WO2022127726A1 - 传感器封装结构及电子设备 - Google Patents

传感器封装结构及电子设备 Download PDF

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Publication number
WO2022127726A1
WO2022127726A1 PCT/CN2021/137365 CN2021137365W WO2022127726A1 WO 2022127726 A1 WO2022127726 A1 WO 2022127726A1 CN 2021137365 W CN2021137365 W CN 2021137365W WO 2022127726 A1 WO2022127726 A1 WO 2022127726A1
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Prior art keywords
chip
hole
board
carrier board
electronic device
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PCT/CN2021/137365
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English (en)
French (fr)
Inventor
罗雷
杨望来
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维沃移动通信有限公司
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Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2022127726A1 publication Critical patent/WO2022127726A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves

Definitions

  • the present application belongs to the technical field of sensors, and in particular relates to a sensor packaging structure and electronic equipment.
  • sensors are configured in the device to realize the function of the electronic device.
  • the chip is arranged on the carrier board, the upper cover forms a groove structure and is buckled outside the chip, and the groove structure is filled with transparent resin.
  • the present application aims to provide a sensor packaging structure, which at least solves one of the problems of complex structure, large volume and excessive space occupation of the existing sensor packaging structure.
  • an embodiment of the present application provides a sensor package structure, the sensor package structure includes a carrier board, a first chip, a second chip, and a packaging material;
  • the first chip and the second chip are both disposed on the carrier board, and both the first chip and the second chip are electrically connected to the carrier board;
  • the carrier board is provided with a first through hole and a second through hole, the active area of the first chip is opposite to the first through hole, and the active area of the second chip is opposite to the second through hole. hole opposite;
  • the packaging material wraps the first chip and the second chip.
  • an embodiment of the present application provides an electronic device, which includes the sensor package structure as described above.
  • the first chip and the second chip are optically isolated by the packaging material, so that the first chip interacts with the outside world through the first through hole, and the second chip interacts with the outside world through the second through hole, so as to realize
  • the function of the sensor does not require an upper cover and does not need to be filled with transparent resin, the structure of the sensor packaging structure is simpler, the volume of the sensor packaging structure is reduced, and the space occupied by the sensor is reduced.
  • FIG. 1 is one of the structural schematic diagrams of an embodiment of a sensor package structure according to the present application
  • FIG. 2 is a second structural schematic diagram of an embodiment of a sensor packaging structure according to the present application.
  • FIG. 3 is a schematic structural diagram of a carrier according to an embodiment of the present application.
  • FIG. 4 is one of partial schematic views of an embodiment of an electronic device according to the present application.
  • Fig. 5 is the second partial schematic diagram of the embodiment of the electronic device according to the present application.
  • FIG. 6 is a third partial schematic diagram of an embodiment of an electronic device according to the present application.
  • 10-carrier board 101-first through hole, 102-second through hole, 103-pad, 11-first chip, 12-second chip, 13-package material, 14-first bump, 15- 2nd bump, 2-translucent material, 3-mainboard, 33-third through hole, 34-fourth through hole, 4-shell, 5-flexible circuit board, 51-fifth through-hole, 52-th Six through holes.
  • the terms “installed”, “connected” and “connected” should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements.
  • installed should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements.
  • the sensor packaging structure process in the related art is complicated, and the space between the upper cover and the carrier board needs to be filled with transparent resin, then drilled, and then filled with silver glue to fix the upper cover on the carrier board.
  • the sensor package structure in the related art has a large volume and takes up too much space. When it is installed in an electronic device, enough space needs to be reserved, which occupies the internal space of the electronic device. The volume of the sensor package structure is large, and the thickness of the electronic device cannot be further reduced.
  • the existing sensor package structure is complex in structure, large in volume, and takes up too much space.
  • the sensor package structure according to the embodiment of the present application solves at least one of the above-mentioned problems in the related art.
  • the sensor package structure includes a carrier board 10 , a first chip 11 , a second chip 12 and a packaging material 13 .
  • the first chip 11 and the second chip 12 are both disposed on the carrier board 10 , and both the first chip 11 and the second chip 12 are electrically connected to the carrier board 13 .
  • the carrier board 10 is provided with a first through hole 101 and a second through hole 102 .
  • the active area of the first chip 11 is opposite to the first through hole 101
  • the active area of the second chip 12 is opposite to the first through hole 101 .
