WO2022137457A1 - Substrate work machine and method for measuring depth of viscous body - Google Patents

Substrate work machine and method for measuring depth of viscous body Download PDF

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Publication number
WO2022137457A1
WO2022137457A1 PCT/JP2020/048555 JP2020048555W WO2022137457A1 WO 2022137457 A1 WO2022137457 A1 WO 2022137457A1 JP 2020048555 W JP2020048555 W JP 2020048555W WO 2022137457 A1 WO2022137457 A1 WO 2022137457A1
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WO
WIPO (PCT)
Prior art keywords
viscous body
measuring member
measuring
depth
flux
Prior art date
Application number
PCT/JP2020/048555
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French (fr)
Japanese (ja)
Inventor
正太郎 皆川
Original Assignee
株式会社Fuji
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to PCT/JP2020/048555 priority Critical patent/WO2022137457A1/en
Priority to JP2022570906A priority patent/JPWO2022137457A1/ja
Priority to CN202080107066.4A priority patent/CN116490752A/en
Publication of WO2022137457A1 publication Critical patent/WO2022137457A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/04—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by dip members, e.g. dip-sticks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
    • G01F23/28—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring the variations of parameters of electromagnetic or acoustic waves applied directly to the liquid or fluent solid material
    • G01F23/284—Electromagnetic waves
    • G01F23/292—Light, e.g. infrared or ultraviolet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • This specification relates to a substrate working machine and a method for measuring the depth of a viscous body.
  • a viscous body for example, flux or the like
  • a component for example, an electrode of an electronic component
  • the substrate working machine may be provided with a storage unit for storing the viscous body.
  • the substrate working machine disclosed in International Publication No. 2015/097731 is provided with a mechanism for measuring the depth of the viscous body stored in the storage unit.
  • 2015/097731 includes a measuring jig including a plurality of rod-shaped measuring units. Since the lengths of the plurality of measuring units are different, the positions of the lower ends of the plurality of measuring units are different from each other.
  • the measuring jig is positioned at a predetermined height set in advance with respect to the storage part, a plurality of measuring parts are pressed against the surface of the stored viscous body, and the measuring part is applied to the surface of the viscous body. Make a measurement mark. Then, the surface of the viscous body is imaged from above using an image pickup device, and the measurement mark is detected from the captured image. As described above, since the positions of the lower ends of the plurality of measuring units are different from each other, it is possible to measure the range of the depth of the viscous body by identifying which measuring unit has detected the measurement mark. There is.
  • This specification discloses a technique for efficiently measuring the depth of a viscous body in a storage portion that stores a viscous body attached to a component.
  • the board working machine disclosed in this specification performs work on the board.
  • the board working machine includes a storage unit that stores the viscous body to be attached to the component, a measuring member used to measure the depth of the viscous body stored in the storage unit, and a head to which the measuring member is detachably mounted.
  • An image pickup device that is installed so as to move integrally with the head and captures an image of the measurement member mounted on the head, and a measurement that is imaged by the image pickup device when the measurement member adsorbed on the head is immersed in the reservoir.
  • a specific portion for specifying the depth of the viscous body in the reservoir from the captured image of the member is provided.
  • the measuring member is immersed in the viscous body in the reservoir, and the depth of the viscous body in the reservoir is specified from the captured image of the measuring member after the immersion.
  • it is not necessary to take an image of the viscous body in the storage portion after the measuring member is immersed, and the depth of the viscous body in the storage portion can be efficiently measured.
  • the measuring method disclosed in this embodiment is a method of measuring the depth of the viscous body in the storage portion for storing the viscous body to be attached to the component.
  • the measuring method includes a dipping step of immersing the measuring member in the reservoir and a measuring step of measuring the length in the height direction of the viscous body adhering to the side of the measuring member immersed in the reservoir in the dipping step. , Equipped with.
  • FIG. 1 is a cross-sectional view taken along the line II-II of FIG.
  • the flowchart which shows an example of the process of measuring the film thickness of the flux stored in a storage part using a measuring member.
  • the measuring member mounted on the head is immersed in the storage portion, and the measured member after immersion is imaged by an image pickup device that moves integrally with the head. Since the head, the measuring member, and the imaging device move integrally, the viscous body attached to the measuring member can be efficiently imaged. Therefore, the process of measuring the depth of the viscous body in the storage portion can be efficiently executed.
  • the image pickup apparatus may image the measuring member from the side.
  • the specific unit may detect the range of the viscous body attached to the measuring member from the captured image to specify the depth of the viscous body in the storage unit. According to such a configuration, since the measuring member is imaged from the side, the depth of the viscous body in the reservoir can be accurately measured from the range of the viscous body attached to the measuring member.
  • the parts may be set to be immersed in a predetermined position of the storage portion.
  • the position where the measuring member is immersed may be a predetermined position of the storage portion (that is, a position where the component is immersed in the viscous body).
  • the depth of the viscous material in the reservoir may vary slightly depending on the location.
  • the board working machine will be described with reference to the drawings.
  • the component mounting machine 10 will be described as an example of the board working machine.
  • the component mounting machine 10 is a device for mounting the electronic component 4 on the circuit board 2.
  • the component mounting machine 10 is also referred to as an electronic component mounting device or a chip mounter.
  • the component mounting machine 10 is installed together with other board working machines such as a solder printing machine and a board inspection machine to form a series of mounting lines.
  • the component mounting machine 10 moves a plurality of component feeders 12, a feeder holding unit 14, a mounting head 16, an imaging device 30, a mounting head 16, and an imaging device 30. It includes an apparatus 18, a nozzle accommodating portion 34, a nozzle holder 36, a substrate conveyor 20, a flux unit 40, a control device 22, and a touch panel 24.
  • a management device 8 configured to be able to communicate with the component mounting machine 10 is arranged outside the component mounting machine 10.
  • Each component feeder 12 accommodates a plurality of electronic components 4.
  • the component feeder 12 is detachably attached to the feeder holding portion 14 and supplies the electronic component 4 to the mounting head 16.
  • the specific configuration of the component feeder 12 is not particularly limited.
  • Each component feeder 12 is, for example, a tape-type feeder that accommodates a plurality of electronic components 4 on a wound tape, a tray-type feeder that accommodates a plurality of electronic components 4 on a tray, or a plurality of electronic components 4 in a container. It may be any of the bulk type feeders that randomly accommodate the above.
  • the feeder holding unit 14 is provided with a plurality of slots, and the component feeder 12 can be detachably installed in each of the plurality of slots.
  • the feeder holding portion 14 may be fixed to the component mounting machine 10 or may be detachable from the component mounting machine 10.
  • the mounting head 16 has a nozzle 6 that attracts the electronic component 4.
  • the nozzle 6 is detachably attached to the mounting head 16.
  • the mounting head 16 can move the nozzle 6 in the Z direction (here, the vertical direction), and brings the nozzle 6 closer to and further from the component feeder 12 and the circuit board 2.
  • the mounting head 16 can mount the electronic component 4 sucked on the nozzle 6 on the circuit board 2 while sucking the electronic component 4 from the component feeder 12 by the nozzle 6.
  • the mounting head 16 is not limited to the one having a single nozzle 6, and may have a plurality of nozzles 6.
  • the image pickup device 30 is fixed to the moving base 18a by the fixing member 29, and moves integrally with the moving base 18a.
  • the image pickup apparatus 30 includes a camera 32, a light source for illumination (not shown), and a prism (not shown).
  • the camera 32 takes an image of the nozzle 6 from the horizontal direction (that is, the ⁇ Y direction) so as to include the entire axial direction (that is, the Z direction) of the nozzle 6.
  • a CCD camera is used.
  • the illumination light source is composed of LEDs and illuminates the image pickup surface (side surface in the ZX plane direction in this embodiment) of the nozzle 6.
  • the prism aligns the optical axis of the camera 32 with the image pickup target.
