4 when the circuit board 200 is produced. That is, as shown in FIG. 10, a resin laminate 150 having a hole 152 and an insertion hole 154 is formed on the upper surface of the base 60. Then, pad 160 is formed by discharging conductive resin paste 158 into hole 152 .
　このように、ホール１５２の内部にパッド１６０が形成されると、第１造形ユニット２２の第１印刷部７２において、インクジェットヘッド７６が、樹脂積層体１５０の上面に金属インク２１２を、２個のパッド１６０を繋ぐように吐出する。そして、第１造形ユニット２２の焼成部７４において、金属インク２１２に赤外線照射装置７８が赤外線を照射する。これにより、金属インク２１２が焼成し、樹脂積層体１５０の上に配線２１４が形成される。 When the pad 160 is formed inside the hole 152 in this way, the inkjet head 76 in the first printing section 72 of the first modeling unit 22 applies two pieces of metal ink 212 onto the upper surface of the resin laminate 150. Discharge so as to connect the pads 160. Then, in the firing section 74 of the first modeling unit 22, an infrared ray irradiation device 78 irradiates the metal ink 212 with infrared rays. As a result, the metal ink 212 is fired, and the wiring 214 is formed on the resin laminate 150.
　続いて、第２造形ユニット２４の第２印刷部８４において、樹脂積層体１５０の上に、樹脂積層体１５０と同様の手法により樹脂積層体２１６が形成される。なお、樹脂積層体２１６の外寸は、樹脂積層体１５０の外寸と厚さ寸法を除いて同じ寸法である。また、樹脂積層体２１６には、樹脂積層体１５０の挿通穴１５４と同じ位置に挿通穴２１８が形成されている。このように、樹脂積層体１５０の上に樹脂積層体２１６が形成されることで、カバー基板２１０が形成される。 Subsequently, in the second printing section 84 of the second modeling unit 24, a resin laminate 216 is formed on the resin laminate 150 using the same method as the resin laminate 150. Note that the outer dimensions of the resin laminate 216 are the same as the outer dimensions of the resin laminate 150 except for the thickness dimension. Furthermore, an insertion hole 218 is formed in the resin laminate 216 at the same position as the insertion hole 154 of the resin laminate 150 . In this way, by forming the resin laminate 216 on the resin laminate 150, the cover substrate 210 is formed.
　また、回路形成装置１０では、回路基板２００が２個形成され、２個の回路基板２００とカバー基板２１０とが積層されてボルト締結されることで、積層基板２２０が形成される。詳しくは、図１１に示すように、２個の回路基板２００が積層され、積層された２個の回路基板２００の上にカバー基板２１０が積層される。この際、１番下の回路基板２００ａのプローブピン１９０ａの上端面が、その回路基板２００ａの上に積層された回路基板２００ｂのパッド１６０ｂの下端面と接触する。これにより、プローブピン１９０ａは、回路基板２００ａにおいてインタポーザ部材２０４ａの上側と下側とを電気的に接続する。また、回路基板２００ｂのプローブピン１９０ｂの上端面は、その回路基板２００ｂの上に積層されたカバー基板２１０のパッド１６０ｃの下端面と接触する。これにより、プローブピン１９０ｂは、回路基板２００ｂにおいてインタポーザ部材２０４ｂの上側と下側とを電気的に接続する。 Furthermore, in the circuit forming apparatus 10, two circuit boards 200 are formed, and the two circuit boards 200 and the cover board 210 are stacked and bolted together to form a laminated board 220. Specifically, as shown in FIG. 11, two circuit boards 200 are stacked, and a cover board 210 is stacked on the two stacked circuit boards 200. At this time, the upper end surface of the probe pin 190a of the lowest circuit board 200a comes into contact with the lower end surface of the pad 160b of the circuit board 200b stacked on the circuit board 200a. Thereby, the probe pin 190a electrically connects the upper side and the lower side of the interposer member 204a on the circuit board 200a. Further, the upper end surface of the probe pin 190b of the circuit board 200b contacts the lower end surface of the pad 160c of the cover substrate 210 stacked on the circuit board 200b. Thereby, the probe pin 190b electrically connects the upper and lower sides of the interposer member 204b on the circuit board 200b.
　また、回路基板２００ａと回路基板２００ｂとが積層されることで、回路基板２００ａの第２筒部材１７０ｂの内部と回路基板２００ｂの挿通穴１５４とが連通する。また、回路基板２００ｂとカバー基板２１０とが積層されることで、回路基板２００ｂの第２筒部材１７０ｂの内部とカバー基板２１０の挿通穴１５４とが連通する。これにより、回路基板２００ａの挿通穴１５４及び第２筒部材１７０ｂの内部と、回路基板２００ｂの挿通穴１５４及び第２筒部材１７０ｂの内部と、カバー基板２１０の挿通穴１５４，２１８とが連通する。そして、回路基板２００ａの挿通穴１５４及び第２筒部材１７０ｂの内部と、回路基板２００ｂの挿通穴１５４及び第２筒部材１７０ｂの内部と、カバー基板２１０の挿通穴１５４，２１８とにボルト２３０が挿通されて、回路基板２００ａと回路基板２００ｂとカバー基板２１０とがボルト締結される。これにより、積層基板２２０が形成される。 Furthermore, by stacking the circuit board 200a and the circuit board 200b, the inside of the second cylindrical member 170b of the circuit board 200a communicates with the insertion hole 154 of the circuit board 200b. Further, by stacking the circuit board 200b and the cover board 210, the inside of the second cylindrical member 170b of the circuit board 200b and the insertion hole 154 of the cover board 210 communicate with each other. Thereby, the insertion hole 154 of the circuit board 200a and the inside of the second cylindrical member 170b, the insertion hole 154 of the circuit board 200b and the inside of the second cylindrical member 170b, and the insertion holes 154 and 218 of the cover board 210 communicate with each other. . Then, the bolts 230 are inserted into the insertion hole 154 of the circuit board 200a and the inside of the second cylindrical member 170b, the insertion hole 154 of the circuit board 200b and the inside of the second cylindrical member 170b, and the insertion holes 154 and 218 of the cover board 210. After being inserted, the circuit board 200a, the circuit board 200b, and the cover board 210 are bolted together. As a result, a laminated substrate 220 is formed.