  • the packaging material 13 wraps the first chip 11 and the second chip 12 .
  • the encapsulation material 13 forms optical isolation for the part other than the active area of the first chip 11
  • the encapsulation material 13 forms optical isolation for the part outside the active area of the second chip 12 , and at the same time, the first chip 11 and the second chip 12 are formed.
  • the packaging material 13 forms optical isolation between the first chip 11 and the second chip 12 , so that the active area of the first chip 11 can only interact with the outside through the first channel 101 .
  • the active area of the first chip 11 is the functional area of the first chip 11 , and the functional area of the first chip 11 communicates with the outside through the first channel 101 .
  • the active area of the second chip 12 is the functional area of the second chip 12 , and the functional area of the second chip 12 communicates with the outside through the second channel 102 .
  • the packaging material 13 forms packaging and optical isolation for the first chip 11 and the second chip 12 , which avoids the interference of external light on the first chip 11 and the second chip 12 , and also avoids the space between the first chip 11 and the second chip 12 . interfere with each other.
  • the first chip 11 and the second chip 12 are packaged on the carrier board 10 through the packaging material 13 , and can communicate with the outside through the first through holes 101 and the second through holes 102 provided on the carrier board 10 .
  • the structure of the sensor packaging structure is simpler, the thickness dimension is reduced, the volume of the sensor packaging structure is reduced, and the sensor packaging structure is reduced. The space occupied by the structure.
  • the internal space of the electronic device occupied by the sensor packaging structure can be reduced.
  • Using the sensor package structure can reduce the volume of the electronic device and optimize the size of the electronic device.
  • the structure of the sensor package structure is simpler than that of the existing sensor package structure, and it is easier to package the first chip 11 and the second chip 12 on the carrier board 10.
  • the processing technology of the sensor package structure is simplified.
  • the first chip 11 is a light emitting chip, such as a light emitting diode (Light Emitting Diode, LED).
  • the active area of the first chip 11 is the functional area of the light emitting diode, and the functional area is used for emitting light.
  • the second chip 12 is a light receiving chip, such as a photodiode (PD), and the active area of the second chip 12 is a functional area of the photodiode, and the functional area is used for receiving light.
  • the sensor package structure is the package structure of the proximity sensor. The first chip 11 emits light, and the second chip 12 receives the reflected light, so that the distance between the object and the proximity sensor can be obtained.
  • the encapsulation material 13 includes black resin or blue resin.
  • the packaging material 13 forms optical isolation between the first chip 11 and the second chip 12 to ensure that the first chip 11 interacts with the outside through the first through hole 101 , and the second chip 12 interacts with the outside through the second through hole 102 .
  • Black resin or blue resin can effectively form optical isolation, and it is more convenient to package the first chip 11 and the second chip 12 on the carrier board 10 .
  • the light emitting chip can emit light of different colors according to different components, and the black resin can effectively form optical isolation for the light.
  • the black resin can effectively form optical isolation for the light.
  • blue resin can be used for encapsulation.
  • any non-transparent resin capable of forming optical isolation may be set.
  • the first through holes 101 and the second through holes 102 are filled with a light-transmitting material 2 .
  • the light-transmitting material 2 in the first through hole 101 and the second through hole 102 can allow light to pass through.
  • the light-transmitting material 2 forms protection in the first through hole 101 and the second through hole 102 to prevent foreign matter from entering the first through hole 101 or the second through hole 102 and causing interference to the first chip 11 and the second chip 12 .
  • the light-transmitting material 2 includes glass or transparent resin.
  • Both glass and transparent resin have excellent light-transmitting properties, light can pass through the light-transmitting material 2, and can form an effective package in the first through hole 101 and the second through hole 102, so that the first chip 11 and the second chip can be effectively packaged. 12 forms an effective protection.
  • the first chip 11 is provided with first bumps 14 , and the first chip 11 is electrically connected to the carrier board 10 through the first bumps 14 .
  • the second chip 12 has second bumps 15 , and the second chip 12 is electrically connected to the carrier board 10 through the second bumps 15 .
  • the first chip 11 is electrically connected to the carrier board 10 through the first bumps 14 , so that the carrier board 10 ensures that the first chip 11 can complete the function of emitting light.
