WO2023108617A1 - 光源模块及显示装置 - Google Patents
光源模块及显示装置 Download PDFInfo
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- WO2023108617A1 WO2023108617A1 PCT/CN2021/139193 CN2021139193W WO2023108617A1 WO 2023108617 A1 WO2023108617 A1 WO 2023108617A1 CN 2021139193 W CN2021139193 W CN 2021139193W WO 2023108617 A1 WO2023108617 A1 WO 2023108617A1
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- light
- emitting
- light source
- pins
- branches
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- 239000002356 single layer Substances 0.000 claims abstract description 56
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 239000002184 metal Substances 0.000 description 10
- 230000009286 beneficial effect Effects 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 3
- 238000012905 input function Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133612—Electrical details
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Definitions
- the invention relates to the field of display technology, in particular to a light source module and a display device.
- Submillimeter light-emitting diode refers to a light-emitting diode with a grain (chip) size of 50 to 200 microns.
- the application direction includes Mini LED direct display and Mini LED backlight display devices. Display devices based on LED technology have the advantages of long lifespan and low screen burn-in.
- the invention provides a light source module and a display device, which are used to improve the problems caused by the existing light source module with two or more layers of metal wiring.
- a first aspect of the present invention provides a light source module, which includes: a substrate configured to have a plurality of light emitting regions arranged in an array, and two light emitting regions are arranged in each light emitting region of the substrate Light-emitting groups, each light-emitting group includes a plurality of light-emitting branches arranged in parallel, two driving chips are arranged in parallel between the two light-emitting groups; the two driving chips are arranged symmetrically in the center; and single-layer layout wiring , arranged on the substrate, the single-layer layout wiring couples the driver chips in the plurality of light-emitting regions to each other, and connects the driver chip to the plurality of light-emitting chips in a single light-emitting group.
- each of the light-emitting branches includes a sub-millimeter light-emitting diode, or each of the light-emitting branches includes at least two sub-millimeter light-emitting diodes, and the at least two sub-millimeter light-emitting diodes are connected in parallel or in series.
- each driver chip includes a ground pin, at least one power pin, multiple function pins and multiple output pins, and the two drivers located in each of the light-emitting areas
- the ground pins of the chip are close to each other, and the multiple output pins are close to the multiple light-emitting branches in a single light-emitting group.
- the single-layer layout routing is configured such that each output pin in each light-emitting area is coupled to one end of one of the light-emitting branches in the same light-emitting area, and the plurality of The other ends of the light-emitting branches in the light-emitting areas are coupled to each other, the ground pins in the multiple light-emitting areas are coupled to each other, and the power supply pins in the multiple light-emitting areas are coupled to each other, and the same or corresponding functional pins in the plurality of light emitting regions are respectively coupled.
- the plurality of light-emitting branches are arranged side by side along a first direction
- the single-layer layout wiring is further configured to form a ground line portion, and the ground line portion is connected between the two extending between the driving chips along the first direction to couple the ground pins in the plurality of light emitting regions.
- the single-layer layout wiring is further configured to form two light source line parts, and each light source line part is along the first direction on the side of the light-emitting group away from the driving chip. extending to couple the light emitting branches in the plurality of light emitting areas.
- the single-layer layout wiring is further configured to form two power line parts, and each power line part is between the ground line part and the light source line part along the first extending in a direction to couple the power supply pins in the plurality of light emitting areas.
- the single-layer layout wiring is further configured to form various functional line parts, and the various functional line parts extend along the first direction between the two light-emitting groups to and being coupled to the same or corresponding functional pins in the plurality of light-emitting areas.
- a second aspect of the present invention provides a light source module, including: a substrate configured to have a plurality of light-emitting areas arranged in an array, each light-emitting area is provided with two light-emitting groups, each light-emitting The group includes a plurality of light-emitting branches arranged in parallel, and two driving chips are arranged in parallel between the two light-emitting groups; and a single-layer layout wiring is arranged on the substrate, and the single-layer layout wiring will The driving chips in the plurality of light-emitting areas are coupled to each other, and the driving chips are electrically connected to the plurality of light-emitting branches in a single light-emitting group.
- each driver chip includes a ground pin, at least one power pin, multiple function pins and multiple output pins, and the two drivers located in each of the light-emitting areas
- the ground pins of the chip are close to each other, and the multiple output pins are close to the multiple light-emitting branches in a single light-emitting group.
- the single-layer layout routing is configured such that each output pin in each light-emitting area is coupled to one end of one of the light-emitting branches in the same light-emitting area, and the plurality of The other ends of the light-emitting branches in the light-emitting areas are coupled to each other, the ground pins in the multiple light-emitting areas are coupled to each other, and the power supply pins in the multiple light-emitting areas are coupled to each other, and the same or corresponding functional pins in the plurality of light emitting regions are respectively coupled.
- the plurality of light-emitting branches are arranged side by side along a first direction
- the single-layer layout wiring is further configured to form a ground line portion, and the ground line portion is connected between the two extending between the driving chips along the first direction to couple the ground pins in the plurality of light emitting regions.
- the single-layer layout wiring is further configured to form two light source line parts, and each light source line part is along the first direction on the side of the light-emitting group away from the driving chip. extending to couple the light emitting branches in the plurality of light emitting areas.
- the single-layer layout wiring is further configured to form two power line parts, and each power line part is between the ground line part and the light source line part along the first extending in a direction to couple the power supply pins in the plurality of light emitting areas.
- the single-layer layout wiring is further configured to form a plurality of functional line parts, and the plurality of functional line parts extend along the first direction between the two light-emitting groups to and being coupled to the same or corresponding functional pins in the plurality of light-emitting areas.
- the two driving chips are arranged symmetrically about the center.
- the light-emitting branches include one sub-millimeter light-emitting diode; or, each of the light-emitting branches includes at least two sub-millimeter light-emitting diodes, and the at least two sub-millimeter light-emitting diodes are connected in parallel or in series .
- a third aspect of the present invention provides a display device, including a display screen and the above-mentioned light source module, the light source module is connected to the display screen.
- the substrate is configured to have a plurality of light-emitting areas arranged in an array, each light-emitting area is provided with two light-emitting groups, and each light-emitting group includes a plurality of light-emitting areas arranged in parallel Branches, two driving chips are arranged side by side between the two light-emitting groups; are coupled to each other, and electrically connect the driving chip to the plurality of light-emitting branches in a single light-emitting group. Therefore, a chip-driven submillimeter light-emitting diode backlight product can be designed based on a single-layer metal wiring.
- An output pin is close to the plurality of light-emitting branches in a single light-emitting group.
- the present invention can avoid problems such as easy short circuit between different metal layers and high cost, not only can reflect product competitiveness, but also can reduce costs, Improve product yield.
