WO2023282121A1 - Procédé de formation d'un circuit filaire - Google Patents

Procédé de formation d'un circuit filaire Download PDF

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Publication number
WO2023282121A1
WO2023282121A1 PCT/JP2022/025703 JP2022025703W WO2023282121A1 WO 2023282121 A1 WO2023282121 A1 WO 2023282121A1 JP 2022025703 W JP2022025703 W JP 2022025703W WO 2023282121 A1 WO2023282121 A1 WO 2023282121A1
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WO
WIPO (PCT)
Prior art keywords
wire
base material
heater wire
forming
terminal
Prior art date
Application number
PCT/JP2022/025703
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English (en)
Japanese (ja)
Inventor
明 松波
Original Assignee
豊田合成株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 豊田合成株式会社 filed Critical 豊田合成株式会社
Publication of WO2023282121A1 publication Critical patent/WO2023282121A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Definitions

  • the present disclosure relates to a wire circuit forming method for forming a wire circuit on a synthetic resin base material.
  • Patent Document 1 discloses forming or drawing a heater element (wire) on the back surface of an insulating film (base material).
  • the insulating film is made of a synthetic resin material such as polycarbonate.
  • the heater element is constructed from an electrically conductive material such as, for example, Nichrome wire.
  • Patent Document 1 describes that printing, vapor deposition, sputtering, plating, etching, wire bonding, inkjet, dispenser, or the like is used for forming or drawing a heater element on an insulating film.
  • a wire bonding method for example, is used to form the heater element on the insulating film, there are the following problems.
  • the insulating film is made of general-purpose synthetic resin, if a heater element is formed on the insulating film using a wire bonding method that joins metals together, the insulating film will melt due to the large amount of heat generated by the wire bonding method. . Therefore, there is a problem that the heater element cannot be formed on the insulating film without thermally damaging the insulating film.
  • a wire circuit forming method for solving the above problems is a wire circuit forming method for forming a wire circuit on a synthetic resin base material, comprising: a terminal forming step of forming a metal terminal on the base material; A joining step of thermally joining the end of the wire to the terminal, a drawing step of drawing a circuit pattern on the base material with the wire while pressing the wire against the base material and embedding it, and the wire. and a cutting step of cutting the wire while leaving the base material from the end portion serving as the starting point to the portion serving as the end point.
  • FIG. 1 is a schematic plan view of a part of one embodiment.
  • 2 is a cross-sectional view taken along line 2-2 of FIG. 1.
  • FIG. 3 is a schematic side view showing a heater circuit forming apparatus for forming a heater circuit on a substrate.
  • FIG. 4 is a schematic cross-sectional view showing the initial state when forming the heater circuit on the substrate.
  • FIG. 5 is a schematic cross-sectional view showing a state in the middle of forming a heater circuit on a substrate.
  • FIG. 6 is a schematic cross-sectional view showing the final state of forming the heater circuit on the substrate.
  • FIG. 7 is a schematic side view showing a state in which the joining unit in the writing unit of the modification is at the use position.
  • FIG. 8 is a schematic side view showing a state in which the joining unit in the writing unit of the modification is at the non-use position.
  • the component 11 is used in general synthetic resin products requiring wire circuit formation. That is, the parts 11 are used for covers, emblems, garnishes, etc. that hide a millimeter-wave radar device and a LiDAR (Light Detection and Ranging) sensor in a vehicle and have a heater circuit 12 for snow melting as an example of a wire circuit. be done.
  • the parts 11 are used for covers, emblems, garnishes, etc. that hide a millimeter-wave radar device and a LiDAR (Light Detection and Ranging) sensor in a vehicle and have a heater circuit 12 for snow melting as an example of a wire circuit. be done.
  • LiDAR Light Detection and Ranging
  • the component 11 includes a rectangular plate-shaped base material 13 made of synthetic resin, a pair of metal terminals 14 formed on the base material 13, and a pair of terminals 14 formed on the base material 13 and electrically connected to each other. and a heater circuit 12 connected to the One of the pair of terminals 14 is a first terminal 15 and the other is a second terminal 16 .
  • the base material 13 can be composed of almost all synthetic resins.
  • the base material 13 is made of, for example, general-purpose resins such as polyethylene terephthalate (PET), polypropylene (PP), and acrylonitrile-butadiene-styrene copolymer (ABS) resins, or engineering plastics such as polycarbonate (PC).
