WO2023245599A1 - 显示面板及其制备方法、显示装置 - Google Patents

显示面板及其制备方法、显示装置 Download PDF

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Publication number
WO2023245599A1
WO2023245599A1 PCT/CN2022/101039 CN2022101039W WO2023245599A1 WO 2023245599 A1 WO2023245599 A1 WO 2023245599A1 CN 2022101039 W CN2022101039 W CN 2022101039W WO 2023245599 A1 WO2023245599 A1 WO 2023245599A1
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Prior art keywords
layer
display panel
electrode
light
area
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PCT/CN2022/101039
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English (en)
French (fr)
Inventor
宋泳锡
刘威
孙宏达
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京东方科技集团股份有限公司
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to PCT/CN2022/101039 priority Critical patent/WO2023245599A1/zh
Priority to CN202280001891.5A priority patent/CN117813938A/zh
Publication of WO2023245599A1 publication Critical patent/WO2023245599A1/zh

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  • the present disclosure belongs to the field of display technology, and specifically relates to a display panel, a preparation method thereof, and a display device.
  • OLED Organic Light-Emitting Diode
  • Transparent display means that the display panel displays images in a transparent state. The viewer can not only see the image in the display device, but also the scene behind the display device.
  • the present disclosure aims to solve at least one of the technical problems existing in the prior art and provide a display panel, a preparation method thereof, and a display device.
  • an embodiment of the present disclosure provides a display panel having a plurality of display areas; each of the display areas includes: a light-emitting area and a transparent area; wherein the display panel includes: a display substrate, located on the display The planarization layer, the pixel definition layer and the light-emitting device on the substrate; the light-emitting device includes: a first electrode and a second electrode arranged oppositely, and an organic functional layer located between the first electrode and the second electrode. ;
  • the planarization layer is provided with a partition groove between the light-emitting area and the transparent area; at least part of the pixel definition layer is provided in the partition groove; both the first electrode and the second electrode are It extends from the light-emitting area to the partition groove and is cut off; the organic functional layer is located in the area limited by the pixel defining layer.
  • the first electrode covers the side wall of the partition groove close to the light-emitting area
  • the second electrode covers the side wall of the partition trench close to the transparent area
  • the display panel further includes: a first barrier layer, a second barrier layer and a third barrier layer;
  • the first blocking layer is located on the side of the pixel defining layer close to the first electrode; the second blocking layer is located on the side of the pixel defining layer close to the organic functional layer; the third blocking layer Located on a side of the pixel defining layer close to the second electrode.
  • the sum of the heights of the first blocking layer and the second blocking layer is less than or equal to the height of the pixel defining layer
  • the height of the third blocking layer is less than or equal to the height of the pixel defining layer.
  • the corners of the second barrier layer and the third barrier layer on the side facing away from the display substrate are both configured as notch structures.
  • the display panel further includes: a first encapsulation layer and a second encapsulation layer covering the second electrode and arranged in a stack;
  • the first encapsulation layer extends from the light-emitting area to the partition groove and is cut off, and the second encapsulation layer extends from the light-emitting area to the transparent area.
  • the luminescent area includes: a reflective luminescent area and a transparent luminescent area;
  • the first electrode includes: a reflective layer and a transparent conductive layer located on the side of the reflective layer facing away from the display substrate; the reflective layer is disposed in the reflective luminescent area; the transparent conductive layer is disposed in the reflective luminescent area and The transparent light-emitting area.
  • the material of the reflective layer includes: at least one of silver, aluminum, and copper;
  • the material of the transparent conductive layer includes: at least one of indium tin oxide and indium zinc oxide.
  • the display substrate includes: a substrate and a driving circuit layer located on the substrate;
  • the driving circuit layer includes: a plurality of thin film transistors;
  • the plurality of thin film transistors are disposed in the reflective light-emitting area.
  • the orthographic projection of the plurality of thin film transistors on the substrate falls within the orthographic projection of the reflective layer on the substrate.
  • the thin film transistor includes: a multi-layer insulating layer; the multi-layer insulating layer is cut off at a position between the reflective light-emitting area and the transparent light-emitting area.
  • the display panel further includes: a cover;
  • the cover plate is located on the side of the second encapsulation layer facing away from the display substrate.
  • an embodiment of the present disclosure provides a display device, wherein the display device includes the display panel provided as above.
  • embodiments of the present disclosure provide a method for preparing a display panel.
  • the display panel has a plurality of display areas; each of the display areas includes: a light-emitting area and a transparent area; wherein, the preparation of the display panel Methods include:
  • the second electrode in the transparent area is removed, so that the second electrode is cut off at the partition groove.
  • forming a pixel defining layer in the partition groove also includes:
  • a first barrier layer is formed on the first electrode at the partition groove.
  • forming a pixel defining layer in the partition groove also includes:
  • a second blocking layer and a third blocking layer are formed on the pixel defining layer, so that the second blocking layer defines the pixel close to the side of the light emitting area, and the third blocking layer covers the pixel defining layer Close to the side of the transparent area.
  • forming a second electrode on the organic functional layer further includes:
  • a second encapsulation layer is formed on the first encapsulation layer.
  • forming an organic functional layer in the area defined by the pixel defining layer includes:
  • the organic functional layer is formed using a fine metal mask.
  • forming an organic functional layer in the area defined by the pixel defining layer includes:
  • the organic functional layer is formed using an inkjet printing process.
  • forming a second encapsulation layer on the first encapsulation layer further includes:
  • the cover plate is attached to the second packaging layer.
  • Figure 1 is a schematic structural diagram of an exemplary display panel
  • Figure 2 is a schematic cross-sectional structural diagram of the display panel shown in Figure 1 along the AA' direction;
  • Figure 3 is a schematic structural diagram of a display panel provided by an embodiment of the present disclosure.
  • Figure 4 is a schematic cross-sectional structural diagram of the display panel shown in Figure 3 along the BB' direction;
  • Figure 5 is a schematic flowchart of a method for manufacturing a display panel provided by an embodiment of the present disclosure
  • Figures 6a to 6k are schematic structural diagrams corresponding to each step in the manufacturing method of the display panel shown in Figure 5.
  • Figure 1 is a schematic structural diagram of an exemplary display panel.
  • the display panel has multiple display areas; each display area includes: a luminescent area and a transparent area; the luminous area and the transparent area are along a first Arrange in the direction, such as X direction.
  • Figure 2 is a schematic cross-sectional structural diagram of the display panel shown in Figure 1 along the AA' direction.
  • the display panel includes: a display substrate 101, a display substrate 101 located on the display substrate and arranged in sequence. Planarization layer 102, pixel definition layer 103 and light emitting device 104.
  • the light-emitting devices 104 may specifically be red light-emitting devices R, green light-emitting devices G, and blue light-emitting devices B; the light-emitting devices 104 of different colors are arranged along a second direction, such as the Y direction.
  • the light emitting device 104 includes: a first electrode 1041 and a second electrode 1042 arranged oppositely, and an organic functional layer 1043 located between the first electrode 1041 and the second electrode 1042 .
  • the first electrode 1041 is located on the planarization layer 102 and is electrically connected to the display substrate through a via hole penetrating the planarization layer 102 .
  • the organic functional layer 1043 is located in the area defined by the pixel defining layer 103 .
  • the organic functional layer 1043 can emit red light, blue light or blue light driven by the electric field of the first electrode 1041 and the second electrode 1042 to achieve colorful display.
  • the second electrode 1042 is generally an entire conductive layer made of transparent material, and its transparency is generally about 90%, but the transparent area still affects the transparency of the entire display panel.
  • the transparency of the display panel is often improved by simplifying the film structure of the transparent area, for example, removing the second electrode 1042 in the transparent area through an etching process.
  • moisture or oxygen during the etching process can easily invade through the organic film layer in the display panel, causing the organic functional layer of the light-emitting device to be corroded, thus affecting the life and reliability of the display panel. The performance is reduced and the display effect is affected.
