WO2023282121A1 - Method for forming wire circuit - Google Patents
Method for forming wire circuit Download PDFInfo
- Publication number
- WO2023282121A1 WO2023282121A1 PCT/JP2022/025703 JP2022025703W WO2023282121A1 WO 2023282121 A1 WO2023282121 A1 WO 2023282121A1 JP 2022025703 W JP2022025703 W JP 2022025703W WO 2023282121 A1 WO2023282121 A1 WO 2023282121A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wire
- base material
- heater wire
- forming
- terminal
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 238000005304 joining Methods 0.000 claims abstract description 26
- 238000005520 cutting process Methods 0.000 claims abstract description 20
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 11
- 239000000057 synthetic resin Substances 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 9
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 74
- 238000010438 heat treatment Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 235000021189 garnishes Nutrition 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
Definitions
- the present disclosure relates to a wire circuit forming method for forming a wire circuit on a synthetic resin base material.
- Patent Document 1 discloses forming or drawing a heater element (wire) on the back surface of an insulating film (base material).
- the insulating film is made of a synthetic resin material such as polycarbonate.
- the heater element is constructed from an electrically conductive material such as, for example, Nichrome wire.
- Patent Document 1 describes that printing, vapor deposition, sputtering, plating, etching, wire bonding, inkjet, dispenser, or the like is used for forming or drawing a heater element on an insulating film.
- a wire bonding method for example, is used to form the heater element on the insulating film, there are the following problems.
- the insulating film is made of general-purpose synthetic resin, if a heater element is formed on the insulating film using a wire bonding method that joins metals together, the insulating film will melt due to the large amount of heat generated by the wire bonding method. . Therefore, there is a problem that the heater element cannot be formed on the insulating film without thermally damaging the insulating film.
- a wire circuit forming method for solving the above problems is a wire circuit forming method for forming a wire circuit on a synthetic resin base material, comprising: a terminal forming step of forming a metal terminal on the base material; A joining step of thermally joining the end of the wire to the terminal, a drawing step of drawing a circuit pattern on the base material with the wire while pressing the wire against the base material and embedding it, and the wire. and a cutting step of cutting the wire while leaving the base material from the end portion serving as the starting point to the portion serving as the end point.
- FIG. 1 is a schematic plan view of a part of one embodiment.
- 2 is a cross-sectional view taken along line 2-2 of FIG. 1.
- FIG. 3 is a schematic side view showing a heater circuit forming apparatus for forming a heater circuit on a substrate.
- FIG. 4 is a schematic cross-sectional view showing the initial state when forming the heater circuit on the substrate.
- FIG. 5 is a schematic cross-sectional view showing a state in the middle of forming a heater circuit on a substrate.
- FIG. 6 is a schematic cross-sectional view showing the final state of forming the heater circuit on the substrate.
- FIG. 7 is a schematic side view showing a state in which the joining unit in the writing unit of the modification is at the use position.
- FIG. 8 is a schematic side view showing a state in which the joining unit in the writing unit of the modification is at the non-use position.
- the component 11 is used in general synthetic resin products requiring wire circuit formation. That is, the parts 11 are used for covers, emblems, garnishes, etc. that hide a millimeter-wave radar device and a LiDAR (Light Detection and Ranging) sensor in a vehicle and have a heater circuit 12 for snow melting as an example of a wire circuit. be done.
- the parts 11 are used for covers, emblems, garnishes, etc. that hide a millimeter-wave radar device and a LiDAR (Light Detection and Ranging) sensor in a vehicle and have a heater circuit 12 for snow melting as an example of a wire circuit. be done.
- LiDAR Light Detection and Ranging
- the component 11 includes a rectangular plate-shaped base material 13 made of synthetic resin, a pair of metal terminals 14 formed on the base material 13, and a pair of terminals 14 formed on the base material 13 and electrically connected to each other. and a heater circuit 12 connected to the One of the pair of terminals 14 is a first terminal 15 and the other is a second terminal 16 .
- the base material 13 can be composed of almost all synthetic resins.
- the base material 13 is made of, for example, general-purpose resins such as polyethylene terephthalate (PET), polypropylene (PP), and acrylonitrile-butadiene-styrene copolymer (ABS) resins, or engineering plastics such as polycarbonate (PC).
- general-purpose resins such as polyethylene terephthalate (PET), polypropylene (PP), and acrylonitrile-butadiene-styrene copolymer (ABS) resins
- ABS acrylonitrile-butadiene-styrene copolymer
- PC polycarbonate
- the heater circuit 12 is composed of a heater wire 17 as an example of a wire.
- the heater wire 17 is composed of, for example, a bare wire whose main material is copper or aluminum, an enamel wire, a magnet wire, or the like.
- a magnet wire is a wire whose main material is copper or aluminum and which has an insulating layer and a self-bonding layer.
- the pair of terminals 14 are both rectangular plate-shaped.
- the pair of terminals 14 are formed on the base material 13 by insert molding, for example.
- the pair of terminals 14 are arranged, for example, on the edge portion of the surface 13a of the substrate 13 so as to be flush with the surface 13a and at different positions apart from each other.
- the heater wire 17 is formed on the surface 13a of the substrate 13 so as to draw a preset circuit pattern. Both ends of the heater wire 17 are connected to the pair of terminals 14 respectively.
- about half of the heater wire 17 is embedded in the surface 13 a of the base material 13 . That is, about half of the heater wire 17 is buried in the base material 13 and about half of the remaining part is exposed from the base material 13 .
- the heater circuit forming apparatus 20 includes a rectangular plate-shaped stage 21 that supports the substrate 13, a drawing unit 22 that is arranged above the stage 21, and a bonding unit that is arranged above the stage 21.
- a unit 23 is provided.
- the stage 21 is configured to be able to fix the substrate 13 placed on its upper surface.
- the drawing unit 22 and the joining unit 23 are each supported by a robot arm (not shown). In other words, the drawing unit 22 and the joining unit 23 can be freely moved three-dimensionally by a robot arm (not shown).
- the drawing unit 22 has a cylindrical body case 24 extending in the vertical direction.
- the lower end of the main body case 24 is tapered such that the outer diameter becomes smaller toward the bottom.
- a delivery section 25 is provided in the body case 24 .
- the sending unit 25 takes in the heater wire 17 supplied from a heater wire supply device (not shown) into the main body case 24 from an opening formed in the side of the main body case 24 and feeds it from the lower end opening 24a of the main body case 24 to the base. It is delivered to the surface 13 a of the material 13 .
- a drawing section 26 and a cutting section 27 are provided at the lower end of the main body case 24 .
- the drawing unit 26 presses the heater wire 17 sent out from the lower end opening 24a of the main body case 24 to the surface 13a of the base material 13 by the sending unit 25 against the surface 13a of the base material 13, and heats the surface 13a of the base material 13 so that the surface 13a is softened. Heat is generated to bury the heater wire 17 into the surface 13 a of the substrate 13 .
- the drawing unit 26 is, for example, an ultrasonic vibration device having an ultrasonic horn that presses the heater wire 17 against the surface 13a of the substrate 13 while vibrating the heater wire 17 with ultrasonic waves in the vertical direction (direction perpendicular to the surface 13a of the substrate 13). Consists of In this case, the drawing unit 26 vibrates the heater wire 17 in the vertical direction by contacting the vibrating ultrasonic horn with the heater wire 17 , so that the substrate 13 is between the heater wire 17 and the surface 13 a of the substrate 13 . Frictional heat is generated at a relatively low temperature such that the surface 13a of the is softened.
