WO2022227785A1 - 一种电子元件连接结构以及电子设备 - Google Patents

一种电子元件连接结构以及电子设备 Download PDF

Info

Publication number
WO2022227785A1
WO2022227785A1 PCT/CN2022/075892 CN2022075892W WO2022227785A1 WO 2022227785 A1 WO2022227785 A1 WO 2022227785A1 CN 2022075892 W CN2022075892 W CN 2022075892W WO 2022227785 A1 WO2022227785 A1 WO 2022227785A1
Authority
WO
WIPO (PCT)
Prior art keywords
sub
connection board
connection
board
distance
Prior art date
Application number
PCT/CN2022/075892
Other languages
English (en)
French (fr)
Inventor
王岩
高久亮
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Priority to EP22731460.6A priority Critical patent/EP4106105B1/en
Priority to US17/791,257 priority patent/US20240178549A1/en
Publication of WO2022227785A1 publication Critical patent/WO2022227785A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3816—Mechanical arrangements for accommodating identification devices, e.g. cards or chips; with connectors for programming identification devices

Definitions

  • the present application relates to the field of electrical connection structures, and in particular, to an electronic component connection structure and electronic equipment.
  • antenna shrapnel In order to realize different functions of electronic devices, multiple electronic components (such as antenna shrapnel) are usually installed. When the antenna shrapnel is installed in the electronic device, other components are usually connected on the circuit board where the antenna shrapnel is installed. In order to avoid the antenna shrapnel If there is mutual interference with other components, a certain avoidance space is usually set between the antenna shrapnel and other components. The way of setting the avoidance space in the prior art will take up a lot of space, resulting in an insufficiently compact internal layout of the electronic equipment. The downsizing of electronic devices is limited to a certain extent.
  • Embodiments of the present application provide an electronic component connection structure and an electronic device, which can reduce the space occupation of the connection structure in the lateral dimension, thereby reducing the occupation of the lateral space inside the electronic device, which is conducive to reducing the external size of the electronic device.
  • an electronic component connection structure comprising a connection board, a first element and a second element, the first element is connected on one side of the connection board, and the second element is connected on the other side of the connection board.
  • the vertical projection of the first element on the preset plane overlaps with the vertical projection of the second element on the preset plane, or the vertical projection of the first element on the preset plane is perpendicular to the vertical projection of the second element on the preset plane.
  • the projection distance is less than the threshold distance, and the preset plane is parallel to the plane where one side of the connecting plate is located; the distance between the first element and the second element in the direction perpendicular to the preset plane is greater than or equal to the threshold distance.
  • the threshold distance is the minimum distance that prevents mutual interference between the first element and the second element.
  • the connecting plate by arranging the first element and the second element on both sides of the connecting plate, and setting the vertical projection of the first element on the preset plane to overlap with the vertical projection of the second element on the preset plane, That is, set the first element and the second element in corresponding positions on both sides of the connecting plate, and make the distance between the first element and the second element greater than or equal to the preset threshold distance, avoiding the first element and the second element.
  • the elements interfere with each other, and at the same time, the space on both sides of the connecting plate is formed as the avoidance space between the first element and the second element, which reduces the occupation of the lateral space.
  • the thickness direction of the connecting plate is usually set to be consistent with the thickness direction of the electronic device, that is, the avoidance space between the first element and the second element is the space in the thickness direction of the electronic device, which avoids the need for the electronic device.
  • the horizontal space is occupied, thereby helping to reduce the external size of the electronic device.
  • the connection board includes a first sub-connection board and a second sub-connection board, the first element is connected to the first side of the first sub-connection board, and the second element is connected to the first sub-connection board.
  • the first side is opposite to the second side of the first sub-connection board, and the first side of the second sub-connection board is opposite to the second side of the second sub-connection board.
  • the first sub-connecting board and the second sub-connecting board are superimposed and arranged, and the overlapping position can increase the thickness of the connecting board.
  • This type of connecting board has a simple process and is easy to manufacture. lower cost.
  • the first element and the second element are respectively arranged on the first sub-connection board and the second sub-connection board, so that the first element and the second element are located on both sides of the connection board, where the thickness of the connection board is thicker, which is beneficial to Increasing the distance between the first element and the second element to meet the threshold distance prevents the first element and the second element from interfering with each other. At the same time, the occupation of the lateral space by the first element and the second element is reduced.
  • the first element is connected in the first sub-connection board, and the distance between the first element and the second sub-connection board in the direction perpendicular to the preset plane is greater than or equal to the preset Set distance.
  • the design method provides a specific connection method of the first element.
  • the gap can prevent mutual interference between the first element and the elements and circuits on the second sub-connection board.
  • a protrusion is provided on one side of the connecting plate, and the first element is connected to the protrusion.
  • the thickness of the local area of the connecting plate is increased.
  • the distance between the element and the second element may satisfy the threshold distance to avoid mutual interference between the first element and the second element.
  • an avoidance space is formed between the first element and the second element in the longitudinal direction, and the occupation of the lateral space is reduced.
  • the thickness of the first sub-connection board is 0.4 mm to 1.0 mm
  • the thickness of the second sub-connection board is 0.4 mm to 1.0 mm.
  • the above design method provides a specific implementation manner of the first sub-connection board and the second sub-connection board.
  • the present application provides an electronic device, including a housing and the electronic component connection structure described in the first aspect and any possible design manner thereof, wherein the electronic component connection structure is connected in the housing.
  • Fig. 1 is the schematic diagram of a kind of electronic component connection structure in the prior art:
  • Fig. 2 is the schematic diagram that the first component is installed on the mounting plate in the prior art
  • FIG. 3 is a top view of an electronic component connection structure in the prior art
  • FIG. 4 is a schematic diagram of an electronic device according to an embodiment of the present application.
  • FIG. 5 is a schematic diagram of an electronic component connection structure provided by an embodiment of the present application.
  • FIG. 6 is a schematic diagram of another electronic component connection structure provided by an embodiment of the present application.
  • FIG. 7 is a top view of an electronic component connection structure provided by an embodiment of the present application.
  • FIG. 8 is a bottom view of an electronic component connection structure provided by an embodiment of the present application.
  • words such as “exemplary” or “for example” are used to represent examples, illustrations or illustrations. Any embodiment or design described in the embodiments of the present application as “exemplary” or “such as” should not be construed as preferred or advantageous over other embodiments or designs. Rather, the use of words such as “exemplary” or “such as” is intended to present the related concepts in a specific manner.
  • first and second are only used for description purposes, and cannot be understood as indicating or implying relative importance or implying the number of indicated technical features.
  • a feature defined as “first” or “second” may expressly or implicitly include one or more of that feature.
  • At least one means one or more, and “plurality” means two or more.
  • At least one item(s) below” or similar expressions thereof refer to any combination of these items, including any combination of single item(s) or plural items(s).
  • at least one item (a) of a, b, or c can represent: a, b, c, a-b, a-c, b-c, or a-b-c, where a, b, c may be single or multiple .
  • connection should be understood in a broad sense, for example, “connection” may be a fixed connection, a sliding connection, or a detachable connection, Or integrated, etc.; it can be directly connected or indirectly connected through an intermediary.
  • references throughout the specification to "one embodiment,” “another embodiment,” and “one possible design” mean that a particular feature, structure, or characteristic associated with the embodiment or implementation is included herein in at least one embodiment of the application.
  • appearances of "in one embodiment of the present application” or “in another embodiment of the present application” or “one possible design” in various places throughout the specification are not necessarily referring to the same embodiment.
  • the particular features, structures or characteristics may be combined in any suitable manner in one or more embodiments.
  • FIG. 1 shows a connection schematic diagram of an electronic component connection structure in the prior art.
  • the direction indicated by F1 in the figure is the horizontal direction
  • the direction indicated by F2 is the vertical direction.
  • the first component 100 is fixedly mounted on the mounting plate 400
  • the second component 200 is also fixedly mounted on the mounting plate 400
  • the mounting plate 400 is fixed in the housing of the electronic device or on a support inside the electronic device.
  • the first element 100 and the second element 200 are respectively fixed at different positions on the mounting board 400 , so that the first element 100 and the second element 200 maintain a certain distance in the F1 direction.
  • FIG. 2 shows a schematic diagram of the first component 100 on the mounting board 400.
  • the first component 100 is fixed on the mounting board 400 and communicates with the circuit on the mounting board 400.
  • the mounting board 400 may be a PCB board or other types of circuit boards.