  • embodiments of the present disclosure provide a display panel, a preparation method thereof, and a display device.
  • the display panel and preparation method thereof provided by embodiments of the present disclosure will be described below with reference to the drawings and specific embodiments. , the display device is described in further detail.
  • an embodiment of the present disclosure provides a display panel.
  • Figure 3 is a schematic structural diagram of a display panel provided by an embodiment of the present disclosure. As shown in Figure 3, the display panel has multiple display areas; each display area The region includes: a luminescent region and a transparent region; the luminescent region and the transparent region are arranged along a first direction, such as the X direction.
  • Figure 4 is a schematic cross-sectional structural diagram of the display panel shown in Figure 3 along the BB' direction. As shown in Figures 3 and 4, the display panel includes: a display substrate 101, and flattened surfaces located on the display substrate 101 and arranged in sequence.
  • the light-emitting device 104 includes: a first electrode 1041 and a second electrode 1042 arranged oppositely, and an organic functional layer 1043 located between the first electrode 1041 and the second electrode 1042; the planarization layer 102 is arranged between the light-emitting area and the transparent area.
  • partition trench V There is a partition trench V; at least part of the pixel defining layer 103 is disposed in the partition trench V; the first electrode 1041 and the second electrode 1042 both extend from the light-emitting area to the partition trench and are cut off; the organic functional layer 1043 is located within the pixel defining layer 103 within the area.
  • the number of light-emitting devices 104 in each light-emitting area is not limited in this embodiment of the present disclosure, and can be three or four, etc.
  • the embodiment of the present disclosure has an arrangement of multiple sub-pixels in the light-emitting area 100 Without limitation, they can be arranged side by side in the first direction (X direction) or the second direction (Y direction), or three sub-pixels can be arranged in a "pin" shape, four sub-pixels can be arranged in two rows and two columns, etc. .
  • the display substrate 101 can specifically be an array substrate, in which a pixel driving circuit is provided.
  • the pixel driving circuit can provide a driving voltage to the first electrode 1041 of the light-emitting device 104, so that the light-emitting device 104 emits light and emits red light, green light or Blue light enables colorful display.
  • the circuit structure of the pixel driving circuit in the array substrate can be the same as that of the pixel driving circuit in the related art, for example, it can be a 7T1C pixel driving circuit, an 8T1C pixel driving circuit or a 7T2C pixel driving circuit, etc., which The specific structure will not be described again.
  • the planarization layer 102 can be formed of organic materials such as acrylic resin, polyimide (PI) or benzocyclobutene (BCB), and can planarize the surface of the array substrate to form other films on the array substrate.
  • the layer (such as the first electrode 1041 of the light-emitting device 104) provides a flat surface, which facilitates the bonding between the array substrate and other film layers.
  • the planarization layer 102 is provided with a partition groove between the light-emitting area and the transparent area. The partition groove can disconnect the planarization layer 102 between the light-emitting area and the transparent area to prevent moisture or oxygen from intruding through the planarization layer 103 to the organic functional layer of the light emitting device 104 .
  • the pixel defining layer 103 is formed of organic materials such as polyimide (PI), polyamide (PA), benzocyclobutene (BCB), acrylic resin, or phenolic resin.
  • the pixel defining layer 103 can be composed of a plurality of pixel blocking walls, and pixel openings are formed between adjacent pixel blocking walls. The pixel openings can leak the first electrode 1041 of the light-emitting device 104 to achieve the organic function of the light-emitting device 104.
  • Layer 1043 provides carrying space.
  • the first electrode 1041 and the second electrode 1042 have opposite polarities.
  • the first electrode 1041 can be an anode of the light-emitting device 104.
  • the anode can be made of metals such as silver (Ag), aluminum (Al), titanium (Ti), etc. Made of at least one of the following materials.
  • the second electrode 1042 may specifically be the cathode of the light-emitting device 104.
  • the cathode may be made of transparent conductive materials such as indium tin oxide (ITO) and indium zinc oxide (IZO) to improve the overall transparency of the display panel.
  • ITO indium tin oxide
  • IZO indium zinc oxide
  • Both the anode and the cathode may have a single-layer structure made of the above-mentioned single material, or may have a multi-layer structure made of the above-mentioned multiple materials, which can be selected according to actual needs.
  • Both the anode and the cathode extend from the light-emitting area to the partition groove and are cut off.
  • the anode can cover the side wall of the partition groove close to the light-emitting area
  • the cathode can cover the side wall of the partition groove close to the transparent area. In this way, there is no anode or cathode in the transparent area. , thus preventing the anode and cathode from blocking light in the transparent area, thereby improving the transparency of the display panel.
  • the organic functional layer 1043 may include an organic light-emitting layer.
  • the organic light-emitting layer may be formed of a small molecular weight organic light-emitting material or a polymer organic light-emitting material, and may emit light driven by an electric field between the anode and the cathode.
  • the organic functional layer 1043 may also include other various functional layers, such as a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer. (EIL) at least one.
  • HIL hole injection layer
  • HTL hole transport layer
  • ETL electron transport layer
  • EIL electron injection layer
  • the first electrode 1041 and the second electrode 1042 of the light-emitting device 104 can extend from the light-emitting area to the partition groove and be cut off. It is not necessary to provide the first electrode 1041 and the second electrode 1042 in the transparent area. , therefore, the first electrode 1041 and the second electrode 1042 can avoid blocking light, thereby improving the transparency of the display panel.
  • the isolation groove can disconnect the planarization layer 102 between the light-emitting area and the transparent area, thereby preventing moisture or oxygen from intruding into the organic functional layer of the light-emitting device 104 through the planarization layer 102 . In this way, the reliability of the service life of the display panel can be improved, thereby improving the display effect of the display panel.
  • the first electrode 1041 covers the side wall of the partition groove V close to the light-emitting area
  • the second electrode 1042 covers the side wall of the partition trench V close to the transparent area
  • the first electrode 1041 may also cover the bottom opening of the partition trench V and/or cover the sidewall of the partition trench V close to the transparent area.
  • the second electrode 1042 can also cover the bottom opening of the partition groove V.
  • the first electrode 1041 and the second electrode 1042 are both made of inorganic materials, which can cover the two side walls of the isolation trench V to further prevent moisture or oxygen from intruding into the organic functional layer of the light-emitting device 104 through the planarization layer 102 . In this way, the reliability of the service life of the display panel can be improved, thereby improving the display effect of the display panel.
  • the display panel further includes: a first barrier layer 105a, a second barrier layer 105b, and a third barrier layer 105c;
  • the first barrier layer 105a is located on a side of the pixel defining layer 103 close to the first electrode 1041;
  • the blocking layer 105b is located on the side of the pixel defining layer 103 close to the organic functional layer 1043;
  • the third blocking layer 105c is located on the side of the pixel defining layer 103 close to the second electrode 1042.
  • the first barrier layer 105a is located on the side of the pixel defining layer 103 close to the first electrode 1041
  • the second barrier layer 105b is located on the side of the pixel defining layer 103 close to the organic functional layer 1043
  • the third barrier layer 105c is located on the side of the pixel defining layer 103 close to the first electrode 1041.
  • the first barrier layer 105a, the second barrier layer 105b and the third barrier layer 105c can all be made of inorganic insulating materials, for example, at least one of silicon nitride, silicon oxide, and silicon oxynitride. .
  • the first barrier layer 105a, the second barrier layer 105b, and the third barrier layer 105c can surround the sides of the pixel defining layer 103, thus preventing moisture or oxygen from intruding into the organic functional layer of the light emitting device 104 through the pixel defining layer 103. In this way, the reliability of the service life of the display panel can be further improved, thereby improving the display effect of the display panel.
  • the sum of the heights of the first blocking layer 105a and the second blocking layer 105b is less than or equal to the height of the pixel defining layer 103; the height of the third blocking layer 105c is less than or equal to the height of the pixel defining layer 103.