  • the entire axial direction of the nozzle 6 is illuminated by the illumination light source, and the reflected light is reflected by the prism and guided to the camera 32, so that the camera 32 takes an image of the nozzle 6.
  • the image data of the image captured by the camera 32 is stored in the memory (not shown) of the control device 22.
  • the moving device 18 moves the mounting head 16 and the image pickup device 30 between the component feeder 12 and the circuit board 2.
  • the moving device 18 of this embodiment is an XY robot that moves the moving base 18a in the X direction and the Y direction, and the mounting head 16 and the imaging device 30 are fixed to the moving base 18a.
  • the mounting head 16 is not limited to the one fixed to the moving base 18a, and may be detachably attached to the moving base 18a.
  • the nozzle accommodating portion 34 is arranged between the component feeder 12 and the substrate conveyor 20 (specifically, the substrate conveyor 20 installed on the component feeder 12 side of the pair of substrate conveyors 20).
  • the nozzle accommodating portion 34 can accommodate a plurality of nozzles 6, and transfers the nozzle 6 to and from the mounting head 16.
  • the plurality of nozzles 6 are housed in the nozzle holder 36 attached to the nozzle housing portion 34.
  • a plurality of types of nozzles 6 can be accommodated in the nozzle holder 36.
  • the nozzle holder 36 is removable from the nozzle accommodating portion 34, and is removed from the nozzle accommodating portion 34, for example, when an operator replaces the nozzle 6 of the nozzle holder 36.
  • the nozzle holder 36 also houses the measuring member 44.
  • the measuring member 44 is used to measure the film thickness of the flux in the storage portion 42 (described later) of the flux unit 40.
  • the measuring member 44 has a shape that can be mounted on the mounting head 16 and can be accommodated in the nozzle holder 36.
  • the base end portion of the measuring member 44 has the same shape as the nozzle 6, and the tip end portion thereof has a rod shape so that the adhesion range of the flux can be discriminated.
  • the outer shape of the measuring member 44 has a rectangular shape (see FIG. 5). Therefore, when the measuring member 44 mounted on the mounting head 16 is imaged by the imaging device 30, the measuring member 44 is imaged in a rectangular shape.
  • the board conveyor 20 is a device for carrying in, positioning, and carrying out the circuit board 2.
  • the substrate conveyor 20 of this embodiment has a pair of belt conveyors and a support device (not shown) that supports the circuit board 2 from below.
  • the flux unit 40 can be installed in the feeder holding portion 14.
  • the dimension of the flux unit 40 in the X direction is larger than the dimension of the component feeder 12 in the X direction. Therefore, the flux unit 40 is installed across the plurality of slots of the feeder holding portion 14.
  • a storage unit 42 is provided on the upper surface of the flux unit 40.
  • the storage unit 42 has a rectangular box shape when viewed in a plan view, and a viscous body is stored inside the storage unit 42.
  • the viscous body is used by being attached to the electronic component 4 (for example, the electrode of the electronic component 4 or the like) when the electronic component 4 is mounted on the circuit board 2.
  • the viscous body of this embodiment is a flux.
  • the storage unit 42 is arranged on the substrate conveyor 20 side of the flux unit 40 (the tip side when the flux unit 40 is inserted to be installed in the feeder holding unit 14).
  • the storage unit 42 is arranged at a position accessible to the mounting head 16. Therefore, an electrode installed on the lower side of the electronic component 4 (for example, the lower surface of the electronic component 4 or the lower side of the electronic component 4) in a state where the upper surface of the electronic component 4 is attracted by the nozzle 6 mounted on the mounting head 16. Etc.), the flux in the storage unit 42 can be attached.
  • the control device 22 is configured by using a computer including a memory and a CPU.
  • the control device 22 controls the operation of each part of the component mounting machine 10 based on the production program transmitted from the management device 8. As shown in FIG. 3, the control device 22 is connected to the mobile device 18, the substrate conveyor 20, the image pickup device 30, and the touch panel 24, and controls each part of the mobile device 18, the board conveyor 20, the image pickup device 30, and the touch panel 24. is doing.
  • the touch panel 24 is a display device that provides various information of the component mounting machine 10 to the operator, and is an input device that receives instructions and information from the operator.
  • the process of measuring the film thickness of the flux stored in the storage unit 42 is performed, for example, before executing the process of mounting the electronic component 4 on the circuit board 2. By performing the following processing, the film thickness of the flux stored in the storage unit 42 can be accurately specified.
  • the control device 22 controls the position of the electronic component 4 with respect to the storage unit 42 based on the measured value of the film thickness of the flux, whereby the flux is appropriately applied to the electronic component 4. Can be attached.
  • the control device 22 mounts the measuring member 44 on the mounting head 16 (S12). Specifically, the control device 22 moves the moving base 18a so that the mounting head 16 is arranged above the measuring member 44 in the nozzle holder 36. Then, the control device 22 moves the mounting head 16 downward, and mounts the measuring member 44 on the mounting head 16 in the same procedure as when mounting the nozzle 6.
  • the control device 22 immerses the measuring member 44 in the storage unit 42 (S14). Specifically, the control device 22 moves the moving base 18a so that the measuring member 44 is located above the storage unit 42 in a state where the measuring member 44 is mounted on the mounting head 16. Then, the control device 22 moves the mounting head 16 downward and immerses the measuring member 44 in the flux in the storage unit 42. At this time, the control device 22 is moved so that the measuring member 44 is located above the position where the flux is attached to the electronic component 4 (hereinafter, also referred to as the attachment position) in the storage unit 42, and the attachment position is set to the position. The measuring member 44 is immersed in the same position.
  • the same position as the attachment position means that when the storage unit 42 is viewed in a plan view, the range (position) in the storage unit 42 to which the electronic component 4 is attached and the position where the measuring member 44 is immersed are defined. It means that they overlap.
  • the position where the measuring member 44 is immersed may be at least partially overlapped with the position (range) in the storage portion 42 where the electronic component 4 is immersed.
  • the measuring member 44 is immersed in the same position as the attachment position of the electronic component 4 (that is, a position overlapping the position in the storage portion 42 in which the electronic component 4 is immersed).
  • the control device 22 immerses the measuring member 44 so that the measuring member 44 comes into contact with the bottom of the storage portion 42.
  • the control device 22 takes an image of the measuring member 44 with the image pickup device 30 (S16). Specifically, the control device 22 moves the mounting head 16 upward and takes out the measuring member 44 immersed in the storage unit 42 from the storage unit 42. Then, the control device 22 takes an image of the measuring member 44 with the image pickup device 30. As shown in FIG. 1, the mounting head 16 and the image pickup device 30 are installed on the moving base 18a, and the image pickup device 30 moves integrally with the mounting head 16. Therefore, even if the mounting head 16 moves, the position of the measuring member 44 with respect to the image pickup apparatus 30 does not change. When the tip of the measuring member 44 is imaged by using the image pickup device 30 with the measuring member 44 mounted on the mounting head 16, the region of the measuring member 44 facing the image pickup device 30 is imaged from the side.
  • the control device 22 calculates the length of the flux adhering to the measuring member 44 in the height direction from the captured image (S18).
  • the portion to which the flux is attached is imaged in a different mode (for example, different luminance) from the portion to which the flux is not attached.
  • the control device 22 specifies the number of pixels in the height direction of the portion to which the flux is attached in the captured image.
  • the control device 22 detects whether or not flux is attached to each pixel on the line (center line) in the height direction passing through the center of the captured image, and specifies the number of pixels to which flux is attached. do.
  • the length d of the flux adhering to the measuring member 44 in the height direction is calculated.
  • the measuring member 44 is immersed so as to be in contact with the bottom of the storage portion 42. Therefore, the calculated length d in the height direction of the flux coincides with the film thickness (depth) in the reservoir 42 at the adhesion position.
  • the measuring member 44 is immersed in the flux in the storage unit 42 with the flux unit 40 installed in the feeder holding unit 14.
  • the flux unit 40 may be measured in a state of being pulled out of the component mounting machine 10 by an operator.