  • FIG. 3 is a top view of an electronic component connection structure in the prior art, and FIG. 3 shows the relative position between the first component 100 and the second component 200, as shown in FIG.
  • the planes parallel to the planes on either side of the board 400 are the reference planes, and the projection of the first element 100 on the reference plane does not coincide with the projection of the second element 200 on the reference plane.
  • FIG. 1 that is, the misalignment of the first element 100 and the second element 200 in the longitudinal direction (F2 direction).
  • L in FIG. 1 is the distance between the first element 100 and the second element 200 in the figure.
  • the first element 100 and the second element 200 correspond to a specific element, for example: antenna shrapnel, Subscriber Identity Module (SIM) card holder, microphone, speaker, motor, camera, receiver, etc. Since the position of the interference source in each element is different, in this embodiment, the distance between the first element 100 and the second element 200 may refer to: the smallest straight line between the body of the first element 100 and the body of the second element 200 distance. Of course, the distance between the first element 100 and the second element 200 can also be determined according to specific elements.
  • SIM Subscriber Identity Module
  • the distance between the first element 100 and the second element 200 essentially refers to the minimum linear distance between the antenna shrapnel and the SIM card in the SIM card holder.
  • the distance L between the first element 100 and the second element 200 is a safety distance, and the distance L is also a threshold distance.
  • a horizontal arrangement is generally adopted, that is, the plate surface of the mounting plate 400 is parallel to the F1 direction.
  • the space indicated by L in the figure is the avoidance space between the first element 100 and the second element 200 , and the avoidance space is the space in the lateral direction.
  • the horizontal direction (F1 direction) generally refers to the length direction or the width direction of the electronic device, and the vertical direction (F2 direction) generally refers to the thickness direction of the electronic device.
  • the electronic component connection structure in the prior art solution usually adopts the space in the lateral direction as the avoidance space between the first component 100 and the second component 200, and such electronic component connection structure will occupy more inside the electronic device.
  • the space in the horizontal direction of the electronic device is affected, thereby affecting the reduction of the size of the electronic device in the length and width directions, resulting in a larger overall size of the electronic device.
  • the embodiments of the present application provide an electronic component connection structure and an electronic device, the electronic component connection structure can reduce the space occupied in the lateral dimension, Thus, the occupation of the internal space of the electronic device is reduced.
  • the embodiments of the present application will be described below with reference to FIGS. 4 to 8 .
  • Embodiments of the present application provide an electronic device.
  • the electronic device 01 includes, for example, a mobile phone, a tablet computer, a personal digital assistant (PDA), an in-vehicle computer, a smart wearable product, and the like.
  • PDA personal digital assistant
  • the specific form of the electronic device 01 described above is not particularly limited in this embodiment of the present application. For the convenience of description, the following description will be given by taking the electronic device 01 as a mobile phone as an example.
  • FIG. 4 shows a schematic diagram of an electronic device in an embodiment of the present application.
  • the electronic device 01 is a mobile phone, which mainly includes a display assembly (not shown in the figure), a casing 11, a middle frame 12 and an internal assembly 13.
  • the display assembly is connected to one side of the middle frame 12, and the casing 11 is connected to the other side of the middle frame 12
  • the internal component 13 is arranged between the display component and the casing 11 and is fixedly connected to the inner side of the casing 11 or the middle frame 12 .
  • the internal components 13 may include chips, PCB boards, memories, sensors, and the like.
  • the mobile phone may further include an electronic connection structure 10 disposed inside the casing 11 , and the electronic connection structure 10 may be fixedly connected with the casing 11 , or may be fixedly connected with the middle frame 12 or the internal components 13 .
  • the mobile phone includes a variety of electronic components, such as: antenna shrapnel, Subscriber Identity Module (SIM) card holder, microphone, speaker, motor, camera, receiver and so on. When these components are installed inside the mobile phone, a corresponding electronic connection structure is usually required for connection, and a certain avoidance space is provided.
  • SIM Subscriber Identity Module
  • the specific structure of the electronic connection structure 10 is described below by taking the first element 100 as an antenna shrapnel and the second element 200 as a SIM card holder as an example.
  • FIG. 5 is a schematic diagram of an electronic component connection structure provided by an embodiment of the present application.
  • the connecting structure includes a connecting plate 300 , a first element 100 and a second element 200 , wherein the connecting plate 300 is used for connecting the first element 100 and the second element 200 .
  • the first element 100 is connected to one side of the connection board 300
  • the second element 200 is connected to the other side of the connection board 300 .
  • the arrangement of the first element 100 and the second element 200 on both sides of the connection board 300 is beneficial to make full use of the space on both sides of the connection board 300 .
  • the distance between the vertical projection of the first element 100 on the preset plane and the vertical projection of the second element 200 on the preset plane is less than L or overlaps.
  • the distance between the vertical projection of the first element 100 on the preset plane and the vertical projection of the second element 200 on the preset plane may refer to the distance between the vertical projection of the body of the first element 100 on the preset plane and the vertical projection of the second element 200 on the preset plane.
  • the distance between the vertical projection of the first element 100 on the preset plane and the vertical projection of the second element 200 on the preset plane may be 0.
  • the sources of interference between the antenna shrapnel and the SIM card holder are the antenna shrapnel body and the SIM card in the SIM card holder, respectively. Therefore, the distance between the vertical projection of the first element 100 on the preset plane and the vertical projection of the second element 200 on the preset plane essentially means: the vertical projection of the antenna shrapnel on the preset plane and the SIM card holder The minimum straight-line distance between the two SIM cards when their vertical projections on the preset plane do not overlap.
  • the preset plane in this application refers to a plane parallel to the plane on which one side of the connection board 300 is located. 5 , when the connecting plate 300 is installed, the planes on both sides of the connecting plate 300 are parallel to the F1 direction and perpendicular to the F2 direction. It can be seen from the above that the preset plane is perpendicular to the F2 direction. However, in actual production and processing, the above requirements may not be fully met due to errors and other reasons.
  • the vertical projection of the first element 100 on the preset plane is the first projection
  • the vertical projection of the second element 200 on the preset plane is the second projection
  • the first projection and the second projection overlap.
  • the overlap in the embodiments of the present application includes partial overlap and full overlap.
  • the completely overlapping of the first projection and the second projection means that the shapes of the first projection and the second projection are exactly the same and coincide on a preset plane. However, since it is difficult for the shapes of the first projection and the second projection to be completely consistent, it is rare for the first projection and the second projection to completely overlap.
  • the partial overlap between the first projection and the second projection includes the following situations: the first projection completely falls within the second projection, and the overlapping part of the first projection and the second projection is the size of the first projection; the second projection completely falls within the second projection.
  • the overlapping part of the first projection and the second projection is the size of the second projection; the first projection neither falls within the second projection, nor the second projection falls within the first projection, the first projection and the second projection
  • the first projection and the second projection overlap, which can increase the degree of coincidence of the first element 100 and the second element 200 in the direction perpendicular to the preset plane, that is, increase the first element 100 and the second element 200
  • the degree of coincidence in the longitudinal direction (F2 direction) thereby reducing the occupation of the space in the lateral direction.
  • the horizontal space in the electronic device is mainly determined by the length and width, which reduces the occupation of the horizontal space and is beneficial to reducing the length and width of the electronic device.
  • the distance between the first element 100 and the second element 200 in a direction perpendicular to the preset plane is greater than or equal to a threshold distance.
  • a threshold distance By setting the distance between the first element 100 and the second element 200 to be not less than the threshold distance, a sufficient space for avoidance is reserved for the first element 100 and the second element 200 to prevent the first element 100 and the second element 200 from interacting with each other. Generate interference, or make the interference between the first element and the second element acceptable and within a controllable range.
  • the distance between the two is greater than or Equal to the threshold distance, the SIM card holder does not affect the antenna performance, and the antenna shrapnel does not affect the data transmission of the SIM card holder.
  • the threshold distance may be the distance L shown in FIG. 1 .
  • connection board 300 in the embodiment of the present application is generally a circuit board, such as a PCB board, and the connection between the first element 100 and the connection board 300 means that the circuit inside the first element 100 is connected to the circuit in the connection board 300 , and the first element 100 and the connection board 300 are fixedly connected.
  • the connection point between the first element 100 and the connection board 300 is called the first connection pin, and there are generally multiple connection points between the first element 100 and the connection board 300, so the connection between the first element 100 and the connection board 300 can be There are multiple connection pins.
