WO2022185611A1 - 粘着シート - Google Patents

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Publication number
WO2022185611A1
WO2022185611A1 PCT/JP2021/040263 JP2021040263W WO2022185611A1 WO 2022185611 A1 WO2022185611 A1 WO 2022185611A1 JP 2021040263 W JP2021040263 W JP 2021040263W WO 2022185611 A1 WO2022185611 A1 WO 2022185611A1
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WO
WIPO (PCT)
Prior art keywords
pressure
sensitive adhesive
liner
adhesive sheet
adhesive layer
Prior art date
Application number
PCT/JP2021/040263
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English (en)
French (fr)
Japanese (ja)
Inventor
高正 平山
昭徳 西尾
Original Assignee
日東電工株式会社
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Publication date
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to CN202180095230.9A priority Critical patent/CN116917432A/zh
Priority to KR1020237029743A priority patent/KR20230141837A/ko
Priority to JP2023503373A priority patent/JPWO2022185611A1/ja
Publication of WO2022185611A1 publication Critical patent/WO2022185611A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

Definitions

  • the present invention relates to an adhesive sheet.
  • the semiconductor chips are often sealed with resin in order to prevent damage to the semiconductor chips and expand metal wiring.
  • the semiconductor chip is sometimes resin-sealed on the adhesive sheet from the viewpoint of workability.
  • a plurality of semiconductor chips are placed on an adhesive sheet as a predetermined temporary fixing material, and the semiconductor chips are collectively sealed on the adhesive sheet.
  • a sealing resin precursor having fluidity is applied to cover the semiconductor chip, and then the fluidity of the precursor is reduced to seal the semiconductor chip.
  • the fluidity of the precursor at this time is one factor that affects sealing quality (particularly working time and sealing uniformity).
  • the fluidity of the precursor depends on the affinity between the surface to be coated with the sealing resin (that is, the surface of the adhesive layer of the adhesive sheet) and the sealing resin.
  • the fluidity of the precursor may not be constant.
  • the present invention has been made to solve the above-mentioned conventional problems, and its object is to provide an adhesive layer on the surface of which a sealing resin for sealing a semiconductor chip or the like can flow with little variation. To provide an adhesive sheet.
  • the pressure-sensitive adhesive sheet of the present invention is a pressure-sensitive adhesive sheet comprising a base material and a pressure-sensitive adhesive layer disposed on at least one side of the base material, wherein the pressure-sensitive adhesive layer adheres to polyethylene terephthalate at 23°C.
  • the force is 0.1 N/20 mm to 8 N/20 mm
  • the adhesive layer is composed of an adhesive containing a base polymer
  • the sp value of the base polymer is 7 (cal/cm 3 ) 1/2 to 10 (cal/cm 3 ) 1/2
  • the water content of the adhesive sheet is 0.05% by weight to 6% by weight.
  • the substrate is a resin sheet composed of a resin having a glass transition temperature (Tg) of 60°C to 450°C.
  • the base material is composed of an aromatic polyimide resin.
  • the pressure-sensitive adhesive layer has a thickness of 2 ⁇ m to 15 ⁇ m.
  • the adhesive layer has a gel fraction of 60% to 100%.
  • the base polymer is an acrylic polymer, the acrylic polymer contains a structural unit derived from a hydroxyl group-containing monomer, and the content of the structural unit derived from the hydroxyl group-containing monomer is the acrylic polymer It is 0.1 to 20 parts by weight per 100 parts by weight of all structural units constituting the polymer.
  • the pressure-sensitive adhesive sheet further comprises a second pressure-sensitive adhesive layer on the opposite side of the base material to the pressure-sensitive adhesive layer.
  • the pressure-sensitive adhesive sheet is used as a sheet for temporarily fixing a semiconductor chip when manufacturing a CSP (Chip Size/Scale Package) or a WLP (Wafer Level Package).
  • the semiconductor chip is sealed with a sealing resin, and the processing temperature during the resin sealing is 100° C. or higher. According to another aspect of the present invention, there is provided a method for producing the pressure-sensitive adhesive sheet.
  • This manufacturing method comprises the steps of: forming a coating layer of a composition containing an adhesive on a substrate; placing a liner on the surface of the coating layer to form a laminate; Humidification heat time (for example, 2 hours to 7 days), and a heat humidification step in an environment where temperature and humidity are controlled, and the product of the heat humidification time, temperature and humidity in the heat humidification step is 100 ⁇ 300000°C.RH%.h.
  • a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer on the surface of which a sealing resin for sealing semiconductor chips or the like can flow with little variation.
  • FIG. 1 is a schematic cross-sectional view of an adhesive sheet according to one embodiment of the present invention
  • FIG. 4 is a schematic cross-sectional view of a pressure-sensitive adhesive sheet according to another embodiment of the invention
  • FIG. 1 is a schematic cross-sectional view of a liner-attached double-sided pressure-sensitive adhesive sheet according to one embodiment of the present invention
  • FIG. 1 is a schematic cross-sectional view of an adhesive sheet according to one embodiment of the present invention.
  • the adhesive sheet 100 includes a substrate 10 and an adhesive layer (first adhesive layer) 20 arranged on at least one side of the substrate 10 .
  • the pressure-sensitive adhesive sheet of the present invention has a pressure-sensitive adhesive strength of 0.1 N/20 mm to 8 N/20 mm at 23° C. when the pressure-sensitive adhesive layer is adhered to polyethylene terephthalate.
  • the pressure-sensitive adhesive layer is composed of a pressure-sensitive adhesive containing a base polymer, and the base polymer has an sp value of 7 (cal/cm 3 ) 1/2 to 10 (cal/cm 3 ) 1/2 . Further, the pressure-sensitive adhesive sheet has a moisture content of 0.05% to 6% by weight.
  • the adhesive sheet of the present invention can be suitably used as a temporary fixing material when sealing semiconductor chips with resin. More specifically, the pressure-sensitive adhesive sheet of the present invention is obtained by arranging semiconductor chips on the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet, covering the semiconductor chips with a sealing resin (usually epoxy resin) precursor, and It can be used as a temporary fixing material for the semiconductor chip when the semiconductor chip is resin-sealed by curing the precursor. After the semiconductor chip is resin-encapsulated, in the case of predetermined post-processes (for example, back grinding of the encapsulation resin, pattern formation, bump formation, chip formation (cutting)), the adhesive sheet is used to separate the encapsulation resin and the semiconductor. It can be peeled off from the structure composed of the chip.
  • the epoxy equivalent of the sealing resin is, for example, 50 g/eq to 500 g/eq.
  • the sealing resin Precursors can preferably flow.
  • the time required for the sealing process can be shortened in the mass production process of semiconductor chips, and resin sealing with excellent uniformity can be stably performed.
  • the pressure-sensitive adhesive sheet of the present invention is characterized in that it has an excellent balance of adhesiveness and peelability (that is, excellent temporary fixability) and can contribute to improvement in sealing quality.
  • the pressure-sensitive adhesive sheet of the present invention is particularly useful in that it can contribute to improvement in sealing quality even at high temperatures.
  • FIG. 2 is a schematic cross-sectional view of an adhesive sheet according to another embodiment of the invention.
  • the pressure-sensitive adhesive sheet 200 is a double-sided pressure-sensitive adhesive sheet, and further includes a second pressure-sensitive adhesive layer 30 on the opposite side of the base material 10 to the pressure-sensitive adhesive layer 20 . That is, the adhesive sheet 200 includes the adhesive layer 20, the base material 10, and the second adhesive layer 30 in this order.
  • the adhesive sheet 200 can be used with good fixability by sticking the second adhesive layer 30 side to the pedestal when resin sealing is performed on the pedestal. can be done.
  • the second adhesive layer contains thermally expandable microspheres.
  • the heat-expandable microspheres can expand at a given temperature.
  • the pressure-sensitive adhesive layer containing such heat-expandable microspheres is heated to a predetermined temperature or higher, the heat-expandable microspheres expand and irregularities occur on the pressure-sensitive adhesive surface (that is, the surface of the second pressure-sensitive adhesive layer). Adhesion is reduced or lost.
  • the necessary pressure-sensitive adhesiveness is exhibited when the pressure-sensitive adhesive sheet is fixed (for example, when fixed to a pedestal), and when the pressure-sensitive adhesive sheet is peeled off ( For example, when peeling from the pedestal), the adhesive strength is reduced or lost by heating, and good peelability is exhibited.
