WO2022183793A1 - 薄板型环路热管 - Google Patents
薄板型环路热管 Download PDFInfo
- Publication number
- WO2022183793A1 WO2022183793A1 PCT/CN2021/133542 CN2021133542W WO2022183793A1 WO 2022183793 A1 WO2022183793 A1 WO 2022183793A1 CN 2021133542 W CN2021133542 W CN 2021133542W WO 2022183793 A1 WO2022183793 A1 WO 2022183793A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- channel
- chamber
- plate
- heat pipe
- thin
- Prior art date
Links
- 239000007788 liquid Substances 0.000 claims abstract description 84
- 239000012530 fluid Substances 0.000 claims abstract description 81
- 238000009833 condensation Methods 0.000 claims abstract description 67
- 230000005494 condensation Effects 0.000 claims abstract description 67
- 238000001704 evaporation Methods 0.000 claims abstract description 65
- 230000008020 evaporation Effects 0.000 claims abstract description 65
- 238000007789 sealing Methods 0.000 claims abstract description 25
- 239000007791 liquid phase Substances 0.000 claims abstract description 21
- 239000002184 metal Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 10
- 239000000835 fiber Substances 0.000 claims description 9
- 239000006262 metallic foam Substances 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000012808 vapor phase Substances 0.000 description 19
- 238000000034 method Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 238000009834 vaporization Methods 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 7
- 230000008016 vaporization Effects 0.000 description 6
- 238000003466 welding Methods 0.000 description 5
- 230000020169 heat generation Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000012071 phase Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
Definitions
- the invention relates to the technical field of heat dissipation devices, in particular to a thin-plate loop heat pipe.
- Loop heat pipes are an advanced phase change heat transfer technology.
- a loop heat pipe consists of five basic components: evaporator (with capillary wick), vapor line, condenser, liquid line, and compensator. These five parts are connected in turn to form a closed loop, in which the working medium circulates.
- the working principle of the loop heat pipe is as follows: the evaporator contacts the heat source, the liquid working medium is vaporized on the surface of the capillary core in the evaporator, and the vaporized gaseous working medium enters the condenser along the gas pipeline, and releases heat in the condenser and condenses into a liquid state.
- the working medium then flows to the compensator along the liquid pipeline, infiltrates the capillary wick in the evaporator, and the liquid working medium is heated and evaporated again, and enters the next cycle.
- loop heat pipes have larger heat transfer capacity, longer heat transfer distance and more flexible arrangement.
- the thickness of the existing loop heat pipe is relatively large, and its main components are usually arranged separately and connected by welding, and the process is complicated.
- the pressure and temperature of the evaporator are higher than those of the compensator, so there is a heat load leaking from the evaporator to the compensator, which is called leakage heat.
- the leakage heat The heat needs to be offset by increasing the subcooling degree of the liquid working fluid returning from the condenser to maintain the thermal balance of the compensator.
- the technical problem to be solved by the present invention is to provide a thin-plate loop heat pipe with simple and efficient manufacturing process and small heat transfer temperature difference, so as to overcome the above-mentioned defects of the prior art.
- a thin-plate type loop heat pipe comprising a casing
- the casing comprises a first casing plate and a second casing plate which are relatively covered and connected with edges in a sealing manner, the first casing plate
- An evaporation cavity, a vapor passage, a condensation cavity, a liquid passage, a compensation cavity and an auxiliary fluid passage are formed between the second shell plate and the compensation cavity, and the liquid phase working medium is stored in the compensation cavity.
- a first capillary structure of a steam chamber and a second steam chamber the second steam chamber is located between the first steam chamber and the compensation chamber, and the second steam chamber and the compensation chamber are separated by the first capillary structure, and the first steam chamber
- the condensation chamber is connected to the condensation chamber through the vapor passage, the condensation chamber is connected to the compensation chamber through the liquid passage, and the auxiliary fluid passage is connected to the second vapor chamber and the liquid passage.
- the condensation chamber is provided with a flow channel.
- both ends of the auxiliary fluid channel are respectively connected to the second vapor chamber and the liquid channel.
- both ends of the auxiliary fluid channel are respectively connected to the second steam chamber and the condensation chamber.
- a concave area is etched on the inner wall of the first shell plate and/or the second shell plate, and an evaporation cavity, a vapor channel, a condensation cavity, and a liquid are formed between the first shell plate and the second shell plate at the concave region.
- Channels, Compensation Chambers and Auxiliary Fluid Channels are etched on the inner wall of the first shell plate and/or the second shell plate, and an evaporation cavity, a vapor channel, a condensation cavity, and a liquid are formed between the first shell plate and the second shell plate at the concave region.
- the casing is annular, and the evaporation chamber, the vapor passage, the condensation chamber, the liquid passage and the compensation chamber are sequentially arranged along the circumferential direction of the casing to form a closed circuit.
- the auxiliary fluid channel is located on one side of the vapor channel and shares the sealing edge of the housing with the vapor channel, or the auxiliary fluid channel is located on one side of the liquid channel and shares the sealing edge of the housing with the liquid channel.
- the auxiliary fluid channel has a sealing edge independent of the vapor channel and the liquid channel.
- the first capillary structure and the shell are separate structures, and the first capillary structure is a combination of one or more of wire mesh, powder sintered material, metal felt, fiber bundle, metal foam and laminated perforated metal sheet.
- a concave structure is provided on one end of the first capillary structure close to the compensation cavity, and a second steam cavity is formed between the concave structure and the casing.
- the first capillary structure and the shell are integral structures
- the inner wall of the first shell plate is etched with a plurality of first micro-channels at the evaporation chamber
- the inner wall of the second shell plate is etched at the evaporation chamber
- a groove is also etched on the inner wall of the second shell plate at the evaporation chamber, the groove and the second micro-channel are separated and independent from each other, and one end of the first micro-channel is arranged to intersect with the second micro-channel, And the other end of the first micro channel extends to intersect with the groove, and the groove, the second shell plate, the first micro channel and the first shell plate form a second steam cavity together.
- the condensation chamber is provided with a second capillary structure, and the second capillary structure extends to the evaporation chamber through one or more of the vapor passage, the liquid passage and the auxiliary fluid passage, and is in contact with or connected with the first capillary structure.
- the second capillary structure is a third microchannel formed by etching on the inner wall of the first shell plate and/or the second shell plate, or the second capillary structure is a wire mesh, powder sintered material, metal felt, A combination of one or more of fiber bundles, metal foam, and laminated perforated metal sheets.
- one or more of the condensation chamber, the vapor channel, the liquid channel and the auxiliary fluid channel are provided with a third capillary structure.
- the third capillary structure is a fourth microchannel formed by etching on the inner wall of the first shell plate and/or the second shell plate, or the third capillary structure is a wire mesh, powder sintered material, metal felt, A combination of one or more of fiber bundles, metal foam, and laminated perforated metal sheets.
- the casing is bent into a bent shape at any one or more positions except the evaporation chamber.
- the thin-plate loop heat pipe of the present invention adopts two shell plates to cover each other, and the edges are sealed and connected to form an evaporation chamber, a vapor channel, a condensation chamber, a liquid channel, a compensation chamber and an auxiliary fluid between the two shell plates.
- the structure of the channel integrates the various components of the loop heat pipe between the two shell plates, which greatly simplifies the structure, can significantly reduce the overall thickness of the thin-plate loop heat pipe, and the manufacturing process is simpler and more efficient.
- the thin-plate loop heat pipe of the present invention adds a second steam chamber and an auxiliary fluid channel, so that the heat leakage from the evaporation chamber to the compensation chamber is thermally isolated by the second steam chamber, That is, the leakage heat causes part of the working medium to vaporize in the second steam chamber, and the vaporized working medium in the second steam chamber flows into the liquid channel through the auxiliary fluid channel, and finally returns to the compensation chamber to complete the cycle.
- the thin-plate loop heat pipe of the present invention can well meet the heat dissipation requirements of ultra-thin and compact electronic devices with high heat flux density.
- FIG. 1 is a schematic diagram of the split structure of the first embodiment of the thin-plate loop heat pipe of the present invention.
- FIG. 2 is a partial enlarged schematic view of FIG. 1 .
- FIG. 3 is a schematic diagram of the use of the first embodiment of the thin-plate loop heat pipe of the present invention.
- FIG. 4 is a schematic structural diagram of the second embodiment of the thin-plate loop heat pipe of the present invention.
- FIG. 5 is a schematic diagram of the split structure of the first capillary structure in the third embodiment of the thin-plate loop heat pipe of the present invention.
- FIG. 6 is a schematic structural diagram of the fourth embodiment of the thin-plate loop heat pipe of the present invention.
- FIG. 7 is a schematic diagram of the use of the fourth embodiment of the thin-plate loop heat pipe of the present invention.
- FIG. 8 is a schematic structural diagram of a fifth embodiment of the thin-plate loop heat pipe of the present invention.
- FIG. 9 is a schematic structural diagram of a sixth embodiment of the thin-plate loop heat pipe of the present invention.
- the terms “installed”, “connected” and “connected” should be understood in a broad sense, unless otherwise expressly specified and limited, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements.
- installed should be understood in a broad sense, unless otherwise expressly specified and limited, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements.
- FIG. 1 to FIG. 9 an embodiment of the thin plate type loop heat pipe of the present invention is shown.
- the thin-plate loop heat pipe 100 of this embodiment includes a casing 1
- the casing 1 includes a first casing plate 11 and a second casing plate 12 , the first casing plate 11 and the second casing plate 11
- the plates 12 are relatively closed, and the edges of the first shell plate 11 and the second shell plate 12 are sealed and connected to form the sealing edge of the casing 1, thereby forming a casing between the first shell plate 11 and the second shell plate 12 1 of the inner sealed space.
- An evaporation chamber 2 , a vapor passage 3 , a condensation chamber 4 , a liquid passage 5 , a compensation chamber 6 and an auxiliary fluid passage 7 are formed between the first shell plate 11 and the second shell plate 12 .
- the evaporation chamber 2 is provided with a first capillary structure 21.
- the first capillary structure 21 divides the evaporation chamber 2 into a first steam chamber 22 and a second steam chamber 23.
- the second steam chamber 23 is located between the first steam chamber 22 and the compensation chamber 6. In between, the second steam chamber 23 and the compensation chamber 6 are separated by the first capillary structure 21 , and the second steam chamber 23 and the first steam chamber 22 are also separated by the first capillary structure 21 .