- the cutting part 27 is configured by, for example, a cutting device that cuts the heater wire 17 with a cutting blade.
- the joining unit 23 joins the heater wire 17 to the terminal 14 by heat.
- the joining unit 23 is composed of, for example, an ultrasonic vibration device having an ultrasonic horn that presses the heater wire 17 against the terminal 14 while vibrating the heater wire 17 in the lateral direction (direction along the surface 13a of the substrate 13) with ultrasonic waves.
- the joining unit 23 laterally vibrates the heater wire 17 by contacting the heater wire 17 with a vibrating ultrasonic horn, so that the heater wire 17 and the terminal 14 are placed between the heater wire 17 and the terminal 14 . Frictional heat is generated at a relatively high temperature to the extent that the welding is performed.
- the first terminal 15 and the second terminal 15 are inserted into different positions on the edge of the surface 13a of the substrate 13 by insert molding.
- Two terminals 16 are formed (terminal forming step).
- the drawing unit 22 is moved to a position where the lower end opening 24a of the main body case 24 faces the initial position S.
- the initial position S is a position immediately beside the first terminal 15 on the surface 13 a of the base material 13 .
- the feeder 25 feeds the heater wire 17 from the lower end opening 24a of the main body case 24 to the initial position S on the surface 13a of the substrate 13 .
- the drawing unit 26 presses the tip of the heater wire 17 to the initial position S on the surface 13a of the substrate 13 and embeds it.
- the drawing unit 26 vibrates the heater wire 17 so that the surface 13a of the substrate 13 is relatively softened between the tip of the heater wire 17 and the initial position S of the surface 13a of the substrate 13. Generates low-temperature frictional heat. Therefore, the tip of the heater wire 17 is smoothly inserted into the initial position S on the surface 13a of the base material 13 and joined. Subsequently, as shown in FIG. 4, the drawing unit 22 is moved to the position where the lower end opening 24a of the main body case 24 faces the first terminal 15 on the surface 13a of the base material 13. move along.
- the heater wire 17 is sent out from the lower end opening 24a of the main body case 24 toward the surface 13a of the base material 13 by the sending part 25 as the drawing unit 22 moves along the surface 13a of the base material 13 . Subsequently, as shown in FIG. 5, when the drawing unit 22 crosses the position facing the first terminal 15, the joining unit 23 is placed at the position where the first terminal 15 overlaps the leading end portion 17a of the heater wire 17. move.
- the heater wire 17 and the first terminal 15 are welded between the heater wire 17 and the first terminal 15 by relatively high temperature frictional heat. generate As a result, the tip portion 17a, which is the starting point of the heater wire 17, and the first terminal 15 are welded. That is, the tip portion 17a, which is the starting point of the heater wire 17, is joined to the first terminal 15, which is one of the pair of terminals 14, by frictional heat (joining step). After performing this bonding step, the bonding unit 23 is retracted upward away from the surface 13 a of the base material 13 .
- the drawing unit 22 crossing the position facing the first terminal 15 is moved along the surface 13a of the substrate 13 so that the circuit pattern preset on the surface 13a of the substrate 13 is drawn by the heater wire 17. to move.
- the heater wires 17 sent out from the lower end opening 24a of the main body case 24 by the sending part 25 to the surface 13a of the base material 13 are sequentially pressed against the surface 13a of the base material 13 by the drawing part 26 and embedded therein.
- the circuit pattern is drawn on the surface 13a of the base material 13 with the heater wire 17 while the drawing unit 26 presses the heater wire 17 against the surface 13a of the base material 13 and embeds it (drawing step).
- the drawing unit 22 is moved to move the portion of the surface 13a of the substrate 13 into which the heater wire 17 is pressed and embedded, that is, the portion of the surface 13a of the substrate 13 where the circuit pattern is to be drawn. Along with this, they are softened by heat in sequence.
- the drawing unit 26 vibrates the heater wire 17 to generate frictional heat at a relatively low temperature between the heater wire 17 and the surface 13a of the base material 13 to soften the surface 13a of the base material 13.
- the drawing unit 26 vibrates the heater wire 17 to generate frictional heat at a relatively low temperature between the heater wire 17 and the surface 13a of the base material 13 to soften the surface 13a of the base material 13.
- the surface 13a of the base material 13 is softened. Therefore, the heater wire 17 is easily and smoothly embedded into the surface 13a of the base material 13 . Therefore, the drawing process is smoothly performed.
- the drawing unit 22 draws the circuit pattern on the surface 13a of the substrate 13 with the heater wires 17, the drawing unit 22 draws across the position facing the second terminal 16.
- the unit 22 is moved and stopped.
- the portion 17b of the heater wire 17 overlapping the second terminal 16 becomes the end point.
- the joining unit 23 is moved to a position where the end point 17b of the heater wire 17 and the second terminal 16 overlap.
- the heater wire 17 and the second terminal 16 are welded between the heater wire 17 and the second terminal 16 by relatively high temperature frictional heat. generate As a result, the end point 17b of the heater wire 17 and the second terminal 16 are welded. That is, the second terminal 16, which is the other of the pair of terminals 14, is joined to the end point 17b of the heater wire 17 by frictional heat.
- the bonding unit 23 is retracted upward and away from the surface 13a of the base material 13 .
- the heater wire 17 is cut by the cutting part 27 leaving the base material 13 from the leading end portion 17a to the terminal portion 17b of the heater wire 17 (cutting step). That is, in the cutting step, after the portion 17b serving as the end point of the heater wire 17 is joined to the second terminal 16 by heat, the portion from the tip portion 17a serving as the starting point of the heater wire 17 to the portion 17b serving as the end point of the heater wire 17 is left on the base material 13. to cut the heater wire 17. Thereby, the heater circuit 12 is formed on the surface 13a of the base material 13, and the component 11 described above is manufactured.
- the bonding (embedding) of the heater wire 17 to the surface 13a of the base material 13 and the bonding of the heater wire 17 to the pair of terminals 14 are combined into one work process. can be implemented as Therefore, the number of substantial work steps can be reduced.
- the method of forming the heater circuit 12 includes a terminal forming step of forming the metal terminal 14 on the base material 13, and a joining step of joining the tip portion 17a, which is the starting point of the heater wire 17, to the terminal 14 by frictional heat. a drawing step of drawing a circuit pattern on the base material 13 with the heater wire 17 while pressing the heater wire 17 against the base material 13 and embedding the heater wire 17 into the base material 13; and a cutting step of cutting the heater wire 17 while leaving the .
- the heater circuit 12 can be formed on the substrate 13 without thermally damaging the substrate 13 .
- the pair of terminals 14 are formed at mutually different positions on the substrate 13, and in the bonding step, one of the pair of terminals 14 is attached to the heater wire 17.
- the tip portion 17a serving as the starting point is joined by heat, and in the cutting step, after joining the portion 17b serving as the end point of the heater wire 17 to the other of the pair of terminals 14 by heat, the tip portion serving as the starting point of the heater wire 17 is joined.
- the heater wire 17 is cut leaving the base material 13 from 17a to the end point 17b.
- the heater circuit 12 connecting the pair of terminals 14 with the heater wire 17 can be formed on the base material 13 without thermally damaging the base material 13 .
- the circuit pattern is drawn on the base material 13 by the heater wire 17 while the heater wire 17 is pressed against the base material 13 and embedded therein.
