WO2022227676A1 - Array substrate, liquid crystal display panel, and liquid crystal display device - Google Patents

Array substrate, liquid crystal display panel, and liquid crystal display device Download PDF

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Publication number
WO2022227676A1
WO2022227676A1 PCT/CN2021/143332 CN2021143332W WO2022227676A1 WO 2022227676 A1 WO2022227676 A1 WO 2022227676A1 CN 2021143332 W CN2021143332 W CN 2021143332W WO 2022227676 A1 WO2022227676 A1 WO 2022227676A1
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WO
WIPO (PCT)
Prior art keywords
array substrate
laser
area
lead
along
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PCT/CN2021/143332
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French (fr)
Chinese (zh)
Inventor
张立志
林欣
康报虹
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惠科股份有限公司
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Publication of WO2022227676A1 publication Critical patent/WO2022227676A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells

Definitions

  • the present application belongs to the field of display technology, and in particular, relates to an array substrate, a liquid crystal display panel and a liquid crystal display device.
  • LCDs Liquid crystal display panels
  • LCDs have the advantages of low radiation, small size and low power consumption, and are widely used in various electronic devices such as notebook computers and televisions.
  • the liquid crystal display panel usually includes an array substrate (thin film transistor, TFT), a color filter substrate (color filter, CF), a liquid crystal (liquid crystal, LC) sandwiched between the array substrate and the color filter substrate, and a sealant frame, etc. .
  • TFT thin film transistor
  • CF color filter substrate
  • LC liquid crystal
  • the array substrate includes a display area and a peripheral area disposed outside the display area. Since the array substrate needs to connect the circuit in the display area with the driving circuit outside the array substrate to realize signal transmission, multiple pads and multiple signal leads are arranged in the peripheral area of the array substrate. Wherein, the first end of each signal lead is connected with a pad, and the second end is connected with the driving circuit outside the array substrate. With this structure, when the circuit in the display area is connected to the pad, the external signal can be transmitted to the inside of the display area of the array substrate to control the display screen.
  • test leads are usually distributed in the peripheral area for testing the display area.
  • the test leads usually need to be disconnected.
  • laser technology is generally used to cut the test leads, and after the cutting is completed, a machine is used to check whether the test leads are completely cut.
  • the embodiments of the present application provide an array substrate, a liquid crystal display panel, and a liquid crystal display device.
  • the subsequent machine detection is assisted, so as to prevent the machine from mistakenly thinking that the area with sparse test leads has not been
  • the test leads cut by the laser are used to prevent false alarms from the machine.
  • an array substrate comprising a base substrate and a metal pattern layer arranged in layers, the array substrate further comprising: a display area and a binding area, the binding area is located on at least one side outside the display area;
  • the metal pattern layer is located in the binding area, the metal pattern layer includes a plurality of pads and a plurality of test leads, and the pads are in one-to-one correspondence with the test leads and are connected;
  • the array substrate further includes: two laser marks arranged along a second direction, and a laser cutting area defined by the two laser marks; the second direction is parallel to the display area and is closest to the bonding area. The direction of the edge of the fixed area;
  • the length of the laser cutting area along the second direction is greater than a preset length; the test leads located in the laser cutting area are all parallel to the first direction, and the distance between two adjacent test leads along the second direction greater than or equal to the first distance, the first direction and the second direction are perpendicular to each other;
  • the array substrate further includes at least one For the auxiliary leads arranged on the same layer as the metal pattern layer, the reference spacing is greater than the first spacing.
  • a metal pattern layer is added between the two adjacent test leads.
  • the auxiliary leads set on the same layer are used to assist the subsequent machine to detect the laser effect, so as to prevent the machine from mistakenly thinking that there are no test leads cut by the laser in the area where the test leads are sparse, thereby preventing the machine from falsely reporting.
  • the two laser marks are respectively a first laser mark and a second laser mark
  • the array substrate further includes at least one of the auxiliary leads;
  • the array substrate further includes at least one of the auxiliary leads.
  • the relationship between the reference distance and the first distance is: Dc ⁇ 2 ⁇ D1+ds;
  • Dc is the reference distance
  • D1 is the first distance
  • ds is the length of the auxiliary lead along the second direction.
  • At least the first spacing is greater than or equal to 25 ⁇ m.
  • the width of the auxiliary lead along the second direction ranges from 2.5 ⁇ m to 100 ⁇ m.
  • the auxiliary lead extends along the first direction, and the length of the auxiliary lead along the first direction is greater than the length of the laser mark along the first direction.
  • the array substrate includes a plurality of auxiliary leads
  • the plurality of auxiliary leads are arranged at intervals along the second direction at a second pitch, and the second pitch is equal to the first distance.
  • the array substrate further includes a first metal pattern layer, an insulating layer, a second metal pattern layer and a pixel electrode layer that are located in the display area and are stacked;
  • the electrode layer is set with the same material.
  • the array substrate further includes a signal line located in the display area, and the signal line is connected to the pad.
  • the metal pattern layer and the signal line are laid on the same layer.
  • the metal pattern layer and the signal line are formed of the same material.
  • the laser marking is laid on the same layer as the pad and the test lead.
  • the laser marking is provided with the same material as the pad and the test lead.
  • a liquid crystal display panel comprising: an opposite substrate and an array substrate as in the first aspect or any possible implementation manner of the first aspect, and a liquid crystal display panel disposed between the opposite substrate and the array substrate the liquid crystal layer in between.
  • a third aspect provides a liquid crystal display device, comprising: the liquid crystal display panel according to the second aspect.
  • Embodiments of the present application provide an array substrate, a liquid crystal display panel, and a liquid crystal display device.
  • an auxiliary lead set on the same layer as the metal pattern layer is added to assist the subsequent machine to detect the laser effect, so as to prevent the machine from mistaking the sparse area of the test lead without the test lead cut by the laser. The purpose of preventing machine false alarms.
  • FIG. 1 is a schematic structural diagram of a liquid crystal display device
  • FIG. 2 is a schematic top view of an array substrate in FIG. 1;
  • Fig. 3 is the structural representation of the binding area in Fig. 2;
  • FIG. 4 is a schematic diagram of the binarized image corresponding to (b) in FIG. 3;
  • FIG. 5 is a schematic structural diagram of a binding area provided by an embodiment of the present application.
  • FIG. 6 is a schematic diagram of the binarized image corresponding to (b) in FIG. 5 .
  • liquid crystal display technology has been widely used in various electronic devices.
  • Electronic equipment that utilizes liquid crystal display technology for display includes a liquid crystal display device, and the liquid crystal display device usually includes a liquid crystal display panel and a driving device for driving the liquid crystal display panel, and the liquid crystal display panel in turn includes an array substrate.
  • the embodiment of the present application provides an array substrate, which is applied to a liquid crystal display device in an electronic device.
  • the electronic devices may be various types of electronic devices such as smart phones, tablet computers, electronic readers, in-vehicle computers, navigators, digital cameras, smart TVs, and smart wearable devices.
  • This embodiment of the present application does not impose any limitation on this.
  • FIG. 1 shows a schematic structural diagram of a liquid crystal display device 100 provided by an embodiment of the present application.
  • the main structure of the liquid crystal display device 100 includes a frame 1 , a cover glass 2 , a liquid crystal display panel 3 , a backlight module 4 , a circuit board 5 , and other electronic accessories including a camera.
  • the circuit board 5 is a driving device for driving the liquid crystal display panel 3 , or is a part of the driving device for driving the liquid crystal display panel 3 .
  • the circuit board 5 may be a flexible circuit board.
  • the liquid crystal display panel 3 includes an array substrate 31 , an opposite substrate 32 , a liquid crystal layer 33 disposed between the array substrate 31 and the opposite substrate 32 , and upper and lower polarizing layers.
  • the array substrate 31 and the opposite substrate 32 are assembled together by the frame sealant, so that the liquid crystal layer 33 is limited in the area surrounded by the frame sealant.
  • the opposite substrate 32 is a color filter substrate.
  • the longitudinal section of the frame 1 is U-shaped, the liquid crystal display panel 3, the backlight module 4, the circuit board 5 and other electronic accessories including cameras are arranged in the frame 1, the backlight module 4 is located under the liquid crystal display panel 3, and the circuit board 5 is located between the backlight module 4 and the frame 1 , and the cover plate 2 is located on the side of the liquid crystal display panel 3 away from the backlight module 4 .
  • FIG. 2 shows a schematic top view of an array substrate 31 in FIG. 1 .
  • the array substrate 31 includes a display area 10 and a peripheral area 20 surrounding the display area 10 .
  • the peripheral area 20 includes a binding area 21 and a non-binding area 22 , and the binding area 21 is disposed in the At least one side outside the display area 10 is illustrated in FIG. 2 by taking the binding area 21 located on the lower side outside the display area 10 as an example.
  • FIG. 3 is a schematic structural diagram of the binding area 21 in FIG. 2 in the exemplary technology.
  • (a) in FIG. 3 is a schematic structural diagram of the test lead before being cut by laser technology in the exemplary technology;
  • (b) in FIG. 3 is a schematic structural diagram of the test lead in the exemplary technology after being cut by laser technology.
  • the display area 10 of the array substrate 31 is provided with various signal lines 11 for displaying, and the bonding area 21 is provided with a plurality of pads 210 arranged along the x direction. , the shape of the pad 210 is a square.
  • a plurality of test leads 220 are also provided in the bonding area 21 , the test leads 220 are bent, and the test leads 220 are in one-to-one correspondence with the pads 210 and are connected.
  • the pads 210 of the bonding area 21 are used to connect with the signal lines 11 in the display area 10, one end of the test leads 220 is connected to the pads 210, and the other end is connected to an external driving circuit, thus,
  • the circuit structure composed of the test lead 220 and the pad 210 can transmit the signal provided by the driving circuit to the inside of the display area 10 in the order of the test lead 220, the pad 210 and the signal line 11 in the display area 10 to control the display screen, The display function of the display area 10 is tested.
  • the plurality of pads 210 are arranged along the second direction (eg, the y-direction).
  • Each pad 210 is connected to one test lead 220 , that is, there are multiple test leads 220 , all the test leads 220 extend along the first direction (eg, the x direction) and are bent, and the x direction and the y direction are perpendicular to each other.
  • a laser cutting area 30 is also distributed in the binding area 21 , and the laser cutting area 30 is defined by two laser marks 310 arranged along the second direction.
  • the test leads 220 in the laser cutting area 30 are all parallel to the first direction x, and the test leads 220 in the laser cutting area 30 will be laser cut off after the test is completed.
  • the size of the laser cutting area 30 is generally determined by the distance between the two laser marks 310 as the length and the side length of the laser mark 310 as the width, thus forming a rectangle 30 of the laser cutting area.
  • the machine When performing laser cutting, the machine first looks for two laser marks 310, and then determines the laser cutting area 30 through the two laser marks 310; then, usually chooses to start from the laser mark 310 that is closer to the edge of the binding area 21 for laser cutting cut. For example, in FIG. 3 , the second laser mark 312 is closer to the edge of the binding area 21 extending along the first direction x than the first laser mark 311 , then the machine starts from the position of the second laser mark 312 to the first laser Laser is performed at the position of the mark 311 , and the test leads 220 located in the laser cutting area 30 are cut off.
  • the machine After the laser technology is used for cutting, the machine also takes pictures of the laser cutting area 30 to generate a corresponding binarized image, and the laser effect is detected according to the binarized image.
  • FIG. 4 is the binarized image corresponding to (b) in FIG. 3 .
  • the pad 210 , the test lead 220 and the laser marker 310 correspond to the white area in FIG. 4
  • the others correspond to the black area in FIG. 4 .
  • the binarized image here is usually a part of the binding area 21 .
  • the machine can determine the laser cutting area 30 according to the binarized image, and then judge whether the laser effect is qualified according to whether the corresponding pixel value in the laser cutting area 30 satisfies the preset condition.
