WO2023142958A1 - 显示装置及显示面板 - Google Patents

显示装置及显示面板 Download PDF

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Publication number
WO2023142958A1
WO2023142958A1 PCT/CN2023/070809 CN2023070809W WO2023142958A1 WO 2023142958 A1 WO2023142958 A1 WO 2023142958A1 CN 2023070809 W CN2023070809 W CN 2023070809W WO 2023142958 A1 WO2023142958 A1 WO 2023142958A1
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WO
WIPO (PCT)
Prior art keywords
display
area
groove
heat dissipation
display substrate
Prior art date
Application number
PCT/CN2023/070809
Other languages
English (en)
French (fr)
Inventor
庞孟媛
廖川东
王亚明
石佳凡
杨恕权
李俊杉
柳文良
杨超
杨阳
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US18/578,015 priority Critical patent/US20240224479A1/en
Publication of WO2023142958A1 publication Critical patent/WO2023142958A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a display device and a display panel.
  • a flexible display substrate is usually provided in the display panel, and the flexible display substrate is used to connect the end portion of the flexible display substrate to an external circuit by taking advantage of the bendable characteristics of the display panel. Folding in half toward the back of the flexible display substrate reduces the packaging size of the flexible display substrate, thereby reducing the frame size of the display panel.
  • the inventors have found that when the end of the flexible display substrate is bent to the back of the flexible display substrate, it is impossible to achieve an extremely narrow frame of the display panel.
  • the purpose of the present disclosure is to provide a display device and a display panel, which can realize extremely narrow frame of the display panel.
  • a display panel comprising:
  • a display substrate having a display area, a non-display area, and a bending area between the display area and the non-display area;
  • the back film located on a side away from the light-emitting surface of the display substrate, the back film includes a first support area and a second support area, the projection of the first support area on the display substrate at least coincides with the display area, The projection of the second support area on the display substrate is located in the non-display area;
  • the heat dissipation film is located on the side of the back film away from the display substrate, and the orthographic projection on the back film is located in the first support area, and the surface of the heat dissipation film away from the display substrate has grooves , the groove is filled with an adhesive;
  • the non-display area and the second support area are located on the side of the heat dissipation film away from the first support area, and the second support area covers the groove and contact with the adhesive.
  • the heat dissipation film includes an adhesive layer, a thermal conduction layer and a conductive layer stacked in sequence in a direction away from the display substrate, and the groove penetrates through the conductive layer.
  • the groove further penetrates the heat conduction layer, and the adhesive layer extends into the groove to form the adhesive.
  • the groove wall of the groove has a stepped surface facing the display substrate.
  • the heat dissipation film includes an adhesive layer, a heat conduction layer and a conductive layer, and the depth of the groove is greater than the thickness of the conductive layer;
  • the area of the first region corresponding to the groove on the surface of the heat conducting layer facing the conductive layer is greater than the area of the second region corresponding to the groove on the surface of the conducting layer facing the heat conducting layer.
  • the groove gradually shrinks in a direction close to the display substrate.
  • the difference between the thickness of the adhesive and the depth of the groove is less than or equal to 0.02 mm.
  • the surface of the heat dissipation film facing away from the display substrate has a plurality of grooves arranged in an array, and the plurality of grooves are all filled with the adhesive.
  • the distance between the outermost groove and the corresponding edge on the heat dissipation film is greater than or equal to 0.3 mm;
  • the distance between the outermost groove and the corresponding edge on the heat dissipation film is greater than or equal to 3.5 mm.
  • a method for manufacturing a display panel including:
  • the display substrate has a display area, a non-display area, and a bending area between the display area and the non-display area;
  • the back film includes a first support area and a second support area, and the projection of the first support area on the display substrate at least coincides with the display area , the projection of the second support area on the display substrate is located in the non-display area;
  • a heat dissipation film is fabricated on the side of the first support area away from the display substrate, the orthographic projection of the heat dissipation film on the back film is located in the first support area, and the surface away from the display substrate has a groove, the groove is filled with an adhesive that is at least flush with the surface of the heat dissipation film;
  • the heat dissipation film includes an adhesive layer, a heat conduction layer and a conductive layer
  • the fabrication of the heat dissipation film on the side of the back film away from the display substrate includes:
  • a gap of a first distance is reserved between the conductive layer and the table top of the operating table, and the first distance is less than or equal to 0.02 mm;
  • the second through hole is opposite to the first through hole to form the groove
  • the adhesive layer on the side of the heat conducting layer away from the conductive layer to obtain the heat dissipation film, the adhesive layer extending to the first through hole and the second through hole;
  • the heat dissipation film is peeled off from the table top of the operating table, and the surface of the adhesive layer facing away from the heat conduction layer is bonded to the side of the first support area facing away from the display substrate.
  • a display device including the display panel described in the first aspect above.
  • FIG. 1 is a schematic structural diagram of a display panel provided in the related art.
  • FIG. 2 is a schematic structural diagram of the display panel shown in FIG. 1 after being bent.
  • FIG. 3 is a schematic structural diagram of a display panel provided by an embodiment of the present disclosure.
  • FIG. 4 is a schematic structural diagram of the display panel shown in FIG. 3 after being bent.
  • FIG. 5 is a schematic structural diagram of another display panel after being bent according to an embodiment of the present disclosure.
  • FIG. 6 is a schematic bottom view of a heat dissipation film provided by an embodiment of the present disclosure.
  • FIG. 7 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure.
  • FIG. 8 is a schematic front view structural view of a heat dissipation film provided by an embodiment of the present disclosure.
  • FIG. 9 is a front structural schematic view of another heat dissipation film provided by an embodiment of the present disclosure.
  • FIG. 10 is a schematic flowchart of a manufacturing method of a display panel provided by an embodiment of the present disclosure.
  • Example embodiments will now be described more fully with reference to the accompanying drawings.
  • Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art.
  • the same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted.
  • the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale.
  • the packaging process of the display substrate 1 includes COF (Chip On Flex or Chip On Film), COG (Chip On Glass), COP (Chip On Plastic), the COP packaging process can significantly reduce the frame of the display panel compared with the COF packaging process and the COG packaging process.
  • the inventors found that when the display substrate 1 is packaged using the above-mentioned COP packaging process, since the total thickness of the film layer on the back side of the display substrate 1 is relatively thick, the bending radius of the display substrate 1 is relatively large when it is bent, thus making After forming a display panel, the extremely narrow frame of the display panel has not been realized.
  • FIG. 1 a display panel in the related art is shown in FIG. 1 , including a display substrate 1, a back film 2, a heat dissipation film 3 and a spacer layer;
  • the film 2 is on the side away from the display substrate 1
  • the spacer layer is located on the side of the heat dissipation film 3 away from the display substrate 1 .
  • FIG. 2 when the display substrate 1 is packaged, the display substrate 1 is directly bent to realize a narrow frame of the display panel.
