WO2023179149A1 - 芯片检测封装设备 - Google Patents

芯片检测封装设备 Download PDF

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Publication number
WO2023179149A1
WO2023179149A1 PCT/CN2022/142831 CN2022142831W WO2023179149A1 WO 2023179149 A1 WO2023179149 A1 WO 2023179149A1 CN 2022142831 W CN2022142831 W CN 2022142831W WO 2023179149 A1 WO2023179149 A1 WO 2023179149A1
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WIPO (PCT)
Prior art keywords
packaging
track
carrier tape
module
conveying
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Application number
PCT/CN2022/142831
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English (en)
French (fr)
Inventor
刘中海
马学超
曾晓春
吕绍林
Original Assignee
博众精工科技股份有限公司
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Publication of WO2023179149A1 publication Critical patent/WO2023179149A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36—Sorting apparatus characterised by the means used for distribution
    • B07C5/361—Processing or control devices therefor, e.g. escort memory
    • B07C5/362—Separating or distributor mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36—Sorting apparatus characterised by the means used for distribution
    • B07C5/38—Collecting or arranging articles in groups

Definitions

  • This application relates to the technical field of automation equipment, such as a chip detection and packaging equipment.
  • semiconductor chips are placed in a tray.
  • the detection equipment usually detects one tray of chips before testing the next tray.
  • the detection components are in an idle state, and the equipment rhythm is not full, which is easy to This causes discontinuity in the supply of good chips to the packaging device.
  • the equipment will become larger and the cost will increase.
  • Embodiments of the present application provide a device with a compact structure that can quickly and effectively detect and package chips, which can avoid the situation in related technologies that the equipment rhythm is not full and the equipment is large in size.
  • This application provides a chip detection and packaging equipment, including a machine, and:
  • a plurality of conveyor rails are arranged parallel to the machine platform along the Y-axis direction, and are in sequence a feeding rail, a classification rail and a packaging rail.
  • the classification rail includes a good product rail and several defective product rails.
  • the conveyor rails It includes a conveying guide rail and at least two conveying mechanisms, each conveying mechanism is connected to a material tray cart, and the material tray cart is slidingly connected to the conveying guide rail;
  • a plurality of detection stations which are respectively arranged on the workbench on the side of the loading track and/or supported above the conveyor track and reciprocate along the X-axis direction;
  • a transportation module is located on the workbench and reciprocates between multiple conveyor tracks
  • a classification module configured to reciprocate between said classification tracks
  • the packaging module is arranged on one side of the packaging track, and uses braiding to package the qualified products picked up from the packaging track by the picking module.
  • Figure 1 is a schematic diagram of the overall structure of an embodiment of the present application.
  • FIG. 2 is a schematic diagram of the conveyor track of this application.
  • Figure 3 is an enlarged schematic diagram of the material tray truck of the present application.
  • Figure 4 is a schematic diagram of the pickup module and the third detection station of this application.
  • FIG. 5 is a schematic diagram of the transfer and transportation module of this application.
  • Figure 6 is a schematic structural diagram of the packaging module of the present application.
  • Figure 7 is a schematic diagram of the overall structure of another embodiment of the present application.
  • Conveyor track 210. Feeding track; 220. Classification track; 221. Good product track; 222. Defective product track; 230. Packaging track; 240. Conveyor guide rail; 250. Conveyor mechanism; 251. Driving wheel; 252. From Moving wheel; 253. Drive motor; 254. Transmission belt; 260. Tray cart; 261. Connecting block; 262. Slider; 263. Support plate; 264. First stopper; 265. Second stopper; 266. Adjustment cylinder;
  • First detection station 311. Lower surface detector; 312. First transfer mechanism; 320. Second detection station; 321. Upper surface detector; 330. Third detection station; 331. Peripheral detection device; 332, second transfer mechanism;
  • Transport module
  • Packaging module 710. Carrier tape reel; 720. Carrier tape pulling component; 730. Pressing tape reel; 740. Heat pressing component; 750. Carrier tape rewinding reel; 760. Switching mechanism; 761. Packaging platform; 762, switching cylinder; 763, switching guide rail; 770, fourth detection station; 771, appearance detector.
  • FIG. 1 is a schematic diagram of the overall structure of an embodiment of a chip testing and packaging device according to the present application.
  • Figure 2 which is a schematic diagram of the conveyor track of the present application.
  • Figure 5 which is a schematic diagram of the transfer and pickup module of the present application.
  • the testing and packaging equipment of this application includes a machine 100, and:
  • a plurality of conveyor rails 200 are arranged parallel to the machine 100 along the Y-axis direction, including a feeding rail 210, a classification rail 220 and a packaging rail 230.
  • the classification rail 220 includes a good product rail 221 and several items.
  • the conveyor track 200 includes a conveyor guide rail 240 and at least two conveyor mechanisms 250. Each conveyor mechanism 250 is connected to a material tray cart 260, and the material tray cart 260 is slidingly connected to the conveyor guide rail 240;
  • a plurality of detection stations are respectively provided on the workbench on the side of the loading track 210 and/or supported above the conveyor track 200, and the multiple detection stations reciprocate along the X-axis direction;
  • the transportation module 400 is located on the workbench and reciprocates between the plurality of conveyor rails 200;
  • a classification module 500 configured to reciprocate between the classification tracks 220;
  • the packaging module 700 is disposed on one side of the packaging rail 230 and packages the qualified products picked up by the picking module 600 from the packaging rail 230 through braiding.