  • the pads 210 in the bonding area 21 are generally unevenly distributed along the second direction y, and the test leads 220 connected thereto are also unevenly distributed along the second direction y.
  • the bending conditions of the test leads 220 are also different, which further leads to uneven distribution of the test leads 220 along the second direction y.
  • the test leads 220 located in the laser cutting area 30 are unevenly distributed along the second direction y.
  • test lead 220 is cut off by the laser, thereby reporting an error.
  • the machine is cut from the position of the second laser mark 312 to the position of the first laser mark 311, when the rightmost test lead 220 is far away from the second laser mark 312, the machine is in the lens range ( Most of the pixel values detected in the region P) as shown in Figure 4 are 0, which meet the preset conditions (for example, 98% of the pixels in the binarized image have a value of 0). Therefore, although there are actually The two test leads 220 were cut by the laser, but the machine would mistakenly think that no test leads 220 were cut by the laser within the scope of the lens, resulting in an error.
  • an embodiment of the present application provides an array substrate, by adding auxiliary leads between test leads with a spacing greater than or equal to a reference spacing, so that when the machine performs laser, the auxiliary leads can be referenced to determine whether any test leads are cut. , so as to prevent the false alarm of the machine.
  • FIG. 5 is a schematic structural diagram of a binding region in an array substrate provided by an embodiment of the present application
  • FIG. 5 is a schematic structural diagram of (a) in FIG. 5 after being cut by a laser
  • FIG. 6 is a schematic diagram of the binarized image corresponding to (b) in FIG. 5 .
  • the array substrate 31 provided in the embodiment of the present application includes: a base substrate 110 and a metal pattern layer 120 arranged in layers, and the array substrate 31 further includes: a display area 10 and a binding area 21 .
  • the area 21 is located on at least one side outside the display area 10 .
  • the display area 10 refers to the area where the array substrate 31 can display images, and can be arranged in the middle area of the array substrate 31 .
  • the display area 10 that is arranged at the center of the array substrate 31 and has a rectangular shape is example.
  • the array substrate 31 usually also includes a peripheral area 20 .
  • the peripheral area 20 refers to an area where images cannot be displayed.
  • the peripheral area 20 is usually arranged around the display area 10 .
  • the peripheral area 20 with the same width surrounding the display area 10 is example.
  • the peripheral area 20 is used for arranging circuit traces and other electronic components for driving.
  • the peripheral area 20 includes a binding area 21 and a non-binding area 22 .
  • the binding area 21 refers to the area of the array substrate 31 used to connect the external driving circuit with the circuit in the display area 10 , and is usually arranged on the side outside the display area 10 . In the embodiment of this application, the binding area 21 is located in the display area 10 . The lower side of the zone 10 is taken as an example.
  • the non-binding area 22 refers to the remaining area in the peripheral area 20 except the over-binding area 21 .
  • the array substrate 31 may include a plurality of binding areas 21 , and the present application does not have any limitation on the number of the binding areas 21 .
  • the multiple binding areas 21 may be distributed on the same side outside the display area 10 at the same time, or may be distributed on different sides outside the display area 10 , which is not limited in any embodiment of the present application.
  • the metal pattern layer 120 is located in the bonding area 21 , and the metal pattern layer 120 includes a plurality of bonding pads 210 and a plurality of test leads 220 , and the bonding pads 210 are in one-to-one correspondence with the test leads 220 and are connected.
  • the pad 210 is used to connect with the signal line 11 in the display area 10, and the end of the test lead 220 that is not connected to the pad 210 is used to connect to an external drive circuit, so that the external drive circuit, test
  • the leads 220 , the pads 210 , and the signal lines 11 in the display area 10 can form a conducting loop, and transmit external signals to the inside of the display area 10 to test the display function of the display area 10 .
  • the number and arrangement of the pads 210, as well as the number and wiring of the test leads 220 can be set as required, which is not limited in this embodiment of the present application.
  • the metal pattern layer 120 can be laid on the same layer as the signal lines 11 of the display area 10, and the metal pattern layer 120 can also be laid with the same material as the signal lines 11 of the display area 10 to save costs. Of course, it can also be It is not the same material, and the embodiments of the present application do not impose any limitation on this.
  • the array substrate 31 further includes: two laser marks 310 arranged along the second direction, and a laser cutting area 30 defined by the two laser marks 310 .
  • the second direction is the direction in which the edge of the display area 10 closest to the binding area 21 is located.
  • the laser marker 310, the pad 210 and the test lead 220 can be laid on the same layer, and the laser marker 310, the pad 210 and the test lead 220 can also be made of the same material. In this way, the laser marker 310 is convenient for machine positioning and use, and does not will be lasered off.
  • the binding area 21 is located on the lower side of the display area 10, the edge of the display area 10 closest to the binding area 21 is the edge of the lower side, and the direction in which the edge is located is the horizontal direction, that is, the second direction. is the horizontal direction y.
  • the two laser marks 310 are arranged along the horizontal direction y.
  • the first direction is perpendicular to the second direction, and the first direction is the vertical direction x.
  • the distance between the two laser marks 310 is the length of the laser cutting area 30 along the second direction y, the length of the laser mark 310 along the first direction x, That is, the length of the laser cutting region 30 along the first direction x.
  • a rectangular laser cutting area 30 can be defined by the two laser marks 310 .
  • the laser marking 310 is used to define the laser cutting area 30 , so that the machine can subsequently determine the laser cutting area 30 according to the laser marking 310 , and then perform laser cutting on the test leads 220 located in the laser cutting area 30 .
  • the length of the laser cutting area 30 along the second direction is greater than the predetermined length; the test leads 220 located in the laser cutting area 30 are all parallel to the first direction, and the distance between two adjacent test leads 220 along the second direction is greater than or equal to the first direction. At a distance, the first direction and the second direction are perpendicular to each other.
  • the length of the laser cutting region 30 along the second direction is greater than the predetermined length, that is, the distance between the two laser marks 310 is greater than the predetermined length.
  • the preset length is set as required, and this embodiment of the present application does not impose any restrictions on this.
  • the scope of the lens detected by the machine is usually less than 3000 ⁇ m, so the preset length can be set to 3000 ⁇ m. Based on this, when the machine uses a laser mark 310 as a reference point to detect the laser effect of the laser cutting area 30, Another laser marker 310 does not appear on the lens range, so there are no false positives.
  • the effective cutting length for each test lead 220 is the cross-sectional length of the test lead 220, thereby avoiding wasting laser energy .
  • the distance between the two adjacent test leads 220 along the second direction is greater than or equal to the first distance, a short circuit can be avoided.
  • the array substrate 31 further includes at least one test lead 220 and a metal pattern layer. 120
  • the reference spacing is greater than the first spacing.
  • the reference distance can be set as required, which is not limited in this embodiment of the present application.
  • the reference distance is greater than the first distance.
  • the test leads 220 are relatively sparse.
  • an auxiliary lead 40 can be added between the two sparse test leads 220, and the auxiliary lead 40 can be used as a reference. detection accuracy.
  • the auxiliary leads 40 and the metal pattern layer 120 are arranged in the same layer, that is, the auxiliary leads 40 and the test leads 220 are arranged in the same layer. Therefore, during subsequent laser cutting, the auxiliary leads 40 located in the laser cutting area 30 can be Cut off at the same time as the test leads 220 .
  • the embodiment of the present application provides an array substrate, in the laser cutting area, when the distance between two adjacent test leads along the second direction is greater than or equal to the reference distance, by adding between the two adjacent test leads and
  • the auxiliary lead set on the same layer of the metal pattern layer is used to assist the subsequent machine to detect the laser effect, so as to avoid the machine from misunderstanding that there is no test lead cut by the laser in the sparse area of the test lead, thus preventing the machine from false alarm.
  • the two laser marks 310 are a first laser mark 311 and a second laser mark 312 respectively.
  • the array substrate 31 further includes at least one auxiliary lead 40 .
  • the array substrate 31 further includes at least one auxiliary lead 40 .
  • the laser mark 310 near the left side of the binding area 21 is the first laser mark 311
  • the laser mark 310 near the right side of the binding area 21 is the second laser mark 312 .
  • the positions of the two laser marks 310 can also be interchanged, which is not limited in this embodiment of the present application.
  • test lead 220 closest to the first laser mark 311 is the leftmost test lead 220 (G1 in FIG. 5 ), and the test lead 220 closest to the second laser mark 312 is the rightmost test lead 220 (Gn in Figure 5).
  • an auxiliary lead 40 is also added between the test lead G1 and the first laser mark 311 .
  • auxiliary leads 40 may be arranged between the distances, which may be specifically arranged as required, which is not limited in this application.
  • the auxiliary lead 40 and the auxiliary lead 40 added between the two test leads 220 may have the same structure.
  • an auxiliary lead 40 is also added between the test lead Gn and the second laser mark 312 .
  • a plurality of auxiliary leads 40 may be arranged between the distances, which may be specifically arranged as required, which is not limited in this application.
  • the auxiliary lead 40 and the auxiliary lead 40 added between the two test leads 220 may have the same structure.
  • the auxiliary lead 40 extends along the first direction and the length of the auxiliary lead 40 along the first direction is greater than the length of the laser marking 310 along the first direction.
  • the auxiliary lead 40 is parallel to the first direction x, that is, the auxiliary lead 40 is parallel to the test lead 220, which can prevent the auxiliary lead 40 from being too wide to waste laser energy.
  • the auxiliary lead 40 in the laser cutting area 30 will be After being cut off, the auxiliary leads 40 located outside the laser cutting area 30 will continue to remain, and the remaining part can be used as a reference to judge the laser cutting effect when the subsequent machine performs detection.
  • the machine checks the laser effect according to the binarized image (Fig. 6) corresponding to (b) in FIG. 40 and the laser mark 310 correspond to the white areas in FIG. 6 , and the others correspond to the black areas in FIG. 6 .
  • the machine detects that 80% of the pixels in the lens range (area P1 as shown in Figure 6) have a value of 0, which does not meet the preset conditions (for example, 98% of the pixels in the binarized image have a value of 0). 0), thus, the machine can determine that the test lead 220 is cut by laser cutting.
  • the plurality of auxiliary leads 40 are arranged along the second direction at a second interval, and the second interval is equal to the first interval.
  • auxiliary leads 40 are arranged along the second direction with a second pitch, and at this time, the problem of short circuit in the laser process can be avoided.
  • the width of the auxiliary lead 40 along the second direction ranges from 2.5 ⁇ m to 100 ⁇ m.
  • the width of the auxiliary lead 40 along the second direction preferably ranges from 2.5 ⁇ m to 100 ⁇ m.
  • the width ds of the auxiliary lead 40 along the second direction y is 2.5 ⁇ m, or the width ds of the auxiliary lead 40 along the second direction y is 100 ⁇ m.
  • the relationship between the reference distance and the first distance is: Dc ⁇ 2 ⁇ D1+ds; wherein, Dc is the reference distance, D1 is the first distance, and ds is the second distance along the auxiliary lead 40 . Length in direction y.
  • the auxiliary lead 40 of ds plays the role of auxiliary detection.
  • the reference distance is greater than 2 ⁇ D1+ds
  • the distance between the two adjacent test leads 220 along the second direction y is greater than or equal to the reference distance, and between the two adjacent test leads 220, a plurality of test leads 220 with a width of ds can be added.
  • the auxiliary lead 40 has the effect of assisting detection.
  • the distance between the test lead 220 closest to the first laser mark and the first laser mark 311 along the second direction y is equal to the reference distance, and the distance between the two can be An auxiliary lead 40 with a width of ds is added to play an auxiliary detection effect.
  • the reference distance is greater than 2 ⁇ D1+ds
  • the distance between the test lead 220 closest to the first laser mark and the first laser mark 311 is greater than or equal to the reference distance, and a plurality of strips with a width of ds can be added between the two.
  • the auxiliary lead 40 has the effect of assisting detection.