- the part where the heater wire 17 is pressed and embedded in is softened by heat.
- the heater wire 17 can be easily embedded in the base material 13 . Therefore, the drawing process of drawing a circuit pattern on the base material 13 with the heater wire 17 can be performed smoothly while the heater wire 17 is pressed against the base material 13 and embedded therein.
- the drawing unit 22 may incorporate the joining unit 23 . That is, the joining unit 23 may be arranged inside the body case 24 of the drawing unit 22 . In this case, the joining unit 23 moves between a use position (position shown in FIG. 7) protruding from the lower end opening 24a of the main body case 24 and a non-use position (position shown in FIG. 8) raised from the use position. configured as possible.
- the terminal forming step it is not always necessary to form the terminals 14 on the substrate 13 by insert molding.
- - In the terminal forming step it is not always necessary to form the pair of terminals 14 at mutually different positions on the substrate 13 . That is, in the terminal forming step, only one terminal 14 may be formed on the substrate 13 .
- the heater wire 17 on the base material 13 is not always pressed and embedded. It is not necessary to soften the part to be applied by heat.
- the heater wire 17 may be embedded in the substrate 13 by half or more.
- the second terminal 16 is connected to the terminal portion of the heater wire 17. 17b may be joined by heat.
- the joining unit 23 includes a device that causes resistance heating of the heater wire 17 by energizing the heater wire 17, a spot heater that locally supplies hot air to heat, a device that heats by irradiating a laser, and an electromagnetic induction heating (Induction A device using IH spot reflow technology, which locally heats only the metal portion for soldering using heating), may also be used.
- the cutting unit 27 may be configured by a device capable of burning off the heater wire 17 by causing the heater wire 17 to generate resistance heat by excessively energizing a portion of the heater wire 17 to be cut.
- the heater circuit forming apparatus 20 may be configured such that the substrate 13, the drawing unit 22, and the joining unit 23 are movable relative to each other. That is, for example, when forming the heater circuit 12 on the surface 13a of the base material 13, the heater circuit forming apparatus 20 moves the base material 13 in the horizontal direction while the drawing unit 22 and the joining unit 23 are fixed. may In this case, the substrate 13 is horizontally moved via a stage 21 configured to be horizontally movable.
- the base material 13 is not limited to a plate shape (planar shape), and may have a three-dimensional shape.
- the wire is not limited to the heater wire 17 and may be, for example, a signal wire.
- the wire circuit may be an electric circuit other than the heater circuit 12 .
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
This method for forming a wire circuit includes: a terminal forming step for forming a metal terminal (14) on a synthetic resin substrate (13); a joining step for employing heat to join a tip end portion (17a) serving as a starting point of a heater wire (17) to the terminal (14); a drawing step for drawing a circuit pattern on the substrate (13) using the heater wire (17), while pressing the heater wire (17) against the substrate (13) to embed the heater wire (17) in the substrate (13); and a cutting step for cutting the heater wire (17) while leaving, on the substrate (13), a part of the heater wire (17) from the tip end portion (17a) serving as the starting point to a part (17b) thereof serving as an end point.
Description
本開示は、合成樹脂製の基材にワイヤー回路を形成するワイヤー回路の形成方法に関する。
The present disclosure relates to a wire circuit forming method for forming a wire circuit on a synthetic resin base material.
従来、この種のワイヤー回路の形成方法として、例えば特許文献1に記載されたものが知られている。この特許文献1には、絶縁フィルム(基材)の背面にヒーターエレメント(ワイヤー)を形成または描画することが開示されている。絶縁フィルムは、例えばポリカーボネートなどの合成樹脂材料によって構成される。ヒーターエレメントは、例えばニクロム線などの導電性材料によって構成される。
Conventionally, as a method for forming this type of wire circuit, for example, the method described in Patent Document 1 is known. This patent document 1 discloses forming or drawing a heater element (wire) on the back surface of an insulating film (base material). The insulating film is made of a synthetic resin material such as polycarbonate. The heater element is constructed from an electrically conductive material such as, for example, Nichrome wire.
ところで、上述の特許文献1では、絶縁フィルムへのヒーターエレメントの形成または描画には、印刷、蒸着、スパッタ、メッキ、エッチング、ワイヤーボンディング、インクジェット、又はディスペンサー等を用いることが記載されている。しかしながら、絶縁フィルムへのヒーターエレメントの形成に、例えばワイヤーボンディング工法を用いた場合、次のような問題がある。
By the way, the above-mentioned Patent Document 1 describes that printing, vapor deposition, sputtering, plating, etching, wire bonding, inkjet, dispenser, or the like is used for forming or drawing a heater element on an insulating film. However, when a wire bonding method, for example, is used to form the heater element on the insulating film, there are the following problems.
すなわち、絶縁フィルムは汎用性の合成樹脂製であるため、金属同士を接合するワイヤーボンディング工法を用いて絶縁フィルムにヒーターエレメントを形成すると、ワイヤーボンディング工法で発生する大きな熱量によって絶縁フィルムが溶けてしまう。このため、絶縁フィルムに対して熱によるダメージを与えることなく絶縁フィルムにヒーターエレメントを形成することができないという問題がある。
In other words, since the insulating film is made of general-purpose synthetic resin, if a heater element is formed on the insulating film using a wire bonding method that joins metals together, the insulating film will melt due to the large amount of heat generated by the wire bonding method. . Therefore, there is a problem that the heater element cannot be formed on the insulating film without thermally damaging the insulating film.
上記課題を解決するワイヤー回路の形成方法は、合成樹脂製の基材にワイヤー回路を形成するワイヤー回路の形成方法であって、前記基材に金属製の端子を形成する端子形成工程と、前記端子にワイヤーにおける始点となる端部を熱によって接合する接合工程と、前記ワイヤーを前記基材に押し付けてめり込ませながら前記ワイヤーで前記基材に回路パターンを描画する描画工程と、前記ワイヤーにおける前記始点となる前記端部から終点となる部位までを前記基材に残して前記ワイヤーを切断する切断工程と、を備える。
A wire circuit forming method for solving the above problems is a wire circuit forming method for forming a wire circuit on a synthetic resin base material, comprising: a terminal forming step of forming a metal terminal on the base material; A joining step of thermally joining the end of the wire to the terminal, a drawing step of drawing a circuit pattern on the base material with the wire while pressing the wire against the base material and embedding it, and the wire. and a cutting step of cutting the wire while leaving the base material from the end portion serving as the starting point to the portion serving as the end point.
以下、ワイヤー回路の形成方法をヒーター回路の形成方法に具体化した一実施形態を図面に従って説明する。
図1及び図2に示すように、部品11は、ワイヤー回路形成を必要とする合成樹脂製品全般に用いられる。すなわち、部品11は、例えば車両におけるミリ波レーダー装置及びLiDAR(Light Detection and Ranging)センサーなどを隠すとともにワイヤー回路の一例としての融雪用のヒーター回路12を有したカバー、エンブレム、及びガーニッシュなどに用いられる。 An embodiment in which the method of forming the wire circuit is embodied in the method of forming the heater circuit will be described below with reference to the drawings.
As shown in FIGS. 1 and 2, thecomponent 11 is used in general synthetic resin products requiring wire circuit formation. That is, the parts 11 are used for covers, emblems, garnishes, etc. that hide a millimeter-wave radar device and a LiDAR (Light Detection and Ranging) sensor in a vehicle and have a heater circuit 12 for snow melting as an example of a wire circuit. be done.
