WO2023184244A1 - 显示基板及显示装置 - Google Patents

显示基板及显示装置 Download PDF

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Publication number
WO2023184244A1
WO2023184244A1 PCT/CN2022/084105 CN2022084105W WO2023184244A1 WO 2023184244 A1 WO2023184244 A1 WO 2023184244A1 CN 2022084105 W CN2022084105 W CN 2022084105W WO 2023184244 A1 WO2023184244 A1 WO 2023184244A1
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WO
WIPO (PCT)
Prior art keywords
sub
layer
touch signal
area
signal line
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PCT/CN2022/084105
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English (en)
French (fr)
Inventor
仝可蒙
董向丹
何帆
樊聪
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to PCT/CN2022/084105 priority Critical patent/WO2023184244A1/zh
Priority to CN202280000632.0A priority patent/CN117157761A/zh
Publication of WO2023184244A1 publication Critical patent/WO2023184244A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body

Definitions

  • the present disclosure relates to the field of display technology, and in particular to display substrates and display devices.
  • the touch signal line of the touch module needs to be jumped to the metal layer of the display panel, that is, the touch signal line needs to pass through the transfer hole that penetrates the insulation layer and the metal layer of the display panel. Layers are overlapped.
  • the distance between the boundary of the inorganic encapsulation layer in the touch display panel and the transfer hole is relatively close.
  • the display substrate includes:
  • the base substrate includes: a display area and a peripheral area outside the display area; the peripheral area includes at least one bending area, a first sub-area located between the at least one bending area and the display area, and a first sub-area located between the at least one bending area and the display area.
  • the second sub-area on the side away from the display area;
  • a plurality of first connection leads located on one side of the base substrate; a plurality of first connection leads extending from the first sub-region through the bending area to the second sub-region;
  • the encapsulation layer is located on the side of the first connection lead facing away from the base substrate; the encapsulation layer covers the display area and extends to the first sub-region;
  • a plurality of first touch signal lines are located on the side of the packaging layer away from the first connection leads; the first touch signal lines correspond to the first connection leads one-to-one; each first touch signal line includes a component located in the first sub-region The first sub-touch signal line and the second sub-touch signal line located in the second sub-region; one end of the first connection lead is electrically connected to the first sub-touch signal line, and the other end of the first connection lead is electrically connected to the second sub-touch signal line.
  • the sub-touch signal line is electrically connected;
  • a plurality of second connection leads are located between the packaging layer and the first touch signal line, or on the same layer as the first touch signal line; the second connection leads correspond to the first connection leads one by one; the second connection leads pass through The bending area is electrically connected to the first sub-touch signal line and the second sub-touch signal line in one-to-one correspondence.
  • the display substrate further includes: a plurality of first transfer electrodes and a plurality of second transfer electrodes located between the first touch signal line and the packaging layer. a first organic insulating layer between the transfer electrodes, and a first planarization layer between the first connection lead and the packaging layer;
  • the first transfer electrode is located in the first sub-region, and the second transfer electrode is located in the second sub-region;
  • the first sub-touch signal line is electrically connected to the first transfer electrode through a via hole penetrating the first organic insulating layer
  • the second sub-touch signal line is electrically connected to the second transfer electrode through a via hole penetrating the first organic insulating layer. connect;
  • the first transfer electrode and the second transfer electrode are respectively electrically connected to both ends of the first connection lead through via holes penetrating the first planarization layer.
  • the second connection lead and the first touch signal line are arranged on the same layer and connected integrally.
  • the display substrate further includes:
  • the second organic insulating layer is located on the side of the first touch signal line away from the packaging layer; the second organic insulating layer covers the second connecting lead.
  • the second connection lead is arranged on the same layer as the first transfer electrode and the second transfer electrode and is integrally connected.
  • the first organic insulating layer covers the second connection lead.
  • the display substrate further includes:
  • the third organic insulating layer is located between the first transfer electrode and the encapsulation layer;
  • the third organic insulating layer includes a first removal area
  • the orthographic projection of the first removal area on the base substrate covers the bending area and the orthographic projections of the first transfer electrode and the second transfer electrode on the base substrate;
  • the distance between the edge of the first sub-region and the first transfer electrode in the first removal area is greater than 0, and the distance between the edge of the first removal area and the second transfer electrode in the second sub-area is greater than 0.
  • the display substrate further includes:
  • the third organic insulating layer is located between the first transfer electrode and the encapsulation layer;
  • the third organic insulating layer includes a first removal area
  • the orthographic projection of the first removal area on the base substrate covers the bending area and the orthographic projection of the first transfer electrode on the base substrate; the orthographic projection of the first removal area on the base substrate and the second transfer electrode on the base substrate The orthographic projections of do not overlap with each other;
  • the distance between the edge of the first sub-region and the first transfer electrode in the first removal area is greater than 0, and the distance between the edge of the first removal area and the second transfer electrode in the second sub-area is greater than 0.
  • the first organic insulating layer covers an edge of the first removal area.
  • the encapsulation layer includes an inorganic encapsulation layer and an organic encapsulation layer that are alternately stacked; the inorganic encapsulation layer covers the display area and extends to cover the first sub-region; the inorganic encapsulation layer is located at the edge of the first sub-region and is removed from the first sub-region. The area is on one side of the edge of the first sub-area close to the display area.
  • the encapsulation layer specifically includes: a stacked first inorganic encapsulation layer, a first organic encapsulation layer, a second inorganic encapsulation layer, a second organic encapsulation layer, and a third inorganic encapsulation layer.
  • the first connection lead includes: a first sub-connection lead and a second sub-connection lead;
  • the display substrate also includes:
  • a plurality of third connection leads are located between the substrate and the first connection lead, corresponding to the first connection leads one-to-one; one end of the third connection lead is electrically connected to the first sub-connection lead, and the other end of the third connection lead is electrically connected to the first sub-connection lead. electrically connected to the second sub-connection lead.
  • the third connection lead is located in the second sub-region.
  • the display substrate further includes:
  • the second planarization layer is located between the first connection lead and the third connection lead; in the bending area, only the second planarization layer is included between the base substrate and the first connection lead.
  • the display substrate further includes:
  • a plurality of light-emitting devices located between the first planarization layer and the packaging layer;
  • a plurality of third connection electrodes are arranged in the same layer as the first connection leads; the third connection electrodes are electrically connected to the light-emitting devices in one-to-one correspondence through via holes penetrating the first planarization layer;
  • a plurality of thin film transistors are located between the base substrate and the second planarization layer; the thin film transistors include a gate electrode arranged in the same layer as the third connection lead, a source electrode and a drain electrode located between the gate electrode and the second planarization layer. ; The third connection electrode is electrically connected to the source or the drain through a via hole penetrating the second planarization layer.
  • a display device provided by an embodiment of the present disclosure includes a display substrate provided by an embodiment of the present disclosure.
  • Figure 1 is a schematic structural diagram of a display substrate provided by an embodiment of the present disclosure
  • Figure 2 is an enlarged schematic diagram of area A in Figure 1 provided by an embodiment of the present disclosure
  • Figure 3 is a cross-sectional view along BB' in Figure 2 provided by an embodiment of the present disclosure
  • Figure 4 is a schematic structural diagram of a display area of a display substrate provided by an embodiment of the present disclosure
  • Figure 5 is another enlarged schematic diagram of area A in Figure 1 provided by an embodiment of the present disclosure.
  • Figure 6 is a cross-sectional view along CC' in Figure 5 provided by an embodiment of the present disclosure.
  • Figure 7 is another enlarged schematic diagram of area A in Figure 1 provided by an embodiment of the present disclosure.
  • Figure 8 is a cross-sectional view along DD' in Figure 7 provided by an embodiment of the present disclosure.
  • Figure 9 is another enlarged schematic diagram of area A in Figure 1 provided by an embodiment of the present disclosure.
  • Figure 10 is a cross-sectional view along EE' in Figure 9 provided by an embodiment of the present disclosure.
  • FIG. 11 is a schematic structural diagram of another display substrate provided by an embodiment of the present disclosure.