  • the distance between the test lead 220 closest to the second laser mark 312 and the second laser mark 312 along the second direction y is equal to the reference distance.
  • An auxiliary lead 40 with a width of ds can be added between them to play an auxiliary detection effect.
  • the reference distance is greater than 2 ⁇ D1+ds
  • the distance between the test lead 220 closest to the second laser mark 312 and the second laser mark 312 is greater than or equal to the reference distance, and a plurality of strips with a width of ds can be added between the two
  • the auxiliary lead 40 has the effect of assisting detection.
  • At least the first pitch is greater than or equal to 25 ⁇ m.
  • the value of the first spacing may be at least greater than or equal to 25 ⁇ m.
  • the array substrate 31 further includes a first metal pattern layer, an insulating layer, a second metal pattern layer and a pixel electrode layer which are located in the display area 10 and are stacked and disposed;
  • auxiliary lead 40 and the first metal pattern layer, or the auxiliary lead 40 and the insulating layer, or the auxiliary lead 40 and the second metal pattern layer, or the auxiliary lead 40 and the pixel electrode layer are provided with the same material.
  • auxiliary lead 40 and the first metal pattern layer, or the auxiliary lead 40 and the insulating layer, or the auxiliary lead 40 and the second metal pattern layer, or the auxiliary lead 40 and the pixel electrode layer are provided with the same material, it is possible to Simplify the process and increase productivity.
  • Embodiments of the present application further provide a liquid crystal display panel, comprising: an opposite substrate and the above-mentioned array substrate, and a liquid crystal layer disposed between the opposite substrate and the array substrate.
  • Embodiments of the present application further provide a liquid crystal display device 100, including: the liquid crystal display panel as described above.

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Abstract

An array substrate (31), a liquid crystal display panel (3), and a liquid crystal display device (100). The array substrate (31) comprises: a base substrate (110) and a metal pattern layer (120) that are stacked. The array substrate (31) further comprises: a display area (10) and a binding area (21); the binding area (21) is located outside at least one side of the display area (10); the metal pattern layer (120) is located in the binding area (21), and the metal pattern layer (120) comprises a plurality of pads (210) and a plurality of test leads (220). The array substrate (31) further comprises: two laser markers (310) arranged in a second direction (y), and a laser cutting area (30) defined by the two laser markers (310); in the laser cutting area (30), when the pitch between two adjacent test leads (220) in the second direction (y) is greater than or equal to a reference pitch, the array substrate (31) further comprises, between the two adjacent test leads (220), at least one auxiliary lead (40) arranged in the same layer as the metal pattern layer (120). An auxiliary lead (40) is added between the sparse test leads (220) to assist subsequent machine detection, thereby achieving the purpose of preventing misinformation of a machine.

Description

阵列基板、液晶显示面板及液晶显示装置Array substrate, liquid crystal display panel and liquid crystal display device
本申请要求于2021年04月29日在中华人民共和国国家知识产权局专利局提交的、申请号为202110477213.3、申请名称为“阵列基板、液晶显示面板及液晶显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。This application claims the priority of the Chinese patent application with the application number of 202110477213.3 and the application name of "array substrate, liquid crystal display panel and liquid crystal display device", which was filed in the Patent Office of the State Intellectual Property Office of the People's Republic of China on April 29, 2021 , the entire contents of which are incorporated herein by reference.
技术领域technical field
本申请属于显示技术领域，尤其涉及一种阵列基板、液晶显示面板及液晶显示装置。The present application belongs to the field of display technology, and in particular, relates to an array substrate, a liquid crystal display panel and a liquid crystal display device.
背景技术Background technique
液晶显示面板（liquid crystal display，LCD）具有低辐射、体积小及低耗能等优点，被广泛的应用于笔记本电脑、电视等各种电子设备中。Liquid crystal display panels (LCDs) have the advantages of low radiation, small size and low power consumption, and are widely used in various electronic devices such as notebook computers and televisions.
其中，液晶显示面板通常包括阵列基板（thin film transistor，TFT）、彩膜基板（color filter，CF）、夹在阵列基板和彩膜基板之间的液晶（liquid crystal，LC）以及密封胶框等。Among them, the liquid crystal display panel usually includes an array substrate (thin film transistor, TFT), a color filter substrate (color filter, CF), a liquid crystal (liquid crystal, LC) sandwiched between the array substrate and the color filter substrate, and a sealant frame, etc. .
阵列基板包括显示区和设置在显示区外的周边区。由于阵列基板需要将显示区内的电路与阵列基板外部的驱动电路连接起来以实现信号传递，因此，在阵列基板的周边区内，设置有多个焊盘和多条信号引线。其中，每条信号引线的第一端与一个焊盘相连接，第二端与阵列基板外部的驱动电路相连接。利用该结构，当显示区内的电路与焊盘相连接时，即可将外界信号传递到阵列基板的显示区内部，以控制显示画面。The array substrate includes a display area and a peripheral area disposed outside the display area. Since the array substrate needs to connect the circuit in the display area with the driving circuit outside the array substrate to realize signal transmission, multiple pads and multiple signal leads are arranged in the peripheral area of the array substrate. Wherein, the first end of each signal lead is connected with a pad, and the second end is connected with the driving circuit outside the array substrate. With this structure, when the circuit in the display area is connected to the pad, the external signal can be transmitted to the inside of the display area of the array substrate to control the display screen.
此外，在周边区通常还分布有一些焊盘和测试引线，用于对显示区进行测试，当测试完成后，为了避免后续出现短路问题，通常需要将测试引线断开。在范例技术中，一般会使用镭射技术对测试引线切割，切割完成后再利用机台来检查测试引线是否被完全切断。In addition, some pads and test leads are usually distributed in the peripheral area for testing the display area. When the test is completed, in order to avoid subsequent short circuit problems, the test leads usually need to be disconnected. In the exemplary technology, laser technology is generally used to cut the test leads, and after the cutting is completed, a machine is used to check whether the test leads are completely cut.
然而，在实际操作过程中，由于机台的检测范围、检测精度受限等问题，导致机台将一些测试引线被切割的地方误判为没有测试引线被切割，进而导致检测结果不准确，由此，亟待一种能辅助提高检测效果，避免机台出现误报的阵列基板。However, in the actual operation process, due to the limited detection range and detection accuracy of the machine, the machine misjudged the places where some test leads were cut as no test leads were cut, resulting in inaccurate test results. Therefore, there is an urgent need for an array substrate that can assist in improving the detection effect and avoid false alarms in the machine.
技术问题technical problem
本申请实施例提供了一种阵列基板、液晶显示面板及液晶显示装置，通过在稀疏的测试引线之间增设辅助引线，来辅助后续机台检测，避免机台误以为测试引线稀疏的区域没有被镭射切断的测试引线，从而起到防止机台误报的目的。The embodiments of the present application provide an array substrate, a liquid crystal display panel, and a liquid crystal display device. By adding auxiliary leads between the sparse test leads, the subsequent machine detection is assisted, so as to prevent the machine from mistakenly thinking that the area with sparse test leads has not been The test leads cut by the laser are used to prevent false alarms from the machine.
技术解决方案technical solutions
第一方面，提供了一种阵列基板，包括层叠设置的衬底基板和金属图案层，所述阵列基板还包括：显示区和绑定区，所述绑定区位于显示区外至少一侧；In a first aspect, an array substrate is provided, comprising a base substrate and a metal pattern layer arranged in layers, the array substrate further comprising: a display area and a binding area, the binding area is located on at least one side outside the display area;
所述金属图案层位于所述绑定区，所述金属图案层包括多个焊盘和多条测试引线，所述焊盘与所述测试引线一一对应且连接；The metal pattern layer is located in the binding area, the metal pattern layer includes a plurality of pads and a plurality of test leads, and the pads are in one-to-one correspondence with the test leads and are connected;
所述阵列基板还包括：沿第二方向排布的两个镭射标记，以及由所述两个镭射标记限定出的镭射切割区；所述第二方向平行于所述显示区最靠近所述绑定区的边沿所在的方向；The array substrate further includes: two laser marks arranged along a second direction, and a laser cutting area defined by the two laser marks; the second direction is parallel to the display area and is closest to the bonding area. The direction of the edge of the fixed area;
所述镭射切割区沿第二方向的长度大于预设长度；位于所述镭射切割区中的所述测试引线均平行于所述第一方向，且相邻两条测试引线沿第二方向的间距大于或等于第一间距，所述第一方向与所述第二方向相互垂直；The length of the laser cutting area along the second direction is greater than a preset length; the test leads located in the laser cutting area are all parallel to the first direction, and the distance between two adjacent test leads along the second direction greater than or equal to the first distance, the first direction and the second direction are perpendicular to each other;
在所述镭射切割区中，当所述相邻两条测试引线沿第二方向的间距大于或等于参考间距时，在所述相邻两条测试引线之间，所述阵列基板还包括至少一条与所述金属图案层同层设置的辅助引线，所述参考间距大于所述第一间距。In the laser cutting area, when the distance between the two adjacent test leads along the second direction is greater than or equal to the reference distance, between the two adjacent test leads, the array substrate further includes at least one For the auxiliary leads arranged on the same layer as the metal pattern layer, the reference spacing is greater than the first spacing.
第一方面提供的阵列基板，在镭射切割区中，当相邻两条测试引线沿第二方向的间距大于或者等于参考间距时，通过在相邻两条测试引线之间，增设与金属图案层同层设置的辅助引线，来辅助后续机台对镭射效果进行检测，避免机台误以为测试引线稀疏的区域没有被镭射切断的测试引线，从而起到防止机台误报的目的。In the array substrate provided by the first aspect, in the laser cutting area, when the distance between two adjacent test leads along the second direction is greater than or equal to the reference distance, a metal pattern layer is added between the two adjacent test leads. The auxiliary leads set on the same layer are used to assist the subsequent machine to detect the laser effect, so as to prevent the machine from mistakenly thinking that there are no test leads cut by the laser in the area where the test leads are sparse, thereby preventing the machine from falsely reporting.
在第一方面一种可能的实现方式中，所述两个镭射标记分别为第一镭射标记和第二镭射标记；In a possible implementation manner of the first aspect, the two laser marks are respectively a first laser mark and a second laser mark;
当最靠近所述第一镭射标记的测试引线与所述第一镭射标记之间沿所述第二方向的间距大于或等于所述参考间距时，在所述最靠近所述第一镭射标记的测试引线与所述第一镭射标记之间，所述阵列基板还包括至少一条所述辅助引线；When the distance along the second direction between the test lead closest to the first laser mark and the first laser mark is greater than or equal to the reference distance, the distance between the test lead closest to the first laser mark and the first laser mark is greater than or equal to the reference distance. Between the test lead and the first laser mark, the array substrate further includes at least one of the auxiliary leads;
当最靠近所述第二镭射标记的测试引线与所述第二镭射标记之间沿所述第二方向的间距大于或等于所述参考间距时，在所述最靠近所述第二镭射标记的测试引线与所述第二镭射标记之间，所述阵列基板还包括至少一条所述辅助引线。When the distance between the test lead closest to the second laser mark and the second laser mark along the second direction is greater than or equal to the reference distance, the distance between the test lead closest to the second laser mark and the second laser mark is greater than or equal to the reference distance. Between the test lead and the second laser mark, the array substrate further includes at least one of the auxiliary leads.
在第一方面一种可能的实现方式中，所述参考间距与所述第一间距之间的关系为：Dc≥2×D1+ds；In a possible implementation manner of the first aspect, the relationship between the reference distance and the first distance is: Dc≥2×D1+ds;
其中，Dc为所述参考间距，D1为所述第一间距，ds为所述辅助引线沿第二方向的长度。在该实现方式中，相邻两条测试引线之间的间距大于或等于参考间距时，在其间距之间至少可以设置一条宽度为ds的辅助引线。Wherein, Dc is the reference distance, D1 is the first distance, and ds is the length of the auxiliary lead along the second direction. In this implementation manner, when the distance between two adjacent test leads is greater than or equal to the reference distance, at least one auxiliary lead with a width of ds may be set between the distances.