  • general-purpose resins such as polyethylene terephthalate (PET), polypropylene (PP), and acrylonitrile-butadiene-styrene copolymer (ABS) resins
  • ABS acrylonitrile-butadiene-styrene copolymer
  • PC polycarbonate
  • the heater circuit 12 is composed of a heater wire 17 as an example of a wire.
  • the heater wire 17 is composed of, for example, a bare wire whose main material is copper or aluminum, an enamel wire, a magnet wire, or the like.
  • a magnet wire is a wire whose main material is copper or aluminum and which has an insulating layer and a self-bonding layer.
  • the pair of terminals 14 are both rectangular plate-shaped.
  • the pair of terminals 14 are formed on the base material 13 by insert molding, for example.
  • the pair of terminals 14 are arranged, for example, on the edge portion of the surface 13a of the substrate 13 so as to be flush with the surface 13a and at different positions apart from each other.
  • the heater wire 17 is formed on the surface 13a of the substrate 13 so as to draw a preset circuit pattern. Both ends of the heater wire 17 are connected to the pair of terminals 14 respectively.
  • about half of the heater wire 17 is embedded in the surface 13 a of the base material 13 . That is, about half of the heater wire 17 is buried in the base material 13 and about half of the remaining part is exposed from the base material 13 .
  • the heater circuit forming apparatus 20 includes a rectangular plate-shaped stage 21 that supports the substrate 13, a drawing unit 22 that is arranged above the stage 21, and a bonding unit that is arranged above the stage 21.
  • a unit 23 is provided.
  • the stage 21 is configured to be able to fix the substrate 13 placed on its upper surface.
  • the drawing unit 22 and the joining unit 23 are each supported by a robot arm (not shown). In other words, the drawing unit 22 and the joining unit 23 can be freely moved three-dimensionally by a robot arm (not shown).
  • the drawing unit 22 has a cylindrical body case 24 extending in the vertical direction.
  • the lower end of the main body case 24 is tapered such that the outer diameter becomes smaller toward the bottom.
  • a delivery section 25 is provided in the body case 24 .
  • the sending unit 25 takes in the heater wire 17 supplied from a heater wire supply device (not shown) into the main body case 24 from an opening formed in the side of the main body case 24 and feeds it from the lower end opening 24a of the main body case 24 to the base. It is delivered to the surface 13 a of the material 13 .
  • a drawing section 26 and a cutting section 27 are provided at the lower end of the main body case 24 .
  • the drawing unit 26 presses the heater wire 17 sent out from the lower end opening 24a of the main body case 24 to the surface 13a of the base material 13 by the sending unit 25 against the surface 13a of the base material 13, and heats the surface 13a of the base material 13 so that the surface 13a is softened. Heat is generated to bury the heater wire 17 into the surface 13 a of the substrate 13 .
  • the drawing unit 26 is, for example, an ultrasonic vibration device having an ultrasonic horn that presses the heater wire 17 against the surface 13a of the substrate 13 while vibrating the heater wire 17 with ultrasonic waves in the vertical direction (direction perpendicular to the surface 13a of the substrate 13). Consists of In this case, the drawing unit 26 vibrates the heater wire 17 in the vertical direction by contacting the vibrating ultrasonic horn with the heater wire 17 , so that the substrate 13 is between the heater wire 17 and the surface 13 a of the substrate 13 . Frictional heat is generated at a relatively low temperature such that the surface 13a of the is softened.
  • the cutting part 27 is configured by, for example, a cutting device that cuts the heater wire 17 with a cutting blade.
  • the joining unit 23 joins the heater wire 17 to the terminal 14 by heat.
  • the joining unit 23 is composed of, for example, an ultrasonic vibration device having an ultrasonic horn that presses the heater wire 17 against the terminal 14 while vibrating the heater wire 17 in the lateral direction (direction along the surface 13a of the substrate 13) with ultrasonic waves.
  • the joining unit 23 laterally vibrates the heater wire 17 by contacting the heater wire 17 with a vibrating ultrasonic horn, so that the heater wire 17 and the terminal 14 are placed between the heater wire 17 and the terminal 14 . Frictional heat is generated at a relatively high temperature to the extent that the welding is performed.
  • the first terminal 15 and the second terminal 15 are inserted into different positions on the edge of the surface 13a of the substrate 13 by insert molding.
  • Two terminals 16 are formed (terminal forming step).
  • the drawing unit 22 is moved to a position where the lower end opening 24a of the main body case 24 faces the initial position S.
  • the initial position S is a position immediately beside the first terminal 15 on the surface 13 a of the base material 13 .