  • first buffer layer when forming a touch functional layer on an encapsulation layer, it is usually necessary to form a first buffer layer, a first touch metal layer, a touch insulation layer, and a second touch metal layer in sequence.
  • first buffer layer and the touch insulation layer are both organic materials, when the organic material is patterned, only exposure and development are required without etching process.
  • touch signal line needs to pass through the insulation layer,
  • the contact hole is overlapped with the metal layer of the display panel, if the inorganic material of the encapsulation layer remains at the transfer hole, the remaining inorganic material cannot be removed during the patterning process of the organic material, resulting in the touch signal line and metal The layers cannot overlap, causing the touch signal to be unable to be transmitted.
  • the display substrate includes:
  • the base substrate 1 includes: a display area 2 and a peripheral area 3 outside the display area 2; the peripheral area 3 includes at least one bending area 4, a first sub-area located between at least one bending area 4 and the display area 2 5, and a second sub-region 6 located on the side of at least one bending region 4 away from the display region 2;
  • a plurality of first connection leads 7 are located on one side of the base substrate 1; a plurality of first connection leads 7 extend from the first sub-region 5 through the bending area 4 to the second sub-region 6;
  • the encapsulation layer 8 is located on the side of the first connection lead 7 away from the base substrate 1; the encapsulation layer 8 covers the display area 2 and extends to the first sub-region 5;
  • a plurality of first touch signal lines 9 are located on the side of the packaging layer 8 away from the first connection leads 7; the first touch signal lines 9 correspond to the first connection leads 7 one-to-one; each first touch signal line 9 It includes a first sub-touch signal line 10 located in the first sub-region 5 and a second sub-touch signal line 11 located in the second sub-region 6; one end of the first connection lead 7 is electrically connected to the first sub-touch signal line 10. Connect, the other end of the first connection lead 7 is electrically connected to the second sub-touch signal line 11;
  • a plurality of second connection leads 12 are located between the packaging layer 8 and the first touch signal line 9 , or on the same layer as the first touch signal line 9 ; the second connection leads 12 correspond to the first connection leads 7 one-to-one. ; The second connection lead 12 penetrates the bending area 4 and is electrically connected to the first sub-touch signal line 10 and the second sub-touch signal line 11 in one-to-one correspondence.
  • the first touch signal line, the first connection lead, and the second connection lead form a touch wiring that transmits the touch signal; because the second connection lead is arranged on the packaging layer away from the base substrate, side, and the second connection lead is electrically connected to the first sub-touch signal line and the second sub-touch signal line in a one-to-one correspondence, so the second connection lead is connected to the first sub-touch signal line and the second sub-touch signal line.
  • the connection will not be affected by the residue of the encapsulation layer.
  • the touch signal can also be transmitted through the second connection lead, which can avoid touch failure.
  • FIG. 2 is an enlarged schematic diagram of area A in FIG. 1 .
  • Figure 3 is a cross-sectional view along BB' in Figure 2.
  • Figure 4 is a cross-sectional view of the display substrate in the display area.
  • FIG. 2 and FIG. 3 illustrate using the example that the second connection lead 12 and the first touch signal line 9 are located on the same layer.
  • the second connection lead and the first touch signal line may be integrally connected.
  • Figure 1 takes the peripheral area 3 including only one bending area as an example for illustration, and Figures 1 and 2 take the state where the bending area is not bent as an example for illustration.
  • the bending area can be bent along the bending axis to bend the second sub-region toward the back side of the base substrate.
  • the perimeter zone may also include further bending zones.
  • the display area 2 further includes a plurality of touch electrodes 34 .
  • the touch electrode 34 is located on the side of the packaging layer 8 facing away from the base substrate 1 .
  • the touch electrode 34 includes a plurality of touch sensing electrodes RX and a plurality of touch driving electrodes TX that intersect with each other; each touch sensing electrode RX includes: a plurality of touch sensing electrodes RX. sub-electrodes 17, and connecting portions 16 connecting adjacent touch sensing sub-electrodes 17; each touch driving electrode TX includes: a plurality of touch driving sub-electrodes 14, and bridge electrodes connecting adjacent touch driving sub-electrodes 14 15.
  • the touch sensing sub-electrodes 17 and the connecting portion 16 are integrally connected, and the touch sensing sub-electrodes 17, the connecting portion 16 and the touch driving sub-electrodes 14 are arranged on the same layer.
  • the bridge electrode 15 is located between the encapsulation layer 8 and the touch driving sub-electrode 14 .
  • the touch sensing sub-electrodes and the touch driving sub-electrodes are rhombus-shaped block electrodes as an example for illustration.
  • the touch sensing electrodes and the touch driving electrodes may be mesh electrodes, for example.
  • the display substrate further includes: a first organic insulating layer 23 , a second organic insulating layer 24 , and a third organic insulating layer 22 .
  • the first organic insulating layer 23 is located between the touch sensor sub-electrode 14 and the bridge electrode 15 .
  • the second organic insulating layer 24 is located on the side of the touch sensor sub-electrode 14 and the first touch signal line 9 away from the packaging layer 8 .
  • the three organic insulation layers 22 are located between the bridge electrode 15 and the encapsulation layer 8 .
  • the touch sensing sub-electrode 14 is electrically connected to the bridge electrode 15 through a via hole penetrating the first organic insulating layer 23 .
  • the material of the first organic insulating layer, the second organic insulating layer and the third organic insulating layer is photoresist.
  • the insulating layer on the side of the encapsulation layer facing away from the base substrate is an organic insulating layer.
  • the arrangement of the organic insulating layer can satisfy the needs of most people. Stress requirements for angle bending to avoid defects such as bending and fracture.
  • the first touch signal line is arranged in the same layer as the touch sensing sub-electrodes, the connecting portion and the touch driving sub-electrodes.
  • the embodiments of the present disclosure use Flexible Multi Layer On Cell (FMLOC) to form an organic insulating layer, a touch electrode, a first touch signal line, a second touch signal line, and a second touch signal line on the packaging layer. Connect leads and other touch functional layers.
  • FMLOC Flexible Multi Layer On Cell
  • the touch sensing electrode RX extends along the first direction X
  • the touch driving electrode TX extends along the second direction Y
  • the first direction X intersects the second direction Y, for example, the first direction X Perpendicular to the second direction Y.
  • the positions of the touch sensing electrodes RX and the touch driving electrodes TX can be interchanged.
  • both the touch sensing electrode RX and the touch driving electrode TX need to be electrically connected to the first touch signal line 9 .
  • part of the first sub-touch signal line 10 located in the first sub-region 5 extends to the remaining peripheral areas and is electrically connected to the touch sensing electrode RX extending along the first direction X, and part of it is located in the first sub-region 5 .
  • a sub-touch signal line 10 extends to the display area and is electrically connected to the touch driving electrode TX extending along the second direction Y.
  • the first touch signal line, the first connection lead, and the second connection lead form a touch trace that transmits the touch signal.
  • the touch trace can provide a driving signal to the corresponding touch electrode or receive a corresponding touch signal. sensing signal on the touch electrode. That is, the touch wiring electrically connected to the touch sensing electrode RX receives the sensing signal on the corresponding touch sensing electrode RX, and the touch wiring electrically connected to the touch driving electrode TX is used to send the signal to the corresponding touch driving electrode TX. Provides driving signals.
  • the display substrate further includes a binding terminal 13 electrically connected to the first touch signal line 9 .
  • the binding terminal can be bound to a driving unit such as a flexible circuit board, for example, so that the driving unit such as the flexible circuit board can provide driving signals and receive sensing signals.
  • the display substrate further includes: a plurality of first touch signal lines 9 located between the first touch signal lines 9 and the packaging layer.
  • Figure 5 is another enlarged schematic view of area A in Figure 1
  • Figure 6 is a cross-sectional view along CC' in Figure 5.
  • Figure 7 is another enlarged schematic view of area A in Figure 1
  • Figure 8 is a cross-sectional view along DD' in Figure 7.
  • Figure 9 is another enlarged schematic view of area A in Figure 1
  • Figure 10 is a cross-sectional view along EE' in Figure 9.