  • the pressure-sensitive adhesive sheet of the present invention has a pressure-sensitive adhesive strength at 23° C. when the pressure-sensitive adhesive layer is adhered to polyethylene terephthalate, as described above, from 0.1 N/20 mm to 8 N/20 mm, preferably from 0.2 N/20 mm. 7.5 N/20 mm, more preferably 0.5 N/20 mm to 6 N/20 mm, still more preferably 0.8 N/20 mm to 5 N/20 mm, most preferably 0.8 N/20 mm to 3 N/20 mm is. Within such a range, it is possible to obtain a pressure-sensitive adhesive sheet that can preferably fix an adherend (for example, a semiconductor chip) and leaves little adhesive residue when peeled off. In this specification, the “adhesive strength at 23° C.
  • the moisture content of the adhesive sheet is 0.05% to 6% by weight.
  • the moisture content of the adhesive sheet is preferably 0.1% to 5% by weight, more preferably 0.5% to 4% by weight, and still more preferably 1% to 3% by weight.
  • the affinity with the encapsulating resin precursor is appropriately adjusted, and a pressure-sensitive adhesive layer that can contribute to the improvement of resin encapsulation quality can be formed. Also, deterioration of the sealing resin can be prevented.
  • the water content can be measured by Karl Fischer titration.
  • the moisture content of the PSA sheet can be adjusted by any appropriate method. For example, it can be adjusted by adjusting the water content of the adhesive during the formation of the adhesive layer (during the coating of the adhesive), the composition of the base polymer contained in the adhesive, and the implementation of the moistening and heating process (described later).
  • the thickness of the adhesive sheet of the present invention is preferably 3 ⁇ m to 300 ⁇ m, more preferably 5 ⁇ m to 150 ⁇ m, still more preferably 10 ⁇ m to 100 ⁇ m.
  • Adhesive layer The adhesive layer is composed of an adhesive containing a base polymer.
  • a “base polymer” means the main component of the polymer contained in an adhesive.
  • main component refers to a component contained in an amount exceeding 50% by weight unless otherwise specified.
  • the thickness of the pressure-sensitive adhesive layer is preferably 1 ⁇ m to 50 ⁇ m, more preferably 3 ⁇ m to 30 ⁇ m, still more preferably 5 ⁇ m to 20 ⁇ m. Within such a range, it is possible to obtain a pressure-sensitive adhesive sheet that is difficult for the semiconductor chip to be embedded in the resin even when pressurized during the sealing process.
  • the pressure-sensitive adhesive layer has a thickness of 2 ⁇ m to 15 ⁇ m. Within such a range, the diffusion of moisture from the pressure-sensitive adhesive layer can be appropriately adjusted, and the fluidity of the sealing resin precursor can be made preferable.
  • the sp value of the base polymer is 7 (cal/cm 3 ) 1/2 to 10 (cal/cm 3 ) 1/2
  • the sp value of the base polymer is preferably 7.5 ( cal/cm 3 ) 1/2 to 9.5 (cal/cm 3 ) 1/2 , more preferably 8 (cal/cm 3 ) 1/2 to 9 (cal/cm 3 ) 1/2 .
  • a pressure-sensitive adhesive layer whose affinity for the encapsulating resin is appropriately adjusted and which can contribute to the improvement of resin encapsulation quality.
  • the sp value is determined by the method of Fedors (Hideki Yamamoto, "Sp Value: Fundamentals, Applications and Calculation Methods", Joho Kyoukai Publishing Co., Ltd., published on April 3, 2006, pp. 66-67). Specifically, the sp value is the evaporation energy ⁇ e (cal) of each atom or atomic group forming the polymer at 25° C. and the molar volume ⁇ V (cm 3 ) of each atom or atomic group forming the polymer at 25° C. is calculated by the following formula.
  • the water contact angle of the pressure-sensitive adhesive layer is preferably 70° to 120°, more preferably 80° to 110°, still more preferably 90° to 105°. Within such a range, the affinity with the encapsulating resin precursor is appropriately adjusted, and a pressure-sensitive adhesive layer that can contribute to the improvement of resin encapsulation quality can be formed.
  • the contact angle of water is determined by dropping 2 ⁇ l of pure water onto the adhesive layer surface in a 23° C./50% RH environment using a contact angle meter (for example, Kyowa Interface Co., Ltd., trade name “CX-A”). , the measurement of the contact angle of the droplet five seconds after the droplet is dropped is repeated five times, and the average value can be obtained.
  • the gel fraction of the adhesive layer is preferably 60% to 100%, more preferably 70% to 99%, still more preferably 75% to 98%, and particularly preferably 80% to 95%. is. Within such a range, the diffusion of moisture from the pressure-sensitive adhesive layer can be appropriately adjusted, and the fluidity of the sealing resin precursor can be made preferable. In addition, it is possible to form a pressure-sensitive adhesive layer that has appropriate adhesiveness and does not leave adhesive residue, etc., when peeled off, and does not easily stain the adherend. A method for measuring the gel fraction will be described later.
  • the elastic modulus of the pressure-sensitive adhesive layer measured by the nanoindentation method at 25°C is preferably less than 100 MPa, more preferably 0.1 MPa to 50 MPa, and still more preferably 0.1 MPa to 10 MPa. If it is such a range, the adhesive sheet which has suitable adhesive force can be obtained.
  • the elastic modulus by the nanoindentation method is obtained by continuously measuring the load applied to the indenter and the indentation depth during loading and unloading when the indenter is pushed into the sample. It refers to the elastic modulus obtained from the curve.
  • the elastic modulus by the nanoindentation method refers to the elastic modulus measured as described above under the measurement conditions of load: 1 mN, loading/unloading rate: 0.1 mN/s, and holding time: 1 s.
  • the adhesive constituting the adhesive layer is an acrylic adhesive.
  • the acrylic pressure-sensitive adhesive for example, an acrylic polymer (homopolymer or copolymer) using one or more of (meth)acrylic acid alkyl esters as a monomer component is used as a prepolymer, and the prepolymer Examples include acrylic pressure-sensitive adhesives using a crosslinked product as a base polymer.
  • the "base polymer" contained in the acrylic pressure-sensitive adhesive in the pressure-sensitive adhesive layer means a polymer formed by cross-linking a prepolymer (uncross-linked polymer).
  • the base polymer has a crosslinked structure of an acrylic polymer and an epoxy crosslinking agent.
  • (meth)acrylic acid alkyl esters include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, ( isobutyl (meth)acrylate, s-butyl (meth)acrylate, t-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, (meth)acrylic acid Octyl, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, (meth)acrylic undecyl acid, dodecyl (meth)acrylate,
  • (meth)acrylic acid alkyl esters having a linear or branched alkyl group having 4 to 20 carbon atoms (more preferably 6 to 20, particularly preferably 8 to 18 carbon atoms) are more preferable.
  • 2-ethylhexyl (meth)acrylate is 2-ethylhexyl (meth)acrylate.
  • (meth)acryl means acryl and/or methacryl.
  • the acrylic polymer (prepolymer), for the purpose of modifying cohesive strength, heat resistance, crosslinkability, etc., if necessary, other monomer components copolymerizable with the (meth)acrylic acid alkyl ester may include units corresponding to Examples of such monomer components include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; maleic anhydride and icotanic anhydride; Acid anhydride monomers such as; hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, hydroxyhexyl (meth)acrylate, hydroxyoctyl (meth)acrylate, (meth)acrylate Hydroxyl group-containing monomers such as hydroxydecyl acrylate, hydroxyllauryl (meth)
  • cyanoacrylate monomers such as acrylonitrile and methacrylonitrile; epoxy group-containing acrylic monomers such as glycidyl (meth)acrylate; polyethylene glycol (meth)acrylate, polypropylene glycol (meth)acrylate, (meth)acrylic acid Glycol-based acrylic ester monomers such as methoxyethylene glycol and methoxypolypropylene glycol (meth)acrylate; heterocycles such as tetrahydrofurfuryl (meth)acrylate, fluorine (meth)acrylate, and silicone (meth)acrylate, halogen atoms, silicon atoms Acrylic acid ester-based monomers having, etc.; hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol Polyfunctional mono
  • the acrylic polymer (prepolymer) further contains a structural unit derived from a hydroxyl group-containing monomer.