- the first capillary structure 21 can permeate the liquid-phase working medium and prevent the vapor-phase working medium from circulating between the second steam chamber 23 and the compensation chamber 6 and between the second steam chamber 23 and the first steam chamber 22 .
- the first steam chamber 22 is connected to the condensation chamber 4 through the vapor passage 3
- the condensation chamber 4 is connected to the compensation chamber 6 through the liquid passage 5
- the auxiliary fluid passage 7 is connected to the second steam chamber 23 and the liquid passage 5 .
- the liquid-phase working medium is stored in the compensation chamber 6 , and the liquid-phase working medium in the compensation chamber 6 can penetrate and infiltrate the first capillary structure 21 in the evaporation chamber 2 .
- the thin-plate loop heat pipe 100 of the present embodiment can be accommodated in a casing 201 of an electronic device 200 when in use.
- the casing 201 of the electronic device 200 has a heat source 202 , and the evaporation chamber 2 of the thin-plate loop heat pipe 100 and
- the heat source 202 is in contact with the heat source 202, and its working principle is: the evaporation chamber 2 contacts the heat source 202 to absorb the heat of the heat source 202, the liquid-phase working medium in the first steam chamber 22 is vaporized on the surface of the first capillary structure 21, and the vapor-phase working medium after vaporization It enters the condensation chamber 4 through the vapor channel 3.
- the condensation chamber 4 After the condensation chamber 4 releases heat and condenses, it returns to the compensation chamber 6 and the evaporation chamber 2 through the liquid channel 5, thus completing a cycle; at the same time, due to the temperature in the evaporation chamber 2 And the pressure is higher than the temperature and pressure of the working fluid in the compensation chamber 6, the evaporation chamber 2 starts to conduct heat to the compensation chamber 6, and when the heat is conducted to the second steam chamber 23, the liquid-phase working medium in the second steam chamber 23 is heated and vaporized, It absorbs most of the heat conducted from the evaporation chamber 2 to the compensation chamber 6, thereby significantly reducing the heat leakage into the compensation chamber 6.
- the vaporized vapor-phase working medium in the second steam chamber 23 flows into the liquid channel 5 through the auxiliary fluid channel 7. , returns to the compensation chamber 6 and the evaporation chamber 2 through the liquid channel 5, thereby completing another round of circulation; the two rounds of circulation are carried out in parallel.
- the thin-plate loop heat pipe 100 of the present embodiment adopts two shell plates to cover each other, and the edges are sealed and connected to form an evaporation chamber 2 , a vapor channel 3 , a condensation chamber 4 , and a liquid channel 5 between the two shell plates.
- the structure of the compensation cavity 6 and the auxiliary fluid channel 7 integrates the various components of the loop heat pipe between the two shell plates, which greatly simplifies the structure and can significantly reduce the overall thickness of the thin-plate loop heat pipe 100, and the manufacturing process Simpler and more efficient.
- the thin-plate loop heat pipe 100 of the present embodiment is provided with a second steam chamber 23 and an auxiliary fluid channel 7 , so that the heat leakage from the evaporation chamber 2 to the compensation chamber 6 is eliminated by the second steam chamber 23 and the auxiliary fluid passage 7 .
- the steam chamber 23 is thermally isolated, that is, the heat leakage causes part of the working medium to vaporize in the second steam chamber 23, and the vaporized working medium in the second steam chamber 23 flows into the liquid channel 5 through the auxiliary fluid channel 7, and Finally, it returns to the compensation chamber 6 to complete the cycle.
- the vaporization of the working fluid in the second steam chamber 23 absorbs most of the heat leakage from the evaporation chamber 2 to the compensation chamber 6, which can significantly reduce the heat leakage into the compensation chamber 6, thereby effectively
- the heat transfer temperature difference of the thin-plate loop heat pipe 100 is reduced to ensure the heat transfer performance of the thin-plate loop heat pipe 100 . Therefore, the thin-plate loop heat pipe 100 of this embodiment can well meet the heat dissipation requirements of ultra-thin and compact electronic devices with high heat flux density.
- the manner in which the auxiliary fluid passage 7 communicates with the second steam chamber 23 and the liquid passage 5 is not limited.
- both ends of the auxiliary fluid channel 7 are respectively connected to the second steam chamber 23 and the condensation chamber 4 , and the condensation chamber 4 is connected to the liquid channel 5 , thus achieving
- the auxiliary fluid passage 7 communicates the second vapor chamber 23 and the liquid passage 5 .
- the vaporized vapor-phase working medium in the second vapor chamber 23 enters the condensation chamber 4 through the auxiliary fluid channel 7. After the condensation chamber 4 releases heat and condenses, it returns to the liquid channel 5 for compensation along with the condensed working medium flowing through the vapor channel 3. Cavity 6.
- both ends of the auxiliary fluid channel 7 are respectively connected to the second vapor chamber 23 and the liquid channel 5 , that is, the auxiliary fluid channel 7 is directly connected to the liquid channel 5 .
- the vaporized vapor-phase working medium in the second vapor chamber 23 directly enters the liquid channel 5 through the auxiliary fluid channel 7. Because this part of the vapor-phase working medium has less mass, it gradually releases heat and condenses during the flow along the auxiliary fluid channel 7 and the liquid channel 5. , and finally return to the compensation chamber 6.
- a concave area is etched on the inner wall of the first shell plate 11 and/or the second shell plate 12, and an evaporation chamber is formed at the concave area between the first shell plate 11 and the second shell plate 12 2.
- Vapor channel 3 , condensation chamber 4 , liquid channel 5 , compensation chamber 6 and auxiliary fluid channel 7 is formed at the concave area between the first shell plate 11 and the second shell plate 12 2.
- a concave area can be etched on the inner wall of one of the first shell plate 11 and the second shell plate 12, and the inner wall of the other can be a flat surface, and the concave region on one shell plate and the flat surface on the other shell plate
- the inner sealed space of the shell 1 is formed by facing the cover, and the evaporation chamber 2, the vapor passage 3, the condensation chamber 4, the liquid passage 5, the compensation chamber 6 and the auxiliary fluid passage 7 are formed in the sealed space;
- the inner wall of the first shell plate 11 and the inner wall of the second shell plate 12 are both etched with concave areas, and the concave areas on the two shell plates are relatively covered to form the inner sealed space of the casing 1, and the evaporation is formed in the sealed space.
- Chamber 2 vapor channel 3 , condensation chamber 4 , liquid channel 5 , compensation chamber 6 and auxiliary fluid channel 7 .
- the inner wall of the first shell plate 11 and the inner wall of the second shell plate 12 refer to the opposite wall surfaces of the first shell plate 11 and the second shell plate 12 .
- a flow channel 41 is provided in the condensation chamber 4 .
- the vaporized vapor-phase working medium in the evaporation chamber 2 enters the condensation chamber 4 through the vapor channel 3 and the auxiliary fluid channel 7, and flows along the flow channel 41 in the condensation chamber 4 to release heat and condense to the outside.
- a plurality of flow channels 41 may be provided, and the plurality of flow channels 41 are arranged in parallel.
- the flow channel 41 can be formed by etching on the inner wall of the first shell plate 11 and/or the second shell plate 12 where the condensation chamber 4 is located. That is, the flow channel 41 may be etched on the inner wall of one of the first shell plate 11 and the second shell plate 12 , or the flow channel may be etched on both the inner wall of the first shell plate 11 and the inner wall of the second shell plate 12 41.
- the casing 1 is annular, and the evaporation chamber 2 , the vapor passage 3 , the condensation chamber 4 , the liquid passage 5 and the compensation chamber 6 are sequentially arranged along the circumferential direction of the casing 1 to form a closed circuit .
- the sealing edge of the casing 1 includes an outer peripheral sealing edge and an inner peripheral sealing edge
- the evaporation chamber 2, the vapor passage 3, the condensation chamber 4, the liquid passage 5 and the compensation chamber 6 are all formed on the outer peripheral sealing edge of the casing 1 and the inner peripheral sealing edge.
- the inner perimeter seals between the edges.
- the arrangement position of the auxiliary fluid channel 7 is not limited.
- the auxiliary fluid channel 7 may be located on one side of the vapor channel 3 and share the sealing edge of the housing 1 with the vapor channel 3 , that is, the auxiliary fluid channel 7 may share the sealing edge of the housing 1 with the vapor channel 3 .
- the auxiliary fluid channel 7 may be located on one side of the liquid channel 5 and share the sealing edge of the housing 1 with the liquid channel 5, that is, the auxiliary fluid channel 7 may be arranged in parallel with the liquid channel 5 and formed between the outer peripheral sealing edge of the housing 1 and the sealing edge of the housing 1.
- the auxiliary fluid channel 7 may have a sealing edge independent of the vapor channel 3 and the liquid channel 5, so that between the auxiliary fluid channel 7 and the vapor channel 3, the auxiliary fluid channel 7 and the liquid channel A space can be formed between 5.
- the arrangement form of the auxiliary fluid channel 7 can be selected and determined according to the conditions of use and installation position of the electronic device 200, so as to better adapt to different electronic devices 200 and use environments.
- the shape and structural form of the first capillary structure 21 are not limited.
- the first capillary structure 21 and the housing 1 may be separate structures, and the first capillary structure 21 may be combined with the inner wall of the first shell plate 11 or the second capillary structure 21 by sintering or welding.
- the first capillary structure 21 may be a combination of one or more of wire mesh, powder sintered material, metal felt, fiber bundle, metal foam and laminated perforated metal sheet.
- a concave structure may be provided on one end of the first capillary structure 21 close to the compensation cavity 6 , and a second steam cavity 23 is formed between the concave structure and the casing 1 .
- the first capillary structure 21 and the shell 1 may be an integral structure, and a plurality of first microchannels are etched on the inner wall of the first shell plate 11 at the evaporation chamber 2 11a, a plurality of second microchannels 12a are etched on the inner wall of the second shell plate 12 at the evaporation chamber 2, and the first microchannels 11a and the second microchannels 12a are both capable of permeating liquid due to their extremely small widths.