  • each conveyor track 200 includes two pallet trucks 260 . Since the conveying direction of each conveying track 200 is different, the conveying direction of the loading track 210 is used as a reference in this application, and the feeding end and the discharging end referred to below are the feeding end direction and the discharging end of the loading track 210 direction.
  • the material tray loaded with chips is placed on the first material tray truck 260 close to the feeding end of the loading track 210, and the conveying mechanism 250 drives the material tray truck 260 to move to the detection station located on the side of the loading track 210. .
  • the material tray is placed on the first material tray truck 260 or is transported to the second material tray truck 260 .
  • the material tray is transported from the first material tray car 260 to the second material tray car 260, and then the corresponding conveying mechanism 250 of the second material tray car 260 no longer operates.
  • the position of the second tray cart 260 is fixed to perform chip detection, while the first tray cart 260 returns to carry the next tray. While one material tray is being inspected, another material tray is loaded, thereby saving the round trip time of the material tray truck 260 and improving the inspection efficiency.
  • the transport module 400 transports the tray to a tray truck 260 on the quality track 221 .
  • the inspection station located above the sorting track 220 detects the chips in the tray again to obtain a conclusion as to whether the chips are good products and what kind of defects there are in the chips.
  • the classification module 500 places the good products in the trays on the good product track 221 according to the obtained detection results, and the defective products are placed in different trays on the defective product track 222 according to different types of defects. Since the chips in the first tray are separated, the first tray is no longer full. As the classification proceeds, the chip in the second tray on the loading track 210 completes the detection, and the second tray is transported by the transport module 400 to the tray truck 260 on the good product track 221. The classification module 500 classifies the chips in the second tray again, sorting the good products into the first tray, and sorting the defective products into different trays according to the type of defects.
  • the transportation module 400 transports the material tray to the packaging track 230
  • the material tray truck is within 260. If the previous material tray is not full and the material tray being sorted is empty, the empty material tray will be sent out directly from the end of the conveyor track 200 .
  • the defective product track 222 directly sends the material tray out from the loading end of the loading track 210 .
  • the material tray is transported from the discharge end of the loading rail 210 to the classification rail 220.
  • the transportation module 400 and one of the detection stations are arranged at the outlet.
  • the classification module 500 is disposed close to the feeding end of the feeding track 210, and the movement of the classification module 500 will not interfere with the transportation mechanism, achieving synchronous operation of the two. Therefore, when unloading materials, the material tray carrying good products is sent out from the discharging end, and the material tray carrying defective products is sent out from the feeding end, ensuring that the material tray carrying defective products will not interact with the handling module 400 and the inspection station when it is sent out. put one's oar in.
  • each good product track 221 and defective product track 222 are provided with at least two pallet trucks 260 , enough pallets carrying defective products can be provided without increasing the number of conveyor rails 200 , so that the chips can be sorted at one time. Picking, and the chips that have been detected at the same time can be continuously sent to the classification track 220 for classification, and the classification efficiency is high.
  • the separated good products are transported from the good product track 221 to the tray cart 260 on the packaging track 230 near the feeding end by the transport module 400.
  • the picking module 600 picks up the chips from the tray and puts the chips into the package.
  • Module 700 the chip is packaged through the packaging module 700.
  • the second material tray is transported to the packaging module 700, the second material tray is placed on the material tray cart 260 near the discharge end.
  • the transport module 400 transports the second tray on the discharge end pallet 260 to the feed end pallet.
  • the next plate of good products is placed again on the material tray car 260 near the discharging end. This cycle ensures that the material will not be cut off during the packaging process.
  • the conveying mechanism 250 is installed on the side of the conveying guide rail 240 , and the conveying mechanisms 250 are arranged side by side along the Z-axis direction.
  • the width of the conveyor track 200 itself is narrow. Arranging the conveyor mechanisms 250 up and down along the Z-axis direction greatly saves space. At the same time, guidance through the track can ensure the stability of the material tray truck 260 during operation.
  • the conveying mechanism 250 includes a driving wheel 251 and a driven wheel 252.
  • the driving wheel 251 is connected to a driving motor 253.
  • the driving wheel 251 and the driven wheel 252 are connected through a transmission belt 254.
  • the material tray car 260 is fixed on the transmission belt 254 on one side of the driving wheel 251 and the driven wheel 252.
  • the transmission belt 254 is suitable for long transportation distances and takes up little space. If the conveying distance is short, transmission forms such as cylinders and screws can also be used.
  • the conveyor track 200 includes support frames disposed on both sides, and the conveyor guide rail 240 is disposed between the two support frames. Since the size of the material tray cart 260 is small, if the material tray is not supported on both sides, it will The material tray is prone to shaking during the discharging process, causing the position of the chips in the material tray to be inaccurate.