  • the content of the structural unit derived from the hydroxyl group-containing monomer is preferably 0.1 to 20 parts by weight, more preferably 0.1 part by weight, with respect to 100 parts by weight of all the structural units constituting the acrylic polymer. ⁇ 10 parts by weight. It is more preferably 0.5 to 10 parts by weight. Within such a range, it is possible to form a pressure-sensitive adhesive layer in which the diffusion of water from the pressure-sensitive adhesive layer is appropriately adjusted and the water content is preferably adjusted. Moreover, it has moderate cohesiveness and can form a pressure-sensitive adhesive layer with little adhesive residue.
  • the hydroxyl group may be an alcoholic hydroxyl group or an acidic hydroxyl group such as a carboxyl group.
  • the acrylic pressure-sensitive adhesive may contain any suitable additive as necessary.
  • the additives include, for example, cross-linking agents, tackifiers, plasticizers (e.g., trimellitic acid ester plasticizers, pyromellitic acid ester plasticizers, etc.), pigments, dyes, fillers, anti-aging agents, conductive materials, antistatic agents, ultraviolet absorbers, light stabilizers, release modifiers, softeners, surfactants, flame retardants, antioxidants, and the like.
  • cross-linking agent contained in the acrylic pressure-sensitive adhesive examples include isocyanate-based cross-linking agents, epoxy-based cross-linking agents, melamine-based cross-linking agents, peroxide-based cross-linking agents, urea-based cross-linking agents, metal alkoxide cross-linking agents, Examples include metal chelate cross-linking agents, metal salt cross-linking agents, carbodiimide cross-linking agents, oxazoline cross-linking agents, aziridine cross-linking agents, and amine cross-linking agents.
  • the amount of the cross-linking agent to be added to the carboxyl groups of the acrylic polymer (prepolymer) is preferably 0.08 molar equivalents to 2 molar equivalents, more preferably 0.1 molar equivalents to 1 molar equivalent. molar equivalents. Within such a range, an acrylic pressure-sensitive adhesive having a high cross-linking density can be formed, and component migration between the pressure-sensitive adhesive layer and the encapsulating resin is preferably prevented.
  • the blending amount of the cross-linking agent here means the content of the cross-linking agent before the acrylic polymer is cross-linked.
  • the isocyanate-based cross-linking agent contained in the acrylic pressure-sensitive adhesive include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; group isocyanates; 2,4-tolylene diisocyanate, 4,4′-diphenylmethane diisocyanate, xylylene diisocyanate and other aromatic isocyanates; name "Coronate L”), trimethylolpropane/hexamethylene diisocyanate trimer adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate HL”), isocyanurate of hexamethylene diisocyanate (manufactured by Nippon Polyurethane Industry Co., Ltd., product isocyanate adducts such as the name "Coronate HX");
  • the amount of the isocyanate-based cross-linking agent can be set to any appropriate amount depending on the
  • the blending amount of the cross-linking agent here means the content of the cross-linking agent before the acrylic polymer is cross-linked.
  • epoxy-based cross-linking agent contained in the acrylic pressure-sensitive adhesive examples include N,N,N',N'-tetraglycidyl-m-xylenediamine, diglycidylaniline, 1,3-bis(N,N- glycidylaminomethyl)cyclohexane (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name "Tetrad C”), 1,6-hexanediol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Epolite 1600"), neopentyl glycol diglycidyl ether ( Kyoeisha Chemical Co., Ltd., trade name "Epolite 1500NP”), ethylene glycol diglycidyl ether (Kyoeisha Chemical Co., Ltd., trade name "Epolite 40E”), propylene glycol diglycidyl ether (Kyoeisha Chemical Co., Ltd., trade
  • the amount of the epoxy-based cross-linking agent can be set to any appropriate amount depending on the desired adhesive strength. parts, more preferably 0.6 to 15 parts by weight, still more preferably 2 to 13 parts by weight, and particularly preferably 3 to 10 parts by weight. With such a range, it is possible to obtain a pressure-sensitive adhesive sheet with few residual carboxyl groups in the components of the pressure-sensitive adhesive layer.
  • the blending amount of the cross-linking agent here means the content of the cross-linking agent before the acrylic polymer is cross-linked.
  • Substrates of the substrate include resin sheets, nonwoven fabrics, paper, metal foils, woven fabrics, rubber sheets, foam sheets, laminates thereof (especially laminates containing resin sheets), and the like.
  • the resin constituting the resin sheet include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), polyethylene (PE), polypropylene (PP), ethylene-propylene copolymer, ethylene- Vinyl acetate copolymer (EVA), polyamide (nylon), wholly aromatic polyamide (aramid), polyimide (PI), polyvinyl chloride (PVC), polyphenylene sulfide (PPS), fluorine resin, polyether ether ketone (PEEK) ) and the like.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PBT polybutylene terephthalate
  • PE polyethylene
  • PP polypropylene
  • EVA ethylene-propylene
  • nonwoven fabrics include nonwoven fabrics made of heat-resistant natural fibers such as nonwoven fabrics containing manila hemp; synthetic resin nonwoven fabrics such as polypropylene resin nonwoven fabrics, polyethylene resin nonwoven fabrics and ester resin nonwoven fabrics.
  • metal foil include copper foil, stainless steel foil, and aluminum foil.
  • paper include Japanese paper and kraft paper.
  • the substrate is a resin sheet composed of a resin having a glass transition temperature (Tg) of 60° C. to 450° C. (preferably 65° C. to 430° C., more preferably 80° C. to 420° C.).
  • Tg glass transition temperature
  • the molecular motion of the molecules constituting the base material does not become too vigorous, and the diffusion of moisture can be moderately suppressed.
  • a pressure-sensitive adhesive sheet having excellent flexibility can be obtained.
  • resins forming such a resin sheet include polyethylene terephthalate, polyimide, and polyethylene naphthalate.
  • the base material is composed of an aromatic polyimide resin.
  • Aromatic polyimide resins have a polar functional imide group, and the electron-donating properties of the amino group and the electron-withdrawing property of the carbonyl group make it easy to adjust the moisture content, and the high degree of processing required in the resin encapsulation process. It is preferable because it can maintain the vapor dissipation ability over a wide temperature range.
  • aromatic functional groups phenyl group, phenylene group, naphthyl group, naphthylene group, etc.
  • the molecular mobility of the polymer molecules is low, and the surface shape of the tape is maintained smooth.
  • aromatic polyimides examples include ether-based polyphthalimides having an ether bond in the main chain skeleton, ketone-based polyphthalimides having a ketone bond in the main chain skeleton, and bisphenol-based polyphthalimides having a skeleton derived from the same bisphenol.
  • Commercially available products such as “Upilex” manufactured by Ube Industries, “LARC-TPI” manufactured by Mitsui Chemicals, Inc., and “Ultem” manufactured by GE may also be used.
  • ether-based pyromellitimides having an ether bond in the main chain skeleton can be preferably used because the number of imide groups present per weight of repeating monomer residues increases.
  • a resin commercially available products such as "Kapton” manufactured by DuPont, "Apical” manufactured by Kaneka, and “Aurum” manufactured by Mitsui Chemicals, Inc. may be used.
  • the thickness of the base material can be set to any appropriate thickness depending on the desired strength or flexibility, purpose of use, and the like.
  • the thickness of the substrate is preferably 1000 ⁇ m or less, more preferably 25 ⁇ m to 1000 ⁇ m, still more preferably 40 ⁇ m to 500 ⁇ m.
  • the base material may be surface-treated.
  • surface treatment include corona treatment, chromic acid treatment, ozone exposure, flame exposure, high voltage shock exposure, ionizing radiation treatment, and coating treatment with a primer.
  • the organic coating material examples include materials described in Plastic Hard Coat Materials II (CMC Publishing, (2004)). Urethane-based polymers are preferably used, more preferably polyacrylurethane, polyesterurethane, or precursors thereof. This is because coating and applying to the base material is simple, and industrially, a wide variety of materials can be selected and are available at low cost.
  • the urethane-based polymer is, for example, a polymer composed of a reaction mixture of an isocyanate monomer and an alcoholic hydroxyl group-containing monomer (for example, a hydroxyl group-containing acrylic compound or a hydroxyl group-containing ester compound).
  • the organic coating material may contain optional additives such as chain extenders such as polyamines, anti-aging agents, oxidation stabilizers, and the like.
  • the thickness of the organic coating layer is not particularly limited.
  • the second adhesive layer may be an adhesive layer composed of any appropriate adhesive.
  • the second pressure-sensitive adhesive layer further contains thermally expandable microspheres, as described above.
  • the adhesive contained in the second adhesive layer may be a curable adhesive (for example, an active energy ray-curable adhesive) or a pressure-sensitive adhesive.
