TW201118486A - Active device array substrate, liquid crystal display panel and liquid crystal display - Google Patents
Active device array substrate, liquid crystal display panel and liquid crystal display Download PDFInfo
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201118486 --------ΐιΖ 1TW 27456twf.doc/n 六、發明說明ό 【發明所屬之技術領域】 本發明是有關於一種陣列基板、顯示面板以及顯示裝 置’且特別是有關於一種可良好地與軟性電路板電性連接 的主動元件陣列基板，及具有此主動元件陣列基板的液晶 顯示面板與液晶顯示裝置。 【先前技術】201118486 --------ΐιΖ 1TW 27456twf.doc/n VI. Description of the Invention ό Technical Field of the Invention The present invention relates to an array substrate, a display panel, and a display device, and particularly relates to a An active device array substrate electrically connected to a flexible circuit board, and a liquid crystal display panel and a liquid crystal display device having the active device array substrate. [Prior Art]
液晶顯示面板（Liquid Crystal Display panel，LCDLiquid crystal display panel (LCD)
Panel)的多個晝素單元是通過位於液晶顯示面板周圍的驅 動曰曰片與電路板來控制其開啟或關閉。將驅動晶片設置在 液晶顯示面板上的方式有很多種，其中，利用覆晶玻璃封 裴結構（Chip On Glass，COG)來將驅動晶片封裝於液晶 顯示面板上已成為趨勢。 圖1為習知利用覆晶玻璃封裝結構的主動元件陣列基 板的部分構成示意圖。請參照圖丨，此主動元件 二 ，具有晶.片接合區觀，位於晶片接合區102上的多ς輸 =焊墊110與多個輸入焊墊120分別與驅動晶丨13〇的輸 出端132與輸入端134相互電性連接。 續參照® 1，多個輸峡墊110是與多條驅動配 ^ f性連接，輸入焊塾120是與多條引線150電性連 可’使得來自於電路板（未纟會示）的驅動訊號 片6G'引線l5G'輸人焊塾m、驅動晶 片130、輪出焊塾11〇、驅動配線14〇，而傳輸到位於主動 5SAZITW 27456twf.doc/n 201118486 區（未繪示）中的多個晝素單元（未繪示）。 目刖與驅動晶片130結合的輸入焊塾⑽的設計， -般是通過數個輸人焊塾⑶喊具有下列功能的接腳， 如電源供給相關的輸入㈣（p〇爾叫办論^ _ pms)、與系統界面相_輸人接腳（s购瓜μ池㈣㈤ in_ pins)、與測試或虛設相關的接腳（如〇r此 rdatedpins)等，其中，這些接腳—般 墊120所構成。. ^ ^ 紅繼續參照圖1，為了在主動元件陣列基板刚的引 線區106 _L良好地排列從輸入焊墊12〇延伸而出的每一條 引線150,需將餅150的一部分進行彎折，如此一^ L主==列基板1〇0上形成占有相當面積的扇出區 —九件陣舰板1GG的周邊電路佈局的設計容 j de零tde職e)會受限，且位於扇出區刚的較 長的％折引線15 0會導致較大的電阻。 另外，上述具有特定功能的接腳之間 3160的導線.(未緣示).啊 曰在^組具有特定功能的接腳中增加2〜3 .個輸入焊墊 命’以使接腳與導線之間㉟良好地相互搭配，如此一來， 貫際的輸人焊塾12G會比設計時的輸出焊好出2〇〜3〇 個，導致引、⑽1G6整體的長度會變長，而增加製作成本。 【發明内容】 有鑑於此，本發明提供一種主動元件陣列基板，可改 201118486 …一〜AZITW 27456twf.dOC/n 善因丨線所導致的電阻值，且縮短引線區的長度。 陣列^ =甚一種液晶顯示面板’具有上述的主動元件 陣列基板，而能顯示良好的影像。 面拓本供—種液晶顯示裝置，具有上述的液晶顯示 面板，而此嘁示良好的影像。 基於上：4 ’本發明提出—種主動元件 性連接到-印咖 ^條厂¥線’ _鄰第—導線之間為-第-間距。此 配線二:ί基=括:二反、多個晝素單元、多條驅動 古―二 、Λ墊、夕個弟二焊墊與多條引線。基板具 於主動j及鄰接主動區的—周邊區。晝素單元陣列排列 _=辛?動;線配置於主動區且延伸到周邊區，驅 ，配線，、旦素早凡電性連接。第一焊塾配置於 ，位於周邊區的驅動配線電性連接。第 鄰第二谭塾之間為-第二間距，其中第二間4 第-導線ί間引線配置於周邊區，電性連接於第二焊墊與 —基於上述，本發明再提出一種液晶顯示面板，包括： =色濾、光基板、如上所述的主航件陣列基板以及一液 社動元㈣縣板對向於彩色濾光基板而設 、夂日日“又置於彩色濾光基板與主動元The plurality of pixel units of the Panel are controlled to be turned on or off by a driving blade and a circuit board located around the liquid crystal display panel. There are many ways to mount a driver wafer on a liquid crystal display panel, and it has become a trend to package a driver wafer on a liquid crystal display panel by using a chip on glass (COG). BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partial schematic view showing the structure of an active device array substrate using a flip-chip package structure. Referring to FIG. 2, the active device 2 has a crystal junction region, and the plurality of germanium pads 110 and the plurality of input pads 120 and the output terminals 132 of the driving wafers 13 are respectively disposed on the wafer bonding region 102. It is electrically connected to the input terminal 134. Continued reference to ® 1, a plurality of sluice pads 110 are connected to a plurality of driving wires 120, and the input pad 120 is electrically connected to the plurality of leads 150 to enable driving from the circuit board (not shown) The signal chip 6G' lead l5G' input soldering m, the driving chip 130, the turn-off soldering 11塾, the driving wiring 14〇, and transmitted to the active 5SAZITW 27456twf.doc/n 201118486 area (not shown) A single element unit (not shown). The design of the input pad (10) combined with the driving chip 130 is generally called by a plurality of input pads (3), such as a power supply related input (4). Pms), with the system interface _ input pin (s buy mecu μ pool (four) (five) in_ pins), test