WO2023082499A1 - 光模块 - Google Patents

光模块 Download PDF

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Publication number
WO2023082499A1
WO2023082499A1 PCT/CN2022/078425 CN2022078425W WO2023082499A1 WO 2023082499 A1 WO2023082499 A1 WO 2023082499A1 CN 2022078425 W CN2022078425 W CN 2022078425W WO 2023082499 A1 WO2023082499 A1 WO 2023082499A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
light source
optical module
sub
source emitter
Prior art date
Application number
PCT/CN2022/078425
Other languages
English (en)
French (fr)
Inventor
张加傲
王欣南
邵宇辰
慕建伟
Original Assignee
青岛海信宽带多媒体技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202122784337.4U external-priority patent/CN216526403U/zh
Priority claimed from CN202111342027.5A external-priority patent/CN114035283B/zh
Application filed by 青岛海信宽带多媒体技术有限公司 filed Critical 青岛海信宽带多媒体技术有限公司
Priority to CN202280075380.8A priority Critical patent/CN118339492A/zh
Publication of WO2023082499A1 publication Critical patent/WO2023082499A1/zh
Priority to US18/476,010 priority patent/US20240027702A1/en

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors

Definitions

  • the present disclosure relates to the technical field of optical communication, in particular to an optical module.
  • optical communication technology the optical module is a tool to realize the mutual conversion of photoelectric signals and one of the key components in optical communication equipment.
  • the transmission rate of optical modules continues to increase.
  • the distribution of optoelectronic devices inside the optical module is more compact and takes up less space.
  • an optical module in a first aspect, includes: an upper casing, a lower casing, a circuit board, a sub-circuit board and a fixing part.
  • the lower case is covered with the upper case to form a wrapping cavity; the circuit board is arranged in the wrapping cavity and fixedly connected with the lower case, and the lower surface of the circuit board is provided with a second Connector; the sub-circuit board is arranged above the circuit board, and a first connector is arranged on its upper surface; the first connector and the second connector are connected through a flexible circuit board; the fixing part is hoisted Below the inner wall of the upper casing, the sub-circuit board is disposed below the fixing portion.
  • an optical module in a second aspect, includes: an upper shell, a lower shell, a circuit board, a light source installation part, a support column, a pressing plate and a light source emitter.
  • the lower case and the upper case are covered to form a wrapping cavity; the circuit board is arranged in the wrapping cavity; the light source installation part is connected with the upper case; the support column is arranged in the Below the light source installation part, one end is connected to the light source installation part; one end of the pressure plate is connected to the other end of the support column; the light source emitter is arranged between the light source installation part and the pressure plate.
  • an optical module in a third aspect, includes: an upper shell, a lower shell, a circuit board, a light source emitter, a sub-circuit board, a base, a support column and a pressure plate.
  • the lower shell and the upper shell are closed to form a wrapping cavity; the circuit board is set in the wrapping cavity; the light source emitter is set in the wrapping cavity; the sub-circuit board is set in the wrapping cavity
  • One side of the light source emitter is connected to the light source emitter; the base is fixedly connected to the upper case, and the other side is connected to the sub-circuit board and the light source emitter;
  • the supporting column is arranged under the base, and one end is connected to the base; one end of the pressing plate is connected to the other end of the supporting column; the light source emitter is arranged between the base and the pressing plate.
  • Fig. 1 is a connection diagram of an optical communication system according to some embodiments
  • Fig. 2 is a structural diagram of an optical network terminal according to some embodiments.
  • Fig. 3 is a structural diagram of an optical module according to some embodiments.
  • Figure 4 is an exploded view of an optical module according to some embodiments.
  • Fig. 5 is an exploded schematic diagram of a light source emitter and a circuit board according to some embodiments
  • FIG. 6 is a partial cross-sectional view of an optical module according to some embodiments.
  • Fig. 7 is a schematic structural diagram of an upper housing and a light emitting component according to some embodiments.
  • Fig. 8 is a schematic structural diagram of an upper case according to some embodiments.
  • Fig. 9 is a schematic structural diagram of a light source emitter according to some embodiments.
  • Fig. 10 is a schematic structural diagram of another angle of a light source emitter according to some embodiments.
  • Fig. 11 is a schematic diagram of an exploded structure of a light source emitter according to some embodiments.
  • FIG. 12 is a schematic diagram of an exploded structure of a sub-circuit board and a light source according to some embodiments
  • Fig. 13 is a schematic diagram of an exploded structure of a fixing frame according to some embodiments.
  • Fig. 14 is another perspective exploded view of a fixing frame according to some embodiments.
  • Fig. 15 is a schematic structural view of another angle of the upper casing according to some embodiments.
  • Fig. 16 is a schematic diagram of an exploded structure of an upper case and a fixing frame according to some embodiments
  • Fig. 17 is a schematic structural view of an upper housing, a light source transmitter and an optical fiber adapter according to some embodiments;
  • Fig. 18 is a schematic structural diagram of a circuit board and a lower case according to some embodiments.
  • Fig. 19 is a schematic diagram of an exploded structure of a circuit board and a lower case according to some embodiments.
  • Fig. 20 is a schematic structural view of a fixing frame, an optical fiber support and a circuit board according to some embodiments;
  • Fig. 21 is a schematic diagram of a disassembled structure of an optical fiber holder and a circuit board according to some embodiments
  • Fig. 22 is a schematic structural view of another angle of an optical fiber holder according to some embodiments.
  • Fig. 23 is a second schematic diagram of a partial structure of an optical module according to some embodiments.
  • Fig. 24 is a schematic cross-sectional view of a partial structure of an optical module according to some embodiments.
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as “first” and “second” may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality” means two or more.
  • the expressions “coupled” and “connected” and their derivatives may be used.
  • the term “connected” may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other.
  • the term “coupled” may be used when describing some embodiments to indicate that two or more elements are in direct physical or electrical contact.
  • the terms “coupled” or “communicatively coupled” may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other.
  • the embodiments disclosed herein are not necessarily limited by the context herein.
  • At least one of A, B and C has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, A and B A combination of A and C, a combination of B and C, and a combination of A, B and C.
  • a and/or B includes the following three combinations: A only, B only, and a combination of A and B.
  • optical communication technology In optical communication technology, light is used to carry information to be transmitted, and the optical signal carrying information is transmitted to information processing equipment such as a computer through optical fiber or optical waveguide and other information transmission equipment to complete the information transmission. Because optical signals have passive transmission characteristics when they are transmitted through optical fibers or optical waveguides, low-cost, low-loss information transmission can be achieved.
  • the signals transmitted by information transmission equipment such as optical fibers or optical waveguides are optical signals, while the signals that can be recognized and processed by information processing equipment such as computers are electrical signals. To establish an information connection between them, it is necessary to realize the mutual conversion of electrical signals and optical signals.
  • the optical module realizes the mutual conversion function of the above-mentioned optical signal and electrical signal in the technical field of optical fiber communication.
  • the optical module includes an optical port and an electrical port.
  • the optical module realizes optical communication with information transmission equipment such as optical fiber or optical waveguide through the optical port, and realizes the electrical connection with the optical network terminal (such as an optical modem) through the electrical port. It is mainly configured to realize power supply, I2C signal transmission, data signal transmission, and grounding; the optical network terminal transmits electrical signals to information processing equipment such as computers through network cables or wireless fidelity technology (Wi-Fi).
  • Wi-Fi wireless fidelity technology
  • Fig. 1 is a connection diagram of an optical communication system according to some embodiments.
  • the optical communication system mainly includes a remote server 1000 , a local information processing device 2000 , an optical network terminal 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .
  • optical fiber 101 One end of the optical fiber 101 is connected to the remote server 1000 , and the other end is connected to the optical network terminal 100 through the optical module 200 .
  • Optical fiber itself can support long-distance signal transmission, such as signal transmission of several kilometers (6 kilometers to 8 kilometers). On this basis, if repeaters are used, ultra-long-distance transmission can theoretically be achieved. Therefore, in a common optical communication system, the distance between the remote server 1000 and the optical network terminal 100 can usually reach thousands of kilometers, tens of kilometers or hundreds of kilometers.
  • the local information processing device 2000 may be any one or more of the following devices: routers, switches, computers, mobile phones, tablet computers, televisions, and so on.
  • the physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100 .
  • the connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103 ; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100 .
  • the optical module 200 includes an optical port and an electrical port.
  • the optical port is configured to be connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; electrical signal connection.
  • the optical module 200 implements mutual conversion between optical signals and electrical signals, so that a connection is established between the optical fiber 101 and the optical network terminal 100 .
  • the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100
  • the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101 .
  • the optical network terminal 100 includes a substantially rectangular parallelepiped housing (housing), and an optical module interface 102 and a network cable interface 104 disposed on the housing.
  • the optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 establish a bidirectional electrical signal connection;
  • the network cable interface 104 is configured to access the network cable 103, so that the optical network terminal 100 and the network cable 103 A two-way electrical signal connection is established.
  • a connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100 .
  • the optical network terminal 100 transmits the electrical signal from the optical module 200 to the network cable 103, and transmits the signal from the network cable 103 to the optical module 200. Therefore, the optical network terminal 100, as the host computer of the optical module 200, can monitor the optical module 200 work.
  • the host computer of the optical module 200 may also include an optical line terminal (Optical Line Terminal, OLT) and the like.
  • OLT optical Line Terminal
  • the remote server 1000 establishes a two-way signal transmission channel with the local information processing device 2000 through the optical fiber 101 , the optical module 200 , the optical network terminal 100 and the network cable 103 .
  • FIG. 2 is a structural diagram of an optical network terminal according to some embodiments.
  • the optical network terminal 100 further includes a PCB circuit board 105 disposed in the casing, a cage 106 disposed on the surface of the PCB circuit board 105 , and an electrical connector disposed inside the cage 106 .
  • the electrical connector is configured to be connected to the electrical port of the optical module 200; the heat sink 107 has fins and other raised parts that increase the heat dissipation area.
  • the optical module 200 is inserted into the cage 106 of the optical network terminal 100 , and the optical module 200 is fixed by the cage 106 .
  • the heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the radiator 107 .
  • the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106 , so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100 .
  • the optical port of the optical module 200 is connected to the optical fiber 101 , so that the optical module 200 and the optical fiber 101 establish a bidirectional electrical signal connection.
  • Fig. 3 is a structural diagram of an optical module according to some embodiments
  • Fig. 4 is an exploded view of an optical module according to some embodiments.
  • the optical module 200 includes a housing and a circuit board 300 disposed in the housing.
  • the casing includes an upper casing 201 and a lower casing 202.
  • the upper casing 201 is covered on the lower casing 202 to form the above casing with two openings 204 and 205; the outer contour of the casing is generally square.
  • the lower case 202 includes a bottom plate and two lower side plates located on both sides of the bottom plate and perpendicular to the bottom plate;
  • the two upper side plates are combined by two side walls and two side plates to realize that the upper case 201 is covered on the lower case 202 .
  • the direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200 , or may not be consistent with the length direction of the optical module 200 .
  • the opening 204 is located at the end of the optical module 200 (the right end in FIG. 3 ), and the opening 205 is also located at the end of the optical module 200 (the left end in FIG. 3 ).
  • the opening 204 is located at the end of the optical module 200
  • the opening 205 is located at the side of the optical module 200 .
  • the opening 204 is an electrical port, and the golden finger of the circuit board 300 is stretched out from the electrical port 204, and is inserted into a host computer (such as the optical network terminal 100); the opening 205 is an optical port, configured to be connected to an external optical fiber 101, so that The optical fiber 101 is connected to the inside of the optical module 200 .
  • the combination of the upper case 201 and the lower case 202 is used to facilitate the installation of components such as the circuit board 300 into the case, and the upper case 201 and the lower case 202 can form packaging protection for these devices.
  • the upper case 201 and the lower case 202 can form packaging protection for these devices.
  • the upper shell 201 and the lower shell 202 are generally made of metal materials, which is beneficial to realize electromagnetic shielding and heat dissipation.
  • the optical module 200 further includes an unlocking part 203 located on the outer wall of its housing, and the unlocking part 203 is configured to realize a fixed connection between the optical module 200 and the host computer, or release the connection between the optical module 200 and the host computer. fixed connection.