  • the vertical distance between the display area 11 on the front and the non-display area 13 on the back of the display substrate 1 is the thickness of the heat dissipation film 3, the thickness of the spacer layer, and the thickness of the two back films 2
  • the bending radius of the display substrate 1 is relatively large when it is bent, so that the lower frame of the display panel cannot be extremely narrowed.
  • FIG. 3 illustrates a schematic structural diagram of a display panel according to an embodiment of the present disclosure.
  • the display panel includes: a display substrate 1 , a back film 2 and a heat dissipation film 3 .
  • the display substrate 1 has a display area 11, a non-display area 13, and a bending area 12 between the display area 11 and the non-display area 13;
  • the film 3 is located on the side of the back film 2 away from the display substrate 1, and the orthographic projection on the back film 2 is located in the first support area 21.
  • the surface of the heat dissipation film 3 away from the display substrate 1 has a groove 31, and the groove 31 is filled with There are adhesives 5. As shown in FIG. 4, after the bending area 12 is bent, the non-display area 13 and the second support area 22 are located on the side of the heat dissipation film 3 away from the first support area 21, and the second support area 22 covers the groove 31 and is in contact with the first support area 21. Adhesive 5 contacts.
  • the vertical distance between the display area 11 and the non-display area 13 of the display substrate 1 is the thickness of the heat dissipation film 3, the thickness of the spacer cushion layer 4, the thickness of the two-layer back film 2, and for the display panel in the embodiment of the present disclosure, after the display substrate 1 is bent, the vertical distance between the display area 11 and the non-display area 13 of the display substrate 1 is only the thickness of the heat dissipation film 3 and two layers
  • the thickness of the back film 2 and the vertical distance between the display area 11 and the non-display area 13 are reduced, that is, the bending radius of the bending area 12 of the display substrate 1 is reduced, thereby reducing the The purpose of displaying the border width of the panel.
  • the vertical distance between the display area 11 and the non-display area 13 of the display substrate 1 in the related art is approximately 0.6 millimeters, while in the embodiment of the present disclosure, the distance between the display area 11 and the non-display area 13 of the display substrate 1
  • the vertical distance is greater than or equal to 0.19 mm and less than or equal to 0.24 mm. It can be seen that, the display substrate 1 according to the embodiment of the present disclosure can significantly reduce the bending radius during bending, so that the display panel can achieve the purpose of extremely narrow frame.
  • the vertical distance between the display area 11 and the non-display area 13 of the display substrate 1 is 0.2 millimeters, that is, the total thickness of the heat dissipation film 3 and the thickness of the two layers of the back film 2 is 0.2 millimeters. , which shows that the bending radius of the substrate 1 is only 0.1 mm.
  • the area on the display substrate 1 located on the side of the separation line S1 away from the separation line S2 is the display area 11
  • the area between the separation line S1 and the separation line S2 is the bending area 12
  • the area located at the separation line S2 away from the separation line S1 is the non-display area 13, and the display area 11, the bending area 12 and the non-display area 13 of the display substrate 1 are integrated structures, and the layer structure included in the display substrate 1 can refer to related technologies, This will not be described in detail in the implementation manner of the present disclosure.
  • the display area 11, the non-display area 13 and the bending area 12 of the display substrate 1 are all made of flexible materials so as to facilitate the bending of the display substrate 1;
  • the bending region 12 of the display substrate 1 is made of a flexible material, as long as the bending region 12 of the display substrate 1 can be bent, which is not limited in the embodiments of the present disclosure.
  • the separation line S1 may be flush with the edge of the first support area 21 in FIG. 3 or FIG. 4
  • the separation line S2 may be flush with the edge of the second support area 22 .
  • the flexible protective layer 6 is a UV adhesive layer.
  • the thickness of the flexible protective layer 6 can be set to be greater than or equal to 50 microns and less than or equal to 70 microns.
  • the layer structure included in the back film 2 reference may be made to related technologies, which are not limited in the embodiments of the present disclosure.
  • the orthographic projection of the first support area 21 on the display substrate 1 overlaps with the display area 11, or covers
  • the display area 11 that is, the edge of the first support area 21 close to the second support area 22 is aligned with the edge of the display area 11 close to the bending area 12 , or exceeds the edge of the display area 11 close to the bending area 12 .
  • the part of the non-display area 13 can assist the bending of the bending area 12 , thereby ensuring the packaging of the display substrate 1 .
  • the material of the adhesive 5 in the groove 31 can be selected according to the adhesive performance of the material itself, as long as the heat dissipation film 3 and the second support area 22 of the back film 2 can be stably bonded.
  • the adhesive performance of the adhesive 5 is greater than or equal to 2000 gf/inch.
  • the adhesive 5 can be flush with the surface of the heat dissipation film 3 , or slightly protrude from the surface of the heat dissipation film 3 .
  • the adhesive 5 protrudes from the surface of the heat dissipation film 3
  • the second support area 22 of the back film 2 is in contact with the adhesive 5
  • the extrusion of the adhesive 5 can be realized to increase the second support area 22
  • the contact area with the adhesive 5 is improved, thereby improving the bonding effect between the second support area 22 and the adhesive 5 .
  • the thickness of the adhesive 5 and the depth of the groove 31 is less than or equal to 0.02mm.
  • the difference between the thickness of the adhesive 5 and the depth of the groove 31 is 0.01 mm, that is, the height of the adhesive 5 protruding from the surface of the heat dissipation film 3 is 0.01 mm.
  • the groove 31 when filling the adhesive 5 in the groove 31, in order to prevent the adhesive 5 from coming out of the groove 31, in some embodiments, gradually shrinks in the direction close to the display substrate 1, that is, The area of the corresponding region of the groove 31 on a plane parallel to the display substrate 1 gradually decreases along a direction approaching the display substrate 1 . In this way, the bonding area of the adhesive 5 and the heat dissipation film 3 can be increased, thereby improving the bonding stability of the adhesive 5 in the groove 31 .
  • the groove 31 is a conical groove or a pyramidal groove.
  • the contact area between the second support region 22 of the back film 2 and the adhesive 5 can be increased. , so as to ensure the bonding effect on the second supporting area 22 of the back film 2 .
  • the groove wall of the groove 31 has a stepped surface 311 facing the display substrate 1 .
  • the adhesive 5 filled in the groove 31 can form a limit at the step surface 311 , thereby preventing the adhesive 5 from coming out of the groove 31 and ensuring the stability of the adhesive 5 and the heat dissipation film 3 .
  • the position of the stepped surface 311 can be determined in combination with the structural layer included in the heat dissipation film 3 and the depth of the groove 31 , which will be explained in detail when explaining the content of the heat dissipation film 3 below.
  • the groove 31 is a strip-shaped structure. In this way, the contact area between the adhesive 5 in the groove 31 and the second support area 22 is increased through the groove 31 of the strip structure, thereby ensuring the bonding effect on the second support area 22 .
  • the second support area 22 covers the groove 31 of the strip structure , that is, the orthographic projection of the area surrounded by the groove 31 of the strip structure on the second support area 22 is located in the area where the second support area 22 is located.