  • the sum of the heights of the first barrier layer 105a and the second barrier layer 105b is less than or equal to the height of the pixel defining layer 103, and the height of the third barrier layer 105c is less than or equal to the height of the pixel defining layer 103. This can prevent each barrier layer from being higher than the pixel.
  • the definition layer 103 is higher than the height of the pixel definition layer 103, causing the second electrode 1042 on the pixel definition layer 103 to be warped or curled. This can ensure the flatness of the second electrode 1042 thereon, thereby improving the display. Effect.
  • the corners of the second barrier layer 105b and the third barrier layer 105c on the side facing away from the display substrate 101 are both configured as notch structures.
  • the corners of the second barrier layer 105b and the third barrier layer 105c are set into a notch structure, which can make their top surfaces flat and prevent sharp corners from piercing the second electrode 1042, thereby ensuring that the second electrode 1042 is The flatness of 1042 can improve the display effect. It can be understood that the corners of the second barrier layer 105b and the third barrier layer 105c can also be arranged in a gentle arc structure or other shaped structures, which will not be listed one by one here.
  • the display panel further includes: a first encapsulation layer 106a and a second encapsulation layer 106b covering the second electrode 1042 and arranged in a stack; the first encapsulation layer 106a extends from the light-emitting area to the partition The second encapsulation layer 106b extends from the light-emitting area to the transparent area.
  • Both the first encapsulation layer 106a and the second encapsulation layer 106b may adopt a single structure of inorganic materials, or may adopt a stacked structure of organic materials, inorganic materials and organic materials.
  • the first encapsulation layer 106a can encapsulate each film layer in the light-emitting area to prevent moisture or oxygen from intruding into the organic functional layer 1043 of the light-emitting device 104.
  • the second encapsulation layer 106b is used to encapsulate the entire display panel. At the same time, only the first sealing layer 106a is provided in the transparent area, which can simplify the structure of the film layer in the transparent area of the display panel, thereby further improving the transparency of the transparent area of the display panel.
  • the light-emitting area includes: a reflective light-emitting area and a transparent light-emitting area;
  • the first electrode 1041 includes: a reflective layer 1041a and a transparent conductive layer located on the side of the reflective layer 1041a away from the display substrate 101.
  • Layer 1041b; the reflective layer 1041a is disposed in the reflective luminescent area; the transparent conductive layer 1041b is disposed in the reflective luminescent area and the transparent luminescent area.
  • the reflective layer 1041a can be disposed in the reflective light-emitting area and can reflect the light emitted by the organic functional layer 1043 so that the light is emitted from the second electrode 1042 side, which can improve the light extraction efficiency and thereby improve the luminous efficiency of the light-emitting device 104.
  • the transparent conductive layer 1041b is disposed in the reflective luminescent area and the transparent luminescent area.
  • the organic functional layer 1043 emits light
  • light can be emitted from the second electrode 1042.
  • the transparent conductive layer is in a transparent state, that is, the transparent light-emitting area of the display panel is in a transparent state, which further improves the transmittance of the display panel.
  • the material of the reflective layer 1041a can be at least one of silver, aluminum, and copper; the material of the transparent conductive layer 1041b can be at least one of indium tin oxide and indium zinc oxide, and the transparent conductive layer 1041b can be a single layer. structure or multi-layer structure.
  • the material of the second electrode 1042 may be a material with high transparency and low resistance such as indium tin oxide (ITO), indium zinc oxide (IZO), silver nanowire (AgNW) or carbon nanotube (CNT).
  • the display substrate 101 includes: a substrate 1011 and a driving circuit layer 1012 located on the substrate 1011; the driving circuit layer 1012 includes: a plurality of thin film transistors; the plurality of thin film transistors are disposed in the reflective light-emitting area. .
  • the substrate 1011 can be made of rigid materials such as glass, which can improve the carrying capacity of other film layers on the substrate 1011.
  • the substrate 1011 can also be made of flexible materials such as polyimide (PI), which can improve the overall bending resistance and tensile resistance of the display substrate 101 and avoid the occurrence of bending, stretching, and twisting. The stress causes the base 1011 to break, resulting in poor circuit breaking.
  • the material of the substrate 1011 can be reasonably selected according to actual needs to ensure that the display substrate 101 has good performance.
  • the driving circuit layer 1012 is provided with a pixel driving circuit for driving the light emitting device 104 to emit light.
  • the driving circuit layer 1012 includes a plurality of thin film transistors.
  • Each thin film transistor includes: an active layer, a gate insulating layer, a gate electrode, an interlayer insulating layer, and a source layer that are sequentially stacked on the substrate 1011 .
  • the source electrode and the drain electrode are electrically connected to both ends of the active layer through via holes that penetrate the interlayer insulating layer and the gate insulating layer respectively.
  • the planarization layer 102 can planarize the film layer where the source electrode and the drain electrode are located.
  • the source electrode is electrically connected to the first electrode 1041 of the light emitting device 104 through a via hole penetrating the planarization layer 102 .
  • the material of the active layer can be at least one of metal oxide and low-temperature polysilicon.
  • the material of the gate insulating layer can be at least one of silicon nitride, silicon oxide, and silicon oxynitride.
  • the material of the gate Specifically, it can be at least one of copper, aluminum, molybdenum, and nickel.
  • the material of the interlayer insulating layer can be at least one of silicon nitride, silicon oxide, and silicon oxynitride.
  • the material of the source electrode and the drain electrode can be specifically. It is at least one of copper, aluminum, molybdenum and nickel.
  • the plurality of thin film transistors in the driving circuit layer 1012 are only arranged in the reflective light-emitting area, which can prevent the thin film transistors from blocking the transparent light-emitting area and the light in the transparent area, thereby improving the transparency of the display panel.
  • the orthographic projection of the plurality of thin film transistors on the substrate 1011 falls within the orthographic projection of the reflective layer 1041a on the substrate 1011.
  • the reflective layer 1041a can be used as a light-shielding layer to shield the thin film transistor below it.
  • the reflective layer 1041a can reflect the light of the organic functional layer 1043, and at the same time prevent the image in the thin film transistor from entering the user's field of view, thereby It can improve the display effect of the display panel.
  • the thin film transistor includes: a multi-layer insulating layer; the multi-layer insulating layer is cut off at a position between a reflective light-emitting area and a transparent light-emitting area.
  • the insulating layer in the thin film transistor can specifically be a gate insulating layer, an interlayer insulating layer, and other film layers.
  • Each insulating layer can be formed of at least one of silicon nitride, silicon oxide, and silicon oxynitride. Due to the difference in refractive index of each insulation layer, the overall transmittance can easily be reduced by more than 10%.
  • each insulating layer in the thin film transistor is cut off at a position between the reflective light-emitting area and the transparent light-emitting area, that is, each insulating layer in the thin film transistor does not extend into the transparent light-emitting area and the transparent area.
  • the film structure of the transparent light-emitting area and the transparent area in the display panel can be simplified, and the decrease in transparency caused by the difference in refractive index of each insulating layer can be avoided, thereby improving the overall transparency of the display panel.
  • the depth of the partition groove V set in the planarization layer is approximately the height from the substrate 1011 to the reflective layer 1041a, that is, the lower opening of the partition groove V exposes the substrate 1011; making the partition groove V better
  • Each insulating layer in the thin film transistor is cut off at a position between the reflective luminescent area and the transparent luminescent area.
  • the height of the pixel defining layer 103 formed at the partition groove is greater than the depth of the partition groove.
  • the partition groove is formed on the substrate 1011, and the pixel defining layer 103 formed at the partition groove is designed to be closer to the substrate 1011, so that the pixel defining layer 103 formed at the partition groove not only plays a supporting role, but also can thin the display panel. Thickness (because usually the pixel defining layer 103 is formed above the flat layer).
  • such a design is conducive to better forming the first barrier layer 105a, the second barrier layer 105b and the third barrier layer 105c, and cooperating with the first barrier layer 105a, the second barrier layer 105b and the third barrier layer 105c. It is more conducive to isolating water and oxygen and supporting the luminous area.