図1及び図2に示すように、部品11は、ワイヤー回路形成を必要とする合成樹脂製品全般に用いられる。すなわち、部品11は、例えば車両におけるミリ波レーダー装置及びLiDAR(Light Detection and Ranging)センサーなどを隠すとともにワイヤー回路の一例としての融雪用のヒーター回路12を有したカバー、エンブレム、及びガーニッシュなどに用いられる。 An embodiment in which the method of forming the wire circuit is embodied in the method of forming the heater circuit will be described below with reference to the drawings.
As shown in FIGS. 1 and 2, the
部品11は、矩形板状をなす合成樹脂製の基材13と、基材13に形成された一対の金属製の端子14と、基材13に形成されるとともに一対の端子14同士を電気的に接続するヒーター回路12とを備えている。一対の端子14のうち、一方は第1端子15とされ、他方は第2端子16とされている。
The component 11 includes a rectangular plate-shaped base material 13 made of synthetic resin, a pair of metal terminals 14 formed on the base material 13, and a pair of terminals 14 formed on the base material 13 and electrically connected to each other. and a heater circuit 12 connected to the One of the pair of terminals 14 is a first terminal 15 and the other is a second terminal 16 .
基材13は、ほぼ全ての合成樹脂によって構成することができる。基材13は、例えば、ポリエチレンテレフタレート(PET)、ポリプロピレン(PP)、及びアクリロニトリル-ブタジエン-スチレン共重合(ABS)樹脂などの汎用樹脂、あるいはポリカーボネート(PC)などのエンジニアリングプラスチックなどによって構成される。
The base material 13 can be composed of almost all synthetic resins. The base material 13 is made of, for example, general-purpose resins such as polyethylene terephthalate (PET), polypropylene (PP), and acrylonitrile-butadiene-styrene copolymer (ABS) resins, or engineering plastics such as polycarbonate (PC).
ヒーター回路12は、ワイヤーの一例としてのヒーター線17によって構成されている。ヒーター線17は、例えば、銅やアルミニウムなどを主材とする裸線、エナメル線、及びマグネットワイヤーなどによって構成される。マグネットワイヤーは、銅もしくはアルミニウムを主材としたワイヤーであって且つ絶縁層及び自己融着層を有したワイヤーである。
The heater circuit 12 is composed of a heater wire 17 as an example of a wire. The heater wire 17 is composed of, for example, a bare wire whose main material is copper or aluminum, an enamel wire, a magnet wire, or the like. A magnet wire is a wire whose main material is copper or aluminum and which has an insulating layer and a self-bonding layer.
一対の端子14は、共に矩形板状をなしている。一対の端子14は、基材13に対して例えばインサート成型によって形成される。一対の端子14は、例えば基材13の表面13aにおける端縁部に、表面13aと面一になるとともに互いに離れて異なる位置に配置されている。ヒーター線17は、基材13の表面13aに予め設定された回路パターンを描くように延びて形成されている。ヒーター線17の両端部は、一対の端子14に対してそれぞれ接続されている。
The pair of terminals 14 are both rectangular plate-shaped. The pair of terminals 14 are formed on the base material 13 by insert molding, for example. The pair of terminals 14 are arranged, for example, on the edge portion of the surface 13a of the substrate 13 so as to be flush with the surface 13a and at different positions apart from each other. The heater wire 17 is formed on the surface 13a of the substrate 13 so as to draw a preset circuit pattern. Both ends of the heater wire 17 are connected to the pair of terminals 14 respectively.
この場合、ヒーター線17は、基材13の表面13aに半分程度がめり込んだ状態になっている。すなわち、ヒーター線17は、基材13に対して半分程度が埋まるとともに、残りの半分程度が基材13から露出した状態になっている。
In this case, about half of the heater wire 17 is embedded in the surface 13 a of the base material 13 . That is, about half of the heater wire 17 is buried in the base material 13 and about half of the remaining part is exposed from the base material 13 .
次に、一対の端子14が形成された基材13の表面13aにヒーター回路12を形成するためのヒーター回路形成装置20について説明する。
図3に示すように、ヒーター回路形成装置20は、基材13を支持する矩形板状のステージ21と、ステージ21の上方に配置された描画ユニット22と、ステージ21の上方に配置された接合ユニット23とを備えている。ステージ21は、その上面に載置される基材13を固定可能に構成されている。描画ユニット22及び接合ユニット23は、それぞれロボットアーム(図示略)によって支持されている。すなわち、描画ユニット22及び接合ユニット23は、それぞれロボットアーム(図示略)によって三次元的に自在に移動されるようになっている。 Next, a heatercircuit forming apparatus 20 for forming the heater circuit 12 on the surface 13a of the substrate 13 on which the pair of terminals 14 are formed will be described.
As shown in FIG. 3, the heatercircuit forming apparatus 20 includes a rectangular plate-shaped stage 21 that supports the substrate 13, a drawing unit 22 that is arranged above the stage 21, and a bonding unit that is arranged above the stage 21. A unit 23 is provided. The stage 21 is configured to be able to fix the substrate 13 placed on its upper surface. The drawing unit 22 and the joining unit 23 are each supported by a robot arm (not shown). In other words, the drawing unit 22 and the joining unit 23 can be freely moved three-dimensionally by a robot arm (not shown).
図3に示すように、ヒーター回路形成装置20は、基材13を支持する矩形板状のステージ21と、ステージ21の上方に配置された描画ユニット22と、ステージ21の上方に配置された接合ユニット23とを備えている。ステージ21は、その上面に載置される基材13を固定可能に構成されている。描画ユニット22及び接合ユニット23は、それぞれロボットアーム(図示略)によって支持されている。すなわち、描画ユニット22及び接合ユニット23は、それぞれロボットアーム(図示略)によって三次元的に自在に移動されるようになっている。 Next, a heater
As shown in FIG. 3, the heater
描画ユニット22は、鉛直方向に延びる筒状の本体ケース24を備えている。本体ケース24の下端部は、下方に向かうほど外径が小さくなるテーパー状をなしている。本体ケース24には、送出部25が設けられている。送出部25は、ヒーター線供給装置(図示略)から供給されるヒーター線17を本体ケース24の側部に形成された開口から本体ケース24の内部に取り込んで本体ケース24の下端開口24aから基材13の表面13aへ送り出す。
The drawing unit 22 has a cylindrical body case 24 extending in the vertical direction. The lower end of the main body case 24 is tapered such that the outer diameter becomes smaller toward the bottom. A delivery section 25 is provided in the body case 24 . The sending unit 25 takes in the heater wire 17 supplied from a heater wire supply device (not shown) into the main body case 24 from an opening formed in the side of the main body case 24 and feeds it from the lower end opening 24a of the main body case 24 to the base. It is delivered to the surface 13 a of the material 13 .
本体ケース24の下端部には、描画部26及び切断部27が設けられている。描画部26は、送出部25によって本体ケース24の下端開口24aから基材13の表面13aへ送り出されるヒーター線17を基材13の表面13aに押し付けながら基材13の表面13aが軟化する程度の熱を発生させてヒーター線17を基材13の表面13aにめり込ませる。
A drawing section 26 and a cutting section 27 are provided at the lower end of the main body case 24 . The drawing unit 26 presses the heater wire 17 sent out from the lower end opening 24a of the main body case 24 to the surface 13a of the base material 13 by the sending unit 25 against the surface 13a of the base material 13, and heats the surface 13a of the base material 13 so that the surface 13a is softened. Heat is generated to bury the heater wire 17 into the surface 13 a of the substrate 13 .