  • the grooves 31 may be distributed in the arrangement direction of the display area 11 , the bending area 12 , and the non-display area 13 included in the display substrate 1 , and extend in a direction perpendicular to the arrangement direction.
  • a plurality of grooves 31 may be provided on the surface of the heat dissipation film 3 facing away from the display substrate 1 , and the plurality of grooves 31 are filled with adhesive 5 . In this way, the contact area with the second supporting area 22 of the back film 2 is increased by the adhesive 5 in the plurality of grooves 31 , thereby ensuring the bonding effect on the second supporting area 22 .
  • a plurality of grooves 31 are distributed in an array, which can ensure the hardness of the heat dissipation film 3, thereby ensuring the supporting effect of the heat dissipation film 3 on the display substrate 1, and at the same time avoiding the side length of the heat dissipation path of the heat dissipation film 3, thereby ensuring the support for the display substrate 1. cooling effect.
  • the cross-sectional shape of the groove 31 is circular, elliptical or rectangular, etc., and the non-display area 13 of the display substrate 1 and the second support area 22 of the back film 2 are bent to a part where the heat dissipation film 3 is away from the display area 11 of the display substrate 1. Later, the orthographic projection of the area surrounded by each groove 31 on the second support area 22 is located in the area where the second support area 22 is located.
  • the plurality of grooves 31 are distributed in a matrix
  • the matrix includes a plurality of grooves 31 in the row direction O2
  • the matrix includes at least one groove 31 in the column direction O1.
  • the row direction O1 of the matrix is perpendicular to the arrangement direction O1 of the display area 11, the bending area 12, and the non-display area 13 included in the display substrate 1, and the column direction O1 of the matrix is the direction O1 of the display substrate 1.
  • the outermost groove 31 and the heat dissipation film 3 are greater than or equal to 0.3 mm.
  • the distance a between the outermost groove 31 and the corresponding edge on the heat dissipation film 3 is 0.4 mm.
  • the distance between the outermost groove 31 and the corresponding edge on the heat dissipation film 3 is greater than or equal to 3.5 mm.
  • the distance b between the outermost groove 31 and the corresponding edge on the heat dissipation film 3 is 4 mm.
  • the heat dissipation film 3 can play the roles of shading, buffering, heat dissipation, shielding and supporting for the display substrate 1 .
  • the heat dissipation film 3 includes an adhesive layer 32 , a heat conduction layer 33 and a conduction layer 34 sequentially stacked in a direction away from the display substrate 1 .
  • the adhesive layer 32 is used to fix the heat dissipation film 3 on the side of the back film 2 facing away from the display substrate 1 , and also has a light-shielding function.
  • the material of the adhesive layer 32 can be grid glue or pressure-sensitive adhesive, and of course other materials with adhesive effect can also be chosen, which is not limited in the embodiments of the present disclosure.
  • the adhesive layer 32 also has the function of removing air bubbles.
  • the heat conduction layer 33 is used to conduct the heat of the display substrate 1 to the conduction layer 34 .
  • the heat conduction layer 33 can be made of heat conduction graphite or foam.
  • the heat conduction layer 33 is made of foam, due to the adhesiveness of the foam, the bonding and fixing of the adhesive layer 32 and the conductive layer 34 can be realized, and the heat conduction layer can be avoided.
  • 33 and the conductive layer 34 are separated; in addition, foam not only has the function of heat conduction, but also has the function of cushioning and vibration reduction.
  • an adhesive 5 needs to be used for bonding between the thermally conductive layer 33 and the conductive layer 34, so as to avoid the gap between the thermally conductive layer 33 and the conductive layer 34. case of separation.
  • the conductive layer 34 is used to realize heat dissipation and electromagnetic shielding, and the conductive layer 34 may have a certain hardness so as to support the display substrate 1 .
  • the material of the conductive layer 34 is copper foil.
  • the preparation of the heat dissipation film 3 can be completed first, and then the heat dissipation film 3 including the adhesive layer 32, the heat conduction layer 33 and the conduction layer 34 is bonded on the back as a whole.
  • the side of the film 2 facing away from the display substrate 1 .
  • the surface of the adhesive layer 32 facing away from the heat conduction layer 33 has a release paper.
  • each structural layer included in the heat dissipation film 3 may also be bonded layer by layer on the side of the back film 2 away from the display substrate 1 .
  • an adhesive layer 32 , a heat conduction layer 33 , and a conduction layer 34 are provided layer by layer on the side of the back film 2 away from the display substrate 1 .
  • the surface of the heat dissipation film 3 facing away from the display substrate 1 has a groove 31 .
  • the depth of the groove 31 can be determined according to the thickness of the conductive layer 34 .
  • the thickness and the thickness of the heat conduction layer 33 are determined, as long as the adhesive 5 filled in the groove 31 can be firmly bonded to the heat dissipation film 3 .
  • the groove 31 does not penetrate the conductive layer 34, that is, the depth of the groove 31 is less than the thickness of the conductive layer 34; or the groove 31 only penetrates the conductive layer 34, that is, the depth of the groove 31 is equal to the thickness of the conductive layer 34
  • the area of the surface of the thermally conductive layer 33 close to the conductive layer 34 corresponding to the groove 31 is used as the groove bottom of the groove 31; or as shown in FIG. That is, the depth of the groove 31 is greater than the thickness of the conductive layer 34 and less than the sum of the thicknesses of the conductive layer 34 and the heat conducting layer 33; or as shown in FIG. 9, the groove 31 not only penetrates the conducting layer 34, but also penetrates the heat conducting layer 33, that is, The depth of the groove 31 is equal to the sum of the thicknesses of the conductive layer 34 and the thermal conductive layer 33 .
  • the depth of the groove 31 is less than or equal to the thickness of the conductive layer 34, it can be set on the conductive layer 34 in advance, or it can be set after the conductive layer 34 is bonded to the heat-conducting layer 33; if the groove 31 is greater than the thickness of the conductive layer 34 and less than or equal to the sum of the thickness of the conductive layer 34 and the thermally conductive layer 33, then it can be respectively set on the conductive layer 34 and the thermally conductive layer 33 in advance, and the conductive layer 34 is bonded to the thermally conductive layer 33 Alignment can be performed at any time.
  • the adhesive layer 32 can extend into the groove 31 to form the adhesive 5 integrated with the adhesive layer 32 .
  • the structural layers of the heat dissipation film 3 are bonded layer by layer on the side away from the display substrate 1, since the material of the adhesive layer 32 has good fluidity, it is not easy to pre-form the adhesive layer 32 for filling when preparing the adhesive layer 32.
  • the adhesive 5 in the groove 31 can only be filled with the adhesive 5 in the groove 31 after the thermal conduction layer 33 and the conductive layer 34 are set completely.
  • the depth of the groove 31 is greater than the thickness of the conductive layer 34, then the area of the corresponding region of the groove 31 on the surface of the conductive layer 34 close to the heat conduction layer 33 is larger than the corresponding region on the surface of the heat conduction layer 33 close to the conductive layer 34 In this way, a step surface 311 facing the adhesive layer 32 can be formed in the groove 31, so that the adhesive 5 in the groove 31 can be limited by the step surface 311, ensuring the adhesion between the adhesive 5 and the heat dissipation film 3 Relay strength.