在第一方面一种可能的实现方式中，所述第一间距的至少大于或等于25μm。In a possible implementation manner of the first aspect, at least the first spacing is greater than or equal to 25 μm.
在第一方面一种可能的实现方式中，所述辅助引线沿第二方向的宽度的取值范围为2.5μm~100μm。In a possible implementation manner of the first aspect, the width of the auxiliary lead along the second direction ranges from 2.5 μm to 100 μm.
在第一方面一种可能的实现方式中，所述辅助引线沿所述第一方向延伸且所述辅助引线沿第一方向的长度大于所述镭射标记沿第一方向的长度。In a possible implementation manner of the first aspect, the auxiliary lead extends along the first direction, and the length of the auxiliary lead along the first direction is greater than the length of the laser mark along the first direction.
在第一方面一种可能的实现方式中，当所述阵列基板包括多条辅助引线时，所述多条辅助引线沿所述第二方向以第二间距间隔排布，所述第二间距等于所述第一间距。In a possible implementation manner of the first aspect, when the array substrate includes a plurality of auxiliary leads, the plurality of auxiliary leads are arranged at intervals along the second direction at a second pitch, and the second pitch is equal to the first distance.
在第一方面一种可能的实现方式中，所述阵列基板还包括位于显示区且层叠设置的第一金属图案层、绝缘层、第二金属图案层和像素电极层；In a possible implementation manner of the first aspect, the array substrate further includes a first metal pattern layer, an insulating layer, a second metal pattern layer and a pixel electrode layer that are located in the display area and are stacked;
所述辅助引线与所述第一金属图案层，或者，所述辅助引线与所述绝缘层，或者，所述辅助引线与所述第二金属图案层，或者，所述辅助引线与所述像素电极层同材料设置。The auxiliary wire and the first metal pattern layer, or the auxiliary wire and the insulating layer, or the auxiliary wire and the second metal pattern layer, or the auxiliary wire and the pixel The electrode layer is set with the same material.
在第一方面一种可能的实现方式中，所述阵列基板还包括位于显示区的信号线，所述信号线与所述焊盘相连接。In a possible implementation manner of the first aspect, the array substrate further includes a signal line located in the display area, and the signal line is connected to the pad.
在第一方面一种可能的实现方式中，所述金属图案层和所述信号线同层铺设。In a possible implementation manner of the first aspect, the metal pattern layer and the signal line are laid on the same layer.
在第一方面一种可能的实现方式中，所述金属图案层和所述信号线同材料设置。In a possible implementation manner of the first aspect, the metal pattern layer and the signal line are formed of the same material.
在第一方面一种可能的实现方式中，所述镭射标记与所述焊盘、所述测试引线同层铺设。In a possible implementation manner of the first aspect, the laser marking is laid on the same layer as the pad and the test lead.
在第一方面一种可能的实现方式中，所述镭射标记与所述焊盘、所述测试引线同材料设置。In a possible implementation manner of the first aspect, the laser marking is provided with the same material as the pad and the test lead.
第二方面，提供一种液晶显示面板，包括：对置基板和如第一方面或第一方面的任意可能的实现方式中的阵列基板，以及设置在所述对置基板和所述阵列基板之间的液晶层。In a second aspect, a liquid crystal display panel is provided, comprising: an opposite substrate and an array substrate as in the first aspect or any possible implementation manner of the first aspect, and a liquid crystal display panel disposed between the opposite substrate and the array substrate the liquid crystal layer in between.
第三方面，提供一种液晶显示装置，包括：如第二方面所述的液晶显示面板。A third aspect provides a liquid crystal display device, comprising: the liquid crystal display panel according to the second aspect.
有益效果beneficial effect
本申请实施例提供了一种阵列基板、液晶显示面板及液晶显示装置，在镭射切割区中，当相邻两条测试引线沿第二方向的间距大于或者等于参考间距时，通过在相邻两条测试引线之间，增设与金属图案层同层设置的辅助引线，来辅助后续机台对镭射效果进行检测，避免机台误以为测试引线稀疏的区域没有被镭射切断的测试引线，从而起到防止机台误报的目的。Embodiments of the present application provide an array substrate, a liquid crystal display panel, and a liquid crystal display device. In the laser cutting area, when the distance between two adjacent test leads along the second direction is greater than or equal to the reference distance, the Between the test leads, an auxiliary lead set on the same layer as the metal pattern layer is added to assist the subsequent machine to detect the laser effect, so as to prevent the machine from mistaking the sparse area of the test lead without the test lead cut by the laser. The purpose of preventing machine false alarms.
附图说明Description of drawings
为了更清楚地说明本申请实施例技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to explain the technical solutions of the embodiments of the present application more clearly, the following briefly introduces the accompanying drawings used in the description of the embodiments. For those of ordinary skill, other drawings can also be obtained from these drawings without any creative effort.
图1是一种液晶显示装置的结构示意图；1 is a schematic structural diagram of a liquid crystal display device;
图2是图1中的一种阵列基板的俯视示意图；FIG. 2 is a schematic top view of an array substrate in FIG. 1;
图3是图2中的绑定区的结构示意图；Fig. 3 is the structural representation of the binding area in Fig. 2;
图4是图3中的（b）对应的二值化图像的示意图；FIG. 4 is a schematic diagram of the binarized image corresponding to (b) in FIG. 3;
图5是本申请实施例提供的一种绑定区的结构示意图；FIG. 5 is a schematic structural diagram of a binding area provided by an embodiment of the present application;
图6是图5中的（b）对应的二值化图像的示意图。FIG. 6 is a schematic diagram of the binarized image corresponding to (b) in FIG. 5 .
附图标记：Reference number:
1-框架；2-盖板玻璃；3-液晶显示面板；4-背光模组；5-电路板；10-显示区；11-信号线；20-周边区；21-绑定区；22-非绑定区；31-阵列基板；32-对置基板；33-液晶层；100-液晶显示装置；110-衬底基板；120-金属图案层；210-焊盘；220-测试引线；30-镭射切割区；310-镭射标记；311-第一镭射标记；312-第二镭射标记；40-辅助引线。1-frame; 2-cover glass; 3-liquid crystal display panel; 4-backlight module; 5-circuit board; 10-display area; 11-signal line; 20-peripheral area; 21-binding area; 22- 31-array substrate; 32-opposing substrate; 33-liquid crystal layer; 100-liquid crystal display device; 110-substrate substrate; 120-metal pattern layer; 210-pad; 220-test lead; 30 -Laser cutting area; 310-Laser mark; 311-First laser mark; 312-Second laser mark; 40-Auxiliary lead.
本申请目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。The realization, functional characteristics and advantages of the purpose of the present application will be further described with reference to the accompanying drawings in conjunction with the embodiments.
本发明的实施方式Embodiments of the present invention
应当理解，此处所描述的具体实施例仅仅用以解释本申请，并不用于限定本申请。It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application.
随着显示技术的发展，液晶显示技术已被广泛的应用于各种电子设备中。利用液晶显示技术进行显示的电子设备包括液晶显示装置，而液晶显示装置通常包括液晶显示面板和用于驱动液晶显示面板的驱动装置，液晶显示面板又包括阵列基板。本申请实施例提供了一种阵列基板，应用于电子设备中的液晶显示装置中。With the development of display technology, liquid crystal display technology has been widely used in various electronic devices. Electronic equipment that utilizes liquid crystal display technology for display includes a liquid crystal display device, and the liquid crystal display device usually includes a liquid crystal display panel and a driving device for driving the liquid crystal display panel, and the liquid crystal display panel in turn includes an array substrate. The embodiment of the present application provides an array substrate, which is applied to a liquid crystal display device in an electronic device.
其中，电子设备可以为智能手机、平板电脑、电子阅读器、车载电脑、导航仪、数码相机、智能电视机以及智能可穿戴设备等多种不同类型的电子设备。本申请实施例对此不进行任何限制。Among them, the electronic devices may be various types of electronic devices such as smart phones, tablet computers, electronic readers, in-vehicle computers, navigators, digital cameras, smart TVs, and smart wearable devices. This embodiment of the present application does not impose any limitation on this.
图1示出了本申请实施例提供的一种液晶显示装置100的结构示意图。如图1所示，液晶显示装置100的主要结构包括框架1、盖板玻璃2、液晶显示面板3、背光模组4、电路板5以及包括摄像头等的其他电子配件。其中，电路板5为用于驱动液晶显示面板3的驱动装置，或者为驱动液晶显示面板3的驱动装置的一部分。此外，电路板5可以是柔性电路板。FIG. 1 shows a schematic structural diagram of a liquid crystal display device 100 provided by an embodiment of the present application. As shown in FIG. 1 , the main structure of the liquid crystal display device 100 includes a frame 1 , a cover glass 2 , a liquid crystal display panel 3 , a backlight module 4 , a circuit board 5 , and other electronic accessories including a camera. The circuit board 5 is a driving device for driving the liquid crystal display panel 3 , or is a part of the driving device for driving the liquid crystal display panel 3 . Furthermore, the circuit board 5 may be a flexible circuit board.
如图1所示，液晶显示面板3包括阵列基板31、对置基板32、设置于阵列基板31和对置基板32之间的液晶层33、以及上下偏光层等。阵列基板31和对置基板32通过封框胶对合在一起，从而将液晶层33限定在封框胶围成的区域内。其中，当彩色滤光层设置于对置基板32上时，对置基板32为彩膜基板。As shown in FIG. 1 , the liquid crystal display panel 3 includes an array substrate 31 , an opposite substrate 32 , a liquid crystal layer 33 disposed between the array substrate 31 and the opposite substrate 32 , and upper and lower polarizing layers. The array substrate 31 and the opposite substrate 32 are assembled together by the frame sealant, so that the liquid crystal layer 33 is limited in the area surrounded by the frame sealant. Wherein, when the color filter layer is disposed on the opposite substrate 32, the opposite substrate 32 is a color filter substrate.
框架1的纵截面呈U型，液晶显示面板3、背光模组4、电路板5以及包括摄像头等的其他电子配件设置于框架1内，背光模组4位于液晶显示面板3的下方，电路板5位于背光模组4和框架1之间，盖板2位于液晶显示面板3远离背光模组4的一侧。The longitudinal section of the frame 1 is U-shaped, the liquid crystal display panel 3, the backlight module 4, the circuit board 5 and other electronic accessories including cameras are arranged in the frame 1, the backlight module 4 is located under the liquid crystal display panel 3, and the circuit board 5 is located between the backlight module 4 and the frame 1 , and the cover plate 2 is located on the side of the liquid crystal display panel 3 away from the backlight module 4 .
图1的液晶显示装置100中的光路传播顺序为：背光模组4射出，依次透过液晶显示面板3中的阵列基板31、液晶层33、对置基板32，再射出盖板2。The light path propagation sequence in the liquid crystal display device 100 of FIG.
其中，在图1的基础上，图2示出了图1中的一种阵列基板31的俯视示意图。如图2所示，在该俯视示意图中，阵列基板31包括显示区10和环绕显示区10的周边区20，周边区20包括绑定区21和非绑定区22，绑定区21设置在显示区10外至少一侧，图2中以绑定区21位于显示区10外的下方一侧为例进行示意。Wherein, on the basis of FIG. 1 , FIG. 2 shows a schematic top view of an array substrate 31 in FIG. 1 . As shown in FIG. 2 , in this schematic top view, the array substrate 31 includes a display area 10 and a peripheral area 20 surrounding the display area 10 . The peripheral area 20 includes a binding area 21 and a non-binding area 22 , and the binding area 21 is disposed in the At least one side outside the display area 10 is illustrated in FIG. 2 by taking the binding area 21 located on the lower side outside the display area 10 as an example.