描画部26は、例えば、ヒーター線17を超音波によって縦方向(基材13の表面13aと直交する方向)に振動させながら基材13の表面13aに押し付ける超音波ホーンを有した超音波振動装置によって構成される。この場合、描画部26は、振動する超音波ホーンのヒーター線17への接触によってヒーター線17を縦方向に振動させることで、ヒーター線17と基材13の表面13aとの間に基材13の表面13aが軟化する程度の比較的低い温度の摩擦熱を発生させる。切断部27は、例えば、ヒーター線17を切断刃によって切断する切断装置によって構成される。
The drawing unit 26 is, for example, an ultrasonic vibration device having an ultrasonic horn that presses the heater wire 17 against the surface 13a of the substrate 13 while vibrating the heater wire 17 with ultrasonic waves in the vertical direction (direction perpendicular to the surface 13a of the substrate 13). Consists of In this case, the drawing unit 26 vibrates the heater wire 17 in the vertical direction by contacting the vibrating ultrasonic horn with the heater wire 17 , so that the substrate 13 is between the heater wire 17 and the surface 13 a of the substrate 13 . Frictional heat is generated at a relatively low temperature such that the surface 13a of the is softened. The cutting part 27 is configured by, for example, a cutting device that cuts the heater wire 17 with a cutting blade.
接合ユニット23は、ヒーター線17を端子14に熱によって接合するものである。接合ユニット23は、例えば、ヒーター線17を超音波によって横方向(基材13の表面13aに沿う方向)に振動させながら端子14に押し付ける超音波ホーンを有した超音波振動装置によって構成される。この場合、接合ユニット23は、振動する超音波ホーンのヒーター線17への接触によってヒーター線17を横方向に振動させることで、ヒーター線17と端子14との間にヒーター線17と端子14とが溶接される程度の比較的高い温度の摩擦熱を発生させる。
The joining unit 23 joins the heater wire 17 to the terminal 14 by heat. The joining unit 23 is composed of, for example, an ultrasonic vibration device having an ultrasonic horn that presses the heater wire 17 against the terminal 14 while vibrating the heater wire 17 in the lateral direction (direction along the surface 13a of the substrate 13) with ultrasonic waves. In this case, the joining unit 23 laterally vibrates the heater wire 17 by contacting the heater wire 17 with a vibrating ultrasonic horn, so that the heater wire 17 and the terminal 14 are placed between the heater wire 17 and the terminal 14 . Frictional heat is generated at a relatively high temperature to the extent that the welding is performed.
次に、上記した部品11を製造するべく、基材13の表面13aにヒーター回路12を形成する方法について説明する。
図3に示すように、基材13の表面13aにヒーター回路12を形成する場合には、まず、基材13の表面13aの端縁部における互いに異なる位置にインサート成型によって第1端子15及び第2端子16を形成する(端子形成工程)。続いて、描画ユニット22を、本体ケース24の下端開口24aが初期位置Sと対向する位置に移動させる。初期位置Sは、基材13の表面13aにおける第1端子15の直ぐ横の位置である。 Next, a method for forming theheater circuit 12 on the surface 13a of the substrate 13 in order to manufacture the component 11 described above will be described.
As shown in FIG. 3, when forming theheater circuit 12 on the surface 13a of the substrate 13, first, the first terminal 15 and the second terminal 15 are inserted into different positions on the edge of the surface 13a of the substrate 13 by insert molding. Two terminals 16 are formed (terminal forming step). Subsequently, the drawing unit 22 is moved to a position where the lower end opening 24a of the main body case 24 faces the initial position S. Then, as shown in FIG. The initial position S is a position immediately beside the first terminal 15 on the surface 13 a of the base material 13 .
図3に示すように、基材13の表面13aにヒーター回路12を形成する場合には、まず、基材13の表面13aの端縁部における互いに異なる位置にインサート成型によって第1端子15及び第2端子16を形成する(端子形成工程)。続いて、描画ユニット22を、本体ケース24の下端開口24aが初期位置Sと対向する位置に移動させる。初期位置Sは、基材13の表面13aにおける第1端子15の直ぐ横の位置である。 Next, a method for forming the
As shown in FIG. 3, when forming the
続いて、送出部25により本体ケース24の下端開口24aから基材13の表面13aにおける初期位置Sへヒーター線17を送り出す。ヒーター線17の先端が基材13の表面13aにおける初期位置Sに接触したら、描画部26によりヒーター線17の先端を基材13の表面13aにおける初期位置Sに押し付けてめり込ませる。
Subsequently, the feeder 25 feeds the heater wire 17 from the lower end opening 24a of the main body case 24 to the initial position S on the surface 13a of the substrate 13 . When the tip of the heater wire 17 comes into contact with the initial position S on the surface 13a of the substrate 13, the drawing unit 26 presses the tip of the heater wire 17 to the initial position S on the surface 13a of the substrate 13 and embeds it.
このとき、描画部26は、ヒーター線17を振動させることで、ヒーター線17の先端と基材13の表面13aの初期位置Sとの間に基材13の表面13aが軟化する程度の比較的低い温度の摩擦熱を発生させる。このため、ヒーター線17の先端は、基材13の表面13aにおける初期位置Sに円滑にめり込んで接合される。続いて、図4に示すように、描画ユニット22を、本体ケース24の下端開口24aが基材13の表面13aにおける第1端子15と対向する位置に移動するように、基材13の表面13aに沿って移動させる。
At this time, the drawing unit 26 vibrates the heater wire 17 so that the surface 13a of the substrate 13 is relatively softened between the tip of the heater wire 17 and the initial position S of the surface 13a of the substrate 13. Generates low-temperature frictional heat. Therefore, the tip of the heater wire 17 is smoothly inserted into the initial position S on the surface 13a of the base material 13 and joined. Subsequently, as shown in FIG. 4, the drawing unit 22 is moved to the position where the lower end opening 24a of the main body case 24 faces the first terminal 15 on the surface 13a of the base material 13. move along.
ヒーター線17は、描画ユニット22の基材13の表面13aに沿う移動に伴って、送出部25により本体ケース24の下端開口24aから基材13の表面13aに向けて送り出される。続いて、図5に示すように、描画ユニット22が第1端子15と対向する位置を横切ったら、ヒーター線17における始点となる先端部17aと第1端子15とが重なる位置に接合ユニット23を移動させる。
The heater wire 17 is sent out from the lower end opening 24a of the main body case 24 toward the surface 13a of the base material 13 by the sending part 25 as the drawing unit 22 moves along the surface 13a of the base material 13 . Subsequently, as shown in FIG. 5, when the drawing unit 22 crosses the position facing the first terminal 15, the joining unit 23 is placed at the position where the first terminal 15 overlaps the leading end portion 17a of the heater wire 17. move.