  • the driving motor 253 is started to drive the driving wheel 251 to rotate.
  • the transmission belt 254 is displaced due to the rotation of the driving wheel 251, thereby realizing the movement of the material tray cart 260 connected to the transmission belt 254.
  • the material tray car 260 in order to position the material tray, includes a connecting block 261, a sliding block 262 and a support plate 263.
  • the connecting block 261 is connected to the conveying mechanism 250. In this embodiment In this example, it is connected to the transmission belt 254 .
  • the slider 262 is connected to the conveyor guide rail 240, and the slider 262 is slidingly connected to the conveyor guide rail 240.
  • the support plate 263 connects the connecting block 261 and the slider 262, so that the support plate 263 can be driven while ensuring movement. Stablize.
  • a first stopper 264 and a second stopper 265 are respectively provided at both ends of the support plate 263.
  • the second stopper 265 is driven close to or away from the first stopper 264 by an adjusting cylinder 266.
  • the adjusting cylinder 266 drives the second stopper 265 away from the first stopper 264 so that the material tray can be placed between the two stops.
  • the adjusting cylinder 266 drives the second stopper 265 close to the first stopper 264, clamping the material tray between the first stopper 264 and the second stopper 265, and the material tray is fixed, so that during transportation The position of the material tray will not shift during the process.
  • the detection station includes:
  • the first detection station 310 is provided with a lower surface detector 311 and a first transfer mechanism 312.
  • the lower surface detector 311 is located on one side of the loading rail 210.
  • the first transfer mechanism 312 is configured to Reciprocating between the loading track 210 and the lower surface detector 311;
  • the second detection station 320 is provided with an upper surface detector 321 , and the upper surface detector 321 is arranged above the workbench to reciprocate between the classification rails 220 .
  • the first inspection station 310 is configured to detect defects on the lower surface of the chip.
  • the loading track 210 transports the material tray to the position of the first detection station 310, and then the first transfer mechanism 312 picks up the chips from the material tray and moves them above the lower surface detector 311, which detects the lower surface of the chip. Defects are detected.
  • the transport module 400 transports the material tray to the classification track 220 .
  • the second inspection station 320 above the classification track 220 moves above the material tray according to the position where it is transported to detect defects on the upper surface of the chip. In this process, the position of the material tray is transferred, and the steps for detecting defects on the upper surface are simplified. There is no need to remove the chip from the material tray for inspection, and there is no need to set up an additional detection position on the machine 100, which saves time. space.
  • the detection station also includes a third detection station 330, which is provided with a peripheral detector 331 and a second transfer mechanism 332.
  • the peripheral detector 331 and the lower surface detection station are arranged on one side of the loading track 210 in sequence or side by side, and the second transfer mechanism 332 is arranged between the loading track 210 and the peripheral detector 331 back and forth between.
  • the peripheral detector 331 and the lower surface detector 311 can be arranged on one side of the loading track 210 , and both are arranged along the conveying direction of the loading track 210 .
  • the tray truck 260 at the feeding end of the loading track 210 first transports the tray to the position corresponding to the peripheral detector 331.
  • the second transplanting mechanism picks up the chips from the tray and places them above the peripheral detector 331. Defects around the chip are detected.
  • the transport module 400 then transports the material tray to the material tray truck 260 at the discharge end for upper surface inspection, and the material tray truck 260 at the feed end returns to support the material tray again.
  • the first detection station 310 and the third detection station 330 are arranged on one side of the loading rail 210 in a direction perpendicular to the conveyor rail 200 . At this time, the first transfer mechanism 312 and the second transplant mechanism are arranged oppositely.
  • the picking module 600 includes a lifting mechanism 630 and a plurality of picking suction heads 610 , and the plurality of picking suction heads 610 are connected to the lifting mechanism 630 through a rotating mechanism 620 connected.
  • the lifting mechanism 630 controls the pickup head 610 to descend to pick up chips from the material tray. Since the direction in which the chip is transported on the transport track 200 is different from the direction in which it needs to be packaged, a rotation mechanism 620 is provided so that the chip can rotate at a certain angle to match the direction of the packaging module 700 .
  • a fixed suction head 612 is also provided in the pick-up suction head 610 .
  • the packaging module 700 includes: a carrier tape reel 710, a carrier tape pulling assembly 720, a pressure tape reel 730, and a thermal pressing assembly. 740 and carrier tape take-up reel 750.
  • the carrier tape reel 710 and the pressure tape reel 730 are respectively provided below and above the carrier tape pulling assembly 720 to supply the carrier tape and the pressure tape to clamp the chip.
  • the thermal pressing assembly 740 is installed on the carrier tape pulling assembly 720 to press the carrier tape and the pressure tape around the chip.
  • the carrier tape rewinding disc 750 is disposed on the The discharge end of the carrier tape pulling assembly 720 is used to wind up the packaged carrier tape.
  • the carrier tape pulling assembly 720 is composed of a mounting frame, a transmission wheel, a synchronous wheel, a synchronous motor, a pressure roller, and a synchronous belt.
  • the mounting frame is fixed on the machine 100.
  • the two ends of the mounting frame are respectively connected to the transmission wheels for rotation.