  • the feeder 25 feeds the heater wire 17 from the lower end opening 24a of the main body case 24 to the initial position S on the surface 13a of the substrate 13 .
  • the drawing unit 26 presses the tip of the heater wire 17 to the initial position S on the surface 13a of the substrate 13 and embeds it.
  • the drawing unit 26 vibrates the heater wire 17 so that the surface 13a of the substrate 13 is relatively softened between the tip of the heater wire 17 and the initial position S of the surface 13a of the substrate 13. Generates low-temperature frictional heat. Therefore, the tip of the heater wire 17 is smoothly inserted into the initial position S on the surface 13a of the base material 13 and joined. Subsequently, as shown in FIG. 4, the drawing unit 22 is moved to the position where the lower end opening 24a of the main body case 24 faces the first terminal 15 on the surface 13a of the base material 13. move along.
  • the heater wire 17 is sent out from the lower end opening 24a of the main body case 24 toward the surface 13a of the base material 13 by the sending part 25 as the drawing unit 22 moves along the surface 13a of the base material 13 . Subsequently, as shown in FIG. 5, when the drawing unit 22 crosses the position facing the first terminal 15, the joining unit 23 is placed at the position where the first terminal 15 overlaps the leading end portion 17a of the heater wire 17. move.
  • the heater wire 17 and the first terminal 15 are welded between the heater wire 17 and the first terminal 15 by relatively high temperature frictional heat. generate As a result, the tip portion 17a, which is the starting point of the heater wire 17, and the first terminal 15 are welded. That is, the tip portion 17a, which is the starting point of the heater wire 17, is joined to the first terminal 15, which is one of the pair of terminals 14, by frictional heat (joining step). After performing this bonding step, the bonding unit 23 is retracted upward away from the surface 13 a of the base material 13 .
  • the drawing unit 22 crossing the position facing the first terminal 15 is moved along the surface 13a of the substrate 13 so that the circuit pattern preset on the surface 13a of the substrate 13 is drawn by the heater wire 17. to move.
  • the heater wires 17 sent out from the lower end opening 24a of the main body case 24 by the sending part 25 to the surface 13a of the base material 13 are sequentially pressed against the surface 13a of the base material 13 by the drawing part 26 and embedded therein.
  • the circuit pattern is drawn on the surface 13a of the base material 13 with the heater wire 17 while the drawing unit 26 presses the heater wire 17 against the surface 13a of the base material 13 and embeds it (drawing step).
  • the drawing unit 22 is moved to move the portion of the surface 13a of the substrate 13 into which the heater wire 17 is pressed and embedded, that is, the portion of the surface 13a of the substrate 13 where the circuit pattern is to be drawn. Along with this, they are softened by heat in sequence.
  • the drawing unit 26 vibrates the heater wire 17 to generate frictional heat at a relatively low temperature between the heater wire 17 and the surface 13a of the base material 13 to soften the surface 13a of the base material 13.
  • the drawing unit 26 vibrates the heater wire 17 to generate frictional heat at a relatively low temperature between the heater wire 17 and the surface 13a of the base material 13 to soften the surface 13a of the base material 13.
  • the surface 13a of the base material 13 is softened. Therefore, the heater wire 17 is easily and smoothly embedded into the surface 13a of the base material 13 . Therefore, the drawing process is smoothly performed.
  • the drawing unit 22 draws the circuit pattern on the surface 13a of the substrate 13 with the heater wires 17, the drawing unit 22 draws across the position facing the second terminal 16.
  • the unit 22 is moved and stopped.
  • the portion 17b of the heater wire 17 overlapping the second terminal 16 becomes the end point.
  • the joining unit 23 is moved to a position where the end point 17b of the heater wire 17 and the second terminal 16 overlap.
  • the heater wire 17 and the second terminal 16 are welded between the heater wire 17 and the second terminal 16 by relatively high temperature frictional heat. generate As a result, the end point 17b of the heater wire 17 and the second terminal 16 are welded. That is, the second terminal 16, which is the other of the pair of terminals 14, is joined to the end point 17b of the heater wire 17 by frictional heat.
  • the bonding unit 23 is retracted upward and away from the surface 13a of the base material 13 .
  • the heater wire 17 is cut by the cutting part 27 leaving the base material 13 from the leading end portion 17a to the terminal portion 17b of the heater wire 17 (cutting step). That is, in the cutting step, after the portion 17b serving as the end point of the heater wire 17 is joined to the second terminal 16 by heat, the portion from the tip portion 17a serving as the starting point of the heater wire 17 to the portion 17b serving as the end point of the heater wire 17 is left on the base material 13. to cut the heater wire 17. Thereby, the heater circuit 12 is formed on the surface 13a of the base material 13, and the component 11 described above is manufactured.