  • the film thickness of the flux in the storage portion 42 can be automatically measured.
  • the film thickness of the flux in the storage unit 42 can be measured more accurately. ..
  • the measuring member 44 is immersed in the same position as the immersion position (adhesion position) when the flux is adhered to the electronic component 4.
  • the surface of the storage portion 42 has substantially the same film thickness, but the film thickness may differ slightly depending on the position in the storage portion 42.
  • the measuring member 44 is imaged by the image pickup device 30 installed so as to move integrally with the mounting head 16 to which the measuring member 44 is mounted.
  • the measuring member 44 is imaged by an image pickup device fixedly installed in the component mounting machine 10
  • the measuring member 44 is imaged by the image pickup device 30 installed so as to move integrally with the mounting head 16
  • the measuring member 44 that is, the mounting head 16
  • the measuring member 44 can be efficiently imaged without moving the measuring member 44.
  • the measuring member 44 is immersed so as to be in contact with the bottom of the storage portion 42, but the configuration is not limited to this.
  • the control device 22 controls how much position (height) the tip of the measuring member 44 is lowered (moved) with respect to the bottom of the storage portion 42. Therefore, the control device 22 determines the film thickness of the flux in the storage unit 42 based on the length of the flux adhering to the measurement member 44 in the height direction and the distance of the tip of the measurement member 44 to the bottom of the storage unit 42. (Depth) can be specified.
  • control device 22 adds the length d of the flux adhering to the measuring member 44 in the height direction and the length between the lower end of the measuring member 44 and the bottom of the storage portion 42 to store the storage unit.
  • the film thickness of the flux in 42 can be specified.
  • the film thickness of the flux in the storage unit 42 included in the component mounting machine 10 can be measured, but the configuration is not limited to this. As long as it is a substrate working machine provided with a storage portion for storing the viscous body, the same configuration as in this embodiment can be adopted. A configuration similar to the example may be provided.
  • the component mounting machine 10 of the embodiment is an example of a "board working machine”
  • the electronic component 4 is an example of a “component”
  • the mounting head 16 is an example of a "head”
  • the control device 22 is an example. This is an example of a "specific part”.

Abstract

A substrate work machine that executes work on a substrate. The substrate work machine comprises: a storage unit that stores a viscous body that is adhered to a component; a measurement member that is used for measuring the depth of the viscous body stored in the storage unit; a head that detachably mounts the measurement member; an imaging device that is disposed so as to move integrally with the head and captures images of the measurement member mounted on the head; and a specification unit that, when the measurement member attached to the head is immersed in the storage unit, specifies the depth of the viscous body inside the storage unit, from a captured image of the measurement member captured by the imaging device.

Description

基板作業機及び粘性体の深さの測定方法Substrate working machine and method for measuring the depth of viscous material
　本明細書は、基板作業機及び粘性体の深さの測定方法に関する。 This specification relates to a substrate working machine and a method for measuring the depth of a viscous body.
　基板に対して所定の作業を実行する基板作業機（例えば、部品実装機）では、基板に対して作業する際に部品（例えば、電子部品の電極等）に粘性体（例えば、フラックス等）を付着させることがある。このため、基板作業機には、粘性体を貯留する貯留部が設けられていることがある。この種の基板作業機では、部品に粘性体を正確に付着させるために、貯留部に貯留されている粘性体の深さを正確に把握する必要がある。例えば、国際公開第２０１５／０９７７３１号公報に開示の基板作業機は、貯留部に貯留される粘性体の深さを測定するための機構を備えている。国際公開第２０１５／０９７７３１号公報の基板作業機は、複数の棒状の測定部を備える測定治具を備える。複数の測定部はそれぞれ長さが異なるため、複数の測定部の下端の位置はそれぞれ相違する。測定の際には、測定治具を貯留部に対して予め設定された所定の高さに位置決めし、貯留される粘性体の表面に複数の測定部を押し付け、粘性体の表面に測定部による測定痕を付ける。そして、撮像装置を用いて粘性体の表面を上方から撮像し、撮像画像から測定痕を検出する。上述したように、複数の測定部の下端の位置はそれぞれ異なるため、どの測定部の測定痕が検出されたのかを特定することによって、粘性体の深さがどの範囲であるのかを測定している。 In a board working machine (for example, a component mounting machine) that performs a predetermined operation on a substrate, a viscous body (for example, flux or the like) is applied to a component (for example, an electrode of an electronic component) when working on the substrate. May adhere. For this reason, the substrate working machine may be provided with a storage unit for storing the viscous body. In this type of substrate working machine, it is necessary to accurately grasp the depth of the viscous body stored in the storage portion in order to accurately attach the viscous body to the component. For example, the substrate working machine disclosed in International Publication No. 2015/097731 is provided with a mechanism for measuring the depth of the viscous body stored in the storage unit. The substrate working machine of International Publication No. 2015/097731 includes a measuring jig including a plurality of rod-shaped measuring units. Since the lengths of the plurality of measuring units are different, the positions of the lower ends of the plurality of measuring units are different from each other. At the time of measurement, the measuring jig is positioned at a predetermined height set in advance with respect to the storage part, a plurality of measuring parts are pressed against the surface of the stored viscous body, and the measuring part is applied to the surface of the viscous body. Make a measurement mark. Then, the surface of the viscous body is imaged from above using an image pickup device, and the measurement mark is detected from the captured image. As described above, since the positions of the lower ends of the plurality of measuring units are different from each other, it is possible to measure the range of the depth of the viscous body by identifying which measuring unit has detected the measurement mark. There is.
　国際公開第２０１５／０９７７３１号公報の基板作業機では、貯留部内の粘性体の深さを測定する際に、粘性体の表面に測定痕を付けた後、測定痕を上方から撮像している。したがって、測定治具を粘性体の表面に押し付けた後、測定治具を貯留部の上方から退避させ、次いで、撮像装置を測定痕の上方（貯留部の上方）に移動して粘性体の表面の測定痕を撮像する必要がある。このため、粘性体の表面に測定痕を付けた後に、測定痕を撮像するために撮像装置を移動させる必要が生じ、貯留部内の粘性体の深さを測定する処理に時間がかかっていた。 In the substrate working machine of International Publication No. 2015/097731, when measuring the depth of the viscous body in the reservoir, after making a measurement mark on the surface of the viscous body, the measurement mark is imaged from above. Therefore, after pressing the measuring jig against the surface of the viscous body, the measuring jig is retracted from above the reservoir, and then the image pickup device is moved above the measurement mark (above the reservoir) to move the surface of the viscous body. It is necessary to take an image of the measurement mark of. For this reason, after making a measurement mark on the surface of the viscous body, it is necessary to move the image pickup device in order to image the measurement mark, and it takes time to measure the depth of the viscous body in the reservoir.
　本明細書は、部品に付着させる粘性体を貯留する貯留部内の粘性体の深さを効率良く測定する技術を開示する。 This specification discloses a technique for efficiently measuring the depth of a viscous body in a storage portion that stores a viscous body attached to a component.
　本明細書に開示する基板作業機は、基板に対して作業を実行する。基板作業機は、部品に付着させる粘性体を貯留する貯留部と、貯留部内に貯留する粘性体の深さを測定するために用いられる測定部材と、測定部材を着脱可能に装着するヘッドと、ヘッドと一体的に移動するように設置され、ヘッドに装着された測定部材を撮像する撮像装置と、ヘッドに吸着された測定部材を貯留部に浸漬させたときに、撮像装置で撮像される測定部材の撮像画像から貯留部内の粘性体の深さを特定する特定部と、を備える。 The board working machine disclosed in this specification performs work on the board. The board working machine includes a storage unit that stores the viscous body to be attached to the component, a measuring member used to measure the depth of the viscous body stored in the storage unit, and a head to which the measuring member is detachably mounted. An image pickup device that is installed so as to move integrally with the head and captures an image of the measurement member mounted on the head, and a measurement that is imaged by the image pickup device when the measurement member adsorbed on the head is immersed in the reservoir. A specific portion for specifying the depth of the viscous body in the reservoir from the captured image of the member is provided.