　このように、回路基板２００ａと回路基板２００ｂとカバー基板２１０とが積層されて、例えばボルト締結されることで、積層基板２２０が形成される。近年では、基板の軽量化が望まれている。例えば、ロボットハンドに基板が配設される場合には、ロボットハンドの移動速度の向上，制振制御の面から基板の軽量化が望まれている。また、例えば、ドローン，ラジコン等に基板が配設される場合には、１回の充電で長い時間稼働することができるように、基板の軽量化が望まれている。そして、回路形成装置１０では、任意の位置に紫外線硬化樹脂を吐出することで、回路基板２００を構成するインタポーザ部材２０４を任意の形状に形成することが可能である。このようなことに鑑みて、回路形成装置１０では、回路基板２００において、電子部品１８０，プローブピン１９０，ボルト２３０を配設するための筒部材１７０及びインタポーザ部材２０４の枠となる枠部材１７２から構成されるインタポーザ部材２０４が紫外線硬化樹脂により形成される。 In this way, the circuit board 200a, the circuit board 200b, and the cover board 210 are laminated and, for example, bolted together to form the laminated board 220. In recent years, it has been desired to reduce the weight of substrates. For example, when a substrate is disposed on a robot hand, it is desired to reduce the weight of the substrate from the viewpoint of increasing the moving speed of the robot hand and controlling vibration damping. Further, for example, when a board is installed in a drone, a radio control device, etc., it is desired that the board be lightweight so that it can operate for a long time with one charge. In the circuit forming apparatus 10, the interposer member 204 constituting the circuit board 200 can be formed into an arbitrary shape by discharging the ultraviolet curing resin at an arbitrary position. In view of this, in the circuit forming apparatus 10, in the circuit board 200, the cylindrical member 170 for arranging the electronic components 180, the probe pins 190, and the bolts 230, and the frame member 172 serving as the frame for the interposer member 204. The interposer member 204 is made of ultraviolet curing resin.
　詳しくは、回路基板２００が設計される際に、まず、ＣＡＤ（Computer Aided Design）により回路基板２００の設計画像（以下、「ＣＡＤ画像」と記載する）が作成される。ＣＡＤ画像の作成方法は公知の技術であるため、ＣＡＤ画像の作成方法を簡単に説明する。ＣＡＤ画像作成時に、作業者は回路基板２００を構成する樹脂積層体１５０の寸法、電子部品１８０，プローブピン１９０，ボルト２３０等の配設位置を入力する。そして、回路基板２００を構成する樹脂積層体１５０の寸法、電子部品１８０，プローブピン１９０，ボルト２３０等の配設位置に基づいてＣＡＤ画像が作成される。このため、ＣＡＤ画像を分析することで、樹脂積層体１５０の寸法及び、電子部品１８０，プローブピン１９０，ボルト２３０の配設位置を演算することができる。なお、作成されたＣＡＤ画像は回路形成装置１０の制御装置２８に記憶されている。また、作業者は、電子部品１８０，プローブピン１９０，ボルト２３０の寸法を制御装置２８に登録しておく。 Specifically, when the circuit board 200 is designed, first, a design image (hereinafter referred to as a "CAD image") of the circuit board 200 is created using CAD (Computer Aided Design). Since the method for creating a CAD image is a well-known technique, the method for creating a CAD image will be briefly described. When creating a CAD image, the operator inputs the dimensions of the resin laminate 150 constituting the circuit board 200 and the locations of the electronic components 180, probe pins 190, bolts 230, and the like. Then, a CAD image is created based on the dimensions of the resin laminate 150 constituting the circuit board 200 and the positions of the electronic components 180, probe pins 190, bolts 230, and the like. Therefore, by analyzing the CAD image, the dimensions of the resin laminate 150 and the locations of the electronic component 180, probe pin 190, and bolt 230 can be calculated. Note that the created CAD image is stored in the control device 28 of the circuit forming apparatus 10. The operator also registers the dimensions of the electronic component 180, probe pin 190, and bolt 230 in the control device 28.
　また、制御装置２８のコントローラ１３０には、第１設計プログラム２５０（図２参照）が記憶されている。そして、第１設計プログラム２５０は、制御装置２８に記憶されているＣＡＤ画像に基づいて、樹脂積層体１５０の寸法及び、電子部品１８０，プローブピン１９０，ボルト２３０の配設位置を演算する。また、第１設計プログラム２５０は、制御装置２８に登録されている電子部品１８０，プローブピン１９０，ボルト２３０の寸法を取得する。また、第１設計プログラム２５０は、インタポーザ部材２０４の高さ寸法と厚さ寸法とを入力するための入力画像を表示モニター（図示省略）に表示する。この際、作業者が、その入力画面においてインタポーザ部材２０４の高さ寸法と厚さ寸法とを入力する。なお、入力されたインタポーザ部材２０４の高さ寸法を入力高さ寸法と記載し、入力されたインタポーザ部材２０４の厚さ寸法を入力厚さ寸法と記載する。 Further, the controller 130 of the control device 28 stores a first design program 250 (see FIG. 2). Then, the first design program 250 calculates the dimensions of the resin laminate 150 and the placement positions of the electronic component 180, the probe pin 190, and the bolt 230 based on the CAD image stored in the control device 28. The first design program 250 also acquires the dimensions of the electronic component 180, probe pin 190, and bolt 230 registered in the control device 28. The first design program 250 also displays an input image for inputting the height and thickness of the interposer member 204 on a display monitor (not shown). At this time, the operator inputs the height and thickness of the interposer member 204 on the input screen. Note that the input height dimension of the interposer member 204 is described as an input height dimension, and the input thickness dimension of the interposer member 204 is described as an input thickness dimension.