  • the first transfer electrode and the second transfer electrode are arranged in the same layer as the bridge electrode. That is, the third organic insulating layer is located between the first transfer electrode and the encapsulation layer, and the first organic insulating layer extends to the peripheral area and is located between the first touch signal line and the first transfer electrode.
  • the first sub-touch signal line 10 is electrically connected to the first transfer electrode 35 through the via hole 38 penetrating the first organic insulating layer 23 .
  • the sub-touch signal line 11 is electrically connected to the second transfer electrode 36 through the via hole 40 penetrating the first organic insulating layer 23 .
  • the display substrate further includes: a first planarization layer 25 located between the first connection lead 7 and the packaging layer; a first transfer electrode 35 and a first transfer electrode 35 .
  • the two transfer electrodes 36 are respectively electrically connected to both ends of the first connection lead 7 through via holes penetrating the first planarization layer 25 .
  • the first transfer electrode 35 is electrically connected to the first connection lead 7 through the via hole 37 penetrating the first planarization layer 25 in the first sub-region 5 .
  • the connecting electrode 36 is electrically connected to the first connecting lead 7 through a via hole 39 penetrating the first planarization layer 25 in the second sub-region 6 .
  • first connection lead since the first connection lead needs to be electrically connected to the first touch signal line, it is necessary to form a through-hole through the first planarization layer in the first sub-region and the second sub-region to expose the first connection. lead.
  • first connection lead exposed by the via hole is not provided with any protection, if overetching occurs during the bridge electrode patterning process, damage will be caused to the first connection lead in the via hole area.
  • a first connection electrode and a second connection electrode that are in contact with the first connection lead are provided in the area where the first connection lead is exposed through the first planarization layer via hole, and the first connection electrode and the second connection are The electrode covers the first connection lead in the via area to avoid damage to the first connection lead if over-engraving occurs during the patterning process, and the first connection lead and the first touch signal line can also pass through the first connection electrode and The second connection electrode implements electrical connection.
  • the second connection lead 12 and the first touch signal line 9 are arranged on the same layer and integrally connected.
  • the second organic insulating layer 24 covers the second connection lead 12 . Therefore, the second organic insulating layer can protect the second connecting lead.
  • the second connection lead 12 is arranged on the same layer as the first transfer electrode 35 and the second transfer electrode 36 and is integrally connected.
  • the first organic insulating layer 23 covers the second connection lead 12 . Therefore, the first organic insulating layer can protect the second connecting lead.
  • the display substrate further includes: second touch signal lines 18 that correspond to and are electrically connected to the first touch signal lines 9 . Therefore, when the resistance of the touch signal line meets the needs, the line width of the touch signal line can be reduced to save wiring space.
  • the second touch signal line and the bridge electrode are arranged on the same layer.
  • the second touch signal line is arranged in the same layer as the bridge electrode, the first transfer electrode and the second transfer electrode.
  • the orthographic projection of the second touch signal line on the base substrate overlaps with the orthographic projection of the first touch signal line on the base substrate.
  • the first touch signal line communicates with the second touch signal line through a via hole penetrating the first organic insulating layer.
  • the touch signal line is electrically connected.
  • the first touch signal is used in Figures 2, 5, 7, and 9.
  • An example will be given by taking an example in which the line widths of the line, the second touch signal line, the first connection lead, and the second connection lead are not exactly the same.
  • the line widths between the first touch signal line, the second touch signal line, the first connection lead, and the second connection lead can be set as needed, and the line widths of the above signal lines can be exactly the same. Partially the same, or completely different.
  • the third organic insulating layer 22 includes a first removal area 41;
  • the orthographic projection of the first removal area 41 on the base substrate 1 covers the bending area 4 and the orthographic projection of the first transfer electrode 35 and the second transfer electrode 36 on the base substrate 1;
  • the distance between the edge of the first sub-region 5 and the first transfer electrode 35 in the first removal area 41 is greater than 0, and the distance between the edge of the first removal area 41 and the second transfer electrode 36 is between the edge of the second sub-area 6 and the second transfer electrode 36 .
  • the distance is greater than 0.
  • the third organic insulating layer after the third organic insulating layer is patterned, its edge usually has a rough inclined surface. After the first transfer electrode, the second transfer electrode and the bridge electrode are patterned, the third organic insulating layer Sloping surfaces at the edges of large removed areas can easily cause conductor material to remain.
  • the distance between the edge of the first removal area and the first transfer electrode and the second transfer electrode is greater than 0, that is, the distance between the edge of the first removal area and the first transfer electrode and the second transfer electrode is greater than 0.
  • the two transfer electrodes are not in contact, thereby avoiding the occurrence of conductor material residue on the inclined surface at the edge of the first removal area, causing short circuits between the plurality of first transfer electrodes and short circuits between the plurality of second transfer electrodes.
  • the orthographic projection of the first removal area on the base substrate covers the bending area and the orthographic projection of the first transfer electrode on the base substrate; the first removal area The orthographic projection on the base substrate and the orthographic projection of the second transfer electrode on the base substrate do not overlap with each other;
  • the distance between the edge of the first sub-region and the first transfer electrode in the first removal area is greater than 0, and the distance between the edge of the first removal area and the second transfer electrode in the second sub-area is greater than 0.
  • the edge of the first removal area in the first sub-region is located on the side of the first transfer electrode close to the display area, and the edge of the first removal area in the second sub-area is located between the bending area and the second transfer electrode.
  • the first removal area is located at the edge of the first sub-region on the side of the first transfer electrode close to the display area, and the first removal area is located at the edge of the second sub-region between the bending area and the first transfer electrode.
  • the distances between the edge of the first removal area and the first transfer electrode and the second transfer electrode are both greater than 0, that is, the distance between the edge of the first removal area and the first transfer electrode and the second transfer electrode can be satisfied. None of the second transfer electrodes are in contact with each other, thereby avoiding short circuits between multiple first transfer electrodes and short circuits between multiple second transfer electrodes caused by residual conductor material on the inclined surface at the edge of the first removal area.
  • the first removal area 41 is conveniently located on the side of the second transfer electrode 36 away from the bending area 4, that is, in the second sub-region 6.
  • the third organic insulating layer on the side of the transfer electrode 36 away from the bending area 4 has an entire edge that has been removed. Therefore, in order to avoid the occurrence of conductor material residue on the inclined surface of the edge of the area where the third organic insulating layer has been removed in a large area, resulting in multiple strips of the third organic insulating layer.
  • the two touch signal lines are short-circuited, and the second touch signal line 18 is only located in the first sub-region 5 .
  • the first removal area is located between the bending area and the second transfer electrode at the edge of the second sub-area, it is in the second sub-area and at the second transfer electrode.
  • multiple via holes are provided in the third organic insulating layer to realize the transfer between the second transferring electrode and the first connecting lead.
  • the third organic insulation layer does not have an entire edge removed. Therefore, as shown in FIG. 9 , the second touch signal line 18 can still be provided in the second sub-region 6 to save wiring space.
  • the first organic insulating layer 23 covers the edge of the first removal region 41 .
  • the first organic insulating layer covers the edge of the first removal area, that is, the first organic insulating layer covers the area between the third organic insulating layer and the first transfer electrode and the third organic insulating layer.
  • the area between the first transfer electrode and the second transfer electrode further ensures that the edge of the first removal area does not contact the first transfer electrode and the second transfer electrode, thereby avoiding the occurrence of residual conductor material on the inclined surface of the edge of the removal area, causing multiple There is a short circuit between the first switching electrodes, and there is a short circuit between the plurality of second switching electrodes.
  • the encapsulation layer includes an inorganic encapsulation layer and an organic encapsulation layer that are alternately stacked; the inorganic encapsulation layer covers the display area and extends to cover the first sub-region; the inorganic encapsulation layer is located at the edge of the first sub-region and is removed from the first sub-region. The area is on one side of the edge of the first sub-area close to the display area.
  • the encapsulation layer 8 specifically includes: a first inorganic encapsulation layer 47 , a first organic encapsulation layer 48 , a second inorganic encapsulation layer 49 , a second organic encapsulation layer 50 , and a stacked arrangement. Three inorganic encapsulation layers 51.