  • the circuit in the connection board 300 that communicates with the first element 100 is called a first circuit.
  • connection between the second element 200 and the connection board 300 means that the circuit inside the second element 200 is communicated with the circuit in the connection board 300 , and the second element 200 and the connection board 300 are fixedly connected.
  • the connection point between the second element 200 and the connection board 300 is called the second connection pin.
  • There may be multiple connection points between the second element 200 and the connection board 300 so the connection between the second element 200 and the connection board 300 can be There are multiple connection pins.
  • the circuit in the connection board 300 that communicates with the second element 200 is called a second circuit. Preventing mutual interference between the first element 100 and the second element 200 includes: preventing the contact between the first connecting pin and the second connecting pin, causing short circuit or signal flow and other influences; and the first circuit and the second interference between circuits.
  • the above-mentioned fixed connection can be connected by welding, which can not only ensure the connection strength between the first element 100 and the second element 200 and the connecting plate 300, but also can easily realize the connection between the first element 100 and the second element 200 and the connection plate 300. Electrical connections between the connection boards 300 .
  • the connecting plate 300 may be a whole, but the connecting plate 300 is a plate of unequal thickness. Specifically, a protrusion is provided on one side of the connection board 300 , the first element 100 is connected to the protrusion on one side of the connection board 300 , the second element 200 is connected to the other side of the connection board 300 , the first element 100 and the second element 200 are respectively connected to both sides of the connection board 300 .
  • the thickness of the local area on the connecting plate 300 is increased by providing the protrusions, the first element 100 is disposed on the protrusion of the connecting plate 300, and the second element 200 is disposed on the other side of the connecting plate 300,
  • the connection plate 300 and the protrusions on the connection plate 300 serve to isolate the first element 100 and the second element 200 .
  • the distance between the first element 100 and the second element 200 can be adjusted, so that a safe avoidance distance (ie, a threshold distance) is maintained between the first element 100 and the second element 200 to avoid the first element 100 and the second element 200. 100 and the second element 200 interfere with each other.
  • the first element 100 and the second element 200 can be respectively connected to the protrusions on both sides by providing protrusions on both sides of the connecting plate 300, and the protrusions on one side can be adjusted by adjusting the protrusions on one side.
  • the height or the raised heights on both sides are adjusted at the same time, and the distance between the first element 100 and the second element 200 is adjusted so that it is not less than the threshold distance to avoid mutual interference between the first element 100 and the second element 200 .
  • connection board 300 may be a composite structure, for example, the connection board 300 is a structure composed of a plurality of sub-connection boards 300 .
  • FIGS. 6 and 7 FIG. 6 is a schematic diagram of another electronic component connection structure provided by an embodiment of the present application; FIG. 7 is a top view of an electronic component connection structure provided by an embodiment of the present application.
  • the connection board 300 includes a first sub-connection board 310 and a second sub-connection board 320
  • the first sub-connection board 310 includes a first side A 1 and a second side A 2 , A 1 and A 2 are opposite
  • the second sub-connection board 320 includes a first side B 1 and a second side B 2 , and B 1 and B 2 are opposite.
  • the first element 100 is connected to the first side A1 of the first sub-connection board 310
  • the second element 200 is connected to the second side B 2 of the second sub-connection board 320 .
  • the second side A 2 of the first sub-connection board 310 is connected to the first side B 1 of the second sub-connection board 320 , and the area of the first sub-connection board 310 is smaller than that of the second sub-connection board 320 .
  • the second sub-connection board 320 may be fixed in the housing of the electronic device, or fixed on a support inside the electronic device.
  • the first element 100 located on the first side A1 of the first sub-connection board 310 Since the second side A2 of the first sub-connection board 310 is connected with the first side B1 of the second sub-connection board 320, the first element 100 located on the first side A1 of the first sub-connection board 310, The second element 200 located on the second side B2 of the second sub-connection board 320 is located on both sides of the connection board 300, so that the space on both sides of the connection board 300 can be fully utilized.
  • Two sub-connecting boards 300 are used to form the connecting board 300 .
  • the first element 100 and the second element 200 are located on both sides of the connecting board 300 respectively, that is, the first sub-connecting board 310 and the second element 200 are spaced between the first element 100 and the second element 200 .
  • the second sub-connection board 320, the first sub-connection board 310 and the second sub-connection board 320 are superimposed and arranged, and the overlapping position can increase the thickness of the connection board 300, which is beneficial to increase the distance between the first element 100 and the second element 200 distance so that it meets the threshold distance.
  • the increase in the thickness of the connection board 300 is conducive to realizing the positional arrangement of the first connecting pin and the second connecting pin, preventing the contact between the first connecting pin and the second connecting pin, and facilitating the wiring of the first circuit and the second circuit, preventing the The first circuit connected to the first element 100 and the second circuit connected to the second element 200 interfere with each other.
  • FIG. 8 which shows a bottom view of the electronic component connection structure
  • F2 direction the bottom view direction
  • first element 100 and the second element 200 are located on two sides of the connecting board 300 respectively, and the first projection of the first element 100 on the preset plane and the second element 200 are in the preset
  • the second projections on the plane overlap, so that when the first element 100 and the second element 200 are spatially arranged, they mainly occupy the longitudinal space in the electronic device, and this arrangement can reduce the impact of the first element 100 and the second element 200 on the electronic device. Occupation of horizontal space.
  • the first component 100 may be connected to the surface of the first sub-connection board 310, or may be connected to the interior of the first sub-connection board 310.
  • the first component 100 may be a dual in-line package.
  • the (dual in-line package, Dip) technology is used to connect the first sub-connection board 310, and this connection method can enhance the connection strength between the first element 100 and the first sub-connection board 310.
  • the first element 100 may also be in the form of a broken plate element or a sinking plate element to realize the connection with the first sub-connection plate 310 .
  • the distance between the first element 100 and the second sub-connection board 320 in the direction perpendicular to the preset plane is greater than or equal to the preset distance
  • the The preset distance is a safe process distance, which is mainly used to realize the connection process between the first element 100 and the first sub-connection board 310 and to avoid interference between the first element 100 and the second sub-connection board 320 .
  • the specific installation method may refer to the methods shown in FIG. 2 and FIG. 3 .
  • the first side B1 of the second sub-connection board 320 is connected with the second side A2 of the first sub-connection board 310, the second sub-connection board 320 and the first sub-connection board 310 can generally be glued together Alternatively, the connection is performed by welding. Therefore, the first side B 1 of the second sub-connection board 320 is substantially abutted with the second side A 2 of the first sub-connection board 310 .
  • the distance between the first element 100 and the second sub-connection board 320 in the direction perpendicular to the preset plane can be understood as the distance between the first element 100 and the second side A2 of the first sub-connection board 310, that is, the first element If part or all of the 100 is submerged in the first sub-connection board 310, it is necessary to maintain at least a preset distance from the other side of the first sub-connection board 310 to prevent the first element 100 from contacting the second sub-connection board 320.
  • This part of the distance can be used as a process space when the first element 100 and the first sub-connection board 310 are connected, so as to ensure a good connection effect between the first element 100 and the first sub-connection board 310 .
  • the first element 100 and the other side of the first sub-connection board 310 maintain at least a predetermined distance, and this part of the space can play the role of avoiding circuits or connecting pins on the second sub-connection board 320 .
  • the thickness of the first sub-connecting board 310 is 0.4 mm ⁇ 1.0 mm
  • the thickness of the second sub-connecting board 320 is 0.4 mm ⁇ 1.0 mm.
  • the thickness of the first sub-connection board 310 is generally set to 0.5mm ⁇ 0.8mm
  • the thickness of the second sub-connection board 320 is also generally set to 0.5mm ⁇ 0.8mm.
  • the thickness of the first sub-connection board 310 may be set to 0.6 mm
  • the thickness of the second sub-connection board 320 may be set to 0.5 mm.
  • the thickness of the first sub-connection board 310 and/or the second sub-connection board 320 can be set thicker, the thickness of the first sub-connection board 310 can be set to about 1.0 mm, or can be set to be greater than 1.0 mm according to the actual situation mm; the thickness of the second sub-connection board 320 may be set to be about 1.0 mm, or may be set to be greater than 1.0 mm according to the actual situation. In addition, the thicknesses of the first sub-connection board 310 and the second sub-connection board 320 can also be set to be less than 0.3 mm. In this case, the first sub-connection board 310 and the second sub-connection board 320 are generally made of flexible boards.
  • the embodiments of the present application do not limit the specific thicknesses of the first sub-connection board 310 and the second sub-connection board 320.
  • the first sub-connection board 310 and the second sub-connection board 320 can be adjusted according to actual needs. thickness is set.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