  • the stepped surface 311 may also be formed on the conductive layer 34 corresponding to the groove wall of the groove 31 , or the stepped surface 311 may be formed on the thermally conductive layer 33 corresponding to the groove wall of the groove 31 , which is not limited in the embodiments of the present disclosure.
  • a method for manufacturing a display panel is also provided, and the method is used for manufacturing the display panel shown in the above embodiments. As shown in Fig. 10, the method includes the following steps.
  • Step 110 making a display substrate, the display substrate has a display area, a non-display area, and a bending area between the display area and the non-display area.
  • Step 120 Make a back film on the side of the display substrate that separates the light-emitting surface.
  • the back film includes a first support area and a second support area.
  • the projection of the first support area on the display substrate overlaps at least the display area, and the second support area is in The projection on the display substrate is located in the non-display area.
  • Step 130 Fabricate a heat dissipation film on the side of the first support area away from the display substrate, the orthographic projection of the heat dissipation film on the back film is located in the first support area, and the surface away from the display substrate has a groove filled with at least Adhesive that is flush with the surface of the thermal film.
  • Step 140 bending the bending area of the display substrate to bend the non-display area and the second support area to the side of the heat dissipation film away from the display area, and bonding the second support area to the adhesive.
  • the display panel described in the above embodiment can be produced through the above steps 110 to 140.
  • the technical effect of the display panel can be specifically referred to in the above embodiment, and the embodiment of the present disclosure will not elaborate on this repeat.
  • the heat dissipation film on the side of the back film facing away from the display substrate can be realized through various processes, that is, the above step 130 can be realized through various processes.
  • the heat dissipation film is produced first, and then the heat dissipation film is bonded as a whole on the side of the back film away from the display substrate; side of the substrate.
  • a conductive layer with a first through hole and a thermally conductive layer with a second through hole supporting the conductive layer on the operating table, a gap of a first distance is reserved between the conductive layer and the table top of the operating table, and the first distance is less than or equal to 0.02 mm; laminate the heat conduction layer on the conduction layer, and the second through hole faces the first through hole to form a groove; make an adhesive layer on the side of the heat conduction layer away from the conduction layer to obtain a heat dissipation film, bond The layer extends to the first through hole and the second through hole; the heat dissipation film is peeled off from the table top of the operating table, and the surface of the adhesive layer away from the heat conduction layer is bonded to the side of the first support area away from the display substrate.
  • the above implementation process is explained by taking the conductive layer and the heat conduction layer where the groove penetrates the heat dissipation film as an example.