  • the second chip 12 is electrically connected to the carrier board 10 through the second bumps 15 , so that the carrier board 10 ensures that the second chip 12 can complete the function of receiving light.
  • the first chip 11 is provided with two first bumps 14 , and the two first bumps 14 form an electrical connection between the active area of the first chip 11 and the carrier board 10 .
  • the second chip 12 is provided with two second bumps 15 , and the two second bumps 15 form an electrical connection between the active area of the second chip 15 and the carrier board 10 .
  • an electronic device is provided, and the electronic device includes the sensor package structure described in any one of the above embodiments.
  • the sensor package structure has a smaller volume and occupies less internal space of the electronic device, so that the volume of the electronic device can be further reduced.
  • the size of the sensor package structure in the thickness direction of the stacking of the carrier board 10 and the packaging material 13 is smaller, which can further reduce the thickness of the electronic device in the thickness direction and make the electronic device lighter and thinner.
  • the electronic device further includes a housing 4 and a main board 3 , the housing 4 forms a accommodating cavity, and the main board 3 and the sensor packaging structure are arranged in the in the receiving cavity.
  • the carrier board 10 is disposed on the main board 3, and the main board 3 is electrically connected to the carrier board 10.
  • the main board 3 is provided with a third through hole 33 and a fourth through hole 34, and the third through hole 33 is provided on the main board 3.
  • the hole 33 is opposite to the first through hole 101
  • the fourth through hole 34 is opposite to the second through hole 102 .
  • the sensor package structure is disposed on the main board 3, and the first channel 101 and the third channel 33 form a light-emitting channel of the first chip 11, so that the first chip 11 can emit light along the light-emitting channel.
  • the second channel 102 and the fourth channel 34 form a receiving channel of the second chip 12 so that the second chip 12 can receive light through the receiving channel.
  • the sensor package structure occupies a smaller thickness dimension, which can make the thickness dimension of the electronic device smaller.
  • the arrangement of the third through hole 33 and the fourth through hole 34 on the main board 3 enables the main board 3 to be located between the sensor package structure and the housing 4 without affecting the functions of the first chip 11 and the second chip 12 in the sensor package structure .
  • One surface of the housing 4 is opposite to the third through hole 33 and the fourth through hole 34 , and the first chip 11 and the second chip 12 in the sensor package structure face this surface and interact with the outside.
  • the surface is the back surface or the display surface of the electronic device.
  • the main board 3 is located between the sensor package structure and the surface, which can effectively reduce the distance between the surface and the main board 3 .
  • the distance between the casing 4 and the main board 3 can be reduced, and the thickness of the electronic device can be reduced.
  • the carrier board 10 is provided with at least one pad 103 , and the main board 3 is electrically connected to the carrier board 10 through the at least one pad 103 .
  • At least one is one or more, and the number of the pads 103 is set according to the actual requirement of electrical connection.
  • the pads 103 on the carrier board 10 are used for electrical connection with the main board 3 , so that the first chip 11 and the second chip 12 can interact with the main board 3 , so that the first chip 11 and the second chip 12 can be controlled by the main board 3 .
  • the main board 3 is provided with connection parts corresponding to the pads 103 .
  • Each pad 103 is electrically connected to the corresponding connection portion.
  • the electronic device further includes a casing 4 and a flexible circuit board 5 , the casing 4 forms a accommodating cavity, and the flexible circuit board 5 and the sensor packaging structure are disposed in the inside the receiving cavity.
  • the flexible circuit board 5 is attached to the casing 4 , the carrier board 10 is disposed on the flexible circuit board 5 , the carrier board 10 is electrically connected to the flexible circuit board 5 , and the flexible circuit board 5 is provided with a fifth through hole 51 and a sixth through hole 52 , the fifth through hole 51 is opposite to the first through hole 101 , and the sixth through hole 52 is opposite to the second through hole 102 .
  • the flexible circuit board 5 and the casing 4 are attached to the display surface side of the electronic device, or the flexible circuit board 5 and the casing 4 are attached to the back side of the electronic device.
  • the carrier board 10 is disposed on the flexible circuit board 5 , and the first through holes 101 are opposite to the fifth through holes 51 , and the second through holes 102 are opposite to the sixth through holes 52 .
  • the first through hole 101 and the fifth through hole 51 form a light emitting channel of the first chip 11 , and the first chip 11 emits light to the outside through the light emitting channel.