  • the unlocking component 203 is located on the outer walls of the two lower side panels of the lower housing 202 , and includes an engaging component matching with a cage of the upper computer (for example, the cage 106 of the optical network terminal 100 ).
  • a cage of the upper computer for example, the cage 106 of the optical network terminal 100 .
  • the optical module 200 is inserted into the cage of the host computer, the optical module 200 is fixed in the cage of the host computer by the engaging part of the unlocking part 203; when the unlocking part 203 is pulled, the engaging part of the unlocking part 203 moves accordingly, thereby changing
  • the connection relationship between the engaging part and the host computer is to release the engagement relationship between the optical module 200 and the host computer, so that the optical module 200 can be pulled out from the cage of the host computer.
  • the circuit board 300 includes circuit traces, electronic components and chips, through which the electronic components and chips are connected together according to the circuit design, so as to realize functions such as power supply, electrical signal transmission and grounding.
  • the electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET).
  • Chips can include, for example, a Microcontroller Unit (MCU), a limiting amplifier (limiting amplifier), a clock data recovery chip (Clock and Data Recovery, CDR), a power management chip, and a digital signal processing (Digital Signal Processing, DSP) chip.
  • MCU Microcontroller Unit
  • limiting amplifier limiting amplifier
  • CDR clock data recovery chip
  • DSP digital signal processing
  • the circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function, such as the rigid circuit board can carry the chip smoothly; the rigid circuit board can also be inserted into the electrical connector in the cage of the upper computer .
  • the circuit board 300 also includes gold fingers formed on the surface of its end, and the gold fingers are composed of a plurality of independent pins.
  • the circuit board 300 is inserted into the cage 106 and electrically connected with the electrical connector in the cage 106 by the gold finger.
  • Gold fingers can be arranged only on one side of the circuit board 300 (for example, the upper surface shown in FIG. 4 ), or on the upper and lower sides of the circuit board 300, so as to meet the occasions where the number of pins is large.
  • the golden finger is configured to establish an electrical connection with the host computer to realize power supply, grounding, I2C signal transmission, data signal transmission, etc.
  • flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.
  • the optical transceiver device includes an optical transmitting sub-module and an optical receiving sub-module.
  • Fig. 3 is a structural diagram of an optical module according to some embodiments
  • Fig. 4 is an exploded view of an optical module according to some embodiments.
  • the optical module 200 includes a housing, a circuit board 300 disposed in the housing, and an optical transceiver device.
  • the casing includes an upper casing 201 and a lower casing 202.
  • the upper casing 201 is covered on the lower casing 202 to form the above casing with two openings 204 and 205; the outer contour of the casing is generally square.
  • the lower case 202 includes a bottom plate and two lower side plates located on both sides of the bottom plate and perpendicular to the bottom plate;
  • the two upper side plates are combined by two side walls and two side plates to realize that the upper case 201 is covered on the lower case 202 .
  • the direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200 , or may not be consistent with the length direction of the optical module 200 .
  • the opening 204 is located at the end of the optical module 200 (the left end in FIG. 3 ), and the opening 205 is also located at the end of the optical module 200 (the right end in FIG. 3 ).
  • the opening 204 is located at the end of the optical module 200
  • the opening 205 is located at the side of the optical module 200 .
  • the opening 204 is an electrical port, and the golden finger of the circuit board 300 is stretched out from the electrical port 204, and is inserted into a host computer (such as the optical network terminal 100); the opening 205 is an optical port, configured to be connected to an external optical fiber 101, so that The optical fiber 101 is connected to the optical transceiver device inside the optical module 200 .
  • the combination of the upper case 201 and the lower case 202 is used to facilitate the installation of components such as the circuit board 300 and the optical transceiver device into the case, and the upper case 201 and the lower case 202 can form package protection for these devices.
  • the upper case 201 and the lower case 202 can form package protection for these devices.
  • the upper shell 201 and the lower shell 202 are generally made of metal materials, which is beneficial to realize electromagnetic shielding and heat dissipation.
  • the optical module 200 further includes an unlocking part 203 located on the outer wall of its housing, and the unlocking part 203 is configured to realize a fixed connection between the optical module 200 and the host computer, or release the connection between the optical module 200 and the host computer. fixed connection.
  • the unlocking component 203 is located on the outer walls of the two lower side panels of the lower housing 202 , and includes an engaging component matching with a cage of the upper computer (for example, the cage 106 of the optical network terminal 100 ).
  • a cage of the upper computer for example, the cage 106 of the optical network terminal 100 .
  • the optical module 200 is inserted into the cage of the host computer, the optical module 200 is fixed in the cage of the host computer by the engaging part of the unlocking part 203; when the unlocking part 203 is pulled, the engaging part of the unlocking part 203 moves accordingly, thereby changing
  • the connection relationship between the engaging part and the host computer is used to release the engagement relationship between the optical module 200 and the host computer, so that the optical module 200 can be pulled out from the cage of the host computer.
  • the circuit board 300 includes circuit traces, electronic components and chips, through which the electronic components and chips are connected together according to the circuit design, so as to realize functions such as power supply, electrical signal transmission and grounding.
  • the electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET).
  • Chips can include, for example, a Microcontroller Unit (MCU), a limiting amplifier (limiting amplifier), a clock data recovery chip (Clock and Data Recovery, CDR), a power management chip, and a digital signal processing (Digital Signal Processing, DSP) chip.
  • MCU Microcontroller Unit
  • limiting amplifier limiting amplifier
  • CDR clock data recovery chip
  • DSP digital signal processing
  • the circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function, such as the rigid circuit board can carry the chip smoothly; the rigid circuit board can also be inserted into the electrical connector in the cage of the upper computer .
  • the circuit board 300 also includes gold fingers formed on the surface of its end, and the gold fingers are composed of a plurality of independent pins.
  • the circuit board 300 is inserted into the cage 106 and electrically connected with the electrical connector in the cage 106 by the gold finger.
  • Gold fingers can be arranged only on one side of the circuit board 300 (for example, the upper surface shown in FIG. 4 ), or on the upper and lower sides of the circuit board 300, so as to meet the occasions where the number of pins is large.
  • the golden finger is configured to establish an electrical connection with the host computer to realize functions such as power supply, grounding, I2C signal transmission, and data signal transmission.
  • flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.
  • the optical transceiver device includes an optical transmitting sub-module and an optical receiving sub-module.
  • Fig. 5 is an exploded schematic diagram of a light source emitter and a circuit board according to some embodiments.
  • Fig. 6 is a partial cross-sectional view of an optical module according to some embodiments.
  • a light source transmitter 410 is disposed in the optical module, disposed above the circuit board 300 , configured to emit light, and one end is connected to an outgoing optical fiber.
  • the sub-circuit board 420 is disposed above the circuit board 300 and is electrically connected to the circuit board 300 through the flexible circuit board 440 .
  • the light source emitter 410 is electrically connected to the sub-circuit board 420 , and the sub-circuit board 420 drives the optoelectronic devices in the light source emitter 410 .
  • the fixing frame 430 is disposed above the circuit board 300 and is configured to fix the light source emitter 410 .
  • the light source emitter 410 is fixed on the fixing frame 430 , and a plurality of pins are provided on one side to connect with the sub-circuit board 420 .
  • the fixing frame 430 is also connected with the upper casing, and the light source transmitter 410 is fixed on the upper casing through the fixing frame 430, and the heat emitted by it can be directly transferred to the upper casing by the fixing frame, so as to improve the heat dissipation function of the optical module.
  • the light source transmitter may be a light source, which emits light without a signal, and the silicon photonic chip receives the light loading signal sent by the light source to form signal light.
  • the light source emitter is disposed above the circuit board and configured to emit light.
  • the sub-circuit board 420 is disposed above the circuit board 300 and is electrically connected to the circuit board 300 through a flexible circuit board.
  • the light source is electrically connected to the sub-circuit board 420, and the sub-circuit board 420 drives the light source.
  • the fixing frame 430 is disposed above the circuit board and is configured to fix the light source.
  • the fixing bracket 430 is also connected to the upper housing 201, and the light source transmitter 410 is fixed on the upper housing 201 through the fixing bracket 430, and the heat emitted by it can be directly transferred to the upper housing by the fixing bracket, so as to improve the heat dissipation function of the optical module.
  • Fig. 7 is a schematic structural diagram of an upper housing and a light emitting component according to some embodiments
  • Fig. 8 is a schematic structural diagram of an upper housing according to some embodiments
  • Fig. 9 is a light source emitting component according to some embodiments
  • the upper case 201 includes: a cover plate 2011, and two first upper side plates 2012 and a second upper side plate 2012 located on both sides of the cover plate 2011 perpendicular to the cover plate. Two upper side panels in 2013.
  • the cover plate 2011 is provided with a bracket installation groove 2014 , which is recessed relative to the lower surface of the cover plate 2011 .
  • the support mounting groove 2014 is matched with the upper surface of the fixed frame, and the fixed frame 430 is installed in the support mounting groove 2014 inside.
  • the bracket installation groove 2014 is provided with a first fixing hole 2015, which is located at a corner of the bracket installation groove 2014, corresponding to the position of the first connection through hole 4311 on the fixing bracket 430; the bracket installation groove 2014 is also provided with a second fixing hole 2016, which is located at The other corner of the bracket installation groove 2014 corresponds to the position of the second connection through hole 4312 on the base.
  • the first fixing hole 2015 and the second fixing hole 2016 are located at the opposite corners of the bracket installation groove, which is convenient for installation and stability.
  • the fixing frame 430 includes: a base and a bracket.
  • the base is a rectangular plate structure, and one side is a plane structure, which is connected with the upper case and configured for fixing; the other side is provided with a plurality of avoidance grooves, configured for fixed installation of the light source and the sub-circuit board 420 .
  • the bracket includes: a supporting column and a pressing plate, the supporting column is arranged under the base, one end is connected with the base, and the other end is connected with the pressing plate. One side of the pressing plate is connected with the light source, and the light source is fixed between the pressing plate and the base.
  • the light source emitter 410 may be a common rectangular parallelepiped shell, in which the light source emitter is arranged, and one end is connected with an outgoing optical fiber.
  • the upper surface of the light source emitter 410 is connected to the lower surface of the base, and the lower surface is connected to the upper surface of the pressure plate.
  • One side surface of the light source emitter 410 is provided with a plurality of metal pins, which are connected with the sub-circuit board 420 to realize the fixing and electrical connection of the light source and the sub-circuit board 420, and the metal pins are set towards the side of the sub-circuit board 420, reducing the The distance between the small pins and the sub-circuit board 420 increases connection stability.
  • the fixing frame 430 includes: a base 431 and a bracket 432 .
  • the base 431 is a rectangular plate structure, one side is a planar structure, connected with the upper case, configured for fixing; the other side is configured for fixed installation of the light source emitter 410 and the sub-circuit board 420 .
  • the bracket 432 includes: a supporting column 4321 and a pressing plate 4322 , the supporting column 4321 is disposed under the base 431 , one end is connected to the base 431 , and the other end is connected to the pressing plate 4322 .
  • One side of the pressing plate 4322 is connected to the light source, and the light source is fixed between the pressing plate 4322 and the base 431 .
  • one side of the lower surface of the base 431 includes a light source installation part 4313 , which is matched with the light source.
  • the base 431 includes a fixing portion 4314 fixedly connected with the sub-circuit board 420 .
  • the fixing part 4314 is disposed on one side of the light source installation part 4313 .
  • the upper surface of the base 431 is connected to the upper casing 201, and the lower surface is provided with a light source emitter 410 and a sub-circuit board 420, wherein the light source emitter 410 is arranged between the pressure plate 4322 and the base 431, and the sub-circuit board 420 is arranged on the light source emitter 410 One side is connected with the sub-circuit board 420 through pins.
  • the heat generated by the light source emitter 410 is directly transferred to the upper casing 201 through the base 431 , and then transferred to the cage for heat dissipation.
  • the base 431 is provided with a plurality of connection through holes, and is connected with the upper case 201 by screws.
  • the upper housing 201 is provided with fixing holes corresponding to the positions of the connecting through holes. When connecting, screws are passed through the fixing holes to connect with the connecting through holes.