  • pressure-sensitive adhesives include acrylic adhesives and rubber adhesives. Details of the adhesive contained in the second adhesive layer can be referred to, for example, the description of JP-A-2018-009050. The publication is incorporated herein by reference in its entirety.
  • the adhesive contained in the second adhesive layer may be the acrylic adhesive described in section B above.
  • the acrylic polymer (prepolymer) contained in the acrylic pressure-sensitive adhesive contains a structural unit derived from a hydroxyl group-containing monomer.
  • the content of the structural unit derived from the hydroxyl group-containing monomer is preferably 0.1 to 20 parts by weight, more preferably 0.1 part by weight, with respect to 100 parts by weight of all the structural units constituting the acrylic polymer. ⁇ 10 parts by weight. It is more preferably 0.5 to 10 parts by weight.
  • heat-expandable microspheres can be used as the heat-expandable microspheres as long as they are microspheres that can be expanded or foamed by heating.
  • the heat-expandable microspheres for example, microspheres in which a substance (a volatile substance such as an organic solvent) that is easily expanded by heating is encapsulated in an elastic shell can be used.
  • Such heat-expandable microspheres can be produced by any appropriate method such as coacervation, interfacial polymerization, and the like.
  • Substances that easily expand when heated include, for example, propane, propylene, butene, normal butane, isobutane, isopentane, neopentane, normal pentane, normal hexane, isohexane, heptane, octane, petroleum ether, methane halides, and tetraalkylsilanes.
  • low boiling point liquid such as; azodicarbonamide gasified by thermal decomposition; and the like.
  • substances constituting the shell include nitrile monomers such as acrylonitrile, methacrylonitrile, ⁇ -chloroacrylonitrile, ⁇ -ethoxyacrylonitrile, and fumaronitrile; acrylic acid, methacrylic acid, itaconic acid, maleic acid, fumaric acid, Carboxylic acid monomers such as citraconic acid; vinylidene chloride; vinyl acetate; methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, (Meth)acrylic acid esters such as isobornyl (meth)acrylate, cyclohexyl (meth)acrylate, benzyl (meth)acrylate, ⁇ -carboxyethyl acrylate; styrene monomers such as styrene, ⁇ -methyl
  • copolymer examples include vinylidene chloride-methyl methacrylate-acrylonitrile copolymer, methyl methacrylate-acrylonitrile-methacrylonitrile copolymer, methyl methacrylate-acrylonitrile copolymer, acrylonitrile-methacrylonitrile-itaconic acid copolymer, A polymer etc. are mentioned.
  • the structural unit derived from the carboxyl group-containing monomer is preferably 80 parts by weight or less, more preferably 70 parts by weight or less, relative to 100 parts by weight of the polymer constituting the shell. Within such a range, it is possible to form a second pressure-sensitive adhesive layer with a moderately adjusted water content.
  • An inorganic foaming agent or an organic foaming agent may be used as the thermally expandable microspheres.
  • inorganic foaming agents include ammonium carbonate, ammonium hydrogencarbonate, sodium hydrogencarbonate, ammonium nitrite, sodium borohydride, and various azides.
  • organic foaming agents include chlorofluoroalkane compounds such as trichloromonofluoromethane and dichloromonofluoromethane; and azo compounds such as azobisisobutyronitrile, azodicarbonamide, and barium azodicarboxylate.
  • hydrazine compounds such as paratoluenesulfonyl hydrazide, diphenylsulfone-3,3′-disulfonyl hydrazide, 4,4′-oxybis(benzenesulfonyl hydrazide), and allylbis(sulfonyl hydrazide); p-toluylenesulfonyl semicarbazide, 4, Semicarbazide compounds such as 4'-oxybis(benzenesulfonyl semicarbazide); triazole compounds such as 5-morpholyl-1,2,3,4-thiatriazole; N,N'-dinitrosopentamethylenetetramine, N,N' -dimethyl-N,N'-dinitrosoterephthalamide; and other N-nitroso compounds.
  • thermally expandable microspheres Commercially available products may be used as the thermally expandable microspheres.
  • specific examples of commercially available heat-expandable microspheres include Matsumoto Yushi Seiyaku's trade name "Matsumoto Microspheres" (grades: F-30, F-30D, F-36D, F-36LV, F-50 , F-50D, F-65, F-65D, FN-100SS, FN-100SSD, FN-180SS, FN-180SSD, F-190D, F-260D, F-2800D), a product name manufactured by Nippon Philite Co., Ltd.
  • the average particle size (number basis) of the heat-expandable microspheres before heating is preferably 1 ⁇ m to 40 ⁇ m, more preferably 5 ⁇ m to 40 ⁇ m, still more preferably 10 ⁇ m to 40 ⁇ m.
  • the above particle size and average particle size are values determined by a particle size distribution measurement method in a laser scattering method.
  • the thermally expandable microspheres have an appropriate strength such that they do not burst until the volume expansion coefficient is preferably 5 times or more, more preferably 7 times or more, and still more preferably 10 times or more.
  • the adhesive strength can be efficiently reduced by heat treatment.
  • the content ratio of the heat-expandable microspheres in the second adhesive layer can be appropriately set according to the desired decrease in adhesive force.
  • the content of the heat-expandable microspheres is, for example, 1 to 150 parts by weight, preferably 10 to 130 parts by weight, with respect to 100 parts by weight of the base polymer forming the second pressure-sensitive adhesive layer. , more preferably 25 to 100 parts by weight.
  • the arithmetic surface roughness Ra of the second adhesive layer before the thermally expandable microspheres are expanded is preferably 500 nm or less, more preferably 400 nm or less, and even more preferably 300 nm or less. is. Within such a range, it is possible to obtain a pressure-sensitive adhesive sheet having excellent adhesion to an adherend.
  • an undercoat layer may be provided between the substrate and the second pressure-sensitive adhesive layer.
  • the undercoat layer contains any suitable adhesive.
  • the adhesive that constitutes the undercoat layer include acrylic adhesives, rubber adhesives, silicone adhesives, and the like. Among them, an acrylic pressure-sensitive adhesive can be preferably used.
  • an active energy ray-curable acrylic adhesive (hereinafter referred to as an active energy ray-curable adhesive) may be used.
  • the same pressure-sensitive adhesive as the pressure-sensitive adhesive forming the second pressure-sensitive adhesive layer is used as the pressure-sensitive adhesive forming the undercoat layer.
  • the thickness of the undercoat layer is preferably 1 ⁇ m to 40 ⁇ m, more preferably 5 ⁇ m to 35 ⁇ m, still more preferably 10 ⁇ m to 30 ⁇ m.
  • the adhesive sheet of the present invention can be produced by any appropriate method.
  • Methods for obtaining the pressure-sensitive adhesive sheet of the present invention include, for example, a method of directly coating a substrate with a composition containing a pressure-sensitive adhesive (for example, an acrylic pressure-sensitive adhesive), or a method of applying a pressure-sensitive adhesive onto any appropriate substrate. Examples include a method of transferring a coating layer formed by coating a composition containing the composition to a substrate.
  • a composition containing an acrylic pressure-sensitive adhesive may contain any suitable solvent.
  • composition containing the adhesive contains any suitable solvent.
  • the water content in the solvent is preferably 0.003% to 0.3% by weight.
  • a pressure-sensitive adhesive layer (second pressure-sensitive adhesive layer) containing heat-expandable microspheres
  • a composition containing heat-expandable microspheres, a pressure-sensitive adhesive, and any appropriate solvent is applied to a substrate.
  • the pressure-sensitive adhesive layer can be formed.
  • the heat-expandable microspheres are embedded in the adhesive using a laminator or the like to form an adhesive layer containing the heat-expandable microspheres. may be formed.
  • each layer can be formed by coating and then drying.
  • the coating method include coating methods using a multi-coater, die coater, gravure coater, applicator, and the like. Drying methods include, for example, natural drying and heat drying.
  • the heating temperature for drying by heating can be set to any suitable temperature depending on the properties of the substance to be dried.
  • a liner is placed on the surface of the coating layer to obtain a laminate (liner-attached pressure-sensitive adhesive sheet precursor),
  • the laminate (liner-attached pressure-sensitive adhesive sheet precursor) is subjected to a step of placing the laminate (liner-attached pressure-sensitive adhesive sheet precursor) in an environment in which the temperature and humidity are controlled for a predetermined moist heat time (for example, 2 hours to 7 days) (humidification heat step), and the pressure-sensitive adhesive sheet is removed.