　上記の基板作業機では、貯留部内の粘性体に測定部材を浸漬し、浸漬後の測定部材の撮像画像から貯留部内の粘性体の深さを特定する。これにより、従来技術のように測定部材の浸漬後に貯留部内の粘性体を撮像する必要はなく、貯留部内の粘性体の深さを効率良く測定することができる。 In the above-mentioned substrate working machine, the measuring member is immersed in the viscous body in the reservoir, and the depth of the viscous body in the reservoir is specified from the captured image of the measuring member after the immersion. As a result, unlike the conventional technique, it is not necessary to take an image of the viscous body in the storage portion after the measuring member is immersed, and the depth of the viscous body in the storage portion can be efficiently measured.
　また、本実施例に開示する測定方法は、部品に付着させる粘性体を貯留する貯留部内の粘性体の深さを測定する方法である。測定方法は、測定部材を貯留部に浸漬させる浸漬工程と、浸漬工程で貯留部に浸漬された測定部材の側方に付着している粘性体の高さ方向の長さを測定する測定工程と、を備える。 Further, the measuring method disclosed in this embodiment is a method of measuring the depth of the viscous body in the storage portion for storing the viscous body to be attached to the component. The measuring method includes a dipping step of immersing the measuring member in the reservoir and a measuring step of measuring the length in the height direction of the viscous body adhering to the side of the measuring member immersed in the reservoir in the dipping step. , Equipped with.
　上記の測定方法でも、浸漬後の測定部材を撮像するだけでよいため、貯留部内の粘性体の深さを効率良く測定することができる。 Even with the above measurement method, since it is only necessary to take an image of the measuring member after immersion, the depth of the viscous body in the reservoir can be efficiently measured.
実施例に係る基板作業機の一例である部品実装機の概構成を示す図。The figure which shows the outline structure of the component mounting machine which is an example of the board working machine which concerns on Example. 図１のＩＩ－ＩＩ線における断面図。FIG. 1 is a cross-sectional view taken along the line II-II of FIG. 部品実装機の制御系を示すブロック図。A block diagram showing a control system of a component mounting machine. 測定部材を用いて貯留部に貯留されるフラックスの膜厚を測定する処理の一例を示すフローチャート。The flowchart which shows an example of the process of measuring the film thickness of the flux stored in a storage part using a measuring member. フラックスに浸漬させた測定部材を撮像した撮像画像を示す図。The figure which shows the image which imaged the measuring member immersed in the flux.
　以下に説明する実施例の主要な特徴を列記しておく。なお、以下に記載する技術要素は、それぞれ独立した技術要素であって、単独であるいは各種の組合せによって技術的有用性を発揮するものであり、出願時の請求項に記載の組合せに限定されるものではない。 The main features of the examples described below are listed. The technical elements described below are independent technical elements and exhibit technical usefulness alone or in various combinations, and are limited to the combinations described in the claims at the time of filing. It's not a thing.
　本明細書に開示する基板作業機では、ヘッドに装着した測定部材を貯留部に浸漬し、浸漬後の測定部材を、ヘッドと一体的に移動する撮像装置で撮像する。ヘッドと測定部材と撮像装置が一体的に移動するため、測定部材に付着した粘性体を効率的に撮像することができる。このため、貯留部内の粘性体の深さを測定する処理を効率良く実行することができる。 In the substrate working machine disclosed in the present specification, the measuring member mounted on the head is immersed in the storage portion, and the measured member after immersion is imaged by an image pickup device that moves integrally with the head. Since the head, the measuring member, and the imaging device move integrally, the viscous body attached to the measuring member can be efficiently imaged. Therefore, the process of measuring the depth of the viscous body in the storage portion can be efficiently executed.
　本明細書に開示する基板作業機では、撮像装置は、測定部材を側方から撮像してもよい。特定部は、撮像画像から測定部材に付着した粘性体の範囲を検出して貯留部内の粘性体の深さを特定してもよい。このような構成によると、測定部材を側方から撮像するため、測定部材に付着した粘性体の範囲から貯留部内の粘性体の深さを正確に測定することができる。 In the substrate working machine disclosed in the present specification, the image pickup apparatus may image the measuring member from the side. The specific unit may detect the range of the viscous body attached to the measuring member from the captured image to specify the depth of the viscous body in the storage unit. According to such a configuration, since the measuring member is imaged from the side, the depth of the viscous body in the reservoir can be accurately measured from the range of the viscous body attached to the measuring member.
　本明細書に開示する基板作業機では、部品は貯留部の所定の位置に浸漬されるように設定されていてもよい。測定部材を浸漬させる位置は、貯留部の所定の位置（すなわち、部品を粘性体に浸漬する位置）とされていてもよい。貯留部の粘性体の深さは、位置によって僅かに異なることがある。部品を浸漬する位置に測定部材を浸漬させることによって、貯留部全体のうち部品を浸漬する位置における粘性体の深さを測定できる。このため、部品に付着させる粘性体の量を正確にコントロールすることができる。 In the substrate working machine disclosed in the present specification, the parts may be set to be immersed in a predetermined position of the storage portion. The position where the measuring member is immersed may be a predetermined position of the storage portion (that is, a position where the component is immersed in the viscous body). The depth of the viscous material in the reservoir may vary slightly depending on the location. By immersing the measuring member in the position where the component is immersed, the depth of the viscous body at the position where the component is immersed in the entire reservoir can be measured. Therefore, the amount of the viscous body attached to the component can be accurately controlled.
　図面を参照して、実施例に係る基板作業機について説明する。ここで、基板作業機の一例として、部品実装機１０について説明する。部品実装機１０は、回路基板２に電子部品４を実装する装置である。部品実装機１０は、電子部品装着装置やチップマウンタとも称される。通常、部品実装機１０は、はんだ印刷機及び基板検査機といった他の基板作業機と共に併設され、一連の実装ラインを構成する。 The board working machine according to the embodiment will be described with reference to the drawings. Here, the component mounting machine 10 will be described as an example of the board working machine. The component mounting machine 10 is a device for mounting the electronic component 4 on the circuit board 2. The component mounting machine 10 is also referred to as an electronic component mounting device or a chip mounter. Usually, the component mounting machine 10 is installed together with other board working machines such as a solder printing machine and a board inspection machine to form a series of mounting lines.
　図１、図２に示すように、部品実装機１０は、複数の部品フィーダ１２と、フィーダ保持部１４と、装着ヘッド１６と、撮像装置３０と、装着ヘッド１６と撮像装置３０を移動させる移動装置１８と、ノズル収容部３４と、ノズルホルダ３６と、基板コンベア２０と、フラックスユニット４０と、制御装置２２と、タッチパネル２４を備える。部品実装機１０の外部には、部品実装機１０と通信可能に構成された管理装置８が配置されている。各々の部品フィーダ１２は、複数の電子部品４を収容している。部品フィーダ１２は、フィーダ保持部１４に着脱可能に取り付けられ、装着ヘッド１６へ電子部品４を供給する。部品フィーダ１２の具体的な構成は特に限定されない。各々の部品フィーダ１２は、例えば、巻テープ上に複数の電子部品４を収容するテープ式フィーダ、トレイ上に複数の電子部品４を収容するトレイ式フィーダ、又は、容器内に複数の電子部品４をランダムに収容するバルク式フィーダのいずれであってもよい。 As shown in FIGS. 1 and 2, the component mounting machine 10 moves a plurality of component feeders 12, a feeder holding unit 14, a mounting head 16, an imaging device 30, a mounting head 16, and an imaging device 30. It includes an apparatus 18, a nozzle accommodating portion 34, a nozzle holder 36, a substrate conveyor 20, a flux unit 40, a control device 22, and a touch panel 24. A management device 8 configured to be able to communicate with the component mounting machine 10 is arranged outside the component mounting machine 10. Each component feeder 12 accommodates a plurality of electronic components 4. The component feeder 12 is detachably attached to the feeder holding portion 14 and supplies the electronic component 4 to the mounting head 16. The specific configuration of the component feeder 12 is not particularly limited. Each component feeder 12 is, for example, a tape-type feeder that accommodates a plurality of electronic components 4 on a wound tape, a tray-type feeder that accommodates a plurality of electronic components 4 on a tray, or a plurality of electronic components 4 in a container. It may be any of the bulk type feeders that randomly accommodate the above.