続いて、接合ユニット23によりヒーター線17を振動させることで、ヒーター線17と第1端子15との間にヒーター線17と第1端子15とが溶接される程度の比較的高い温度の摩擦熱を発生させる。これにより、ヒーター線17における始点となる先端部17aと第1端子15とが溶接される。すなわち、一対の端子14のうちの一方である第1端子15にヒーター線17における始点となる先端部17aを摩擦熱によって接合する(接合工程)。この接合工程を行った後は、接合ユニット23を基材13の表面13aから上方へ離れるように退避させる。
Subsequently, by vibrating the heater wire 17 by the joining unit 23, the heater wire 17 and the first terminal 15 are welded between the heater wire 17 and the first terminal 15 by relatively high temperature frictional heat. generate As a result, the tip portion 17a, which is the starting point of the heater wire 17, and the first terminal 15 are welded. That is, the tip portion 17a, which is the starting point of the heater wire 17, is joined to the first terminal 15, which is one of the pair of terminals 14, by frictional heat (joining step). After performing this bonding step, the bonding unit 23 is retracted upward away from the surface 13 a of the base material 13 .
引き続き、第1端子15と対向する位置を横切った描画ユニット22を、ヒーター線17によって基材13の表面13aに予め設定された回路パターンが描画されるように、基材13の表面13aに沿って移動させる。このとき、送出部25により本体ケース24の下端開口24aから基材13の表面13aに送り出されるヒーター線17を、描画部26により順次に基材13の表面13aに押し付けてめり込ませる。
Subsequently, the drawing unit 22 crossing the position facing the first terminal 15 is moved along the surface 13a of the substrate 13 so that the circuit pattern preset on the surface 13a of the substrate 13 is drawn by the heater wire 17. to move. At this time, the heater wires 17 sent out from the lower end opening 24a of the main body case 24 by the sending part 25 to the surface 13a of the base material 13 are sequentially pressed against the surface 13a of the base material 13 by the drawing part 26 and embedded therein.
すなわち、描画部26によりヒーター線17を基材13の表面13aに押し付けてめり込ませながらヒーター線17で基材13の表面13aに上記回路パターンを描画する(描画工程)。これと同時に、描画工程では、基材13の表面13aにおけるヒーター線17を押し付けてめり込ませる部分、すなわち基材13の表面13aにおける上記回路パターンを描画する部分を、描画ユニット22の移動に伴って順次に熱によって軟化させる。
That is, the circuit pattern is drawn on the surface 13a of the base material 13 with the heater wire 17 while the drawing unit 26 presses the heater wire 17 against the surface 13a of the base material 13 and embeds it (drawing step). At the same time, in the drawing process, the drawing unit 22 is moved to move the portion of the surface 13a of the substrate 13 into which the heater wire 17 is pressed and embedded, that is, the portion of the surface 13a of the substrate 13 where the circuit pattern is to be drawn. Along with this, they are softened by heat in sequence.
この場合、描画部26は、ヒーター線17を振動させることで、ヒーター線17と基材13の表面13aとの間に基材13の表面13aが軟化する程度の比較的低い温度の摩擦熱を発生させることで、基材13の表面13aを軟化させる。このため、ヒーター線17は、基材13の表面13aに容易且つ円滑にめり込む。したがって、描画工程が円滑に行われる。
In this case, the drawing unit 26 vibrates the heater wire 17 to generate frictional heat at a relatively low temperature between the heater wire 17 and the surface 13a of the base material 13 to soften the surface 13a of the base material 13. By generating it, the surface 13a of the base material 13 is softened. Therefore, the heater wire 17 is easily and smoothly embedded into the surface 13a of the base material 13 . Therefore, the drawing process is smoothly performed.
そして、図6に示すように、描画ユニット22により基材13の表面13aにヒーター線17で上記回路パターンを描画した後には、描画ユニット22が第2端子16と対向する位置を横切るように描画ユニット22を移動させて停止させる。このとき、ヒーター線17における第2端子16と重なる部位17bは終点となる。続いて、ヒーター線17における終点となる部位17bと第2端子16とが重なる位置に接合ユニット23を移動させる。
Then, as shown in FIG. 6, after the drawing unit 22 draws the circuit pattern on the surface 13a of the substrate 13 with the heater wires 17, the drawing unit 22 draws across the position facing the second terminal 16. The unit 22 is moved and stopped. At this time, the portion 17b of the heater wire 17 overlapping the second terminal 16 becomes the end point. Subsequently, the joining unit 23 is moved to a position where the end point 17b of the heater wire 17 and the second terminal 16 overlap.
続いて、接合ユニット23によりヒーター線17を振動させることで、ヒーター線17と第2端子16との間にヒーター線17と第2端子16とが溶接される程度の比較的高い温度の摩擦熱を発生させる。これにより、ヒーター線17における終点となる部位17bと第2端子16とが溶接される。すなわち、一対の端子14のうちの他方である第2端子16にヒーター線17における終点となる部位17bを摩擦熱によって接合する。
Subsequently, by vibrating the heater wire 17 by the joining unit 23, the heater wire 17 and the second terminal 16 are welded between the heater wire 17 and the second terminal 16 by relatively high temperature frictional heat. generate As a result, the end point 17b of the heater wire 17 and the second terminal 16 are welded. That is, the second terminal 16, which is the other of the pair of terminals 14, is joined to the end point 17b of the heater wire 17 by frictional heat.
この接合を行った後は、接合ユニット23を基材13の表面13aから上方へ離れるように退避させる。その後、切断部27により、ヒーター線17における始点となる先端部17aから終点となる部位17bまでを基材13に残してヒーター線17を切断する(切断工程)。つまり、切断工程では、第2端子16にヒーター線17における終点となる部位17bを熱によって接合した後、ヒーター線17における始点となる先端部17aから終点となる部位17bまでを基材13に残してヒーター線17を切断する。これにより、基材13の表面13aにヒーター回路12を形成されて上記した部品11が製造される。
After performing this bonding, the bonding unit 23 is retracted upward and away from the surface 13a of the base material 13 . After that, the heater wire 17 is cut by the cutting part 27 leaving the base material 13 from the leading end portion 17a to the terminal portion 17b of the heater wire 17 (cutting step). That is, in the cutting step, after the portion 17b serving as the end point of the heater wire 17 is joined to the second terminal 16 by heat, the portion from the tip portion 17a serving as the starting point of the heater wire 17 to the portion 17b serving as the end point of the heater wire 17 is left on the base material 13. to cut the heater wire 17. Thereby, the heater circuit 12 is formed on the surface 13a of the base material 13, and the component 11 described above is manufactured.
このように、本実施形態のヒーター回路12の形成方法では、基材13の表面13aに対するヒーター線17の接合(埋め込み)と、一対の端子14に対するヒーター線17の接合とを、一つの作業工程として実施できる。このため、実質的な作業工程の数を低減できる。
As described above, in the method of forming the heater circuit 12 of the present embodiment, the bonding (embedding) of the heater wire 17 to the surface 13a of the base material 13 and the bonding of the heater wire 17 to the pair of terminals 14 are combined into one work process. can be implemented as Therefore, the number of substantial work steps can be reduced.
以上詳述した実施形態によれば、次のような効果が発揮される。
(1)ヒーター回路12の形成方法は、基材13に金属製の端子14を形成する端子形成工程と、端子14にヒーター線17における始点となる先端部17aを摩擦熱によって接合する接合工程と、ヒーター線17を基材13に押し付けてめり込ませながらヒーター線17で基材13に回路パターンを描画する描画工程と、ヒーター線17における始点となる先端部17aから終点となる部位17bまでを基材13に残してヒーター線17を切断する切断工程と、を備えている。 According to the embodiment detailed above, the following effects are exhibited.