  • the second through hole 102 and the sixth channel 52 form a receiving channel of the second chip 12 , and the second chip 12 receives external light through the receiving channel.
  • the carrier board 10 is electrically connected to the flexible circuit board 5, and the flexible circuit board 5 provides a path for the electrical connection between the first chip 11 and the second chip 12 and the main board of the electronic device.
  • the structure of the flexible circuit board 5 is light and thin, and the stacking thickness of the sensor package structure and the flexible circuit board 5 laminated on the casing 4 is smaller, so that the assembly between the structures is more compact. Further reduce the thickness dimension of electronic devices.
  • the main board 3 and the sensor packaging structure in the electronic device avoid each other, and the main board 3 and the carrier board 10 in the sensor packaging structure are electrically connected through the flexible circuit board 5 .
  • At least one pad 103 is provided on the carrier board 10 , and the flexible circuit board 5 is electrically connected to the carrier board 10 through the at least one pad 103 .
  • the flexible circuit board 5 is used to form an electrical connection between the carrier board 10 and the main board 3 in the electronic device, and the thickness of the flexible circuit board 5 is smaller and thinner, which reduces the thickness occupied by the sensor packaging structure. For example, the touch sensor package structure and the main board 3 are avoided from each other, thereby further reducing the thickness of the electronic device and making the electronic device lighter and thinner.
  • the electronic device may be any electronic device suitable for including a sensor package structure, such as a mobile phone, a notebook computer, a tablet computer, or a wearable device.

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  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

本申请公开了一种传感器封装结构及电子设备，该传感器封装结构包括载板、第一芯片、第二芯片和封装材料；所述第一芯片和所述第二芯片均设置于所述载板上，所述第一芯片和所述第二芯片均与所述载板电连接；所述载板上设置有第一通孔和第二通孔，所述第一芯片的有源区与所述第一通孔相对，所述第二芯片的有源区与所述第二通孔相对；所述封装材料包裹所述第一芯片和所述第二芯片。