- the first micro-channel 11a and the second micro-channel 12a are arranged to cross each other, and the first micro-channel 11a and the second micro-channel 12a intersect each other to form a structure with extremely small pore size and capillary force, that is, the first capillary structure is formed. twenty one. Meanwhile, a first steam cavity 22 is formed between the first capillary structure 21 and the first shell plate 11 and the second shell plate 12 .
- a channel 12c is formed on the inner wall of the second shell plate 12 at the evaporation chamber 2, the channel 12c communicates with the second micro channel 12a, and a first steam is formed between the channel 12c and the first shell plate 11 In the cavity 22 , the vaporized vapor-phase working medium can escape along the channel 12 c and be collected into the vapor channel 3 .
- a groove 12b is also etched on the inner wall of the second shell plate 12 at the evaporation chamber 2, the groove 12b and the second micro channel 12a are separated and independent from each other, and the groove 12b and the channel 12c are also separated and independent from each other,
- One end of the first micro channel 11a is arranged to intersect with the second micro channel 12a, and the other end of the first micro channel 11a extends to intersect with the groove 12b, through the first micro channel 11a and the groove 12b Crossing each other, the groove 12b, the second shell plate 12, the first micro channel 11a, and the first shell plate 11 together form the second steam chamber 23.
- the groove 12b and the second micro channel 12a are separated and independent from each other , the groove 12b and the channel 12c are also separated and independent from each other, and the first micro channel 11a that is cross-connected with the groove 12b is a part of the first capillary structure 21, and the first micro channel 11a itself has a permeable liquid phase working medium and The properties of the vapor-phase working medium are blocked, so the second vapor chamber 23 and the first vapor chamber 22 are separated by the first capillary structure 21 .
- the first capillary structure 21 is a part of the housing 1 .
- the width of the first micro-channel 11a and the width of the second micro-channel 12a are both less than 0.3 mm.
- the second micro-channels 12a are preferably arranged at intervals to form channels, which is conducive to the escape of the working medium after vaporization.
- the condensation chamber 4 may be provided with a second capillary structure 42 .
- the second capillary structure 42 may extend to the evaporation chamber 2 through one or more of the vapor channel 3 , the liquid channel 5 and the auxiliary fluid channel 7 and contact or connect with the first capillary structure 21 .
- FIG. 1 only shows the situation where the second capillary structure 42 extends to the evaporation chamber 2 through the vapor channel 3 and is in contact with or connected with the first capillary structure 21 .
- the second capillary structure 42 can drain the liquid-phase working medium in the condensation chamber 4 to the first capillary structure 21 in the evaporation chamber 2, so as to infiltrate the first capillary structure 21, thereby avoiding the thin-plate loop in this embodiment.
- the first capillary structure 21 is in a dry state, which ensures that the thin-plate loop heat pipe 100 can be started normally.
- the shape and structural form of the second capillary structure 42 are not limited.
- the second capillary structure 42 and the casing 1 may be an integral structure, and the second capillary structure 42 is a first capillary structure 42 formed by etching on the inner wall of the first casing plate 11 and/or the second casing plate 12 .
- Three micro-channels, that is, the third micro-channel can be etched on the inner wall of one of the first shell plate 11 and the second shell plate 12 to form the second capillary structure 42, or the inner wall of the first shell plate 11 and the second shell plate 12 can be formed by etching the third micro-channel.
- Third micro-channels are etched on the inner wall of the second shell plate 12 to form the second capillary structure 42 .
- the width of the third microchannel is less than 0.3 mm.
- the second capillary structure 42 is a part of the housing 1 .
- the second capillary structure 42 and the shell 1 may be separate structures, and the second capillary structure 42 may be combined with the inner wall of the first shell plate 11 or the second shell plate 12 by sintering or welding
- the second capillary structure 42 can also be a combination of one or more of wire mesh, powder sintered material, metal felt, fiber bundle, metal foam and laminated perforated metal sheet.
- one or more of the condensation chamber 4 , the vapor channel 3 , the liquid channel 5 and the auxiliary fluid channel 7 are provided with a third capillary structure 8 .
- FIG. 6 only shows the case where the third capillary structure 8 is provided in the condensation chamber 4 and the liquid channel 5 .
- a compact electronic device 200 such as a smart phone, a tablet computer, a notebook computer, a wearable electronic device, etc. usually has a plurality of heat sources 202 , 203 , and 204 dispersed in positions, and the thin-plate loop heat pipe 100 of this embodiment is used.
- the heat source 202 in the electronic device 200 with the largest heat generation can be contacted by the evaporation chamber 2, the third capillary structure 8 arranged in the condensation chamber 4, the vapor channel 3, the liquid channel 5 and the auxiliary fluid channel 7 corresponds to the installation position according to the installation position.
- the vaporization chamber 2 absorbs the heat of the heat source 202, the liquid-phase working medium in the first vapor chamber 22 and the second vapor chamber 23 is heated and vaporized, and the vaporized vapor-phase working medium flows along the vapor channel 3 and the auxiliary fluid channel 7 respectively, During the flow process, heat will be released to the outside through the shell 1 and the outer shell 201 of the electronic device 200 in thermal contact with it, so that part of the vapor-phase working medium is condensed into a liquid phase, and this part of the liquid-phase working medium is along the vapor channel 3 and the auxiliary fluid channel.
- the third capillary structure 8 arranged in the vapor channel 3 and the auxiliary fluid channel 7 is adsorbed, and can be re-vaporized by absorbing the heat corresponding to the heat source here, and continues to flow forward along the circulation loop , and repeat the above-mentioned exothermic condensation-re-vaporization process in case of heat source until it enters the condensation chamber 4; the liquid-phase working medium after condensation in the condensation chamber 4 flows in the condensation chamber 4 and the liquid channel 5.
- the third capillary structure 8 in the liquid channel 5 is adsorbed, and can be vaporized by absorbing the heat corresponding to the heat source here, so that part of the liquid-phase working medium is in the vapor phase, and this part of the vapor-phase working medium flows along the liquid channel 5 during the process It will re-condense through the shell 1 and the outer shell 201 of the electronic device 200 in thermal contact with it, and continue to flow forward along the circulation loop, and repeat the above-mentioned process of vaporization in case of heat source-external heat release and recondensation until entering Compensation cavity 6. Therefore, the thin-plate loop heat pipe 100 of the present embodiment can simultaneously dissipate heat from a plurality of heat sources of the electronic device 200 on its circulating loop, and the heat dissipation capability is very strong.
- the heat source position and the heat dissipation position of the compact electronic device 200 are not limited to the positions of the heat sources 202, 203 and 204 shown in FIG. Due to the compact and miniaturized structure of the thin-plate loop heat pipe 100, there may be a heat source and heat dissipation of the electronic device 200 at any position on the entire circulation loop of the thin-plate loop heat pipe 100, and there may also be a heat dissipation part of the electronic device 200. Cover the entire thin plate type loop heat pipe 100 .
- the vaporized vapor-phase working medium in the first vapor chamber 22 and the second vapor chamber 23 enters the vapor channel 3 and the auxiliary fluid channel respectively. 7.
- the vapor-phase working medium will release heat through the shell 1 and the outer shell 201 of the electronic device 200 in thermal contact with it, so that part of the vapor-phase working medium condenses and becomes The liquid phase, and this part of the liquid phase working medium flows along the vapor channel 3 and the auxiliary fluid channel 7, if it does not pass the heat dissipation part of the electronic device 200, it will directly flow into the condensation chamber 4; At the position, it will absorb heat and vaporize again, and continue to flow forward along the circulation loop, and repeat the above-mentioned external exothermic condensation-endothermic re-vaporization process until it enters the condensation chamber 4 .
- the vapor passage 3 and the auxiliary fluid passage 7 actually also have a condensing function.
- the condensed liquid-phase working medium in the condensation chamber 4 enters the liquid channel 5, and the liquid-phase working medium flows directly into the compensation chamber 6 if it does not pass through the heat dissipation part of the electronic device 200 during the process of flowing along the liquid channel 5; If it passes through the heat dissipation part of the electronic device 200 , it will absorb heat and vaporize, so that part of the liquid-phase working medium is in the vapor phase, and this part of the vapor-phase working medium will pass through the shell 1 and be in thermal contact with it during the flow along the liquid channel 5 .
- the outer shell 201 of the electronic device 200 releases heat to the outside and condenses again, and continues to flow forward along the circulation loop, and repeats the above-mentioned endothermic vaporization-exothermic heat release and recondensation process until it enters the compensation chamber 6 . Therefore, the liquid passage 5 actually has a condensing function as well. Therefore, in the circulation loop of the thin-plate loop heat pipe 100 in this embodiment, the vapor passage 3 , the auxiliary fluid passage 7 , the condensation chamber 4 and the liquid passage 5 can be regarded as the condensation area as a whole. The flow in the area other than 2 can present repeated cycles of condensation-vaporization-recondensation for many times, and finally flows into the compensator 6 as a liquid-phase working medium.
- the shape and structural form of the third capillary structure 8 are not limited.
- the third capillary structure 8 and the housing 1 may be an integral structure, and the third capillary structure 8 is a first capillary structure 8 formed by etching on the inner wall of the first shell plate 11 and/or the second shell plate 12 .
- Four micro-channels, that is, the fourth micro-channel can be etched on the inner wall of one of the first shell plate 11 and the second shell plate 12 to form the third capillary structure 8, or the inner wall of the first shell plate 11 and the inner wall of the second shell plate 12 can be etched to form the third capillary structure 8.
- Fourth micro-channels are etched on the inner wall of the second shell plate 12 to form the third capillary structure 8 .
- the width of the fourth microchannel is less than 0.3 mm.
- the third capillary structure 8 is part of the housing 1 .
- the third capillary structure 8 and the shell 1 may be separate structures, and the third capillary structure 8 may be combined with the inner wall of the first shell plate 11 or the second shell plate 12 by sintering or welding
- the third capillary structure 8 can also be a combination of one or more of wire mesh, powder sintered material, metal felt, fiber bundle, metal foam and laminated perforated metal sheet.
- the casing 1 of the thin-plate type loop heat pipe 100 of the present embodiment may be in the shape of a flat plate.
- the shell 1 of the thin-plate loop heat pipe 100 of the present embodiment can also be bent into a bent shape at any one or more positions except the evaporation chamber 2 .