(1) The method of forming theheater circuit 12 includes a terminal forming step of forming the metal terminal 14 on the base material 13, and a joining step of joining the tip portion 17a, which is the starting point of the heater wire 17, to the terminal 14 by frictional heat. a drawing step of drawing a circuit pattern on the base material 13 with the heater wire 17 while pressing the heater wire 17 against the base material 13 and embedding the heater wire 17 into the base material 13; and a cutting step of cutting the heater wire 17 while leaving the .
(1)ヒーター回路12の形成方法は、基材13に金属製の端子14を形成する端子形成工程と、端子14にヒーター線17における始点となる先端部17aを摩擦熱によって接合する接合工程と、ヒーター線17を基材13に押し付けてめり込ませながらヒーター線17で基材13に回路パターンを描画する描画工程と、ヒーター線17における始点となる先端部17aから終点となる部位17bまでを基材13に残してヒーター線17を切断する切断工程と、を備えている。 According to the embodiment detailed above, the following effects are exhibited.
(1) The method of forming the
この構成によれば、金属製の端子14にヒーター線17における始点となる先端部17aを熱によって接合する際に、当該熱が直接的に合成樹脂製の基材13に加わらないので、当該基材13に加わる熱を効果的に低減できる。このため、基材13に対して熱によるダメージを与えることなく基材13にヒーター回路12を形成することができる。
According to this configuration, when the tip portion 17a, which is the starting point of the heater wire 17, is joined to the metal terminal 14 by heat, the heat is not directly applied to the synthetic resin base material 13. The heat applied to the material 13 can be effectively reduced. Therefore, the heater circuit 12 can be formed on the substrate 13 without thermally damaging the substrate 13 .
(2)上記ヒーター回路12の形成方法において、端子形成工程では、基材13における互いに異なる位置に一対の端子14を形成し、接合工程では、一対の端子14のうちの一方にヒーター線17における始点となる先端部17aを熱によって接合し、切断工程では、一対の端子14のうちの他方にヒーター線17における終点となる部位17bを熱によって接合した後、ヒーター線17における始点となる先端部17aから終点となる部位17bまでを基材13に残してヒーター線17を切断する。
(2) In the method for forming the heater circuit 12, in the terminal forming step, the pair of terminals 14 are formed at mutually different positions on the substrate 13, and in the bonding step, one of the pair of terminals 14 is attached to the heater wire 17. The tip portion 17a serving as the starting point is joined by heat, and in the cutting step, after joining the portion 17b serving as the end point of the heater wire 17 to the other of the pair of terminals 14 by heat, the tip portion serving as the starting point of the heater wire 17 is joined. The heater wire 17 is cut leaving the base material 13 from 17a to the end point 17b.
この構成によれば、金属製の一対の端子14にヒーター線17における始点及び終点を熱によってそれぞれ接合する際に、当該熱が直接的に合成樹脂製の基材13に加わらないので、当該基材13に加わる熱を効果的に低減できる。したがって、一対の端子14をヒーター線17で接続するヒーター回路12を、基材13に対して熱によるダメージを与えることなく基材13に形成することができる。
According to this configuration, when the starting point and the end point of the heater wire 17 are respectively joined to the pair of metal terminals 14 by heat, the heat is not directly applied to the synthetic resin base material 13, so that the base material The heat applied to the material 13 can be effectively reduced. Therefore, the heater circuit 12 connecting the pair of terminals 14 with the heater wire 17 can be formed on the base material 13 without thermally damaging the base material 13 .
(3)上記ヒーター回路12の形成方法において、描画工程では、ヒーター線17を基材13に押し付けてめり込ませながらヒーター線17で基材13に回路パターンを描画する際に、基材13におけるヒーター線17を押し付けてめり込ませる部分を熱によって軟化させる。
(3) In the method of forming the heater circuit 12 described above, in the drawing step, the circuit pattern is drawn on the base material 13 by the heater wire 17 while the heater wire 17 is pressed against the base material 13 and embedded therein. The part where the heater wire 17 is pressed and embedded in is softened by heat.
この構成によれば、ヒーター線17を基材13に対して容易にめり込ませることができる。このため、ヒーター線17を基材13に押し付けてめり込ませながらヒーター線17で基材13に回路パターンを描画する描画工程を円滑に行うことができる。
With this configuration, the heater wire 17 can be easily embedded in the base material 13 . Therefore, the drawing process of drawing a circuit pattern on the base material 13 with the heater wire 17 can be performed smoothly while the heater wire 17 is pressed against the base material 13 and embedded therein.
(変更例)
上記実施形態は、以下のように変更して実施することができる。また、上記実施形態及び以下の変更例は、技術的に矛盾しない範囲で互いに組み合わせて実施することができる。 (Change example)
The above embodiment can be implemented with the following modifications. Moreover, the above embodiments and the following modified examples can be implemented in combination with each other within a technically consistent range.
上記実施形態は、以下のように変更して実施することができる。また、上記実施形態及び以下の変更例は、技術的に矛盾しない範囲で互いに組み合わせて実施することができる。 (Change example)
The above embodiment can be implemented with the following modifications. Moreover, the above embodiments and the following modified examples can be implemented in combination with each other within a technically consistent range.
・図7及び図8に示すように、描画ユニット22に接合ユニット23を内蔵するようにしてもよい。すなわち、描画ユニット22の本体ケース24内に接合ユニット23を配置するようにしてもよい。この場合、接合ユニット23は、本体ケース24の下端開口24aから突出する使用位置(図7に示す位置)と、使用位置から上昇させた非使用位置(図8に示す位置)との間で移動可能に構成される。
· As shown in FIGS. 7 and 8, the drawing unit 22 may incorporate the joining unit 23 . That is, the joining unit 23 may be arranged inside the body case 24 of the drawing unit 22 . In this case, the joining unit 23 moves between a use position (position shown in FIG. 7) protruding from the lower end opening 24a of the main body case 24 and a non-use position (position shown in FIG. 8) raised from the use position. configured as possible.
・端子形成工程では、基材13に対して端子14を必ずしもインサート成型によって形成する必要はない。
・端子形成工程では、必ずしも基材13における互いに異なる位置に一対の端子14を形成する必要はない。すなわち、端子形成工程では、基材13に端子14を1つだけ形成するようにしてもよい。 - In the terminal forming step, it is not always necessary to form theterminals 14 on the substrate 13 by insert molding.
- In the terminal forming step, it is not always necessary to form the pair ofterminals 14 at mutually different positions on the substrate 13 . That is, in the terminal forming step, only one terminal 14 may be formed on the substrate 13 .
・端子形成工程では、必ずしも基材13における互いに異なる位置に一対の端子14を形成する必要はない。すなわち、端子形成工程では、基材13に端子14を1つだけ形成するようにしてもよい。 - In the terminal forming step, it is not always necessary to form the
- In the terminal forming step, it is not always necessary to form the pair of
・描画工程では、ヒーター線17を基材13に押し付けてめり込ませながらヒーター線17で基材13に回路パターンを描画する際に、必ずしも基材13におけるヒーター線17を押し付けてめり込ませる部分を熱によって軟化させる必要はない。
In the drawing process, when drawing a circuit pattern on the base material 13 with the heater wire 17 while pressing the heater wire 17 against the base material 13 and embedding it, the heater wire 17 on the base material 13 is not always pressed and embedded. It is not necessary to soften the part to be applied by heat.
・描画工程では、ヒーター線17を基材13に対して半分以上めり込ませるようにしてもよい。
・切断工程では、ヒーター線17における始点となる先端部17aから終点となる部位17bまでを基材13に残してヒーター線17を切断した後に、第2端子16にヒーター線17における終点となる部位17bを熱によって接合するようにしてもよい。 - In the drawing process, theheater wire 17 may be embedded in the substrate 13 by half or more.