图3是范例技术中图2中的绑定区21的结构示意图。其中，图3中的（a）是范例技术中测试引线被镭射技术切割之前的结构示意图；图3中的（b）是范例技术中测试引线被镭射技术切割之后的结构示意图。FIG. 3 is a schematic structural diagram of the binding area 21 in FIG. 2 in the exemplary technology. Wherein, (a) in FIG. 3 is a schematic structural diagram of the test lead before being cut by laser technology in the exemplary technology; (b) in FIG. 3 is a schematic structural diagram of the test lead in the exemplary technology after being cut by laser technology.
如图2和图3所示，阵列基板31的显示区10中设置有用于进行显示的多种信号线11，绑定区21设置有沿x方向排布的多个焊盘210，示例性的，焊盘210的形状为方形。此外，绑定区21中还设置有多条测试引线220，测试引线220呈弯折状，且测试引线220与焊盘210一一对应且连接。As shown in FIG. 2 and FIG. 3 , the display area 10 of the array substrate 31 is provided with various signal lines 11 for displaying, and the bonding area 21 is provided with a plurality of pads 210 arranged along the x direction. , the shape of the pad 210 is a square. In addition, a plurality of test leads 220 are also provided in the bonding area 21 , the test leads 220 are bent, and the test leads 220 are in one-to-one correspondence with the pads 210 and are connected.
应理解，绑定区21的焊盘210用于与显示区10中的信号线11相连接，测试引线220的一端与焊盘210相连接，另一端与外部的驱动电路相连接，由此，测试引线220和焊盘210组成的电路结构即可将驱动电路提供的信号按照测试引线220、焊盘210、显示区10中的信号线11的顺序传输至显示区10内部，以控制显示画面，对显示区10的显示功能进行测试。It should be understood that the pads 210 of the bonding area 21 are used to connect with the signal lines 11 in the display area 10, one end of the test leads 220 is connected to the pads 210, and the other end is connected to an external driving circuit, thus, The circuit structure composed of the test lead 220 and the pad 210 can transmit the signal provided by the driving circuit to the inside of the display area 10 in the order of the test lead 220, the pad 210 and the signal line 11 in the display area 10 to control the display screen, The display function of the display area 10 is tested.
示例性的，如图3所示，以多个焊盘210为例，该多个焊盘210沿第二方向（如y方向）排布。每个焊盘210连接一条测试引线220，即有多条测试引线220，所有测试引线220均沿第一方向（如x方向）延伸且呈弯折状，x方向和y方向相互垂直。Exemplarily, as shown in FIG. 3 , taking a plurality of pads 210 as an example, the plurality of pads 210 are arranged along the second direction (eg, the y-direction). Each pad 210 is connected to one test lead 220 , that is, there are multiple test leads 220 , all the test leads 220 extend along the first direction (eg, the x direction) and are bent, and the x direction and the y direction are perpendicular to each other.
在绑定区21还分布有一个镭射切割区30，该镭射切割区30由沿第二方向排布的两个镭射标记310限定出来。该镭射切割区30中的测试引线220均平行于第一方向x，位于该镭射切割区30中的测试引线220在完成测试后将被镭射切割掉。其中，以镭射标记310为方形为例，镭射切割区30的尺寸通常以两个镭射标记310之间的间距为长度，以镭射标记310的边长为宽度来确定出，由此，形成一个矩形的镭射切割区30。A laser cutting area 30 is also distributed in the binding area 21 , and the laser cutting area 30 is defined by two laser marks 310 arranged along the second direction. The test leads 220 in the laser cutting area 30 are all parallel to the first direction x, and the test leads 220 in the laser cutting area 30 will be laser cut off after the test is completed. Wherein, taking the laser mark 310 as a square as an example, the size of the laser cutting area 30 is generally determined by the distance between the two laser marks 310 as the length and the side length of the laser mark 310 as the width, thus forming a rectangle 30 of the laser cutting area.
在进行镭射切割时，机台先寻找两个镭射标记310，再通过两个镭射标记310确定出镭射切割区30；然后，通常选择从更靠近绑定区21边缘的镭射标记310处开始进行镭射切割。例如，在图3中，第二镭射标记312相对于第一镭射标记311更靠近绑定区21沿第一方向x延伸的边缘，则机台从第二镭射标记312的位置处向第一镭射标记311的位置处进行镭射，将位于镭射切割区30中的测试引线220切割掉。When performing laser cutting, the machine first looks for two laser marks 310, and then determines the laser cutting area 30 through the two laser marks 310; then, usually chooses to start from the laser mark 310 that is closer to the edge of the binding area 21 for laser cutting cut. For example, in FIG. 3 , the second laser mark 312 is closer to the edge of the binding area 21 extending along the first direction x than the first laser mark 311 , then the machine starts from the position of the second laser mark 312 to the first laser Laser is performed at the position of the mark 311 , and the test leads 220 located in the laser cutting area 30 are cut off.
利用镭射技术进行切割之后，机台还会对镭射切割区30拍照，生成对应的二值化图像，根据该二值化图像对镭射效果进行检测。例如，图4为图3中的（b）所对应的二值化图像，此时，焊盘210、测试引线220和镭射标记310对应图4中的白色区域，其他对应图4中的黑色区域。应理解，由于拍摄镜头范围受限，此处的二值化图像通常为绑定区21的局部。机台根据该二值化图像可确定出镭射切割区30，再根据镭射切割区30中对应的像素值是否满足预设条件来判断镭射效果是否合格。After the laser technology is used for cutting, the machine also takes pictures of the laser cutting area 30 to generate a corresponding binarized image, and the laser effect is detected according to the binarized image. For example, FIG. 4 is the binarized image corresponding to (b) in FIG. 3 . At this time, the pad 210 , the test lead 220 and the laser marker 310 correspond to the white area in FIG. 4 , and the others correspond to the black area in FIG. 4 . . It should be understood that due to the limited range of the shooting lens, the binarized image here is usually a part of the binding area 21 . The machine can determine the laser cutting area 30 according to the binarized image, and then judge whether the laser effect is qualified according to whether the corresponding pixel value in the laser cutting area 30 satisfies the preset condition.
但是，在实际布线时，绑定区21中的焊盘210通常沿第二方向y分布不均，与其相连的测试引线220沿第二方向y的分布也不均，此外，为了节省排布空间，测试引线220的弯折情况也不同，这就进一步导致测试引线220沿第二方向y分布不均，例如，位于镭射切割区30中的测试引线220沿第二方向y分布不均。一些测试引线220之间距离较近，一些测试引线220之间距离较远，最靠近镭射标记310的测试引线220与镭射标记310之间的距离也可能较远。However, during actual wiring, the pads 210 in the bonding area 21 are generally unevenly distributed along the second direction y, and the test leads 220 connected thereto are also unevenly distributed along the second direction y. In addition, in order to save the layout space , the bending conditions of the test leads 220 are also different, which further leads to uneven distribution of the test leads 220 along the second direction y. For example, the test leads 220 located in the laser cutting area 30 are unevenly distributed along the second direction y. Some test leads 220 are close together, some test leads 220 are far apart, and the distance between the test leads 220 closest to the laser mark 310 and the laser mark 310 may also be farther.
由此，在利用镭射技术进行切割后，机台根据二值化图像检测镭射效果时，受限于机台的镜头范围，机台在根据像素值判断镭射效果时，会误以为镜头范围内没有测试引线220被镭射切断，从而报错。Therefore, after using the laser technology for cutting, when the machine detects the laser effect according to the binarized image, it is limited by the lens range of the machine. The test lead 220 is cut off by the laser, thereby reporting an error.
例如，机台从第二镭射标记312的位置处向第一镭射标记311的位置处进行切割后，最右侧的测试引线220距离第二镭射标记312距离较远时，机台在镜头范围（如图4中的所示的区域P）内检测到的大多数像素值都是0，满足预设条件（例如二值化图像中98%的像素值为0），由此，虽然实际上有两条测试引线220被镭射切断了，但是，机台却会误以为镜头范围内没有测试引线220被镭射切断，导致报错。For example, after the machine is cut from the position of the second laser mark 312 to the position of the first laser mark 311, when the rightmost test lead 220 is far away from the second laser mark 312, the machine is in the lens range ( Most of the pixel values detected in the region P) as shown in Figure 4 are 0, which meet the preset conditions (for example, 98% of the pixels in the binarized image have a value of 0). Therefore, although there are actually The two test leads 220 were cut by the laser, but the machine would mistakenly think that no test leads 220 were cut by the laser within the scope of the lens, resulting in an error.
有鉴于此，本申请实施例提供了一种阵列基板，通过在间距大于或等于参考间距的测试引线之间增加辅助引线，使得机台进行镭射时可以参考辅助引线来判断是否有测试引线被切割，从而起到防止机台误报的目的。In view of this, an embodiment of the present application provides an array substrate, by adding auxiliary leads between test leads with a spacing greater than or equal to a reference spacing, so that when the machine performs laser, the auxiliary leads can be referenced to determine whether any test leads are cut. , so as to prevent the false alarm of the machine.
下面结合图2、图5~图6，对本申请实施例提供的阵列基板的结构进行详细说明。图5中的（a）是本申请实施例提供的一种阵列基板中绑定区的结构示意图，图5中（b）是图5中的（a）被镭射切割之后的结构示意图，图6是图5中的（b）对应的二值化图像的示意图。The structure of the array substrate provided by the embodiment of the present application will be described in detail below with reference to FIG. 2 and FIG. 5 to FIG. 6 . (a) in FIG. 5 is a schematic structural diagram of a binding region in an array substrate provided by an embodiment of the present application, (b) in FIG. 5 is a schematic structural diagram of (a) in FIG. 5 after being cut by a laser, and FIG. 6 is a schematic diagram of the binarized image corresponding to (b) in FIG. 5 .
如图2和图5所示，本申请实施例提供的阵列基板31包括：层叠设置的衬底基板110和金属图案层120，阵列基板31还包括：显示区10和绑定区21，绑定区21位于显示区10外至少一侧。As shown in FIG. 2 and FIG. 5 , the array substrate 31 provided in the embodiment of the present application includes: a base substrate 110 and a metal pattern layer 120 arranged in layers, and the array substrate 31 further includes: a display area 10 and a binding area 21 . The area 21 is located on at least one side outside the display area 10 .
应理解，显示区10，指的是阵列基板31能够显示图像的区域，可设置在阵列基板31的中部区域，本申请实施例以设置于阵列基板31的中心且形状为矩形的显示区10为例。此外，阵列基板31通常还包括周边区20，周边区20指的是不能显示图像的区域，周边区20通常环绕显示区10设置，本申请实施例以环绕显示区10宽度一致的周边区20为例。周边区20用于布置电路走线及其他驱动的电子元器件。It should be understood that the display area 10 refers to the area where the array substrate 31 can display images, and can be arranged in the middle area of the array substrate 31 . In the embodiment of the present application, the display area 10 that is arranged at the center of the array substrate 31 and has a rectangular shape is example. In addition, the array substrate 31 usually also includes a peripheral area 20 . The peripheral area 20 refers to an area where images cannot be displayed. The peripheral area 20 is usually arranged around the display area 10 . In the embodiment of the present application, the peripheral area 20 with the same width surrounding the display area 10 is example. The peripheral area 20 is used for arranging circuit traces and other electronic components for driving.
应理解，如图2所示，周边区20包括绑定区21和非绑定区22。绑定区21，指的是阵列基板31用于将外部驱动电路与显示区10内电路进行连接的区域，通常设置在显示区10外的一侧，本申请实施例以绑定区21位于显示区10的下方一侧为例。非绑定区22，指的是周边区20中除过绑定区21之外剩余的区域。It should be understood that, as shown in FIG. 2 , the peripheral area 20 includes a binding area 21 and a non-binding area 22 . The binding area 21 refers to the area of the array substrate 31 used to connect the external driving circuit with the circuit in the display area 10 , and is usually arranged on the side outside the display area 10 . In the embodiment of this application, the binding area 21 is located in the display area 10 . The lower side of the zone 10 is taken as an example. The non-binding area 22 refers to the remaining area in the peripheral area 20 except the over-binding area 21 .