- the case where the condensation chamber 4 and the liquid channel 5 are respectively bent into a bent shape. Therefore, the thin-plate loop heat pipe 100 of the present embodiment can match the compact space layout of the electronic device 200 , so that the thin-plate loop of the present embodiment can be flexibly arranged in the housing 201 of the electronic device 200 according to the compact spatial layout of the electronic device 200 .
- Heat pipe 100 is
- the material of the casing 1 of the thin-plate loop heat pipe 100 in this embodiment is not limited.
- both the first shell plate 11 and the second shell plate 12 can be made of metal sheets, such as copper sheets with excellent thermal conductivity, and the two can be joined by diffusion welding.
- the casing 1 can also be made of a non-metallic material.
- both the first shell plate 11 and the second shell plate 12 are thin plates, and the thickness of the thin plates may be 0.2 mm-3 mm.
- the thicknesses of the first shell plate 11 and the second shell plate 12 may be the same or different.
- the working medium in the thin-plate loop heat pipe 100 in this embodiment can be reasonably selected according to the operating temperature requirements.
- the first embodiment of the thin-plate loop heat pipe 100 of the present embodiment is shown.
- the first shell plate 11 and the second shell plate 12 are covered relative to each other, and the edges are sealed and connected to form an annular casing 1, and the casing 1 is in the shape of a flat plate.
- a concave area is etched on the inner wall of the first shell plate 11 and/or the second shell plate 12, and an evaporation chamber 2, a vapor channel 3, a condensation chamber are formed between the first shell plate 11 and the second shell plate 12 at the concave area.
- the cavity 4, the liquid channel 5, the compensation cavity 6 and the auxiliary fluid channel 7, the evaporation cavity 2, the vapor channel 3, the condensation cavity 4, the liquid channel 5 and the compensation cavity 6 are arranged in sequence along the circumferential direction of the casing 1 and connected to form a closed loop.
- the evaporation chamber 2 is provided with a first capillary structure 21 that separates the evaporation chamber 2 into a first steam chamber 22 and a second steam chamber 23.
- the first capillary structure 21 and the shell 1 are separate structures, and in the first capillary structure 21 There is a concave structure on one end close to the compensation cavity 6, a second steam cavity 23 is formed between the concave structure and the casing 1, and the second steam cavity 23 and the compensation cavity 6 are separated by the first capillary structure 21 , the second steam chamber 23 and the first steam chamber 22 are also isolated by the first capillary structure 21 , the first steam chamber 22 is connected to the condensation chamber 4 through the vapor passage 3 , and the second steam chamber 23 is connected through the auxiliary fluid passage 7 .
- the auxiliary fluid channel 7 is located on one side of the vapor channel 3 and shares the sealing edge of the casing 1 with the vapor channel 3 .
- the condensation chamber 4 is provided with a plurality of flow channels 41 .
- the condensation chamber 4 is also provided with a second capillary structure 42.
- the second capillary structure 42 extends to the evaporation chamber 2 through one or more of the vapor passage 3, the liquid passage 5 and the auxiliary fluid passage 7 and is in phase with the first capillary structure 21. Contact or connection, the figure only shows the situation where the second capillary structure 42 extends to the evaporation chamber 2 through the vapor channel 3 and is in contact or connection with the first capillary structure 21 .
- the second capillary structure 42 and the housing 1 have an integral structure or a separate structure. In use, the thin-plate loop heat pipe 100 is accommodated in the casing 201 of the electronic device 200 , and the evaporation chamber 2 is in contact with the heat source 202 of the electronic device 200 .
- the second embodiment of the thin-plate loop heat pipe 100 of this embodiment is shown.
- the second embodiment is basically the same as the above-mentioned first embodiment, and the similarities will not be repeated.
- the sealing edge of the auxiliary fluid channel 7 and the vapor channel 3 and the auxiliary fluid channel 7 and the liquid channel 5 all form a space.
- the third embodiment of the thin-plate loop heat pipe 100 of the present embodiment is shown.
- the third embodiment is basically the same as the above-mentioned first embodiment, and the similarities will not be repeated.
- the difference is that in the third embodiment, the first capillary structure 21 and the housing 1
- a plurality of first micro-channels 11a are etched on the inner wall of a shell plate 11 at the evaporation chamber 2, and a plurality of second micro-channels 12a are etched on the inner wall of the second shell plate 12 at the evaporation chamber 2.
- a micro-channel 11a is arranged to intersect with the second micro-channel 12a to form a first capillary structure 21 .
- a first steam cavity 22 is formed between the first capillary structure 21 and the first shell plate 11 and the second shell plate 12, and a groove 12b is also etched at the first capillary structure 21, and the groove 12b is connected with the shell.