  • a shaft is fixed on each transmission wheel, and a synchronous motor is fixed on the mounting frame.
  • the output shaft of the synchronous motor is fixed on the shaft end of one transmission wheel. Synchronous wheels are fixed on the shafts of the two transmission wheels.
  • Both synchronous wheels are fixed on the shaft. It is meshed with a synchronous belt, and the two ends of the mounting frame are respectively connected with pressure rollers for pressing the carrier tape.
  • the carrier tape is unrolled, the chip is placed in the pocket of the carrier tape, the pressure tape reel 730 is unrolled, the pressure tape covers the carrier tape, and the pressure tape and the carrier tape hold the chip through the thermal compression assembly 740,
  • the heat sealing assembly 740 heat-seals the pockets of the pressure tape and the carrier tape to achieve sealed packaging of the chip.
  • a group of packaging modules 700 is provided, and the packaging modules 700 are arranged on the machine 100 parallel to the packaging rail 230 .
  • the width of the package module 700 is narrow, and the length matches the size of the machine 100, so it takes up little space.
  • the packaging module 700 is arranged at one end of the machine 100 to facilitate maintenance of the packaging module 700.
  • the packaging module 700 is provided with two groups. When one group of packaging modules 700 is working, the carrier tape and pressure tape can be replaced on the other group of packaging modules 700 . operate. When the carrier tapes of one group of packaging modules 700 are used up, they can be directly switched to another group to continue packaging without stopping the machine. If both sets of package modules 700 are arranged parallel to the conveyor track 200, the package modules 700 located inside are difficult to maintain.
  • two sets of the packaging modules 700 are installed on the side of the machine 100 through a packaging platform 761.
  • the packaging platform 761 and the workbench are connected through a switching mechanism 760.
  • the switching mechanism 760 The two groups of packaging modules 700 are pushed to cooperate with the pickup modules 600 respectively.
  • the switching mechanism 760 includes a switching cylinder 762.
  • the switching cylinder 762 is installed on the side of the machine 100 along the Y-axis direction.
  • Switching guide rails 763 are provided on the upper and lower sides of the switching cylinder 762.
  • the switching cylinder 762 is connected to
  • the packaging platform 761 is slidably connected to the switching guide rail 763, and the two packaging modules 700 are installed on the packaging platform 761.