应理解，阵列基板31可以包括多个绑定区21，对于绑定区21的数量本申请没有任何限制。该多个绑定区21可以同时分布于显示区10外的同一侧，也可以分布在显示区10外的不同侧，本申请实施例对此也不进行任何限制。It should be understood that the array substrate 31 may include a plurality of binding areas 21 , and the present application does not have any limitation on the number of the binding areas 21 . The multiple binding areas 21 may be distributed on the same side outside the display area 10 at the same time, or may be distributed on different sides outside the display area 10 , which is not limited in any embodiment of the present application.
金属图案层120位于绑定区21，金属图案层120包括多个焊盘210和多条测试引线220，焊盘210与测试引线220一一对应且连接。The metal pattern layer 120 is located in the bonding area 21 , and the metal pattern layer 120 includes a plurality of bonding pads 210 and a plurality of test leads 220 , and the bonding pads 210 are in one-to-one correspondence with the test leads 220 and are connected.
应理解，焊盘210用于与显示区10内的信号线11进行连接，测试引线220未与焊盘210连接的一端用于与外部的驱动电路进行连接，由此，外部的驱动电路、测试引线220、焊盘210、显示区10内的信号线11可以形成导通的回路，将外部的信号传输至显示区10内部以对显示区10的显示功能进行测试。It should be understood that the pad 210 is used to connect with the signal line 11 in the display area 10, and the end of the test lead 220 that is not connected to the pad 210 is used to connect to an external drive circuit, so that the external drive circuit, test The leads 220 , the pads 210 , and the signal lines 11 in the display area 10 can form a conducting loop, and transmit external signals to the inside of the display area 10 to test the display function of the display area 10 .
此处，焊盘210的数量和排布方式，以及测试引线220的数量和布线方式均可以根据需要进行设置，本申请实施例对此不做任何限制。Here, the number and arrangement of the pads 210, as well as the number and wiring of the test leads 220 can be set as required, which is not limited in this embodiment of the present application.
应理解，金属图案层120可以与显示区10的信号线11同层进行铺设，金属图案层120还可以与显示区10的信号线11使用相同的材料进行铺设，以节约成本，当然，也可以不是相同材料，本申请实施例对此不进行任何限制。It should be understood that the metal pattern layer 120 can be laid on the same layer as the signal lines 11 of the display area 10, and the metal pattern layer 120 can also be laid with the same material as the signal lines 11 of the display area 10 to save costs. Of course, it can also be It is not the same material, and the embodiments of the present application do not impose any limitation on this.
阵列基板31还包括：沿第二方向排布的两个镭射标记310，以及由两个镭射标记310限定出的镭射切割区30。第二方向为显示区10最靠近绑定区21的边沿所在的方向。The array substrate 31 further includes: two laser marks 310 arranged along the second direction, and a laser cutting area 30 defined by the two laser marks 310 . The second direction is the direction in which the edge of the display area 10 closest to the binding area 21 is located.
应理解，镭射标记310与焊盘210、测试引线220可以同层铺设，镭射标记310与焊盘210、测试引线220还可以同材料设置，这样，镭射标记310便于机台定位使用，而且还不会被镭射掉。It should be understood that the laser marker 310, the pad 210 and the test lead 220 can be laid on the same layer, and the laser marker 310, the pad 210 and the test lead 220 can also be made of the same material. In this way, the laser marker 310 is convenient for machine positioning and use, and does not will be lasered off.
示例性的，绑定区21位于显示区10的下侧，显示区10最靠近绑定区21的边沿即为下侧的边沿，该边沿所在的方向即为水平方向，也即，第二方向为水平方向y。由此，两个镭射标记310沿水平方向y排布。第一方向与第二方向垂直，则第一方向为垂直方向x。Exemplarily, the binding area 21 is located on the lower side of the display area 10, the edge of the display area 10 closest to the binding area 21 is the edge of the lower side, and the direction in which the edge is located is the horizontal direction, that is, the second direction. is the horizontal direction y. Thus, the two laser marks 310 are arranged along the horizontal direction y. The first direction is perpendicular to the second direction, and the first direction is the vertical direction x.
如图5所示，通常两个镭射标记310之间的间距（沿第二方向y的长度）即为镭射切割区30沿第二方向y的长度，镭射标记310沿第一方向x的长度，即为镭射切割区30沿第一方向x的长度。由此，由两个镭射标记310即可限定出一个呈矩形的镭射切割区30。As shown in FIG. 5 , usually the distance between the two laser marks 310 (the length along the second direction y) is the length of the laser cutting area 30 along the second direction y, the length of the laser mark 310 along the first direction x, That is, the length of the laser cutting region 30 along the first direction x. Thus, a rectangular laser cutting area 30 can be defined by the two laser marks 310 .
应理解，镭射标记310用于限定出镭射切割区30，以便于机台后续可以根据镭射标记310确定出镭射切割区30，进而对位于镭射切割区30中的测试引线220进行镭射切割。It should be understood that the laser marking 310 is used to define the laser cutting area 30 , so that the machine can subsequently determine the laser cutting area 30 according to the laser marking 310 , and then perform laser cutting on the test leads 220 located in the laser cutting area 30 .
镭射切割区30沿第二方向的长度大于预设长度；位于镭射切割区30中的测试引线220均平行于第一方向，且相邻两条测试引线220沿第二方向的间距大于或等于第一间距，第一方向与第二方向相互垂直。The length of the laser cutting area 30 along the second direction is greater than the predetermined length; the test leads 220 located in the laser cutting area 30 are all parallel to the first direction, and the distance between two adjacent test leads 220 along the second direction is greater than or equal to the first direction. At a distance, the first direction and the second direction are perpendicular to each other.
镭射切割区30沿第二方向的长度大于预设长度，即，两个镭射标记310之间的间距大于预设长度。The length of the laser cutting region 30 along the second direction is greater than the predetermined length, that is, the distance between the two laser marks 310 is greater than the predetermined length.
其中，预设长度根据需要进行设置，本申请实施例对此不进行任何限制。示例性的，机台检测的镜头范围通常小于3000μm，由此，可以设置预设长度为3000μm，基于此，机台以一个镭射标记310为基准点对镭射切割区30的镭射效果进行检测时，镜头范围不会出现另一个镭射标记310，从而不会出现误报。The preset length is set as required, and this embodiment of the present application does not impose any restrictions on this. Exemplarily, the scope of the lens detected by the machine is usually less than 3000 μm, so the preset length can be set to 3000 μm. Based on this, when the machine uses a laser mark 310 as a reference point to detect the laser effect of the laser cutting area 30, Another laser marker 310 does not appear on the lens range, so there are no false positives.
应理解，位于镭射切割区30中的测试引线220均平行于第一方向x时，针对每条测试引线220的有效切割长度即为测试引线220的横截面长度，由此，可以避免浪费镭射能量。此外，相邻两条测试引线220沿第二方向的间距大于或等于第一间距时，可以避免短路。It should be understood that when the test leads 220 located in the laser cutting area 30 are all parallel to the first direction x, the effective cutting length for each test lead 220 is the cross-sectional length of the test lead 220, thereby avoiding wasting laser energy . In addition, when the distance between the two adjacent test leads 220 along the second direction is greater than or equal to the first distance, a short circuit can be avoided.
在镭射切割区30中，当相邻两条测试引线220沿第二方向的间距大于或等于参考间距时，在相邻两条测试引线220之间，阵列基板31还包括至少一条与金属图案层120同层设置的辅助引线40，参考间距大于第一间距。In the laser cutting area 30, when the distance between the two adjacent test leads 220 along the second direction is greater than or equal to the reference distance, between the two adjacent test leads 220, the array substrate 31 further includes at least one test lead 220 and a metal pattern layer. 120 For the auxiliary leads 40 arranged on the same layer, the reference spacing is greater than the first spacing.
参考间距可以根据需要进行设置，本申请实施例对此不进行任何限制。The reference distance can be set as required, which is not limited in this embodiment of the present application.
应理解，当相邻两条测试引线220沿第二方向的间距大于或等于参考间距时，参考间距大于第一间距，此时，测试引线220较为稀疏，在机台进行镭射效果检测时，可能会误以为没有测试引线220被切断，由此，可以在稀疏的两条测试引线220之间增加辅助引线40，以辅助引线40作为参考，从而后续进行检测时，可以避免机台误判，提高检测的准确度。It should be understood that when the distance between the two adjacent test leads 220 along the second direction is greater than or equal to the reference distance, the reference distance is greater than the first distance. At this time, the test leads 220 are relatively sparse. When the machine performs laser effect detection, it may be It will be mistaken to think that no test leads 220 are cut off. Therefore, an auxiliary lead 40 can be added between the two sparse test leads 220, and the auxiliary lead 40 can be used as a reference. detection accuracy.
此处，辅助引线40与金属图案层120同层设置，即，辅助引线40与测试引线220是同层设置，由此，后续进行镭射切割时，可以将位于镭射切割区30中的辅助引线40和测试引线220同时切割掉。Here, the auxiliary leads 40 and the metal pattern layer 120 are arranged in the same layer, that is, the auxiliary leads 40 and the test leads 220 are arranged in the same layer. Therefore, during subsequent laser cutting, the auxiliary leads 40 located in the laser cutting area 30 can be Cut off at the same time as the test leads 220 .
本申请实施例提供了一种阵列基板，在镭射切割区中，当相邻两条测试引线沿第二方向的间距大于或者等于参考间距时，通过在相邻两条测试引线之间，增设与金属图案层同层设置的辅助引线，来辅助后续机台对镭射效果进行检测，避免机台误以为测试引线稀疏的区域没有被镭射切断的测试引线，从而起到防止机台误报的目的。The embodiment of the present application provides an array substrate, in the laser cutting area, when the distance between two adjacent test leads along the second direction is greater than or equal to the reference distance, by adding between the two adjacent test leads and The auxiliary lead set on the same layer of the metal pattern layer is used to assist the subsequent machine to detect the laser effect, so as to avoid the machine from misunderstanding that there is no test lead cut by the laser in the sparse area of the test lead, thus preventing the machine from false alarm.
在本申请的一实施例中，如图3~图6所示，两个镭射标记310分别为第一镭射标记311和第二镭射标记312。In an embodiment of the present application, as shown in FIGS. 3 to 6 , the two laser marks 310 are a first laser mark 311 and a second laser mark 312 respectively.
如图5和图6所示，当最靠近第一镭射标记311的测试引线220与第一镭射标记311之间沿第二方向y的间距大于或等于参考间距时，在最靠近第一镭射标记的测试引线220与第一镭射标记311之间，阵列基板31还包括至少一条辅助引线40。As shown in FIG. 5 and FIG. 6 , when the distance between the test lead 220 closest to the first laser mark 311 and the first laser mark 311 along the second direction y is greater than or equal to the reference distance Between the test lead 220 and the first laser mark 311 , the array substrate 31 further includes at least one auxiliary lead 40 .
当最靠近第二镭射标记312的测试引线220与第二镭射标记312之间沿第二方向的间距大于或等于参考间距时，在最靠近第二镭射标记312的测试引线220与第二镭射标记312之间，阵列基板31还包括至少一条辅助引线40。When the distance between the test lead 220 closest to the second laser mark 312 and the second laser mark 312 along the second direction is greater than or equal to the reference distance, the test lead 220 closest to the second laser mark 312 and the second laser mark Between 312 , the array substrate 31 further includes at least one auxiliary lead 40 .
例如，如图5和图6所示，靠近绑定区21左侧的镭射标记310为第一镭射标记311，靠近绑定区21右侧的镭射标记310为第二镭射标记312。当然，两个镭射标记310的位置也可以互换，本申请实施例对此不进限制。For example, as shown in FIG. 5 and FIG. 6 , the laser mark 310 near the left side of the binding area 21 is the first laser mark 311 , and the laser mark 310 near the right side of the binding area 21 is the second laser mark 312 . Of course, the positions of the two laser marks 310 can also be interchanged, which is not limited in this embodiment of the present application.
