WO2022188168A1 - Display substrate, preparation method therefor, and display device - Google Patents

Display substrate, preparation method therefor, and display device Download PDF

Info

Publication number
WO2022188168A1
WO2022188168A1 PCT/CN2021/080562 CN2021080562W WO2022188168A1 WO 2022188168 A1 WO2022188168 A1 WO 2022188168A1 CN 2021080562 W CN2021080562 W CN 2021080562W WO 2022188168 A1 WO2022188168 A1 WO 2022188168A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
layer
substrate
display
blank
Prior art date
Application number
PCT/CN2021/080562
Other languages
French (fr)
Chinese (zh)
Inventor
黄耀
黄炜赟
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to PCT/CN2021/080562 priority Critical patent/WO2022188168A1/en
Priority to CN202180000486.7A priority patent/CN115606329A/en
Publication of WO2022188168A1 publication Critical patent/WO2022188168A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers

Definitions

  • the present disclosure relates to, but is not limited to, the field of display technology, and more particularly, to a display substrate, a method for manufacturing the same, and a display device.
  • OLED Organic Light Emitting Diode
  • TFT Thin Film Transistor
  • Exemplary embodiments of the present disclosure provide a display substrate including a normal resolution display area and a low resolution display area, the low resolution display area having a resolution smaller than that of the normal resolution display area; the low resolution display area
  • the display area includes a light-transmitting display area and a non-light-transmitting display area located at the periphery of the light-transmitting display area;
  • the light-transmitting display area includes a pixel area and a blank area, and the pixel area includes a plurality of pixel islands configured to display images ,
  • the blank area includes a plurality of blank islands configured to transmit light; in a plane perpendicular to the display substrate, the pixel islands include a display structure layer disposed on the side of the substrate facing the light outgoing light, and the display structure layer at least It includes a light-emitting device, and the blank island includes a blank structure layer disposed on the side of the substrate facing the light-emitting side and a light-transmitting hole disposed on the substrate; the
  • the orthographic projection of the blank island on the plane of the display substrate includes the orthographic projection of the light-transmitting hole on the plane of the display substrate.
  • the plurality of pixel islands form a plurality of display columns, the plurality of blank islands form a plurality of blank columns, and the display columns and the blank columns are alternately arranged in a row direction;
  • the light transmission The holes are strip-shaped light-transmitting holes extending along the column direction, the plurality of strip-shaped light-transmitting holes are arranged at intervals in the row direction, and the orthographic projection of the blank column on the plane of the display substrate includes the strip-shaped light-transmitting holes Orthographic projection on the plane of the display substrate.
  • the plurality of pixel islands form a plurality of display rows, the plurality of blank islands form a plurality of blank rows, and the display rows and the blank rows are alternately arranged in a column direction;
  • the transparent The light holes are strip-shaped light-transmitting holes extending along the row direction, the plurality of strip-shaped light-transmitting holes are arranged at intervals in the column direction, and the orthographic projection of the blank row on the plane of the display substrate includes the strip-shaped light-transmitting holes Orthographic projection of the hole on the plane of the display substrate.
  • the plurality of pixel islands are alternately arranged in the row direction and the column direction, and the plurality of blank islands are alternately arranged in the row direction and the column direction;
  • the light-transmitting holes are block-shaped light-transmitting holes
  • the plurality of block-shaped light-transmitting holes are arranged at intervals in the row direction and the column direction, and the orthographic projection of the blank islands on the display substrate plane includes the orthographic projection of the block-shaped light-transmitting holes on the display substrate plane.
  • the pixel island includes a plurality of display sub-pixels, and a display structure layer of at least one display sub-pixel includes a driving circuit layer disposed on the substrate, and a light emitting structure disposed on the driving circuit layer layer and an encapsulation layer disposed on the light-emitting structure layer,
  • the drive circuit layer includes transistors and storage capacitors constituting the pixel drive circuit
  • the light-emitting structure layer includes an anode constituting the light-emitting device, an organic light-emitting layer and cathode
  • the blank island includes a plurality of blank sub-pixels
  • the blank structure layer of at least one blank sub-pixel includes a composite insulating layer arranged on the substrate and an inorganic encapsulation layer arranged on the composite insulating layer.
  • the substrate includes a first flexible layer
  • the light-transmitting hole is disposed on a side of the substrate away from the blank structure layer; the depth of the light-transmitting hole is less than or equal to the first flexible layer layer thickness.
  • the substrate includes a stacked first flexible layer, a first inorganic layer and a second flexible layer, and the light-transmitting hole is disposed on a side of the substrate away from the blank structure layer; the The depth of the light transmission hole is less than or equal to the thickness of the first flexible layer, or the depth of the light transmission hole is less than or equal to the total thickness of the first flexible layer and the first inorganic layer, or the light transmission hole The depth of the hole is less than or equal to the total thickness of the first flexible layer, the first inorganic layer and the second flexible layer.
  • the substrate includes a stacked first flexible layer, a first inorganic layer, a second flexible layer and a second inorganic layer, and the light-transmitting holes are disposed on the substrate away from the blank structure layer.
  • the depth of the light-transmitting hole is less than or equal to the thickness of the first flexible layer, or the depth of the light-transmitting hole is less than or equal to the total thickness of the first flexible layer and the first inorganic layer, or , the depth of the light-transmitting hole is less than or equal to the total thickness of the first flexible layer, the first inorganic layer and the second flexible layer, or the depth of the light-transmitting hole is less than or equal to the first flexible layer, The total thickness of the first inorganic layer, the second flexible layer and the second inorganic layer.
  • Exemplary embodiments of the present disclosure also provide a display device including the aforementioned display substrate.
  • Exemplary embodiments of the present disclosure also provide a method for manufacturing a display substrate, the display substrate includes a normal resolution display area and a low resolution display area, the low resolution display area having a smaller resolution than the normal resolution display area resolution; the low-resolution display area includes a light-transmitting display area and a non-light-transmitting display area located at the periphery of the light-transmitting display area; the light-transmitting display area includes a pixel area and a blank area, and the pixel area includes a configuration In order to display a plurality of pixel islands of a picture, the blank area includes a plurality of blank islands configured to transmit light; the preparation method includes:
  • a display structure layer disposed on the substrate is formed in the pixel area, and a blank structure layer disposed on the substrate is formed in the blank area; the display structure layer at least includes a light-emitting device;
  • a light-transmitting hole is formed on the base; the orthographic projection of the light-transmitting hole on the plane of the display substrate and the orthographic projection of the light-emitting device on the plane of the display substrate have no overlapping area.
  • the plurality of pixel islands form a plurality of display columns
  • the plurality of blank islands form a plurality of blank columns
  • the display columns and the blank columns are alternately arranged in a row direction
  • Forming the light-transmitting holes on the substrate includes: forming a plurality of strip-shaped light-transmitting holes extending in the column direction on the substrate, the plurality of strip-shaped light-transmitting holes are arranged at intervals in the row direction, and the blank columns are displayed in the display
  • the orthographic projection on the plane of the substrate includes the orthographic projection of the strip-shaped light-transmitting holes on the plane of the display substrate.
  • the plurality of pixel islands form a plurality of display rows
  • the plurality of blank islands form a plurality of blank rows
  • the display rows and the blank rows are alternately arranged in a column direction
  • Forming light-transmitting holes on the substrate includes: forming a plurality of strip-shaped light-transmitting holes extending in the row direction on the substrate, the plurality of strip-shaped light-transmitting holes are arranged at intervals in the column direction, and the blank rows are displayed in the display
  • the orthographic projection on the plane of the substrate includes the orthographic projection of the strip-shaped light-transmitting holes on the plane of the display substrate.
  • the plurality of pixel islands are alternately arranged in a row direction and a column direction, and the plurality of blank islands are alternately arranged in a row direction and a column direction;
  • Forming light-transmitting holes on the substrate includes: forming a plurality of block-shaped light-transmitting holes on the substrate, the plurality of block-shaped light-transmitting holes are spaced apart in the row direction and the column direction, and the blank islands are on the plane of the display substrate
  • the orthographic projection includes the orthographic projection of the block-shaped light-transmitting hole on the plane of the display substrate.
  • forming light-transmitting holes on the substrate includes:
  • the light-transmitting hole is formed by irradiating a side of the back film away from the substrate with a laser.
  • a blank structure layer disposed on the substrate is formed in the blank area, including:
  • first flexible layer covering the peeling layer, the first flexible layer on the side of the peeling layer away from the glass carrier is used as a peeling substrate, and the first flexible layer in other areas is used as a substrate;
  • Form light-transmitting holes on the substrate including:
  • the glass carrier plate is peeled off from the substrate, the glass carrier plate drives the peeling layer and the peeling substrate to peel off together, and a light-transmitting hole is formed on the substrate.
  • a blank structure layer disposed on the substrate is formed in the blank area, including:
  • a first flexible layer, a first inorganic layer and a second flexible layer are formed in sequence; inorganic openings are arranged on the first inorganic layer, and the orthographic projection of the inorganic openings on the glass carrier plate includes the peeling layer on the glass carrier plate The orthographic projection on the surface, the second flexible layer fills the inorganic opening; the first flexible layer and the second flexible layer on the side of the peeling layer away from the glass carrier serve as peeling substrates, and the first flexible layer in other areas layer, the first inorganic layer and the second flexible layer as a substrate;
  • Form light-transmitting holes on the substrate including:
  • the glass carrier plate is peeled off from the substrate, the glass carrier plate drives the peeling layer and the peeling substrate to peel off together, and a light-transmitting hole is formed on the substrate.
  • 1 is a schematic structural diagram of a display device
  • FIG. 2 is a schematic plan view of a display substrate
  • FIG. 3 is a schematic cross-sectional structure diagram of a display substrate
  • FIG. 4 is a schematic diagram of an equivalent circuit of a pixel driving circuit
  • FIG. 6 is a schematic plan view of a resolution display area in a display substrate
  • 7a to 7e are front views of several light-transmitting display regions in a display substrate
  • FIG. 8 is a schematic cross-sectional structure diagram of a light-transmitting display area according to an exemplary embodiment of the present disclosure
  • 9a to 9e are rear views of several light-transmitting display areas according to exemplary embodiments of the present disclosure.
  • FIG. 10 is a schematic diagram after forming a base pattern in a preparation method of the present disclosure.
  • FIG. 11 is a schematic diagram after forming a driving circuit layer pattern in a preparation method of the present disclosure.
  • FIG. 12 is a schematic diagram after forming a light-emitting structure and an encapsulation layer pattern in a preparation method of the present disclosure
  • FIG. 13 is a schematic diagram after peeling off the glass carrier plate in a preparation method of the present disclosure.
  • Figure 14 is a schematic diagram of a preparation method of the disclosure after the back film is attached;
  • 15a to 15e are schematic diagrams after forming light-transmitting holes in a preparation method of the present disclosure.
  • 16 is a schematic diagram after forming a peeling layer pattern in another preparation method of the present disclosure.
  • FIG. 17 is a schematic diagram after forming a base pattern in another preparation method of the present disclosure.
  • FIG. 18 is a schematic diagram after forming a display structure layer pattern in another preparation method of the present disclosure.
  • 19 is a schematic diagram of forming a light-transmitting hole pattern in another preparation method of the present disclosure.
  • FIG. 20 is a schematic diagram after forming a peeling layer pattern in yet another preparation method of the present disclosure.
  • FIG. 21 is a schematic diagram after forming a base pattern in yet another preparation method of the present disclosure.
  • FIG. 22 is a schematic diagram after forming a display structure layer pattern in yet another preparation method of the present disclosure.
  • FIG. 23 is a schematic diagram of forming a light-transmitting hole pattern in yet another preparation method of the present disclosure.
  • 10A the first flexible layer
  • 10B the first inorganic layer
  • 10C the second flexible layer
  • 10D the second inorganic layer
  • 31 anode
  • 32 pixel definition layer
  • 102 drive circuit layer
  • 103 light emitting structure layer
  • 104 encapsulation layer
  • 202 composite insulating layer
  • 210 normal resolution display area
  • 220 low resolution display area
  • 310 display structure layer
  • 400 blank island
  • 410 blank structure layer
  • 500 light transmission hole
  • 501 light transmission hole group.
  • the terms “installed”, “connected” and “connected” should be construed in a broad sense. For example, it may be a fixed connection, or a detachable connection, or an integral connection; it may be a mechanical connection, or an electrical connection; it may be a direct connection, or an indirect connection through an intermediate piece, or an internal communication between two elements.
  • installed should be construed in a broad sense. For example, it may be a fixed connection, or a detachable connection, or an integral connection; it may be a mechanical connection, or an electrical connection; it may be a direct connection, or an indirect connection through an intermediate piece, or an internal communication between two elements.
  • a transistor refers to an element including at least three terminals of a gate electrode, a drain electrode, and a source electrode.
  • a transistor has a channel region between a drain electrode (drain electrode terminal, drain region, or drain electrode) and a source electrode (source electrode terminal, source region, or source electrode), and current can flow through the drain electrode, the channel region, and the source electrode .
  • the channel region refers to a region through which current mainly flows.
  • the first electrode may be the drain electrode and the second electrode may be the source electrode, or the first electrode may be the source electrode and the second electrode may be the drain electrode.
  • the functions of the "source electrode” and the “drain electrode” may be interchanged when using transistors of opposite polarities or when the direction of the current changes during circuit operation. Therefore, in this specification, “source electrode” and “drain electrode” may be interchanged with each other.
  • electrically connected includes a case where constituent elements are connected together by an element having a certain electrical effect.
  • the "element having a certain electrical effect” is not particularly limited as long as it can transmit and receive electrical signals between the connected constituent elements.
  • Examples of “elements having a certain electrical effect” include not only electrodes and wirings, but also switching elements such as transistors, resistors, inductors, capacitors, other elements having various functions, and the like.
  • parallel refers to a state where the angle formed by two straight lines is -10° or more and 10° or less, and therefore includes a state where the angle is -5° or more and 5° or less.
  • perpendicular refers to the state where the angle formed by two straight lines is 80° or more and 100° or less, and therefore includes the state where the angle is 85° or more and 95° or less.
  • film and “layer” are interchangeable.
  • conductive layer may be replaced by “conductive film” in some cases.
  • insulating film may be replaced with “insulating layer” in some cases.
  • FIG. 1 is a schematic structural diagram of a display device.
  • the OLED display device may include a timing controller, a data signal driver, a scan signal driver, a light-emitting signal driver, and a pixel array
  • the pixel array may include a plurality of scan signal lines (S1 to Sm), a plurality of data signal lines (D1 to Dn), a plurality of light-emitting signal lines (E1 to Eo), and a plurality of sub-pixels Pxij.
  • the timing controller may supply a grayscale value and a control signal suitable for the specification of the data signal driver to the data signal driver, and may supply a clock signal, a scan start signal, etc., suitable for the specification of the scan signal driver When supplied to the scan signal driver, a clock signal, an emission stop signal, and the like suitable for the specifications of the light-emitting signal driver can be supplied to the light-emitting signal driver.
  • the data signal driver may generate data voltages to be supplied to the data signal lines D1, D2, D3, . . . and Dn using the grayscale values and control signals received from the timing controller.
  • the data signal driver may sample grayscale values with a clock signal and apply data voltages corresponding to the grayscale values to the data signal lines D1 to Dn in pixel row units, where n may be a natural number.
  • the scan signal driver may generate scan signals to be supplied to the scan signal lines S1 , S2 , S3 , . . . and Sm by receiving a clock signal, a scan start signal, and the like from the timing controller.
  • the scan signal driver may sequentially supply scan signals having on-level pulses to the scan signal lines S1 to Sm.
  • the scan signal driver may be constructed in the form of a shift register, and may generate scans in such a manner that a scan start signal supplied in the form of an on-level pulse is sequentially transmitted to the next stage circuit under the control of a clock signal signal, m can be a natural number.
  • the emission signal driver may generate emission signals to be supplied to the emission signal lines E1 , E2 , E3 , . . . and Eo by receiving a clock signal, an emission stop signal, and the like from the timing controller.
  • the emission signal driver may sequentially supply emission signals having off-level pulses to the emission signal lines E1 to Eo.
  • the light-emitting signal driver may be constructed in the form of a shift register, and may generate the emission signal by sequentially transmitting the emission stop signal provided in the form of an off-level pulse to the next stage circuit under the control of the clock signal, o Can be a natural number.
  • the pixel array may include a plurality of sub-pixels PXij. Each sub-pixel PXij may be connected to a corresponding data signal line, a corresponding scan signal line, and a corresponding light-emitting signal line, and i and j may be natural numbers.
  • the sub-pixel PXij may refer to a sub-pixel in which a transistor is connected to the i-th scan signal line and to the j-th data signal line.
  • FIG. 2 is a schematic plan view of a display substrate.
  • the display substrate may include a plurality of pixel units P arranged in a matrix, and at least one of the plurality of pixel units P includes a first light-emitting unit (sub-pixel) P1 that emits light of a first color, a second light-emitting unit P1 that emits light of a first color, and a
  • the second light emitting unit P2 for color light and the third light emitting unit P3 for emitting third color light, the first light emitting unit P1, the second light emitting unit P2 and the third light emitting unit P3 may all include pixel driving circuits and light emitting devices.
  • the pixel driving circuits in the first light emitting unit P1, the second light emitting unit P2 and the third light emitting unit P3 are respectively connected with the scanning signal line, the data signal line and the light emitting signal line, and the pixel driving circuit is configured to connect the scanning signal line and the light emitting signal line. Under the control of the line, the data voltage transmitted by the data signal line is received, and the corresponding current is output to the light-emitting device.
  • the light-emitting devices in the first light-emitting unit P1, the second light-emitting unit P2, and the third light-emitting unit P3 are respectively connected to the pixel driving circuit of the light-emitting unit, and the light-emitting devices are configured to respond to the current output by the pixel driving circuit of the light-emitting unit. Brightness of light.
  • the pixel unit P may include a red (R) light-emitting unit, a green (G) light-emitting unit, and a blue (B) light-emitting unit, or may include a red light-emitting unit, a green light-emitting unit, and a blue light-emitting unit and white light-emitting units, which are not limited in the present disclosure.
  • the shape of the light emitting unit in the pixel unit may be a rectangle shape, a diamond shape, a pentagon shape or a hexagon shape.
  • the pixel unit includes three light-emitting units, the three light-emitting units can be arranged horizontally, vertically, or in a square pattern.
  • the pixel unit includes four light-emitting units, the four light-emitting units can be horizontally, vertically, or square. (Square) arrangement, which is not limited in the present disclosure.
  • FIG. 3 is a schematic cross-sectional structure diagram of a display substrate, illustrating the structure of three sub-pixels of the OLED display substrate.
  • the display substrate may include a driving circuit layer 102 disposed on the substrate 10, a light emitting structure layer 103 disposed on the side of the driving circuit layer 102 away from the substrate 10, and a light emitting structure layer 103 disposed on the light emitting
  • the structure layer 103 is away from the encapsulation layer 104 on the side of the substrate 10 .
  • the display substrate may include other film layers, such as spacer columns, etc., which are not limited in the present disclosure.
  • substrate 10 may be a flexible substrate, or may be a rigid substrate.
  • the driving circuit layer 102 of each sub-pixel may include a plurality of transistors and storage capacitors constituting the pixel driving circuit, and each sub-pixel in FIG. 3 only shows one transistor 101 and one storage capacitor 101A as an example.
  • the light-emitting structure layer 103 may include an anode 31, a pixel definition layer 32, an organic light-emitting layer 33, and a cathode 34.
  • the anode 31 is connected to the drain electrode of the transistor 101 through a via hole, the organic light-emitting layer 33 is connected to the anode 31, and the cathode 34 is connected to the organic light-emitting layer.
  • the encapsulation layer 104 may include a stacked first encapsulation layer 41 , a second encapsulation layer 42 and a third encapsulation layer 43 .
  • the first encapsulation layer 41 and the third encapsulation layer 43 may be made of inorganic materials, and the second encapsulation layer 42 may be made of organic materials.
  • the second encapsulation layer 42 is disposed between the first encapsulation layer 41 and the third encapsulation layer 43 to ensure that the outside water vapor cannot enter the light emitting structure layer 103 .
  • the organic light-emitting layer may include an emission layer (Emitting Layer, referred to as EML), and any one or more of the following: a hole injection layer (Hole Injection Layer, referred to as HIL), a hole transport layer (Hole Transport Layer (HTL), Electron Block Layer (EBL), Hole Block Layer (HBL), Electron Transport Layer (ETL) and Electron Injection Layer, referred to as EIL).
  • EML emission layer
  • EML emission layer
  • EML emission layer
  • HIL hole injection layer
  • HTL hole transport layer
  • EBL Electron Block Layer
  • HBL Hole Block Layer
  • ETL Electron Transport Layer
  • EIL Electron Injection Layer
  • the organic light-emitting layer may be formed by using a fine metal mask (Fine Metal Mask, FMM for short) or an open mask (Open Mask) evaporation, or by using an inkjet process.
  • FMM fine metal mask
  • Open Mask Open Mask
  • the hole injection layers of all subpixels may be a common layer connected together
  • the electron injection layers of all subpixels may be a common layer connected together
  • the hole transport layers of all subpixels may be A common layer connected together
  • the electron transport layer of all subpixels can be a common layer connected together
  • the hole blocking layer of all subpixels can be a common layer connected together
  • the light emitting layers of adjacent subpixels can have a small amount of The electron blocking layers of adjacent sub-pixels may overlap slightly, or may be isolated.
  • the pixel driving circuit may be a 3T1C, 4T1C, 5T1C, 5T2C, 6T1C or 7T1C structure.
  • FIG. 4 is a schematic diagram of an equivalent circuit of a pixel driving circuit.
  • the pixel driving circuit may include 7 thin film transistors (first transistor T1 to seventh transistor T7 ), 1 storage capacitor C and 7 signal lines (data signal line D, first scan signal line S1 , The second scanning signal line S2, the light emitting signal line E, the initial signal line INIT, the first power supply line VDD, and the second power supply line VSS).
  • the first end of the storage capacitor C is connected to the first power supply line VDD
  • the second end of the storage capacitor C is connected to the second node N2, that is, the second end of the storage capacitor C is connected to the third transistor T3 Control pole connection.
  • the control electrode of the first transistor T1 is connected to the second scan signal line S2, the first electrode of the first transistor T1 is connected to the initial signal line INIT, and the second electrode of the first transistor is connected to the second node N2.
  • the first transistor T1 transmits an initialization voltage to the gate of the third transistor T3 to initialize the charge amount of the gate of the third transistor T3.
  • the control electrode of the second transistor T2 is connected to the first scan signal line S1, the first electrode of the second transistor T2 is connected to the second node N2, and the second electrode of the second transistor T2 is connected to the third node N3.
  • the second transistor T2 connects the control electrode of the third transistor T3 to the second electrode.
  • the control electrode of the third transistor T3 is connected to the second node N2, that is, the control electrode of the third transistor T3 is connected to the second end of the storage capacitor C, the first electrode of the third transistor T3 is connected to the first node N1, and the third transistor T3 is connected to the first node N1.
  • the second pole of T3 is connected to the third node N3.
  • the third transistor T3 may be referred to as a driving transistor, and the third transistor T3 determines the amount of driving current flowing between the first power supply line VDD and the second power supply line VSS according to the potential difference between its control electrode and the first electrode.
  • the control electrode of the fourth transistor T4 is connected to the first scan signal line S1, the first electrode of the fourth transistor T4 is connected to the data signal line D, and the second electrode of the fourth transistor T4 is connected to the first node N1.
  • the fourth transistor T4 may be referred to as a switching transistor, a scan transistor, or the like, and enables the data voltage of the data signal line D to be input to the pixel driving circuit when an on-level scan signal is applied to the first scan signal line S1.
  • the control electrode of the fifth transistor T5 is connected to the light-emitting signal line E, the first electrode of the fifth transistor T5 is connected to the first power line VDD, and the second electrode of the fifth transistor T5 is connected to the first node N1.
  • the control electrode of the sixth transistor T6 is connected to the light emitting signal line E, the first electrode of the sixth transistor T6 is connected to the third node N3, and the second electrode of the sixth transistor T6 is connected to the first electrode of the light emitting device.
  • the fifth transistor T5 and the sixth transistor T6 may be referred to as light emitting transistors. When an on-level light emission signal is applied to the light emission signal line E, the fifth and sixth transistors T5 and T6 make the light emitting device emit light by forming a driving current path between the first power supply line VDD and the second power supply line VSS.
  • the control electrode of the seventh transistor T7 is connected to the first scan signal line S1, the first electrode of the seventh transistor T7 is connected to the initial signal line INIT, and the second electrode of the seventh transistor T7 is connected to the first electrode of the light emitting device.
  • the seventh transistor T7 transmits an initialization voltage to the first electrode of the light emitting device to initialize or discharge the amount of charge accumulated in the first electrode of the light emitting device to emit light The amount of charge accumulated in the first pole of the device.
  • the second pole of the light emitting device is connected to the second power supply line VSS, the signal of the second power supply line VSS is a low-level signal, and the signal of the first power supply line VDD is a continuous high-level signal.
  • the first scan signal line S1 is the scan signal line in the pixel driving circuit of the display row
  • the second scan signal line S2 is the scan signal line in the pixel driving circuit of the previous display row, that is, for the nth display row, the first scan signal
  • the line S1 is S(n)
  • the second scanning signal line S2 is S(n-1)
  • the second scanning signal line S2 of this display line is the same as the first scanning signal line S1 in the pixel driving circuit of the previous display line
  • the signal lines can reduce the signal lines of the display substrate and realize the narrow frame of the display substrate.
  • the first to seventh transistors T1 to T7 may be P-type transistors, or may be N-type transistors. Using the same type of transistors in the pixel driving circuit can simplify the process flow, reduce the process difficulty of the display substrate, and improve the yield of the product. In some possible implementations, the first to seventh transistors T1 to T7 may include P-type transistors and N-type transistors.
  • the first scan signal line S1, the second scan signal line S2, the light emitting signal line E and the initial signal line INIT extend in the horizontal direction
  • the second power supply line VSS, the first power supply line VDD and the data signal line D extends in the vertical direction.
  • the light emitting device may be an organic electroluminescent diode (OLED) including a stacked first electrode (anode), an organic light emitting layer and a second electrode (cathode).
  • OLED organic electroluminescent diode
  • FIG. 5 is a working timing diagram of a pixel driving circuit. Exemplary embodiments of the present disclosure will be described below through the operation process of the pixel driving circuit illustrated in FIG. 4 .
  • the pixel driving circuit in FIG. 4 includes 7 thin film transistors (the first transistor T1 to the sixth transistor T7 ), a storage capacitor C and 7 signal lines (data signal line D, first scanning signal line S1, second scanning signal line S2, light-emitting signal line E, initial signal line INIT, first power supply line VDD and second power supply line VSS), 7 transistors All are P-type transistors.
  • the working process of the pixel driving circuit may include:
  • the first stage A1 is called the reset stage
  • the signal of the second scanning signal line S2 is a low-level signal
  • the signals of the first scanning signal line S1 and the light-emitting signal line E are a high-level signal.
  • the signal of the second scanning signal line S2 is a low level signal, which turns on the first transistor T1
  • the signal of the initial signal line INIT is supplied to the second node N2 to initialize the storage capacitor C and clear the original data voltage in the storage capacitor.
  • the signals of the first scanning signal line S1 and the light-emitting signal line E are high-level signals, so that the second transistor T2, the fourth transistor T4, the fifth transistor T5, the sixth transistor T6 and the seventh transistor T7 are turned off. At this stage, the OLED Not glowing.
  • the second stage A2 is called the data writing stage or the threshold compensation stage.
  • the signal of the first scanning signal line S1 is a low-level signal
  • the signals of the second scanning signal line S2 and the light-emitting signal line E are a high-level signal
  • the data The signal line D outputs the data voltage.
  • the third transistor T3 is turned on.
  • the signal of the first scan signal line S1 is a low level signal, so that the second transistor T2, the fourth transistor T4 and the seventh transistor T7 are turned on.
  • the second transistor T2 and the fourth transistor T4 are turned on so that the data voltage output from the data signal line D is supplied to the second through the first node N1, the turned-on third transistor T3, the third node N3, and the turned-on second transistor T2 node N2, and the difference between the data voltage output by the data signal line D and the threshold voltage of the third transistor T3 is charged into the storage capacitor C, and the voltage of the second end (second node N2) of the storage capacitor C is Vd-
  • the seventh transistor T7 is turned on so that the initial voltage of the initial signal line INIT is supplied to the first electrode of the OLED, initializes (resets) the first electrode of the OLED, clears the internal pre-stored voltage, completes the initialization, and ensures that the OLED does not emit light.
  • the signal of the second scanning signal line S2 is a high-level signal, so that the first transistor T1 is turned off.
  • the signal of the light-emitting signal line E is a high-level signal, so that the fifth transistor T5 and the sixth transistor T6 are turned off.
  • the third stage A3 is called the light-emitting stage, the signal of the light-emitting signal line E is a low-level signal, and the signals of the first scanning signal line S1 and the second scanning signal line S2 are high-level signals.
  • the signal of the light-emitting signal line E is a low-level signal, so that the fifth transistor T5 and the sixth transistor T6 are turned on, and the power supply voltage output by the first power line VDD passes through the fifth transistor T5, the third transistor T3 and the sixth transistor T5, which are turned on.
  • the transistor T6 provides a driving voltage to the first electrode of the OLED to drive the OLED to emit light.
  • the driving current flowing through the third transistor T3 (driving transistor) is determined by the voltage difference between its gate electrode and the first electrode. Since the voltage of the second node N2 is Vdata-
  • I is the driving current flowing through the third transistor T3, that is, the driving current for driving the OLED
  • K is a constant
  • Vgs is the voltage difference between the gate electrode and the first electrode of the third transistor T3
  • Vth is the third transistor.
  • Vd is the data voltage output by the data signal line D
  • Vdd is the power supply voltage output by the first power line VDD.
  • full-screen displays have gradually become the development trend of display products with their large screen-to-body ratio and ultra-narrow bezels.
  • Full-screen products usually use off-screen sensing technology. Sensors such as cameras, 3D imaging, and fingerprint recognition are placed under the screen.
  • the screen area where the sensors are placed has sufficient light transmittance to realize off-screen sensing. It has a display function to achieve a real full-screen display. In order to improve the sensing effect of the sensing area under the screen, this area needs to have a high light transmittance.
  • the current rigid display panel uses polyethylene terephthalate (PET) as the base material, the transmittance of PET can be about 90%, and the optical loss caused by the base is small, which can meet the requirements of light transmittance.
  • PET polyethylene terephthalate
  • PI polyimide
  • the PI substrate has a great influence on the light transmittance, especially for the blue light band, the transmittance is only about 20% to 60% at the wavelength of 420nm to 450nm.
  • FIG. 6 is a schematic plan view of a resolution display area in a display substrate.
  • the display substrate may include a normal resolution display area 210 and a low resolution display area 220, the normal resolution display area 210 is located at the periphery of the low resolution display area 220, and the normal resolution display area
  • Both the low-resolution display area 210 and the low-resolution display area 220 include a plurality of regularly arranged pixels, but the resolution of the low-resolution display area 220 is smaller than that of the normal-resolution display area 210 .
  • Resolution Pigels Per Inch, referred to as PPI refers to the number of pixels per unit area, which can be called pixel density.
  • the low-resolution display area 220 may include a light-transmitting display area 221 and a non-light-transmitting display area 222 , and the non-light-transmitting display area 222 is located at the periphery of the light-transmitting display area 221 .
  • the position of the light-transmitting display area 221 may correspond to the position of the optical device, and has the functions of displaying a picture and transmitting light, and the transmitted light is received by the optical device.
  • the non-transparent display area 222 has the functions of displaying images and configuring signal lines, and the signal lines are connected to the signal lines in the light-transmitting display area to lead out these signal lines.
  • the shape of the light-transmitting display area 221 may be any one or more of the following: rectangle, polygon, circle and ellipse, and the optical device may be a fingerprint identification device , a camera device, or an optical sensor such as 3D imaging, which is not limited in the present disclosure.
  • the shape of the light-transmitting display area 221 is a circle
  • the diameter of the circle may be about 3 mm to 5 mm.
  • the side length of the rectangle may be about 3 mm to 5 mm.
  • the shape of the non-light-transmitting display area 222 may be any one or more of the following: rectangle, polygon, circle, and ellipse.
  • the light-transmitting display area may include a pixel area and a blank area.
  • the pixel area is configured to display a picture and includes a plurality of pixel islands 300 distributed in an array and spaced apart from each other.
  • the blank area is configured to transmit light, including A plurality of blank islands 400 are distributed in an array and spaced apart from each other.
  • At least one pixel island 300 may include one or more display pixels, and one display pixel may include 3 display sub-pixels that emit light of different colors (eg, red, green, and blue) or 4 display sub-pixels that emit light of different colors (eg, red, green, and blue).
  • 3 display sub-pixels that emit light of different colors (eg, red, green, and blue) or 4 display sub-pixels that emit light of different colors (eg, red, green, and blue).
  • red, green, blue, and white display sub-pixels at least one display sub-pixel may include at least a light-emitting device, and the light-emitting device is configured to emit light of corresponding brightness in response to the current output by the corresponding pixel drive circuit, so that the display sub-pixel can display a picture.
  • At least one blank island 400 may include one or more blank sub-pixels that do not emit light, and neither a pixel driving circuit nor a light-emitting device is provided in the blank sub-pixel, nor a picture is displayed.
  • the shape, size and arrangement of the display sub-pixels may be the same as the sub-pixels in the normal resolution display area, and the shape and size of the blank sub-pixels may be the same as those of the sub-pixels in the normal resolution display area. Same shape and size.
  • the display sub-pixel may include both a pixel driving circuit and a light-emitting device, and the light-emitting device of the display sub-pixel is driven by the driving circuit of the display sub-pixel to emit light.
  • the display sub-pixel may only be provided with a light-emitting device without a pixel driving circuit.
  • the pixel driving circuit of 222 drives the light-emitting device to emit light, which is not limited in this disclosure.
  • the plurality of pixel islands 300 and the plurality of blank islands 400 may be alternately arranged in the row direction (the first direction X), and the plurality of pixel islands 300 may be arranged in sequence in the column direction (the second direction Y), Multiple blank islands 400 are arranged in sequence in the column direction, so that multiple pixel islands 300 form multiple display columns, multiple blank islands 400 form multiple blank columns, and display columns and blank columns are alternately arranged in the row direction, as shown in FIG. 7a Show.
  • the plurality of pixel islands 300 and the plurality of blank islands 400 may be alternately arranged in the column direction (the second direction Y), and the plurality of pixel islands 300 may be arranged in sequence in the row direction (the first direction X), Multiple blank islands 400 are arranged in sequence in the row direction, so that multiple pixel islands 300 form multiple display rows, multiple blank islands 400 form multiple blank rows, and the display rows and blank rows are alternately arranged in the column direction, as shown in FIG. 7b Show.
  • the plurality of pixel islands 300 may be alternately arranged in the row direction (the first direction X) and the column direction (the second direction Y), and the plurality of blank islands 400 may be alternately arranged in the row direction And alternately arranged in the column direction, so that no matter in the row direction or in the column direction, the pixel island 300 is adjacent to the blank island 400, the blank island 400 is adjacent to the pixel island 300, and the plurality of pixel islands 300 and many are adjacent to each other.
  • the blank islands 400 form a checkerboard arrangement, as shown in FIG. 7c.
  • the resolution of the light-transmitting display area is about the normal resolution About 50% of the resolution of the display area.
  • the number of blank islands 400 can be increased and the resolution can be reduced, as shown in FIG. 7d .
  • the number of the pixel islands 300 can be increased, and the resolution can be increased, as shown in FIG. 7e.
  • the arrangement of the pixel islands and blank islands in the light-transmitting display area, the arrangement of sub-pixels in the pixel island, the shape and size of the sub-pixels, etc. can be determined according to the application scenario, resolution and transmittance. It is set according to other requirements, which is not limited in this disclosure.
  • FIG. 8 is a schematic cross-sectional structure diagram of a light-transmitting display area according to an exemplary embodiment of the present disclosure, and is a cross-sectional view taken along the direction A-A in FIG. 7a.
  • the light-transmitting display area may include a plurality of pixel islands 300 and a plurality of blank islands 400
  • the pixel islands 300 may include a plurality of display sub-pixels
  • the blank islands 400 may include a plurality of blank sub-pixels.
  • FIG. 8 is a schematic cross-sectional structure diagram of a light-transmitting display area according to an exemplary embodiment of the present disclosure, and is a cross-sectional view taken along the direction A-A in FIG. 7a.
  • the light-transmitting display area may include a plurality of pixel islands 300 and a plurality of blank islands 400
  • the pixel islands 300 may include a plurality of display sub-pixels
  • the blank islands 400 may include a plurality of blank sub-pixels.
  • the pixel island 300 may include a display structure layer 310 disposed on the side of the substrate 10 facing the light outgoing light, and the display structure layer 310 may include light-emitting devices, or include pixel driving circuits and light-emitting device.
  • the blank island 400 may include a blank structure layer 410 disposed on the side of the substrate 10 facing the outgoing light and a light-transmitting hole 500 disposed on the side of the substrate 10 away from the outgoing light.
  • the orthographic projection of the light-transmitting hole 500 on the plane of the display substrate and the orthographic projection of the light emitting device in the pixel island on the plane of the display substrate have no overlapping area.
  • the light-transmitting hole 500 is disposed on the surface of the substrate 10 on the side away from the blank structure layer 410 , the substrate at the depth H in the light-transmitting hole 500 is removed, and a blind hole structure is formed on the back of the display substrate.
  • the depth H of the light-transmitting hole 500 may be less than or equal to the thickness D of the substrate 10.
  • the shape of the light-transmitting hole 500 may correspond to the shape of the blank island 400 , the width L1 of the light-transmitting hole 500 may be less than or equal to the width L2 of the blank island 400 , and the width of the blank island 400 on the display substrate plane may be smaller than or equal to that of the blank island 400 .
  • the orthographic projection may include the orthographic projection of the light-transmitting hole 500 on the plane of the display substrate.
  • the width may be the dimension in the first direction X, or may be the dimension in the second direction Y.
  • the display structure layer 310 of the pixel island 300 may include a driving circuit layer disposed on the substrate 10, a light emitting structure layer disposed on a side of the driving circuit layer away from the substrate, and a light emitting structure layer disposed on a side away from the substrate of the light emitting structure layer
  • the encapsulation layer, the drive circuit layer may include transistors and storage capacitors that constitute the pixel drive circuit, or may include signal lines configured to connect the light-emitting device
  • the light-emitting structure layer may include an anode, an organic light-emitting layer and a cathode that constitute the light-emitting device
  • the encapsulation layer may It includes a stacked first encapsulation layer, an organic encapsulation layer and a second encapsulation layer.
  • the driving circuit layer may include: an active layer disposed on the substrate 10, a first insulating layer covering the active layer, a first insulating layer disposed on the first insulating layer
  • the source electrode and the drain electrode on the insulating layer cover the fourth insulating layer of the source electrode and the drain electrode.
  • the active layer, the gate electrode, the source electrode and the drain electrode form a transistor
  • the first capacitor electrode and the second capacitor electrode form a storage capacitor.
  • the blank structure layer 410 of the blank island 400 does not contain a light-emitting device
  • the blank structure layer 410 may include a composite insulating layer disposed on the substrate 10 and an inorganic encapsulation layer disposed on the side of the composite insulating layer away from the substrate
  • the composite insulating layer may include a plurality of inorganic insulating layers
  • the inorganic encapsulation layer may include a first inorganic encapsulation layer and a second inorganic encapsulation layer.
  • the plurality of inorganic insulating layers may be provided in the same layer as the first insulating layer, the second insulating layer, the third insulating layer and the fourth insulating layer in the driving circuit layer in the pixel island 300, and the materials are the same, and Formed simultaneously by the same process, the first inorganic encapsulation layer and the second inorganic encapsulation layer can be provided in the same layer as the first encapsulation layer and the second encapsulation layer of the encapsulation layer in the pixel island 300, with the same materials, and formed simultaneously by the same process .
  • the substrate may include a first flexible layer on which the display structure layer and the blank structure layer are disposed.
  • the light-transmitting holes may be disposed on the first flexible layer, and the depths of the light-transmitting holes may be less than or equal to the thickness of the first flexible layer.
  • the substrate may include a stacked first flexible layer, a first inorganic layer, a second flexible layer and a second inorganic layer, and the display structure layer and the blank structure layer are disposed on the second inorganic layer.
  • the light-transmitting holes may be disposed on the first flexible layer, and the depths of the light-transmitting holes may be less than or equal to the thickness of the first flexible layer.
  • the light-transmitting holes may be disposed on the first flexible layer and the first inorganic layer, and the depths of the light-transmitting holes may be less than or equal to the total thickness of the first flexible layer and the first inorganic layer.
  • light-transmitting holes may be provided on the first flexible layer, the first inorganic layer and the second flexible layer, and the depth of the light-transmitting holes may be less than or equal to the total thickness of the first flexible layer, the first inorganic layer and the second flexible layer .
  • the light-transmitting holes may be disposed on the first flexible layer, the first inorganic layer, the second flexible layer, and the second inorganic layer, and the depths of the light-transmitting holes may be less than or equal to the first flexible layer, the first inorganic layer, the second flexible layer, and the second inorganic layer. The total thickness of the flexible layer and the second inorganic layer.
  • the substrate may include a stacked first flexible layer, a first inorganic layer, a semiconductor layer, a second flexible layer and a second inorganic layer, and the display structure layer and the blank structure layer are disposed on the second inorganic layer .
  • the light-transmitting holes may be disposed on the first flexible layer, and the depths of the light-transmitting holes may be less than or equal to the thickness of the first flexible layer.
  • the light-transmitting holes may be disposed on the first flexible layer and the first inorganic layer, and the depths of the light-transmitting holes may be less than or equal to the total thickness of the first flexible layer and the first inorganic layer.
  • the light-transmitting holes may be provided on the first flexible layer, the first inorganic layer and the semiconductor layer, and the depths of the light-transmitting holes may be less than or equal to the total thickness of the first flexible layer, the first inorganic layer and the semiconductor layer.
  • the light-transmitting holes may be disposed on the first flexible layer, the first inorganic layer, the semiconductor layer and the second flexible layer, and the depths of the light-transmitting holes may be less than or equal to the first flexible layer, the first inorganic layer, the semiconductor layer and the second flexible layer. The total thickness of the two flexible layers.
  • a plurality of strip-shaped light-transmitting holes 500 may be provided on the substrate 10 of the light-transmitting display area, and each light-transmitting hole 500 The holes 500 extend along the first direction X (row direction), and a plurality of light-transmitting holes 500 are arranged along the second direction Y (column direction) at intervals, as shown in FIG. 9b .
  • a plurality of block-shaped light-transmitting holes 500 may be provided on the substrate 10 of the light-transmitting display area, and a plurality of block-shaped light-transmitting holes 500 are spaced in the first direction X (row direction) and spaced in the second direction Y (column direction), as shown in FIG. 9c.
  • the position of each block-shaped light-transmitting hole 500 corresponds to the position of the blank island on the light-transmitting display area, and the orthographic projection of the blank island on the substrate includes the orthographic projection of the corresponding block-shaped light-transmitting hole on the substrate.
  • each light-transmitting hole group 501 corresponds to the position of the blank column on the light-transmitting display area, and the orthographic projection of the blank column on the substrate includes the orthographic projection of the corresponding light-transmitting hole group 501 on the substrate.
  • the shape and arrangement of the plurality of light-transmitting holes in the light-transmitting hole group can be set according to actual needs, which is not limited in the present disclosure.
  • light-transmitting holes are only provided in the blank island regions in the light-transmitting display area that do not participate in the screen display, and no light-transmitting holes are provided in the pixel island areas in the light-transmitting display area that perform screen display. That is to say, to retain the substrate of the pixel island area, not only the light transmittance of the light-transmitting display area is equivalent to the light transmittance of the light-transmitting display area as a whole with light-transmitting holes, which ensures the light transmittance of the light-transmitting display area, but also the pixel island area retains the light transmittance.
  • the substrate provides effective support for the display structure of the display sub-pixels, avoids the deformation of the display structure, and avoids affecting the packaging effect, thereby effectively ensuring the quality and service life of the display image.
  • the orthographic projection of A includes the orthographic projection of B means that the boundary of the orthographic projection of B falls within the boundary range of the orthographic projection of A, or the boundary of the orthographic projection of A is the same as the boundary of the orthographic projection of B.
  • the projected boundaries overlap.
  • Forming a flexible base pattern may include: firstly coating a first flexible film on the glass carrier 1 , and then curing it into a film to form a first flexible layer 10A; then depositing a first flexible film on the first flexible layer 10A an inorganic thin film to form a first inorganic layer 10B; then a second flexible thin film is coated on the first inorganic layer 10B, and cured to form a film to form a second flexible layer 10C; then a second inorganic thin film is deposited on the second flexible layer 10C, The second inorganic layer 10D is formed, and the preparation of the substrate 10 is completed, as shown in FIG. 10 .
  • the materials of the first flexible layer and the second flexible layer may be polyimide (PI) or a surface-treated soft polymer film, etc.
  • the materials of the first inorganic layer and the second inorganic layer may be Silicon nitride (SiNx) or silicon oxide (SiOx), etc. may be used, and the first inorganic layer and the second inorganic layer may be called a barrier layer or a buffer layer.
  • the thickness of the first flexible layer and the second flexible layer may be about 5 ⁇ m to 10 ⁇ m, and the thickness of the first inorganic layer and the second inorganic layer may be about 0.3 ⁇ m to 1.0 ⁇ m.
  • the thickness of the first flexible layer may be about 8.5 ⁇ m
  • the thickness of the second flexible layer may be about 8.5 ⁇ m
  • the thickness of the first inorganic layer may be about 0.6 ⁇ m
  • the thickness of the second inorganic layer may be about 0.6 ⁇ m.
  • the substrate may include only the first flexible layer, or may include a stacked first flexible layer, a first inorganic layer, and a second flexible layer, or may include other film layers, such as a stacked
  • the first flexible layer, the first inorganic layer, the semiconductor layer, the second flexible layer and the second inorganic layer are not limited in this disclosure.
  • a driving circuit layer pattern is formed.
  • the driving circuit layer may include transistors and storage capacitors constituting a pixel driving circuit.
  • forming the driving circuit layer pattern may include:
  • a second insulating film and a first metal film are sequentially deposited, and the first metal film is patterned through a patterning process to form a second insulating layer covering the pattern of the semiconductor layer, and a first conductive layer disposed on the second insulating layer Layer pattern, the first conductive layer pattern is formed in the pixel island 300 area, at least including a gate electrode and a first capacitor electrode located in each display sub-pixel, the orthographic projection of the gate electrode on the substrate is located on the positive side of the active layer on the substrate. within the projection range.
  • the first metal film in the area of the blank island 400 is etched away, leaving the second insulating layer, that is, the area of the blank island 400 includes the first insulating layer and the second insulating layer stacked on the substrate 10 .
  • a fourth insulating film is deposited, and the fourth insulating film is patterned by a patterning process to form a fourth insulating layer covering the pattern of the second conductive layer.
  • Via holes are formed in the pixel island 300 area, and the via holes are located in each display panel respectively.
  • the fourth insulating layer, the third insulating layer and the second insulating layer in the via hole are etched away, respectively exposing the surface of the active layer.
  • the area of the blank island 400 includes the first insulating layer, the second insulating layer, the third insulating layer and the fourth insulating layer stacked on the substrate 10.
  • the third metal film in the area of the blank island 400 is etched away, and the area of the blank island 400 includes the first insulating layer, the second insulating layer, the third insulating layer and the fourth insulating layer stacked on the substrate 10 .
  • the driving circuit layer 102 and the composite insulating layer 202 are respectively prepared in the pixel island 300 region and the blank island 400 region, as shown in FIG. 11 .
  • the driving circuit layer 102 may include a transistor and a storage capacitor, the transistor may include an active layer, a gate electrode, a source electrode and a drain electrode, the storage capacitor may include a first capacitor electrode and a second capacitor electrode, and the transistor may It is a driving transistor in a pixel driving circuit, and the driving transistor can be a thin film transistor.
  • the composite insulating layer 202 may include a stacked first insulating layer, a second insulating layer, a third insulating layer, and a fourth insulating layer.
  • the first insulating layer, the second insulating layer, the third insulating layer, and the fourth insulating layer may adopt silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON) Any one or more of them may be a single layer, multiple layers or composite layers.
  • the first insulating layer is called a buffer layer
  • the second insulating layer and the third insulating layer are called a (GI) layer
  • the fourth insulating layer is called an interlayer insulating (ILD) layer.
  • the flat film can be made of organic materials such as resins.
  • the first conductive layer, the second conductive layer and the third conductive layer can be made of metal materials, such as any one of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo) or More, or alloy materials of the above metals, such as aluminum neodymium alloy (AlNd) or molybdenum niobium alloy (MoNb), can be a single-layer structure, or a multi-layer composite structure, such as Ti/Al/Ti and the like.
  • metal materials such as any one of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo) or More, or alloy materials of the above metals, such as aluminum neodymium alloy (AlNd) or molybdenum niobium alloy (MoNb)
  • AlNd aluminum neodymium alloy
  • MoNb molybdenum niobium alloy
  • the display substrate may include a fifth insulating layer, the fifth insulating layer may cover the third conductive layer pattern, the planarization layer is disposed on the fifth insulating layer, and the fifth insulating layer is called a passivation (PVX) layer .
  • PVX passivation
  • a conductive film is deposited on the substrate formed with the aforementioned pattern, and the conductive film is patterned through a patterning process to form an anode pattern.
  • the anode is formed in each display sub-pixel in the pixel island 300 region, and the anode is connected to the drain electrode through the anode via hole. .
  • the conductive film deposited on the area of the blank island 400 is etched away, and the structure of the area of the blank island 400 is the same as that after the previous process.
  • an organic light-emitting layer pattern is formed in the pixel island 300 region by vapor deposition or inkjet printing on the substrate on which the aforementioned pattern is formed, and the organic light-emitting layer in each display sub-pixel is connected to the anode through the pixel opening.
  • the structure of the blank island 400 region is the same as that after the previous process.
  • a cathode pattern is formed on the substrate on which the aforementioned pattern is formed by evaporation.
  • the cathode is formed in the pattern in the pixel island 300 region, and is connected to the organic light-emitting layer in each display sub-pixel.
  • the cathode may be an integral structure connected together. .
  • the structure of the blank island 400 region is the same as that after the previous process.
  • a first encapsulation film is firstly deposited, and a first encapsulation layer is formed in the pixel islands 300 and the blank islands 400;
  • the organic packaging material is inkjet printed, and after curing into a film, an organic packaging layer is formed; then a second packaging film is deposited to form a second packaging layer on the pixel islands 300 and the blank islands 400 .
  • the pixel island 300 area includes the display structure layer 310 disposed on the substrate 10
  • the blank island 400 area includes the blank structure layer 410 disposed on the substrate 10
  • the display structure layer 310 It includes the driving circuit layer 102 , the light emitting structure layer 103 and the encapsulation layer 104
  • the blank structure layer 410 includes the composite insulating layer 202 and the inorganic encapsulation layer, as shown in FIG. 12 .
  • the pixel definition layer may employ polyimide, acrylic, polyethylene terephthalate, or the like.
  • the shape of the pixel opening may be a triangle, a rectangle, a polygon, a circle, an ellipse, or the like.
  • the cross-sectional shape of the pixel opening may be a rectangle or a trapezoid or the like.
  • the first encapsulation layer and the second encapsulation layer may adopt any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and may be a single layer, multi-layer or composite layer
  • the organic encapsulation layer can be made of resin material, and a laminated structure of inorganic material/organic material/inorganic material is formed in the pixel island 300 area, and the organic material layer is arranged between the two inorganic material layers.
  • the area of the island 400 forms a layered structure of inorganic materials/inorganic materials, which can ensure that external water vapor cannot enter the light-emitting structure layer.
  • peeling off the glass carrier may include peeling off the glass carrier from the display substrate through a peeling process, as shown in FIG. 13 .
  • the lift-off process may employ a laser lift-off process.
  • the laser lift-off process is to scan the back of the glass carrier (the side of the glass carrier without the display substrate) with a high-energy laser beam emitted by a laser device, so that the film layer of the flexible substrate is denatured and the adhesion performance is reduced, thereby destroying the flexible substrate and the substrate. Adhesion of the contact surfaces between the glass carriers, and then use physical means such as pulling, pulling, knife cutting, etc. to peel off the display substrate from the hard glass carrier.
  • the lift-off process may adopt a mechanical lift-off manner, which is not limited in the present disclosure.
  • attaching the back film may include: attaching the back film 2 on the back side of the display substrate through an attaching process, as shown in FIG. 14 .
  • the back film may include one or more film layers of organic materials to protect the display substrate from scratches.
  • the thickness of the back film may be about 30 ⁇ m to 100 ⁇ m.
  • the thickness of the backing film may be about 38 ⁇ m, or 75 ⁇ m.
  • a light-transmitting hole is formed.
  • forming the light-transmitting holes may include: irradiating a laser from the side of the back film 2 away from the display substrate, removing the back film 2 and the substrate 10 in the area of the blank islands 400 , and forming a pattern of light-transmitting holes 500 , as shown in FIG. 15a to 15e.
  • the laser irradiation process can use a nanosecond solid-state ultraviolet laser with a wavelength of about 355 nm, which has higher single-photon energy, higher material absorption rate, and less thermal impact, and the focused spot can be only More than ten microns can achieve higher machining accuracy.
  • Pulsed UV laser cutting uses the principle of photophysics. When the energy of the single photon of the laser is lower than the chemical bond energy of the material, the very high energy density at the focused spot exceeds the gasification threshold of the material, thereby instantly gasifying the material and realizing the removal of the material .
  • the depth H of the light-transmitting hole 500 can be controlled by adjusting the laser energy and irradiation time, thereby adjusting the transmittance of the light-transmitting display area.
  • the depth H of the light-transmitting hole 500 may be less than or equal to the thickness of the first flexible layer, as shown in FIG. 15a.
  • the depth H of the light-transmitting hole 500 may be less than or equal to the total thickness of the first flexible layer and the first inorganic layer, as shown in FIG. 15b.
  • the depth H of the light-transmitting hole 500 may be greater than the total thickness of the first flexible layer and the first inorganic layer, but less than the total thickness of the first flexible layer, the first inorganic layer and the second flexible layer, as shown in FIG. 15c .
  • the depth H of the light-transmitting hole 500 may be equal to the total thickness of the first flexible layer, the first inorganic layer and the second flexible layer, as shown in FIG. 15d .
  • the depth H of the light-transmitting hole 500 may be greater than the total thickness of the first flexible layer, the first inorganic layer, and the second flexible layer, but less than the first flexible layer, the first inorganic layer, the second flexible layer, and the second inorganic layer.
  • the total thickness of the layers is shown in Figure 15e.
  • a display substrate In a display substrate, light-transmitting holes are formed through a patterning process when a substrate is prepared, and then a corresponding structural film layer is formed. Since the first-formed light-transmitting hole pattern has a step difference, and the supportability of the substrate is deteriorated, the formation quality of the subsequent film layer is lowered, and the display quality is lowered.
  • the present disclosure not only ensures the substrate and the substrate can provide good support, which improves the formation quality of the subsequent film layers and improves the display quality.
  • the preparation method of the present disclosure can be well compatible with the existing preparation process, and has the advantages of simple process realization, easy implementation, high production efficiency, easy process realization, low production cost and high yield.
  • FIG. 16 to 19 show another fabrication process of the substrate according to an exemplary embodiment of the present disclosure.
  • another manufacturing process of the display substrate may include the following operations.
  • the material of the first flexible layer may be a material such as polyimide (PI) or a surface-treated soft polymer film.
  • the display structure layer 310 is formed in the area of the pixel island 300, and the blank structure layer 410 is formed in the area of the blank island 400.
  • the display structure layer 310 may include the driving circuit layer 102, the light emitting structure layer 103 and the encapsulation layer 104 formed in sequence.
  • the driving circuit The layers may include transistors and storage capacitors constituting a pixel driving circuit, and the blank structure layer 410 may include a composite insulating layer and an inorganic encapsulation layer formed in sequence, as shown in FIG. 18 .
  • the process of forming the display structure layer and the blank structure layer may be the same as the steps (12) to (13) in the foregoing embodiment, which will not be repeated here.
  • a pattern of light-transmitting holes is formed when the glass carrier plate is peeled off.
  • forming the light-transmitting hole pattern when peeling off the glass carrier plate may include: firstly irradiating the interface area between the substrate 10 and the peeling substrate 91 through the glass carrier plate 1 with laser light, and cutting off the interface area by laser irradiation Link keys of the first flexible layer. Subsequently, the glass carrier 1 is peeled off from the substrate 10 by a laser lift-off process.
  • the glass carrier 1 drives the peeling layer 90 and the peeling layer 90 drives the peeling substrate 91 thereon to peel off together, forming a light-transmitting hole 500 on the substrate 10, and the depth of the light-transmitting hole 500 is about the first flexible layer 10A thickness, as shown in Figure 19.
  • the main chain of polyimide PI contains a class of polymers containing an imide ring (-CO-NH-CO-), and the photochemical principle can be used to cut the link bond of the PI film by laser irradiation, Using the laser single photon energy to reach or exceed the chemical bond energy of the material, the main chain of the material is interrupted.
  • the bond energies of the C-C bond and the C-N bond are 3.45 eV and 3.17 eV respectively in the normal state
  • the single-photon energy of the 355nm UV laser cutting device is 3.49 eV, which is higher than the C-C bond and the C-N bond in the normal state.
  • the bond energy can directly destroy the chemical bond of the material.
  • the light-transmitting holes can be filled with a highly transparent material by coating or inkjet printing, and the high-transparency material can be polyethylene terephthalate. (PET) etc.
  • PET polyethylene terephthalate.
  • the preparation process of the display substrate may include processes such as attaching a back film, cutting, etc., which are not limited herein by the present disclosure.
  • a display substrate In a display substrate, light-transmitting holes are formed through a patterning process when a substrate is prepared, and then a corresponding structural film layer is formed. Since the first-formed light-transmitting hole pattern has a step difference, and the supportability of the substrate is deteriorated, the formation quality of the subsequent film layer is lowered, and the display quality is lowered.
  • the exemplary embodiment of the present disclosure not only ensures the flatness of the substrate, but also provides The good supportability improves the formation quality of the subsequent film layers and improves the display quality.
  • a peeling layer pattern is formed, as shown in FIG. 20 .
  • the process of forming the pattern of the peeling layer may be the same as the previous embodiment, and the material and structure of the peeling layer may be the same as the previous embodiment.
  • forming the base pattern may include: coating a first flexible film on the glass carrier plate 1 formed with the aforementioned pattern, and forming a first flexible layer 10A covering the release layer 90 after curing into a film. Subsequently, a first inorganic thin film is deposited, and the first inorganic thin film is patterned by a patterning process to form a first inorganic layer 10B. An inorganic opening is formed on the first inorganic layer 10B, the inorganic opening is located in the area of the blank island 400 , and the inorganic opening is located in the area of the blank island 400 .
  • the orthographic projection on the glass carrier includes the orthographic projection of the release layer 90 on the glass carrier.
  • a second flexible film is coated, cured into a film, and a second flexible layer 10C is formed.
  • the second flexible layer 10C fills the inorganic openings on the first inorganic layer 10B, and the second flexible layer 10C and the first flexible layer in the inorganic openings 10A direct contact.
  • a second inorganic thin film is deposited to form a second inorganic layer 10D, and the preparation of the substrate 10 is completed, as shown in FIG. 21 .
  • the first flexible layer 10A and the second flexible layer 10C located above the peeling layer 90 may include two parts, the first flexible layer 10A, the first inorganic layer 10B, the second flexible layer 10A disposed on the glass carrier 1
  • the flexible layer 10C and the second inorganic layer 10D serve as the substrate 10
  • the first flexible layer 10A and the second flexible layer 10C provided on the release layer 90 serve as the release substrate 91 .
  • the material of the first flexible layer and the second flexible layer may be polyimide (PI) or a surface-treated soft polymer film or the like.
  • a light-transmitting hole pattern is formed when the glass carrier plate is peeled off.
  • forming the light-transmitting hole pattern when peeling off the glass carrier plate may include: firstly irradiating the interface area between the substrate 10 and the peeling substrate 91 through the glass carrier plate 1 with laser light, and cutting off the interface area by laser irradiation Link keys of the first flexible layer and the second flexible layer. Subsequently, the glass carrier 1 is peeled off from the substrate 10 by a laser lift-off process.
  • the glass carrier 1 drives the peeling layer 90 and the peeling layer 90 drives the peeling substrate 91 thereon to peel off together, forming a light-transmitting hole 500 on the substrate 10, and the depth of the light-transmitting hole 500 is about the first flexible layer 10A , the sum of the thicknesses of the first inorganic layer 10B and the second flexible layer 10C, as shown in FIG. 23 .
  • the exemplary embodiment of the present disclosure not only ensures the flatness of the substrate, but also provides The good supportability improves the formation quality of the subsequent film layers and improves the display quality.
  • Exemplary embodiments of the present disclosure use peeling layers to form light-transmitting holes, which have neat boundaries, smooth inner walls, and uniform depths, thereby improving the light-transmitting performance of the light-transmitting holes and improving the optical performance of the sensor.
  • Exemplary embodiments of the present disclosure also provide a method for manufacturing a display substrate, the display substrate includes a normal resolution display area and a low resolution display area, the low resolution display area having a smaller resolution than the normal resolution display area resolution; the low-resolution display area includes a light-transmitting display area and a non-light-transmitting display area located at the periphery of the light-transmitting display area; the light-transmitting display area includes a pixel area and a blank area, and the pixel area includes a configuration In order to display a plurality of pixel islands of a picture, the blank area includes a plurality of blank islands configured to transmit light; in an exemplary embodiment, the preparation method may include:
  • step S2 may include: :
  • Forming the light-transmitting holes on the substrate includes: forming a plurality of strip-shaped light-transmitting holes extending in the column direction on the substrate, the plurality of strip-shaped light-transmitting holes are arranged at intervals in the row direction, and the blank columns are displayed in the display
  • the orthographic projection on the plane of the substrate includes the orthographic projection of the strip-shaped light-transmitting holes on the plane of the display substrate.
  • step S2 may include:
  • a plurality of strip-shaped light-transmitting holes extending in the row direction are formed on the substrate, the strip-shaped light-transmitting holes are arranged at intervals in the column direction, and the orthographic projection of the blank row on the plane of the display substrate includes the stripes The orthographic projection of the light-transmitting hole on the plane of the display substrate.
  • step S2 may include:
  • a plurality of block-shaped light-transmitting holes are formed on the substrate, and the plurality of block-shaped light-transmitting holes are arranged at intervals in the row direction and the column direction.
  • the orthographic projection of the blank island on the plane of the display substrate includes the block-shaped light-transmitting holes Orthographic projection of the hole on the plane of the display substrate.
  • step S2 may include:
  • the light-transmitting hole is formed by irradiating a side of the back film away from the substrate with a laser.
  • forming a blank structure layer disposed on the substrate in the blank area in step S1 may include:
  • first flexible layer on the side of the peeling layer away from the glass carrier is used as a peeling substrate, and the first flexible layer in other areas is used as a substrate;
  • step S2 may include:
  • the glass carrier plate is peeled off from the substrate, the glass carrier plate drives the peeling layer and the peeling substrate to peel off together, and a light-transmitting hole is formed on the substrate.
  • forming a blank structure layer disposed on the substrate in the blank area in step S1 may include:
  • a first flexible layer, a first inorganic layer and a second flexible layer are formed in sequence; inorganic openings are arranged on the first inorganic layer, and the orthographic projection of the inorganic openings on the glass carrier plate includes the peeling layer on the glass carrier plate The orthographic projection on the surface, the second flexible layer fills the inorganic opening; the first flexible layer and the second flexible layer on the side of the peeling layer away from the glass carrier serve as peeling substrates, and the first flexible layer in other areas layer, the first inorganic layer and the second flexible layer as a substrate;
  • step S2 may include:
  • the glass carrier plate is peeled off from the substrate, the glass carrier plate drives the peeling layer and the peeling substrate to peel off together, and a light-transmitting hole is formed on the substrate.
  • Exemplary embodiments of the present disclosure also provide a display device including the display substrate of the foregoing embodiments.
  • the display device can be: mobile phone, tablet computer, TV, monitor, notebook computer, digital photo frame, navigator, etc. any product or component with display function.