  • the first packaging module 700 cooperates with the picking module 600.
  • the picking module 600 takes out the chips from the tray on the packaging track 230 and puts them into the carrier tape at the end of the first packaging module 700.
  • the push rod of the switching cylinder 762 is connected to the packaging table 761.
  • the push rod is pushed out, and the packaging table 761 is displaced, causing the first packaging module 700 to leave the position matching the pickup module 600.
  • the second packaging module 700 cooperates with the pickup module 600.
  • a fourth detection station 770 is also included to detect the chip placed in the carrier tape, which is equipped with an appearance detector. 771. Since there are two groups of packaging modules 700, in order to save costs, the appearance detector 771 is arranged above the packaging stage 761 to move back and forth between the two packaging modules 700. Therefore, one appearance detector 771 can detect two package modules 700.
  • the detection and packaging equipment described in this application has multiple conveying mechanisms in the conveying track, which improves the conveying efficiency and saves the time of tray transfer during the inspection process. Multiple inspections and transfers can be carried out at the same time, which greatly improves the efficiency. , and makes the equipment compact and saves space.

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Abstract

一种芯片检测封装设备，包括机台（100），以及：多条输送轨道（200），其沿Y轴方向平行设置于机台上，依次为上料轨道（210）、分类轨道（220）和封装轨道（230），分类轨道包括一条良品轨道（221）及若干条次品轨道（222），每条输送轨道包括输送导轨（240）和至少两个输送机构（250），每个输送机构连接有料盘车（260），料盘车与输送导轨滑动连接；多个检测工位，其分别位于以下至少之一的位置：设置于上料轨道侧边的工作台上，支撑于输送轨道上方，多个检测工位沿X轴方向往复；搬运模组（400），其位于工作台上，且在多条输送轨道之间往复；分类模组（500），其被设置为在分类轨道之间进行往复；封装模组（700），设置于封装轨道一侧，通过编带对拾取模组（600）从封装轨道拾取的合格品进行包装。芯片检测封装设备工作效率高，结构紧凑。

Description

芯片检测封装设备
本申请要求在2022年3月25日提交中国专利局、申请号为202210302522.1的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请涉及自动化设备技术领域，例如一种芯片检测封装设备。
背景技术
在半导体芯片的制造过程中可能产生如划痕或裂纹等缺陷，影响芯片的性能，因此需要对芯片进行多种外观缺陷检测，进而分拣出良品和次品，阻断有缺陷的芯片继续封装，从而提高产品的品质。
相关技术，半导体芯片放置在料盘中，检测设备通常对一盘芯片检测完成后再进行下一盘芯片的检测，在料盘更换的过程中，检测组件处于空闲状态，设备节拍不饱满，容易造成供给封装装置的良品芯片不连续。同时在芯片缺陷种类多的情况下，若实现全类型分拣，会导致设备体积大，成本增加。
发明内容
本申请实施例提供一种结构紧凑且能够迅速有效地对芯片进行检测封装的设备，可以避免相关技术中设备节拍不饱满，设备体积大的情况，。
本申请提供了一种芯片检测封装设备，包括机台，以及：
多条输送轨道，其沿Y轴方向平行设置于所述机台上，依次为上料轨道、分类轨道和封装轨道，所述分类轨道包括一条良品轨道及若干条次品轨道，所述输送轨道包括输送导轨和至少两个输送机构，每个输送机构连接有料盘车，所述料盘车与所述输送导轨滑动连接；
多个检测工位，其分别设置于所述上料轨道侧边的工作台上和/或支撑于所述输送轨道上方沿X轴方向往复；
搬运模组，其位于工作台上，且在多条所述输送轨道之间往复；
分类模组，其被设置为在所述分类轨道之间进行往复；
封装模组，设置于所述封装轨道一侧，通过编带对拾取模组从封装轨道拾取的合格品进行包装。
附图说明
图1是本申请一实施例的整体结构示意图；