  • blind holes can also be provided on the surface close to the conduction layer, or blind holes can be provided only on the surface of the conduction layer away from the heat conduction layer. etc., the implementation of the present disclosure does not repeat the corresponding specific implementation process. It only needs to be noted that, for the case where the groove does not penetrate the conductive layer and the thermally conductive layer at the same time, it needs to be filled separately in the groove formed by the through hole and/or blind hole after the multiple structural layers of the heat dissipation film are bonded completely.
  • the adhesive is at least flush with the surface of the conductive layer.
  • steps of the manufacturing method of the display panel in the present disclosure are described in a specific order in FIG. 10 , this does not require or imply that these steps must be performed in this specific order, or that all The steps shown are required to achieve the desired result. Additionally or alternatively, certain steps may be omitted, multiple steps may be combined into one step for execution, and/or one step may be decomposed into multiple steps for execution, etc.
  • Embodiments of the present disclosure also provide a display device, which includes the display panel described in the above embodiments.
  • the display panel described in the above embodiment can realize extremely narrow frame, so when the display device is manufactured based on the display panel of the above embodiment, the extremely narrow frame of the display device can be realized, thereby improving the aesthetics of the display device.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

一种显示装置及显示面板，涉及显示技术领域。显示面板包括: 显示基板(1)、背膜(2)和散热膜(3)，显示基板(1)具有显示区(11)、非显示区(13)和弯折区(12)；背膜(2)包括第一支撑区(21)和第二支撑区(22)；散热膜(3)在背膜(2)上的正投影位于第一支撑区(21)内，散热膜(3)背离显示基板(1)的表面具有填充粘接剂(5)的凹槽(31)。显示基板(1)弯折后，显示基板(1)的显示区(11)和非显示区(13)之间的垂直距离仅为散热膜(3)的厚度与两层背膜(2)的厚度和，从而减小了显示基板(1)弯折时的弯折半径，达到显示面板极窄边框的目的。

Description

显示装置及显示面板
交叉引用
本公开要求于2022年01月30日提交的申请号为202210113961.8名称为“显示装置及显示面板”的中国专利申请的优先权，该中国专利申请的全部内容通过引用全部并入本文。
技术领域
本公开涉及显示技术领域，具体而言，涉及一种显示装置及显示面板。
背景技术
目前，为了实现显示面板的窄边框化或者极窄边框化，通常在显示面板中设置柔性显示基板，利用柔性显示基板可弯折的特性，将柔性显示基板上用于与外部电路连接的端部向柔性显示基板的背面对折，减少柔性显示基板的封装尺寸，从而减小显示面板的边框尺寸。然而，发明人发现在将柔性显示基板的端部弯折至柔性显示基板的背面时，并不能实现显示面板的极窄边框化。
需要说明的是，在上述背景技术部分公开的信息仅用于加强对本公开的背景的理解，因此可以包括不构成对本领域普通技术人员已知的现有技术的信息。
发明内容
本公开的目的在于提供一种显示装置及显示面板，能够实现显示面板的极窄边框化。
根据本公开的第一方面，提供一种显示面板，包括：
显示基板，具有显示区、非显示区，以及位于所述显示区和所述非显示区之间的弯折区；
背膜，位于背离所述显示基板出光面的一侧，所述背膜包括第一支撑区和第二支撑区，所述第一支撑区在显示基板上的投影至少与所述显 示区重合，所述第二支撑区在所述显示基板上的投影位于所述非显示区内；
散热膜，位于所述背膜背离所述显示基板的一侧，且在所述背膜上的正投影位于所述第一支撑区内，所述散热膜背离所述显示基板的表面具有凹槽，所述凹槽内填充有粘接剂；
所述弯折区弯折后，所述非显示区和所述第二支撑区位于所述散热膜背离所述第一支撑区的一侧，且所述第二支撑区覆盖所述凹槽并与所述粘接剂接触。
根据本公开任一所述的显示面板，所述散热膜包括在背离所述显示基板的方向上依次层叠的粘接层、导热层和导电层，所述凹槽贯穿所述导电层。
根据本公开任一所述的显示面板，所述凹槽还贯穿所述导热层，所述粘接层延伸至所述凹槽内以形成所述粘接剂。
根据本公开任一所述的显示面板，所述凹槽的槽壁具有朝向所述显示基板的台阶面。
根据本公开任一所述的显示面板，所述散热膜包括粘接层、导热层和导电层，所述凹槽的深度大于所述导电层的厚度；
所述导热层朝向所述导电层的表面上对应所述凹槽的第一区域的面积大于所述导电层朝向所述导热层的表面上对应所述凹槽的第二区域的面积。
根据本公开任一所述的显示面板，所述凹槽在靠近显示基板的方向上逐渐收缩。
根据本公开任一所述的显示面板，所述粘接剂的厚度与所述凹槽的深度之间的差值小于或等于0.02毫米。
根据本公开任一所述的显示面板，所述散热膜背离所述显示基板的表面具有呈排列的多个所述凹槽，多个所述凹槽内均填充有所述粘接剂。
根据本公开任一所述的显示面板，在所述显示区、所述弯折区、所述非显示区的排布方向上，最外侧的所述凹槽与所述散热膜上相应边缘之间的距离大于或等于0.3毫米；
在与所述显示区、所述弯折区、所述非显示区的排布方向垂直的方 向上，最外侧的所述凹槽与所述散热膜上相应边缘之间的距离大于或等于3.5毫米。
根据本公开的第二方面，提供一种显示面板的制作方法，包括：
制作显示基板，所述显示基板具有显示区、非显示区，以及位于所述显示区和所述非显示区之间的弯折区；
在所述显示基板别理出光面的一侧制作背膜，所述背膜包括第一支撑区和第二支撑区，所述第一支撑区在显示基板上的投影至少与所述显示区重合，所述第二支撑区在所述显示基板上的投影位于所述非显示区内；
在所述第一支撑区背离所述显示基板的一侧制作散热膜，所述散热膜在所述背膜上的正投影位于所述第一支撑区内，且背离所述显示基板的表面具有凹槽，所述凹槽内填充有至少与所述散热膜表面平齐的粘接剂；
弯折所述显示基板的弯折区，以将所述非显示区和所述第二支撑区弯折至所述散热膜背离所述显示区的一侧，并将所述第二支撑区粘接在所述粘接剂上。