　そして、第１設計プログラム２５０は、樹脂積層体１５０の寸法、電子部品１８０，プローブピン１９０，ボルト２３０の配設位置及び寸法、入力高さ寸法及び入力厚さ寸法に基づいて、インタポーザ部材２０４を設計する。この際、第１設計プログラム２５０は、樹脂積層体１５０の寸法、電子部品１８０，プローブピン１９０，ボルト２３０の配設位置及び寸法、入力厚さ寸法に基づいて、インタポーザ部材２０４の画像（以下、「インタポーザ画像」と記載する）２６０（図１２参照）を作成する。 The first design program 250 then designs the interposer member 204 based on the dimensions of the resin laminate 150, the arrangement positions and dimensions of the electronic component 180, the probe pin 190, and the bolt 230, the input height dimension, and the input thickness dimension. design. At this time, the first design program 250 generates an image of the interposer member 204 (hereinafter referred to as 260 (described as an "interposer image") (see FIG. 12).
　具体的に、第１設計プログラム２５０は、樹脂積層体１５０の寸法と入力厚さ寸法とに基づいて、インタポーザ部材２０４を構成する枠部材１７２の画像（以下、「枠部材画像」と記載する）２６２（図１２参照）を作成する。この際、第１設計プログラム２５０において、樹脂積層体１５０の上方からの視点における外寸と同じ寸法の外縁を有し、入力厚さ寸法と同じ寸法の厚さの枠形状の枠部材画像２６２が作成される。つまり、枠部材画像２６２は、樹脂積層体１５０の上方からの視点における外寸と同じ寸法の外縁を有し、入力厚さ寸法と同じ寸法の厚さの枠形状の画像である。 Specifically, the first design program 250 creates an image of the frame member 172 that constitutes the interposer member 204 (hereinafter referred to as "frame member image") based on the dimensions of the resin laminate 150 and the input thickness dimension. 262 (see FIG. 12). At this time, in the first design program 250, a frame member image 262 having a frame shape having an outer edge with the same dimensions as the outer dimensions when viewed from above of the resin laminate 150 and a thickness with the same dimension as the input thickness dimension is created. Created. In other words, the frame member image 262 is a frame-shaped image having an outer edge having the same dimensions as the outer dimensions of the resin laminate 150 when viewed from above, and having a thickness equal to the input thickness dimension.
　また、第１設計プログラム２５０は、プローブピン１９０の寸法及び配設位置と入力厚さ寸法とに基づいて、インタポーザ部材２０４を構成する第１筒部材１７０ａの画像（以下、「第１筒部材画像」と記載する）２６４（図１２参照）を作成する。この際、第１設計プログラム２５０において、プローブピン１９０の外径より僅かに大きい寸法の内径を有し、入力厚さ寸法と同じ寸法の厚さの円環形状の第１筒部材画像２６４が作成される。つまり、第１筒部材画像２６４は、プローブピン１９０の上方からの視点における外寸より僅かに大きい寸法の内径を有し、入力厚さ寸法と同じ寸法の厚さの円環形状の画像である。 The first design program 250 also generates an image of the first cylindrical member 170a constituting the interposer member 204 (hereinafter referred to as "first cylindrical member image") based on the dimensions and arrangement position of the probe pin 190 and the input thickness dimension. ) 264 (see FIG. 12). At this time, in the first design program 250, an annular first cylindrical member image 264 having an inner diameter slightly larger than the outer diameter of the probe pin 190 and a thickness equal to the input thickness dimension is created. be done. In other words, the first cylindrical member image 264 is an annular image having an inner diameter that is slightly larger than the outer dimension of the probe pin 190 when viewed from above, and a thickness that is the same as the input thickness dimension. .
　また、第１設計プログラム２５０は、ボルト２３０の寸法及び配設位置と入力厚さ寸法とに基づいて、インタポーザ部材２０４を構成する第２筒部材１７０ｂの画像（以下、「第２筒部材画像」と記載する）２６６（図１２参照）を作成する。この際、第１設計プログラム２５０において、ボルト２３０の軸部の外径より僅かに大きい寸法の内径を有し、入力厚さ寸法と同じ寸法の厚さの円環形状の第２筒部材画像２６６が作成される。つまり、第２筒部材画像２６６は、ボルト２３０の軸部の外径より僅かに大きい寸法の内径を有し、入力厚さ寸法と同じ寸法の厚さの円環形状の画像である。 The first design program 250 also generates an image of the second cylindrical member 170b that constitutes the interposer member 204 (hereinafter referred to as a "second cylindrical member image") based on the dimensions and arrangement positions of the bolts 230 and the input thickness dimensions. ) 266 (see FIG. 12) is created. At this time, in the first design program 250, an annular second cylindrical member image 266 having an inner diameter slightly larger than the outer diameter of the shaft portion of the bolt 230 and a thickness equal to the input thickness dimension. is created. That is, the second cylindrical member image 266 is an annular image having an inner diameter slightly larger than the outer diameter of the shaft portion of the bolt 230 and a thickness equal to the input thickness dimension.