本申请提供一种电子元件连接结构以及电子设备，涉及电性连接结构领域，能够减小连接结构在横向尺寸上的空间占用，从而减小对电子设备内部横向空间的占用，有利于减小电子设备的外形尺寸。上述电子元件连接结构，包括连接板、第一元件和第二元件，第一元件连接在连接板的一侧，第二元件连接在连接板的另一侧。第一元件在预设平面上的垂直投影，与第二元件在预设平面上的垂直投影重叠，预设平面与连接板其中一侧所在的平面平行；第一元件和第二元件在垂直于预设平面的方向上的距离大于或者等于阈值距离。

Description

一种电子元件连接结构以及电子设备
本申请要求于2021年4月30日提交国家知识产权局、申请号为202120944650.7、申请名称为“一种电子元件连接结构以及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电性连接结构领域，尤其涉及一种电子元件连接结构以及电子设备。
背景技术
随着科技的发展，人们对电子设备的移动性和便携性需求越来越高，而电子设备的外形尺寸是影响其便携性的重要因素之一。
为了实现电子设备的不同功能，通常安装有多个电子元件(例如天线弹片)，天线弹片安装在电子设备中时，在安装天线弹片的电路板上通常还连接有其它元器件，为了避免天线弹片与其它元器件产生互扰，通常会在天线弹片与其它元器件之间设置一定的避让空间，现有技术中设置避让空间的方式，会占用较多的空间，导致电子设备内部布局不够紧凑，在一定程度上限制电子设备的尺寸的缩小。
发明内容
本申请实施例提供一种电子元件连接结构以及电子设备，能够减小连接结构在横向尺寸上的空间占用，从而减小对电子设备内部横向空间的占用，有利于减小电子设备的外形尺寸。
为达到上述目的，本申请采用如下技术方案：
第一方面，提供一种电子元件连接结构，包括连接板、第一元件和第二元件，第一元件连接在连接板的一侧，第二元件连接在连接板的另一侧。第一元件在预设平面上的垂直投影，与第二元件在预设平面上的垂直投影重叠，或者第一元件在预设平面上的垂直投影，与第二元件在预设平面上的垂直投影距离小于阈值距离，预设平面与连接板其中一侧所在的平面平行；第一元件和第二元件在垂直于预设平面的方向上的距离大于或者等于阈值距离。
阈值距离为防止第一元件和第二元件之间互相产生干扰的最小距离。
在此基础上，通过将第一元件和第二元件设置在连接板的两侧，并且设置第一元件在预设平面上的垂直投影，与第二元件在预设平面上的垂直投影重叠，即设置第一元件与第二元件在连接板的两侧处于对应的位置，并使第一元件和第二元件之间的距离大于或者等于预设的阈值距离，避免了第一元件和第二元件之间相互干涉，同时形成将连接板两侧的空间作为第一元件和第二元件之间的避让空间，减小了对横向空间的占用。而在设置连接板时，通常将其厚度方向设置为与电子设备的厚度方向一致，即第一元件和第二元件之间的避让空间为电子设备的厚度方向上的空间，避免了对电子设备横向空间的占用，从而有利于减小电子设备的外形尺寸。
结合第一方面，在一种可能的设计方式中，连接板包括第一子连接板和第二子连接板，第一元件连接在第一子连接板的第一侧，第二元件连接在第二子连接板的第二 侧；第一子连接板的第二侧与第二子连接板的第一侧连接，第一子连接板的面积小于第二子连接板；第一子连接板的第一侧与第一子连接板的第二侧相对，第二子连接板的第一侧与第二子连接板的第二侧相对。
在此基础上，通过设置两个子连接板组成连接板，第一子连接板与第二子连接板叠加设置，相互重叠的位置可以增加连接板的厚度，该种形式的连接板工艺简单，制作成本较低。将第一元件和第二元件分别设置在第一子连接板和第二子连接板上，使得第一元件和第二元件位于连接板的两侧，该处的连接板厚度较厚，有利于增加第一元件和第二元件之间的距离，使其满足阈值距离，防止第一元件和第二元件相互干扰。同时，减小第一元件与第二元件对横向空间的占用。
结合第一方面，在一种可能的设计方式中，第一元件连接于第一子连接板内，第一元件和第二子连接板在垂直于预设平面的方向上的距离大于或者等于预设距离。
在此基础上，通过将第一元件设置在第一子连接板内，该设计方式给出了第一元件的一种具体连接方式，通过设置第一元件和第二子连接板之间具有安全间隙，可以防止第一元件与第二子连接板上的元件和电路发生互扰。
结合第一方面，在一种可能的设计方式中，连接板的一侧设置有凸起，第一元件连接在凸起上。
在此基础上，通过设置凸起，增加了连接板局部区域的厚度，将第一元件和第二元件分别设置在凸起上以及与凸起相对应的另一侧连接板上，使得第一元件和第二元件之间的距离可以满足阈值距离，避免第一元件和第二元件之间相互干扰。同时，在纵向方向上形成第一元件和第二元件之间的避让空间，减小对横向空间占用。
结合第一方面，在一种可能的设计方式中，第一子连接板的厚度为0.4mm～1.0mm，第二子连接板的厚度为0.4mm～1.0mm。
在此基础上，上述设计方式给出了第一子连接板和第二子连接板的一种具体实现方式。
第二方面，本申请提供一种电子设备，包括壳体以及如第一方面及其任一种可能的设计方式所述的电子元件连接结构，电子元件连接结构连接于壳体内。
附图说明
图1为现有技术中的一种电子元件连接结构的示意图：
图2为现有技术中第一元件安装在安装板上的示意图；
图3为现有技术中一种电子元件连接结构的俯视图；
图4为本申请实施例提供的一种电子设备的示意图；
图5为本申请实施例提供的一种电子元件连接结构的示意图；
图6为本申请实施例提供的另一种电子元件连接结构的示意图；
图7为本申请实施例提供的一种电子元件连接结构的俯视图；
图8为本申请实施例提供的一种电子元件连接结构的仰视图。
具体实施方式
下面将结合附图，对本申请中的技术方案进行描述。
在本申请实施例中，“示例性的”或者“例如”等词用于表示作例子、例证或说明。本申请实施例中被描述为“示例性的”或者“例如”的任何实施例或设计方案不应被解释 为比其它实施例或设计方案更优选或更具优势。确切而言，使用“示例性的”或者“例如”等词旨在以具体方式呈现相关概念。
在本申请的实施例中，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。
应理解，在本文中对各种所述示例的描述中所使用的术语只是为了描述特定示例，而并非旨在进行限制。如在对各种所述示例的描述中所使用的那样，单数形式“一个(“a”，“an”)”和“该”旨在也包括复数形式，除非上下文另外明确地指示。
本申请中，“至少一个”是指一个或者多个，“多个”是指两个或两个以上。“以下至少一项(个)”或其类似表达，是指的这些项中的任意组合，包括单项(个)或复数项(个)的任意组合。例如，a,b,或c中的至少一项(个)，可以表示：a,b,c,a-b,a-c,b-c,或a-b-c，其中a,b,c可以是单个，也可以是多个。
还应理解，本文中所使用的术语“和/或”是指并且涵盖相关联的所列出的项目中的一个或多个项目的任何和全部可能的组合。术语“和/或”，是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。另外，本申请中的字符“/”，一般表示前后关联对象是一种“或”的关系。
还应理解，在本申请中，除非另有明确的规定和限定，术语“连接”应做广义理解，例如，“连接”可以是固定连接，也可以是滑动连接，还可以是可拆卸连接，或成一体等；可以是直接相连，也可以通过中间媒介间接相连。
还应理解，术语“包括”(也称“includes”、“including”、“comprises”和/或“comprising”)当在本说明书中使用时指定存在所陈述的特征、整数、步骤、操作、元素、和/或部件，但是并不排除存在或添加一个或多个其他特征、整数、步骤、操作、元素、部件、和/或其分组。
应理解，说明书通篇中提到的“一实施例”、“另一实施例”、“一种可能的设计方式”意味着与实施例或实现方式有关的特定特征、结构或特性包括在本申请的至少一个实施例中。因此，在整个说明书各处出现的“在本申请一实施例中”或“在本申请另一实施例中”、“一种可能的设计方式”未必一定指相同的实施例。此外，这些特定的特征、结构或特性可以任意适合的方式结合在一个或多个实施例中。