Abstract

Provided by the present disclosure are a display substrate, a preparation method therefor, and a display device. The display substrate comprises a normal-resolution display region and a low-resolution display region. The low-resolution display region comprises a light-transmitting display region and a non-light-transmitting display region which is located at the periphery of the light-transmitting display region. The light-transmitting display region comprises a pixel region and a blank region, wherein the pixel region comprises a plurality of pixel islands configured to display a picture, and the blank region comprises a plurality of blank islands configured to transmit light. In a plane perpendicular to the display substrate, the pixel islands comprise display structure layers which are disposed on one side of the substrate facing the emergent light, the display structure layers at least comprise light-emitting devices, and the blank islands comprise blank structure layers which are disposed on one side of the substrate facing the emergent light and light-transmitting holes which are disposed on the substrate. The orthographic projections of the light-transmitting holes on the plane of the display substrate do not overlap with the orthographic projections of the light-emitting devices on the plane of the display substrate.

Description

显示基板及其制备方法、显示装置Display substrate and preparation method thereof, and display device 技术领域technical field
本公开涉及但不限于显示技术领域，尤指一种显示基板及其制备方法、显示装置。The present disclosure relates to, but is not limited to, the field of display technology, and more particularly, to a display substrate, a method for manufacturing the same, and a display device.
背景技术Background technique
有机发光二极管(Organic Light Emitting Diode，简称OLED)为主动发光显示器件，具有自发光、广视角、高对比度、低耗电、极高反应速度、轻薄、可弯曲和成本低等优点。随着显示技术的不断发展，以OLED为发光器件、由薄膜晶体管(Thin Film Transistor，简称TFT)进行信号控制的柔性显示装置(Flexible Display)已成为目前显示领域的主流产品，已被广泛应用于手机、电脑、电视、车载、智能可穿戴设备等领域。Organic Light Emitting Diode (OLED) is an active light-emitting display device, which has the advantages of self-luminescence, wide viewing angle, high contrast ratio, low power consumption, extremely high response speed, lightness, flexibility, and low cost. With the continuous development of display technology, the flexible display device (Flexible Display), which uses OLED as the light-emitting device and is signal-controlled by Thin Film Transistor (TFT), has become the mainstream product in the current display field and has been widely used in Mobile phones, computers, TVs, vehicles, smart wearable devices and other fields.
发明内容SUMMARY OF THE INVENTION
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。The following is an overview of the topics detailed in this article. This summary is not intended to limit the scope of protection of the claims.
本公开示例性实施例提供了一种显示基板，包括正常分辨率显示区和低分辨显示区，所述低分辨显示区的分辨率小于所述正常分辨率显示区的分辨率；所述低分辨显示区包括透光显示区和位于所述透光显示区***的非透光显示区；所述透光显示区包括像素区和空白区，所述像素区包括配置为显示画面的多个像素岛，所述空白区包括配置为透过光线的多个空白岛；在垂直于显示基板的平面内，所述像素岛包括设置在基底朝向出射光一侧的显示结构层，所述显示结构层至少包括发光器件，所述空白岛包括设置在基底朝向出射光一侧的空白结构层以及设置在基底上的透光孔；所述透光孔在显示基板平面上的正投影与所述发光器件在显示基板平面上的正投影没有重叠区域。Exemplary embodiments of the present disclosure provide a display substrate including a normal resolution display area and a low resolution display area, the low resolution display area having a resolution smaller than that of the normal resolution display area; the low resolution display area The display area includes a light-transmitting display area and a non-light-transmitting display area located at the periphery of the light-transmitting display area; the light-transmitting display area includes a pixel area and a blank area, and the pixel area includes a plurality of pixel islands configured to display images , the blank area includes a plurality of blank islands configured to transmit light; in a plane perpendicular to the display substrate, the pixel islands include a display structure layer disposed on the side of the substrate facing the light outgoing light, and the display structure layer at least It includes a light-emitting device, and the blank island includes a blank structure layer disposed on the side of the substrate facing the light-emitting side and a light-transmitting hole disposed on the substrate; the orthographic projection of the light-transmitting hole on the plane of the display substrate is at the same level as the light-emitting device. The orthographic projections on the plane of the display substrate have no overlapping areas.
在示例性实施方式中，所述空白岛在显示基板平面上的正投影包含所述透光孔在显示基板平面上的正投影。In an exemplary embodiment, the orthographic projection of the blank island on the plane of the display substrate includes the orthographic projection of the light-transmitting hole on the plane of the display substrate.
在示例性实施方式中，所述多个像素岛形成多个显示列，所述多个空白岛形成多个空白列，所述显示列和所述空白列在行方向上交替设置；所述透光孔为沿着列方向上延伸的条状透光孔，所述多个条状透光孔在行方向上间隔设置，所述空白列在显示基板平面上的正投影包含所述条状透光孔在显示基板平面上的正投影。In an exemplary embodiment, the plurality of pixel islands form a plurality of display columns, the plurality of blank islands form a plurality of blank columns, and the display columns and the blank columns are alternately arranged in a row direction; the light transmission The holes are strip-shaped light-transmitting holes extending along the column direction, the plurality of strip-shaped light-transmitting holes are arranged at intervals in the row direction, and the orthographic projection of the blank column on the plane of the display substrate includes the strip-shaped light-transmitting holes Orthographic projection on the plane of the display substrate.
在示例性实施方式中，所述多个像素岛形成多个显示行，所述多个空白岛形成多个空白行，所述显示行和所述空白行在列方向上交替设置；所述透光孔为沿着行方向上延伸的条状透光孔，所述多个条状透光孔在列方向上间隔设置，所述空白行在显示基板平面上的正投影包含所述条状透光孔在显示基板平面上的正投影。In an exemplary embodiment, the plurality of pixel islands form a plurality of display rows, the plurality of blank islands form a plurality of blank rows, and the display rows and the blank rows are alternately arranged in a column direction; the transparent The light holes are strip-shaped light-transmitting holes extending along the row direction, the plurality of strip-shaped light-transmitting holes are arranged at intervals in the column direction, and the orthographic projection of the blank row on the plane of the display substrate includes the strip-shaped light-transmitting holes Orthographic projection of the hole on the plane of the display substrate.
在示例性实施方式中，所述多个像素岛在行方向上和列方向上交替设置，所述多个空白岛在行方向上和列方向上交替设置；所述透光孔为块状透光孔，所述多个块状透光孔在行方向上和列方向上间隔设置，所述空白岛在显示基板平面上的正投影包含所述块状透光孔在显示基板平面上的正投影。In an exemplary embodiment, the plurality of pixel islands are alternately arranged in the row direction and the column direction, and the plurality of blank islands are alternately arranged in the row direction and the column direction; the light-transmitting holes are block-shaped light-transmitting holes The plurality of block-shaped light-transmitting holes are arranged at intervals in the row direction and the column direction, and the orthographic projection of the blank islands on the display substrate plane includes the orthographic projection of the block-shaped light-transmitting holes on the display substrate plane.
在示例性实施方式中，所述像素岛包括多个显示子像素，至少一个显示子像素的显示结构层包括设置在所述基底上的驱动电路层、设置在所述驱动电路层上的发光结构层以及设置在所述发光结构层上的封装层，所述驱动电路层包括构成所述像素驱动电路的晶体管和存储电容，所述发光结构层包括构成所述发光器件的阳极、有机发光层和阴极；所述空白岛包括多个空白子像素，至少一个空白子像素的空白结构层包括设置在所述基底上的复合绝缘层和设置在所述复合绝缘层上的无机封装层。In an exemplary embodiment, the pixel island includes a plurality of display sub-pixels, and a display structure layer of at least one display sub-pixel includes a driving circuit layer disposed on the substrate, and a light emitting structure disposed on the driving circuit layer layer and an encapsulation layer disposed on the light-emitting structure layer, the drive circuit layer includes transistors and storage capacitors constituting the pixel drive circuit, the light-emitting structure layer includes an anode constituting the light-emitting device, an organic light-emitting layer and cathode; the blank island includes a plurality of blank sub-pixels, and the blank structure layer of at least one blank sub-pixel includes a composite insulating layer arranged on the substrate and an inorganic encapsulation layer arranged on the composite insulating layer.
在示例性实施方式中，所述基底包括第一柔性层，所述透光孔设置在所述基底远离所述空白结构层一侧；所述透光孔的深度小于或等于所述第一柔性层的厚度。In an exemplary embodiment, the substrate includes a first flexible layer, the light-transmitting hole is disposed on a side of the substrate away from the blank structure layer; the depth of the light-transmitting hole is less than or equal to the first flexible layer layer thickness.
在示例性实施方式中，所述基底包括叠设的第一柔性层、第一无机层和第二柔性层，所述透光孔设置在所述基底远离所述空白结构层一侧；所述透光孔的深度小于或等于所述第一柔性层的厚度，或者，所述透光孔的深度小于或等于所述第一柔性层和第一无机层的总厚度，或者，所述透光孔的深度小于或等于所述第一柔性层、第一无机层和第二柔性层的总厚度。In an exemplary embodiment, the substrate includes a stacked first flexible layer, a first inorganic layer and a second flexible layer, and the light-transmitting hole is disposed on a side of the substrate away from the blank structure layer; the The depth of the light transmission hole is less than or equal to the thickness of the first flexible layer, or the depth of the light transmission hole is less than or equal to the total thickness of the first flexible layer and the first inorganic layer, or the light transmission hole The depth of the hole is less than or equal to the total thickness of the first flexible layer, the first inorganic layer and the second flexible layer.
在示例性实施方式中，所述基底包括叠设的第一柔性层、第一无机层、第二柔性层和第二无机层，所述透光孔设置在所述基底远离所述空白结构层一侧；所述透光孔的深度小于或等于所述第一柔性层的厚度，或者，所述透光孔的深度小于或等于所述第一柔性层和第一无机层的总厚度，或者，所述透光孔的深度小于或等于所述第一柔性层、第一无机层和第二柔性层的总厚度，或者，所述透光孔的深度小于或等于所述第一柔性层、第一无机层、第二柔性层和第二无机层的总厚度。In an exemplary embodiment, the substrate includes a stacked first flexible layer, a first inorganic layer, a second flexible layer and a second inorganic layer, and the light-transmitting holes are disposed on the substrate away from the blank structure layer. one side; the depth of the light-transmitting hole is less than or equal to the thickness of the first flexible layer, or the depth of the light-transmitting hole is less than or equal to the total thickness of the first flexible layer and the first inorganic layer, or , the depth of the light-transmitting hole is less than or equal to the total thickness of the first flexible layer, the first inorganic layer and the second flexible layer, or the depth of the light-transmitting hole is less than or equal to the first flexible layer, The total thickness of the first inorganic layer, the second flexible layer and the second inorganic layer.
本公开示例性实施例还提供了一种显示装置，包括前述的显示基板。Exemplary embodiments of the present disclosure also provide a display device including the aforementioned display substrate.
本公开示例性实施例还提供了一种显示基板的制备方法，所述显示基板包括正常分辨率显示区和低分辨显示区，所述低分辨显示区的分辨率小于所述正常分辨率显示区的分辨率；所述低分辨显示区包括透光显示区和位于所述透光显示区***的非透光显示区；所述透光显示区包括像素区和空白区，所述像素区包括配置为显示画面的多个像素岛，所述空白区包括配置为透过光线的多个空白岛；所述制备方法包括：Exemplary embodiments of the present disclosure also provide a method for manufacturing a display substrate, the display substrate includes a normal resolution display area and a low resolution display area, the low resolution display area having a smaller resolution than the normal resolution display area resolution; the low-resolution display area includes a light-transmitting display area and a non-light-transmitting display area located at the periphery of the light-transmitting display area; the light-transmitting display area includes a pixel area and a blank area, and the pixel area includes a configuration In order to display a plurality of pixel islands of a picture, the blank area includes a plurality of blank islands configured to transmit light; the preparation method includes:
在像素区形成设置在基底上的显示结构层，在空白区形成设置在基底上的空白结构层；所述显示结构层至少包括发光器件；A display structure layer disposed on the substrate is formed in the pixel area, and a blank structure layer disposed on the substrate is formed in the blank area; the display structure layer at least includes a light-emitting device;
在基底上形成透光孔；所述透光孔在显示基板平面上的正投影与所述发光器件在显示基板平面上的正投影没有重叠区域。A light-transmitting hole is formed on the base; the orthographic projection of the light-transmitting hole on the plane of the display substrate and the orthographic projection of the light-emitting device on the plane of the display substrate have no overlapping area.
在示例性实施方式中，所述多个像素岛形成多个显示列，所述多个空白岛形成多个空白列，所述显示列和所述空白列在行方向上交替设置；In an exemplary embodiment, the plurality of pixel islands form a plurality of display columns, the plurality of blank islands form a plurality of blank columns, and the display columns and the blank columns are alternately arranged in a row direction;
在基底上形成透光孔，包括：在基底上形成沿着列方向上延伸的多个条状透光孔，所述多个条状透光孔在行方向上间隔设置，所述空白列在显示基板平面上的正投影包含所述条状透光孔在显示基板平面上的正投影。Forming the light-transmitting holes on the substrate includes: forming a plurality of strip-shaped light-transmitting holes extending in the column direction on the substrate, the plurality of strip-shaped light-transmitting holes are arranged at intervals in the row direction, and the blank columns are displayed in the display The orthographic projection on the plane of the substrate includes the orthographic projection of the strip-shaped light-transmitting holes on the plane of the display substrate.
在示例性实施方式中，所述多个像素岛形成多个显示行，所述多个空白岛形成多个空白行，所述显示行和所述空白行在列方向上交替设置；In an exemplary embodiment, the plurality of pixel islands form a plurality of display rows, the plurality of blank islands form a plurality of blank rows, and the display rows and the blank rows are alternately arranged in a column direction;
在基底上形成透光孔，包括：在基底上形成沿着行方向上延伸的多个条状透光孔，所述多个条状透光孔在列方向上间隔设置，所述空白行在显示基板平面上的正投影包含所述条状透光孔在显示基板平面上的正投影。Forming light-transmitting holes on the substrate includes: forming a plurality of strip-shaped light-transmitting holes extending in the row direction on the substrate, the plurality of strip-shaped light-transmitting holes are arranged at intervals in the column direction, and the blank rows are displayed in the display The orthographic projection on the plane of the substrate includes the orthographic projection of the strip-shaped light-transmitting holes on the plane of the display substrate.
在示例性实施方式中，所述多个像素岛在行方向上和列方向上交替设置，所述多个空白岛在行方向上和列方向上交替设置；In an exemplary embodiment, the plurality of pixel islands are alternately arranged in a row direction and a column direction, and the plurality of blank islands are alternately arranged in a row direction and a column direction;
在基底上形成透光孔，包括：在基底上形成多个块状透光孔，所述多个块状透光孔在行方向上和列方向上间隔设置，所述空白岛在显示基板平面上的正投影包含所述块状透光孔在显示基板平面上的正投影。Forming light-transmitting holes on the substrate includes: forming a plurality of block-shaped light-transmitting holes on the substrate, the plurality of block-shaped light-transmitting holes are spaced apart in the row direction and the column direction, and the blank islands are on the plane of the display substrate The orthographic projection includes the orthographic projection of the block-shaped light-transmitting hole on the plane of the display substrate.
在示例性实施方式中，在基底上形成透光孔，包括：In an exemplary embodiment, forming light-transmitting holes on the substrate includes:
将玻璃载板与基底剥离；Peel off the glass carrier from the substrate;
在基底远离所述显示结构层和空白结构层的一侧贴附背膜；Attach a back film on the side of the substrate away from the display structure layer and the blank structure layer;
采用激光在所述背膜远离所述基底的一侧进行照射，形成所述透光孔。The light-transmitting hole is formed by irradiating a side of the back film away from the substrate with a laser.
在示例性实施方式中，In an exemplary embodiment,
在空白区形成设置在基底上的空白结构层，包括：A blank structure layer disposed on the substrate is formed in the blank area, including:
在玻璃载板上形成剥离层；forming a release layer on a glass carrier;
形成覆盖所述剥离层的第一柔性层，位于所述剥离层远离所述玻璃载板一侧的第一柔性层作为剥离基底，其它区域的第一柔性层作为基底；forming a first flexible layer covering the peeling layer, the first flexible layer on the side of the peeling layer away from the glass carrier is used as a peeling substrate, and the first flexible layer in other areas is used as a substrate;
在所述基底上形成空白结构层；forming a blank structure layer on the substrate;
在基底上形成透光孔，包括：Form light-transmitting holes on the substrate, including:
采用激光透过所述玻璃载板对所述基底与剥离基底交界区域的第一柔性层进行照射；Irradiate the first flexible layer in the interface area between the substrate and the peeling substrate by using a laser through the glass carrier plate;
将玻璃载板与基底剥离，所述玻璃载板带动所述剥离层以及所述剥离基底一起剥离，在基底上形成透光孔。The glass carrier plate is peeled off from the substrate, the glass carrier plate drives the peeling layer and the peeling substrate to peel off together, and a light-transmitting hole is formed on the substrate.
在示例性实施方式中，In an exemplary embodiment,
在空白区形成设置在基底上的空白结构层，包括：A blank structure layer disposed on the substrate is formed in the blank area, including:
在玻璃载板上形成剥离层；forming a release layer on a glass carrier;
依次形成第一柔性层、第一无机层和第二柔性层；所述第一无机层上设置有无机开口，所述无机开口在玻璃载板上的正投影包含所述剥离层在玻璃 载板上的正投影，所述第二柔性层填充所述无机开口；位于所述剥离层远离所述玻璃载板一侧的第一柔性层和第二柔性层作为剥离基底，其它区域的第一柔性层、第一无机层和第二柔性层作为基底；A first flexible layer, a first inorganic layer and a second flexible layer are formed in sequence; inorganic openings are arranged on the first inorganic layer, and the orthographic projection of the inorganic openings on the glass carrier plate includes the peeling layer on the glass carrier plate The orthographic projection on the surface, the second flexible layer fills the inorganic opening; the first flexible layer and the second flexible layer on the side of the peeling layer away from the glass carrier serve as peeling substrates, and the first flexible layer in other areas layer, the first inorganic layer and the second flexible layer as a substrate;
在所述基底上形成空白结构层；forming a blank structure layer on the substrate;
在基底上形成透光孔，包括：Form light-transmitting holes on the substrate, including:
采用激光透过所述玻璃载板对所述基底与剥离基底交界区域的第一柔性层和第二柔性层进行照射；Irradiate the first flexible layer and the second flexible layer in the interface area between the substrate and the peeling substrate through the glass carrier by using laser light;
将玻璃载板与基底剥离，所述玻璃载板带动所述剥离层以及所述剥离基底一起剥离，在基底上形成透光孔。The glass carrier plate is peeled off from the substrate, the glass carrier plate drives the peeling layer and the peeling substrate to peel off together, and a light-transmitting hole is formed on the substrate.
在阅读并理解了附图和详细描述后，可以明白其他方面。Other aspects will become apparent upon reading and understanding of the drawings and detailed description.
附图说明Description of drawings
附图用来提供对本公开技术方案的进一步理解，并且构成说明书的一部分，与本公开的实施例一起用于解释本公开的技术方案，并不构成对本公开的技术方案的限制。附图中各部件的形状和大小不反映真实比例，目的只是示意说明本公开内容。The accompanying drawings are used to provide a further understanding of the technical solutions of the present disclosure, and constitute a part of the specification. They are used to explain the technical solutions of the present disclosure together with the embodiments of the present disclosure, and do not limit the technical solutions of the present disclosure. The shapes and sizes of the various components in the drawings do not reflect true scale, and are only intended to illustrate the present disclosure.
图1为一种显示装置的结构示意图；1 is a schematic structural diagram of a display device;
图2为一种显示基板的平面结构示意图；FIG. 2 is a schematic plan view of a display substrate;
图3为一种显示基板的剖面结构示意图；3 is a schematic cross-sectional structure diagram of a display substrate;
图4为一种像素驱动电路的等效电路示意图；4 is a schematic diagram of an equivalent circuit of a pixel driving circuit;
图5为一种像素驱动电路的工作时序图；5 is a working timing diagram of a pixel driving circuit;
图6为一种显示基板中分辨率显示区的平面示意图；6 is a schematic plan view of a resolution display area in a display substrate;
图7a至图7e为一种显示基板中几种透光显示区的前视图；7a to 7e are front views of several light-transmitting display regions in a display substrate;
图8为本公开示例性实施例一种透光显示区的剖面结构示意图；8 is a schematic cross-sectional structure diagram of a light-transmitting display area according to an exemplary embodiment of the present disclosure;
图9a至图9e为本公开示例性实施例几种透光显示区的后视图；9a to 9e are rear views of several light-transmitting display areas according to exemplary embodiments of the present disclosure;
图10为本公开一种制备方法中形成基底图案后的示意图；FIG. 10 is a schematic diagram after forming a base pattern in a preparation method of the present disclosure;
图11为本公开一种制备方法中形成驱动电路层图案后的示意图；FIG. 11 is a schematic diagram after forming a driving circuit layer pattern in a preparation method of the present disclosure;
图12为本公开一种制备方法中形成发光结构和封装层图案后的示意图；12 is a schematic diagram after forming a light-emitting structure and an encapsulation layer pattern in a preparation method of the present disclosure;
图13为本公开一种制备方法中剥离玻璃载板后的示意图；FIG. 13 is a schematic diagram after peeling off the glass carrier plate in a preparation method of the present disclosure;
图14为本公开一种制备方法中贴附背膜后的示意图；Figure 14 is a schematic diagram of a preparation method of the disclosure after the back film is attached;
图15a至图15e为本公开一种制备方法中形成透光孔后的示意图；15a to 15e are schematic diagrams after forming light-transmitting holes in a preparation method of the present disclosure;
图16为本公开另一种制备方法中形成剥离层图案后的示意图；16 is a schematic diagram after forming a peeling layer pattern in another preparation method of the present disclosure;
图17为本公开另一种制备方法中形成基底图案后的示意图；FIG. 17 is a schematic diagram after forming a base pattern in another preparation method of the present disclosure;
图18为本公开另一种制备方法中形成显示结构层图案后的示意图；18 is a schematic diagram after forming a display structure layer pattern in another preparation method of the present disclosure;
图19为本公开另一种制备方法中形成透光孔图案的示意图；19 is a schematic diagram of forming a light-transmitting hole pattern in another preparation method of the present disclosure;
图20为本公开又一种制备方法中形成剥离层图案后的示意图；20 is a schematic diagram after forming a peeling layer pattern in yet another preparation method of the present disclosure;
图21为本公开又一种制备方法中形成基底图案后的示意图；FIG. 21 is a schematic diagram after forming a base pattern in yet another preparation method of the present disclosure;
图22为本公开又一种制备方法中形成显示结构层图案后的示意图；22 is a schematic diagram after forming a display structure layer pattern in yet another preparation method of the present disclosure;
图23为本公开又一种制备方法中形成透光孔图案的示意图。FIG. 23 is a schematic diagram of forming a light-transmitting hole pattern in yet another preparation method of the present disclosure.
附图标记说明:Explanation of reference numbers:
1—玻璃载板；          2—背膜；               10—基底；1—glass carrier plate; 2—back film; 10—substrate;
10A—第一柔性层；      10B—第一无机层；       10C—第二柔性层；10A—the first flexible layer; 10B—the first inorganic layer; 10C—the second flexible layer;
10D—第二无机层；      31—阳极；              32—像素定义层；10D—the second inorganic layer; 31—anode; 32—pixel definition layer;
33—有机发光层；       34—阴极；              41—第一封装层；33—organic light-emitting layer; 34—cathode; 41—first encapsulation layer;
42—有机封装层；       43—第二封装层；        90—剥离层；42—organic encapsulation layer; 43—second encapsulation layer; 90—peeling layer;
91—剥离基底；         101—晶体管；           101A—存储电容；91—stripping the substrate; 101—transistor; 101A—storage capacitor;
102—驱动电路层；      103—发光结构层；       104—封装层；102—drive circuit layer; 103—light emitting structure layer; 104—encapsulation layer;
202—复合绝缘层；      210—正常分辨率显示区； 220—低分辨显示区；202—composite insulating layer; 210—normal resolution display area; 220—low resolution display area;
221—透光显示区；      222—非透光显示区；     300—像素岛；221—transparent display area; 222—non-transparent display area; 300—pixel island;
310—显示结构层；      400—空白岛；           410—空白结构层；310—display structure layer; 400—blank island; 410—blank structure layer;
500—透光孔；          501—透光孔组。500—light transmission hole; 501—light transmission hole group.
具体实施方式Detailed ways
为使本公开的目的、技术方案和优点更加清楚明白，下文中将结合附图对本公开的实施例进行详细说明。注意，实施方式可以以多个不同形式来实施。所属技术领域的普通技术人员可以很容易地理解一个事实，就是方式和内容可以在不脱离本公开的宗旨及其范围的条件下被变换为各种各样的形式。因此，本公开不应该被解释为仅限定在下面的实施方式所记载的内容中。在不冲突的情况下，本公开中的实施例及实施例中的特征可以相互任意组合。In order to make the objectives, technical solutions and advantages of the present disclosure clearer, the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. Note that embodiments may be implemented in many different forms. Those skilled in the art can easily understand the fact that the manner and content can be changed into various forms without departing from the spirit and scope of the present disclosure. Therefore, the present disclosure should not be construed as being limited only to the contents described in the following embodiments. The embodiments of the present disclosure and the features of the embodiments may be arbitrarily combined with each other without conflict.
在附图中，有时为了明确起见，夸大表示了各构成要素的大小、层的厚度或区域。因此，本公开的一个方式并不一定限定于该尺寸，附图中各部件的形状和大小不反映真实比例。此外，附图示意性地示出了理想的例子，本公开的一个方式不局限于附图所示的形状或数值等。In the drawings, the size of each constituent element, the thickness of a layer, or a region are sometimes exaggerated for clarity. Therefore, one form of the present disclosure is not necessarily limited to this size, and the shapes and sizes of the various components in the drawings do not reflect true scale. In addition, the drawings schematically show ideal examples, and one form of the present disclosure is not limited to the shapes, numerical values, and the like shown in the drawings.
本说明书中的“第一”、“第二”、“第三”等序数词是为了避免构成要素的混同而设置，而不是为了在数量方面上进行限定的。In this specification, ordinal numbers such as "first", "second", and "third" are provided to avoid confusion of constituent elements, and are not intended to be limited in quantity.
在本说明书中，为了方便起见，使用“中部”、“上”、“下”、“前”、“后”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示方位或位置关系的词句以参照附图说明构成要素的位置关系，仅是为了便于描述本说明书和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本公开的限制。构成要素的位置关系根据描述各构成要素的方向适当地改变。因此，不局限于在说明书中说明的词句，根据情况可以适当地更换。In this specification, "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inside" are used for convenience , "outside" and other words indicating orientation or positional relationship are used to describe the positional relationship of constituent elements with reference to the drawings, which are only for the convenience of describing this specification and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation. , are constructed and operated in a particular orientation and are therefore not to be construed as limitations of the present disclosure. The positional relationship of the constituent elements is appropriately changed according to the direction in which each constituent element is described. Therefore, it is not limited to the words and phrases described in the specification, and can be appropriately replaced according to the situation.
在本说明书中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解。例如，可以是固定连接，或可拆卸连接，或一体地连接；可以是机械连接，或电连接；可以是直接相连，或通过中间件间接相连，或两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本公开中的具体含义。In this specification, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be construed in a broad sense. For example, it may be a fixed connection, or a detachable connection, or an integral connection; it may be a mechanical connection, or an electrical connection; it may be a direct connection, or an indirect connection through an intermediate piece, or an internal communication between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present disclosure can be understood in specific situations.
在本说明书中，晶体管是指至少包括栅电极、漏电极以及源电极这三个端子的元件。晶体管在漏电极(漏电极端子、漏区域或漏电极)与源电极(源 电极端子、源区域或源电极)之间具有沟道区域，并且电流能够流过漏电极、沟道区域以及源电极。注意，在本说明书中，沟道区域是指电流主要流过的区域。In this specification, a transistor refers to an element including at least three terminals of a gate electrode, a drain electrode, and a source electrode. A transistor has a channel region between a drain electrode (drain electrode terminal, drain region, or drain electrode) and a source electrode (source electrode terminal, source region, or source electrode), and current can flow through the drain electrode, the channel region, and the source electrode . Note that in this specification, the channel region refers to a region through which current mainly flows.
在本说明书中，第一极可以为漏电极、第二极可以为源电极，或者第一极可以为源电极、第二极可以为漏电极。在使用极性相反的晶体管的情况或电路工作中的电流方向变化的情况等下，“源电极”及“漏电极”的功能有时互相调换。因此，在本说明书中，“源电极”和“漏电极”可以互相调换。In this specification, the first electrode may be the drain electrode and the second electrode may be the source electrode, or the first electrode may be the source electrode and the second electrode may be the drain electrode. The functions of the "source electrode" and the "drain electrode" may be interchanged when using transistors of opposite polarities or when the direction of the current changes during circuit operation. Therefore, in this specification, "source electrode" and "drain electrode" may be interchanged with each other.
在本说明书中，“电连接”包括构成要素通过具有某种电作用的元件连接在一起的情况。“具有某种电作用的元件”只要可以进行连接的构成要素间的电信号的授受，就对其没有特别的限制。“具有某种电作用的元件”的例子不仅包括电极和布线，而且还包括晶体管等开关元件、电阻器、电感器、电容器、其它具有各种功能的元件等。In this specification, "electrically connected" includes a case where constituent elements are connected together by an element having a certain electrical effect. The "element having a certain electrical effect" is not particularly limited as long as it can transmit and receive electrical signals between the connected constituent elements. Examples of "elements having a certain electrical effect" include not only electrodes and wirings, but also switching elements such as transistors, resistors, inductors, capacitors, other elements having various functions, and the like.