　また、第１設計プログラム２５０は、電子部品１８０の寸法及び配設位置と入力厚さ寸法とに基づいて、インタポーザ部材２０４を構成する第３筒部材１７０ｃの画像（以下、「第３筒部材画像」と記載する）２６８（図１２参照）を作成する。この際、第１設計プログラム２５０において、電子部品１８０の上方からの視点における外寸より僅かに大きい寸法の内縁を有し、入力厚さ寸法と同じ寸法の厚さの枠形状の第３筒部材画像２６８が作成される。つまり、第３筒部材画像２６８は、電子部品１８０の上方からの視点における外寸より僅かに大きい寸法の内縁を有し、入力厚さ寸法と同じ寸法の厚さの枠形状の画像である。 The first design program 250 also generates an image of the third cylindrical member 170c that constitutes the interposer member 204 (hereinafter referred to as "third cylindrical member image") based on the dimensions and arrangement position of the electronic component 180 and the input thickness dimension. ) 268 (see FIG. 12). At this time, in the first design program 250, a frame-shaped third cylindrical member having an inner edge slightly larger than the outer dimension when viewed from above the electronic component 180 and having a thickness equal to the input thickness dimension. Image 268 is created. That is, the third cylindrical member image 268 is a frame-shaped image that has an inner edge that is slightly larger than the outer dimension when viewed from above the electronic component 180, and has a thickness that is the same as the input thickness dimension.
　このように、枠部材画像２６２と第１筒部材画像２６４と第２筒部材画像２６６と第３筒部材画像２６８とが形成されることで、インタポーザ画像２６０が形成される。 In this way, the interposer image 260 is formed by forming the frame member image 262, the first cylinder member image 264, the second cylinder member image 266, and the third cylinder member image 268.
　また、第１設計プログラム２５０は、入力高さ寸法に基づいて、インタポーザ部材２０４の形成時における樹脂層の積層数を演算する。つまり、例えば、インタポーザ部材２０４の形成時における樹脂層の厚さ寸法が５０μｍであり、入力高さ寸法が３ｍｍである場合に、第１設計プログラム２５０は、樹脂層の積層数を６０（＝３０００／５０）回と演算する。 The first design program 250 also calculates the number of resin layers to be laminated when forming the interposer member 204 based on the input height dimension. That is, for example, if the thickness of the resin layer at the time of forming the interposer member 204 is 50 μm and the input height is 3 mm, the first design program 250 sets the number of stacked resin layers to 60 (=3000). /50) times.
　このように、第１設計プログラム２５０によりインタポーザ画像２６０が形成され、インタポーザ部材２０４の形成時における樹脂層の積層数が演算されることで、インタポーザ部材２０４が設計される。つまり、第１設計プログラム２５０では、作業者により入力された樹脂積層体１５０の寸法、電子部品１８０，プローブピン１９０，ボルト２３０の配設位置及び寸法、入力高さ寸法及び入力厚さ寸法に基づいて、インタポーザ部材２０４が設計される。 In this way, the interposer image 260 is formed by the first design program 250, and the number of resin layers stacked when forming the interposer member 204 is calculated, thereby designing the interposer member 204. That is, the first design program 250 is based on the dimensions of the resin laminate 150, the arrangement positions and dimensions of the electronic component 180, the probe pin 190, and the bolt 230, the input height dimension, and the input thickness dimension input by the operator. Thus, the interposer member 204 is designed.
　また、制御装置２８のコントローラ１３０には、第１設計プログラム２５０だけでなく、第２設計プログラム２５２（図２参照）も記憶されている。そして、第２設計プログラム２５２では、回路基板２００を構成するベース基板２０２の３Ｄ画像から、樹脂積層体１５０の寸法と電子部品１８０，プローブピン１９０，ボルト２３０の配設位置及び寸法とが取得される。そして、取得された樹脂積層体１５０の寸法と電子部品１８０，プローブピン１９０，ボルト２３０の配設位置及び寸法とに基づいてインタポーザ部材２０４が設計される。 Furthermore, the controller 130 of the control device 28 stores not only the first design program 250 but also a second design program 252 (see FIG. 2). Then, in the second design program 252, the dimensions of the resin laminate 150 and the positions and dimensions of the electronic components 180, probe pins 190, and bolts 230 are acquired from the 3D image of the base board 202 that constitutes the circuit board 200. Ru. Then, the interposer member 204 is designed based on the obtained dimensions of the resin laminate 150 and the positions and dimensions of the electronic component 180, probe pin 190, and bolt 230.
　詳しくは、ＣＡＤ画像は、上述したように、樹脂積層体１５０の寸法、電子部品１８０，プローブピン１９０，ボルト２３０等の配設位置に基づいて作成される。このため、ＣＡＤ画像と電子部品１８０，プローブピン１９０，ボルト２３０等の寸法とに基づいて、回路基板２００の３Ｄ画像が作成される。そして、作成された３Ｄ画像は、制御装置２８に記憶されている。なお、３Ｄ画像の作成方法は公知の技術であるため、３Ｄ画像の作成方法の説明は省略する。 Specifically, as described above, the CAD image is created based on the dimensions of the resin laminate 150 and the placement positions of the electronic component 180, probe pin 190, bolt 230, and the like. Therefore, a 3D image of the circuit board 200 is created based on the CAD image and the dimensions of the electronic component 180, probe pin 190, bolt 230, etc. The created 3D image is then stored in the control device 28. Note that since the method for creating a 3D image is a well-known technique, a description of the method for creating a 3D image will be omitted.