- FIG. 1 is a schematic circuit diagram of a light source module according to a first embodiment of the present invention
- FIG. 2 is a schematic diagram of the pins of the driver chip in the first embodiment of the present invention.
- FIG. 3 is a schematic circuit diagram of a light source module according to a second embodiment of the present invention.
- FIG. 4 is a schematic diagram of the pins of the driver chip in the second embodiment of the present invention.
- FIG. 5 is a schematic diagram of wiring using multiple light source modules in a display device according to an embodiment of the present invention.
- first and second are used for description purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as “first” or “second” may explicitly or implicitly include one or more of said features.
- “plurality” means two or more, unless otherwise specifically defined.
- the light source module can be designed based on the single-layer layout and routing technology, such as realizing the dual-column loading of a single data channel, and the light source driver design does not require other peripheral auxiliary devices except for the light-emitting unit and the driver chip. Examples are as follows: But not limited to this.
- An embodiment of the present invention provides a light source module, which can be applied to display devices of various light emitting diodes, for example, the light source module can be used for submillimeter light emitting diodes (Mini LED) as a display device with a backlight source, such as a liquid crystal display device, etc.; but not limited thereto, the light source module can also be used for a display device with a submillimeter light-emitting diode as a direct display light source, such as a Mini LED display.
- the light source module can also be applied to other products, such as lighting equipment, in addition to being applicable to display devices. It should be understood that the light emitting diodes may generate a spectrum of specific colors, such as the red, green and blue spectrum.
- the light source module includes a substrate 1, and the substrate 1 can be provided with a plurality of light-emitting branches 2, a plurality of driving chips 3 and a single-layer layout.
- Line 4 In this example, in order to simplify the description, it is only exemplified that the light source module can be configured as a surface light source, such as a backlight source or a direct display light source, according to the lighting requirements of the display device.
- the following examples illustrate an implementation in which the light source module is used as a backlight module, but not limited thereto.
- the substrate 1 may be a glass substrate, a printed circuit board (PCB) substrate or a BT resin substrate, etc., but not limited thereto.
- the substrate 1 It can be configured to have a plurality of light-emitting regions M arranged in an array, each light-emitting region M is provided with two light-emitting groups G, and each light-emitting group G includes a plurality of light-emitting branches 2 arranged in parallel, such as the multiple Four light-emitting branches 2 are arranged side by side along a first direction (as shown in Fig.
- the light-emitting branch 2 includes at least one sub-millimeter light-emitting diode 21, and a plurality of sub-millimeter light-emitting diodes 21 can be connected in series, parallel or series-parallel, so that the light-emitting branch 2 can be one lamp, two lamps , one of four lights, six lights, eight lights, ten lights, twelve lights, fourteen lights or sixteen lights, here only two light lights as an example, but not limited to this;
- Two driving chips 3 can also be arranged side by side between the two light-emitting groups G, for example, the two driving chips 3 are vertically arranged side by side between the two light-emitting groups G, such as the size of the driving chip 3 is preferably Less than 1500*1500 microns ( ⁇ m), but not limited thereto.
- each driver chip 3 includes ten pins, such as pin 30 is a serial output (such as SO) pin, and pin 31 is a ground (such as GND) pin, Pin 32 is a reserved (such as NC) pin, pin 33 is a power supply (such as VDD) pin, pin 34 is a serial input (such as SI) pin, and pins 35, 36, 37, and 38 are four output (such as 01, 02, 03, 04) pins, and pin 39 is a data input (such as DI) pin, such as pins 30 ⁇ 34 and pins 35 ⁇ 39 are arranged on the opposite two sides of the driver chip 3 side, but not limited to this.
- pin 30 is a serial output (such as SO) pin
- pin 31 is a ground (such as GND) pin
- Pin 32 is a reserved (such as NC) pin
- pin 33 is a power supply (such as VDD) pin
- pin 34 is a serial input (such as SI) pin
- pins 35, 36, 37, and 38 are four output (such
- each driver chip 3 includes a ground (such as GND) pin 31, a power supply (such as VDD) pin 33, a plurality of functions (such as SO, SI, DI ) pins 30, 34, 39 and a plurality of output (such as 01, 02, 03, 04) pins 35, 36, 37, 38, the ground (such as GND) pins 31 of the two driver chips 3 Close to each other, the multiple output (such as 01, 02, 03, 04) pins 35-38 of a single driver chip 3 are close to the multiple light-emitting branches 2 of a single light-emitting group G.
- the single-layer layout wiring 4 can be configured so that each output (such as 01, 02, 03, 04) pin 35 in each light-emitting area M , 36, 37, 38 are coupled to one end of one of the light-emitting branches 2 in the same light-emitting area M, and the other ends of the light-emitting branches 2 in the plurality of light-emitting areas M are coupled to each other, and the plurality of The ground (such as GND) pins 31 in the light emitting regions M are coupled to each other, the power supply (such as VDD) pins 33 in the plurality of light emitting regions M are coupled to each other, and the plurality of light emitting regions M The same or corresponding function (such as SO, SI or DI) pins 30, 34 or 39 are respectively coupled.
- each output such as 01, 02, 03, 04
- the plurality of The ground (such as GND) pins 31 in the light emitting regions M are coupled to each other
- the single-layer layout trace 4 can also be configured to form a ground line part GND', and the ground line part GND' is between the two driving chips 3 along the
- the first direction (for example, as shown in FIG. 1, the vertical direction from top to bottom) extends to couple the ground (such as GND) pins 31 of the driving chips 3 in the plurality of light emitting regions M
- the ground line part GND' includes a first ground segment (a longitudinal segment as shown in the figure) and a plurality of second ground segments (a horizontal segment as shown in the figure), and the first ground segment is between the two
- the two driving chips 3 extend along the first direction
- the second ground segment extends between the two driving chips 3 along a second direction (for example, as shown in FIG. 1 , the horizontal direction from left to right). ) is coupled to the ground (such as GND) pin 31.
- the single-layer layout wiring 4 can also be configured to form two light source line parts VLED, and each light source line part VLED is located on a side of the light-emitting group G far away from the driving chip 3 .
- the sides extend along the first direction to couple the light-emitting branches 2 in the plurality of light-emitting regions M.
- the single-layer layout trace 4 can also be configured to form two power line parts VDD', and each power line part VDD' is connected between the ground line part GND' and the light source.
- the lines between VLEDs extend along the first direction to be coupled to the power supply (such as VDD) pins 33 of the driving chips 3 in the plurality of light emitting regions M.
- the single-layer layout wiring 4 can also be configured to form various functional line parts, and the various functional line parts are along the first The direction extends to couple the same or corresponding functional pins in the plurality of light emitting regions M, for example, a data input function line part DI' is coupled to the data input (such as DI) pins 39 of all the driving chips 3, The data input function line part DI' can also extend through the projection range of the two driving chips 3 on the substrate 1 to reduce the overall wiring range; a serial function line part SR is coupled to all The serial output (such as SO) pin 30 and the serial input (such as SI) pin 34 of the driver chip 3, so that the serial output (such as SO) pin 30 and the serial input (such as SI) pin 34 are connected in series with each other. Therefore, a set of data can drive two columns of driving chips.