在本说明书中，“平行”是指两条直线形成的角度为-10°以上且10°以下的状态，因此，也包括该角度为-5°以上且5°以下的状态。另外，“垂直”是指两条直线形成的角度为80°以上且100°以下的状态，因此，也包括85°以上且95°以下的角度的状态。In this specification, "parallel" refers to a state where the angle formed by two straight lines is -10° or more and 10° or less, and therefore includes a state where the angle is -5° or more and 5° or less. In addition, "perpendicular" refers to the state where the angle formed by two straight lines is 80° or more and 100° or less, and therefore includes the state where the angle is 85° or more and 95° or less.
在本说明书中，“膜”和“层”可以相互调换。例如，有时可以将“导电层”换成为“导电膜”。与此同样，有时可以将“绝缘膜”换成为“绝缘层”。In this specification, "film" and "layer" are interchangeable. For example, "conductive layer" may be replaced by "conductive film" in some cases. Similarly, "insulating film" may be replaced with "insulating layer" in some cases.
本公开中的“约”，是指不严格限定界限，允许工艺和测量误差范围内的数值。"About" in this disclosure refers to a numerical value within an acceptable range of process and measurement error without strictly limiting the limit.
图1为一种显示装置的结构示意图。如图1所示，OLED显示装置可以包括时序控制器、数据信号驱动器、扫描信号驱动器、发光信号驱动器和像素阵列，像素阵列可以包括多个扫描信号线(S1到Sm)、多个数据信号线(D1到Dn)、多个发光信号线(E1到Eo)和多个子像素Pxij。在示例性实施方式中，时序控制器可以将适合于数据信号驱动器的规格的灰度值和控制信号提供到数据信号驱动器，可以将适合于扫描信号驱动器的规格的时钟信号、扫描起始信号等提供到扫描信号驱动器，可以将适合于发光信号驱动器的规格的时钟信号、发射停止信号等提供到发光信号驱动器。数据信号驱 动器可以利用从时序控制器接收的灰度值和控制信号来产生将提供到数据信号线D1、D2、D3、……和Dn的数据电压。例如，数据信号驱动器可以利用时钟信号对灰度值进行采样，并且以像素行为单位将与灰度值对应的数据电压施加到数据信号线D1至Dn，n可以是自然数。扫描信号驱动器可以通过从时序控制器接收时钟信号、扫描起始信号等来产生将提供到扫描信号线S1、S2、S3、……和Sm的扫描信号。例如，扫描信号驱动器可以将具有导通电平脉冲的扫描信号顺序地提供到扫描信号线S1至Sm。例如，扫描信号驱动器可以被构造为移位寄存器的形式，并且可以以在时钟信号的控制下顺序地将以导通电平脉冲形式提供的扫描起始信号传输到下一级电路的方式产生扫描信号，m可以是自然数。发光信号驱动器可以通过从时序控制器接收时钟信号、发射停止信号等来产生将提供到发光信号线E1、E2、E3、……和Eo的发射信号。例如，发光信号驱动器可以将具有截止电平脉冲的发射信号顺序地提供到发光信号线E1至Eo。例如，发光信号驱动器可以被构造为移位寄存器的形式，并且可以在时钟信号的控制下顺序地将以截止电平脉冲形式提供的发射停止信号传输到下一级电路的方式产生发射信号，o可以是自然数。像素阵列可以包括多个子像素PXij。每个子像素PXij可以连接到对应的数据信号线、对应的扫描信号线和对应的发光信号线，i和j可以是自然数。子像素PXij可以指其中晶体管连接到第i扫描信号线且连接到第j数据信号线的子像素。FIG. 1 is a schematic structural diagram of a display device. As shown in FIG. 1, the OLED display device may include a timing controller, a data signal driver, a scan signal driver, a light-emitting signal driver, and a pixel array, and the pixel array may include a plurality of scan signal lines (S1 to Sm), a plurality of data signal lines (D1 to Dn), a plurality of light-emitting signal lines (E1 to Eo), and a plurality of sub-pixels Pxij. In an exemplary embodiment, the timing controller may supply a grayscale value and a control signal suitable for the specification of the data signal driver to the data signal driver, and may supply a clock signal, a scan start signal, etc., suitable for the specification of the scan signal driver When supplied to the scan signal driver, a clock signal, an emission stop signal, and the like suitable for the specifications of the light-emitting signal driver can be supplied to the light-emitting signal driver. The data signal driver may generate data voltages to be supplied to the data signal lines D1, D2, D3, . . . and Dn using the grayscale values and control signals received from the timing controller. For example, the data signal driver may sample grayscale values with a clock signal and apply data voltages corresponding to the grayscale values to the data signal lines D1 to Dn in pixel row units, where n may be a natural number. The scan signal driver may generate scan signals to be supplied to the scan signal lines S1 , S2 , S3 , . . . and Sm by receiving a clock signal, a scan start signal, and the like from the timing controller. For example, the scan signal driver may sequentially supply scan signals having on-level pulses to the scan signal lines S1 to Sm. For example, the scan signal driver may be constructed in the form of a shift register, and may generate scans in such a manner that a scan start signal supplied in the form of an on-level pulse is sequentially transmitted to the next stage circuit under the control of a clock signal signal, m can be a natural number. The emission signal driver may generate emission signals to be supplied to the emission signal lines E1 , E2 , E3 , . . . and Eo by receiving a clock signal, an emission stop signal, and the like from the timing controller. For example, the emission signal driver may sequentially supply emission signals having off-level pulses to the emission signal lines E1 to Eo. For example, the light-emitting signal driver may be constructed in the form of a shift register, and may generate the emission signal by sequentially transmitting the emission stop signal provided in the form of an off-level pulse to the next stage circuit under the control of the clock signal, o Can be a natural number. The pixel array may include a plurality of sub-pixels PXij. Each sub-pixel PXij may be connected to a corresponding data signal line, a corresponding scan signal line, and a corresponding light-emitting signal line, and i and j may be natural numbers. The sub-pixel PXij may refer to a sub-pixel in which a transistor is connected to the i-th scan signal line and to the j-th data signal line.
图2为一种显示基板的平面结构示意图。如图2所示，显示基板可以包括以矩阵方式排布的多个像素单元P，多个像素单元P的至少一个包括出射第一颜色光线的第一发光单元(子像素)P1、出射第二颜色光线的第二发光单元P2和出射第三颜色光线的第三发光单元P3，第一发光单元P1、第二发光单元P2和第三发光单元P3可以均包括像素驱动电路和发光器件。第一发光单元P1、第二发光单元P2和第三发光单元P3中的像素驱动电路分别与扫描信号线、数据信号线和发光信号线连接，像素驱动电路被配置为在扫描信号线和发光信号线的控制下，接收数据信号线传输的数据电压，向所述发光器件输出相应的电流。第一发光单元P1、第二发光单元P2和第三发光单元P3中的发光器件分别与所在发光单元的像素驱动电路连接，发光器件被配置为响应所在发光单元的像素驱动电路输出的电流发出相应亮度的光。FIG. 2 is a schematic plan view of a display substrate. As shown in FIG. 2 , the display substrate may include a plurality of pixel units P arranged in a matrix, and at least one of the plurality of pixel units P includes a first light-emitting unit (sub-pixel) P1 that emits light of a first color, a second light-emitting unit P1 that emits light of a first color, and a The second light emitting unit P2 for color light and the third light emitting unit P3 for emitting third color light, the first light emitting unit P1, the second light emitting unit P2 and the third light emitting unit P3 may all include pixel driving circuits and light emitting devices. The pixel driving circuits in the first light emitting unit P1, the second light emitting unit P2 and the third light emitting unit P3 are respectively connected with the scanning signal line, the data signal line and the light emitting signal line, and the pixel driving circuit is configured to connect the scanning signal line and the light emitting signal line. Under the control of the line, the data voltage transmitted by the data signal line is received, and the corresponding current is output to the light-emitting device. The light-emitting devices in the first light-emitting unit P1, the second light-emitting unit P2, and the third light-emitting unit P3 are respectively connected to the pixel driving circuit of the light-emitting unit, and the light-emitting devices are configured to respond to the current output by the pixel driving circuit of the light-emitting unit. Brightness of light.
在示例性实施方式中，像素单元P中可以包括红色(R)发光单元、绿色(G)发光单元和蓝色(B)发光单元，或者可以包括红色发光单元、绿色发光单元、蓝色发光单元和白色发光单元，本公开在此不做限定。在示例性实施方式中，像素单元中发光单元的形状可以是矩形状、菱形、五边形或六边形。像素单元包括三个发光单元时，三个发光单元可以采用水平并列、竖直并列或品字方式排列，像素单元包括四个发光单元时，四个发光单元可以采用水平并列、竖直并列或正方形(Square)方式排列，本公开在此不做限定。In an exemplary embodiment, the pixel unit P may include a red (R) light-emitting unit, a green (G) light-emitting unit, and a blue (B) light-emitting unit, or may include a red light-emitting unit, a green light-emitting unit, and a blue light-emitting unit and white light-emitting units, which are not limited in the present disclosure. In an exemplary embodiment, the shape of the light emitting unit in the pixel unit may be a rectangle shape, a diamond shape, a pentagon shape or a hexagon shape. When the pixel unit includes three light-emitting units, the three light-emitting units can be arranged horizontally, vertically, or in a square pattern. When the pixel unit includes four light-emitting units, the four light-emitting units can be horizontally, vertically, or square. (Square) arrangement, which is not limited in the present disclosure.
图3为一种显示基板的剖面结构示意图，示意了OLED显示基板三个子像素的结构。如图3所示，在垂直于显示基板的平面上，显示基板可以包括设置在基底10上的驱动电路层102、设置在驱动电路层102远离基底10一侧的发光结构层103以及设置在发光结构层103远离基底10一侧的封装层104。在一些可能的实现方式中，显示基板可以包括其它膜层，如隔垫柱等，本公开在此不做限定。FIG. 3 is a schematic cross-sectional structure diagram of a display substrate, illustrating the structure of three sub-pixels of the OLED display substrate. As shown in FIG. 3, on a plane perpendicular to the display substrate, the display substrate may include a driving circuit layer 102 disposed on the substrate 10, a light emitting structure layer 103 disposed on the side of the driving circuit layer 102 away from the substrate 10, and a light emitting structure layer 103 disposed on the light emitting The structure layer 103 is away from the encapsulation layer 104 on the side of the substrate 10 . In some possible implementations, the display substrate may include other film layers, such as spacer columns, etc., which are not limited in the present disclosure.
在示例性实施方式中，基底10可以是柔性基底，或者可以是刚性基底。每个子像素的驱动电路层102可以包括构成像素驱动电路的多个晶体管和存储电容，图3中的每个子像素仅示出一个晶体管101和一个存储电容101A作为示例。发光结构层103可以包括阳极31、像素定义层32、有机发光层33和阴极34，阳极31通过过孔与晶体管101的漏电极连接，有机发光层33与阳极31连接，阴极34与有机发光层33连接，有机发光层33在阳极31和阴极34驱动下出射相应颜色的光线。封装层104可以包括叠设的第一封装层41、第二封装层42和第三封装层43，第一封装层41和第三封装层43可以采用无机材料，第二封装层42可以采用有机材料，第二封装层42设置在第一封装层41和第三封装层43之间，可以保证外界水汽无法进入发光结构层103。In an exemplary embodiment, substrate 10 may be a flexible substrate, or may be a rigid substrate. The driving circuit layer 102 of each sub-pixel may include a plurality of transistors and storage capacitors constituting the pixel driving circuit, and each sub-pixel in FIG. 3 only shows one transistor 101 and one storage capacitor 101A as an example. The light-emitting structure layer 103 may include an anode 31, a pixel definition layer 32, an organic light-emitting layer 33, and a cathode 34. The anode 31 is connected to the drain electrode of the transistor 101 through a via hole, the organic light-emitting layer 33 is connected to the anode 31, and the cathode 34 is connected to the organic light-emitting layer. 33 is connected, and the organic light-emitting layer 33 is driven by the anode 31 and the cathode 34 to emit light of the corresponding color. The encapsulation layer 104 may include a stacked first encapsulation layer 41 , a second encapsulation layer 42 and a third encapsulation layer 43 . The first encapsulation layer 41 and the third encapsulation layer 43 may be made of inorganic materials, and the second encapsulation layer 42 may be made of organic materials. The second encapsulation layer 42 is disposed between the first encapsulation layer 41 and the third encapsulation layer 43 to ensure that the outside water vapor cannot enter the light emitting structure layer 103 .
在示例性实施方式中，有机发光层可以包括发光层(Emitting Layer，简称EML)，以及如下任意一种或多种：空穴注入层(Hole Injection Layer，简称HIL)、空穴传输层(Hole Transport Layer，简称HTL)、电子阻挡层(Electron Block Layer，简称EBL)、空穴阻挡层(Hole Block Layer，简称 HBL)、电子传输层(Electron Transport Layer，简称ETL)和电子注入层(Electron Injection Layer，简称EIL)。在示例性实施方式中，有机发光层可以通过采用精细金属掩模版(Fine Metal Mask，简称FMM)或者开放式掩膜版(Open Mask)蒸镀制备形成，或者采用喷墨工艺制备形成。在示例性实施方式中，所有子像素的空穴注入层可以是连接在一起的共通层，所有子像素的电子注入层可以是连接在一起的共通层，所有子像素的空穴传输层可以是连接在一起的共通层，所有子像素的电子传输层可以是连接在一起的共通层，所有子像素的空穴阻挡层可以是连接在一起的共通层，相邻子像素的发光层可以有少量的交叠，或者可以是隔离的，相邻子像素的电子阻挡层可以有少量的交叠，或者可以是隔离的。In an exemplary embodiment, the organic light-emitting layer may include an emission layer (Emitting Layer, referred to as EML), and any one or more of the following: a hole injection layer (Hole Injection Layer, referred to as HIL), a hole transport layer (Hole Transport Layer (HTL), Electron Block Layer (EBL), Hole Block Layer (HBL), Electron Transport Layer (ETL) and Electron Injection Layer, referred to as EIL). In an exemplary embodiment, the organic light-emitting layer may be formed by using a fine metal mask (Fine Metal Mask, FMM for short) or an open mask (Open Mask) evaporation, or by using an inkjet process. In an exemplary embodiment, the hole injection layers of all subpixels may be a common layer connected together, the electron injection layers of all subpixels may be a common layer connected together, and the hole transport layers of all subpixels may be A common layer connected together, the electron transport layer of all subpixels can be a common layer connected together, the hole blocking layer of all subpixels can be a common layer connected together, and the light emitting layers of adjacent subpixels can have a small amount of The electron blocking layers of adjacent sub-pixels may overlap slightly, or may be isolated.
在示例性实施方式中，像素驱动电路可以是3T1C、4T1C、5T1C、5T2C、6T1C或7T1C结构。图4为一种像素驱动电路的等效电路示意图。如图4所示，像素驱动电路可以包括7个薄膜晶体管(第一晶体管T1到第七晶体管T7)、1个存储电容C和7个信号线(数据信号线D、第一扫描信号线S1、第二扫描信号线S2、发光信号线E、初始信号线INIT、第一电源线VDD和第二电源线VSS)。In an exemplary embodiment, the pixel driving circuit may be a 3T1C, 4T1C, 5T1C, 5T2C, 6T1C or 7T1C structure. FIG. 4 is a schematic diagram of an equivalent circuit of a pixel driving circuit. As shown in FIG. 4 , the pixel driving circuit may include 7 thin film transistors (first transistor T1 to seventh transistor T7 ), 1 storage capacitor C and 7 signal lines (data signal line D, first scan signal line S1 , The second scanning signal line S2, the light emitting signal line E, the initial signal line INIT, the first power supply line VDD, and the second power supply line VSS).
在示例性实施方式中，存储电容C的第一端与第一电源线VDD连接，存储电容C的第二端与第二节点N2连接，即存储电容C的第二端与第三晶体管T3的控制极连接。In the exemplary embodiment, the first end of the storage capacitor C is connected to the first power supply line VDD, the second end of the storage capacitor C is connected to the second node N2, that is, the second end of the storage capacitor C is connected to the third transistor T3 Control pole connection.
第一晶体管T1的控制极与第二扫描信号线S2连接，第一晶体管T1的第一极与初始信号线INIT连接，第一晶体管的第二极与第二节点N2连接。当导通电平扫描信号施加到第二扫描信号线S2时，第一晶体管T1将初始化电压传输到第三晶体管T3的控制极，以使第三晶体管T3的控制极的电荷量初始化。The control electrode of the first transistor T1 is connected to the second scan signal line S2, the first electrode of the first transistor T1 is connected to the initial signal line INIT, and the second electrode of the first transistor is connected to the second node N2. When the on-level scan signal is applied to the second scan signal line S2, the first transistor T1 transmits an initialization voltage to the gate of the third transistor T3 to initialize the charge amount of the gate of the third transistor T3.
第二晶体管T2的控制极与第一扫描信号线S1连接，第二晶体管T2的第一极与第二节点N2连接，第二晶体管T2的第二极与第三节点N3连接。当导通电平扫描信号施加到第一扫描信号线S1时，第二晶体管T2使第三晶体管T3的控制极与第二极连接。The control electrode of the second transistor T2 is connected to the first scan signal line S1, the first electrode of the second transistor T2 is connected to the second node N2, and the second electrode of the second transistor T2 is connected to the third node N3. When the on-level scan signal is applied to the first scan signal line S1, the second transistor T2 connects the control electrode of the third transistor T3 to the second electrode.
第三晶体管T3的控制极与第二节点N2连接，即第三晶体管T3的控制 极与存储电容C的第二端连接，第三晶体管T3的第一极与第一节点N1连接，第三晶体管T3的第二极与第三节点N3连接。第三晶体管T3可以称为驱动晶体管，第三晶体管T3根据其控制极与第一极之间的电位差来确定在第一电源线VDD与第二电源线VSS之间流动的驱动电流的量。The control electrode of the third transistor T3 is connected to the second node N2, that is, the control electrode of the third transistor T3 is connected to the second end of the storage capacitor C, the first electrode of the third transistor T3 is connected to the first node N1, and the third transistor T3 is connected to the first node N1. The second pole of T3 is connected to the third node N3. The third transistor T3 may be referred to as a driving transistor, and the third transistor T3 determines the amount of driving current flowing between the first power supply line VDD and the second power supply line VSS according to the potential difference between its control electrode and the first electrode.
第四晶体管T4的控制极与第一扫描信号线S1连接，第四晶体管T4的第一极与数据信号线D连接，第四晶体管T4的第二极与第一节点N1连接。第四晶体管T4可以称为开关晶体管、扫描晶体管等，当导通电平扫描信号施加到第一扫描信号线S1时，第四晶体管T4使数据信号线D的数据电压输入到像素驱动电路。The control electrode of the fourth transistor T4 is connected to the first scan signal line S1, the first electrode of the fourth transistor T4 is connected to the data signal line D, and the second electrode of the fourth transistor T4 is connected to the first node N1. The fourth transistor T4 may be referred to as a switching transistor, a scan transistor, or the like, and enables the data voltage of the data signal line D to be input to the pixel driving circuit when an on-level scan signal is applied to the first scan signal line S1.
第五晶体管T5的控制极与发光信号线E连接，第五晶体管T5的第一极与第一电源线VDD连接，第五晶体管T5的第二极与第一节点N1连接。第六晶体管T6的控制极与发光信号线E连接，第六晶体管T6的第一极与第三节点N3连接，第六晶体管T6的第二极与发光器件的第一极连接。第五晶体管T5和第六晶体管T6可以称为发光晶体管。当导通电平发光信号施加到发光信号线E时，第五晶体管T5和第六晶体管T6通过在第一电源线VDD与第二电源线VSS之间形成驱动电流路径而使发光器件发光。The control electrode of the fifth transistor T5 is connected to the light-emitting signal line E, the first electrode of the fifth transistor T5 is connected to the first power line VDD, and the second electrode of the fifth transistor T5 is connected to the first node N1. The control electrode of the sixth transistor T6 is connected to the light emitting signal line E, the first electrode of the sixth transistor T6 is connected to the third node N3, and the second electrode of the sixth transistor T6 is connected to the first electrode of the light emitting device. The fifth transistor T5 and the sixth transistor T6 may be referred to as light emitting transistors. When an on-level light emission signal is applied to the light emission signal line E, the fifth and sixth transistors T5 and T6 make the light emitting device emit light by forming a driving current path between the first power supply line VDD and the second power supply line VSS.
第七晶体管T7的控制极与第一扫描信号线S1连接，第七晶体管T7的第一极与初始信号线INIT连接，第七晶体管T7的第二极与发光器件的第一极连接。当导通电平扫描信号施加到第一扫描信号线S1时，第七晶体管T7将初始化电压传输到发光器件的第一极，以使发光器件的第一极中累积的电荷量初始化或释放发光器件的第一极中累积的电荷量。The control electrode of the seventh transistor T7 is connected to the first scan signal line S1, the first electrode of the seventh transistor T7 is connected to the initial signal line INIT, and the second electrode of the seventh transistor T7 is connected to the first electrode of the light emitting device. When the on-level scan signal is applied to the first scan signal line S1, the seventh transistor T7 transmits an initialization voltage to the first electrode of the light emitting device to initialize or discharge the amount of charge accumulated in the first electrode of the light emitting device to emit light The amount of charge accumulated in the first pole of the device.
在示例性实施方式中，发光器件的第二极与第二电源线VSS连接，第二电源线VSS的信号为低电平信号，第一电源线VDD的信号为持续提供高电平信号。第一扫描信号线S1为本显示行像素驱动电路中的扫描信号线，第二扫描信号线S2为上一显示行像素驱动电路中的扫描信号线，即对于第n显示行，第一扫描信号线S1为S(n)，第二扫描信号线S2为S(n-1)，本显示行的第二扫描信号线S2与上一显示行像素驱动电路中的第一扫描信号线S1为同一信号线，可以减少显示基板的信号线，实现显示基板的窄边框。In an exemplary embodiment, the second pole of the light emitting device is connected to the second power supply line VSS, the signal of the second power supply line VSS is a low-level signal, and the signal of the first power supply line VDD is a continuous high-level signal. The first scan signal line S1 is the scan signal line in the pixel driving circuit of the display row, and the second scan signal line S2 is the scan signal line in the pixel driving circuit of the previous display row, that is, for the nth display row, the first scan signal The line S1 is S(n), the second scanning signal line S2 is S(n-1), the second scanning signal line S2 of this display line is the same as the first scanning signal line S1 in the pixel driving circuit of the previous display line The signal lines can reduce the signal lines of the display substrate and realize the narrow frame of the display substrate.
在示例性实施方式中，第一晶体管T1到第七晶体管T7可以是P型晶体管，或者可以是N型晶体管。像素驱动电路中采用相同类型的晶体管可以简化工艺流程，减少显示基板的工艺难度，提高产品的良率。在一些可能的实现方式中，第一晶体管T1到第七晶体管T7可以包括P型晶体管和N型晶体管。In an exemplary embodiment, the first to seventh transistors T1 to T7 may be P-type transistors, or may be N-type transistors. Using the same type of transistors in the pixel driving circuit can simplify the process flow, reduce the process difficulty of the display substrate, and improve the yield of the product. In some possible implementations, the first to seventh transistors T1 to T7 may include P-type transistors and N-type transistors.
在示例性实施方式中，第一扫描信号线S1、第二扫描信号线S2、发光信号线E和初始信号线INIT沿水平方向延伸，第二电源线VSS、第一电源线VDD和数据信号线D沿竖直方向延伸。In an exemplary embodiment, the first scan signal line S1, the second scan signal line S2, the light emitting signal line E and the initial signal line INIT extend in the horizontal direction, the second power supply line VSS, the first power supply line VDD and the data signal line D extends in the vertical direction.
在示例性实施方式中，发光器件可以是有机电致发光二极管(OLED)，包括叠设的第一极(阳极)、有机发光层和第二极(阴极)。In an exemplary embodiment, the light emitting device may be an organic electroluminescent diode (OLED) including a stacked first electrode (anode), an organic light emitting layer and a second electrode (cathode).
图5为一种像素驱动电路的工作时序图。下面通过图4示例的像素驱动电路的工作过程说明本公开示例性实施例，图4中的像素驱动电路包括7个薄膜晶体管(第一晶体管T1到第六晶体管T7)、1个存储电容C和7个信号线(数据信号线D、第一扫描信号线S1、第二扫描信号线S2、发光信号线E、初始信号线INIT、第一电源线VDD和第二电源线VSS)，7个晶体管均为P型晶体管。FIG. 5 is a working timing diagram of a pixel driving circuit. Exemplary embodiments of the present disclosure will be described below through the operation process of the pixel driving circuit illustrated in FIG. 4 . The pixel driving circuit in FIG. 4 includes 7 thin film transistors (the first transistor T1 to the sixth transistor T7 ), a storage capacitor C and 7 signal lines (data signal line D, first scanning signal line S1, second scanning signal line S2, light-emitting signal line E, initial signal line INIT, first power supply line VDD and second power supply line VSS), 7 transistors All are P-type transistors.
在示例性实施方式中，像素驱动电路的工作过程可以包括：In an exemplary embodiment, the working process of the pixel driving circuit may include:
第一阶段A1，称为复位阶段，第二扫描信号线S2的信号为低电平信号，第一扫描信号线S1和发光信号线E的信号为高电平信号。第二扫描信号线S2的信号为低电平信号，使第一晶体管T1导通，初始信号线INIT的信号提供至第二节点N2，对存储电容C进行初始化，清除存储电容中原有数据电压。第一扫描信号线S1和发光信号线E的信号为高电平信号，使第二晶体管T2、第四晶体管T4、第五晶体管T5、第六晶体管T6和第七晶体管T7断开，此阶段OLED不发光。The first stage A1 is called the reset stage, the signal of the second scanning signal line S2 is a low-level signal, and the signals of the first scanning signal line S1 and the light-emitting signal line E are a high-level signal. The signal of the second scanning signal line S2 is a low level signal, which turns on the first transistor T1, and the signal of the initial signal line INIT is supplied to the second node N2 to initialize the storage capacitor C and clear the original data voltage in the storage capacitor. The signals of the first scanning signal line S1 and the light-emitting signal line E are high-level signals, so that the second transistor T2, the fourth transistor T4, the fifth transistor T5, the sixth transistor T6 and the seventh transistor T7 are turned off. At this stage, the OLED Not glowing.
第二阶段A2、称为数据写入阶段或者阈值补偿阶段，第一扫描信号线S1的信号为低电平信号，第二扫描信号线S2和发光信号线E的信号为高电平信号，数据信号线D输出数据电压。此阶段由于存储电容C的第二端为低电平，因此第三晶体管T3导通。第一扫描信号线S1的信号为低电平信号使 第二晶体管T2、第四晶体管T4和第七晶体管T7导通。第二晶体管T2和第四晶体管T4导通使得数据信号线D输出的数据电压经过第一节点N1、导通的第三晶体管T3、第三节点N3、导通的第二晶体管T2提供至第二节点N2，并将数据信号线D输出的数据电压与第三晶体管T3的阈值电压之差充入存储电容C，存储电容C的第二端(第二节点N2)的电压为Vd-|Vth|，Vd为数据信号线D输出的数据电压，Vth为第三晶体管T3的阈值电压。第七晶体管T7导通使得初始信号线INIT的初始电压提供至OLED的第一极，对OLED的第一极进行初始化(复位)，清空其内部的预存电压，完成初始化，确保OLED不发光。第二扫描信号线S2的信号为高电平信号，使第一晶体管T1断开。发光信号线E的信号为高电平信号，使第五晶体管T5和第六晶体管T6断开。The second stage A2 is called the data writing stage or the threshold compensation stage. The signal of the first scanning signal line S1 is a low-level signal, the signals of the second scanning signal line S2 and the light-emitting signal line E are a high-level signal, and the data The signal line D outputs the data voltage. At this stage, since the second end of the storage capacitor C is at a low level, the third transistor T3 is turned on. The signal of the first scan signal line S1 is a low level signal, so that the second transistor T2, the fourth transistor T4 and the seventh transistor T7 are turned on. The second transistor T2 and the fourth transistor T4 are turned on so that the data voltage output from the data signal line D is supplied to the second through the first node N1, the turned-on third transistor T3, the third node N3, and the turned-on second transistor T2 node N2, and the difference between the data voltage output by the data signal line D and the threshold voltage of the third transistor T3 is charged into the storage capacitor C, and the voltage of the second end (second node N2) of the storage capacitor C is Vd-|Vth| , Vd is the data voltage output by the data signal line D, and Vth is the threshold voltage of the third transistor T3. The seventh transistor T7 is turned on so that the initial voltage of the initial signal line INIT is supplied to the first electrode of the OLED, initializes (resets) the first electrode of the OLED, clears the internal pre-stored voltage, completes the initialization, and ensures that the OLED does not emit light. The signal of the second scanning signal line S2 is a high-level signal, so that the first transistor T1 is turned off. The signal of the light-emitting signal line E is a high-level signal, so that the fifth transistor T5 and the sixth transistor T6 are turned off.
第三阶段A3、称为发光阶段，发光信号线E的信号为低电平信号，第一扫描信号线S1和第二扫描信号线S2的信号为高电平信号。发光信号线E的信号为低电平信号，使第五晶体管T5和第六晶体管T6导通，第一电源线VDD输出的电源电压通过导通的第五晶体管T5、第三晶体管T3和第六晶体管T6向OLED的第一极提供驱动电压，驱动OLED发光。The third stage A3 is called the light-emitting stage, the signal of the light-emitting signal line E is a low-level signal, and the signals of the first scanning signal line S1 and the second scanning signal line S2 are high-level signals. The signal of the light-emitting signal line E is a low-level signal, so that the fifth transistor T5 and the sixth transistor T6 are turned on, and the power supply voltage output by the first power line VDD passes through the fifth transistor T5, the third transistor T3 and the sixth transistor T5, which are turned on. The transistor T6 provides a driving voltage to the first electrode of the OLED to drive the OLED to emit light.
在像素驱动电路驱动过程中，流过第三晶体管T3(驱动晶体管)的驱动电流由其栅电极和第一极之间的电压差决定。由于第二节点N2的电压为Vdata-|Vth|，因而第三晶体管T3的驱动电流为：During the driving process of the pixel driving circuit, the driving current flowing through the third transistor T3 (driving transistor) is determined by the voltage difference between its gate electrode and the first electrode. Since the voltage of the second node N2 is Vdata-|Vth|, the driving current of the third transistor T3 is:
I＝K*(Vgs-Vth) 2＝K*[(Vdd-Vd+|Vth|)-Vth] 2＝K*[(Vdd-Vd] 2 I=K*(Vgs-Vth) 2 =K*[(Vdd-Vd+|Vth|)-Vth] 2 =K*[(Vdd-Vd] 2
其中，I为流过第三晶体管T3的驱动电流，也就是驱动OLED的驱动电流，K为常数，Vgs为第三晶体管T3的栅电极和第一极之间的电压差，Vth为第三晶体管T3的阈值电压，Vd为数据信号线D输出的数据电压，Vdd为第一电源线VDD输出的电源电压。Among them, I is the driving current flowing through the third transistor T3, that is, the driving current for driving the OLED, K is a constant, Vgs is the voltage difference between the gate electrode and the first electrode of the third transistor T3, and Vth is the third transistor. For the threshold voltage of T3, Vd is the data voltage output by the data signal line D, and Vdd is the power supply voltage output by the first power line VDD.
随着显示技术的发展，全面屏以其较大的屏占比和超窄的边框，已逐步成为显示产品的发展趋势。全面屏产品通常是采用屏下传感技术，将摄像头、3D成像和指纹识别等传感器放置于屏幕下方，放置有传感器的屏幕区域具有足够的光穿透率实现屏下传感，且该屏幕区域具有显示功能实现真正的全面屏显示。为了提高屏下传感区域的传感效果，需要该区域具有较高的光透过 率。目前的刚性显示面板是采用聚对苯二甲酸乙二酯(PET)作为基底材料，PET的透过率可以在90％左右，基底造成的光学损耗较小，能够满足光透过率要求。但由于PET折叠会出现明显的折痕，因此目前的柔性显示面板中通常采用聚酰亚胺(PI)等作为基底材料。研究表明，PI基底对光透过率的影响很大，特别是对蓝光波段，在波长420nm至450nm，透过率仅为20％至60％左右。With the development of display technology, full-screen displays have gradually become the development trend of display products with their large screen-to-body ratio and ultra-narrow bezels. Full-screen products usually use off-screen sensing technology. Sensors such as cameras, 3D imaging, and fingerprint recognition are placed under the screen. The screen area where the sensors are placed has sufficient light transmittance to realize off-screen sensing. It has a display function to achieve a real full-screen display. In order to improve the sensing effect of the sensing area under the screen, this area needs to have a high light transmittance. The current rigid display panel uses polyethylene terephthalate (PET) as the base material, the transmittance of PET can be about 90%, and the optical loss caused by the base is small, which can meet the requirements of light transmittance. However, due to obvious creases when PET is folded, polyimide (PI) or the like is usually used as the base material in current flexible display panels. Studies have shown that the PI substrate has a great influence on the light transmittance, especially for the blue light band, the transmittance is only about 20% to 60% at the wavelength of 420nm to 450nm.