图2是本申请的输送轨道示意图；
图3是本申请的料盘车放大示意图；
图4是本申请的拾取模组和第三检测工位示意图；
图5是本申请的移载和搬运模组示意图；
图6是本申请的封装模组结构示意图；
图7是本申请的另一实施例整体结构示意图。
说明书附图标记说明：100、机台；
200、输送轨道；210、上料轨道；220、分类轨道；221、良品轨道；222、次品轨道；230、封装轨道；240、输送导轨；250、输送机构；251、驱动轮；252、从动轮；253、驱动电机；254、传动皮带；260、料盘车；261、连接块；262、滑块；263、支撑板；264、第一挡块；265、第二挡块；266、调节气缸；
310、第一检测工位；311、下表面检测器；312、第一移载机构；320、第二检测工位；321、上表面检测器；330、第三检测工位；331、周边检测器；332、第二移载机构；
400、搬运模组；
500、分类模组；
600、拾取模组；610、拾取吸头；611、调距吸头；612、固定吸头；620、旋转机构；630、升降机构；
700、封装模组；710、载带卷盘；720、载带拉动组件；730、压带卷盘；740、热压合组件；750、载带收卷盘；760、切换机构；761、封装台；762、切换气缸；763、切换导轨；770、第四检测工位；771、外观检测器。
具体实施方式
参照图1所示，为本申请的一种芯片检测封装设备一实施例整体结构示意。参照图2所示，为本申请的输送轨道示意图。参照图5所示，为本申请的移载和拾取模组示意图。本申请的检测封装设备包括机台100，以及：
多条输送轨道200，其沿Y轴方向平行设置于所述机台100上，依次为上料轨道210、分类轨道220和封装轨道230，所述分类轨道220包括一条良品轨 道221及若干条次品轨道222，所述输送轨道200包括输送导轨240和至少两个输送机构250，每个输送机构250连接有料盘车260，所述料盘车260与所述输送导轨240滑动连接；
多个检测工位，其分别设置于所述上料轨道210侧边的工作台上和/或支撑于所述输送轨道200上方，多个检测工位沿X轴方向往复；
搬运模组400，其位于工作台上，且在多条所述输送轨道200之间往复；
分类模组500，其被设置为在所述分类轨道220之间进行往复；
封装模组700，设置于所述封装轨道230一侧，通过编带对拾取模组600从封装轨道230拾取的合格品进行包装。
本实施例中以输送轨道200设置有两个输送机构250为例进行描述，此时每条输送轨道200包括两个料盘车260。由于每条输送轨道200的输送方向不同，本申请中以上料轨道210的输送方向为基准，以下所称的进料端和出料端均为上料轨道210的进料端方向和出料端方向。
工作时，将载满芯片的料盘放置在靠近上料轨道210进料端的第一料盘车260上，输送机构250带动料盘车260移动至位于上料轨道210侧边的检测工位处。根据检测工位的具***置，使料盘位于第一料盘车260上，或被搬运至第二料盘车260上。在对应该检测工位的位置拾取料盘内的芯片进行外观检测。在上料轨道210侧边仅有一个检测工位时，将料盘从第一料盘车260搬运至第二料盘车260，而后第二料盘车260对应的输送机构250不再动作，使第二料盘车260位置固定，进行芯片的检测，而第一料盘车260返回，以承载下一个料盘。在一个料盘进行检测的同时，再对另一个料盘进行上料，从而节约了料盘车260往返的时间，提高了检测效率。
当第一个料盘内的芯片全部检测完成，搬运模组400将料盘搬运至良品轨道221上的一个料盘车260上。而后位于分类轨道220上方的检测工位再次对料盘内的芯片进行检测，得到芯片是否为良品以及芯片存在何种缺陷的结论。此时，良品轨道221的两个料盘车260上存在一个料盘，其他次品轨道222的料盘车260上根据需要区分的次品种类放置有对应数量的空料盘。分类模组500根据得到的检测结果将良品放置在良品轨道221上的料盘内，次品根据缺陷种类的不同放置在次品轨道222的不同料盘内。由于第一个料盘内的芯片被分出，因此第一个料盘不再满料。随着分类的进行，上料轨道210上的第二个料盘内的芯片完成检测，第二个料盘被搬运模组400搬运至良品轨道221上的料盘车 260上。分类模组500再次对第二个料盘内的芯片进行分类，将良品分拣到第一料盘中，根据缺陷的种类，将次品分拣到不同的料盘中。当第一料盘满料，则第二料盘中的良品保留在第二料盘中，第一料盘移动至搬运模组400下方，搬运模组400将料盘搬运至封装轨道230上的料盘车260内。若上一个料盘未装满而正在分拣的料盘已空载，则将空载的料盘从输送轨道200的端部直接送出。当承载次品的料盘满料，次品轨道222直接将料盘从上料轨道210的上料端送出。本实施例中，为提高检测效率，同时防止多个模组干涉，料盘从上料轨道210的出料端被搬运至分类轨道220，因此搬运模组400和其中一个检测工位设置于出料端的同一直线上，无需料盘再向检测工位的位置移动。同时分类模组500靠近上料轨道210的进料端设置，分类模组500的移动不会与搬运机构干涉，实现两者的同步工作。因此下料时，承载良品的料盘从出料端送出，而承载次品的料盘从进料端送出，保证承载次品的料盘在送出时不会与搬运模组400和检测工位干涉。由于每条良品轨道221和次品轨道222均设置有至少两个料盘车260，因此在不增加输送轨道200数量的情况下能够提供足够的承载次品的料盘，使得芯片被一次性分拣，同时检测完成的芯片能够不间断送入分类轨道220进行分类，分类效率高。
分离出的良品，第一次时，由搬运模组400从良品轨道221搬运至封装轨道230上靠近进料端的料盘车260，拾取模组600从料盘内拾取芯片，将芯片放入封装模组700，芯片通过封装模组700被包装。随着第二个料盘被搬运至封装模组700，第二个料盘放置在靠近出料端的料盘车260上。当第一个料盘内的芯片被取空，第一料盘向进料端的方向流出，搬运模组400将出料端料盘车260上的第二料盘搬运至进料端料盘车260上，下一盘良品再次放置于靠近出料端的料盘车260上。如此循环，保证封装的过程中不会断料。