由此，最靠近第一镭射标记311的测试引线220即为最左侧的测试引线220（如图5中的G1），最靠近第二镭射标记312的测试引线220即为最右侧测试引线220（如图5中的Gn）。Therefore, the test lead 220 closest to the first laser mark 311 is the leftmost test lead 220 (G1 in FIG. 5 ), and the test lead 220 closest to the second laser mark 312 is the rightmost test lead 220 (Gn in Figure 5).
基于此，当测试引线G1与第一镭射标记311之间沿第二方向y的间距大于或等于参考间距时，说明测试引线G1与第一镭射标记311的间距过远，后期机台进行镭射效果检测时，也可能误以为测试引线G1和第一镭射标记311之间没有测试引线220被镭射切断，因此，本申请实施例在测试引线G1和第一镭射标记311之间也增设辅助引线40。此处，根据测试引线G1和第一镭射标记311之间的间距可以在其间距之间设置多条辅助引线40，具体可以根据需要进行设置，本申请对此不进行任何限制。此外，该辅助引线40与上述两条测试引线220之间增设的辅助引线40的结构可以相同。Based on this, when the distance between the test lead G1 and the first laser mark 311 along the second direction y is greater than or equal to the reference distance, it means that the distance between the test lead G1 and the first laser mark 311 is too far, and the laser effect is performed later by the machine. During detection, it may be mistakenly believed that no test lead 220 is cut by the laser between the test lead G1 and the first laser mark 311 . Therefore, in the embodiment of the present application, an auxiliary lead 40 is also added between the test lead G1 and the first laser mark 311 . Here, according to the distance between the test lead G1 and the first laser mark 311 , a plurality of auxiliary leads 40 may be arranged between the distances, which may be specifically arranged as required, which is not limited in this application. In addition, the auxiliary lead 40 and the auxiliary lead 40 added between the two test leads 220 may have the same structure.
当测试引线Gn与第二镭射标记312之间沿第二方向y的间距大于或等于参考间距时，说明测试引线Gn与第二镭射标记312的间距也过远，后期机台进行镭射效果检测时，也可能误以为测试引线Gn和第二镭射标记312之间没有测试引线220被镭射切断，因此，本申请实施例在测试引线Gn和第二镭射标记312之间也增设辅助引线40。此处，根据测试引线G1和第一镭射标记311之间的间距，可以在其间距之间设置多条辅助引线40，具体可以根据需要进行设置，本申请对此不进行任何限制。此外，该辅助引线40与上述两条测试引线220之间增设的辅助引线40的结构可以相同。When the distance between the test lead Gn and the second laser mark 312 along the second direction y is greater than or equal to the reference distance, it means that the distance between the test lead Gn and the second laser mark 312 is too far. , it may be mistakenly thought that no test lead 220 is cut by the laser between the test lead Gn and the second laser mark 312 . Therefore, in the embodiment of the present application, an auxiliary lead 40 is also added between the test lead Gn and the second laser mark 312 . Here, according to the distance between the test lead G1 and the first laser mark 311 , a plurality of auxiliary leads 40 may be arranged between the distances, which may be specifically arranged as required, which is not limited in this application. In addition, the auxiliary lead 40 and the auxiliary lead 40 added between the two test leads 220 may have the same structure.
在本申请的一实施例中，辅助引线40沿第一方向延伸且辅助引线40沿第一方向的长度大于镭射标记310沿第一方向的长度。In an embodiment of the present application, the auxiliary lead 40 extends along the first direction and the length of the auxiliary lead 40 along the first direction is greater than the length of the laser marking 310 along the first direction.
应理解，在镭射切割区30中辅助引线40平行于第一方向x，即辅助引线40与测试引线220平行，可以避免辅助引线40过宽浪费镭射能量。It should be understood that in the laser cutting area 30, the auxiliary lead 40 is parallel to the first direction x, that is, the auxiliary lead 40 is parallel to the test lead 220, which can prevent the auxiliary lead 40 from being too wide to waste laser energy.
如图5和图6所示，辅助引线40沿第一方向x的长度大于镭射标记310沿第一方向的长度时，当进行完镭射切割后，位于镭射切割区30中的辅助引线40将被切割掉，而位于镭射切割区30之外的辅助引线40还将继续保留，该残留的部分在后续机台进行检测时，可以作为参考来判断镭射切割效果。As shown in FIGS. 5 and 6 , when the length of the auxiliary lead 40 along the first direction x is greater than the length of the laser marking 310 along the first direction, after the laser cutting is completed, the auxiliary lead 40 in the laser cutting area 30 will be After being cut off, the auxiliary leads 40 located outside the laser cutting area 30 will continue to remain, and the remaining part can be used as a reference to judge the laser cutting effect when the subsequent machine performs detection.
例如，利用镭射而技术切割之后，机台根据图5中的（b）对应的二值化图像（图6）对镭射效果进行检测，此时，焊盘210、测试引线220、残留的辅助引线40和镭射标记310对应图6中的白色区域，其他对应图6中的黑色区域。For example, after cutting with laser technology, the machine checks the laser effect according to the binarized image (Fig. 6) corresponding to (b) in FIG. 40 and the laser mark 310 correspond to the white areas in FIG. 6 , and the others correspond to the black areas in FIG. 6 .
基于此，例如，机台在镜头范围（如图6中所示的区域P1）内检测到80%的像素值为0，不满足预设条件（例如二值化图像中98%的像素值为0），由此，机台可以判断出有测试引线220被镭射切割断了。Based on this, for example, the machine detects that 80% of the pixels in the lens range (area P1 as shown in Figure 6) have a value of 0, which does not meet the preset conditions (for example, 98% of the pixels in the binarized image have a value of 0). 0), thus, the machine can determine that the test lead 220 is cut by laser cutting.
在本申请的一实施例中，当阵列基板31包括多条辅助引线40时，多条辅助引线40沿第二方向以第二间距间隔排布，第二间距等于第一间距。In an embodiment of the present application, when the array substrate 31 includes a plurality of auxiliary leads 40 , the plurality of auxiliary leads 40 are arranged along the second direction at a second interval, and the second interval is equal to the first interval.
应理解，多条辅助引线40沿第二方向以第二间距排布，此时，可以避免镭射过程中出现短路问题。It should be understood that the plurality of auxiliary leads 40 are arranged along the second direction with a second pitch, and at this time, the problem of short circuit in the laser process can be avoided.
应理解，辅助引线40之间的间距与测试引线220之间的间距相同时，排布的更均匀，更有利于进行镭射切割，避免短路、镭射不干净等问题。It should be understood that when the spacing between the auxiliary leads 40 is the same as the spacing between the test leads 220 , the arrangement is more uniform, which is more conducive to laser cutting, and avoids problems such as short circuit and unclean laser.
在本申请的一实施例中，辅助引线40沿第二方向的宽度的取值范围为2.5μm~100μm。In an embodiment of the present application, the width of the auxiliary lead 40 along the second direction ranges from 2.5 μm to 100 μm.
应理解，辅助引线40沿第二方向的宽度如果太小，后续机台可能检测不到，无法判断是否被镭射切割断；宽度如果太大，镭射时则需要的镭射能量特别大，耗能多，此外，还容易出现镭射切割不干净的情况，由此，辅助引线40沿第二方向的宽度取值范围最好满足2.5μm~100μm。It should be understood that if the width of the auxiliary lead 40 along the second direction is too small, the subsequent machine may not be able to detect it, and it is impossible to judge whether it is cut by the laser; if the width is too large, the laser energy required for the laser is particularly large, and the energy consumption is large. , in addition, it is easy to cause the laser cutting to be unclean. Therefore, the width of the auxiliary lead 40 along the second direction preferably ranges from 2.5 μm to 100 μm.
例如，辅助引线40沿第二方向y的宽度ds为2.5μm，或者，辅助引线40沿第二方向y的宽度ds为100μm。For example, the width ds of the auxiliary lead 40 along the second direction y is 2.5 μm, or the width ds of the auxiliary lead 40 along the second direction y is 100 μm.
在本申请的一实施例中，参考间距与第一间距之间的关系为：Dc≥2×D1+ds；其中，Dc为参考间距，D1为第一间距，ds为辅助引线40沿第二方向y的长度。In an embodiment of the present application, the relationship between the reference distance and the first distance is: Dc≥2×D1+ds; wherein, Dc is the reference distance, D1 is the first distance, and ds is the second distance along the auxiliary lead 40 . Length in direction y.
应理解，当参考间距满足公式Dc=2×D1+ds时，相邻两条测试引线220沿第二方向y的间距等于参考间距，在该相邻两条测试引线220之间可以增设一条宽度为ds的辅助引线40以起到辅助检测的效果。当参考间距大于2×D1+ds时，相邻两条测试引线220沿第二方向y的间距大于或等于参考间距，在该相邻两条测试引线220之间则可以增设多条宽度为ds的辅助引线40以起到辅助检测的效果。It should be understood that when the reference distance satisfies the formula Dc=2×D1+ds, the distance between the two adjacent test leads 220 along the second direction y is equal to the reference distance, and a width can be added between the two adjacent test leads 220 The auxiliary lead 40 of ds plays the role of auxiliary detection. When the reference distance is greater than 2×D1+ds, the distance between the two adjacent test leads 220 along the second direction y is greater than or equal to the reference distance, and between the two adjacent test leads 220, a plurality of test leads 220 with a width of ds can be added. The auxiliary lead 40 has the effect of assisting detection.
当参考间距满足公式Dc=2×D1+ds时，最靠近第一镭射标记的测试引线220和第一镭射标记311之间沿第二方向y的间距等于参考间距，在该两者之间可以增设一条宽度为ds的辅助引线40以起到辅助检测效果。当参考间距大于2×D1+ds时，最靠近第一镭射标记的测试引线220和第一镭射标记311之间大于或等于参考间距，在该两者之间则可以增设多条宽度为ds的辅助引线40以起到辅助检测的效果。When the reference distance satisfies the formula Dc=2×D1+ds, the distance between the test lead 220 closest to the first laser mark and the first laser mark 311 along the second direction y is equal to the reference distance, and the distance between the two can be An auxiliary lead 40 with a width of ds is added to play an auxiliary detection effect. When the reference distance is greater than 2×D1+ds, the distance between the test lead 220 closest to the first laser mark and the first laser mark 311 is greater than or equal to the reference distance, and a plurality of strips with a width of ds can be added between the two. The auxiliary lead 40 has the effect of assisting detection.
同理，当参考间距满足公式Dc=2×D1+ds时，最靠近第二镭射标记312的测试引线220和第二镭射标记312之间沿第二方向y的间距等于参考间距，在该两者之间可以增设一条宽度为ds的辅助引线40以起到辅助检测效果。当参考间距大于2×D1+ds时，最靠近第二镭射标记312的测试引线220和第二镭射标记312之间大于或等于参考间距，在该两者之间则可以增设多条宽度为ds的辅助引线40以起到辅助检测的效果。Similarly, when the reference distance satisfies the formula Dc=2×D1+ds, the distance between the test lead 220 closest to the second laser mark 312 and the second laser mark 312 along the second direction y is equal to the reference distance. An auxiliary lead 40 with a width of ds can be added between them to play an auxiliary detection effect. When the reference distance is greater than 2×D1+ds, the distance between the test lead 220 closest to the second laser mark 312 and the second laser mark 312 is greater than or equal to the reference distance, and a plurality of strips with a width of ds can be added between the two The auxiliary lead 40 has the effect of assisting detection.
在本申请的一实施例中，第一间距的至少大于或等于25μm。In an embodiment of the present application, at least the first pitch is greater than or equal to 25 μm.
应理解，相邻测试引线220之间的第一间距太小则可能发生短路，由此，其第一间距的取值可以至少大于或等于25μm。It should be understood that if the first spacing between adjacent test leads 220 is too small, a short circuit may occur, and thus, the value of the first spacing may be at least greater than or equal to 25 μm.