图6为一种显示基板中分辨率显示区的平面结构示意图。如图6所示，在示例性实施方式中，显示基板可以包括正常分辨率显示区210和低分辨显示区220，正常分辨率显示区210位于低分辨显示区220的***，正常分辨率显示区210和低分辨显示区220均包括多个规则排布的像素，但低分辨显示区220的分辨率小于正常分辨率显示区210的分辨率。分辨率(Pixels Per Inch，简称PPI)是指单位面积所拥有像素的数量，可以称为像素密度，PPI数值越高，代表显示基板能够以越高的密度显示画面，画面的细节就越丰富。FIG. 6 is a schematic plan view of a resolution display area in a display substrate. As shown in FIG. 6, in an exemplary embodiment, the display substrate may include a normal resolution display area 210 and a low resolution display area 220, the normal resolution display area 210 is located at the periphery of the low resolution display area 220, and the normal resolution display area Both the low-resolution display area 210 and the low-resolution display area 220 include a plurality of regularly arranged pixels, but the resolution of the low-resolution display area 220 is smaller than that of the normal-resolution display area 210 . Resolution (Pixels Per Inch, referred to as PPI) refers to the number of pixels per unit area, which can be called pixel density.
在示例性实施方式中，低分辨显示区220可以包括透光显示区221和非透光显示区222，非透光显示区222位于透光显示区221的***。在示例性实施方式中，透光显示区221的位置可以与光学装置的位置相对应，具有显示画面和透过光线的功能，透过的光线被光学装置接收。非透光显示区222具有显示画面和配置信号走线的功能，信号走线与透光显示区中的信号线连接，以将这些信号线引出。In an exemplary embodiment, the low-resolution display area 220 may include a light-transmitting display area 221 and a non-light-transmitting display area 222 , and the non-light-transmitting display area 222 is located at the periphery of the light-transmitting display area 221 . In an exemplary embodiment, the position of the light-transmitting display area 221 may correspond to the position of the optical device, and has the functions of displaying a picture and transmitting light, and the transmitted light is received by the optical device. The non-transparent display area 222 has the functions of displaying images and configuring signal lines, and the signal lines are connected to the signal lines in the light-transmitting display area to lead out these signal lines.
在示例性实施方式中，在平行于显示基板的平面内，透光显示区221的形状可以是如下任意一种或多种：矩形、多边形、圆形和椭圆形，光学装置可以是指纹识别装置、摄像装置或3D成像等光学传感器，本公开在此不做限定。例如，透光显示区221的形状为圆形时，圆形的直径可以约为3mm至5mm。又如，透光显示区221的形状为矩形时，矩形的边长可以约为3mm至5mm。In an exemplary embodiment, in a plane parallel to the display substrate, the shape of the light-transmitting display area 221 may be any one or more of the following: rectangle, polygon, circle and ellipse, and the optical device may be a fingerprint identification device , a camera device, or an optical sensor such as 3D imaging, which is not limited in the present disclosure. For example, when the shape of the light-transmitting display area 221 is a circle, the diameter of the circle may be about 3 mm to 5 mm. For another example, when the shape of the light-transmitting display area 221 is a rectangle, the side length of the rectangle may be about 3 mm to 5 mm.
在示例性实施方式中，在平行于显示基板的平面内，非透光显示区222的形状可以是如下任意一种或多种：矩形、多边形、圆形和椭圆形。In an exemplary embodiment, in a plane parallel to the display substrate, the shape of the non-light-transmitting display area 222 may be any one or more of the following: rectangle, polygon, circle, and ellipse.
图7a至图7e为一种显示基板中几种透光显示区的前视图，示意了显示基板出光面一侧的平面结构。在示例性实施方式中，透光显示区可以包括像 素区和空白区，像素区配置为显示画面，包括呈阵列分布且彼此隔开的多个像素岛300，空白区配置为透过光线，包括呈阵列分布且彼此隔开的多个空白岛400。在示例性实施方式中，至少一个像素岛300可以包括一个或多个显示像素，一个显示像素可以包括3个出射不同颜色光(如红绿蓝)的显示子像素或4个出射不同颜色光(如红绿蓝白)的显示子像素，至少一个显示子像素可以至少包括发光器件，发光器件配置为响应相应像素驱动电路输出的电流发出相应亮度的光，使该显示子像素进行画面显示。至少一个空白岛400可以包括一个或多个不出射光的空白子像素，空白子像素中既没有设置像素驱动电路和发光器件，也不显示画面。在示例性实施方式中，显示子像素的形状、尺寸和排列方式等可以与正常分辨率显示区中的子像素相同，空白子像素的形状和尺寸可以与正常分辨率显示区中的子像素的形状和尺寸相同。7a to 7e are front views of several light-transmitting display regions in a display substrate, illustrating the planar structure of the light-emitting surface side of the display substrate. In an exemplary embodiment, the light-transmitting display area may include a pixel area and a blank area. The pixel area is configured to display a picture and includes a plurality of pixel islands 300 distributed in an array and spaced apart from each other. The blank area is configured to transmit light, including A plurality of blank islands 400 are distributed in an array and spaced apart from each other. In an exemplary embodiment, at least one pixel island 300 may include one or more display pixels, and one display pixel may include 3 display sub-pixels that emit light of different colors (eg, red, green, and blue) or 4 display sub-pixels that emit light of different colors (eg, red, green, and blue). For example, red, green, blue, and white) display sub-pixels, at least one display sub-pixel may include at least a light-emitting device, and the light-emitting device is configured to emit light of corresponding brightness in response to the current output by the corresponding pixel drive circuit, so that the display sub-pixel can display a picture. At least one blank island 400 may include one or more blank sub-pixels that do not emit light, and neither a pixel driving circuit nor a light-emitting device is provided in the blank sub-pixel, nor a picture is displayed. In an exemplary embodiment, the shape, size and arrangement of the display sub-pixels may be the same as the sub-pixels in the normal resolution display area, and the shape and size of the blank sub-pixels may be the same as those of the sub-pixels in the normal resolution display area. Same shape and size.
在一些可能的示例性实施方式中，显示子像素可以既包括像素驱动电路也包括发光器件，由本显示子像素的驱动电路驱动本显示子像素的发光器件进行发光。在另一些可能的示例性实施方式中，显示子像素可以只设置发光器件，而没有设置像素驱动电路，发光器件与非透光显示区222中设置的像素驱动电路连接，由非透光显示区222的像素驱动电路驱动发光器件进行发光，本公开在此不做限定。In some possible exemplary embodiments, the display sub-pixel may include both a pixel driving circuit and a light-emitting device, and the light-emitting device of the display sub-pixel is driven by the driving circuit of the display sub-pixel to emit light. In some other possible exemplary embodiments, the display sub-pixel may only be provided with a light-emitting device without a pixel driving circuit. The pixel driving circuit of 222 drives the light-emitting device to emit light, which is not limited in this disclosure.
在示例性实施方式中，多个像素岛300和多个空白岛400可以在行方向(第一方向X)上交替设置，多个像素岛300在列方向(第二方向Y)上依次设置，多个空白岛400在列方向上依次设置，使得多个像素岛300形成多个显示列，多个空白岛400形成多个空白列，显示列和空白列在行方向上交替设置，如图7a所示。In an exemplary embodiment, the plurality of pixel islands 300 and the plurality of blank islands 400 may be alternately arranged in the row direction (the first direction X), and the plurality of pixel islands 300 may be arranged in sequence in the column direction (the second direction Y), Multiple blank islands 400 are arranged in sequence in the column direction, so that multiple pixel islands 300 form multiple display columns, multiple blank islands 400 form multiple blank columns, and display columns and blank columns are alternately arranged in the row direction, as shown in FIG. 7a Show.
在示例性实施方式中，多个像素岛300和多个空白岛400可以在列方向(第二方向Y)上交替设置，多个像素岛300在行方向(第一方向X)上依次设置，多个空白岛400在行方向上依次设置，使得多个像素岛300形成多个显示行，多个空白岛400形成多个空白行，显示行和空白行在列方向上交替设置，如图7b所示。In an exemplary embodiment, the plurality of pixel islands 300 and the plurality of blank islands 400 may be alternately arranged in the column direction (the second direction Y), and the plurality of pixel islands 300 may be arranged in sequence in the row direction (the first direction X), Multiple blank islands 400 are arranged in sequence in the row direction, so that multiple pixel islands 300 form multiple display rows, multiple blank islands 400 form multiple blank rows, and the display rows and blank rows are alternately arranged in the column direction, as shown in FIG. 7b Show.
在示例性实施方式中，多个像素岛300可以在行方向(第一方向X)上 交替设置且在列方向(第二方向Y)上交替设置，多个空白岛400可以在行方向上交替设置且在列方向上交替设置，使得无论是在行方向上，还是在列方向上，像素岛300均与空白岛400相邻，空白岛400均与像素岛300相邻，多个像素岛300和多个空白岛400形成棋盘排布方式，如图7c所示。In an exemplary embodiment, the plurality of pixel islands 300 may be alternately arranged in the row direction (the first direction X) and the column direction (the second direction Y), and the plurality of blank islands 400 may be alternately arranged in the row direction And alternately arranged in the column direction, so that no matter in the row direction or in the column direction, the pixel island 300 is adjacent to the blank island 400, the blank island 400 is adjacent to the pixel island 300, and the plurality of pixel islands 300 and many are adjacent to each other. The blank islands 400 form a checkerboard arrangement, as shown in FIG. 7c.
在示例性实施方式中，对于图7a、图7b和图7c所示排布，由于像素岛300的数量与空白岛400的数量基本上相同，因而透光显示区的分辨率约为正常分辨率显示区的分辨率的50％左右。In an exemplary embodiment, for the arrangement shown in FIGS. 7a, 7b and 7c, since the number of pixel islands 300 is substantially the same as the number of blank islands 400, the resolution of the light-transmitting display area is about the normal resolution About 50% of the resolution of the display area.
在示例性实施方式中，在图7c所示像素岛和空白岛排布中，通过将部分像素岛300替换为空白岛400，可以增加空白岛400的数量，减少分辨率，如图7d所示。或者，通过将空白岛400替换为像素岛300，可以增加像素岛300的数量，增加分辨率，如图7e所示。In an exemplary embodiment, in the arrangement of pixel islands and blank islands shown in FIG. 7c, by replacing some of the pixel islands 300 with blank islands 400, the number of blank islands 400 can be increased and the resolution can be reduced, as shown in FIG. 7d . Alternatively, by replacing the blank islands 400 with the pixel islands 300, the number of the pixel islands 300 can be increased, and the resolution can be increased, as shown in FIG. 7e.
在示例性实施方式中，透光显示区中像素岛和空白岛的排布方式、像素岛中子像素的排布方式、子像素的形状和尺寸等可以根据应用场景、分辨率和透过率等需求来设置，本公开在此不做限定。In an exemplary embodiment, the arrangement of the pixel islands and blank islands in the light-transmitting display area, the arrangement of sub-pixels in the pixel island, the shape and size of the sub-pixels, etc. can be determined according to the application scenario, resolution and transmittance. It is set according to other requirements, which is not limited in this disclosure.
图8为本公开示例性实施例一种透光显示区的剖面结构示意图，为图7a中A-A向的剖视图。在平行于显示基板的平面内，透光显示区可以包括多个像素岛300和多个空白岛400，像素岛300可以包括多个显示子像素，空白岛400可以包括多个空白子像素。如图8所示，在垂直于显示基板的平面内，像素岛300可以包括设置在基底10朝向出射光一侧的显示结构层310，显示结构层310可以包括发光器件，或者包括像素驱动电路和发光器件。空白岛400可以包括设置在基底10朝向出射光一侧的空白结构层410以及设置在基底10背离出射光一侧的透光孔500。在示例性实施方式中，透光孔500在显示基板平面上的正投影与像素岛中发光器件在显示基板平面上的正投影没有重叠区域。FIG. 8 is a schematic cross-sectional structure diagram of a light-transmitting display area according to an exemplary embodiment of the present disclosure, and is a cross-sectional view taken along the direction A-A in FIG. 7a. In a plane parallel to the display substrate, the light-transmitting display area may include a plurality of pixel islands 300 and a plurality of blank islands 400, the pixel islands 300 may include a plurality of display sub-pixels, and the blank islands 400 may include a plurality of blank sub-pixels. As shown in FIG. 8 , in a plane perpendicular to the display substrate, the pixel island 300 may include a display structure layer 310 disposed on the side of the substrate 10 facing the light outgoing light, and the display structure layer 310 may include light-emitting devices, or include pixel driving circuits and light-emitting device. The blank island 400 may include a blank structure layer 410 disposed on the side of the substrate 10 facing the outgoing light and a light-transmitting hole 500 disposed on the side of the substrate 10 away from the outgoing light. In an exemplary embodiment, the orthographic projection of the light-transmitting hole 500 on the plane of the display substrate and the orthographic projection of the light emitting device in the pixel island on the plane of the display substrate have no overlapping area.
在示例性实施方式中，透光孔500设置在基底10远离空白结构层410一侧的表面上，透光孔500内深度H的基底被去掉，在显示基板的背面形成盲孔结构。In an exemplary embodiment, the light-transmitting hole 500 is disposed on the surface of the substrate 10 on the side away from the blank structure layer 410 , the substrate at the depth H in the light-transmitting hole 500 is removed, and a blind hole structure is formed on the back of the display substrate.
在示例性实施方式中，透光孔500的深度H可以小于或等于基底10的 厚度D。In an exemplary embodiment, the depth H of the light-transmitting hole 500 may be less than or equal to the thickness D of the substrate 10.
在示例性实施方式中，透光孔500的形状可以与空白岛400的形状相对应，透光孔500的宽度L1可以小于或等于空白岛400的宽度L2，空白岛400在显示基板平面上的正投影可以包含透光孔500在显示基板平面上的正投影。在示例性实施方式中，宽度可以是第一方向X的尺寸，或者可以是第二方向Y的尺寸。In an exemplary embodiment, the shape of the light-transmitting hole 500 may correspond to the shape of the blank island 400 , the width L1 of the light-transmitting hole 500 may be less than or equal to the width L2 of the blank island 400 , and the width of the blank island 400 on the display substrate plane may be smaller than or equal to that of the blank island 400 . The orthographic projection may include the orthographic projection of the light-transmitting hole 500 on the plane of the display substrate. In an exemplary embodiment, the width may be the dimension in the first direction X, or may be the dimension in the second direction Y.
在示例性实施方式中，像素岛300的显示结构层310可以包括设置在基底10上的驱动电路层、设置在驱动电路层远离基底一侧的发光结构层和设置在发光结构层远离基底一侧的封装层，驱动电路层可以包括构成像素驱动电路的晶体管和存储电容，或者包括配置为连接发光器件的信号线，发光结构层可以包括构成发光器件的阳极、有机发光层和阴极，封装层可以包括叠设的第一封装层、有机封装层和第二封装层。In an exemplary embodiment, the display structure layer 310 of the pixel island 300 may include a driving circuit layer disposed on the substrate 10, a light emitting structure layer disposed on a side of the driving circuit layer away from the substrate, and a light emitting structure layer disposed on a side away from the substrate of the light emitting structure layer The encapsulation layer, the drive circuit layer may include transistors and storage capacitors that constitute the pixel drive circuit, or may include signal lines configured to connect the light-emitting device, the light-emitting structure layer may include an anode, an organic light-emitting layer and a cathode that constitute the light-emitting device, and the encapsulation layer may It includes a stacked first encapsulation layer, an organic encapsulation layer and a second encapsulation layer.
在示例性实施方式中，对于驱动电路层包括像素驱动电路，驱动电路层可以包括：设置在基底10上的有源层，覆盖有源层的第一绝缘层，设置在第一绝缘层上的栅电极和第一电容电极，覆盖栅电极和第一电容电极的第二绝缘层，设置在第二绝缘层上的第二电容电极，覆盖第二电容电极的第三绝缘层，设置在第三绝缘层上的源电极和漏电极，覆盖源电极和漏电极的第四绝缘层。有源层、栅电极、源电极和漏电极组成晶体管，第一电容电极和第二电容电极组成存储电容。In an exemplary embodiment, for the driving circuit layer including the pixel driving circuit, the driving circuit layer may include: an active layer disposed on the substrate 10, a first insulating layer covering the active layer, a first insulating layer disposed on the first insulating layer The gate electrode and the first capacitor electrode, the second insulating layer covering the gate electrode and the first capacitor electrode, the second capacitor electrode arranged on the second insulating layer, the third insulating layer covering the second capacitor electrode, and the third insulating layer covering the second capacitor electrode. The source electrode and the drain electrode on the insulating layer cover the fourth insulating layer of the source electrode and the drain electrode. The active layer, the gate electrode, the source electrode and the drain electrode form a transistor, and the first capacitor electrode and the second capacitor electrode form a storage capacitor.
在示例性实施方式中，空白岛400的空白结构层410不含有发光器件，空白结构层410可以包括设置在基底10上的复合绝缘层和设置在复合绝缘层远离基底一侧的无机封装层，复合绝缘层可以包括多个无机绝缘层，无机封装层可以包括第一无机封装层和第二无机封装层。在示例性实施方式中，多个无机绝缘层可以与像素岛300中驱动电路层中的第一绝缘层、第二绝缘层、第三绝缘层和第四绝缘层同层设置，材料相同，且通过同一次工艺同时形成，第一无机封装层和第二无机封装层可以与像素岛300中封装层的第一封装层和第二封装层同层设置，材料相同，且通过同一次工艺同时形成。In an exemplary embodiment, the blank structure layer 410 of the blank island 400 does not contain a light-emitting device, and the blank structure layer 410 may include a composite insulating layer disposed on the substrate 10 and an inorganic encapsulation layer disposed on the side of the composite insulating layer away from the substrate, The composite insulating layer may include a plurality of inorganic insulating layers, and the inorganic encapsulation layer may include a first inorganic encapsulation layer and a second inorganic encapsulation layer. In an exemplary embodiment, the plurality of inorganic insulating layers may be provided in the same layer as the first insulating layer, the second insulating layer, the third insulating layer and the fourth insulating layer in the driving circuit layer in the pixel island 300, and the materials are the same, and Formed simultaneously by the same process, the first inorganic encapsulation layer and the second inorganic encapsulation layer can be provided in the same layer as the first encapsulation layer and the second encapsulation layer of the encapsulation layer in the pixel island 300, with the same materials, and formed simultaneously by the same process .
在示例性实施方式中，基底可以包括第一柔性层，显示结构层和空白结构层设置在第一柔性层上。透光孔可以设置在第一柔性层上，透光孔的深度 可以小于或等于第一柔性层的厚度。In an exemplary embodiment, the substrate may include a first flexible layer on which the display structure layer and the blank structure layer are disposed. The light-transmitting holes may be disposed on the first flexible layer, and the depths of the light-transmitting holes may be less than or equal to the thickness of the first flexible layer.
在示例性实施方式中，基底可以包括叠设的第一柔性层、第一无机层和第二柔性层，显示结构层和空白结构层设置在第二柔性层上。透光孔可以设置在第一柔性层上，透光孔的深度可以小于或等于第一柔性层的厚度。或者，透光孔可以设置在第一柔性层和第一无机层上，透光孔的深度可以小于或等于第一柔性层和第一无机层的总厚度。或者，透光孔可以设置在第一柔性层、第一无机层和第二柔性层上，透光孔的深度可以小于或等于第一柔性层、第一无机层和第二柔性层的总厚度。In an exemplary embodiment, the substrate may include a stacked first flexible layer, a first inorganic layer, and a second flexible layer, and the display structure layer and the blank structure layer are disposed on the second flexible layer. The light-transmitting holes may be disposed on the first flexible layer, and the depths of the light-transmitting holes may be less than or equal to the thickness of the first flexible layer. Alternatively, the light-transmitting holes may be disposed on the first flexible layer and the first inorganic layer, and the depths of the light-transmitting holes may be less than or equal to the total thickness of the first flexible layer and the first inorganic layer. Alternatively, light-transmitting holes may be provided on the first flexible layer, the first inorganic layer and the second flexible layer, and the depth of the light-transmitting holes may be less than or equal to the total thickness of the first flexible layer, the first inorganic layer and the second flexible layer .
在示例性实施方式中，基底可以包括叠设的第一柔性层、第一无机层、第二柔性层和第二无机层，显示结构层和空白结构层设置在第二无机层上。透光孔可以设置在第一柔性层上，透光孔的深度可以小于或等于第一柔性层的厚度。或者，透光孔可以设置在第一柔性层和第一无机层上，透光孔的深度可以小于或等于第一柔性层和第一无机层的总厚度。或者，透光孔可以设置在第一柔性层、第一无机层和第二柔性层上，透光孔的深度可以小于或等于第一柔性层、第一无机层和第二柔性层的总厚度。或者，透光孔可以设置在第一柔性层、第一无机层、第二柔性层和第二无机层上，透光孔的深度可以小于或等于第一柔性层、第一无机层、第二柔性层和第二无机层的总厚度。In an exemplary embodiment, the substrate may include a stacked first flexible layer, a first inorganic layer, a second flexible layer and a second inorganic layer, and the display structure layer and the blank structure layer are disposed on the second inorganic layer. The light-transmitting holes may be disposed on the first flexible layer, and the depths of the light-transmitting holes may be less than or equal to the thickness of the first flexible layer. Alternatively, the light-transmitting holes may be disposed on the first flexible layer and the first inorganic layer, and the depths of the light-transmitting holes may be less than or equal to the total thickness of the first flexible layer and the first inorganic layer. Alternatively, light-transmitting holes may be provided on the first flexible layer, the first inorganic layer and the second flexible layer, and the depth of the light-transmitting holes may be less than or equal to the total thickness of the first flexible layer, the first inorganic layer and the second flexible layer . Alternatively, the light-transmitting holes may be disposed on the first flexible layer, the first inorganic layer, the second flexible layer, and the second inorganic layer, and the depths of the light-transmitting holes may be less than or equal to the first flexible layer, the first inorganic layer, the second flexible layer, and the second inorganic layer. The total thickness of the flexible layer and the second inorganic layer.
在示例性实施方式中，基底可以包括叠设的第一柔性层、第一无机层、半导体层、第二柔性层和第二无机层，显示结构层和空白结构层设置在第二无机层上。透光孔可以设置在第一柔性层上，透光孔的深度可以小于或等于第一柔性层的厚度。或者，透光孔可以设置在第一柔性层和第一无机层上，透光孔的深度可以小于或等于第一柔性层和第一无机层的总厚度。或者，透光孔可以设置在第一柔性层、第一无机层和半导体层上，透光孔的深度可以小于或等于第一柔性层、第一无机层和半导体层的总厚度。或者，透光孔可以设置在第一柔性层、第一无机层、半导体层和第二柔性层上，透光孔的深度可以小于或等于第一柔性层、第一无机层、半导体层和第二柔性层的总厚度。或者，透光孔可以设置在第一柔性层、第一无机层、半导体层、第二柔性层和第二无机层上，透光孔的深度可以小于或等于第一柔性层、第一无机层、半导体层、第二柔性层和第二无机层的总厚度。In an exemplary embodiment, the substrate may include a stacked first flexible layer, a first inorganic layer, a semiconductor layer, a second flexible layer and a second inorganic layer, and the display structure layer and the blank structure layer are disposed on the second inorganic layer . The light-transmitting holes may be disposed on the first flexible layer, and the depths of the light-transmitting holes may be less than or equal to the thickness of the first flexible layer. Alternatively, the light-transmitting holes may be disposed on the first flexible layer and the first inorganic layer, and the depths of the light-transmitting holes may be less than or equal to the total thickness of the first flexible layer and the first inorganic layer. Alternatively, the light-transmitting holes may be provided on the first flexible layer, the first inorganic layer and the semiconductor layer, and the depths of the light-transmitting holes may be less than or equal to the total thickness of the first flexible layer, the first inorganic layer and the semiconductor layer. Alternatively, the light-transmitting holes may be disposed on the first flexible layer, the first inorganic layer, the semiconductor layer and the second flexible layer, and the depths of the light-transmitting holes may be less than or equal to the first flexible layer, the first inorganic layer, the semiconductor layer and the second flexible layer. The total thickness of the two flexible layers. Alternatively, the light-transmitting holes may be provided on the first flexible layer, the first inorganic layer, the semiconductor layer, the second flexible layer and the second inorganic layer, and the depths of the light-transmitting holes may be less than or equal to the first flexible layer, the first inorganic layer , the total thickness of the semiconductor layer, the second flexible layer and the second inorganic layer.
图9a至图9e为本公开示例性实施例几种透光显示区的后视图，示意了显示基板背离出光面一侧的平面结构。在示例性实施方式中，透光孔500设置在基底10背离出射光的一侧，透光孔500的形状和位置基本上与空白岛400的形状和位置相对应。9a to 9e are rear views of several light-transmitting display areas according to exemplary embodiments of the present disclosure, illustrating the planar structure of the side of the display substrate facing away from the light-emitting surface. In the exemplary embodiment, the light-transmitting holes 500 are disposed on the side of the substrate 10 away from the outgoing light, and the shapes and positions of the light-transmitting holes 500 substantially correspond to the shapes and positions of the blank islands 400 .
在示例性实施方式中，对于如图7a所示多个空白列排布方式的透光显示区，透光显示区的基底10上可以设置多个条状的透光孔500，每个透光孔500沿着第二方向Y(列方向)延伸，多个透光孔500沿着第一方向X(行方向)间隔设置，如图9a所示。每个条状透光孔500的位置与透光显示区上空白列的位置相对应，空白列在基底上的正投影包含与之相对应的条状透光孔在基底上的正投影。In an exemplary embodiment, for the light-transmitting display area in the arrangement of multiple blank columns as shown in FIG. 7a, a plurality of strip-shaped light-transmitting holes 500 may be provided on the substrate 10 of the light-transmitting display area, each light-transmitting The holes 500 extend along the second direction Y (column direction), and a plurality of light-transmitting holes 500 are arranged at intervals along the first direction X (row direction), as shown in FIG. 9a . The position of each strip-shaped light-transmitting hole 500 corresponds to the position of the blank column on the light-transmitting display area, and the orthographic projection of the blank column on the substrate includes the orthographic projection of the corresponding strip-shaped light-transmitting hole on the substrate.
在示例性实施方式中，对于如图7b所示多个空白行排布方式的透光显示区，透光显示区的基底10上可以设置多个条状的透光孔500，每个透光孔500沿着第一方向X(行方向)延伸，多个透光孔500沿着第二方向Y(列方向)间隔设置，如图9b所示。每个条状透光孔500的位置与透光显示区上空白行的位置相对应，空白行在基底上的正投影包含与之相对应的条状透光孔在基底上的正投影。In an exemplary embodiment, for the light-transmitting display area in which multiple blank rows are arranged as shown in FIG. 7b, a plurality of strip-shaped light-transmitting holes 500 may be provided on the substrate 10 of the light-transmitting display area, and each light-transmitting hole 500 The holes 500 extend along the first direction X (row direction), and a plurality of light-transmitting holes 500 are arranged along the second direction Y (column direction) at intervals, as shown in FIG. 9b . The position of each strip-shaped light-transmitting hole 500 corresponds to the position of the blank line on the light-transmitting display area, and the orthographic projection of the blank line on the substrate includes the orthographic projection of the corresponding strip-shaped light-transmitting hole on the substrate.
在示例性实施方式中，对于如图7c所示棋盘排布方式的透光显示区，透光显示区的基底10上可以设置多个块状的透光孔500，多个块状透光孔500在第一方向X(行方向)上间隔设置，在第二方向Y(列方向)上间隔设置，如图9c所示。每个块状透光孔500的位置与透光显示区上空白岛的位置相对应，空白岛在基底上的正投影包含与之相对应的块状透光孔在基底上的正投影。In an exemplary embodiment, for the light-transmitting display area in a checkerboard arrangement as shown in FIG. 7c, a plurality of block-shaped light-transmitting holes 500 may be provided on the substrate 10 of the light-transmitting display area, and a plurality of block-shaped light-transmitting holes 500 are spaced in the first direction X (row direction) and spaced in the second direction Y (column direction), as shown in FIG. 9c. The position of each block-shaped light-transmitting hole 500 corresponds to the position of the blank island on the light-transmitting display area, and the orthographic projection of the blank island on the substrate includes the orthographic projection of the corresponding block-shaped light-transmitting hole on the substrate.
在示例性实施方式中，对于如图7d所示排布方式的透光显示区，透光显示区的基底10上可以设置网格状的透光孔500，一部分透光孔500沿着第一方向X(行方向)延伸，沿着第二方向Y(列方向)间隔设置，另一部分透光孔500沿着第二方向Y延伸，沿着第一方向X间隔设置，形成网格状，如图9d所示。网格状透光孔的位置与透光显示区上网格状空白岛的位置相对应，网格状空白岛在基底上的正投影包含网格状透光孔在基底上的正投影。In an exemplary embodiment, for the light-transmitting display area arranged as shown in FIG. 7d , grid-shaped light-transmitting holes 500 may be provided on the substrate 10 of the light-transmitting display area, and a part of the light-transmitting holes 500 are arranged along the first The light-transmitting holes 500 extend along the second direction Y (row direction) and are arranged at intervals along the second direction Y (column direction), and another part of the light-transmitting holes 500 extend along the second direction Y and are arranged at intervals along the first direction X to form a grid shape, such as shown in Figure 9d. The positions of the grid-shaped light-transmitting holes correspond to the positions of the grid-shaped blank islands on the light-transmitting display area, and the orthographic projection of the grid-shaped blank islands on the substrate includes the orthographic projection of the grid-shaped light-transmitting holes on the substrate.
在示例性实施方式中，对于如图7a所示多个空白列排布方式的透光显示 区，透光显示区的基底10上可以设置多个透光孔组501，每个透光孔组501包括多个条状的透光孔500，多个条状的透光孔500均沿着第二方向Y(列方向)延伸，并沿着第一方向X(行方向)间隔设置，如图9e所示。每个透光孔组501的位置与透光显示区上空白列的位置相对应，空白列在基底上的正投影包含与之相对应的透光孔组501在基底上的正投影。在示例性实施方式中，透光孔组中多个的透光孔的形状以及排布方式，可以根据实际需要来设置，本公开在此不做限定。In an exemplary embodiment, for a light-transmitting display area with a plurality of blank columns arranged in FIG. 7a, a plurality of light-transmitting hole groups 501 may be provided on the substrate 10 of the light-transmitting display area, and each light-transmitting hole group 501 includes a plurality of strip-shaped light-transmitting holes 500, and the plurality of strip-shaped light-transmitting holes 500 all extend along the second direction Y (column direction) and are spaced along the first direction X (row direction), as shown in the figure. 9e. The position of each light-transmitting hole group 501 corresponds to the position of the blank column on the light-transmitting display area, and the orthographic projection of the blank column on the substrate includes the orthographic projection of the corresponding light-transmitting hole group 501 on the substrate. In the exemplary embodiment, the shape and arrangement of the plurality of light-transmitting holes in the light-transmitting hole group can be set according to actual needs, which is not limited in the present disclosure.