- a second steam chamber 23 is formed between 1 .
- FIG. 6 and FIG. 7 there is a fourth implementation of the thin-plate loop heat pipe 100 of this embodiment.
- the fourth embodiment is basically the same as the above-mentioned first embodiment, and the similarities will not be repeated. The difference is that in the fourth embodiment, the condensation chamber 4, the vapor passage 3, the liquid passage 5 and the auxiliary fluid
- One or more of the channels 7 are provided with a third capillary structure 8 , and only the case where the third capillary structure 8 is provided in the condensation chamber 4 and the liquid channel 5 is shown in the figure.
- the evaporation chamber 2 contacts the heat source 202 with the largest heat generation in the electronic device 200, and the third capillary structure 8 arranged in the condensation chamber 4, the vapor channel 3, the liquid channel 5 and the auxiliary fluid channel 7 corresponds to the installation position.
- the third capillary structure 8 and the housing 1 have an integral structure or a separate structure.
- FIG. 8 a fifth implementation of the thin-plate loop heat pipe 100 of the present embodiment is shown.
- the fifth embodiment is basically the same as the above-mentioned first embodiment, and the similarities will not be repeated.
- the casing 1 can be located anywhere except the evaporation chamber 2 or multiple positions are bent into a bent shape, and only the case where the condensation chamber 4 and the liquid channel 5 are respectively bent into a bent shape is shown in the figure.
- the sixth embodiment of the thin-plate loop heat pipe 100 of the present embodiment is shown.
- the sixth embodiment is basically the same as the above-mentioned first embodiment, and the similarities will not be repeated.
- the sealing edge of the auxiliary fluid passage 7 and the vapor passage 3 and the auxiliary fluid passage 7 and the liquid passage 5 all form a space.
- the auxiliary fluid channel 7 is directly connected with the liquid channel 5 .
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本发明涉及散热装置技术领域,尤其涉及一种薄板型环路热管,包括壳体,壳体包括相对盖合且边缘密封连接的第一壳板和第二壳板,第一壳板与第二壳板之间形成有蒸发腔、汽体通道、冷凝腔、液体通道、补偿腔和辅助流体通道,补偿腔内储存有液相工质,蒸发腔内设有将蒸发腔分隔成第一蒸汽腔和第二蒸汽腔的第一毛细结构,第二蒸汽腔位于第一蒸汽腔与补偿腔之间,第二蒸汽腔与补偿腔之间通过第一毛细结构隔离开,第一蒸汽腔和第二蒸汽腔分别通过汽体通道和辅助流体通道连通至冷凝腔,冷凝腔通过液体通道连通至补偿腔。将环路热管的各个部件集成于两个壳板之间,制造工艺更简单、高效。增设了第二蒸汽腔和辅助流体通道,可降低环路热管的传热温差。
Description
本发明涉及散热装置技术领域,尤其涉及一种薄板型环路热管。
近年来,很多电子设备朝超薄型、紧凑型发展,而且发热量越来越大。传统的热管越来越不能满足电子设备的散热需求。
环路热管是一项先进的相变传热技术。环路热管包括五个基本组成部分:蒸发器(含毛细芯)、汽体管线、冷凝器、液体管线和补偿器。这五个部分依次连接,构成闭合回路,其内部有工质循环流动。环路热管的工作原理为:蒸发器接触热源,液态工质在蒸发器内的毛细芯表面汽化,汽化后的汽态工质沿汽体管线进入冷凝器,在冷凝器内放热冷凝成液态工质,之后沿液体管线流至补偿器,浸润蒸发器内的毛细芯,液态工质受热再蒸发,进入下一循环。相比传统热管,环路热管具有更大的传热能力、更远的传热距离以及更灵活的布置形式。
然而,现有的环路热管厚度较大,其主要部件通常分开设置,并通过焊接连接,工艺复杂。此外,由于环路热管正常工作时,蒸发器的压力和温度皆高于补偿器,因此存在从蒸发器向补偿器泄漏的热负荷,称为漏热,依据环路热管的工作原理,该漏热需要通过增加从冷凝器回流的液态工质的过冷度来抵消,以维持补偿器的热平衡,漏热越大,需要的回流液态工质过冷度也就越大,由此导致环路热管冷热两端存在较大的传热温差,影响了环路热管的传热性能。而当环路热管微小型化后,蒸发器向补偿器的漏热问题就更为突出,导致环路热管的传热效率大幅降低。因此,现有环路热管不能满足超薄型、紧凑型的高热流密度电子设备的散热需求。
发明内容
本发明要解决的技术问题是提供一种制造工艺简单高效、传热温差小的薄板型环路热管,以克服现有技术的上述缺陷。
为了解决上述技术问题,本发明采用如下技术方案:一种薄板型环路热管,包括壳体,壳体包括相对盖合且边缘密封连接的第一壳板和第二壳板,第一壳板与第二壳板之间形成有蒸发腔、汽体通道、冷凝腔、液体通道、补偿腔和辅助流体通道,补偿腔内储存有液相工质, 蒸发腔内设有将蒸发腔分隔成第一蒸汽腔和第二蒸汽腔的第一毛细结构,第二蒸汽腔位于第一蒸汽腔与补偿腔之间,第二蒸汽腔与补偿腔之间通过第一毛细结构隔离开,第一蒸汽腔通过汽体通道连通至冷凝腔,冷凝腔通过液体通道连通至补偿腔,辅助流体通道连通第二蒸汽腔与液体通道。
优选地,冷凝腔内设有流道。
优选地,辅助流体通道的两端分别连接第二蒸汽腔和液体通道。
优选地,辅助流体通道的两端分别连接第二蒸汽腔和冷凝腔。
优选地,第一壳板和/或第二壳板的内壁上刻蚀有凹陷区域,第一壳板与第二壳板之间于凹陷区域处形成蒸发腔、汽体通道、冷凝腔、液体通道、补偿腔和辅助流体通道。
优选地,壳体呈环形,蒸发腔、汽体通道、冷凝腔、液体通道和补偿腔沿壳体的周向依次布置构成闭合回路。
优选地,辅助流体通道位于汽体通道的一侧并与汽体通道共用壳体的密封边缘,或者,辅助流体通道位于液体通道的一侧并与液体通道共用壳体的密封边缘。
优选地,辅助流体通道具有独立于汽体通道和液体通道的密封边缘。
优选地,第一毛细结构与壳体为分体式结构,第一毛细结构为丝网、粉末烧结材料、金属毡、纤维束、泡沫金属和层叠带孔金属片其中一种或多种的组合。
优选地,第一毛细结构靠近补偿腔的一端上设有凹形结构,凹形结构与壳体之间形成第二蒸汽腔。
优选地,第一毛细结构与壳体为一体式结构,第一壳板的内壁上在蒸发腔处刻蚀有多个第一微槽道,第二壳板的内壁上在蒸发腔处刻蚀有多个第二微槽道,第一微槽道与第二微槽道交叉布置形成第一毛细结构。
优选地,第二壳板的内壁上在蒸发腔处还刻蚀有凹槽,凹槽与第二微槽道相互分隔独立,第一微槽道的一端与第二微槽道相交叉布置,且第一微槽道的另一端延伸至与凹槽相交叉布置,凹槽、第二壳板、第一微槽道、第一壳板之间共同相形成第二蒸汽腔。
优选地,冷凝腔内设有第二毛细结构,第二毛细结构经过汽体通道、液体通道和辅助流体通道其中一个或多个延伸至蒸发腔并与第一毛细结构相接触或相连接。
优选地,第二毛细结构为在第一壳板和/或第二壳板的内壁上刻蚀形成的第三微槽道,或者,第二毛细结构为丝网、粉末烧结材料、金属毡、纤维束、泡沫金属和层叠带孔金属片其中一种或多种的组合。
优选地,冷凝腔、汽体通道、液体通道和辅助流体通道其中一个或多个内设有第三毛细结构。
优选地,第三毛细结构为在第一壳板和/或第二壳板的内壁上刻蚀形成的第四微槽道,或者,第三毛细结构为丝网、粉末烧结材料、金属毡、纤维束、泡沫金属和层叠带孔金属片其中一种或多种的组合。
优选地,壳体在除蒸发腔之外的任意一处或多处位置折弯成弯折状。
与现有技术相比,本发明具有显著的进步:
一方面,本发明的薄板型环路热管采用两个壳板相对盖合、边缘密封连接并在两个壳板之间形成蒸发腔、汽体通道、冷凝腔、液体通道、补偿腔和辅助流体通道的结构,将环路热管的各个部件集成于两个壳板之间,大大简化了结构,能够显著减小薄板型环路热管的整体厚度,且制造工艺更加简单、高效。另一方面,相较现有的环路热管,本发明的薄板型环路热管增设了第二蒸汽腔和辅助流体通道,使得蒸发腔向补偿腔的漏热被第二蒸汽腔进行热隔断,即,使该漏热引起部分工质在第二蒸汽腔内汽化,第二蒸汽腔内汽化后的汽态工质经辅助流体通道流入液体通道,并最终返回到补偿腔,完成循环,第二蒸汽腔内的工质汽化吸收了蒸发腔向补偿腔的漏热的绝大部分,能够显著降低漏入补偿腔的热量,从而有效降低薄板型环路热管的传热温差,保证薄板型环路热管的传热性能。因此,本发明的薄板型环路热管能够很好地满足超薄型、紧凑型的高热流密度电子设备的散热需求。
图1是本发明薄板型环路热管的第一种实施方式的分体结构示意图。
图2是图1中的局部放大示意图。
图3是本发明薄板型环路热管的第一种实施方式的使用示意图。
图4是本发明薄板型环路热管的第二种实施方式的结构示意图。
图5是本发明薄板型环路热管的第三种实施方式中,第一毛细结构的分体结构示意图。
图6是本发明薄板型环路热管的第四种实施方式的结构示意图。
图7是本发明薄板型环路热管的第四种实施方式的使用示意图。
图8是本发明薄板型环路热管的第五种实施方式的结构示意图。
图9是本发明薄板型环路热管的第六种实施方式的结构示意图。
其中,附图标记说明如下:
100 薄板型环路热管
1 壳体
11 第一壳板
11a 第一微槽道
12 第二壳板
12a 第二微槽道
12b 凹槽
12c 槽道
2 蒸发腔
21 第一毛细结构
22 第一蒸汽腔
23 第二蒸汽腔
3 汽体通道
4 冷凝腔
41 流道
42 第二毛细结构
5 液体通道
6 补偿腔
7 辅助流体通道
8 第三毛细结构
200 电子设备
201 外壳
202、203、204 热源
下面结合附图对本发明的具体实施方式作进一步详细说明。这些实施方式仅用于说明本发明,而并非对本发明的限制。