  • a predetermined moist heat time for example, 2 hours to 7 days
  • the moisture content of the pressure-sensitive adhesive sheet can be preferably adjusted by performing the moist heat step.
  • the temperature in this step is, for example, 40°C to 120°C.
  • the humidity is, for example, 1% RH to 100% RH.
  • the adhesive sheet is a double-sided adhesive sheet, both sides of the adhesive coating layer surface (that is, the adhesive coating layer surface forming the adhesive layer and the adhesive coating layer forming the second adhesive layer)
  • a laminate obtained by arranging the liners (the first liner and the second liner) on the layer surface) can be subjected to the humidification heat step. Details of the liner will be described later.
  • the product of the heat humidification time, the temperature and the humidity is preferably 100 to 300000°C.RH%h, more preferably 180 to 265000°C.RH%h. Within such a range, the moisture content of the pressure-sensitive adhesive sheet can be preferably adjusted.
  • FIG. 3 is a schematic cross-sectional view of a liner-attached double-sided pressure-sensitive adhesive sheet according to one embodiment of the present invention.
  • the liner-equipped double-sided pressure-sensitive adhesive sheet 110 comprises a double-sided pressure-sensitive adhesive sheet 200, a first liner 40 releasably arranged directly on one side of the pressure-sensitive adhesive sheet 200, and a releasable first liner 40 on the other side of the double-sided pressure-sensitive adhesive sheet 200. and a directly disposed second liner 50 .
  • the first liner 40 and the second liner 50 By arranging the first liner 40 and the second liner 50, it is possible to protect the pressure-sensitive adhesive layer from contamination and prevent blocking of the double-sided pressure-sensitive adhesive sheet of the roll or sheet.
  • the first liner and the second liner comprise a liner substrate and a release treatment layer disposed on at least one side of the liner substrate. The first liner and the second liner are arranged so that the release treated layer is on the double-sided pressure-sensitive adhesive sheet side.
  • the double-sided pressure-sensitive adhesive sheet 200 may be the pressure-sensitive adhesive sheet described above, that is, a pressure-sensitive adhesive sheet comprising the pressure-sensitive adhesive layer 20, the base material 10, and the second pressure-sensitive adhesive layer 30.
  • the first liner 20 and the second liner 30 may be heterogeneous. “Heterogeneous” means, for example, different thicknesses (for example, the absolute value of the difference in thickness is 1 ⁇ m or more (preferably 5 ⁇ m or more, more preferably 10 ⁇ m or more)), different colors, different constituent materials, etc. can be
  • the difference in thickness between the first liner 20 and the second liner 30 is preferably 70 ⁇ m or less, more preferably 50 ⁇ m or less, even more preferably 25 ⁇ m or less.
  • the first liner when using the liner-attached double-sided pressure-sensitive adhesive sheet, the first liner is removed first. More specifically, the liner-attached double-sided pressure-sensitive adhesive sheet is prepared by first peeling off the first liner and attaching an adherend (for example, an electronic component) to the exposed pressure-sensitive adhesive surface (for example, the surface of the first pressure-sensitive adhesive layer). It can be used by sticking, then peeling off the second liner, and sticking the surface of the second pressure-sensitive adhesive layer on another adherend (for example, a pedestal).
  • adherend for example, an electronic component
  • the adherend e.g., electronic component
  • the adherend is temporarily fixed to the pedestal via the adhesive sheet; the adherend is subjected to a predetermined process; By reducing the adhesive strength of the adhesive layer, the adhesive sheet with the adherend is peeled off from the base. As described above, if the first liner and the second liner are different, it becomes easy to identify the liner to be peeled off at a predetermined timing.
  • the peel force of the first liner to the double-sided pressure-sensitive adhesive sheet is preferably 0.001N/50mm to 2N/50mm, more preferably 0.01N/50mm to 1.5N/50mm, and still more preferably 0.05N. /50 mm to 1 N/50 mm, particularly preferably 0.1 N/50 mm to 0.8 N/50 mm.
  • the release force of the first liner to the double-sided PSA sheet (and the release force of the second liner to the double-sided PSA sheet) was determined by peeling the liner from the double-sided PSA sheet of the liner-attached double-sided PSA sheet in an environment of 23°C. angle: 180°, peeling speed (tensile speed): 300 mm/min.
  • the release force of the liner to the double-sided PSA sheet can be adjusted by any appropriate method, such as the composition of the PSA layer, the type of liner, and the surface treatment applied to the liner.
  • the peel force of the second liner to the double-sided pressure-sensitive adhesive sheet is preferably 0.001N/50mm to 2N/50mm, more preferably 0.01N/50mm to 1.5N/50mm, and still more preferably 0.05N. /50 mm to 1 N/50 mm, particularly preferably 0.1 N/50 mm to 0.8 N/50 mm.
  • the thickness of the first liner is preferably 5 ⁇ m to 250 ⁇ m, more preferably 10 ⁇ m to 200 ⁇ m, even more preferably 20 to 150 ⁇ m, most preferably 30 to 100 ⁇ m.
  • the thickness of the second liner is preferably 5 ⁇ m to 250 ⁇ m, more preferably 10 ⁇ m to 200 ⁇ m, even more preferably 20 to 150 ⁇ m, most preferably 30 to 100 ⁇ m.
  • the liner base material can be composed of any appropriate material.
  • the liner base material for example, in addition to plastic films and plastic sheets, various sheet-like materials such as paper, cloth, nonwoven fabric, metal foil, plastic laminates thereof, and laminates of plastics can be used. .
  • plastic films and plastic sheets are most preferable from the viewpoint of handling and cost.
  • the material for the plastic film can be selected according to need from the viewpoint of strength, heat resistance, and the like.
  • polyethylene polyethylene
  • PP polypropylene
  • EVA ethylene-vinyl acetate copolymer
  • PBT polyethylene terephthalate
  • PET polyethylene
  • Polyesters such as naphthalate (PEN) and polybutylene terephthalate (PBT)
  • PVC polyvinyl chloride
  • PPS polyphenylene sulfide
  • amide resins such as polyamide (nylon) and wholly aromatic polyamide (aramid); Ketone (PEEK), polyimide, polyetherimide, polystyrene, acrylic resin and the like.
  • any of an unstretched film, a uniaxially oriented film, and a biaxially oriented film may be used.
  • these films may be laminated films composed of two or more film layers, or films to which a lubricant such as inert particles is appropriately added may be used from the viewpoint of handleability.
  • the release treated layer is a silicone treated layer.
  • a reactive silicone compound containing a dimethylpolysiloxane as a main component and having a functional group necessary for cross-linking (curing) can be preferably used. This is because it can be applied to a film in a low-molecular-weight state, and can be cured after application to form a release treated layer that is resistant to rubbing and the like.
  • functional groups of reactive silicone compounds include vinyl groups, epoxy groups, alkoxy groups, isocyanato groups, and the like.
  • the silicone-treated layer is formed, for example, by diluting the above-mentioned reactive silicone compound with a solvent or the like to adjust the concentration, and applying and heating with a gravure coater or the like. Heating accelerates solvent drying and curing reactions.
  • a catalyst that accelerates the curing reaction. Examples of catalysts that can be used include metal complexes such as platinum, palladium, rhodium, zirconium and tin, organic bases such as amines, and organic acids such as acetic acid.
  • the first liner and/or the second liner (substantially the release treatment layer of each liner) has a Si—K ⁇ ray intensity of 0.01 by fluorescent X-ray analysis. ⁇ 500 kcps (preferably 0.5 to 250 kcps, more preferably 1.0 to 150 kcps, still more preferably 1.05 to 100 kcps, particularly preferably 10 to 30 kcps). Within such a range, the liner can be peeled off from the pressure-sensitive adhesive layer with a small force. In addition, the adhesion between the liner and the adhesive layer is sufficient, and unnecessary peeling of the liner can be prevented.
  • the intensity of the Si-K ⁇ ray obtained by the above fluorescent X-ray analysis is obtained by measuring the Si intensity of the release agent layer and the non-release agent layer by the fluorescence X-ray analysis, and calculating the intensity of the release agent layer from the intensity of the non-release agent. It is a value obtained by reducing the strength of the layer.
  • the strength can be adjusted by controlling the release treatment layer forming conditions such as the coating amount, concentration, coating speed and drying of the release treatment agent.
  • the first liner and the second liner are different colors.