or dummy related pins (such as 〇 r this rdatedpins), etc., of which, these pins - the general pad 120 Composition. ^ ^ Red continues with reference to Figure 1, in order to properly arrange each of the leads 150 extending from the input pad 12 在 in the lead region 106 _L of the active device array substrate, a portion of the cake 150 is bent, A ^ L main == column substrate 1 〇 0 forms a fan-out area occupying a considerable area - the design of the peripheral circuit layout of the nine-piece array board 1GG is limited, and is located in the fan-out area Just the longer % fold lead 150 will result in a larger resistance. In addition, the above-mentioned wire with a specific function between the pins of 3160. (not shown). Add 2 to 3 of the pins with specific functions in the group. Input pads are used to make the pins and wires 35 is well matched with each other, so that the continuous input welding 12G will be 2〇~3〇 better than the output welding at the time of design, resulting in the length of the lead, (10)1G6 will become longer, and the production will increase. cost. SUMMARY OF THE INVENTION In view of the above, the present invention provides an active device array substrate, which can change the resistance value caused by the 18 2011 2011 2011 2011 , , 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The array ^ = the other type of liquid crystal display panel' has the active element array substrate described above, and can display a good image. The present invention provides a liquid crystal display device having the above-described liquid crystal display panel, and this shows a good image. Based on the above: 4' The present invention proposes that the active component is connected to the -printer, the factory line, the line _ adjacent to the ---the distance between the wires. This wiring 2: ί base = bracket: two reverse, multiple halogen units, multiple drivers, ancient - two, Λ pad, eve a brother two pads and a number of leads. The substrate has an active j and a peripheral region adjacent to the active region. The pixel unit array is arranged _=simulating; the line is arranged in the active area and extends to the peripheral area, and the wiring, wiring, and electrical connections are made. The first solder fillet is disposed on the drive wiring electrically connected to the peripheral region. Between the second and second tan 为 is a second spacing, wherein the second 4th lead-wire is disposed in the peripheral region, electrically connected to the second pad and based on the above, the present invention further provides a liquid crystal display The panel comprises: a color filter, a light substrate, a main carrier array substrate as described above, and a liquid-state dynamic medium (4) county plate opposite to the color filter substrate, and the daytime "on the color filter substrate Active element
基於上述，本發明又槎屮接、广agE & a人故出一種液晶顯示裝置，包括： 上所_液晶顯示面板以及背光模組。此背光模組設置 於液晶顯示面板的一側。 201118486 x w/u〇45SAZlTW 27456twfdoc/n 在本發明的-實施例中，上述的每—⑽將每 焊塾與每一第一導線一對一電性連接。 〃在本發明的一實施例中，上述的部分引線將至少二個 第一焊塾與至少兩條第一導線電性連接。 在本發明的-實施例中，上述的主動元件陣列基板更 包括多個第三焊墊，配置於該周邊區，每一第三焊塾是配 置於兩相鄰的第二焊墊之間。 、在本發明的-實施例中，上述的第三焊塾包括驅動晶 片測試焊塾或虛設焊塾。 在本發明的一貫施例中，上述的主動元件陣列基板更 包括-驅動晶>}’設置於周邊區’驅動晶片具有多個訊號 輸出端與多個訊號輸入端，而訊號輸出端與第一焊墊電性 連接，訊號輸入端與第二焊塾電性連接。 在本發明的一實施例中，上述的印刷電路板設置在軟 性電路板上。 在本發明的一實施例中，上述的主動元件陣列基板更 Φ 包括至少一對位標記，設置於周邊區且位於引線4一側。 在本發明的一實施例中，上述的主動元件陣列基板更 包括至少一虛設引線，設置於肩邊區且位於引線的一側。 本發明採用使主動元件陣列基板的兩個第二焊墊之 間的第一間距專於权性電路板的兩條第一導線之間的第一 門足巨，引線可良好地攸弟一焊塾垂直延伸出來而直接與軟 性電路板的第一導線電性連接。如此，可節省習知的扇出 區所佔的空間，進而能提昇主動元件陣列基板的周邊區的 201118486 P070845SAZ1TW 27456twf.doc/n 電路佈局的設計容忍度，且可降低引線的電阻值以利驅動 訊號的傳遞。 為讓本發明之上述待徵和優點能更明顯易懂，下文特 舉較佳實施例’並配合所附圖式，作詳細說明如下。 【實施方式】 圖2為本發明較佳實施例的一種主動元件陣列基板的 俯視示意圖。請參照圖2，此絲元件陣列基板藉由 一权性電路板300電性連接到一印刷電路板4〇〇。此軟性 電路板300具有多條第—導線31G，兩相鄰第一導線31〇 之間為一第一間距Π。此主動元件陣列基板2〇〇包括：基 板210、多個晝素單元220、多條驅動配線23〇、多個第一 焊墊240、多個第二焊塾250 (25〇a與25〇b)與多條引線 262、264。基板210具有一主動區212及鄰接主動區212 的一周邊區21+4。晝素單元22〇陣列排列於主動區212内。 