在本发明的描述中,需要说明的是,术语“中心”、“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示 所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性。
在本发明的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本发明中的具体含义。
此外,在本发明的描述中,除非另有说明,“多个”的含义是两个或两个以上。
如图1至图9所示,本发明薄板型环路热管的一种实施例。
参见图1、图2和图9,本实施例的薄板型环路热管100包括壳体1,壳体1包括第一壳板11和第二壳板12,第一壳板11和第二壳板12相对盖合,并且,第一壳板11和第二壳板12的边缘密封连接,形成壳体1的密封边缘,从而在第一壳板11与第二壳板12之间形成壳体1的内部密封空间。第一壳板11与第二壳板12之间形成有蒸发腔2、汽体通道3、冷凝腔4、液体通道5、补偿腔6和辅助流体通道7。蒸发腔2内设有第一毛细结构21,第一毛细结构21将蒸发腔2分隔成第一蒸汽腔22和第二蒸汽腔23,第二蒸汽腔23位于第一蒸汽腔22与补偿腔6之间,第二蒸汽腔23与补偿腔6之间通过第一毛细结构21隔离开,第二蒸汽腔23与第一蒸汽腔22之间也通过第一毛细结构21隔离开。第一毛细结构21能够渗透液相工质并阻止汽相工质在第二蒸汽腔23与补偿腔6之间、第二蒸汽腔23与第一蒸汽腔22之间流通。第一蒸汽腔22通过汽体通道3连通至冷凝腔4,冷凝腔4通过液体通道5连通至补偿腔6,辅助流体通道7连通第二蒸汽腔23与液体通道5。补偿腔6内储存有液相工质,补偿腔6内的液相工质可以渗透浸润蒸发腔2内的第一毛细结构21。
参见图3,本实施例的薄板型环路热管100在使用时可收容于电子设备200的外壳201内,电子设备200的外壳201内具有热源202,薄板型环路热管100的蒸发腔2与热源202相接触,其工作原理为:蒸发腔2与热源202接触吸收热源202的热量,第一蒸汽腔22内的液相工质在第一毛细结构21表面汽化,汽化后的汽相工质经汽体通道3进入冷凝腔4,在冷凝腔4放热冷凝后,经液体通道5返回补偿腔6及蒸发腔2,由此完成一轮循环;与此同时,由于蒸发腔2内的温度和压力高于补偿腔6内的工质的温度和压力,蒸发腔2开始向补偿腔6传导热量,导热至第二蒸汽腔23时,第二蒸汽腔23内的液相工质受热汽化,吸收了蒸发 腔2向补偿腔6传导热量的绝大部分,从而显著降低了漏入补偿腔6的热量,第二蒸汽腔23内汽化后的汽相工质通过辅助流体通道7流入液体通道5,经液体通道5返回补偿腔6及蒸发腔2,由此完成另一轮循环;两轮循环并列同时进行。
一方面,本实施例的薄板型环路热管100采用两个壳板相对盖合、边缘密封连接并在两个壳板之间形成蒸发腔2、汽体通道3、冷凝腔4、液体通道5、补偿腔6和辅助流体通道7的结构,将环路热管的各个部件集成于两个壳板之间,大大简化了结构,能够显著减小薄板型环路热管100的整体厚度,且制造工艺更加简单、高效。另一方面,相较现有的环路热管,本实施例的薄板型环路热管100增设了第二蒸汽腔23和辅助流体通道7,使得蒸发腔2向补偿腔6的漏热被第二蒸汽腔23进行热隔断,即,使该漏热引起部分工质在第二蒸汽腔23内汽化,第二蒸汽腔23内汽化后的汽态工质经辅助流体通道7流入液体通道5,并最终返回到补偿腔6,完成循环,第二蒸汽腔23内的工质汽化吸收了蒸发腔2向补偿腔6的漏热的绝大部分,能够显著降低漏入补偿腔6的热量,从而有效降低薄板型环路热管100的传热温差,保证薄板型环路热管100的传热性能。因此,本实施例的薄板型环路热管100能够很好地满足超薄型、紧凑型的高热流密度电子设备的散热需求。
本实施例中,辅助流体通道7连通第二蒸汽腔23与液体通道5的方式并不局限。
参见图1、图4、图6和图8,在一种实施方式中,辅助流体通道7的两端分别连接第二蒸汽腔23和冷凝腔4,而冷凝腔4连通液体通道5,因此实现辅助流体通道7连通第二蒸汽腔23与液体通道5。第二蒸汽腔23内汽化后的汽相工质通过辅助流体通道7进入冷凝腔4,在冷凝腔4放热冷凝后,随流经汽体通道3的冷凝工质一起经液体通道5返回补偿腔6。
参见图9,在另一种实施方式中,辅助流体通道7的两端分别连接第二蒸汽腔23和液体通道5,即辅助流体通道7直接与液体通道5相连。第二蒸汽腔23内汽化后的汽相工质通过辅助流体通道7直接进入液体通道5,因为此部分汽相工质量较少,沿辅助流体通道7和液体通道5流动过程逐渐放热并冷凝,并最终返回到补偿腔6。
本实施例中,优选地,第一壳板11和/或第二壳板12的内壁上刻蚀有凹陷区域,第一壳板11与第二壳板12之间于凹陷区域处形成蒸发腔2、汽体通道3、冷凝腔4、液体通道5、补偿腔6和辅助流体通道7。即,可以在第一壳板11和第二壳板12其中一个的内壁上刻蚀凹陷区域,另一个的内壁则为平整面,由一个壳板上的凹陷区域与另一个壳板上的平整面相对盖合形成壳体1的内部密封空间,并于该密封空间内形成蒸发腔2、汽体通道3、冷凝腔4、液体通道5、补偿腔6和辅助流体通道7;也可以在第一壳板11的内壁和第二壳板12的内壁 上均刻蚀凹陷区域,由两个壳板上的凹陷区域相对盖合形成壳体1的内部密封空间,并于该密封空间内形成蒸发腔2、汽体通道3、冷凝腔4、液体通道5、补偿腔6和辅助流体通道7。本文中,第一壳板11的内壁和第二壳板12的内壁是指第一壳板11和第二壳板12相对的壁面。
参见图1,本实施例中,优选地,冷凝腔4内设有流道41。蒸发腔2内汽化后的汽相工质经汽体通道3和辅助流体通道7进入冷凝腔4后,沿冷凝腔4内的流道41流动并对外放热冷凝。流道41可以设有多个,多个流道41并列设置。流道41可以通过在第一壳板11和/或第二壳板12的内壁上于冷凝腔4所在位置处刻蚀形成。即,可以在第一壳板11和第二壳板12其中一个的内壁上刻蚀流道41,也可以在第一壳板11的内壁和第二壳板12的内壁上均刻蚀流道41。
参见图1,本实施例中,优选地,壳体1呈环形,蒸发腔2、汽体通道3、冷凝腔4、液体通道5和补偿腔6沿壳体1的周向依次布置构成闭合回路。由此,壳体1的密封边缘包括外周密封边缘和内周密封边缘,蒸发腔2、汽体通道3、冷凝腔4、液体通道5和补偿腔6均形成于壳体1的外周密封边缘与内周密封边缘之间。
辅助流体通道7的布置位置则不局限。例如,参见图1、图6和图8,辅助流体通道7可以位于汽体通道3的一侧并与汽体通道3共用壳体1的密封边缘,即辅助流体通道7可以与汽体通道3并列设置并形成于壳体1的外周密封边缘与内周密封边缘之间。或者,辅助流体通道7可以位于液体通道5的一侧并与液体通道5共用壳体1的密封边缘,即辅助流体通道7可以与液体通道5并列设置并形成于壳体1的外周密封边缘与内周密封边缘之间。再或者,参见图4和图9,辅助流体通道7可以具有独立于汽体通道3和液体通道5的密封边缘,使得辅助流体通道7与汽体通道3之间、辅助流体通道7与液体通道5之间都能够形成间隔空间。实际应用时,辅助流体通道7的布置形式可以根据电子设备200的使用情况、安装位置等条件进行选择确定,以更好地适配不同的电子设备200和使用环境。
本实施例中,第一毛细结构21的形状和结构形式均不局限。
参见图2,在一种实施方式中,第一毛细结构21与壳体1可以为分体式结构,第一毛细结构21可以通过烧结或焊接的方式结合在第一壳板11的内壁或第二壳板12的内壁上,第一毛细结构21可以为丝网、粉末烧结材料、金属毡、纤维束、泡沫金属和层叠带孔金属片其中一种或多种的组合。优选地,可以在第一毛细结构21靠近补偿腔6的一端上设有凹形结构,由该凹形结构与壳体1之间形成第二蒸汽腔23。
参见图5,在另一种实施方式中,第一毛细结构21与壳体1可以为一体式结构,第一壳板11的内壁上在蒸发腔2处刻蚀有多个第一微槽道11a,第二壳板12的内壁上在蒸发腔2处刻蚀有多个第二微槽道12a,第一微槽道11a和第二微槽道12a均为因宽度极小而能够渗透液相工质且阻隔汽相工质的槽道。第一微槽道11a与第二微槽道12a交叉布置,通过第一微槽道11a与第二微槽道12a相互交叉,形成孔径极小、具有毛细力的结构,即形成第一毛细结构21。同时,第一毛细结构21与第一壳板11和第二壳板12之间形成第一蒸汽腔22。优选地,第二壳板12的内壁上在蒸发腔2处形成有槽道12c,槽道12c与第二微槽道12a相连通,槽道12c与第一壳板11之间形成第一蒸汽腔22,汽化后的汽相工质可沿槽道12c逃逸,并汇总进入汽体通道3。优选地,第二壳板12的内壁上在蒸发腔2处还刻蚀有凹槽12b,凹槽12b与第二微槽道12a相互分隔独立,凹槽12b与槽道12c也相互分隔独立,第一微槽道11a的一端与第二微槽道12a相交叉布置,且第一微槽道11a的另一端延伸至与凹槽12b相交叉布置,通过第一微槽道11a与凹槽12b相互交叉,凹槽12b、第二壳板12、第一微槽道11a、第一壳板11之间共同相形成第二蒸汽腔23,由于凹槽12b与第二微槽道12a相互分隔独立,凹槽12b与槽道12c也相互分隔独立,并且与凹槽12b交叉连通的第一微槽道11a是第一毛细结构21的一部分,第一微槽道11a本身具有渗透液相工质且阻隔汽相工质的特性,因此第二蒸汽腔23与第一蒸汽腔22被第一毛细结构21分隔开。由此,第一毛细结构21为壳体1的一部分。优选地,第一微槽道11a的宽度和第二微槽道12a的宽度均小于0.3mm。第二微槽道12a优选呈间隔布置形成通道,有利于工质汽化后逸出。
本实施例中,参见图1,优选地,冷凝腔4内可以设有第二毛细结构42。第二毛细结构42可以经过汽体通道3、液体通道5和辅助流体通道7其中一个或多个延伸至蒸发腔2并与第一毛细结构21相接触或相连接。图1中仅示出了第二毛细结构42经过汽体通道3延伸至蒸发腔2并与第一毛细结构21相接触或相连接的情况。第二毛细结构42可以将冷凝腔4中的液相工质引流至蒸发腔2内的第一毛细结构21,使其浸润第一毛细结构21,由此可以避免本实施例的薄板型环路热管100在启动前第一毛细结构21处于干涸状态,保证薄板型环路热管100能够正常启动。
本实施例中,第二毛细结构42的形状和结构形式均不局限。
在一种实施方式中,第二毛细结构42与壳体1可以为一体式结构,第二毛细结构42为在第一壳板11和/或第二壳板12的内壁上刻蚀形成的第三微槽道,即,可以在第一壳板11和第二壳板12其中一个的内壁上刻蚀第三微槽道构成第二毛细结构42,也可以在第一壳板 11的内壁和第二壳板12的内壁上均刻蚀第三微槽道共同构成第二毛细结构42。优选地,第三微槽道的宽度小于0.3mm。由此,第二毛细结构42为壳体1的一部分。
在另一种实施方式中,第二毛细结构42与壳体1可以为分体式结构,第二毛细结构42可以通过烧结或焊接的方式结合在第一壳板11的内壁或第二壳板12的内壁上,第二毛细结构42也可以为丝网、粉末烧结材料、金属毡、纤维束、泡沫金属和层叠带孔金属片其中一种或多种的组合。
本实施例中,参见图6,优选地,冷凝腔4、汽体通道3、液体通道5和辅助流体通道7其中一个或多个内设有第三毛细结构8。图6中仅示出了冷凝腔4和液体通道5内设有第三毛细结构8的情况。参见图7,紧凑型的电子设备200如智能手机、平板电脑、笔记本电脑、可穿戴电子器件等通常具有多个位置分散的热源202、203、204,采用本实施例的薄板型环路热管100时,可以由蒸发腔2接触电子设备200中发热量最大的热源202,由设于冷凝腔4、汽体通道3、液体通道5和辅助流体通道7内的第三毛细结构8根据安装位置对应接触电子设备200的其它发热量相对较小的热源203、204。蒸发腔2吸收热源202的热量,第一蒸汽腔22和第二蒸汽腔23内的液相工质受热汽化,汽化后的汽相工质分别沿汽体通道3和辅助流体通道7流动,在流动过程中会通过壳体1及与之热接触的电子设备200的外壳201对外放热,使得部分汽相工质冷凝呈液相,此部分液相工质沿汽体通道3和辅助流体通道7流动过程中途径设于汽体通道3和辅助流体通道7内的第三毛细结构8而被吸附,并可通过吸收对应此处的热源的热量而再次汽化,并继续沿循环回路向前流动,并重复上述对外放热冷凝-遇热源再汽化过程,直至进入冷凝腔4内;冷凝腔4冷凝后的液相工质在冷凝腔4和液体通道5内流动时途径设于冷凝腔4和液体通道5内的第三毛细结构8而被吸附,并可通过吸收对应此处的热源的热量而汽化,使得部分液相工质呈汽相,此部分汽相工质沿液体通道5流动过程中会通过壳体1及与之热接触的电子设备200的外壳201对外放热而再次冷凝,并继续沿循环回路向前流动,并重复上述遇热源汽化-对外放热再冷凝过程,直至进入补偿腔6内。由此,本实施例的薄板型环路热管100能够在其循环回路上对电子设备200的多个热源同时进行散热,散热能力非常强。