　そして、第２設計プログラム２５２は、制御装置２８に記憶されている３Ｄ画像に基づいて、樹脂積層体１５０の寸法、電子部品１８０，プローブピン１９０，ボルト２３０の配設位置及び寸法を演算する。詳しくは、第２設計プログラム２５２は、３Ｄ画像に基づいて、回路基板２００を構成するベース基板２０２の上面の画像（以下、「ベース基板画像」と記載する）２８０（図１３参照）を特定する。ベース基板画像２８０では、図１３に示すように、樹脂積層体１５０の上方からの視点における外寸、電子部品１８０，プローブピン１９０，ボルト２３０の配設位置、電子部品１８０の上方からの視点における外寸、プローブピン１９０の外径、ボルト２３０の軸部の外径を認識できる。このため、第２設計プログラム２５２は、制御装置２８に記憶されている３Ｄ画像に基づいて、樹脂積層体１５０の上方からの視点における外寸、電子部品１８０，プローブピン１９０，ボルト２３０の配設位置、電子部品１８０の上方からの視点における外寸、プローブピン１９０の外径、ボルト２３０の外径を演算する。 Then, the second design program 252 calculates the dimensions of the resin laminate 150 and the placement positions and dimensions of the electronic component 180, probe pin 190, and bolt 230 based on the 3D image stored in the control device 28. Specifically, the second design program 252 specifies an image (hereinafter referred to as "base board image") 280 (see FIG. 13) of the top surface of the base board 202 that constitutes the circuit board 200 based on the 3D image. . In the base board image 280, as shown in FIG. The outer dimensions, the outer diameter of the probe pin 190, and the outer diameter of the shaft portion of the bolt 230 can be recognized. Therefore, the second design program 252 determines the external dimensions of the resin laminate 150 as viewed from above, the arrangement of the electronic component 180, the probe pin 190, and the bolt 230 based on the 3D image stored in the control device 28. The position, the outer size of the electronic component 180 when viewed from above, the outer diameter of the probe pin 190, and the outer diameter of the bolt 230 are calculated.
　また、第２設計プログラム２５２においても、第１設計プログラム２５０と同様に、インタポーザ部材２０４の高さ寸法と厚さ寸法とを入力するための入力画像を表示モニターに表示する。この際、作業者が、その入力画面においてインタポーザ部材２０４の高さ寸法と厚さ寸法とを入力する。そして、第２設計プログラム２５２は、演算した樹脂積層体１５０の外寸、電子部品１８０，プローブピン１９０，ボルト２３０の配設位置、電子部品１８０の外寸、プローブピン１９０の外径、ボルト２３０の外径及び、入力された入力厚さ寸法に基づいて、インタポーザ画像２６０を作成する。なお、第２設計プログラム２５２でのインタポーザ画像２６０の作成方法は、第１設計プログラム２５０でのインタポーザ画像２６０の作成方法と同じである。また、第２設計プログラム２５２においても、第１設計プログラム２５０と同様に、インタポーザ部材２０４の形成時における樹脂層の積層数が演算される。 Also, in the second design program 252, similarly to the first design program 250, an input image for inputting the height dimension and thickness dimension of the interposer member 204 is displayed on the display monitor. At this time, the operator inputs the height and thickness of the interposer member 204 on the input screen. The second design program 252 then calculates the calculated outer dimensions of the resin laminate 150, the arrangement positions of the electronic component 180, the probe pin 190, and the bolt 230, the outer dimension of the electronic component 180, the outer diameter of the probe pin 190, and the location of the bolt 230. An interposer image 260 is created based on the outer diameter and the input thickness dimension. Note that the method for creating the interposer image 260 in the second design program 252 is the same as the method for creating the interposer image 260 in the first design program 250. Also, in the second design program 252, similarly to the first design program 250, the number of laminated resin layers when forming the interposer member 204 is calculated.
　このように、第２設計プログラム２５２においても、インタポーザ画像２６０が形成され、インタポーザ部材２０４の形成時における樹脂層の積層数が演算されることで、インタポーザ部材２０４が設計される。なお、第２設計プログラム２５２では、第１設計プログラム２５０と異なり、３Ｄ画像から演算された樹脂積層体１５０の寸法、電子部品１８０，プローブピン１９０，ボルト２３０の配設位置及び寸法に基づいて、インタポーザ画像２６０が形成される。 In this way, also in the second design program 252, the interposer image 260 is formed, and the number of resin layers stacked when forming the interposer member 204 is calculated, thereby designing the interposer member 204. Note that, unlike the first design program 250, in the second design program 252, based on the dimensions of the resin laminate 150 calculated from the 3D image, and the arrangement positions and dimensions of the electronic component 180, probe pin 190, and bolt 230, An interposer image 260 is formed.
　このように、第１設計プログラム２５０若しくは第２設計プログラム２５２によりインタポーザ部材２０４が設計されると、インタポーザ画像２６０に基づいて紫外線硬化樹脂がインクジェットヘッド８８により吐出される。そして、吐出された紫外線硬化樹脂が平坦化装置９０により平坦化され、照射装置９２により紫外線が照射されることで、図１２に示す形状の樹脂層が形成される。そして、インタポーザ部材２０４の設計時に演算された積層数分の樹脂層が積層されることで、図１４に示す形状のインタポーザ部材２０４が形成される。 In this way, when the interposer member 204 is designed by the first design program 250 or the second design program 252, the ultraviolet curable resin is ejected by the inkjet head 88 based on the interposer image 260. Then, the discharged ultraviolet curable resin is flattened by a flattening device 90 and irradiated with ultraviolet rays by an irradiation device 92, thereby forming a resin layer having the shape shown in FIG. Then, the interposer member 204 having the shape shown in FIG. 14 is formed by laminating resin layers corresponding to the number of layers calculated at the time of designing the interposer member 204.