  • the connecting through hole may be a threaded hole, and the screw is connected with the connecting through hole.
  • a plurality of optoelectronic devices are arranged in the optical module, and a plurality of optical fibers are arranged in order to realize the transmission of light between the optoelectronic devices.
  • the length of optical fibers is much longer than the distance between optoelectronic components.
  • the optical module is also provided with an optical fiber support, which is arranged above the circuit board, and an optical fiber groove is arranged above the optical fiber support, and the optical fiber is fixed in the optical fiber groove.
  • the upper surface and the lower surface of the sub-circuit board 420 are provided with a plurality of electronic components, and the size and height of each electronic component are not completely consistent.
  • the base 431 is provided with a third connection through hole 4315 located on one side of the fixing portion 4314 and configured to be fixed with the sub-circuit board 420 .
  • the base 431 also has a fourth connection through hole 4316 located on the other side of the fixing portion 4314 and configured to be fixed with the sub-circuit board 420 .
  • the sub-circuit board 420 is provided with a third fixing hole 421 , matching the position of the third connection through hole 4315 .
  • the third fixing hole 421 is connected to the third connecting through hole 4315 by screws.
  • the sub-circuit board 420 is provided with a fourth fixing hole 422 matching the position of the fourth connection through hole 4316 .
  • the fourth fixing hole 422 is connected to the fourth connecting through hole 4316 by screws.
  • the third fixing hole 421 and the fourth fixing hole 422 are arranged at opposite corners of the circuit board to realize positioning between the sub-circuit board 420 and the base 431 parallel to the plane direction of the circuit board.
  • the third fixing hole 421 is disposed adjacent to the bracket 432, and may be a circular through hole, or may also be in the form of an escape hole.
  • FIG. 12 is a schematic diagram of an exploded structure of a sub-circuit board and a light source according to some embodiments.
  • the sub-circuit board 420 is provided with an installation avoidance portion 424
  • the light source emitter 410 is disposed at the installation avoidance portion 424 .
  • the upper surface of the light source emitter 410 is in contact with the base, one end of the light source emitter 410 close to the light port is in contact with the bracket 432 , and the other end is connected with the corner of the mounting escape portion 424 .
  • One side of the light source emitter 410 is connected to the sub-circuit board 420 through a plurality of pins 411 . In some embodiments of the present disclosure, one side of the light source emitter 410 is connected to the upper surface of the sub-circuit board 420 through pins.
  • Fig. 13 is a schematic diagram of an exploded structure of a fixing frame according to some embodiments.
  • Fig. 14 is another perspective exploded view of a fixing frame according to some embodiments.
  • the base 431 and the bracket 432 may be integrally formed, and the upper surface of the pressure plate 4322 is connected to the lower surface of the light source emitter 410 .
  • the base 431 and the bracket 432 are separate structures, as shown in the figure.
  • the bracket 432 includes a support column 4321 and a pressure plate 4322 , the support column 4321 is disposed under the base 431 , one end is connected to the base 431 , and the other end is connected to the pressure plate 4322 .
  • the upper surface of the pressing plate 4322 is connected with the light source emitter 410 , and the light source emitter 410 is fixed between the pressing plate 4322 and the base 431 .
  • the support column 4321 is provided with a fixing threaded hole 43211 , and the corresponding position of the base 431 is provided with a connection hole 4317 .
  • the third connection through hole 4315 is connected to the third fixing hole 421 and the third connection through hole 4315 is connected to the third fixing hole 421 by screw connection, so as to realize the connection and fixation of the sub-circuit board 420 and the base 431 .
  • the material of the base 431 includes but not limited to tungsten-copper, cobalt alloy, SPCC (Steel Plate Cold rolled Commercial, cold-rolled carbon steel), copper, etc., so as to transfer the heat generated by the optoelectronic device to the base 431.
  • the light source emitter 410 is the most important source of heat generation in the optical module. In this disclosure, the light source emitter 410 is arranged on the base 431. Through the base 431 and the upper housing 201, the heat generated by the light source emitter 410 is directly conducted from the base 431. to the upper casing 201 .
  • the upper casing 201 is externally connected to the cage, and has a cooling channel to increase heat conduction efficiency.
  • a gasket 4323 is provided between the pressing plate 4322 and the light source emitter 410 .
  • the upper surface of the pressure plate 4322 is provided with a pressure receiving portion 43221 and a receiving portion 43222 , and the receiving portion 43222 is disposed between the pressure receiving portion 43221 and the support column 4321 to realize the connection between the pressure receiving portion 43221 and the support column 4321 .
  • the upper surface of the pressure bearing part 43221 is connected to the lower surface of the gasket 4323
  • the lower surface of the gasket 4323 is connected to the light source emitter 410 .
  • the upper surface of the pressure receiving part 43221 is lower than the upper surface of the receiving part 43222, so there is a stepped surface between the pressure receiving part 43221 and the receiving part 43222, and one end of the gasket 4323 is in contact with the stepped surface to realize the positioning of the gasket 4323.
  • the height of the upper surface of the spacer 4323 is not lower than the height of the upper surface of the receiving portion 43222 .
  • the height of the upper surface of the gasket 4323 is higher than that of the receiving part 43222, so that the light source emitter 410 is connected to the upper surface of the gasket 4323, and there is a certain gap between the light source emitter 410 and the receiving part 43222 , to avoid excessive force on the screws between the support column 4321 and the base 431 during installation, and excessive pressure of the pressure plate 4322 on the light source emitter 410, so as to prevent the pressure plate 4322 from breaking.
  • the third connection through hole 4315 is connected to the third fixing hole 421 and the third connection through hole 4315 is connected to the third fixing hole 421 by screw connection, so as to realize the connection and fixation of the sub-circuit board 420 and the base 431 .
  • the base 431 Place the base 431 in the mounting groove of the bracket 432, connect the first connection through hole with the first fixing hole, the second connection through hole and the second fixing hole with screws, so as to realize the fixation frame 430 of the light source emitter 410 and the upper casing 201 connections.
  • the light source transmitter 410 is fixed on the light source transmitter 410 fixing frame 430, and then the light source transmitter 410 fixing frame 430 is fixed on the lower surface of the upper housing 201, so that the light source transmitter 410 is installed and fixed inside the optical module, and the light source
  • the emitter 410 is connected to the upper casing 201 through the base 431 , and the heat emitted by the light source emitter 410 is transferred to the upper casing 201 through the base 431 to improve the cooling effect.
  • the sub-circuit board 420 is provided with a first connector located on the lower surface of the sub-circuit board 420 , and the opening faces the side away from the light source emitter 410 .
  • the circuit board 300 is provided with the second connector, and the opening orientation is consistent with the opening orientation of the first connector.
  • the first connector and the second connector are connected by a flexible circuit board.
  • One end of the circuit board 300 is provided with a gold finger, which is connected to the host computer through the gold finger, receives the electrical signal of the host computer, transmits it to the sub-circuit board 420 through the flexible circuit board, and connects the power-on pins of the sub-circuit board 420 to the light source transmitter 410
  • the external pins are connected to realize signal transmission.
  • the heat generated by the light source emitter 410 is transferred to the upper housing 201 through the base 431 , and then connected to the upper housing 201 through the base 431 .
  • the material of the shell of the light source emitter 410 includes but is not limited to tungsten copper, can raft alloy, SPCC (Steel Plate Cold rolled Commercial, cold-rolled carbon steel), copper, etc., to facilitate the generation of optoelectronic devices
  • the heat is transferred to the base 431.
  • Fig. 15 is a structural schematic diagram of another angle of the upper case according to some embodiments
  • Fig. 16 is a schematic diagram of an exploded structure of the upper case and the fixing bracket according to some embodiments
  • Fig. 17 is a schematic view of the upper case and the light source according to some embodiments Schematic diagram of the transmitter and fiber optic adapter.
  • the fixing frame 430 is installed inside the bracket installation groove 2014, and the upper surface of the base contacts the bracket The lower surface of the mounting groove 2014.
  • the first fixing hole 2015 and the second fixing hole 2016 are located at opposite corners of the bracket installation groove, which is convenient for installation and stability.
  • the first fixing hole 2015 and the second fixing hole 2016 are set as countersunk holes on the upper surface of the cover plate 2011, so that the head of the screw can sink in easily and not protrude from the surface of the cover plate 2011, making the appearance of the optical module more tidy and convenient for connecting with the host computer Structural connections.
  • the cover plate 2011 is further provided with a third fixing hole, passing through the upper surface and the lower surface of the cover plate 2011 , configured to realize the fixing of the upper shell 201 and the lower shell 202 .
  • countersunk screws are used to screw in from the lower surface of the upper housing 201 to the inside of the optical module, and the fixing frame 430 is installed on the lower surface of the upper housing 201 .
  • the support column 4321 is connected with the base 431 by screws.
  • the second fixing hole 2016 is connected with the second connection through hole 4312 on the base, and connects the fixing frame 430 on which the light source emitter 410 and the sub-circuit board 420 are installed with the upper casing 201 .
  • the fifth fixing hole 2017 is disposed on one side of the bracket installation groove 2014, close to the position of the optical port. In order to achieve uniform stress on the upper shell and the lower shell, the distance from the fifth fixing hole to the first upper side plate 2012 is consistent with the distance from the fifth fixing hole to the second upper side plate 2013 .
  • the first optical fiber adapter 206 and the second optical fiber adapter 207 are arranged in the optical module, and are arranged at the optical port 205.
  • the support column 4321 is provided with a fitting escape groove 4324
  • the first fiber optic adapter 206 and the second fiber optic adapter 207 are arranged between the fixing frame and the circuit board 300 .
  • the edge of the first optical fiber adapter 206 is in contact with the matching avoidance groove 4324, so that the avoidance installation of the first optical fiber adapter 206 can be realized, and the positioning of the first optical fiber adapter 206 can be realized at the same time, which is beneficial to the stability of the first optical fiber adapter.
  • the first optical fiber adapter 206 is connected to the silicon optical chip through an optical fiber, and is configured to transmit optical signals to the outside of the optical module.
  • Fig. 18 is a schematic structural diagram of a circuit board and a lower case according to some embodiments
  • Fig. 19 is a schematic diagram of an exploded structure of a circuit board and a lower case according to some embodiments.
  • the lower housing 202 includes a bottom plate 2021 and two lower side plates, a first lower side plate 2022 and a second lower side plate 2023 , located on both sides of the bottom plate and perpendicular to the bottom plate.
  • the upper case 201 is covered on the lower case 202 by combining the two side walls with the two side plates.
  • the lower case 202 is provided with a plurality of fixing platforms 2024, and the fixing platforms 2024 have the same top surface height and are configured to support the circuit board.
  • the supporting top surface of the fixing table 2024 is configured to contact the lower surface of the circuit board 300 to realize the support of the circuit board 300 and the positioning in the height direction of the optical module.
  • the fixing platform may be a structure that protrudes from the inner side wall of the lower housing 202 and has a supporting top surface.
  • the shapes of each fixing table can be the same or different.
  • a first limit post 2025 and a second limit post 2026 are further provided on the side wall of the lower housing 202 .
  • the first limiting post 2025 and the second limiting post 2026 can not only realize the installation and positioning of the circuit board 300, but also can realize the fixing of the circuit board 300 in the length direction of the optical module.
  • the positions of the first limiting post 2025 and the second limiting post 2026 in the length direction of the optical module may be different or the same.
  • the side of the circuit board 300 is provided with a first limit port 301, the first limit port 301 is clamped and connected to the first limit post 2025, the second side of the circuit board 300 is provided with a second limit port 302, and the second limit The port 302 is clamped and connected to the second limiting post 2026 .
  • the first limiting post 2025 and the second limiting post 2026 correspond to the first limiting opening 301 and the second limiting opening 302 respectively.
  • a fifth mounting through hole 20211 is provided in the middle of the bottom plate 2021 , and a seventh fixing hole 310 is provided in the circuit board 300 . Screws are used to pass through the seventh fixing hole 310 from the upper surface of the circuit board 300 to connect with the fifth installation through hole 20211 .
  • a through-hole platform 20212 is provided in the middle of the bottom plate 2021, and the fifth installation through-hole 20211 is located on the through-hole platform 20212.