　フィーダ保持部１４は、複数のスロットを備えており、複数のスロットのそれぞれには部品フィーダ１２を着脱可能に設置することができる。フィーダ保持部１４は、部品実装機１０に固定されたものであってもよいし、部品実装機１０に対して着脱可能なものであってもよい。 The feeder holding unit 14 is provided with a plurality of slots, and the component feeder 12 can be detachably installed in each of the plurality of slots. The feeder holding portion 14 may be fixed to the component mounting machine 10 or may be detachable from the component mounting machine 10.
　装着ヘッド１６は、電子部品４を吸着するノズル６を有する。ノズル６は、装着ヘッド１６に着脱可能に取り付けられている。装着ヘッド１６は、ノズル６をＺ方向（ここでは鉛直方向）に移動可能であり、部品フィーダ１２や回路基板２に対して、ノズル６を接近及び離間させる。装着ヘッド１６は、部品フィーダ１２から電子部品４をノズル６によって吸着すると共に、ノズル６に吸着された電子部品４を回路基板２上に装着することができる。なお、装着ヘッド１６は、単一のノズル６を有するものに限られず、複数のノズル６を有するものであってもよい。 The mounting head 16 has a nozzle 6 that attracts the electronic component 4. The nozzle 6 is detachably attached to the mounting head 16. The mounting head 16 can move the nozzle 6 in the Z direction (here, the vertical direction), and brings the nozzle 6 closer to and further from the component feeder 12 and the circuit board 2. The mounting head 16 can mount the electronic component 4 sucked on the nozzle 6 on the circuit board 2 while sucking the electronic component 4 from the component feeder 12 by the nozzle 6. The mounting head 16 is not limited to the one having a single nozzle 6, and may have a plurality of nozzles 6.
　撮像装置３０は、固定部材２９により移動ベース１８ａに固定されており、移動ベース１８ａと一体的に移動する。撮像装置３０は、カメラ３２と、照明用光源（図示省略）と、プリズム（図示省略）を備える。カメラ３２は、ノズル６の軸方向（即ち、Ｚ方向）全体が含まれるように、ノズル６を水平方向（即ち、－Ｙ方向）から撮像する。カメラ３２には、例えばＣＣＤカメラが用いられる。照明用光源は、ＬＥＤにより構成されており、ノズル６の撮像面（本実施例ではＺＸ平面方向の側面）を照らす。プリズムは、カメラ３２の光軸を撮像対象に合わせる。照明用光源によりノズル６の軸方向全体が照らされ、その反射光がプリズムで反射してカメラ３２に導かれることで、カメラ３２はノズル６を撮像する。カメラ３２によって撮像された画像の画像データは、制御装置２２のメモリ（図示省略）に記憶される。 The image pickup device 30 is fixed to the moving base 18a by the fixing member 29, and moves integrally with the moving base 18a. The image pickup apparatus 30 includes a camera 32, a light source for illumination (not shown), and a prism (not shown). The camera 32 takes an image of the nozzle 6 from the horizontal direction (that is, the −Y direction) so as to include the entire axial direction (that is, the Z direction) of the nozzle 6. For the camera 32, for example, a CCD camera is used. The illumination light source is composed of LEDs and illuminates the image pickup surface (side surface in the ZX plane direction in this embodiment) of the nozzle 6. The prism aligns the optical axis of the camera 32 with the image pickup target. The entire axial direction of the nozzle 6 is illuminated by the illumination light source, and the reflected light is reflected by the prism and guided to the camera 32, so that the camera 32 takes an image of the nozzle 6. The image data of the image captured by the camera 32 is stored in the memory (not shown) of the control device 22.
　移動装置１８は、部品フィーダ１２と回路基板２との間で装着ヘッド１６及び撮像装置３０を移動させる。一例ではあるが、本実施例の移動装置１８は、移動ベース１８ａをＸ方向及びＹ方向に移動させるＸＹロボットであり、移動ベース１８ａに対して装着ヘッド１６及び撮像装置３０が固定されている。なお、装着ヘッド１６は、移動ベース１８ａに固定されるものに限られず、移動ベース１８ａに着脱可能に取り付けられるものであってもよい。 The moving device 18 moves the mounting head 16 and the image pickup device 30 between the component feeder 12 and the circuit board 2. As an example, the moving device 18 of this embodiment is an XY robot that moves the moving base 18a in the X direction and the Y direction, and the mounting head 16 and the imaging device 30 are fixed to the moving base 18a. The mounting head 16 is not limited to the one fixed to the moving base 18a, and may be detachably attached to the moving base 18a.
　ノズル収容部３４は、部品フィーダ１２と基板コンベア２０（詳細には、一対の基板コンベア２０のうち部品フィーダ１２側に設置される基板コンベア２０）との間に配置されている。ノズル収容部３４は、複数のノズル６を収容可能であり、装着ヘッド１６との間でノズル６の受け渡しを行う。複数のノズル６は、ノズル収容部３４に取り付けられたノズルホルダ３６に収容されている。ノズルホルダ３６には、複数種類のノズル６が収容可能となっている。ノズルホルダ３６は、ノズル収容部３４に対して着脱可能であり、例えば作業者がノズルホルダ３６のノズル６を交換するときに、ノズル収容部３４から取り外される。 The nozzle accommodating portion 34 is arranged between the component feeder 12 and the substrate conveyor 20 (specifically, the substrate conveyor 20 installed on the component feeder 12 side of the pair of substrate conveyors 20). The nozzle accommodating portion 34 can accommodate a plurality of nozzles 6, and transfers the nozzle 6 to and from the mounting head 16. The plurality of nozzles 6 are housed in the nozzle holder 36 attached to the nozzle housing portion 34. A plurality of types of nozzles 6 can be accommodated in the nozzle holder 36. The nozzle holder 36 is removable from the nozzle accommodating portion 34, and is removed from the nozzle accommodating portion 34, for example, when an operator replaces the nozzle 6 of the nozzle holder 36.
　また、ノズルホルダ３６には、測定部材４４も収容されている。測定部材４４は、フラックスユニット４０の貯留部４２（後述）内のフラックスの膜厚を測定するために用いられる。測定部材４４は、装着ヘッド１６に装着可能であると共に、ノズルホルダ３６に収容可能な形状を有している。本実施例では、測定部材４４は、その基端部がノズル６と同一の形状を有しており、その先端部はフラックスの付着範囲が判別できるように棒形状となっている。測定部材４４が装着ヘッド１６に装着された状態で撮像装置３０の撮像方向から測定部材４４を見ると、測定部材４４の外形は矩形状を有している（図５参照）。したがって、撮像装置３０で装着ヘッド１６に装着された測定部材４４を撮像すると、測定部材４４は矩形状に撮像される。 The nozzle holder 36 also houses the measuring member 44. The measuring member 44 is used to measure the film thickness of the flux in the storage portion 42 (described later) of the flux unit 40. The measuring member 44 has a shape that can be mounted on the mounting head 16 and can be accommodated in the nozzle holder 36. In this embodiment, the base end portion of the measuring member 44 has the same shape as the nozzle 6, and the tip end portion thereof has a rod shape so that the adhesion range of the flux can be discriminated. When the measuring member 44 is viewed from the imaging direction of the image pickup apparatus 30 with the measuring member 44 mounted on the mounting head 16, the outer shape of the measuring member 44 has a rectangular shape (see FIG. 5). Therefore, when the measuring member 44 mounted on the mounting head 16 is imaged by the imaging device 30, the measuring member 44 is imaged in a rectangular shape.