在本申请的一实施例中，阵列基板31还包括位于显示区10且层叠设置的第一金属图案层、绝缘层、第二金属图案层和像素电极层；In an embodiment of the present application, the array substrate 31 further includes a first metal pattern layer, an insulating layer, a second metal pattern layer and a pixel electrode layer which are located in the display area 10 and are stacked and disposed;
辅助引线40与第一金属图案层，或者，辅助引线40与绝缘层，或者，辅助引线40与第二金属图案层，或者，辅助引线40与像素电极层同材料设置。The auxiliary lead 40 and the first metal pattern layer, or the auxiliary lead 40 and the insulating layer, or the auxiliary lead 40 and the second metal pattern layer, or the auxiliary lead 40 and the pixel electrode layer are provided with the same material.
应理解，当辅助引线40与第一金属图案层，或者，辅助引线40与绝缘层，或者，辅助引线40与第二金属图案层，或者，辅助引线40与像素电极层同材料设置时，可以简化工艺，提高产能。It should be understood that when the auxiliary lead 40 and the first metal pattern layer, or the auxiliary lead 40 and the insulating layer, or the auxiliary lead 40 and the second metal pattern layer, or the auxiliary lead 40 and the pixel electrode layer are provided with the same material, it is possible to Simplify the process and increase productivity.
本申请实施例还提供一种液晶显示面板，包括：对置基板和如上所述的阵列基板，以及设置在对置基板和所述阵列基板之间的液晶层。Embodiments of the present application further provide a liquid crystal display panel, comprising: an opposite substrate and the above-mentioned array substrate, and a liquid crystal layer disposed between the opposite substrate and the array substrate.
本申请实施例提供的液晶显示面板的有益效果与上阵列基板对应的有益效果相同，在此不再赘述。The beneficial effects of the liquid crystal display panel provided by the embodiments of the present application are the same as the beneficial effects corresponding to the upper array substrate, which will not be repeated here.
本申请实施例还提供一种液晶显示装置100，包括：如上所述的液晶显示面板。Embodiments of the present application further provide a liquid crystal display device 100, including: the liquid crystal display panel as described above.
本申请实施例提供的液晶显示装置100的有益效果与上述阵列基板对应的有益效果相同，在此不再赘述。The beneficial effects of the liquid crystal display device 100 provided by the embodiments of the present application are the same as those corresponding to the above-mentioned array substrates, which are not repeated here.
以上所述实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围，均应包含在本申请的保护范围之内。The above-mentioned embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the above-mentioned embodiments, those of ordinary skill in the art should understand that: it is still possible to implement the above-mentioned implementations. The technical solutions described in the examples are modified, or some technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions in the embodiments of the application, and should be included in the within the scope of protection of this application.

Claims (15)

  1. 一种阵列基板（31），其中，包括层叠设置的衬底基板（110）和金属图案层（120），所述阵列基板（31）还包括：显示区（10）和绑定区（21），所述绑定区（21）位于显示区（10）外至少一侧；An array substrate (31), comprising a base substrate (110) and a metal pattern layer (120) arranged in layers, the array substrate (31) further comprising: a display area (10) and a binding area (21) , the binding area (21) is located on at least one side outside the display area (10);
    所述金属图案层（120）位于所述绑定区（21），所述金属图案层（120）包括多个焊盘（210）和多条测试引线（220），所述焊盘（210）与所述测试引线（220）一一对应且连接；The metal pattern layer (120) is located in the bonding area (21), the metal pattern layer (120) includes a plurality of pads (210) and a plurality of test leads (220), and the pads (210) one-to-one correspondence and connection with the test leads (220);
    所述阵列基板（31）还包括：沿第二方向排布的两个镭射标记（310），以及由所述两个镭射标记（310）限定出的镭射切割区（30）；所述第二方向平行于所述显示区（10）最靠近所述绑定区（21）的边沿所在的方向；The array substrate (31) further comprises: two laser marks (310) arranged along the second direction, and a laser cutting area (30) defined by the two laser marks (310); the second laser mark (310) The direction is parallel to the direction in which the edge of the display area (10) closest to the binding area (21) is located;
    所述镭射切割区（30）沿第二方向的长度大于预设长度；位于所述镭射切割区（30）中的所述测试引线（220）均平行于第一方向，且相邻两条测试引线（220）沿第二方向的间距大于或等于第一间距，所述第一方向与所述第二方向相互垂直；The length of the laser cutting area (30) along the second direction is greater than a preset length; the test leads (220) located in the laser cutting area (30) are parallel to the first direction, and two adjacent test leads (220) are The spacing of the leads (220) along the second direction is greater than or equal to the first spacing, and the first direction and the second direction are perpendicular to each other;
    在所述镭射切割区（30）中，当所述相邻两条测试引线（220）沿第二方向的间距大于或等于参考间距时，在所述相邻两条测试引线（220）之间，所述阵列基板（31）还包括至少一条与所述金属图案层（120）同层设置的辅助引线（40），所述参考间距大于所述第一间距。In the laser cutting area (30), when the distance between the two adjacent test leads (220) along the second direction is greater than or equal to the reference distance, between the two adjacent test leads (220) , the array substrate (31) further comprises at least one auxiliary lead (40) arranged in the same layer as the metal pattern layer (120), and the reference spacing is greater than the first spacing.
  2. 根据权利要求1所述的阵列基板（31），其中，所述两个镭射标记（310）分别为第一镭射标记（311）和第二镭射标记（312）；The array substrate (31) according to claim 1, wherein the two laser marks (310) are a first laser mark (311) and a second laser mark (312), respectively;
    当最靠近所述第一镭射标记（311）的测试引线（220）与所述第一镭射标记（311）之间沿所述第二方向的间距大于或等于所述参考间距时，在所述最靠近所述第一镭射标记（311）的测试引线（220）与所述第一镭射标记（311）之间，所述阵列基板（31）还包括至少一条所述辅助引线（40）；When the distance along the second direction between the test lead ( 220 ) closest to the first laser mark ( 311 ) and the first laser mark ( 311 ) is greater than or equal to the reference distance, the Between the test lead (220) closest to the first laser mark (311) and the first laser mark (311), the array substrate (31) further includes at least one auxiliary lead (40);
    当最靠近所述第二镭射标记（312）的测试引线（220）与所述第二镭射标记（312）之间沿所述第二方向的间距大于或等于所述参考间距时，在所述最靠近所述第二镭射标记（312）的测试引线（220）与所述第二镭射标记（312）之间，所述阵列基板（31）还包括至少一条所述辅助引线（40）。When the distance along the second direction between the test lead ( 220 ) closest to the second laser mark ( 312 ) and the second laser mark ( 312 ) is greater than or equal to the reference distance, the Between the test lead (220) closest to the second laser mark (312) and the second laser mark (312), the array substrate (31) further includes at least one auxiliary lead (40).
  3. 根据权利要求1或2所述的阵列基板（31），其中，所述辅助引线（40）沿所述第一方向延伸且所述辅助引线（40）沿第一方向的长度大于所述镭射标记（310）沿第一方向的长度。The array substrate (31) according to claim 1 or 2, wherein the auxiliary lead (40) extends along the first direction and the length of the auxiliary lead (40) along the first direction is greater than the laser mark (310) Length along the first direction.
  4. 根据权利要求3所述的阵列基板（31），其中，当所述阵列基板（31）包括多条辅助引线（40）时，所述多条辅助引线（40）沿所述第二方向以第二间距间隔排布，所述第二间距等于所述第一间距。The array substrate (31) according to claim 3, wherein, when the array substrate (31) includes a plurality of auxiliary leads (40), the plurality of auxiliary leads (40) are arranged in the second direction along the second direction. Two pitches are arranged at intervals, and the second pitch is equal to the first pitch.
  5. 根据权利要求4所述的阵列基板（31），其中，所述辅助引线（40）沿第二方向的宽度的取值范围为2.5μm~100μm。The array substrate (31) according to claim 4, wherein the width of the auxiliary lead (40) along the second direction ranges from 2.5 μm to 100 μm.
  6. 根据权利要求1或2所述的阵列基板（31），其中，所述参考间距与所述第一间距之间的关系为：Dc≥2×D1+ds；The array substrate (31) according to claim 1 or 2, wherein the relationship between the reference distance and the first distance is: Dc≥2×D1+ds;
    其中，Dc为所述参考间距，D1为所述第一间距，ds为所述辅助引线（40）沿第二方向的长度。Wherein, Dc is the reference distance, D1 is the first distance, and ds is the length of the auxiliary lead (40) along the second direction.
  7. 根据权利要求6所述的阵列基板（31），其中，所述第一间距的至少大于或等于25μm。The array substrate (31) according to claim 6, wherein at least the first pitch is greater than or equal to 25 μm.
  8. 根据权利要求1所述的阵列基板（31），其中，所述阵列基板（31）还包括位于显示区（10）且层叠设置的第一金属图案层、绝缘层、第二金属图案层和像素电极层；The array substrate (31) according to claim 1, wherein the array substrate (31) further comprises a first metal pattern layer, an insulating layer, a second metal pattern layer and pixels which are located in the display area (10) and are stacked and arranged electrode layer;
    所述辅助引线（40）与所述第一金属图案层，或者，所述辅助引线（40）与所述绝缘层，或者，所述辅助引线（40）与所述第二金属图案层，或者，所述辅助引线（40）与所述像素电极层同材料设置。The auxiliary lead (40) and the first metal pattern layer, or the auxiliary lead (40) and the insulating layer, or the auxiliary lead (40) and the second metal pattern layer, or , the auxiliary lead (40) and the pixel electrode layer are provided with the same material.
  9. 根据权利要求1所述的阵列基板（31），其中，所述阵列基板（31）还包括位于显示区（10）的信号线（11），所述信号线（11）与所述焊盘（210）相连接。The array substrate (31) according to claim 1, wherein the array substrate (31) further comprises a signal line (11) located in the display area (10), the signal line (11) and the pad ( 210) are connected.
  10. 根据权利要求9所述的阵列基板（31），其中，所述金属图案层（120）和所述信号线（11）同层铺设。The array substrate (31) according to claim 9, wherein the metal pattern layer (120) and the signal line (11) are laid on the same layer.
  11. 根据权利要求9所述的阵列基板（31），其中，所述金属图案层（120）和所述信号线（11）同材料设置。The array substrate (31) according to claim 9, wherein the metal pattern layer (120) and the signal line (11) are formed of the same material.
  12. 根据权利要求1所述的阵列基板（31），其中，所述镭射标记（310）与所述焊盘（210）、所述测试引线（220）同层铺设。The array substrate (31) according to claim 1, wherein the laser marking (310) is laid on the same layer as the bonding pad (210) and the test lead (220).
  13. 根据权利要求1所述的阵列基板31，其中，所述镭射标记（310）与所述焊盘（210）、所述测试引线（220）同材料设置。The array substrate 31 according to claim 1, wherein the laser marking (310), the pad (210) and the test lead (220) are provided with the same material.
  14. 一种液晶显示面板（3），其中，包括：对置基板（32）和如权利要求1至13任一项所述的阵列基板（31），以及设置在所述对置基板（32）和所述阵列基板（31）之间的液晶层（33）。A liquid crystal display panel (3), comprising: an opposite substrate (32) and the array substrate (31) according to any one of claims 1 to 13, and a liquid crystal display panel (32) disposed on the opposite substrate (32) and the array substrate (31) according to any one of claims 1 to 13. A liquid crystal layer (33) between the array substrates (31).
  15. 一种液晶显示装置（100），其中，包括：权利要求14所述的液晶显示面板（3）。A liquid crystal display device (100), comprising: the liquid crystal display panel (3) according to claim 14.
PCT/CN2021/143332 2021-04-29 2021-12-30 Array substrate, liquid crystal display panel, and liquid crystal display device WO2022227676A1 (en)

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