  • the first barrier layer 105a, the second barrier layer 105b, and the third barrier layer 105c are made of the same material.
  • the materials of the first barrier layer 105a, the second barrier layer 105b and the third barrier layer 105c are the same.
  • the materials of the first barrier layer 105a, the second barrier layer 105b and the third barrier layer 105c can be silicon oxide, nitride At least one of silicon and silicon oxynitride.
  • the first barrier layer 105a, the second barrier layer 105b and the third barrier layer 105c can be formed using the same preparation process, thereby reducing process steps and saving preparation costs.
  • the first barrier layer 105a and the second barrier layer 105b are in direct contact.
  • the first barrier layer 105a and the second barrier layer 105b can be in direct contact, and at the same time, they are made of the same material, which can avoid a gap between the first barrier layer 105a and the second barrier layer 105b, thereby preventing moisture or oxygen from passing through the first barrier.
  • the gap between the layer 105a and the second barrier layer 105b invades the organic functional layer of the light emitting device 104.
  • the display panel further includes: a cover plate 107; the cover plate 107 is located on the side of the second encapsulation layer 106b away from the display substrate 101.
  • the cover 107 can be made of glass, acrylic or other transparent materials, and can protect each film layer in the display panel and prevent external forces from damaging other film layers in the display panel during use.
  • the display panel provided by the embodiments of the present disclosure can also include, in addition to the above-mentioned film layers, existing film layers in related technologies such as touch layers and polarizer layers.
  • existing film layers in related technologies such as touch layers and polarizer layers.
  • the implementation principles thereof are the same as those in related technologies. The principles are the same and will not be repeated here.
  • inventions of the present disclosure provide a display device.
  • the display device includes the display panel provided in any of the above embodiments.
  • the display device can be a mobile phone, a tablet computer, a television, a computer monitor, a notebook computer,
  • the implementation principles and beneficial effects of any products or components with display functions, such as digital photo frames and navigators, are the same as those of the above-mentioned display panels, and will not be described again here.
  • an embodiment of the present disclosure provides a method for preparing a display panel, which is used to prepare a display panel as provided in any of the above embodiments.
  • the display panel has multiple display areas; each display area includes: a light-emitting area and a Transparent area.
  • Figure 5 is a schematic flowchart of a method for preparing a display panel provided by an embodiment of the present disclosure.
  • Figures 6a to 6k are schematic structural diagrams corresponding to each step in the method of preparing a display panel shown in Figure 5. The following will be combined with the figures. As shown in 5, the preparation method of the display panel includes the following steps S501 to S511.
  • S501 Form a planarization layer on the display substrate, and etch the position between the light-emitting area and the transparent area of the planarization layer to form a partition groove.
  • a driving circuit layer 1012 is formed on the substrate 1011 to form the display substrate 101.
  • An organic material layer is deposited on the driving circuit layer 1012 to form a planarization layer 102, and the planarization layer 102 is patterned.
  • part of the material of the planarization layer 102 between the light-emitting area and the transparent area is etched away to form isolation trenches.
  • S502 Form a first electrode on the planarization layer so that the first electrode is cut off at the isolation groove.
  • a first electrode 1041 is formed on the planarization layer 102, and the first electrode 1041 is patterned so that the first electrode 1041 is cut off at the partition groove to avoid affecting the transmittance of the transparent area.
  • an inorganic material layer is deposited on the first electrode, and the inorganic material layer is patterned to form a first barrier layer 105a, so that the first barrier layer 105a covers the first electrode 1041 at the isolation groove. .
  • the pixel defining layer 103 is formed at the partition groove, so that the pixel defining layer 103 covers the first blocking layer 105a.
  • S505 form a second blocking layer and a third blocking layer on the pixel defining layer, so that the second blocking layer covers the side of the pixel defining layer close to the light-emitting area, and the third blocking layer covers the side of the pixel defining layer close to the transparent area.
  • a layer of inorganic material is formed on the pixel definition layer 103, and the inorganic material layer is patterned to form a second barrier layer 105b and a third barrier layer 105c, so that the second barrier layer 105b covers the pixel definition layer.
  • S506 Form an organic functional layer in the area defined by the pixel defining layer.
  • a high-precision metal mask or an inkjet printing process is used to inject organic light-emitting materials into the area defined by the pixel defining layer 103, and form an organic functional layer 1043.
  • a conductive material is deposited on the organic functional layer 1043 to form a second electrode 1042.
  • an inorganic material layer is deposited on the second electrode 1042 to form a first encapsulation layer 106a to encapsulate the light-emitting device 104 and prevent moisture or oxygen from intruding into the organic functional layer 1043 of the light-emitting device 104.
  • an etching process is used to remove the first encapsulation layer 106a and the second electrode 1042 in the transparent area to simplify the structure of the transparent area of the display panel and improve the transparency of the display panel.
  • an inorganic material layer is deposited on the first encapsulation layer 106a to form a second encapsulation layer 106b to encapsulate the entire display panel.
  • the cover plate 107 is attached to the second packaging layer 106b to protect each film layer in the display panel and prevent damage to each film layer by external force during use.
  • the first electrode 1041 and the second electrode 1042 of the light-emitting device 104 can be extended from the light-emitting area to the partition groove and cut off. It is not necessary to provide the first electrode 1041 and the second electrode in the transparent area.
  • the two electrodes 1042 can avoid the first electrode 1041 and the second electrode 1042 from blocking light, thereby improving the transparency of the display panel.
  • the isolation groove can disconnect the planarization layer 102 between the light-emitting area and the transparent area, thereby preventing moisture or oxygen from intruding into the organic functional layer of the light-emitting device 104 through the planarization layer 102 .
  • the pixel defining layer 103 is disposed at the partition groove.
  • the first barrier layer 105a, the second barrier layer 105b and the third barrier layer 105c can surround each side of the pixel defining layer 103, which can prevent moisture or oxygen from passing through the pixel defining layer. 103 invades into the organic functional layer of the light emitting device 104. In this way, the reliability of the service life of the display panel can be improved, thereby improving the display effect of the display panel.