  • the display substrate provided by the embodiment of the present disclosure, three layers of inorganic encapsulation layers and two layers of organic encapsulation layers are alternately arranged. Compared with the conventional display product that only has three layers of encapsulation layers, it can meet the stress requirements of large-angle bending and avoid the occurrence of Defects such as bending and breakage.
  • edges of the first inorganic encapsulation layer, the second inorganic encapsulation layer, and the third inorganic encapsulation layer at the first sub-region are all located on the side of the first removal area at the edge of the first sub-region close to the display area.
  • the display substrate specifically includes: a driving circuit layer 32 located between the substrate substrate 1 and the packaging layer 8 , and a plurality of light-emitting devices located between the driving circuit layer 32 and the packaging layer 8 33.
  • the light emitting device 33 is located between the first planarization layer 25 and the packaging layer 8 .
  • the driving circuit layer includes a plurality of pixel driving circuits arranged in an array; the pixel driving circuits are used to drive the light-emitting device to emit light.
  • the pixel driving circuit includes, for example, a thin film transistor 42 and a storage capacitor (not shown).
  • the thin film transistor 42 includes: an active layer 43 , a gate G between the active layer 43 and the first planarization layer 25 , a gate electrode between the gate G and the first planarization layer 25 .
  • the source electrode S and the drain electrode D between the layers 25; the display substrate also includes: a first buffer layer 27 located between the base substrate 1 and the active layer 43; a third buffer layer 27 located between the active layer 43 and the gate electrode G.
  • the display substrate also includes: a first electrode of the storage capacitor located between the first gate insulating layer and the second gate insulating layer; and a second electrode of the storage capacitor and the gate electrode G are arranged in the same layer.
  • the third connection electrode 52 is electrically connected to the light-emitting device 33 in a one-to-one correspondence through via holes penetrating the first planarization layer 25 .
  • the thin film transistor 42 is located between the base substrate 1 and the second planarization layer 26 .
  • the third connection electrode is electrically connected to the source or drain of the thin film transistor 42 through a via hole penetrating the second planarization layer 26 and the passivation layer 31.
  • the third connection electrode 52 passes through the second planarization layer 31.
  • the light-emitting device layer 31 includes a stacked anode 44 , a light-emitting functional layer 45 , and a cathode 46 .
  • the third connection electrode 52 is electrically connected to the anode 44 through a via hole penetrating the first planarization layer 25.
  • the light-emitting device is, for example, an organic light-emitting diode device or a quantum dot light-emitting diode device.
  • the pixel definition layer has multiple opening areas corresponding to the light-emitting devices one-to-one, and the light-emitting devices are located in the opening areas.
  • the display substrate also includes a retaining wall surrounding the display area.
  • the retaining wall is composed of a stack of portions placed on the same layer as the pixel definition layer and portions placed on the same layer as the first planarization layer.
  • the retaining wall is used to block the organic encapsulation layer; at least the first inorganic encapsulation layer covers the retaining wall. In the first sub-region, the edge of the first inorganic insulation layer is located between the retaining wall and the edge of the first removal area.
  • the first connection lead and the third connection electrode are arranged in the same layer.
  • only the second planarization layer 26 is included between the substrate 1 and the first connection lead 7 . This can reduce the number of insulating film layers in the bending area, and avoid the risk of film peeling and falling off when bending in the bending area when there are many film layers.