　一方で、従来のインタポーザ部材２９０（図１５参照）は、板形状の部材であり、電子部品１８０，プローブピン１９０，ボルト２３０の配設位置に貫通穴２９２が形成されていた。図１４に示すインタポーザ部材２０４と、図１５に示すインタポーザ部材２９０とを比較すれば分かるように、回路形成装置１０で作成されるインタポーザ部材２０４は、従来のインタポーザ部材２９０の不要な箇所を除いた形状である。つまり、回路形成装置１０で作成されるインタポーザ部材２０４は、インタポーザ部材２０４の上に積層される基板を支持するための枠部材１７２と、電子部品１８０，プローブピン１９０，ボルト２３０を配設するための筒部材１７０とにより構成された形状である。このため、回路形成装置１０で作成されるインタポーザ部材２０４の容積は、従来のインタポーザ部材２９０の容積より明らかに少ない。これにより、回路形成装置１０で作成されるインタポーザ部材２０４の重量を、従来のインタポーザ部材２９０の重量より格段に少なくすることが可能となり、基板の軽量化を図ることが可能となる。また、インタポーザ部材２０４の上に積層される基板の支持及び、電子部品１８０，プローブピン１９０，ボルト２３０の配設に不要な箇所の樹脂積層体を形成する必要がなくなるため、樹脂積層体の形成に要する時間の短縮及び、樹脂積層体の材料の削減をも図ることが可能となる。さらに言えば、第１設計プログラム２５０、若しくは第２設計プログラム２５２によりインタポーザ部材２０４が設計されるため、インタポーザ部材２０４の設計に要する時間の短縮をも図ることが可能となる。 On the other hand, a conventional interposer member 290 (see FIG. 15) is a plate-shaped member, and a through hole 292 is formed at the position where the electronic component 180, probe pin 190, and bolt 230 are disposed. As can be seen by comparing the interposer member 204 shown in FIG. 14 and the interposer member 290 shown in FIG. It is the shape. In other words, the interposer member 204 created by the circuit forming apparatus 10 includes the frame member 172 for supporting the substrate laminated on the interposer member 204, the electronic component 180, the probe pin 190, and the bolt 230. It has a shape composed of a cylindrical member 170. Therefore, the volume of the interposer member 204 created by the circuit forming apparatus 10 is clearly smaller than the volume of the conventional interposer member 290. As a result, the weight of the interposer member 204 produced by the circuit forming apparatus 10 can be made much smaller than the weight of the conventional interposer member 290, and the weight of the board can be reduced. Furthermore, since there is no need to form a resin laminate in unnecessary locations for supporting the substrate laminated on the interposer member 204 and arranging the electronic components 180, probe pins 190, and bolts 230, the formation of a resin laminate is eliminated. It is also possible to reduce the time required for the process and the material used for the resin laminate. Furthermore, since the interposer member 204 is designed by the first design program 250 or the second design program 252, it is possible to reduce the time required to design the interposer member 204.
　なお、上記実施例において、第１筒部材１７０ａは、囲い部材の一例である。枠部材１７２は、枠部材の一例である。電子部品１８０は、電気部品の一例である。プローブピン１９０は、導通部材の一例である。ベース基板２０２は、ベース基板の一例である。インタポーザ部材２０４は、インタポーザ部材の一例である。 Note that in the above embodiment, the first cylindrical member 170a is an example of an enclosing member. Frame member 172 is an example of a frame member. Electronic component 180 is an example of an electrical component. Probe pin 190 is an example of a conductive member. Base substrate 202 is an example of a base substrate. Interposer member 204 is an example of an interposer member.
　なお、本発明は、上記実施例に限定されるものではなく、当業者の知識に基づいて種々の変更、改良を施した種々の態様で実施することが可能である。例えば、上記実施例において、インタポーザ部材２０４は筒部材１７０と枠部材１７２とを備えているが、筒部材１７０及び枠部材１７２以外の部材を備えていてもよい。具体的には、例えば、ベース基板２０２の上面より上方に部品を配設する場合に、インタポーザ部材２０４は、図１６に示すように、更に凸部材３００を備えていてもよい。このような場合には、第１設計プログラム２５０若しくは第２設計プログラム２５２に、凸部材３００の配設位置及び寸法を入力することで、図１７に示すように、凸部材３００の画像３０２を含むインタポーザ画像３１０が形成される。これにより、筒部材１７０と枠部材１７２と凸部材３００とを含むインタポーザ部材２０４が形成される。なお、凸部材３００の配設位置及び寸法は、ＣＡＤ画像，３Ｄ画像に含まれていてもよく、制御装置２８に登録されていてもよい。 Note that the present invention is not limited to the above-mentioned embodiments, but can be implemented in various forms with various modifications and improvements based on the knowledge of those skilled in the art. For example, in the above embodiment, the interposer member 204 includes the cylindrical member 170 and the frame member 172, but may include members other than the cylindrical member 170 and the frame member 172. Specifically, for example, when components are disposed above the upper surface of the base substrate 202, the interposer member 204 may further include a convex member 300, as shown in FIG. In such a case, by inputting the placement position and dimensions of the convex member 300 into the first design program 250 or the second design program 252, an image 302 of the convex member 300 is included as shown in FIG. An interposer image 310 is formed. As a result, an interposer member 204 including the cylindrical member 170, the frame member 172, and the convex member 300 is formed. Note that the arrangement position and dimensions of the convex member 300 may be included in the CAD image or 3D image, or may be registered in the control device 28.