Landscapes

  • Electroluminescent Light Sources (AREA)

Abstract

一种显示面板及其制备方法，显示面板具有多个显示区；每个显示区包括：发光区和透明区；显示面板包括：显示基板(101)、位于显示基板(101)上的平坦化层(102)、像素限定层(103)和发光器件(104)；发光器件(104)包括：相对设置的第一电极(1041)和第二电极(1042)、及位于第一电极(1041)和第二电极（1042）之间的有机功能层（1043）；平坦化层（102）在发光区和透明区的之间设置有隔断槽（V）；至少部分像素限定层（103）设置于隔断槽（V）内；第一电极（1041）和第二电极（1042）均由发光区延伸至隔断槽（V）处并截止；有机功能层（1043）位于像素限定层（103）所限的区域内。显示面板可解决有机功能层（1043）容易被水分或氧气侵入的问题。

Description

显示面板及其制备方法、显示装置 技术领域
本公开属于显示技术领域，具体涉及一种显示面板及其制备方法、显示装置。
背景技术
有机电致发光二极管(Organic Light-Emitting Diode，OLED)是一种利用有机固态半导体作为发光材料的发光器件，由于其具有制备工艺简单、成本低、功耗低、发光亮度高、工作温度适应范围广等优点，因而有着广阔的应用前景。
随着显示技术的不断发展，透明显示技术已经成为显示技术中的一个重要的个性化领域。透明显示是指显示面板在透明状态下进行图像显示，观看者不仅可以看到显示装置中的图像，而且可以看到显示装置背后的景象。
发明内容
本公开旨在至少解决现有技术中存在的技术问题之一，提供一种显示面板及其制备方法、显示装置。
第一方面，本公开实施例提供了一种显示面板，具有多个显示区；每个所述显示区包括：发光区和透明区；其中，所述显示面板包括：显示基板、位于所述显示基板上的平坦化层、像素限定层和发光器件；所述发光器件包括：相对设置的第一电极和第二电极、及位于所述第一电极和所述第二电极之间的有机功能层；
所述平坦化层在所述发光区和所述透明区的之间设置有隔断槽；至少部分所述像素限定层设置于所述隔断槽内；所述第一电极和所述第二电极均由 所述发光区延伸至所述隔断槽处并截止；所述有机功能层位于所述像素限定层所限的区域内。
可选地，所述第一电极覆盖所述隔断槽靠近所述发光区的侧壁，所述第二电极覆盖所述隔断槽靠近所述透明区的侧壁。
可选地，所述显示面板还包括：第一阻挡层、第二阻挡层和第三阻挡层；
所述第一阻挡层位于所述像素限定层靠近所述第一电极的一侧；所述第二阻挡层位于所述像素限定层靠近所述有机功能层的一侧；所述第三阻挡层位于所述像素限定层靠近所述第二电极的一侧。
可选地，所述第一阻挡层和所述第二阻挡层的高度和小于或等于所述像素限定层的高度；
所述第三阻挡层的高度小于或等于所述像素限定层的高度。
可选地，所述第二阻挡层和所述第三阻挡层背离所述显示基板的一侧的角部均设置为缺角结构。
可选地，所述显示面板还包括：覆盖所述第二电极且叠层设置的第一封装层和第二封装层；
所述第一封装层由所述发光区延伸至所述隔断槽处并截止，所述第二封装层由所述发光区延伸至所述透明区。
可选地，所述发光区包括：反射发光区和透明发光区；
所述第一电极包括：反射层和位于所述反射层背离所述显示基板一侧的透明导电层；所述反射层设置于反射发光区；所述透明导电层设置于所述反射发光区和所述透明发光区。
可选地，所述反射层的材料包括：银、铝、铜中的至少一种；
所述透明导电层的材料包括：氧化铟锡、氧化铟锌中的至少一种。
可选地，所述显示基板包括：基底、位于所述基底上的驱动电路层；所述驱动电路层包括：多个薄膜晶体管；
所述多个薄膜晶体管设置于所述反射发光区。
可选地，所述多个薄膜晶体管在所述基底上的正投影落在所述反射层在所述基底上的正投影内。
可选地，所述薄膜晶体管包括：多层绝缘层；所述多层绝缘层在所述反射发光区和所述透明发光区之间的位置截止。
可选地，所述显示面板还包括：盖板；
所述盖板位于所述第二封装层背离所述显示基板一侧。
第二方面，本公开实施例提供了一种显示装置，其中，所述显示装置包括如上述提供的显示面板。
第三方面，本公开实施例提供了一种显示面板的制备方法，所述显示面板具有多个显示区；每个所述显示区包括：发光区和透明区；其中，所述显示面板的制备方法包括：
在所述显示基板上形成平坦化层，并将所述平坦化层的所述发光区和所述透明区之间的位置进行刻蚀，形成隔断槽；
在所述平坦化层上形成第一电极，使得所述第一电极在所述隔断槽处截止；
在所述隔断槽内形成像素限定层；
在所述像素限定层所限定区域形成有机功能层；
在所述有机功能层上形成第二电极；
去除所述透明区的所述第二电极，使得所述第二电极在所述隔断槽处截止。
可选地，在所述隔断槽内形成像素限定层，之前还包括：
在隔断槽处所述第一电极上形成第一阻挡层。
可选地，在所述隔断槽内形成像素限定层，之前还包括：
在所述像素限定层上形成第二阻挡层和第三阻挡层，使得所述第二阻挡 层所述像素限定成靠近所述发光区的侧面，所述第三阻挡层覆盖所述像素限定层靠近所述透明区的侧面。
可选地，在所述有机功能层上形成第二电极，之后还包括：
在所述第二电极上形成第一封装层；
去除所述透明区的第一封装层和第二电极；
在所述第一封装层上形成第二封装层。
可选地，在所述像素限定层所限定区域形成有机功能层，包括：
利用精细金属掩模板，形成所述有机功能层。
可选地，在所述像素限定层所限定区域形成有机功能层，包括：
采用喷墨打印工艺，形成所述有机功能层。
可选地，在所述第一封装层上形成第二封装层，之后还包括：
将盖板贴合于所述第二封装层上。
附图说明
图1为一种示例性的显示面板的结构示意图；
图2为图1所示的显示面板沿A-A'方向上的截面结构示意图；
图3为本公开实施例提供的一种显示面板的结构示意图；
图4为图3所示的显示面板沿B-B'方向上的截面结构示意图；
图5为本公开实施例提供的一种显示面板的制备方法的流程示意图；
图6a至图6k为图5所示的显示面板的制备方法中的各个步骤对应的结构示意图。
具体实施方式
为使本领域技术人员更好地理解本公开的技术方案，下面结合附图和具体实施方式对本公开作进一步详细描述。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属 领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”、“一”或者“该”等类似词语也不表示数量限制，而是表示存在至少一个。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
图1为一种示例性的显示面板的结构示意图，如图1所示，该显示面板具有多个显示区；每个显示区包括：发光区和透明区；发光区和透明区沿着第一方向上排布，例如X方向。图2为图1所示的显示面板沿A-A'方向上的截面结构示意图，如图1和图2所示，该显示面板包括：显示基板101、位于所述显示基板上且依次设置的平坦化层102、像素限定层103和发光器件104。发光器件104具体可以为红色发光器件R、绿色发光器件G和蓝色发光器件B；不同颜色的发光器件104沿着第二方向上排布，例如Y方向。
继续参考图2，发光器件104包括：相对设置的第一电极1041和第二电极1042、及位于第一电极1041和第二电极1042之间的有机功能层1043。其中，第一电极1041位于平坦化层102上，并通过贯穿平坦化层102的过孔与显示基板电连接。有机功能层1043位于像素限定层103所限定的区域。有机功能层1043可以在第一电极1041和第二电极1042的电场的驱动下进行发出红色光线、蓝色光线或蓝色光线，以实现多彩显示。其中，第二电极1042一般为采用透明材料制成的整面导电层，其透明度一般在90％左右，但是透明区中依然影响显示面板整体的透明度。