　基板コンベア２０は、回路基板２の搬入、位置決め、及び搬出を行う装置である。一例ではあるが、本実施例の基板コンベア２０は、一対のベルトコンベアと、回路基板２を下方から支持する支持装置（図示省略）とを有する。 The board conveyor 20 is a device for carrying in, positioning, and carrying out the circuit board 2. As an example, the substrate conveyor 20 of this embodiment has a pair of belt conveyors and a support device (not shown) that supports the circuit board 2 from below.
　図２に示すように、フラックスユニット４０は、フィーダ保持部１４に設置可能となっている。フラックスユニット４０のＸ方向の寸法は、部品フィーダ１２のＸ方向の寸法より大きい。このため、フラックスユニット４０は、フィーダ保持部１４の複数スロットに跨って設置される。フラックスユニット４０の上面には、貯留部４２が設けられている。貯留部４２は、平面視したときに矩形の箱状であり、内部に粘性体が貯留されている。粘性体は、電子部品４を回路基板２に実装する際に、電子部品４（例えば、電子部品４の電極等）に付着させて用いられる。本実施例の粘性体は、フラックスである。貯留部４２は、フラックスユニット４０の基板コンベア２０側（フラックスユニット４０をフィーダ保持部１４に設置するために挿入する際の先端側）に配置されている。貯留部４２は、装着ヘッド１６がアクセス可能な位置に配置されている。このため、装着ヘッド１６に装着されたノズル６で電子部品４の上面を吸着した状態で、電子部品４の下側（例えば、電子部品４の下面や電子部品４の下側に設置される電極等）に貯留部４２内のフラックスを付着させることができる。 As shown in FIG. 2, the flux unit 40 can be installed in the feeder holding portion 14. The dimension of the flux unit 40 in the X direction is larger than the dimension of the component feeder 12 in the X direction. Therefore, the flux unit 40 is installed across the plurality of slots of the feeder holding portion 14. A storage unit 42 is provided on the upper surface of the flux unit 40. The storage unit 42 has a rectangular box shape when viewed in a plan view, and a viscous body is stored inside the storage unit 42. The viscous body is used by being attached to the electronic component 4 (for example, the electrode of the electronic component 4 or the like) when the electronic component 4 is mounted on the circuit board 2. The viscous body of this embodiment is a flux. The storage unit 42 is arranged on the substrate conveyor 20 side of the flux unit 40 (the tip side when the flux unit 40 is inserted to be installed in the feeder holding unit 14). The storage unit 42 is arranged at a position accessible to the mounting head 16. Therefore, an electrode installed on the lower side of the electronic component 4 (for example, the lower surface of the electronic component 4 or the lower side of the electronic component 4) in a state where the upper surface of the electronic component 4 is attracted by the nozzle 6 mounted on the mounting head 16. Etc.), the flux in the storage unit 42 can be attached.
　制御装置２２は、メモリとＣＰＵを含むコンピュータを用いて構成されている。制御装置２２は、管理装置８から送信される生産プログラムに基づいて、部品実装機１０の各部の動作を制御する。図３に示すように、制御装置２２は、移動装置１８、基板コンベア２０、撮像装置３０及びタッチパネル２４と接続しており、移動装置１８、基板コンベア２０、撮像装置３０及びタッチパネル２４の各部を制御している。タッチパネル２４は、作業者に部品実装機１０の各種の情報を提供する表示装置であると共に、作業者からの指示や情報を受け付ける入力装置である。 The control device 22 is configured by using a computer including a memory and a CPU. The control device 22 controls the operation of each part of the component mounting machine 10 based on the production program transmitted from the management device 8. As shown in FIG. 3, the control device 22 is connected to the mobile device 18, the substrate conveyor 20, the image pickup device 30, and the touch panel 24, and controls each part of the mobile device 18, the board conveyor 20, the image pickup device 30, and the touch panel 24. is doing. The touch panel 24 is a display device that provides various information of the component mounting machine 10 to the operator, and is an input device that receives instructions and information from the operator.
　次に、測定部材４４を用いて貯留部４２に貯留されるフラックスの膜厚（深さ）を測定する処理について説明する。貯留部４２に貯留されるフラックスの膜厚を測定する処理は、例えば、電子部品４を回路基板２に実装する処理を実行する前に行われる。以下の処理を行うことにより、貯留部４２に貯留されるフラックスの膜厚を正確に特定することができる。制御装置２２は、電子部品４にフラックスを付着させる際に、フラックスの膜厚の測定値に基づいて、貯留部４２に対する電子部品４の位置を制御することで、電子部品４にフラックスを適切に付着させることができる。 Next, a process of measuring the film thickness (depth) of the flux stored in the storage unit 42 using the measuring member 44 will be described. The process of measuring the film thickness of the flux stored in the storage unit 42 is performed, for example, before executing the process of mounting the electronic component 4 on the circuit board 2. By performing the following processing, the film thickness of the flux stored in the storage unit 42 can be accurately specified. When the flux is adhered to the electronic component 4, the control device 22 controls the position of the electronic component 4 with respect to the storage unit 42 based on the measured value of the film thickness of the flux, whereby the flux is appropriately applied to the electronic component 4. Can be attached.
　図４に示すように、まず、制御装置２２は、装着ヘッド１６に測定部材４４を装着させる（Ｓ１２）。具体的には、制御装置２２は、装着ヘッド１６がノズルホルダ３６内の測定部材４４の上方に配置されるように、移動ベース１８ａを移動させる。そして、制御装置２２は、装着ヘッド１６を下方に移動させ、ノズル６を装着するときと同様の手順で、測定部材４４を装着ヘッド１６に装着する。 As shown in FIG. 4, first, the control device 22 mounts the measuring member 44 on the mounting head 16 (S12). Specifically, the control device 22 moves the moving base 18a so that the mounting head 16 is arranged above the measuring member 44 in the nozzle holder 36. Then, the control device 22 moves the mounting head 16 downward, and mounts the measuring member 44 on the mounting head 16 in the same procedure as when mounting the nozzle 6.
　次いで、制御装置２２は、測定部材４４を貯留部４２内に浸漬させる（Ｓ１４）。具体的には、制御装置２２は、装着ヘッド１６に測定部材４４を装着した状態で、測定部材４４が貯留部４２の上方に位置するように移動ベース１８ａを移動させる。そして、制御装置２２は、装着ヘッド１６を下方に移動させ、測定部材４４を貯留部４２内のフラックスに浸漬させる。このとき、制御装置２２は、測定部材４４が、貯留部４２内において電子部品４にフラックスを付着させる位置（以下、付着位置ともいう）の上方に位置にするように移動させ、この付着位置と同一の位置に測定部材４４を浸漬させる。ここで、「付着位置と同一の位置」とは、貯留部４２を平面視したときに、電子部品４を付着させる貯留部４２内の範囲（位置）と、測定部材４４を浸漬させる位置とが重なっていることを意味する。なお、測定部材４４を浸漬させる位置は、電子部品４を浸漬させる貯留部４２内の位置（範囲）と少なくとも一部が重なっていればよい。これにより、測定部材４４は、電子部品４の付着位置と同一の位置（すなわち、電子部品４を浸漬させる貯留部４２内の位置と重なる位置）に浸漬される。また、本実施例では、制御装置２２は、測定部材４４が貯留部４２の底部に接触するように測定部材４４を浸漬させる。 Next, the control device 22 immerses the measuring member 44 in the storage unit 42 (S14). Specifically, the control device 22 moves the moving base 18a so that the measuring member 44 is located above the storage unit 42 in a state where the measuring member 44 is mounted on the mounting head 16. Then, the control device 22 moves the mounting head 16 downward and immerses the measuring member 44 in the flux in the storage unit 42. At this time, the control device 22 is moved so that the measuring member 44 is located above the position where the flux is attached to the electronic component 4 (hereinafter, also referred to as the attachment position) in the storage unit 42, and the attachment position is set to the position. The measuring member 44 is immersed in the same position. Here, "the same position as the attachment position" means that when the storage unit 42 is viewed in a plan view, the range (position) in the storage unit 42 to which the electronic component 4 is attached and the position where the measuring member 44 is immersed are defined. It means that they overlap. The position where the measuring member 44 is immersed may be at least partially overlapped with the position (range) in the storage portion 42 where the electronic component 4 is immersed. As a result, the measuring member 44 is immersed in the same position as the attachment position of the electronic component 4 (that is, a position overlapping the position in the storage portion 42 in which the electronic component 4 is immersed). Further, in this embodiment, the control device 22 immerses the measuring member 44 so that the measuring member 44 comes into contact with the bottom of the storage portion 42.