  • first connection lead and the source and drain electrodes may also be arranged on the same layer; or the first connection lead and the gate electrode may be arranged on the same layer.
  • the first connection lead 7 includes: a first sub-connection lead 53 and a second sub-connection lead 54;
  • the display substrate also includes:
  • a plurality of third connecting leads 55 are located between the base substrate 1 and the first connecting leads 7 and correspond to the first connecting leads 1 one-to-one; one end of the third connecting leads 55 is electrically connected to the first sub-connecting lead 53. The other end of the third connection lead 55 is electrically connected to the second sub-connection lead 54 .
  • a third connection lead is provided to transfer the first sub-connection lead and the second sub-connection lead, which can avoid the situation where only one type of signal line is provided to generate a large amount of static electricity that affects the touch signal transmission.
  • FIG. 11 takes as an example that the display substrate includes a first transfer electrode, a second transfer electrode, and the second connection lead and the first touch signal line are arranged on the same layer.
  • the third connection lead 55 is located in the second sub-region 6 .
  • the third connection lead is arranged on the same layer as the gate electrode of the thin film transistor.
  • the base substrate is a flexible base substrate.
  • the material of the flexible substrate is, for example, polyimide.
  • the base substrate may include, for example, a single-layer flexible base substrate.
  • the base substrate may also include two layers of flexible base substrates and a second buffer layer located between the two layers of flexible base substrates.
  • a display device provided by an embodiment of the present disclosure includes a display substrate provided by an embodiment of the present disclosure.
  • the display device provided by the embodiment of the present disclosure is: a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, or any other product or component with a display function.
  • Other essential components of the display device are understood by those of ordinary skill in the art, and will not be described in detail here, nor should they be used to limit the present disclosure.
  • the first touch signal line, the first connection lead, and the second connection lead constitute the touch wiring that transmits the touch signal; due to the arrangement of the second connection lead
  • the second connection lead is electrically connected to the first sub-touch signal line and the second sub-touch signal line in a one-to-one correspondence. Therefore, the second connection lead is connected to the first sub-touch signal line. The connection with the second sub-touch signal line will not be affected by the residue of the packaging layer.
  • the touch signal can also be transmitted through the second connection lead, which can avoid touch failure.

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Abstract

本公开提供了一种显示基板及显示装置。显示基板包括：衬底基板，包括：显示区以及周边区；周边区包括弯折区，第一子区域，以及第二子区域；多条第一连接引线，从第一子区域经过弯折区延伸至第二子区域；封装层，位于第一连接引线背离衬底基板的一侧；多条第一触控信号线，位于封装层背离第一连接引线的一侧；第一触控信号线包括第一子触控信号线以及第二子触控信号线；第一连接引线的一端与第一子触控信号线电连接，第一连接引线的另一端与第二子触控信号线电连接；多条第二连接引线，位于封装层与第一触控信号线之间，或者与第一触控信号线位于同层；第二连接引线贯穿弯折区、且与第一子触控信号线和第二子触控信号线一一对应电连接。

Description

显示基板及显示装置 技术领域
本公开涉及显示技术领域，尤其涉及显示基板及显示装置。
背景技术
随着显示技术的快发展，人们对手机等显示产品的外观、功能等要求越来越稿，显示产品制备工艺上的挑战也越来越大。
现有技术中，为了减小周边区的尺寸，增大显示区的占屏比，需要将扇出区弯折至显示面板背面。对于触控显示面板，在弯折区，需要将触控模组的触控信号线跳转到显示面板的金属层，即触控信号线需要通过贯穿绝缘层的转接孔与显示面板的金属层进行搭接。但是，触控显示面板中的无机封装层的边界与转接孔之间的距离较近，当对无机封装层进行图形化工艺中，若出现无机材料阴影等工艺不良，在转接孔处容易出现无机材料残留，导致触控信号线与金属层无法搭接，导致触控信号无法传输。
发明内容
本公开实施例提供的一种显示基板，显示基板包括：
衬底基板，包括：显示区以及显示区之外的周边区；周边区包括至少一个弯折区，位于至少一个弯折区与显示区之间的第一子区域，以及位于至少一个弯折区背离显示区一侧的第二子区域；
多条第一连接引线，位于衬底基板的一侧；多条第一连接引线从第一子区域经过弯折区延伸至第二子区域；
封装层，位于第一连接引线背离衬底基板的一侧；封装层覆盖显示区且延伸至第一子区域；
多条第一触控信号线，位于封装层背离第一连接引线的一侧；第一触控信号线与第一连接引线一一对应；每一第一触控信号线包括位于第一子区域 的第一子触控信号线以及位于第二子区域的第二子触控信号线；第一连接引线的一端与第一子触控信号线电连接，第一连接引线的另一端与第二子触控信号线电连接；
多条第二连接引线，位于封装层与第一触控信号线之间，或者与第一触控信号线位于同层；第二连接引线与第一连接引线一一对应；第二连接引线贯穿弯折区、且与第一子触控信号线和第二子触控信号线一一对应电连接。
在一些实施例中，显示基板还包括：位于第一触控信号线与封装层之间的多个第一转接电极以及多个第二转接电极，位于第一触控信号线与第一转接电极之间的第一有机绝缘层，以及位于第一连接引线与封装层之间的第一平坦化层；