驅動配線230配置於主動區212且延伸到周邊區214，驅 動配線230與晝素單元220電性連接.。第一焊塾240配置 於周邊區214，且與位於周邊區214的驅動配線230電性 連接。第二焊墊250配置於周邊區214，兩相鄰第二焊墊 250之間為一第二間距P2，其中第二間距p2等於第一間 距P1。引線262、264配置於周邊區214，電性連接於第 一焊墊*250與弟一導線310 (310a、310b與310c)之間。 藉由使主動元件陣列基板200的兩個第二焊墊250 (250a與250b)之間的第二間距P2等於軟性電路板300 27456twf.doc/n 201118486Based on the above, the present invention further provides a liquid crystal display device, including: a liquid crystal display panel and a backlight module. The backlight module is disposed on one side of the liquid crystal display panel. 201118486 x w/u〇45SAZlTW 27456twfdoc/n In the embodiment of the present invention, each of the above-mentioned (10) is electrically connected to each of the first wires one to one. In an embodiment of the invention, the partial leads are electrically connected to the at least two first pads and the at least two first wires. In an embodiment of the invention, the active device array substrate further includes a plurality of third pads disposed in the peripheral region, and each of the third pads is disposed between the two adjacent second pads. In the embodiment of the invention, the third soldering pad comprises driving a wafer test pad or a dummy pad. In a consistent embodiment of the present invention, the active device array substrate further includes a driving crystal, and the driving chip has a plurality of signal output terminals and a plurality of signal input terminals, and the signal output terminal and the first A pad is electrically connected, and the signal input end is electrically connected to the second pad. In an embodiment of the invention, the printed circuit board is disposed on a flexible circuit board. In an embodiment of the invention, the active device array substrate further includes at least one pair of bit marks disposed on the peripheral region and on the side of the lead 4. In an embodiment of the invention, the active device array substrate further includes at least one dummy lead disposed on the shoulder region and on one side of the lead. The invention adopts that the first spacing between the two second pads of the active device array substrate is specific to the first gate between the two first wires of the weight circuit board, and the leads can be well soldered The 塾 extends vertically and is electrically connected directly to the first wire of the flexible circuit board. In this way, the space occupied by the conventional fan-out area can be saved, thereby improving the design tolerance of the 201118486 P070845SAZ1TW 27456twf.doc/n circuit layout of the peripheral region of the active device array substrate, and reducing the resistance value of the lead wire to facilitate driving. The transmission of the signal. In order to make the above-described aspects and advantages of the present invention more comprehensible, the preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings. Embodiments Fig. 2 is a top plan view of an active device array substrate in accordance with a preferred embodiment of the present invention. Referring to FIG. 2, the wire element array substrate is electrically connected to a printed circuit board 4 by a weight circuit board 300. The flexible circuit board 300 has a plurality of first conductors 31G, and a first spacing Π between the two adjacent first conductors 31〇. The active device array substrate 2 includes: a substrate 210, a plurality of pixel units 220, a plurality of driving wires 23, a plurality of first pads 240, and a plurality of second pads 250 (25〇a and 25〇b) ) with a plurality of leads 262, 264. The substrate 210 has an active region 212 and a peripheral region 21+4 adjacent to the active region 212. The array of halogen elements 22 is arranged in the active region 212. The driving wiring 230 is disposed on the active region 212 and extends to the peripheral region 214, and the driving wiring 230 is electrically connected to the pixel unit 220. The first