　次いで、制御装置２２は、測定部材４４を撮像装置３０で撮像する（Ｓ１６）。具体的には、制御装置２２は、装着ヘッド１６を上方に移動させ、貯留部４２内に浸漬された測定部材４４を貯留部４２から取り出す。そして、制御装置２２は、撮像装置３０で測定部材４４を撮像する。図１に示すように、装着ヘッド１６と撮像装置３０は、移動ベース１８ａに設置されており、撮像装置３０は、装着ヘッド１６と一体的に移動する。したがって、装着ヘッド１６が移動しても、撮像装置３０に対する測定部材４４の位置が変化することはない。装着ヘッド１６に測定部材４４が装着された状態で撮像装置３０を用いて測定部材４４の先端を撮像すると、測定部材４４の撮像装置３０に対向する領域が側方から撮像される。 Next, the control device 22 takes an image of the measuring member 44 with the image pickup device 30 (S16). Specifically, the control device 22 moves the mounting head 16 upward and takes out the measuring member 44 immersed in the storage unit 42 from the storage unit 42. Then, the control device 22 takes an image of the measuring member 44 with the image pickup device 30. As shown in FIG. 1, the mounting head 16 and the image pickup device 30 are installed on the moving base 18a, and the image pickup device 30 moves integrally with the mounting head 16. Therefore, even if the mounting head 16 moves, the position of the measuring member 44 with respect to the image pickup apparatus 30 does not change. When the tip of the measuring member 44 is imaged by using the image pickup device 30 with the measuring member 44 mounted on the mounting head 16, the region of the measuring member 44 facing the image pickup device 30 is imaged from the side.
　次いで、制御装置２２は、撮像画像から測定部材４４に付着しているフラックスの高さ方向の長さを算出する（Ｓ１８）。図５に示すように、測定部材４４において、フラックスが付着している部分は、フラックスが付着していない部分とは異なる態様（例えば、異なる輝度）で撮像される。制御装置２２は、撮像画像において、フラックスが付着している部分の高さ方向の画素数を特定する。例えば、制御装置２２は、撮像画像の中心を通る高さ方向の線（中心線）上の各画素について、フラックスが付着しているか否かを検出し、フラックスが付着している画素数を特定する。これにより、測定部材４４に付着しているフラックスの高さ方向の長さｄが算出される。本実施例では、測定部材４４は、貯留部４２の底部に接触するように浸漬されている。このため、算出されたフラックスの高さ方向の長さｄが、付着位置における貯留部４２内の膜厚（深さ）と一致する。 Next, the control device 22 calculates the length of the flux adhering to the measuring member 44 in the height direction from the captured image (S18). As shown in FIG. 5, in the measuring member 44, the portion to which the flux is attached is imaged in a different mode (for example, different luminance) from the portion to which the flux is not attached. The control device 22 specifies the number of pixels in the height direction of the portion to which the flux is attached in the captured image. For example, the control device 22 detects whether or not flux is attached to each pixel on the line (center line) in the height direction passing through the center of the captured image, and specifies the number of pixels to which flux is attached. do. As a result, the length d of the flux adhering to the measuring member 44 in the height direction is calculated. In this embodiment, the measuring member 44 is immersed so as to be in contact with the bottom of the storage portion 42. Therefore, the calculated length d in the height direction of the flux coincides with the film thickness (depth) in the reservoir 42 at the adhesion position.
　本実施例では、フラックスユニット４０をフィーダ保持部１４に設置した状態で測定部材４４を貯留部４２内のフラックスに浸漬する。従来では、貯留部４２内のフラックスの膜厚を測定する際には、作業者によってフラックスユニット４０が部品実装機１０外に引き出された状態で測定することがあった。本実施例では、フラックスユニット４０をフィーダ保持部１４に設置した状態で測定部材４４をフラックスに浸漬するため、自動で貯留部４２内のフラックスの膜厚を測定することができる。また、貯留部４２内のフラックスの膜厚を測定するためにフラックスユニット４０をフィーダ保持部１４から移動させる必要がないため、より正確に貯留部４２内のフラックスの膜厚を測定することができる。さらに、本実施例では、電子部品４にフラックスを付着させるときの浸漬位置（付着位置）と同一の位置に測定部材４４が浸漬される。貯留部４２の表面は、概ね同一の膜厚となっているが、貯留部４２内の位置によって膜厚が多少異なることもある。測定部材４４を付着位置でフラックスに浸漬させることにより、電子部品４にフラックスを付着させる位置（付着位置）のフラックスの膜厚を測定することができる。 In this embodiment, the measuring member 44 is immersed in the flux in the storage unit 42 with the flux unit 40 installed in the feeder holding unit 14. Conventionally, when measuring the film thickness of the flux in the storage unit 42, the flux unit 40 may be measured in a state of being pulled out of the component mounting machine 10 by an operator. In this embodiment, since the measuring member 44 is immersed in the flux with the flux unit 40 installed in the feeder holding portion 14, the film thickness of the flux in the storage portion 42 can be automatically measured. Further, since it is not necessary to move the flux unit 40 from the feeder holding unit 14 in order to measure the film thickness of the flux in the storage unit 42, the film thickness of the flux in the storage unit 42 can be measured more accurately. .. Further, in this embodiment, the measuring member 44 is immersed in the same position as the immersion position (adhesion position) when the flux is adhered to the electronic component 4. The surface of the storage portion 42 has substantially the same film thickness, but the film thickness may differ slightly depending on the position in the storage portion 42. By immersing the measuring member 44 in the flux at the attachment position, the film thickness of the flux at the position where the flux is attached to the electronic component 4 (adhesion position) can be measured.
　また、本実施例では、測定部材４４を装着する装着ヘッド１６と一体的に移動するように設置された撮像装置３０で測定部材４４が撮像される。例えば、部品実装機１０内に固定して設置されている撮像装置で測定部材４４を撮像する場合には、測定部材４４を撮像するために測定部材４４（すなわち、装着ヘッド１６）を移動させる必要が生じる。本実施例では、装着ヘッド１６と一体的に移動するように設置された撮像装置３０で測定部材４４が撮像されるため、測定部材４４を撮像するために測定部材４４（すなわち、装着ヘッド１６）を移動させることなく、効率よく測定部材４４を撮像することができる。 Further, in this embodiment, the measuring member 44 is imaged by the image pickup device 30 installed so as to move integrally with the mounting head 16 to which the measuring member 44 is mounted. For example, when the measuring member 44 is imaged by an image pickup device fixedly installed in the component mounting machine 10, it is necessary to move the measuring member 44 (that is, the mounting head 16) in order to image the measuring member 44. Occurs. In this embodiment, since the measuring member 44 is imaged by the image pickup device 30 installed so as to move integrally with the mounting head 16, the measuring member 44 (that is, the mounting head 16) is used to image the measuring member 44. The measuring member 44 can be efficiently imaged without moving the measuring member 44.