  • the lower surface of the circuit board 300 is in contact with the through-hole platform 20212 to realize the support and positioning of the circuit board 300 .
  • the through-hole platform 20212 protrudes relative to the inner sidewall of the bottom plate 2021 and has a supporting top surface.
  • the through-hole platform 20212 is arranged in the middle of the bottom plate 2021, and the distance from the through-hole platform 20212 to the first lower side plate 2022 , which is the same as the distance from the through-hole platform 20212 to the second lower side plate 2023 .
  • the distance between the end surface of the through-hole platform 20212 and the lower surface of the bottom plate 2021 is greater than the distance from the upper surface to the lower surface of the bottom plate 2021 , that is, the thickness of the through-hole platform 20212 is greater than that of the bottom plate 2021 .
  • the screw penetrates from the top of the seventh fixing hole 310 on the circuit board 300, and is connected with the fifth installation through hole 20211, but does not protrude from the lower end surface of the fifth installation through hole 20211, so as to maintain the integrity of the lower surface of the bottom plate 2021, and facilitate The connection between the optical module and the host computer.
  • a plurality of optoelectronic devices are arranged in the optical module, and a plurality of optical fibers are arranged in order to realize the transmission of light between the optoelectronic devices.
  • the length of optical fibers is much longer than the distance between optoelectronic components.
  • the optical module is also provided with an optical fiber holder 500, which is arranged above the circuit board 300, and an optical fiber groove is arranged above the optical fiber holder, and the optical fiber is fixed in the optical fiber groove.
  • Fig. 20 is a schematic structural view of a fixing frame, an optical fiber support and a circuit board according to some embodiments
  • Fig. 21 is a schematic diagram of a disassembled structure of the optical fiber support and a circuit board according to some embodiments
  • Fig. 22 is a schematic structural diagram of another angle of an optical fiber holder according to some embodiments.
  • one end of the bottom surface of the fiber optic bracket 500 is provided with a first limiting portion 501 and a second limiting portion 502 .
  • the circuit board 300 is provided with a third limiting opening 303 , and the first limiting portion 501 is clamped and connected to the third limiting opening 303 .
  • the circuit board 300 is provided with a fourth limiting opening 304 , and the second limiting portion 502 is clamped and connected to the fourth limiting opening 304 .
  • the first limiting part 501 and the second limiting part 502 can not only realize the installation and positioning of the optical fiber support 500 on the circuit board 300 , but also can realize the fixing of the optical fiber support 500 in the height direction of the optical module.
  • the first limiting part 501 is provided with a first clamping part 5011, which is embedded in the third limiting port 303, and is clamped with the circuit board 300, so as to realize the positioning of the optical fiber bracket 500 in the length direction of the optical module.
  • the first clamping part 5011 protrudes downward relative to the first supporting surface 5012, and the first supporting surface 5012 contacts the upper surface of the circuit board 300 to realize the installation and positioning of the optical fiber bracket 500 on the circuit board 300.
  • the optical fiber bracket 500 is at the height of the optical module.
  • Direction is fixed.
  • the first clamping portion 5011 is inserted into the third limiting opening 303 to realize the fixing of the optical fiber bracket 500 in the length direction of the optical module.
  • the second limiting part 502 is provided with a second clamping part 5021 , which is embedded in the fourth limiting opening 304 and clamped with the circuit board 300 to realize the fixing of the optical fiber bracket 500 in the length direction of the optical module.
  • the second clamping portion 5021 protrudes downward relative to the second supporting surface 5022, and the second supporting surface 5022 contacts the upper surface of the circuit board 300 to realize the installation and positioning of the optical fiber bracket 500 on the circuit board 300.
  • the optical fiber bracket 500 is at the height of the optical module. Direction is fixed.
  • the second clamping portion 5021 is inserted into the fourth limiting opening 304 to realize the fixing of the optical fiber bracket 500 in the length direction of the optical module.
  • the lower surface of the optical fiber support 500 is further provided with a first support portion 503 and a second support portion 504, which are connected to the upper surface of the circuit board 300.
  • the contact connection realizes the fixing of the optical fiber support 500 in the height direction of the optical module.
  • the first supporting portion 503 and the second supporting portion 504 have a flat supporting top surface and are configured to contact and connect with the upper surface of the circuit board 300 .
  • the ends of the first support part 503 and the second support part 504 are at the same height. And the ends of the first supporting portion 503 and the second supporting portion 504 are at the same height as the first supporting surface 5012 and the second supporting surface 5022 .
  • the fixing of the optical fiber bracket 500 in the height direction of the optical module is realized by contacting and connecting the first support portion 503 and the second support portion 504 with the upper surface of the circuit board 300 .
  • the clamping connection between the first limiting part 501 , the second limiting part 502 and the third limiting opening 303 and the fourth limiting opening 304 realizes the fixed connection between the optical fiber support 500 and the circuit board 300 .
  • the first supporting portion 503 and the second supporting portion 504 are in contact with the upper surface of the circuit board 300, and the first locking portion 5011 is inserted into the third limiting opening 303 to be engaged with the circuit board 300; the second locking portion 5021 Embedded in the fourth limiting port 304, and clamped with the circuit board 300, to realize the fixing of the optical fiber bracket 500 in the height direction of the optical module.
  • the first supporting part 503 and the second supporting part 504 are contacted and connected with the upper surface of the circuit board 300; Fixing, fixing the fiber support 500 on the circuit board 300 .
  • One end of the side of the fiber support 500 is provided with a first mounting slot 505 corresponding to the position of the first limiting opening 301 on the circuit board 300 , and is clamped and connected with the first limiting post 2025 .
  • One end of the other side of the fiber optic bracket 500 is provided with a second mounting slot 506 corresponding to the position of the second limiting opening 302 on the circuit board 300 , and is clamped and connected with the second limiting post 2026 .
  • the arrangement of the first installation slot 505 and the second installation slot 506 realizes the positioning of the fiber support 500 in the longitudinal direction of the lower housing 202 .
  • the circuit board 300 is provided with a plurality of photoelectric chips such as DSP.
  • the lower surface of the fiber optic bracket 500 is provided with photoelectric avoidance grooves, DSP, etc.
  • the chip is arranged in the photoelectric escape groove.
  • the optical fiber support 500 is disposed above the DSP, and the distance between the optical fiber support 500 and the circuit board 300 is relatively small, and the reduced space is conducive to the miniaturization of optical modules.
  • the lower surface of the fiber holder 500 is provided with a fiber groove, which is configured to fix the outgoing fiber of the light source transmitter 410 .
  • Both the fiber support 500 and the fixing frame 430 are arranged above the circuit board 300 , and the fiber support 500 is located on one side of the fixing frame 430 .
  • the projection of the fiber support 500 on the circuit board 300 does not coincide with the projection of the fixing frame 430 on the circuit board 300 .
  • the fixing frame 430 is close to the side of the optical port 205
  • the fiber holder 500 is also close to the side of the optical port 205 .
  • the seventh fixing hole 310 and the fifth installation through hole 20211 are located outside the projection of the fiber support 500 on the circuit board 300 , near the optical port 205 .
  • Figure 23 is a second schematic diagram of a partial structure of an optical module according to some embodiments
  • Figure 24 is a schematic cross-sectional view of a partial structure of an optical module according to some embodiments.
  • the sub-circuit board 420 is provided with a first connector 423, which is located on the lower surface of the sub-circuit board 420, and the opening faces One side of the light source emitter 410 .
  • the circuit board 300 is provided with a second connector 305 , the opening orientation of which is consistent with that of the first connector.
  • the first connector 423 and the second connector 305 are connected by a flexible circuit board 440 .
  • One end of the circuit board 300 is provided with a gold finger, which is connected to the host computer through the gold finger, receives the electrical signal of the host computer, transmits it to the sub-circuit board 420 through the flexible circuit board 440, and passes through the sub-circuit board 420 to power on the pin and the light source transmitter 410 external pin connection to realize signal transmission.
  • the first connector 423 is located outside the fixing frame, and the projection of the first connector 423 on the circuit board 300 is the same as the projection of the second connector 305 on the circuit board 300 The positions along the length direction of the optical module are consistent.
  • the lower surface of the sub-circuit board 420 is close to the upper surface of the circuit board 300 . After installation, the gap between the lower surface of the sub-circuit board 420 and the upper surface of the circuit board 300 is small, which is not conducive to the installation of electrical connectors. Therefore, in the present disclosure, the second connector 305 is disposed on the lower surface of the circuit board 300 , the first connector 423 is disposed on the upper surface of the sub-circuit board 420 , and the flexible circuit board 440 wraps the outside of the light source emitter 410 . In some embodiments of the present disclosure, the flexible circuit board 440 covers the outside of the optical fiber connector of the light source transmitter 410 . The flexible circuit board 440 has better flexibility and is convenient for installation.
  • the second fixing hole 2016 is connected with the second connection through hole on the base 4312 connection
  • the fixing frame 430 on which the light source emitter 410 and the sub-circuit board 420 are installed is connected to the upper casing 201 .
  • the first support portion 503 and the second support portion 504 are connected in contact with the upper surface of the circuit board 300, the first clamping portion 5011 is embedded in the third limit opening 303 and clamped with the circuit board 300; the second clamping portion 5021 is embedded in the fourth limit
  • the slot 304 is clamped with the circuit board 300 to realize the fixing of the optical fiber bracket 500 in the height direction of the optical module.
  • the first supporting part 503 and the second supporting part 504 are contacted and connected with the upper surface of the circuit board 300; fixed.
  • Screws penetrate from the top of the seventh fixing hole 310 on the circuit board 300 to connect with the fifth installation through hole 20211 to fix the circuit board 300 inside the lower casing.
  • One end of the flexible circuit board 440 is connected to the second connector on the lower surface of the circuit board 300, and the other end is connected to the first connector on the upper surface of the sub-circuit board 420 bypassing the light source emitter 410, so as to realize the connection between the circuit board 300 and the sub-circuit board. Electrical connection between 420. Then connect the upper case to the lower case.
  • the present disclosure discloses an optical module, including: a light source emitter 410 disposed above a circuit board and configured to emit light.
  • the sub-circuit board 420 is disposed above the circuit board 300 and is electrically connected to the circuit board 300 through a flexible circuit board.
  • the light source emitter 410 is electrically connected to the sub-circuit board 420 , and the sub-circuit board 420 drives the light source emitter 410 .
  • the light source emitter 410 fixing frame 430 is disposed above the circuit board and is configured to fix the light source emitter 410 .
  • the light source emitter 410 is fixed on the fixing frame 430 of the light source emitter 410 , and a plurality of pins are provided on one side to connect with the sub-circuit board 420 .
  • the light source emitter 410 fixing frame 430 is also connected with the upper casing 201, the light source emitter 410 is fixed on the upper casing 201 through the light source emitter 410 fixing frame 430, and the heat emitted by it can be directly transferred by the light source emitter 410 fixing frame 430
  • the upper casing 201 improves the heat dissipation function of the optical module.
  • the bracket 432 includes: a supporting column 4321 and a pressing plate 4322 , the supporting column 4321 is disposed under the base 431 , one end is connected to the base 431 , and the other end is connected to the pressing plate 4322 .
  • the upper surface of the pressing plate 4322 is connected to the light source emitter 410 , and the light source emitter 410 is fixed between the pressing plate 4322 and the base 431 to realize the fixing of the light source emitter 410 .
  • the heat generated by the light source emitter 410 is directly transferred to the upper casing 201 through the base 431 , and then transferred to the cage for heat dissipation.