pad 240 is disposed in the peripheral region 214 and is electrically connected to the driving wiring 230 located in the peripheral region 214. The second pad 250 is disposed in the peripheral region 214, and a second pitch P2 is formed between the two adjacent pads 250, wherein the second pitch p2 is equal to the first pitch P1. The leads 262, 264 are disposed in the peripheral region 214 and electrically connected between the first pad * 250 and the first wire 310 (310a, 310b and 310c). By making the second pitch P2 between the two second pads 250 (250a and 250b) of the active device array substrate 200 equal to the flexible circuit board 300 27456twf.doc/n 201118486
1 v / v/ut5SAZ1 TW 的兩條第一導線310 (31〇a、310b與310c)之間的第一間 距PI，如此一來，引線262、264可良好地從第二焊墊250 垂直延伸出來而直接與軟性電路板300的第一導線310 (310a、310b 與 310c)電性連接。 請繼續參照圖2，更詳細而言，第二焊墊250可包括 具有相同訊號的第二焊墊250a以及分別具有不同訊號的 第二焊墊250b ’其中’這些第二焊墊250a透過引線264 與第一導線310a、310b電性連接，而第二焊墊250b透過 引線262分別與第一導線310c電性連接。 如圖2所示’第二焊墊25〇a與第一導線310a、31〇b 位於周邊區214的周邊位置’而第二焊墊250b與第一導線 310c位於周邊區的中間位置。然而，在另外的實施例中（未 繪示），第二焊墊250a與第一導線310a、310b可位於周 邊區214的中間位置，而第二焊墊25〇b與第一導線31〇c 可位於周邊區的周邊位置。實際上可根據設計需要來安排 上述第二焊墊250a、250b及第一導線31〇a、310b、310c 的設置位置，’在此並不予以限定。 值得注意的是，不同的驅動訊號可在單一個第二焊墊 25〇上進行傳輸，所以雖然僅設置少數個第二焊墊250，也 了以良好地傳輸多種不同的驅動訊號。如此一來’整體的 焊墊250的數量可較少，在周邊區214的寬度不變的 刖提下二即可以將每一個第二焊墊250的寬度設計為較 大且第—間距P2也可設計為較大。總之，第二焊墊250 的間距可成為較大，而能直接搭配軟性電路板300的線距 201118486 F070845 S AZ1TW 27456t wf.doc/n (較大的線距）。 例如，在習知的圖l所示的兩相鄰輸入焊墊12〇的間 距約為50〜60μπι’而本申請案的第二間距？2可為π〇μιη 左右。即使將變大的第二間距Ρ2乘以所需的第二焊墊25〇 數目，得到的總寬度也可符合下述驅動晶片27〇的寬度， 而此良好地接合驅動晶片270於第一焊墊240與第二焊熱 250 上。 /、 另外，由於每一第二焊墊25〇本身的寬度較大而可 具有較低的電阻值以利傳輸驅動訊號。如此，即不需要將 引線262、264進行彎折，而可節省習知的扇出區1〇4所佔 的空間，進而能提昇主動元件陣列基板2〇〇的周邊區214 的電路佈局的設計容忍度。並且，由於引線262、264的電 阻值小於習知引線150的電阻值，而有利驅動訊號的傳遞。 #請繼續參照圖2，在一實施例中，每一引線262將每 二第二焊墊250與每一第一導線310 —對一電性連接。更 _細而言，如圖2的中間位置的引線262可將位於中間位 ^的第二焊墊250b —對一電性連接到第一導線31〇c。此 時各個第二焊墊250b所傳輸的驅動信號不相同。 曰在另一實施例中，部分引線264也可將至少二個第二 烊墊250與至少兩條第一導線31〇電性連接。更詳細而言， 位於周邊位置的引線264寬度較大，其可將二個第二焊墊 =〇a與兩條第一導線31〇a、31〇b進行電性連接。換言之， 右需要較低的電阻值，可使多個第二焊墊25〇a彼此電性連 接並共同傳輸一個驅動訊號，可達到良好的傳輸效果。 27456twf.doc/n 2〇1118486saz]tw 承上所述，可以於上述的第二焊墊25〇以及第一導線 310中傳輸不同的驅動訊號。然而，當於上述第二焊墊25〇 以及第-導線31G中傳輸相同的驅動訊麟，此時第二焊 塾250及第-導線31G的整體電阻值可以更進—步下降， 進而能提升驅動訊號的傳輸效率。 請再參照圖2，上述的絲元件_基板·可更包 括-驅動晶片270,設置於周邊區214，驅動晶片27〇具有 多個訊號輸出端272與多個訊號輸入端274，而訊號輸出 端272與第-焊藝240電性連接，訊號輸入端 274與第二 焊墊250 ( 250a與250b)電性連接。再者，印刷電路板4〇〇 可设置在軟性電路板300上。來自於印刷電路板働的驅 動訊號經由紐電路板的傳輸而職鶴晶片27〇， 進而驅動絲元件_基板 Μ個晝素單元22〇。 請再參照圖2，在-實施例中，上述的主動元件陣列 基板2⑻可更包括多個第三焊塾28()，配置於周邊區μ， 每二第三焊墊280是配置於兩相鄰的第二悍墊250之間。 此第三焊塾280是配置在有豸行驅動訊號傳輸的兩個第二 焊塾250、（2伽與2漏）之間。第三焊塾珊可以是驅動 晶片測試焊墊，韓賴轉晶# 27()内部的功能 常運作。 特另j疋第一4墊280也可以是虛設焊塾，用來調整 部分第二焊墊25G的整體電阻值，以利驅動訊號的傳輸。 更詳細而言’請參照圖2’位於周邊區域的第二焊塾施、 250a之間的第二焊墊28〇也與引線264電性連接在一起， 201118486 F070845SAZ1TW 27456twf.doc/n 如此一來，可進一步降低整體第二焊墊25〇a、25〇a、第三 焊墊280以及引線264的電阻值。 類似地，主動元件陣列基板2〇〇可更包括至少一虛設 引線266’設置於周邊區214且位於引線262、264的一側。 更詳細而言，此虛設引線266是位於所有引線262、264 的最外面兩側的位置。 請參照圖2，主動元件陣列基板2〇〇可更包括至少一 對位標記290，設置於周邊區214且位於引線262、264之 一側。更詳細而言，此對位標記29〇是位於所有引線262、 264的最外面兩側的位置，對位標記29〇是作為與後續的 液晶顯示面板500組裝時之對位用。 矣示上所述，使弟一焊塾250 (250a與250b)的寬度變 大，且使第二焊墊250 (250a與250b)的第二間距P1與 軟性電路板300的第一導線31〇 (31〇a、31〇b與31〇c) ^ 間的第一間距P1相同，可達到省略扇出區104的佈局面 積、縮短引線262、264所佔據的整體長度，且降低引線 262、264的阻值。 圖3繪示為本發明較佳實施例的一種液晶顯示面板的 示意圖。此液晶顯示面板500包括：一彩色濾光基板51〇、 主動元件陣列基板520以及一液晶層53〇。 ，繼續參照圖3，彩色濾光基板51〇可包括玻璃基板 (未繪示）、設置在玻璃基板上的黑矩陣（未緣示）、設 置在黑矩陣所圍出的次畫素區域（未繪示）中 膜(糊，以及透明電極(未繪示二中：色= 12 201118486 ru/w〇45SAZ!TW 27456twf.doc/n 板510可以是任意種類的彩色濾光基板，以使液晶顯示面 板500顯示彩色晝面。 請同時參照圖2與圖3，主動元件陣列基板520是採 用上述的主動元件陣列基板200,且主動元件陣列基板520 對向於彩色濾光基板51 〇而設置。此主動元件陣列基板5 2 〇 中的兩個第二焊墊25〇(25〇a與25〇b)之間的第二間距P2 等於軟性電路板300的兩條第一導線310 (310a、310b與 310c)之間的第—間距ρι。所以，引線262、264可良好 地從第二焊墊250垂直延伸出來而直接與軟性電路板300 的第一導線310電性連接。亦即，來自印刷電路板4〇〇的 驅動訊號可良好地傳遞到晝素單元220中，而能顯示良好 的影像。 液晶層530設置於彩色濾光基板510與主動元件陣列 基板520之間。此液晶層530可以採用適當種類的液晶分 子，在此並不予以限定。 圖4繪示為本發明較佳實施例的一種液晶顯示裝置的 示意圖。此600液晶顯示裝置包括：液晶顯示面板610从 及背光模組620。液晶顯示面板610可以採用如圖3所示 的液晶顯示面板500,關於詳細的構造在此不予以重述。 而背光模組620設置於液晶顯示面板610的一側，用以提 供面光源L到液晶顯示面板610。此背光模組620可以是 直下式背光模組、側面入光式背光模組或是其他適當的背 光模組。