　なお、本実施例では、測定部材４４は、貯留部４２の底部に接触するように浸漬されたが、このような構成に限定されない。例えば、測定部材４４が貯留部４２内のフラックスに浸漬すれば、測定部材４４は、貯留部４２の底部に接触しなくてもよい。この場合、制御装置２２は、測定部材４４の先端が貯留部４２の底部に対してどのくらいの位置（高さ）となるまで下降（移動）させるのかを制御している。このため、制御装置２２は、測定部材４４に付着したフラックスの高さ方向の長さと、貯留部４２の底部に対する測定部材４４の先端の距離とに基づいて、貯留部４２内のフラックスの膜厚（深さ）を特定することができる。すなわち、制御装置２２は、測定部材４４に付着しているフラックスの高さ方向の長さｄと、測定部材４４の下端と貯留部４２の底部の間の長さを加算することで、貯留部４２内のフラックスの膜厚を特定することができる。 In this embodiment, the measuring member 44 is immersed so as to be in contact with the bottom of the storage portion 42, but the configuration is not limited to this. For example, if the measuring member 44 is immersed in the flux in the storage section 42, the measuring member 44 does not have to come into contact with the bottom portion of the storage section 42. In this case, the control device 22 controls how much position (height) the tip of the measuring member 44 is lowered (moved) with respect to the bottom of the storage portion 42. Therefore, the control device 22 determines the film thickness of the flux in the storage unit 42 based on the length of the flux adhering to the measurement member 44 in the height direction and the distance of the tip of the measurement member 44 to the bottom of the storage unit 42. (Depth) can be specified. That is, the control device 22 adds the length d of the flux adhering to the measuring member 44 in the height direction and the length between the lower end of the measuring member 44 and the bottom of the storage portion 42 to store the storage unit. The film thickness of the flux in 42 can be specified.
　なお、本実施例では、部品実装機１０が備える貯留部４２内のフラックスの膜厚を測定可能に構成されていたが、このような構成に限定されない。粘性体を貯留する貯留部を備える基板作業機であれば、本実施例と同様の構成を採用することができ、例えば、粘性体を塗布する塗布機や粘性体を印刷する印刷機に本実施例と同様の構成を設けてもよい。 In this embodiment, the film thickness of the flux in the storage unit 42 included in the component mounting machine 10 can be measured, but the configuration is not limited to this. As long as it is a substrate working machine provided with a storage portion for storing the viscous body, the same configuration as in this embodiment can be adopted. A configuration similar to the example may be provided.
　実施例で説明した基板作業機に関する留意点を述べる。実施例の部品実装機１０は、「基板作業機」の一例であり、電子部品４は、「部品」の一例であり、装着ヘッド１６は、「ヘッド」の一例であり、制御装置２２は、「特定部」の一例である。 The points to keep in mind regarding the board working machine described in the examples will be described. The component mounting machine 10 of the embodiment is an example of a "board working machine", the electronic component 4 is an example of a "component", the mounting head 16 is an example of a "head", and the control device 22 is an example. This is an example of a "specific part".
　以上、本明細書に開示の技術の具体例を詳細に説明したが、これらは例示にすぎず、請求の範囲を限定するものではない。請求の範囲に記載の技術には、以上に例示した具体例を様々に変形、変更したものが含まれる。また、本明細書または図面に説明した技術要素は、単独であるいは各種の組合せによって技術的有用性を発揮するものであり、出願時請求項記載の組合せに限定されるものではない。また、本明細書または図面に例示した技術は複数目的を同時に達成するものであり、そのうちの一つの目的を達成すること自体で技術的有用性を持つものである。 Although specific examples of the disclosed techniques have been described in detail in the present specification, these are merely examples and do not limit the scope of claims. The techniques described in the claims include various modifications and modifications of the specific examples exemplified above. Further, the technical elements described in the present specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the techniques exemplified in this specification or drawings achieve a plurality of purposes at the same time, and achieving one of the purposes itself has technical usefulness.

Claims (4)

  1. 　基板に対して作業を実行する基板作業機であって、
    　部品に付着させる粘性体を貯留する貯留部と、
    　前記貯留部内に貯留する前記粘性体の深さを測定するために用いられる測定部材と、
    　前記測定部材を着脱可能に装着するヘッドと、
    　前記ヘッドと一体的に移動するように設置され、前記ヘッドに装着された前記測定部材を撮像する撮像装置と、
    　前記ヘッドに吸着された前記測定部材を前記貯留部に浸漬させたときに、前記撮像装置で撮像される前記測定部材の撮像画像から前記貯留部内の粘性体の深さを特定する特定部と、を備える、基板作業機。     It is a board work machine that executes work on the board.
    A storage unit that stores the viscous body attached to the parts,
    A measuring member used for measuring the depth of the viscous body stored in the storage portion, and a measuring member.
    A head to which the measuring member is detachably attached and
    An image pickup device that is installed so as to move integrally with the head and images the measuring member mounted on the head, and an image pickup device.
    When the measuring member adsorbed on the head is immersed in the storage portion, a specific portion for specifying the depth of the viscous body in the reservoir from the image captured by the measuring member captured by the imaging device, and a specific portion. Equipped with a board working machine.
  2. 　前記撮像装置は、前記測定部材を側方から撮像し、
    　前記特定部は、前記撮像画像から前記測定部材に付着した前記粘性体の範囲を検出して前記貯留部内の粘性体の深さを特定する、請求項１に記載の基板作業機。     The image pickup device captures the measurement member from the side and obtains an image.
    The substrate working machine according to claim 1, wherein the specific unit detects a range of the viscous body attached to the measuring member from the captured image to specify the depth of the viscous body in the storage unit.
  3. 　前記部品は前記貯留部の所定の位置に浸漬されることで、前記部品に前記粘性体が付着されるように設定されており、
    　前記測定部材を浸漬させる位置は、前記貯留部の前記所定の位置とされている、請求項１又は２に記載の基板作業機。     The viscous body is set so that the viscous body adheres to the component by immersing the component in a predetermined position of the storage portion.
    The substrate working machine according to claim 1 or 2, wherein the position where the measuring member is immersed is the predetermined position of the storage portion.
  4. 　部品に付着させる粘性体を貯留する貯留部内の前記粘性体の深さを測定する方法であって、
    　測定部材を前記貯留部に浸漬させる浸漬工程と、
    　前記浸漬工程で前記貯留部に浸漬された前記測定部材の側方に付着している前記粘性体の高さ方向の長さを測定する測定工程と、を備える、測定方法。     It is a method of measuring the depth of the viscous body in the storage part for storing the viscous body to be attached to the component.
    The dipping step of immersing the measuring member in the reservoir and
    A measuring method comprising a measuring step of measuring the length in the height direction of the viscous body adhering to the side of the measuring member immersed in the reservoir in the dipping step.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008026504A1 (en) * 2006-09-01 2008-03-06 Panasonic Corporation Electronic component mounting device and electronic component mounting method
JP2009170524A (en) * 2008-01-11 2009-07-30 Yamaha Motor Co Ltd Component mounting method, and surface mounting machine
JP2011060874A (en) * 2009-09-08 2011-03-24 Panasonic Corp Paste film forming apparatus, electronic component packaging device, method of forming paste film, and method of packaging electronic component
WO2015097731A1 (en) * 2013-12-23 2015-07-02 富士機械製造株式会社 Electronic component mounting machine
WO2018179315A1 (en) * 2017-03-31 2018-10-04 株式会社Ｆｕｊｉ Electronic component mounting machine and mounting method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008026504A1 (en) * 2006-09-01 2008-03-06 Panasonic Corporation Electronic component mounting device and electronic component mounting method
JP2009170524A (en) * 2008-01-11 2009-07-30 Yamaha Motor Co Ltd Component mounting method, and surface mounting machine
JP2011060874A (en) * 2009-09-08 2011-03-24 Panasonic Corp Paste film forming apparatus, electronic component packaging device, method of forming paste film, and method of packaging electronic component
WO2015097731A1 (en) * 2013-12-23 2015-07-02 富士機械製造株式会社 Electronic component mounting machine
WO2018179315A1 (en) * 2017-03-31 2018-10-04 株式会社Ｆｕｊｉ Electronic component mounting machine and mounting method

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