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Abstract

一种光模块（200），包括上壳体（201）、下壳体（202）、电路板（300）、子电路板（420）和固定部（4314）。上壳体（201）与下壳体（202）盖合形成包裹腔体；电路板（300）设置于包裹腔体内，与下壳体（202）固定连接，电路板（300）的下表面设置第二连接器（305）；子电路板（420）设置于电路板（300）的上方，其上表面设置第一连接器（423），第一连接器（423）与第二连接器（305）通过柔性电路板（440）连接；固定部（4314）吊装于上壳体（201）内壁下方，且子电路板（420）设置于固定部（4314）下方。

Description

光模块
本公开要求在2021年11月12日提交中国专利局、申请号为202111342027.5，在2021年11月12日提交中国专利局、申请号为202122784337.4的专利优先权，其全部内容通过引用结合在本公开中。
技术领域
本公开涉及光通信技术领域，尤其涉及一种光模块。
背景技术
随着云计算、移动互联网、视频等新型业务和应用模式发展，光通信技术的发展进步变得愈加重要。而在光通信技术中，光模块是实现光电信号相互转换的工具，是光通信设备中的关键器件之一，并且随着光通信技术发展的需求，光模块的传输速率不断提高。
随着器件小型化，光模块内部各光电器件分布更加紧密、占用空间较小。
发明内容
第一方面，公开了一种光模块。所述光模块包括：上壳体、下壳体、电路板、子电路板和固定部。所述下壳体与所述上壳体盖合形成包裹腔体；所述电路板设置于所述包裹腔体内，且与所述下壳体固定连接，所述电路板的下表面设置第二连接器；所述子电路板设置于所述电路板的上方，其上表面设置第一连接器；所述第一连接器与所述第二连接器通过柔性电路板连接；所述固定部吊装于所述上壳体内壁下方，所述子电路板设置于所述固定部下方。
第二方面，公开了一种光模块。所述光模块包括：上壳体、下壳体、电路板、光源安装部、支撑柱、压板和光源发射器。所述下壳体与所述上壳体盖合形成包裹腔体；所述电路板设置于所述包裹腔体内；所述光源安装部与所述上壳体连接；所述支撑柱设置于所述光源安装部的下方，一端与所述光源安装部连接；所述压板的一端与所述支撑柱的另一端连接；所述光源发射器设置于所述光源安装部与所述压板之间。
第三方面，公开了一种光模块。所述光模块包括：上壳体、下壳体、电路板、光源发射器、子电路板、底座、支撑柱和压板。所述下壳体与所述上壳体盖合形成包裹腔体；所述电路板设置于所述包裹腔体内；所述光源发射器设置于所述包裹腔体内；所述子电路板设置于所述光源发射器的一侧，且与所述光源发射器连接；所述底座与所述上壳体固定连接，且另一侧与所述子电路板和所述光源发射器连接；所述支撑柱设置于所述底座的下方，且一端与所述底座连接；所述压板的一端与所述支撑柱的另一端连接；所述光源发射器设置于所述底座与所述压板之间。
附图说明
为了更清楚地说明本公开中的技术方案，下面将对本公开一些实施例中所需要使用的附 图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例的附图，对于本领域普通技术人员来讲，还可以根据这些附图获得其他的附图。此外，以下描述中的附图可以视作示意图，并非对本公开实施例所涉及的产品的实际尺寸、方法的实际流程、信号的实际时序等的限制。
图1为根据一些实施例的一种光通信***的连接关系图；
图2为根据一些实施例的一种光网络终端的结构图；
图3为根据一些实施例的一种光模块的结构图；
图4为根据一些实施例的一种光模块的分解图；
图5为根据一些实施例的一种光源发射器与电路板的分解示意图；
图6为根据一些实施例的一种光模块的局部剖面图；
图7为根据一些实施例的一种上壳体与光发射部件的结构示意图；
图8为根据一些实施例的一种上壳体的结构示意图；
图9为根据一些实施例的一种光源发射器的结构示意图；
图10为根据一些实施例的一种光源发射器的另一角度结构示意图；
图11为根据一些实施例的一种光源发射器的分解结构示意图；
图12为根据一些实施例的子电路板与光源的分解结构示意图；
图13为根据一些实施例的一种固定架的分解结构示意图；
图14为根据一些实施例的一种固定架的另一角度分解示意图；
图15为根据一些实施例的上壳体的另一角度结构示意图；
图16为根据一些实施例的上壳体与固定架的分解结构示意图；
图17为根据一些实施例的上壳体、光源发射器与光纤适配器的结构示意图；
图18为根据一些实施例的一种电路板与下壳体的结构示意图；
图19为根据一些实施例的一种电路板与下壳体的分解结构示意图；
图20为根据一些实施例的一种固定架、光纤支架与电路板的结构示意图；
图21为根据一些实施例的光纤支架与电路板的拆分结构示意图；
图22为根据一些实施例的一种光纤支架的另一角度结构示意图；
图23为根据一些实施例的光模块的局部结构示意图二；
图24为根据一些实施例的光模块局部结构的剖面示意图。
具体实施方式
下面将结合附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开所提供的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
除非上下文另有要求，否则，在整个说明书和权利要求书中，术语“包括(comprise)”及其其他形式例如第三人称单数形式“包括(comprises)”和现在分词形式“包括(comprising)”被解释为开放、包含的意思，即为“包含，但不限于”。在说明书的描述中，术语“一个实施 例(one embodiment)”、“一些实施例(some embodiments)”、“示例性实施例(exemplary embodiments)”、“示例(example)”、“特定示例(specific example)”或“一些示例(some examples)”等旨在表明与该实施例或示例相关的特定特征、结构、材料或特性包括在本公开的至少一个实施例或示例中。上述术语的示意性表示不一定是指同一实施例或示例。此外，所述的特定特征、结构、材料或特点可以以任何适当方式包括在任何一个或多个实施例或示例中。
以下，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本公开实施例的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在描述一些实施例时，可能使用了“耦接”和“连接”及其衍伸的表达。例如，描述一些实施例时可能使用了术语“连接”以表明两个或两个以上部件彼此间有直接物理接触或电接触。又如，描述一些实施例时可能使用了术语“耦接”以表明两个或两个以上部件有直接物理接触或电接触。然而，术语“耦接”或“通信耦合(communicatively coupled)”也可能指两个或两个以上部件彼此间并无直接接触，但仍彼此协作或相互作用。这里所公开的实施例并不必然限制于本文内容。
“A、B和C中的至少一个”与“A、B或C中的至少一个”具有相同含义，均包括以下A、B和C的组合：仅A，仅B，仅C，A和B的组合，A和C的组合，B和C的组合，及A、B和C的组合。
“A和/或B”，包括以下三种组合：仅A，仅B，及A和B的组合。
本文中“被配置为”的使用意味着开放和包容性的语言，其不排除被配置为执行额外任务或步骤的设备。
如本文所使用的那样，“约”、“大致”或“近似”包括所阐述的值以及处于特定值的可接受偏差范围内的平均值，其中所述可接受偏差范围如由本领域普通技术人员考虑到正在讨论的测量以及与特定量的测量相关的误差(即，测量***的局限性)所确定。
光通信技术中，使用光携带待传输的信息，并使携带有信息的光信号通过光纤或光波导等信息传输设备传输至计算机等信息处理设备，以完成信息的传输。由于光信号通过光纤或光波导中传输时具有无源传输特性，因此可以实现低成本、低损耗的信息传输。此外，光纤或光波导等信息传输设备传输的信号是光信号，而计算机等信息处理设备能够识别和处理的信号是电信号，因此为了在光纤或光波导等信息传输设备与计算机等信息处理设备之间建立信息连接，需要实现电信号与光信号的相互转换。
光模块在光纤通信技术领域中实现上述光信号与电信号的相互转换功能。光模块包括光口和电口，光模块通过光口实现与光纤或光波导等信息传输设备的光通信，通过电口实现与光网络终端(例如，光猫)之间的电连接，电连接主要被配置为实现供电、I2C信号传输、数据信号传输以及接地等；光网络终端通过网线或无线保真技术(Wi-Fi)将电信号传输给计算机等信息处理设备。
图1为根据一些实施例的一种光通信***的连接关系图。如图1所示，光通信***主要包括远端服务器1000、本地信息处理设备2000、光网络终端100、光模块200、光纤101及网线103。
光纤101的一端连接远端服务器1000，另一端通过光模块200与光网络终端100连接。光纤本身可支持远距离信号传输，例如数千米(6千米至8千米)的信号传输，在此基础上如果使用中继器，则理论上可以实现超长距离传输。因此在通常的光通信***中，远端服务器1000与光网络终端100之间的距离通常可达到数千米、数十千米或数百千米。
网线103的一端连接本地信息处理设备2000，另一端连接光网络终端100。本地信息处理设备2000可以为以下设备中的任一种或几种：路由器、交换机、计算机、手机、平板电脑、电视机等。
远端服务器1000与光网络终端100之间的物理距离大于本地信息处理设备2000与光网络终端100之间的物理距离。本地信息处理设备2000与远端服务器1000的连接由光纤101与网线103完成；而光纤101与网线103之间的连接由光模块200和光网络终端100完成。
光模块200包括光口和电口。光口被配置为与光纤101连接，从而使得光模块200与光纤101建立双向的光信号连接；电口被配置为接入光网络终端100中，从而使得光模块200与光网络终端100建立双向的电信号连接。光模块200实现光信号与电信号的相互转换，从而使得光纤101与光网络终端100之间建立连接。示例的，来自光纤101的光信号由光模块200转换为电信号后输入至光网络终端100中，来自光网络终端100的电信号由光模块200转换为光信号输入至光纤101中。
光网络终端100包括大致呈长方体的壳体(housing)，以及设置在壳体上的光模块接口102和网线接口104。光模块接口102被配置为接入光模块200，从而使得光网络终端100与光模块200建立双向的电信号连接；网线接口104被配置为接入网线103，从而使得光网络终端100与网线103建立双向的电信号连接。光模块200与网线103之间通过光网络终端100建立连接。示例的，光网络终端100将来自光模块200的电信号传递给网线103，将来自网线103的信号传递给光模块200，因此光网络终端100作为光模块200的上位机，可以监控光模块200的工作。光模块200的上位机除光网络终端100之外还可以包括光线路终端(Optical Line Terminal，OLT)等。
远端服务器1000通过光纤101、光模块200、光网络终端100及网线103，与本地信息处理设备2000之间建立了双向的信号传递通道。
图2为根据一些实施例的一种光网络终端的结构图，为了清楚地显示光模块200与光网络终端100的连接关系，图2仅示出了光网络终端100的与光模块200相关的结构。如图2所示，光网络终端100中还包括设置于壳体内的PCB电路板105，设置在PCB电路板105的表面的笼子106，以及设置在笼子106内部的电连接器。电连接器被配置为接入光模块200的电口；散热器107具有增大散热面积的翅片等凸起部。
光模块200***光网络终端100的笼子106中，由笼子106固定光模块200，光模块200产生的热量传导给笼子106，然后通过散热器107进行扩散。光模块200***笼子106中后， 光模块200的电口与笼子106内部的电连接器连接，从而光模块200与光网络终端100建立双向的电信号连接。此外，光模块200的光口与光纤101连接，从而光模块200与光纤101建立双向的电信号连接。
图3为根据一些实施例的一种光模块的结构图，图4为根据一些实施例的一种光模块的分解图。如图3和图4所示，光模块200包括壳体、设置于壳体中的电路板300。
壳体包括上壳体201和下壳体202，上壳体201盖合在下壳体202上，以形成具有两个开口204和205的上述壳体；壳体的外轮廓一般呈现方形体。
在本公开一些实施例中，下壳体202包括底板以及位于底板两侧、与底板垂直设置的两个下侧板；上壳体201包括盖板，以及位于盖板两侧与盖板垂直设置的两个上侧板，由两个侧壁与两个侧板结合，以实现上壳体201盖合在下壳体202上。