由於此液晶顯示裝置600採用上述的主動元件陣 列基板200,而可顯示良好品質的影像。 201118486 FU7U845SAZ1TW 27456twf.d〇c/n 本發明主動元件陣列基板、液晶顯示面板 以及液aa顯不裝置至少具有以下的優點：1 v / v / ut5SAZ1 TW the first pitch PI between the two first wires 310 (31A, 310b and 310c), such that the leads 262, 264 can extend well from the second pad 250 It is directly connected to the first wires 310 (310a, 310b and 310c) of the flexible circuit board 300. Referring to FIG. 2 in more detail, the second pad 250 may include a second pad 250a having the same signal and a second pad 250b having different signals respectively. [These second pads 250a pass through the lead 264. The first wires 310a and 310b are electrically connected to each other, and the second pads 250b are electrically connected to the first wires 310c through the wires 262. As shown in Fig. 2, the second pad 25A and the first wires 310a, 31b are located at the peripheral position of the peripheral region 214, and the second pad 250b and the first wire 310c are located at an intermediate position of the peripheral region. However, in another embodiment (not shown), the second pad 250a and the first wires 310a, 310b may be located at an intermediate position of the peripheral region 214, and the second pad 25〇b and the first wire 31〇c Can be located in the surrounding area of the surrounding area. Actually, the positions of the second pads 250a and 250b and the first wires 31a, 310b, and 310c can be arranged according to design requirements, which is not limited herein. It should be noted that different driving signals can be transmitted on a single second pad 25, so that although only a few second pads 250 are provided, a plurality of different driving signals are well transmitted. In this way, the number of the integrated pads 250 can be small, and the width of each of the second pads 250 can be designed to be large and the first pitch P2 can also be raised when the width of the peripheral region 214 is constant. Can be designed to be larger. In short, the pitch of the second pad 250 can be made larger, and can be directly matched with the line pitch of the flexible circuit board 300 201118486 F070845 S AZ1TW 27456t wf.doc/n (larger line pitch). For example, in the conventional Figure 1, the distance between two adjacent input pads 12A is about 50~60μπι' and the second pitch of the present application is? 2 can be around π〇μιη. Even if the larger second pitch Ρ2 is multiplied by the required number of second pads 25A, the total width obtained can be made to conform to the width of the drive wafer 27A described below, which is good to bond the drive wafer 270 to the first bond. Pad 240 and second soldering heat 250. Further, since each of the second pads 25 itself has a large width, it may have a lower resistance value for transmitting the driving signal. In this way, the lead wires 262 and 264 need not be bent, and the space occupied by the conventional fan-out area 1〇4 can be saved, thereby improving the circuit layout design of the peripheral region 214 of the active device array substrate 2〇〇. Tolerance. Moreover, since the resistance values of the leads 262, 264 are smaller than the resistance value of the conventional lead 150, the transmission of the driving signal is facilitated. #Continuing to refer to FIG. 2, in one embodiment, each of the leads 262 electrically connects each of the second pads 250 to each of the first wires 310. More specifically, the lead 262 of the intermediate position of FIG. 2 can electrically connect the second pad 250b located at the intermediate position to the first wire 31〇c. At this time, the driving signals transmitted by the respective second pads 250b are different. In another embodiment, the portion of the leads 264 may electrically connect the at least two second pads 250 to the at least two first wires 31. In more detail, the lead wire 264 located at the peripheral position has a large width, and the two second pads = 〇a can be electrically connected to the two first wires 31A, 31B. In other words, a lower resistance value is required for the right side, so that the plurality of second pads 25A are electrically connected to each other and a driving signal is transmitted together to achieve a good transmission effect. 