一种显示基板中，为了提高透光显示区的透光率，通常是将整个透光显示区的基底去除。例如，对于直径约为4mm的圆形透光显示区，则在透光显示区的基底上开设直径约为4mm透光孔。研究表明，这种将透光显示区的基底全部去除的方案，使得透光显示区中显示子像素的显示结构失去支撑，支撑性变差的透光显示区不仅会导致显示结构变形，降低显示画面品质，而且会影响显示结构的封装效果，使得封装层阻隔水氧性能降低，降低了显示基板的使用寿命。In a display substrate, in order to improve the light transmittance of the light-transmitting display area, the substrate of the entire light-transmitting display area is usually removed. For example, for a circular light-transmitting display area with a diameter of about 4 mm, a light-transmitting hole with a diameter of about 4 mm is opened on the substrate of the light-transmitting display area. Studies have shown that this solution of removing all the substrates of the light-transmitting display area makes the display structure of the display sub-pixels in the light-transmitting display area lose support. The quality of the picture is affected, and the encapsulation effect of the display structure is affected, so that the water and oxygen barrier performance of the encapsulation layer is reduced, and the service life of the display substrate is reduced.
本公开示例性实施例的显示基板中，仅在透光显示区中不参与画面显示的空白岛区域设置透光孔，而透光显示区中进行画面显示的像素岛区域不设置透光孔，即保留像素岛区域的基底，不仅透光显示区的透光率与透光显示区整体开设透光孔的透光率相当，保证了透光显示区的透光率，而且像素岛区域保留的基底为显示子像素的显示结构提供了有效的支撑，避免了显示结构变形，避免了影响封装效果，因而有效保证了显示画面品质和使用寿命。In the display substrate of the exemplary embodiment of the present disclosure, light-transmitting holes are only provided in the blank island regions in the light-transmitting display area that do not participate in the screen display, and no light-transmitting holes are provided in the pixel island areas in the light-transmitting display area that perform screen display. That is to say, to retain the substrate of the pixel island area, not only the light transmittance of the light-transmitting display area is equivalent to the light transmittance of the light-transmitting display area as a whole with light-transmitting holes, which ensures the light transmittance of the light-transmitting display area, but also the pixel island area retains the light transmittance. The substrate provides effective support for the display structure of the display sub-pixels, avoids the deformation of the display structure, and avoids affecting the packaging effect, thereby effectively ensuring the quality and service life of the display image.
下面通过显示基板的一种制备过程进行示例性说明。本公开所说的“图案化工艺”，对于金属材料、无机材料或透明导电材料，包括涂覆光刻胶、掩模曝光、显影、刻蚀、剥离光刻胶等处理，对于有机材料，包括涂覆有机材料、掩模曝光和显影等处理。沉积可以采用溅射、蒸镀、化学气相沉积中的任意一种或多种，涂覆可以采用喷涂、旋涂和喷墨打印中的任意一种或多种，刻蚀可以采用干刻和湿刻中的任意一种或多种，本公开不做限定。“薄膜”是指将某一种材料在基底上利用沉积、涂覆或其它工艺制作出的一层薄膜。若在整个制作过程当中该“薄膜”无需图案化工艺，则该“薄膜”还可以称为“层”。若在整个制作过程当中该“薄膜”需图案化工艺，则在图案化工艺前称为“薄 膜”，图案化工艺后称为“层”。经过图案化工艺后的“层”中包含至少一个“图案”。本公开所说的“A和B同层设置”是指，A和B通过同一次图案化工艺同时形成，膜层的“厚度”为膜层在垂直于显示基板方向上的尺寸。本公开示例性实施例中，“A的正投影包含B的正投影”，是指B的正投影的边界落入A的正投影的边界范围内，或者A的正投影的边界与B的正投影的边界重叠。An exemplary description is given below through a preparation process of the display substrate. The "patterning process" mentioned in this disclosure, for metal materials, inorganic materials or transparent conductive materials, includes photoresist coating, mask exposure, development, etching, stripping photoresist and other treatments, for organic materials, including Processes such as coating organic materials, mask exposure and development. Deposition can use any one or more of sputtering, evaporation, chemical vapor deposition, coating can use any one or more of spraying, spin coating and inkjet printing, etching can use dry etching and wet Any one or more of the engravings are not limited in the present disclosure. "Film" refers to a thin film made of a material on a substrate by deposition, coating or other processes. If the "thin film" does not require a patterning process during the entire fabrication process, the "thin film" may also be referred to as a "layer". If the "thin film" needs a patterning process in the whole manufacturing process, it is called a "thin film" before the patterning process, and a "layer" after the patterning process. The "layer" after the patterning process contains at least one "pattern". In the present disclosure, "A and B are arranged in the same layer" means that A and B are simultaneously formed through the same patterning process, and the "thickness" of the film layer is the dimension of the film layer in the direction perpendicular to the display substrate. In an exemplary embodiment of the present disclosure, "the orthographic projection of A includes the orthographic projection of B" means that the boundary of the orthographic projection of B falls within the boundary range of the orthographic projection of A, or the boundary of the orthographic projection of A is the same as the boundary of the orthographic projection of B. The projected boundaries overlap.
在示例性实施方式中，以显示基板透光显示区中的2个像素岛300和1个空白岛400为例，显示基板的一种制备过程可以包括如下操作。其中，像素岛300包括三个显示子像素，每个显示子像素的像素驱动电路以一个晶体管和存储电容作为示例，空白岛400中空白子像素的尺寸与像素岛300中显示子像素的尺寸基本上相同。In an exemplary embodiment, taking two pixel islands 300 and one blank island 400 in the light-transmitting display area of the display substrate as an example, a preparation process of the display substrate may include the following operations. The pixel island 300 includes three display sub-pixels, and the pixel driving circuit of each display sub-pixel takes a transistor and a storage capacitor as an example. The size of the blank sub-pixel in the blank island 400 is basically the same as the size of the display sub-pixel in the pixel island 300 same as above.
(11)形成柔性基底图案。在示例性实施方式中，形成柔性基底图案可以包括：先在玻璃载板1上涂布第一柔性薄膜，固化成膜后形成第一柔性层10A；随后在第一柔性层10A上沉积第一无机薄膜，形成第一无机层10B；随后在第一无机层10B上涂布第二柔性薄膜，固化成膜后形成第二柔性层10C；随后在第二柔性层10C上沉积第二无机薄膜，形成第二无机层10D，完成基底10的制备，如图10所示。(11) Forming a flexible base pattern. In an exemplary embodiment, forming the flexible base pattern may include: firstly coating a first flexible film on the glass carrier 1 , and then curing it into a film to form a first flexible layer 10A; then depositing a first flexible film on the first flexible layer 10A an inorganic thin film to form a first inorganic layer 10B; then a second flexible thin film is coated on the first inorganic layer 10B, and cured to form a film to form a second flexible layer 10C; then a second inorganic thin film is deposited on the second flexible layer 10C, The second inorganic layer 10D is formed, and the preparation of the substrate 10 is completed, as shown in FIG. 10 .
在示例性实施方式中，第一柔性层和第二柔性层的材料可以采用聚酰亚胺(PI)或经表面处理的聚合物软膜等材料，第一无机层和第二无机层的材料可以采用氮化硅(SiNx)或氧化硅(SiOx)等，第一无机层和第二无机层可以称为阻挡(Barrier)层或缓冲(Buffer)层。In an exemplary embodiment, the materials of the first flexible layer and the second flexible layer may be polyimide (PI) or a surface-treated soft polymer film, etc., and the materials of the first inorganic layer and the second inorganic layer may be Silicon nitride (SiNx) or silicon oxide (SiOx), etc. may be used, and the first inorganic layer and the second inorganic layer may be called a barrier layer or a buffer layer.
在示例性实施方式中，第一柔性层和第二柔性层的厚度可以约为5μm至10μm，第一无机层和第二无机层的厚度可以约为0.3μm至1.0μm。例如，第一柔性层的厚度可以约为8.5μm，第二柔性层的厚度可以约为8.5μm，第一无机层的厚度可以约为0.6μm，第二无机层的厚度可以约为0.6μm。In an exemplary embodiment, the thickness of the first flexible layer and the second flexible layer may be about 5 μm to 10 μm, and the thickness of the first inorganic layer and the second inorganic layer may be about 0.3 μm to 1.0 μm. For example, the thickness of the first flexible layer may be about 8.5 μm, the thickness of the second flexible layer may be about 8.5 μm, the thickness of the first inorganic layer may be about 0.6 μm, and the thickness of the second inorganic layer may be about 0.6 μm.
本次工艺后，像素岛300区域和空白岛400区域均包括基底10，基底10包括在玻璃载板1上叠设的第一柔性层、第一无机层、第二柔性层和第二无机层。After this process, both the pixel island 300 area and the blank island 400 area include the substrate 10 , and the substrate 10 includes the first flexible layer, the first inorganic layer, the second flexible layer and the second inorganic layer stacked on the glass carrier 1 . .
本公开示例性实施例中，基底可以只包括第一柔性层，或者可以包括叠 设的第一柔性层、第一无机层和第二柔性层，或者可以包括其它膜层，如包括叠设的第一柔性层、第一无机层、半导体层、第二柔性层和第二无机层，本公开在此不做限定。In an exemplary embodiment of the present disclosure, the substrate may include only the first flexible layer, or may include a stacked first flexible layer, a first inorganic layer, and a second flexible layer, or may include other film layers, such as a stacked The first flexible layer, the first inorganic layer, the semiconductor layer, the second flexible layer and the second inorganic layer are not limited in this disclosure.
(12)形成驱动电路层图案。在示例性实施方式中，驱动电路层可以包括构成像素驱动电路的晶体管和存储电容。在示例性实施方式中，形成驱动电路层图案可以包括：(12) A driving circuit layer pattern is formed. In an exemplary embodiment, the driving circuit layer may include transistors and storage capacitors constituting a pixel driving circuit. In an exemplary embodiment, forming the driving circuit layer pattern may include:
在基底10上依次沉积第一绝缘薄膜和半导体薄膜，通过图案化工艺对半导体薄膜进行图案化，形成覆盖基底10的第一绝缘层，以及设置在第一绝缘层上的半导体层图案，半导体层图案形成在像素岛300区域，至少包括位于每个显示子像素中的有源层。本次工艺后，空白岛400区域的半导体薄膜被刻蚀掉，暴露出第一绝缘层。A first insulating film and a semiconductor film are sequentially deposited on the substrate 10, and the semiconductor film is patterned through a patterning process to form a first insulating layer covering the substrate 10, and a semiconductor layer pattern disposed on the first insulating layer. The semiconductor layer The pattern is formed in the pixel island 300 region, including at least the active layer in each display sub-pixel. After this process, the semiconductor thin film in the area of the blank island 400 is etched away, exposing the first insulating layer.
随后，依次沉积第二绝缘薄膜和第一金属薄膜，通过图案化工艺对第一金属薄膜进行图案化，形成覆盖半导体层图案的第二绝缘层，以及设置在第二绝缘层上的第一导电层图案，第一导电层图案形成在像素岛300区域，至少包括位于每个显示子像素中的栅电极和第一电容电极，栅电极在基底上的正投影位于有源层在基底上的正投影的范围之内。本次工艺后，空白岛400区域的第一金属薄膜被刻蚀掉，保留第二绝缘层，即空白岛400区域包括在基底10上叠设的第一绝缘层和第二绝缘层。Subsequently, a second insulating film and a first metal film are sequentially deposited, and the first metal film is patterned through a patterning process to form a second insulating layer covering the pattern of the semiconductor layer, and a first conductive layer disposed on the second insulating layer Layer pattern, the first conductive layer pattern is formed in the pixel island 300 area, at least including a gate electrode and a first capacitor electrode located in each display sub-pixel, the orthographic projection of the gate electrode on the substrate is located on the positive side of the active layer on the substrate. within the projection range. After this process, the first metal film in the area of the blank island 400 is etched away, leaving the second insulating layer, that is, the area of the blank island 400 includes the first insulating layer and the second insulating layer stacked on the substrate 10 .
随后，依次沉积第三绝缘薄膜和第二金属薄膜，通过图案化工艺对第二金属薄膜进行图案化，形成覆盖第一导电层图案的第三绝缘层，以及设置在第三绝缘层上的第二导电层图案，第二导电层图案形成在像素岛300区域，至少包括位于每个显示子像素中的第二电容电极，第二电容电极的位置与第一电容电极的位置相对应。本次工艺后，空白岛400区域的第二金属薄膜被刻蚀掉，保留第三绝缘层，即空白岛400区域包括在基底10上叠设的第一绝缘层、第二绝缘层和第三绝缘层。Subsequently, a third insulating film and a second metal film are sequentially deposited, and the second metal film is patterned through a patterning process to form a third insulating layer covering the pattern of the first conductive layer, and a third insulating layer disposed on the third insulating layer. Two conductive layer patterns. The second conductive layer pattern is formed in the pixel island 300 and includes at least a second capacitor electrode located in each display sub-pixel, and the position of the second capacitor electrode corresponds to that of the first capacitor electrode. After this process, the second metal film in the area of the blank island 400 is etched away, leaving the third insulating layer, that is, the area of the blank island 400 includes the first insulating layer, the second insulating layer and the third insulating layer stacked on the substrate 10 Insulation.
随后，沉积第四绝缘薄膜，通过图案化工艺对第四绝缘薄膜进行图案化，形成覆盖第二导电层图案的第四绝缘层，像素岛300区域形成有过孔，过孔分别位于每个显示子像素中有源层的两端，过孔内的第四绝缘层、第三绝缘层和第二绝缘层被刻蚀掉，分别暴露出有源层的表面。本次工艺后，空白岛 400区域包括在基底10上叠设的第一绝缘层、第二绝缘层、第三绝缘层和第四绝缘层。Subsequently, a fourth insulating film is deposited, and the fourth insulating film is patterned by a patterning process to form a fourth insulating layer covering the pattern of the second conductive layer. Via holes are formed in the pixel island 300 area, and the via holes are located in each display panel respectively. At both ends of the active layer in the sub-pixel, the fourth insulating layer, the third insulating layer and the second insulating layer in the via hole are etched away, respectively exposing the surface of the active layer. After this process, the area of the blank island 400 includes the first insulating layer, the second insulating layer, the third insulating layer and the fourth insulating layer stacked on the substrate 10.
随后，沉积第三金属薄膜，通过图案化工艺对第三金属薄膜进行图案化，在第四绝缘层上形成第三导电层图案，第三导电层图案形成在像素岛300区域，至少包括位于每个显示子像素中的源电极和漏电极，源电极和漏电极分别通过过孔与有源层连接。本次工艺后，空白岛400区域的第三金属薄膜被刻蚀掉，空白岛400区域包括在基底10上叠设的第一绝缘层、第二绝缘层、第三绝缘层和第四绝缘层。Then, depositing a third metal film, patterning the third metal film through a patterning process, forming a third conductive layer pattern on the fourth insulating layer, and forming the third conductive layer pattern in the pixel island 300 area, at least including The source electrode and the drain electrode in each display sub-pixel are respectively connected to the active layer through the via hole. After this process, the third metal film in the area of the blank island 400 is etched away, and the area of the blank island 400 includes the first insulating layer, the second insulating layer, the third insulating layer and the fourth insulating layer stacked on the substrate 10 .
随后，沉积平坦薄膜，通过图案化工艺对平坦薄膜进行图案化，在像素岛300区域形成覆盖第三导电层图案的平坦层，位于每个显示子像素中的平坦层上开设有阳极过孔，阳极过孔内的平坦层被去掉，暴露出漏电极的表面。本次工艺后，空白岛400区域的平坦薄膜被去掉，空白岛400区域包括在基底10上叠设的第一绝缘层、第二绝缘层、第三绝缘层和第四绝缘层。Subsequently, a flat film is deposited, the flat film is patterned by a patterning process, a flat layer covering the pattern of the third conductive layer is formed in the pixel island 300 area, and an anode via hole is opened on the flat layer in each display sub-pixel, The flat layer inside the anode via is removed, exposing the surface of the drain electrode. After this process, the flat film in the area of the blank island 400 is removed, and the area of the blank island 400 includes the first insulating layer, the second insulating layer, the third insulating layer and the fourth insulating layer stacked on the substrate 10 .
至此，在像素岛300区域和空白岛400区域分别制备完成驱动电路层102和复合绝缘层202，如图11所示。在示例性实施方式中，驱动电路层102可以包括晶体管和存储电容，晶体管可以包括有源层、栅电极、源电极和漏电极，存储电容可以包括第一电容电极和第二电容电极，晶体管可以是像素驱动电路中的驱动晶体管，驱动晶体管可以是薄膜晶体管。在示例性实施方式中，复合绝缘层202可以包括叠设的第一绝缘层、第二绝缘层、第三绝缘层和第四绝缘层。So far, the driving circuit layer 102 and the composite insulating layer 202 are respectively prepared in the pixel island 300 region and the blank island 400 region, as shown in FIG. 11 . In an exemplary embodiment, the driving circuit layer 102 may include a transistor and a storage capacitor, the transistor may include an active layer, a gate electrode, a source electrode and a drain electrode, the storage capacitor may include a first capacitor electrode and a second capacitor electrode, and the transistor may It is a driving transistor in a pixel driving circuit, and the driving transistor can be a thin film transistor. In an exemplary embodiment, the composite insulating layer 202 may include a stacked first insulating layer, a second insulating layer, a third insulating layer, and a fourth insulating layer.
在示例性实施方式中，第一绝缘层、第二绝缘层、第三绝缘层和第四绝缘层可以采用硅氧化物(SiOx)、硅氮化物(SiNx)和氮氧化硅(SiON)中的任意一种或更多种，可以是单层、多层或复合层。第一绝缘层称为缓冲(Buffer)层，第二绝缘层和第三绝缘层称为(GI)层，第四绝缘层称为层间绝缘(ILD)层。平坦薄膜可以采用有机材料，如树脂等。第一导电层、第二导电层和第三导电层可以采用金属材料，如银(Ag)、铜(Cu)、铝(Al)、钛(Ti)和钼(Mo)中的任意一种或更多种，或上述金属的合金材料，如铝钕合金(AlNd)或钼铌合金(MoNb)，可以是单层结构，或者多层复合结构，如Ti/Al/Ti等。有源层可以采用非晶态氧化铟镓锌材料(a-IGZO)、氮 氧化锌(ZnON)、氧化铟锌锡(IZTO)、非晶硅(a-Si)、多晶硅(p-Si)、六噻吩、聚噻吩等各种材料，即本公开适用于基于氧化物Oxide技术、硅技术以及有机物技术制造的晶体管。In exemplary embodiments, the first insulating layer, the second insulating layer, the third insulating layer, and the fourth insulating layer may adopt silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON) Any one or more of them may be a single layer, multiple layers or composite layers. The first insulating layer is called a buffer layer, the second insulating layer and the third insulating layer are called a (GI) layer, and the fourth insulating layer is called an interlayer insulating (ILD) layer. The flat film can be made of organic materials such as resins. The first conductive layer, the second conductive layer and the third conductive layer can be made of metal materials, such as any one of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo) or More, or alloy materials of the above metals, such as aluminum neodymium alloy (AlNd) or molybdenum niobium alloy (MoNb), can be a single-layer structure, or a multi-layer composite structure, such as Ti/Al/Ti and the like. The active layer can be made of amorphous indium gallium zinc oxide (a-IGZO), zinc oxynitride (ZnON), indium zinc tin oxide (IZTO), amorphous silicon (a-Si), polycrystalline silicon (p-Si), Various materials such as hexathiophene and polythiophene, that is, the present disclosure is applicable to transistors manufactured based on oxide technology, silicon technology and organic technology.
在示例性实施方式中，显示基板可以包括第五绝缘层，第五绝缘层可以覆盖第三导电层图案，平坦层设置在第五绝缘层上，第五绝缘层称为钝化(PVX)层。In an exemplary embodiment, the display substrate may include a fifth insulating layer, the fifth insulating layer may cover the third conductive layer pattern, the planarization layer is disposed on the fifth insulating layer, and the fifth insulating layer is called a passivation (PVX) layer .
(13)形成发光结构层和封装层图案。在示例性实施方式中，形成发光结构层图案可以包括：(13) Patterns of the light emitting structure layer and the encapsulation layer are formed. In an exemplary embodiment, forming the light emitting structure layer pattern may include:
在形成前述图案的基底上沉积导电薄膜，通过图案化工艺对导电薄膜进行图案化，形成阳极图案，阳极形成在像素岛300区域的每个显示子像素中，阳极通过阳极过孔与漏电极连接。本次工艺后，沉积在空白岛400区域的导电薄膜被刻蚀掉，空白岛400区域的结构与前一工艺后的结构相同。A conductive film is deposited on the substrate formed with the aforementioned pattern, and the conductive film is patterned through a patterning process to form an anode pattern. The anode is formed in each display sub-pixel in the pixel island 300 region, and the anode is connected to the drain electrode through the anode via hole. . After this process, the conductive film deposited on the area of the blank island 400 is etched away, and the structure of the area of the blank island 400 is the same as that after the previous process.
随后，在形成前述图案的基底上涂覆像素定义薄膜，通过图案化工艺对像素定义薄膜进行图案化，在像素岛300区域形成像素定义层图案，位于每个显示子像素中的像素定义层上开设有像素开口，像素开口内的像素定义层被去掉，暴露出阳极的表面。本次工艺后，涂覆在空白岛400区域的像素定义薄膜被去掉，空白岛400区域的结构与前一工艺后的结构相同。Subsequently, a pixel definition film is coated on the substrate on which the aforementioned pattern is formed, the pixel definition film is patterned by a patterning process, and a pixel definition layer pattern is formed in the pixel island 300 region, which is located on the pixel definition layer in each display sub-pixel A pixel opening is provided, and the pixel defining layer in the pixel opening is removed to expose the surface of the anode. After this process, the pixel definition film coated on the area of the blank island 400 is removed, and the structure of the area of the blank island 400 is the same as that after the previous process.
随后，在形成前述图案的基底上，通过蒸镀方式或喷墨打印方式在像素岛300区域形成有机发光层图案，位于每个显示子像素中的有机发光层通过像素开口与阳极连接。本次工艺后，空白岛400区域的结构与前一工艺后的结构相同。Subsequently, an organic light-emitting layer pattern is formed in the pixel island 300 region by vapor deposition or inkjet printing on the substrate on which the aforementioned pattern is formed, and the organic light-emitting layer in each display sub-pixel is connected to the anode through the pixel opening. After this process, the structure of the blank island 400 region is the same as that after the previous process.
随后，在形成前述图案的基底上，通过蒸镀方式形成阴极图案，阴极形成在图案在像素岛300区域，与每个显示子像素中的有机发光层连接，阴极可以是连通在一起的整体结构。本次工艺后，空白岛400区域的结构与前一工艺后的结构相同。Subsequently, a cathode pattern is formed on the substrate on which the aforementioned pattern is formed by evaporation. The cathode is formed in the pattern in the pixel island 300 region, and is connected to the organic light-emitting layer in each display sub-pixel. The cathode may be an integral structure connected together. . After this process, the structure of the blank island 400 region is the same as that after the previous process.
随后，在形成前述图案的基底上，先沉积第一封装薄膜，在像素岛300和空白岛400区域形成第一封装层；然后利用喷墨打印工艺在像素岛300区域的第一封装层31上喷墨打印有机封装材料，固化成膜后，形成有机封装层； 然后沉积第二封装薄膜，在像素岛300和空白岛400区域形成第二封装层。像素岛300区域的第一封装层、有机封装层和第二封装层组成封装层，空白岛400区域作为第一无机封装层的第一封装层和作为第二无机封装层的第二封装层组成无机封装层。Subsequently, on the substrate on which the aforementioned pattern is formed, a first encapsulation film is firstly deposited, and a first encapsulation layer is formed in the pixel islands 300 and the blank islands 400; The organic packaging material is inkjet printed, and after curing into a film, an organic packaging layer is formed; then a second packaging film is deposited to form a second packaging layer on the pixel islands 300 and the blank islands 400 . The first encapsulation layer, the organic encapsulation layer and the second encapsulation layer in the pixel island 300 area constitute an encapsulation layer, and the blank island 400 area is composed of the first encapsulation layer of the first inorganic encapsulation layer and the second encapsulation layer of the second inorganic encapsulation layer. Inorganic encapsulation layer.
至此，制备完成发光结构层103和封装层104图案，像素岛300区域包括设置在基底10上的显示结构层310，空白岛400区域包括设置在基底10上的空白结构层410，显示结构层310包括驱动电路层102、发光结构层103和封装层104，空白结构层410包括复合绝缘层202和无机封装层，如图12所示。So far, the patterns of the light emitting structure layer 103 and the encapsulation layer 104 are prepared. The pixel island 300 area includes the display structure layer 310 disposed on the substrate 10 , the blank island 400 area includes the blank structure layer 410 disposed on the substrate 10 , and the display structure layer 310 It includes the driving circuit layer 102 , the light emitting structure layer 103 and the encapsulation layer 104 , and the blank structure layer 410 includes the composite insulating layer 202 and the inorganic encapsulation layer, as shown in FIG. 12 .
在示例性实施方式中，导电薄膜可以采用金属材料或者透明导电材料，金属材料可以包括银(Ag)、铜(Cu)、铝(Al)、钛(Ti)和钼(Mo)中的任意一种或更多种，或上述金属的合金材料，透明导电材料可以包括氧化铟锡(ITO)或氧化铟锌(IZO)。在示例性实施方式中，导电薄膜可以是单层结构，或者是多层复合结构，如ITO/Al/ITO等。In an exemplary embodiment, the conductive thin film may be a metal material or a transparent conductive material, and the metal material may include any one of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo). One or more, or alloy materials of the above metals, the transparent conductive material may include indium tin oxide (ITO) or indium zinc oxide (IZO). In an exemplary embodiment, the conductive thin film may be a single-layer structure, or a multi-layer composite structure, such as ITO/Al/ITO and the like.
在示例性实施方式中，像素定义层可以采用聚酰亚胺、亚克力或聚对苯二甲酸乙二醇酯等。在平行于显示基板的平面内，像素开口的形状可以是三角形、矩形、多边形、圆形或椭圆形等。在垂直于显示基板的平面内，像素开口的截面形状可以是矩形或者梯形等。In an exemplary embodiment, the pixel definition layer may employ polyimide, acrylic, polyethylene terephthalate, or the like. In a plane parallel to the display substrate, the shape of the pixel opening may be a triangle, a rectangle, a polygon, a circle, an ellipse, or the like. In a plane perpendicular to the display substrate, the cross-sectional shape of the pixel opening may be a rectangle or a trapezoid or the like.
在示例性实施例中，第一封装层和第二封装层可以采用硅氧化物(SiOx)、硅氮化物(SiNx)和氮氧化硅(SiON)中的任意一种或多种，可以是单层、多层或复合层，有机封装层可以采用树脂材料，在像素岛300区域形成无机材料/有机材料/无机材料的叠层结构，有机材料层设置在两个无机材料层之间，在空白岛400区域形成无机材料/无机材料的叠层结构，可以保证外界水汽无法进入发光结构层。In an exemplary embodiment, the first encapsulation layer and the second encapsulation layer may adopt any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and may be a single layer, multi-layer or composite layer, the organic encapsulation layer can be made of resin material, and a laminated structure of inorganic material/organic material/inorganic material is formed in the pixel island 300 area, and the organic material layer is arranged between the two inorganic material layers. The area of the island 400 forms a layered structure of inorganic materials/inorganic materials, which can ensure that external water vapor cannot enter the light-emitting structure layer.
在示例性实施方式中，制备完成封装层后，可以在像素岛300区域的封装层上形成触摸结构层(TSP)，触摸结构层可以包括触控电极层，或者包括触控电极层和触控绝缘层。在示例性实施方式中，形成封装层或触摸结构层后，可以在显示基板上贴附偏光片等膜层，本公开在此不作限定。In an exemplary embodiment, after the encapsulation layer is prepared, a touch structure layer (TSP) may be formed on the encapsulation layer in the pixel island 300 region, and the touch structure layer may include a touch electrode layer, or a touch electrode layer and a touch control layer. Insulation. In an exemplary embodiment, after the encapsulation layer or the touch structure layer is formed, a film layer such as a polarizer may be attached on the display substrate, which is not limited in the present disclosure.
(14)剥离玻璃载板。在示例性实施方式中，剥离玻璃载板可以包括：通过剥离工艺将玻璃载板与显示基板剥离，如图13所示。(14) Peel off the glass carrier. In an exemplary embodiment, peeling off the glass carrier may include peeling off the glass carrier from the display substrate through a peeling process, as shown in FIG. 13 .
在示例性实施方式中，剥离工艺可以采用激光剥离工艺。激光剥离工艺是在玻璃载板背面(玻璃载板未设置显示基板的一侧)采用激光设备发射的高能激光光束进行扫描，使柔性基底的膜层发生变性，粘着性能下降，从而破坏柔性基底与玻璃载板之间的接触面的附着力，然后使用物理手段如提拉、牵引、刀切等方式将显示基板从硬质玻璃载板上剥离下来。在示例性实施方式中，剥离工艺可以采用机械剥离方式，本公开在此不做限定。In an exemplary embodiment, the lift-off process may employ a laser lift-off process. The laser lift-off process is to scan the back of the glass carrier (the side of the glass carrier without the display substrate) with a high-energy laser beam emitted by a laser device, so that the film layer of the flexible substrate is denatured and the adhesion performance is reduced, thereby destroying the flexible substrate and the substrate. Adhesion of the contact surfaces between the glass carriers, and then use physical means such as pulling, pulling, knife cutting, etc. to peel off the display substrate from the hard glass carrier. In the exemplary embodiment, the lift-off process may adopt a mechanical lift-off manner, which is not limited in the present disclosure.
(15)贴附背膜。在示例性实施方式中，贴附背膜可以包括：通过贴附工艺在显示基板的背面贴附背膜2，如图14所示。(15) Attach the back film. In an exemplary embodiment, attaching the back film may include: attaching the back film 2 on the back side of the display substrate through an attaching process, as shown in FIG. 14 .
在示例性实施方式中，贴附工艺可以采用滚轮贴合方式，下工作台固定显示基板，上工作台固定背膜，下工作台1与上工作台翻转后对向盖合，通过滚压机构对背膜施加滚压作用力使其与显示基板彼此贴合成一体。In the exemplary embodiment, the attaching process can adopt the method of roller bonding, the lower worktable fixes the display substrate, the upper worktable fixes the back film, the lower worktable 1 and the upper worktable are turned over to cover each other, and the rolling mechanism A rolling force is applied to the back film to make it adhere to the display substrate into one body.
在示例性实施方式中，背膜可以包括有机材料的一个或多个膜层，以保护显示基板不被划伤。在示例性实施方式中，背膜的厚度可以约为30μm至100μm。例如，背膜的厚度可以约为38μm，或者75μm。In exemplary embodiments, the back film may include one or more film layers of organic materials to protect the display substrate from scratches. In an exemplary embodiment, the thickness of the back film may be about 30 μm to 100 μm. For example, the thickness of the backing film may be about 38 μm, or 75 μm.
在示例性实施方式中，背膜远离显示基板的一侧可以贴附有散热膜(SCF Tape)，本公开在此不做限定。In an exemplary embodiment, a heat dissipation film (SCF Tape) may be attached to the side of the back film away from the display substrate, which is not limited in the present disclosure.
(16)形成透光孔。在示例性实施方式中，形成透光孔可以包括：从背膜2远离显示基板的一侧进行激光照射，去除空白岛400区域的背膜2和基底10，形成透光孔500图案，如图15a至图15e所示。(16) A light-transmitting hole is formed. In an exemplary embodiment, forming the light-transmitting holes may include: irradiating a laser from the side of the back film 2 away from the display substrate, removing the back film 2 and the substrate 10 in the area of the blank islands 400 , and forming a pattern of light-transmitting holes 500 , as shown in FIG. 15a to 15e.
在示例性实施方式中，激光照射工艺可以采用纳秒级固体紫外激光器，波长为355nm左右，有更高的单光子能量，材料吸收率更高，产生的热影响更小，聚焦光斑可以仅有十几微米，能够实现更高的加工精度。脉冲紫外激光切割是利用光物理原理，当激光单光子能量低于材料化学键键能时，依靠聚焦光斑处非常高的能量密度，超过材料的气化阈值，从而瞬间气化材料，实现材料的去除。In an exemplary embodiment, the laser irradiation process can use a nanosecond solid-state ultraviolet laser with a wavelength of about 355 nm, which has higher single-photon energy, higher material absorption rate, and less thermal impact, and the focused spot can be only More than ten microns can achieve higher machining accuracy. Pulsed UV laser cutting uses the principle of photophysics. When the energy of the single photon of the laser is lower than the chemical bond energy of the material, the very high energy density at the focused spot exceeds the gasification threshold of the material, thereby instantly gasifying the material and realizing the removal of the material .
在示例性实施方式中，透光孔500的位置与空白岛400的位置相对应， 空白岛400在显示基板平面上的正投影包含透光孔500在显示基板平面上的正投影。In an exemplary embodiment, the positions of the light-transmitting holes 500 correspond to the positions of the blank islands 400 , and the orthographic projection of the blank islands 400 on the display substrate plane includes the orthographic projection of the light-transmitting holes 500 on the display substrate plane.