第一转接电极位于第一子区域，第二转接电极位于第二子区域；
第一子触控信号线通过贯穿第一有机绝缘层的过孔与第一转接电极电连接，第二子触控信号线通过贯穿第一有机绝缘层的过孔与第二转接电极电连接；
第一转接电极和第二转接电极通过贯穿第一平坦化层的过孔分别与第一连接引线的两端电连接。
在一些实施例中，第二连接引线与第一触控信号线同层设置且一体连接。
在一些实施例中，显示基板还包括：
第二有机绝缘层，位于第一触控信号线背离封装层一侧；第二有机绝缘层覆盖第二连接引线。
在一些实施例中，第二连接引线与第一转接电极、第二转接电极同层设置且一体连接。
在一些实施例中，第一有机绝缘层覆盖第二连接引线。
在一些实施例中，显示基板还包括：
第三有机绝缘层，位于第一转接电极与封装层之间；
在周边区，第三有机绝缘层包括第一去除区；
第一去除区在衬底基板的正投影覆盖弯折区以及第一转接电极和第二转 接电极在衬底基板的正投影；
第一去除区在第一子区域的边缘与第一转接电极之间的距离大于0，第一去除区在第二子区域的边缘与第二转接电极之间的距离大于0。
在一些实施例中，显示基板还包括：
第三有机绝缘层，位于第一转接电极与封装层之间；
在周边区，第三有机绝缘层包括第一去除区；
第一去除区在衬底基板的正投影覆盖弯折区以及第一转接电极在衬底基板的正投影；第一去除区在衬底基板的正投影与第二转接电极在衬底基板的正投影互不交叠；
第一去除区在第一子区域的边缘与第一转接电极之间的距离大于0，第一去除区在第二子区域的边缘与第二转接电极之间的距离大于0。
在一些实施例中，第一有机绝缘层覆盖第一去除区的边缘。
在一些实施例中，封装层包括交替堆叠设置的无机封装层和有机封装层；无机封装层覆盖显示区且延伸覆盖至第一子区域；无机封装层在第一子区域的边缘位于第一去除区在第一子区域的边缘靠近显示区的一侧。
在一些实施例中，封装层具体包括：堆叠设置的第一无机封装层、第一有机封装层、第二无机封装层、第二有机封装层、第三无机封装层。
在一些实施例中，第一连接引线包括：第一子连接引线以及第二子连接引线；
显示基板还包括：
多条第三连接引线，位于衬底基板与第一连接引线之间，与第一连接引线一一对应；第三连接引线的一端与第一子连接引线电连接，第三连接引线的另一端与第二子连接引线电连接。
在一些实施例中，第三连接引线位于第二子区域。
在一些实施例中，显示基板还包括：
第二平坦化层，位于第一连接引线与第三连接引线之间；在弯折区，衬底基板与第一连接引线之间仅包括第二平坦化层。
在一些实施例中，显示基板还包括：
多个发光器件，位于第一平坦化层与封装层之间；
多个第三连接电极，与第一连接引线同层设置；第三连接电极通过贯穿第一平坦化层的过孔与发光器件一一对应电连接；
多个薄膜晶体管，位于衬底基板与第二平坦化层之间；薄膜晶体管包括与第三连接引线同层设置的栅极、位于栅极与第二平坦化层之间的源极和漏极；第三连接电极通过贯穿第二平坦化层的过孔与源极或漏极电连接。
本公开实施例提供的一种显示装置，显示装置包括本公开实施例提供的显示基板。
附图说明
为了更清楚地说明本公开实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简要介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域的普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本公开实施例提供的一种显示基板的结构示意图；
图2为本公开实施例提供的一种图1中A区域的放大示意图；
图3为本公开实施例提供的沿图2中BB’的截面图；
图4为本公开实施例提供的一种显示基板的显示区的结构示意图；
图5为本公开实施例提供的另一种图1中A区域的放大示意图；
图6为本公开实施例提供的沿图5中CC’的截面图；
图7为本公开实施例提供的又一种图1中A区域的放大示意图；
图8为本公开实施例提供的沿图7中DD’的截面图；
图9为本公开实施例提供的又一种图1中A区域的放大示意图；
图10为本公开实施例提供的沿图9中EE’的截面图；
图11为本公开实施例提供的另一种显示基板的结构示意图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。并且在不冲突的情况下，本公开中的实施例及实施例中的特征可以相互组合。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。
需要注意的是，附图中各图形的尺寸和形状不反映真实比例，目的只是示意说明本公开内容。并且自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。
相关技术中，当在封装层上形成触控功能层时，通常需要依次形成第一缓冲层、第一触控金属层、触控绝缘层、第二触控金属层。若第一缓冲层以及触控绝缘层均为有机材料，当对有机材料进行图形化处理时，仅需要进行曝光、显影而无需进行刻蚀工艺，当触控信号线需要通过贯穿绝缘层的转接孔与显示面板的金属层进行搭接时，若在转接孔处出现封装层的无机材料残留，在有机材料进行图形化工艺中无法将残留的无机材料去除，导致触控信号线与金属层无法搭接，导致触控信号无法传输。
基于相关技术存在的上述问题，本公开实施例提供了一种显示基板，如图1、图2、图3、图4所示，显示基板包括：
衬底基板1，包括：显示区2以及显示区2之外的周边区3；周边区3包 括至少一个弯折区4，位于至少一个弯折区4与显示区2之间的第一子区域5，以及位于至少一个弯折区4背离显示区2一侧的第二子区域6；
多条第一连接引线7，位于衬底基板1的一侧；多条第一连接引线7从第一子区域5经过弯折区4延伸至第二子区域6；
封装层8，位于第一连接引线7背离衬底基板1的一侧；封装层8覆盖显示区2且延伸至第一子区域5；
多条第一触控信号线9，位于封装层8背离第一连接引线7的一侧；第一触控信号线9与第一连接引线7一一对应；每一第一触控信号线9包括位于第一子区域5的第一子触控信号线10以及位于第二子区域6的第二子触控信号线11；第一连接引线7的一端与第一子触控信号线10电连接，第一连接引线7的另一端与第二子触控信号线11电连接；
多条第二连接引线12，位于封装层8与第一触控信号线9之间，或者与第一触控信号线9位于同层；第二连接引线12与第一连接引线7一一对应；第二连接引线12贯穿弯折区4、且与第一子触控信号线10和第二子触控信号线11一一对应电连接。
本公开实施例提供的显示基板，第一触控信号线、第一连接引线、第二连接引线组成传输触控信号的触控走线；由于第二连接引线设置在封装层背离衬底基板一侧，且第二连接引线与第一子触控信号线和第二子触控信号线一一对应电连接，因此第二连接引线与第一子触控信号线和第二子触控信号线的连接不会受到封装层残留的影响。并且，即便在第一子触控信号线和第二子触控信号线与第一连接引线电连接的区域存在封装层材料残留而导致第一连接引线与第一触控信号线无法电连接，触控信号也可以通过第二连接引线进行传输，可以避免触控失效。
需要说明的是，图2为图1中A区域的放大示意图。图3为沿图2中BB’的截面图。图4为显示基板在显示区的截面图。图2、图3以第二连接引线12与第一触控信号线9位于同层为例进行举例说明。在具体实施时，当第二连接引线与第一触控信号线位于同层时，第二连接引线与第一触控信号线可 以是一体连接。
需要说明的是，图1以周边区3仅包括一个弯折区为例进行举例说明，且图1、图2中以弯折区未弯折的状态为例进行示意。在具体实施时，可以使得弯折区沿弯折轴弯折以使第二子区域向衬底基板的背面弯折。周边区还可以包括更多弯折区。
在一些实施例中，如图1所示，显示区2还包括多个触控电极34。如图4所示，触控电极34位于封装层8背离衬底基板1一侧。
在一些实施例中，如图1所示，触控电极34包括相互交叉的多个触控感应电极RX和多个触控驱动电极TX；每一触控感应电极RX包括：多个触控感应子电极17，以及连接相邻触控感应子电极17的连接部16；每一触控驱动电极TX包括：多个触控驱动子电极14，以及连接相邻触控驱动子电极14的桥接电极15。在具体实施时，触控感应子电极17以及连接部16一体连接，且触控感应子电极17、连接部16以及触控驱动子电极14同层设置。在一些实施例中，如图4所示，桥接电极15位于封装层8与触控驱动子电极14之间。
需要说明的是，图1中以触控感应子电极和触控驱动子电极为菱形块电极为例进行举例说明。在具体实施时，触控感应电极以及触控驱动电极例如可以是网格状电极。
在一些实施例中，如图3、4所示，显示基板还包括：第一有机绝缘层23、第二有机绝缘层24以及第三有机绝缘层22。第一有机绝缘层23位于触控感应子电极14与桥接电极15之间，第二有机绝缘层24位于触控感应子电极14、第一触控信号线9背离封装层8的一侧，第三有机绝缘层22位于桥接电极15与封装层8之间。触控感应子电极14通过贯穿第一有机绝缘层23的过孔与桥接电极15电连接。
在一些实施例中，第一有机绝缘层、第二有机绝缘层以及第三有机绝缘层的材料为光刻胶。
本公开实施例提供的显示基板，封装层背离衬底基板一侧的绝缘层为有 机绝缘层，当显示基板为柔性显示基板、且应用于曲面弯折产品时，有机绝缘层的设置可以满足大角度弯折的应力需求，避免出现弯曲断裂等不良。
在一些实施例中，第一触控信号线与触控感应子电极、连接部以及触控驱动子电极同层设置。
在具体实施时，本公开实施例采用柔性多层一体化集成触控技术(Flexible Multi Layer On Cell，FMLOC)在封装层上形成有机绝缘层、触控电极、第一触控信号线、第二连接引线等触控功能层。
在一些实施例中，图1中，触控感应电极RX沿第一方向X延伸，触控驱动电极TX沿第二方向Y延伸，第一方向X与第二方向Y相交，例如第一方向X与第二方向Y垂直。当然，在具体实施时，触控感应电极RX与触控驱动电极TX的位置可以互换。