27456twf.doc/n 2〇1118486saz] tw As described above, different driving signals can be transmitted in the second pad 25A and the first wire 310 described above. However, when the same driving channel is transmitted in the second pad 25A and the first wire 31G, the overall resistance value of the second pad 250 and the first wire 31G can be further decreased, thereby improving Drive signal transmission efficiency. Referring to FIG. 2 again, the above-mentioned wire component _ substrate may further include a driving chip 270 disposed in the peripheral region 214. The driving chip 27 has a plurality of signal output terminals 272 and a plurality of signal input terminals 274, and the signal output terminal The 272 is electrically connected to the first soldering die 240, and the signal input end 274 is electrically connected to the second pad 250 (250a and 250b). Furthermore, the printed circuit board 4 can be disposed on the flexible circuit board 300. The driving signal from the printed circuit board 经由 is transmitted through the circuit board and the driver chip 27 〇, and then the wire element _ substrate 昼 昼 昼 unit 22 〇. Referring to FIG. 2 again, in the embodiment, the active device array substrate 2 (8) may further include a plurality of third solder pads 28 () disposed in the peripheral region μ, and each of the second solder pads 280 is disposed in two phases. Adjacent to the second mat 250. The third pad 280 is disposed between two second pads 250 (2 gamma and 2 drain) having a 驱动 drive signal transmission. The third soldering can be used to drive the wafer test pads, and the internal functions of Han Laijing #27() are often functioning. Specifically, the first 4 pads 280 may also be dummy solder pads for adjusting the overall resistance value of the portion of the second pads 25G to facilitate the transmission of the driving signals. In more detail, please refer to FIG. 2, the second pad 28 位于 between the second soldering pads 250a in the peripheral region is also electrically connected with the lead 264, 201118486 F070845SAZ1TW 27456twf.doc/n The resistance values of the entire second pads 25A, 25A, the third pads 280, and the leads 264 can be further reduced. Similarly, the active device array substrate 2 can further include at least one dummy lead 266' disposed on the peripheral region 214 and on one side of the leads 262, 264. In more detail, the dummy lead 266 is located at the outermost sides of all of the leads 262, 264. Referring to FIG. 2, the active device array substrate 2 can further include at least one alignment mark 290 disposed on the peripheral region 214 and on one side of the leads 262, 264. More specifically, the alignment mark 29A is located at the outermost sides of all of the leads 262, 264, and the alignment mark 29 is used for alignment with the subsequent liquid crystal display panel 500. As indicated above, the width of the wiper 250 (250a and 250b) is increased, and the second pitch P1 of the second pads 250 (250a and 250b) and the first wire 31 of the flexible circuit board 300 are folded. The first pitch P1 between (31〇a, 31〇b and 31〇c) ^ is the same, the layout area of the fan-out area 104 is omitted, the overall length occupied by the leads 262, 264 is shortened, and the leads 262, 264 are lowered. Resistance. 