  • a liner-equipped double-sided pressure-sensitive adhesive sheet having such a structure can be obtained, for example, by coloring one of the liners (for example, the liner substrate). If both liners are of different colors, the front and back of the liner-attached double-sided pressure-sensitive adhesive sheet can be clearly distinguished, making it easy to identify the liner to be peeled off.
  • the pressure-sensitive adhesive sheet and the liner-attached double-sided pressure-sensitive adhesive sheet can be preferably used as a temporary fixing sheet when processing any appropriate member (for example, electronic parts such as semiconductor chips).
  • the liner-attached double-sided pressure-sensitive adhesive sheet can be used as a sheet for temporarily fixing a semiconductor chip during the manufacture of CSP (Chip Size/Scale Package) or WLP (Wafer Level Package).
  • the liner-attached double-sided pressure-sensitive adhesive sheet is used for processing including the step of peeling off the second liner first.
  • the semiconductor chip is sealed with the sealing resin, and the processing temperature during resin sealing is 100° C. or higher.
  • the liner-attached double-sided pressure-sensitive adhesive sheet is roll-shaped.
  • Example 1 A toluene solution of the acrylic polymer 1 (acrylic polymer 1: 100 parts by weight), a cross-linking agent (manufactured by Tosoh Corporation, trade name “Coronate L”) 3 parts by weight, a plasticizer (manufactured by DIC, trade name “Monocizer W700”) ” and 10 parts by weight to prepare an adhesive.
  • the above-mentioned adhesive is applied (applied and dried) to the release-treated surface of the liner (PET film, thickness: 38 ⁇ m, silicone-based release-treated product, manufactured by Mitsubishi Plastics, Inc., product name “MRF-38”), and the adhesive is A layer (thickness: 10 ⁇ m) was formed.
  • the liner with the pressure-sensitive adhesive layer was attached to a base material (polyester film, trade name “Lumirror S10” manufactured by Toray Industries, Inc., thickness: 50 ⁇ m) to obtain a liner-attached pressure-sensitive adhesive sheet precursor.
  • the Si—K ⁇ ray intensity of the liner (trade name “MRF-38”) was 18 (kcps).
  • the method for measuring the intensity of the Si—K ⁇ ray is as follows.
  • the liner-attached pressure-sensitive adhesive sheet precursor was allowed to stand for 5 days in an environment with a temperature of 40° C.
  • the intensity (i) of the Si—K ⁇ ray of the surface of the liner in contact with the adhesive layer (the surface coated with the release agent) and the surface not in contact with the adhesive layer (the surface coated with the release agent) Measure the intensity (ii) of the Si-K ⁇ ray of the surface that is not exposed), obtain the absolute value of the value obtained by subtracting the value of (ii) from the value of (i), and calculate the average value of 100 measurements of the value.
  • the Si—K ⁇ ray intensity of the liner was used.
  • the intensity of the Si-K ⁇ ray is the intensity at a wavelength of 7.125 angstroms as measured by the following equipment.
  • Example 2 A toluene solution of the acrylic polymer 1 (acrylic polymer 1: 100 parts by weight), a cross-linking agent (manufactured by Tosoh Corporation, trade name “Coronate L”) 3 parts by weight, a plasticizer (manufactured by DIC, trade name “Monocizer W700”) ”) was mixed with 10 parts by weight to prepare an adhesive.
  • the above-mentioned adhesive is applied to the release-treated surface of the liner (PET film, thickness: 38 ⁇ m, silicone-based release-treated product, manufactured by Mitsubishi Plastics, Inc., product name “MRF-38”) to form an adhesive layer (thickness: 10 ⁇ m ) was formed.
  • the liner with the pressure-sensitive adhesive layer was attached to a substrate (polyethylene naphthalate film, manufactured by Teijin DuPont Films Ltd., trade name "Teonex Q51", thickness: 50 ⁇ m) to obtain a liner-attached pressure-sensitive adhesive sheet precursor.
  • the liner-attached pressure-sensitive adhesive sheet precursor was allowed to stand in an environment of 40° C. and 20% humidity for 5 days to obtain a liner-attached pressure-sensitive adhesive sheet consisting of liner/adhesive layer (first adhesive layer)/substrate. .
  • Example 3 A toluene solution of the acrylic polymer 1 (acrylic polymer 1: 100 parts by weight), a cross-linking agent (manufactured by Tosoh Corporation, trade name “Coronate L”) 3 parts by weight, a plasticizer (manufactured by DIC, trade name “Monocizer W700”) ”) was mixed with 10 parts by weight to prepare an adhesive.
  • the above-mentioned adhesive is applied to the release-treated surface of the liner (PET film, thickness: 38 ⁇ m, silicone-based release-treated product, manufactured by Mitsubishi Plastics, Inc., product name “MRF-38”) to form an adhesive layer (thickness: 10 ⁇ m ) was formed.
  • the liner with the pressure-sensitive adhesive layer was attached to a base material (aromatic polyimide film, manufactured by Ube Industries, Ltd., trade name “Upilex-R”, thickness: 50 ⁇ m) to obtain a liner-attached pressure-sensitive adhesive sheet precursor.
  • the liner-attached pressure-sensitive adhesive sheet precursor was allowed to stand in an environment of 40° C. and 20% humidity for 5 days to obtain a liner-attached pressure-sensitive adhesive sheet consisting of liner/adhesive layer (first adhesive layer)/substrate. .
  • Example 4 A toluene solution of the acrylic polymer 1 (acrylic polymer 1: 100 parts by weight), a cross-linking agent (manufactured by Tosoh Corporation, trade name “Coronate L”) 3 parts by weight, a plasticizer (manufactured by DIC, trade name “Monocizer W700”) ”) was mixed with 10 parts by weight to prepare adhesive a1.
  • the pressure-sensitive adhesive a1 is applied to the release-treated surface of the liner (PET film, thickness: 38 ⁇ m, silicone-based release-treated product, manufactured by Mitsubishi Plastics, Inc., trade name “MRF-38”) to form an adhesive layer (thickness: 7 ⁇ m) was formed.
  • the liner with the pressure-sensitive adhesive layer was attached to a base material (aromatic polyimide film, manufactured by DuPont, trade name "Kapton 200H", thickness: 50 ⁇ m) to obtain a liner-attached pressure-sensitive adhesive sheet precursor.
  • the liner-attached pressure-sensitive adhesive sheet precursor was allowed to stand in an environment of 40° C. and 20% humidity for 5 days to obtain a liner-attached pressure-sensitive adhesive sheet consisting of liner/adhesive layer (first adhesive layer)/substrate. .
  • Example 5 A liner-attached pressure-sensitive adhesive sheet was obtained in the same manner as in Example 4, except that the thickness of the pressure-sensitive adhesive layer was 2 ⁇ m.
  • Example 6 A liner-attached pressure-sensitive adhesive sheet was obtained in the same manner as in Example 4, except that the thickness of the pressure-sensitive adhesive layer was 15 ⁇ m.
  • Example 7 (Adhesive sheet with liner a2) A toluene solution of the acrylic polymer 1 (acrylic polymer 1: 100 parts by weight), a cross-linking agent (manufactured by Tosoh Corporation, trade name “Coronate L”) 3 parts by weight, a plasticizer (manufactured by DIC, trade name “Monocizer W700”) ”) was mixed with 10 parts by weight to prepare adhesive a1.
  • the pressure-sensitive adhesive a1 is applied to the release-treated surface of the liner (PET film, thickness: 38 ⁇ m, silicone-based release-treated product, manufactured by Mitsubishi Plastics, Inc., trade name “MRF-38”) to form an adhesive layer (thickness: 7 ⁇ m) was formed.
  • the base material (aromatic polyimide film, manufactured by DuPont, trade name “Kapton 200H”, thickness: 50 ⁇ m) is laminated with the liner with the adhesive layer, and the liner (first liner)/adhesive layer (first A liner-attached pressure-sensitive adhesive sheet a2 consisting of the pressure-sensitive adhesive layer)/base material was obtained.
  • Liner-attached adhesive sheet a2/undercoat layer laminate A toluene solution of acrylic polymer 1 (acrylic polymer 1: 100 parts by weight) and 3 parts by weight of a cross-linking agent (manufactured by Tosoh Corporation, trade name "Coronate L”) were mixed to prepare adhesive b.
  • the base material of the liner-attached adhesive sheet a2 was coated with the adhesive b to form a laminate composed of the liner-attached adhesive sheet a2/undercoat layer (thickness: 13 ⁇ m).