　また、上記実施例では、インタポーザ部材２０４は、電子部品１８０，プローブピン１９０，ボルト２３０を配設するための筒部材１７０を備えているが、電子部品１８０，プローブピン１９０，ボルト２３０以外の部品を配設するための筒部材を備えていてもよい。また、筒部材１７０として、プローブピン１９０を配設するための第１筒部材１７０ａと、ボルト２３０を配設するための第２筒部材１７０ｂと、電子部品１８０を配設するための第３筒部材１７０ｃとが採用されているが、少なくとも第１筒部材１７０ａが採用されていればよい。つまり、インタポーザ部材２０４は、少なくとも第１筒部材１７０ａと枠部材１７２とを備えていれば、第２筒部材１７０ｂと第３筒部材１７０ｃと凸部材３００とのうちの少なくとも１つを更に備えていてもよい。 Furthermore, in the above embodiment, the interposer member 204 includes the cylindrical member 170 for arranging the electronic component 180, the probe pin 190, and the bolt 230; It may be provided with a cylindrical member for arranging the. Further, as the cylindrical member 170, a first cylindrical member 170a for arranging the probe pin 190, a second cylindrical member 170b for arranging the bolt 230, and a third cylindrical member 170b for arranging the electronic component 180. Although the member 170c is employed, at least the first cylindrical member 170a may be employed. In other words, if the interposer member 204 includes at least the first cylindrical member 170a and the frame member 172, it also includes at least one of the second cylindrical member 170b, the third cylindrical member 170c, and the convex member 300. You can.
　また、上記実施例では、インタポーザ部材２０４が第１筒部材１７０ａと第２筒部材１７０ｂと第３筒部材１７０ｃと枠部材１７２とを備えているが、更に第１筒部材１７０ａと第２筒部材１７０ｂと第３筒部材１７０ｃと枠部材１７２との各々を連結する連結部材を備えていてもよい。インタポーザ部材２０４が更に連結部材を備えることで、一体的なインタポーザ部材２０４を作成することが可能となり、インタポーザ部材２０４を単体で流通させることが可能となる。 Further, in the above embodiment, the interposer member 204 includes the first cylindrical member 170a, the second cylindrical member 170b, the third cylindrical member 170c, and the frame member 172. A connecting member that connects each of the third cylinder member 170b, the third cylinder member 170c, and the frame member 172 may be provided. Since the interposer member 204 further includes a connecting member, it becomes possible to create an integral interposer member 204, and it becomes possible to distribute the interposer member 204 alone.
　また、筒部材１７０は電子部品１８０，プローブピン１９０，ボルト２３０の周囲を全周に渡って囲っているが、電子部品１８０，プローブピン１９０，ボルト２３０の周囲の一部を囲っていてもよい。つまり、筒部材１７０は筒形状に限定されず、筒形状の部材の一部が欠けた形状の部材であってもよい。 Further, although the cylindrical member 170 surrounds the entire circumference of the electronic component 180, the probe pin 190, and the bolt 230, it may partially surround the periphery of the electronic component 180, the probe pin 190, and the bolt 230. . In other words, the cylindrical member 170 is not limited to a cylindrical shape, and may be a cylindrical member with a part cut off.
　また、上記実施例では、第１筒部材１７０ａと第２筒部材１７０ｂと第３筒部材１７０ｃと枠部材１７２とが同じ高さ寸法であるが、第１筒部材１７０ａと第２筒部材１７０ｂと第３筒部材１７０ｃと枠部材１７２とが異なる高さ寸法であってもよい。 Further, in the above embodiment, the first cylindrical member 170a, the second cylindrical member 170b, the third cylindrical member 170c, and the frame member 172 have the same height, but the first cylindrical member 170a and the second cylindrical member 170b have the same height. The third cylindrical member 170c and the frame member 172 may have different height dimensions.
　また、回路形成装置１０の制御装置２８に第１設計プログラム２５０及び第２設計プログラム２５２が記憶されているが、回路形成装置１０と異なる装置、例えば、回路基板の設計に用いられる情報処理装置に、第１設計プログラム２５０及び第２設計プログラム２５２が記憶されていてもよい。また、回路形成装置１０の制御装置２８、又は回路形成装置１０と異なる装置に、第１設計プログラム２５０及び第２設計プログラム２５２の一方のみが記憶されていてもよい。 Further, although the first design program 250 and the second design program 252 are stored in the control device 28 of the circuit forming device 10, the first design program 250 and the second design program 252 are stored in a device different from the circuit forming device 10, for example, an information processing device used for designing a circuit board. , a first design program 250, and a second design program 252 may be stored. Further, only one of the first design program 250 and the second design program 252 may be stored in the control device 28 of the circuit forming device 10 or in a device different from the circuit forming device 10.
　また、上記実施例では、インタポーザ部材２０４を形成するための硬化性樹脂として紫外線硬化樹脂が採用されているが、熱硬化性樹脂，２液混合型樹脂など、種々の樹脂を採用することが可能である。 Further, in the above embodiment, an ultraviolet curable resin is used as the curable resin for forming the interposer member 204, but it is possible to use various resins such as a thermosetting resin and a two-component mixed resin. It is.