Description

传感器封装结构及电子设备
相关申请的交叉引用
本申请要求享有于2020年12月18日提交的中国专利申请202011515217.8的优先权，该申请的全部内容通过引用并入本文中。
技术领域
本申请属于传感器技术领域，具体涉及一种传感器封装结构及电子设备。
背景技术
相关技术中，随着技术的发展，设备内会配置传感器，以用于实现电子设备的功能。现有的传感器封装结构是将芯片设置在载板上，上盖形成槽结构并扣在芯片外，并在槽结构内填充透明树脂。
发明内容
本申请旨在提供一种传感器封装结构，至少解决现有传感器封装结构的结构复杂，体积大，占用过多空间的问题之一。
第一方面，本申请实施例提出了一种传感器封装结构，该传感器封装结构包括载板、第一芯片、第二芯片和封装材料；
所述第一芯片和所述第二芯片均设置于所述载板上，所述第一芯片和所述第二芯片均与所述载板电连接；
所述载板上设置有第一通孔和第二通孔，所述第一芯片的有源区与所述第一通孔相对，所述第二芯片的有源区与所述第二通孔相对；
所述封装材料包裹所述第一芯片和所述第二芯片。
第二方面，本申请实施例提出了一种电子设备，该电子设备包括如上所述的传感器封装结构。
在本申请的实施例中，通过封装材料对第一芯片以及第二芯片形成光学隔离，使第一芯片通过第一通孔与外界交互，第二芯片通过第二通孔与外界交互，从而实现传感器的功能，不需要设置上盖，以及不需要在上盖内填充透明树脂，传感器封装结构的结构更加简单，减少了传感器封装结构的体积，减小了传感器占用的空间。
本申请的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：
图1是根据本申请的传感器封装结构的实施例的结构示意图之一；
图2是根据本申请的传感器封装结构的实施例的结构示意图之二；
图3是根据本申请实施例的载板的结构示意图；
图4是根据本申请的电子设备的实施例的局部示意图之一；
图5是根据本申请的电子设备的实施例的局部示意图之二；
图6是根据本申请的电子设备的实施例的局部示意图之三。
附图标记：
10-载板，101-第一通孔，102-第二通孔，103-焊盘，11-第一芯片，12-第二芯片，13-封装材料，14-第一凸点，15-第二凸点，2-透光材料，3-主板，33-第三通孔，34-第四通孔，4-壳体，5-柔性线路板，51-第五通孔，52-第六通孔。
具体实施方式
下面将详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下，还可以获得其他实施例，这些 实施例都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
相关技术中的传感器封装结构工艺复杂，需要在上盖与载板之间的空间内填充透明树脂后进行钻孔，再填充银胶，以将上盖固定到载板上。
相关技术中的传感器封装结构的体积大，占用过多空间，设置在电子设备内时，需要预留足够的空间，占用了电子设备的内部空间。传感器封装结构的体积大，无法进一步降低电子设备的厚度尺寸。
在实现本申请过程中，申请人发现相关技术中至少存在如下问题：现有传感器封装结构的结构复杂，体积大，占用过多空间。
根据本申请实施例的传感器封装结构至少解决上述相关技术中的问题之一。
下面结合图1-图6描述根据本申请实施例的传感器封装结构。
如图1-图3所示，根据本申请一些实施例的传感器封装结构，该传感器封装结构包括载板10、第一芯片11、第二芯片12和封装材料13。
所述第一芯片11和所述第二芯片12均设置于所述载板10上，所述第一芯片11和所述第二芯片12均与所述载板13电连接。
所述载板10上设置有第一通孔101和第二通孔102，所述第一芯片11的有源区与所述第一通孔101相对，所述第二芯片12的有源区与所述第二通孔102相对。
所述封装材料13包裹所述第一芯片11和所述第二芯片12。封装材料13对第一芯片11的有源区以外的部分形成光学隔离，封装材料13对第二芯片12的有源区以外的部分形成光学隔离，同时使第一芯片11与第二芯片12形成光学隔离。
在该实施例中，封装材料13对第一芯片11和第二芯片12形成光学隔离，以使第一芯片11的有源区只能通过第一通道101与外部交互。第一芯片11的有源区为第一芯片11的功能区，第一芯片11的功能区通过第一通道101与外部交互。第二芯片12的有源区为第二芯片12的功能区，第二芯片12的功能区通过第二通道102与外部交互。封装材料13对第一芯片11和第二芯片12形成封装以及光学隔离，避免了外部光线对第一芯片11和第二芯片12的干扰，也避免了第一芯片11和第二芯片12之间相互干扰。