在具体实施时，如图1所示，触控感应电极RX和触控驱动电极TX均需要与第一触控信号线9电连接。图1中，部分位于第一子区域5的第一子触控信号线10延伸至其余周边区与沿第一方向X延伸的触控感应电极RX电连接，部分位于第一子区域5的第一子触控信号线10延伸至显示区与沿第二方向Y延伸的触控驱动电极TX电连接。
在具体实施时，第一触控信号线、第一连接引线、第二连接引线组成传输触控信号的触控走线，可以通过触控走线向对应的触控电极提供驱动信号或者接收对应的触控电极上的感应信号。即与触控感应电极RX电连接的触控走线接收对应的触控感应电极RX上的感应信号，与触控驱动电极TX电连接的触控走线用于向对应的触控驱动电极TX提供驱动信号。
在具体实施时，如图1所示，在第二子区域6，显示基板还包括与第一触控信号线9电连接的绑定端子13。
在具体实施时，绑定端子例如可以与柔性电路板等驱动单元绑定，从而柔性电路板等驱动单元可以提供驱动信号、接受感应信号。
在一些实施例中，如图5、图6、图7、图8、图9、图10所示，显示基板还包括：位于第一触控信号线9与封装层之间的多个第一转接电极35以及 多个第二转接电极36；第一转接电极35位于第一子区域5，第二转接电极36位于第二子区域6。
需要说明的是，图5为图1中A区域的另一种放大示意图，图6为沿图5中CC’的截面图。图7为图1中A区域的又一种放大示意图，图8为沿图7中DD’的截面图。图9为图1中A区域的又一种放大示意图，图10为沿图9中EE’的截面图。
在一些实施例中，第一转接电极以及第二转接电极与桥接电极同层设置。即第三有机绝缘层位于第一转接电极与封装层之间，第一有机绝缘层延伸至周边区位于第一触控信号线与第一转接电极之间。
在一些实施例中，如图6、图8、图10所示，第一子触控信号线10通过贯穿第一有机绝缘层23的过孔38与第一转接电极35电连接，第二子触控信号线11通过贯穿第一有机绝缘层23的过孔40与第二转接电极36电连接。
在一些实施例中，如图6、图8、图10所示，显示基板还包括：位于第一连接引线7与封装层之间的第一平坦化层25；第一转接电极35和第二转接电极36通过贯穿第一平坦化层25的过孔分别与第一连接引线7的两端电连接。在具体实施时，如图6、图8所示，第一转接电极35通过在第一子区域5贯穿第一平坦化层25的过孔37与第一连接引线7电连接，第二转接电极36通过在第二子区域6贯穿第一平坦化层25的过孔39与第一连接引线7电连接。
需要说明的是，由于第一连接引线需要与第一触控信号线之间实现电连接，因此需要在第一子区域、第二子区域形成贯穿第一平坦化层过孔以露出第一连接引线。当被过孔暴露的第一连接引线未设置任何保护时，桥接电极图形化工艺中若出现过刻则会对过孔区域的第一连接引线造成损伤。
本公开实施例提供的显示基板，在第一平坦化层过孔露出第一连接引线的区域设置与第一连接引线接触的第一连接电极以及第二连接电极，第一连接电极以及第二连接电极对过孔区域的第一连接引线进行覆盖，避免图形化工艺中若出现过刻对第一连接引线造成损伤，并且第一连接引线、第一触控 信号线还可以通过第一连接电极以及第二连接电极实现电连接。
在一些实施例中，如图5、图6、图9、图10所示，第二连接引线12与第一触控信号线9同层设置且一体连接。
在一些实施例中，如图6、图10所示，第二有机绝缘层24覆盖第二连接引线12。从而第二有机绝缘层可以对第二连接引线进行保护。
或者，在一些实施例中，如图7、图8所示，第二连接引线12与第一转接电极35、第二转接电极36同层设置且一体连接。
在一些实施例中，如图8所示，第一有机绝缘层23覆盖第二连接引线12。从而第一有机绝缘层可以对第二连接引线进行保护。
在一些实施例中，如图2、图5、图7、图9所示，显示基板还包括：与第一触控信号线9一一对应且电连接的第二触控信号线18。从而可以在触控信号线电阻满足需要的情况下减小触控信号线的线宽，以节省布线空间。
在具体实施时，第二触控信号线与桥接电极同层设置。当显示基板包括第一转接电极以及第二转接电极时，第二触控信号线与桥接电极、第一转接电极以及第二转接电极同层设置。第二触控信号线在衬底基板的正投影与第一触控信号线在衬底基板的正投影具有交叠，第一触控信号线通过贯穿第一有机绝缘层的过孔与第二触控信号线电连接。
需要说明的是，为了清楚的示意第一触控信号线、第二触控信号线、第一连接引线的正投影关系，图2、图5、图7、图9中以第一触控信号线、第二触控信号线、第一连接引线、第二连接引线之间的线宽不完全相同为例进行举例说明。在具体实施时，第一触控信号线、第二触控信号线、第一连接引线、第二连接引线之间的线宽可以根据需要进行设置，上述各信号线的线宽可以完全相同、部分相同、或完全不同。
在一些实施例中，如图2、图3、图5～图8所示，在周边区，第三有机绝缘层22包括第一去除区41；
第一去除区41在衬底基板1的正投影覆盖弯折区4以及第一转接电极35和第二转接电极36在衬底基板1的正投影；
第一去除区41在第一子区域5的边缘与第一转接电极35之间的距离大于0，第一去除区41在第二子区域6的边缘与第二转接电极36之间的距离大于0。
需要说明的是，第三有机绝缘层进行图形化工艺后，其边缘通常具有粗糙的倾斜表面，第一转接电极、第二转接电极以及桥接电极的图形化工艺后，第三有机绝缘层大面积去除的区域的边缘的倾斜表面容易造成导体材料的残留。
本公开实施例提供的显示基板，第一去除区的边缘与第一转接电极、第二转接电极之间的距离均大于0，即第一去除区的边缘与第一转接电极、第二转接电极均不接触，从而可以避免第一去除区的边缘的倾斜表面出现导体材料的残留造成多个第一转接电极之间短路、多个第二转接电极之间短路。
或者，在一些实施例中，如图9、图10所示，第一去除区在衬底基板的正投影覆盖弯折区以及第一转接电极在衬底基板的正投影；第一去除区在衬底基板的正投影与第二转接电极在衬底基板的正投影互不交叠；
第一去除区在第一子区域的边缘与第一转接电极之间的距离大于0，第一去除区在第二子区域的边缘与第二转接电极之间的距离大于0。
即第一去除区在第一子区域的边缘位于第一转接电极靠近显示区的一侧，而第一去除区在第二子区域的边缘位于弯折区与第二转接电极之间。
本公开实施例提供的显示基板，第一去除区在第一子区域的边缘位于第一转接电极靠近显示区的一侧，第一去除区在第二子区域的边缘位于弯折区与第二转接电极之间，仍可以满足第一去除区的边缘与第一转接电极、第二转接电极之间的距离均大于0，即第一去除区的边缘与第一转接电极、第二转接电极均不接触，从而可以避免第一去除区的边缘的倾斜表面出现导体材料的残留造成多个第一转接电极之间短路、多个第二转接电极之间短路。
需要说明的是，如图2、图5、图7所示，在第二子区域6，第一去除区41的便于位于第二转接电极36背离弯折区4一侧，即在第二转接电极36背离弯折区4一侧第三有机绝缘层具有整面去除的边缘，因此为了避免第三有 机绝缘层大面积去除的区域的边缘的倾斜表面出现导体材料的残留导致多条第二触控信号线短路，第二触控信号线18仅位于第一子区域5。
本公开实施例提供的如图9所示的显示基板，由于第一去除区在第二子区域的边缘位于弯折区与第二转接电极之间，在第二子区域且在第二转接电极与第一连接引线连接的区域，第三有机绝缘层设置多个过孔即可实现第二转接电极与第一连接引线转接，在第二转接电极背离弯折区一侧，第三有机绝缘层不具有整面去除的边缘。因此如图9所示，在第二子区域6仍可设置第二触控信号线18，以节省布线空间。
在一些实施例中，如图3、图6、图8、图10所示，第一有机绝缘层23覆盖第一去除区41的边缘。
本公开实施例提供的显示基板，第一有机绝缘层覆盖第一去除区的边缘，即第一有机绝缘层覆盖第三有机绝缘层与第一转接电极之间的区域以及第三有机绝缘层与第二转接电极之间的区域，进一步保证第一去除区的边缘与第一转接电极、第二转接电极均不接触，避免去除区的边缘的倾斜表面出现导体材料的残留造成多个第一转接电极之间短路、多个第二转接电极之间短路。
在一些实施例中，封装层包括交替堆叠设置的无机封装层和有机封装层；无机封装层覆盖显示区且延伸覆盖至第一子区域；无机封装层在第一子区域的边缘位于第一去除区在第一子区域的边缘靠近显示区的一侧。
在一些实施例中，如图4所示，封装层8具体包括：堆叠设置的第一无机封装层47、第一有机封装层48、第二无机封装层49、第二有机封装层50、第三无机封装层51。
本公开实施例提供的显示基板，三层无机封装层以及两层有机封装层交替设置，相比于常规显示产品仅设置三层封装层的情况，可以满足大角度弯折的应力需求，避免出现弯曲断裂等不良。
在具体实施时，第一无机封装层、第二无机封装层、第三无机封装层在第一子区域的边缘均位于第一去除区在第一子区域的边缘靠近显示区的一侧。
在一些实施例中，如图4所示，显示基板具体包括：位于衬底基板1和 封装层8之间的驱动电路层32，位于驱动电路层32与封装层8之间的多个发光器件33。
在具体实施时，如图4所示，发光器件33位于第一平坦化层25与封装层8之间。
在一些实施例中，驱动电路层包括多个阵列排布的像素驱动电路；像素驱动电路用于驱动发光器件发光。如图4所示，像素驱动电路例如包括薄膜晶体管42以及存储电容(未示出)。
在一些实施例中，如图4所示，薄膜晶体管42包括：有源层43、位于有源层43与第一平坦化层25之间的栅极G、位于栅极G与第一平坦化层25之间的源极S和漏极D；显示基板还包括：位于衬底基板1与有源层43之间的第一缓冲层27；位于有源层43和栅极G之间的第一栅绝缘层28、位于第一栅绝缘层28和源极S之间的第二栅绝缘层29，位于第二栅绝缘层29和源极S之间的层间绝缘层30、位于源极S和第一平坦化层25之间的钝化层31，位于钝化层31和第一平坦化层25之间的多个第三连接电极52、位于第三连接电极52和第一平坦化层25之间的第二平坦化层26，位于第一平坦化层25和封装层8之间的像素定义层21。显示基板还包括：位于第一栅绝缘层和第二栅绝缘层之间的存储电容的第一电极；存储电容的第二电极与栅极G同层设置。
在具体实施时，如图4所示，第三连接电极52通过贯穿第一平坦化层25的过孔与发光器件33一一对应电连接。
在具体实施时，如图4所示，薄膜晶体管42位于衬底基板1与第二平坦化层26之间。第三连接电极通过贯穿第二平坦化层26、钝化层31的过孔与薄膜晶体管42的源极或漏极电连接；其中，图4中以第三连接电极52通过贯穿第二平坦化层26、钝化层31的过孔与薄膜晶体管的源极S电连接为例进行说明。