两个开口204和205的连线所在方向可以与光模块200的长度方向一致，也可以与光模块200的长度方向不一致。示例地，开口204位于光模块200的端部(图3的右端)，开口205也位于光模块200的端部(图3的左端)。或者，开口204位于光模块200的端部，而开口205则位于光模块200的侧部。其中，开口204为电口，电路板300的金手指从电口204伸出，***上位机(如光网络终端100)中；开口205为光口，配置为接入外部的光纤101，以使光纤101连接光模块200的内部。
采用上壳体201、下壳体202结合的装配方式，便于将电路板300等器件安装到壳体中，由上壳体201、下壳体202可以对这些器件形成封装保护。此外，在装配电路板300等器件时，便于这些器件的定位部件、散热部件以及电磁屏蔽部件的部署，有利于自动化的实施生产。
在一些实施例中，上壳体201及下壳体202一般采用金属材料制成，利于实现电磁屏蔽以及散热。
在一些实施例中，光模块200还包括位于其壳体外壁的解锁部件203，解锁部件203被配置为实现光模块200与上位机之间的固定连接，或解除光模块200与上位机之间的固定连接。
示例地，解锁部件203位于下壳体202的两个下侧板的外壁，包括与上位机的笼子(例如，光网络终端100的笼子106)匹配的卡合部件。当光模块200***上位机的笼子里，由解锁部件203的卡合部件将光模块200固定在上位机的笼子里；拉动解锁部件203时，解锁部件203的卡合部件随之移动，进而改变卡合部件与上位机的连接关系，以解除光模块200与上位机的卡合关系，从而可以将光模块200从上位机的笼子里抽出。
电路板300包括电路走线、电子元件及芯片，通过电路走线将电子元件和芯片按照电路设计连接在一起，以实现供电、电信号传输及接地等功能。电子元件例如可以包括电容、电阻、三极管、金属氧化物半导体场效应管(Metal-Oxide-Semiconductor Field-Effect Transistor，MOSFET)。芯片例如可以包括微控制单元(Microcontroller Unit，MCU)、限幅放大器(limiting amplifier)、时钟数据恢复芯片(Clock and Data Recovery，CDR)、电源管理芯片、数字信号处理(Digital Signal Processing，DSP)芯片。
电路板300一般为硬性电路板，硬性电路板由于其相对坚硬的材质，还可以实现承载作用，如硬性电路板可以平稳地承载芯片；硬性电路板还可以***上位机笼子中的电连接器中。
电路板300还包括形成在其端部表面的金手指，金手指由相互独立的多个引脚组成。电路板300***笼子106中，由金手指与笼子106内的电连接器导通连接。金手指可以仅设置在电路板300一侧的表面(例如图4所示的上表面)，也可以设置在电路板300上下两侧的表面，以适应引脚数量需求大的场合。金手指被配置为与上位机建立电连接，以实现供电、接地、I2C信号传递、数据信号传递等。当然，部分光模块中也会使用柔性电路板。柔性电路板一般与硬性电路板配合使用，以作为硬性电路板的补充。
光收发器件包括光发射次模块及光接收次模块。
图3为根据一些实施例的一种光模块的结构图，图4为根据一些实施例的一种光模块的分解图。如图3和图4所示，光模块200包括壳体、设置于壳体中的电路板300及光收发器件。
壳体包括上壳体201和下壳体202，上壳体201盖合在下壳体202上，以形成具有两个开口204和205的上述壳体；壳体的外轮廓一般呈现方形体。
在本公开一些实施例中，下壳体202包括底板以及位于底板两侧、与底板垂直设置的两个下侧板；上壳体201包括盖板，以及位于盖板两侧与盖板垂直设置的两个上侧板，由两个侧壁与两个侧板结合，以实现上壳体201盖合在下壳体202上。
两个开口204和205的连线所在方向可以与光模块200的长度方向一致，也可以与光模块200的长度方向不一致。示例地，开口204位于光模块200的端部(图3的左端)，开口205也位于光模块200的端部(图3的右端)。或者，开口204位于光模块200的端部，而开口205则位于光模块200的侧部。其中，开口204为电口，电路板300的金手指从电口204伸出，***上位机(如光网络终端100)中；开口205为光口，配置为接入外部的光纤101，以使光纤101连接光模块200内部的光收发器件。
采用上壳体201、下壳体202结合的装配方式，便于将电路板300、光收发器件等器件安装到壳体中，由上壳体201、下壳体202可以对这些器件形成封装保护。此外，在装配电路板300等器件时，便于这些器件的定位部件、散热部件以及电磁屏蔽部件的部署，有利于自动化的实施生产。
在一些实施例中，上壳体201及下壳体202一般采用金属材料制成，利于实现电磁屏蔽以及散热。
在一些实施例中，光模块200还包括位于其壳体外壁的解锁部件203，解锁部件203被配置为实现光模块200与上位机之间的固定连接，或解除光模块200与上位机之间的固定连接。
示例地，解锁部件203位于下壳体202的两个下侧板的外壁，包括与上位机的笼子(例如，光网络终端100的笼子106)匹配的卡合部件。当光模块200***上位机的笼子里，由解锁部件203的卡合部件将光模块200固定在上位机的笼子里；拉动解锁部件203时，解锁部件203的卡合部件随之移动，进而改变卡合部件与上位机的连接关系，以解除光模块200 与上位机的卡合关系，从而可以将光模块200从上位机的笼子里抽出。
电路板300包括电路走线、电子元件及芯片，通过电路走线将电子元件和芯片按照电路设计连接在一起，以实现供电、电信号传输及接地等功能。电子元件例如可以包括电容、电阻、三极管、金属氧化物半导体场效应管(Metal-Oxide-Semiconductor Field-Effect Transistor，MOSFET)。芯片例如可以包括微控制单元(Microcontroller Unit，MCU)、限幅放大器(limiting amplifier)、时钟数据恢复芯片(Clock and Data Recovery，CDR)、电源管理芯片、数字信号处理(Digital Signal Processing，DSP)芯片。
电路板300一般为硬性电路板，硬性电路板由于其相对坚硬的材质，还可以实现承载作用，如硬性电路板可以平稳地承载芯片；硬性电路板还可以***上位机笼子中的电连接器中。
电路板300还包括形成在其端部表面的金手指，金手指由相互独立的多个引脚组成。电路板300***笼子106中，由金手指与笼子106内的电连接器导通连接。金手指可以仅设置在电路板300一侧的表面(例如图4所示的上表面)，也可以设置在电路板300上下两侧的表面，以适应引脚数量需求大的场合。金手指被配置为与上位机建立电连接，以实现供电、接地、I2C信号传递、数据信号传递等功能。当然，部分光模块中也会使用柔性电路板。柔性电路板一般与硬性电路板配合使用，以作为硬性电路板的补充。
光收发器件包括光发射次模块及光接收次模块。
图5为根据一些实施例的一种光源发射器与电路板的分解示意图。图6为根据一些实施例的一种光模块局部剖面图。如图5和图6所示，光模块中设有光源发射器410，设置于电路板300的上方，被配置为发射光，一端与出射光纤连接。子电路板420，设置于电路板300的上方，与电路板300通过柔性电路板440电连接。光源发射器410与子电路板420电连接，子电路板420对光源发射器410内光电器件的驱动。固定架430，设置于电路板300的上方，被配置为固定光源发射器410。光源发射器410固定于固定架430上，一侧设有多个引脚与子电路板420连接。固定架430还与上壳体连接，光源发射器410通过固定架430固定在上壳体上，其散发的热量可直接由固定架传递至上壳体，提高光模块的散热功能。
在本公开实施例中，光源发射器可以是光源，发射不带信号的光，硅光芯片接收光源发出的光加载信号，形成信号光。
在本公开实施例中，光源发射器设置于电路板的上方，被配置为发射光。子电路板420，设置于电路板300的上方，与电路板300通过柔性电路板电连接。光源与子电路板420电连接，子电路板420对光源驱动。固定架430，设置于电路板的上方，被配置为固定光源。固定架430还与上壳体201连接，光源发射器410通过固定架430固定在上壳体201上，其散发的热量可直接由固定架传递至上壳体，提高光模块的散热功能。
图7为根据一些实施例的一种上壳体与光发射部件的结构示意图，图8为根据一些实施例的一种上壳体的结构示意图，图9为根据一些实施例的一种光源发射器的结构示意图，如图7、图8和图9所示，上壳体201包括：盖板2011，以及位于盖板2011两侧与盖板垂直设置的两个第一上侧板2012和第二上侧板2013。盖板2011设有支架安装槽2014，相对于盖板2011的下表面凹陷。支架安装槽2014与固定架的上表面相匹配，固定架430安装于支架安 装槽2014内部。支架安装槽2014上设有第一固定孔2015，位于支架安装槽2014的一角，与固定架430上第一连接通孔4311位置对应；支架安装槽2014上还设有第二固定孔2016，位于支架安装槽2014的另一角，与底座上第二连接通孔4312位置对应。
为方便固定架430与上壳体201的连接和固定，提高连接稳定性，第一固定孔2015和第二固定孔2016位于支架安装槽的对角位置，便于安装和稳定。
固定架430包括：底座和支架。底座为长方板状结构，一侧面为平面结构，与上壳体连接，被配置为固定；另一侧面设有多个避让凹槽，被配置为光源和子电路板420的固定安装。支架包括：支撑柱和压板，支撑柱设置于底座下方，一端与底座连接，另一端与压板连接。压板的一侧与光源连接，将光源固定于压板与底座之间。
在本公开实施例中，光源发射器410可以是常见的长方体结构外壳，其内设置光源发射器，一端连接有出射光纤。光源发射器410的上表面与底座的下表面连接，下表面与压板的上表面连接。光源发射器410的一侧表面设有多个金属引脚，与子电路板420连接，实现光源与子电路板420的固定及电连接，且金属引脚朝向子电路板420一侧设置，减小引脚与子电路板420之间的距离，增加连接稳定性。
图10为根据一些实施例的一种光源发射器的另一角度结构示意图，图11为根据一些实施例的一种光源发射器的分解结构示意图。结合图10和图11，在本公开实施例中，固定架430包括：底座431和支架432。底座431为长方板状结构，一侧面为平面结构，与上壳体连接，被配置为固定；另一侧面被配置为光源发射器410和子电路板420的固定安装。支架432包括：支撑柱4321和压板4322，支撑柱4321设置于底座431下方，一端与底座431连接，另一端与压板4322连接。压板4322的一侧与光源连接，将光源固定于压板4322与底座431之间。
为方便光源在底座431的限位，底座431的下表面的一侧包括光源安装部4313，与光源匹配安装。底座431包括固定部4314，与子电路板420固定连接。固定部4314设置于光源安装部4313的一侧。
底座431的上表面与上壳体201连接，下表面设置有光源发射器410和子电路板420，其中光源发射器410设置于压板4322与底座431之间，子电路板420设置于光源发射器410的一侧，与子电路板420通过引脚连接。光源发射器410产生的热量直接通过底座431传导至上壳体201，而后传递至笼子进行散热。
为实现底座431与上壳体201的固定连接，底座431设有多个连接通孔，通过螺钉与上壳体201连接。上壳体201相对位置设置固定孔，与连接通孔位置对应，连接时，通过螺钉穿过固定孔与连接通孔连接。连接通孔可以是具有螺纹的螺纹孔，螺钉与连接通孔连接。
光模块中设有多个光电器件，为实现光电器件之间光的传播，设有多条光纤。为方便光纤的安装、减少光损耗，光纤的长度远远大于光电元器件之间的距离。为提高光纤的稳定性，光模块中还设有光纤支架，设置于电路板的上方，光纤支架的上方设有光纤槽，光纤固定于光纤槽内。
子电路板420的上表面与下表面均设有多个电子元器件，且各电子元器件的大小、高度 等不完全一致，为方便光源发射器410的出射光纤角度的设置，固定部4314设有多个避让凹陷43141，被配置为电子元器件的避让安装，使得安装后子电路板420与电路板300保持平行或基本平行。
为了底座431与子电路板420之间的固定，底座431设有第三连接通孔4315，位于固定部4314的一侧，被配置为与子电路板420固定。底座431还设有第四连接通孔4316，位于固定部4314的另一侧，被配置为与子电路板420固定。子电路板420上设有第三固定孔421，与第三连接通孔4315位置匹配。第三固定孔421与第三连接通孔4315通过螺钉连接。子电路板420上设有第四固定孔422，与第四连接通孔4316位置匹配。第四固定孔422与第四连接通孔4316通过螺钉连接。
在本公开的某一些实施例中，第三固定孔421与第四固定孔422设置于电路板的对角位置，实现子电路板420与底座431之间平行于电路板平面方向的定位。第三固定孔421临近支架432设置，可以是圆形通孔，可也以是避让孔的形式。