参考图1，图1示出了现有技术中的电子元件连接结构的连接示意图。如图1所示，图中F1所指示的方向为横向，F2所指示的方向为纵向。其中，第一元件100固定安装在安装板400上，第二元件200也固定安装在安装板400上，安装板400固定在电子设备的壳体内，或者固定在电子设备内部的支撑件上。第一元件100和第二元件200分别固定在安装板400上的不同位置，使得第一元件100与第二元件200在F1方向上保持一定的距离。
参考图2，图2示出了第一元件100在安装板400上的示意图，第一元件100固定在安装板400上，并与安装板400上的电路连通，安装板400可以为PCB板或者其它类型的电路板。参考图3，图3为现有技术中一种电子元件连接结构的俯视图，且图3示出了第一元件100与第二元件200之间的相对位置，如图3所示，以与安装 板400任意一侧的平面相平行的面为参考平面，第一元件100在参考平面上的投影和第二元件200在参考平面上的投影并不重合。结合图1，即第一元件100和第二元件200在纵向方向(F2方向)上的不重合。
如图1所示，图1中L为该图中第一元件100与第二元件200之间的距离。当第一元件100与第二元件200对应到某一个具体的元件时，例如：天线弹片，用户识别卡(Subscriber Identity Module，SIM)卡座，麦克风，喇叭，马达，摄像头，受话器等。由于每个元件中干扰源的位置不同，因此本实施例中，第一元件100与第二元件200之间的距离可以是指：第一元件100本体与第二元件200本体之间的最小直线距离。当然，也可以根据具体的元件，确定第一元件100与第二元件200之间的距离。例如，第一元件100为天线弹片，第二元件为SIM卡座，则第一元件100与第二元件200之间的距离实质是指天线弹片与SIM卡座中SIM卡的最小直线距离。
第一元件100与第二元件200之间的距离L为安全距离，该距离L也为阈值距离。在设置安装板400时，一般采用横向设置的方式，即安装板400的板面与F1方向平行。图中L所指的空间为第一元件100和第二元件200之间的避让空间，该避让空间为横向方向上的空间。横向(F1方向)一般指电子设备的长度方向或者宽度方向，纵向(F2方向)一般指电子设备的厚度方向。
从上述可知，现有技术方案中的电子元件连接结构通常采用横向方向上的空间作为第一元件100和第二元件200之间的避让空间，这样的电子元件连接结构会占用电子设备内部较多的横向方向上空间，从而影响到电子设备长宽方向上尺寸的缩小，造成电子设备的外形尺寸较大。
为了解决现有技术中的电子元件连接结构占用空间较大的问题，本申请实施例提供一种电子元件连接结构以及电子设备，该电子元件连接结构能够减小其在横向尺寸上的空间占用，从而减小对电子设备内部空间的占用。下面结合图4至图8对本申请实施例进行说明。
本申请实施例提供一种电子设备。该电子设备01包括例如手机、平板电脑、个人数字助理(personal digital assistant，PDA)、车载电脑、智能穿戴产品等。本申请实施例对上述电子设备01的具体形式不做特殊限制。以下为了方便说明，以电子设备01为手机为例进行的说明。
参考图4，图4示出了本申请实施例中一种电子设备的示意图。如图4所示，该电子设备01为手机，主要包括显示组件(图中未示出)、壳体11、中框12和内部组件13，显示组件连接于中框12的一侧，壳体11连接于中框12的另一侧，内部组件13设置于显示组件与壳体11之间，并与壳体11的内侧或者中框12固定连接。内部组件13可以包括芯片、PCB板、存储器和传感器等。
手机还可以包括设置于壳体11内部的电子连接结构10，该电子连接结构10可以与壳体11固定连接，也可以与中框12或者内部组件13进行固定连接。手机内包括多种电子元件，例如：天线弹片，用户识别卡(Subscriber Identity Module，SIM)卡座，麦克风，喇叭，马达，摄像头，受话器等。这些元件安装在手机内部时，通常需要相应的电子连接结构进行连接，并且设置一定的避让空间。
下面以第一元件100为天线弹片，第二元件200为SIM卡座为例，对电子连接 结构10的具体结构进行介绍。
参考图5，图5为本申请实施例提供的一种电子元件连接结构的示意图。如图5所示，该连接结构包括连接板300、第一元件100和第二元件200，其中，连接板300用于连接的第一元件100和第二元件200。具体的，第一元件100连接在连接板300的一侧，第二元件200连接在连接板300的另一侧。将第一元件100和第二元件200设置在连接板300的两侧，有利于充分利用连接板300两侧的空间。第一元件100在预设平面上的垂直投影，与第二元件200在预设平面上的垂直投影之间的距离小于L或重叠。
第一元件100在预设平面上的垂直投影，与第二元件200在预设平面上的垂直投影之间的距离可以是指：第一元件100的本体在预设平面上的垂直投影与第二元件200的本体在预设平面上的垂直投影不重叠时，两个投影之间的最小直线距离。当然，也可以指第一元件100的干扰源在预设平面上的垂直投影与第二元件200的干扰源在预设平面上的垂直投影不重叠时，两者之间的最小直线距离。例如，第一元件100在预设平面上的垂直投影，与第二元件200在预设平面上的垂直投影之间的距离可以为0。
例如，当第一元件100为天线弹片，第二元件为SIM卡座时，天线弹片与SIM卡座之间的干扰源分别为天线弹片本体和SIM卡座中的SIM卡。因此，第一元件100在预设平面上的垂直投影，与第二元件200在预设平面上的垂直投影之间的距离实质是指：天线弹片在预设平面上的垂直投影与SIM卡座中SIM卡在预设平面上的垂直投影不重叠时，两者之间的最小直线距离。
下面以第一元件100在预设平面上的垂直投影，与第二元件200在预设平面上的垂直投影重叠的情况对本申请实施例进行说明。
需要说明的是，本申请中的预设平面是指与连接板300其中一侧所在的平面相平行的平面。结合图5可知，连接板300在设置时，连接板300两侧的平面与F1方向平行，且与F2方向垂直。由上述可知，预设平面与F2方向垂直。不过在实际生产加工中，由于误差等原因可能无法完全满足上述要求。
本申请实施例中，第一元件100在预设平面上的垂直投影为第一投影，与第二元件200在预设平面上的垂直投影为第二投影，第一投影与第二投影重叠。本申请实施例中的重叠包括部分重叠和全部重叠。第一投影与第二投影完全重叠是指第一投影与第二投影的形状完全一样，并在预设平面上重合。但是，由于第一投影与第二投影的形状很难完全一致，因此出现第一投影与第二投影完全重叠的情况较少。
第一投影与第二投影部分重叠包括以下几种情况：第一投影完全落在第二投影内，第一投影与第二投影重叠的部分为第一投影的大小；第二投影完全落在第一投影内，第一投影与第二投影重叠的部分为第二投影的大小；第一投影既不落在第二投影内，第二投影也不落在第一投影内，第一投影与第二投影之间有部分重叠，重叠部分的面积小于第一投影的面积，也小于第二投影的面积。
本申请实施例中的第一投影与第二投影重合，可以增加第一元件100和第二元件200在与预设平面垂直的方向上的重合度，即增加第一元件100和第二元件200在纵向方向(F2方向)上的重合度，从而减小对横向方向上的空间的占用。电子设备中 的横向空间主要是由长宽尺寸决定的，减少了对横向空间的占用，有利于缩小电子设备的长宽尺寸。
本申请实施例中，第一元件100和第二元件200在垂直于预设平面的方向上的距离大于或者等于阈值距离。通过设置第一元件100和第二元件200之间的距离不小于阈值距离，为第一元件100和第二元件200预留足够的避让空间，防止第一元件100和第二元件200之间互相产生干扰，或者使得第一元件和第二元件之间的干扰可被接受，处于可控范围，比如第一元件是天线弹片，第二元件是SIM卡座时，两者之间的距离大于或者等于阈值距离使得SIM卡座不影响天线性能，天线弹片不影响SIM卡座数据传输。该阈值距离可以为图1中所示的距离L。