- a data input function line part DI' is coupled to the data input (such as DI) pins 39 of all the driving chips 3
- the data input function line part DI' can also extend through the projection range of the two driving chips
- the two driving chips 3 of the first embodiment are vertically arranged side by side between the two light-emitting groups G, and the two driving chips 3 are symmetrically arranged in the center.
- one driver chip 3 is rotated 180 degrees relative to the other driver chip 3, so that the same features of the two driver chips 3 are arranged side by side toward or away from each other, for example, two marks ( The position of the solid triangle mark (as shown in Figure 1) is opposite to that of the hollow triangle mark), so that the multiple output (such as 01, 02, 03, 04) pins 35-38 of a single driver chip 3 are close to all of the single light-emitting group G
- the plurality of light-emitting branches 2, the ground (such as GND) pins 31 of the two driving chips 3 are close to each other, so that the wiring (ie, the ground line part GND') coupled to the ground pins can be concentrated Being arranged between the two driving chips 3 can reduce the area occupied by wires.
- the light source module in the second embodiment of the light source module, includes a substrate 1', and the substrate 1' can be provided with a plurality of light-emitting branches 2' and a plurality of driving chips 3. ' and single-layer layout trace 4'.
- the light source module can be configured as a surface light source, such as a backlight source or a direct display light source, according to the lighting requirements of the display device.
- the substrate 1' and the light-emitting branch 2' in the second embodiment are substantially the same as the substrate 1 and the light-emitting branch 2 in the first embodiment.
- the substrate 1' It can be configured to have a plurality of light-emitting regions M' arranged in an array, and each light-emitting region M' can be provided with two light-emitting groups G', and each light-emitting group G' includes a plurality of light-emitting branches 2 arranged in parallel ', please refer to the above description for its implementation content, and will not repeat it here.
- the difference between the second embodiment and the first embodiment is that: as shown in FIG. Between them, the two drive chips 3' are arranged symmetrically about the center.
- each driver chip 3' includes twelve pins, such as pins 30' and 31' are two output (such as 01, 02) pins, pins 32' and 37' is a power supply (such as VDD) pin, pins 33' and 38' are data input (such as DI) pins, pin 34' is a serial output (such as SO) pin, pins 35' and 36' It is two output (such as 03, 04) pins, pin 39' is a serial input (such as SI) pin, pin 3a' is a reserved (such as NC) pin, and pin 3b' is a ground (such as GND) pins, such as pins 30' ⁇ 34' and pins 35' ⁇ 39' are arranged on both sides (such as the upper and lower sides) of the driver chip 3', and the pins 3a' and pins 3b' are located on the The two ends (such as the left and right ends) of the above-mentioned driving chip 3', but not limited thereto.
- pins 30' and 31' are two output (
- each driver chip 3' includes a ground (such as GND) pin 3b', two power supply (such as VDD) pins 32', 37', multiple functions (such as DI, SO, SI) pins 33', 34', 38', 39' and multiple output (such as 01, 02, 03, 04) pins 30', 31', 35', 36', the The ground (such as GND) pins 3b' of two driver chips 3' are close to each other, and the multiple output (such as 01, 02, 03, 04) pins 30', 31', 35 of a single driver chip 3 ', 36' are close to the plurality of lighting branches 2' of a single lighting group G'.
- the single-layer layout and routing 4' of the second embodiment is slightly different from the single-layer layout and routing 4 of the first embodiment, for example, the single-layer layout and routing 4' can also be configured In order to form a ground line part GND'', two light source line parts VLED', two power line parts VDD'' and various function line parts, such as a data input function line part DI'' and a serial function line part SR', the wiring method of which changes the wiring layout according to the pin position of the driver chip 3'.
- the single-layer layout wiring 4' can be configured so that each output (such as 01, 02, 03 , 04) Pins 30', 31', 35', 36' are coupled to one end of one of the light-emitting branches 2' in the same light-emitting area M', and the light-emitting branches in the plurality of light-emitting areas M'
- the other ends of the circuit 2' are coupled to each other, the ground (such as GND) pins 3b' in the multiple light emitting areas M' are coupled to each other, and the power supplies (such as GND) in the multiple light emitting areas M' are coupled to each other.
- VDD VDD pins 32' and 37' are coupled to each other, and the same or corresponding function (such as DI, SO, SI) pins 33', 34', 38', 39' in the plurality of light emitting regions M' each coupled. Therefore, a set of data can drive two columns of driving chips.
- a light source module including: a substrate configured to have a plurality of light-emitting areas arranged in an array, each light-emitting area is provided with two light-emitting groups, and each light-emitting group includes a plurality of light-emitting areas arranged in parallel
- the driving chips are coupled to each other, and the driving chips are electrically connected to the plurality of light-emitting branches in a single light-emitting group.
- the single-layer layout wiring is arranged on the substrate, and two driving chips are arranged in parallel between the two light-emitting groups, so that each driving chip drives the plurality of light-emitting branches in a single light-emitting group.
- the backlight drive design does not require other peripheral auxiliary devices except the light-emitting unit and the driver chip, which can reduce the number of components used and the layout area, simplify the processing process, and help reduce costs and improve product yield. .
- each driver chip includes a ground pin, at least one power pin, multiple function pins and multiple output pins, and the two pins located in each of the light-emitting areas
- the ground pins of each driver chip are close to each other, and the multiple output pins are close to the multiple light-emitting branches in a single light-emitting group. Therefore, the ground wires can be arranged centrally between the two driving chips, which is beneficial to reduce the area occupied by the wires, reduce the cost, and improve the product yield.
- the single-layer layout routing is configured such that each output pin in each light-emitting area is coupled to one end of one of the light-emitting branches in the same light-emitting area, the The other ends of the light-emitting branches in the multiple light-emitting areas are coupled to each other, the ground pins in the multiple light-emitting areas are coupled to each other, and the power supply pins in the multiple light-emitting areas are coupled to each other and the same or corresponding functional pins in the plurality of light emitting areas are respectively coupled. Therefore, the area occupied by the layout of the single-layer wiring can be greatly reduced, and easy short circuit between different metal layers and high cost can be avoided.
- the plurality of light-emitting branches are arranged side by side along a first direction
- the single-layer layout traces are further configured to form a ground line part
- the ground line part is in the extending between the two driving chips along the first direction to couple the ground pins in the plurality of light emitting regions. Therefore, through the centralized layout of the ground wires, it is beneficial to reduce costs and improve product yield.