图12为根据一些实施例的子电路板与光源的分解结构示意图。结合图11和图12所示，子电路板420设有安装避让部424，光源发射器410设置于安装避让部424处。光源发射器410的上表面与底座接触，光源发射器410靠近光口的一端与支架432接触，另一端与安装避让部424的拐角位置连接。光源发射器410的一侧通过多个引脚411与子电路板420连接。在本公开的某一些实施例中，光源发射器410的一侧通过引脚与子电路板420的上表面连接。
图13为根据一些实施例的一种固定架的分解结构示意图。图14为根据一些实施例的一种固定架的另一角度分解示意图。结合图12和图13所示，在本公开的一些实施例中，底座431与支架432可以是一体成型的结构，压板4322的上表面与光源发射器410的下表面连接。在本公开的某一些实施例中，底座431与支架432是分离的结构，如图所示。支架432包括支撑柱4321和压板4322，支撑柱4321设置于底座431下方，一端与底座431连接，另一端与压板4322连接。压板4322的上表面与光源发射器410连接，将光源发射器410固定于压板4322与底座431之间。支撑柱4321设有固定螺纹孔43211，底座431相应位置设有连接孔4317。
安装时，先利用螺钉连接将第三连接通孔4315与第三固定孔421、第三连接通孔4315与第三固定孔421连接，实现子电路板420与底座431的连接固定。然后将光源发射器410安装于压板4322与底座431的光源发射器410安装槽之间，再利用螺钉将支撑柱4321与底座431连接，利用压板4322将光源发射器410固定在底座431上。将底座431安放于支架432安装槽内，利用螺钉连接将第一连接通孔与第一固定孔、第二连接通孔与第二固定孔连接，实现光源发射器410固定架430与上壳体201之间的连接。最终将光源发射器410固定于光源发射器410固定架430上，再将光源发射器410固定架430固定于上壳体201的下表面，实现光源发射器410在光模块内部的安装固定，且光源发射器410通过底座431与上壳体201连接，光源发射器410散发的热量通过底座431传递至上壳体201，提高散热效果。
为方便热量的传导，底座431的材料包括但不限于钨铜、可筏合金、SPCC(Steel Plate Cold rolled Commercial，冷轧碳钢)、铜等，便于将光电器件产生的热量传递至底座431。光源发 射器410是光模块中最主要的产热源，本公开中将光源发射器410设置于底座431，通过底座431与上壳体201，便于将光源发射器410产生的热量由底座431直接传导至上壳体201。上壳体201外部与笼子连接，具有散热通道，增加热传导效率的功能。
在本公开的一些实施例中，为方便维修，压板4322与光源发射器410之间设有垫片4323。压板4322的上表面设有承压部43221和承接部43222，承接部43222设置于承压部43221与支撑柱4321之间，实现承压部43221与支撑柱4321之间的连接。承压部43221的上表现与垫片4323下表面连接，垫片4323的下表面与光源发射器410连接。承压部43221的上表面低于承接部43222的上表面，因此承压部43221和承接部43222之间存在一个台阶面，垫片4323的一端与台阶面接触，实现对垫片4323的定位。
在本公开的某一些实施例中，垫片4323的上表面高度不低于承接部43222的上表面高度。为方便维修拆卸，垫片4323的上表面高度高于承接部43222的上表面高度，使得光源发射器410与垫片4323上表面连接，而光源发射器410与承接部43222之间存在一定的缝隙，避免安装时支撑柱4321与底座431之间的螺钉受力过大，压板4322对光源发射器410的压力过大，避免压板4322折断。
安装时，先利用螺钉连接将第三连接通孔4315与第三固定孔421、第三连接通孔4315与第三固定孔421连接，实现子电路板420与底座431的连接固定。将光源发射器410安装于压板4322与底座431的光源发射器410安装槽之间，垫片4323安装于压板4322与光源发射器410之间，再利用螺钉将支撑柱4321与底座431连接，利用压板4322将光源发射器410固定在底座431上。将底座431安放于支架432安装槽内，利用螺钉连接将第一连接通孔与第一固定孔、第二连接通孔与第二固定孔连接，实现光源发射器410固定架430与上壳体201之间的连接。最终将光源发射器410固定于光源发射器410固定架430上，再将光源发射器410固定架430固定于上壳体201下表面，实现光源发射器410在光模块内部的安装固定，且光源发射器410通过底座431与上壳体201连接，光源发射器410散发的热量通过底座431传递至上壳体201，提高散热效果。拆卸时，仅需将支撑柱4321与底座431连接的螺钉拧开数圈，垫片4323在压板4322与光源发射器410之间产生松动，即可将垫片4323取出，光源发射器410与底座431之间的连接即可解除。因此，在维修、替换光源发射器410时仅需支撑柱4321与底座431连接的螺钉拧松，即可取出光源发射器410，方便快捷。
为实现子电路板420与电路板300之间的电连接，子电路板420上设有第一连接器，位于子电路板420的下表面，开口朝向远离光源发射器410的一侧。电路板300设置有第二连接器，开口朝向与第一连接器的开口朝向一致。第一连接器与第二连接器之间采用柔性电路板连接。电路板300的一端设有金手指，通过金手指与上位机连接，接收上位机的电信号，经柔性电路板传递至子电路板420，经过子电路板420上电引脚与光源发射器410的外接引脚连接，实现信号传递。
光源发射器410产生的热量经底座431传递至上壳体201，再通过底座431与上壳体201连接，光源发射器410散发的热量通过底座431传递至上壳体201，提高散热效果。为实现光源发射器410的散热，光源发射器410的外壳的材料包括但不限于钨铜、可筏合金、SPCC (Steel Plate Cold rolled Commercial，冷轧碳钢)、铜等，便于将光电器件产生的热量传递至底座431。
图15为根据一些实施例的上壳体的另一角度结构示意图，图16为根据一些实施例的上壳体与固定架的分解结构示意图，图17为根据一些实施例的上壳体、光源发射器与光纤适配器的结构示意图。如图15、图16和图17中所示，为方便固定架430与上壳体201的连接和固定，提高连接稳定性，固定架430安装于支架安装槽2014内部，底座的上表面接触支架安装槽2014的下表面。第一固定孔2015和第二固定孔2016位于支架安装槽的对角位置，便于安装和稳定。第一固定孔2015和第二固定孔2016在盖板2011上表面为沉孔设置，方便螺钉头部沉入，不凸出于盖板2011表面，使得光模块外观更加整洁，方便与上位机的结构的连接。盖板2011还设有第三固定孔，穿过盖板2011的上表面与下表面，被配置为实现上壳体201与下壳体202的固定。本公开中采用沉头螺钉，从上壳体201的下表面向光模块的内部拧入，固定架430安装于支上壳体201的下表面。
安装时，将子电路板420与底座431通过第三固定孔421与第三连接通孔4315、第四固定孔422与第四连接通孔4316之间的螺钉固定，光源发射器410固定于压板4322与底座431之间，利用螺钉将支撑柱4321与底座431连接。将光源发射器410、子电路板420固定于固定架430上。然后使用螺钉，从上壳体201的下表面向光模块的内部拧入，由第一固定孔2015与第一连接通孔4311连接。同样，第二固定孔2016与底座上第二连接通孔4312连接，将安装有光源发射器410、子电路板420的固定架430与上壳体201连接。
第五固定孔2017设置于支架安装槽2014的一侧，靠近光口位置。为实现上壳体与下壳体受力均匀，第五固定孔到第一上侧板2012的距离，与第五固定孔到第二上侧板2013的距离一致。
为实现光的传输，光模块中设置第一光纤适配器206和第二光纤适配器207，设置于光口205处，第一光纤适配器206靠近光源发射器410设置，为方便第一光纤适配器206的安装，支撑柱4321设置适配避让槽4324，第一光纤适配器206和第二光纤适配器207设置于固定架与电路板300之间。第一光纤适配器206的边缘与适配避让槽4324接触，可实现第一光纤适配器206的避让安装，同时实现对第一光纤适配器206定位，有利于第一光纤适配器的稳定。第一光纤适配器206通过光纤与硅光芯片连接，被配置为将光信号传递至光模块外部。
图18为根据一些实施例的一种电路板与下壳体的结构示意图，图19为根据一些实施例的一种电路板与下壳体的分解结构示意图。结合图18和图19所示，下壳体202包括底板2021以及位于底板两侧、与底板垂直设置的两个下侧板，第一下侧板2022、第二下侧板2023。由两个侧壁与两个侧板结合，以实现上壳体201盖合在下壳体202上。为实现电路板在下壳体的定位，下壳体202设有若干固定台2024，固定台2024具有相同的顶面高度，被配置为支撑电路板。固定台2024的支撑顶面被配置为接触电路板300的下表面，实现对电路板300的支撑及在光模块高度方向的定位。在本公开实施例中，固定台可为下壳体202的内侧壁上凸出且具有支撑顶面的结构。各个固定台的形状可以相同，也可不同。
在本公开的某一些实施例中，为保证电路板300安装的精度，下壳体202的侧壁上还设置第一限位柱2025和第二限位柱2026。第一限位柱2025、第二限位柱2026不仅可以实现电路板300的安装定位，还可以实现电路板300在光模块长度方向的固定。第一限位柱2025、第二限位柱2026在光模块长度方向的位置可以不同，也可以相同。
电路板300的侧边设置第一限位口301，第一限位口301卡设连接第一限位柱2025，电路板300的第二侧边设置第二限位口302，第二限位口302卡设连接第二限位柱2026。在本公开实施例中，第一限位柱2025和第二限位柱2026分别对应第一限位口301和第二限位口302。
为实现电路板300与下壳体的固定，底板2021中部设有第五安装通孔20211，电路板300中设有第七固定孔310。利用螺钉从电路板300的上表面穿过第七固定孔310与第五安装通孔20211连接。因电路板300下表面同样设有多个电子元器件，为实现对电路板的支撑，底板2021中部设有通孔台20212，第五安装通孔20211位于通孔台20212上。电路板300的下表面与通孔台20212接触连接，实现对电路板300的支撑定位。通孔台20212相对于底板2021的内侧壁凸出且具有支撑顶面。
在本公开的某一些实施例中，为方便电路板300的安装，实现电路板300受力均匀，通孔台20212设置于底板2021的中部，通孔台20212到第一下侧板2022的距离，与通孔台20212到第二下侧板2023的距离相同。通孔台20212的端面到底板2021的下表面的距离，大于底板2021上表面到下表面的距离，即通孔台20212的厚度大于底板2021的厚度。螺钉从电路板300上的第七固定孔310的上方穿入，与第五安装通孔20211连接，但不凸出第五安装通孔20211的下端面，保持底板2021下表面的完整性，便于光模块与上位机的连接。
光模块中设有多个光电器件，为实现光电器件之间光的传播，设有多条光纤。为方便光纤的安装、减少光损耗，光纤的长度远远大于光电元器件之间的距离。为提高光纤的稳定性，光模块中还设有光纤支架500，其设置于电路板300的上方，光纤支架的上方设有光纤槽，光纤固定于光纤槽内。
图20为根据一些实施例的一种固定架、光纤支架与电路板的结构示意图，图21为根据一些实施例的光纤支架与电路板的拆分结构示意图。图22为根据一些实施例的一种光纤支架的另一角度结构示意图。结合图20、图21和图22所示，为实现光纤支架500与电路板300的定位安装，光纤支架500的底面一端设有第一限位部501和第二限位部502。电路板300设置第三限位口303，第一限位部501卡设连接第三限位口303。电路板300设置第四限位口304，第二限位部502卡设连接第四限位口304。第一限位部501和第二限位部502不仅可以实现光纤支架500在电路板300的安装定位，还可以实现光纤支架500在光模块高度方向的固定。
在本公开的某一些实施例中，第一限位部501设置第一卡连部5011，其嵌入第三限位口303，与电路板300卡接，实现光纤支架500在光模块长度方向的固定。第一卡连部5011相对第一支撑面5012向下方凸起，第一支撑面5012与电路板300的上表面接触，实现光纤支架500在电路板300的安装定位，光纤支架500在光模块高度方向的固定。第一卡连部5011 嵌入第三限位口303，实现光纤支架500在光模块长度方向的固定。
第二限位部502设置第二卡连部5021，其嵌入第四限位口304，与电路板300卡接，实现光纤支架500在光模块长度方向的固定。第二卡连部5021相对第二支撑面5022向下方凸起，第二支撑面5022与电路板300的上表面接触，实现光纤支架500在电路板300的安装定位，光纤支架500在光模块高度方向的固定。第二卡连部5021嵌入第四限位口304，实现光纤支架500在光模块长度方向的固定。