需要说明的是，本申请实施例中的连接板300一般为电路板，例如为PCB板，第一元件100与连接板300连接是指第一元件100内部的电路与连接板300内的电路连通，且第一元件100与连接板300之间固定连接。第一元件100与连接板300之间的连接点称为第一连接脚，第一元件100与连接板300之间的连接点一般有多个，因此第一元件100与连接板300之间可以存在多个连接脚。连接板300内与第一元件100所连通的电路称为第一电路。第二元件200与连接板300连接是指第二元件200内部的电路与连接板300内的电路连通，且第二元件200与连接板300之间固定连接。第二元件200与连接板300之间的连接点称为第二连接脚，第二元件200与连接板300之间的连接点可能有多个，因此第二元件200与连接板300之间可以存在多个连接脚。连接板300内与第二元件200所连通的电路称为第二电路。防止第一元件100和第二元件200之间互相产生干扰，包括：防止第一连接脚与第二连接脚之间的接触，造成短路或者信号串流等其它影响；以及第一电路与第二电路之间的干扰。上述的固定连接可以是采用焊接的方式进行连接，既能保证第一元件100和第二元件200与连接板300之间的连接强度，又可以便捷地实现第一元件100和第二元件200与连接板300之间的电连接。
如图5所示，在本申请一实施例中，连接板300可以为一整体，但连接板300为一不等厚的板。具体的，在连接板300的一侧设置有凸起，第一元件100连接在该连接板300一侧的凸起上，第二元件200连接在连接板300的另一侧，第一元件100和第二元件200是分别连接于连接板300的两侧。
本申请实施例中通过设置凸起，增加连接板300上局部区域的厚度，将第一元件100设置在连接板300的凸起上，将第二元件200设置在连接板300的另一侧，连接板300和连接板300上的凸起对第一元件100和第二元件200起到隔离的作用。通过设置凸起的厚度，可以调整第一元件100和第二元件200之间的距离，使第一元件100和第二元件200之间保持安全的避让距离(即阈值距离)，避免第一元件100和第二元件200之间相互干扰。
此外，本申请实施例中也可以通过在连接板300的两侧均设置凸起，将第一元件100和第二元件200分别连接在两侧的凸起上，可以通过调整一侧的凸起高度或者同时调整两侧的凸起高度，调节第一元件100和第二元件200之间的距离，使其不小于阈值距离，避免第一元件100和第二元件200之间相互干扰。
在本申请一实施例中，连接板300可以是一个复合型结构，如连接板300是由多 个子连接板300构成的一个结构。参考图6、图7，图6为本申请实施例提供的另一种电子元件连接结构的示意图；图7为本申请实施例提供的一种电子元件连接结构的俯视图。
如图6、图7所示，连接板300包括第一子连接板310和第二子连接板320，第一子连接板310包括第一侧A 1和第二侧A 2，A 1和A 2相对；第二子连接板320包括第一侧B 1和第二侧B 2，B 1和B 2相对。第一元件100连接在第一子连接板310的第一侧A1，第二元件200连接在第二子连接板320的第二侧B 2。第一子连接板310的第二侧A 2与第二子连接板320的第一侧B 1连接，第一子连接板310的面积小于第二子连接板320。第二子连接板320可以固定在电子设备的壳体内，或者固定在电子设备内部的支撑件上。
由于第一子连接板310的第二侧A 2与第二子连接板320的第一侧B 1连接在一起，因此，位于第一子连接板310第一侧A 1的第一元件100，和位于第二子连接板320第二侧B 2的第二元件200，分别位于连接板300的两侧，这样便于充分利用连接板300两侧的空间。采用两个子连接板300组成连接板300，第一元件100和第二元件200分别位于连接板300的两侧，即第一元件100与第二元件200之间间隔有第一子连接板310和第二子连接板320，第一子连接板310与第二子连接板320叠加设置，相互重叠的位置可以增加连接板300的厚度，从而有利于增加第一元件100和第二元件200之间的距离，使其满足阈值距离。连接板300厚度的增加，有利于实现第一连接脚和第二连接脚的位置布置，防止第一连接脚和第二连接脚的接触，并且有利于第一电路与第二电路的布线，防止与第一元件100相连的第一电路与第二元件200相连的第二电路之间相互干扰。
参考图8，图8示出了电子元件连接结构的仰视图，从图8可以看出，在仰视方向(F2方向)第一元件100与第二元件200重叠。
如图7、图8所示，由于第一元件100和第二元件200分别位于连接板300的两侧，且第一元件100在预设平面上的第一投影与第二元件200在预设平面上的第二投影重叠，使得第一元件100和第二元件200在空间布置时，主要占用电子设备内的纵向空间，这样设置可以减小第一元件100和第二元件200对电子设备内横向空间的占用。
在本申请一实施例中，第一元件100可以连接在第一子连接板310的表面，也可以连接于第一子连接板310的内部，例如，第一元件100可以采用双列直插封装(dual in-line package，Dip)技术与第一子连接板310进行连接，这种连接方式可以增强第一元件100与第一子连接板310之间的连接强度。此外，第一元件100也可以以破板元件或者沉板元件的形式，实现与第一子连接板310之间的连接。当第一元件100部分或全部沉于第一子连接板310的内部时，第一元件100和第二子连接板320在垂直于预设平面的方向上的距离大于或者等于预设距离，该预设距离为一安全工艺距离，主要用于实现第一元件100与第一子连接板310的连接工艺以及避免第一元件100与第二子连接板320之间产生干扰。第一元件100为破板元件或者沉板元件时，具体的安装方式可以参考图2和图3所示的方式。
由于第二子连接板320的第一侧B 1是与第一子连接板310的第二侧A 2连接在一起的，第二子连接板320与第一子连接板310一般可以通过胶粘或者焊接的方式进行连接，因此，第二子连接板320的第一侧B 1基本与第一子连接板310的第二侧A 2贴合。第一元件100与第二子连接板320在垂直于预设平面的方向上的距离可以理解为第一元件100到第一子连接板310第二侧A 2之间的距离，即第一元件100若部分或全部沉于第一子连接板310内部时，需要与第一子连接板310的另一侧至少保持预设距离，防止第一元件100接触到第二子连接板320，同时，这部分距离可以作为第一元件100与第一子连接板310连接时的工艺空间，以保证第一元件100与第一子连接板310之间具有良好的连接效果。此外，第一元件100与第一子连接板310的另一侧至少保持预设一定的距离，该部分空间可以起到避让第二子连接板320上的电路或者连接脚的作用。
在本申请一实施例中，第一子连接板310的厚度为0.4mm～1.0mm，第二子连接板320的厚度为0.4mm～1.0mm。在目前的电子设备中，第一子连接板310的厚度一般设置为0.5mm～0.8mm，第二子连接板320的厚度一般也设置为0.5mm～0.8mm。本申请实施例中，第一子连接板310的厚度可以设置为0.6mm，第二子连接板320的厚度可以设置为0.5mm。当第一子连接板310和/或第二子连接板320的厚度需要设置得较厚时，第一子连接板310的厚度可以设置为1.0mm左右，也可以根据实际情况，设置为大于1.0mm；第二子连接板320的厚度可以设置为1.0mm左右，也可以根据实际情况，设置为大于1.0mm。此外，第一子连接板310和第二子连接板320的厚度也可以设置小于0.3mm，此时，第一子连接板310和第二子连接板320一般采用柔性板制成。当然，本申请实施例并不限定第一子连接板310和第二子连接板320的具体厚度，在实际生产加工中，可以根据实际需求对第一子连接板310和第二子连接板320的厚度进行设置。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。
本说明书中的各个实施例均采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似的部分互相参见即可。
尽管已描述了本申请实施例的优选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例做出另外的变更和修改。所以，本申请保护范围包括优选实施例以及落入本申请实施例范围的所有变更和修改。
以上对本申请所提供的一种射频测试探针结构、射频测试装置以及***，进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的一般技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (9)