- the single-layer layout wiring is further configured to form two light source line parts, and each light source line part is along the first A direction extends to couple the light-emitting branches in the plurality of light-emitting areas. Therefore, by disposing the two light source line parts outside the light-emitting branch, it is possible to avoid mutual interference of wiring lines, which is beneficial to improve product yield.
- the single-layer layout routing is further configured to form two power line parts, and each power line part is between the ground line part and the light source line part along the The first direction extends to couple the power supply pins in the plurality of light emitting areas. Therefore, by disposing the two power line parts on both sides of the ground line part, it is possible to avoid mutual interference of power supply by wiring, which is beneficial to improve product yield.
- the single-layer layout routing is further configured to form a plurality of functional line parts, and the multiple functional line parts are along the first direction between the two light-emitting groups. extending to couple the same or corresponding functional pins in the plurality of light emitting regions. Therefore, by disposing the plurality of functional line parts between the two light-emitting groups, the redundant space for setting the driver chip can be effectively used for wiring layout, which is beneficial to reduce costs and improve product yield.
- the two driving chips are arranged symmetrically about the center. Therefore, through the different arrangements of the two driving chips, the grounding traces can be laid out in a concentrated manner, which is beneficial to reducing costs and improving product yields.
- each of the light-emitting branches includes a sub-millimeter light-emitting diode; or, each of the light-emitting branches includes at least two sub-millimeter light-emitting diodes, and the at least two sub-millimeter light-emitting diodes Diodes are connected in parallel or in series. Therefore, the submillimeter light-emitting diode can be used as the backlight source of the display device, so that the display device has the advantages of long life and less burn-in.
- a display device such as a display device using a submillimeter light-emitting diode as a backlight source or a direct display light source
- the display device includes a display screen and the above-mentioned light source module, and the light source The module is connected with the display screen.
- the display device may be a liquid crystal display device using the light source module as a backlight; alternatively, the display device may also be a Mini LED display screen using the light source module as a direct display light source, but not This is the limit.
- the display device includes a plurality of light source modules C and a controller (Bcon) B.
- Bcon controller
- only two light source modules such as The embodiment of the light source module shown in FIG. 1 and FIG. 2 is described as an example, but not limited thereto. The description can also be applied to the light source module shown in FIG. 3 and FIG. 4 .