目前往往通过简化透明区的膜层结构提高显示面板的透明度，例如，通 过刻蚀工艺去除透明区中的第二电极1042。然而，在简化透明区的膜层结构的同时，刻蚀过程中的水分或氧气容易通过显示面板中的有机膜层侵入，导致发光器件的有机功能层受到侵蚀，从而导致显示面板的寿命及信赖性降低，影响显示效果。
为了至少解决上述的技术问题之一，本公开实施例提供了一种显示面板及其制备方法、显示装置，下面将结合附图和具体实施方式，对本公开实施例提供的显示面板及其制备方法、显示装置进行进一步详细描述。
第一方面，本公开实施例提供了一种显示面板，图3为本公开实施例提供的一种显示面板的结构示意图，如图3所示，该显示面板具有多个显示区；每个显示区包括：发光区和透明区；发光区和透明区沿着第一方向上排布，例如X方向。图4为图3所示的显示面板沿B-B'方向上的截面结构示意图，如图3和图4所示，显示面板包括：显示基板101、位于显示基板101上且依次设置的平坦化层102、像素限定层103和发光器件104；不同颜色的发光器件104沿着第二方向上排布，例如Y方向。发光器件104包括：相对设置的第一电极1041和第二电极1042、及位于第一电极1041和第二电极1042之间的有机功能层1043；平坦化层102在发光区和透明区之间设置有隔断槽V；至少部分像素限定层103设置于隔断槽V内；第一电极1041和第二电极1042均由发光区延伸至隔断槽处并截止；有机功能层1043位于像素限定层103所限定的区域内。
在此需要说明的是，本公开实施例每个发光区中的发光器件104的数量不作限制，可以是三个或四个等，本公开实施例对发光区100的多个子像素的排布方式不作限制，可以在第一方向(X方向)或第二方向(Y方向)上并列设置，或者三个子像素可以呈“品”字型排布，四个子像素可以呈两行两列排布等。
显示基板101具体可以为阵列基板，其中设置有像素驱动电路，可以通 过像素驱动电路为发光器件104的第一电极1041提供驱动电压，以使得发光器件104进行发光，并发出红色光线、绿色光线或蓝色光线，实现多彩显示。在此需要说明的是，阵列基板中的像素驱动电路的电路结构可以与相关技术中的像素驱动电路的结构相同，例如可以为7T1C像素驱动电路、8T1C像素驱动电路或7T2C像素驱动电路等，其具体结构将不再进行赘述。
平坦化层102可以采用压克力树脂、聚酰亚胺(PI)或苯并环丁烯(BCB)等有机材料形成，可以对阵列基板的表面进行平坦化，以为阵列基板之上的其他膜层(例如发光器件104的第一电极1041)提供平整的表面，利于阵列基板与其他膜层之间的贴合。平坦化层102在发光区和透明区之间的位置设置有隔断槽，隔断槽可以将平坦化层102在发光区和透明区之间的位置断开，避免水分或氧气通过平坦化层103侵入至发光器件104的有机功能层。
像素限定层103以采用聚酰亚胺(PI)、聚酰胺(PA)、苯并环丁烯(BCB)、压克力树脂或酚醛树脂等的有机材料形成。具体地，像素限定层103可以由多个像素挡墙构成，相邻的像素挡墙之间形成有像素开口，像素开口可以将发光器件104的第一电极1041漏出，以为发光器件104的有机功能层1043提供承载空间。
第一电极1041和第二电极1042的极性相反，其中，第一电极1041具体可以为发光器件104的阳极，该阳极可以次采用银(Ag)、铝(Al)、钛(Ti)等金属材料中的至少一种制成。第二电极1042具体可以为发光器件104的阴极，该阴极可以采用氧化铟锡(ITO)，氧化铟锌(IZO)等透明导电材料制成，以提高显示面板整体的透明度。阳极和阴极均可以为由上述的单一材料制成的单层结构，也可以为由上述的多种材料制成的多层结构，具体可以根据实际需要进行选择。阳极和阴极均由发光区延伸至隔断槽处并截止，阳极可以覆盖隔断槽靠近发光区的侧壁，阴极可以覆盖隔断槽靠近透明区的侧壁，这样，在透明区未设置有阳极和阴极，从而可以避免阳极和阴极在透明 区对光线的遮挡，进而可以提高显示面板的透明度。
有机功能层1043可以包括有机发光层，有机发光层可以由小分子量有机发光材料或高分子有机发光材料形成，在阳极和阴极之间的电场的驱动下可以发出光线。有机功能层1043除了上述的有机发光层之外，还可以包括其它各种功能层，例如，空穴注入层(HIL)、空穴传输层(HTL)、电子传输层(ETL)和电子注入层(EIL)中的至少一个。
本公开实施例提供的显示面板中，发光器件104的第一电极1041和第二电极1042可以由发光区延伸至隔断槽处并截止，可以不必在透明区设置第一电极1041和第二电极1042，因此可以避免第一电极1041和第二电极1042对光线的遮挡，从而可以提高显示面板的透明度。并且，隔断槽可以将平坦化层102在发光区和透明区之间的位置断开，可以避免水分或氧气通过平坦化层102侵入至发光器件104的有机功能层。这样，可以提高显示面板的寿命的信赖性，进而提高显示面板的显示效果。
在一些实施例中，第一电极1041覆盖隔断槽V靠近发光区的侧壁，第二电极1042覆盖隔断槽V靠近透明区的侧壁。
在一些实施例中，第一电极1041还可以覆盖隔断槽V底部开口和/或覆盖隔断槽V靠近透明区的侧壁。
在一些实施例中，第二电极1042还可以覆盖隔断槽V底部开口。
第一电极1041和第二电极1042均采用无机材料构成，可以对隔断槽V的两个侧壁进行包覆，进一步避免水分或氧气通过平坦化层102侵入至发光器件104的有机功能层。这样，可以提高显示面板的寿命的信赖性，进而提高显示面板的显示效果。
在一些实施例中，显示面板还包括：第一阻挡层105a、第二阻挡层105b和第三阻挡层105c；第一阻挡层105a位于像素限定层103靠近第一电极1041的一侧；第二阻挡层105b位于像素限定层103靠近有机功能层1043的一侧； 第三阻挡层105c位于像素限定层103靠近第二电极1042的一侧。
第一阻挡层105a位于像素限定层103靠近第一电极1041的一侧，第二阻挡层105b位于像素限定层103靠近有机功能层1043的一侧，第三阻挡层105c位于像素限定层103靠近第二电极1042的一侧，第一阻挡层105a、第二阻挡层105b和第三阻挡层105c可以均由无机绝缘材料制成，例如，氮化硅、氧化硅、氮氧化硅中的至少一种。第一阻挡层105a、第二阻挡层105b、第三阻挡层105c可以将像素限定层103的侧面均包围，因此可以避免水分或氧气通过像素限定层103侵入至发光器件104的有机功能层。这样，可以进一步提高显示面板的寿命的信赖性，进而提高显示面板的显示效果。
在一些实施例中，第一阻挡层105a和第二阻挡层105b的高度和小于或等于像素限定层103的高度；第三阻挡层105c的高度小于或等于像素限定层103的高度。
第一阻挡层105a和第二阻挡层105b的高度和小于或等于像素限定层103的高度，第三阻挡层105c的高度小于或等于像素限定层103的高度，这样可以避免各个阻挡层高于像素限定层103高于像素限定层103的高度而导致像素限定层103上的第二电极1042发生翘起或卷边等不良，从而可以保证其上的第二电极1042的平整性，进而可以提高显示效果。
在一些实施例中，第二阻挡层105b和第三阻挡层105c背离显示基板101的一侧的角部均设置为缺角结构。
第二阻挡层105b和第三阻挡层105c的角部设置成缺角结构，可以使得其顶面平缓，避免较为尖锐的角部将第二电极1042刺破，从而可以保证其上的第二电极1042的平整性，进而可以提高显示效果。可以理解的是，第二阻挡层105b和第三阻挡层105c的角部还可以设置成平缓的弧形结构或其他形状的结构，在此不再进行一一列举。
在一些实施例中，如图4所示，显示面板还包括：覆盖第二电极1042 且叠层设置的第一封装层106a和第二封装层106b；第一封装层106a由发光区延伸至隔断槽处并截止，第二封装层106b由发光区延伸至透明区。
第一封装层106a和第二封装层106b均可以采用的无机材料的单结构，或者采用有机材料、无机材料和有机材料的叠层结构。其中，第一封装层106a可以对发光区的各个膜层进行封装，以避免水分或氧气侵入至发光器件104的有机功能层1043中。第二封装层106b以对显示面板整体进行封装。同时，在透明区中仅设置有第一封住层106a，可以简化显示面板透明区中的膜层的结构，从而可以进一步提高显示面板透明区的透明度。