根据本公开任一所述的方法，所述散热膜包括粘接层、导热层和导电层，所述在所述背膜背离所述显示基板的一侧制作散热膜，包括：
制作具有第一通孔的所述导电层和具有第二通孔的所述导热层；
将所述导电层支撑在操作台上，所述导电层与所述操作台的台面之间预留有第一距离的间隙，所述第一距离小于或等于0.02毫米；
将所述导热层层叠在所述导电层上，所述第二通孔与所述第一通孔正对以形成所述凹槽；
在所述导热层背离所述导电层的一侧制作所述粘接层，得到所述散热膜，所述粘接层延伸至所述第一通孔和所述第二通孔；
从所述操作台的台面剥离所述散热膜，并将所述粘接层背离所述导热层的表面粘接在所述第一支撑区背离所述显示基板的一侧。
根据本公开的第三方面，提供一种显示装置，包括上述第一方面 所述的显示面板。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性和解释性的，并不能限制本公开。
附图说明
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本公开的实施例，并与说明书一起用于解释本公开的原理。显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为相关技术提供的一种显示面板的结构示意图。
图2为图1所示的显示面板弯折后的结构示意图。
图3为本公开实施方式提供的一种显示面板的结构示意图。
图4为图3所示的显示面板弯折后的结构示意图。
图5为本公开实施方式提供的另一种显示面板弯折后的结构示意图。
图6为本公开实施方式提供的一种散热膜的仰视结构示意图。
图7为本公开实施方式提供的又一种显示面板的结构示意图。
图8为本公开实施方式提供的一种散热膜的主视结构示意图。
图9为本公开实施方式提供的另一种散热膜的主视结构示意图。
图10为本公开实施方式提供的一种显示面板的制作方法的流程示意图。
附图标记：
1、显示基板；2、背膜；3、散热膜；4、隔物垫层；5、粘接剂；6、柔性保护层；
11、显示区；12、弯折区；13、非显示区；
21、第一支撑区；22、第二支撑区；
31、凹槽；311、台阶面；32、粘接层；33、导热层；34、导电层。
具体实施方式
现在将参考附图更全面地描述示例实施方式。然而，示例实施方式能够以多种形式实施，且不应被理解为限于在此阐述的实施方式；相反，提供这些实施方式使得本公开将全面和完整，并将示例实施方式的构思全面地传达给本领域的技术人员。图中相同的附图标记表示相同或类似的结构，因而将省略它们的详细描述。此外，附图仅为本公开的示意性图解，并非一定是按比例绘制。
用语“一个”、“一”、“该”、“所述”和“至少一个”用以表示存在一个或多个要素/组成部分/等；用语“包括”和“具有”用以表示开放式的包括在内的意思并且是指除了列出的要素/组成部分/等之外还可存在另外的要素/组成部分/等；用语“第一”、“第二”和“第三”等仅作为标记使用，不是对其对象的数量限制。
相关技术中，为了实现显示面板的窄边框化或者极窄边框化，同时保证显示面板包括的显示基板1的端部与外接电路的连接，显示基板1的封装工艺包括COF(Chip On Flex or Chip On Film)、COG(Chip On Glass)、COP(Chip On Plastic)，COP封装工艺相较于COF封装工艺和COG封装工艺能够明显减小显示面板的边框。然而，发明人发现在采用上述COP封装工艺对显示基板1进行封装时，由于显示基板1的背侧的膜层总厚度较厚，造成显示基板1弯折时的弯折半径较大，从而制成显示面板后并没有实现显示面板的极窄边框化。
示例地，相关技术中显示面板如图1所示，包括显示基板1、背膜2、散热膜3和隔垫物层；背膜2位于背离显示基板1出光面一侧，散热膜3位于背膜2背离显示基板1的一侧，隔垫物层位于散热膜3背离显示基板1的一侧。如图2所示，在对显示基板1进行封装时，直接将显示基板1进行弯折，以实现显示面板的窄边框。而显示基板1弯折后，显示基板1位于正面的显示区11和位于背面的非显示区13的垂直距离为散热膜3的厚度、隔垫物层的厚度，以及两层背膜2的厚度总和，由于显示区11和非显示区13之间的垂直距离较大，造成显示基板1弯折时的弯折半径较大，从而使得显示面板的下边框并不能实现极窄化。
图3示例了本公开实施方式的一种显示面板的结构示意图。如图3所示，该显示面板包括：显示基板1、背膜2和散热膜3。显示基板1具有显示区11、非显示区13，以及位于显示区11和非显示区13之间的弯折区12；背膜2位于背离显示基板1出光面的一侧，背膜2包括第一支撑区21和第二支撑区22，第一支撑区21在显示基板1上的投影至少与显示区11重合，第二支撑区22在显示基板1上的投影位于非显示区13内；散热膜3位于背膜2背离显示基板1的一侧，且在背膜2上的正投影位于第一支撑区21内，散热膜3背离显示基板1的表面具有凹槽31，凹槽31内填充有粘接剂5。如图4所示，弯折区12弯折后，非显示区13和第二支撑区22位于散热膜3背离第一支撑区21的一侧，且第二支撑区22覆盖凹槽31并与粘接剂5接触。
相关技术中的显示面板，在显示基板1弯折后显示基板1的显示区11和非显示区13之间的垂直距离为散热膜3的厚度、隔物垫层4的厚度、两层背膜2的厚度总和，而对于本公开实施方式中的显示面板，显示基板1弯折后，显示基板1的显示区11和非显示区13之间的垂直距离仅为散热膜3的厚度与两层背膜2的厚度和，从而减小显示区11和非显示区13之间的垂直距离，也即是减小了显示基板1的弯折区12弯折时的弯折半径，进而达到减小显示面板的边框宽度的目的。
示例地，相关技术中显示基板1的显示区11与非显示区13之间的垂直距离近似为0.6毫米，而本公开实施方式中，显示基板1的显示区11与非显示区13之间的垂直距离大于或等于0.19毫米且小于或等于0.24毫米。由此可知，本公开实施方式的显示基板1在弯折时能够明显减小弯折半径，从而使得显示面板达到极窄边框的目的。示例地，本公开实施方式中，显示基板1的显示区11与非显示区13之间的垂直距离为0.2毫米，也即是散热膜3的厚度、两层背膜2的厚度总和为0.2毫米，此时显示基板1弯折时的弯折半径仅为0.1毫米。
其中，如图3或图4所示，显示基板1上位于分隔线S1远离分隔线S2一侧的区域为显示区11，位于分隔线S1和分隔线S2之间的区域为弯折区12，位于分隔线S2远离分隔线S1的区域为非显示区13，显示基板1的显示区11、弯折区12和非显示区13为一体式结构，显示基板1 包括的层结构可参考相关技术，本公开实施方式对此不再赘述。显示基板1的显示区11、非显示区13和弯折区12均采用柔性材料制备，以便于显示基板1的弯折；当然也可以是显示基板1的显示区11和非显示区13采用硬质材料制备，显示基板1的弯折区12采用柔性材料制备，只要能够保证显示基板1的弯折区12的可弯折即可，本公开实施方式对此不做限定。
在一些实施例中，上述分隔线S1也可以是跟图3或图4中第一支撑区21的边缘齐平，分隔线S2可以是跟第二支撑区22的边缘齐平。
对于显示基板1的弯折区12，为了避免弯折区12弯折时内部线路的折断，如图5所示，显示面板还包括柔性保护层6，柔性保护层6位于显示基板1出光面的一侧，且在显示基板1上的投影位于弯折区12。示例地，该柔性保护层6为UV胶层。为了避免柔性保护层6增大显示面板的边框宽度，柔性保护层6的厚度可设置为大于或等于50微米且小于或等于70微米。
其中，背膜2包括的层结构可参考相关技术，本公开实施方式对此不做限定。为了保证显示基板1的显示区11能够正常显示画面，避免因显示区11的边缘出现弯曲变形从而影响画质，第一支撑区21在显示基板1上的正投影与显示区11重合，或者覆盖显示区11，也即是第一支撑区21靠近第二支撑区22的边缘与显示区11靠近弯折区12的边缘对齐，或者超出显示区11靠近弯折区12的边缘。另外，对于第二支撑区22在显示基板1上的正投影位于非显示区13内的情况，当弯折区12上的可弯折部分不足以使第二支撑区22和非显示区13弯折至散热膜3的背侧时，可通过非显示区13的部分辅助弯折区12的弯折，从而保证显示基板1的封装。
本公开实施方式中，凹槽31内粘接剂5的材料可根据材料本身的粘接性能进行选择，只要能够保证散热膜3与背膜2的第二支撑区22粘接稳定即可。示例地，粘接剂5的粘接性能大于或等于2000克力/英寸。