需要说明的是,在工作过程中,紧凑型的电子设备200的热源位置和散热位置并不局限于图7中所示的热源202、203、204所在的位置,实际上,由于电子设备200及薄板型环路热管100的结构紧凑型和微小化,在薄板型环路热管100的整个循环回路上的任意位置处都有可能存在电子设备200的热源和散热,也有可能电子设备200的散热部位覆盖整个薄板型 环路热管100。
因此,需要说明的是,本实施例的薄板型环路热管100在使用时,第一蒸汽腔22和第二蒸汽腔23内汽化后的汽相工质分别进入汽体通道3和辅助流体通道7,汽相工质在沿汽体通道3和辅助流体通道7流动的过程中会通过壳体1及与之热接触的电子设备200的外壳201对外放热,使得部分汽相工质冷凝呈液相,而此部分液相工质沿汽体通道3和辅助流体通道7流动过程中,若不经过电子设备200的散热部位,则会直接流入冷凝腔4内;若途径电子设备200的散热部位,则会吸收热量再次汽化,并继续沿循环回路向前流动,并重复上述对外放热冷凝-吸热再汽化过程,直至进入冷凝腔4内。因此,汽体通道3和辅助流体通道7实际上也具有冷凝功能。而冷凝腔4中冷凝后的液相工质进入液体通道5,液相工质在沿液体通道5流动的过程中,若不经过电子设备200的散热部位,则会直接流入补偿腔6内;若途径电子设备200的散热部位,则会吸收热量而汽化,使得部分液相工质呈汽相,而此部分汽相工质沿液体通道5流动过程中会通过壳体1及与之热接触的电子设备200的外壳201对外放热而再次冷凝,并继续沿循环回路向前流动,并重复上述吸热汽化-对外放热再冷凝过程,直至进入补偿腔6内。因此,液体通道5实际上也具有冷凝功能。故而,本实施例的薄板型环路热管100的循环回路中,汽体通道3、辅助流体通道7、冷凝腔4和液体通道5整体可视为冷凝区域,工质在循环回路中除蒸发腔2以外的区域内流动,可呈现多次冷凝-汽化-再冷凝的重复循环,最终以液相工质流入补偿器6内。
本实施例中,第三毛细结构8的形状和结构形式均不局限。
在一种实施方式中,第三毛细结构8与壳体1可以为一体式结构,第三毛细结构8为在第一壳板11和/或第二壳板12的内壁上刻蚀形成的第四微槽道,即,可以在第一壳板11和第二壳板12其中一个的内壁上刻蚀第四微槽道构成第三毛细结构8,也可以在第一壳板11的内壁和第二壳板12的内壁上均刻蚀第四微槽道共同构成第三毛细结构8。优选地,第四微槽道的宽度小于0.3mm。由此,第三毛细结构8为壳体1的一部分。
在另一种实施方式中,第三毛细结构8与壳体1可以为分体式结构,第三毛细结构8可以通过烧结或焊接的方式结合在第一壳板11的内壁或第二壳板12的内壁上,第三毛细结构8也可以为丝网、粉末烧结材料、金属毡、纤维束、泡沫金属和层叠带孔金属片其中一种或多种的组合。
参见图1、图4、图6和图9,本实施例的薄板型环路热管100的壳体1可以为平板状。参见图8,本实施例的薄板型环路热管100的壳体1也可以在除蒸发腔2之外的任意一处或 多处位置折弯成弯折状,图8中仅示出了在冷凝腔4和液体通道5处分别折弯成弯折状的情况。由此,本实施例的薄板型环路热管100可以匹配电子设备200紧凑的空间布局,实现根据电子设备200紧凑的空间布局在电子设备200的外壳201内灵活布置本实施例的薄板型环路热管100。
本实施例的薄板型环路热管100的壳体1的材质并不局限。例如,第一壳板11和第二壳板12可以均采用金属片,例如热传导性优秀的铜片,两者可以通过扩散焊接的方式结合。壳体1也可以采用非金属材质。
本实施例中,优选地,第一壳板11和第二壳板12均为薄板,薄板的厚度可以是0.2mm-3mm。第一壳板11和第二壳板12的厚度可以相同,也可以不同。
本实施例的薄板型环路热管100中的工质可以根据使用的工作温度要求进行合理选择。
以下提供本实施例的薄板型环路热管100的六种具体的实施方式。
参见图1至图3,为本实施例的薄板型环路热管100的第一种实施方式。在第一种实施方式中,第一壳板11和第二壳板12相对盖合且边缘密封连接形成环形的壳体1,壳体1为平板状。第一壳板11和/或第二壳板12的内壁上刻蚀有凹陷区域,第一壳板11与第二壳板12之间于凹陷区域处形成蒸发腔2、汽体通道3、冷凝腔4、液体通道5、补偿腔6和辅助流体通道7,蒸发腔2、汽体通道3、冷凝腔4、液体通道5和补偿腔6沿壳体1的周向依次布置且相连通构成闭合回路。蒸发腔2内设有将蒸发腔2分隔成第一蒸汽腔22和第二蒸汽腔23的第一毛细结构21,第一毛细结构21与壳体1为分体式结构,在第一毛细结构21靠近补偿腔6的一端上设有凹形结构,由该凹形结构与壳体1之间形成第二蒸汽腔23,第二蒸汽腔23与补偿腔6之间通过第一毛细结构21隔离开,第二蒸汽腔23与第一蒸汽腔22之间也通过第一毛细结构21隔离开,第一蒸汽腔22通过汽体通道3连通至冷凝腔4,第二蒸汽腔23通过辅助流体通道7连通至冷凝腔4,辅助流体通道7位于汽体通道3的一侧并与汽体通道3共用壳体1的密封边缘。冷凝腔4内设有多个流道41。冷凝腔4内还设有第二毛细结构42,第二毛细结构42经过汽体通道3、液体通道5和辅助流体通道7其中一个或多个延伸至蒸发腔2并与第一毛细结构21相接触或相连接,图中仅示出了第二毛细结构42经过汽体通道3延伸至蒸发腔2并与第一毛细结构21相接触或相连接的情况。第二毛细结构42与壳体1为一体式结构或分体式结构。使用时,该薄板型环路热管100收容于电子设备200的外壳201内,并由蒸发腔2与电子设备200的热源202接触。
参见图4,为本实施例的薄板型环路热管100的第二种实施方式。第二种实施方式与上 述第一种实施方式基本相同,相同之处不再赘述,不同之处在于,在第二种实施方式中,辅助流体通道7具有独立于汽体通道3和液体通道5的密封边缘,且辅助流体通道7与汽体通道3之间、辅助流体通道7与液体通道5之间都形成间隔空间。
参见图5,为本实施例的薄板型环路热管100的第三种实施方式。第三种实施方式与上述第一种实施方式基本相同,相同之处不再赘述,不同之处在于,在第三种实施方式中,第一毛细结构21与壳体1为一体式结构,第一壳板11的内壁上在蒸发腔2处刻蚀有多个第一微槽道11a,第二壳板12的内壁上在蒸发腔2处刻蚀有多个第二微槽道12a,第一微槽道11a与第二微槽道12a交叉布置,形成第一毛细结构21。同时,第一毛细结构21与第一壳板11和第二壳板12之间形成第一蒸汽腔22,在第一毛细结构21处还刻蚀凹槽12b,由该凹槽12b与壳体1之间形成第二蒸汽腔23。
参见图6和图7,为本实施例的薄板型环路热管100的第四种实施方式。第四种实施方式与上述第一种实施方式基本相同,相同之处不再赘述,不同之处在于,在第四种实施方式中,冷凝腔4、汽体通道3、液体通道5和辅助流体通道7其中一个或多个内设有第三毛细结构8,图中仅示出了冷凝腔4和液体通道5内设有第三毛细结构8的情况。使用时,由蒸发腔2接触电子设备200中发热量最大的热源202,由设于冷凝腔4、汽体通道3、液体通道5和辅助流体通道7内的第三毛细结构8根据安装位置对应接触电子设备200的其它发热量相对较小的热源203、204。第三毛细结构8与壳体1为一体式结构或分体式结构。
参见图8,为本实施例的薄板型环路热管100的第五种实施方式。第五种实施方式与上述第一种实施方式基本相同,相同之处不再赘述,不同之处在于,在第五种实施方式中,壳体1可以在除蒸发腔2之外的任意一处或多处位置折弯成弯折状,图中仅示出了在冷凝腔4和液体通道5处分别折弯成弯折状的情况。
参见图9,为本实施例的薄板型环路热管100的第六种实施方式。第六种实施方式与上述第一种实施方式基本相同,相同之处不再赘述,不同之处在于,在第六种实施方式中,辅助流体通道7具有独立于汽体通道3和液体通道5的密封边缘,且辅助流体通道7与汽体通道3之间、辅助流体通道7与液体通道5之间都形成间隔空间。并且,辅助流体通道7直接与液体通道5相连。
以上所述仅是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明技术原理的前提下,还可以做出若干改进和替换,这些改进和替换也应视为本发明的保护范围。
Claims (17)
- 一种薄板型环路热管,其特征在于,包括壳体(1),所述壳体(1)包括相对盖合且边缘密封连接的第一壳板(11)和第二壳板(12),所述第一壳板(11)与所述第二壳板(12)之间形成有蒸发腔(2)、汽体通道(3)、冷凝腔(4)、液体通道(5)、补偿腔(6)和辅助流体通道(7),所述补偿腔(6)内储存有液相工质,所述蒸发腔(2)内设有将所述蒸发腔(2)分隔成第一蒸汽腔(22)和第二蒸汽腔(23)的第一毛细结构(21),所述第二蒸汽腔(23)位于所述第一蒸汽腔(22)与所述补偿腔(6)之间,所述第二蒸汽腔(23)与所述补偿腔(6)之间通过所述第一毛细结构(21)隔离开,所述第一蒸汽腔(22)通过所述汽体通道(3)连通至所述冷凝腔(4),所述冷凝腔(4)通过所述液体通道(5)连通至所述补偿腔(6),所述辅助流体通道(7)连通所述第二蒸汽腔(23)与所述液体通道(5)。
- 根据权利要求1所述的薄板型环路热管,其特征在于,所述冷凝腔(4)内设有流道(41)。
- 根据权利要求1所述的薄板型环路热管,其特征在于,所述辅助流体通道(7)的两端分别连接所述第二蒸汽腔(23)和所述液体通道(5)。
- 根据权利要求1所述的薄板型环路热管,其特征在于,所述辅助流体通道(7)的两端分别连接所述第二蒸汽腔(23)和所述冷凝腔(4)。
- 根据权利要求1所述的薄板型环路热管,其特征在于,所述第一壳板(11)和/或所述第二壳板(12)的内壁上刻蚀有凹陷区域,所述第一壳板(11)与所述第二壳板(12)之间于所述凹陷区域处形成所述蒸发腔(2)、所述汽体通道(3)、所述冷凝腔(4)、所述液体通道(5)、所述补偿腔(6)和所述辅助流体通道(7)。
- 根据权利要求1所述的薄板型环路热管,其特征在于,所述壳体(1)呈环形,所述蒸发腔(2)、所述汽体通道(3)、所述冷凝腔(4)、所述液体通道(5)和所述补偿腔(6)沿所述壳体(1)的周向依次布置构成闭合回路。
- 根据权利要求6所述的薄板型环路热管,其特征在于,所述辅助流体通道(7)位于所述汽体通道(3)的一侧并与所述汽体通道(3)共用所述壳体(1)的密封边缘,或者,所述辅助流体通道(7)位于所述液体通道(5)的一侧并与所述液体通道(5)共用所述壳体(1)的密封边缘。
- 根据权利要求6所述的薄板型环路热管,其特征在于,所述辅助流体通道(7)具有独立于所述汽体通道(3)和所述液体通道(5)的密封边缘。
- 根据权利要求1所述的薄板型环路热管,其特征在于,所述第一毛细结构(21)与所述 壳体(1)为分体式结构,所述第一毛细结构(21)为丝网、粉末烧结材料、金属毡、纤维束、泡沫金属和层叠带孔金属片其中一种或多种的组合。
- 根据权利要求9所述的薄板型环路热管,其特征在于,所述第一毛细结构(21)靠近所述补偿腔(6)的一端上设有凹形结构,所述凹形结构与所述壳体(1)之间形成所述第二蒸汽腔(23)。
- 根据权利要求1所述的薄板型环路热管,其特征在于,所述第一毛细结构(21)与所述壳体(1)为一体式结构,所述第一壳板(11)的内壁上在所述蒸发腔(2)处刻蚀有多个第一微槽道(11a),所述第二壳板(12)的内壁上在所述蒸发腔(2)处刻蚀有多个第二微槽道(12a),所述第一微槽道(11a)与所述第二微槽道(12a)交叉布置形成所述第一毛细结构(21)。
- 根据权利要求11所述的薄板型环路热管,其特征在于,所述第二壳板(12)的内壁上在所述蒸发腔(2)处还刻蚀有凹槽(12b),所述凹槽(12b)与所述第二微槽道(12a)相互分隔独立,所述第一微槽道(11a)的一端与所述第二微槽道(12a)相交叉布置,且所述第一微槽道(11a)的另一端延伸至与所述凹槽(12b)相交叉布置,所述凹槽(12b)、所述第二壳板(12)、所述第一微槽道(11a)、所述第一壳板(11)之间共同相形成所述第二蒸汽腔(23)。
- 根据权利要求1所述的薄板型环路热管,其特征在于,所述冷凝腔(4)内设有第二毛细结构(42),所述第二毛细结构(42)经过所述汽体通道(3)、所述液体通道(5)和所述辅助流体通道(7)其中一个或多个延伸至所述蒸发腔(2)并与所述第一毛细结构(21)相接触或相连接。
- 根据权利要求13所述的薄板型环路热管,其特征在于,所述第二毛细结构(42)为在所述第一壳板(11)和/或所述第二壳板(12)的内壁上刻蚀形成的第三微槽道,或者,所述第二毛细结构(42)为丝网、粉末烧结材料、金属毡、纤维束、泡沫金属和层叠带孔金属片其中一种或多种的组合。