In the cutting step, after cutting theheater wire 17 leaving the base material 13 from the leading end portion 17a to the terminal portion 17b of the heater wire 17, the second terminal 16 is connected to the terminal portion of the heater wire 17. 17b may be joined by heat.
・切断工程では、ヒーター線17における始点となる先端部17aから終点となる部位17bまでを基材13に残してヒーター線17を切断した後に、第2端子16にヒーター線17における終点となる部位17bを熱によって接合するようにしてもよい。 - In the drawing process, the
In the cutting step, after cutting the
・接合ユニット23は、ヒーター線17に通電することによってヒーター線17を抵抗発熱させる装置、局所的に熱風を供給して加熱するスポットヒーター、レーザーを照射して加熱する装置、電磁誘導加熱(Induction Heating)を使って局所的に金属部分のみを加熱して半田付けを行うIHスポットリフロー技術を利用した装置などであってもよい。
・The joining unit 23 includes a device that causes resistance heating of the heater wire 17 by energizing the heater wire 17, a spot heater that locally supplies hot air to heat, a device that heats by irradiating a laser, and an electromagnetic induction heating (Induction A device using IH spot reflow technology, which locally heats only the metal portion for soldering using heating), may also be used.
・切断部27は、ヒーター線17における切断したい箇所に過剰に通電することによってヒーター線17を抵抗発熱させてヒーター線17を焼き切ることが可能な装置によって構成してもよい。
· The cutting unit 27 may be configured by a device capable of burning off the heater wire 17 by causing the heater wire 17 to generate resistance heat by excessively energizing a portion of the heater wire 17 to be cut.
・ヒーター回路形成装置20は、基材13と、描画ユニット22及び接合ユニット23とを相対移動可能に構成してもよい。すなわち、ヒーター回路形成装置20は、例えば、基材13の表面13aにヒーター回路12を形成する場合に、描画ユニット22及び接合ユニット23を固定した状態で基材13を水平方向に移動させるようにしてもよい。この場合、基材13は、水平方向に移動可能に構成されたステージ21を介して水平方向に移動される。
· The heater circuit forming apparatus 20 may be configured such that the substrate 13, the drawing unit 22, and the joining unit 23 are movable relative to each other. That is, for example, when forming the heater circuit 12 on the surface 13a of the base material 13, the heater circuit forming apparatus 20 moves the base material 13 in the horizontal direction while the drawing unit 22 and the joining unit 23 are fixed. may In this case, the substrate 13 is horizontally moved via a stage 21 configured to be horizontally movable.
・基材13は、板状(平面状)に限らず、立体的な形状であってもよい。
・ワイヤーは、ヒーター線17に限らず例えば信号線によって構成してもよい。
・ワイヤー回路は、ヒーター回路12以外の電気回路であってもよい。 - Thebase material 13 is not limited to a plate shape (planar shape), and may have a three-dimensional shape.
- The wire is not limited to theheater wire 17 and may be, for example, a signal wire.
- The wire circuit may be an electric circuit other than theheater circuit 12 .
・ワイヤーは、ヒーター線17に限らず例えば信号線によって構成してもよい。
・ワイヤー回路は、ヒーター回路12以外の電気回路であってもよい。 - The
- The wire is not limited to the
- The wire circuit may be an electric circuit other than the
Claims (3)
- 合成樹脂製の基材にワイヤー回路を形成するワイヤー回路の形成方法であって、
前記基材に金属製の端子を形成する端子形成工程と、
前記端子にワイヤーにおける始点となる端部を熱によって接合する接合工程と、
前記ワイヤーを前記基材に押し付けてめり込ませながら前記ワイヤーで前記基材に回路パターンを描画する描画工程と、
前記ワイヤーにおける前記始点となる前記端部から終点となる部位までを前記基材に残して前記ワイヤーを切断する切断工程と、
を備えることを特徴とするワイヤー回路の形成方法。 A wire circuit forming method for forming a wire circuit on a synthetic resin substrate,
A terminal forming step of forming a metal terminal on the base material;
A joining step of thermally joining an end portion, which is a starting point of the wire, to the terminal;
a drawing step of drawing a circuit pattern on the base material with the wire while pressing the wire against the base material and embedding the wire;
a cutting step of cutting the wire leaving the base material from the end portion serving as the start point to the portion serving as the end point of the wire;
A method of forming a wire circuit, comprising: - 前記端子形成工程では、前記基材における互いに異なる位置に一対の前記端子を形成し、
前記接合工程では、一対の前記端子のうちの一方に前記ワイヤーにおける前記始点となる前記端部を熱によって接合し、
前記切断工程では、一対の前記端子のうちの他方に前記ワイヤーにおける前記終点となる前記部位を熱によって接合した後、前記ワイヤーにおける前記始点となる前記端部から前記終点となる前記部位までを前記基材に残して前記ワイヤーを切断することを特徴とする請求項1に記載のワイヤー回路の形成方法。 forming a pair of terminals at mutually different positions on the base material in the terminal forming step;
In the bonding step, the end portion serving as the starting point of the wire is bonded to one of the pair of terminals by heat,
In the cutting step, after the portion serving as the terminal point of the wire is joined to the other of the pair of terminals by heat, the wire is cut from the end portion serving as the starting point to the portion serving as the terminal point. 2. The method of forming a wire circuit according to claim 1, wherein the wire is cut while leaving it on the substrate. - 前記描画工程では、前記ワイヤーを前記基材に押し付けてめり込ませながら前記ワイヤーで前記基材に前記回路パターンを描画する際に、前記基材における前記ワイヤーを押し付けてめり込ませる部分を熱によって軟化させることを特徴とする請求項1または請求項2に記載のワイヤー回路の形成方法。 In the drawing step, when the circuit pattern is drawn on the base material with the wire while the wire is pressed against the base material and embedded, a portion of the base material where the wire is pressed and embedded is 3. The method of forming a wire circuit according to claim 1, wherein the wire is softened by heat.
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JPH04118985A (en) * | 1990-09-10 | 1992-04-20 | Hitachi Chem Co Ltd | Manufacture of printed circuit board |
JP2004039647A (en) * | 2003-08-20 | 2004-02-05 | K-Tech Devices Corp | Resistive heating element and its manufacturing method |
US20200009801A1 (en) * | 2018-07-03 | 2020-01-09 | Board Of Regents, The University Of Texas System | Methods and apparatus for embedding a wire intermittently |
JP2020047393A (en) * | 2018-09-14 | 2020-03-26 | 三菱重工業株式会社 | Joining heating circuit, joint, method for manufacturing joining heating circuit, and joining method |
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JPH04118985A (en) * | 1990-09-10 | 1992-04-20 | Hitachi Chem Co Ltd | Manufacture of printed circuit board |
JP2004039647A (en) * | 2003-08-20 | 2004-02-05 | K-Tech Devices Corp | Resistive heating element and its manufacturing method |
US20200009801A1 (en) * | 2018-07-03 | 2020-01-09 | Board Of Regents, The University Of Texas System | Methods and apparatus for embedding a wire intermittently |
JP2020047393A (en) * | 2018-09-14 | 2020-03-26 | 三菱重工業株式会社 | Joining heating circuit, joint, method for manufacturing joining heating circuit, and joining method |
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