在示例性实施方式中，通过调整激光能量和照射时间可以控制透光孔500的深度H，进而调整透光显示区的透过率。例如，透光孔500的深度H可以小于或等于第一柔性层的厚度，如图15a所示。又如，透光孔500的深度H可以小于或等于第一柔性层和第一无机层的总厚度，如图15b所示。又如，透光孔500的深度H可以大于第一柔性层和第一无机层的总厚度，但小于第一柔性层、第一无机层和第二柔性层的总厚度，如图15c所示。又如，透光孔500的深度H可以等于第一柔性层、第一无机层和第二柔性层的总厚度，如图15d所示。又如，透光孔500的深度H可以大于第一柔性层、第一无机层和第二柔性层的总厚度，但小于第一柔性层、第一无机层、第二柔性层和第二无机层的总厚度，如图15e所示。In an exemplary embodiment, the depth H of the light-transmitting hole 500 can be controlled by adjusting the laser energy and irradiation time, thereby adjusting the transmittance of the light-transmitting display area. For example, the depth H of the light-transmitting hole 500 may be less than or equal to the thickness of the first flexible layer, as shown in FIG. 15a. For another example, the depth H of the light-transmitting hole 500 may be less than or equal to the total thickness of the first flexible layer and the first inorganic layer, as shown in FIG. 15b. For another example, the depth H of the light-transmitting hole 500 may be greater than the total thickness of the first flexible layer and the first inorganic layer, but less than the total thickness of the first flexible layer, the first inorganic layer and the second flexible layer, as shown in FIG. 15c . For another example, the depth H of the light-transmitting hole 500 may be equal to the total thickness of the first flexible layer, the first inorganic layer and the second flexible layer, as shown in FIG. 15d . For another example, the depth H of the light-transmitting hole 500 may be greater than the total thickness of the first flexible layer, the first inorganic layer, and the second flexible layer, but less than the first flexible layer, the first inorganic layer, the second flexible layer, and the second inorganic layer. The total thickness of the layers is shown in Figure 15e.
一种显示基板中，是在制备基底时就通过图案化工艺形成透光孔，然后形成相应的结构膜层。由于先形成的透光孔图案存在段差，而且基底的支撑性变差，因而降低了后续膜层的形成质量，降低了显示品质。In a display substrate, light-transmitting holes are formed through a patterning process when a substrate is prepared, and then a corresponding structural film layer is formed. Since the first-formed light-transmitting hole pattern has a step difference, and the supportability of the substrate is deteriorated, the formation quality of the subsequent film layer is lowered, and the display quality is lowered.
通过本公开示例性实施例显示基板的结构和制备过程可以看出，本公开通过先在玻璃载板上形成基底和相应膜层，然后在贴附背膜后形成透光孔，不仅保证了基底的平整性，而且基底能够提供良好的支撑性，提高了后续膜层的形成质量，提高了显示品质。It can be seen from the structure and preparation process of the substrate displayed by the exemplary embodiments of the present disclosure that by first forming the substrate and the corresponding film layer on the glass carrier, and then forming the light-transmitting hole after attaching the back film, the present disclosure not only ensures the substrate and the substrate can provide good support, which improves the formation quality of the subsequent film layers and improves the display quality.
本公开通过在透光显示区的空白岛区域形成透光孔，而保留透光显示区的像素岛区域的基底，不仅保证了透光显示区整体的高透光率，而且像素岛区域保留的基底为显示子像素的显示结构提供了有效的支撑，避免了显示结构变形，避免了影响封装效果，因而有效保证了显示画面品质和使用寿命。In the present disclosure, by forming light-transmitting holes in the blank island regions of the light-transmitting display area, while retaining the substrate of the pixel island areas of the light-transmitting display area, not only the high light transmittance of the entire light-transmitting display area is ensured, but also the pixel island area retains a high light transmittance. The substrate provides effective support for the display structure of the display sub-pixels, avoids the deformation of the display structure, and avoids affecting the packaging effect, thereby effectively ensuring the quality and service life of the display image.
本公开的制备方法能够很好地与现有制备工艺兼容，工艺实现简单，易于实施，生产效率高，具有易于工艺实现、生产成本低和良品率高等优点。The preparation method of the present disclosure can be well compatible with the existing preparation process, and has the advantages of simple process realization, easy implementation, high production efficiency, easy process realization, low production cost and high yield.
图16至图19为本公开示例性实施例显示基板的另一种制备过程。在示例性实施方式中，显示基板的另一种制备过程可以包括如下操作。16 to 19 show another fabrication process of the substrate according to an exemplary embodiment of the present disclosure. In an exemplary embodiment, another manufacturing process of the display substrate may include the following operations.
(21)形成剥离层图案。在示例性实施方式中，形成剥离层图案可以包 括：先在玻璃载板1上沉积剥离薄膜，通过图案化工艺对剥离薄膜进行图案化，在玻璃载板1上形成多个剥离层90图案，多个剥离层90图案设置在空白岛400区域，如图16所示。本次工艺后，像素岛300区域的剥离薄膜被刻蚀掉，暴露出玻璃载板1。在示例性实施方式中，剥离层90配置为在后续形成的基底上形成透光孔。(21) A peeling layer pattern is formed. In an exemplary embodiment, forming the peeling layer pattern may include: first depositing a peeling film on the glass carrier 1, patterning the peeling film through a patterning process, and forming a plurality of peeling layer 90 patterns on the glass carrier 1, A plurality of patterns of peeling layers 90 are arranged in the area of the blank island 400 , as shown in FIG. 16 . After this process, the peeling film in the pixel island 300 region is etched away, exposing the glass carrier 1 . In an exemplary embodiment, the release layer 90 is configured to form light-transmitting holes in a subsequently formed substrate.
在示例性实施方式中，剥离薄膜可以采用与玻璃载板和后续形成的柔性层粘结力比较大的材料，以保证在后续剥离玻璃载板时，剥离层能够随着玻璃载板一起剥离。例如，剥离薄膜可以采用非晶硅(A-Si)材料。In an exemplary embodiment, the release film can be made of a material with relatively strong adhesive force with the glass carrier plate and the subsequently formed flexible layer, so as to ensure that when the glass carrier plate is subsequently peeled off, the release layer can be peeled off together with the glass carrier plate. For example, an amorphous silicon (A-Si) material may be used for the release film.
在示例性实施方式中，剥离层的宽度可以小于或等于空白岛400的宽度，即空白岛400在玻璃载板上的正投影包含剥离层90在玻璃载板上的正投影。In an exemplary embodiment, the width of the peeling layer may be less than or equal to the width of the blank islands 400 , that is, the orthographic projection of the blank islands 400 on the glass carrier includes the orthographic projection of the peeling layer 90 on the glass carrier.
(22)形成基底图案。在示例性实施方式中，形成基底图案可以包括：在形成前述图案的玻璃载板1涂布第一柔性薄膜，固化成膜后形成覆盖剥离层90的第一柔性层10A，如图17所示。覆盖剥离层90的第一柔性层10A可以包括两部分，一部分第一柔性层10A设置在玻璃载板1上，作为基底10，另一部分第一柔性层10A设置在剥离层90上，作为剥离基底91，即位于剥离层90远离玻璃载板1一侧的区域作为剥离区域，剥离区域中的第一柔性层为剥离基底91。本次工艺后，像素岛300区域包括作为基底10的第一柔性层10A，空白岛400区域包括剥离层90和设置在剥离层90上的剥离基底91。(22) Forming a base pattern. In an exemplary embodiment, forming the base pattern may include: coating a first flexible film on the glass carrier plate 1 formed with the aforementioned pattern, and forming a first flexible layer 10A covering the release layer 90 after curing into a film, as shown in FIG. 17 . . The first flexible layer 10A covering the peeling layer 90 may include two parts, one part of the first flexible layer 10A is disposed on the glass carrier plate 1 as the substrate 10, and the other part of the first flexible layer 10A is disposed on the peeling layer 90 as the peeling substrate 91 , that is, the area on the side of the peeling layer 90 away from the glass carrier 1 is used as the peeling area, and the first flexible layer in the peeling area is the peeling substrate 91 . After this process, the pixel island 300 region includes the first flexible layer 10A serving as the substrate 10 , and the blank island 400 region includes the release layer 90 and the release substrate 91 disposed on the release layer 90 .
在示例性实施方式中，第一柔性层的材料可以采用聚酰亚胺(PI)或经表面处理的聚合物软膜等材料。In an exemplary embodiment, the material of the first flexible layer may be a material such as polyimide (PI) or a surface-treated soft polymer film.
在示例性实施方式中，剥离层的厚度可以根据第一柔性层的厚度(所形成的透光孔的深度)以及剥离层与玻璃载板和第一柔性层的粘结力等参数来设置。在示例性实施方式中，剥离层的厚度可以约为0.3μm至1.0μm。In an exemplary embodiment, the thickness of the release layer may be set according to parameters such as the thickness of the first flexible layer (the depth of the formed light-transmitting hole) and the adhesion of the release layer to the glass carrier and the first flexible layer. In an exemplary embodiment, the thickness of the release layer may be about 0.3 μm to 1.0 μm.
(23)在像素岛300区域形成显示结构层310，在空白岛400区域形成空白结构层410，显示结构层310可以包括依次形成的驱动电路层102、发光结构层103和封装层104，驱动电路层可以包括构成像素驱动电路的晶体管和存储电容，空白结构层410可以包括依次形成的复合绝缘层和无机封装层，如图18所示。(23) The display structure layer 310 is formed in the area of the pixel island 300, and the blank structure layer 410 is formed in the area of the blank island 400. The display structure layer 310 may include the driving circuit layer 102, the light emitting structure layer 103 and the encapsulation layer 104 formed in sequence. The driving circuit The layers may include transistors and storage capacitors constituting a pixel driving circuit, and the blank structure layer 410 may include a composite insulating layer and an inorganic encapsulation layer formed in sequence, as shown in FIG. 18 .
在示例性实施方式中，形成显示结构层和空白结构层的过程可以与前述实施例中步骤(12)至步骤(13)相同，这里不再赘述。In the exemplary embodiment, the process of forming the display structure layer and the blank structure layer may be the same as the steps (12) to (13) in the foregoing embodiment, which will not be repeated here.
(24)在剥离玻璃载板时形成透光孔图案。在示例性实施方式中，在剥离玻璃载板时形成透光孔图案可以包括：先利用激光透过玻璃载板1对基底10与剥离基底91的交界区域进行照射，通过激光照射切断交界区域内第一柔性层的链接键。随后，通过激光剥离工艺将玻璃载板1与基底10剥离。在剥离玻璃载板1时，由于剥离层90与玻璃载板1之间的粘结力、剥离层90与剥离基底91之间的粘结力较大，且大于基底10与剥离基底91之间的连接力，因而玻璃载板1带动剥离层90、剥离层90带动其上的剥离基底91一起剥离，在基底10上形成透光孔500，透光孔500的深度约为第一柔性层10A的厚度，如图19所示。(24) A pattern of light-transmitting holes is formed when the glass carrier plate is peeled off. In an exemplary embodiment, forming the light-transmitting hole pattern when peeling off the glass carrier plate may include: firstly irradiating the interface area between the substrate 10 and the peeling substrate 91 through the glass carrier plate 1 with laser light, and cutting off the interface area by laser irradiation Link keys of the first flexible layer. Subsequently, the glass carrier 1 is peeled off from the substrate 10 by a laser lift-off process. When peeling off the glass carrier 1 , due to the adhesive force between the peeling layer 90 and the glass carrier 1 , the adhesive force between the peeling layer 90 and the peeling substrate 91 is relatively large, and is greater than that between the substrate 10 and the peeling substrate 91 . Therefore, the glass carrier 1 drives the peeling layer 90 and the peeling layer 90 drives the peeling substrate 91 thereon to peel off together, forming a light-transmitting hole 500 on the substrate 10, and the depth of the light-transmitting hole 500 is about the first flexible layer 10A thickness, as shown in Figure 19.
在示例性实施方式中，聚酰亚氨PI的主链上含有酰亚胺环(-CO-NH-CO-)的一类聚合物，通过激光照射切断PI膜的链接键可以采用光化学原理，利用激光单光子能量达到或超过材料化学键键能，打断材料的主链。例如，在PI膜的化学键结构中，常态下C-C键和C-N键的键能分别为3.45eV和3.17eV，355nm紫外激光切割设备的单光子能量为3.49eV，高于常态下C-C键和C-N键的键能，可直接破坏材料的化学键。In an exemplary embodiment, the main chain of polyimide PI contains a class of polymers containing an imide ring (-CO-NH-CO-), and the photochemical principle can be used to cut the link bond of the PI film by laser irradiation, Using the laser single photon energy to reach or exceed the chemical bond energy of the material, the main chain of the material is interrupted. For example, in the chemical bond structure of the PI film, the bond energies of the C-C bond and the C-N bond are 3.45 eV and 3.17 eV respectively in the normal state, and the single-photon energy of the 355nm UV laser cutting device is 3.49 eV, which is higher than the C-C bond and the C-N bond in the normal state. The bond energy can directly destroy the chemical bond of the material.
在示例性实施方式中，在剥离玻璃载板形成透光孔后，可以采用涂覆或喷墨打印方式在透光孔中填充高透明材料，高透明材料可以采用聚对苯二甲酸乙二酯(PET)等。In an exemplary embodiment, after peeling off the glass carrier to form the light-transmitting holes, the light-transmitting holes can be filled with a highly transparent material by coating or inkjet printing, and the high-transparency material can be polyethylene terephthalate. (PET) etc.
在示例性实施方式中，显示基板的制备过程可以包括贴附背膜、切割等工艺，本公开在此不作限定。In an exemplary embodiment, the preparation process of the display substrate may include processes such as attaching a back film, cutting, etc., which are not limited herein by the present disclosure.
一种显示基板是在制备基底时就通过图案化工艺形成透光孔，然后形成相应的结构膜层。由于先形成的透光孔图案存在段差，而且基底的支撑性变差，因而降低了后续膜层的形成质量，降低了显示品质。本公开示例性实施例通过先在玻璃载板上形成剥离层，随后形成基底和相应膜层，然后在剥离工艺中利用剥离层形成透光孔，不仅保证了基底的平整性，而且基底能够提供良好的支撑性，提高了后续膜层的形成质量，提高了显示品质。In a display substrate, light-transmitting holes are formed through a patterning process when a substrate is prepared, and then a corresponding structural film layer is formed. Since the first-formed light-transmitting hole pattern has a step difference, and the supportability of the substrate is deteriorated, the formation quality of the subsequent film layer is lowered, and the display quality is lowered. The exemplary embodiment of the present disclosure not only ensures the flatness of the substrate, but also provides The good supportability improves the formation quality of the subsequent film layers and improves the display quality.
为了提高显示基板的膜层质量，一种显示基板采用先制备显示基板，然后采用激光工艺在基底上开孔的方式形成透光孔。由于通过激光工艺形成的透光孔存在边界不整齐、内壁不平整和透光孔深度差异大等现象，因而影响了传感器的光学性能。本公开示例性实施例利用剥离层形成透光孔，透光孔具有边界整齐、内壁平整和透光孔深度均一等特点，提高了透光孔的透光性能，有利于提高传感器的光学性能。In order to improve the film quality of the display substrate, a display substrate is prepared by first preparing the display substrate, and then using a laser process to open holes on the substrate to form light-transmitting holes. The optical performance of the sensor is affected due to the phenomenon of irregular boundaries, uneven inner walls and large differences in the depth of the light-transmitting holes formed by the laser process. Exemplary embodiments of the present disclosure use peeling layers to form light-transmitting holes, which have neat boundaries, smooth inner walls, and uniform depths, thereby improving the light-transmitting performance of the light-transmitting holes and improving the optical performance of the sensor.
图20至图23为本公开示例性实施例显示基板的又一种制备过程。在示例性实施方式中，显示基板的又一种制备过程可以包括如下操作。20 to 23 show yet another fabrication process of the substrate according to an exemplary embodiment of the present disclosure. In an exemplary embodiment, yet another preparation process of the display substrate may include the following operations.
(31)形成剥离层图案，如图20所示。在示例性实施方式中，形成剥离层图案的过程可以与前述实施例相同，剥离层的材料和结构可以与前述实施例相同。(31) A peeling layer pattern is formed, as shown in FIG. 20 . In the exemplary embodiment, the process of forming the pattern of the peeling layer may be the same as the previous embodiment, and the material and structure of the peeling layer may be the same as the previous embodiment.
(32)形成基底图案。在示例性实施方式中，形成基底图案可以包括：在形成前述图案的玻璃载板1涂布第一柔性薄膜，固化成膜后形成覆盖剥离层90的第一柔性层10A。随后，沉积第一无机薄膜，通过图案化工艺对第一无机薄膜进行图案化，形成第一无机层10B，第一无机层10B上形成有无机开口，无机开口位于空白岛400区域，无机开口在玻璃载板上的正投影包含剥离层90在玻璃载板上的正投影。随后，涂布第二柔性薄膜，固化成膜后形成第二柔性层10C，第二柔性层10C填充第一无机层10B上的无机开口，无机开口内的第二柔性层10C与第一柔性层10A直接接触。随后，沉积第二无机薄膜，形成第二无机层10D，完成基底10的制备，如图21所示。(32) Forming a base pattern. In an exemplary embodiment, forming the base pattern may include: coating a first flexible film on the glass carrier plate 1 formed with the aforementioned pattern, and forming a first flexible layer 10A covering the release layer 90 after curing into a film. Subsequently, a first inorganic thin film is deposited, and the first inorganic thin film is patterned by a patterning process to form a first inorganic layer 10B. An inorganic opening is formed on the first inorganic layer 10B, the inorganic opening is located in the area of the blank island 400 , and the inorganic opening is located in the area of the blank island 400 . The orthographic projection on the glass carrier includes the orthographic projection of the release layer 90 on the glass carrier. Then, a second flexible film is coated, cured into a film, and a second flexible layer 10C is formed. The second flexible layer 10C fills the inorganic openings on the first inorganic layer 10B, and the second flexible layer 10C and the first flexible layer in the inorganic openings 10A direct contact. Subsequently, a second inorganic thin film is deposited to form a second inorganic layer 10D, and the preparation of the substrate 10 is completed, as shown in FIG. 21 .
在示例性实施方式中，位于剥离层90上方第一柔性层10A和第二柔性层10C可以包括两部分，设置在玻璃载板1上的第一柔性层10A、第一无机层10B、第二柔性层10C和第二无机层10D作为基底10，设置在剥离层90上的第一柔性层10A和第二柔性层10C作为剥离基底91。In an exemplary embodiment, the first flexible layer 10A and the second flexible layer 10C located above the peeling layer 90 may include two parts, the first flexible layer 10A, the first inorganic layer 10B, the second flexible layer 10A disposed on the glass carrier 1 The flexible layer 10C and the second inorganic layer 10D serve as the substrate 10 , and the first flexible layer 10A and the second flexible layer 10C provided on the release layer 90 serve as the release substrate 91 .
在示例性实施方式中，第一柔性层和第二柔性层的材料可以采用聚酰亚胺(PI)或经表面处理的聚合物软膜等材料。In an exemplary embodiment, the material of the first flexible layer and the second flexible layer may be polyimide (PI) or a surface-treated soft polymer film or the like.
(33)在像素岛300区域形成显示结构层310，在空白岛400区域形成空白结构层410，如图22所示。在示例性实施方式中，相关过程可以与前述 实施例相同。(33) The display structure layer 310 is formed in the pixel island 300 region, and the blank structure layer 410 is formed in the blank island 400 region, as shown in FIG. 22 . In an exemplary embodiment, the related procedures may be the same as in the previous embodiment.
(34)在剥离玻璃载板时形成透光孔图案。在示例性实施方式中，在剥离玻璃载板时形成透光孔图案可以包括：先利用激光透过玻璃载板1对基底10与剥离基底91的交界区域进行照射，通过激光照射切断交界区域内第一柔性层和第二柔性层的链接键。随后，通过激光剥离工艺将玻璃载板1与基底10剥离。在剥离玻璃载板1时，由于剥离层90与玻璃载板1之间的粘结力、剥离层90与剥离基底91之间的粘结力较大，且大于基底10与剥离基底91之间的连接力，因而玻璃载板1带动剥离层90、剥离层90带动其上的剥离基底91一起剥离，在基底10上形成透光孔500，透光孔500的深度约为第一柔性层10A、第一无机层10B和第二柔性层10C的厚度之和，如图23所示。(34) A light-transmitting hole pattern is formed when the glass carrier plate is peeled off. In an exemplary embodiment, forming the light-transmitting hole pattern when peeling off the glass carrier plate may include: firstly irradiating the interface area between the substrate 10 and the peeling substrate 91 through the glass carrier plate 1 with laser light, and cutting off the interface area by laser irradiation Link keys of the first flexible layer and the second flexible layer. Subsequently, the glass carrier 1 is peeled off from the substrate 10 by a laser lift-off process. When peeling off the glass carrier 1 , due to the adhesive force between the peeling layer 90 and the glass carrier 1 , the adhesive force between the peeling layer 90 and the peeling substrate 91 is relatively large, and is greater than that between the substrate 10 and the peeling substrate 91 . Therefore, the glass carrier 1 drives the peeling layer 90 and the peeling layer 90 drives the peeling substrate 91 thereon to peel off together, forming a light-transmitting hole 500 on the substrate 10, and the depth of the light-transmitting hole 500 is about the first flexible layer 10A , the sum of the thicknesses of the first inorganic layer 10B and the second flexible layer 10C, as shown in FIG. 23 .
本公开示例性实施例通过先在玻璃载板上形成剥离层，随后形成基底和相应膜层，然后在剥离工艺中利用剥离层形成透光孔，不仅保证了基底的平整性，而且基底能够提供良好的支撑性，提高了后续膜层的形成质量，提高了显示品质。本公开示例性实施例利用剥离层形成透光孔，透光孔具有边界整齐、内壁平整和透光孔深度均一等特点，提高了透光孔的透光性能，有利于提高传感器的光学性能。The exemplary embodiment of the present disclosure not only ensures the flatness of the substrate, but also provides The good supportability improves the formation quality of the subsequent film layers and improves the display quality. Exemplary embodiments of the present disclosure use peeling layers to form light-transmitting holes, which have neat boundaries, smooth inner walls, and uniform depths, thereby improving the light-transmitting performance of the light-transmitting holes and improving the optical performance of the sensor.
需要说明的是，本公开示例性实施例所示结构及其制备过程仅仅是一种示例性说明，可以根据实际需要变更相应结构以及增加或减少构图工艺，本公开在此不做限定。It should be noted that the structures shown in the exemplary embodiments of the present disclosure and the preparation process thereof are merely exemplary descriptions, and corresponding structures may be changed and patterning processes may be increased or decreased according to actual needs, which are not limited in the present disclosure.
本公开示例性实施例还提供了一种显示基板的制备方法，所述显示基板包括正常分辨率显示区和低分辨显示区，所述低分辨显示区的分辨率小于所述正常分辨率显示区的分辨率；所述低分辨显示区包括透光显示区和位于所述透光显示区***的非透光显示区；所述透光显示区包括像素区和空白区，所述像素区包括配置为显示画面的多个像素岛，所述空白区包括配置为透过光线的多个空白岛；在示例性实施方式中，所述制备方法可以包括：Exemplary embodiments of the present disclosure also provide a method for manufacturing a display substrate, the display substrate includes a normal resolution display area and a low resolution display area, the low resolution display area having a smaller resolution than the normal resolution display area resolution; the low-resolution display area includes a light-transmitting display area and a non-light-transmitting display area located at the periphery of the light-transmitting display area; the light-transmitting display area includes a pixel area and a blank area, and the pixel area includes a configuration In order to display a plurality of pixel islands of a picture, the blank area includes a plurality of blank islands configured to transmit light; in an exemplary embodiment, the preparation method may include:
S1、在像素区形成设置在基底上的显示结构层，在空白区形成设置在基底上的空白结构层；所述显示结构层包括发光器件；S1, forming a display structure layer disposed on the substrate in the pixel area, and forming a blank structure layer disposed on the substrate in the blank area; the display structure layer includes a light-emitting device;
S2、在基底上形成透光孔；所述透光孔在显示基板平面上的正投影与所述发光器件在显示基板平面上的正投影没有重叠区域。S2, forming a light-transmitting hole on the substrate; the orthographic projection of the light-transmitting hole on the plane of the display substrate and the orthographic projection of the light-emitting device on the plane of the display substrate have no overlapping area.
在示例性实施方式中，所述多个像素岛形成多个显示列，所述多个空白岛形成多个空白列，所述显示列和所述空白列在行方向上交替设置；步骤S2可以包括：In an exemplary embodiment, the plurality of pixel islands form a plurality of display columns, the plurality of blank islands form a plurality of blank columns, and the display columns and the blank columns are alternately arranged in the row direction; step S2 may include: :
在基底上形成透光孔，包括：在基底上形成沿着列方向上延伸的多个条状透光孔，所述多个条状透光孔在行方向上间隔设置，所述空白列在显示基板平面上的正投影包含所述条状透光孔在显示基板平面上的正投影。Forming the light-transmitting holes on the substrate includes: forming a plurality of strip-shaped light-transmitting holes extending in the column direction on the substrate, the plurality of strip-shaped light-transmitting holes are arranged at intervals in the row direction, and the blank columns are displayed in the display The orthographic projection on the plane of the substrate includes the orthographic projection of the strip-shaped light-transmitting holes on the plane of the display substrate.
在示例性实施方式中，所述多个像素岛形成多个显示行，所述多个空白岛形成多个空白行，所述显示行和所述空白行在列方向上交替设置；步骤S2可以包括：In an exemplary embodiment, the plurality of pixel islands form a plurality of display rows, the plurality of blank islands form a plurality of blank rows, and the display rows and the blank rows are alternately arranged in the column direction; step S2 may include:
在基底上形成沿着行方向上延伸的多个条状透光孔，所述多个条状透光孔在列方向上间隔设置，所述空白行在显示基板平面上的正投影包含所述条状透光孔在显示基板平面上的正投影。A plurality of strip-shaped light-transmitting holes extending in the row direction are formed on the substrate, the strip-shaped light-transmitting holes are arranged at intervals in the column direction, and the orthographic projection of the blank row on the plane of the display substrate includes the stripes The orthographic projection of the light-transmitting hole on the plane of the display substrate.
在示例性实施方式中，所述多个像素岛在行方向上和列方向上交替设置，所述多个空白岛在行方向上和列方向上交替设置；步骤S2可以包括：In an exemplary embodiment, the plurality of pixel islands are alternately arranged in the row direction and the column direction, and the plurality of blank islands are alternately arranged in the row direction and the column direction; step S2 may include:
在基底上形成多个块状透光孔，所述多个块状透光孔在行方向上和列方向上间隔设置，所述空白岛在显示基板平面上的正投影包含所述块状透光孔在显示基板平面上的正投影。A plurality of block-shaped light-transmitting holes are formed on the substrate, and the plurality of block-shaped light-transmitting holes are arranged at intervals in the row direction and the column direction. The orthographic projection of the blank island on the plane of the display substrate includes the block-shaped light-transmitting holes Orthographic projection of the hole on the plane of the display substrate.
在示例性实施方式中，步骤S2可以包括：In an exemplary embodiment, step S2 may include:
将玻璃载板与基底剥离；Peel off the glass carrier from the substrate;
在基底远离所述显示结构层和空白结构层的一侧贴附背膜；Attach a back film on the side of the substrate away from the display structure layer and the blank structure layer;
采用激光在所述背膜远离所述基底的一侧进行照射，形成所述透光孔。The light-transmitting hole is formed by irradiating a side of the back film away from the substrate with a laser.
在示例性实施方式中，步骤S1中在空白区形成设置在基底上的空白结构层，可以包括：In an exemplary embodiment, forming a blank structure layer disposed on the substrate in the blank area in step S1 may include:
在玻璃载板上形成剥离层；forming a release layer on a glass carrier;
形成第一柔性层，位于所述剥离层远离所述玻璃载板一侧的第一柔性层作为剥离基底，其它区域的第一柔性层作为基底；forming a first flexible layer, the first flexible layer on the side of the peeling layer away from the glass carrier is used as a peeling substrate, and the first flexible layer in other areas is used as a substrate;
在所述基底上形成空白结构层；forming a blank structure layer on the substrate;
在示例性实施方式中，步骤S2可以包括：In an exemplary embodiment, step S2 may include:
采用激光透过所述玻璃载板对所述基底与剥离基底交界区域的第一柔性层进行照射；Irradiate the first flexible layer in the interface area between the substrate and the peeling substrate by using a laser through the glass carrier plate;
将玻璃载板与基底剥离，所述玻璃载板带动所述剥离层以及所述剥离基底一起剥离，在基底上形成透光孔。The glass carrier plate is peeled off from the substrate, the glass carrier plate drives the peeling layer and the peeling substrate to peel off together, and a light-transmitting hole is formed on the substrate.
在示例性实施方式中，步骤S1中在空白区形成设置在基底上的空白结构层，可以包括：In an exemplary embodiment, forming a blank structure layer disposed on the substrate in the blank area in step S1 may include:
在玻璃载板上形成剥离层；forming a release layer on a glass carrier;
依次形成第一柔性层、第一无机层和第二柔性层；所述第一无机层上设置有无机开口，所述无机开口在玻璃载板上的正投影包含所述剥离层在玻璃载板上的正投影，所述第二柔性层填充所述无机开口；位于所述剥离层远离所述玻璃载板一侧的第一柔性层和第二柔性层作为剥离基底，其它区域的第一柔性层、第一无机层和第二柔性层作为基底；A first flexible layer, a first inorganic layer and a second flexible layer are formed in sequence; inorganic openings are arranged on the first inorganic layer, and the orthographic projection of the inorganic openings on the glass carrier plate includes the peeling layer on the glass carrier plate The orthographic projection on the surface, the second flexible layer fills the inorganic opening; the first flexible layer and the second flexible layer on the side of the peeling layer away from the glass carrier serve as peeling substrates, and the first flexible layer in other areas layer, the first inorganic layer and the second flexible layer as a substrate;
在所述基底上形成空白结构层；forming a blank structure layer on the substrate;
在示例性实施方式中，步骤S2可以包括：In an exemplary embodiment, step S2 may include:
采用激光透过所述玻璃载板对所述基底与剥离基底交界区域的第一柔性层和第二柔性层进行照射；Irradiate the first flexible layer and the second flexible layer in the interface area between the substrate and the peeling substrate through the glass carrier by using laser light;
将玻璃载板与基底剥离，所述玻璃载板带动所述剥离层以及所述剥离基底一起剥离，在基底上形成透光孔。The glass carrier plate is peeled off from the substrate, the glass carrier plate drives the peeling layer and the peeling substrate to peel off together, and a light-transmitting hole is formed on the substrate.
在示例性实施方式中，各个膜层的结构、材料、相关参数及其详细制备过程已在前述实施例中详细说明，这里不再赘述。In the exemplary embodiment, the structure, material, related parameters and detailed preparation process of each film layer have been described in detail in the foregoing embodiments, and will not be repeated here.
本公开示例性实施例还提供了一种显示装置，包括前述实施例的显示基板。显示装置可以为：手机、平板电脑、电视机、显示器、笔记本电脑、数 码相框、导航仪等任何具有显示功能的产品或部件。Exemplary embodiments of the present disclosure also provide a display device including the display substrate of the foregoing embodiments. The display device can be: mobile phone, tablet computer, TV, monitor, notebook computer, digital photo frame, navigator, etc. any product or component with display function.
虽然本公开所揭露的实施方式如上，但所述的内容仅为便于理解本公开而采用的实施方式，并非用以限定本公开。任何本公开所属领域内的技术人员，在不脱离本公开所揭露的精神和范围的前提下，可以在实施的形式及细节上进行任何的修改与变化，但本发明的专利保护范围，仍须以所附的权利要求书所界定的范围为准。Although the embodiments disclosed in the present disclosure are as above, the described contents are only the embodiments adopted to facilitate the understanding of the present disclosure, and are not intended to limit the present disclosure. Any person skilled in the art to which this disclosure pertains, without departing from the spirit and scope disclosed in this disclosure, can make any modifications and changes in the form and details of the implementation, but the scope of patent protection of the present invention still needs to be The scope defined by the appended claims shall prevail.