在一些实施例中，如图3和图4所示，发光区包括：反射发光区和透明发光区；第一电极1041包括：反射层1041a和位于反射层1041a背离显示基板101一侧的透明导电层1041b；反射层1041a设置于反射发光区；透明导电层1041b设置于反射发光区和透明发光区。
反射层1041a可以设置于反射发光区，可以对有机功能层1043发出的光线进行反射，使得光线由第二电极1042一侧出射，可以提高光线的出光效率，进而可以提高发光器件104的发光效率。
透明导电层1041b设置于反射发光区和透明发光区，在有机功能层1043发光时，光线可以由第二电极1042出射。在有机功能层1043不发光时，透明导电层呈透明状态，即显示面板的透明发光区呈透明状态，进而可以进一步提高显示面板的透光度。
具体地，反射层1041a的材料可以采用银、铝、铜中的至少一种；透明导电层1041b的材料可以采用氧化铟锡、氧化铟锌中的至少一种，透明导电层1041b可以采用单层结构或者多层结构。第二电极1042的材料可以采用氧化铟锡(ITO)、氧化铟锌(IZO)、银纳米线(AgNW)或碳纳米管(CNT)等高透明度且电阻较低的材料。
在一些实施例中，如图4所示，显示基板101包括：基底1011、位于基 底1011上的驱动电路层1012；驱动电路层1012包括：多个薄膜晶体管；多个薄膜晶体管设置于反射发光区。
基底1011可以采用玻璃等刚性材料制成，可以提高基底1011对其上的其他膜层的承载能力。当然，基底1011还可以采用聚酰亚胺(polyimide，PI)等柔性材料制成，可以提高显示基板101整体的抗弯折、抗拉伸性能，避免在弯折、拉伸、扭曲过程中产生的应力使得基底1011发生断裂，造成断路不良。在实际应用中，可以根据实际需要，合理选择基底1011的材料，以保证显示基板101具有良好的性能。
驱动电路层1012中设置有用于驱动发光器件104发光的像素驱动电路，像素电路的具体结构可以参考相关技术中的像素驱动电路的的结构，在此不再进行详述。例如：图4所示，驱动电路层1012包括多个薄膜晶体管，每个薄膜晶体管包括：依次叠层设置于基底1011上的有源层、栅极绝缘层、栅极、层间绝缘层、源极和漏极；源极和漏极分别通过贯穿层间绝缘层和栅极绝缘层的过孔与有源层的两端电连接。平坦化层102可以对源极和漏极所在的膜层进行平坦化。源极通过贯穿平坦化层102的过孔与发光器件104的第一电极1041电连接。
有源层的材料具体可以为金属氧化物、低温多晶硅材料中的至少一种，栅极绝缘层的材料具体可以为氮化硅、氧化硅、氮氧化硅中的至少一种，栅极的材料具体可以为铜、铝、钼、镍中的至少一种，层间绝缘层的材料具体可以为氮化硅、氧化硅、氮氧化硅中的至少一种，源极和漏极的材料具体可以为铜、铝、钼、镍中的至少一种。
驱动电路层1012中的多个薄膜晶体管仅设置于反射发光区，可以避免薄膜晶体管对透明发光区及透明区中的光线造成遮挡，从而可以提高显示面板的透明度。
在一些实施例中，多个薄膜晶体管在基底1011上的正投影落在反射层 1041a在基底1011上的正投影内。
反射层1041a可以作为遮光层，对其下方的薄膜晶体管进行遮光，在显示过程中，反射层1041a可以对有机功能层1043的光线进行反射，同时可以避免薄膜晶体管中的影像进入用户的视野，从而可以提高显示面板的显示效果。另一方面可以不必针对薄膜晶体管制备相应地黑矩阵来进行遮光，从而可以减少工艺步骤，简化显示面板的结构，从而可以节约制备成本。
在一些实施例中，如图4所示，薄膜晶体管包括：多层绝缘层；多层绝缘层在反射发光区和透明发光区之间的位置截止。
薄膜晶体管中的绝缘层具体可以为栅极绝缘层、层间绝缘层等膜层，各个绝缘层均可以采用氮化硅、氧化硅、氮氧化硅中的至少一种形成。由于各个绝缘层的折射率差异，容易使得整体透光度会降低10％以上。在本公开实施例中，薄膜晶体管中的各个绝缘层在反射发光区和透明发光区之间的位置截止，即在薄膜晶体管中的各个绝缘层均未延伸至透明发光区和透明区中，因此可以简化显示面板中透明发光区和透明区的膜层结构，可以避免由于各个绝缘层的折射率差异导致的透明度下降，从而可以提高显示面板整体的透明度。在一些实施例中，如图4所示，平坦化层设置的隔断槽V深度大致为基底1011到反射层1041a的高度，即隔断槽V的下部开口暴露出基底1011；使得隔断槽V更好的将薄膜晶体管中的各个绝缘层在反射发光区和透明发光区之间的位置截止。
在一些实施例中，如图4所示，隔断槽处形成像素限定层103高度大于隔断槽的深度。例如：隔断槽处形成在基底1011上，如此设计的隔断槽处形成像素限定层103更靠近基底1011，使得隔断槽处形成像素限定层103起到支撑作用的同时，还能减薄显示面板的厚度(因通常像素限定层103是形成在平坦层上方)。当然，如此设计有利于更好的形成第一阻挡层105a、第二阻挡层105b和第三阻挡层105c，并与第一阻挡层105a、第二阻挡层105b 和第三阻挡层105c相互配合，更有利于对发光区域进行隔绝水氧和起到支撑作用。
在一些实施例中，第一阻挡层105a、第二阻挡层105b和第三阻挡层105c的材料相同。
第一阻挡层105a、第二阻挡层105b和第三阻挡层105c的材料相同，例如，第一阻挡层105a、第二阻挡层105b和第三阻挡层105c的材料均可以为氧化硅、氮化硅、氮氧化硅中的至少一种。在制备过程中，第一阻挡层105a、第二阻挡层105b和第三阻挡层105c可以采用同一制备工艺形成，从而可以减少工艺步骤，节约制备成本。
在一些实施例中，第一阻挡层105a和第二阻挡层105b直接接触。
第一阻挡层105a和第二阻挡层105b可以直接接触，同时二者的材料相同，可以避免第一阻挡层105a和第二阻挡层105b之间产生缝隙，从而可以避免水分或氧气通过第一阻挡层105a和第二阻挡层105b之间的缝隙侵入至发光器件104的有机功能层。
在一些实施例中，显示面板还包括：盖板107；盖板107位于第二封装层106b背离显示基板101一侧。
盖板107可以采用玻璃、亚克力等透明材料制成，可以对显示面板中的各个膜层进行保护，防止在使用过程中外力对显示面板中的其他膜层造成损坏。
可以理解的是，本公开实施例提供的显示面板除了上述的各个膜层之外还可以包括触控层、偏光片层等相关技术中的现有膜层，其实现原理与相关技术中的实现原理相同，在此不再进行赘述。
第二方面，本公开实施例提供了一种显示装置，该显示装置包括如上述任一实施例提供的显示面板，该显示装置具体可以为手机、平板电脑、电视机、电脑显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产 品或部件，其实现原理及有益效果与上述的显示面板的实现原理及有益效果相同，在此不再进行赘述。
第三方面，本公开实施例提供了一种显示面板的制备方法，用于制备如上述任一实施例提供的显示面板，该显示面板具有多个显示区；每个显示区包括：发光区和透明区。图5为本公开实施例提供的一种显示面板的制备方法的流程示意图，图6a至图6k为图5所示的显示面板的制备方法中的各个步骤对应的结构示意图，下面将结合如图5所示，该显示面板的制备方法包括如下步骤S501至步骤S511。
S501，在显示基板上形成平坦化层，并将平坦化层的发光区和透明区之间的位置进行刻蚀，形成隔断槽。
如图6a所示，首先在基底1011上形成驱动电路层1012，以形成显示基板101，在驱动电路层1012上沉积一层有机材料层，形成平坦化层102，并对平坦化层102进行图案化处理，刻蚀掉平坦化层102在发光区和透明区之间的位置的部分材料，形成隔断槽。
S502，在平坦化层上形成第一电极，使得第一电极在隔断槽处截止。
如图6b所示，在平坦化层102上形成第一电极1041，并对第一电极1041进行图案化处理，使得第一电极1041在隔断槽处截止，避免影响透明区的透光度。
S503，在隔断槽处的第一电极上形成第一阻挡层。
如图6c所示，在第一电极上沉积一层无机材料层，并对无机材料层进行图案化处理，形成第一阻挡层105a，使得第一阻挡层105a覆盖隔断槽处的第一电极1041。