该传感器封装结构中通过封装材料13将第一芯片11和第二芯片12封装在载板10上，并且能够通过载板10上设置的第一通孔101和第二通孔102与外部交互。相对于现有技术的不需要设置上盖以及不需要在上盖内填充透明树脂，使传感器封装结构的结构更加简单，减少了厚度尺寸，减小了传感器封装结构的体积，减小了传感器封装结构占用的空间。
将该传感器封装结构设置在电子设备内，能够减小传感器封装结构所占用的电子设备的内部空间。使用该传感器封装结构能够减小电子设备的体积，优化电子设备的尺寸。
传感器封装结构的结构相对于现有的传感器封装结构的结构更加简 单，更容易将第一芯片11和第二芯片12封装在载板10上。简化了传感器封装结构的加工工艺。
可选地，第一芯片11为光发射芯片，例如是发光二极管(Light Emitting Diode，LED)。第一芯片11的有源区为发光二极管的功能区，该功能区用于发射光线。第二芯片12为光接收芯片，例如是光电二极管(Photo-Diode，PD)，第二芯片12的有源区为光电二极管的功能区，该功能区用于接收光线。传感器封装结构为接近传感器的封装结构。第一芯片11发射出光线，第二芯片12接收反射回来的光线，从而能够获取物体与接近传感器之间的距离。
可选地，所述封装材料13包括黑色树脂或蓝色树脂。
封装材料13对第一芯片11和第二芯片12形成光学隔离，以保障第一芯片11从第一通孔101与外部交互，以及第二芯片12通过第二通孔102与外部交互。黑色树脂或蓝色树脂能够有效地形成光学隔离，并且更方便将第一芯片11和第二芯片12封装在载板10上。
例如，光发射芯片根据不同的成分能够发出不同颜色的光，黑色树脂能够有效地对光线形成光学隔离。在光发射芯片发出的光色不属于蓝色时可以使用蓝色树脂进行封装。根据第一芯片11发出光线的颜色设置能够形成光学隔离的非透明树脂均可。
在一个实施例中，如图2所示，第一通孔101和所述第二通孔102内填充有透光材料2。
在该实施例中，第一通孔101和第二通孔102内的透光材料2能够使光线通过。透光材料2在第一通孔101和第二通孔102形成防护，避免异物从第一通孔101或第二通孔102进入对第一芯片11和第二芯片12造成干扰。
可选地，所述透光材料2包括玻璃或透明树脂。
玻璃和透明树脂均具有优异的透光性能，光线能够透过透光材料2，且能够在第一通孔101和第二通孔102形成有效的封装，以对第一芯片11和第二芯片12形成有效的保护。
在一个实施例中，如图1-图3所示，所述第一芯片11设有第一凸点 14，所述第一芯片11通过所述第一凸点14与所述载板10电连接，所述第二芯片12具有第二凸点15，所述第二芯片12通过所述第二凸点15与所述载板10电连接。
在该实施例中，第一芯片11通过第一凸点14与载板10电连接，从而使载板10保障第一芯片11能够完成发射光线的功能。第二芯片12通过第二凸点15与载板10电连接，从而使载板10保障第二芯片12能够完成接收光线的功能。
第一芯片11设置有两个第一凸点14，两个第一凸点14在第一芯片11的有源区与载板10之间形成电连接。第二芯片12设置有两个第二凸点15，两个第二凸点15在第二芯片15的有源区与载板10之间形成电连接。
在本申请的一个实施例中，提供了一种电子设备，该电子设备包括如上任意一项实施例中所述的传感器封装结构。
在该实施例中，传感器封装结构的体积更小，占用的电子设备的内部空间更少，从而能够进一步减小电子设备的体积。例如，该传感器封装结构在载板10与封装材料13层叠的厚度方向上的尺寸更小，能够使电子设备在厚度方向上进一步缩减厚度尺寸，使电子设备更加轻薄。
在一个实施例中，如图4和图5所示，该电子设备还包括壳体4和主板3，所述壳体4形成容纳腔，所述主板3和所述传感器封装结构设置于所述容纳腔内。
所述载板10设置于所述主板3上，所述主板3与所述载板10电连接，所述主板3上设置有第三通孔33和第四通孔34，所述第三通孔33与所述第一通孔101相对，所述第四通孔34与所述第二通孔102相对。
在该实施例中，传感器封装结构设置在主板3上，第一通道101和第三通道33形成第一芯片11的发光通道，以使第一芯片11能够沿发光通道发出光线。第二通道102和第四通道34形成第二芯片12的接收通道，以使第二芯片12能够通过接收通道接收光线。
该传感器封装结构占用的厚度尺寸更小，能够使电子设备的厚度尺寸更小。主板3上设置第三通孔33和第四通孔34能够使主板3位于传感器封装结构与壳体4之间，并且不会影响传感器封装结构中的第一芯片11和 第二芯片12的功能。
壳体4的一个面与第三通孔33以及第四通孔34相对，传感器封装结构中的第一芯片11和第二芯片12朝向该面并与外部交互。例如该面为电子设备的背面或显示面。主板3位于传感器封装结构与该面之间，能够有效缩减该面与主板3之间的距离。
相比于现有技术，能够缩减壳体4与主板3之间的距离，减小电子设备的厚度尺寸。
在一个实施例中，如图1-图5所示，所述载板10上设置有至少一个焊盘103，所述主板3通过至少一个所述焊盘103与所述载板10电连接。