Claims (17)

  1. 一种显示基板，包括正常分辨率显示区和低分辨显示区，所述低分辨显示区的分辨率小于所述正常分辨率显示区的分辨率；所述低分辨显示区包括透光显示区和位于所述透光显示区***的非透光显示区；所述透光显示区包括像素区和空白区，所述像素区包括配置为显示画面的多个像素岛，所述空白区包括配置为透过光线的多个空白岛；在垂直于显示基板的平面内，所述像素岛包括设置在基底朝向出射光一侧的显示结构层，所述显示结构层至少包括发光器件，所述空白岛包括设置在基底朝向出射光一侧的空白结构层以及设置在基底上的透光孔；所述透光孔在显示基板平面上的正投影与所述发光器件在显示基板平面上的正投影没有重叠区域。A display substrate, comprising a normal resolution display area and a low resolution display area, the resolution of the low resolution display area is smaller than the resolution of the normal resolution display area; the low resolution display area includes a light transmission display area and a low resolution display area. A non-light-transmitting display area located on the periphery of the light-transmitting display area; the light-transmitting display area includes a pixel area and a blank area, the pixel area includes a plurality of pixel islands configured to display images, and the blank area includes a A plurality of blank islands that transmit light; in a plane perpendicular to the display substrate, the pixel islands include a display structure layer disposed on the side of the substrate facing the light outgoing light, the display structure layer at least includes light-emitting devices, and the blank islands It includes a blank structure layer arranged on the side of the base facing the light outgoing light and a light-transmitting hole arranged on the base; the orthographic projection of the light-transmitting hole on the plane of the display substrate is not the same as the orthographic projection of the light-emitting device on the plane of the display substrate overlapping area.
  2. 根据权利要求1所述的显示基板，其中，所述空白岛在显示基板平面上的正投影包含所述透光孔在显示基板平面上的正投影。The display substrate according to claim 1, wherein the orthographic projection of the blank island on the plane of the display substrate comprises the orthographic projection of the light-transmitting hole on the plane of the display substrate.
  3. 根据权利要求1所述的显示基板，其中，所述多个像素岛形成多个显示列，所述多个空白岛形成多个空白列，所述显示列和所述空白列在行方向上交替设置；所述透光孔为沿着列方向上延伸的条状透光孔，所述多个条状透光孔在行方向上间隔设置，所述空白列在显示基板平面上的正投影包含所述条状透光孔在显示基板平面上的正投影。The display substrate of claim 1, wherein the plurality of pixel islands form a plurality of display columns, the plurality of blank islands form a plurality of blank columns, and the display columns and the blank columns are alternately arranged in a row direction ; the light-transmitting holes are strip-shaped light-transmitting holes extending along the column direction, the plurality of strip-shaped light-transmitting holes are arranged at intervals in the row direction, and the orthographic projection of the blank column on the plane of the display substrate includes the The orthographic projection of the strip-shaped light-transmitting holes on the plane of the display substrate.
  4. 根据权利要求1所述的显示基板，其中，所述多个像素岛形成多个显示行，所述多个空白岛形成多个空白行，所述显示行和所述空白行在列方向上交替设置；所述透光孔为沿着行方向上延伸的条状透光孔，所述多个条状透光孔在列方向上间隔设置，所述空白行在显示基板平面上的正投影包含所述条状透光孔在显示基板平面上的正投影。The display substrate of claim 1, wherein the plurality of pixel islands form a plurality of display rows, the plurality of blank islands form a plurality of blank rows, and the display rows and the blank rows alternate in a column direction The light-transmitting holes are strip-shaped light-transmitting holes extending in the row direction, the plurality of strip-shaped light-transmitting holes are arranged at intervals in the column direction, and the orthographic projection of the blank row on the plane of the display substrate includes all the strip-shaped light-transmitting holes. The orthographic projection of the strip-shaped light-transmitting holes on the plane of the display substrate.
  5. 根据权利要求1所述的显示基板，其中，所述多个像素岛在行方向上和列方向上交替设置，所述多个空白岛在行方向上和列方向上交替设置；所述透光孔为块状透光孔，所述多个块状透光孔在行方向上和列方向上间隔设置，所述空白岛在显示基板平面上的正投影包含所述块状透光孔在显示基板平面上的正投影。The display substrate according to claim 1, wherein the plurality of pixel islands are alternately arranged in the row direction and the column direction, and the plurality of blank islands are alternately arranged in the row direction and the column direction; the light-transmitting holes are Block-shaped light-transmitting holes, the plurality of block-shaped light-transmitting holes are arranged at intervals in the row direction and the column direction, and the orthographic projection of the blank island on the plane of the display substrate includes the block-shaped light-transmitting holes on the plane of the display substrate orthographic projection.
  6. 根据权利要求1至5任一项所述的显示基板，其中，所述像素岛包括 多个显示子像素，至少一个显示子像素的显示结构层包括设置在所述基底上的驱动电路层、设置在所述驱动电路层上的发光结构层以及设置在所述发光结构层上的封装层，所述驱动电路层包括构成像素驱动电路的晶体管和存储电容，所述发光结构层包括构成所述发光器件的阳极、有机发光层和阴极；所述空白岛包括多个空白子像素，至少一个空白子像素的空白结构层包括设置在所述基底上的复合绝缘层和设置在所述复合绝缘层上的无机封装层。The display substrate according to any one of claims 1 to 5, wherein the pixel island includes a plurality of display sub-pixels, and the display structure layer of at least one display sub-pixel includes a driving circuit layer disposed on the substrate, an A light-emitting structure layer on the driving circuit layer and an encapsulation layer disposed on the light-emitting structure layer, the driving circuit layer includes transistors and storage capacitors that constitute a pixel driving circuit, and the light-emitting structure layer includes a structure that constitutes the light-emitting The anode, the organic light-emitting layer and the cathode of the device; the blank island includes a plurality of blank sub-pixels, and the blank structure layer of at least one blank sub-pixel includes a composite insulating layer arranged on the substrate and a composite insulating layer arranged on the composite insulating layer the inorganic encapsulation layer.
  7. 根据权利要求1至5任一项所述的显示基板，其中，所述基底包括第一柔性层，所述透光孔设置在所述基底远离所述空白结构层一侧；所述透光孔的深度小于或等于所述第一柔性层的厚度。The display substrate according to any one of claims 1 to 5, wherein the base comprises a first flexible layer, and the light-transmitting holes are disposed on a side of the base away from the blank structure layer; the light-transmitting holes The depth is less than or equal to the thickness of the first flexible layer.
  8. 根据权利要求1至5任一项所述的显示基板，其中，所述基底包括叠设的第一柔性层、第一无机层和第二柔性层，所述透光孔设置在所述基底远离所述空白结构层一侧；所述透光孔的深度小于或等于所述第一柔性层的厚度，或者，所述透光孔的深度小于或等于所述第一柔性层和第一无机层的总厚度，或者，所述透光孔的深度小于或等于所述第一柔性层、第一无机层和第二柔性层的总厚度。The display substrate according to any one of claims 1 to 5, wherein the base comprises a stacked first flexible layer, a first inorganic layer and a second flexible layer, and the light-transmitting holes are disposed far away from the base one side of the blank structure layer; the depth of the light-transmitting hole is less than or equal to the thickness of the first flexible layer, or the depth of the light-transmitting hole is less than or equal to the first flexible layer and the first inorganic layer or, the depth of the light-transmitting hole is less than or equal to the total thickness of the first flexible layer, the first inorganic layer and the second flexible layer.
  9. 根据权利要求1至5任一项所述的显示基板，其中，所述基底包括叠设的第一柔性层、第一无机层、第二柔性层和第二无机层，所述透光孔设置在所述基底远离所述空白结构层一侧；所述透光孔的深度小于或等于所述第一柔性层的厚度，或者，所述透光孔的深度小于或等于所述第一柔性层和第一无机层的总厚度，或者，所述透光孔的深度小于或等于所述第一柔性层、第一无机层和第二柔性层的总厚度，或者，所述透光孔的深度小于或等于所述第一柔性层、第一无机层、第二柔性层和第二无机层的总厚度。The display substrate according to any one of claims 1 to 5, wherein the base comprises a stacked first flexible layer, a first inorganic layer, a second flexible layer and a second inorganic layer, and the light-transmitting holes are provided On the side of the substrate away from the blank structure layer; the depth of the light-transmitting hole is less than or equal to the thickness of the first flexible layer, or the depth of the light-transmitting hole is less than or equal to the first flexible layer and the total thickness of the first inorganic layer, or, the depth of the light-transmitting hole is less than or equal to the total thickness of the first flexible layer, the first inorganic layer and the second flexible layer, or, the depth of the light-transmitting hole Less than or equal to the total thickness of the first flexible layer, the first inorganic layer, the second flexible layer and the second inorganic layer.
  10. 一种显示装置，包括权利要求1至9任一项所述的显示基板。A display device, comprising the display substrate of any one of claims 1 to 9.
  11. 一种显示基板的制备方法，所述显示基板包括正常分辨率显示区和低分辨显示区，所述低分辨显示区的分辨率小于所述正常分辨率显示区的分辨率；所述低分辨显示区包括透光显示区和位于所述透光显示区***的非透光显示区；所述透光显示区包括像素区和空白区，所述像素区包括配置为显示画面的多个像素岛，所述空白区包括配置为透过光线的多个空白岛；所述制备方法包括：A preparation method of a display substrate, the display substrate comprises a normal resolution display area and a low resolution display area, the resolution of the low resolution display area is smaller than the resolution of the normal resolution display area; the low resolution display area the light-transmitting display area includes a light-transmitting display area and a non-light-transmitting display area located at the periphery of the light-transmitting display area; the light-transmitting display area includes a pixel area and a blank area, and the pixel area includes a plurality of pixel islands configured to display images, The blank area includes a plurality of blank islands configured to transmit light; the preparation method includes:
    在像素区形成设置在基底上的显示结构层，在空白区形成设置在基底上的空白结构层；所述显示结构层至少包括发光器件；A display structure layer disposed on the substrate is formed in the pixel area, and a blank structure layer disposed on the substrate is formed in the blank area; the display structure layer at least includes a light-emitting device;
    在基底上形成透光孔；所述透光孔在显示基板平面上的正投影与所述发光器件在显示基板平面上的正投影没有重叠区域。A light-transmitting hole is formed on the base; the orthographic projection of the light-transmitting hole on the plane of the display substrate and the orthographic projection of the light-emitting device on the plane of the display substrate have no overlapping area.
  12. 根据权利要求11所述的制备方法，其中，所述多个像素岛形成多个显示列，所述多个空白岛形成多个空白列，所述显示列和所述空白列在行方向上交替设置；The manufacturing method according to claim 11, wherein the plurality of pixel islands form a plurality of display columns, the plurality of blank islands form a plurality of blank columns, and the display columns and the blank columns are alternately arranged in a row direction ;
    在基底上形成透光孔，包括：在基底上形成沿着列方向上延伸的多个条状透光孔，所述多个条状透光孔在行方向上间隔设置，所述空白列在显示基板平面上的正投影包含所述条状透光孔在显示基板平面上的正投影。Forming the light-transmitting holes on the substrate includes: forming a plurality of strip-shaped light-transmitting holes extending in the column direction on the substrate, the plurality of strip-shaped light-transmitting holes are arranged at intervals in the row direction, and the blank columns are displayed in the display The orthographic projection on the plane of the substrate includes the orthographic projection of the strip-shaped light-transmitting holes on the plane of the display substrate.
  13. 根据权利要求11所述的制备方法，其中，所述多个像素岛形成多个显示行，所述多个空白岛形成多个空白行，所述显示行和所述空白行在列方向上交替设置；The manufacturing method of claim 11, wherein the plurality of pixel islands form a plurality of display rows, the plurality of blank islands form a plurality of blank rows, and the display rows and the blank rows alternate in a column direction set up;
    在基底上形成透光孔，包括：在基底上形成沿着行方向上延伸的多个条状透光孔，所述多个条状透光孔在列方向上间隔设置，所述空白行在显示基板平面上的正投影包含所述条状透光孔在显示基板平面上的正投影。Forming light-transmitting holes on the substrate includes: forming a plurality of strip-shaped light-transmitting holes extending in the row direction on the substrate, the plurality of strip-shaped light-transmitting holes are arranged at intervals in the column direction, and the blank rows are displayed in the display The orthographic projection on the plane of the substrate includes the orthographic projection of the strip-shaped light-transmitting holes on the plane of the display substrate.
  14. 根据权利要求11所述的制备方法，其中，所述多个像素岛在行方向上和列方向上交替设置，所述多个空白岛在行方向上和列方向上交替设置；The preparation method according to claim 11, wherein the plurality of pixel islands are alternately arranged in a row direction and a column direction, and the plurality of blank islands are alternately arranged in a row direction and a column direction;
    在基底上形成透光孔，包括：在基底上形成多个块状透光孔，所述多个块状透光孔在行方向上和列方向上间隔设置，所述空白岛在显示基板平面上的正投影包含所述块状透光孔在显示基板平面上的正投影。Forming light-transmitting holes on the substrate includes: forming a plurality of block-shaped light-transmitting holes on the substrate, the plurality of block-shaped light-transmitting holes are spaced apart in the row direction and the column direction, and the blank islands are on the plane of the display substrate The orthographic projection includes the orthographic projection of the block-shaped light-transmitting hole on the plane of the display substrate.
  15. 根据权利要求11至14任一项所述的制备方法，其中，在基底上形成透光孔，包括：The preparation method according to any one of claims 11 to 14, wherein forming light-transmitting holes on the substrate comprises:
    将玻璃载板与基底剥离；Peel off the glass carrier from the substrate;
    在基底远离所述显示结构层和空白结构层的一侧贴附背膜；Attach a back film on the side of the substrate away from the display structure layer and the blank structure layer;
    采用激光在所述背膜远离所述基底的一侧进行照射，形成所述透光孔。The light-transmitting hole is formed by irradiating a side of the back film away from the substrate with a laser.
  16. 根据权利要求11至14任一项所述的制备方法，其中，The preparation method according to any one of claims 11 to 14, wherein,
    在空白区形成设置在基底上的空白结构层，包括：A blank structure layer disposed on the substrate is formed in the blank area, including:
    在玻璃载板上形成剥离层；forming a release layer on a glass carrier;
    形成覆盖所述剥离层的第一柔性层，位于所述剥离层远离所述玻璃载板一侧的第一柔性层作为剥离基底，其它区域的第一柔性层作为基底；forming a first flexible layer covering the peeling layer, the first flexible layer on the side of the peeling layer away from the glass carrier is used as a peeling substrate, and the first flexible layer in other areas is used as a substrate;
    在所述基底上形成空白结构层；forming a blank structure layer on the substrate;
    在基底上形成透光孔，包括：Form light-transmitting holes on the substrate, including:
    采用激光透过所述玻璃载板对所述基底与剥离基底交界区域的第一柔性层进行照射；Irradiate the first flexible layer in the interface area between the substrate and the peeling substrate by using a laser through the glass carrier plate;
    将玻璃载板与基底剥离，所述玻璃载板带动所述剥离层以及所述剥离基底一起剥离，在基底上形成透光孔。The glass carrier plate is peeled off from the substrate, the glass carrier plate drives the peeling layer and the peeling substrate to peel off together, and a light-transmitting hole is formed on the substrate.
  17. 根据权利要求11至14任一项所述的制备方法，其中，The preparation method according to any one of claims 11 to 14, wherein,
    在空白区形成设置在基底上的空白结构层，包括：A blank structure layer disposed on the substrate is formed in the blank area, including:
    在玻璃载板上形成剥离层；forming a release layer on a glass carrier;
    依次形成第一柔性层、第一无机层和第二柔性层；所述第一无机层上设置有无机开口，所述无机开口在玻璃载板上的正投影包含所述剥离层在玻璃载板上的正投影，所述第二柔性层填充所述无机开口；位于所述剥离层远离所述玻璃载板一侧的第一柔性层和第二柔性层作为剥离基底，其它区域的第一柔性层、第一无机层和第二柔性层作为基底；A first flexible layer, a first inorganic layer and a second flexible layer are formed in sequence; inorganic openings are arranged on the first inorganic layer, and the orthographic projection of the inorganic openings on the glass carrier plate includes the peeling layer on the glass carrier plate The orthographic projection on the surface, the second flexible layer fills the inorganic opening; the first flexible layer and the second flexible layer on the side of the peeling layer away from the glass carrier serve as peeling substrates, and the first flexible layer in other areas layer, the first inorganic layer and the second flexible layer as a substrate;
    在所述基底上形成空白结构层；forming a blank structure layer on the substrate;
    在基底上形成透光孔，包括：Form light-transmitting holes on the substrate, including:
    采用激光透过所述玻璃载板对所述基底与剥离基底交界区域的第一柔性层和第二柔性层进行照射；Irradiate the first flexible layer and the second flexible layer in the interface area between the substrate and the peeling substrate through the glass carrier by using laser light;
    将玻璃载板与基底剥离，所述玻璃载板带动所述剥离层以及所述剥离基底一起剥离，在基底上形成透光孔。The glass carrier plate is peeled off from the substrate, the glass carrier plate drives the peeling layer and the peeling substrate to peel off together, and a light-transmitting hole is formed on the substrate.
PCT/CN2021/080562 2021-03-12 2021-03-12 Display substrate, preparation method therefor, and display device WO2022188168A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2021/080562 WO2022188168A1 (en) 2021-03-12 2021-03-12 Display substrate, preparation method therefor, and display device
CN202180000486.7A CN115606329A (en) 2021-03-12 2021-03-12 Display substrate, preparation method thereof and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2021/080562 WO2022188168A1 (en) 2021-03-12 2021-03-12 Display substrate, preparation method therefor, and display device