在一些实施例中，如图4所示，发光器件层31包括堆叠设置的阳极44、发光功能层45、阴极46。第三连接电极52通过贯穿第一平坦化层25的过孔 与阳极44电连接。
在具体实施时，发光器件例如为有机发光二极管器件或量子点发光二极管器件。
在具体实施时，在显示区，像素定义层具有与发光器件一一对应的多个开口区，发光器件位于开口区。
在具体实施时，显示基板还包括包围显示区的挡墙。挡墙例如由与像素定义层同层设置的部分以及与第一平坦化层同层设置的部分堆叠组成。挡墙用于阻挡有机封装层；至少第一无机封装层覆盖挡墙。在第一子区域，第一无机绝缘层的边缘位于挡墙与第一去除区的边缘之间。
在一些实施例中，第一连接引线与第三连接电极同层设置。
在一些实施例中，如图3、图6、图8、图10所示，在弯折区4，衬底基板1与第一连接引线7之间仅包括第二平坦化层26。从而可以减少弯折区的绝缘膜层的数量，避免膜层较多时在弯折区弯折出现膜层剥离、脱落的风险。
当然，在具体实施时，也可以是第一连接引线与源极、漏极同层设置；或者第一连接引线与栅极同层设置。
在一些实施例中，如图11所示，第一连接引线7包括：第一子连接引线53以及第二子连接引线54；
显示基板还包括：
多条第三连接引线55，位于衬底基板1与第一连接引线7之间，与第一连接引线1一一对应；第三连接引线55的一端与第一子连接引线53电连接，第三连接引线55的另一端与第二子连接引线54电连接。
本公开实施例提供的显示基板，设置第三连接引线对第一子连接引线和第二子连接引线转接，可以避免仅设置一种信号线的情况产生大量静电对触控信号传输造成影响。
需要说明的是，图11中以显示基板包括第一转接电极、第二转接电极且第二连接引线与第一触控信号线同层设置为例进行举例说明。
在一些实施例中，如图11所示，第三连接引线55位于第二子区域6。
在一些实施例中，第三连接引线与薄膜晶体管的栅极同层设置。
在一些实施例中，衬底基板为柔性衬底基板。柔性衬底基板的材料例如为聚酰亚胺。
在具体实施时，衬底基板例如可以包括单层柔性衬底基板。或者，衬底基板也可以包括两层柔性衬底基板以及位于两层柔性衬底基板之间的第二缓冲层。
本公开实施例提供的一种显示装置，显示装置包括本公开实施例提供的显示基板。
本公开实施例提供的显示装置为：手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。对于该显示装置的其它必不可少的组成部分均为本领域的普通技术人员应该理解具有的，在此不做赘述，也不应作为对本公开的限制。该显示装置的实施可以参见上述显示基板的实施例，重复之处不再赘述。
综上所述，本公开实施例提供的显示基板及显示装置，第一触控信号线、第一连接引线、第二连接引线组成传输触控信号的触控走线；由于第二连接引线设置在封装层背离衬底基板一侧，且第二连接引线与第一子触控信号线和第二子触控信号线一一对应电连接，因此第二连接引线与第一子触控信号线和第二子触控信号线的连接不会受到封装层残留的影响。并且，即便在第一子触控信号线和第二子触控信号线与第一连接引线电连接的区域存在封装层材料残留而导致第一连接引线与第一触控信号线无法电连接，触控信号也可以通过第二连接引线进行传输，可以避免触控失效。
尽管已描述了本发明的优选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例作出另外的变更和修改。所以，所附权利要求意欲解释为包括优选实施例以及落入本发明范围的所有变更和修改。
显然，本领域的技术人员可以对本发明实施例进行各种改动和变型而不脱离本发明实施例的精神和范围。这样，倘若本发明实施例的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些 改动和变型在内。

Claims (16)

  1. 一种显示基板，其中，所述显示基板包括：
    衬底基板，包括：显示区以及所述显示区之外的周边区；所述周边区包括至少一个弯折区，位于所述至少一个弯折区与所述显示区之间的第一子区域，以及位于所述至少一个弯折区背离所述显示区一侧的第二子区域；
    多条第一连接引线，位于所述衬底基板的一侧；所述多条第一连接引线从所述第一子区域经过所述弯折区延伸至所述第二子区域；
    封装层，位于所述第一连接引线背离所述衬底基板的一侧；所述封装层覆盖所述显示区且延伸至所述第一子区域；
    多条第一触控信号线，位于所述封装层背离所述第一连接引线的一侧；所述第一触控信号线与所述第一连接引线一一对应；每一所述第一触控信号线包括位于所述第一子区域的第一子触控信号线以及位于所述第二子区域的第二子触控信号线；所述第一连接引线的一端与所述第一子触控信号线电连接，所述第一连接引线的另一端与所述第二子触控信号线电连接；
    多条第二连接引线，位于所述封装层与所述第一触控信号线之间，或者与所述第一触控信号线位于同层；所述第二连接引线与所述第一连接引线一一对应；所述第二连接引线贯穿所述弯折区、且与所述第一子触控信号线和所述第二子触控信号线一一对应电连接。
  2. 根据权利要求1所述的显示基板，其中，所述显示基板还包括：位于所述第一触控信号线与所述封装层之间的多个第一转接电极以及多个第二转接电极，位于所述第一触控信号线与所述第一转接电极之间的第一有机绝缘层，以及位于所述第一连接引线与所述封装层之间的第一平坦化层；
    所述第一转接电极位于所述第一子区域，所述第二转接电极位于所述第二子区域；
    所述第一子触控信号线通过贯穿所述第一有机绝缘层的过孔与所述第一转接电极电连接，所述第二子触控信号线通过贯穿所述第一有机绝缘层的过 孔与所述第二转接电极电连接；
    所述第一转接电极和所述第二转接电极通过贯穿所述第一平坦化层的过孔分别与所述第一连接引线的两端电连接。
  3. 根据权利要求2所述的显示基板，其中，所述第二连接引线与所述第一触控信号线同层设置且一体连接。
  4. 根据权利要求3所述的显示基板，其中，所述显示基板还包括：
    第二有机绝缘层，位于所述第一触控信号线背离所述封装层一侧；所述第二有机绝缘层覆盖所述第二连接引线。
  5. 根据权利要求2所述的显示基板，其中，所述第二连接引线与所述第一转接电极、所述第二转接电极同层设置且一体连接。
  6. 根据权利要求5所述的显示基板，其中，所述第一有机绝缘层覆盖所述第二连接引线。
  7. 根据权利要求2～6任一项所述的显示基板，其中，所述显示基板还包括：
    第三有机绝缘层，位于所述第一转接电极与所述封装层之间；
    在所述周边区，所述第三有机绝缘层包括第一去除区；
    所述第一去除区在所述衬底基板的正投影覆盖所述弯折区以及所述第一转接电极和所述第二转接电极在所述衬底基板的正投影；
    所述第一去除区在所述第一子区域的边缘与所述第一转接电极之间的距离大于0，所述第一去除区在所述第二子区域的边缘与所述第二转接电极之间的距离大于0。
  8. 根据权利要求2～6任一项所述的显示基板，其中，所述显示基板还包括：
    第三有机绝缘层，位于所述第一转接电极与所述封装层之间；
    在所述周边区，所述第三有机绝缘层包括第一去除区；
    所述第一去除区在所述衬底基板的正投影覆盖所述弯折区以及所述第一转接电极在所述衬底基板的正投影；所述第一去除区在所述衬底基板的正投 影与所述第二转接电极在所述衬底基板的正投影互不交叠；
    所述第一去除区在所述第一子区域的边缘与所述第一转接电极之间的距离大于0，所述第一去除区在所述第二子区域的边缘与所述第二转接电极之间的距离大于0。
  9. 根据权利要求7或8所述的显示基板，其中，所述第一有机绝缘层覆盖所述第一去除区的边缘。
  10. 根据权利要求7～9任一项所述的显示基板，其中，所述封装层包括交替堆叠设置的无机封装层和有机封装层；所述无机封装层覆盖所述显示区且延伸覆盖至所述第一子区域；所述无机封装层在所述第一子区域的边缘位于所述第一去除区在所述第一子区域的边缘靠近所述显示区的一侧。
  11. 根据权利要求10所述的显示基板，其中，所述封装层具体包括：堆叠设置的第一无机封装层、第一有机封装层、第二无机封装层、第二有机封装层、第三无机封装层。
  12. 根据权利要求1～11任一项所述的显示基板，其中，所述第一连接引线包括：第一子连接引线以及第二子连接引线；
    所述显示基板还包括：
    多条第三连接引线，位于所述衬底基板与所述第一连接引线之间，与所述第一连接引线一一对应；所述第三连接引线的一端与所述第一子连接引线电连接，所述第三连接引线的另一端与所述第二子连接引线电连接。
  13. 根据权利要求12所述的显示基板，其中，所述第三连接引线位于所述第二子区域。
  14. 根据权利要求12或13所述的显示基板，其中，所述显示基板还包括：
    第二平坦化层，位于所述第一连接引线与所述第三连接引线之间；在所述弯折区，所述衬底基板与所述第一连接引线之间仅包括所述第二平坦化层。
  15. 根据权利要求14所述的显示基板，其中，所述显示基板还包括：
    多个发光器件，位于所述第一平坦化层与所述封装层之间；
    多个第三连接电极，与所述第一连接引线同层设置；所述第三连接电极通过贯穿所述第一平坦化层的过孔与所述发光器件一一对应电连接；
    多个薄膜晶体管，位于所述衬底基板与所述第二平坦化层之间；所述薄膜晶体管包括与所述第三连接引线同层设置的栅极、位于所述栅极与所述第二平坦化层之间的源极和漏极；所述第三连接电极通过贯穿所述第二平坦化层的过孔与所述源极或漏极电连接。
  16. 一种显示装置，其中，所述显示装置包括根据权利要求1～15任一项所述的显示基板。
PCT/CN2022/084105 2022-03-30 2022-03-30 显示基板及显示装置 WO2023184244A1 (zh)

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