3 is a schematic diagram of a liquid crystal display panel according to a preferred embodiment of the present invention. The liquid crystal display panel 500 includes a color filter substrate 51, an active device array substrate 520, and a liquid crystal layer 53. With continued reference to FIG. 3, the color filter substrate 51A may include a glass substrate (not shown), a black matrix disposed on the glass substrate (not shown), and a sub-pixel area disposed in the black matrix (not shown). Illustrated) middle film (paste, and transparent electrode (not shown in two: color = 12 201118486 ru / w 〇 45SAZ! TW 27456twf. doc / n plate 510 can be any kind of color filter substrate to make liquid crystal display The panel 500 displays a color plane. Referring to FIG. 2 and FIG. 3 simultaneously, the active device array substrate 520 is formed by using the active device array substrate 200 described above, and the active device array substrate 520 is disposed opposite to the color filter substrate 51. The second pitch P2 between the two second pads 25A (25〇a and 25〇b) of the active device array substrate 5 2 is equal to the two first wires 310 (310a, 310b and the flexible circuit board 300) The first spacing between the ends of the flexible circuit board 300 is electrically connected to the first wire 310 of the flexible circuit board 300. That is, from the printed circuit. The driving signal of the board 4 良好 can be well transmitted to the halogen The liquid crystal layer 530 is disposed between the color filter substrate 510 and the active device array substrate 520. The liquid crystal layer 530 may be of a suitable type of liquid crystal molecules, which is not limited herein. 4 is a schematic diagram of a liquid crystal display device according to a preferred embodiment of the present invention. The 600 liquid crystal display device includes: a liquid crystal display panel 610 and a backlight module 620. The liquid crystal display panel 610 can adopt a liquid crystal display as shown in FIG. The backlight module 620 is disposed on one side of the liquid crystal display panel 610 for providing the surface light source L to the liquid crystal display panel 610. The backlight module 620 can be a direct type. The backlight module, the side-input backlight module or other suitable backlight module. Since the liquid crystal display device 600 adopts the above-mentioned active device array substrate 200, it can display good quality images. 201118486 FU7U845SAZ1TW 27456twf.d〇c /n The active device array substrate, the liquid crystal display panel, and the liquid aa display device of the present invention have at least the following advantages:
使主動70件陣列基板的兩個第二焊墊之間的第二間 距等於軟性電路板的兩條第—導線之間的第—間距，引線 可良好地從第二焊墊垂纽伸出來而直接與軟性電路板的 第-導線電性連接。如此，可節省習知的扇出區所佔的空 間，由於引線所佔據的面積*，而能提昇主動元件陣列基 板的周邊㈣電路佈局的輯容忍度。並且，由於引線的 電阻值降低，有利於㈣減的舰。另外，驅動訊 號能夠良好地傳遞’使得具有此絲元件_基板的液晶 顯不面板與液晶顯示裴置具有良好的顯示品質。 雖然本杂明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何所屬技術領域中具有通常知識者，在不 脫離本發明之精神和範圍内，當可作些許之更動與潤飾， 因此本發明之保護範圍當視後附之申請專利範圍所界定者 為準。The second spacing between the two second pads of the active 70-piece array substrate is equal to the first spacing between the two first conductors of the flexible circuit board, and the leads can well protrude from the second bonding pad Directly connected to the first conductor of the flexible circuit board. In this way, the space occupied by the conventional fan-out area can be saved, and the tolerance of the circuit layout of the periphery (4) of the active device array substrate can be improved due to the area occupied by the leads*. Moreover, since the resistance value of the lead wire is lowered, it is advantageous for the (four) reduced ship. In addition, the driving signal can be transmitted well, so that the liquid crystal display panel having the silk element_substrate and the liquid crystal display device have good display quality. Although the present invention has been disclosed in the preferred embodiments as described above, it is not intended to limit the invention, and those skilled in the art can make a few changes without departing from the spirit and scope of the invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims.