- 根据权利要求1所述的薄板型环路热管,其特征在于,所述冷凝腔(4)、所述汽体通道(3)、所述液体通道(5)和所述辅助流体通道(7)其中一个或多个内设有第三毛细结构(8)。
- 根据权利要求15所述的薄板型环路热管,其特征在于,所述第三毛细结构(8)为在所述第一壳板(11)和/或所述第二壳板(12)的内壁上刻蚀形成的第四微槽道,或者,所 述第三毛细结构(8)为丝网、粉末烧结材料、金属毡、纤维束、泡沫金属和层叠带孔金属片其中一种或多种的组合。
- 根据权利要求1所述的薄板型环路热管,其特征在于,所述壳体(1)在除所述蒸发腔(2)之外的任意一处或多处位置折弯成弯折状。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18/279,870 US20240044582A1 (en) | 2021-03-01 | 2021-11-26 | Thin-plate loop heat pipe |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110222991.8 | 2021-03-01 | ||
CN202120431012.5 | 2021-03-01 | ||
CN202110222991 | 2021-03-01 | ||
CN202120431012 | 2021-03-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022183793A1 true WO2022183793A1 (zh) | 2022-09-09 |
Family
ID=83154925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2021/133542 WO2022183793A1 (zh) | 2021-03-01 | 2021-11-26 | 薄板型环路热管 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20240044582A1 (zh) |
WO (1) | WO2022183793A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115493436A (zh) * | 2022-09-15 | 2022-12-20 | 维沃移动通信有限公司 | 蒸发器、散热装置及电子设备 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2755219A3 (fr) * | 1996-10-30 | 1998-04-30 | N Proizv Objedinenie Im Sa Lav | Tube thermique de circuit |
US20080283223A1 (en) * | 2007-05-16 | 2008-11-20 | Industrial Technology Research Institute | Heat Dissipation System With A Plate Evaporator |
CN104930893A (zh) * | 2015-05-29 | 2015-09-23 | 西安交通大学 | 一种喷射器辅助式平板型环路热管 |
US20150338171A1 (en) * | 2012-12-28 | 2015-11-26 | Ibérica Del Espacio, S.A. | Loop heat pipe apparatus for heat transfer and thermal control |
CN205262267U (zh) * | 2015-11-23 | 2016-05-25 | 天津商业大学 | 一种平板式环路热管散热器*** |
CN108253830A (zh) * | 2018-01-30 | 2018-07-06 | 中国科学院理化技术研究所 | 具有辅助输液管路的回路热管 |
CN110530185A (zh) * | 2019-08-20 | 2019-12-03 | 西安交通大学 | 一种带支路的微结构液体自驱动平板式环路热管 |
CN112201635A (zh) * | 2020-10-10 | 2021-01-08 | 西安交通大学 | 一种协同驱动的高热流密度芯片相变散热装置和方法 |
CN215572347U (zh) * | 2021-08-03 | 2022-01-18 | 苏州圣荣元电子科技有限公司 | 一种环路热管 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2752291B1 (fr) * | 1996-08-12 | 1998-09-25 | Centre Nat Etd Spatiales | Evaporateur capillaire pour boucle diphasique de transfert d'energie entre une source chaude et une source froide |
JP3450148B2 (ja) * | 1997-03-07 | 2003-09-22 | 三菱電機株式会社 | ループ型ヒートパイプ |
TWI660151B (zh) * | 2018-04-26 | 2019-05-21 | 泰碩電子股份有限公司 | 在冷凝段有部分填滿毛細材的迴路熱管 |
TW201945682A (zh) * | 2018-04-26 | 2019-12-01 | 泰碩電子股份有限公司 | 透過分隔牆分隔汽態及液態工作流體通道的迴路式均溫裝置 |
-
2021
- 2021-11-26 US US18/279,870 patent/US20240044582A1/en active Pending
- 2021-11-26 WO PCT/CN2021/133542 patent/WO2022183793A1/zh active Application Filing
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2755219A3 (fr) * | 1996-10-30 | 1998-04-30 | N Proizv Objedinenie Im Sa Lav | Tube thermique de circuit |
US20080283223A1 (en) * | 2007-05-16 | 2008-11-20 | Industrial Technology Research Institute | Heat Dissipation System With A Plate Evaporator |
US20150338171A1 (en) * | 2012-12-28 | 2015-11-26 | Ibérica Del Espacio, S.A. | Loop heat pipe apparatus for heat transfer and thermal control |
CN104930893A (zh) * | 2015-05-29 | 2015-09-23 | 西安交通大学 | 一种喷射器辅助式平板型环路热管 |
CN205262267U (zh) * | 2015-11-23 | 2016-05-25 | 天津商业大学 | 一种平板式环路热管散热器*** |
CN108253830A (zh) * | 2018-01-30 | 2018-07-06 | 中国科学院理化技术研究所 | 具有辅助输液管路的回路热管 |
CN110530185A (zh) * | 2019-08-20 | 2019-12-03 | 西安交通大学 | 一种带支路的微结构液体自驱动平板式环路热管 |
CN112201635A (zh) * | 2020-10-10 | 2021-01-08 | 西安交通大学 | 一种协同驱动的高热流密度芯片相变散热装置和方法 |
CN215572347U (zh) * | 2021-08-03 | 2022-01-18 | 苏州圣荣元电子科技有限公司 | 一种环路热管 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115493436A (zh) * | 2022-09-15 | 2022-12-20 | 维沃移动通信有限公司 | 蒸发器、散热装置及电子设备 |
WO2024055907A1 (zh) * | 2022-09-15 | 2024-03-21 | 维沃移动通信有限公司 | 蒸发器、散热装置及电子设备 |
Also Published As
Publication number | Publication date |
---|---|
US20240044582A1 (en) | 2024-02-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN113983843A (zh) | 薄板型环路热管 | |
KR100912538B1 (ko) | 평판형 마이크로 열이송 장치 | |
US9423187B2 (en) | Plate type heat pipe with mesh wick structure having opening | |
US8792240B2 (en) | Heat dissipation device and radio frequency module with the same | |
TWI443944B (zh) | Thin hot plate structure | |
JP2017531154A (ja) | 貯留機能を備えた平面型ヒートパイプ | |
WO2022183793A1 (zh) | 薄板型环路热管 | |
CN110710342A (zh) | 薄板型热管及其制造方法 | |
CN114727546B (zh) | 一种散热装置和电子设备 | |
TW201947180A (zh) | 液、汽分離之迴路均溫板 | |
CN110243217A (zh) | 一种带有包围式储液室的平板型环路热管蒸发器 | |
TW202221274A (zh) | 立體傳熱裝置 | |
CN114383447A (zh) | 蒸发器和环路热管 | |
US20070034358A1 (en) | Heat dissipation device | |
US20230358482A1 (en) | Three-dimensional heat exchanger | |
CN211210319U (zh) | 冷凝器的稳流增压装置 | |
CN216668394U (zh) | 薄板型环路热管 | |
WO2001063195A1 (fr) | Caloduc mince et procede de fabrication correspondant | |
CN215572347U (zh) | 一种环路热管 | |
JP3168202U (ja) | 薄板型ヒートパイプの構造 | |
WO2021213391A1 (zh) | 一种均温板和电子设备 | |
CN216245752U (zh) | 环路热管、降低环路热管传热温差的组件 | |
WO2022183773A1 (zh) | 环路热管、降低环路热管传热温差的方法及组件 | |
CN116518760B (zh) | 一种分流通道式平板环路热管 | |
WO2024021719A1 (zh) | 一种均热板及电子设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 21928865 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 18279870 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 21928865 Country of ref document: EP Kind code of ref document: A1 |