  • the composition for forming the second pressure-sensitive adhesive layer is applied to the release-treated surface of a liner (PET film, thickness: 50 ⁇ m, silicone-based release-treated product, manufactured by Mitsubishi Plastics, trade name “MRF-50”). to form a second adhesive layer (thickness: 35 ⁇ m).
  • the Si—K ⁇ ray intensity of the liner (trade name “MRF-50”) was 28 (kcps).
  • the second pressure-sensitive adhesive layer-bearing liner and a laminate consisting of the liner-bearing pressure-sensitive adhesive sheet a2 and the undercoat layer were laminated together to obtain a liner-bearing double-faced pressure-sensitive adhesive sheet precursor.
  • the liner-equipped double-sided pressure-sensitive adhesive sheet precursor was allowed to stand for 5 days in an environment with a temperature of 40° C. and a humidity of 20% to form a first liner/first pressure-sensitive adhesive layer/substrate/undercoat layer/second pressure-sensitive adhesive layer. / A liner-equipped double-sided pressure-sensitive adhesive sheet consisting of a second liner was obtained.
  • Example 8 Adhesive sheet with liner a2
  • liner (first liner)/pressure-sensitive adhesive layer (first pressure-sensitive adhesive layer)/substrate) was obtained in the same manner as in Example 7.
  • Liner-attached adhesive sheet a2/undercoat layer laminate A toluene solution of acrylic polymer 1 (acrylic polymer 1: 100 parts by weight) and 3 parts by weight of a cross-linking agent (manufactured by Tosoh Corporation, trade name "Coronate L") were mixed to prepare adhesive b.
  • the base material of the liner-attached adhesive sheet a2 was coated with the adhesive b to form a laminate composed of the liner-attached adhesive sheet a2/undercoat layer (thickness: 13 ⁇ m).
  • the composition for forming the second pressure-sensitive adhesive layer is applied to the release-treated surface of a liner (PET film, thickness: 50 ⁇ m, silicone-based release-treated product, manufactured by Mitsubishi Plastics, trade name “MRF-50”). to form a second adhesive layer (thickness: 35 ⁇ m).
  • the second pressure-sensitive adhesive layer-bearing liner and a laminate consisting of the liner-bearing pressure-sensitive adhesive sheet a2 and the undercoat layer were laminated together to obtain a liner-bearing double-faced pressure-sensitive adhesive sheet precursor.
  • the liner-equipped double-sided pressure-sensitive adhesive sheet precursor was allowed to stand for 2 hours in an environment with a temperature of 90° C. and a humidity of 1% RH to form a first liner/first pressure-sensitive adhesive layer/substrate/undercoat layer/second pressure-sensitive adhesive.
  • a lined double-sided PSA sheet consisting of layer/second liner was obtained.
  • Example 9 Adhesive sheet with liner a2
  • liner (first liner)/pressure-sensitive adhesive layer (first pressure-sensitive adhesive layer)/substrate) was obtained in the same manner as in Example 7.
  • Liner-attached adhesive sheet a2/undercoat layer laminate A toluene solution of acrylic polymer 1 (acrylic polymer 1: 100 parts by weight) and 3 parts by weight of a cross-linking agent (manufactured by Tosoh Corporation, trade name "Coronate L") were mixed to prepare adhesive b.
  • the base material of the liner-attached adhesive sheet a2 was coated with the adhesive b to form a laminate composed of the liner-attached adhesive sheet a2/undercoat layer (thickness: 13 ⁇ m).
  • the composition for forming the second pressure-sensitive adhesive layer is applied to the release-treated surface of a liner (PET film, thickness: 50 ⁇ m, silicone-based release-treated product, manufactured by Mitsubishi Plastics, trade name “MRF-50”). to form a second adhesive layer (thickness: 35 ⁇ m).
  • the second pressure-sensitive adhesive layer-bearing liner and a laminate consisting of the liner-bearing pressure-sensitive adhesive sheet a/undercoat layer were laminated together to obtain a liner-bearing double-faced pressure-sensitive adhesive sheet precursor.
  • the liner-equipped double-sided pressure-sensitive adhesive sheet precursor was allowed to stand in an environment with a temperature of 40° C. and a humidity of 92% RH for 3 days to form a first liner/first pressure-sensitive adhesive layer/substrate/undercoat layer/second pressure-sensitive adhesive.
  • a lined double-sided PSA sheet consisting of layer/second liner was obtained.
  • Example 10 Adhesive sheet with liner a3 Toluene solution of acrylic polymer 2 (acrylic polymer 2: 100 parts by weight), cross-linking agent (manufactured by Tosoh Corporation, trade name “Coronate L”) 3 parts by weight, tackifying resin (manufactured by Arakawa Chemical Industries, trade name " Tamanol 200N”) was mixed with 15 parts by weight to prepare an adhesive a'.
  • the adhesive a' is applied to the release-treated surface of the liner (PET film, thickness: 38 ⁇ m, silicone-based release-treated product, manufactured by Mitsubishi Plastics, product name "MRF-38”) to form an adhesive layer (thickness: : 5 ⁇ m).
  • the base material (aromatic polyimide film, manufactured by DuPont, trade name “Kapton 200H”, thickness: 50 ⁇ m) is laminated with the liner with the adhesive layer, and the liner (first liner)/adhesive layer (first A liner-attached pressure-sensitive adhesive sheet a3 consisting of the pressure-sensitive adhesive layer)/substrate was obtained.
  • Liner-attached adhesive sheet a3/undercoat layer laminate A toluene solution of acrylic polymer 2 (acrylic polymer 2: 100 parts by weight) and 3 parts by weight of a cross-linking agent (manufactured by Tosoh Corporation, trade name "Coronate L”) were mixed to prepare adhesive b'.
  • Adhesive b′ was applied to the substrate of the liner-attached adhesive sheet a3 to form a laminate consisting of the liner-attached adhesive sheet a3/undercoat layer (thickness: 13 ⁇ m).
  • the composition for forming the second pressure-sensitive adhesive layer is applied to the release-treated surface of a liner (PET film, thickness: 50 ⁇ m, silicone-based release-treated product, manufactured by Mitsubishi Plastics, trade name “MRF-50”). to form a second adhesive layer (thickness: 35 ⁇ m).
  • the second pressure-sensitive adhesive layer-bearing liner and a laminate consisting of the liner-bearing pressure-sensitive adhesive sheet a3 and the undercoat layer were laminated together to obtain a liner-bearing double-faced pressure-sensitive adhesive sheet precursor.
  • the liner-equipped double-sided pressure-sensitive adhesive sheet precursor was allowed to stand in an environment with a temperature of 40° C. and a humidity of 20% RH for 5 days to form a first liner/first pressure-sensitive adhesive layer/substrate/undercoat layer/second pressure-sensitive adhesive.
  • a lined double-sided PSA sheet consisting of layer/second liner was obtained.
  • Example 11 (Adhesive sheet a4 with liner) Toluene solution of acrylic polymer 3 (acrylic polymer 3: 100 parts by weight), cross-linking agent (manufactured by Tosoh Corporation, trade name “Coronate L”) 3 parts by weight, tackifier resin (manufactured by Arakawa Chemical Industries, trade name " Tamanol 200N”) was mixed with 15 parts by weight to prepare an adhesive a''. The adhesive a' is applied to the release-treated surface of the liner (PET film, thickness: 38 ⁇ m, silicone-based release-treated product, manufactured by Mitsubishi Plastics, product name "MRF-38”) to form an adhesive layer (thickness: : 5 ⁇ m).
  • PET film thickness: 38 ⁇ m
  • silicone-based release-treated product manufactured by Mitsubishi Plastics, product name "MRF-38
  • the base material (aromatic polyimide film, manufactured by DuPont, trade name “Kapton 200H”, thickness: 50 ⁇ m) is laminated with the liner with the adhesive layer, and the liner (first liner)/adhesive layer (first A liner-attached pressure-sensitive adhesive sheet a4 consisting of the pressure-sensitive adhesive layer)/substrate was obtained.
  • Liner-attached adhesive sheet a4/undercoat layer laminate A toluene solution of acrylic polymer 3 (acrylic polymer 3: 100 parts by weight) and 3 parts by weight of a cross-linking agent (manufactured by Tosoh Corporation, trade name "Coronate L”) were mixed to prepare adhesive b''.
  • the base material of the liner-attached adhesive sheet a4 was coated with the adhesive b′′ to form a laminate composed of the liner-attached adhesive sheet a4/undercoat layer (thickness: 13 ⁇ m).