- each light source module C includes a substrate 1 configured to have a plurality of light emitting regions M arranged in an array, and each light emitting region M There are two light-emitting groups G, each light-emitting group G includes a plurality of light-emitting branches 2 arranged in parallel, two driving chips 3 are arranged in parallel between the two light-emitting groups G, and the single-layer layout wiring 4 is arranged On the substrate 1, so that a plurality of driving chips 3 in the plurality of light emitting regions M are coupled to each other and each driving chip 3 drives the plurality of light emitting branches 2 in a single light emitting group G, One of the plurality of driving chips 3 on the substrate 1 of each light source module C is coupled to the controller B.
- a driver chip 3 close to the controller B on the substrate 1 can be configured as a specific driver chip 3 to couple to the controller B,
- two functional (such as SO, DI) pins 30 and 39 of the specific driver chip 3 are coupled to two corresponding pins of the controller B through a part of the single-layer layout wiring 4 .
- the controller B can control the plurality of mutually coupled driver chips 3 of the plurality of light source modules C, for example, the controller B performs data transmission (for example, transmission of control commands) to the plurality of driver chips 3 etc.), so as to facilitate various light source control operations and meet the display requirements of the display device.
- the light source module and the display device of the above-mentioned embodiments of the present invention are configured to have a plurality of light-emitting areas arranged in an array through the substrate, each light-emitting area is provided with two light-emitting groups, and each light-emitting group includes a plurality of light-emitting areas arranged in parallel
- the driving chips are coupled to each other, and the driving chips are electrically connected to the plurality of light-emitting branches in a single light-emitting group.
- the above embodiments of the present invention can design chip-driven submillimeter light-emitting diode backlight products based on single-layer metal wiring. Proximity, the multiple output pins are close to the multiple light-emitting branches in a single light-emitting group. Compared with the light source module based on two or more layers of metal wiring in the prior art, the above-mentioned embodiments of the present invention can avoid problems such as easy short circuit between different metal layers and high cost, and can not only reflect product competitiveness, but also Reduce costs and improve product yield.
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Abstract
一种光源模块及显示装置,包括:基板,被配置成具有多个呈阵列排布的发光区域,每个发光区域设置有两个发光组,每个发光组包括多个并列排布的发光支路,所述两个发光组之间并列设置两个驱动芯片;及单层布局走线,被布置在所述基板上,所述单层布局走线将多个所述发光区域中的驱动芯片相互耦接,并将所述驱动芯片与单个所述发光组中的所述多个发光支路电连接。
Description
本发明涉及显示技术领域,具体涉及一种光源模块及显示装置。
次毫米发光二极管(Mini LED)指晶粒(芯片)尺寸在50至200微米的发光二极管,应用方向包括Mini LED直显和Mini LED背光的显示装置,采用Mini
LED技术的显示装置拥有长寿命及不易烧屏等优势。
在Mini LED背光的显示装置中,需要集成数量更多的Mini
LED,导致光源模块的厚度不易做薄,也会产生更大热量。以往虽有一些基于两层或两层以上金属走线的光源模块,但此种走线方式存在不同金属层间易短路及成本较高等问题,仍待改善。
本发明提供一种光源模块及显示装置,用于改善现有两层或两层以上金属走线的光源模块引起的问题。
为解决上述问题,本发明的一第一方面提供一种光源模块,其包括:基板,被配置成具有多个呈阵列排布的发光区域,所述基板的每个发光区域内设置有两个发光组,每个发光组包括多个并列排布的发光支路,所述两个发光组之间并列设置两个驱动芯片;所述两个驱动芯片是中心对称设置;及单层布局走线,被布置在所述基板上,所述单层布局走线将多个所述发光区域中的驱动芯片相互耦接,并将所述驱动芯片与单个所述发光组中的所述多个发光支路电连接;每一所述发光支路包括一个次毫米发光二极管,或者,每一所述发光支路包括至少两个次毫米发光二极管,所述至少两个次毫米发光二极管并联或者串联。
根据本发明的一实施例,每个驱动芯片包括一接地引脚、至少一电源引脚、多种功能引脚及多个输出引脚,位于每一所述发光区域内的所述两个驱动芯片的所述接地引脚相互靠近,所述多个输出引脚靠近单个所述发光组中的所述多个发光支路。
根据本发明的一实施例,所述单层布局走线被配置以致使每个发光区域中的每个输出引脚耦接相同发光区域中的一个所述发光支路的一端,所述多个发光区域中的所述发光支路的另一端相互耦接,所述多个发光区域中的所述接地引脚相互耦接,所述多个发光区域中的所述电源引脚相互耦接,及所述多个发光区域中的相同或相应的功能引脚各自耦接。
根据本发明的一实施例,所述多个发光支路沿一第一方向并列排布,所述单层布局走线还被配置为形成一接地线部,所述接地线部在所述两个驱动芯片之间沿所述第一方向延伸以耦接所述多个发光区域中的所述接地引脚。
根据本发明的一实施例,所述单层布局走线还被配置为形成两个光源线部,每个光源线部在所述发光组远离所述驱动芯片的一侧沿所述第一方向延伸以耦接所述多个发光区域中的所述发光支路。