　また、上記実施例では、インクジェットヘッド８８によって吐出された紫外線硬化樹脂の上面が、平坦化装置９０によって平坦化される。しかし、紫外線硬化樹脂は、インクジェットヘッド８８によって吐出された後、平坦化されなくてもよい。この場合、硬化部８６に、平坦化装置９０が設けられなくてもよい。 Furthermore, in the above embodiment, the upper surface of the ultraviolet curing resin discharged by the inkjet head 88 is flattened by the flattening device 90. However, the ultraviolet curing resin does not need to be flattened after being ejected by the inkjet head 88. In this case, the hardening section 86 does not need to be provided with the flattening device 90.
　１７０ａ：第１筒部材（囲い部材）　　１７２：枠部材　　１８０：電子部品（電気部品）　　１９０：プローブピン（導通部材）　　２０２：ベース基板　　２０４：インタポーザ部材（インタポーザ部材） 170a: First cylinder member (enclosure member) 172: Frame member 180: Electronic component (electrical component) 190: Probe pin (conducting member) 202: Base board 204: Interposer member (interposer member)

Claims (5)

  1. 　電気部品が装着されるベース基板の上に設けられるインタポーザ部材であって、
    　前記インタポーザ部材の上側と下側とを電気的に接続する導通部材の周囲を囲む囲い部材と、
    　前記ベース基板の外縁に沿って立設される枠部材と、
    　を備えるインタポーザ部材。     An interposer member provided on a base board on which electrical components are mounted,
    an enclosing member surrounding a conductive member that electrically connects the upper and lower sides of the interposer member;
    a frame member erected along the outer edge of the base substrate;
    An interposer member comprising:
  2. 　電気部品が装着されるベース基板を硬化性樹脂により形成するベース基板形成工程と、
    　前記ベース基板形成工程において形成されたベース基板の上にインタポーザ部材を硬化性樹脂により形成するインタポーザ部材形成工程と、
    　を含み、
    　前記インタポーザ部材形成工程は、
    　前記インタポーザ部材の上側と下側とを電気的に接続する導通部材の周囲を囲む囲い部材と、前記ベース基板の外縁に沿って立設される枠部材とを前記ベース基板の上に硬化性樹脂により形成する回路基板作製方法。     a base board forming step of forming a base board on which electrical components are mounted from a curable resin;
    an interposer member forming step of forming an interposer member from a curable resin on the base substrate formed in the base substrate forming step;
    including;
    The interposer member forming step includes:
    A surrounding member that surrounds a conductive member that electrically connects the upper and lower sides of the interposer member and a frame member that stands along the outer edge of the base substrate are mounted on the base substrate using a curable resin. A method for manufacturing a circuit board.
  3. 　電気部品が装着されるベース基板の上に設けられるインタポーザ部材の設計方法であって、
    　前記インタポーザ部材の上側と下側とを電気的に接続する導通部材の寸法及び配設位置に基づいて、前記導通部材の周囲を囲む囲い部材の画像データを生成し、前記ベース基板の寸法に基づいて、前記ベース基板の外縁に沿って立設される枠部材の画像データを作成することで前記インタポーザ部材を設計する設計方法。     A method for designing an interposer member provided on a base board on which electrical components are mounted, the method comprising:
    Generate image data of a surrounding member surrounding the conductive member based on the dimensions and arrangement position of the conductive member that electrically connects the upper and lower sides of the interposer member, and generate image data of an enclosing member surrounding the conductive member, and based on the dimensions of the base substrate. A design method for designing the interposer member by creating image data of a frame member erected along the outer edge of the base substrate.
  4. 　作業者により入力された前記導通部材の寸法及び配設位置と前記ベース基板の寸法とに基づいて、前記囲い部材及び前記枠部材の画像データを作成することで前記インタポーザ部材を設計する請求項３に記載の設計方法。 3. The interposer member is designed by creating image data of the enclosure member and the frame member based on the dimensions and arrangement position of the conductive member and the dimensions of the base substrate input by an operator. The design method described in .
  5. 　前記ベース基板の設計画像から前記導通部材の寸法及び配設位置と前記ベース基板の寸法とを取得し、取得した前記導通部材の寸法及び配設位置と前記ベース基板の寸法とに基づいて、前記囲い部材及び前記枠部材の画像データを作成することで前記インタポーザ部材を設計する請求項３に記載の設計方法。 The dimensions and arrangement position of the conductive member and the dimensions of the base board are acquired from the design image of the base board, and based on the acquired dimensions and arrangement position of the conductive member and the dimensions of the base board, the 4. The design method according to claim 3, wherein the interposer member is designed by creating image data of the enclosing member and the frame member.
PCT/JP2022/028461 2022-07-22 2022-07-22 Interposer member, method for manufacturing circuit board, and design method WO2024018615A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016125275A1 (en) * 2015-02-05 2016-08-11 富士機械製造株式会社 Data conversion apparatus and additive manufacturing system
WO2021019684A1 (en) * 2019-07-30 2021-02-04 株式会社Ｆｕｊｉ Method for manufacturing stack components
JP2022080062A (en) * 2020-11-17 2022-05-27 株式会社Fuji Detection data storage device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016125275A1 (en) * 2015-02-05 2016-08-11 富士機械製造株式会社 Data conversion apparatus and additive manufacturing system
WO2021019684A1 (en) * 2019-07-30 2021-02-04 株式会社Ｆｕｊｉ Method for manufacturing stack components
JP2022080062A (en) * 2020-11-17 2022-05-27 株式会社Fuji Detection data storage device

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