参照图2和图3所示，作为本申请的示例实施例，所述输送机构250安装于所述输送导轨240侧面，所述输送机构250沿Z轴方向并排设置。输送轨道200的宽度本身较窄，将输送机构250沿Z轴方向上下并排设置大大节省了空间，同时通过轨道进行导向，能够保证料盘车260在工作中的稳定。例如，为实现输送机构250的传动效果，所述输送机构250包括驱动轮251和从动轮252，所述驱动轮251连接有驱动电机253，所述驱动轮251和从动轮252通过传动皮带254相连，所述料盘车260固定于所述驱动轮251和从动轮252一侧的传动皮带254上。传动皮带254适于输送距离较远的情况，且占用空间小。若输送距离近， 还可以采用气缸、丝杠等传动形式。
本实施例中，输送轨道200包括设置于两侧的支撑架，输送导轨240设置于两支撑架之间，由于料盘车260的尺寸较小，若不对料盘两侧进行支撑，则在取放料的过程中料盘容易产生晃动，导致料盘内芯片的位置不准确。料盘放置在料盘车260上后，驱动电机253启动，带动驱动轮251转动，传动皮带254由于驱动轮251的转动而产生位移，实现与传动皮带254相连的料盘车260的移动。
作为本申请的示例实施例，为实现对料盘的定位，所述料盘车260包括连接块261、滑块262和支撑板263，所述连接块261与所述输送机构250相连，本实施例中，例如与传动皮带254相连。所述滑块262与所述输送导轨240相连，滑块262与输送导轨240滑动连接，所述支撑板263连接所述连接块261和滑块262，实现支撑板263被驱动的同时保证移动的稳定。所述支撑板263两端分别设置有第一挡块264和第二挡块265，所述第二挡块265通过调节气缸266驱动靠近或远离所述第一挡块264。当放置料盘时，调节气缸266驱动第二挡块265远离第一挡块264，使得料盘能够放入两个挡块之间。料盘放置好后，调节气缸266驱动第二挡块265靠近第一挡块264，将料盘夹持在第一挡块264和第二挡块265之间，料盘被固定，从而在输送过程中不会发生料盘位置偏移的情况。
参照图1，图4和图5所示，作为本申请的示例实施例，所述检测工位包括：
第一检测工位310，其设置有下表面检测器311和第一移载机构312，所述下表面检测器311位于上料轨道210一侧，所述第一移载机构312设置为在所述上料轨道210和下表面检测器311之间往复；
第二检测工位320，其设置有上表面检测器321，所述上表面检测器321在所述工作台上方被设置为在所述分类轨道220之间往复。
第一检测工位310设置为芯片下表面缺陷的检测。上料轨道210将料盘输送到对第一检测工位310的位置，而后第一移载机构312从料盘中拾取芯片，移动到下表面检测器311上方，下表面检测器对芯片下表面的缺陷进行检测。检测完成后，搬运模组400将料盘搬运至分类轨道220。分类轨道220上方的第二检测工位320，根据料盘被搬运的位置，移动到其上方，对芯片上表面的缺陷进行检测。在此过程中，即实现了料盘位置的转移，也简化了上表面缺陷检测的步骤，无需将芯片从料盘中取出即可进行检测，无需在机台100上另外设置 检测位置，节省了空间。
参照图1，图4和图5所示，例如，为实现芯片的全面检测，所述检测工位还包括第三检测工位330，其设置有周边检测器331和第二移载机构332，所述周边检测器331与所述下表面检测工位依次或并排设置于所述上料轨道210一侧，所述第二移载机构332设置为在所述上料轨道210和周边检测器331之间往复。为节约空间，可以将周边检测器331和下表面检测器311设置在上料轨道210一侧，两者沿上料轨道210的输送方向设置。此时，上料轨道210中进料端的料盘车260先将料盘输送至对应周边检测器331的位置，第二移栽机构从料盘中拾取芯片，放置到周边检测器331上方，对芯片周边的缺陷进行检测。而后搬运模组400将料盘搬运至出料端的料盘车260上，进行上表面检测，进料端的料盘车260返回以再次承托料盘。在本申请的其他实施例中，第一检测工位310和第三检测工位330沿垂直于输送轨道200的方向设置于上料轨道210一侧。此时第一移载机构312和第二移栽机构相对设置。
参照图4所示，作为本申请的示例实施例，所述拾取模组600包括升降机构630和多个拾取吸头610，多个所述拾取吸头610通过旋转机构620与所述升降机构630相连。升降机构630控制拾取吸头610下降，以配合料盘拾取芯片。由于芯片在输送轨道200上进行输送时的方向与需要封装的方向不同，因此设置旋转机构620，使得芯片能够旋转一定的角度，以配合封装模组700的方向。例如，由于封装模组700中载带上放置芯片的口袋之间的间距与料盘内芯片之间的间距不同，因此，设置多个调距吸头611。同时，为实现在将芯片放入载带的同时能够将不良品取出，因此拾取吸头610中还设置一个固定吸头612。
参照图6所示，作为本申请的示例实施例，为实现芯片的封装，所述封装模组700包括：载带卷盘710、载带拉动组件720、压带卷盘730、热压合组件740和载带收卷盘750，所述载带卷盘710和压带卷盘730分别设置于所述载带拉动组件720的下方和上方，用以供给载带和压带，以将芯片夹持在两者之间，所述热压合组件740安装于所述载带拉动组件720上，用以将芯片周围的载带和压带压合，所述载带收卷盘750设置于所述载带拉动组件720的出料端，用以对封装后的载带进行收卷。工作时，将载带的带头从载带卷盘710抽出，使得载带绕过载带拉动组件720，并将载带的带头与载带收卷盘750固定。例如，载带拉动组件720由安装架、传动轮、同步轮、同步电机、压辊、同同步带组成，安装架固定在机台100上，安装架的两端分别转动连接有传动轮，两个传 动轮上均固定有轴，安装架上固定有一个同步电机，同步电机的输出轴固定在一个传动轮的轴端，两个传动轮的轴上均固定有同步轮，两个同步轮均啮合在一条同步带上，安装架两端分别转动连接有用于压住载带的压辊。随着载带的放卷，芯片被放置在载带的口袋内，压带卷盘730放卷，压带覆盖在载带上，压带和载带夹持芯片穿过热压合组件740，热压合组件740将压带与载带的口袋四周热封，实现芯片的密封包装。
参照图1所示，为本申请的一实施例，所述封装模组700设置有一组，所述封装模组700平行于所述封装轨道230设置于所述机台100上。此种设置方式封装模组700宽度较窄，长度与机台100尺寸相匹配，因此占用空间小。且封装模组700设置于机台100一端，方便对封装模组700进行维护。