【圖式簡單說明】 圖1為習知利用覆晶玻璃封裝結構的主動元件陣列基 板的部分構成示意圖。 圖2為本發明較佳實施例的一種主動元件陣列基板的 俯視示意圖。 圖3奢示為本發明较佳實施例的一種液晶顯示面板的 不意圖。 14 201118486BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partial schematic view showing the structure of an active device array substrate using a flip-chip package structure. 2 is a top plan view of an active device array substrate in accordance with a preferred embodiment of the present invention. Figure 3 is a schematic illustration of a liquid crystal display panel in accordance with a preferred embodiment of the present invention. 14 201118486
,^5SAZ1TW 27456twf.doc/n 圖4繪示為本發明較佳實施例的一種液晶顯示裝置的 示意圖。 【主要元件符號說明】 100、200、520 :主動元件陣列基板 102 .晶片接合區 104 :扇出區 106 :引線區 ® 110 :輸出浑墊 120 :輸入焊墊 130 :驅動晶片 132 :輸出端 134 :輸入端 140、230 :驅動配線 150、262、264 :引線 160、300 :軟性電路板 • 210 :基板 212 :主動區 214 :周邊區 220 :晝素單元 240 :第一焊墊 250、250a、250b :第二焊墊 266 :虛設引線 270:驅動晶片 15 201118486^5SAZ1TW 27456twf.doc/n FIG. 4 is a schematic view showing a liquid crystal display device according to a preferred embodiment of the present invention. [Main component symbol description] 100, 200, 520: active device array substrate 102. Wafer bonding region 104: fan-out region 106: lead region® 110: output pad 120: input pad 130: drive wafer 132: output terminal 134 : input terminals 140, 230: drive wirings 150, 262, 264: leads 160, 300: flexible circuit board • 210: substrate 212: active area 214: peripheral area 220: halogen unit 240: first pads 250, 250a, 250b: second pad 266: dummy lead 270: drive wafer 15 201118486
rw /uohjoAZITW 27456twfdoc/n 272 訊號輸出端 274 訊號輸入端 280 第三焊墊 290 對位標記 310、310a、310b、310c:第一導線 400 :印刷電路板 500、610 :液晶顯示面板 510 :彩色濾光基板 530 :液晶層 600 :液晶顯示裝置 620 :背光模組 L :面光源 P1 :第一間距 P2 :第二間距 16Rw /uohjoAZITW 27456twfdoc/n 272 Signal output 274 Signal input 280 Third pad 290 Alignment mark 310, 310a, 310b, 310c: First wire 400: Printed circuit board 500, 610: Liquid crystal display panel 510: Color filter Light substrate 530: liquid crystal layer 600: liquid crystal display device 620: backlight module L: surface light source P1: first pitch P2: second pitch 16
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98139804A TW201118486A (en) | 2009-11-23 | 2009-11-23 | Active device array substrate, liquid crystal display panel and liquid crystal display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98139804A TW201118486A (en) | 2009-11-23 | 2009-11-23 | Active device array substrate, liquid crystal display panel and liquid crystal display |
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| TW201118486A true TW201118486A (en) | 2011-06-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW98139804A TW201118486A (en) | 2009-11-23 | 2009-11-23 | Active device array substrate, liquid crystal display panel and liquid crystal display |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10319940B2 (en) | 2015-10-08 | 2019-06-11 | Futaba Corporation | Organic electroluminiscent display device with arrangement of dummy interconnections |
| TWI716922B (en) * | 2018-12-26 | 2021-01-21 | 友達光電股份有限公司 | Display panel |
| CN113156727A (en) * | 2021-04-29 | 2021-07-23 | 惠科股份有限公司 | Array substrate, liquid crystal display panel and liquid crystal display device |
-
2009
- 2009-11-23 TW TW98139804A patent/TW201118486A/en unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10319940B2 (en) | 2015-10-08 | 2019-06-11 | Futaba Corporation | Organic electroluminiscent display device with arrangement of dummy interconnections |
| TWI716922B (en) * | 2018-12-26 | 2021-01-21 | 友達光電股份有限公司 | Display panel |
| CN113156727A (en) * | 2021-04-29 | 2021-07-23 | 惠科股份有限公司 | Array substrate, liquid crystal display panel and liquid crystal display device |
| CN113156727B (en) * | 2021-04-29 | 2022-09-20 | 惠科股份有限公司 | Array substrate, liquid crystal display panel and liquid crystal display device |
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