根据本发明的一实施例,所述单层布局走线还被配置为形成两个电源线部,每个电源线部在所述接地线部与所述光源线部之间沿所述第一方向延伸以耦接所述多个发光区域中的所述电源引脚。
根据本发明的一实施例,所述单层布局走线还被配置为形成多种功能线部,所述多种功能线部在所述两个发光组之间沿所述第一方向延伸以耦接所述多个发光区域中的相同或相应的功能引脚。
为解决上述问题,本发明的一第二方面提供一种光源模块,包括:基板,被配置成具有多个呈阵列排布的发光区域,每个发光区域设置有两个发光组,每个发光组包括多个并列排布的发光支路,所述两个发光组之间并列设置两个驱动芯片;及单层布局走线,被布置在所述基板上,所述单层布局走线将多个所述发光区域中的驱动芯片相互耦接,并将所述驱动芯片与单个所述发光组中的所述多个发光支路电连接。
根据本发明的一实施例,每个驱动芯片包括一接地引脚、至少一电源引脚、多种功能引脚及多个输出引脚,位于每一所述发光区域内的所述两个驱动芯片的所述接地引脚相互靠近,所述多个输出引脚靠近单个所述发光组中的所述多个发光支路。
根据本发明的一实施例,所述单层布局走线被配置以致使每个发光区域中的每个输出引脚耦接相同发光区域中的一个所述发光支路的一端,所述多个发光区域中的所述发光支路的另一端相互耦接,所述多个发光区域中的所述接地引脚相互耦接,所述多个发光区域中的所述电源引脚相互耦接,及所述多个发光区域中的相同或相应的功能引脚各自耦接。
根据本发明的一实施例,所述多个发光支路沿一第一方向并列排布,所述单层布局走线还被配置为形成一接地线部,所述接地线部在所述两个驱动芯片之间沿所述第一方向延伸以耦接所述多个发光区域中的所述接地引脚。
根据本发明的一实施例,所述单层布局走线还被配置为形成两个光源线部,每个光源线部在所述发光组远离所述驱动芯片的一侧沿所述第一方向延伸以耦接所述多个发光区域中的所述发光支路。
根据本发明的一实施例,所述单层布局走线还被配置为形成两个电源线部,每个电源线部在所述接地线部与所述光源线部之间沿所述第一方向延伸以耦接所述多个发光区域中的所述电源引脚。
根据本发明的一实施例,所述单层布局走线还被配置为形成多个功能线部,所述多个功能线部在所述两个发光组之间沿所述第一方向延伸以耦接所述多个发光区域中的相同或相应的功能引脚。
根据本发明的一实施例,所述两个驱动芯片是中心对称设置。
根据本发明的一实施例,所述发光支路包括一个次毫米发光二极管;或者,每一所述发光支路包括至少两个次毫米发光二极管,所述至少两个次毫米发光二极管并联或者串联。
为解决上述问题,本发明的一第三方面提供一种显示装置,包括显示屏以及如上所述的光源模块,所述光源模块与所述显示屏连接。
本发明的光源模块及显示装置,通过所述基板被配置成具有多个呈阵列排布的发光区域,每个发光区域设置有两个发光组,每个发光组包括多个并列排布的发光支路,所述两个发光组之间并列设置两个驱动芯片;及单层布局走线被布置在所述基板上,所述单层布局走线将多个所述发光区域中的驱动芯片相互耦接,并将所述驱动芯片与单个所述发光组中的所述多个发光支路电连接。从而,可基于单层金属走线设计芯片驱动的次毫米发光二极管背光产品,譬如所述两个驱动芯片是中心对称设置,所述两个驱动芯片的所述接地引脚相互靠近,所述多个输出引脚靠近单个所述发光组中的所述多个发光支路。与现有技术中的基于两层或两层以上金属走线的光源模块相比,本发明可以避免不同金属层间易短路及成本较高等问题,不仅可以体现产品竞争力,还可以降低成本,提高产品良率。
为了更清楚地说明本发明实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅是本发明的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为本发明第一实施例的光源模块的电路示意图;
图2为本发明第一实施例在驱动芯片的引脚示意图;
图3为本发明第二实施例的光源模块的电路示意图;
图4为本发明第二实施例在驱动芯片的引脚示意图;
图5为本发明实施例的显示装置采用多个光源模块的接线示意图。
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的全部所述其他实施例,都属于本发明保护的范围。
在本文的描述中,应被理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。
在本文的描述中,应被理解的是,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。
在本文中提供许多不同的实施方式或例子用来实现本发明的不同结构。为了简化本发明的公开内容,下文中对特定示例的部件和设置进行描述。当然,它们仅为示例,并且目的不在于限制本发明。此外,本发明可以在不同示例中重复参考数字和/或参考字母,这种重复是为了简化和清楚的目的,其本身不指示所讨论各种实施方式和/或设置之间的关系。此外,本文提供的各种特定的工艺和材料的示例,但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
在显示装置中,可以根据基于单层布局走线技术来设计光源模块,譬如实现单数据通道的双列带载,光源驱动设计除了发光单元和驱动芯片外无需其它***辅助器件,举例说明如下,但不以此为限。
本发明实施例提供一种光源模块,所述光源模块可适用于各式发光二极管的显示装置,譬如所述光源模块可用于以次毫米发光二极管(Mini
LED)作为背光源的显示装置,例如液晶显示装置等;但不以此为限,所述光源模块还可用于以次毫米发光二极管作为直显光源的显示装置,例如Mini LED显示屏。又,所述光源模块除了可以适用于显示装置,还可以适用于其它产品,譬如照明设备等。应被理解的是,所述发光二极管可以生成特定颜色的光谱,诸如红、绿及蓝色光谱。
如图1所示,在所述光源模块的第一实施例中,所述光源模块包括一基板1,所述基板1可以设置多个发光支路2、多个驱动芯片3及单层布局走线4。在此例中,为了简化说明内容,仅举例说明所述光源模块可以因应显示装置的发光需求被配置成面光源,譬如背光源或直显光源。
以下举例说明所述光源模块被应用作为背光模块的实施方式,但不以此为限。
举例来说,在一实施例中,如图1所示,所述基板1可以是玻璃基板、印刷电路板(PCB)基板或BT树脂基板等,但不以此为限,譬如所述基板1可被配置成具有多个呈阵列排布的发光区域M,每个发光区域M设置有两个发光组G,每个发光组G包括多个并列排布的发光支路2,譬如所述多个发光支路2沿一第一方向(如图1为例,被示为从上到下的竖直方向)并列排布,在此仅以四个发光支路2为例,但不以此为限;所述发光支路2包括至少一个次毫米发光二极管21,多个次毫米发光二极管21可以是串联、并联或串并联的形态,使得所述发光支路2可以是一灯,两灯,四灯,六灯,八灯,十灯,十二灯,十四灯或十六灯中的一种发光形态,在此仅以两灯发光形态为例,但不以此为限;所述两个发光组G之间还可并列设置两个驱动芯片3,譬如所述两个驱动芯片3纵向并列设置于所述两个发光组G之间,诸如所述驱动芯片3的尺寸优选为小于1500*1500微米(μm),但不以此为限。
在一示例中,如图2所示,譬如每个驱动芯片3包括十个引脚,诸如引脚30为串列输出(如SO)引脚,引脚31为接地(如GND)引脚,引脚32为预留(如NC)引脚,引脚33为电源(如VDD)引脚,引脚34为串列输入(如SI)引脚,引脚35、36、37、38为四个输出(如01、02、03、04)引脚,引脚39为数据输入(如DI)引脚,例如引脚30~34与引脚35~39排列在所述驱动芯片3的相对两侧,但不以此为限。
在此例中,如图1及图2所示,每个驱动芯片3包括一接地(如GND)引脚31、一电源(如VDD)引脚33、多个功能(如SO、SI、DI)引脚30、34、39及多个输出(如01、02、03、04)引脚35、36、37、38,所述两个驱动芯片3的所述接地(如GND)引脚31相互靠近,单个驱动芯片3的所述多个输出(如01、02、03、04)引脚35~38靠近单个发光组G的所述多个发光支路2。
在此例中,如图1及图2所示,所述单层布局走线4可被配置以致使每个发光区域M中的每个输出(如01、02、03、04)引脚35、36、37、38耦接相同发光区域M中的一个所述发光支路2的一端,所述多个发光区域M中的所述发光支路2的另一端相互耦接,所述多个发光区域M中的所述接地(如GND)引脚31相互耦接,所述多个发光区域M中的所述电源(如VDD)引脚33相互耦接,及所述多个发光区域M中的相同或相应的功能(如SO、SI或DI)引脚30、34或39各自耦接。