S504，在隔断槽内形成像素限定层。
如图6d所示，在隔断槽处形成像素限定层103，使得像素限定层103覆盖第一阻挡层105a。
S505，在像素限定成上形成第二阻挡层和第三阻挡层，使得第二阻挡层覆盖像素限定层靠近发光区的侧面，及第三阻挡层覆盖像素限定层靠近透明区的侧面。
如图6e所示，在像素限定层103上形成一层无机材料，并对无机材料层进行图案化处理，形成第二阻挡层105b和第三阻挡层105c，使得第二阻挡层105b覆盖像素限定层103靠近发光区的侧面，及第三阻挡层105c覆盖像素限定层103靠近透明区的侧面。
S506，在像素限定层所限定区域形成有机功能层。
如图6f所示，利用高精度金属掩膜板，或者喷墨打印工艺，将有机发光材料注入至像素限定层103所限定的区域内，与形成有机功能层1043。
S507，在有机功能层上形成第二电极。
如图6g所示，在有机功能层1043上沉积导电材料，以形成第二电极1042。
S508，在第二电极上形成第一封装层。
如图6h所示，在第二电极1042上沉积一层无机材料层，形成第一封装层106a，以对发光器件104进行封装，防止水分或氧气侵入发光器件104的有机功能层1043。
S509，去除透明区的第一封装层和第二电极。
如图6i所示，利用刻蚀工艺，将透明区的第一封装层106a和第二电极1042去除，以简化显示面板透明区的结构，提高显示面板的透明度。
S510，在第一封装层上形成第二封装层。
如图6j所示，在第一封装层106a上沉积一层无机材料层，形成第二封装层106b，以对显示面板整体进行封装。
S511，将盖板贴合于第二封装层上。
如图6k所示，将盖板107贴合于第二封装层106b上，以对显示面板中 的各个膜层进行保护，防止使用过程中外力对各个膜层造成损坏。
本公开实施例提供的显示面板的制备方法中，发光器件104的第一电极1041和第二电极1042可以由发光区延伸至隔断槽处并截止，可以不必再透明区设置第一电极1041和第二电极1042，因此可以避免第一电极1041和第二电极1042对光线的遮挡，从而可以提高显示面板的透明度。并且，隔断槽可以将平坦化层102在发光区和透明区之间的位置断开，可以避免水分或氧气通过平坦化层102侵入至发光器件104的有机功能层。同时，像素限定层103设置于隔断槽处，第一阻挡层105a、第二阻挡层105b和第三阻挡层105c可以将像素限定层103的各个侧面进行包围，可以避免水分或氧气通过像素限定层103侵入至发光器件104的有机功能层。这样，可以提高显示面板的寿命的信赖性，进而提高显示面板的显示效果。
可以理解的是，以上实施方式仅仅是为了说明本公开的原理而采用的示例性实施方式，然而本公开并不局限于此。对于本领域内的普通技术人员而言，在不脱离本公开的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本公开的保护范围。

Claims (20)

  1. 一种显示面板，具有多个显示区；每个所述显示区包括：发光区和透明区；其中，所述显示面板包括：显示基板、位于所述显示基板上的平坦化层、像素限定层和发光器件；所述发光器件包括：相对设置的第一电极和第二电极、及位于所述第一电极和所述第二电极之间的有机功能层；
    所述平坦化层在所述发光区和所述透明区的之间设置有隔断槽；至少部分所述像素限定层设置于所述隔断槽内；所述第一电极和所述第二电极均由所述发光区延伸至所述隔断槽处并截止；所述有机功能层位于所述像素限定层所限的区域内。
  2. 根据权利要去1所述的显示面板，其中，所述第一电极覆盖所述隔断槽靠近所述发光区的侧壁，所述第二电极覆盖所述隔断槽靠近所述透明区的侧壁。
  3. 根据权利要去1所述的显示面板，其中，所述显示面板还包括：第一阻挡层、第二阻挡层和第三阻挡层；
    所述第一阻挡层位于所述像素限定层靠近所述第一电极的一侧；所述第二阻挡层位于所述像素限定层靠近所述有机功能层的一侧；所述第三阻挡层位于所述像素限定层靠近所述第二电极的一侧。
  4. 根据权利要求3所述的显示面板，其中，所述第一阻挡层和所述第二阻挡层的高度和小于或等于所述像素限定层的高度；
    所述第三阻挡层的高度小于或等于所述像素限定层的高度。
  5. 根据权利要求3所述的显示面板，其中，所述第二阻挡层和所述第三阻挡层背离所述显示基板的一侧的角部均设置为缺角结构。
  6. 根据权利要求1所述的显示面板，其中，所述显示面板还包括：覆盖所述第二电极且叠层设置的第一封装层和第二封装层；
    所述第一封装层由所述发光区延伸至所述隔断槽处并截止，所述第二封装层由所述发光区延伸至所述透明区。
  7. 根据权利要求1所述的显示面板，其中，所述发光区包括：反射发光区和透明发光区；
    所述第一电极包括：反射层和位于所述反射层背离所述显示基板一侧的透明导电层；所述反射层设置于反射发光区；所述透明导电层设置于所述反射发光区和所述透明发光区。
  8. 根据权利要求7所述的显示面板，其中，所述反射层的材料包括：银、铝、铜中的至少一种；
    所述透明导电层的材料包括：氧化铟锡、氧化铟锌中的至少一种。
  9. 根据权利要求7所述的显示面板，其中，所述显示基板包括：基底、位于所述基底上的驱动电路层；所述驱动电路层包括：多个薄膜晶体管；
    所述多个薄膜晶体管设置于所述反射发光区。
  10. 根据权利要求9所述的显示面板，其中，所述多个薄膜晶体管在所述基底上的正投影落在所述反射层在所述基底上的正投影内。
  11. 根据权利要求9所述的显示面板，其中，所述薄膜晶体管包括：多层绝缘层；所述多层绝缘层在所述反射发光区和所述透明发光区之间的位置截止。
  12. 根据权利要求6所述的显示面板，其中，所述显示面板还包括：盖板；
    所述盖板位于所述第二封装层背离所述显示基板一侧。
  13. 一种显示装置，其中，所述显示装置包括如权利要求1至12任一项所述的显示面板。
  14. 一种显示面板的制备方法，所述显示面板具有多个显示区；每个所述显示区包括：发光区和透明区；其中，所述显示面板的制备方法包括：
    在所述显示基板上形成平坦化层，并将所述平坦化层的所述发光区和所述透明区之间的位置进行刻蚀，形成隔断槽；
    在所述平坦化层上形成第一电极，使得所述第一电极在所述隔断槽处截 止；
    在所述隔断槽内形成像素限定层；
    在所述像素限定层所限定区域形成有机功能层；
    在所述有机功能层上形成第二电极；
    去除所述透明区的所述第二电极，使得所述第二电极在所述隔断槽处截止。
  15. 根据权利要求14所述的显示面板的制备方法，其中，在所述隔断槽内形成像素限定层，之前还包括：
    在隔断槽处所述第一电极上形成第一阻挡层。
  16. 根据权利要求15所述的显示面板的制备方法，其中，在所述隔断槽内形成像素限定层，之后还包括：
    在所述像素限定层上形成第二阻挡层和第三阻挡层，使得所述第二阻挡层所述像素限定成靠近所述发光区的侧面，所述第三阻挡层覆盖所述像素限定层靠近所述透明区的侧面。
  17. 根据权利要求14所述的显示面板的制备方法，其中，在所述有机功能层上形成第二电极，之后还包括：
    在所述第二电极上形成第一封装层；
    去除所述透明区的第一封装层和第二电极；
    在所述第一封装层上形成第二封装层。
  18. 根据权利要求14所述的显示面板的制备方法，其中，在所述像素限定层所限定区域形成有机功能层，包括：
    利用精细金属掩模板，形成所述有机功能层。
  19. 根据权利要求14所述的显示面板的制备方法，其中，在所述像素限定层所限定区域形成有机功能层，包括：
    采用喷墨打印工艺，形成所述有机功能层。
  20. 根据权利要求17所述的显示面板的制备方法，其中，在所述第一 封装层上形成第二封装层，之后还包括：
    将盖板贴合于所述第二封装层上。
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