至少一个是一个或多个，根据电连接的实际需求设置焊盘103的数量。载板10上的焊盘103用于与主板3电连接，从而使第一芯片11和第二芯片12能够与主板3交互，从而能够通过主板3控制第一芯片11和第二芯片12。例如，主板3上设置有与焊盘103对应的连接部位。每个焊盘103与对应的连接部位电连接。
在一个实施例中，如图6所示，该电子设备还包括壳体4和柔性线路板5，所述壳体4形成容纳腔，所述柔性线路板5和所述传感器封装结构设置于所述容纳腔内。
所述柔性线路板5贴附于所述壳体4，所述载板10设置于所述柔性线路板5上，所述载板10与所述柔性线路板5电连接，所述柔性线路板5上设置有第五通孔51和第六通孔52，所述第五通孔51与所述第一通孔101相对，所述第六通孔52与所述第二通孔102相对。
在该实施例中，柔性线路板5与壳体4的位于电子设备的显示面一侧贴附，或者柔性线路板5与壳体4的位于电子设备的背面一侧贴附。载板10设置在柔性线路板5上，并使第一通孔101与第五通孔51相对，第二通孔102与第六通孔52相对。第一通孔101与第五通孔51形成第一芯片11的发光通道，第一芯片11经发光通道向外部发射光线。第二通孔102与第六通道52形成第二芯片12的接收通道，第二芯片12通过接收通道接收外部光线。
载板10与柔性线路板5电连接，柔性线路板5提供了第一芯片11和 第二芯片12与电子设备的主板电连接的路径。柔性线路板5的结构轻薄，传感器封装结构和柔性线路板5层叠于壳体4上的层叠厚度更小，使结构间的装配更加紧凑。进一步减小电子设备的厚度尺寸。
可选地，电子设备内的主板3与传感器封装结构在相互避让，并通过柔性线路板5使主板3与传感器封装结构中的载板10电连接。
可选地，所述载板10上设置有至少一个焊盘103，所述柔性线路板5通过至少一个所述焊盘103与所述载板10电连接。柔性线路板5用于在载板10与电子设备内的主板3之间形成电连接，并且柔性线路板5的厚度尺寸小，更加轻薄，减小了设置传感器封装结构所占用的厚度尺寸。例如，使触感器封装结构与主板3相互避让，从而进一步减小电子设备厚度上的尺寸，使电子设备更加轻薄。
根据本申请实施例的电子设备可以是任何适于包含传感器封装结构的电子设备，如手机、笔记本电脑、平板电脑或者可穿戴设备等。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
尽管已经示出和描述了本申请的实施例，本领域的普通技术人员可以理解：在不脱离本申请的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (11)

  1. 一种传感器封装结构，包括载板、第一芯片、第二芯片和封装材料；
    所述第一芯片和所述第二芯片均设置于所述载板上，所述第一芯片和所述第二芯片均与所述载板电连接；
    所述载板上设置有第一通孔和第二通孔，所述第一芯片的有源区与所述第一通孔相对，所述第二芯片的有源区与所述第二通孔相对；
    所述封装材料包裹所述第一芯片和所述第二芯片。
  2. 根据权利要求1所述的传感器封装结构，其中，所述第一芯片为光发射芯片，所述第二芯片为光接收芯片。
  3. 根据权利要求1所述的传感器封装结构，其中，所述第一通孔和所述第二通孔内填充有透光材料。
  4. 根据权利要求3所述的传感器封装结构，其中，所述透光材料包括玻璃或透明树脂。
  5. 根据权利要求1所述的传感器封装结构，其中，所述封装材料包括黑色树脂或蓝色树脂。
  6. 根据权利要求1所述的传感器封装结构，其中，所述第一芯片设有第一凸点，所述第一芯片通过所述第一凸点与所述载板电连接，所述第二芯片具有第二凸点，所述第二芯片通过所述第二凸点与所述载板电连接。
  7. 一种电子设备，包括如权利要求1-6任意一项所述的传感器封装结构。
  8. 根据权利要求7所述的电子设备，还包括壳体和主板；
    所述壳体形成容纳腔，所述主板和所述传感器封装结构设置于所述容纳腔内；
    所述载板设置于所述主板上，所述主板与所述载板电连接，所述主板上设置有第三通孔和第四通孔，所述第三通孔与所述第一通孔相对，所述第四通孔与所述第二通孔相对。
  9. 根据权利要求8所述的电子设备，其中，所述载板上设置有至少一个焊盘，所述主板通过至少一个所述焊盘与所述载板电连接。
  10. 根据权利要求7所述的电子设备，还包括壳体和柔性线路板；
    所述壳体形成容纳腔，所述柔性线路板和所述传感器封装结构设置于所述容纳腔内；
    所述柔性线路板贴附于所述壳体，所述载板设置于所述柔性线路板上，所述载板与所述柔性线路板电连接，所述柔性线路板上设置有第五通孔和第六通孔，所述第五通孔与所述第一通孔相对，所述第六通孔与所述第二通孔相对。
  11. 根据权利要求10所述的电子设备，其中，所述载板上设置有至少一个焊盘，所述柔性线路板通过至少一个所述焊盘与所述载板电连接。
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