示例地,如图1所示,所述单层布局走线4还可被配置为形成一接地线部GND’,所述接地线部GND’在所述两个驱动芯片3之间沿所述第一方向(譬如图1中所示,从上到下的竖直方向)延伸以耦接所述多个发光区域M中的所述驱动芯片3的所述接地(如GND)引脚31,譬如所述接地线部GND’包括一第一接地段(如图所示的纵向段)及多个第二接地段(如图所示的横向段),所述第一接地段在所述两个驱动芯片3之间沿所述第一方向延伸,所述第二接地段在所述两个驱动芯片3之间沿一第二方向(譬如图1中所示,从左到右的水平方向)耦接所述接地(如GND)引脚31。
示例地,如图1所示,所述单层布局走线4还可被配置为形成两个光源线部VLED,每个光源线部VLED在所述发光组G远离所述驱动芯片3的一侧沿所述第一方向延伸以耦接所述多个发光区域M中的所述发光支路2。
示例地,如图1所示,所述单层布局走线4还可被配置为形成两个电源线部VDD’,每个电源线部VDD’在所述接地线部GND’与所述光源线部VLED之间沿所述第一方向延伸以耦接所述多个发光区域M中的所述驱动芯片3的所述电源(如VDD)引脚33。
示例地,如图1所示,所述单层布局走线4还可被配置为形成多种功能线部,所述多种功能线部在所述两个发光组之间沿所述第一方向延伸以耦接所述多个发光区域M中的相同或相应的功能引脚,譬如一数据输入功能线部DI’耦接全部所述驱动芯片3的数据输入(如DI)引脚39,所述数据输入功能线部DI’还可延伸穿过所述两个驱动芯片3在所述基板1上的投影范围,用以降低整体走线范围;一串列功能线部SR耦接全部所述驱动芯片3的串列输出(如SO)引脚30及串列输入(如SI)引脚34,使得所述串列输出(如SO)引脚30及串列输入(如SI)引脚34相互串接。从而,可以实现一组数据驱动两列驱动芯片。
应被注意的是,如图1所示,第一实施例的所述两个驱动芯片3竖向并列设置于所述两个发光组G之间,所述两个驱动芯片3是中心对称设置,例如将一个驱动芯片3相对于另一个驱动芯片3旋转180度角,使所述两个驱动芯片3的相同特征朝向或背向彼此并列设置,譬如两个驱动芯片3具备的两个标记(如图1所示的实心三角标记与空心三角标记)位置相反,使得单个驱动芯片3的所述多个输出(如01、02、03、04)引脚35~38靠近单个发光组G的所述多个发光支路2,所述两个驱动芯片3的所述接地(如GND)引脚31相互靠近,可以让耦接所述接地引脚的走线(即接地线部GND’)集中设置在所述两个驱动芯片3之间,可以减少走线占用的面积。
此外,如图3所示,在所述光源模块的第二实施例中,所述光源模块包括一基板1’,所述基板1’可以设置多个发光支路2’、多个驱动芯片3’及单层布局走线4’。为了简化说明内容,仅举例说明所述光源模块可以因应显示装置的发光需求被配置成面光源,譬如背光源或直显光源。在第二实施例中的所述基板1’及所述发光支路2’与在第一实施例中的所述基板1及所述发光支路2的实施方式大致相同,所述基板1’可被配置成具有多个呈阵列排布的发光区域M’,每个发光区域M’可设置有两个发光组G’,每个发光组G’包括多个并列排布的发光支路2’,其实施内容请参阅如上说明,不再赘述于此。
应被注意的是,第二实施例与第一实施例的差异在于:如图3所示,第二实施例的所述两个驱动芯片3’横向并列设置于所述两个发光组G’之间,所述两个驱动芯片3’是中心对称设置。
在一示例中,如图4所示,每个驱动芯片3’包括十二个引脚,诸如引脚30’及31’为两个输出(如01、02)引脚,引脚32’及37’为电源(如VDD)引脚,引脚33’及38’为数据输入(如DI)引脚,引脚34’为串列输出(如SO)引脚,引脚35’及36’为两个输出(如03、04)引脚,引脚39’为串列输入(如SI)引脚,引脚3a’为预留(如NC)引脚,引脚3b’为接地(如GND)引脚,例如引脚30’~34’与引脚35’~39’ 排列在所述驱动芯片3’的两侧(如上下两侧),引脚3a’与引脚3b’位于所述驱动芯片3’的两端(如左右两端),但不以此为限。
在此例中,如图3及图4所示,每个驱动芯片3’包括一接地(如GND)引脚3b’、两电源(如VDD)引脚32’、37’、多个功能(如DI、SO、SI)引脚33’、34’、38’、39’及多个输出(如01、02、03、04)引脚30’、31’、35’、36’,所述两个驱动芯片3’的所述接地(如GND)引脚3b’相互靠近,单个驱动芯片3的所述多个输出(如01、02、03、04)引脚30’、31’、35’、36’靠近单个发光组G’的所述多个发光支路2’。
相应地,如图3所示,第二实施例的单层布局走线4’与第一实施例的单层布局走线4稍微不同,譬如所述单层布局走线4’还可被配置为形成一接地线部GND’’、两个光源线部VLED’、两个电源线部VDD’’及多种功能线部,譬如一数据输入功能线部DI’’及一串列功能线部SR’,其接线方式因应所述驱动芯片3’的引脚位置而改变走线布局形态。
举例来说,在此例中,如图3及图4所示,所述单层布局走线4’可被配置以致使每个发光区域M’中的每个输出(如01、02、03、04)引脚30’、31’、35’、36'耦接相同发光区域M’中的一个所述发光支路2’的一端,所述多个发光区域M’中的所述发光支路2’的另一端相互耦接,所述多个发光区域M’中的所述接地(如GND)引脚3b’相互耦接,所述多个发光区域M’中的所述电源(如VDD)引脚32’及37’相互耦接,及所述多个发光区域M’中的相同或相应的功能(如DI、SO、SI)引脚33’、34’、38’、39’各自耦接。从而,可以实现一组数据驱动两列驱动芯片。
以下举例说明所述光源模块的一些实施例,但不以此为限。
本发明的一方面提供一种光源模块,包括:基板,被配置成具有多个呈阵列排布的发光区域,每个发光区域设置有两个发光组,每个发光组包括多个并列排布的发光支路,所述两个发光组之间并列设置两个驱动芯片;及单层布局走线,被布置在所述基板上,所述单层布局走线将多个所述发光区域中的驱动芯片相互耦接,并将所述驱动芯片与单个所述发光组中的所述多个发光支路电连接。从而,通过单层布局走线被布置在所述基板上,所述两个发光组之间并列设置两个驱动芯片,使得每个驱动芯片驱动单个所述发光组中的所述多个发光支路,实现单数据通道的双列带载,背光驱动设计除了发光单元和驱动芯片外无需其它***辅助器件,可以减少使用元件数量及布局面积,简化加工过程,有利于降低成本与提高产品良率。
可选地,在一实施例中,每个驱动芯片包括一接地引脚、至少一电源引脚、多种功能引脚及多个输出引脚,位于每一所述发光区域内的所述两个驱动芯片的所述接地引脚相互靠近,所述多个输出引脚靠近单个所述发光组中的所述多个发光支路。从而,可使接地走线集中布局于所述两个驱动芯片之间,有利于降低走线占用面积,可以降低成本,提高产品良率。
可选地,在一实施例中,所述单层布局走线被配置以致使每个发光区域中的每个输出引脚耦接相同发光区域中的一个所述发光支路的一端,所述多个发光区域中的所述发光支路的另一端相互耦接,所述多个发光区域中的所述接地引脚相互耦接,所述多个发光区域中的所述电源引脚相互耦接,及所述多个发光区域中的相同或相应的功能引脚各自耦接。从而,可使单层走线的布局占用面积大幅精简,可以避免不同金属层间易短路及成本较高。
可选地,在一实施例中,所述多个发光支路沿一第一方向并列排布,所述单层布局走线还被配置为形成一接地线部,所述接地线部在所述两个驱动芯片之间沿所述第一方向延伸以耦接所述多个发光区域中的所述接地引脚。从而,通过所述接地线集中化布局,有利于降低成本与提高产品良率。
可选地,在一实施例中,所述单层布局走线还被配置为形成两个光源线部,每个光源线部在所述发光组远离所述驱动芯片的一侧沿所述第一方向延伸以耦接所述多个发光区域中的所述发光支路。从而,通过所述两个光源线部被配置在所述发光支路的外侧,可以避免走线相互干扰,有利于提高产品良率。
可选地,在一实施例中,所述单层布局走线还被配置为形成两个电源线部,每个电源线部在所述接地线部与所述光源线部之间沿所述第一方向延伸以耦接所述多个发光区域中的所述电源引脚。从而,通过所述两个电源线部被配置在所述接地线部的两侧,可以避免走线供电相互干扰,有利于提高产品良率。