凹槽31内填充粘接剂5时，粘接剂5可与散热膜3的表面平齐，当然也可略凸出散热膜3的表面。当粘接剂5凸出散热膜3的表面时，背膜2的第二支撑区22与粘接剂5接触时，可实现对粘接剂5的挤压，以 增大第二支撑区22与粘接剂5的接触面积，从而提高第二支撑区22与粘接剂5之间的粘接效果。
其中，为了避免粘接剂5凸出散热膜3表面的高度太大，造成显示基板1的非显示区13与导电层34之间形成空气间隙，粘接剂5的厚度与凹槽31的深度之间的差值小于或等于0.02毫米。示例地，粘接剂5的厚度与凹槽31的深度之间的差值为0.01毫米，也即是粘接剂5凸出散热膜3的表面高度为0.01毫米。
另外，在凹槽31内填充粘接剂5时，为了避免粘接剂5从凹槽31内脱出，在一些实施方式中，凹槽31在靠近显示基板1的方向上逐渐收缩，也即是凹槽31在平行于显示基板1的平面上对应区域的面积沿靠近显示基板1的方向逐渐减小。如此，可增大粘接剂5与散热膜3的粘接面积，从而提高粘接剂5在凹槽31内粘接的稳固性。示例地，凹槽31为圆锥槽或棱锥槽。
其中，由于凹槽31在平行于显示基板1的平面上对应区域的面积沿背离显示基板1的方向逐渐增大，从而能够提高背膜2的第二支撑区22与粘接剂5的接触面积，从而保证对背膜2的第二支撑区22的粘接效果。
在另一些实施方式中，凹槽31的槽壁具有朝向显示基板1的台阶面311。如此，填充在凹槽31内的粘接剂5能够台阶面311处形成限位，从而避免粘接剂5从凹槽31内脱出，保证粘接剂5与散热膜3粘接的稳固性。
其中，台阶面311的位置可结合散热膜3包括的结构层和凹槽31的深度确定，具体在下述解释散热膜3的内容时进行详细解释。
本公开实施方式中，通过凹槽31内的粘接剂5将背膜2的第二支撑区22粘接在散热膜3背离显示区11的一侧时，为了保证对第二支撑区22的粘接效果，在一些实施方式中，凹槽31为长条状结构。如此，通过条状结构的凹槽31，增大凹槽31内粘接剂5与第二支撑区22的接触面积，从而保证对第二支撑区22的粘接效果。
其中，显示基板1的非显示区13和背膜2的第二支撑区22弯折至散热膜3背离第一支撑区21的一侧后，第二支撑区22覆盖条状结构的 凹槽31，也即是条状结构的凹槽31围城的区域在第二支撑区22上的正投影均位于第二支撑区22所在的区域内。凹槽31可在显示基板1包括的显示区11、弯折区12、非显示区13的排布方向上分布，在与该排布方向垂直的方向上延伸。
在另一些实施方式中，如图6所示，可在散热膜3背离显示基板1的表面设置多个凹槽31，多个凹槽31内均填充有粘接剂5。如此，通过多个凹槽31内的粘接剂5增大了与背膜2的第二支撑区22的接触面积，从而保证了对第二支撑区22的粘接效果。
其中，多个凹槽31呈阵列分布，可保证散热膜3的硬度，进而保证散热膜3对显示基板1的支撑效果，同时避免散热膜3的散热路径边长，从而保证了对显示基板1的散热效果。
凹槽31的截面形状为圆形、椭圆形或者矩形等，显示基板1的非显示区13和背膜2的第二支撑区22弯折至散热膜3背离显示基板1的显示区11的一侧后，每个凹槽31围城的区域在第二支撑区22上的正投影均位于第二支撑区22所在的区域内。
其中，如图6所示，多个凹槽31呈矩阵分布，矩阵的行方向O2上包括多个凹槽31，矩阵的列方向O1上包括至少一个凹槽31。结合图3和图6所示，矩阵的行方向O1与显示基板1包括的显示区11、弯折区12、非显示区13的排布方向O1垂直，矩阵的列方向O1为显示基板1包括的显示区11、弯折区12、非显示区13的排布方向O1。
对于上述两种方式，在散热膜3背离显示基板1的表面设置凹槽31时，在显示区11、弯折区12、非显示区13的排布方向上，最外侧的凹槽31与散热膜3上相应边缘之间的距离大于或等于0.3毫米。示例地，如图6所示，在阵列排布的多个凹槽31的列方向O1上，最外侧的凹槽31与散热膜3上相应边缘之间的距离a为0.4毫米。在与显示区11、弯折区12、非显示区13的排布方向垂直的方向上，最外侧的凹槽31与散热膜3上相应边缘之间的距离大于或等于3.5毫米。示例地，如图6所示，在阵列排布的多个凹槽31的行方向O2上，最外侧的凹槽31与散热膜3上相应边缘之间的距离b为4毫米。
本公开实施方式中，散热膜3可对显示基板1起到遮光、缓冲、散热、屏蔽和支撑的作用。如图7、图8或图9所示，散热膜3包括在背离显示基板1的方向上依次层叠的粘接层32、导热层33和导电层34。
粘接层32用于将散热膜3固定在背膜2背离显示基板1的一侧，并且还具有遮光的作用。粘接层32的材料可选用网格胶或者压敏胶，当然也可以选用其他具有粘接作用的材料，本公开实施方式对此不做限定。当粘接层32的材料为网格胶时，粘接层32还具备去除气泡的作用。
导热层33用于将显示基板1的热量传导至导电层34。导热层33可以采用导热石墨或泡棉制备，当采用泡棉制备导热层33时，由于泡棉所具有的粘接性，可实现粘接层32与导电层34的粘接固定，避免导热层33与导电层34之间分离的情况；另外，泡棉除了导热的作用外，还具有缓冲减振的作用。而当采用其他不具有粘接性的材料比如导热石墨制备导热层33时，则导热层33与导电层34之间需要使用粘接剂5进行粘接，以避免导热层33与导电层34之间分离的情况。
导电层34用于实现散热和电磁屏蔽，且导电层34可具有一定的硬度，以实现对显示基板1的支撑。示例地，导电层34的材料为铜箔。
需要说明的是，本公开实施方式中，在制作显示面板时，可先完成散热膜3的制备，再将包括粘接层32、导热层33和导电层34的散热膜3整体粘接在背膜2背离显示基板1的一侧。其中，完成散热膜3的制备后，粘接层32背离导热层33的表面具有离型纸。当然，也可将散热膜3包括的各结构层逐层粘接在背膜2背离显示基板1的一侧。比如，在背膜2背离显示基板1的一侧逐层设置粘接层32、导热层33、导电层34。
本公开实施方式中，如图8或图9所示，散热膜3背离显示基板1的表面具有凹槽31，结合上述散热膜3的层结构，该凹槽31的深度可根据导电层34的厚度和导热层33的厚度确定，只要保证凹槽31内填充的粘接剂5能够稳固的粘接在散热膜3上即可。
其中，凹槽31未贯穿导电层34，也即是凹槽31的深度小于导电层34的厚度；或者凹槽31仅贯穿导电层34，也即是凹槽31的深度等于导电层34的厚度，此时导热层33靠近导电层34的表面对应凹槽31的区 域作为凹槽31的槽底；或者如图8所示，凹槽31贯穿至导热层33，且未贯穿导热层33，也即是凹槽31的深度大于导电层34的厚度且小于导电层34和导热层33的厚度和；或者如图9所示，凹槽31不仅贯穿导电层34，还贯穿导热层33，也即是凹槽31的深度等于导电层34和导热层33的厚度和。
需要说明的是，若凹槽31的深度小于或等于导电层34的厚度，则可预先在导电层34上进行设置，也可在导电层34与导热层33粘接后进行设置；若凹槽31的深度大于导电层34的厚度且小于或等于导电层34和导热层33的厚度和，则可预先在导电层34和导热层33上分别设置，且在导电层34与导热层33贴合时进行对位即可。
结合上述描述，为了避免粘接剂5从凹槽31内脱出，如图9所示，若凹槽31贯穿导电层34和导热层33，也即是凹槽31的深度等于导电层34和导热层33的厚度和，则在制作散热膜3的粘接层32时，粘接层32可延伸至凹槽31内，以形成与粘接层32一体化的粘接剂5。而对于散热膜3的各结构层逐层粘接在背离背离显示基板1一侧的情况，由于粘接层32的材料的流动性较好，在制备粘接层32时不易预先形成用于填充凹槽31的粘接剂5，从而只能在导热层33和导电层34设置完整后再单独在凹槽31内填充粘接剂5。
如图8所示，若凹槽31的深度大于导电层34的厚度，则凹槽31在导电层34靠近导热层33的表面对应区域的面积大于在导热层33靠近导电层34的表面对应区域的面积，如此凹槽31内可形成朝向粘接层32的台阶面311，从而通过台阶面311对凹槽31内的粘接剂5形成限位，保证粘接剂5与散热膜3的粘接力度。当然，也可以在导电层34上对应凹槽31的槽壁形成台阶面311，或者在导热层33对应凹槽31的槽壁形成台阶面311，本公开实施方式对此不做限定。
本公开实施方式中，还提供了一种显示面板的制作方法，该方法用于制作上述实施方式所示的显示面板。如图10所示，该方法包括如下步骤。
步骤110、制作显示基板，显示基板具有显示区、非显示区，以及 位于显示区和非显示区之间的弯折区。