  • the bonding (embedding) of the heater wire 17 to the surface 13a of the base material 13 and the bonding of the heater wire 17 to the pair of terminals 14 are combined into one work process. can be implemented as Therefore, the number of substantial work steps can be reduced.
  • the method of forming the heater circuit 12 includes a terminal forming step of forming the metal terminal 14 on the base material 13, and a joining step of joining the tip portion 17a, which is the starting point of the heater wire 17, to the terminal 14 by frictional heat. a drawing step of drawing a circuit pattern on the base material 13 with the heater wire 17 while pressing the heater wire 17 against the base material 13 and embedding the heater wire 17 into the base material 13; and a cutting step of cutting the heater wire 17 while leaving the .
  • the heater circuit 12 can be formed on the substrate 13 without thermally damaging the substrate 13 .
  • the pair of terminals 14 are formed at mutually different positions on the substrate 13, and in the bonding step, one of the pair of terminals 14 is attached to the heater wire 17.
  • the tip portion 17a serving as the starting point is joined by heat, and in the cutting step, after joining the portion 17b serving as the end point of the heater wire 17 to the other of the pair of terminals 14 by heat, the tip portion serving as the starting point of the heater wire 17 is joined.
  • the heater wire 17 is cut leaving the base material 13 from 17a to the end point 17b.
  • the heater circuit 12 connecting the pair of terminals 14 with the heater wire 17 can be formed on the base material 13 without thermally damaging the base material 13 .
  • the circuit pattern is drawn on the base material 13 by the heater wire 17 while the heater wire 17 is pressed against the base material 13 and embedded therein.
  • the part where the heater wire 17 is pressed and embedded in is softened by heat.
  • the heater wire 17 can be easily embedded in the base material 13 . Therefore, the drawing process of drawing a circuit pattern on the base material 13 with the heater wire 17 can be performed smoothly while the heater wire 17 is pressed against the base material 13 and embedded therein.
  • the drawing unit 22 may incorporate the joining unit 23 . That is, the joining unit 23 may be arranged inside the body case 24 of the drawing unit 22 . In this case, the joining unit 23 moves between a use position (position shown in FIG. 7) protruding from the lower end opening 24a of the main body case 24 and a non-use position (position shown in FIG. 8) raised from the use position. configured as possible.
  • the terminal forming step it is not always necessary to form the terminals 14 on the substrate 13 by insert molding.
  • - In the terminal forming step it is not always necessary to form the pair of terminals 14 at mutually different positions on the substrate 13 . That is, in the terminal forming step, only one terminal 14 may be formed on the substrate 13 .
  • the heater wire 17 on the base material 13 is not always pressed and embedded. It is not necessary to soften the part to be applied by heat.
  • the heater wire 17 may be embedded in the substrate 13 by half or more.
  • the second terminal 16 is connected to the terminal portion of the heater wire 17. 17b may be joined by heat.
  • the joining unit 23 includes a device that causes resistance heating of the heater wire 17 by energizing the heater wire 17, a spot heater that locally supplies hot air to heat, a device that heats by irradiating a laser, and an electromagnetic induction heating (Induction A device using IH spot reflow technology, which locally heats only the metal portion for soldering using heating), may also be used.
  • the cutting unit 27 may be configured by a device capable of burning off the heater wire 17 by causing the heater wire 17 to generate resistance heat by excessively energizing a portion of the heater wire 17 to be cut.
  • the heater circuit forming apparatus 20 may be configured such that the substrate 13, the drawing unit 22, and the joining unit 23 are movable relative to each other. That is, for example, when forming the heater circuit 12 on the surface 13a of the base material 13, the heater circuit forming apparatus 20 moves the base material 13 in the horizontal direction while the drawing unit 22 and the joining unit 23 are fixed. may In this case, the substrate 13 is horizontally moved via a stage 21 configured to be horizontally movable.
  • the base material 13 is not limited to a plate shape (planar shape), and may have a three-dimensional shape.
  • the wire is not limited to the heater wire 17 and may be, for example, a signal wire.
  • the wire circuit may be an electric circuit other than the heater circuit 12 .