Publications (1)

Publication Number Publication Date
WO2022188168A1 true WO2022188168A1 (en) 2022-09-15

Family

ID=83226241

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/080562 WO2022188168A1 (en) 2021-03-12 2021-03-12 Display substrate, preparation method therefor, and display device

Country Status (2)

Country Link
CN (1) CN115606329A (en)
WO (1) WO2022188168A1 (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009104417A1 (en) * 2008-02-22 2009-08-27 パナソニック株式会社 Image pickup device
CN109037270A (en) * 2018-07-26 2018-12-18 武汉天马微电子有限公司 A kind of display panel and display device
CN110504289A (en) * 2019-08-27 2019-11-26 武汉天马微电子有限公司 A kind of display panel and display device
CN110797381A (en) * 2019-11-07 2020-02-14 武汉天马微电子有限公司 Display panel and display device
US10777521B2 (en) * 2015-08-10 2020-09-15 X Display Company Technology Limited Printable component structure with electrical contact
CN111682052A (en) * 2020-06-23 2020-09-18 京东方科技集团股份有限公司 Display substrate, preparation method thereof, display panel and display device
CN111900259A (en) * 2020-06-15 2020-11-06 昆山国显光电有限公司 Display panel, display device and preparation method of display panel
CN111916486A (en) * 2020-08-27 2020-11-10 武汉天马微电子有限公司 Display panel and display device
CN112309990A (en) * 2020-10-30 2021-02-02 武汉华星光电半导体显示技术有限公司 Display panel and preparation method thereof

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009104417A1 (en) * 2008-02-22 2009-08-27 パナソニック株式会社 Image pickup device
US10777521B2 (en) * 2015-08-10 2020-09-15 X Display Company Technology Limited Printable component structure with electrical contact
CN109037270A (en) * 2018-07-26 2018-12-18 武汉天马微电子有限公司 A kind of display panel and display device
CN110504289A (en) * 2019-08-27 2019-11-26 武汉天马微电子有限公司 A kind of display panel and display device
CN110797381A (en) * 2019-11-07 2020-02-14 武汉天马微电子有限公司 Display panel and display device
CN111900259A (en) * 2020-06-15 2020-11-06 昆山国显光电有限公司 Display panel, display device and preparation method of display panel
CN111682052A (en) * 2020-06-23 2020-09-18 京东方科技集团股份有限公司 Display substrate, preparation method thereof, display panel and display device
CN111916486A (en) * 2020-08-27 2020-11-10 武汉天马微电子有限公司 Display panel and display device
CN112309990A (en) * 2020-10-30 2021-02-02 武汉华星光电半导体显示技术有限公司 Display panel and preparation method thereof

Also Published As

Publication number Publication date
CN115606329A (en) 2023-01-13

Similar Documents

Publication Publication Date Title
US20190165065A1 (en) Organic light-emitting display device
US11569488B2 (en) Display device including light absorption layer and low potential electrode in pad region and method of fabricating the same
KR101872963B1 (en) Method of fabricating organic light emitting device
TWI766481B (en) Organic light emitting diode display device including touch sensor and manufacturing method of same
WO2022166306A1 (en) Display substrate and manufacturing method therefor, and display device
TW202125810A (en) Display device and manufacturing method of same
KR101476433B1 (en) Organic Light Emitting Display Device And Method For Manufacturing Of The Same
WO2021189484A9 (en) Display substrate and manufacturing method therefor, and display device
WO2022188168A1 (en) Display substrate, preparation method therefor, and display device
WO2022088978A1 (en) Display substrate, preparation method therefor, and display apparatus
WO2022266887A1 (en) Display substrate and preparation method therefor, and display apparatus
WO2022178827A1 (en) Display substrate and preparation method therefor, and display device
WO2022241747A1 (en) Display substrate and preparation method therefor, and display apparatus
WO2022204918A1 (en) Display substrate and preparation method therefor, and display apparatus
KR20160042679A (en) Organic electoluminescent emitted diode device
CN114420871A (en) Display panel, preparation method thereof and display device
US10978528B2 (en) Organic light emitting display device
WO2022193316A1 (en) Display substrate and preparation method therefor, and display apparatus
WO2022155944A1 (en) Display substrate, preparation method therefor, and display apparatus
WO2022252230A1 (en) Display substrate and display device
WO2023206462A1 (en) Display substrate, manufacturing method therefor, and display device
WO2023159511A1 (en) Display substrate and manufacturing method therefor, and display device
WO2022267556A1 (en) Display substrate and preparation method therefor, and display apparatus
WO2024036574A1 (en) Display substrate and manufacturing method therefor, and display apparatus
WO2023225887A1 (en) Display substrate and preparation method therefor, and electronic apparatus

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21929641

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 19.01.2024)