  • the composition for forming the second pressure-sensitive adhesive layer is applied to the release-treated surface of a liner (PET film, thickness: 50 ⁇ m, silicone-based release-treated product, manufactured by Mitsubishi Plastics, trade name “MRF-50”). to form a second adhesive layer (thickness: 35 ⁇ m).
  • the second pressure-sensitive adhesive layer-bearing liner and a laminate consisting of the liner-bearing pressure-sensitive adhesive sheet a4 and the undercoat layer were laminated together to obtain a liner-bearing double-faced pressure-sensitive adhesive sheet precursor.
  • the liner-equipped double-sided pressure-sensitive adhesive sheet precursor was allowed to stand in an environment with a temperature of 40° C. and a humidity of 20% RH for 5 days to form a first liner/first pressure-sensitive adhesive layer/substrate/undercoat layer/second pressure-sensitive adhesive.
  • a lined double-sided PSA sheet consisting of layer/second liner was obtained.
  • a toluene solution of the acrylic polymer 1 (acrylic polymer 1: 100 parts by weight), a cross-linking agent (manufactured by Tosoh Corporation, trade name “Coronate L”) 3 parts by weight, a plasticizer (manufactured by DIC, trade name “Monocizer W700”) ”) was mixed with 10 parts by weight to prepare adhesive a1.
  • the adhesive a is applied to the release-treated surface of the liner (PET film, thickness: 38 ⁇ m, silicone-based release-treated product, manufactured by Mitsubishi Plastics, Inc., trade name “MRF-38”) to form an adhesive layer (thickness: 7 ⁇ m) was formed.
  • the liner with the pressure-sensitive adhesive layer was attached to a base material (aromatic polyimide film, manufactured by DuPont, trade name "Kapton 200H", thickness: 50 ⁇ m) to obtain a liner-attached pressure-sensitive adhesive sheet precursor.
  • the liner-attached pressure-sensitive adhesive sheet precursor was allowed to stand in an environment with a temperature of 200° C. and a humidity of 0.1% RH for 4 hours to obtain a liner-attached pressure-sensitive adhesive sheet consisting of a liner/adhesive layer (first pressure-sensitive adhesive layer)/substrate. got a sheet.
  • Adhesive sheet with liner a2 A toluene solution of the acrylic polymer 1 (acrylic polymer 1: 100 parts by weight), a cross-linking agent (manufactured by Tosoh Corporation, trade name “Coronate L”) 3 parts by weight, a plasticizer (manufactured by DIC, trade name “Monocizer W700”) ”) was mixed with 10 parts by weight to prepare adhesive a1.
  • the adhesive a is applied to the release-treated surface of the liner (PET film, thickness: 38 ⁇ m, silicone-based release-treated product, manufactured by Mitsubishi Plastics, Inc., trade name “MRF-38”) to form an adhesive layer (thickness: 7 ⁇ m) was formed.
  • the base material (aromatic polyimide film, manufactured by DuPont, trade name “Kapton 200H”, thickness: 50 ⁇ m) is laminated with the liner with the adhesive layer, and the liner (first liner)/adhesive layer (first A liner-attached pressure-sensitive adhesive sheet a2 consisting of the pressure-sensitive adhesive layer)/base material was obtained.
  • Liner-attached adhesive sheet a2/undercoat layer laminate A toluene solution of acrylic polymer 1 (acrylic polymer 1: 100 parts by weight) and 3 parts by weight of a cross-linking agent (manufactured by Tosoh Corporation, trade name "Coronate L”) were mixed to prepare adhesive b.
  • the base material of the liner-attached adhesive sheet a2 was coated with the adhesive b to form a laminate composed of the liner-attached adhesive sheet a2/undercoat layer (thickness: 13 ⁇ m).
  • the composition for forming the second pressure-sensitive adhesive layer is applied to the release-treated surface of a liner (PET film, thickness: 50 ⁇ m, silicone-based release-treated product, manufactured by Mitsubishi Plastics, trade name “MRF-50”). to form a second adhesive layer (thickness: 35 ⁇ m).
  • the second pressure-sensitive adhesive layer-bearing liner and a laminate consisting of the liner-bearing pressure-sensitive adhesive sheet a2 and the undercoat layer were laminated together to obtain a liner-bearing double-faced pressure-sensitive adhesive sheet precursor.
  • the liner-equipped double-sided pressure-sensitive adhesive sheet precursor was allowed to stand for 7 days in an environment with a temperature of 85° C. and a humidity of 92% RH to form a first liner/first pressure-sensitive adhesive layer/substrate/undercoat layer/second pressure-sensitive adhesive.
  • a lined double-sided PSA sheet consisting of layer/second liner was obtained.
  • a 2-kg roller was reciprocated one time under the pressure and bonded together to prepare an evaluation sample.
  • the evaluation sample was set in a tensile tester with a constant temperature bath set at 23° C. (manufactured by Shimadzu Corporation, trade name “Shimadzu Autograph AG-120 kN”) and left for 30 minutes. After standing, the polyethylene terephthalate was peeled off from the adhesive sheet at a temperature of 23° C. under the conditions of a peeling angle of 180° and a peeling speed (tensile speed) of 300 mm/min. The maximum load (the maximum value of the load excluding the peak top at the initial stage of measurement) was obtained, and this maximum load was defined as the adhesive strength (N/20 mm).
  • a 130 ⁇ m thick polytetrafluoroethylene (PTFE) sheet with 3 mm diameter holes was placed on the first adhesive layer.
  • a sealing resin precursor epoxy resin, manufactured by Nagase ChemteX Corporation, trade name "R4212"
  • R4212 epoxy resin, manufactured by Nagase ChemteX Corporation, trade name "R4212”
  • the PTFE sheet was removed, and the pressure-sensitive adhesive sheet with the pillars of the sealing resin precursor was placed on an optical microscope with a hot stage.
  • the time required for the shortest distance between the outer edge of the columnar body formation position and the outer edge of the sealing resin precursor after flowing to be 30 ⁇ m was measured.
  • the above measurement was performed 10 times, and the difference between the longest time and the shortest time was used to evaluate the variation in fluidity of the sealing resin precursor according to the following criteria.
  • Excellent ⁇ in the table: The above difference is less than 60 seconds Acceptable ( ⁇ in the table): The above difference is 60 seconds to 180 seconds Impossible (X in the table): The above difference exceeds 180 seconds

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JP2012102229A (ja) * 2010-11-10 2012-05-31 Nitto Denko Corp 絶縁テープ
JP2015168711A (ja) * 2014-03-05 2015-09-28 日東電工株式会社 粘着シート
WO2016063802A1 (ja) * 2014-10-20 2016-04-28 積水化成品工業株式会社 接着用途を有する粘着性ゲルシート、その製造方法、一対の被着体の固定方法及び複合材
JP2018016701A (ja) * 2016-07-27 2018-02-01 東洋インキＳｃホールディングス株式会社 粘着剤組成物、および粘着シート
JP2020117677A (ja) * 2018-12-07 2020-08-06 長興材料工業股▲ふん▼有限公司Ｅｔｅｒｎａｌ Ｍａｔｅｒｉａｌｓ Ｃｏ．，Ｌｔｄ． 架橋性コポリマーおよびその使用

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JP4403631B2 (ja) 2000-04-24 2010-01-27 ソニー株式会社 チップ状電子部品の製造方法、並びにその製造に用いる擬似ウエーハの製造方法
JP2001313350A (ja) 2000-04-28 2001-11-09 Sony Corp チップ状電子部品及びその製造方法、並びにその製造に用いる疑似ウエーハ及びその製造方法
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Publication number Priority date Publication date Assignee Title
JP2012102229A (ja) * 2010-11-10 2012-05-31 Nitto Denko Corp 絶縁テープ
JP2015168711A (ja) * 2014-03-05 2015-09-28 日東電工株式会社 粘着シート
WO2016063802A1 (ja) * 2014-10-20 2016-04-28 積水化成品工業株式会社 接着用途を有する粘着性ゲルシート、その製造方法、一対の被着体の固定方法及び複合材
JP2018016701A (ja) * 2016-07-27 2018-02-01 東洋インキＳｃホールディングス株式会社 粘着剤組成物、および粘着シート
JP2020117677A (ja) * 2018-12-07 2020-08-06 長興材料工業股▲ふん▼有限公司Ｅｔｅｒｎａｌ Ｍａｔｅｒｉａｌｓ Ｃｏ．，Ｌｔｄ． 架橋性コポリマーおよびその使用

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