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)

Abstract

La présente divulgation concerne un procédé de formation d'un circuit filaire qui comprend : une étape de formation de borne pour former une borne métallique (14) sur un substrat de résine synthétique (13) ; une étape de jonction pour utiliser la chaleur pour joindre une partie d'extrémité de pointe (17a) servant de point de départ d'un fil chauffant (17) à la borne (14) ; une étape de dessin pour dessiner un motif de circuit sur le substrat (13) à l'aide du fil chauffant (17), tout en pressant le fil chauffant (17) contre le substrat (13) pour incorporer le fil chauffant (17) dans le substrat (13) ; et une étape de découpe pour couper le fil chauffant (17) tout en laissant, sur le substrat (13), une partie du fil chauffant (17) à partir de la partie d'extrémité de pointe (17a) servant de point de départ à une partie (17b) de celui-ci servant de point d'extrémité.
PCT/JP2022/025703 2021-07-05 2022-06-28 Procédé de formation d'un circuit filaire WO2023282121A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-111499 2021-07-05
JP2021111499A JP2023008163A (ja) 2021-07-05 2021-07-05 ワイヤー回路の形成方法

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WO2023282121A1 true WO2023282121A1 (fr) 2023-01-12

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WO (1) WO2023282121A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04118985A (ja) * 1990-09-10 1992-04-20 Hitachi Chem Co Ltd 印刷配線板製造装置
JP2004039647A (ja) * 2003-08-20 2004-02-05 K-Tech Devices Corp 抵抗発熱体及びその製造方法
US20200009801A1 (en) * 2018-07-03 2020-01-09 Board Of Regents, The University Of Texas System Methods and apparatus for embedding a wire intermittently
JP2020047393A (ja) * 2018-09-14 2020-03-26 三菱重工業株式会社 接合用発熱回路、接合体、接合用発熱回路の製造方法及び接合方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04118985A (ja) * 1990-09-10 1992-04-20 Hitachi Chem Co Ltd 印刷配線板製造装置
JP2004039647A (ja) * 2003-08-20 2004-02-05 K-Tech Devices Corp 抵抗発熱体及びその製造方法
US20200009801A1 (en) * 2018-07-03 2020-01-09 Board Of Regents, The University Of Texas System Methods and apparatus for embedding a wire intermittently
JP2020047393A (ja) * 2018-09-14 2020-03-26 三菱重工業株式会社 接合用発熱回路、接合体、接合用発熱回路の製造方法及び接合方法

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