在本公开的某一些实施例中，为提高光纤支架500在电路板300上的稳定性，光纤支架500的下表面还设置第一支撑部503和第二支撑部504，与电路板300上表面接触连接，实现光纤支架500在光模块高度方向的固定。第一支撑部503和第二支撑部504具有平整的支撑顶面的结构，被配置为与电路板300上表面接触连接。在本公开实施例中，为方便电路板光电器件的安装，第一支撑部503和第二支撑部504的端部高度一致。且第一支撑部503和第二支撑部504的端部，与第一支撑面5012、第二支撑面5022在同一高度处。
本公开中，通过第一支撑部503和第二支撑部504与电路板300上表面接触连接，实现了光纤支架500在光模块高度方向的固定。第一限位部501、第二限位部502与第三限位口303、第四限位口304的卡接，实现了光纤支架500与电路板300的固定连接。
安装时，第一支撑部503和第二支撑部504与电路板300上表面接触连接，第一卡连部5011嵌入第三限位口303，与电路板300卡接；第二卡连部5021嵌入第四限位口304，与电路板300卡接，实现光纤支架500在光模块高度方向的固定。第一支撑部503和第二支撑部504与电路板300上表面接触连接；第一支撑部503和第二支撑部504与电路板300上表面接触连接，实现光纤支架500在光模块高度方向的固定，将光纤支架500固定于电路板300上。
光纤支架500的侧边一端设置第一安装卡槽505，与电路板300上第一限位口301的位置对应，与第一限位柱2025卡设连接。光纤支架500的另一侧边的一端设置第二安装卡槽506，与电路板300上第二限位口302的位置对应，与第二限位柱2026卡设连接。第一安装卡槽505与第二安装卡槽506的设置，实现光纤支架500在下壳体202内长度方向的定位。
在本公开的某一些实施例中，电路板300上设有DSP等多个光电芯片，为方便光纤支架500的固定安装，减小空间占用，光纤支架500的下表面设置光电避让槽，DSP等芯片设置于光电避让槽内。光纤支架500罩设于DSP上方，光纤支架500与电路板300的之间的距离较小，减少空间有利于光模块小型化设置。
光纤支架500的下表面设置光纤槽，被配置为光源发射器410出射光纤的固定。光纤支架500与固定架430均设置于电路板300的上方，且光纤支架500位于固定架430的一侧，光纤支架500在电路板300的投影不与固定架430在电路板300的投影重合。在本公开中，固定架430靠近光口205一侧，光纤支架500也靠近光口205一侧。
为了方便电路板300在下壳体的安装，第七固定孔310、第五安装通孔20211位于光纤支架500在电路板300的投影的外部，靠近光口205一侧。
图23为根据一些实施例的光模块的局部结构示意图二；图24为根据一些实施例的光模 块局部结构的剖面示意图。如图23和图24中所示，为实现子电路板420与电路板300之间的电连接，子电路板420上设有第一连接器423，位于子电路板420的下表面，开口朝向光源发射器410的一侧。电路板300设置有第二连接器305，开口朝向与第一连接器的开口朝向一致。第一连接器423与第二连接器305之间采用柔性电路板440连接。电路板300的一端设有金手指，通过金手指与上位机连接，接收上位机的电信号，经柔性电路板440传递至子电路板420，经过子电路板420上电引脚与光源发射器410的外接引脚连接，实现信号传递。
在本公开的某一些实施例中，为方便安装，第一连接器423位于固定架的外侧，且第一连接器423在电路板300的投影，与第二连接器305在电路板300的投影在光模块长度方向的位置一致。
子电路板420的下表面与电路板300的上表面临近，安装后子电路板420的下表面与电路板300的上表面之间空隙较小，不利于电连接器的设置。因此，本公开中，将第二连接器305设置于电路板300的下表面，第一连接器423设置于子电路板420的上表面，柔性电路板440包覆于光源发射器410的外侧。在本公开的某一些实施例中，柔性电路板440包覆于光源发射器410的光纤接头的外侧。柔性电路板440具有较好的柔性，方便安装。
安装时，将子电路板420与底座431通过第三固定孔421与第三连接通孔4315、第四固定孔422与第四连接通孔4316之间的螺钉固定，光源发射器410固定于压板4322与底座431之间，利用螺钉将支撑柱4321与底座431连接。将光源发射器410、子电路板420固定于固定架430上。然后使用螺钉，从上壳体201的下表面向光模块的内部拧入，由第一固定孔2015与第一连接通孔4311连接，同样，第二固定孔2016与底座上第二连接通孔4312连接，将安装有光源发射器410、子电路板420的固定架430与上壳体201连接。第一支撑部503和第二支撑部504与电路板300上表面接触连接，第一卡连部5011嵌入第三限位口303与电路板300卡接；第二卡连部5021嵌入第四限位口304与电路板300卡接，实现光纤支架500在光模块高度方向的固定。第一支撑部503和第二支撑部504与电路板300上表面接触连接；第一支撑部503和第二支撑部504与电路板300上表面接触连接，实现光纤支架500在光模块高度方向的固定。将光纤支架500固定于电路板300上。螺钉从电路板300上的第七固定孔310的上方穿入与第五安装通孔20211连接，将电路板300固定于下壳体内部。柔性电路板440的一端与电路板300的下表面的第二连接器连接，另一端绕过光源发射器410与子电路板420上表面的第一连接器连接，实现电路板300与子电路板420之间的电连接。然后将上壳体与下壳体连接。
本公开公开一种光模块，包括：光源发射器410，设置于电路板的上方，被配置为发射光。子电路板420，设置于电路板300的上方，与电路板300通过柔性电路板电连接。光源发射器410与子电路板420电连接，子电路板420对光源发射器410驱动。光源发射器410固定架430，设置于电路板的上方，被配置为固定光源发射器410。光源发射器410固定于光源发射器410固定架430上，一侧设有多个引脚与子电路板420连接。光源发射器410固定架430还与上壳体201连接，光源发射器410通过光源发射器410固定架430固定在上壳体 201上，其散发的热量可直接由光源发射器410固定架430传递至上壳体201，提高光模块的散热功能。支架432包括：支撑柱4321和压板4322，支撑柱4321设置于底座431下方，一端与底座431连接，另一端与压板4322连接。压板4322的上表面与光源发射器410连接，将光源发射器410固定于压板4322与底座431之间，实现光源发射器410的固定。光源发射器410产生的热量直接通过底座431传导至上壳体201，而后传递至笼子进行散热。
由于以上实施方式均是在其他方式之上引用结合进行说明，不同实施例之间均具有相同的部分，本说明书中各个实施例之间相同、相似的部分互相参见即可。在此不再详细阐述。
需要说明的是，在本说明书中，诸如“第一”和“第二”等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或暗示这些实体或操作之间存在任何这种实际的关系或顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的电路结构、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种电路结构、物品或者设备所固有的要素。在没有更多限制的情况下，有语句“包括一个……”限定的要素，并不排除在包括所述要素的电路结构、物品或者设备中还存在另外的相同要素。
本领域技术人员在考虑说明书及实践本公开的公开后，将容易想到本公开的其他实施方案。本公开旨在涵盖本公开的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由权利要求的内容指出。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (19)

  1. 一种光模块，包括：上壳体；
    下壳体，与所述上壳体盖合形成包裹腔体；
    电路板，设置于所述包裹腔体内，与所述下壳体固定连接，所述电路板的下表面设置第二连接器；
    子电路板，设置于所述电路板的上方，其上表面设置第一连接器；所述第一连接器与所述第二连接器通过柔性电路板连接；
    固定部，吊装于所述上壳体内壁下方，所述子电路板设置于所述固定部下方。
  2. 根据权利要求1所述的光模块，其中，所述上壳体内壁设置支架安装槽，被配置为所述固定部的上表面的定位。
  3. 根据权利要求2所述的光模块，其中，所述支架安装槽的对角位置设置第一固定孔和第二固定孔；所述固定部设置第一连接通孔与第二连接通孔；所述第一连接通孔与所述第一固定孔通过螺钉连接；所述第二连接通孔与所述第二固定孔通过螺钉连接。
  4. 根据权利要求1所述的光模块，其中，所述固定部的下表面设置避让凹陷，被配置为所述子电路板上电子元器件的避让、限位。
  5. 根据权利要求1所述的光模块，其中，还包括：光源安装部，设置于所述电路板上方，位于所述固定部的一侧；
    支撑柱，设置于所述光源安装部的下方，一端与所述光源安装部连接；
    压板，一端与所述支撑柱的另一端连接；
    光源发射器，设置于所述光源安装部与所述压板之间，位于所述子电路板的一侧，与所述子电路板连接。
  6. 根据权利要求5所述的光模块，其中，所述子电路板设置安装避让部，被配置为所述光源发射器的定位。
  7. 一种光模块，包括：上壳体；
    下壳体，与所述上壳体盖合形成包裹腔体；
    电路板，设置于所述包裹腔体内；
    光源安装部，与所述上壳体连接；
    支撑柱，设置于所述光源安装部的下方，一端与所述光源安装部连接；
    压板，一端与所述支撑柱的另一端连接；
    光源发射器，设置于所述光源安装部与所述压板之间。
  8. 根据权利要求7所述的光模块，其中，所述压板包括：
    承接部，一端与所述支撑柱的另一端连接；
    承压部，一端与所述承接部的另一端连接；所述光源发射器设置于所述承压部与所述光源安装部之间；所述承压部的上表面高于所述承接部的上表面。
  9. 根据权利要求8所述的光模块，其中，还包括：垫片，设置于所述光源发射器与所述 承压部之间。
  10. 根据权利要求8所述的光模块，其中，还包括：
    子电路板，设置于所述电路板的上方，位于所述光源发射器的一侧，与所述光源发射器电连接；固定部，与所述上壳体通过螺钉连接，下表面与所述子电路板连接；
    所述子电路板设置安装避让部，被配置为所述光源发射器的定位。
  11. 一种光模块，包括：上壳体；
    下壳体，与所述上壳体盖合形成包裹腔体；
    电路板，设置于所述包裹腔体内；
    光源发射器，设置于所述包裹腔体内；
    子电路板，设置于所述光源发射器的一侧，与所述光源发射器电连接；
    底座，与所述上壳体固定连接，且另一侧与所述子电路板和所述光源发射器连接；
    支撑柱，设置于所述底座的下方，一端与所述底座连接；
    压板，一端与所述支撑柱的另一端连接；所述光源发射器设置于所述底座与所述压板之间。
  12. 根据权利要求11所述的光模块，其中，所述压板包括：
    承接部，一端与所述支撑柱的另一端连接；
    承压部，一端与所述承接部的另一端连接；所述光源发射器设置于所述承压部与所述底座之间；所述承压部的上表面高于所述承接部的上表面；
    垫片，设置于所述光源发射器与所述承压部之间，所述承压部的上表面低于所述垫片部的上表面。
  13. 根据权利要求12所述的光模块，其中，所述光源发射器的上表面与所述底座的下表面连接；
    所述光源发射器的下表面与所述承压部的上表面连接。
  14. 根据权利要求11所述的光模块，其中，所述子电路板边缘设置安装避让部，被配置为所述光源发射器的定位安装。
  15. 根据权利要求11所述的光模块，其中，所述子电路板的上表面设置第一连接器；所述电路板的下表面设置第二连接器；所述第一连接器与所述第二连接器通过柔性电路板连接。
  16. 根据权利要求11所述的光模块，其中，所述电路板设置硅光芯片，与所述光源发射器通过光纤连接。
  17. 根据权利要求16所述的光模块，其中，还包括：光纤适配器，与所述硅光芯片连接；
    所述支撑柱设置适配避让槽，与所述光纤适配器的外壁匹配。
  18. 根据权利要求17所述的光模块，其中，所述固定部设有多个避让凹陷，被配置为所述子电路板上电子元器件的让位。
  19. 根据权利要求11所述的光模块，其中，所述上壳体内壁设有支架安装槽，被配置为所述底座的避让、定位；所述底座设置连接通孔，所述上壳体设置固定孔，所述连接通孔与所述固定孔之间通过螺钉连接。
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