  1. 一种电子元件连接结构，其特征在于，包括连接板、第一元件和第二元件，所述第一元件连接在所述连接板的一侧，所述第二元件连接在所述连接板的另一侧；
    所述第一元件在预设平面上的垂直投影，与所述第二元件在所述预设平面上的垂直投影重叠，或者所述第一元件在预设平面上的垂直投影，与所述第二元件在所述预设平面上的垂直投影的距离小于阈值距离，所述预设平面与所述连接板其中一侧所在的平面平行；
    所述第一元件和所述第二元件在垂直于所述预设平面的方向上的距离大于或者等于所述阈值距离。
  2. 根据权利要求1所述的电子元件连接结构，其特征在于，所述连接板包括第一子连接板和第二子连接板，所述第一元件连接在所述第一子连接板的第一侧，所述第二元件连接在所述第二子连接板的第二侧；
    所述第一子连接板的第二侧与所述第二子连接板的第一侧连接，所述第一子连接板的面积小于所述第二子连接板；
    所述第一子连接板的第一侧与所述第一子连接板的第二侧相对，所述第二子连接板的第一侧与所述第二子连接板的第二侧相对。
  3. 根据权利要求2所述的电子元件连接结构，其特征在于，所述第一元件沉于所述第一子连接板内，所述第一元件和所述第二子连接板在垂直于所述预设平面的方向上的距离大于或者等于预设距离。
  4. 根据权利要求1所述的电子元件连接结构，其特征在于，所述连接板的一侧设置有凸起，所述第一元件连接在所述凸起上。
  5. 根据权利要求2或3所述的电子元件连接结构，其特征在于，所述第一子连接板与所述第二子连接板之间通过焊接的方式连接。
  6. 根据权利要求2或3所述的电子元件连接结构，其特征在于，所述第一子连接板的厚度为0.4mm～1.0mm，所述第二子连接板的厚度为0.4mm～1.0mm。
  7. 根据权利要求1所述的电子元件连接结构，其特征在于，所述第一元件为天线弹片，所述第二元件为SIM卡座，所述连接板为PCB板。
  8. 根据权利要求1所述的电子元件连接结构，其特征在于，所述阈值距离为防止所述第一元件和所述第二元件之间互相产生干扰的最小距离。
  9. 一种电子设备，其特征在于，包括壳体以及如权利要求1至8任意一项所述的电子元件连接结构，所述电子元件连接结构连接于所述壳体内。
PCT/CN2022/075892 2021-04-30 2022-02-10 一种电子元件连接结构以及电子设备 WO2022227785A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP22731460.6A EP4106105B1 (en) 2021-04-30 2022-02-10 Electronic component connection structure and electronic device
US17/791,257 US20240178549A1 (en) 2021-04-30 2022-02-10 Electronic element connection structure and electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202120944650 2021-04-30
CN202120944650.7 2021-04-30

Publications (1)