参照图7所示，例如，当封装模组700中载带或压带用完，需要更换载带或压带时，需要对设备进行停机，防止物料堆积。此种形式影响了工作效率。因此在本申请的另一实施例中，所述封装模组700设置有两组，当一组封装模组700在工作时，可以对另一组封装模组700执行更换载带、压带的操作。一组封装模组700的载带使用完，可以不停机直接切换到另一组继续封装。若两组封装模组700均与输送轨道200平行设置，则位于内部的封装模组700不易进行维护。故本实施例中，两组所述封装模组700通过封装台761安装于所述机台100侧面，所述封装台761与所述工作台之间通过切换机构760相连，所述切换机构760推动两组所述封装模组700分别与所述拾取模组600配合。例如，所述切换机构760包括切换气缸762，所述切换气缸762沿Y轴方向安装于所述机台100侧面，所述切换气缸762上下两侧设置有切换导轨763，所述切换气缸762连接封装台761，所述封装台761与所述切换导轨763滑动连接，两所述封装模组700安装在所述封装台761上。工作时第一封装模组700与拾取模组600配合，拾取模组600从封装轨道230上的料盘内取出芯片，放入第一封装模组700端部的载带内。当第一封装模组700的载带使用完，切换气缸762的推杆连接封装台761，推杆推出，封装台761产生位移，使得第一封装模组700离开与拾取模组600配合的位置，第二封装模组700与拾取模组600配合。例如，芯片在放入载带的口袋过程中，仍有可能因为磕碰等造成损伤，因此还包括第四检测工位770，以对放入载带内的芯片进行检测，其设置有外观检测器771。由于封装模组700设置有两组，为节约成本，所述外观检测器771在封装台761上方被设置为在两所述封装模组700之间往复移动。从而一个外观检测 器771能够实现两个封装模组700的检测。
本申请所述的检测封装设备，由于在输送轨道中设置多个输送机构，使得输送效率提高，节省了检测过程中料盘转运的时间，多种检测和移载能够同时进行，大大提高了效率，且使得设备结构紧凑，节约了空间。

Claims (13)

  1. 一种芯片检测封装设备，包括机台，以及：
    多条输送轨道，所述多条输送轨道沿Y轴方向平行设置于所述机台上，依次为上料轨道、分类轨道和封装轨道，所述分类轨道包括一条良品轨道及多条次品轨道，每条输送轨道包括输送导轨和至少两个输送机构，每个输送机构连接有料盘车，所述料盘车与所述输送导轨滑动连接；
    多个检测工位，所述多个检测工位分别位于以下至少之一的位置：设置于所述上料轨道侧边的工作台上，支撑于所述多条输送轨道上方，所述多个检测工位沿X轴方向往复；
    搬运模组，所述搬运模组位于所述工作台上，且在所述多条输送轨道之间往复；
    分类模组，所述分类模组被设置为在所述分类轨道之间进行往复；
    封装模组，设置于所述封装轨道一侧，通过编带对拾取模组从所述封装轨道中拾取的合格品进行包装。
  2. 根据权利要求1所述的设备，其中，所述至少两个输送机构安装于所述输送导轨侧面，所述至少两个输送机构沿Z轴方向并排设置。
  3. 根据权利要求2所述的设备，其中，每个输送机构包括驱动轮和从动轮，所述驱动轮连接有驱动电机，所述驱动轮和从动轮通过传动皮带相连，所述料盘车固定于所述驱动轮和所述从动轮一侧的传动皮带上。
  4. 根据权利要求1所述的设备，其中，所述料盘车包括连接块、滑块和支撑板，所述连接块与对应的输送机构相连，所述滑块与所述输送导轨相连，所述支撑板连接所述连接块和所述滑块，所述支撑板两端分别设置有第一挡块和第二挡块，所述第二挡块通过调节气缸驱动靠近或远离所述第一挡块。
  5. 根据权利要求1所述的设备，其中，所述检测工位包括：
    第一检测工位，所述第一检测工位设置有下表面检测器和第一移载机构，所述下表面检测器位于所述上料轨道一侧，所述第一移载机构设置为在所述上料轨道和所述下表面检测器之间往复；
    第二检测工位，所述第二检测工位设置有上表面检测器，所述上表面检测器在所述工作台上方被设置为在所述分类轨道之间往复。
  6. 根据权利要求5所述的设备，其中，所述检测工位还包括第三检测工位，所述第三检测工位设置有周边检测器和第二移载机构，所述周边检测器与所述下表面检测工位依次或并排设置于所述上料轨道一侧，所述第二移载机构设置 为在所述上料轨道和所述周边检测器之间往复。
  7. 根据权利要求1所述的设备，其中，所述拾取模组包括升降机构和多个拾取吸头，所述多个拾取吸头通过旋转机构与所述升降机构相连。
  8. 根据权利要求7所述的设备，其中，所述拾取吸头包括一个固定吸头和多个调距吸头。
  9. 根据权利要求1所述的设备，其中，所述封装模组包括：载带卷盘、载带拉动组件、压带卷盘、热压合组件和载带收卷盘，所述载带卷盘和所述压带卷盘分别设置于所述载带拉动组件的下方和上方，设置为供给载带和压带，以将芯片夹持在载带和压带之间，所述热压合组件安装于所述载带拉动组件上，设置为将所述芯片周围的载带和压带压合，所述载带收卷盘设置于所述载带拉动组件的出料端，设置为对封装后的载带进行收卷。
  10. 根据权利要求1所述的设备，其中，所述封装模组设置有一组，所述封装模组平行于所述封装轨道设置于所述机台上。
  11. 根据权利要求1所述的设备，其中，所述封装模组设置有两组，所述两组封装模组通过封装台安装于所述机台侧面，所述封装台与所述工作台之间通过切换机构相连，所述切换机构设置为推动所述两组封装模组分别与所述拾取模组配合。
  12. 根据权利要求11所述的设备，其中，所述切换机构包括切换气缸，所述切换气缸沿Y轴方向安装于所述机台侧面，所述切换气缸的上侧和下侧分别设置有切换导轨，所述切换气缸连接所述封装台，所述封装台与所述切换导轨滑动连接，所述两组封装模组安装在所述封装台上。
  13. 根据权利要求11所述的设备，其中，所述检测工位还包括第四检测工位，所述第四检测工位设置有外观检测器，所述外观检测器在所述封装台上方被设置为在所述两组封装模组之间往复移动。
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