可选地,在一实施例中,所述单层布局走线还被配置为形成多个功能线部,所述多个功能线部在所述两个发光组之间沿所述第一方向延伸以耦接所述多个发光区域中的相同或相应的功能引脚。从而,通过所述多个功能线部被配置在所述两个发光组之间,可以有效利用设置驱动芯片的冗余空间进行走线布局,有利于降低成本与提高产品良率。
可选地,在一实施例中,所述两个驱动芯片是中心对称设置。从而,通过所述两个驱动芯片的不同摆放方式,可以集中布局接地走线,有利于降低成本与提高产品良率。
可选地,在一实施例中,每一所述发光支路包括一个次毫米发光二极管;或者,每一所述发光支路包括至少两个次毫米发光二极管,所述至少两个次毫米发光二极管并联或者串联。从而,可利用次毫米发光二极管作为显示装置的背光源,使得显示装置拥有长寿命及不易烧屏等优势。
此外,本发明的另一方面提供一种显示装置,譬如以次毫米发光二极管为背光源或直显光源的显示装置,例如所述显示装置包括显示屏以及如上所述的光源模块,所述光源模块与所述显示屏连接。所述光源模块的实施内容及有益效果说明如上,不再赘述。举例来说,所述显示装置可以是采用所述光源模块作为背光源的液晶显示装置;替代地,所述显示装置还可以是采用所述光源模块作为直显光源的Mini LED显示屏,但不以此为限。
举例来说,在一应用示例中,如图5所示,所述显示装置包括多个光源模块C及一控制器(Bcon)B,为了简化说明内容,在此仅以两个光源模块(如图1及图2所示的光源模块实施例)为例进行说明,但不以此为限,所述说明也可适用于图3及图4所示的光源模块。
可选地,如图1、图2及图5所示,每个光源模块C包括一基板1,所述基板1被配置成具有多个呈阵列排布的发光区域M,每个发光区域M设置有两个发光组G,每个发光组G包括多个并列排布的发光支路2,所述两个发光组G之间并列设置两个驱动芯片3,单层布局走线4被布置在所述基板1上,以致使所述多个发光区域M中的多个驱动芯片3相互耦接及每个驱动芯片3驱动单个所述发光组G中的所述多个发光支路2,在每个光源模块C的所述基板1上的多个驱动芯片3中的一个驱动芯片3耦接所述控制器B。
示例地,如图1、图2及图5所示,在所述基板1上接近所述控制器B的一个驱动芯片3可被配置作为一特定驱动芯片3以耦接所述控制器B,譬如所述特定驱动芯片3的两个功能(如SO、DI)引脚30、39通过所述单层布局走线4的一部分耦接所述控制器B的两个相应引脚。从而,使得所述控制器B可以控制所述多个光源模块C的多个相互耦接的驱动芯片3,譬如所述控制器B对所述多个驱动芯片3进行数据传输(譬如传输控制命令等),以利进行各种光源控制作业,适应所述显示装置的显示需求。
本发明上述实施例的光源模块及显示装置,通过所述基板被配置成具有多个呈阵列排布的发光区域,每个发光区域设置有两个发光组,每个发光组包括多个并列排布的发光支路,所述两个发光组之间并列设置两个驱动芯片;及单层布局走线被布置在所述基板上,所述单层布局走线将多个所述发光区域中的驱动芯片相互耦接,并将所述驱动芯片与单个所述发光组中的所述多个发光支路电连接。
从而,本发明上述实施例可基于单层金属走线设计芯片驱动的次毫米发光二极管背光产品,譬如所述两个驱动芯片是中心对称设置,所述两个驱动芯片的所述接地引脚相互靠近,所述多个输出引脚靠近单个所述发光组中的所述多个发光支路。与现有技术中的基于两层或两层以上金属走线的光源模块相比,本发明上述实施例可以避免不同金属层间易短路及成本较高等问题,不仅可以体现产品竞争力,还可以降低成本,提高产品良率。
以上对本发明实施例进行详细介绍,本文中应用具体个例对本发明的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本发明的技术方案及其核心思想;本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例的技术方案的范围。
Claims (17)
- 一种光源模块,其包括:基板,被配置成具有多个呈阵列排布的发光区域,所述基板的每个发光区域内设置有两个发光组,每个发光组包括多个并列排布的发光支路,所述两个发光组之间并列设置两个驱动芯片;所述两个驱动芯片是中心对称设置;及单层布局走线,被布置在所述基板上,所述单层布局走线将多个所述发光区域中的驱动芯片相互耦接,并将所述驱动芯片与单个所述发光组中的所述多个发光支路电连接;每一所述发光支路包括一个次毫米发光二极管,或者,每一所述发光支路包括至少两个次毫米发光二极管,所述至少两个次毫米发光二极管并联或者串联。
- 根据权利要求1所述的光源模块,其中每个驱动芯片包括一接地引脚、至少一电源引脚、多种功能引脚及多个输出引脚,位于每一所述发光区域内的所述两个驱动芯片的所述接地引脚相互靠近,所述多个输出引脚靠近单个所述发光组中的所述多个发光支路。
- 根据权利要求2所述的光源模块,其中所述单层布局走线被配置以致使每个发光区域中的每个输出引脚耦接相同发光区域中的一个所述发光支路的一端,所述多个发光区域中的所述发光支路的另一端相互耦接,所述多个发光区域中的所述接地引脚相互耦接,所述多个发光区域中的所述电源引脚相互耦接,及所述多个发光区域中的相同或相应的功能引脚各自耦接。
- 根据权利要求2所述的光源模块,其中所述多个发光支路沿一第一方向并列排布,所述单层布局走线还被配置为形成一接地线部,所述接地线部在所述两个驱动芯片之间沿所述第一方向延伸以耦接所述多个发光区域中的所述接地引脚。
- 根据权利要求4所述的光源模块,其中所述单层布局走线还被配置为形成两个光源线部,每个光源线部在所述发光组远离所述驱动芯片的一侧沿所述第一方向延伸以耦接所述多个发光区域中的所述发光支路。
- 根据权利要求5所述的光源模块,其中所述单层布局走线还被配置为形成两个电源线部,每个电源线部在所述接地线部与所述光源线部之间沿所述第一方向延伸以耦接所述多个发光区域中的所述电源引脚。
- 根据权利要求4所述的光源模块,其中所述单层布局走线还被配置为形成多种功能线部,所述多种功能线部在所述两个发光组之间沿所述第一方向延伸以耦接所述多个发光区域中的相同或相应的功能引脚。
- 一种光源模块,其包括:基板,被配置成具有多个呈阵列排布的发光区域,所述基板的每个发光区域内设置有两个发光组,每个发光组包括多个并列排布的发光支路,所述两个发光组之间并列设置两个驱动芯片;及单层布局走线,被布置在所述基板上,所述单层布局走线将多个所述发光区域中的驱动芯片相互耦接,并将所述驱动芯片与单个所述发光组中的所述多个发光支路电连接。
- 根据权利要求8所述的光源模块,其中每个驱动芯片包括一接地引脚、至少一电源引脚、多种功能引脚及多个输出引脚,位于每一所述发光区域内的所述两个驱动芯片的所述接地引脚相互靠近,所述多个输出引脚靠近单个所述发光组中的所述多个发光支路。
- 根据权利要求9所述的光源模块,其中所述单层布局走线被配置以致使每个发光区域中的每个输出引脚耦接相同发光区域中的一个所述发光支路的一端,所述多个发光区域中的所述发光支路的另一端相互耦接,所述多个发光区域中的所述接地引脚相互耦接,所述多个发光区域中的所述电源引脚相互耦接,及所述多个发光区域中的相同或相应的功能引脚各自耦接。
- 根据权利要求9所述的光源模块,其中所述多个发光支路沿一第一方向并列排布,所述单层布局走线还被配置为形成一接地线部,所述接地线部在所述两个驱动芯片之间沿所述第一方向延伸以耦接所述多个发光区域中的所述接地引脚。
- 根据权利要求11所述的光源模块,其中所述单层布局走线还被配置为形成两个光源线部,每个光源线部在所述发光组远离所述驱动芯片的一侧沿所述第一方向延伸以耦接所述多个发光区域中的所述发光支路。
- 根据权利要求12所述的光源模块,其中所述单层布局走线还被配置为形成两个电源线部,每个电源线部在所述接地线部与所述光源线部之间沿所述第一方向延伸以耦接所述多个发光区域中的所述电源引脚。
- 根据权利要求11所述的光源模块,其中所述单层布局走线还被配置为形成多种功能线部,所述多种功能线部在所述两个发光组之间沿所述第一方向延伸以耦接所述多个发光区域中的相同或相应的功能引脚。
- 根据权利要求8所述的光源模块,其中所述两个驱动芯片是中心对称设置。
- 根据权利要求8所述的光源模块,其中每一所述发光支路包括一个次毫米发光二极管;或者,每一所述发光支路包括至少两个次毫米发光二极管,所述至少两个次毫米发光二极管并联或者串联。
- 一种显示装置,其包括显示屏以及根据权利要求8所述的光源模块,所述光源模块与所述显示屏连接。
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