步骤120、在显示基板别理出光面的一侧制作背膜，背膜包括第一支撑区和第二支撑区，第一支撑区在显示基板上的投影至少显示区重合，第二支撑区在显示基板上的投影位于非显示区内。
步骤130、在第一支撑区背离显示基板的一侧制作散热膜，散热膜在背膜上的正投影位于第一支撑区内，且背离显示基板的表面具有凹槽，凹槽内填充有至少与散热膜表面平齐的粘接剂。
步骤140、弯折显示基板的弯折区，以将非显示区和第二支撑区弯折至散热膜背离显示区的一侧，并将第二支撑区粘接在粘接剂上。
本公开实施方式中，通过上述步骤110-步骤140即可制作得到上述实施方式所述的显示面板，制作得到显示面板的技术效果具体可参考上述实施方式所述，本公开实施方式对此不再赘述。
结合上述实施方式可知，在背膜背离显示基板的一侧制作散热膜时刻通过多种工艺实现，也即是上述步骤130可通过多种工艺实现。示例地，先制作得到散热膜，再将散热膜整体粘接在背膜背离显示基板的一侧；或者将散热膜包括的粘接层、导热层、导电层逐层粘接在背膜背离显示基板的一侧。
对于先制作散热膜，再进行整体粘接的工艺，该工艺的实现过程为：
制作具有第一通孔的导电层和具有第二通孔的导热层；将导电层支撑在操作台上，导电层与操作台的台面之间预留有第一距离的间隙，第一距离小于或等于0.02毫米；将导热层层叠在导电层上，第二通孔与第一通孔正对以形成凹槽；在导热层背离导电层的一侧制作粘接层，得到散热膜，粘接层延伸至第一通孔和第二通孔；从操作台的台面剥离散热膜，并将粘接层背离导热层的表面粘接在第一支撑区背离显示基板的一侧。
其中，上述实现过程是以凹槽贯穿散热膜的导电层和导热层为例解释的，当然，也可在靠近导电层的表面设置盲孔，或者仅在导电层背离导热层的表面设置盲孔等，本公开实施方式对相应的具体实现过程不再赘述。仅需要说明的是，对于凹槽未同时贯穿导电层和导热层的情况，需要在散热膜的多个结构层粘接完整后，在由通孔和/或盲孔形成的凹槽 内单独填充至少与导电层的表面平齐的粘接剂。
需要说明的是，尽管在附图10中以特定顺序描述了本公开中显示面板的制作方法的各个步骤，但是，这并非要求或者暗示必须按照该特定顺序来执行这些步骤，或是必须执行全部所示的步骤才能实现期望的结果。附加的或备选的，可以省略某些步骤，将多个步骤合并为一个步骤执行，以及/或者将一个步骤分解为多个步骤执行等。
本公开实施方式还提供了一种显示装置，该显示装置包括上述实施方式所述的显示面板。上述实施方式所述的显示面板能够实现极窄边框化，从而在基于上述实施方式的显示面板制作得到显示装置时，能够实现显示装置的极窄边框化，从而提高显示装置的美观度。
本领域技术人员在考虑说明书及实践这里公开的发明后，将容易想到本公开的其它实施方案。本申请旨在涵盖本公开的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由所附的权利要求指出。

Claims (10)

  1. 一种显示面板，其特征在于，包括：
    显示基板(1)，具有显示区(11)、非显示区(13)，以及位于所述显示区(11)和所述非显示区(13)之间的弯折区(12)；
    背膜(2)，位于背离所述显示基板(1)出光面的一侧，所述背膜(2)包括第一支撑区(21)和第二支撑区(22)，所述第一支撑区(21)在显示基板(1)上的投影至少与所述显示区(11)重合，所述第二支撑区(22)在所述显示基板(1)上的投影位于所述非显示区(13)内；
    散热膜(3)，位于所述背膜(2)背离所述显示基板(1)的一侧，且在所述背膜(2)上的正投影位于所述第一支撑区(21)内，所述散热膜(3)背离所述显示基板(1)的表面具有凹槽(31)，所述凹槽(31)内填充有粘接剂(5)；
    所述弯折区(12)弯折后，所述非显示区(13)和所述第二支撑区(22)位于所述散热膜(3)背离所述第一支撑区(21)的一侧，且所述第二支撑区(22)覆盖所述凹槽(31)并与所述粘接剂(5)接触。
  2. 如权利要求1所述的显示面板，其特征在于，所述散热膜(3)包括在背离所述显示基板(1)的方向上依次层叠的粘接层(32)、导热层(33)和导电层(34)，所述凹槽(31)贯穿所述导电层(34)。
  3. 如权利要求2所述的显示面板，其特征在于，所述凹槽(31)还贯穿所述导热层(33)，所述粘接层(32)延伸至所述凹槽(31)内以形成所述粘接剂(5)。
  4. 如权利要求1-3任一所述的显示面板，其特征在于，所述凹槽(31)的槽壁具有朝向所述显示基板(1)的台阶面(311)。
  5. 如权利要求4所述的显示面板，其特征在于，所述散热膜(3)包括粘接层(32)、导热层(33)和导电层(34)，所述凹槽(31)的深度大于所述导电层(34)的厚度；
    所述导热层(33)朝向所述导电层(34)的表面上对应所述凹槽(31)的第一区域的面积大于所述导电层(34)朝向所述导热层(33)的表面上对应所述凹槽(31)的第二区域的面积。
  6. 如权利要求1-3任一所述的显示面板，其特征在于，所述凹槽(31)在靠近显示基板(1)的方向上逐渐收缩。
  7. 如权利要求1所述的显示面板，其特征在于，所述粘接剂(5)的厚度与所述凹槽(31)的深度之间的差值小于或等于0.02毫米。
  8. 如权利要求1所述的显示面板，其特征在于，所述散热膜(3)背离所述显示基板(1)的表面具有呈阵列分布的多个所述凹槽(31)，多个所述凹槽(31)内均填充有所述粘接剂(5)。
  9. 如权利要求8所述的显示面板，其特征在于，在所述显示区(11)、所述弯折区(12)、所述非显示区(13)的排布方向上，最外侧的所述凹槽(31)与所述散热膜(3)上相应边缘之间的距离大于或等于0.3毫米；
    在与所述显示区(11)、所述弯折区(12)、所述非显示区(13)的排布方向垂直的方向上，最外侧的所述凹槽(31)与所述散热膜(3)上相应边缘之间的距离大于或等于3.5毫米。
  10. 一种显示装置，其特征在于，包括如权利要求1-9任一所述的显示面板。
PCT/CN2023/070809 2022-01-30 2023-01-06 显示装置及显示面板 WO2023142958A1 (zh)

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JP2020027190A (ja) * 2018-08-13 2020-02-20 株式会社ジャパンディスプレイ 表示装置
CN111798746A (zh) * 2020-07-15 2020-10-20 京东方科技集团股份有限公司 显示基板、显示面板及显示装置
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CN113066361A (zh) * 2021-03-01 2021-07-02 武汉华星光电半导体显示技术有限公司 柔性显示装置及其制备方法
CN113066365A (zh) * 2021-03-15 2021-07-02 京东方科技集团股份有限公司 显示装置以及制作方法
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US20070069212A1 (en) * 2005-09-29 2007-03-29 Matsushita Electric Industrial Co., Ltd. Flat panel display and method for manufacturing the same
JP2020027190A (ja) * 2018-08-13 2020-02-20 株式会社ジャパンディスプレイ 表示装置
CN109375408A (zh) * 2018-12-17 2019-02-22 武汉华星光电半导体显示技术有限公司 一种柔性显示装置
CN111798746A (zh) * 2020-07-15 2020-10-20 京东方科技集团股份有限公司 显示基板、显示面板及显示装置
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CN113066361A (zh) * 2021-03-01 2021-07-02 武汉华星光电半导体显示技术有限公司 柔性显示装置及其制备方法
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