Publication Number Publication Date
WO2022227785A1 true WO2022227785A1 (zh) 2022-11-03

Family

ID=81536743

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/CN2022/072165 WO2022227718A1 (zh) 2021-04-30 2022-01-14 一种电子元件连接结构以及电子设备
PCT/CN2022/075892 WO2022227785A1 (zh) 2021-04-30 2022-02-10 一种电子元件连接结构以及电子设备

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/072165 WO2022227718A1 (zh) 2021-04-30 2022-01-14 一种电子元件连接结构以及电子设备

Country Status (4)

Country Link
US (2) US20240170830A1 (zh)
EP (2) EP4109918A4 (zh)
CN (2) CN216563498U (zh)
WO (2) WO2022227718A1 (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2565233Y (zh) * 2002-07-23 2003-08-06 宏达国际电子股份有限公司 印刷电路板
US20050017902A1 (en) * 2001-11-20 2005-01-27 Ryuji Oyama Dielectric antenna module
TW200605770A (en) * 2004-07-30 2006-02-01 E Ten Information Sys Co Ltd Method of printed circuit layout for reducing noise interference, printed circuit board, and electronic device
CN201830551U (zh) * 2010-10-21 2011-05-11 中兴通讯股份有限公司 印制电路板、通信模块及通信装置
CN107948355A (zh) * 2017-11-20 2018-04-20 广东欧珀移动通信有限公司 可改善天线辐射性能的电路板及终端设备
CN208460973U (zh) * 2018-06-11 2019-02-01 深圳迈睿智能科技有限公司 同一基板天线

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4682180A (en) * 1985-09-23 1987-07-21 American Telephone And Telegraph Company At&T Bell Laboratories Multidirectional feed and flush-mounted surface wave antenna
TWM331816U (en) * 2007-11-30 2008-05-01 A Men Technology Corp Module structure improvement for expanding and reinforcing the function of SIM card
CN102789590B (zh) * 2011-06-02 2015-09-09 深圳中科讯联科技有限公司 射频sim卡及具有该射频sim卡的移动通信设备
TWI523324B (zh) * 2012-09-14 2016-02-21 宏碁股份有限公司 通訊裝置
CN202838355U (zh) * 2012-10-08 2013-03-27 速码波科技股份有限公司 无线射频识别模块
CN203086534U (zh) * 2013-01-04 2013-07-24 深圳酷比通信设备有限公司 一种智能手机主板及智能手机
CN103762411A (zh) * 2014-02-21 2014-04-30 上海坤锐电子科技有限公司 带天线的苹果手机全卡方案sim卡的卡托
TWM491959U (zh) * 2014-08-29 2014-12-11 Au Optronics Corp 光源裝置
WO2016046184A1 (en) * 2014-09-22 2016-03-31 Féinics Amatech Teoranta Passive smart cards, metal cards, payment objects and smart jewelry
WO2018191898A1 (zh) * 2017-04-19 2018-10-25 广东欧珀移动通信有限公司 插接装置及终端
CN207022058U (zh) * 2017-07-03 2018-02-16 昆山金鹏电子有限公司 高精密抗干扰手机用电路板
CN207020704U (zh) * 2017-07-17 2018-02-16 中兴通讯股份有限公司 Sim卡
CN107454215B (zh) * 2017-07-28 2020-12-04 捷开通讯(深圳)有限公司 防止耦合灵敏度恶化的移动终端
KR102381435B1 (ko) * 2017-10-30 2022-03-31 삼성전자주식회사 전자기 간섭 검출을 위한 안테나 및 그것을 포함하는 휴대용 전자 장치
KR102467737B1 (ko) * 2018-01-03 2022-11-16 삼성전자 주식회사 디스플레이장치 및 안테나 어셈블리
CN111971851B (zh) * 2018-10-26 2022-04-29 华为技术有限公司 一种高带宽的封装天线装置
KR102577623B1 (ko) * 2018-12-06 2023-09-13 삼성전자주식회사 무선 통신을 위한 안테나를 포함하는 전자 장치
CN111836507B (zh) * 2019-04-18 2023-05-05 威刚科技股份有限公司 控制器装置
CN110061038B (zh) * 2019-04-26 2021-08-06 武汉天马微电子有限公司 一种显示面板及显示装置
CN110635234A (zh) * 2019-09-24 2019-12-31 环鸿电子（昆山）有限公司 天线结构
CN211791724U (zh) * 2020-04-30 2020-10-27 无锡宇宁智能科技有限公司 主板和智能穿戴终端

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050017902A1 (en) * 2001-11-20 2005-01-27 Ryuji Oyama Dielectric antenna module
CN2565233Y (zh) * 2002-07-23 2003-08-06 宏达国际电子股份有限公司 印刷电路板
TW200605770A (en) * 2004-07-30 2006-02-01 E Ten Information Sys Co Ltd Method of printed circuit layout for reducing noise interference, printed circuit board, and electronic device
CN201830551U (zh) * 2010-10-21 2011-05-11 中兴通讯股份有限公司 印制电路板、通信模块及通信装置
CN107948355A (zh) * 2017-11-20 2018-04-20 广东欧珀移动通信有限公司 可改善天线辐射性能的电路板及终端设备
CN208460973U (zh) * 2018-06-11 2019-02-01 深圳迈睿智能科技有限公司 同一基板天线

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4106105A4 *

Also Published As

Publication number Publication date
CN216563498U (zh) 2022-05-17
EP4109918A1 (en) 2022-12-28
EP4106105B1 (en) 2024-05-29
WO2022227718A1 (zh) 2022-11-03
EP4106105A4 (en) 2023-08-30
EP4109918A4 (en) 2024-04-03
US20240178549A1 (en) 2024-05-30
CN116420355B (zh) 2024-05-03
US20240170830A1 (en) 2024-05-23
EP4106105A1 (en) 2022-12-21
CN116420355A (zh) 2023-07-11

Similar Documents

Publication Publication Date Title
KR20170100749A (ko) 노트북 컴퓨터
CN107046588B (zh) 显示组件及移动终端
US8882541B2 (en) Socket connector, camera module and terminal device
WO2015077956A1 (zh) 具有新型天线结构的移动终端
WO2021185237A1 (zh) 电路板组件和电子设备
JP2017050235A (ja) コネクタソケット及びコネクタ
WO2022268017A1 (zh) 电子设备
CN107331948B (zh) 天线组件及电子设备
US10827105B1 (en) Lens module and electronic device using the lens module
JP2004310529A (ja) Ｐｃカード
WO2022227785A1 (zh) 一种电子元件连接结构以及电子设备
KR101993374B1 (ko) 휴대용 단말기의 전자 부품 접속 장치
US9773528B1 (en) Socket with branching point
JP4682646B2 (ja) 実装体
US20020141169A1 (en) Electronic apparatus having a plurality of printed board layers
CN210112125U (zh) 镜头模组及电子装置
US20120026699A1 (en) Circuit board of portable electronic device
JP2005122595A (ja) 近接非接触通信機器
CN111403941A (zh) 弹簧针连接器、电子器件连接结构及电子设备
JP2007013014A (ja) 折畳み式携帯電子機器およびフレキシブル配線基板
CN218103663U (zh) 电路板组件和电子设备
US20230246395A1 (en) Electronic device including shielding connector structure
CN210986139U (zh) 不等厚玻璃盖板和移动终端
CN215935193U (zh) 柔性线路板和显示装置
WO2024114151A1 (zh) 连接结构及电子设备

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2022731460

Country of ref document: EP

Effective date: 20220628

WWE Wipo information: entry into national phase

Ref document number: 17791257

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE